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MURA110T3G
Fast / Ultrafast Diode, 100 V, 1 A, Single, 875 mV, 30 ns, 50 A
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: ONSEMI
- Product type: Fast & Ultrafast Recovery Rectifier Diodes
- Repetitive Reverse Voltage Vrrm Max:100V; Forward Current If(AV):1A; Diode Configuration:Single; Forward Voltage VF Max:875mV; Reverse Recovery Time trr Max:30ns; Forward Surge Current Ifsm Ma
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 2 Pin
- Product Range: MURA1
- Qualification: AEC-Q101
- Diode Case Style: DO-214AC (SMA)
- Diode Configuration: Single
- Forward Voltage Max: 875mV
- Forward Surge Current: 50A
- Reverse Recovery Time: 30ns
- Average Forward Current: 1A
- Operating Temperature Max: 175°C
- Repetitive Peak Reverse Voltage: 100V
| Delivery and price | |
|---|---|
| Units per pack | 3000 |
| Price | 0.101 € |
| Current stock | 1000+ |
| Lead time | 30 days |
Datasheet
## Final Product/Process Change Notification Document #:FPCN25638X Issue Date:12 Apr 2024 |**Title of Change:**<br>~~a~~|Goodark – SMA, SMB and SMC product transfer to a new test and assembly site location|Goodark – SMA, SMB and SMC product transfer to a new test and assembly site location|| |---|---|---|---| |**Proposed First Ship date:**<br>~~a~~|19 Jul 2024 or earlier if approved by customer||| |**Contact Information:**<br>~~Sf~~|Contact your local onsemi Sales Office orNurulAqilah.AbuHurairah@onsemi.com<br>~~Sf~~||| |**PCN Samples Contact:**<br>~~Sf~~|Contact your local onsemi Sales Office.<br>Sample requests are to be submitted no later than 30 days from the date of first notification,<br>Initial PCN or Final PCN, for this change.<br>Samples delivery timing will be subject to request date, sample quantity and special customer<br>packing/label requirements.<br>~~Sf~~||| |**Additional Reliability Data:**<br>~~Sf~~<br>~~a~~|Contact your local onsemi Sales Office orPat.Recella@onsemi.com<br>~~Sf~~||| |**Type of Notification:**|This is a Final Product/Process Change Notification (FPCN) sent to customers. FPCNs are issued 90<br>days prior to implementation of the change.<br>onsemi will consider this change accepted, unless an inquiry is made in writing within 30 days of<br>delivery of this notice. To do so, contactPCN.Support@onsemi.com||| |**Marking of Parts/ Traceability of**<br>**Change:**<br>~~a~~|Changed material can be identified by date or lot code.||| |**Change Category:**<br>~~a~~|Assembly Change, Test Change||| |**Change Sub-Category(s):**<br>~~a~~|Manufacturing Site Transfer||| |**Sites Affected:**<br>~~OO~~|||| |**onsemi Sites**<br>~~a~~||**External Foundry/Subcon Sites**<br>~~a~~|| |None<br>~~a~~||Good-Ark, China<br>~~a~~|| |**Description and Purpose:**<br>This Final Notification announces to customers the transfer of Goodark – SMA, SMB and SMC products to a new test and assembly site location.<br>There is no change in the material for assembly and test. The Subcon company remains the same; only the assembly and test site location is being<br>changed. All machines will also be transferred to the new site.