MUN3C1BR6-SB

Non Isolated POL DC/DC Converter, Micro Module, 1 Output, 720 mW, 1.2 V, 600 mA

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Manufacturer: CYNTEC
Product type: DC / DC Non Isolated Board Mount Converters - Fixed Output
SVHC: No SVHC (21-Jan-2025)
Depth: 2.5mm
Width: 2mm
Height: 1.1mm
Product Range: MUN3C1XR6-SB Series
No. of Outputs: 1 Output
Output Power Max: 720mW
Output Current Max: 600mA
Output Voltage Nom: 1.2V
Input Voltage DC Max: 5.5V
Input Voltage DC Min: 2.7V
DC / DC Converter Type: Micro Module
Power Supply Applications: -
DC / DC Converter Mounting: Surface Mount Device
DC / DC Converter Output Type: Fixed
Delivery and price
Units per pack	500
Price	1.96 €
Current stock	1000+
Lead time	30 days
Datasheet
## **uPOL MODULE** 

**600mA, High Efficiency uPOL Module** 

## **MUN3C1XR6-SB Series** 

## **FEATURES:** 

- High Density Power Module 

- 600mA Output Current 

- Input Voltage Range from 2.7V to 5.5V 

- Fixed Output Voltage 

- 100% Maximum Duty Cycle with Low Dropout 

- Enable Function 

- Automatic Power Saving/PWM Mode 

- Protections (UVLO, OCP: Non-latching) 

- Internal Soft Start 

- Compact Size: 2.5mm*2.0mm*1.1mm 

- Pb-free for RoHS compliant 

- MSL 2, 260C Reflow 

## **APPLICATIONS:** 

- Single Li-Ion Battery-Powered Equipment 

- LDOs Replacement 

- Cell phone / PDAs / Palmtops 

## **GENERAL DESCRIPTION:** 

The MUN3C1XR6-SB power module series is non-isolated dc-dc converters that can deliver up to 600mA of output current. The PWM switching regulator, high frequency power inductor are integrated in one hybrid package. It needs input and output capacitor only and no additional feedback circuit. 

The MUN3C1XR6-SB power module series has automatic operation with PWM mode and power saving mode according to loading. Other features include remote enable function, internal soft-start, non-latching over current protection, and input under voltage locked-out capability. 

The low profile and compact size package (2.5mm × 2.0mm x 1.1mm) is suitable for automated assembly by standard surface mount equipment. The MUN3C1XR6-SB power module is Pb-free and RoHS compliance. 

## **TYPICAL APPLICATION CIRCUIT & PACKAGE:** 

**==> picture [466 x 233] intentionally omitted <==**

**----- Start of picture text -----**<br>
Enable<br>E N<br>VIN VOU T 2.5mm  1.1mm<br>(+) (+)<br>(Max.)<br>C in C o<br>VIN VOUT<br>G ND<br>(2.7V ~5.5V) 1.8V<br>(-) (-)<br>2.0mm<br> g&<br>FIGURE 1 TYPICAL APPLICATION CIRCUIT  FIGURE 2 HIGH DENSITY LOW PROFILE<br>uPOL MODULE<br>1 Rev.A1<br>**----- End of picture text -----**<br>


Rev.A1 

**MUN3C1XR6-SB Series** 

## **ORDERING INFORMATION:** ~~ee~~ 

CAUTION: These devices have limited built-in ESD protection. The leads should be shorted together or the devices placed in conductive foam during the storage or handling to prevent electrostatic damage to internal circuit. 

|**PART NUMBER**|**OUTPUT VOLTAGE**|**MARKING**<br>**(Code: X)**|**ORDERING**|**QUANTITY**|
|---|---|---|---|---|
|**MHUN3C1BR6-SB**|**1.2V**|**B**|**MUN3C1BR6-SB**|**2000**|
|**MHUN3C1CR6-SB**|**1.25V**|**C**|**MUN3C1CR6-SB**|**2000**|
|**MHUN3C1DR6-SB**|**1.35V**|**D**|**MUN3C1DR6-SB**|**2000**|
|**MHUN3C1ER6-SB**|**1.5V**|**E**|**MUN3C1ER6-SB**|**2000**|
|**MHUN3C1HR6-SB**|**1.8V**|**H**|**MUN3C1HR6-SB**|**2000**|



