MUN3CAD03-JE

Non Isolated POL DC/DC Converter, ITE, Micro Module, 12 W, 600 mV, 4 V, 3 A

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
Manufacturer: CYNTEC
Product type: DC / DC Non Isolated Board Mount Converters - Adjustable Output
SVHC: No SVHC (21-Jan-2025)
Depth: 3mm
Width: 2.8mm
Height: 1.3mm
Product Range: -
Output Power Max: 12W
Output Current Max: 3A
Output Voltage Max: 4V
Output Voltage Min: 600mV
Input Voltage DC Max: 5.5V
Input Voltage DC Min: 2.75V
DC / DC Converter Type: Micro Module
Power Supply Applications: ITE
DC / DC Converter Output Type: Adjustable
Delivery and price
Units per pack	500
Price	1.76 €
Current stock	1000+
Lead time	30 days
Datasheet
## **uPOL MODULE** 

## **3A, High Efficiency uPOL Module** 

**MUN3CAD03-JE** 

## **FEATURES:** ~~A,~~ 

◼ High Density uPOL Module 

- 3A Output Current 

- 94.5% Peak Efficiency at 5.0Vin to 3.3Vout 

- Input Voltage Range from 2.75V to 5.5V 

- Adjustable Output Voltage 

- Enable / PGOOD Function 

- Force PWM Mode 

- Protections (UVLO,OCP: Non-latching, OTP) 

- Internal Soft Start 

- Compact Size: 3.0mm*2.8mm*1.3mm 

- Pb-free for RoHS compliant 

- 100% Duty Cycle Operation 

- ◼ MSL 2, 260°C Reflow 

## **GENERAL DESCRIPTION:** 

The uPOL module is non-isolated dc-dc converters that can deliver up to 3A of output current. The PWM switching regulator, high frequency power inductor are integrated in one hybrid package. It only needs input/output capacitors and voltage dividing resistors. 

The module operates with PWM mode in full loading range to minimize the output voltage ripple and the module offers a simpler control loop and faster transient response. Other features include remote enable function, internal soft-start, non-latching over current protection, power good, and input under voltage locked-out capability. 

## **APPLICATIONS:** ~~ee~~ 

◼ Single Li-Ion Battery-Powered Equipment 

- Server power / telecom power 

- Cell Phones / PDAs / Palmtops 

- ◼ SSD 

The low profile and compact size package (3.0mm × 2.8mm x 1.3mm) is suitable for automated assembly by standard surface mount equipment. The uPOL module is Pb-free and RoHS compliance. 

## **TYPICAL APPLICATION CIRCUIT& PACKAGE:** ~~|~~ 

**==> picture [422 x 84] intentionally omitted <==**

**----- Start of picture text -----**<br>
Vin Vout<br>VIN VOUT<br>REN RFB_<br>CIN Power  TOP 1.3mm<br>EN<br>COUT<br>Module FB<br>2.8mm<br>PG<br>RFB_<br>BOT 3.0mm<br>GND<br>**----- End of picture text -----**<br>


**FIG.1 TYPICAL APPLICATION CIRCUIT** 

**FIG.2 HIGH DENSITY LOW PROFILE uPOL MODULE** 

1 

Rev. A1 

## **MUN3CAD03-JE** 

## **ORDER INFORMATION:** 

||**Ambient Temp. Range**|**Ambient Temp. Range**|**Package**|||
|---|---|---|---|---|---|
|**Part Number**||||**MSL**|**Note**|
|||**(°C)**|**(Pb-Free)**|||
|MUN3CAD03-JE|-40 ~ +125|-40 ~ +125|DFN|Level 2|-|
|||||||
|**Order Code**|||**Packing**||**Quantity**|
|MUN3CAD03-JE|||Tape and reel||2000|



