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MUN3CAD05-JF
Non Isolated POL DC/DC Converter, ITE, Micro Module, 16.5 W, 600 mV, 3.3 V, 5 A
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: CYNTEC
- Product type: DC / DC Non Isolated Board Mount Converters - Adjustable Output
- SVHC: No SVHC (21-Jan-2025)
- Depth: 3mm
- Width: 3mm
- Height: 1.5mm
- Product Range: -
- Output Power Max: 16.5W
- Output Current Max: 5A
- Output Voltage Max: 3.3V
- Output Voltage Min: 600mV
- Input Voltage DC Max: 5.5V
- Input Voltage DC Min: 2.7V
- DC / DC Converter Type: Micro Module
- Power Supply Applications: ITE
- DC / DC Converter Output Type: Adjustable
| Delivery and price | |
|---|---|
| Units per pack | 500 |
| Price | 2.31 € |
| Current stock | 1000+ |
| Lead time | 30 days |
## **uPOL MODULE**
## **5A, High Efficiency uPOL Module**
## **MUN3CAD05-JF**
## **FEATURES:** ~~Pi~~
◼ High Density uPOL Module
- 5A Output Current
- 95.8% Peak Efficiency at 5Vin to 3.3Vout
- Input Voltage Range from 2.7V to 5.5V
- Adjustable Output Voltage
- Enable / Power Good Function
- Forced PWM Mode
- Protections (input UVLO, OCP: Nonlatching, OTP, OVP)
- Internal Soft Start 2.1mS
- Compact Size: 3.0mm*3.0mm*1.5mm
- Pb-free for RoHS compliant
- 100% dropout voltage
- ◼ MSL 2, 260°C Reflow
## **APPLICATIONS:** ~~ee~~
## **GENERAL DESCRIPTION:**
The uPOL module is non-isolated dc-dc converters that can deliver up to 5A of output current. The PWM switching regulator, high frequency power inductor are integrated in one hybrid package. It only needs input/output capacitors and voltage dividing resistors.
The module was forced PWM mode, through constant on-time control, the module offers a simpler control loop and faster transient response. Other features include remote enable function, internal soft-start, non-latching over current protection, power good, and input under voltage locked-out capability.
The low profile and compact size package is suitable for automated assembly by standard surface mount equipment.
◼ 100G/400G/800G Optical module
- Server power / telecom power
- SSD
**TYPICAL APPLICATION CIRCUIT& PACKAGE:** ~~Lo~~
**==> picture [446 x 105] intentionally omitted <==**
**----- Start of picture text -----**<br>
Vin Vout<br>IN OUT<br>REN RFB_<br>CIN EN Power TOP CFB COUT<br>Module FB<br>PG RFB_ 1.5mm<br>BOT<br>GND<br>3mm<br>3mm<br>**----- End of picture text -----**<br>
**FIG.1 TYPICAL APPLICATION CIRCUIT**
**FIG.2 HIGH DENSITY uPOL MODULE**
1
Rev. A1
## **MUN3CAD05-JF**
## **ORDER INFORMATION:**
||**Ambient Temp. Range**|**Ambient Temp. Range**|**Package (Pb-**|||||
|---|---|---|---|---|---|---|---|
|**Part Number**||||**MSL**||**MSL**|**Note**|
||**(°C)**||**Free)**|||||
|MUN3CAD05-JF|-40 ~ +105||QFN|Level 2||Level 2|-|
|||||||||
|**Order Code**|||**Packing**|||**Quantity**||
|MUN3CAD05-JF|||Tape and reel|||2000||
## **PIN CONFIGURATION:**
## **TOP VIEW**
## **PIN DESCRIPTION:**
|**Symbol**|**Pin No.**|**Description**|
|---|---|---|
|FB|1|Feedback input. Connect an external resistor divider from the output to<br>FB and FB to GND.|
|PG|2|Power Good indicator. With internal 500kΩ pull-up resistor to VIN.|
|IN|3, 6, 10|Power input pin.|
|EN|4|Enable control. Do not be float.<br>EN = LOW, the module is off.<br>EN=HIGH, the module is on.|
|OUT|5|Power output pin.|
|GND|7|Power ground pin for signal, input, and output return path. This pin<br>needs to connect one or more ground plane directly.|
|LX|8, 9|Switch node, leave it no connection.|
2
Rev. A1
**MUN3CAD05-JF**
## **ELECTRICAL SPECIFICATIONS:** ~~eee~~
CAUTION: Do not operate at or near absolute maximum rating listed for extended periods of time. This stress may adversely impacted product reliability and result in failures not covered by warranty.
