MMQA33VT1G

## MMQA, SZMMQA Quad Common Anode Series 

## ESD Protection Diode 

## **SC−74 Quad Monolithic Common Anode** 

This quad monolithic silicon voltage suppressor is designed for applications requiring transient overvoltage protection capability. It is intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. Its quad junction common anode design protects four separate lines using only one package. These devices are ideal for situations where board space is at a premium. 

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**SC−74 QUAD SURGE PROTECTION 24 WATTS PEAK POWER 5.6 −33 VOLTS** 

## **Features** 

- SC−74 Package Allows Four Separate Unidirectional Configurations 

- Peak Power − Min. 24 W @ 1.0 ms (Unidirectional), per Figure 5 Waveform 

- Peak Power − Min. 150 W @ 20 s (Unidirectional), per Figure 6 Waveform 

- Maximum Clamping Voltage @ Peak Pulse Current 

**SC−74 CASE 318F STYLE 1** 

**PIN ASSIGNMENT** 

- Low Leakage < 2.0 A 

• ESD Rating of Class 3B (exceeding 16 kV) per the Human Body PIN 1. CATHODE 1 6 Model 2. ANODE 3. CATHODE • SZ Prefix for Automotive and Other Applications Requiring Unique 2 5 4. CATHODE Site and Control Change Requirements; AEC−Q101 Qualified and 5. ANODE 3 4 6. CATHODE PPAP Capable ~~=~~ • These Devices are Pb−Free and are RoHS Compliant* **MARKING DIAGRAM** 

xxxM ~~=~~ xxx = Specific Device Code M = Date Cade = Pb−Free Package 

(Note: Microdot may be in either location) 

## **DEVICE MARKING & ORDERING INFORMATION** 

See specific marking and ordering information in the device marking and ordering information table on page 6 of this data sheet. 

> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MMQA/D** 

**1** 

© Semiconductor Components Industries, LLC, 2015 **October, 2017 − Rev. 12** 

## **MMQA, SZMMQA Quad Common Anode Series** 

## **THERMAL CHARACTERISTICS** (TA = 25 ° C Unless Otherwise Noted) 

|**THERMAL CHARACTERISTICS**(TA= 25°C Unless Otherwise Noted)||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Peak Power Dissipation @ 1.0 ms (Note 1)<br>@ TA≤25°C|Ppk|24|W|
|Peak Power Dissipation @ 20�s (Note 2)<br>@ TA≤25°C|Ppk|150|W|
|Total Power Dissipation on FR-5 Board (Note 3)<br>@ TA = 25°C|PD|225<br>1.8|MW<br>mW/°C|
|Thermal Resistance from Junction−to−Ambient|R�JA|556|°C/W|
|Total Power Dissipation on Alumina Substrate (Note 4)<br>@ TA = 25°C<br>Derate above 25°C|PD|300<br>2.4|MW<br>mW/°C|
|Thermal Resistance from Junction−to−Ambient|R�JA|417|°C/W|
|Junction and Storage Temperature Range|TJ, Tstg|−55 to+150|°C|
|Lead Solder Temperature−Maximum (10 Second Duration)|TL|260|°C|



1. Non-repetitive current pulse per Figure 5 and derate above TA = 25 ° C per Figure 4. 

2. Non-repetitive current pulse per Figure 6 and derate above TA = 25 ° C per Figure 4. 

3. FR-5 = 1.0 x 0.75 x 0.62 in. 

4. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C Unless Otherwise Noted) **UNIDIRECTIONAL** 

