MRA4004T3G

## MRA4003T3G Series, NRVA4003T3G Series 

## Surface Mount Standard Recovery Power Rectifier **SMA Power Surface Mount Package** 

Features construction with glass passivation. Ideally suited for surface mounted automotive applications. 

## **Features** 

- Compact Package with J−Bend Leads Ideal for Automated Handling 

- Stable, High Temperature, Glass Passivated Junction 

- NRVA Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free and are RoHS Compliant* 

## **Mechanical Characteristics** 

- Case: Molded Epoxy Epoxy meets UL 94 V−0 @ 0.125 in 

- Weight: 70 mg (Approximately) 

- Finish: All External Surfaces are Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 seconds in Solder Bath 

- Polarity: Band in Plastic Body Indicates Cathode Lead 

- Marking: MRA4003T3G = R13 

   - MRA4004T3G = R14 MRA4005T1G = R15 MRA4005T3G = R15 MRA4006T3G = R16 MRA4007T3G = R17 NRVA4004T3G = R14 NRVA4005T3G = R15 NRVA4006T3G = R16 NRVA4007T3G = R17 

**www.onsemi.com STANDARD RECOVERY RECTIFIERS 1.0 AMPERES 300−1000 VOLTS CASE 403D SMA MARKING DIAGRAM** R1x FAYWW ~~:~~ R1x = Specific Device Code 

- F = Wafer Source A = Assembly Location Y = Year WW = Work Week 

= Pb−Free Package 

(Note: Microdot may be in either location) 

## **ORDERING INFORMATION** 

See detailed ordering and shipping information in the ordering information section on page 4 of this data sheet. 

- ESD Rating: 

   - ♦ Human Body Model 3A 

   - ♦ Machine Model C 

> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MRA4003T3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2015 **September, 2015 − Rev. 10** 

**MRA4003T3G Series, NRVA4003T3G Series** 

## **MAXIMUM RATINGS** 

|**Rating**|**Symbol**|**Value**|**Value**|**Value**|**Value**|**Value**|**Unit**|
|---|---|---|---|---|---|---|---|
|||**MRA4003**|**MRA4004/**<br>**NRVA4004**|**MRA4005/**<br>**NRVA4005**|**MRA4006/**<br>**NRVA4006**|**MRA4007/**<br>**NRVA4007**||
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|300|400|600|800|1000|Volts|
|Avg. Rectified Forward Current<br>(At Rated VR, TL= 150°C)|IO|1|||||Amp|
|Peak Repetitive Forward Current<br>(At Rated VR, Square Wave,<br>20 kHz, TL= 150°C)|IFRM|2|||||Amps|
|Non−Repetitive Peak Surge Current<br>(Surge applied at rated load<br>conditions, halfwave, single phase,<br>60 Hz)|IFSM|30|||||Amps|
|Junction Operating Temperature Range|TJ|−55 to 150|||||°C|
|Storage Temperature Range|Tstg|−55 to 175|||||°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

## **THERMAL CHARACTERISTICS** 

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Characteristic Symbol Value Unit<br>Thermal Resistance, Junction−to−Lead (Note 1) R θ JL 16.2 ° C/W<br>Thermal Resistance, Junction−to−Ambient (Note 2) R θ JA 88.3<br>ELECTRICAL CHARACTERISTICS<br>Value<br>Characteristic Symbol TJ = 25 ° C TJ = 100 ° C Unit<br>Maximum Instantaneous Forward Voltage (Note 3) VF Volts<br>(IF = 1 A) 1.1 1.04<br>(IF = 2 A) 1.18 1.12<br>Maximum Instantaneous Reverse Current (at rated DC voltage) IR 10 50 � A<br>1. Minimum Pad Size<br>2. 1 inch Pad Size<br>3. Pulse Test: Pulse Width  ≤  250  � s, Duty Cycle  ≤  2%.<br>10 100E−6<br>TJ = 150 ° C<br>TJ = 150 ° C 10E−6<br>1.0<br>1.0E−6<br>100 ° C<br>−40 ° C<br>100E−9<br>0.1 25 ° C<br>10E−9<br>100 ° C 25 ° C<br>0.01 1.0E−9<br>0.4 0.6 0.8 1.0 1.2 0 50 100 150 200 250 300 350 400<br>VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>IR, REVERSE CURRENT (AMPS)<br>IF, INSTANTANEOUS FORWARD CURRENT (AMPS)<br>**----- End of picture text -----**<br>