2 

Rev. A1 

**MUN3C1XR6-SB Series** 

## **ELECTRICAL SPECIFICATIONS:** ~~ee~~ 

CAUTION: Do not operate at or near absolute maximum rating listed for extended periods of time. This stress may adversely impact product reliability and result in failures outside of warranty. 

|**Parameter**<br>~~es~~|**Description**<br>~~ee~~|**Min.**<br>~~ee~~<br>~~ee~~|**Typ.**<br>~~ee~~|**Max.**<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|
|◼<br>Absolute Maximum Ratings<br>~~esee~~<br>~~ee~~<br>~~a~~<br>~~eeee~~||||||
|VIN to GND<br>~~ee~~<br>~~ee~~|~~ee~~|-<br>~~ee~~|-<br>~~ee~~|+6.0<br>~~ee~~|V<br>~~ee~~|
|VOUT to GND<br>~~ee~~<br>~~ee~~<br>~~ee~~|~~ee~~|-<br>~~ee~~|-<br>~~ee~~|+6.0<br>~~ee~~|V<br>~~ee~~|
|EN to GND<br>~~ee~~<br>~~ee~~<br>~~ee~~||-|-|VIN+0.3|V|
|Tc<br>~~ee~~<br>~~ee~~|Case Temperature of Inductor|-|-|+110|°C|
|Tj<br>~~ee~~<br>~~ed~~|Junction Temperature<br>~~ed~~|-40<br>~~ed~~|-<br>~~ed~~|+150<br>~~ed~~|°C<br>~~ed~~|
|Tstg<br>~~ed~~|Storage Temperature<br>~~ed~~|-40<br>~~ed~~|-<br>~~ed~~|+125<br>~~ed~~|°C<br>~~ed~~|
|ESD Rating|Human Body Model (HBM)<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|2k<br>~~ee~~|V<br>~~ee~~|
||Machine Model (MM)<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|200<br>~~ee~~|V<br>~~ee~~|
||Charge Device Model (CDM)<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|1k<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|◼<br>Recommendation Operating Ratings<br>~~ee~~<br>~~ee~~<br>~~a~~<br>~~ee~~||||||
|VIN<br>~~ee~~<br>~~ee~~|Input Supply Voltage|+2.7|-|+5.5|V|
|Ta<br>~~ee~~<br>~~ee~~|Ambient Temperature|-40|-|+85|°C|
|◼<br>Thermal Information<br>~~ee~~<br>~~a~~||||||
|Rth(jchoke-a)|Thermal resistance from junction to<br>ambient.(Note 1)|-|55|-|°C/W|



1. Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The test board size is 30mm× 30mm× 1.6mm with 2 layers. The test condition is compliant with JEDEC EIJ/JESD 51 Standards. 