|**Parameter**<br>~~ee~~|**Description**<br>~~ee~~|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|◼<br>Absolute Maximum Ratings<br>~~ee ee~~<br>~~a~~<br>~~ee~~||||||
|VIN to GND<br>~~ee~~<br>~~ee~~||-|-|+6.0|V|
|VOUT to GND<br>~~ee~~<br>~~ee~~<br>~~ee~~||-|-|+6.0|V|
|LX to GND<br>~~ee~~<br>~~ee~~||-0.3|-|VIN+0.3|V|
|EN to GND<br>~~ee~~<br>~~a~~<br>~~es~~|~~es~~|-<br>~~es~~|-<br>~~es~~|+6.0<br>~~es~~|V<br>~~es~~|
|PG to GND<br>~~es~~<br>~~es~~|~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|+6.0<br>~~es~~<br>~~es~~|V<br>~~es~~<br>~~es~~|
|Tc<br>~~es~~<br>~~es~~<br>~~es~~|Case Temperature of Inductor<br>~~es~~<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~<br>~~es~~|+110<br>~~es~~<br>~~es~~<br>~~es~~|°C<br>~~es~~<br>~~es~~<br>~~es~~|
|Tj<br>~~es~~<br>~~es~~<br>~~es~~|Junction Temperature<br>~~es~~<br>~~es~~<br>~~es~~|-40<br>~~es~~<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~<br>~~es~~|+150<br>~~es~~<br>~~es~~<br>~~es~~|°C<br>~~es~~<br>~~es~~<br>~~es~~|
|Tstg<br>~~es~~<br>~~es~~|Storage Temperature<br>~~es~~<br>~~es~~|-40<br>~~es~~<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~<br>~~ee~~|+125<br>~~es~~<br>~~es~~|°C<br>~~es~~<br>~~es~~|
|ESD Rating<br>~~es~~|Human Body Model (HBM)<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~ee~~<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|2k<br>~~es~~<br>~~ee~~<br>~~ee~~|V<br>~~es~~<br>~~ee~~|
||Machine Model (MM)<br>~~ee~~|-<br>~~es ~~<br>~~ee~~<br>~~ee~~<br>~~es~~|-<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>~~es~~|200<br>~~ee~~<br>~~ee~~|V<br>~~ee~~|
||Charge Device Model (CDM)<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~ee~~<br>~~es~~<br>~~es~~|-<br>~~ee~~<br>~~ee ~~<br>~~es~~<br>~~es~~|1000<br>~~ee~~<br> ~~ee~~<br>~~es~~|V<br>~~ee~~<br>~~es~~|
|◼<br>Recommendation Operating Ratings<br>~~es~~<br>~~es es~~<br>~~a~~<br>~~ss~~||||||
|VIN<br>~~a~~<br>~~ss~~|Input Supply Voltage<br>~~a~~<br>~~ss~~|+2.7<br>~~a~~<br>~~ss~~<br>~~ss~~<br>~~es~~|-<br>~~a~~<br>~~ss~~<br>~~ss~~|+5.5<br>~~a~~<br>~~ss~~|V<br>~~a~~<br>~~ss~~|
|VOUT<br>~~ss~~<br>~~ss~~<br>~~es~~|Output Setting Voltage<br>~~ss~~<br>~~ss~~|+0.6<br>~~ss~~<br>~~ss~~<br>~~ss~~<br>~~es~~<br>~~es~~|-<br>~~ss~~<br>~~ss~~<br>~~ss~~|+3.3<br>~~ss~~<br>~~ss~~|V<br>~~ss~~<br>~~ss~~|
|Ta<br>~~ss~~<br>~~ss~~<br>~~es~~|Ambient Temperature<br>~~ss~~<br>~~ss~~|-40<br>~~ss~~<br>~~es~~<br>~~ss~~<br>~~es~~|-<br>~~ss~~<br>~~ss~~|+105<br>~~ss~~<br>~~ss~~|°C<br>~~ss~~<br>~~ss~~|
|Tj<br>~~ss~~<br>~~es~~|Junction Temperature<br>~~ss~~|-40<br>~~ss~~<br>~~es~~|-<br>~~ss~~|+135<br>~~ss~~|°C<br>~~ss~~|
|◼<br>Thermal Information<br>~~es~~<br>~~es~~<br>~~a~~<br>~~es~~||||||
|Rth(jchoke-a)<br>~~es~~|Thermal resistance from junction to<br>ambient,Ta = 25℃(Note 1)|-|33|-|°C/W|
## NOTES:
1. Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The test board size is 30mm× 30mm× 1.6mm with 4 layers, 2 oz per layer. The test condition is complied with JEDEC EIJ/JESD 51 Standards.