## **PIN CONFIGURATION:** 

**==> picture [172 x 101] intentionally omitted <==**

**----- Start of picture text -----**<br>
e. 7<br>EN LI 1  4 )e-H 8 VOUT<br>PG raLJ 2 | prL 7 J FB<br>en i 9 Ie<br>VIN Lo 3 GND boo 6 GND<br>-27tL__|]rna|<br>VIN Lo 4 Lo 5 GND<br>**----- End of picture text -----**<br>


## **TOP VIEW** 

## **PIN DESCRIPTION:** 

|**Symbol**|**Pin No.**|**Description**|
|---|---|---|
|EN|1|Enable control. Pull High to enable the module. Pull Low to disable the<br>module. This pin has an internal pull-down resistor of typically 1000k<br>Ω|
|PG|2|Power Good indicator. The pin output is an open drain with internal<br>1000kΩ pull-upresistor to Vin|
|VIN|3, 4|Power input pin.|
|VOUT|8|Power output pin.|
|FB|7|Feedback input. Connect an external resistor divider from the output to<br>FB and FB to GND.|
|GND|5, 6, 9|Power ground pin for signal, input, and output return path. This pin<br>needs to connect one or more ground plane directly.|



2 

Rev. A1 

**MUN3CAD03-JE** 

## **ELECTRICAL SPECIFICATIONS:** ~~ee~~ 

CAUTION: Do not operate at or near absolute maximum rating listed for extended periods of time. This stress may adversely impact product reliability and result in failures not covered by warranty. 

|**Parameter**<br>~~ee~~<br>~~en~~|**Description**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|◼<br>Absolute Maximum Ratings<br>~~ee~~<br>~~en~~<br>~~es~~||||||
|VIN to GND<br>~~en~~<br>~~es~~<br>~~Rs~~|~~(~~|-|-|+6.0|V|
|VOUT to GND<br>~~es~~<br>~~Rs~~<br>~~Rs~~|~~(~~<br>~~(~~|-|-|+6.0|V|
|SW to GND<br>~~Rs~~<br>~~Rs~~<br>~~ee~~|Note 1<br>~~(~~<br>~~(~~|-|-|VIN+0.3|V|
|EN to GND<br>~~Rs~~<br>~~ee~~<br>~~ee~~|Note 1<br>~~(~~|-|-|+6.0|V|
|Tc<br>~~ee~~<br>~~ee~~<br>~~ee~~|Case Temperature of Inductor|-|-|+125|°C|
|Tj<br>~~ee~~<br>~~ee~~<br>~~ee~~|Junction Temperature|-40|-|+150|°C|
|Tstg<br>~~ee~~<br>~~ee~~|Storage Temperature|-40|-|+125|°C|
|ESD Rating<br>~~ee~~<br>~~pr~~|Human Body Model (HBM)<br>~~pr~~|-<br>~~pr~~<br>~~ee~~|-<br>~~pr~~|2k<br>~~pr~~|V<br>~~pr~~|
||Charge Device Model (CDM)<br>~~pr~~<br>~~es~~|-<br>~~pr~~<br>~~es~~<br>~~ee~~|-<br>~~pr~~<br>~~es~~|500<br>~~pr~~<br>~~es~~|V<br>~~pr~~<br>~~es~~|
|◼<br>Recommendation Operating Ratings<br>~~ee~~<br>~~ee~~<br>~~ee~~||||||
|VIN<br>~~ee~~<br>~~ee~~|Input Supply Voltage<br>~~ee~~|+2.75<br>~~ee~~|-<br>~~ee~~|+5.5<br>~~ee~~|V<br>~~ee~~|
|VOUT<br>~~ee~~<br>~~**a**~~|Adjusted Output Voltage<br>~~ee~~|+0.6<br>~~ee~~|-|+4.0|V|
|Ta<br>~~**a**~~|Ambient Temperature<br>(Refer to de-rating curve)<br>~~ee~~|-40<br>~~ee~~|-|+125|°C|
|◼<br>Thermal Information<br>~~**a**~~<br>~~ee ee~~||||||
|Rth(jchoke-a)|Thermal resistance from junction to<br>ambient,Ta = 25℃(Note 1)|-|31.9|-|°C/W|



NOTES: 

1. Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The test board size is 30mm× 30mm× 1.6mm with 4 layers, 2 oz per layer. The test condition is complied with JEDEC EIJ/JESD 51 Standards. 

