MSP3V3-M3/89A

**MSP3V3, MSP5.0A** 

www.vishay.com 

Vishay General Semiconductor 

## **Surface-Mount TRANSZORB[®] Transient Voltage Suppressors** 

## **FEATURES** 

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eSMP [®] Series<br>Top View Bottom View<br>MicroSMP (DO-219AD)<br>Cathode Anode<br>**----- End of picture text -----**<br>


- Very low profile - typical height of 0.65 mm 

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Available<br>**----- End of picture text -----**<br>


- Ideal for automated placement 

- Oxide planar chip junction 

- Unidirectional polarity only 

- Peak pulse power: 150 W (10 μs/1000 μs) 

- ESD capability: **15 kV (air), 8 kV (contact)** 

- Meets MSL level 1, per J-STD-020C, LF maximum peak of 260 °C 

- AEC-Q101 qualified 

- Not recommended for PCB bottom side wave mounting 

## **LINKS TO ADDITIONAL RESOURCES** 

3D Models 

## **PRIMARY CHARACTERISTICS** 

|VWM<br>VBR|3.3 V to 5.0 V<br>4.1 V to 7.07 V|
|---|---|
|PPPM|150 W|
|TJmax.|150 °C|
|Polarity|Unidirectional|
|Package|MicroSMP (DO-219AD)|



- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 

## **TYPICAL APPLICATIONS** 

Use in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, industrial, and signal lines of sensor units for protecting sensitive equipment against transient overvoltages. 

## **MECHANICAL DATA** 

## **Case:** MicroSMP (DO-219AD) 

Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and industrial grade Base P/NHM3 - halogen-free, RoHS-compliant, and automotive grade 

**Terminals:** matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 

M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix meets JESD 201 class 2 whisker test 

**Polarity:** color band denotes the cathode end 

|**MAXIMUM RATINGS**(TA= 25 °C unless otherwise noted)|**MAXIMUM RATINGS**(TA= 25 °C unless otherwise noted)|**MAXIMUM RATINGS**(TA= 25 °C unless otherwise noted)|**MAXIMUM RATINGS**(TA= 25 °C unless otherwise noted)|
|---|---|---|---|
|**PARAMETER**|**SYMBOL**|**VALUE**|**UNIT**|
|Peak power dissipation with a 10/1000 μs waveform (fig. 1)|PPPM (1)(2)|150|W|
|Peak pulse current with a 10/1000 μs waveform|IPPM (1)|See next table|A|
|Power dissipation<br>TM= 120 °C|PD (2)|1.0|W|
|Power dissipation<br>TA= 25 °C|PD (3)|0.5|W|
|Operatingjunction and storage temperature range|TJ, TSTG|-55 to +150|°C|



## **Notes** 

> (1) Non-repetitive current pulse, per fig. 1 

> (2) Mounted on 6.0 mm x 6.0 mm copper pads to each terminal 

- (3) Mounted on minimum recommended pad layout 

Revision: 09-Nov-2020 

Document Number: 88486 

**1** 

For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**MSP3V3, MSP5.0A** 

www.vishay.com 

Vishay General Semiconductor 

|**ELECTRICAL CHARACTERISTICS**(TA= 25 °C unless otherwise|**ELECTRICAL CHARACTERISTICS**(TA= 25 °C unless otherwise|**ELECTRICAL CHARACTERISTICS**(TA= 25 °C unless otherwise|**ELECTRICAL CHARACTERISTICS**(TA= 25 °C unless otherwise|**ELECTRICAL CHARACTERISTICS**(TA= 25 °C unless otherwise|**ELECTRICAL CHARACTERISTICS**(TA= 25 °C unless otherwise|**ELECTRICAL CHARACTERISTICS**(TA= 25 °C unless otherwise|noted)|noted)|noted)|noted)|noted)|noted)|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**DEVICE**<br>**TYPE**|**DEVICE**<br>**MARKING**<br>**CODE**|**BREAKDOWN**<br>**VOLTAGE**<br>**VBR  AT IT (1)**<br>**(V)**<br>**MIN.**<br>**MAX.**||**TEST**<br>**CURRENT**<br>**IT**<br>**(mA)**|**STAND-OFF**<br>**VOLTAGE**<br>**VWM**<br>**(V)**|**MAXIMUM**<br>**REVERSE**<br>**LEAKAGE**<br>**CURRENT**<br>**IR AT VWM**<br>**(μA)**|**MAXIMUM**<br>**VC AT IPPM**||**RD**|**MAXIMUM**<br>**VC AT IPPM**||**RD**|
||||||||**10/1000 μs**|||**8/20 μs**|||
||||||||**VC (V)**|**IPPM (A)**|**RD (**Ω**)**|**VC (V)**|**IPPM (A)**|**RD (**Ω**)**|
|MSP3V3|KC|4.10|5.10|1.0|3.3|200|7.6|19.7|0.127|11.5|87|0.074|
|MSP5.0A|AE|6.40|7.07|10|5.0|100|9.2|16.3|0.131|13.4|75|0.085|



