MSRD620CTT4G

## MSRD620CTG, MSRD620CTT4G, SSRD8620CTT4G 

## SWITCHMODE Soft Ultrafast Recovery Power Rectifier 

## **Plastic DPAK Package** 

State−of−the−art geometry features epitaxial construction with glass passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies, free wheeling diode and polarity protection diodes. 

## **http://onsemi.com** 

## **SOFT ULTRAFAST RECTIFIER 6.0 AMPERES, 200 VOLTS** 

## **Features** 

- Soft Ultrafast Recovery (35 ns typ) 

- Highly Stable Oxide Passivated Junction 

- Matched Dual Die Construction − May Be Paralleled for High Current Output 

- Short Heat Sink Tab Manufactured − Not Sheared 

- Epoxy Meets UL 94 V−0 @ 0.125 in. 

- AEC−Q101 Qualified and PPAP Capable 

- SSRD8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements 

- These Devices are Pb−Free and are RoHS Compliant* 

## **Mechanical Characteristics** 

- Case: Epoxy, Molded 

- Weight: 0.4 Grams (Approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260  C Max. for 10 Seconds 

- ESD Ratings: 

   - Machine Model = C 

   - Human Body Model = 2 

**==> picture [44 x 17] intentionally omitted <==**

**----- Start of picture text -----**<br>
DPAK<br>CASE 369C<br>**----- End of picture text -----**<br>


**==> picture [73 x 30] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>2, 4<br>3 “,<br>**----- End of picture text -----**<br>


**==> picture [90 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
MARKING DIAGRAM<br>**----- End of picture text -----**<br>


AYWW S 620TG ~~4)~~ A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package 

**ORDERING INFORMATION** 

**Device Package Shipping**[†] MSRD620CTG DPAK 75 Units/Rail (Pb−Free) MSRD620CTT4G DPAK 2,500 / (Pb−Free) Tape & Reel SSRD8620CTT4G DPAK 2,500 / (Pb−Free) Tape & Reel ~~==~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MSRD620CT/D** 

**1** 

 Semiconductor Components Industries, LLC, 2012 **January, 2012 − Rev. 7** 

**MSRD620CTG, MSRD620CTT4G, SSRD8620CTT4G** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|200|V|
|Average Rectified Forward Current<br>(At Rated VR, TC= 137C)<br>Per Leg<br>Per Package|IO|3.0<br>6.0|A|
|Peak Repetitive Forward Current<br>(At Rated VR, Square Wave, 20 kHz, TC= 138C)<br>Per Leg|IFRM|6.0|A|
|Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz)<br>Per Package|IFSM|50|A|
|Storage / Operating Case Temperature|Tstg,Tc|−55 to +175|C|
|Operating Junction Temperature|TJ|−55 to +175|C|



Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance − Junction−to−Case<br>Per Leg|R�JC|9.0|C/W|
|Thermal Resistance − Junction−to−Ambient<br>Per Leg|R�JA|80|C/W|



## **ELECTRICAL CHARACTERISTICS** 

|**Rating**|**Symbol**|**Value**|**Value**|**Unit**|
|---|---|---|---|---|
|Maximum Instantaneous Forward Voltage (Note 1) (See Figure 2)<br>Per Leg<br>(IF= 3.0 A)<br>(IF= 6.0 A)|VF|**TJ = 25****C**|**TJ = 150****C**|V|
|||1.15<br>1.35|1.05<br>1.30||
|Maximum Instantaneous Reverse Current (See Figure 4)<br>Per Leg<br>(VR= 200 V)<br>(VR= 100 V)|IR|**TJ = 25****C**|**TJ = 150****C**|�A|
|||5.0<br>2.0|200<br>100||
|Maximum Reverse Recovery Time (Note 2)<br>Per Leg<br>(VR= 30 V, IF= 1.0 A, di/dt = 50 A/�s)<br>(VR= 30 V, IF= 3.0 A, di/dt = 50 A/�s)|trr|45<br>55||ns|
|Maximum Peak Reverse Recovery Current<br>Per Leg<br>(VR= 30 V, IF= 1.0 A, di/dt = 50 A/�s)<br>(VR= 30 V, IF= 3.0 A, di/dt = 50 A/�s)|IRM|2.0<br>3.0||A|



1. Pulse Test: Pulse Width  250 � s, Duty Cycle  2%. 

2. trr measured projecting from 25% of IRM to ground. 

**http://onsemi.com** 

**2** 

**MSRD620CTG, MSRD620CTT4G, SSRD8620CTT4G** 

**==> picture [491 x 635] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 100<br>10 10<br>TJ = 175  C<br>150  C TJ = 175  C 150  C<br>1.0 1.0<br>100  C<br>25  C<br>25  C<br>0.1 0.1<br>0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0<br>VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)<br>Figure 1. Typical Forward Voltage, Per Leg Figure 2. Maximum Forward Voltage, Per Leg<br>100E-6 1E-3<br>TJ = 175  C TJ = 175  C<br>10E-6 100E-6<br>150  C 150  C<br>1E-6 10E-6<br>25  C 25  C<br>100E-9 1E-6<br>10E-9 100E-9<br>1E-9 10E-9<br>0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200<br>VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>Figure 3. Typical Reverse Current, Per Leg Figure 4. Maximum Reverse Current, Per Leg<br>5.0 2.5<br>RATED VOLTAGE APPLIED RATED VOLTAGE APPLIED<br>4.5<br>dc FREQUENCY = 20 kHz FREQUENCY = 20 kHz<br>4.0 R�JC = 9  C/W 2.0 R�JA = 80  C/W<br>3.5 SQUARE WAVE TJ = 175  C dc TJ = 175  C<br>SQUARE WAVE<br>3.0 1.5<br>SINE WAVE<br>2.5 SINE WAVE<br>2.0 1.0<br>1.5<br>1.0 0.5<br>0.5<br>0 0<br>100 110 120 130 140 150 160 170 180 25 45 65 85 105 125 145 165 185<br>TC, CASE TEMPERATURE (  C) TA, AMBIENT TEMPERATURE (  C)<br>IF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS)<br>, REVERSE CURRENT (AMPS)<br>IR<br>, MAXIMUM REVERSE CURRENT (AMPS)<br>IR<br>, AVERAGE FORWARD CURRENT (AMPS) , AVERAGE FORWARD CURRENT (AMPS)<br>IF(AV) IF(AV)<br>**----- End of picture text -----**<br>