3
Rev. A1
**MUN3CAD05-JF**
~~ee~~ **ELECTRICAL SPECIFICATIONS:(Cont.)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 4 layers 2 oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Vin = 3.3V, Vout = 1.8V, Cin =22uF/6.3V/0805/X7R * 2pcs, Cout = 22uF/6.3V/0805/X7R * 2pcs, RFB_top = 100k Ω , CFB = 100pF.
|**Symbol**<br>~~a~~|**Parameter**<br>|**Conditions**<br>|**Conditions**<br>|**Min.**<br>|**Typ.**<br>|**Max.**<br>|**Unit**<br>|
|---|---|---|---|---|---|---|---|
|◼<br>Input Characteristics<br>~~aee~~<br>~~ee~~<br>~~a~~||||||||
|Vin<br>~~a~~<br>~~a~~|Input voltage<br>range<br>~~ee~~|~~ee~~||+2.7<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|+5.5<br>~~ee~~|V<br>~~ee~~|
|UVLO<br>~~aa~~|Input Under<br>voltage lockout<br>~~ee~~|Vin increasing<br>~~ee~~||2.3<br>~~ee~~<br>~~ee~~|2.4<br>~~ee~~|2.5<br>~~ee~~|V<br>~~ee~~|
|ISD<br>~~a~~<br>~~a~~|Input shutdown<br>current<br>~~ee~~<br>~~ee~~|Vin=3.3V, EN=GND<br>~~ee~~<br>~~ee~~||-<br>~~ee~~<br>~~ee~~|5.0<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|uA<br>~~ee~~<br>~~ee~~|
|IIN<br>~~a~~<br>~~a~~<br>~~a~~|Input supply<br>bias current<br>~~ee~~<br>~~ee~~<br>~~ee~~|Vin=3.3V, Iout=0A<br>Vout=1.8V, EN=HIGH<br>~~ee~~<br>~~ee~~<br>~~ee~~||-<br>~~ee~~<br>~~ee~~<br>~~ee~~|15<br>~~ee ~~<br>~~ee~~|-<br> ~~ee~~<br>~~ee~~|mA<br>~~ee~~<br>~~ee~~|
|IS<br>~~a~~<br>~~a~~<br>~~en~~|Input supply<br>current<br>~~ee~~<br>~~ee~~<br>~~en~~|Vin=3.3V, EN=HIGH<br>Iout=5.0A<br>Vout=1.8V<br>~~ee~~<br>~~ee~~||-<br>~~ee~~<br>~~ee~~|3.2<br>~~ee ~~|-<br> ~~ee~~|A<br>~~ee~~|
|◼<br>Output Characteristics<br>~~a~~<br>~~ee~~<br>~~ee ee~~<br>~~en~~||||||||
|IOUT(DC)<br>~~en~~|Output current<br>~~en~~|Vin=3.3V, Vout=1.8V||0|-|5|A|
|VFBREF<br>~~a~~<br>~~a~~|Feedback<br>Regulation<br>Voltage<br>~~ee~~<br>|~~ee~~<br>||591<br>~~ee~~<br>|600<br>~~ee~~<br>|609<br>~~ee~~<br>~~ee~~<br>|mV<br>~~ee~~<br>|
|ΔVOUT/ΔVIN<br>~~a~~<br>~~a~~|Line regulation<br>accuracy<br>~~ee~~<br>|Vin=3.3V to 5.5V<br>Vout=1.8V, Iout=5A<br>~~ee~~<br>||-<br>~~ee~~<br><br>~~ee~~|0.2<br>~~ee~~<br><br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br><br>~~ee~~|% VO(SET)<br>~~ee~~<br>|
|ΔVOUT/ΔIOUT<br>~~a~~<br>~~a~~|Load regulation<br>accuracy<br>~~ee~~<br>~~ee~~|Iout=0A to 5A<br>Vin=3.3V, Vout=1.8V<br>~~ee~~<br>~~ee~~||-<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.3<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|% VO(SET)<br>~~ee~~<br>~~ee~~|
|VOUT(AC)|Output ripple<br>voltage|Vin=3.3V,<br>Vout=1.8V<br>EN=HIGH|Iout=0A|-<br>~~ee~~|4<br>~~ee~~|-<br>~~ee~~|mVp-p|
||||Iout=5A<br>~~a~~|-<br>~~a ~~<br>~~ee~~|5<br> ~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|mVp-p<br>~~ee~~<br>~~ee~~|
|Tss<br>~~ee~~|Soft start<br>~~ee~~|~~ee~~||-<br>~~ee~~<br>~~ee~~|2.1<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|mS<br>~~ee~~<br>~~ee~~|
Rev. A1
4
**MUN3CAD05-JF**
~~ee~~ **ELECTRICAL SPECIFICATIONS:(Cont.)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 4 layers 2 oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Vin = 3.3V, Vout = 1.8V, Cin =22uF/6.3V/0805/X7R * 2pcs, Cout = 22uF/6.3V/0805/X7R * 2pcs, RFB_top = 100k Ω , CFB = 100pF.
