MEM2012F101RT001

Power Line Filter, 10 V, 100 mA

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.

Manufacturer: TDK
Product type:
Capacitance:-; Voltage Rating:10V; Filter Type:EMI, RFI; Current Rating:100mA; Filter Terminals:SMD; Inductance Min:-; Leakage Current Max:-; Product Range:-; SVHC:No SVHC (15-Jan-2019)
SVHC: No SVHC (04-Feb-2026)
Product Range: MEM Series
Current Rating: 100mA
Voltage Rating: 10V

Delivery and price
Units per pack	4000
Price	0.138 €
Current stock	10+
Lead time	30 days

Datasheet

November 2013 

## 3-terminal Filters 

For signal line 

## MEM series 

**MEM2012S 2012[0805 inch]* MEM2012SC 2012[0805 inch] MEM2012V 2012[0805 inch] MEM2012F 2012[0805 inch] MEM1608P 1608[0603 inch]** 

***** Dimensions Code JIS[EIA] 

(2/15) 

## **REMINDERS FOR USING THESE PRODUCTS** 

Before using these products, be sure to request the delivery specifications. 

## **SAFETY REMINDERS** 

Please pay sufficient attention to the warnings for safe designing when using these products. 

## **REMINDERS** 

- ~~O~~ The storage period is less than 12 months.  Be sure to follow the storage conditions (Temperature: 5 to 40°C, Humidity: 10 to 75% RH or less). If the storage period elapses, the soldering of the terminal electrodes may deteriorate. 

~~O~~ Do not use or store in locations where there are conditions such as gas corrosion (salt, acid, alkali, etc.). 

- ~~O~~ Before soldering, be sure to preheat components. 

The preheating temperature should be set so that the temperature difference between the solder temperature and chip temperature does not exceed 150°C. 

- ~~O~~ Soldering corrections after mounting should be within the range of the conditions determined in the specifications. If overheated, a short circuit, performance deterioration, or lifespan shortening may occur. 

- ~~O~~ When embedding a printed circuit board where a chip is mounted to a set, be sure that residual stress is not given to the chip due to the overall distortion of the printed circuit board and partial distortion such as at screw tightening portions. 

- O Self heating (temperature increase) occurs when the power is turned ON, so the tolerance should be sufficient for the set thermal design. 

- ~~O~~ Carefully lay out the coil for the circuit board design of the non-magnetic shield type. A malfunction may occur due to magnetic interference. 

~~O~~ Use a wrist band to discharge static electricity in your body through the grounding wire. 

~~O~~ Do not expose the products to magnets or magnetic fields. 

~~O~~ Do not use for a purpose outside of the contents regulated in the delivery specifications. 

- ~~O~~ The products listed on this catalog are intended for use in general electronic equipment (AV equipment, telecommunications equipment, home appliances, amusement equipment, computer equipment, personal equipment, office equipment, measurement equipment, industrial robots) under a normal operation and use condition. 

   - The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage to society, person or property. 

If you intend to use the products in the applications listed below or if you have special requirements exceeding the range or conditions set forth in the each catalog, please contact us. 

- (1) Aerospace/Aviation equipment (8) Public information-processing equipment 

- (2) Transportation equipment (cars, electric trains, ships, etc.) (9) Military equipment 

(3) Medical equipment (10) Electric heating apparatus, burning equipment (4) Power-generation control equipment (11) Disaster prevention/crime prevention equipment (5) Atomic energy-related equipment (12) Safety equipment (6) Seabed equipment (13) Other applications that are not considered general-purpose (7) Transportation control equipment applications 

When designing your equipment even for general-purpose applications, you are kindly requested to take into consideration securing protection circuit/device or providing backup circuits in your equipment. 

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## **3-terminal Filters** 

## **For signal line** 

**Product compatible with RoHS directive Halogen-free Compatible with lead-free solders** 

## **Overview of the MEM Series** 

## **FEATURES** 

Multilayer chip EMC filter. 