## **Notes** 

• To calculate maximum clamping voltage at surge current uses the following formula: VCL max. = RD x IPP + VBR max. (1) Pulse test: tp ≤ 50 ms 

|**THERMAL CHARACTERISTICS**(TA= 25 °C|unless otherwise noted)|unless otherwise noted)|unless otherwise noted)|
|---|---|---|---|
|**PARAMETER**|**SYMBOL**|**VALUE**|**UNIT**|
|Typical thermal resistance|RθJA (1)|250|°C/W|
||RθJM (2)|30||



## **Notes** 

> (1) Free air, mounted on recommended PCB 1 oz. pad area; thermal resistance RθJA - junction to ambient 

- (2) Units mounted on PCB with 6.0 mm x 6.0 mm copper pad areas; RθJM - junction to mount 

|**IMMUNITY TO STATIC ELECTRICAL DISCHARGE TO THE FOLLOWING STANDARDS**<br>(TA= 25 °C unless otherwise noted)|**IMMUNITY TO STATIC ELECTRICAL DISCHARGE TO THE FOLLOWING STANDARDS**<br>(TA= 25 °C unless otherwise noted)|**IMMUNITY TO STATIC ELECTRICAL DISCHARGE TO THE FOLLOWING STANDARDS**<br>(TA= 25 °C unless otherwise noted)|**IMMUNITY TO STATIC ELECTRICAL DISCHARGE TO THE FOLLOWING STANDARDS**<br>(TA= 25 °C unless otherwise noted)|**IMMUNITY TO STATIC ELECTRICAL DISCHARGE TO THE FOLLOWING STANDARDS**<br>(TA= 25 °C unless otherwise noted)|**IMMUNITY TO STATIC ELECTRICAL DISCHARGE TO THE FOLLOWING STANDARDS**<br>(TA= 25 °C unless otherwise noted)|
|---|---|---|---|---|---|
|**STANDARD**|**TEST TYPE**|**TEST CONDITIONS**|**SYMBOL**|**CLASS**|**VALUE**|
|AEC-Q101-001|Human body model (contact mode)|C = 100 pF, R = 1.5 kΩ|VC|H3B|> 8 kV|
|IEC 61000-4-2(2)|Human body model (air discharge mode)(1)|C = 150 pF, R = 330Ω||4|> 15 kV|



## **Notes** 

> (1) Immunity to IEC 61000-4-2 air discharge mode has a typical performance > 30 kV 

- (2) System ESD standard 

|**ORDERING INFORMATION**(Example)|**ORDERING INFORMATION**(Example)|**ORDERING INFORMATION**(Example)|**ORDERING INFORMATION**(Example)|**ORDERING INFORMATION**(Example)|
|---|---|---|---|---|
|**PREFERRED P/N**|**UNIT WEIGHT (g)**|**PREFERRED PACKAGE CODE**|**BASE QUANTITY**|**DELIVERY MODE**|
|MSP3V3-M3/89A|0.006|89A|4500|7" diameter plastic tape and reel|
|MSP3V3HM3/89A(1)|0.006|89A|4500|7" diameter plastic tape and reel|
|MSP5.0A-M3/89A|0.006|89A|4500|7" diameter plastic tape and reel|
|MSP5.0AHM3/89A(1)|0.006|89A|4500|7" diameter plastic tape and reel|



