MUN3CAD02-JE

## **uPOL MODULE** 

**2A, High Efficiency uPOL Module** 

## **MUN3CAD02-JE** 

## **FEATURES:** 

- High Density uPOL Module 

- 2A Output Current 

- Input Voltage Range from 2.7V to 5.5V 

- Adjustable Output Voltage 

- Enable / Power Good Function 

- Forced PWM Mode 

- Protections (input UVLO, OCP: Nonlatching, OTP, OVP) 

- Internal Soft Start 2.1mS 

- Compact Size: 3.5mm*2.5mm*1.5mm 

- Pb-free for RoHS compliant 

- 100% dropout voltage 

- MSL 2, 260°C Reflow 

## **GENERAL DESCRIPTION:** 

The uPOL module is non-isolated dc-dc converters that can deliver up to 2A of output current. The PWM switching regulator, high frequency power inductor are integrated in one hybrid package. It only needs input/output capacitors and voltage dividing resistors. 

The module was forced PWM mode, through constant on-time control. The module offers a simpler control loop and faster transient response. Other features include remote enable function, internal soft-start, non-latching over current protection, power good, and input under voltage locked-out capability. 

## **APPLICATIONS:** 

The low profile and compact size package is suitable for automated assembly by standard surface mount equipment. 

- 100G/400G/800G Optical module 

- Server power / telecom power 

- SSD 

## **TYPICAL APPLICATION CIRCUIT& PACKAGE:** 

**==> picture [226 x 83] intentionally omitted <==**

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Vin Vout<br>IN OUT<br>REN<br>CIN EN OUT_S RFB_ COUT<br>Power  TOP CFB<br>PG Module FB<br>PGND RFB_<br>BOT<br>AGND<br>**----- End of picture text -----**<br>


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1.5mm<br>3.5mm<br>2.5mm<br>**----- End of picture text -----**<br>


**FIG.1 TYPICAL APPLICATION CIRCUIT** 

**FIG.2 HIGH DENSITY uPOL MODULE** 

1 

Rev. A1 

## **MUN3CAD02-JE** 

## **ORDER INFORMATION:** 

||**Ambient Temp. Range**|**Ambient Temp. Range**||||||
|---|---|---|---|---|---|---|---|
|**Part Number**|||**Package (Pb-Free)**|**MSL**||**MSL**|**Note**|
||**(°C)**|**(°C)**||||||
|MUN3CAD02-JE|-40 ~ +105||QFN|Level 2||Level 2|-|
|||||||||
|**Order Code**|||**Packing**|||**Quantity**||
|MUN3CAD02-JE|||Tape and reel|||2000||



## **PIN CONFIGURATION:** 

**==> picture [162 x 113] intentionally omitted <==**

**----- Start of picture text -----**<br>
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## **TOP VIEW** 

## **PIN DESCRIPTION:** 

|**Symbol**|**Pin No.**|**Description**|
|---|---|---|
|AGND|1|Analog ground. The internal controller ground|
|FB|2|Feedback input. Connect an external resistor divider from the output to<br>FB and FB to GND.|
|OUT_S|3|Output Voltage Sense Pin.|
|EN|4|Enable control. Do not be float.|
|SW|5~7、15|Switch node. Leave it no connection.|
|OUT|8~10|Power output pin.|
|NC|11|No connection. Float NC or connect NC to GND|
|PG|12|Power Good indicator. Power Good indicator. With internal 500kΩ pull-<br>upresistortoVIN.|
|IN|13~14|Power input pin.|
|PGND|16|Power ground.|
|NC|17~18|No connection. Leave NC floating.|



2 

Rev. A1 

**MUN3CAD02-JE** 

## **ELECTRICAL SPECIFICATIONS:** ~~eee~~ 

CAUTION: Do not operate at or near absolute maximum rating listed for extended periods of time. This stress may adversely impacted product reliability and result in failures not covered by warranty. 