**Figure 1. Typical Forward Voltage** 

**Figure 2. Typical Reverse Current** 

**www.onsemi.com** 

**2** 

**MRA4003T3G Series, NRVA4003T3G Series** 

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2.0 1.8<br>dc<br>1.6<br>DC<br>1.4<br>1.5<br>Square Wave<br>1.2<br>Square Wave Ipk/IO =  �<br>1.0<br>1.0 5<br>0.8<br>10<br>0.6<br>20<br>0.5<br>0.4<br>0.2<br>0 0<br>50 60 70 80 90 100 110 120 130 140 150 0 0.5 1.0 1.5 2.0<br>TL, LEAD TEMPERATURE ( ° C) IO, AVERAGE FORWARD CURRENT (AMPS)<br>, AVERAGE FORWARD CURRENT (A)<br>PFO, AVERAGE POWER DISSIPATION (WATTS)<br>IF(AV)<br>**----- End of picture text -----**<br>


**Figure 3. Current Derating** 

**Figure 4. Forward Power Dissipation per Leg** 

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100<br>TJ = 25 ° C<br>10<br>1<br>0 20 40 60 80 100 120 140 160 180 200<br>VR, REVERSE VOLTAGE (VOLTS)<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 5. Capacitance** 

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1.0<br>R � JL (Min Pad Board)<br>R � JA  (1 inch Pad Board)<br>0.1<br>0.01 R � JL(t) = R � JL * r(t)<br>0.001<br>10E−6 100E−6 1E−3 10E−3 100E−3 1E+0 10E+0 100E+0 1E+3 10E+3<br>t, TIME (s)<br>(NORMALIZED)<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 6. Thermal Response** 

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**3** 

**MRA4003T3G Series, NRVA4003T3G Series** 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**|||
|---|---|---|
|**Device**|**Package**|**Shipping**†|
|MRA4003T3G|SMA<br>(Pb−Free)|5,000 / Tape & Reel|
|MRA4004T3G|||
|MRA4005T1G||1,500 / Tape & Reel|
|MRA4005T3G||5,000 / Tape & Reel|
|MRA4006T3G|||
|MRA4007T3G|||
|NRVA4004T3G*|||
|NRVA4005T3G*|||
|NRVA4006T3G*|||
|NRVA4007T3G*|||



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

*NRVA Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. 

**www.onsemi.com** 

**4** 

**MRA4003T3G Series, NRVA4003T3G Series** 

## **PACKAGE DIMENSIONS** 

**SMA** CASE 403D−02 ISSUE G 

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HE<br>NOTES:<br>1.<br>E 1982.<br>2.<br>3.<br>=<br>DIM MIN NOM<br>b D A 1.97 2.10<br>A1 0.05 0.10<br>b 1.27 1.45<br>c 0.15 0.28<br>Le POLARITY INDICATOR = == D 2.29 2.60<br>OPTIONAL AS NEEDED E 4.06 4.32<br>(SEE STYLES) H E 4.83 5.21<br>L 0.76 1.14<br>A<br>A1<br>=, L c Sn<br>SOLDERING FOOTPRINT*<br>4.0<br>0.157<br>2.0<br>0.0787<br>oy<br>oe<br>2.0<br>an<br>0.0787<br>SCALE 8:1 mm<br>(—) inches<br>*For additional information on our Pb−Free strategy and soldering<br>details, please download the ON Semiconductor Soldering and<br>Mounting Techniques Reference Manual, SOLDERRM/D.<br>**----- End of picture text -----**<br>


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NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,<br>1982.<br>**----- End of picture text -----**<br>


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2. CONTROLLING DIMENSION: INCH.<br>3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L.<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>A 1.97 2.10 2.20 0.078 0.083 0.087<br>A1 0.05 0.10 0.20 0.002 0.004 0.008<br>b 1.27 1.45 1.63 0.050 0.057 0.064<br>c 0.15 0.28 0.41 0.006 0.011 0.016<br>== D 2.29 SSSSE 2.60 2.92 0.090 0.103 0.115<br>E 4.06 4.32 4.57 0.160 0.170 0.180<br>H E 4.83 5.21 5.59 0.190 0.205 0.220<br>L 0.76 1.14 1.52 0.030 0.045 0.060<br>**----- End of picture text -----**<br>


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A<br>A1<br>c<br>SOLDERING FOOTPRINT*<br>4.0<br>0.157<br>2.0<br>0.0787<br>oy<br>oe<br>2.0<br>an<br>0.0787<br>SCALE 8:1 mm<br>(—) inches<br>**----- End of picture text -----**<br>


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**MRA4003T3/D** 

**5**