3 

Rev. A1 

|**Symbol**<br>~~a~~<br>~~ce~~|**Parameter**<br>~~a~~<br>~~es~~|**Conditions**<br>~~a~~<br>~~ee~~|**Min.**<br>~~a~~<br>~~ee~~|**Typ.**<br>~~a~~<br>~~ee~~|**Max.**<br>~~a~~<br>~~ee~~|**Unit**<br>~~a~~<br>~~ee~~|
|---|---|---|---|---|---|---|
|◼<br>Input Characteristics<br>~~a~~<br>~~esee~~<br>~~ce~~|||||||
|ISD(IN)<br>~~ce~~|Input shutdown<br>current<br>~~es~~|Vin = 3.3V,<br>Vin connected EN by 100K ohm<br>EN = GND<br>~~ee~~<br>~~ee~~|Vin connected EN by 100K ohm<br>-<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|uA<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|||Vout=1.2 V<br>~~ee~~<br>~~ee~~|-|0.1<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~||
|||Vout=1.25 V<br>~~ee~~<br>~~ee~~<br>~~ee~~||0.1<br>~~ee~~<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~<br>~~ee~~||
|||Vout=1.35 V<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|0.1<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~||
|||Vout=1.5 V<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.1<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~||
|||Vout=1.8 V<br>~~ee~~|-<br>~~ee ~~<br>~~ee~~<br>~~ee~~|0.1<br> ~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~||
|IQ(IN)|Input supply bias<br>current|Vin = 3.3V, Iout = 0A<br>EN = VIN<br>~~ee~~|-<br>~~ee ~~|-<br> ~~ee ~~<br>~~ee~~|-<br> ~~ee~~<br>~~ee~~|uA<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|||Vout=1.2 V<br>~~ee~~<br>~~ee~~|-|50<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~||
|||Input supply bias<br>Vout=1.25 V<br>~~ee~~<br>~~ee~~|~~ee~~|52<br>~~ee~~<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~||
|||Vout=1.35 V<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|56<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~||
|||Vout=1.5 V<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|60<br>~~ee~~<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~||
|||Vout=1.8 V<br>~~ee~~<br>~~ee~~|-<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|70<br> ~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~eee~~|-<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>~~eee~~||
|IS(IN)|Input supply<br>current|Vin = 3.3V, EN = VIN<br>Iout = 5mA<br>~~ee~~|-<br>~~ee ~~<br>~~ee~~<br>~~ee~~|-<br> ~~ee ~~<br>~~eee~~<br>~~ee~~|-<br> ~~ee~~<br>~~eee~~<br>~~ee~~|mA<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|||Vout=1.2 V<br>~~ee~~<br>~~ee~~|-<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~es~~|2.2<br> ~~eee~~<br>~~ee~~<br>~~ee~~|-<br>~~eee~~<br>~~ee~~<br>~~ee~~||
|||Vout=1.25 V<br>~~es~~|~~ee ~~<br>~~es~~<br>~~es~~<br>~~ee~~|2.3<br> ~~ee ~~<br>~~es~~<br>~~ee~~|~~ee~~<br>~~es~~||
|||Vout=1.35 V<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~es~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|2.5<br>~~es~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~es~~<br>~~ee~~||
|||Vout=1.5 V<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|2.7<br>~~ee~~<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>||
|||Vout=1.8 V<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>|3.2<br>~~ee~~<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>||
|||Vin = 3.3V, EN = VIN<br>Iout = 600mA<br>~~ee ~~|-<br>~~ee~~<br> ~~eee~~|-<br>~~ee~~<br>~~eee~~|-<br>~~ee~~<br>~~eee~~|mA<br>~~ee~~<br>~~ee~~|
|||Vout=1.2 V<br>~~ee ~~<br>~~ee~~|-<br>~~ee ~~<br> <br>~~ee~~|285<br> ~~ee ~~<br><br>~~ee~~|-<br> ~~ee~~<br><br>~~ee~~||
|||Vout=1.25 V<br>~~ee~~|~~ee~~<br>~~ee~~|298<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~||
|||Vout=1.35 V<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|310<br>~~ee~~<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~ee~~||
|||Vout=1.5 V<br>~~ee~~|-<br>~~ee ~~<br>~~ee~~<br>~~ee~~|340<br> ~~ee ~~<br>~~ee~~<br>~~es~~|-<br> ~~ee~~<br>~~ee~~||
|||Vout=1.8 V<br>~~ee~~|-<br>~~ee ~~<br>~~ee~~|400<br> ~~es~~<br>~~ee~~|-<br>~~ee~~||