|**Parameter**<br>~~ee~~|**Description**<br>~~ee~~|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|◼<br>Absolute Maximum Ratings<br>~~ee ee~~<br>~~a~~<br>~~ee~~||||||
|VIN to GND<br>~~ee~~<br>~~ee~~||-0.3|-|+6.0|V|
|VOUT to GND<br>~~ee~~<br>~~ee~~<br>~~ee~~||-|-|+6.0|V|
|SW to GND<br>~~ee~~<br>~~ee~~||-0.3|-|VIN+0.3|V|
|The other pin to GND<br>~~ee~~<br>~~a~~<br>~~es~~|~~es~~|-0.3<br>~~es~~|-<br>~~es~~|+6.0<br>~~es~~|V<br>~~es~~|
|Tc<br>~~es~~<br>~~es~~|Case Temperature of Inductor<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|+110<br>~~es~~<br>~~es~~|°C<br>~~es~~<br>~~es~~|
|Tj<br>~~es~~<br>~~es~~<br>~~es~~|Junction Temperature<br>~~es~~<br>~~es~~<br>~~es~~|-40<br>~~es~~<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~<br>~~es~~|+150<br>~~es~~<br>~~es~~<br>~~es~~|°C<br>~~es~~<br>~~es~~<br>~~es~~|
|Tstg<br>~~es~~<br>~~es~~|Storage Temperature<br>~~es~~<br>~~es~~|-40<br>~~es~~<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~<br>~~es~~|+125<br>~~es~~<br>~~es~~|°C<br>~~es~~<br>~~es~~|
|ESD Rating<br>~~es~~|Human Body Model (HBM)<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~ee~~<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~ee~~<br>~~es~~<br>~~ee~~|2k<br>~~es~~<br>~~ee~~<br>~~ee~~|V<br>~~es~~<br>~~ee~~|
||Machine Model (MM)<br>~~es~~|-<br>~~es ~~<br>~~es~~<br>~~es~~<br>~~es~~|-<br> ~~es~~<br>~~es~~<br>~~ee~~<br>~~ee~~|200<br>~~es~~<br>~~ee~~<br>~~ee~~|V<br>~~es~~|
||Charge Device Model (CDM)<br>~~es~~|-<br>~~es ~~<br>~~es~~<br>~~es~~|-<br> ~~ee ~~<br>~~es~~<br>~~ee~~|1000<br> ~~ee~~<br>~~es~~<br>~~ee~~|V<br>~~es~~|
|◼<br>Recommendation Operating Ratings<br>~~es~~<br>~~es ee ee~~<br>~~a~~<br>~~ss~~||||||
|VIN<br>~~a~~<br>~~ss~~|Input Supply Voltage<br>~~a~~<br>~~ss~~|+2.7<br>~~a~~<br>~~ss~~<br>~~ss~~<br>~~es~~|-<br>~~a~~<br>~~ss~~<br>~~ss~~|+5.5<br>~~a~~<br>~~ss~~|V<br>~~a~~<br>~~ss~~|
|VOUT<br>~~ss~~<br>~~ss~~<br>~~rs~~|Output Setting Voltage<br>~~ss~~<br>~~ss~~<br>|+0.6<br>~~ss~~<br>~~ss~~<br>~~ss~~<br>~~es~~<br>~~es~~<br>|-<br>~~ss~~<br>~~ss~~<br>~~ss~~<br>|+3.3<br>~~ss~~<br>~~ss~~<br>|V<br>~~ss~~<br>~~ss~~<br>|
|Ta<br>~~ss~~<br>~~ss~~<br>~~rs~~|Ambient Temperature<br>~~ss~~<br>~~ss~~<br>|-40<br>~~ss~~<br>~~es~~<br>~~ss~~<br>~~es~~<br>|-<br>~~ss~~<br>~~ss~~<br><br>~~es~~|+105<br>~~ss~~<br>~~ss~~<br>|°C<br>~~ss~~<br>~~ss~~<br>|
|Tj<br>~~ss~~<br>~~rs~~|Junction Temperature<br>~~ss~~<br>~~ss~~|-40<br>~~ss~~<br>~~es~~<br>~~ss~~|-<br>~~ss~~<br>~~ss~~<br>~~es~~|+135<br>~~ss~~<br>~~ss~~|°C<br>~~ss~~<br>~~ss~~|
|◼<br>Thermal Information<br>~~es~~<br>~~rsss~~<br>~~es~~<br>~~a~~<br>~~eses~~||||||
|Rth(jchoke-a)<br>~~es~~|Thermal resistance from junction to<br>ambient,Ta = 25℃(Note 1)<br>~~es~~|-<br>~~es~~|50.3<br>~~es~~|-<br>~~es~~|°C/W<br>~~es~~|



## NOTES: 

1. Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The test board size is 30mm× 30mm× 1.6mm with 4 layers, 2 oz per layer. The test condition is complied with JEDEC EIJ/JESD 51 Standards. 

