MF-PSML300-2

Resettable Fuse, PPTC, 0805 (2012 Metric), MF-PSML, 6 VDC, 3 A, 6 A, 5 s

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.

Manufacturer: BOURNS
Product type: Surface Mount PPTCs
Time to Trip: 5s
Product Range: MF-PSML
Voltage Rating: 6VDC
Holding Current: 3A
PPTC Case Style: 0805 (2012 Metric)
Tripping Current: 6A
Current Rating Max: 50A
Thermistor Mounting: SMD
Operating Temperature Max: 85°C
Operating Temperature Min: -40°C

Delivery and price
Units per pack	2250
Price	0.55 €
Current stock	10+
Lead time	30 days

Datasheet

## **Features** 

## **Applications** 

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**----- Start of picture text -----**<br>
|||||||||||
|---|---|---|---|---|---|---|---|---|---|
|n|Small footprint size (0805) and low profile|n|USB port protection - USB 2.0, 3.0 & OTG|
|for space-constrained mobile applications|n|HDMI 1.4 Source protection|
|n|Ultra-low resistance|n|PC motherboards - Plug & Play protection|
|n|Symmetrical design|n|Mobile phones - Battery & port protection|
|n|Surface mount packaging for automated|n|PDAs / digital cameras|
|assembly|n|Bluetooth|[®]|earphone power protection|
|n|RoHS compliant* and halogen free**|n|Game console port protection|
|n|Agency recognition:|
|POURNS|MF-PSML Series - Low Ohmic PTC Resettable Fuses|
|Electrical Characteristics|
|Max. Time|Tripped|
|V max.|I max.|Ihold|Itrip|Resistance|To Trip|DissiPower pation|
|Model|
|Volts|Amps|Amperes|Ohms|Amperes|Seconds|Watts|
|at 23 °C|at 23 °C|at 23 °C|at 23 °C|at 23 °C|
|Hold|Trip|RMin.|R1Max.|Typ.|
|MF-PSML110|6|50|1.10|1.80|0.0175|0.130|8.00|0.3|0.6|
|po|Rs|
|MF-PSML150|6|50|1.50|3.00|0.015|0.065|8.00|0.5|0.6|
|po|
|MF-PSML175|6|50|1.75|3.50|0.005|0.055|8.00|0.6|0.6|
|po|
|MF-PSML200|6|50|2.00|4.00|0.005|0.045|8.00|1.0|0.6|
|po|
|MF-PSML260|6|50|2.60|5.00|0.003|0.035|8.00|4.0|0.6|
|po|
|MF-PSML300|6|50|3.00|6.00|0.003|0.030|8.00|5.0|0.6|
|po|
|MF-PSML350***|6|50|3.50|7.00|0.003|0.025|8.00|5.0|0.6|
|eeGO|
|*** TÜV approval pending.|

**----- End of picture text -----**<br>


## ~~**Environmental Characteristics**~~ 

Operating Temperature ......................................... -40 °C to +85 °C Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±10 % typical resistance change Humidity Aging...................................................... +85 °C, 85 % R.H. 100 hours ............................... ±15 % typical resistance change Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±30 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change Vibration ............................................................... MIL-STD-883C, Method 2007.1, ........................... No change Condition A Moisture Sensitivity Level (MSL) .......................... Level 1 ESD Classification - HBM ..................................... Class 6 

## ~~**Test Procedures And Requirements For Model MF-PSML Series**~~ 

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||||
|---|---|---|
|Test|Test Conditions|Accept/Reject Criteria|
|Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description|
|Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max|
|Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds)|
|Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip|
|Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning|
|Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning|
|Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage|
|UL File Number .................................................... E174545|
|http://www.ul.com/  Follow link to Certifications, then UL File No., enter E174545|
|TÜV Certificate Number ....................................... R 50171531|
|http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 50171531|

**----- End of picture text -----**<br>


> *  RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. 

**Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. 

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 

## **MF-NSMF Series - PTC Resettable FusesPSML Series - Low Ohmic PTC Resettable Fuses** 

## ~~**Product Dimensions**~~ 

|**Model**||**A**|**A**|||**B**|**B**|||**C**|**C**|||**D**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||Min.||Max.||Min.||Max.||Min.||Max.||Min.|
|MF-PSML110||2.00<br>(0.079)||2.30<br>(0.091)||1.20<br>(0.047)||1.50<br>(0.059)||0.30<br>(0.012)||0.60<br>(0.024)||0.20<br>(0.008)|
|MF-PSML150|||||||||||||||
|MF-PSML175|||||||||||||||
|MF-PSML200|||||||||||||||
|MF-PSML260||2.00<br>(0.079)||2.30<br>(0.091)||1.20<br>(0.047)||1.50<br>(0.059)||0.45<br>(0.018)||0.80<br>(0.031)||0.20<br>(0.008)|
|MF-PSML300|||||||||||||||
|MF-PSML350|||||||||||||||



