MSC030SDA120BCT
Silicon Carbide Schottky Diode, Dual Common Cathode, 1.2 kV, 30 A, 130 nC, TO-247
- Manufacturer: MICROCHIP
- Product type: Silicon Carbide Schottky Diodes
- SVHC: No SVHC (04-Feb-2026)
- No. of Pins: 3 Pin
- Product Range: -
- Qualification: -
- Diode Mounting: Through Hole
- Diode Case Style: TO-247
- Diode Configuration: Dual Common Cathode
- Average Forward Current: 30A
- Total Capacitive Charge: 130nC
- Operating Temperature Max: 175°C
- Repetitive Peak Reverse Voltage: 1.2kV
| Delivery and price | |
|---|---|
| Units per pack | 25 |
| Price | 14.11 € |
| Current stock | 10+ |
| Lead time | 30 days |
## **MSC030SDA120BCT Zero Recovery Silicon Carbide Schottky Dual Diode** ## **Product Overview** The silicon carbide (SiC) power Schottky barrier diodes (SBD) product line from Microsemi increases your performance over silicon diode solutions while lowering your total cost of ownership for high-voltage applications. The MSC030SDA120BCT is a 1200 V, 30 A SiC dual common cathode SBD in a three-lead TO-247 package shown below. ## **Features** The following are key features of the MSC030SDA120BCT device: - No reverse recovery - Low forward voltage - Low leakage current - Avalanche energy rated - RoHS compliant ## **Benefits** The following are benefits of the MSC030SDA120BCT device: - High switching frequency - Low switching losses - Low noise (EMI) switching - Higher reliability systems - Increased system power density ## **Applications** The MSC030SDA120BCT device is designed for the following applications: - Power factor correction (PFC) - Anti-parallel diode - Switch-mode power supply - Inverters/converters - Motor controllers - Freewheeling diode - Switch-mode power supply - Inverters/converters - Snubber/clamp diode 053-4114 MSC030SDA120BCT Datasheet Revision A 1 Electrical Specifications ## **Electrical Specifications** This section details the specifications for the MSC030SDA120BCT device. All ratings are per leg. ## **Absolute Maximum Ratings** The following table shows the absolute maximum ratings for the MSC030SDA120BCT device. All Ratings: TC = 25 °C unless otherwise specified. ## **Table 1 • Absolute Maximum Ratings** **==> picture [415 x 383] intentionally omitted <==** **----- Start of picture text -----**<br> Sym- Parameter Ratings Unit<br>bol<br>VR Maximum DC reverse voltage 1200 V<br>VRRM Maximum peak repetitive reverse voltage<br>VRWM Maximum working peak reverse voltage<br>IF Maximum DC forward current TC = 25 °C 65 A<br>TC = 135 °C 29<br>TC = 145 °C 24<br>IFRM Repetitive peak forward surge current (TC = 25 °C, tp = 8.3 ms, half sine 92<br>wave)<br>IFSM Non-repetitive forward surge current (TC = 25°C, tp = 8.3 ms, half sine wave) 165<br>PTOT Power dissipation TC = 25 °C 259 W<br>TC = 110 °C 112<br>TJ ,TST- Operating junction and storage temperature range –55 to 175 °C<br>G<br>TL Lead temperature for 10 seconds 300<br>EAS Single pulse avalanche energy (starting TJ = 25 °C, L = 0.22 mH, peak IL = 3 100 mJ<br>0 A)<br>**----- End of picture text -----**<br> The following table shows the thermal and mechanical characteristics of the MSC030SDA120BCT device. **Table 2 • Thermal and Mechanical Characteristics** |**Symbol**|**Characteristic**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---| |RθJC|Junction-to-case thermal resistance||0.4|0.58|°C/W| |WT|Package weight||0.22||oz| 053-4114 MSC030SDA120BCT Datasheet Revision A 2 Electrical Specifications |**Symbol**|**Characteristic**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---| ||||5.9||g| ||Maximum mounting torque|||10|lbf-in| |||||1.1|N-m| ## **Electrical Performance** The following table shows the static characteristics of the MSC030SDA120BCT device. ## **Table 3 • Static Characteristics** |**Symbol**|**Characteristic**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |VF|Forward Voltage|IF= 30 A, TJ= 25 °C||1.5|1.8|V| |||IF= 30 A, TJ= 175 °C||2.1||| |IRM|Reverse leakage current|VR= 1200 V, TJ= 25 °C||9|200|μA| |||VR= 1200 V, TJ= 175 °C||150||| |QC|Total capacitive charge|VR= 600 V, TJ= 25 °C||130||nC| |CJ|Junction capacitance|VR= 400 V, TJ= 25 °C, ƒ = 1 MHz||141||pF| ||Junction capacitance|VR= 800 V, TJ= 25 °C, ƒ = 1 MHz||105||| 053-4114 MSC030SDA120BCT Datasheet Revision A 3 Electrical Specifications ## **Performance Curves** This section shows the typical performance curves for the MSC030SDA120BCT device. **Figure 1 • Maximum Transient Thermal Impedance** **Figure 2 • Forward Current vs. Forward Voltage** **Figure 3 • Max Forward Current vs. Case Temp** **Figure 4 • Max Power Dissipation vs. Case Temp** **Figure 5 • Reverse Current vs. Reverse Voltage** 053-4114 MSC030SDA120BCT Datasheet Revision A 4 Electrical Specifications **Figure 6 • Total Capacitive Charge vs. VR** **Figure 7 • Junction Capacitance vs. VR** 053-4114 MSC030SDA120BCT Datasheet Revision A 5 Package Specification ## **Package Specification** This section outlines the package specification for the MSC030SDA120BCT device. ## **Package Outline Drawing** This section details the TO-247 package drawing of the MSC030SDA120BCT device. Dimensions are in millimeters and (inches). ## **Figure 8 • Package Outline Drawing** The following table shows the TO-247 dimensions and should be used in conjunction with the package outline drawing. ## **Table 4 • Dimensions** |**Symbol**|**Min. (mm)**|**Max. (mm)**|**Min. (in.)