|**Symbol**<br>~~a~~|**Parameter**<br>|**Conditions**<br>|**Min.**<br>|**Typ.**<br>|**Max.**<br>|**Unit**<br>|
|---|---|---|---|---|---|---|
|◼<br>Control Characteristics<br>~~ee~~|||||||
|VEN_TH<br>~~ee~~<br>~~Sa~~<br>~~a~~<br>~~a~~|Enable upper<br>threshold voltage<br>~~ee~~<br>~~Sa~~<br>~~ae~~<br>|VEN_THrising<br>~~ee~~<br>~~Sa~~<br>~~ee~~|1.17<br>~~ee~~<br>~~Sa~~<br>~~ee~~|1.2<br>~~ee~~<br>~~Sa~~<br>~~ee~~|1.23<br>~~ee~~<br>~~Sa~~<br>~~ee~~|V<br>~~ee~~<br>~~Sa~~|
||Enable lower<br>threshold voltage<br>~~Sa~~<br>~~ae~~<br>~~ee~~<br>|VEN_THfalling<br>~~Sa~~<br>~~ee~~|1.07<br>~~Sa~~<br>~~ee~~|1.1<br>~~Sa~~<br>~~ee~~|1.13<br>~~Sa~~<br>~~ee~~|V<br>~~Sa~~|
|ENPDR<br>~~a~~ <br>~~a~~<br>~~a~~|Internal Pull Down<br>Resistor<br>~~ae~~<br> ~~ee~~<br>~~ee~~<br>|Internal Pull Down<br>~~ee ~~|-<br> ~~ee~~|1<br>~~ee ~~|-<br> ~~ee~~|MΩ|
|FOSC<br> <br>~~a~~ <br>~~a~~<br>~~a~~|Oscillator<br>frequency<br> ~~ee~~<br> ~~ee~~<br>~~a~~|PWM Operation<br>~~ee~~|-<br>~~ee~~|1.2<br>~~ee~~|-|MHz|
|VPGUV_TH<br> <br>~~a ~~<br>~~a~~<br>~~a~~|PG Under-Voltage<br>Lower Threshold<br> ~~ee~~<br> ~~a~~<br>~~ee~~<br>|VFBrising, PG Low-to-HiZ,<br>% with respect to VFEREF<br>~~ee~~<br>~~es~~<br>|-<br>~~ee~~<br>|-10<br>~~ee~~<br>|-<br>|%<br>|
|VPGUV_HY<br> <br>~~a~~<br>~~a~~<br>~~a~~|PG Under-Voltage<br>Hysteresis<br> ~~a~~<br>~~ee~~<br><br>|VFBfalling, PG HiZ-to-Low<br>% with respect to VFEREF<br>~~ee~~<br>~~es~~<br><br>|-<br>~~ee~~<br><br>~~ee~~<br>|-15<br>~~ee~~<br><br>~~ee~~<br>|-<br><br>~~ee~~<br>|%<br><br>|
|VPGOV_HY<br> <br>~~a~~<br>~~a ee~~<br>~~a~~<br>~~a~~|PG Over-Voltage<br>Hysteresis<br> ~~a~~<br>~~ee~~<br>~~ee~~<br><br>|VFBrising, PG HiZ-to-Low<br>% with respect to VFEREF<br>~~ee ~~<br>~~es~~<br>~~ee~~<br><br>|-<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br><br>~~ee~~<br>|15<br>~~ee~~<br>~~ee~~<br>~~ee~~<br><br>~~ee~~<br>|-<br>~~ee~~<br>~~ee~~<br><br>~~ee~~<br>|%<br>~~ee~~<br><br>|
|VPGOV_TH<br>~~a ee~~<br>~~a~~<br>~~a~~|PG Over-Voltage<br>Upper Threshold<br>~~ee~~<br><br>|VFBfalling, PG Low-to-HiZ,<br>% with respect to VFEREF<br>~~ee~~<br><br>|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br><br>~~ee~~<br>|10<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br><br>~~ee~~<br>|-<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br><br>~~ee~~<br>|%<br>~~ee~~<br><br>|