**Figure 5. Current Derating, Case (Per Leg)** 

**Figure 6. Current Derating, Ambient (Per Leg)** 

**http://onsemi.com** 

**3** 

**MSRD620CTG, MSRD620CTT4G, SSRD8620CTT4G** 

**==> picture [239 x 189] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>TJ = 25  C<br>10<br>1.0<br>0 20 40 60 80 100 120 140 160 180 200<br>VR, REVERSE VOLTAGE (VOLTS)<br>Figure 7. Typical Capacitance (Per Leg)<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**==> picture [491 x 215] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0E+00<br>1.0E-01<br>1.0E-02<br>1.0E-03<br>1.0E-04<br>0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 10000<br>t, TIME (s)<br>Figure 8. Transient Thermal Response (R � JA)<br>R(t) EFFECTIVE TRANSIENT THERMAL RESISTANCE (NORMALIZE<br>**----- End of picture text -----**<br>


**==> picture [491 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0E+00<br>1.0E-01<br>1.0E-02<br>0.00001 0.0001 0.001 0.01 0.1 1.0 10 100<br>t, TIME (s)<br>Figure 9. Transient Thermal Response (R � JC)<br>(NORMALIZED)<br>RESISTANCE<br>R(t) EFFECTIVE TRANSIENT THERMAL<br>**----- End of picture text -----**<br>


**http://onsemi.com** 

**4** 

**MSRD620CTG, MSRD620CTT4G, SSRD8620CTT4G** 

## **PACKAGE DIMENSIONS** 

**==> picture [467 x 448] intentionally omitted <==**

**----- Start of picture text -----**<br>
DPAK (SINGLE GAUGE)<br>CASE 369C−01<br>ISSUE D<br>NOTES:<br>C 1. DIMENSIONING AND TOLERANCING PER ASME<br>A Y14.5M, 1994.<br>E A 2.3. CONTROLLING DIMENSION: INCHES.THERMAL PAD CONTOUR OPTIONAL WITHIN DI-<br>MENSIONS b3, L3 and Z.<br>b3 B c2 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD<br>FLASH, PROTRUSIONS, OR BURRS. MOLD<br>FLASH, PROTRUSIONS, OR GATE BURRS SHALL<br>NOT EXCEED 0.006 INCHES PER SIDE.<br>L3 4 Z 5. DIMENSIONS D AND E ARE DETERMINED AT THEOUTERMOST EXTREMES OF THE PLASTIC BODY.<br>1 2 3 D DETAIL A H 6. DATUMS A AND B ARE DETERMINED AT DATUMPLANE H.<br>INCHES MILLIMETERS<br>DIM MIN MAX MIN MAX<br>L4 At Fa A 0.086 0.094 2.18 2.38<br>b2 A1 0.000 0.005 0.00 0.13<br>b c b 0.025 0.035 0.63 0.89<br>b2 0.030 0.045 0.76 1.14<br>e 0.005 (0.13) M C H b3 0.180 0.215 4.57 5.46<br>c 0.018 0.024 0.46 0.61<br>by L2 [GAUGE] PLANE MG C SEATINGPLANE eee c2D 0.0180.235 0.0240.245 0.465.97 0.616.22<br>E 0.250 0.265 6.35 6.73<br>e 0.090 BSC 2.29 BSC<br>H 0.370 0.410 9.40 10.41<br>L A1 L 0.055 0.070 1.40 1.78<br>L1 L1 0.108 REF 2.74 REF<br>L2 0.020 BSC 0.51 BSC<br>DETAIL A L3 0.035 0.050 0.89 1.27<br>ROTATED 9  CW L4 −−− 0.040 −−− 1.01<br>Z 0.155 −−− 3.93 −−−<br>SOLDERING FOOTPRINT*<br>6.20 3.00<br>0.244 0.118<br>2.58<br>PE<br>0.102<br>- 4<br>5.80<br>1.60 6.17<br>0.228<br>0.063 0.243<br>LS,<br>SCALE 3:1 mm<br>inches<br>*For additional information on our Pb−Free strategy and soldering<br>details, please download the ON Semiconductor Soldering and<br>Mounting Techniques Reference Manual, SOLDERRM/D.<br>**----- End of picture text -----**<br>


**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **N. American Technical Support** : 800−282−9855 Toll Free **ON Semiconductor Website** : **www.onsemi.com** Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA **Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Japan Customer Focus Center** For additional information, please contact your local **Email** : orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative 

## **LITERATURE FULFILLMENT** : 

**MSRD620CT/D** 

**http://onsemi.com 5**