3 

Rev. A1 

**MUN3CAD03-JE** 

## ~~ee~~ **ELECTRICAL SPECIFICATIONS:(Cont.)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2 oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Vin = 3.3V, Vout = 1.8V, Cin =22uF/6.3V/0805/X7T, Cout = 22uF/6.3V/0805/X7T, unless otherwise specified. 

|**Symbol**<br>~~a~~<br>~~en~~|**Parameter**<br>~~ee~~<br>~~en~~|**Conditions**<br>~~ee~~|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|◼<br>Input Characteristics<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~en~~|||||||
|ISD<br>~~en~~<br>~~a~~|Input shutdown<br>current<br>~~en~~|Vin=3.3V,EN = GND|-|0.1|1.0|uA|
|IIN<br>~~a~~|Input supply bias<br>current<br>~~ee~~|Input supply bias<br>Vin=3.3V, Iout=0A<br>Vout = 1.8V,EN = VIN<br>~~ee~~|-<br>~~ee~~|15<br>~~ee~~|-<br>~~ee~~|mA<br>~~ee~~|
|IS<br>~~ss~~|Input supply<br>current<br>~~ss~~|Vin=3.3V, EN = VIN<br>Iout = 10mA<br>Vout = 1.8V<br>~~ss~~|-<br>~~ss~~|21<br>~~ss~~|-<br>~~>>~~|mA<br>~~>>~~|
|||Vin=3.3V, EN = VIN<br>Iout = 3.0A<br>Vout = 1.8V<br>~~ss~~<br>~~ee~~|-<br>~~ss~~<br>~~ee~~|1.84<br>~~ss ~~<br>~~ee~~|-<br> ~~>>~~<br>~~ee~~|A<br>~~>>~~<br>~~ee~~|
|◼<br>Output Characteristics<br>~~ee~~|||||||
|IOUT(DC)<br>~~ee~~|Output current<br>~~ee~~|Vin=3.3V, Vout=1.8V<br>~~ee~~|0<br>~~ee~~|-<br>~~ee~~|3<br>~~ee~~|A<br>~~ee~~|
|VFB<br>~~a~~|Feedback<br>Reference<br>Voltage|At PWM mode|0.591<br>~~ee~~|0.6<br>~~ee~~|0.609|V|
|ΔVOUT/ΔVIN<br>~~a~~<br>~~a~~|Line regulation<br>accuracy<br>~~ee~~|Vin = 3.3V to 5V<br>Vout = 1.8V, Iout = 3A<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|0.5<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|% VO(SET)<br>~~ee~~|
|ΔVOUT/ΔIOUT<br>~~a~~<br>~~a~~|Load regulation<br>accuracy<br>~~ee~~|Iout = 0A to 3A<br>Vin = 3.3V, Vout = 1.8V<br>~~ee~~|-<br>~~ee~~<br>~~ee ~~|0.5<br>~~ee~~<br> ~~ee~~|-<br>~~ee~~|% VO(SET)<br>~~ee~~|



Rev. A1 

4 

**MUN3CAD03-JE** 

## ~~ee~~ **ELECTRICAL SPECIFICATIONS:(Cont.)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2 oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Vin = 3.3V, Vout = 1.8V, Cin = 22uF/6.3V/0805/X7T, Cout = 22uF/6.3V/0805/X7T, unless otherwise specified. 