(Circuit tied to pins 1, 2, and 5; Pins 2, 3, and 5; Pins 2, 4, and 5; or Pins 2, 5, and 6) (VF = 0.9 V Max @ IF = 10 mA) 

|**Device**<br>(Note 5)|**Breakdown Voltage**|**Breakdown Voltage**|**Breakdown Voltage**|**Breakdown Voltage**|**Max**<br>**Reverse**<br>**Leakage**<br>**Current**|**Max**<br>**Reverse**<br>**Leakage**<br>**Current**|**Max Zener**<br>**Impedance**<br>(Note 7)|**Max**<br>**Reverse**<br>**Surge**<br>**Current**|**Max**<br>**Reverse**<br>**Voltage @**<br>**IRSM**<br>(Note 8)<br>**(Clamping**<br>**Voltage)**|**Maximum**<br>**Temperature**<br>**Coefficient**<br>**of VZ**|**Capacitance**<br>**@ 0 Volt**<br>**Bias, 1 MHz**|**Capacitance**<br>**@ 0 Volt**<br>**Bias, 1 MHz**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||**VZT**<br>(Note 6)<br>**(V)**||**@ IZT**|**IR**|**VR**|||||**(pF)**||
||Min|Nom|Max|(mA)|(nA)|(V)|ZZT@ IZT<br>(�)    (mA)|IRSM<br>(A)|VRSM<br>(V)|(mV/°C)|Min|Max|
|MMQA5V6T1G|5.32|5.6|5.88|1.0|2000|3.0|400|3.0|8.0|1.26|−|−|
|MMQA6V2T1G/T3G|5.89|6.2|6.51|1.0|700|4.0|300|2.66|9.0|10.6|−|−|
|MMQA6V8T1G|6.46|6.8|7.14|1.0|500|4.3|300|2.45|9.8|10.9|100|250|
|MMQA12VT1G|11.4|12|12.6|1.0|75|9.1|80|1.39|17.3|14|−|−|
|MMQA13VT1G|12.4|13|13.7|1.0|75|9.8|80|1.29|18.6|15|−|−|
|MMQA15VT1G|14.3|15|15.8|1.0|75|11|80|1.1|21.7|16|−|−|
|MMQA18VT1G|17.1|18|18.9|1.0|75|14|80|0.923|26|19|−|−|
|MMQA20VT1G/T3G|19|20|21|1.0|75|15|80|0.84|28.6|20.1|−|−|
|MMQA22VT1G|20.9|22|23.1|1.0|75|17|80|0.758|31.7|22|−|−|
|MMQA24VT1G|22.8|24|25.2|1.0|75|18|100|0.694|34.6|25|−|−|
|MMQA27VT1G|25.7|27|28.4|1.0|75|21|125|0.615|39|28|−|−|
|MMQA33VT1G|31.4|33|34.7|1.0|75|25|200|0.504|48.6|37|−|−|



5. Includes SZ-prefix devices where applicable. 

6. VZ measured at pulse test current IT at an ambient temperature of 25 ° C. 

7. ZZT is measured by dividing the AC voltage drop across the device by the AC current supplied. The specified limits are IZ(AC) = 0.1 IZ(DC), with AC frequency = 1 kHz. 

8. Surge current waveform per Figure 5 and derate per Figure 4. 

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**2** 

**MMQA, SZMMQA Quad Common Anode Series** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
300 10,000<br>250 BIASED AT 0 V<br>BIASED AT 1 V 1,000<br>200 BIASED AT 50%<br>OF VZ NOM<br>+150°C<br>150 100<br>+25°C<br>100<br>10 -40°C<br>50<br>0 0<br>5.6 6.8 12 20 27 33 5.6 6.8 20 27 33<br>VZ, NOMINAL ZENER VOLTAGE (V) VZ, NOMINAL ZENER VOLTAGE (V)<br>C, CAPACITANCE (pF) IR, LEAKAGE (nA)<br>**----- End of picture text -----**<br>


