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MF-NSML450-2
Resettable Fuse, PPTC, 1206 (3216 Metric), MF-NSML, 6 VDC, 4.5 A, 9 A, 2 s
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: BOURNS
- Product type: Surface Mount PPTCs
- Time to Trip: 2s
- Product Range: MF-NSML
- Voltage Rating: 6VDC
- Holding Current: 4.5A
- PPTC Case Style: 1206 (3216 Metric)
- Tripping Current: 9A
- Current Rating Max: 50A
- Thermistor Mounting: SMD
- Operating Temperature Max: 85°C
- Operating Temperature Min: -40°C
| Delivery and price | |
|---|---|
| Units per pack | 1500 |
| Price | 0.253 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**==> picture [53 x 52] intentionally omitted <==** **----- Start of picture text -----**<br> &<br>*RoHS COMPLIANT<br>**HALOGEN FREE<br>**----- End of picture text -----**<br> ## **Features** n Surface mount packaging for automated assembly - n Small footprint size (1206) and low profile for space-constrained mobile applications n Ultra-low resistance - n RoHS compliant* and halogen free** - n Agency recognition: ## **Applications** - n Thermal protection for Li-ion & polymer battery packs n USB port protection - USB 2.0, 3.0 & OTG n HDMI 1.4 Source protection n PC motherboards - Plug & Play protection n Mobile phones - Battery & port protection n PDAs / digital cameras n Game console port protection ## **MF-NSML Series - Low Ohmic PTC Resettable Fuses** ## ~~**Electrical Characteristics**~~ **==> picture [505 x 196] intentionally omitted <==** **----- Start of picture text -----**<br> ||||||||||||| |---|---|---|---|---|---|---|---|---|---|---|---| |Max. Time|Tripped| |V max.|I max.|Ihold|Itrip|Resistance|To Trip|DissiPower pation| |Model| |Volts|Amps|Amperes|Ohms|Amperes|Seconds|Watts| |at 23 °C|at 23 °C|at 23 °C|at 23 °C|at 23 °C| |Hold|Trip|RMin.|R1Max.|Typ.| |es| |Ge|MF-NSML150|6|50|Gr|1.50|3.00|0.0100|0.0650|8.00|0.50|0.8| |Ge|MF-NSML175|6|50|Gr|1.75|3.50|0.0050|0.0400|8.00|0.50|0.8| |Ge|MF-NSML190|6|50|Gr|1.90|4.90|0.0050|0.0300|8.00|1.00|0.8| |Ge|MF-NSML200|6|50|Gr|2.00|4.00|0.0050|0.0300|8.00|1.00|0.8| |Ge|MF-NSML260|6|50|Gr|2.60|5.20|0.0030|0.0260|8.00|4.00|0.8| |Ge|MF-NSML300|6|50|Gr|3.00|6.00|0.0025|0.0200|8.00|4.00|0.8| |Ge|MF-NSML350|6|50|Gr|3.50|7.00|0.0020|0.0180|8.00|5.00|0.8| |Ge|MF-NSML380|6|50|Gr|3.80|8.00|0.0015|0.0140|8.00|5.00|0.8| |Ge|MF-NSML400|6|50|Gr|4.00|8.00|0.0015|0.0140|8.00|5.00|0.8| |Ge|MF-NSML450***|6|50|Gr|4.50|9.00|0.0010|0.0140|22.5|2.00|0.8| |De|MF-NSML500***|6|50|Gs|5.00|10.0|0.0010|0.0120|25.0|2.00|0.8| **----- End of picture text -----**<br> *** TÜV approval pending. ## ~~**Environmental Characteristics**~~ Operating Temperature ......................................... -40 °C to +85 °C Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±10 % typical resistance change Humidity Aging...................................................... +85 °C, 85 % R.H. 100 hours ............................... ±15 % typical resistance change Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±30 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change Vibration ............................................................... MIL-STD-883C, Method 2007.1, ........................... No change Condition A ## ~~**Test Procedures And Requirements For Model MF-NSML Series**~~ **==> picture [472 x 116] intentionally omitted <==** **----- Start of picture text -----**<br> |||| |---|---|---| |Test|Test Conditions|Accept/Reject