|**Symbol**<br>~~a~~|**Parameter**<br>~~ee~~|**Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|◼<br>Control Characteristics<br>~~a~~<br>~~ee~~<br>~~a~~|||||||
|VEN_TH<br>~~pe~~<br>~~a~~<br>~~a~~|Enable upper<br>threshold voltage<br>~~pe~~<br>~~ee~~|VEN_THrising<br>~~pe~~<br>~~ee~~|1.6<br>~~pe~~<br>~~ee~~|-<br>~~pe~~<br>~~ee~~|-<br>~~pe~~<br>~~ee~~|V<br>~~pe~~|
||Enable lower<br>threshold voltage<br>~~pe~~<br>~~ee~~<br>~~ee~~|VEN_THfalling<br>~~pe~~<br>~~ee~~<br>~~ee~~|-<br>~~pe~~<br>~~ee~~<br>~~ee~~|-<br>~~pe~~<br>~~ee~~<br>~~ee ee~~|0.5<br>~~pe~~<br>~~ee~~<br>~~ee~~|V<br>~~pe~~<br>~~ee~~|
|FOSC<br>~~a~~<br>~~a~~<br>~~a~~|Oscillator<br>frequency<br>~~ee~~<br>~~ee~~<br>~~ee~~|PWM Operation<br>~~ee ~~<br>~~ee~~<br>~~ee~~|-<br> ~~ee~~<br>~~ee~~<br>~~ee~~|2<br>~~ee ~~<br>~~ee ee~~<br>~~ee~~|-<br> ~~ee~~<br>~~ee~~<br>~~ee~~|MHz<br>~~ee~~|
|VPGOOD_TH<br>~~a~~<br>~~a~~|PGOOD high<br>~~ee~~<br>~~ee~~<br>~~ee~~|Respect the VREF<br>~~ee ~~<br>~~ee~~<br>~~ee~~|-<br> ~~ee~~<br>~~ee~~<br>~~ee~~|90<br>~~ee ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|%<br>~~ee~~|
|VPGOOD_LV<br>~~a~~|PGOOD logic low<br>voltage<br>~~ee~~<br>~~ee~~|IPGOOD= 1mA<br>~~ee~~<br>~~ee~~|-<br>~~ee ~~<br>~~ee~~|0.2<br> ~~ee ~~<br>~~ee~~|0.4<br> ~~ee~~<br>~~ee~~|V|
|◼<br>Fault Protection<br>~~ee~~<br>~~ee~~<br>~~ee ee~~<br>~~ee~~<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~eeee~~|||||||
|ILIMIT_TH<br>~~a~~|Current limit<br>threshold<br>~~ee~~|Peak value of output current<br>~~ee~~|-<br>~~ee~~|4.6<br>~~ee~~|-<br>~~ee~~|A|
|TOTP<br>~~a~~<br>~~ee~~|Over temperature<br>protection<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|160<br>~~ee ~~<br>~~ee~~<br>~~ee~~|-<br> ~~ee~~<br>~~ee~~<br>~~ee~~|°C<br>~~ee~~|
|UVLO<br>~~ee~~<br>~~a~~|Under voltage<br>lockout<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|2.4<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|



Rev. A1 

5 

**MUN3CAD03-JE** 

## **TYPICAL PERFORMANCE CHARACTERISTICS: (VOUT=1V)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Module: MUN3CAD03-JE. Cin = 22uF/6.3V/0805/X7T, Cout = 22uF/6.3V/0805/X7T, unless otherwise specified. The following figures provide the typical characteristic curves at Vout=1.0V. 

**FIG.3 EFFICIENCY V.S. LOAD CURRENT FIG.4 DE-RATING CURVE** ~~eS SSS a~~ ‘Tek Stop ~~rr SSS~~ 5.00mv 6.20m. 4.60m 8.00m. 999) [PB Peak-Peak 5.20mV___6.09m 4.60m 8.00m 990, **FIG.5 OUTPUT RIPPLE FIG.6OUTPUT RIPPLE (3.3VIN, IOUT=0A) (3.3VIN, IOUT=3A)** ~~(as~~ Mn | u + ‘Tek Stop a es t iu PG i ol | : T VIN ; VOUT } T -"253.0000us )| toi points ; ee[P Peak-Peak 1.04V 1.04 1.04 ee1.04 0.00 **FIG.7 TRANSIENT RESPONSE FIG.8 TURN-ON (3.3VIN, 1.5A to 3A LOAD STEP) (3.3VIN, IOUT=3A)** 