|PGPUR<br>~~a~~<br>~~a~~|PG Pull-up<br>resister<br>~~ee~~<br>|~~ee~~<br>|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br><br>~~ee~~|500<br>~~ee~~<br>~~ee~~<br>~~ee~~<br><br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|KΩ<br>~~ee~~<br>|
|VPG_LV<br>~~a~~<br>~~a~~|PG logic low<br>voltage<br>~~ee~~<br>~~ee~~|IPG= 1mA<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.2<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.3<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|◼<br>Fault Protection<br>~~ee ee~~<br>~~aee~~<br>~~ee~~<br>~~ee~~<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~eeee~~|||||||
|ILIMIT_TH<br>~~ee~~<br>~~a~~|Current limit<br>threshold<br>~~ee~~<br>~~ee~~|Peak value of output current<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|7.1<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|A<br>~~ee~~|
|TOTP<br>~~a~~|Over temperature<br>protection<br>~~ee~~|~~ee~~|-<br>~~ee~~|160<br>~~ee ~~|-<br> ~~ee~~|°C|
|THY<br>~~a~~|Thermal<br>Shutdown<br>Hysteresis<br>~~ee~~|~~ee~~|-<br>~~ee~~|30<br>~~ee~~|-<br>~~ee~~|°C<br>~~ee~~|
|OVP<br>~~a~~|Over voltage<br>protection<br>~~ee~~|VFB rising, % with respect to<br>VREF<br>~~ee~~|+18<br>~~ee~~|+20<br>~~ee~~|+22<br>~~ee~~|%<br>~~ee~~|
Rev. A1
5
## **MUN3CAD05-JF**
## **TYPICAL PERFORMANCE CHARACTERISTICS:**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Cin =22uF/6.3V/0805/X7R * 2pcs, Cout = 22uF/6.3V/0805/X7R * 2pcs, RFB_top = 100k Ω , CFB =100pF. The following figures provide the typical characteristic curves at 1.0Vout.
**FIG.3 EFFICIENCY V.S. LOAD CURRENT FIG.4 DE-RATING CURVE** ~~—— a~~ Tek Stop ~~a —<—— a~~ ——u : u Peak—Peak 2.60mV_ 3.87m 2.60m 5.60m 863; [PB Peak~Peak 3.60mV_ 3.60m 3.60m 3.60m 0.00 **FIG.5 OUTPUT RIPPLE FIG.6 OUTPUT RIPPLE (3.3VIN to 1.0VOUT, IOUT=0A) (3.3VIN to 1.0VOUT, IOUT=5A)** ~~eee~~ ‘Tek Stop ~~ee~~ > ~~esSs~~ : ~~A~~ EN DD ruvraewenerenesermnmers PG t Vout | G+ 243.0000us ) (10k points Gy 6.000000ms } (10k points **FIG.7 TRANSIENT RESPONSE FIG.8 TURN-ON (3.3VIN to 1.0VOUT, 2.5A to 5A LOAD STEP) (3.3VIN to 1.0VOUT, IOUT=5A)**
6
Rev. A1
## **MUN3CAD05-JF**
## **TYPICAL PERFORMANCE CHARACTERISTICS:**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Cin =22uF/6.3V/0805/X7R * 2pcs, Cout = 22uF/6.3V/0805/X7R * 2pcs, RFB_top = 100k Ω , CFB = 100pF. The following figures provide the typical characteristic curves at 1.8Vout.