**|**Max (in.)**| |---|---|---|---|---| |A|4.69|5.31|0.185|0.209| |B|1.49|2.49|0.059|0.098| |C|2.21|2.59|0.087|0.102| |D|0.40|0.79|0.016|0.031| |E|5.38|6.20|0.212|0.244| |F|3.50|3.81|0.138|0.150| 053-4114 MSC030SDA120BCT Datasheet Revision A 6 Package Specification |**Symbol**|**Min. (mm)**|**Max. (mm)**|**Min. (in.)**|**Max (in.)**| |---|---|---|---|---| |G|6.15 BSC||0.242 BSC|| |H|20.80|21.46|0.819|0.845| |I|19.81|20.32|0.780|0.800| |J|4.00|4.50|0.157|0.177| |K|1.01|1.40|0.040|0.055| |L|2.87|3.12|0.113|0.123| |M|1.65|2.13|0.065|0.084| |N|15.49|16.26|0.610|0.640| |O|13.50|14.50|0.531|0.571| |P|16.50|17.50|0.650|0.689| |Q|5.45 BSC||0.215 BSC|| |R|2.00|2.75|0.079|0.108| |S|7.10|7.50|0.280|0.295| |Terminal 1|Anode 1|||| |Terminal 2|Common cathode|||| |Terminal 3|Anode 2|||| |Terminal 4|Common cathode|||| 053-4114 MSC030SDA120BCT Datasheet Revision A 7 Legal ## **Microsemi** 2355 W. Chandler Blvd. Chandler, AZ 85224 USA ## Within the USA: +1 (480) 792-7200 Fax: +1 (480) 792-7277 www.microsemi.com[© ] 2020 Microsemi and its corporate affiliates. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation and its corporate affiliates. All other trademarks and service marks are the property of their respective owners. Microsemi's product warranty is set forth in Microsemi's Sales Order Terms and Conditions. Information contained in this publication is provided for the sole purpose of designing with and using Microsemi products. Information regarding device applications and the like is provided only for your convenience and may be superseded by updates. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is your responsibility to ensure that your application meets with your specifications. THIS INFORMATION IS PROVIDED "AS IS." MICROSEMI MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT WILL MICROSEMI BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE WHATSOEVER RELATED TO THIS INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROSEMI HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROSEMI’S TOTAL LIABILITY ON ALL CLAIMS IN RELATED TO THIS INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, YOU PAID DIRECTLY TO MICROSEMI FOR THIS INFORMATION. Use of Microsemi devices in life support, mission-critical equipment or applications, and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend and indemnify Microsemi from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microsemi intellectual property rights unless otherwise stated. Microsemi Corporation, a subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), and its corporate affiliates are leading providers of smart, connected and secure embedded control solutions. Their easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. These solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, the company offers outstanding technical support along with dependable delivery and quality. Learn more at **www.microsemi.com** . 053-4114 | February 2020 | Released 053-4114 MSC030SDA120BCT Datasheet Revision A 8
Updated at April 22, 2026
Microchip Technology Inc. is a leading global provider of smart, connected, and secure embedded control solutions. Known for enabling engineers to design with confidence, the company delivers a comprehensive product portfolio that reduces total system costs and accelerates time to market across the industrial, automotive, communications, and computing sectors. Our extensive selection of Microchip components highlights the manufacturer's strength in both discrete semiconductors and advanced wireless connectivity. We carry a robust lineup of highly efficient single MOSFETs and Schottky diodes tailored for demanding power management and switching applications. Alongside these essential discretes, engineers can source a wide array of ready-to-use networking modules, prominently featuring Bluetooth and WLAN adapters that streamline the development of modern IoT and connected devices. Rounding out the offering is a diverse range of Microchip integrated circuits and specialized components. This includes versatile I/O expanders for simplified system integration, precision timing solutions such as MEMS oscillators and pulse generators, as well as AC/DC LED driver ICs and sub-2.4GHz RF transceivers. Backed by Microchip's renowned commitment to exceptional quality and reliable performance, these components provide scalable, dependable building blocks for complex electronic designs.
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