MMBFJ175LT1G

MMBFJ175LT1G 

## JFET Chopper 

## **P−Channel − Depletion** 

## **Features** 

- S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Drain−Gate Voltage|VDG|25|V|
|Reverse Gate−Source Voltage|VGS(r)|−25|V|
|**THERMAL CHARACTERISTICS**||||
|**Characteristic**<br>**Symbol**<br>**Max**<br>**Unit**<br>Total Device Dissipation FR−5 Board,<br>(Note 1) TA= 25°C<br>Derate above 25°C<br>PD<br>225<br>1.8<br>mW<br>mW/°C<br>~~a~~<br>~~ii~~||||
|Thermal Resistance, Junction−to−Ambient<br>R JA<br>556<br>°C/W<br>Junction and Storage Temperature<br>TJ, Tstg<br>−55 to +150<br>°C<br>~~ee~~||||



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 1.0 x 0.75 x 0.062 in. **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) **Characteristic Symbol Min Max Unit** ~~Rs~~ **OFF CHARACTERISTICS** Gate−Source Breakdown Voltage V(BR)GSS 30 − V (VDS = 0, ID = 1.0 A) ~~er~~ Gate Reverse Current IGSS − 1.0 nA (VDS = 0 V, VGS = 20 V) ~~ee~~ Gate−Source Cutoff Voltage VGS(OFF) 3.0 6.0 V (VDS = 15, ID = 10 nA) ~~ee~~ **ON CHARACTERISTICS** 

Zero Gate−Voltage Drain Current (Note 2) IDSS 7.0 60 mA (VGS = 0, VDS = 15 V) ~~ee~~ Drain Cutoff Current ID(off) − 1.0 nA (VDS = 15 V, VGS = 10 V) ~~ee~~ Drain Source On Resistance rDS(on) − 125 (ID = 500 A) ~~=~~ Input Capacitance VDS = 0, VGS = 10V Ciss − 11 Reverse Transfer f = 1.0 MHz Crss − 5.5 pF Capacitance ~~]~~ Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%. 

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

## **http://onsemi.com** 

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2 SOURCE<br>3<br>GATE<br>1 DRAIN<br>**----- End of picture text -----**<br>


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3<br>SOT−23 (TO−236)<br>1 & CASE 318<br>STYLE 10<br>lS 2<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

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6W M<br>1<br>a<br>6W = Device Code<br>M = Date Code*<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>*Date Code orientation and/or overbar may<br>vary depending upon manufacturing location.<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MMBFJ175LT1G|SOT−23<br>(Pb−Free)|3000 / Tape &<br>Reel|
|SMMBFJ175LT1G|SOT−23<br>(Pb−Free)|3000 / Tape &<br>Reel|



- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: **MMBFJ175LT1/D** 

**1** 

© Semiconductor Components Industries, LLC, 2014 **March, 2014 − Rev. 6** 

**MMBFJ175LT1G** 

## **PACKAGE DIMENSIONS** 

**SOT−23 (TO−236AB)** CASE 318−08 ISSUE AP 

NOTES: 

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 

||||||||||||||**D**|**D**|||||||||||||||||||||||2.|CONTROLLING DIMENSION: INCH.|CONTROLLING DIMENSION: INCH.|||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||||||**3**|||||||||**SEE VIEW C**||**SEE VIEW C**||**SEE VIEW C**||||||||||||3. <br>4.|MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH<br>THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM<br>THICKNESS OF BASE MATERIAL.<br> DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,||||
||**E**|||||||||||||||||||**H**|**E**|||||||||||||||||PROTRUSIONS, OR GATE BURRS.<br>**DIM**<br>**MIN**<br>**NOM**<br>**MAX**<br>**MIN**<br>**MILLIMETERS**||**INCHES**<br>**NOM**|**MAX**|
|||||||||||**1**|||**e**||**2**||||**b**|||||||||||||||0.25<br>**c**||||**A**<br>0.89<br>1.00<br>1.11<br>**A1**<br>0.01<br>0.06<br>0.10<br>**b**<br>0.37<br>0.44<br>0.50<br>**c**<br>0.09<br>0.13<br>0.18<br>**D**<br>2.80<br>2.90<br>3.04|0.035<br>0.001<br>0.015<br>0.003<br>0.110|0.040<br>0.002<br>0.018<br>0.005<br>0.114|0.044<br>0.004<br>0.020<br>0.007<br>0.120|
|||||||||||||||||||||||||||||||||||||||**E**<br>1.20<br>1.30<br>1.40|0.047|0.051|0.055|
|||||||||||||||||||||||||||||||||||||||**e**<br>1.78<br>1.90<br>2.04|0.070|0.075|0.081|
|||||||||||||||||||||||||||||||||||||||**L**<br>0.10<br>0.20<br>0.30|0.004|0.008|0.012|
|**A**||||||||||||||||||||||||||||||||||||||**L1**<br>2.10<br>2.40<br>2.64<br>**HE**<br>0.35<br>0.54<br>0.69|0.083<br>0.014|0.094<br>0.021|0.104<br>0.029|
||**A1**|||||||||||||||||||||||||||**L1**|||**L**|||||||0<br>−−−<br>10<br>°<br>°<br>STYLE 10:<br>PIN 1.<br>DRAIN|0<br>°|−−−|10<br>°|
|||||||||||||||||||||||||||||||||||||||2.<br>SOURCE||||
|||||||||||||||||||||||||||||**VIEW C**||||||||||3.<br>GATE||||



## **SOLDERING FOOTPRINT*** 

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0.95<br>0.037<br>0.95<br>0.037<br>2.0<br>0.079<br>0.9<br>0.035<br>— |-<br>0.8<br>0.031 7 ° ~<br>SCALE 10:1 mm<br>(—) inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf.  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

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## **LITERATURE FULFILLMENT** : 

**http://onsemi.com** 

**MMBFJ175LT1/D** 

**2**