|_<br>100<br>Efficiency vsOutput Current<br>95<br>x 90<br>><br>(2)<br>S<br>85<br>2<br>=<br>80<br>.<br>—Vin=3.3V, Vout=1.8V<br>7s<br>—Vin=5V, Vout=1.8V<br>70<br>0<br>1<br>2<br>3<br>4<br>5<br>lout (A)|MUN3CADOS-JFDe-ratin<br>6<br>8<br>_<br>5<br>=5<br>w<br>4<br>s<br>UO<br>a<br>3<br>2=<br>=g<br>5<br>2<br>a<br>5<br>6<br>61<br>—Vin=3.3V, Vout=1.8V, 0-FLM<br>)<br>25.0<br>45.0<br>65.0<br>85.0<br>105.0<br>AMBIENTOFTEMPERATURE(°C)|
|---|---|
|**FIG.9 EFFICIENCY V.S. LOADCURRENT**|**FIG.10 DE-RATING CURVE**|
|TekStop ~~a~~ |<br>~~|~~<br>y|‘TekStop ~~esi~~<br>|<br>¥|
|**FIG.11 OUTPUT RIPPLE**<br>**(3.3VINto 1.8VOUT, IOUT=0A)**|**FIG.12 OUTPUT RIPPLE**<br>**(3.3VINto 1.8VOUT, IOUT=5A)**|
|‘TekStop ~~CE~~<br>~~u~~<br>~~T~~<br>|<br>~~Ger2i3.0000us}(10kpoints~~|EN<br>PG<br>Vout<br>Tek Stop ~~—~~<br>~~ss~~<br>~~|~~<br>~~u~~<br>~~T~~<br>~~u~~<br>~~i~~<br>|<br>t<br>¢<br>~~{E-~5.000000ms}[40kpoints~~|
|**FIG.13 TRANSIENT RESPONSE**<br>**(3.3VIN to 1.8VOUT, 2.5A to 5A LOAD STEP)**<br>~~Ger2i3.0000us } (10k points~~|**FIG.14 TURN-ON**<br>**(3.3VIN to 1.8VOUT, IOUT=5A)**<br>~~{E-~5.000000ms } [40k points~~|
Rev. A1
7
## **MUN3CAD05-JF**
## **TYPICAL PERFORMANCE CHARACTERISTICS:**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Cin =22uF/6.3V/0805/X7R * 2pcs, Cout = 22uF/6.3V/0805/X7R * 2pcs, RFB_top = 100k Ω , CFB = 100pF. The following figures provide the typical characteristic curves at 3.3Vout.
|100<br>EfficiencyvsOutputCurrent<br>95<br>SG<br>85<br>s<br>80<br>.<br>.<br>15<br>— Vin=5V, Vout=3.3 V<br>70<br>0<br>1<br>2<br>3<br>4<br>5<br>lout (A)|6<br>MUNS3CADOS_JF De-rating<br>=<br>><br>=<<br>—<br>a<br>3<br>~~<br><<br>\<br>5<br>2<br>~~<br>2<br>\<br>**5**<br>1<br>—Vin=5V, Vout=3.3,<br>0FLM<br>)<br>25.0<br>45.0<br>65.0<br>85.0<br>105.0<br>AMBIENTOFTEMPERATURE(°C)|
|---|---|
|**FIG.15 EFFICIENCY V.S. LOADCURRENT**|**FIG.16 DE-RATING CURVE**|
|IP<br>Peak-Peak<br>4.00mv<br>3.32m<br>800,<br>5.60m<br>1.26m|~~poet~~<br>[P<br>Peak—Peak<br>5.20mvV<br>5.19m_<br>800,<br>7.40m<br>149m|
|**FIG.17 OUTPUT RIPPLE**<br>**(5.0VINto 3.3VOUT, IOUT=0A)**|**FIG.18 OUTPUT RIPPLE**<br>**(5.0VINto 3.3VOUT, IOUT=5A)**|
|TekStop ~~A~~<br>~~es~~<br>~~ne~~<br>~~u~~<br>~~{~~<br>~~}~~<br>hAm<br>t<br>|<br>:<br>\<br>|<br>:<br>t+¥243.0000us<br>10k points|EN<br>PG<br>Vout<br>‘Tek Stop ~~SS~~ ————————————————— ~~S|~~<br>~~u~~<br>~~{~~<br>~~u~~<br>~~}~~<br>~~}~~<br>(meresserena<br>ol<br>oom<br>Gy 6.000000ms) 10k points|
|**FIG.19 TRANSIENT RESPONSE**<br>**(5.0VIN to 3.3VOUT, 2.5A to 5A LOAD STEP)**|**FIG.20 TURN-ON**<br>**(5.0VIN to 3.3VOUT, IOUT=5A)**|
8
Rev. A1
## **MUN3CAD05-JF**
## **APPLICATIONS INFORMATION:** ~~hs~~
## **SAFETY CONSIDERATIONS:**
Certain applications and/or safety agencies may require fuses at the inputs of power conversion components. Fuses should also be used when there is the possibility of sustained input voltage reversal which is not current limited. For greatest safety, we recommend a fast blow fuse installed in the ungrounded input supply line. The installer must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in compliance with the end-user safety standard.
