MP700382

## **Thermally Conductive Adhesive Transfer Tapes** 

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MP700386 MP700385 MP700387 MP700388<br>9908 90<br>MP700382 MP700381 MP700383 MP700384<br>**----- End of picture text -----**<br>


## **Description** 

Thermally Conductive Adhesive Transfer Tapes 5Mil and 10 Mil are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes). 

## **Features and Benefits** 

- High mechanical strength 

- Improved surface wet-out for rough surface/LSE substrates 

- Excellent shock performance 

- Wider and longer roll is available 

- Halogen free* 

- Ideal for thin bonding applications 

- Good thermal transfer 

## **Product Construction** 

|**Product Construction**|||
|---|---|---|
|**Product Number**|**Thermally Conductive Adhesive Transfer Tapes**||
||**5 Mil.**|**10 Mil.**|
|Colour|White||
|Tape Type|Filled Acrylic Polymer||
|Tape Thickness|0.125 mm(5 mils)|0.25 mm(10 mils)|
|Filler Type|Ceramic||
|Liner Type|Dual liner using silicone-treated polyester.<br>Easyrelease PET liner is clear in colour, tight side PET liner is blue in colour||
|Liner Thickness|37.5μm to 50μm(1.5 mils to 2 mils)thickness for inside or outside wound liner.||



- Halogen Free is defined as having maximum 900 ppm bromine, maximum 900 ppm chlorine, and/or maximum 1500 ppm total bromine and chlorine, per IEC 61249-2-21. 

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## **Thermally Conductive Adhesive Transfer Tapes** 

## **Typical Physical Properties and Performance Characteristics** 

**Note:** The following technical information and data should be considered representative or typical only and should not be used for specification purposes. 

|**Note:**The following technical informa<br>used for specifcation purposes.|tion and data should be considered representative or typical onl|tion and data should be considered representative or typical onl|y and should not be|
|---|---|---|---|
|**Product Number**|**Thermally Conductive Adhesive Transfer Tapes**|||
||**5 Mil**|**10 Mil**||
|**Property**|**Value**||**Method**|
|Thermal Impedance  (°C cm2/W)<br>(°C in2/W)|3.2<br>(0.5)|5.8<br>(0.9)||
|Thermal Conductivity (W/m-K)|0.6||ASTM C-177|
|Specifc Gravity|1.07g/cc|||
|Surface Resistivity (Ω-cm)|1.6 × 1011|1.6 × 1011|ASTM D-2577|
|Volume Resistivity (Ω-cm)|5.2 × 1011|3.9 × 1011|ASTM D-2577|
|Dielectric Strength  (kV/mm)<br>(V/mil)|26<br>(688)||ASTM D-149|
|Dielectric Properties(frequency)|3 MHz|100 MHz|ASTM D-150|
|Dielectric Constant|93.5|3.2|ASTM D-150|
|90 Degree Peel Test<br>grams/25.4 mm width (oz/in)<br>Untreated aluminium substrate|**5 Mil**|**10 Mil**|1 mil PET Backing|
|Room TempDwell@15 min|990(35)|**1300(46)**||
|65°C Dwell@15 min|1450(51)|2040(72)||
|Room TempDwell@72 hrs|1500(53)|2130(75)||
|65°C TempDwell@72 hrs|1590(56)|2500(88)||
|Static Shear test of holding<br>1000g @Room Tempusing1 in2|PASS|PASS|SS & PET<br>Hold weight 1 week|
|Static Shear test of holding<br>500g @70°C using1 in2|PASS|PASS|SS & PET<br>Hold weight 1 week|
|Heat Aging and Environmental<br>Cycling Performance|Products pass UL-746C Heat Aging testing* and<br>Environmental Cycling testing. Contact your<br>technical services representative for details.||UL-746C|



* UL-746A file number E213134 

** Estimated value based on Tape 8815 test data 

*** When ASTM is mentioned, the test was performed in accordance with the ASTM test method 

**Note:** The following technical information and data should be considered representative or typical only and should not be used for specification purposes. 

**Overlap Shear at Specific Temperatures Properties:** (Test conditions: Test substrates are bare untreated aluminium or anodized aluminium, 1 in. 2 test sample size, shear speed = 0.5 inch/minute. Samples heated to temperature noted below in 5 minutes and then OLS tested. Before testing, samples are dwelled for 3 days at RT to build adhesive bond to substrate). 

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## **Thermally Conductive Adhesive Transfer Tapes** 

## **Thermally Conductive Adhesive Transfer Tapes** 

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**Overlap Shear Heat Aged Properties:** (Test conditions: Test substrates are bare untreated aluminum, OLS speed is 0.5 in./ min., adhesive cleanly removes from substrate surface during OLS test, 1 in.2 test sample size, test at RT conditions after aging cycle complete, Tape 10 Mil). 

