MF-GSMF300/36X-2

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&<br>*RoHS COMPLIANT<br>**HALOGEN FREE<br>**----- End of picture text -----**<br>


## **Features** 

n High power ratings n Low profile 

n Utilizes innovative freeXpansion™ design 

n Standard 3425 mils (8764 mm) footprint 

n Compatible with Pb and Pb-free solder reflow profiles n RoHS compliant* and halogen free** n Agency recognition: 

- n Surface mount packaging for automated assembly 

## **MF-GSMF Series - PTC Resettable Fuses** 

## ~~**Electrical Characteristics**~~ 

|**Model**|**V max.**|**I max.**|**Ihold**|**Itrip**|**Resistance**|**Resistance**|**Max. Time To Trip**|**Max. Time To Trip**|**Tripped**<br>**Power**<br>**Dissipation**|**Agency Recognition**|**Agency Recognition**|
|---|---|---|---|---|---|---|---|---|---|---|---|
||||**at 23 °C**||**at 23 °C Ohms**||**at 23 °C**||**Watts at**<br>**23 °C**|**cUL**|**TÜV**|
||**Volts**|**Amps**|**Amps**||**Rmin**|**R1max**|**Amps**|**Seconds**|**Typ.**|E174545|R50256634|
|MF-GSMF300/36X|36|20|3.0|5.2|0.01|0.06|8.0|20.0|1.5|3|3|



## ~~**Environmental Characteristics**~~ 

Operating Temperature ......................................... -40 °C to +85 °C Recommended Storage........................................ +40 °C max. / 70 % RH max. Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±5 % typical resistance change Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change Thermal Shock ..................................................... -40 °C to +85 °C, 20 times .................................... ±10 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change (Marking still legible) Vibration ............................................................... MIL-STD-883C, Method 2007.1, ........................... No change (Rmin<R<R1max) Condition A Moisture Sensitivity Level (MSL) .......................... See Note ESD Classification - HBM ..................................... 6 

## ~~**Test Procedures and Requirements**~~ 

**Test Test Conditions Accept/Reject Criteria** Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max Time to Trip ........................................................... At specified current, Vmax, 23 °C .......................... T ≤ max. time to trip (seconds) Hold Current ......................................................... 30 min. at Ihold ...................................................... No trip Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles.......................................... No arcing or burning Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning Solderability .......................................................... 245 °C ±5 °C, 5 seconds ...................................... 95 % min. coverage ~~**How to Order Typical Part Marking**~~ **MF - GSMF 300 / 36X - 2** Represents total content. Layout may vary. Multifuse[®] PART IDENTIFICATION: Product Designator MF-GSMF300/36X = N Series GSMF = 3425 mils (8764 mm) Surface Mount Component Hold Current, Ihold 300 (3.0 Amps) Maximum Voltage, Vmax 36 = 36 Volts X = Multifuse® freeXpansion™ Design ~~=~~ BI-WEEKLY DATE CODE Packaging WEEK 05 & 06 = C -2 = Tape and Reel Packaged per EIA-481 

## A 

## **WARNING  Cancer and Reproductive Harm -** ~~ee~~ www.P65Warnings.ca.gov 

- RoHS Directive 2015/863, Mar 31, 2015 and Annex. 

** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. 

Users should verify actual device performance in their specific applications. 

The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. 

## **Applications** 

n Telematics with CAN, Bluetooth, WLAN, GPS and UMTS/LTE n Industrial controls 

n IEEE ports 

## **MF-GSMF Series – PTC Resettable Fuses MF-NSMF Series - PTC Resettable Fuses** 

## ~~**Product Dimensions**~~ 

|**Model**||**A**|**A**|||**B**|**B**|||**C**|**C**|||**D**||**E**|**E**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||Min.||Max.||Min.||Max.||Min.||Max.||Min.||Min.|Max.|
|MF-GSMF300/36X||8.3<br>(0.327)||9.0<br>(0.354)||6.0<br>(0.236)||6.7<br>(0.264)||0.7<br>(0.028)||1.6<br>(0.063)||0.3<br>(0.012)||0.25<br>(0.010)|2.0<br>(0.079)|



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MM<br>DIMENSIONS:<br>(INCHES)<br>Top View Side View Bottom View Terminal material:  Recommended Pad Layout<br>A C D E ENIG-plated terminals<br>1.0 1.0<br>(.039) (.039)<br>B 2.5<br>(.098)<br>2.0<br>(.079)<br>**----- End of picture text -----**<br>


## ~~**Packaging Quantity**~~ 

3,000 pcs. per reel 

## ~~**Typical Time to Trip @ 23 °C**~~ 

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100<br>10<br>1<br>0.1<br>1 10 100<br>FAULT CURRENT (AMPS)<br>TIME TO TRIP (SECONDS)<br>**----- End of picture text -----**<br>


## **Note:** 

The Time to Trip curve represents typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. 

Specifications are subject to change without notice. 

Users should verify actual device performance in their specific applications. 

The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. 

