MF-USMF075-2.
FUSE, PTC RESET, 6V, 750mA, 1210
- Manufacturer: BOURNS
- Product type: Surface Mount PPTCs
- Time to Trip: 0.1s
- Product Range: MF-USMF Series
- Voltage Rating: 6VDC
- Holding Current: 750mA
- PPTC Case Style: 1210 (3225 Metric)
- Tripping Current: 1.5A
- Current Rating Max: 40A
- Operating Temperature Max: 85°C
- Operating Temperature Min: -40°C
| Delivery and price | |
|---|---|
| Units per pack | 15000 |
| Price | 0.205 € |
| Current stock | 200+ |
| Lead time | 7 days |
## **Features** - Compliant with AEC-Q200 Rev-C- Stress Test Qualifi cation for Passive Components in Automotive Applications ■ RoHS compliant* and halogen free** - Agency recognition: - Fast tripping resettable circuit protection - Surface mount packaging for automated assembly - Small footprint size (1210) ## **MF-USMF Series - PTC Resettable Fuses** BOoURNS ~~Ee~~ **==> picture [102 x 7] intentionally omitted <==** **----- Start of picture text -----**<br> Electrical Characteristics<br>**----- End of picture text -----**<br> |**Model**<br>~~P|~~<br>~~a~~|**V max.**<br>**Volts**<br>~~P|~~|**I max.**<br>**Amps**<br>~~Re~~|**Ihold**<br>~~RRR~~|**Itrip**<br>~~RRR~~|**Resistance**<br>~~RRR~~|**Resistance**<br>~~RRR~~|**Max. Time**<br>**To Trip**|**Max. Time**<br>**To Trip**|**Tripped**<br>**Power**<br>**Dissipation**| |---|---|---|---|---|---|---|---|---|---| ||||**Amperes**<br>**at 23 °C**<br>~~RRR~~<br>~~Re De~~||**Ohms**<br>**at 23 °C**<br>~~RRR~~<br>~~es~~<br>~~es~~||**Amperes**<br>**at 23 °C**|**Seconds**<br>**at 23 °C**|**Watts**<br>**at 23 °C**| ||||Hold<br>~~RRR~~<br>~~Re De~~|Trip<br>~~RRR~~<br>~~De~~|RMin.<br>~~RRR~~<br>~~es~~|R1Max.<br>~~RRR~~<br>~~es~~|||Typ.| |MF-USMF005<br>~~P|~~<br>~~a~~|30<br>~~P|~~<br>~~SC~~|10<br>~~Re~~<br>~~SC~~|0.05<br>~~RRR~~<br>~~Re De~~<br>~~a~~|0.15<br>~~RRR~~<br>~~De~~|2.800<br>~~RRR~~<br>~~es~~|50.000<br>~~RRR~~<br>~~es~~|0.25|1.50|0.6| |MF-USMF010<br>~~a~~<br>~~a~~|30<br>~~SC~~<br>~~Ca~~|10<br>~~Re~~<br>~~SC~~<br>~~Ca~~|0.10<br>~~Re De~~<br>~~a~~<br>~~a~~|0.30<br>~~De ~~<br>~~a~~|0.800<br> ~~es~~<br>~~a~~|15.000<br>~~es~~|0.50|0.60|0.6| |MF-USMF020<br>~~a~~<br>~~a~~|30<br>~~Ca~~<br>~~Ca~~|10<br>~~Ca~~<br>~~Ca~~|0.20<br>~~a~~|0.40<br>~~a~~|0.400<br>~~a~~|5.000|8.00|0.02|0.6| |MF-USMF035<br>~~a~~<br>~~a~~|6<br>~~Ca~~<br>~~Ca~~|40<br>~~Ca~~<br>~~Ca~~|0.35<br>~~a~~|0.75<br>~~a~~|0.200<br>~~a~~|1.300|8.00|0.20|0.6| |MF-USMF050<br>~~a~~<br>~~a~~|13.2<br>~~Ca~~|40<br>~~Ca~~|0.50<br>~~a~~|1.00<br>~~a~~|0.180<br>~~a~~|0.900|8.00|0.10|0.6| |MF-USMF075<br>~~a~~<br>~~a~~|6<br>~~Ca~~|40<br>~~Ca~~|0.75<br>~~a~~|1.50<br>~~a~~|0.070|0.450|8.00|0.10|0.6| |MF-USMF110<br>~~a~~<br>~~a~~<br>~~a~~|6<br>~~Ca~~<br>~~Ca~~<br>~~a~~|40<br>~~Ca~~<br>~~Ca~~<br>~~Ca~~|1.10<br>~~a~~<br>~~a~~|2.20<br>~~a~~<br>~~a~~<br>~~a~~|0.050<br>~~a~~|0.210|5.00|1.00|0.6| |MF-USMF150<br>~~a~~<br>~~a~~|6<br>~~Ca~~<br>~~a~~|40<br>~~Ca~~<br>~~Ca~~|1.50<br>~~a~~|3.00<br>~~a~~<br>~~a~~|0.030<br>~~a~~|0.110|5.00|5.00|0.6| |MF-USMF175X<br>~~a~~<br>~~a~~|6<br>~~a~~<br>~~Oa~~|40<br>~~Ca ~~<br>~~Oa~~|1.75<br> ~~a~~<br>~~a~~|3.50<br>~~a~~<br>~~a~~|0.020<br>~~a~~|0.090|8.00|1.00|0.7| ## ~~**Environmental Characteristics**~~ |Operating Temperature ......................................... -40 °C to +85 °C|Operating Temperature ......................................... -40 °C to +85 °C| |---|---| |Maximum Device Surface Temperature|| |in Tripped State .................................................... 125 °C|in Tripped State .................................................... 