Rev. A1 

4 

**MUN3C1XR6-SB Series** 

## ~~LF~~ **ELECTRICAL SPECIFICATIONS: (Cont.)** Conditions: TA = 25 ºC, Vin = 3.3V, Cin = 4.7uF/6.3V/0603, Cout = 10uF/6.3V/0603 unless otherwise specified. 

|**Symbol**<br>~~a~~<br>~~BR~~|**Parameter**<br>~~ee~~|**Conditions**<br>~~es~~|**Min.**<br>~~es~~|**Typ.**<br>~~es~~|**Max.**<br>~~ee~~|**Unit**|
|---|---|---|---|---|---|---|
|◼<br>Output Characteristics<br>~~a ee~~<br>~~es~~<br>~~es~~<br>~~es~~<br>~~ee~~<br>~~BR~~|||||||
|IOUT(DC)<br>~~BR~~|Output<br>continuous<br>current range|Vin=3.3V|0|-|600|mA|
|VO(SET)<br>~~a~~|Ouput Voltage<br>Set Point<br>~~a~~|Vin=3.3V|-3.0|-|+3.0|% VO(SET)|
|ΔVOUT<br>/ΔVIN<br>~~a~~<br>~~a~~|Line regulation<br>accuracy<br>~~a~~<br>|Vin = 3.3V to 5V<br>Iout = 0A<br>Iout = 600mA<br>|-<br>~~es es~~|-<br>~~es~~|1|% VO(SET)|
|ΔVOUT<br>/ΔIOUT<br>~~a~~<br>~~a~~|Load regulation<br>accuracy<br>~~aes~~<br>~~ae~~|Iout = 0A to 600mA<br>Vin = 3.3V,<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~es es~~<br>~~ee~~|1.5<br>~~es~~<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~ee~~|% VO(SET)<br>~~es~~<br>~~ee~~|
|COUT(MAX)<br>~~a ~~|Maximum<br>capacitive load<br> ~~ae~~|Iout = 600mA, ESR≧1 m<br>~~ee~~|-<br>~~es es~~<br>~~ee~~|-<br>~~es~~<br>~~ee~~|22<br>~~ee~~|uF<br>~~ee~~|
|◼<br>Control Characteristics<br> ~~ae ee~~<br>~~ee ee ee~~<br>~~ee~~|||||||
|FOSC<br>~~ee~~|Oscillator<br>frequency<br>~~ee~~|PWM Operation<br>~~ee~~|-<br>~~ee~~|3.0<br>~~ee~~|-<br>~~ee~~|MHz<br>~~ee~~|
|VEN_TH<br>~~BS~~|Enable rising<br>threshold<br>voltage||1.5|-|-|V|
||Enable falling<br>threshold<br>voltage<br>||-|-|0.4|V|
|◼<br>Fault Protection<br>~~BSaee~~<br>~~eeeeee~~|||||||
|VUVLO_TH<br>~~BSa~~<br>~~a~~|Input under<br>voltage lockout<br>threshold<br>~~ee~~<br>~~ee~~|Falling<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|2.5<br>~~ee~~<br>~~ee~~|V<br>~~ee~~|
|TOTP<br>~~a ~~<br>~~a~~<br>~~ee~~|Over temp<br>protection<br> ~~ee~~<br>~~ee~~<br>~~es~~|~~ee~~<br>~~es~~<br>~~es~~|-<br>~~ee ~~<br>~~es~~<br>~~es~~<br>~~es~~|160<br> ~~ee~~<br>~~es~~<br>~~es~~<br>~~es~~|-<br>~~ee ~~<br>~~ee~~<br>~~es~~<br>~~ee~~|℃<br> ~~ee~~<br>~~es~~|
|ILIMIT_TH<br>~~a~~<br>~~ee~~|Current limit<br>threshold<br>~~ee~~<br>~~es~~|Peak value of inductor current,<br>~~es ~~<br>~~es~~|1.3<br> ~~es ~~<br>~~es~~<br>~~es~~|~~es ~~<br>~~es~~<br>~~es~~|2.5<br> ~~ee~~<br>~~es~~<br>~~ee~~|A<br>~~es~~|