6 

Rev. A1 

**MUN3CAD03-JE** 

## **TYPICAL PERFORMANCE CHARACTERISTICS: (VOUT=1.8V)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Module: MUN3CAD03-JE. Cin =22uF/6.3V/0805/X7T, Cout = 22uF/6.3V/0805/X7T, unless otherwise specified. The following figures provide the typical characteristic curves at Vout=1.8V. 

**==> picture [377 x 367] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIG.9 EFFICIENCY V.S. LOAD CURRENT FIG.10 DE-RATING CURVE<br>| (ee ‘Tek Stop a ——————————<br>@<br>value Mean Min Max Std Dev | \#ir0.000000s_) (10k points Ler7 4om0er) value Mean Min Max Std Dev | \tr0.000000 s_) (10k<br>FIG.11 OUTPUT RIPPLE  FIG.12 OUTPUT RIPPLE<br>(3.3VIN, IOUT=0A) (3.3VIN, IOUT=3A)<br>Es u i : S| Tek Stop ao iu<br>   PG<br>i VIN<br>+ba +<br>VOUT<br>t f<br>29.6mV__28.2m 23.2m 30.4m 2.70m [PD Peak-Peak 1.86 V 1.45 1.04 1.86 ssom<br>FIG.13 TRANSIENT RESPONSE  FIG.14 TURN-ON<br>(3.3VIN, 1.5A to 3A LOAD STEP) (3.3VIN, IOUT=3A)<br>**----- End of picture text -----**<br>


Rev. A1 

7 

**MUN3CAD03-JE** 

## **TYPICAL PERFORMANCE CHARACTERISTICS: (VOUT=3.3V)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Module: MUN3CAD03-JE. Cin = 22uF/6.3V/0805/X7T, Cout = 22uF/6.3V/0805/X7T, unless otherwise specified. The following figures provide the typical characteristic curves at Vout=3.3V. 

|||||||||AMBIENT OF TEMPERATURE(°C)|
|---|---|---|---|---|---|---|---|---|
|**FIG.15 EFFI**||**EFFICIENCY V.S. LOADCURRENT**||||||**FIG.16 DE-RATING CURVE**|
|~~Sc~~<br>|~~esfn~~<br>:|||||‘Tek Stop||_~~OS~~|~~OS~~|~~OSSs~~<br>~~A~~<br>:|
|||y||||||y|
|||||||as|||
|Peak-Peak|7.00mV_|7.14m<br>6.80m.<br>8.00m<br>198)||[P|Peak-Peak||7.80mV__|7.21m<br>6.80m<br>8.00m<br>263)|
|||**FIG.17 OUTPUT RIPPLE**||||||**FIG.18 OUTPUT RIPPLE**|
|||**(5.0VIN, IOUT=0A)**||||||**(5.0VIN, IOUT=3A)**|
|~~e~~~~**e**~~<br>e|||||||||
|||||‘TekStop|Stop ~~fe~~||~~fe~~|~~fe~~|
|||||||||PG<br>i<br>i|
|||||||||VIN|
|||t||||||VOUT<br>:|
||||||[BP|Peak-Peak|3.34V|2.08<br>1.04<br>3.34<br>117|
||**FIG.19 TRANSIENT RESPONSE**|||||||**FIG.20 TURN-ON**|
|**(5.0VIN, 50% to 100% LOAD STEP)**||||||||**(5VIN, IOUT=3A)**|



8 

Rev. A1 

## **MUN3CAD03-JE** 

## **APPLICATIONS INFORMATION:** ~~ee~~ 

## **SAFETY CONSIDERATIONS:** 

Certain applications and/or safety agencies may require fuses at the inputs of power conversion components. Fuses should also be used when there is the possibility of sustained input voltage reversal which is not current limited. For greatest safety, we recommend a fast blow fuse installed in the ungrounded input supply line. The installer must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in compliance with the end-user safety standard. 