**Figure 1. Typical Capacitance** 

**Figure 2. Typical Leakage Current** 

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**----- Start of picture text -----**<br>
300 100<br>90<br>250<br>80<br>ALUMINA SUBSTRATE<br>70<br>200<br>60<br>150 50<br>40<br>100<br>30<br>FR‐5 BOARD<br>20<br>50<br>10<br>0 0 25 50 75 100 125 150 175 00 25 50 75 100 125 150 175 200<br>TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C)<br>C<br>°<br>OR CURRENT @ TA = 25<br>PD , POWER DISSIPATION (mW)<br>PEAK PULSE DERATING IN % OF PEAK POWER<br>**----- End of picture text -----**<br>


**Figure 3. Steady State Power Derating Curve** 

**Figure 4. Pulse Derating Curve** 

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**3** 

**MMQA, SZMMQA Quad Common Anode Series** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
100<br>PULSE WIDTH (tP) IS DEFINED tr PEAK VALUE IRSM @ 8 �s<br>AS THAT POINT WHERE THE 90<br>t r PEAK CURRENT DECAYS TO 50% 80 PULSE WIDTH (tP) IS DEFINED<br>100 PEAK VALUE�—�I RSM OF IRSM. AS THAT POINT WHERE THE<br>tr ≤ 10 �s 70 PEAK CURRENT DECAY = 8 �s<br>60<br>IRSM 50 HALF VALUE IRSM/2 @ 20 �s<br>HALF VALUE�—<br>2<br>40<br>50<br>30<br>tP<br>tP 20<br>10<br>0<br>00 1 2 3 4 0 20 40 60 80<br>t, TIME (ms)<br>t, TIME (�s)<br>Figure 5. 10  ×  1000  � s Pulse Waveform Figure 6. 8  ×  20  � s Pulse Waveform<br>100 200<br>RECTANGULAR<br>WAVEFORM, TA = 25 ° C 180<br>160<br>8 × 20 WAVEFORM AS PER FIGURE 6<br>140<br>120<br>10 100<br>80<br>UNIDIRECTIONAL<br>60 10 × 100 WAVEFORM AS PER FIGURE 5<br>40<br>20<br>1.0 0<br>0.1 1.0 10 100 1000 5.6 6.8 12 20 27 33<br>PW, PULSE WIDTH (ms) NOMINAL VZ<br>VALUE (%)<br>% OF PEAK PULSE CURRENT<br>, PEAK SURGE POWER (W)<br>Ppk PEAK SURGE POWER (W) PPK<br>**----- End of picture text -----**<br>


**Figure 7. Maximum Non−Repetitive Surge Power, Ppk versus PW** 

**Figure 8. Typical Maximum Non−Repetitive Surge Power, Ppk versus VZ** 

Power is defined as VRSM x IZ(pk) where VRSM is the clamping voltage at IZ(pk). 

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**4** 

**MMQA, SZMMQA Quad Common Anode Series** 

## **TYPICAL COMMON ANODE APPLICATIONS** 

A quad junction common anode design in a SC-74 package protects four separate lines using only one package. This adds flexibility and creativity to PCB design especially 

when board space is at a premium. A simplified example of MMQA/SZMMQA Series Device applications is illustrated below. 

**==> picture [350 x 150] intentionally omitted <==**

**----- Start of picture text -----**<br>
A<br>KEYBOARD B<br>TERMINAL FUNCTIONAL<br>I/O C<br>PRINTER DECODER<br>D<br>ETC.<br>GND<br>MMQA/SZMMQA SERIES DEVICE<br>**----- End of picture text -----**<br>


**Figure 9. Computer Interface Protection** 

**==> picture [484 x 230] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDD<br>VGG<br>ADDRESS BUS<br>RAM ROM<br>DATA BUS<br>CPU<br>I/O<br>CLOCK<br>CONTROL BUS<br>GND<br>**----- End of picture text -----**<br>