125 °C| |Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±5 % typical resistance change|Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±5 % typical resistance change| |Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change|Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change| |Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±10 % typical resistance change|Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±10 % typical resistance change| |Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change|Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change| |Vibration ............................................................... MIL-STD-883C, Method 2007.1, ........................... No change|Vibration ............................................................... MIL-STD-883C, Method 2007.1, ........................... No change| ||Condition A| ## ~~**Test Procedures And Requirements For Model MF-USMF Series**~~ |**Test**<br>**Test Conditions**<br>**Accept/Reject Criteria**| |---| |Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description| |Resistance ............................................................ In still air @ 23 °C ................................................. Rmin≤R≤R1max| |Time to Trip ........................................................... At specifi ed current, Vmax, 23 °C ......................... T≤max. time to trip (seconds)| |Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip| |Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning| |Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning| |Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage| |UL File Number ..................................................... E174545| |http://www.ul.com/ Follow link to Certifi cations, then UL File No., enter E174545| |TÜV Certifi cate Number ....................................... R 02057213| |http://www.tuvdotcom.com/ Follow link to “other certifi cates”, enter File No. 2057213| > * RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. > ** Bourns follows the prevailing defi nition of “halogen free” in the industry. Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.Specifi cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi c applications. ## **Applications** ## ■ Game consoles ## ■ PC motherboards - USB port protection - USB 2.0, 3.0 & OTG - HDMI 1.4 Source protection - IEEE 1394 ports - Mobile phones - Digital cameras ## **MF-USMF Series - PTC Resettable Fuses** ## ~~**Product Dimensions**~~ |**Model**||**A**|**A**|||**B**|**B**|||**C**|**C**|||**D**| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| |||Min.||Max.||Min.||Max.||Min.||Max.||Min.| |MF-USMF005||3.00<br>(0.118)||3.43<br>(0.135)||2.35<br>(0.093)||2.80<br>(0.110)||0.80<br>(0.031)||1.1<br>(0.043)||0.30<br>(0.012)| |MF-USMF010||3.00<br>(0.118)||3.43<br>(0.135)||2.35<br>(0.093)||2.80<br>(0.110)||0.80<br>(0.031)||1.1<br>(0.043)||0.30<br>(0.012)| |MF-USMF020||3.00<br>(0.118)||3.43<br>(0.135)||2.35<br>(0.093)||2.80<br>(0.110)||0.80<br>(0.031)||1.1<br>(0.043)||0.30<br>(0.012)| |MF-USMF035||3.00<br>(0.118)||3.43<br>(0.135)||2.35<br>(0.093)||2.80<br>(0.110)||0.55<br>(0.022)||0.85<br>(0.033)||0.30<br>(0.012)| |MF-USMF050||3.00<br>(0.118)||3.43<br>(0.135)||2.35<br>(0.093)||2.80<br>(0.110)||0.55<br>(0.022)||0.85<br>(0.033)||0.30<br>(0.012)| |MF-USMF075||3.00<br>(0.118)||3.43<br>(0.135)||2.35<br>(0.093)||2.80<br>(0.110)||0.55<br>(0.022)||0.85<br>(0.033)||0.30<br>(0.012)| |MF-USMF110||3.00<br>(0.118)||3.43<br>(0.135)||2.35<br>(0.093)||2.80<br>(0.110)||0.55<br>(0.022)||0.85<br>(0.033)||0.30<br>(0.012)| |MF-USMF150||3.00<br>(0.118)||3.43<br>(0.135)||2.35<br>(0.093)||2.80<br>(0.110)||0.40<br>(0.016)||0.85<br>(0.033)||0.30<br>(0.012)| |MF-USMF175X||3.00<br>(0.118)||3.43<br>(0.135)||2.35<br>(0.093)||2.80<br>(0.110)||0.40<br>(0.016)||0.85<br>(0.033)||0.30<br>(0.012)| MM DIMENSIONS: (INCHES) Packaging: 3000 pcs. per reel. **==> picture [469 x 291] intentionally omitted <==** **----- Start of picture text -----**<br> Top and Bottom View Side View Recommended Pad Layout<br>Terminal material:<br>1.0 ± 0.05 1.0 ± 0.05<br>A C Electroless Ni under immersion Au<br>(.039 ± .002) (.039 ± .002)<br>Termination pad solderability:<br>2.5 ± 0.1 Standard Au f nish: nish:<br>B (.098 ± .004) Meets ANSI/J-STD-002 Category 2.