## **INPUT AND OUTPUT CAPACITOR SELECTION:** 

The module should be connected to as low AC impedance source supply and a highly inductive source or line inductance can affect the stability of the module. Ceramic capacitor has a DC-Bias effect which has a strong influence on the final effective capacitance. Choose the right capacitor carefully in combination with considering its package size and voltage rating. Ensure that the input effective capacitance is at least 9 μF and the output effective capacitance is at least 12 μF. Following are some suggestion for the input and output capacitor suggestion. 

**==> picture [267 x 74] intentionally omitted <==**

**----- Start of picture text -----**<br>
VIN=2.75V~5.5V, CIN=22uF VOUT=0.6V~4V, COUT =22uF<br>VIN VOUT<br>REN RFB_<br>CIN EN Power  TOP COUT<br>Module FB<br>PG RFB_<br>BOT<br>GND<br>**----- End of picture text -----**<br>


**FIG.21 Reference Circuit with CIN and COUT Component Suggestion** 

|Reference|Description|Manufacturer|
|---|---|---|
|CIN|22μF, Ceramic Capacitor, 6.3V, X7T, size 0805, GRM21BD70J226ME44|MURATA|
|COUT|22μF, Ceramic Capacitor, 6.3V, X7T, size 0805, GRM21BD70J226ME44|MURATA|



**TABLE.1 CIN and COUT Component Suggestion** 

9 

Rev. A1 

## **MUN3CAD03-JE** 

## **PROGRAMMING OUTPUT VOLTAGE:** 

MUN3CAD03-JE output voltage can be programmed by the dividing resistor RFB_top and RFB_bot, Assume RFB_top set 200 Kohm, the output voltage can be calculated as shown in Equation 1 and the resistance according to typical output voltage is shown as following table. 

VOUT (V) = 6.0  + 1 RFB_top   RFB_bot  

**==> picture [34 x 10] intentionally omitted <==**

|Vout (V)|RFB_top (k)|RFB_bot(k)|
|---|---|---|
|1.0|200|300|
|1.2|200|200|
|1.8|200|100|
|2.5|200|63.158|
|3.3|200|44.444|



**TABLE.2 RESISTOR VALUES FOR COMMON OUTPUT VOLTAGES** 

10 

Rev. A1 

**MUN3CAD03-JE** 

## **THERMAL CONSIDERATIONS:** 

All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test board size is 30mm× 30mm× 1.6mm with 4 layers 2oz. The case temperature of module sensing point is shown as FIG.22 Then Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The module is designed for using when the case temperature is below 125°C regardless the change of output current, input/output voltage or ambient temperature. 

Sensing point (Defined case temperature) 

## **FIG.22 CASE TEMPERATURE SENSING POINT** 

11 

Rev. A1 

## **MUN3CAD03-JE** 

## **APPLICATIONS INFORMATION: (Cont.)** 

## **REFLOW PARAMETERS:** 

Lead-free soldering process is a standard of electronic products production. Solder alloys like Sn/Ag, Sn/Ag/Cu and Sn/Ag/Bi are used extensively to replace the traditional Sn/Pb alloy. Sn/Ag/Cu alloy (SAC) is recommended for this power module process. In the SAC alloy series, SAC305 is a very popular solder alloy containing 3% Ag and 0.5% Cu and easy to obtain. Figure 23 shows an example of the reflow profile diagram. Typically, the profile has three stages. During the initial stage from room temperature to 150°C, the ramp rate of temperature should not be more than 3°C/sec. The soak zone then occurs from 150°C to 200°C and should last for 60 to 120 seconds. Finally, keep at over 217°C for 60~150 seconds to melt the solder and make the peak temperature at the range from 255°C to 260°C (Do not exceed 30 sec). It is noted that the time of peak temperature should depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and one should adopt it for optimization according to various solder type and various manufacturers’ formulae. 