Packaging: MF-PSML110~MF-PSML200 = 6000 pcs. per reel MF-PSML260~MF-PSML350 = 4500 pcs. per reel 

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MM<br>MF-PSML110~MF-PSML200 = 6000 pcs. per reel DIMENSIONS:<br>(INCHES)<br>MF-PSML260~MF-PSML350 = 4500 pcs. per reel<br>Top View Bottom View Side View Recommended Pad Layout<br>Terminal material:<br>A C Nickel/gold plated.<br>Termination pad solderability:<br>1.50 ± 0.10 Standard Au fnish:<br>PE B (.059 ± .004)<br>Meets ANSI/J-STD-002 Category 2.<br>Recommended Storage:<br>D 40 °C max./70 % RH max.<br>1.00 ± 0.05 1.20 ± 0.10<br>(.039 ± .002) (.047 ± .004)<br>**----- End of picture text -----**<br>


## ~~**Thermal Derating Chart - Ihold (Amps)**~~ 

|**Model**|**Ambient Operating Temperature**|**Ambient Operating Temperature**|**Ambient Operating Temperature**|**Ambient Operating Temperature**|**Ambient Operating Temperature**|**Ambient Operating Temperature**|**Ambient Operating Temperature**|**Ambient Operating Temperature**|**Ambient Operating Temperature**|
|---|---|---|---|---|---|---|---|---|---|
||**-40 °C**|**-20 °C**|**0 °C**|**23 °C**|**40 °C**|**50 °C**|**60 °C**|**70 °C**|**85 °C**|
|MF-PSML110|1.93|1.65|1.37|1.10|0.83|0.69|0.55|0.41|0.31|
|MF-PSML150|2.37|2.07|1.80|1.50|1.25|1.08|0.93|0.74|0.50|
|MF-PSML175|2.57|2.33|2.07|1.75|1.49|1.36|1.24|1.00|0.91|
|MF-PSML200|2.94|2.66|2.36|2.00|1.70|1.55|1.42|1.14|1.04|
|MF-PSML260|3.82|3.46|3.07|2.60|2.21|2.02|1.85|1.48|1.35|
|MF-PSML300|4.41|3.99|3.54|3.00|2.55|2.33|2.13|1.71|1.56|
|MF-PSML350|5.51|4.66|4.13|3.50|2.98|2.71|2.49|2.00|1.82|



Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 

## **MF-PSML Series - Low Ohmic PTC R3312 - 2 mm SMD Trimming Potentiometersettabl Fuses** 

## ~~**Solder Refow Recommendations**~~ 

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tp<br>TP CRITICAL ZONE<br>RAMP-UP TL TO TP<br>TL<br>t L<br>TS MAX.<br>RAMP-DOWN<br>TS MIN. ts<br>PREHEAT<br>25<br>t  25 *C TO PEAK 8 MINS.<br>Temperature<br>**----- End of picture text -----**<br>


## **Notes:** 

- MF-PSML models cannot be wave soldered or hand soldered. Please contact Bourns for soldering recommendations. 

- All temperatures refer to topside of the package, measured on the package body surface. 

- If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. 

- • Compatible with Pb and Pb-free solder reflow profiles. 

- Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse[®] Polymer PTC Soldering Recommendation guidelines. 

- Designed for single solder reflow operations. 

## **Time** 

|**Time**<br>||
|---|---|
|**Profle Feature**|**Pb-Free Assembly**|
|Average Ramp-Up Rate (TSmaxto Tp)|3 °C / second max.|
|PREHEAT:<br>Temperature Min. (TSmin)<br>Temperature Max. (TSmax)<br>Time (tsminto tsmax)<br>TIME MAINTAINED ABOVE|150 °C<br>200 °C<br>60~180 seconds|
|:<br>Temperature (TL)<br>Time (tL)|217 °C<br>60~150 seconds|
|Peak / Classifcation Temperature (TP)|260 °C|
|Time within 5 °C of Actual Peak Temperature (tp)|20~40 seconds|
|Ramp-Down Rate|6 °C / second max.|
|Time within 25 °C to Peak Temperature|8 minutes max.|



## ~~**How to Order**~~ 

**MF - PSML  110  -  2** Multifuse[®] Product Designator Series PSML = 0805 Surface Mount Component Hold Current, Ihold 110 - 350 (1.10 Amps - 3.50 Amps) Packaging Packaged per EIA 481-1 -2 = Tape and Reel 

## ~~**Typical Part Marking**~~ 

Represents total content. Layout may vary. 