Rev. A1 

5 

**==> picture [461 x 241] intentionally omitted <==**

**----- Start of picture text -----**<br>
     MUN3C1XR6-SB Series<br>G'eyntec<br>PIN CONFIGURATION:<br>a<br>[|<br>(1) VIN  | | | (4) GND<br>PY Ld<br>fF<br>(2) EN  | | | | (3)VOUT<br>**----- End of picture text -----**<br>


**==> picture [58 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
TOP VIEW<br>**----- End of picture text -----**<br>


## **PIN DESCRIPTION:** ~~ee~~ 

|**Symbol**|**Pin No.**|**Description**|
|---|---|---|
|VIN|1|Power input pin. It needs to be connected to input rail with input<br>capacitor. A 4.7uF capacitor at least for input.|
|EN|2|On/Off control pin for module.<br>EN = LOW, the module is off.<br>EN=HIGH, the module is on.|
|VOUT|3|Power output pin. Connect to output for the load with output capacitor. A<br>10uF capacitor at least for output.|
|GND|4|Power ground pin for signal, input, and output return path. This pin<br>needs to be connected to one or more ground plane directly. Connect to<br>thermalexposed pad ofGND for heat transferring.|



6 

Rev. A1 

## **MUN3C1XR6-SB Series** 

## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.2VOUT)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 2 layers. The output ripple and transient response are measured by short loop probing and limited to 20 MegHz bandwidth. The following figures are the typical characteristic curves at 1.2Vout. 

**==> picture [435 x 385] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIGURE 3 EFFICIENCY V.S. LOAD CURRENT FIGURE 4 DE-RATING CURVE AT 3.3VIN<br> Stop ek frevu |<br>Vout  Vout<br>A NN NN NON NON ON ld, rtm gtdating ad [et]<br>t+ 438.0000) 1M points 5.80m¥ G+v0,000000 100k points 1.60<br>FIGURE 5 OUTPUT RIPPLE   FIGURE 6 OUTPUT RIPPLE<br>(3.3VIN, IOUT=0A) (3.3VIN, IOUT=600mA)<br>——S™r a SS<br>Vout  VOUT<br>{ I |<br>i eA tatty |<br>EN<br>\ eneemaene mmmmateammeee poop<br>20.0mv vy if 200 S00MS/ o-<br>FIGURE 7 TRANSIENT RESPONSE   FIGURE 8 TURN-ON<br>(3.3VIN, 0% to 50% LOAD STEP) (3.3VIN, IOUT=600mA)<br>**----- End of picture text -----**<br>


Rev. A1 

7 

## **MUN3C1XR6-SB Series** 

## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.25VOUT)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 2 layers. The output ripple and transient response are measured by short loop probing and limited to 20 MegHz bandwidth. The following figures are the typical characteristic curves at 1.25Vout. 

**==> picture [423 x 393] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIGURE 9 EFFICIENCY V.S. LOAD CURRENT FIGURE 10 DE-RATING CURVE AT 3.3VIN<br>-——————_ i lek Prevu Ej,<br>Vout  Vout<br>: : : + : : : : ] Ch1 Pk-Pk } : + : : : : | Ch1<br>Ce 14.0mv Bo 1.7<br>: : : t : : : : 7 chi Min : : : : tT : : : : 7 Chi<br>= 8. 20mv Ro 72<br>10.0mVVAi Mi10.0ms) Al Chi F 5.20mv 2.00MVQ24 M|200ns, A| Chi F  360yuV<br>fi+y[0.00000s | i+ [0.00000 s<br>FIGURE 11 OUTPUT RIPPLE   FIGURE 12 OUTPUT RIPPLE<br>(3.3VIN, IOUT=0A) (3.3VIN, IOUT=600mA)<br>—— ek PreVu -————_ 7,<br>Vout  VOUT<br>: : : : : : : : Ch1 Pk-Pk : : : : : : : : j<br>  30.8mv pI. : : . Pd<br>:<br>: :<br>: t : : " | 16.0mv : : : : + : : : : |<br>EN<br>a po : : a : : 2<br>iy (246.000ys i+ 400.400u5]<br>FIGURE 13 TRANSIENT RESPONSE   FIGURE 14 TURN-ON<br>(3.3VIN, 0% to 50% LOAD STEP) (3.3VIN, IOUT=600mA)<br>**----- End of picture text -----**<br>