## **FIG.23 RECOMMENDATION REFLOW PROFILE*** 

## **(Not to scale)** 

## ***Refer to the Classification Reflow Profile of J-STD-020.** 

12 

Rev. A1 

## **MUN3CAD03-JE** 

## **PACKAGE OUTLINE DRAWING:** 

**==> picture [63 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
Unit: mm<br>**----- End of picture text -----**<br>


13 

Rev. A1 

**MUN3CAD03-JE** 

## **LAND PATTERN REFERENCE:** ~~Lo~~ 

Unit: mm 8x0.90 1.10 ~~a~~ | oo aS | Cit] ee2) ee RECOMMENDED LAND PATTERN 8x0.90 2x1.04 aS Tt JK¥____250 RECOMMENDED STENCIL PATTERN* *Based on 0.1~0.15mm thickness stencil (Reference only) *Recommended solder paste coverage 55~100% 

14 

Rev. A1 

**MUN3CAD03-JE** 

|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|**PACKING REFERENCE:**<br>~~ee~~|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||Unit: mm|Unit: mm||||||||||||||
|||||||**Package In Tape Loading Orientation**||**Package In Tape Loading Orientation**||||||||
|||||||Pini|||||Sprocket hole|||||
|||||||O||||Oo||||||
||||||||||||\°|||||
|||||||**Tape Dimension**|**Tape Dimension**|||||||||
||Do<br>Po<br>P2<br>B<br>=<br>{| |<br>a<br>:<br>|<br>& oP<br>0 P}O 0:0<br>0 4<br>_<br>sugnovobOs-|<br>:<br>|<br>;<br>D1<br>~B<br>Pulling Direction|||||||||||5'(MAX)<br>«7H<br>Ko|T<br>TT||Z<br>S<br>3<br>:|
|||||A0||3.200.10||||E1|1.750.10|0.10||||
|||||B0||3.300.10||||K0|1.650.10|0.10||||
|||||F||5.500.05||||P0|4.000.10|0.10||||
|||||W||12.000.30||||P1|4.000.10|0.10||||
|||||D0||φ1.550.05||||P2|2.000.05|0.05||||
|||||D1||φ1.5 +0.1/-0||||T|0.250.10|0.10||||



15 

Rev. A1 

## **MUN3CAD03-JE** 

## **PACKING REFERENCE: (Cont.)** 

**==> picture [334 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
Unit: mm<br>Reel Dimension<br>See Detail A<br>Detail A<br>**----- End of picture text -----**<br>


## **Peel Strength of Top Cover Tape** 

The peel speed shall be about 300mm/min. 

The peel force of top cover tape is between 0.1N to 1.3N 

16 

Rev. A1 

**MUN3CAD03-JE** 

## **REVISION HISTORY:** ~~ee~~ 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|2022.07.18|P00|Release the preliminary specification.|
|2022.10.12|P01|Add the typical performance characteristics.|
|2022.10.28|P02|Add the thermal derating curve.|
|2024.12.16|A1|1、Synchronized with document management number|



17 

Rev. A1
Updated at June 9, 2026
About Novapart

Novapart is a B2B electronic component broker specialising in stock shortages and cost reduction. We source hard-to-find parts and identify compliant alternatives across a catalogue of 410,000+ components from 500+ manufacturers.
Learn more →
Stock Shortage Specialist

When a component is unavailable, discontinued or has an unacceptable lead time, we tap into our network of vetted European and Asian distributors to source what you need — without compromising on quality or traceability.
Request a quote →
Compliant Alternatives

We identify pin-to-pin, electrically equivalent substitutes that meet the same certifications (RoHS, AEC-Q100, REACH) as your original specification — validated against datasheets, not just part numbers. Often at a lower cost.
BOM Analysis service →