Criteria| |Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description| |Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max| |Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds)| |Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip| |Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning| |Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning| |Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage| |cUL File Number ................................................... E174545| |http://www.ul.com/ Follow link to Certifications, then cUL File No., enter E174545| |TÜV Certificate Number ....................................... R 02057213| |http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213| **----- End of picture text -----**<br> > * RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. **Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ## **MF-NSMF Series - PTC Resettable FusesNSML Series - Low Ohmic PTC Resettable Fuses** ## ~~**Product Dimensions**~~ |**Model**|**A**|**A**|||**B**|**B**|||**C**|**C**|||**D**||**E**|**E**|| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| ||Min.||Max.||Min.||Max.||Min.||Max.||Min.||Min.||Max.| |MF-NSML150<br>MF-NSML175<br>MF-NSML190<br>MF-NSML200<br>MF-NSML260<br>MF-NSML300<br>MF-NSML350<br>MF-NSML380<br>MF-NSML400|3.00<br>(0.118)||3.50<br>(0.138)||1.40<br>(0.055)||1.80<br>(0.071)||0.30<br>(0.012)||0.60<br>(0.024)||0.25<br>(0.010)||0.05<br>(0.002)||0.45<br>(0.018)| |MF-NSML450<br>MF-NSML500|3.00<br>(0.118)||3.50<br>(0.138)||1.40<br>(0.055)||1.80<br>(0.071)||0.60<br>(0.024)||1.20<br>(0.047)||0.25<br>(0.010)||0.05<br>(0.002)||0.45<br>(0.018)| Packaging: MF-NSML150~MF-NSML400 = 5000 pcs. per reel MF-NSML450~MF-NSML500 = 3500 pcs. per reel **==> picture [504 x 112] intentionally omitted <==** **----- Start of picture text -----**<br> MM<br>MF-NSML150~MF-NSML400 = 5000 pcs. per reel DIMENSIONS:<br>(INCHES)<br>MF-NSML450~MF-NSML500 = 3500 pcs. per reel<br>Top View Side View Bottom View Recommended Pad Layout<br>A C D E Terminal material:<br>1.0 ± 0.05 1.0 ± 0.05 ENIG-plated terminals<br>(.039 ± .002) (.039 ± .002)<br>(Tin-plated terminals available upon<br>request).<br>B 1.6 ± 0.1<br>(.063 ± .004) Termination pad solderability:<br>Meets ANSI/J-STD-002 Category 2.<br>2.0 ± 0.1 Recommended Storage:<br>(.079 ± .004) 40 °C max./70 % RH max.<br>**----- End of picture text -----**<br> ## ~~**Thermal Derating Chart - Ihold (Amps)**~~ |**Model**|**Ambient Operating Temperature**<br>**-40 °C**<br>**-20 °C**<br>**0 °C**<br>**23 °C**<br>**40 °C**<br>**50 °C**<br>**60 °C**<br>**70 °C**<br>**85 °C**|**Ambient Operating Temperature**<br>**-40 °C**<br>**-20 °C**<br>**0 °C**<br>**23 °C**<br>**40 °C**<br>**50 °C**<br>**60 °C**<br>**70 °C**<br>**85 °C**|**Ambient Operating Temperature**<br>**-40 °C**<br>**-20 °C**<br>**0 °C**<br>**23 °C**<br>**40 °C**<br>**50 °C**<br>**60 °C**<br>**70 °C**<br>**85 °C**|**Ambient Operating Temperature**<br>**-40 °C**<br>**-20 °C**<br>**0 °C**<br>**23 °C**<br>**40 °C**<br>**50 °C**<br>**60 °C**<br>**70 °C**<br>**85 °C**|**Ambient Operating Temperature**<br>**-40 °C**<br>**-20 °C**<br>**0 °C**<br>**23 °C**<br>**40 °C**<br>**50 °C**<br>**60 °C**<br>**70 °C**<br>**85 °C**|**Ambient Operating Temperature**<br>**-40 °C**<br>**-20 °C**<br>**0 °C**<br>**23 °C**<br>**40 °C**<br>**50 °C**<br>**60 °C**<br>**70 °C**<br>**85 °C**|**Ambient Operating Temperature**<br>**-40 °C**<br>**-20 °C**<br>**0 °C**<br>**23 °C**<br>**40 °C**<br>**50 °C**<br>**60 °C**<br>**70 °C**<br>**85 °C**|**Ambient Operating Temperature**<br>**-40 °C**<br>**-20 °C**<br>**0 °C**<br>**23 °C**<br>**40 °C**<br>**50 °C**<br>**60 °C**<br>**70 °C**<br>**85 °C**|**Ambient