<br>After the PCN is expired or approved, production will only run at the new site, and production will stop in the old plant.<br>**From**<br>**To**<br>**Assembly Site**<br>Site No. 31, Goodark China<br>onsemi OSV,Vietnam<br>Site No. 200, Goodark China<br>onsemi OSV,Vietnam<br>There is no product marking change as a result of this change.|||| This Final Notification announces to customers the transfer of Goodark – SMA, SMB and SMC products to a new test and assembly site location. There is no change in the material for assembly and test. The Subcon company remains the same; only the assembly and test site location is being changed. All machines will also be transferred to the new site. After the PCN is expired or approved, production will only run at the new site, and production will stop in the old plant. ||**From**|**To**| |---|---|---| |**Assembly Site**|Site No. 31, Goodark China<br>onsemi OSV,Vietnam|Site No. 200, Goodark China<br>onsemi OSV,Vietnam| There is no product marking change as a result of this change. Page 1 of 5 TEM001793 Rev. F Final Product/Process Change Notification Document #:FPCN25638X Issue Date:12 Apr 2024 ## **Reliability Data Summary:** **QV DEVICE NAME: MBRA340T3G RMS: V92386 PACKAGE: SMA** |**Test**|**Specification**|**Condition**|**Interval**|**Results**| |---|---|---|---|---| |High Temperature Reverse Bias|JESD22-A108|Ta=90°C, 100 % max rated V|1008 hrs|0/231| |High Temperature Storage Life|JESD22-A103|Ta= 150°C|1008 hrs|0/231| |Preconditioning|J-STD-020 JESD-A113|MSL 1 @ 260°C||0/924| |Intermittent Operating Life|MIL-STD-750<br>(M1037)<br>AEC-Q101|Ta=+25°C, delta Tj=100°C<br>On/off = 2 mins|15000 cyc|0/120| |Temperature Cycling|JESD22-A104|Ta= -55°C to +150°C|1000 cyc|0/231| |High Temperature High HumidityReverse Bias|JESD22-A101|85°C, 85% RH, reverse bias|1008 hrs|0/231| |Unbiased HighlyAccelerated Stress Test|JESD22-A118|130°C, 85% RH, 18.8psig, unbiased|96 hrs|0/231| |Resistance to Solder Heat|JESD22- B106|Ta = 265°C, 10 sec<br>Required for through hole devices only||0/90| |Solderability|JSTD002|Ta = 245°C, 5 sec||0/45| **QV DEVICE NAME: MURA160T3G RMS: V92728 PACKAGE: SMA** |**Test**|**Specification**|**Condition**|**Interval**|**Results**| |---|---|---|---|---| |High Temperature Reverse Bias|JESD22-A108|Ta=150°C, 100 % max rated V|1008 hrs|0/231| |High Temperature Storage Life|JESD22-A103|Ta= 175°C|1008 hrs|0/231| |Preconditioning|J-STD-020 JESD-A113|MSL 1 @ 260°C||0/924| |Intermittent Operating Life|MIL-STD-750<br>(M1037)<br>AEC-Q101|Ta=+25°C, delta Tj=100°C<br>On/off = 2 mins|15000 cyc|0/120| |Temperature Cycling|JESD22-A104|Ta= -65°C to +150°C|1000 cyc|0/231| |High Temperature High Humidity Reverse Bias|JESD22-A101|85°C, 85% RH, reverse bias|1008 hrs|0/231| |Autoclave|JESD22-A102|121°C, 100% RH, 15 psig, unbiased|96 hrs|0/231| |Resistance to Solder Heat|JESD22- B106|Ta = 265°C, 10 sec<br>Required for through hole devices only||0/90| |Solderability|JSTD002|Ta = 245°C, 5 sec||0/45| Page 2 of 5 TEM001793 Rev. F Final Product/Process Change Notification Document #:FPCN25638X Issue Date:12 Apr 2024 **QV DEVICE NAME: MURS360BT3G RMS: V92734 PACKAGE: SMB** |**Test**|**Specification**<br>**Condition**|**Interval**|**Results**| |---|---|---|---| |High Temperature Reverse Bias<br>~~a~~|JESD22-A108<br>Ta=150°C, 100 % max rated V|1008 hrs|0/231| |High Temperature Storage Life<br>JESD22-A103<br>Ta= 175°C<br>1008 hrs<br>0/231<br>Preconditioning<br>J-STD-020 JESD-A113<br>MSL 1 @ 260°C<br>0/924<br>Intermittent Operating Life<br>MIL-STD-750<br>(M1037)<br>AEC-Q101<br>Ta=+25°C, delta Tj=100°C<br>On/off = 2 mins<br>15000 cyc<br>0/120<br>Temperature Cycling<br>JESD22-A104<br>Ta= -65°C to +150°C<br>1000 cyc<br>0/231<br>~~aee~~|||| |High Temperature High Humidity<br>Reverse Bias<br>~~a~~|JESD22-A101<br>85°C, 85% RH, reverse bias|1008 hrs|0/231| |Unbiased Highly Accelerated Stress<br>Test<br>~~a~~|JESD22-A118<br>130°C, 85% RH, 18.8psig, unbiased|96 hrs|0/231| |Resistance to Solder Heat<br>JESD22- B106<br>Ta = 265°C, 10 sec<br>Required for through hole devices only<br>0/90<br>Solderability<br>JSTD002<br>Ta = 245°C, 5 sec<br>0/45<br>~~ee~~|||| |**QV DEVICE NAME:** **MBRS4201T3G**|||| |**RMS: V92732**|||| |**PACKAGE: SMC**|||| |**Test**|**Specification**<br>**Condition**|**Interval**|**Results**| |High Temperature Reverse Bias<br>High Temperature Storage Life<br>Preconditioning<br>~~ee~~<br>~~a ee~~|JESD22-A108<br>Ta=90°C, 100 % max rated V<br>1008 hrs<br>0/231<br>JESD22-A103<br>Ta= 150°C<br>1008 hrs<br>0/231<br>J-STD-020 JESD-A113<br>MSL 1 @ 260°C<br>0/924<br>~~eG~~<br>~~ee~~||| |Intermittent Operating Life<br>MIL-STD-750<br>(M1037)<br>AEC-Q101<br>Ta=+25°C, delta Tj=100°C<br>On/off = 2 mins<br>15000 cyc<br>0/120<br>Temperature Cycling<br>JESD22-A104<br>Ta= -55°C to +150°C<br>1000 cyc<br>0/231<br>~~ff~~|||| |High Temperature High Humidity<br>Reverse Bias<br>~~a~~|JESD22-A101<br>85°C, 85% RH, reverse bias|1008 hrs|0/231| |Unbiased Highly Accelerated Stress<br>Test<br>~~a~~|JESD22-A118<br>130°C, 85% RH, 18.8psig, unbiased|96 hrs|0/231| |Resistance to Solder Heat<br>JESD22- B106<br>Ta = 265°C, 10 sec<br>Required for through hole devices only<br>0/90<br>Solderability<br>JSTD002<br>Ta = 245°C, 5 sec<br>0/45<br>~~pp~~|||| |**Electrical Characteristics Summary:**|||| Electrical characteristics are not impacted. Page 3 of 5 TEM001793 Rev. F Final Product/Process Change Notification Document #:FPCN25638X Issue Date:12 Apr 2024 ## **List of Affected Parts:** _**Note:** Only the standard (off the shelf) part numbers are listed in the parts list. Any custom parts affected by this PCN are shown in the customer specific PCN addendum in the PCN email notification, or on the_ _**PCN Customized Portal.