Monolithic structure makes it highly reliable. 

Closed magnetic circuit structure makes it possible to achieve high-density mounting without crosstalk. 

Has sharp attenuation characteristics with excellent EMC suppression. 

Wide range of products compatible with passing frequencies and attenuating frequencies. 

## **MEM2012S** 

## **MEM2012V** 

Double  type circuit is used. T Sharp attenuation characteristics. 

O T-type circuit is used. O T O **MEM2012SC** O T-type circuit is used. **MEM2012F** O Compatible with 1A current. On type circuit is used. 

## **MEM1608P** 

type circuit is used. Compact with a low profile design. 

## **APPLICATION** 

Noise removal from signal lines of data terminals, digital cameras, computers, game machines, flat TVs, etc. 

## **PART NUMBER CONSTRUCTION** 

| **PART NUMBER CONSTRUCTION** MEM 2012 S 25R0 T □□□ ~~(esses1—~~ **L×W×T Dimensions Product internal Cutoff frequency Series name Packaging style Internal code (mm) code (MHz)** 1608 1.6×0.8×0.6 S 25R0 25 T Taping 2.0×1.25×0.8 SC 201R 200 2012 2.0×1.25×0.85 V ~~ee~~ F **Capacitance** P **(pF) at 1MHz** 100 10 101 100 MEM2012SC only 

## **OPERATING TEMPERATURE RANGE, PACKAGE QUANTITY, PRODUCT WEIGHT** 

|**Type**|**Temperature range**|**Temperature range**|**Package quantity**|**Individual weight**|
|---|---|---|---|---|
||**Operating**<br>**temperature**|**Storage**<br>**temperature**|||
||（**°C**）|（**°C**）|（**pieces/reel**）|（**mg**）|
|**MEM2012S**|–40 to +85|–40 to +85|4,000|8|
|**MEM2012SC**|–40 to +85|–40 to +85|4,000|8|
|**MEM2012V**|–40 to +85|–40 to +85|4,000|8|
|**MEM2012F**|–40 to +85|–40 to +85|4,000|8|
|**MEM1608P**|–40 to +85|–40 to +85|4,000|3.5|



The Storage temperature range is for after the circuit board is mounted. 

@) RoHS Directive Compliant Product: See the following for more details related to RoHS Directive compliant products. http://www.tdk.co.jp/rohs/ : Halogen-free: Indicates that Cl content is less than 900ppm, Br content is less than 900ppm, and that the total Cl and Br content is less than 1500ppm. 

• All specifications are subject to change without notice. 

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## **Overview of the MEM Series** 

## **RECOMMENDED REFLOW PROFILE** 

||||Preheating|Preheating||Soldering<br>T4<br>Peak|Soldering<br>T4<br>Peak|Soldering<br>T4<br>Peak|Soldering<br>T4<br>Peak|Natural<br>cooling|||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|T:Temperature|T1|||T2|T3||t3|||T3|||
|||||t1|||t2||||||
||||||||||||||
|||||t:Time|||||||||
|**Preheating**|||||**Soldering**||||||**Peak**||
|**Temp.**|||**Time**||**Temp.**|||**Time**|||**Temp.**|**Time**|
|**T1**|**T2**||**t1**||**T3**|||**t2**|||**T4**|**t3**|
|150°C<br>180°C|||60 to 120s|60 to 120s|230°C||30 to 60s||||250 to 260°C|10s max.|



• All specifications are subject to change without notice. 