Operating Temperature**<br>**-40 °C**<br>**-20 °C**<br>**0 °C**<br>**23 °C**<br>**40 °C**<br>**50 °C**<br>**60 °C**<br>**70 °C**<br>**85 °C**| |---|---|---|---|---|---|---|---|---|---| |||**-20 °C**|**0 °C**|**23 °C**|**40 °C**|**50 °C**|**60 °C**|**70 °C**|**85 °C**| |MF-NSML150|2.67|2.32|1.95|1.50|1.15|0.96|0.78|0.64|0.52| |MF-NSML175|2.57|2.33|2.07|1.75|1.49|1.34|1.24|1.00|0.91| |MF-NSML190|2.89|2.58|2.25|1.90|1.54|1.36|1.21|0.94|0.77| |MF-NSML200|3.30|2.90|2.50|2.00|1.62|1.39|1.16|0.90|0.52| |MF-NSML260|3.71|3.42|3.01|2.60|2.08|1.72|1.49|1.30|0.89| |MF-NSML300|4.41|3.99|3.54|3.00|2.55|2.32|2.13|1.71|1.56| |MF-NSML350|5.51|4.66|4.13|3.50|2.98|2.71|2.49|2.00|1.82| |MF-NSML380|5.59|5.05|4.48|3.80|3.23|2.95|2.70|2.17|1.98| |MF-NSML400|5.71|5.26|4.63|4.00|3.20|2.70|2.29|2.00|1.37| |MF-NSML450|6.62|5.99|5.31|4.50|3.83|3.50|3.20|2.57|2.34| |MF-NSML500|7.35|6.66|5.90|5.00|4.25|3.88|3.55|2.85|2.60| Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ## **3312 - 2 mm SMD Trimming PotentiometerMF-NSML Series - Low Oh ic PTC R settabl Fuses** ## ~~**Solder Refow Recommendations**~~ **==> picture [252 x 128] intentionally omitted <==** **----- Start of picture text -----**<br> tp<br>TP CRITICAL ZONE<br>RAMP-UP TL TO TP<br>TL<br>t L<br>TS MAX.<br>RAMP-DOWN<br>TS MIN. ts<br>PREHEAT<br>25<br>t 25 *C TO PEAK 8 MINS.<br>Temperature<br>**----- End of picture text -----**<br> ## **Notes:** - MF-NSML models cannot be wave soldered or hand soldered. Please contact Bourns for soldering recommendations. - All temperatures refer to topside of the package, measured on the package body surface. - If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. - • Compatible with Pb and Pb-free solder reflow profiles. - Excess solder may cause a short circuit, especially during hand - soldering. Please refer to the Multifuse[®] Polymer PTC Soldering Recommendation guidelines. - Designed for single solder reflow operations. ## **Time** |**Time**<br>|| |---|---| |**Profle Feature**|**Pb-Free Assembly**| |Average Ramp-Up Rate (TSmaxto Tp)|3 °C / second max.| |PREHEAT:<br>Temperature Min. (TSmin)<br>Temperature Max. (TSmax)<br>Time (tsminto tsmax)<br>TIME MAINTAINED ABOVE|150 °C<br>200 °C<br>60~180 seconds| |:<br>Temperature (TL)<br>Time (tL)|217 °C<br>60~150 seconds| |Peak / Classifcation Temperature (TP)|260 °C| |Time within 5 °C of Actual Peak Temperature (tp)|20~40 seconds| |Ramp-Down Rate|6 °C / second max.| |Time within 25 °C to Peak Temperature|8 minutes max.| ## ~~**How to Order**~~ **MF - NSML 200 - 2** Multifuse[®] Product Designator Series NSML = 1206 Low Ohmic Surface Mount Component Hold Current, Ihold 150 - 500 (1.50 Amps - 5.00 Amps) Packaging Packaged per EIA 481-1 -2 = Tape and Reel ## ~~**Typical Part Marking**~~ Represents total content. Layout may vary. PART IDENTIFICATION: MF-NSML150 = NG MF-NSML175 = NH MF-NSML190 = NI MF-NSML200 = NJ MF-NSML260 = NN **NJ** MF-NSML300 = NP MF-NSML350 = NS MF-NSML380 = NV MF-NSML400 = NU MF-NSML450 = NX MF-NSML500 = NY MANUFACTURING DATE CODE IS LOCATED ON PACKING LABEL. **Asia-Pacific:** Tel: +886-2 2562-4117 Email: asiacus@bourns.com **Europe:** Tel: +36 88 520 390 Email: eurocus@bourns.com ## **The Americas:** Tel: +1-951 781-5500 Email: americus@bourns.com **www.bourns.com** MF-NSML SERIES, REV. F, 05/17 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ## **MF-NSML Series - Low Ohmic PTC Resettable Fuses** |**Tape Dimensions**|**Tape Dimensions**|**Tape Dimensions**|**Tape Dimensions**|**Tape Dimensions**||||||||||||||||**MF-NSML Series**<br>**per EIA 