<br>2.0 ± 0.1 Recommended Storage:<br>(.079 ± .004)<br>40 °C max./70 % RH max.<br>D<br>Solder Ref ow Recommendations ow Recommendations<br>Preheating Soldering Cooling<br>300 Notes:<br>• MF-USMF models cannot be wave soldered.<br>250<br>• If refl ow temperatures exceed the recommended profi le,<br>devices may not meet the performance requirements.<br>200<br>• Compatible with Pb and Pb-free solder refl ow profi les.<br>150 • Excess solder may cause a short circuit, especially during hand<br>soldering. Please refer to the Multifuse [[®]] Polymer PTC Soldering<br>100 Recommendation guidelines.<br>50<br>0<br>160–220 10–20 120<br>Time (seconds)<br>C)Temperature (°<br>**----- End of picture text -----**<br> **Termination pad solderability:** Standard Au f nish: nish: Meets ANSI/J-STD-002 Category 2. ## ~~**Solder Ref ow Recommendations ow Recommendations**~~ - Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse[[®]] Polymer PTC Soldering Recommendation guidelines. Specifi cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi c applications. ## **MF-USMF Series - PTC Resettable Fuses** ## ~~**Thermal Derating Chart - I**~~ **hold** ~~**(Amps)**~~ |**Model**|**Ambient Operating Temperature**|**Ambient Operating Temperature**|**Ambient Operating Temperature**|**Ambient Operating Temperature**|**Ambient Operating Temperature**|**Ambient Operating Temperature**|**Ambient Operating Temperature**|**Ambient Operating Temperature**| |---|---|---|---|---|---|---|---|---| ||**-40˚C**|**-20˚C**<br>**0˚C**|**23˚C**|**40˚C**|**50˚C**|**60˚C**|**70˚C**|**85˚C**| |MF-USMF005|0.08|0.07<br>0.06|<br>0.05|0.04|0.04|0.03|0.03|0.02| |MF-USMF010|0.15|0.13<br>0.12|<br>0.10|0.09|0.08|0.07|0.06|0.05| |MF-USMF020|0.32|0.28<br>0.24|<br>0.20|0.18|0.16|0.14|0.12|0.10| |MF-USMF035|0.51|0.46<br>0.40|<br>0.34|0.30|0.27|0.24|0.22|0.18| |MF-USMF050|0.76|0.66<br>0.58|<br>0.48|0.42|0.38|0.35|0.29|0.23| |MF-USMF075|1.10|0.97<br>0.86|<br>0.72|0.64|0.58|0.55|0.47|0.39| |MF-USMF110|1.60|1.42<br>1.26|1.10|0.94|0.86|0.80|0.70|0.58| |MF-USMF150|2.30|2.02<br>1.76|<br>1.43|1.24|1.11|1.00|0.85|0.65| |MF-USMF175X|2.80|2.45<br>2.10|<br>1.75|1.55|1.45|1.35|1.25|1.10| ## ~~**Typical Time to Trip at 23 ˚C**~~ **==> picture [289 x 182] intentionally omitted <==** **----- Start of picture text -----**<br> 100<br>MF-USMF020 MF-USMF075 MF-USMF110<br>MF-USMF035 MF-USMF150<br>MF-USMF050 MF-USMF175X<br>MF-USMF010<br>10<br>1<br>MF-USMF005<br>0.1<br>0.01<br>0.001<br>0.1 1 10 100<br>Fault Current (Amps)<br>Time to Trip (Seconds)<br>**----- End of picture text -----**<br> The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specifi c customer applications may differ from these values ## ~~**How to Order**~~ **MF - USMF 010 X - 2** Multifuse[®] Product Designator Series USMF = 1210 Surface Mount Component Hold Current, Ihold 005-175 (0.05-1.75 Amps) Multifuse[®] freeXpansion[™] Design Packaging Packaged per EIA 481-1 -2 = Tape and Reel ## ~~**Typical Part Marking**~~ Represents total content. Layout may vary. **==> picture [125 x 103] intentionally omitted <==** **----- Start of picture text -----**<br> UNDERSCORE<br>SIGNIFIES PART IDENTIFICATION:<br>HALOGEN FREE MF-USMF005 = 0<br>COMPLIANCE MF-USMF010 = 1<br>MF-USMF020 = 2<br>MF-USMF035 = 3<br>6 MF-USMF050 = 4<br>A MF-USMF075 = 5MF-USMF110 = 6<br>MF-USMF150 = 8<br>MF-USMF175X = 9<br>BIWEEKLY DATE CODE:<br>WEEK 1 AND 2 = A<br>WEEK 51 AND 52 = Z<br>**----- End of picture text -----**<br> MF-USMF SERIES, REV. P, 08/15 “freeXpansion Design” is a trademark of