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## MEM series 

## **MEM2012S Type** 

## **SHAPE & DIMENSIONS** 

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**----- Start of picture text -----**<br>
2±0.2<br>GND<br>4<br>1 2 3<br>IN/OUT GND OUT/IN<br>0.2min 0.2min<br>0.4±0.15 0.4±0.15 0.4±0.15 Dimensions in mm<br>0.2<br>±<br>0.1min. 1.25<br>0.15<br>±<br>0.85<br>**----- End of picture text -----**<br>


## **RECOMMENDED LAND PATTERN** 

## **CIRCUIT DIAGRAM** 

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**----- Start of picture text -----**<br>
0.4<br>1.4<br>1.6<br>3 Dimensions in mm<br>2 1<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
GND<br>**----- End of picture text -----**<br>


• All specifications are subject to change without notice. 

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**E M C C o m p o n e n t s** ~~ee~~ MEM series **MEM2012S Type** 

## **ELECTRICAL CHARACTERISTICS** 

## **CHARACTERISTICS SPECIFICATION TABLE** 

|**Cutoff frequency**<br>**(MHz)**|**Insertion loss**<br>**(dB)min.**|**Rated voltage**<br>**(V)max.**|**Rated current**<br>**(mA)max.**|**Part No.**|
|---|---|---|---|---|
|25|30[70MHz to 2GHz]|10|100|MEM2012S25R0T□□□|
|35|30[90MHz to 2GHz]|10|100|MEM2012S35R0T□□□|
|50|30[200MHz to 2GHz]|10|100|MEM2012S50R0T□□□|
|100|30[400MHz to 2GHz]|10|250|MEM2012S101RT□□□|
|200|30[530MHz to 2GHz]|10|250|MEM2012S201RT□□□|
|○Measurement equipment|||||
|Measurement item|Product No.<br>Manufacturer||||
|Frequencycharacteristics|N5230C<br>Agilent Technologies||||



- ＊ Equivalent measurement equipment may be used. 

## **INSERTION LOSS VS. FREQUENCY CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
0<br>10<br>20<br>101R 201R<br>30<br>50R0<br>40<br>35R0<br>50 25R0<br>60<br>Bae<br>70<br>1 10 100 1000 10000<br>Frequency (MHz)<br>○ Measurement equipment<br>Product No. Manufacturer<br>N5230C Agilent Technologies<br>＊ Equivalent measurement equipment may be used.<br>Insertion loss (dB)<br>**----- End of picture text -----**<br>


• All specifications are subject to change without notice. 

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**E M C C o m p o n e n t s** eee MEM series 

## **MEM2012SC Type** 

## **SHAPE & DIMENSIONS** 

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**----- Start of picture text -----**<br>
2±0.2<br>NC GND NC<br>6 5 4<br>1 2 3<br>IN/OUT GND OUT/IN<br>0.2min. 0.2min.<br>ae<br>Dimensions in mm<br>0.4±0.15 0.4±0.15 0.4±0.15<br>1.25±0.2<br>0.1min.<br> –0.20.8+0.15,<br>**----- End of picture text -----**<br>


## **CIRCUIT DIAGRAM** 

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**----- Start of picture text -----**<br>
RECOMMENDED LAND PATTERN<br>GND<br>a JltUL<br>0.4<br>1.2<br>2.6<br>p hd Dimensions in mm<br>2.2 0.5<br>**----- End of picture text -----**<br>


• All specifications are subject to change without notice. 

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## **E M C C o m p o n e n t s** ~~pe~~ MEM series **MEM2012SC Type** 

## **ELECTRICAL CHARACTERISTICS** 

## **CHARACTERISTICS SPECIFICATION TABLE** 

|**Capacitance**<br>**(pF)**|**Tolerance**<br>**(%)**|**Rated voltage**<br>**(V)max.**|**Rated current**<br>**(A)max.**|**DC resistance**<br>**(**<br>**)max.**<br>［**Terminal No.1 to 3**］|**Part No.**|
|---|---|---|---|---|---|
|10|±30|12|1|0.15|MEM2012SC100T□□□|
|22|±30|12|1|0.15|MEM2012SC220T□□□|
|47|±30|12|1|0.15|MEM2012SC470T□□□|
|100|±30|12|1|0.15|MEM2012SC101T□□□|
|150|±30|12|1|0.15|MEM2012SC151T□□□|



Measuring frequency: 1(MHz), measuring voltage: 1(V) 

|○Measurement equipment|||
|---|---|---|
|Measurement item|Product No.|Manufacturer|
|Capacitance|4294A|Agilent Technologies|
|Frequencycharacteristics|N5230C|Agilent Technologies|



- ＊ Equivalent measurement equipment may be used. 