8 

Rev. A1 

## **MUN3C1XR6-SB Series** 

## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.35VOUT)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 2 layers. The output ripple and transient response are measured by short loop probing and limited to 20MegHz bandwidth. The following figures are the typical characteristic curves at 1.35Vout. 

**==> picture [426 x 385] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIGURE 15 EFFICIENCY V.S. LOAD CURRENT FIGURE 16 DE-RATING CURVE AT 3.3VIN<br>pe  es | lek Stop re (13 | _<br>Vout  Vout<br>Nia NN NA NON NON NON [gl NaiBaer in wanna i eanen<br>U¥438.0000ys 1M points 6.40mY t+¥0.000000 100k points -520pV<br>FIGURE 17 OUTPUT RIPPLE   FIGURE 18 OUTPUT RIPPLE<br>(3.3VIN, IOUT=0A) (3.3VIN, IOUT=600mA)<br>ES Ses eee | lek Stop I ee|<br>Vout  VOUT<br>AKU MTT atina ere<br>EN<br>——<br>G+ ¥438,0000s 1M points -12.4mV 07438, 0000p: 1M points 1.92V<br>FIGURE 19 TRANSIENT RESPONSE   FIGURE 20 TURN-ON<br>(3.3VIN, 0% to 50% LOAD STEP) (3.3VIN, IOUT=600mA)<br>**----- End of picture text -----**<br>


9 

Rev. A1 

## **MUN3C1XR6-SB Series** 

## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.5VOUT)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 2 layers. The output ripple and transient response are measured by short loop probing and limited to 20MegHz bandwidth. The following figures are the typical characteristic curves at 1.5Vout. 

**==> picture [455 x 385] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIGURE 21 EFFICIENCY V.S. LOAD CURRENT FIGURE 22 DE-RATING CURVE AT 3.3VIN<br>Vout  Vout<br>hot ek Prevu eee (17 a<br>KOS ONO AN NN AI Brrr pO ff fOr<br>G+¥0,000000 s___ IM points 5.40my Giv0.000000 100k points 1.96<br>FIGURE 23 OUTPUT RIPPLE   FIGURE 24 OUTPUT RIPPLE<br>(3.3VIN, IOUT=0A) (3.3VIN, IOUT=600mA)<br>Tek Stop See es ns Tekstop |<br>Vout  VOUT<br>ee<br>WARK a | Muara<br>EN<br>. |<br>(@D 20.0mv ve 200 SO0MS/ o- | oe<br>FIGURE 25 TRANSIENT RESPONSE   FIGURE 26 TURN-ON<br>(3.3VIN, 0% to 50% LOAD STEP) (3.3VIN, IOUT=600mA)<br>**----- End of picture text -----**<br>


10 

Rev. A1 

## **MUN3C1XR6-SB Series** 

## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.8VOUT)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 2 layers. The output ripple and transient response are measured by short loop probing and limited to 20MegHz bandwidth. The following figures are the typical characteristic curves at 1.8Vout. 