3 

Rev. A1 

**MUN3CAD02-JE** 

~~rs~~ **ELECTRICAL SPECIFICATIONS:(Cont.)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 4 layers 2 oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Vin = 3.3V, Vout = 1.8V, Cin =22uF/6.3V/0805/X7R, Cout = 22uF/6.3V/0805/X7R, RFB_top = 100k Ω , CFB = 100pF. 

|100pF.|||||||
|---|---|---|---|---|---|---|
|**Symbol**<br>~~a~~<br>~~en~~|**Parameter**<br>~~ee~~<br>|**Conditions**<br>|**Min.**<br>|**Typ.**<br>|**Max.**<br>|**Unit**<br>|
|◼<br>Input Characteristics<br>~~a~~<br>~~ee~~<br>~~en~~<br>~~ee~~<br>~~ee~~|||||||
|Vin<br>~~ena~~<br>~~ee~~<br>~~a~~|Input voltage<br>range<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~|+2.7<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|+5.5<br>~~ee~~|V<br>~~ee~~|
|UVLO<br>~~ee~~<br>~~a~~<br>~~a~~|Input Under<br>voltage lockout<br>~~ee~~<br>~~ee~~|Vin increasing<br>~~ee~~<br>~~ee~~|2.3<br>~~ee~~<br>~~ee~~<br>~~ee~~|2.4<br>~~ee~~|2.5<br>~~ee~~|V|
|ISD<br>~~ee ~~<br>~~a~~<br>~~a~~<br>~~a~~|Input shutdown<br>current<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>|Vin=3.3V, EN=GND<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>|-<br>~~ee~~<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>|5.0<br>~~ee~~<br>~~ee~~<br>|-<br>~~ee~~<br>~~ee~~<br>|uA<br>|
|IIN<br>~~a~~<br>~~a~~|Input supply<br>bias current<br>~~ee~~<br>~~ee~~<br>|Vin=3.3V, Iout=0A<br>Vout=1.8V, EN=HIGH<br>~~ee~~<br>~~ee~~<br>|-<br>~~ee ~~<br>~~ee~~<br>|12<br> ~~ee~~<br>~~ee~~<br>|-<br>~~ee~~<br>~~ee~~<br>|mA<br>|
|IS<br>~~a~~|Input supply<br>current<br>~~ee~~<br>~~ee~~|Vin=3.3V, EN=HIGH<br>Iout=2.0A<br>Vout=1.8V<br>~~ee~~<br>~~ee~~|-<br>~~ee ~~<br>~~ee~~|1.22<br> ~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|A<br>~~ee~~|
|◼<br>Output Characteristics<br>~~ee~~|||||||
|IOUT(DC)|Output current|Output current|0|-|2|A|
|VFBREF|Feedback<br>Regulation<br>Voltage||591|600|609|mV|
|RDR|Dropout<br>resistance|100% on duty<br>~~ee~~|-|90|-|mΩ|
|Tss<br>~~ee~~|Soft start<br>~~ee~~|~~ee~~<br>~~ee~~|-<br>~~ee~~|2.1<br>~~ee~~|-<br>~~ee~~|mS<br>~~ee~~|



Rev. A1 

4 

**MUN3CAD02-JE** 

~~ee~~ **ELECTRICAL SPECIFICATIONS:(Cont.)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 4 layers 2 oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Vin = 3.3V, Vout = 1.8V, Cin =22uF/6.3V/0805/X7R, Cout = 22uF/6.3V/0805/X7R, RFB_top = 100k Ω , CFB = 100pF. 

