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MF-SMDF050-2
Resettable Fuse, PPTC, 2018 (5045 Metric), MF-SMDF, 60 VDC, 550 mA, 1.2 A, 3 s
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: BOURNS
- Product type: Surface Mount PPTCs
- Thermistor Mounting:SMD; Product Range:MF-SMDF Series; Holding Current:550mA; Tripping Current:1.2A; Voltage Rating:60V; Operating Temperature Min:-40°C; Operating Temperature Max:
- SVHC: No SVHC (04-Feb-2026)
- Time to Trip: 3s
- Trip Current: 1.2A
- Product Range: MF-SMDF
- Voltage Rating: 60VDC
- Holding Current: 550mA
- PPTC Case Style: 2018 (5045 Metric)
- Current Rating Max: 10A
- Operating Temperature Max: 85°C
- Operating Temperature Min: -40°C
- Automotive Qualification Standard: -
| Delivery and price | |
|---|---|
| Units per pack | 3000 |
| Price | 0.225 € |
| Current stock | 1000+ |
| Lead time | 30 days |
Datasheet
## **Features** ■ Very low profi le - Very fast tripping time - High voltage - RoHS compliant* and halogen free** - 2018 footprint - Agency recognition: ## **Applications** - Power Over Ethernet (IEEE 802.3 af) port protection - Automotive electronic control module protection - Telecom equipment low voltage protection ## **MF-SMDF Series - PTC Resettable Fuses** BOURNS’ BR ## ~~**Electrical Characteristics**~~ **==> picture [504 x 131] intentionally omitted <==** **----- Start of picture text -----**<br> |||||||||||| |---|---|---|---|---|---|---|---|---|---|---| |Max. Time|Tripped| |Ihold|Itrip|Resistance|To Trip|Power| |V max.|I max.|Dissipation| |Model| |Volts|Amps|Amperes|Ohms|Amperes|Seconds|Watts| |at 23 °C|at 23 °C|at 23 °C|at 23 °C|at 23 °C| |Hold|Trip|Rmin|R1max|Typ.| |MF-SMDF050|60|10|0.55|1.20|0.200|1.0|2.5|3.0|0.9| |MF-SMDF100/33X|[(1)]|33|40|1.10|2.20|0.06|0.40|8.0|0.5|1.4| |es|es|ee|ee| |MF-SMDF150|15|40|1.50|3.00|0.05|0.17|8.0|0.8|1.1| |——|ee|ee|ee|ee| |MF-SMDF200|[(2)]|10|40|2.00|4.00|0.030|0.100|8.0|2.4|1.1| |———| |MF-SMDF260/24X|[(1)]|24|20|2.60|5.20|0.015|0.075|8.0|0.8|1.1| |—|ee|ee|ee|ee| **----- End of picture text -----**<br> (1) UL recognized, TÜV pending. (2) Agency approval pending. ## ~~**Environmental Characteristics**~~ Operating Temperature ......................................... -40 °C to +85 °C Maximum Device Surface Temperature in Tripped State ................................................. 125 °C Passive Aging ....................................................... +85 °C, 1000 hours .......................................................... ±5 % typical resistance change Humidity Aging ..................................................... +85 °C, 85 % R.H. 1000 hours ........................................ ±5 % typical resistance change Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .............................................. ±10 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215 .............................................. No change (marking still legible) Vibration ............................................................... MIL-STD-883C, Method 2007.1, Condition A ................. No change (Rmin < R < R1max) ## ~~**Test Procedures And Requirements For Model MF-SMDF Series**~~ **==> picture [486 x 94] intentionally omitted <==** **----- Start of picture text -----**<br> |||| |---|---|---| |Test|Test Conditions|Accept/Reject Criteria| |Visual/Mech. ......................................................... Verify dimensions and materials .......................................Per MF physical description| |Resistance ............................................................ In still air @ 23 °C ..............................................................Rmin|≤ R ≤ R1max| |Time to Trip ........................................................... At specifi ed current, Vmax, 23 °C ....................................T ≤ max. time to trip (seconds)| |Hold Current ......................................................... 30 min. at Ihold .................................................................No trip| |Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ....................................................No arcing or burning| |Trip Endurance ..................................................... Vmax, 48 hours .................................................................No arcing or burning| |Solderability .......................................................... ANSI/J-STD-002 ...............................................................95 % min. coverage| |UL File Number .................................................... E174545| |http://www.ul.com/ Follow link to Certifi cations, then UL File No., enter E174545| **----- End of picture text -----**<br> TÜV Certifi cate Number ....................................... R 02057213 http://www.tuvdotcom.com/ Follow link to “other certifi cates”, enter File No. 2057213 ## ~~**Thermal Derating Chart - I**~~ **hold** ~~**/I**~~ **trip** ~~**(Amps)**~~ **==> picture [505 x 103] intentionally omitted <==** **----- Start of picture text -----**<br> ||||||||||||||| |---|---|---|---|---|---|---|---|---|---|---|---|---|---| |Ambient Operating Temperature| |Model| |-40 °C|-20 °C|0 °C|23 °C|40 °C|50 °C|60 °C|70 °C|85 °C| |ppp| |MF-SMDF050|0.87 / 1.90|0.77 / 1.68|0.67 / 1.46|0.55 / 1.20|0.46 / 1.00|0.41 / 0.89|0.36 / 0.79|0.31 / 0.68|0.23 / 0.50| |MF-SMDF100/33X|1.66 / 3.32|1.47 / 2.94|1.29 / 2.58|1.10 / 2.20|0.91 / 1.82|0.83 / 1.66|0.73 / 1.46|0.64 / 1.28|0.50 / 1.00| |ee|ee|ee|ee|ee| |MF-SMDF150|2.38 / 4.76|2.10 / 4.20|1.82 / 3.64|1.50 / 3.00|1.27 / 2.54|1.13 / 2.26|0.99 / 1.98|0.85 / 1.70|0.64 / 1.28| |——|ee|ee| |—|MF-SMDF200|2.95 / 5.90|2.65 / 5.30|ee|2.35 / 4.70|2.00 / 4.00|1.74 / 3.48|1.59 / 3.18|1.44 / 2.88|1.29 / 2.58|1.06 / 2.12| |ee|MF-SMDF260/24X|3.75 / 7.50|3.35 / 6.70|ee|3.00 / 6.00|2.60 / 5.20|ee|2.35 / 4.70|ee|2.15 / 4.30|2.05 / 4.10|1.80 / 3.60|1.50 / 3.00| |eeee|ee|ee| **----- End of picture text -----**<br> *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. **Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.. Specifi cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi c applications. ## **MF-SMDF Series - PTC Resettable Fuses** ||~~**P Dii**~~|~~**P Dii**~~|~~**P Dii**~~|~~**P Dii**~~|||||||||||||||DIMENSIONS:<br>MM<br>(INCHES)<br>**Style**<br>Max.