## **INSERTION LOSS VS. FREQUENCY CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
0<br>10<br>SC151 SC101 SC100<br>SC220<br>20<br>SC470<br>30 TSX<br>40<br>50<br>60<br>1 10 100 1000 10000<br>Frequency (MHz)<br>○ Measurement equipment<br>Product No. Manufacturer<br>N5230C Agilent Technologies<br>＊ Equivalent measurement equipment may be used.<br>Insertion loss (dB)<br>**----- End of picture text -----**<br>


• All specifications are subject to change without notice. 

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## MEM series 

## **MEM2012V Type** 

## **SHAPE & DIMENSIONS** 

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**----- Start of picture text -----**<br>
2±0.2<br>GND<br>4<br>1 2 3<br>IN/OUT GND OUT/IN<br>0.2min 0.2min<br>0.2<br>±<br>0.1min. 1.25<br>0.15<br>±<br>0.85<br>**----- End of picture text -----**<br>


0.4±0.15 0.4±0.15 0.4±0.15 Dimensions in mm 

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**----- Start of picture text -----**<br>
RECOMMENDED LAND PATTERN CIRCUIT DIAGRAM<br>GND<br>0.4<br>1.4<br>1.6<br>al 3 e Dimensions in mm .<br>2 1<br>**----- End of picture text -----**<br>


• All specifications are subject to change without notice. 

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## **E M C C o m p o n e n t s** ~~ee~~ MEM series **MEM2012V Type** 

## **ELECTRICAL CHARACTERISTICS** 

## **CHARACTERISTICS SPECIFICATION TABLE** 

|**Cutoff frequency**<br>**(MHz)**|**Insertion loss**<br>**(dB)min.**|**Rated voltage**<br>**(V)max.**|**Rated current**<br>**(mA)max.**|**Part No.**|
|---|---|---|---|---|
|120|20[200MHz to 2GHz]|10|100|MEM2012V121RT□□□|
|150|20[250MHz to 2GHz]|10|100|MEM2012V151RT□□□|
|180|20[300MHz to 2GHz]|10|100|MEM2012V181RT□□□|
|210|20[350MHz to 2GHz]|10|100|MEM2012V211RT□□□|
|240|20[450MHz to 2GHz]|10|100|MEM2012V241RT□□□|
|300|20[550MHz to 2GHz]|10|100|MEM2012V301RT□□□|
|○Measurement equipment|||||
|Measurement item|Product No.<br>Manufacturer||||
|Frequencycharacteristics|N5230C<br>Agilent Technologies||||



- ＊ Equivalent measurement equipment may be used. 

## **INSERTION LOSS VS. FREQUENCY CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
0<br>10<br>121R<br>20<br>301R<br>151R<br>30 181R<br>211R<br>40 241R<br>y<br>i<br>50<br>60<br>70<br>1 10 100 1000 10000<br>Frequency (MHz)<br>○ Measurement equipment<br>Product No. Manufacturer<br>N5230C Agilent Technologies<br>＊ Equivalent measurement equipment may be used.<br>Insertion loss (dB)<br>**----- End of picture text -----**<br>


• All specifications are subject to change without notice. 