Bourns, Inc. Specifi cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi c applications. ## **MF-USMF Series Tape and Reel Specifi cations** |**Tape Dimensions**|**Tape Dimensions**|**Tape Dimensions**||||||||||||||||**MF-USMF Series**<br>**per EIA 481-2**|**MF-USMF Series**<br>**per EIA 481-2**|**MF-USMF Series**<br>**per EIA 481-2**|**MF-USMF Series**<br>**per EIA 481-2**|**MF-USMF Series**<br>**per EIA 481-2**|| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| |W|||||||||||||||||||8.0 ± 0.3<br>(0.315 ± 0.012)||||| |P0|||||||||||||||||||4.0 ± 0.1<br>(0.157 ± 0.004)||||| |P1|||||||||||||||||||4.0 ± 0.1<br>(0.157 ± 0.004)||||| |P2|||||||||||||||||||2.0 ± 0.05<br>(0.079 ± 0.002)||||| |A0|||||||||||||||||||2.76 ± 0.10<br>(0.109 ± 0.004)||||| |B0|||||||||||||||||||3.50 ± 0.10<br>(0.138 ± 0.004)||||| |B1 max.||||||||||||||||||||4.35<br>(0.171)|||| |D0|||||||||||||||||||||||| |F|||||||||||||||||||3.5 ± 0.05<br>(0.138 + 0.002)||||| |E1|||||||||||||||||||1.75 ± 0.10<br>(0.069 ± 0.004)||||| |E2 min.||||||||||||||||||||6.25<br>(0.246)|||| |T max.||||||||||||||||||||0.6<br>(0.024)|||| |T1 max.||||||||||||||||||||0.1<br>(0.004)|||| |K0|||||||||||||||||||1.07 ± 0.10<br>(0.042 ± 0.004)||||| |Leader min.||||||||||||||||||||390<br>(15.35)|||| |Trailer min.||||||||||||||||||||160<br>(6.30)|||| |**Reel Dimensions**|||||||||||||||||||||||| |A max.||||||||||||||||||||185<br>(7.283)|||| |N min.||||||||||||||||||||50<br>(1.97)|||| |W1|||||||||||||||||||8.4||||| |W2 max.||||||||||||||||||||14.4<br>(0.567)|||| |B1<br>T<br>COVER<br>TAPE<br>K0<br>T1<br>D0|||||||||||||||B0<br>F<br>E2<br>E1<br>W|||||DIMENSIONS:<br>MM<br>(INCHES)<br>N(HUB DIA.)<br>(MEASURED<br>AT HUB)<br>W2<br>(MEASURED<br>AT HUB)<br>W1|||MM<br>| ||R<br><br>D0|||||P2|||||||||E1||||||||| |||||||||||||||||A||||||W2|| ||||||||||||||||||||||||| ||||||||||||||||||||||||| ||||||||||||||||||||||||| |||||||||||||||||||||||N<br>W1|| ||||||||||||||||||||||||| ||||||||||||||||||||||||| ||||A0||P1||||||||||||||||||| ||||||||||||||||||||||||| Specifi cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi c applications.
Updated at February 9, 2023
Bourns, Inc. is a globally recognized manufacturer of high-reliability electronic components, headquartered in Riverside, California. Renowned for its engineering excellence, the company delivers critical solutions across a diverse range of demanding markets, including automotive, industrial, consumer electronics, telecommunications, and medical equipment. The Bourns product portfolio is anchored by an industry-leading selection of passive components and circuit protection devices. The brand is particularly dominant in magnetic components, offering thousands of high-performance power inductors, alongside specialized RF and toroidal inductors engineered for optimized power management and signal integrity. Equally prominent is their comprehensive suite of circuit protection solutions. This robust lineup features a vast array of standard and resettable fuses, transient voltage suppressors (including TVS varistors and diodes), and gas discharge tubes (GDTs) designed to rigorously safeguard sensitive electronics against overvoltage and overcurrent faults. Beyond its core passives and protection technologies, Bourns manufactures highly effective EMC and RFI suppression components, such as common mode chokes and power line filters. The company's offering also extends into discrete semiconductors and power management, including Schottky diodes, fast recovery rectifiers, bridge rectifiers, and board-level transformers. This expansive breadth of quality components provides design engineers with a trusted foundation for developing resilient, efficient, and long-lasting electronic systems.
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