MMQA5V6T1G

## MMQA, SZMMQA Quad Common Anode Series 

## SC-74 Quad Monolithic Common Anode 

## **Transient Voltage Suppressors for ESD Protection** 

This quad monolithic silicon voltage suppressor is designed for applications requiring transient overvoltage protection capability. It is intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. Its quad junction common anode design protects four separate lines using only one package. These devices are ideal for situations where board space is at a premium. 

## **Features** 

- SC−74 Package Allows Four Separate Unidirectional Configurations 

- Peak Power − Min. 24 W @ 1.0 ms (Unidirectional), per Figure 5 Waveform 

## **www.onsemi.com** 

**SC−74 QUAD TRANSIENT VOLTAGE SUPPRESSOR 24 WATTS PEAK POWER 5.6 −33 VOLTS** 

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SC−74<br>CASE 318F<br>STYLE 1<br>**----- End of picture text -----**<br>


## **PIN ASSIGNMENT** 

- Peak Power − Min. 150 W @ 20 s (Unidirectional), per Figure 6 Waveform 

- Maximum Clamping Voltage @ Peak Pulse Current 

- Low Leakage < 2.0 A 

- ESD Rating of Class 3B (exceeding 16 kV) per the Human Body Model 

- SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free and are RoHS Compliant* 

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PIN 1. CATHODE<br>1 6<br>2. ANODE<br>3. CATHODE<br>2 5<br>4. CATHODE<br>5. ANODE<br>3 4 6. CATHODE<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

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xxxM<br>e S<br>xxx = Specific Device Code<br>M = Date Cade<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br>


## **DEVICE MARKING & ORDERING INFORMATION** 

See specific marking and ordering information in the device marking and ordering information table on page 6 of this data sheet. 

> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MMQA/D** 

**1** 

© Semiconductor Components Industries, LLC, 2015 **January, 2015 − Rev. 11** 

## **MMQA, SZMMQA Quad Common Anode Series** 

## **THERMAL CHARACTERISTICS** (TA = 25 ° C Unless Otherwise Noted) 

|**THERMAL CHARACTERISTICS**(TA= 25°C Unless Otherwise Noted)||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Peak Power Dissipation @ 1.0 ms (Note 1)<br>@ TA≤25°C|Ppk|24|W|
|Peak Power Dissipation @ 20�s (Note 2)<br>@ TA≤25°C|Ppk|150|W|
|Total Power Dissipation on FR-5 Board (Note 3)<br>@ TA = 25°C|PD|225<br>1.8|MW<br>mW/°C|
|Thermal Resistance from Junction−to−Ambient|R�JA|556|°C/W|
|Total Power Dissipation on Alumina Substrate (Note 4)<br>@ TA = 25°C<br>Derate above 25°C|PD|300<br>2.4|MW<br>mW/°C|
|Thermal Resistance from Junction−to−Ambient|R�JA|417|°C/W|
|Junction and Storage Temperature Range|TJ, Tstg|−55 to+150|°C|
|Lead Solder Temperature−Maximum (10 Second Duration)|TL|260|°C|



1. Non-repetitive current pulse per Figure 5 and derate above TA = 25 ° C per Figure 4. 

2. Non-repetitive current pulse per Figure 6 and derate above TA = 25 ° C per Figure 4. 

3. FR-5 = 1.0 x 0.75 x 0.62 in. 

4. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C Unless Otherwise Noted) **UNIDIRECTIONAL** 

(Circuit tied to pins 1, 2, and 5; Pins 2, 3, and 5; Pins 2, 4, and 5; or Pins 2, 5, and 6) (VF = 0.9 V Max @ IF = 10 mA) 