## **Note** 

- (1) Automotive grade 

Revision: 09-Nov-2020 

Document Number: 88486 

**2** 

For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**MSP3V3, MSP5.0A** 

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www.vishay.com<br>**----- End of picture text -----**<br>


## Vishay General Semiconductor 

## **RATINGS AND CHARACTERISTICS CURVES** (TA = 25 °C unless otherwise noted) 

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150 tt r  = 10 μs r  = 8 μs defined as the PointPulse Width T J = 25 °C(td) is<br>Peak Value Where the Peak Current<br>I PPM decays to 50 % of I PPM<br>100<br>Half Value - I PP<br>IPPM 2<br>50<br>t d  = 1000 μs<br>t d  = 20 μs<br>t d<br>0<br>0 1.0 2.0 3.0 4.0<br>t - Time (ms)<br>Fig. 1 - Pulse Waveform<br>100<br>Non-Repetitive Pulse<br>Waveform Shown in Fig. 1<br>T A  = 25 °C<br>10<br>1<br>0.1<br>0.24 "  x 0.24 "  (6.0 mm x 6.0 mm)<br>Copper Pad Areas<br>0.01<br>0.1 1 10 100 1000 10 000<br>td - Pulse Width (μs)<br>Fig. 2 - Peak Pulse Power Rating Curve<br>100<br>75<br>50<br>25<br>0<br>0 25 50 75 100 125 150 175<br>TJ - Initial Temperature (°C)<br>)PP<br>) or Current (I<br>PP<br>Derating in Percentage (%)<br>Peak Pulse Power (P<br>)RSM<br> - Peak Pulse Current (% I<br>IPPM<br> - Peak Pulse Power (kW)<br>PPM<br>P<br>**----- End of picture text -----**<br>


Fig. 3 - Pulse Power or Current vs. Initial Junction Temperature 

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1000<br>Measured at Zero Bias<br>Measured at Stand-off<br>Voltage, VWM<br>TJ = 25 °C<br>f = 1.0 MHz<br>Vsig = 50 mVp-p<br>100<br>3 3.5 4 4.5 5 5.5 6<br>VWM - Reverse Stand-Off Voltage (V)<br>C - Junction Capacitance (pF)J<br>**----- End of picture text -----**<br>


Fig. 4 - Typical Junction Capacitance 

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1.2<br>TA = TM, Mounted on<br>6.0 mm x 6.0 mm Copper Pad<br>1.0<br>0.8<br>0.6<br>Mounted on Minimum<br>Recommende Pad Area<br>0.4<br>0.2<br>0.0<br>0 25 50 75 100 125 150 175<br>Ambient Temperature (°C)<br>Fig. 5 - Power Dissipation Derating Curve<br>1000<br>Junction to Ambient<br>100<br>10<br>0.01 0.1 1 10 100 1000<br>t - Pulse Duration (s)<br> - Power Dissipation (W)<br>D<br>P<br>Transient Thermal Impedance (°C/W)<br>**----- End of picture text -----**<br>


Fig. 6 - Typical Transient Thermal Impedance 

Revision: 09-Nov-2020 

Document Number: 88486 

**3** 

For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**MSP3V3, MSP5.0A** 

www.vishay.com 

## Vishay General Semiconductor 

## **PACKAGE OUTLINE DIMENSIONS** in inches (millimeters) 

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MicroSMP (DO-219AD)<br>0.059 (1.50) 0.030 (0.75)<br>Cathode Band 0.043 (1.10) 0.022 (0.55)<br>0.055 (1.40) 0.039 (0.98) 0.030 (0.75)<br>0.047 (1.20) 0.031 (0.78) 0.022 (0.55)<br>0.091 (2.30)<br>0.083 (2.10)<br>0.106 (2.70)<br>0.091 (2.30) Mounting Pad Layout<br>0.079<br>0.032<br>(2.00)<br>(0.80)<br>0.029 (0.73) 0.043 0.032<br>0.025 (0.63)<br>(1.10) (0.80)<br>0.011 (0.27)<br>0.005 (0.12) 0.020 (0.50)<br>**----- End of picture text -----**<br>


Revision: 09-Nov-2020 

Document Number: 88486 

**4** 

For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Legal Disclaimer Notice** Vishay 

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## **Disclaimer** 

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Revision: 01-Jan-2019 

Document Number: 91000 

**1**