<br>N/A<br>1<br>0.70<br>(0.028)<br>2<br>N/A<br>1<br>N/A<br>1<br>0.70<br>(0.028)<br>3|DIMENSIONS:<br>MM<br>(INCHES)<br>**Style**<br>Max.<br>N/A<br>1<br>0.70<br>(0.028)<br>2<br>N/A<br>1<br>N/A<br>1<br>0.70<br>(0.028)<br>3|DIMENSIONS:<br>MM<br>(INCHES)<br>**Style**<br>Max.<br>N/A<br>1<br>0.70<br>(0.028)<br>2<br>N/A<br>1<br>N/A<br>1<br>0.70<br>(0.028)<br>3| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| ||~~**roduct mensons**~~||||||||||||||||||||| ||**Model**||**A**||||**B**||||**C**||||**D**||**E**|||**Style**|| ||||Min.||Max.||Min.||Max.||Min.||Max.||Min.||Min.||Max.||| ||MF-SMDF050||4.72<br>(0.186)||5.44<br>(0.214)||4.22<br>(0.166)||4.93<br>(0.194)||0.79<br>(0.031)||1.09<br>(0.043)||0.30<br>(0.012)||N/A||N/A||1| ||MF-SMDF100/33X||4.72<br>(0.186)||5.44<br>(0.214)||4.22<br>(0.166)||4.93<br>(0.194)||0.70<br>(0.028)||1.25<br>(0.049)||0.30<br>(0.012)||0.25<br>(0.010)||0.70<br>(0.028)||2| ||MF-SMDF150||4.72<br>(0.186)||5.44<br>(0.214)||4.22<br>(0.166)||4.93<br>(0.194)||0.55<br>(0.022)||0.85<br>(0.033)||0.30<br>(0.012)||N/A||N/A||1| ||MF-SMDF200||4.72<br>(0.186)||5.44<br>(0.214)||4.22<br>(0.166)||4.93<br>(0.194)||0.55<br>(0.022)||0.85<br>(0.033)||0.30<br>(0.012)||N/A||N/A||1| ||MF-SMDF260/24X||4.72<br>(0.186)||5.44<br>(0.214)||4.22<br>(0.166)||4.93<br>(0.194)||0.70<br>(0.028)||2.00<br>(0.079)||0.30<br>(0.012)||0.25<br>(0.010)||0.70<br>(0.028)||3| ||Packaging: 6000 pcs. per reel; 4000 pcs. per reel for Model MF-SMDF260/24X.||||||||||||||||||DIMENSIONS:||| ## **Style 1** **==> picture [483 x 325] intentionally omitted <==** **----- Start of picture text -----**<br> Top and Bottom View Side View Recommended Pad Layout Terminal material:<br>Electroless Ni under immersion Au<br>A C 1.5 ± 0.05 1.5 ± 0.05<br>(.059 ± .002) (.059 ± .002) Termination pad solderability:<br>Standard Au f nish:<br>4.6 ± 0.1 Meets ANSI/J-STD-002 Category 2.<br>B (.181 ± .004)<br>Recommended Storage:<br>3.4 ± 0.1 40 °C max./70 % RH max.<br>(.134 ± .004)<br>D<br>Typical Part Marking<br>Represents total content. Layout may vary.<br>Style 2<br>Top View Bottom View Side View BI-WEEKLY DATE CODE:<br>(Y = WEEKS 49-50)<br>A C<br>YEAR CODE:<br>6 (5 = 2005)<br>PART<br>B IDENTIFICATION:<br>50 = MF-SMDF050<br>X 15 = MF-SMDF150<br>20 = MF-SMDF200<br>D E PART IDENTIFICATION:<br>6 = MF-SMDF100/33X<br>6<br>Style 3<br>Top View Bottom View Side View<br>A C X<br>(X = WEEKS 47-48)<br>D PART IDENTIFICATION:<br>D = MF-SMDF260/24X<br>B<br>D<br>L<br>D E L<br>505Y<br>505Y<br>**----- End of picture text -----**<br> **==> picture [154 x 228] intentionally omitted <==** **----- Start of picture text -----**<br> Represents total content. Layout may vary.