## **INPUT AND OUTPUT CAPACITOR SELECTION:**
The module should be connected to as low AC impedance source supply and a highly inductive source or line inductance can affect the stability of the module. Ceramic capacitor has a DC-Bias effect which has a strong influence on the final effective capacitance. Choose the right capacitor carefully in combination with considering its package size and voltage rating. Ensure that the input effective capacitance is at least 12μF and the output effective capacitance is at least 22μF. Following are some suggestion for the input and output capacitor suggestion.
**==> picture [311 x 78] intentionally omitted <==**
**----- Start of picture text -----**<br>
VIN=2.75V~5.5V,<br>CIN=47uF or 22uF x 2 VOUT=0.6V~3.3V, COUT = 47uF or 22uF x 2<br>VIN VOUT<br>REN RFB_<br>CIN EN Power TOP COUT<br>Module FB<br>PG RFB_<br>BOT<br>GND<br>**----- End of picture text -----**<br>
**FIG.21 Reference Circuit with CIN and COUT Component Suggestion**
**==> picture [445 x 118] intentionally omitted <==**
**----- Start of picture text -----**<br>
||||
|---|---|---|
|Reference|Description|Vender|
|CIN|Vin range =2.75V~5.5V|MURATA|
|47μF, Ceramic Capacitor, 6.3V, X5R, size 0805, GRM21BR60J476M|
|or 22μF x 2, Ceramic Capacitor, 6.3V, X7T, size 0805, GRM21BD70J226M|
|COUT|Vin range =2.75V~5.5V|MURATA|
|47μF, Ceramic Capacitor, 6.3V, X5R, size 0805, GRM21BR60J476M|
|or 22μF x 2, Ceramic Capacitor, 6.3V, X7T, size 0805, GRM21BD70J226M|
**----- End of picture text -----**<br>
**TABLE.1 CIN and COUT Component Suggestion**
9
Rev. A1
## **MUN3CAD05-JF**
**FEEDFORWARD CAPACITOR FOR LOAD TRANSIENT CONSIDERATIONS:** The MUN3CAD05-JF integrates the compensation components to achieve good stability and fast transient responses. In some applications, adding a maximum 100pF ceramic cap between VOUT and FB may further speed up the load transient responses and is thus recommended for applications with large load transient step requirements.
## **PROGRAMMING OUTPUT VOLTAGE:**
The output voltage can be programmed by the dividing resistor RFB_top (recommended 10k~200kohm) and RFB_bot (recommended 10k~200kohm), Assume RFB_top set 100 Kohm, the output voltage can be calculated as shown in Equation 1 and the resistance according to typical output voltage is shown in TABLE 1.
VOUT (V) = 6.0 + 1 RFB_top RFB_bot
**==> picture [34 x 10] intentionally omitted <==**
|VOUT|<br><br>RFB_bot<br>6.0<br>(V)<br>VOUT|<br><br>RFB_bot|
|---|---|---|
|VOUT (V)|RFB_top (k)|RFB_bot(k)|
|1.0|100|150|
|1.2|100|100|
|1.8|100|50|
|2.5|100|31.58|
|3.3|100|22.22|
**TABLE.1 RESISTOR VALUES FOR COMMON OUTPUT VOLTAGES**
10
Rev. A1
**MUN3CAD05-JF**
~~ee~~ **APPLICATIONS INFORMATION: (Cont.)**
## **THERMAL CONSIDERATIONS:**
All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test board size is 30mm×30mm×1.6mm with 4 layers 2oz. The case temperature of module sensing point is shown as FIG.21 Then Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The module is designed for using when the case temperature is below 110°C regardless the change of output current, input/output voltage or ambient temperature.
**Sensing point (Defined case temperature)**
**FIG.21 CASE TEMPERATURE SENSING POINT**
11
Rev. A1
## **MUN3CAD05-JF**
## **APPLICATIONS INFORMATION: (Cont.)**
## **REFLOW PARAMETERS:**
Lead-free soldering process is a standard of electronic products production. Solder alloys like Sn/Ag, Sn/Ag/Cu and Sn/Ag/Bi are used extensively to replace the traditional Sn/Pb alloy. Sn/Ag/Cu alloy (SAC) is recommended for this power module process. In the SAC alloy series, SAC305 is a very popular solder alloy containing 3% Ag and 0.5% Cu and easy to obtain. Figure 22 shows an example of the reflow profile diagram. Typically, the profile has three stages. During the initial stage from room temperature to 150°C, the ramp rate of temperature should not be more than 3°C/sec. The soak zone then occurs from 150°C to 200°C and should last for 60 to 120 seconds. Finally, keep at over 217°C for 60~150 seconds to melt the solder and make the peak temperature at the range from 255°C to 260°C (Do not exceed 30 sec). It is noted that the time of peak temperature should depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and one should adopt it for optimization according to various solder type and various manufacturers’ formulae.
