MSRD620CTG..
Fast / Ultrafast Diode, 200 V, 6 A, Dual Common Cathode, 1.35 V, 55 ns, 50 A
- Manufacturer: ONSEMI
- Product type: Fast & Ultrafast Recovery Rectifier Diodes
- No. of Pins: 3 Pin
- Product Range: MSRD6
- Diode Case Style: TO-252 (DPAK)
- Diode Configuration: Dual Common Cathode
- Forward Voltage Max: 1.35V
- Forward Surge Current: 50A
- Reverse Recovery Time: 55ns
- Average Forward Current: 6A
- Operating Temperature Max: 175°C
- Repetitive Peak Reverse Voltage: 200V
| Delivery and price | |
|---|---|
| Units per pack | 5000 |
| Price | 0.318 € |
| Current stock | 10+ |
| Lead time | 30 days |
## MSRD620CT, NRVSRD620VCT, SSRD8620CT Series ## Switch-mode Soft Ultrafast Recovery Power Rectifier **Plastic DPAK Package** State−of−the−art geometry features epitaxial construction with glass passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies, free wheeling diode and polarity protection diodes. **www.onsemi.com** ## **SOFT ULTRAFAST RECTIFIER 6.0 AMPERES, 200 VOLTS** ## **Features** - Soft Ultrafast Recovery (35 ns typ) - Highly Stable Oxide Passivated Junction - Matched Dual Die Construction − May Be Paralleled for High Current Output - Short Heat Sink Tab Manufactured − Not Sheared **==> picture [74 x 70] intentionally omitted <==** **----- Start of picture text -----**<br> DPAK<br>CASE 369C<br>1<br>2, 4<br>3 “.<br>**----- End of picture text -----**<br> - Epoxy Meets UL 94 V−0 @ 0.125 in. - NRVSRD and SSRD8 Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable - These Devices are Pb−Free and are RoHS Compliant* ## **Mechanical Characteristics** - Case: Epoxy, Molded - Weight: 0.4 Grams (Approximately) - Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable - Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds - ESD Ratings: - ♦ Machine Model = C - ♦ Human Body Model = 2 **MARKING DIAGRAM** **==> picture [111 x 90] intentionally omitted <==** **----- Start of picture text -----**<br> AYWW<br>S<br>620TG<br>c m )<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>G = Pb−Free Package<br>**----- End of picture text -----**<br> ## **ORDERING INFORMATION** |**Device**|**Package**|**Shipping**†| |---|---|---| |MSRD620CTG|DPAK<br>(Pb−Free)|75 Units/Rail| |MSRD620CTT4G|DPAK<br>(Pb−Free)|2,500 /<br>Tape & Reel| |NRVSRD620VCTT4G|DPAK<br>(Pb−Free)|2,500 /<br>Tape & Reel| |SSRD8620CTT4G|DPAK<br>(Pb−Free)|2,500 /<br>Tape & Reel| - †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. - *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Publication Order Number: **MSRD620CT/D** **1** © Semiconductor Components Industries, LLC, 2016 **October, 2016 − Rev. 8** **MSRD620CT, NRVSRD620VCT, SSRD8620CT Series** ## **MAXIMUM RATINGS** |**MAXIMUM RATINGS**|||| |---|---|---|---| |**Rating**|**Symbol**|**Value**|**Unit**| |Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|200|V| |Average Rectified Forward Current<br>(At Rated VR, TC= 137°C)<br>Per Leg<br>Per Package|IO|3.0<br>6.0|A| |Peak Repetitive Forward Current<br>(At Rated VR, Square Wave, 20 kHz, TC= 138°C)<br>Per Leg|IFRM|6.0|A| |Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz)<br>Per Package|IFSM|50|A| |Storage / Operating Case Temperature|Tstg,Tc|−55 to +175|°C| |Operating Junction Temperature|TJ|−55 to +175|°C| Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ## **THERMAL CHARACTERISTICS** |**THERMAL CHARACTERISTICS**|||| |---|---|---|---| |**Rating**|**Symbol**|**Value**|**Unit**| |Thermal Resistance − Junction−to−Case<br>Per Leg|R�JC|9.0|°C/W| |Thermal Resistance − Junction−to−Ambient<br>Per Leg|R�JA|80|°C/W| ## **ELECTRICAL CHARACTERISTICS** |**ELECTRICAL CHARACTERISTICS**||||| |---|---|---|---|---| |**Rating**|**Symbol**|**Value**||**Unit**| |Maximum Instantaneous Forward Voltage (Note 1) (See Figure 2)<br>Per Leg<br>(IF= 3.0 A)<br>(IF= 6.0 A)|VF|**TJ = 25**°**C**|**TJ = 150**°**C**|V| |||1.15<br>1.35|1.05<br>1.30|| |Maximum Instantaneous Reverse Current (See Figure 4)<br>Per Leg<br>(VR= 200 V)<br>(VR= 100 V)|IR|**TJ = 25**°**C**|**TJ = 150**°**C**|�A| |||5.0<br>2.0|200<br>100|| |Maximum Reverse Recovery Time (Note 2)<br>Per Leg<br>(VR= 30 V, IF= 1.0 A, di/dt = 50 A/�s)<br>(VR= 30 V, IF= 3.0 A, di/dt = 50 A/�s)|trr|45<br>55||ns| |Maximum Peak Reverse Recovery Current<br>Per Leg<br>(VR= 30 V, IF= 1.0 A, di/dt = 50 A/�s)<br>(VR= 30 V, IF= 3.0 A, di/dt = 50 A/�s)|IRM|2.0<br>3.0||A| 1. Pulse Test: Pulse Width ≤ 250 � s, Duty Cycle ≤ 2%. 2. trr measured projecting from 25% of IRM to ground. **www.onsemi.com** **2** **MSRD620CT, NRVSRD620VCT, SSRD8620CT Series** **==> picture [234 x 175] intentionally omitted <==** **----- Start of picture text -----**<br> 100<br>10<br>TJ = 175°C<br>150°C<br>1.0<br>100°C<br>25°C<br>0.1<br>0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0<br>VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)<br>IF, INSTANTANEOUS FORWARD CURRENT (AMPS)<br>**----- End of picture text -----**<br> **Figure 1. Typical Forward Voltage, Per Leg** **==> picture [234 x 174] intentionally omitted <==** **----- Start of picture text -----**<br> 100<br>10<br>°<br>TJ = 175 C 150°C<br>1.0<br>25°C<br>0.1<br>0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0<br>VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)<br>IF, INSTANTANEOUS FORWARD CURRENT (AMPS)<br>**----- End of picture text -----**<br> **Figure 2. Maximum Forward Voltage, Per Leg** **==> picture [492 x 405] intentionally omitted <==** **----- Start of picture text -----**<br> 100E-6 1E-3<br>TJ = 175°C TJ = 175°C<br>10E-6 100E-6<br>150°C 150°C<br>1E-6 10E-6<br>25°C 25°C<br>100E-9 1E-6<br>10E-9 100E-9<br>1E-9 10E-9<br>0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200<br>VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>Figure 3. Typical Reverse Current, Per Leg Figure 4. Maximum Reverse Current, Per Leg<br>5.0 2.5<br>RATED VOLTAGE APPLIED RATED VOLTAGE APPLIED<br>4.5<br>dc FREQUENCY = 20 kHz FREQUENCY = 20 kHz<br>4.0 R�JC = 9°C/W 2.0 R�JA = 80°C/W<br>3.5 SQUARE WAVE TJ = 175°C dc TJ = 175°C<br>SQUARE WAVE<br>3.0 1.5<br>SINE WAVE<br>2.5 SINE WAVE<br>2.0 1.0<br>1.5<br>1.0 0.5<br>0.5<br>0 0<br>100 110 120 130 140 150 160 170 180 25 45 65 85 105 125 145 165 185<br>TC, CASE TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C)<br>, REVERSE CURRENT (AMPS)<br>IR<br>, MAXIMUM REVERSE CURRENT (AMPS)<br>IR<br>, AVERAGE FORWARD CURRENT (AMPS) , AVERAGE FORWARD CURRENT (AMPS)<br>IF(AV) IF(AV)<br>**----- End of picture text -----**<br> **Figure 5. Current Derating, Case (Per Leg)** **Figure 6. Current Derating, Ambient (Per Leg)** **www.onsemi.com** **3** **MSRD620CT, NRVSRD620VCT, SSRD8620CT