<br>BI-WEEKLY DATE CODE:<br>(Y = WEEKS 49-50)<br>YEAR CODE:<br>(5 = 2005)<br>PART<br>IDENTIFICATION:<br>50 = MF-SMDF050<br>15 = MF-SMDF150<br>20 = MF-SMDF200<br>PART IDENTIFICATION:<br>6 = MF-SMDF100/33X<br>6<br>X BI-WEEKLY DATE CODE:<br>(X = WEEKS 47-48)<br>PART IDENTIFICATION:<br>D = MF-SMDF260/24X<br>D<br>L BI-WEEKLY DATE CODE:<br>(L = WEEKS 23-24)<br>505Y<br>**----- End of picture text -----**<br> Specifi cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi c applications. ## **MF-SMDF Series - PTC Resettable Fuses** ## ~~**Solder Ref ow Recommendations**~~ **==> picture [236 x 161] intentionally omitted <==** **----- Start of picture text -----**<br> Preheating Soldering Cooling<br>300<br>250<br>200<br>150<br>100<br>50<br>0<br>160–220 10–20 120<br>Time (seconds)<br>C)Temperature (°<br>**----- End of picture text -----**<br> ## **Notes:** - MF-SMDF models cannot be wave soldered. Please contact Bourns for hand soldering recommendations. ## ~~**How to Order**~~ **==> picture [154 x 188] intentionally omitted <==** **----- Start of picture text -----**<br> MF - SMDF 100 /33X - 2<br>Product<br>Designator<br>Series<br>SMDF = 2018 Surface Mount<br>Component<br>Hold Current, Ihold<br>050 = 0.50 A<br>100 = 1.10 A<br>150 = 1.50 A<br>200 = 2.00 A<br>260 = 2.60 A<br>Higher Voltage Option<br>__ = Standard Voltage<br>/24X = 24 V Rated<br>/33X = 33 V Rated<br>X = Multifuse [®] freeXpansion Design [™]<br> MF-SMDF Series<br>Packaging<br> Packaged per EIA 481-1<br>-2 = Tape and Reel<br>**----- End of picture text -----**<br> - If refl ow temperatures exceed the recommended profi le, devices may not meet the performance requirements. - Compatible with Pb and Pb-free solder refl ow profi les. - Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse[®] - Polymer PTC Soldering Recommendation guidelines. ## ~~**Typical Time to Trip at 23 ˚C**~~ **==> picture [331 x 175] intentionally omitted <==** **----- Start of picture text -----**<br> 100<br>MF-SMDF100/33X<br>10<br>MF-SMDF050 MF-SMDF260/24X<br>1<br>0.1<br>0.01<br>MF-SMDF200<br>MF-SMDF150<br>0.001<br>0.1 1 10 100<br>Fault Current (Amps)<br>Time to Trip (Seconds)<br>**----- End of picture text -----**<br> The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specifi c customer applications may diff er from these values due to the infl uence of other variables. MF-SMDF SERIES, REV. T, 08/15 Specifi cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi c applications. ## **MF-SMDF Series Tape and Reel Specifi cations** |**MF-SMDF050, 150, 200**<br>**Tape Dimensions**<br>**per EIA 481-2 **|**MF-SMDF050, 150, 200**<br>**Tape Dimensions**<br>**per EIA 481-2 **|**MF-SMDF050, 150, 200**<br>**Tape Dimensions**<br>**per EIA 481-2 **|**MF-SMDF050, 150, 200**<br>**Tape Dimensions**<br>**per EIA 481-2 **|**MF-SMDF100/33X**<br>**per EIA 481-2 **|**MF-SMDF100/33X**<br>**per EIA 481-2 **|**MF-SMDF100/33X**<br>**per EIA 481-2 **|**MF-SMDF260/24X**<br>**per EIA 481-2**|**MF-SMDF260/24X**<br>**per EIA 481-2**|**MF-SMDF260/24X**<br>**per EIA 481-2**| |---|---|---|---|---|---|---|---|---|---| |W||16.0 ± 0.3<br>(0.630 ± 0.012)|||16.0 ± 0.3<br>(0.630 ± 0.012)|||16.0 ± 0.3<br>(0.630 ± 0.012)|| |P0||4.0 ± 0.1<br>(0.157 ± 0.004)|||4.0 ± 0.1<br>(0.157 ± 0.004)|||4.0 ± 0.1<br>(0.157 ± 0.004)|| |P1||8.0 ± 0.1<br>(0.315 ± 0.004)|||8.0 ± 0.1<br>(0.315 ± 0.004)|||8.0 ± 0.1<br>(0.315 ± 0.004)|| |P2||2.0 ± 0.1<br>(0.079 ± 0.004)|||2.0 ± 0.1<br>(0.079 ± 0.004)|||2.0 ± 0.1<br>(0.079 ± 0.004)|| |A0||5.1 ± 0.15<br>(0.201 ± 0.006)|||5.1 ± 0.1<br>(0.201 ± 0.004)|||5.4 ± 0.15<br>(0.213 ± 0.006)|| |B0||5.6 ± 0.23<br>(0.220 ± 0.009)|||5.6 ± 0.1<br>(0.221 ± 0.004)|||5.7 ± 0.15<br>(0.234 ± 0.006)|| |B1 max.