|**Device**<br>(Note 5)|**Breakdown Voltage**|**Breakdown Voltage**|**Breakdown Voltage**|**Breakdown Voltage**|**Max**<br>**Reverse**<br>**Leakage**<br>**Current**|**Max**<br>**Reverse**<br>**Leakage**<br>**Current**|**Max Zener**<br>**Impedance**<br>(Note 7)|**Max**<br>**Reverse**<br>**Surge**<br>**Current**|**Max**<br>**Reverse**<br>**Voltage @**<br>**IRSM**<br>(Note 8)<br>**(Clamping**<br>**Voltage)**|**Maximum**<br>**Temperature**<br>**Coefficient**<br>**of VZ**|**Capacitance**<br>**@ 0 Volt**<br>**Bias, 1 MHz**|**Capacitance**<br>**@ 0 Volt**<br>**Bias, 1 MHz**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||**VZT**<br>(Note 6)<br>**(V)**||**@ IZT**|**IR**|**VR**|||||**(pF)**||
||Min|Nom|Max|(mA)|(nA)|(V)|ZZT@ IZT<br>(�)    (mA)|IRSM<br>(A)|VRSM<br>(V)|(mV/°C)|Min|Max|
|MMQA5V6T1G|5.32|5.6|5.88|1.0|2000|3.0|400|3.0|8.0|1.26|−|−|
|MMQA6V2T1G/T3G|5.89|6.2|6.51|1.0|700|4.0|300|2.66|9.0|10.6|−|−|
|MMQA6V8T1G|6.46|6.8|7.14|1.0|500|4.3|300|2.45|9.8|10.9|100|250|
|MMQA12VT1G|11.4|12|12.6|1.0|75|9.1|80|1.39|17.3|14|−|−|
|MMQA13VT1G|12.4|13|13.7|1.0|75|9.8|80|1.29|18.6|15|−|−|
|MMQA15VT1G|14.3|15|15.8|1.0|75|11|80|1.1|21.7|16|−|−|
|MMQA18VT1G|17.1|18|18.9|1.0|75|14|80|0.923|26|19|−|−|
|MMQA20VT1G/T3G|19|20|21|1.0|75|15|80|0.84|28.6|20.1|−|−|
|MMQA22VT1G|20.9|22|23.1|1.0|75|17|80|0.758|31.7|22|−|−|
|MMQA24VT1G|22.8|24|25.2|1.0|75|18|100|0.694|34.6|25|−|−|
|MMQA27VT1G|25.7|27|28.4|1.0|75|21|125|0.615|39|28|−|−|
|MMQA33VT1G|31.4|33|34.7|1.0|75|25|200|0.504|48.6|37|−|−|



5. Includes SZ-prefix devices where applicable. 

6. VZ measured at pulse test current IT at an ambient temperature of 25 ° C. 

7. ZZT is measured by dividing the AC voltage drop across the device by the AC current supplied. The specified limits are IZ(AC) = 0.1 IZ(DC), with AC frequency = 1 kHz. 

8. Surge current waveform per Figure 5 and derate per Figure 4. 

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**MMQA, SZMMQA Quad Common Anode Series** 

## **TYPICAL CHARACTERISTICS** 

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300 10,000<br>250 BIASED AT 0 V<br>BIASED AT 1 V 1,000<br>200 BIASED AT 50%<br>OF VZ NOM<br>+150°C<br>150 100<br>+25°C<br>100<br>10 -40°C<br>50<br>0 0<br>5.6 6.8 12 20 27 33 5.6 6.8 20 27 33<br>VZ, NOMINAL ZENER VOLTAGE (V) VZ, NOMINAL ZENER VOLTAGE (V)<br>C, CAPACITANCE (pF) IR, LEAKAGE (nA)<br>**----- End of picture text -----**<br>


**Figure 1. Typical Capacitance** 

**Figure 2. Typical Leakage Current** 

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300 100<br>90<br>250<br>80<br>ALUMINA SUBSTRATE<br>70<br>200<br>60<br>150 50<br>40<br>100<br>30<br>FR‐5 BOARD<br>20<br>50<br>10<br>0 0 25 50 75 100 125 150 175 00 25 50 75 100 125 150 175 200<br>TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C)<br>C<br>°<br>OR CURRENT @ TA = 25<br>PD , POWER DISSIPATION (mW)<br>PEAK PULSE DERATING IN % OF PEAK POWER<br>**----- End of picture text -----**<br>


**Figure 3. Steady State Power Derating Curve** 

**Figure 4. Pulse Derating Curve** 

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**MMQA, SZMMQA Quad Common Anode Series** 

## **TYPICAL CHARACTERISTICS** 

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100<br>PULSE WIDTH (tP) IS DEFINED tr PEAK VALUE IRSM @ 8 �s<br>AS THAT POINT WHERE THE 90<br>t r PEAK CURRENT DECAYS TO 50% 80 PULSE WIDTH (tP) IS DEFINED<br>100 PEAK VALUE�—�I RSM OF IRSM. AS THAT POINT WHERE THE<br>tr ≤ 10 �s 70 PEAK CURRENT DECAY = 8 �s<br>60<br>IRSM 50 HALF VALUE IRSM/2 @ 20 �s<br>HALF VALUE�—<br>2<br>40<br>50<br>30<br>tP<br>tP 20<br>10<br>0<br>00 1 2 3 4 0 20 40 60 80<br>t, TIME (ms)<br>t, TIME (�s)<br>Figure 5. 10  ×  1000  � s Pulse Waveform Figure 6. 8  ×  20  � s Pulse Waveform<br>100 200<br>RECTANGULAR<br>WAVEFORM, TA = 25 ° C 180<br>160<br>8 × 20 WAVEFORM AS PER FIGURE 6<br>140<br>120<br>10 100<br>80<br>UNIDIRECTIONAL<br>60 10 × 100 WAVEFORM AS PER FIGURE 5<br>40<br>20<br>1.0 0<br>0.1 1.0 10 100 1000 5.6 6.8 12 20 27 33<br>PW, PULSE WIDTH (ms) NOMINAL VZ<br>VALUE (%)<br>% OF PEAK PULSE CURRENT<br>, PEAK SURGE POWER (W)<br>Ppk PEAK SURGE POWER (W) PPK<br>**----- End of picture text -----**<br>


**Figure 7. Maximum Non−Repetitive Surge Power, Ppk versus PW** 

**Figure 8. Typical Maximum Non−Repetitive Surge Power, Ppk versus VZ** 

Power is defined as VRSM x IZ(pk) where VRSM is the clamping voltage at IZ(pk). 