PART IDENTIFICATION: MF-PSML110  = PE MF-PSML150  = PG MF-PSML175  = PH MF-PSML200  = PJ MF-PSML260  = PN **PE** MF-PSML300  = PP MF-PSML350  = PS BIWEEKLY DATE CODE WILL APPEAR ON THE PACKAGING LABEL: WEEK 1 AND 2 = A WEEK 51 AND 52 = Z 

**Asia-Pacific:** 

Tel: +886-2 2562-4117 Email: asiacus@bourns.com 

**Europe:** 

Tel: +36 88 520 390 Email: eurocus@bourns.com **The Americas:** Tel: +1-951 781-5500 Email: americus@bourns.com 

**www.bourns.com** 

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. 

MF-PSML SERIES, REV. A, 05/17 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. 

## **MF-PSML Series Tape and Reel Specifications** 

|**Tape Dimensions**|**Tape Dimensions**|**Tape Dimensions**|**Tape Dimensions**|**Tape Dimensions**||||||||||||||||||**MF-PSML Series**<br>**per EIA 481-1**|**MF-PSML Series**<br>**per EIA 481-1**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|W||||||||||||||||||||||8.0±0.30<br>(0.315 ± 0.012)||
|P0||||||||||||||||||||||4.0 ± 0.10<br>(0.157 ± 0.004)||
|P1||||||||||||||||||||||4.0 ± 0.10<br>(0.157 ± 0.004)||
|P2||||||||||||||||||||||2.0 ± 0.05<br>(0.079 ± 0.002)||
|A0||||||||||||||||||||||1.70±0.10<br>(0.067 ± 0.004)||
|B0||||||||||||||||||||||2.45±0.10<br>(0.096 ± 0.004)||
|B1 max.|||||||||||||||||||||||4.35<br>(0.171)|
|D0||||||||||||||||||||||1.5 + 0.10/-0.0<br>(0.059 + 0.004/-0)||
|F||||||||||||||||||||||3.5 ± 0.05<br>(0.138 ± 0.002)||
|E1||||||||||||||||||||||1.75 ± 0.10<br>(0.069 ± 0.004)||
|E2 min.|||||||||||||||||||||||6.25<br>(0.246)|
|T max.|||||||||||||||||||||||0.6<br>(0.024)|
|T1 max.|||||||||||||||||||||||0.1<br>(0.004)|
|K0  (MF-PSML110~MF-PSML200)||||||||||||||||||||||0.65 ± 0.10<br>(0.026 ± 0.004)||
|K0  (MF-PSML260~MF-PSML350)||||||||||||||||||||||0.95 ± 0.10<br>(0.037 ± 0.004)||
|Leader min.|||||||||||||||||||||||390<br>(15.35)|
|Trailer min.|||||||||||||||||||||||160<br>(6.30)|
|**Reel Dimensions**||||||||||||||||||||||||
|A max.|||||||||||||||||||||||185<br>(7.28)|
|N min.|||||||||||||||||||||||50<br>(1.97)|
|W1|||||||||||||||||||||8.4 + 1.5/-0.0<br>(0.331 + 0.059/-0.0)|||
|W2 m|||ax.||||||||||||||||||||14.4<br>(0.567)|
|B1|||||||||||||||||B0<br>F<br>E2<br>E1<br>W|A<br>DIMENSIONS:|MM<br>(INCHES)||N(HUB DIA.)<br>(MEASURED<br>AT HUB)<br>W2<br>(MEASURED<br>AT HUB)<br>W1|||
||||T<br>COVER<br>TAPE<br>K0<br>T1<br>D0|||||P2<br>P0|||||||||E1|||||||
|||||||||||||||||||||||||
|||||||||||||||||||||||||
|||||||||||||||||||||||||
|||||||||||||||||||||||||
||B1|||||||||||||||||||||||
|||||||||||||||||||||||||
|||||||||||||||||||||||||
||||||A0||P1|||||||||||||||||
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Specifications are subject to change without notice. 

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.

Updated at February 9, 2023

Bourns, Inc. is a globally recognized manufacturer of high-reliability electronic components, headquartered in Riverside, California. Renowned for its engineering excellence, the company delivers critical solutions across a diverse range of demanding markets, including automotive, industrial, consumer electronics, telecommunications, and medical equipment. The Bourns product portfolio is anchored by an industry-leading selection of passive components and circuit protection devices. The brand is particularly dominant in magnetic components, offering thousands of high-performance power inductors, alongside specialized RF and toroidal inductors engineered for optimized power management and signal integrity. Equally prominent is their comprehensive suite of circuit protection solutions. This robust lineup features a vast array of standard and resettable fuses, transient voltage suppressors (including TVS varistors and diodes), and gas discharge tubes (GDTs) designed to rigorously safeguard sensitive electronics against overvoltage and overcurrent faults. Beyond its core passives and protection technologies, Bourns manufactures highly effective EMC and RFI suppression components, such as common mode chokes and power line filters. The company's offering also extends into discrete semiconductors and power management, including Schottky diodes, fast recovery rectifiers, bridge rectifiers, and board-level transformers. This expansive breadth of quality components provides design engineers with a trusted foundation for developing resilient, efficient, and long-lasting electronic systems.

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