|||12.1<br>(0.476)|||12.1<br>(0.476)|||12.1<br>(0.476)| |D0|||||||||| |F||7.5 ± 0.10<br>(0.295 + 0.004)|||7.5 ± 0.10<br>(0.295 + 0.004)|||7.5 ± 0.10<br>(0.295 + 0.004)|| |E1||1.75 ± 0.10<br>(0.069 ± 0.004)|||1.75 ± 0.10<br>(0.069 ± 0.004)|||1.75 ± 0.10<br>(0.069 ± 0.004)|| |E2 min.|||14.25<br>(0.561)|||14.25<br>(0.561)|||14.25<br>(0.561)| |T max.|||0.6<br>(0.024)|||0.6<br>(0.024)|||0.6<br>(0.024)| |T1 max.|||0.1<br>(0.004)|||0.1<br>(0.004)|||0.1<br>(0.004)| |K0||1.0 ± 0.15<br>(0.039 ± 0.006)||||||2.15 ± 0.15<br>(0.085 ± 0.006)|| |Leader min.|||390<br>(15.35)|||390<br>(15.35)|||390<br>(15.35)| |Trailer min.|||160<br>(6.30)|||160<br>(6.30)|||160<br>(6.30)| |**Reel Dimensions**|||||||||| |A max.|||331<br>(13.03)|||331<br>(13.03)|||331<br>(13.03)| |N min.|||50<br>(1.97)|||50<br>(1.97)|||50<br>(1.97)| |W1|||||||||| |W2 max.|||22.4<br>(0.882)|||22.4<br>(0.882)|||22.4<br>(0.882)| **==> picture [506 x 161] intentionally omitted <==** **----- Start of picture text -----**<br> MM<br>DIMENSIONS:<br>(INCHES)<br>P0<br>T D0 P2 E1<br>W2(MEASURED<br>AT HUB)<br>COVER<br>TAPE<br>F<br>A N(HUB DIA.)<br>E2 W<br>B1<br>B0<br>W1(MEASURED<br>K0 P1 AT HUB)<br>T1 A0<br>**----- End of picture text -----**<br> Specifi cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi c applications.
Updated at June 8, 2026
Bourns, Inc. is a globally recognized manufacturer of high-reliability electronic components, headquartered in Riverside, California. Renowned for its engineering excellence, the company delivers critical solutions across a diverse range of demanding markets, including automotive, industrial, consumer electronics, telecommunications, and medical equipment. The Bourns product portfolio is anchored by an industry-leading selection of passive components and circuit protection devices. The brand is particularly dominant in magnetic components, offering thousands of high-performance power inductors, alongside specialized RF and toroidal inductors engineered for optimized power management and signal integrity. Equally prominent is their comprehensive suite of circuit protection solutions. This robust lineup features a vast array of standard and resettable fuses, transient voltage suppressors (including TVS varistors and diodes), and gas discharge tubes (GDTs) designed to rigorously safeguard sensitive electronics against overvoltage and overcurrent faults. Beyond its core passives and protection technologies, Bourns manufactures highly effective EMC and RFI suppression components, such as common mode chokes and power line filters. The company's offering also extends into discrete semiconductors and power management, including Schottky diodes, fast recovery rectifiers, bridge rectifiers, and board-level transformers. This expansive breadth of quality components provides design engineers with a trusted foundation for developing resilient, efficient, and long-lasting electronic systems.
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