|100pF.|||||||
|---|---|---|---|---|---|---|
|**Symbol**<br>~~a~~|**Parameter**<br>~~es~~|**Conditions**<br>~~es~~|**Min.**<br>~~es~~|**Typ.**<br>~~es~~|**Max.**<br>~~es~~|**Unit**<br>~~es~~|
|◼<br>Control Characteristics<br>~~aes~~<br>~~ee~~|||||||
|VEN_TH<br>~~pe~~<br>~~a~~<br>~~a~~|Enable upper<br>threshold voltage<br>~~pe~~<br>~~**e**s~~|VEN_THrising<br>~~pe~~<br>~~ee~~|1.17<br>~~pe~~<br>~~eee~~|1.2<br>~~pe~~<br>~~eee~~|1.23<br>~~pe~~<br>~~ee~~|V<br>~~pe~~<br>~~ee~~|
||Enable lower<br>threshold voltage<br>~~pe~~<br>~~**e**s~~<br>|VEN_THfalling<br>~~pe~~<br>~~ee~~<br>|1.07<br>~~pe~~<br>~~eee~~<br>|1.1<br>~~pe~~<br>~~eee~~<br>~~ee eee~~<br>|1.13<br>~~pe~~<br>~~ee~~<br>~~eee~~<br>|V<br>~~pe~~<br>~~ee~~<br>~~eee~~<br>|
|ENPDR<br>~~a~~<br>~~a~~<br>~~a~~|Internal Pull Down<br>Resistor<br>~~**e**s~~<br><br>|Internal Pull Down<br>~~ee ~~<br>~~e~~<br><br>|-<br> ~~eee~~<br>~~e~~<br><br>|1<br>~~eee ~~<br>~~e~~<br>~~ee eee~~<br><br>~~ee eee~~<br>|-<br> ~~ee~~<br>~~e~~<br>~~eee~~<br><br>~~eee~~<br>|MΩ<br>~~ee~~<br>~~e~~<br>~~eee~~<br><br>~~eee~~<br>|
|FOSC<br>~~a ee~~<br>~~a~~<br>~~a~~|Oscillator<br>frequency<br>~~ee~~<br>|PWM Operation<br>~~ee~~<br>|-<br>~~ee~~<br><br>~~**e**~~|1.2<br>~~ee eee~~<br>~~ee~~<br>~~ee eee~~<br><br>~~**e**e~~|-<br>~~eee~~<br>~~ee~~<br>~~eee~~<br><br>~~ee~~|MHz<br>~~eee~~<br>~~ee~~<br>~~eee~~<br>|
|VPGUV_TH<br>~~a~~<br>~~a~~<br>~~a~~|PG Under-Voltage<br>Lower Threshold<br>~~ee~~<br>~~ee~~<br>|VFBrising, PG Low-to-HiZ,<br>% with respect to VFEREF<br>~~ee~~<br>~~e~~<br>|-<br>~~ee~~<br>~~**e**~~<br>~~e~~<br>|-10<br>~~ee eee~~<br>~~ee~~<br>~~**e**e~~<br>|-<br>~~eee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|%<br>~~eee~~<br>~~ee~~<br>|
|VPGUV_HY<br>~~a~~<br>~~a~~<br>~~a~~|PG Under-Voltage<br>Hysteresis<br>~~ee~~<br>|VFBfalling, PG HiZ-to-Low<br>% with respect to VFEREF<br>~~e~~<br>|-<br>~~**e**~~<br>~~e~~<br><br>~~ee~~|-15<br>~~**e**e ~~<br><br>~~ee~~|-<br> ~~ee~~<br>~~ee~~<br><br>~~ee~~|%<br>|
|VPGOV_HY<br>~~a~~<br>~~a~~<br>~~a~~|PG Over-Voltage<br>Hysteresis<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|VFBrising, PG HiZ-to-Low<br>% with respect to VFEREF<br>~~e~~<br>~~ee~~<br>~~es~~<br>|-<br>~~e~~<br>~~ee~~<br>~~ee~~<br>|15<br>~~ee~~<br>~~ee~~<br>|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|%<br>~~ee~~<br>|
|VPGOV_TH<br>~~a~~<br>~~a~~<br>~~a~~<br>~~a~~|PG Over-Voltage<br>Upper Threshold<br>~~ee~~<br>~~ee~~<br>|VFBfalling, PG Low-to-HiZ,<br>% with respect to VFEREF<br>~~ee~~<br>~~es~~<br>|-<br>~~ee~~<br>~~ee~~<br><br>~~ee~~|10<br>~~ee~~<br>~~ee~~<br><br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br><br>~~ee~~|%<br>~~ee~~<br>|
|PGPUR<br>~~a~~<br>~~a ee~~<br>~~a~~<br>~~en~~|PG Pull-up<br>resister<br>~~ee~~<br>~~ee~~<br>~~ee~~|~~es~~<br>~~ee~~<br>~~ee~~|-<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|500<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|KΩ<br>~~ee~~|
|VPG_LV<br>~~a~~<br>~~en~~|PG logic low<br>voltage<br>~~ee~~|IPG= 1mA<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|0.2<br>~~ee ~~<br>~~ee~~|0.3<br> ~~ee~~<br>~~ee~~|V|
|◼<br>Fault Protection<br>~~ee~~<br>~~eeeeee~~<br>~~en~~<br>~~eeee~~<br>~~eeee~~|||||||
|ILIMIT_TH<br>~~en~~<br>~~ee~~|Current limit<br>threshold<br>~~ee~~<br>~~ee~~|Peak value of output current<br>~~ee ~~<br>~~ee~~|-<br> ~~ee~~<br>~~ee~~<br>~~ee~~|5.2<br>~~ee ~~<br>~~ee~~<br>~~ee~~|-<br> ~~ee~~<br>~~ee~~<br>~~ee~~|A<br>~~ee~~|
|TOTP<br>~~ee~~|Over temperature<br>protection<br>~~ee~~|~~ee~~|-<br>~~ee~~<br>~~ee ~~|160<br>~~ee~~<br> ~~ee~~|-<br>~~ee~~<br>~~ee~~|°C<br>~~ee~~|
|THY|Thermal<br>Shutdown<br>Hysteresis||-<br>~~ee~~|30<br>~~ee~~|-|°C|
|OVP<br>~~a~~|Over voltage<br>protection<br>~~ee~~|VFB rising, % with respect to<br>VREF<br>~~ee~~|+18<br>~~ee~~<br>~~ee~~|+20<br>~~ee~~<br>~~ee~~|+22<br>~~ee~~|%<br>~~ee~~|