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## MEM series 

## **MEM2012F Type** 

## **SHAPE & DIMENSIONS** 

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**----- Start of picture text -----**<br>
2±0.2<br>GND<br>4<br>1 2 3<br>IN/OUT GND OUT/IN<br>0.2min 0.2min<br>0.4±0.15 0.4±0.15 0.4±0.15 Dimensions in mm<br>0.2<br>±<br>0.1min. 1.25<br>0.15<br>±<br>0.85<br>**----- End of picture text -----**<br>


## **RECOMMENDED LAND PATTERN** 

## **CIRCUIT DIAGRAM** 

**==> picture [318 x 96] intentionally omitted <==**

**----- Start of picture text -----**<br>
GND<br>0.4<br>1.4<br>1.6<br>3 Dimensions in mm<br>2 1<br>**----- End of picture text -----**<br>


• All specifications are subject to change without notice. 

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## MEM series **MEM2012F Type** 

## **ELECTRICAL CHARACTERISTICS** 

## **CHARACTERISTICS SPECIFICATION TABLE** 

|**Cutoff frequency**<br>**(MHz)**|**Insertion loss**<br>**(dB)min.**|**Rated voltage**<br>**(V)max.**|**Rated current**<br>**(mA)max.**|**Part No.**|
|---|---|---|---|---|
|10|20[200MHz to 2GHz]|12|200|MEM2012F10R0T□□□|
|25|20[300MHz to 2GHz]|12|200|MEM2012F25R0T□□□|
|50|20[400MHz to 2GHz]|12|200|MEM2012F50R0T□□□|
|75|20[700MHz to 2GHz]|12|200|MEM2012F75R0T□□□|
|100|20[1.5GHz to 2GHz]|12|200|MEM2012F101RT□□□|
|○Measurement equipment|||||
|Measurement item|Product No.<br>Manufacturer||||
|Frequencycharacteristics|N5230C<br>Agilent Technologies||||



- ＊ Equivalent measurement equipment may be used. 

## **INSERTION LOSS VS. FREQUENCY CHARACTERISTICS** 

**==> picture [493 x 274] intentionally omitted <==**

**----- Start of picture text -----**<br>
0<br>10<br>20<br>10R0 25R0 50R0 75R0 101R<br>30<br>40<br>5060 \<br>70<br>1 10 100 1000 10000<br>Frequency (MHz)<br>○ Measurement equipment<br>Product No. Manufacturer<br>N5230C Agilent Technologies<br>＊ Equivalent measurement equipment may be used.<br>Insertion loss (dB)<br>**----- End of picture text -----**<br>


• All specifications are subject to change without notice. 

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## MEM series 

## **MEM1608P Type** 

## **SHAPE & DIMENSIONS** 

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**----- Start of picture text -----**<br>
1.6±0.1<br>GND<br>4<br>1 2 3<br>IN/OUT GND OUT/IN<br>0.225min 0.225min<br>0.3±0.1 0.25±0.1 0.3±0.1 Dimensions in mm<br>0.1<br>±<br>0.1min. 0.8<br>0.1<br>±<br>0.6<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
RECOMMENDED LAND PATTERN CIRCUIT DIAGRAM<br>0.1<br>GND<br>0.3<br>0.9<br>Elie ox<br>2.0 Dimensions in mm<br>1.2 0.8 0.2<br>**----- End of picture text -----**<br>


• All specifications are subject to change without notice. 

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**E M C C o m p o n e n t s** ne———— MEM series **MEM1608P Type** 

## **ELECTRICAL CHARACTERISTICS** 

## **CHARACTERISTICS SPECIFICATION TABLE** 

|**Cutoff frequency**<br>**(MHz)**|**Insertion loss**<br>**(dB)min.**|**Rated voltage**<br>**(V)max.**|**Rated current**<br>**(mA)max.**|**Part No.**|
|---|---|---|---|---|
|25|20[70MHz to 2GHz]|10|100|MEM1608P25R0T□□□|
|35|20[90MHz to 2GHz]|10|100|MEM1608P35R0T□□□|
|50|20[200MHz to 2GHz]|10|100|MEM1608P50R0T□□□|
|75|20[300MHz to 2GHz]|10|100|MEM1608P75R0T□□□|
|100|20[400MHz to 2GHz]|10|100|MEM1608P101RT□□□|
|○Measurement equipment|||||
|Measurement item<br>Product No.<br>Manufacturer|||||
|Frequencycharacteristics<br>N5230C<br>Agilent Technologies|||||



＊ Equivalent measurement equipment may be used. 