## **Thermally Conductive Adhesive Transfer Tapes** 

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Newark.com/multicomp-pro Farnell.com/multicomp-pro Element14.com/multicomp-pro 

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## **Thermally Conductive Adhesive Transfer Tapes** 

## **Typical Physical Properties and Performance Characteristics (continued)** 

**Note:** The following technical information and data should be considered representative or typical only and should not be used for specification purposes. 

**Torque Resistance:** (Test conditions: This test indicates the resistance to twisting shear forces, heat sink attachment to different chip package material types, 1.0 hour room temperature dwell after attachment to the package surface before torque testing is completed). 

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**Thermal Impedance (C-in2/W) vs. Thickness:** (Test Conditions: test method). 

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## **Thermally Conductive Adhesive Transfer Tapes** 

## **Available Sizes** 

**Width** : Maximum width 22 inches. **Length** : Multiples of 36 yds. Maximum 108 yds. 

**Custom Sizes** :  Contact your local sales representative for information and availability of custom sizes (width and length) or die cut parts of Thermally Conductive Adhesive Transfer Tapes. 

## **Application Guidelines** 

- 1)  Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass cleaners which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above. 

   - Note:- - Be sure to read and follow the manufacturers’ precautions and directions when using primers and solvents. 

- 2)  Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate. 

- 3)  Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Use of a thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrates can conform to the other substrate. 

- 4) Application pressure guideline table for Thermally Conductive Adhesive Transfer Tapes 5 Mil and 10 Mil. 

|**Substrate**|**Application Conditions**|**Time**|
|---|---|---|
|Rigid to rigid|Minimum: 15 psi at room temperature<br>Preferred: 50 psi at room temperature<br>Morepressure equals better wetting|2 sec<br>5 sec|
|Flexible to rigid|Minimum: 5 psi at room temperature<br>Preferred: 15psi at room temperature|1 sec<br>5 sec|
|Flexible to fexible|Minimum: 5 psi at room temperature<br>Preferred: 15psi at room temperature|1 sec<br>5 sec|



## **Application Tips:** 

- For rigid to rigid bonding, a twisting motion during assembly of the substrates will improve wetting. This should be a back and forth twisting motion during the application of compression. 

- For flexible to rigid or flexible to flexible bonding, a roll lamination system may be employed to apply the flexible substrate down to the rigid (or other flexible) substrate. Rubber nip rollers, heated steel rollers, and other methods can be employed to bond in a continuous manner. 

- Heat can be employed to increase wetting percentage and wetting rate of the substrates and to build room temperature bond strength. 

- Primers may be employed to increase adhesion to low surface energy substrates (eg. plastic packages). Contact your Technical Service Representative for more information about primers. 

- For best product performance, it is important to use pressure and time conditions to achieve as much wetting as possible. 

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## **Thermally Conductive Adhesive Transfer Tapes** 

## **Rework Tips:** 

- Rework requires separation of the two substrates. Separation can be accomplished by any practical means: prying, torquing or peeling. The tape will be destroyed upon separation and must be replaced. The surfaces should be re-cleaned according to the recommendations in this data page. 

- Heating up the substrates can reduce the adhesion level and make removal easier. 

- Part separation can be aided by immersion in warm water. This should eventually reduce the adhesion and make prying, torquing or peeling apart the substrates easier. 

## **Application Ideas** 

- Thermally Conductive Adhesive Transfer Tapes 5 Mil and 10 Mil are designed to provide a preferential heat-transfer path between heat-generating devices and cooling devices (e.g., fans, heat pipes and heat sinks). 

## **Shelf Life** 

The shelf life of Thermally Conductive Adhesive Transfer Tapes 5 Mil and 10 Mil is 24 months from the date of manufacture when stored in the original packaging materials and stored at 22°C (72°F) and 50% relative humidity. 

## **Part Number Table** 

|**Part Number Table**||
|---|---|
|**Description**|**Part Number**|
|ThermallyConductive Adhesive Transfer Tape, White, 5 Mil, 1/2” x 5yd|MP700386|
|ThermallyConductive Adhesive Transfer Tape, White, 5 Mil, 1” x 5yd|MP700385|
|ThermallyConductive Adhesive Transfer Tape, White, 5 Mil, 2” x 5yd|MP700387|
|ThermallyConductive Adhesive Transfer Tape, White, 5 Mil, 3/4” x 5yd|MP700388|
|ThermallyConductive Adhesive Transfer Tape, White, 10Mil, 1/2” x 5yd|MP700382|
|ThermallyConductive Adhesive Transfer Tape, White, 10Mil, 1” x 5yd|MP700381|
|ThermallyConductive Adhesive Transfer Tape, White, 10Mil, 2” x 5yd|MP700383|
|ThermallyConductive Adhesive Transfer Tape, White, 10Mil, 3/4” x 5yd|MP700384|



**Important Notice :** This data sheet and its contents (the “Information”) belong to the members of the AVNET group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence. Multicomp Pro is the registered trademark of Premier Farnell Limited 2019. 

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