Rev. A1 

5 

## **MUN3CAD02-JE** 

## **TYPICAL PERFORMANCE CHARACTERISTICS:** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Cin =22uF/6.3V/0805/X7R, Cout = 22uF/6.3V/0805/X7R, RFB_top = 100k Ω , CFB = 100pF. The following figures provide the typical characteristic curves at 1.0Vout. 

**FIG.3 EFFICIENCY V.S. LOAD CURRENT FIG.4 DE-RATING CURVE** Stop ~~a a \e~~ | Tek Stop ~~IS————————————es A~~ |t++0.000000s 10k points t+ 0.000000 s 10k points [P Peak—-Peak 2.40mvV. 3.12m 2.40m 3.80m 303) [PB Peak—Peak 3.60mvV. 3.36m. 2.40m 4.40m 477) **FIG.5 OUTPUT RIPPLE FIG.6 OUTPUT RIPPLE (Vin=3.3V, Vout=1.0V, Iout=0A) (Vin=3.3V, Vout=1.0V, Iout=2A)** Stop es Se ~~|~~ Sinn | TekStop ~~ce~~ | u T EN prsnssanapuodenminnaaueetanenaimiiiadnnaanlsqmeiemans PG Vout P Peak-Peak 60.0mV__61.9m__57.6m__66.4m__2.00m umd on ol en ti 6.000000ms } 10k points **FIG.7 TRANSIENT RESPONSE FIG.8 TURN-ON (Vin=3.3V, Vout=1V, Iout=1A to 2A load step) (Vin=3.3V, Vout=1.0V, Iout=2A)** 

6 

Rev. A1 

**MUN3CAD02-JE** 

## **TYPICAL PERFORMANCE CHARACTERISTICS:** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Cin =22uF/6.3V/0805/X7R, Cout = 22uF/6.3V/0805/X7R, RFB_top = 100k Ω , CFB =100pF. The following figures provide the typical characteristic curves at 1.8Vout. 

**==> picture [414 x 376] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIG.9 EFFICIENCY V.S. LOAD CURRENT FIG.10 DE-RATING CURVE<br>Stop Sc | es a Tek Stop eS Sc es<br>[P Peak-Peak 3.00mvV 3.11m 2.56m 3.40m 251 [DP Peak-Peak 3.40mvV. 3.20m 2.56m 3.80m 289)<br>FIG.11 OUTPUT RIPPLE  FIG.12 OUTPUT RIPPLE<br>(Vin=3.3V, Vout=1.8V, Iout=0A) (Vin=3.3V, Vout=1.8V, Iout=2A)<br>Stop Se | TekStop eae ee<br>u t<br>EN  reenter emnreeeeerme trent<br>Df eenmennernernd<br>PG<br>Vout<br>FIG.13 TRANSIENT RESPONSE  FIG.14 TURN-ON<br>(Vin=3.3V, Vout=1.8V, Iout=1A to 2A load step) (Vin=3.3V, Vout=1.8V, Iout=2A)<br>**----- End of picture text -----**<br>


Rev. A1 

7 

## **MUN3CAD02-JE** 

## **TYPICAL PERFORMANCE CHARACTERISTICS:** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Cin =22uF/6.3V/0805/X7R, Cout = 22uF/6.3V/0805/X7R, RFB_top = 100k Ω , CFB = 100pF. The following figures provide the typical characteristic curves at 3.3Vout. 