**==> picture [436 x 384] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIGURE 27 EFFICIENCY V.S. LOAD CURRENT FIGURE 28 DE-RATING CURVE AT 3.3VIN<br>Stop_ ES Ses aes Ae ek Prevu C—O<br>Vout  Vout<br>BOON NOONAN NANA OEE A EEa on<br>07538.0000) 5M points 6,20mVv 0.000000 s 100k points 1.60¥<br>FIGURE 29 OUTPUT RIPPLE   FIGURE 30 OUTPUT RIPPLE<br>(3.3VIN, IOUT=0A) (3.3VIN, IOUT=600mA)<br>p Sees ee A | Tek Stop a See |  ee |<br>Vout  VOUT<br>|<br>\ i i l<br>ANA a  Po<br>EN<br>ie bed to<br>FIGURE 31 TRANSIENT RESPONSE   FIGURE 32 TURN-ON<br>(3.3VIN, 0% to 50% LOAD STEP) (3.3VIN, IOUT=600mA)<br>**----- End of picture text -----**<br>


11 

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**MUN3C1XR6-SB Series** 

## **APPLICATIONS INFORMATION:** ~~ee~~ 

## **REFERENCE CIRCUIT FOR GENERAL APPLICATION:** 

The Figure 33 shows the module application schematics for input voltage +5V or +3.3V and turn on by input voltage directly through enable resistor (Ren). 

**==> picture [365 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
Ren Enable<br>—<br>100k/0201<br>ON(High Impedance)OFF(GND) J<br>E N<br>VIN VOU T<br>(+) (+)<br>C in C o<br>VIN 4.7uF/6.3V/0603 10uF/6.3V/0603 VOUT<br>G ND<br>(3.3V / 5V) 1.8V<br>(-) (-)<br>ir,<br>FIGURE 33 GENERAL APPLICATION CIRCUIT WITH TURN-ON BY INPUT VOLTAGE<br>**----- End of picture text -----**<br>


## **SAFETY CONSIDERATIONS:** 

Certain applications and/or safety agencies may require fuses at the inputs of power conversion components. Fuses should also be used when there is the possibility of sustained input voltage reversal which is not current limited. For greatest safety, we recommend a fast blow fuse installed in the ungrounded input supply line. The installer must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in compliance with the end-user safety standard. 

## **INPUT FILTERING:** 

The module should be connected to a source supply of low AC impedance and high inductance in which line inductance can affect the module stability. An input capacitor must be placed as near as possible to the input pin of the module so to minimize input ripple voltage and ensure module stability. 

## **OUTPUT FILTERING:** 

To reduce output ripple and improve the dynamic response as the step load changes, an additional capacitor at the output must be connected. Low ESR polymer and ceramic capacitors are recommended to improve the output ripple and dynamic response of the module. 

12 

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**MUN3C1XR6-SB Series** 

## ~~ee~~ **APPLICATIONS INFORMATION: (Cont.) Thermal Considerations:** 

All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test board size is 30mm× 30mm× 1.6mm with 2 layers. The case temperature of module sensing point is shown as Figure 34. Then Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The MUN3C1XR6-SB series modules are designed for using when the case temperature is below 110°C regardless the change of output current, input/output voltage or ambient temperature. 

Sensing point (Defined case temperature) 

**Figure 34. CASE TEMPERATURE SENSING POINT** 

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## **MUN3C1XR6-SB Series** 

## **APPLICATIONS INFORMATION: (Cont.)** 

## **REFLOW PARAMETERS:** 

Lead-free soldering process is a standard of electronic products production. Solder alloys like Sn/Ag, Sn/Ag/Cu and Sn/Ag/Bi are used extensively to replace the traditional Sn/Pb alloy. Sn/Ag/Cu alloy (SAC) is recommended for this power module process. In the SAC alloy series, SAC305 is a very popular solder alloy containing 3% Ag and 0.5% Cu and easy to obtain. Figure 35 shows an example of the reflow profile diagram. Typically, the profile has three stages. During the initial stage from room temperature to 150°C, the ramp rate of temperature should not be more than 3°C/sec. The soak zone then occurs from 150°C to 200°C and should last for 60 to 120 seconds. Finally, keep at over 217°C for 60~150 seconds to melt the solder and make the peak temperature at the range from 255°C to 260°C (Do not exceed 30 sec). It is noted that the time of peak temperature should depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and one should adopt it for optimization according to various solder type and various manufacturers’ formulae. 