## **3312 - 2 mm SMD Trimming PotentiometerMF-GSMF Series – PTC Resettable Fuses** 

## ~~**Thermal Derating Table - Ihold (Amps)**~~ 

|~~**Thermal Derating**~~|~~**Table - Ihold (Amps)**~~|~~**Table - Ihold (Amps)**~~|~~**Table - Ihold (Amps)**~~|~~**Table - Ihold (Amps)**~~|~~**Table - Ihold (Amps)**~~|~~**Table - Ihold (Amps)**~~|~~**Table - Ihold (Amps)**~~|~~**Table - Ihold (Amps)**~~|~~**Table - Ihold (Amps)**~~|
|---|---|---|---|---|---|---|---|---|---|
|**Model**|**Ambient Operating Temperature**|||||||||
||**-40 °C**|**-20 °C**|**0 °C**|**23 °C**|**40 °C**|**50 °C**|**60 °C**|**70 °C**|**85 °C**|
|MF-GSMF300/36X|4.00|3.55|3.20|3.00|2.60|2.35|2.05|1.75|1.35|



## ~~**Solder Refow Recommendations**~~ 

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tp<br>TP CRITICAL ZONE<br>RAMP-UP TL TO TP<br>TL<br>t L<br>Ts max<br>RAMP-DOWN<br>Ts min<br>ts<br>PREHEAT<br>25<br>t  25 °C TO PEAK<br>Temperature<br>**----- End of picture text -----**<br>


## **Notes:** 

- MF-GSMF models are intended for reflow soldering (including, but not limited to heating plate, hot air, IR, nitrogen, and vapor phase). 

- Wave soldering is permissible only if the device is on the top of the PCB, opposite the heat source. 

- Hand soldering is not recommended for these devices. 

- All temperatures refer to the topside of the device, measured on the device body surface. 

- not meet the published specifications. 

- 

- Excess solder may cause a short circuit. 

- Please refer to the Multifuse[®] Polymer PTC Resettable Fuse Soldering Recommendations document for more details. 

## **Time** 

|**Profle Feature**|**Pb-Free Assembly**|
|---|---|
|Average Ramp-Up Rate (Tsmaxto Tp)|3 °C / second max.|
|PREHEAT:<br>Temperature Min. (Tsmin)<br>Temperature Max. (Tsmax)<br>Time (Tsminto Tsmax) (ts)|150 °C<br>200 °C<br>60~180 seconds|
|TIME MAINTAINED ABOVE:<br>Temperature (TL)<br>Time (tL)|217 °C<br>60~150 seconds|
|Peak Temperature (Tp)|260 °C|
|Time within 5 °C of Actual Peak Temperature (tp)|20~40 seconds|
|Ramp-Down Rate|6 °C / second max.|
|Time 25 °C to Peak Temperature|8 minutes max.|



MF-GSMF SERIES, REV. A, 04/19 

Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. 

The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. 

## **MF-GSMF Series – PTC Resettable Fuses MF-NSMF Series - PTC Resettable Fuses** 

## ~~**Packaging Specifcations**~~ 

MF-GSMF Series per EIA-481 

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10X =<br>40.0 ± 0.10<br>(1.575 ± .004)<br>0.60 1.50 +0.10 / -0 4.00 ± 0.10* 2.00 ± 0.05 1.75 ± 0.10<br>(.024)  [MAX.] (.059 +.004 / -0) [DIA.] (.157 ± .004) (.079 ± .002) (.069 ± .004)<br>7.50 ± 0.05<br>16.00 ± 0.30 (.295 ± .002)<br>(.630 ± .012)<br>12.10<br>(.476)  [MAX.] COVER<br>TAPE<br>9.30 ± 0.10<br>(.366 ± .004)<br>1.45 ± 0.10<br>(.057 ± .004) 0.10 8.00 ± 0.10 6.90 ± 0.10 14.25<br>TYP.<br>(.004)  [MAX.] (.315 ± .004) (.272 ± .004) (.561)<br>LEADER MIN. TRAILER MIN.<br>390 160<br>(15.35) (6.30)<br>331 22.4*<br>MAX. MAX.<br>(13.03) (.88)<br>50 MIN.<br>(1.97) HUB DIA.<br>16.4 +1.0 / -0*<br>(.646 +.039 / -0)<br>*MEASURED AT HUB<br>MM<br>DIMENSIONS:<br>(INCHES)<br>**----- End of picture text -----**<br>


**Asia-Pacific:** Tel: +886-2 2562-4117 • Email: asiacus@bourns.com **EMEA:** Tel: +36 88 885 877 • Email: eurocus@bourns.com **The Americas:** Tel: +1-951 781-5500 • Email: americus@bourns.com **www.bourns.com** 

Specifications are subject to change without notice. 

Users should verify actual device performance in their specific applications. 

The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. 

## **3312 - 2 mm SMD Trimming PotentiometerBourns[®] Multifuse[®] PPTC Resettable Fuses** 

## ~~**Application Notice**~~ 

- Users are responsible for independent and adequate evaluation of Bourns[®] Multifuse[®] Polymer PTC devices in the user’s application, including the PPTC device characteristics stated in the applicable data sheet. 

- Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated within the user’s application during the PTC selection and qualification process. 

- Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions are expected to be repetitive or prolonged. 

- In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC devices if the thermal expansion is inhibited. 

- Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the performance of polymer PTC devices. 

- Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene, which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect on the device. 

- Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet and on the Multifuse[®] Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note: - 

- https://www.bourns.com/docs/RoHS MSL/msl_mf.pdf 

_MFAN 12/18_ Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. 

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