## **INSERTION LOSS VS. FREQUENCY CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
0<br>10<br>20 TTT SST<br>30<br>35R0<br>25R0<br>40<br>50R0<br>50 75R0 VAY 101R //<br>60<br>¥<br>70<br>80<br>|<br>90<br>1 10 100 1000 10000<br>Frequency (MHz)<br>○ Measurement equipment<br>Product No. Manufacturer<br>N5230C Agilent Technologies<br>＊ Equivalent measurement equipment may be used.<br>Insertion loss (dB)<br>**----- End of picture text -----**<br>


• All specifications are subject to change without notice. 

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**E M C C o m p o n e n t s** _——<—————™ 

## MEM series 

## **Packaging style** 

## **REEL DIMENSIONS** 

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**----- Start of picture text -----**<br>
2.0±0.5<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
1.0<br>ø13±0.2 8.4 [+2.0] –0.0<br>ø21±0.8 14.4max.<br>= ia<br>ø180±2.0<br>Dimensions in mm<br>ø60min.<br>**----- End of picture text -----**<br>


## **TAPE DIMENSIONS** 

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**----- Start of picture text -----**<br>
1.5 [+0.1] 0 2.0±0.05 4.0±0.1<br>coy YY |<br>A 4.0±0.1 K<br>| ee LL<br>1.75±0.1<br>B 3.5±0.05 8.0±0.3<br>**----- End of picture text -----**<br>


Dimensions in mm 

|Type|A|B|K|
|---|---|---|---|
|**MEM2012S**|1.55±0.20|2.30±0.20|1.10max.|
|**MEM2012SC**|1.55±0.20|2.30±0.20|1.10max.|
|**MEM2012V**|1.55±0.20|2.30±0.20|1.10max.|
|**MEM2012F**|1.55±0.20|2.30±0.20|1.10max.|
|**MEM1608P**|1.10±0.20|1.90±0.20|0.90max.|



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**----- Start of picture text -----**<br>
160min. Taping 200min.<br>Drawing direction 300min.<br>MEM2012S, MEM2012V, MEM2012F<br>— —<br>MEM2012SC<br>MEM1608P<br>**----- End of picture text -----**<br>


Dimensions in mm 

• All specifications are subject to change without notice. 

001-01 / 20131111 / e96_mem_sp.fm

Updated at June 10, 2026

TDK Corporation is a globally recognized leader in electronic components and magnetic materials. Founded in 1935 to commercialize ferrites, the Tokyo-based company has evolved into a comprehensive manufacturer of high-performance passive components, sensors, and power electronics. TDK’s advanced materials technology serves as the foundation for its extensive portfolio, driving innovation across automotive, industrial, consumer electronics, and communication technologies. Our selection of TDK components heavily features their industry-leading passive components, with a primary focus on magnetics. TDK excels in manufacturing reliable inductive solutions, offering a vast array of power inductors and RF inductors optimized for demanding power management and high-frequency applications. Furthermore, their expertise in electromagnetic compatibility is showcased through a comprehensive range of EMC and RFI suppression products. This includes common mode chokes, power line filters, and specialized shielding materials designed to ensure superior signal integrity in complex designs. Beyond inductors and filtering components, TDK provides robust circuit protection and sensing solutions essential for modern engineering. The portfolio includes precision temperature sensing and compensation NTC thermistors, alongside TVS varistors and inrush current limiting components that safeguard sensitive electronics. Complemented by fixed value inductors, supercapacitors, and charging coils, TDK's versatile product offering delivers the reliability and performance required for sophisticated circuit design.

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