MMQA/SZMMQA SERIES DEVICE 

**Figure 10. Microprocessor Protection** 

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**5** 

**MMQA, SZMMQA Quad Common Anode Series** 

## **DEVICE MARKING AND ORDERING INFORMATION** 

|**Device***|**Device Marking**|**Package**|**Shipping**|
|---|---|---|---|
|MMQA5V6T1G|5A6|SC−74<br>(Pb−Free)|3,000/Tape & Reel|
|MMQA6V2T1G|6A2||3,000/Tape & Reel|
|MMQA6V2T3G|6A2||10,000/Tape & Reel|
|MMQA6V8T1G|6A8||3,000/Tape & Reel|
|MMQA12VT1G|12A||3,000/Tape & Reel|
|MMQA13VT1G|13A||3,000/Tape & Reel|
|MMQA15VT1G|15A||3,000/Tape & Reel|
|MMQA18VT1G|18A||3,000/Tape & Reel|
|MMQA20VT1G|20A||3,000/Tape & Reel|
|MMQA20VT3G|20A||10,000/Tape & Reel|
|MMQA22VT1G|22A||3,000/Tape & Reel|
|MMQA24VT1G|24A||3,000/Tape & Reel|
|MMQA27VT1G|27A||3,000/Tape & Reel|
|MMQA27VT3G|27A||10,000/Tape & Reel|
|MMQA33VT1G|33A||3,000/Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

*IncludeS SZ-prefix devices where applicable. 

## **Mechanical Characteristics:** 

**CASE:** Void−free, Transfer−molded, Thermosetting Plastic Case. **FINISH:** Corrosion resistant finish, easily solderable. Package designed for optimal automated board assembly. Small package size for high density applications. Available in 8 mm Tape and Reel. Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel. 

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**6** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

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SC−74<br>6 CASE 318F<br>ISSUE P<br>1<br>DATE 07 OCT 2021<br>SCALE 2:1<br>**----- End of picture text -----**<br>


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## **GENERIC MARKING DIAGRAM*** 

XXX M � � XXX = Specific Device Code M = Date Code � = Pb−Free Package 

(Note: Microdot may be in either location) 

*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. Some products may not follow the Generic Marking. 

STYLE 1: STYLE 2: STYLE 3: PIN 1. CATHODE PIN 1. NO CONNECTION PIN 1. EMITTER 1 2. ANODE 2. COLLECTOR 2. BASE 1 3. CATHODE 3. EMITTER 3. COLLECTOR 2 4. CATHODE 4. NO CONNECTION 4. EMITTER 2 5. ANODE 5. COLLECTOR 5. BASE 2 6. CATHODE 6. BASE 6. COLLECTOR 1 STYLE 7: STYLE 8: STYLE 9: PIN 1. SOURCE 1 PIN 1. EMITTER 1 PIN 1. EMITTER 2 2. GATE 1 2. BASE 2 2. BASE 2 3. DRAIN 2 3. COLLECTOR 2 3. COLLECTOR 1 4. SOURCE 2 4. EMITTER 2 4. EMITTER 1 5. GATE 2 5. BASE 1 5. BASE 1 6. DRAIN 1 6. COLLECTOR 1 6. COLLECTOR 2 

STYLE 4: STYLE 5: STYLE 6: PIN 1. COLLECTOR 2 PIN 1. CHANNEL 1 PIN 1. CATHODE 2. EMITTER 1/EMITTER 2 2. ANODE 2. ANODE 3. COLLECTOR 1 3. CHANNEL 2 3. CATHODE 4. EMITTER 3 4. CHANNEL 3 4. CATHODE 5. BASE 1/BASE 2/COLLECTOR 3 5. CATHODE 5. CATHODE 6. BASE 3 6. CHANNEL 4 6. CATHODE STYLE 10: STYLE 11: PIN 1. ANODE/CATHODE PIN 1. EMITTER 2. BASE 2. BASE 3. EMITTER 3. ANODE/CATHODE 4. COLLECTOR 4. ANODE 5. ANODE 5. CATHODE 6. CATHODE 6. COLLECTOR 

## **DOCUMENT NUMBER: 98ASB42973B** 

**DESCRIPTION: SC−74** 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

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