## **FIG.35 RECOMMENDATION REFLOW PROFILE*** 

## **(Not to scale)** 

## ***Refer to the Classification Reflow Profile of J-STD-020.** 

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## **PACKAGE OUTLINE DRAWING:** 

**==> picture [52 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
Unit: mm<br>**----- End of picture text -----**<br>


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## **LAND PATTERN REFERENCE:** ~~ee~~ Unit: mm 

**==> picture [181 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
RECOMMENDED LAND PATTERN<br>**----- End of picture text -----**<br>


**==> picture [205 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
*RECOMMENDED STENCIL PATTERN<br>**----- End of picture text -----**<br>


*Based on 0.1~0.15mm thickness stencil (Reference only) 

*Recommended solder paste coverage 55~100% 

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## **MUN3C1XR6-SB Series** 

## **PACKING REFERENCE:** 

|Unit: mm||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||**Package In Tape Loading Orientation**|||||||||||||**Package In Tape Loading Orientation**||||||||||||||||
||||||||||||||||.||sprocket hole|||||||||||||||||||
|||||||||||||||||||||||pin 1|||||||||||||||
||||||||||/||||a|||||/||||~a||||/||||||||||
||||||||||DD|||||||||||||||||||||||||||
||||||||||||||**Tape Dimension**|||||**Tape Dimension**|**Tape Dimension**|||||||||||||||||
||||||||||||||P1||||P0||||||||P2||||||||t|||
||||||||D0|||||||||||||||||||||||||||||
||E1||||~~,~~|||||||||||||||||||||||||A||||||||
|||||||||||||||||||||||||||||||||||||
||F||||||~~_—~~<br>~~Oo]~~||~~=~~<br>~~|S]~~||||||Le]|||||~~=~~<br>~~[eo]~~||||~~—~~<br>~~[4~~||||W||||||B0<br>~~!~~||
|||||||||||||||||||||||||||||||||||||
||||D1||||||||||A0|||||||||pulling direction||||||||||||K0||
|||||||||||||||||||||||||||||||||||||
||||carrier cavity|||||||||||||||||||||||||||||||||
|||A0|||||2.320.10|||||||0.10||||||||||E1||||1.750.10||||||||
|||B0|||||2.820.10|||||||0.10||||||||||K0||||1.150.10||||||||
|||F|||||3.500.05|||||||0.05||||||||||P0||||4.000.10||||||||
|||W|||||8.00 +0.30/-0.10|8.00 +0.30/-0.10||||||||||8.00 +0.30/-0.10|8.00 +0.30/-0.10|||||P1||||2.000.05||||||||
|||D0|||||φ1.50 +0.1/-0.0|||||||||||||||||P2||||4.000.10||||||||
|||D1|||||φ1.0 Min.|||||||||||||||||t|t|||0.250.05||||||||



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## **MUN3C1XR6-SB Series** 

## **PACKING REFERENCE: (Cont.)** 

**==> picture [346 x 353] intentionally omitted <==**

**----- Start of picture text -----**<br>
Unit: mm<br>Reel Dimension<br>See Detail A<br>Detail A<br>Peel Strength of Top Cover Tape<br>The peel speed shall be about 300mm/min.<br>The peel force of top cover tape shall between 0.1N to 1.0N<br>**----- End of picture text -----**<br>


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## **REVISION HISTORY:** ~~ee~~ 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|2018.08.30|00|Initial released for preliminary datasheet.|
|2018.12.05|01|Add 1.35V output voltage|
|2019.07.02|02|Add thermal resistance from junction to ambient Rth(jchoke-a)|
|2019.08.22|03|Add 1.25V output voltage|
|2022.11.01|04|Add recommended reflow profile.|



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Updated at April 23, 2026
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