**==> picture [406 x 366] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIG.15 EFFICIENCY V.S. LOAD CURRENT FIG.16 DE-RATING CURVE<br>Stop eee OOO) Tek Stop es<br>+ 0.000000 s 10k points lepreak-reak vey eam, in, Mae, Sidbev | +r 0.000000 s 10k points<br>FIG.17 OUTPUT RIPPLE  FIG.18 OUTPUT RIPPLE<br>(Vin=5V, Vout=3.3V, Iout=0A) (Vin=5V, Vout=3.3V, Iout=2A)<br>Stop esA | ‘Tek Stop ————<br>EN<br>PG<br>Vout<br>FIG.19 TRANSIENT RESPONSE  FIG.20 TURN-ON<br>(Vin=5V, Vout=3.3V, Iout=1A to 2A load step) (Vin=5V, Vout=3.3V, Iout=2A)<br>**----- End of picture text -----**<br>


8 

Rev. A1 

## **MUN3CAD02-JE** 

## **APPLICATIONS INFORMATION:** ~~eee~~ 

## **SAFETY CONSIDERATIONS:** 

Certain applications and/or safety agencies may require fuses at the inputs of power conversion components. Fuses should also be used when there is the possibility of sustained input voltage reversal which is not current limited. For greatest safety, we recommend a fast blow fuse installed in the ungrounded input supply line. The installer must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in compliance with the end-user safety standard. 

## **INPUT FILTERING:** 

The module should be connected to as low AC impedance source supply and a highly inductive source or line inductance can affect the stability of the module. Input capacitors must be placed directly to the input pin of the module, to minimize input ripple voltage and ensure module stability. 

## **OUTPUT FILTERING:** 

To reduce output ripple and improve the dynamic response to as step load change, the additional capacitors at the output must be used. Low ESR ceramic, X5R or X7R capacitors are recommended to improve the output ripple and dynamic response of the module. 

## **PROGRAMMING OUTPUT VOLTAGE:** 

The output voltage can be programmed by the dividing resistor RFB_top (recommended 10k~200kohm) and RFB_bot, Assume RFB_top set 100 Kohm, the output voltage can be calculated as shown in Equation 1 and the resistance according to typical output voltage is shown in TABLE 1. 

VOUT (V) = 6.0  +[] 1 RFB_top []  RFB_bot  

**==> picture [34 x 10] intentionally omitted <==**

|VOUT|[]<br><br>RFB_bot<br>6.0<br>(V)<br>VOUT|[]<br><br>RFB_bot|
|---|---|---|
|VOUT (V)|RFB_top (k)|RFB_bot(k)|
|1.0|100|150|
|1.2|100|100|
|1.8|100|50|
|2.5|100|31.58|
|3.3|100|22.22|



**TABLE.1 RESISTOR VALUES FOR COMMON OUTPUT VOLTAGES** 

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~~ee~~ **APPLICATIONS INFORMATION: (Cont.)** 

## **LOAD TRANSIENT RESPONSE INCREASE:** 

In some applications, adding a ceramic cap (CFB) in parallel with RFB-top may further speedy up the load transient responses, recommend capacitance 100pF~470pF. 

## **THERMAL CONSIDERATIONS:** 

All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test board size is 30mm×30mm×1.6mm with 4 layers 2oz. The case temperature of module sensing point is shown as FIG.21 Then Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The module is designed for using when the case temperature is below 110°C regardless the change of output current, input/output voltage or ambient temperature. 