481-2**|**MF-NSML Series**<br>**per EIA 481-2**|**MF-NSML Series**<br>**per EIA 481-2**|**MF-NSML Series**<br>**per EIA 481-2**|| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| |W|||||||||||||||||||||12.0 ± 0.30<br>(0.472 ± 0.012)|||| |P0|||||||||||||||||||||4.0 ± 0.10<br>(0.157 ± 0.004)|||| |P1|||||||||||||||||||||4.0 ± 0.10<br>(0.157 ± 0.004)|||| |P2|||||||||||||||||||||2.0 ± 0.05<br>(0.079 ± 0.002)|||| |A0|||||||||||||||||||||1.90 ± 0.10<br>(0.075 ± 0.004)|||| |B0|||||||||||||||||||||3.50 ± 0.10<br>(0.138 ± 0.004)|||| |B1 max.||||||||||||||||||||||4.5<br>(0.177)||| |D0||||||||||||||||||||||||| |F|||||||||||||||||||||5.5 ± 0.05<br>(0.216 + 0.002)|||| |E1|||||||||||||||||||||1.75 ± 0.10<br>(0.069 ± 0.004)|||| |E2 typ.||||||||||||||||||||||10.25<br>(0.404)||| |T max.||||||||||||||||||||||0.6<br>(0.024)||| |T1 max.||||||||||||||||||||||0.1<br>(0.004)||| |K0 (MF-NSML150~MF-NSML400)|||||||||||||||||||||0.65 ± 0.10<br>(0.026 ± 0.004)|||| |K0 (MF-NSML450~MF-NSML500)|||||||||||||||||||||1.10 ± 0.10<br>(0.043 ± 0.004)|||| |Leader min.||||||||||||||||||||||390<br>(15.35)||| |Trailer min.||||||||||||||||||||||160<br>(6.30)||| |**Reel Dimensions**||||||||||||||||||||||||| |A max.||||||||||||||||||||||185<br>(7.283)||| |N min.||||||||||||||||||||||50<br>(1.97)||| |W1||||||||||||||||||||||||| |W2 ma|||x.|||||||||||||||||||15.4<br>(0.606)||| |B1|||||||||||||||||B0<br>F<br>E2<br>E1<br>W|||||N(HUB DIA.)<br>(MEASURED<br>AT HUB)<br>W2<br>(MEASURED<br>AT HUB)<br>W1<br>DIMENSIONS:<br>MM<br>(INCHES)||MM| ||||T<br>COVER<br>TAPE<br>K0<br>T1<br>D0|||||P2<br>P0|||||||||E1|||||||| |||||||||||||||||||A|||||W2|| |||||||||||||||||||||||||| |||||||||||||||||||||||||| ||B1||||||||||||||||||||||N<br>W1|| |||||||||||||||||||||||||| |||||||||||||||||||||||||| ||||||A0||P1|||||||||||||||||| |||||||||||||||||||||||||| Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.
Updated at February 9, 2023
Bourns, Inc. is a globally recognized manufacturer of high-reliability electronic components, headquartered in Riverside, California. Renowned for its engineering excellence, the company delivers critical solutions across a diverse range of demanding markets, including automotive, industrial, consumer electronics, telecommunications, and medical equipment. The Bourns product portfolio is anchored by an industry-leading selection of passive components and circuit protection devices. The brand is particularly dominant in magnetic components, offering thousands of high-performance power inductors, alongside specialized RF and toroidal inductors engineered for optimized power management and signal integrity. Equally prominent is their comprehensive suite of circuit protection solutions. This robust lineup features a vast array of standard and resettable fuses, transient voltage suppressors (including TVS varistors and diodes), and gas discharge tubes (GDTs) designed to rigorously safeguard sensitive electronics against overvoltage and overcurrent faults. Beyond its core passives and protection technologies, Bourns manufactures highly effective EMC and RFI suppression components, such as common mode chokes and power line filters. The company's offering also extends into discrete semiconductors and power management, including Schottky diodes, fast recovery rectifiers, bridge rectifiers, and board-level transformers. This expansive breadth of quality components provides design engineers with a trusted foundation for developing resilient, efficient, and long-lasting electronic systems.
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