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**4** 

**MMQA, SZMMQA Quad Common Anode Series** 

## **TYPICAL COMMON ANODE APPLICATIONS** 

A quad junction common anode design in a SC-74 package protects four separate lines using only one package. This adds flexibility and creativity to PCB design especially 

when board space is at a premium. A simplified example of MMQA/SZMMQA Series Device applications is illustrated below. 

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A<br>KEYBOARD B<br>TERMINAL FUNCTIONAL<br>I/O C<br>PRINTER DECODER<br>D<br>ETC.<br>GND<br>MMQA/SZMMQA SERIES DEVICE<br>**----- End of picture text -----**<br>


**Figure 9. Computer Interface Protection** 

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VDD<br>VGG<br>ADDRESS BUS<br>RAM ROM<br>DATA BUS<br>CPU<br>I/O<br>CLOCK<br>CONTROL BUS<br>GND<br>**----- End of picture text -----**<br>


MMQA/SZMMQA SERIES DEVICE 

**Figure 10. Microprocessor Protection** 

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**5** 

**MMQA, SZMMQA Quad Common Anode Series** 

## **DEVICE MARKING AND ORDERING INFORMATION** 

|**Device***|**Device Marking**|**Package**|**Shipping**|
|---|---|---|---|
|MMQA5V6T1G|5A6|SC−74<br>(Pb−Free)|3,000/Tape & Reel|
|MMQA6V2T1G|6A2||3,000/Tape & Reel|
|MMQA6V2T3G|6A2||10,000/Tape & Reel|
|MMQA6V8T1G|6A8||3,000/Tape & Reel|
|MMQA12VT1G|12A||3,000/Tape & Reel|
|MMQA13VT1G|13A||3,000/Tape & Reel|
|MMQA15VT1G|15A||3,000/Tape & Reel|
|MMQA18VT1G|18A||3,000/Tape & Reel|
|MMQA20VT1G|20A||3,000/Tape & Reel|
|MMQA20VT3G|20A||10,000/Tape & Reel|
|MMQA22VT1G|22A||3,000/Tape & Reel|
|MMQA24VT1G|24A||3,000/Tape & Reel|
|MMQA27VT1G|27A||3,000/Tape & Reel|
|MMQA27VT3G|27A||10,000/Tape & Reel|
|MMQA33VT1G|33A||3,000/Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

*IncludeS SZ-prefix devices where applicable. 

## **Mechanical Characteristics:** 

**CASE:** Void−free, Transfer−molded, Thermosetting Plastic Case. **FINISH:** Corrosion resistant finish, easily solderable. Package designed for optimal automated board assembly. Small package size for high density applications. Available in 8 mm Tape and Reel. Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel. 

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**6** 

**MMQA, SZMMQA Quad Common Anode Series** 

## **PACKAGE DIMENSIONS** 

**SC−74** 

CASE 318F−05 ISSUE N 

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D NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: INCH.<br>3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH<br>THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM<br>d o 6 5 : 4 4 4 THICKNESS OF BASE MATERIAL.<br>HE 1 2 3 E 4. 318F−01, −02, −03, −04 OBSOLETE. NEW STANDARD318F−05.<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>bog b SS A 0.90 1.00 1.10 0.035 0.039 0.043<br>A1 0.01 0.06 0.10 0.001 0.002 0.004<br>e b 0.25 0.37 0.50 0.010 0.015 0.020<br>c 0.10 0.18 0.26 0.004 0.007 0.010<br>7 ======= D 2.90 3.00 3.10 0.114 0.118 0.122<br>E 1.30 1.50 1.70 0.051 0.059 0.067<br>C e 0.85 0.95 1.05 0.034 0.037 0.041<br>0.05 (0.002) A L 0.20 0.40 0.60 0.008 0.016 0.024<br>H E 2.50 2.75 3.00 0.099 0.108 0.118<br>L 0 ° − 10 ° 0 ° − 10 °<br>A1<br>jim, 445 STYLE 1:<br>PIN 1. CATHODE<br>2. ANODE<br>SOLDERING FOOTPRINT* 3. CATHODE<br>4. CATHODE<br>5. ANODE<br>2.4 6. CATHODE<br>0.094<br>0.95<br>1.9 0.037<br>0.074<br>0.95<br>0.7 0.037<br>0.028<br>= 1.0<br>0.039 SCALE 10:1 mm<br>— inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

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## **LITERATURE FULFILLMENT** : 

**MMQA/D** 

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**7**