**_ **Part Number Qualification Vehicle** MBRS360T3G MBRS4201T3G ~~a~~ MBRS340T3G MBRS4201T3G ~~eG~~ MBRS330T3G MBRS4201T3G ~~a~~ MBRS320T3G MBRS4201T3G ~~aG~~ MBRS540T3G MBRS4201T3G MBRS3201T3G MBRS4201T3G ~~a~~ MBRS3100T3G MBRS4201T3G ~~aG~~ MBRS4201T3G MBRS4201T3G ~~a~~ MURS360BT3G MURS360BT3G ~~aG~~ MURS220T3G MURS360BT3G ~~a~~ MURS120T3G MURS360BT3G ~~a~~ MURS110T3G MURS360BT3G ~~a~~ MURS105T3G MURS360BT3G ~~RG~~ MURS240T3G MURS360BT3G ~~RG~~ MURS160T3G MURS360BT3G ~~RG~~ MURS140T3G MURS360BT3G ~~RG~~ MURS260T3G MURS360BT3G ~~RG~~ MBRS2H100T3G MURS360BT3G ~~RG~~ MBRS190T3G MURS360BT3G ~~RG~~ MBRS1100T3G MURS360BT3G ~~RG~~ MBRS360BT3G MURS360BT3G ~~RG~~ MBRS2040LT3G MURS360BT3G ~~a~~ MBRS240LT3G MURS360BT3G ~~eG~~ MBRS3200T3G MURS360BT3G ~~eG~~ MBRS130T3G MURS360BT3G ~~eG~~ MBRS120T3G MURS360BT3G ~~eG~~ MBRS230LT3G MURS360BT3G ~~a~~ MBRS130LT3G MURS360BT3G ~~eG~~ SS26T3G MURS360BT3G ~~ee~~ Page 4 of 5 TEM001793 Rev. F Final Product/Process Change Notification Document #:FPCN25638X Issue Date:12 Apr 2024 SS24T3G MURS360BT3G MBRS260T3G MURS360BT3G ~~eG~~ MBRS1540T3G MURS360BT3G ~~eG~~ MBRS140T3G MURS360BT3G ~~eG~~ MBRA2H100T3G MBRA340T3G, MURA160T3G ~~eG~~ MBRA340T3G MBRA340T3G, MURA160T3G ~~eG~~ MBRA210LT3G MBRA340T3G, MURA160T3G ~~a~~ MURA220T3G MBRA340T3G, MURA160T3G ~~aG~~ MURA210T3G MBRA340T3G, MURA160T3G ~~a~~ MURA205T3G MBRA340T3G, MURA160T3G ~~aG~~ MURA120T3G MBRA340T3G, MURA160T3G ~~a~~ MURA115T3G MBRA340T3G, MURA160T3G ~~aG~~ MURA110T3G MBRA340T3G, MURA160T3G ~~a~~ MURA105T3G MBRA340T3G, MURA160T3G ~~aG~~ MURA260T3G MBRA340T3G, MURA160T3G ~~a~~ MURA230T3G MBRA340T3G, MURA160T3G ~~a~~ MURA160T3G MBRA340T3G, MURA160T3G ~~a~~ MURA140T3G MBRA340T3G, MURA160T3G ~~RG~~ MURA240T3G MBRA340T3G, MURA160T3G ~~RG~~ SS16T3G MBRA340T3G, MURA160T3G ~~RG~~ MBRA140T3G MBRA340T3G, MURA160T3G ~~RG~~ MBRA120ET3G MBRA340T3G, MURA160T3G ~~RG~~ MBRA130LT3G MBRA340T3G, MURA160T3G ~~RG~~ MBRA160T3G MBRA340T3G, MURA160T3G ~~RG~~ MBRA1H100T3G MBRA340T3G, MURA160T3G ~~eG~~ Page 5 of 5 TEM001793 Rev. F
Updated at June 8, 2026
onsemi is a premier global supplier of intelligent power and sensing technologies, driving disruptive innovations across the automotive, industrial, and cloud infrastructure markets. Recognized for their commitment to sustainability and reliable supply chains, the company accelerates advancements in vehicle electrification, industrial automation, and 5G networks by solving the industry's most complex design challenges. At the core of their portfolio is an industry-leading selection of discrete semiconductors. This extensive range features thousands of high-performance bipolar transistors, single and dual MOSFETs, and a comprehensive array of diodes, including Zener, Schottky, and fast-recovery rectifiers. Engineered for superior thermal performance and energy efficiency, these foundational components are critical for demanding power conversion, switching, and signal conditioning applications. Beyond essential discretes, onsemi provides a robust suite of advanced power management and circuit protection solutions. Their lineup includes intelligent power modules, single IGBTs, and transient voltage suppression (TVS) diodes designed to safeguard sensitive circuitry. Complimented by integrated passive filters, AC/DC LED driver ICs, and specialized sub-2.4GHz RF transceivers, onsemi equips engineers with the scalable, high-quality technologies needed to build a cleaner, smarter, and more connected world.
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