## **Sensing point (Defined case temperature)** 

**FIG.21 CASE TEMPERATURE SENSING POINT** 

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## **MUN3CAD02-JE** 

## **APPLICATIONS INFORMATION: (Cont.)** 

## **REFLOW PARAMETERS:** 

Lead-free soldering process is a standard of electronic products production. Solder alloys like Sn/Ag, Sn/Ag/Cu and Sn/Ag/Bi are used extensively to replace the traditional Sn/Pb alloy. Sn/Ag/Cu alloy (SAC) is recommended for this power module process. In the SAC alloy series, SAC305 is a very popular solder alloy containing 3% Ag and 0.5% Cu and easy to obtain. Figure 22 shows an example of the reflow profile diagram. Typically, the profile has three stages. During the initial stage from room temperature to 150°C, the ramp rate of temperature should not be more than 3°C/sec. The soak zone then occurs from 150°C to 200°C and should last for 60 to 120 seconds. Finally, keep at over 217°C for 60~150 seconds to melt the solder and make the peak temperature at the range from 255°C to 260°C (Do not exceed 30 sec). It is noted that the time of peak temperature should depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and one should adopt it for optimization according to various solder type and various manufacturers’ formulae. 

## **FIG.22 RECOMMENDATION REFLOW PROFILE** 

## **(Not to scale)** 

***Refer to the Classification Reflow Profile of J-STD-020.** 

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## **MUN3CAD02-JE** 

## **PACKAGE OUTLINE DRAW:** 

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## **MUN3CAD02-JE** 

## **LAND PATTERN REFERENCE:** 

Unit: mm ive) m/oO|]unN Wey n N| 7]N in a oO Oo da 0.25 5 505 XN 0.8 !! | 0.95 ! ! co ' = 945 | ES} 0.00 | ———0.45 = Ln S 0 oO a! oO!1o!o | RECOMMENDED LAND PATTERN ive) m!/o|]iunN Wey n N| 7]N in a oO Oo cd 0.25 5 +05 XN 0.8 !! | co a a0.95 ! co i = 0.48 = FIp= —0.00 = | Ln0.45 | ° nn) oO] SI} OO} wn un}Oe un}| wooO!1o!o| wn} wu}|in o RECOMMENDED STENCIL PATTERN *Based on 0.1~0.15mm thickness stencil (Reference only) *Recommended solder paste coverage 55~100% 

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|**MUN3CAD02-JE**<br>Goyntec|**MUN3CAD02-JE**<br>Goyntec|**MUN3CAD02-JE**<br>Goyntec|**MUN3CAD02-JE**<br>Goyntec|**MUN3CAD02-JE**<br>Goyntec|**MUN3CAD02-JE**<br>Goyntec|**MUN3CAD02-JE**<br>Goyntec|**MUN3CAD02-JE**<br>Goyntec|
|---|---|---|---|---|---|---|---|
|**PACKING REFERENCE:**<br>~~hee~~||||||||
||Unit: mm|||||||
|||**Package In Tape Loading Orientation**||||||
|||Pinl|||Sprocket|Hole||
|||||OC)||||
||||di|||||
||||**Tape Dimension**|||||
|||—|=|D||~=||
||ARBEREEH-||||*Hs|||
|||A0|2.850.10|E|1.750.10|0.10||
|||B0|3.850.10|K0|1.850.10|0.10||
|||F|5.500.05|P0|4.000.10|0.10||
|||W|12.000.30|P1|4.000.10|0.10||
|||D0|φ1.550.05|P2|2.000.05|0.05||
|||D1|φ1.500.10|t|0.250.05|0.05||



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## **MUN3CAD02-JE** 

## **PACKING REFERENCE: (Cont.)** 

**==> picture [343 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
Unit: mm<br>Reel Dimension<br>See Detail A<br>So x IN<br>//{\ } oN<br>/ \ \<br>/ \ \<br>/ /) \ an \<br>| // S\\ao\ \ \ \\ ( 1)<br>| f Py. \ —~ | (_\\<br>| — \ ws) | —~ si Cx<br>Detail A<br>**----- End of picture text -----**<br>


## **Peel Strength of Top Cover Tape** 

The peel speed shall be about 300mm/min. The peel force of top cover tape is between 0.1N to 1.3N 

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## **REVISION HISTORY:** ~~hee~~ 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|2021.01.04|P00|Release the preliminary specification.|
|2021.04.12|P01|1、Update Outline of Module.<br>2、Update package outline draw.|
|2021.09.06|P02|Update the typical performance characteristics.|
|2021.11.11|P03|Modify the package outline.|
|2022.03.07|P04|Update the electrical specifications.|
|2022.05.11|P05|Update carrier tape dimension and quantity per reel to 2000<br>EA. Modify the reflow parameters.|
|2022.12.23|P06|1、 Page 11, update reflow parameters.<br>2、 Page 13, change the thickness description of stencil. Add<br>note and unit.|
|2024.12.16|A1|1、Synchronized with document management number|



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