Series** **==> picture [239 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 100<br>TJ = 25°C<br>10<br>1.0<br>0 20 40 60 80 100 120 140 160 180 200<br>VR, REVERSE VOLTAGE (VOLTS)<br>Figure 7. Typical Capacitance (Per Leg)<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br> **==> picture [491 x 222] intentionally omitted <==** **----- Start of picture text -----**<br> 1.0E+00<br>1.0E-01<br>1.0E-02<br>1.0E-03<br>1.0E-04<br>0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 10000<br>t, TIME (s)<br>Figure 8. Transient Thermal Response (R � JA)<br>R(t) EFFECTIVE TRANSIENT THERMAL RESISTANCE (NORMALIZED)<br>**----- End of picture text -----**<br> **www.onsemi.com** **4** **MSRD620CT, NRVSRD620VCT, SSRD8620CT Series** **==> picture [491 x 172] intentionally omitted <==** **----- Start of picture text -----**<br> 1.0E+00<br>1.0E-01<br>1.0E-02<br>0.00001 0.0001 0.001 0.01 0.1 1.0 10 100<br>t, TIME (s)<br>(NORMALIZED)<br>RESISTANCE<br>R(t) EFFECTIVE TRANSIENT THERMAL<br>**----- End of picture text -----**<br> **Figure 9. Transient Thermal Response (R � JC)** **www.onsemi.com** **5** **MSRD620CT, NRVSRD620VCT, SSRD8620CT Series** ## **PACKAGE DIMENSIONS** **==> picture [104 x 29] intentionally omitted <==** **----- Start of picture text -----**<br> DPAK (SINGLE GAUGE)<br>CASE 369C<br>ISSUE F<br>**----- End of picture text -----**<br> **==> picture [481 x 417] intentionally omitted <==** **----- Start of picture text -----**<br> NOTES:<br>A 1. DIMENSIONING AND TOLERANCING PER ASME<br>Y14.5M, 1994.<br>E C 2. CONTROLLING DIMENSION: INCHES.<br>A 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-<br>b3 B c2 4. DIMENSIONS D AND E DO NOT INCLUDE MOLDMENSIONS b3, L3 and Z.<br>FLASH, PROTRUSIONS, OR BURRS. MOLD<br>FLASH, PROTRUSIONS, OR GATE BURRS SHALL<br>4 NOT EXCEED 0.006 INCHES PER SIDE.<br>L3 bale Z 5. DIMENSIONS D AND E ARE DETERMINED AT THE<br>D DETAIL A H 6. DATUMS A AND B ARE DETERMINED AT DATUMOUTERMOST EXTREMES OF THE PLASTIC BODY.<br>1 2 3 PLANE H.<br>7. OPTIONAL MOLD FEATURE.<br>L4 NOTE 7 DIM MININCHESMAX MILLIMETERSMIN MAX<br>b2 c BOTTOM VIEW A 0.086 0.094 2.18 2.38<br>e SIDE VIEW A1 0.000 0.005 0.00 0.13<br>b b 0.025 0.035 0.63 0.89<br>TOP VIEW 0.005 (0.13) M C b2b3 0.0280.180 0.0450.215 0.724.57 1.145.46<br>c 0.018 0.024 0.46 0.61<br>c2 0.018 0.024 0.46 0.61<br>H Z Z D 0.235 0.245 5.97 6.22<br>E 0.250 0.265 6.35 6.73<br>e 0.090 BSC 2.29 BSC<br>L2 [GAUGE] PLANE C SEATINGPLANE H 0.370 0.410 9.40 10.41<br>L 0.055 0.070 1.40 1.78<br>L1 0.114 REF 2.90 REF<br>L2 0.020 BSC 0.51 BSC<br>L L3 0.035 0.050 0.89 1.27<br>A1 BOTTOM VIEW L4 −−− 0.040 −−− 1.01<br>wet L1 s So CONSTRUCTIONS h ALTERNATE Gh Z 0.155 −−− 3.93 −−−<br>DETAIL A<br>ROTATED 9 CW SOLDERING FOOTPRINT*<br>6.20 3.00<br>0.244 0.118<br>2.58<br>0.102<br>5.80<br>1.60 6.17<br>0.228<br>0.063 0.243<br>Te<br>SCALE 3:1 mm<br>inches<br>*For additional information on our Pb−Free strategy and soldering<br>details, please download the ON Semiconductor Soldering and<br>Mounting Techniques Reference Manual, SOLDERRM/D.<br>**----- End of picture text -----**<br> ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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Updated at February 9, 2023
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