## **FIG.22 RECOMMENDATION REFLOW PROFILE**
## **(Not to scale)**
***Refer to the Classification Reflow Profile of J-STD-020.**
12
Rev. A1
## **MUN3CAD05-JF**
## **PACKAGE OUTLINE DRAW:**
**==> picture [49 x 9] intentionally omitted <==**
**----- Start of picture text -----**<br>
Unit:mm<br>**----- End of picture text -----**<br>
13
Rev. A1
## **MUN3CAD05-JF**
**==> picture [341 x 608] intentionally omitted <==**
**----- Start of picture text -----**<br>
LAND PATTERN REFERENCE:<br> Unit: mm<br>|<br>coe 1 |<br>0.450 k— 0.960 0.70<br>neoT L<br>3.600 4 0.520 -<br>0.195 [ -—++ 40.400<br>Stk CF<br>L399 —___+<br>RECOMMENDED LAND PATTERN<br>| /-<br>LIE<br>0.520 -k————++ 0.850<br>—<br>|<br>5s 200 | Ll Ta<br>CI rl L<br>iL<br>RECOMMENDED STENCIL PATTERN*<br>*Based on 0.1~0.15mm thickness stencil (Reference only)<br>*Recommended solder paste coverage 55~100%<br>**----- End of picture text -----**<br>
14
Rev. A1
## **MUN3CAD05-JF**
## **PACKING REFERENCE:**
|Unit: mm|Unit: mm|||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||**Package In Tape Loading Orientation**||**Package In Tape Loading Orientation**|||||||
||||||Pini||||||Sprocket||hole|
||||||()||||©|||||
||||||**Tape Dimension**|**Tape Dimension**||||||||
|Do<br>Po<br>P2<br>B<br>| |<br>a<br>:<br>|<br>& oP<br>0 P}O 0:0<br>0 4<br>'<br>'<br>supnboeHesBH<br>:<br>|<br>;<br>D1<br>~B<br>Pulling|||||||||||=<br>Li<br>=<br> Direction||5'(MAX)<br>«7h|
||||A0||3.200.10||||E1|||1.750.10|0.10|
||||B0||3.300.10||||K0|||1.650.10|0.10|
||||F||5.500.05||||P0|||4.000.10|0.10|
||||W||12.000.30||||P1|||4.000.10|0.10|
||||D0||φ1.550.05||||P2|||2.000.05|0.05|
||||D1||φ1.5 +0.1/-0||||T|||0.250.10|0.10|
15
Rev. A1
## **MUN3CAD05-JF**
## **PACKING REFERENCE: (Cont.)**
**==> picture [344 x 178] intentionally omitted <==**
**----- Start of picture text -----**<br>
Unit: mm<br>Reel Dimension<br>See Detail A<br>/ ( \ | \<br>/ [O] \ \<br>// / ~ \\ r\ \ \<br>| \f 2 & } a | wasy) \<br>\ \ __ / ;/ Detail A<br>\ \) ey, / oe<br>**----- End of picture text -----**<br>
## **Peel Strength of Top Cover Tape**
The peel speed shall be about 300mm/min. The peel force of top cover tape is between 0.1N to 1.3N
16
Rev. A1
**MUN3CAD05-JF**
|**Date**|**Revision**|**Changes**|
|---|---|---|
|2020.11.24|P00|Release the preliminary specification.|
|2021.09.06|P01|Update the typical performance characteristics.|
|2022.03.07|P02|Update the electrical specifications.|
|2022.05.11|P03|Modify the reflow parameters.|
|2022.11.07|P04|Update outline drawing and typical performance<br>characteristics.|
|2022.12.16|P05|Add the input, output and feedforward capacitor description in<br>application information.|
|2022.12.21|P06|Add the RFB_bot range in application information and update<br>reflow parameters.|
|2024.12.16|A1|1、Synchronized with document management number|
17
Rev. A1
Updated at June 9, 2026
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