MEKK2016TR68M

**for General Electronic Equipment** 

## **Notice for TAIYO YUDEN roducts p** 

Please read this notice before using the TAIYO YUDEN products. 

## REMINDERS 

- **Product Information in this Catalog** 

   - Product information in this catalog is as of October January 2021. All of the 2020 . All of the contents specified herein and production status of the products listed in this catalog are subject to change without notice due to technical improvement of our products, etc.  Therefore, please check for the latest information carefully before practical application or use of our products. 

Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or equipment incorporating our products, which are caused under the conditions other than those specified in this catalog or individual product specification sheets. 

- **Approval of Product Specifications** 

Please contact TAIYO YUDEN for further details of product specifications as the individual product specification sheets are available. When using our products, please be sure to approve our product specifications or make a written agreement on the product specification with TAIYO YUDEN in advance. 

- **Pre-Evaluation in the Actual Equipment and Conditions** 

Please conduct validation and verification of our products in actual conditions of mounting and operating environment before using our products. 

## ■ **Limited Application** 

**1. Equipment Intended for Use** 

The products listed in this catalog are intended for generalpurpose and standard use in general electronic equipment (e.g., AV equipment, OA equipment, home electric appliances, office equipment, information and communication equipment including, without limitation, mobile phone, and PC) and other equipment specified in this catalog or the individual product specification sheets. 

TAIYO YUDEN has the line-up of the products intended for use in automotive electronic equipment, telecommunications infrastructure and industrial equipment, or medical devices classified as GHTF Classes A to C (Japan Classes I to III). Therefore, when using our products for these equipment, please check available applications specified in this catalog or the individual product specification sheets and use the corresponding products. 

## **2. Equipment Requiring Inquiry** 

Please be sure to contact TAIYO YUDEN for further information before using the products listed in this catalog for the following equipment (excluding intended equipment as specified in this catalog or the individual product specification sheets) which may cause loss of human life, bodily injury, serious property damage and/or serious public impact due to a failure or defect of the products and/or malfunction attributed thereto. 

- (1) Transportation equipment (automotive powertrain control system, train control system, and ship control system, etc.) 

- (2) Traffic signal equipment 

- (4) Power generation control equipment (nuclear power, hydroelectric power, thermal power plant control system, etc.) 

- (5) Undersea equipment (submarine repeating equipment, underwater work equipment, etc.) 

- (6) Military equipment 

- (7) Any other equipment requiring extremely high levels of safety and/or reliability equal to the equipment listed above 

- *Notes: 

1. There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g., in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN. Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment. 

2. Implantable medical devices contain not only internal unit which is implanted in a body, but also external unit which is connected to the internal unit. 

## **4. Limitation of Liability** 

Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog for any equipment that is not intended for use by TAIYO YUDEN, or any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above. 

## ■ **Safety Design** 

When using our products for high safety and/or reliability-required equipment or circuits, please fully perform safety and/or reliability evaluation. In addition, please install (i) systems equipped with a protection circuit and a protection device and/or (ii) systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault for a failsafe design to ensure safety. 

## ■ **Intellectual Property Rights** 

Information contained in this catalog is intended to convey examples of typical performances and/or applications of our products and is not intended to make any warranty with respect to the intellectual property rights or any other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights. 

## ■ **Limited Warranty** 

Please note that the scope of warranty for our products is limited to the delivered our products themselves and TAIYO YUDEN shall not be in any way responsible for any damages resulting from a failure or defect in our products. Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in accordance with such agreement. 

- (3) Disaster prevention equipment, crime prevention equipment 

- (5) Highly public information network equipment, dataprocessing equipment (telephone exchange, and base station, etc.) 

- (6) Any other equipment requiring high levels of quality and/or reliability equal to the equipment listed above 

## **3. Equipment Prohibited for Use** 

- Please do not incorporate our products into the following equipment requiring extremely high levels of safety and/or reliability. 

- (1) Aerospace equipment (artificial satellite, rocket, etc.) (2) Aviation equipment *1 

## ■ **TAIYO YUDEN’s Official Sales Channel** 

The contents of this catalog are applicable to our products which are purchased from our sales offices or authorized distributors (hereinafter “TAIYO YUDEN’s official sales channel”). Please note that the contents of this catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN’s official sales channel. 

## ■ **Caution for Export** 

Some of our products listed in this catalog may require specific procedures for export according to “U.S. Export Administration ”“ ” Regulations , Foreign Exchange and Foreign Trade Control Law of Japan, and other applicable regulations. Should you have any questions on this matter, please contact our sales staff. 

- (3) Medical devices classified as GHTF Class D (Japan Class IV), implantable medical devices *2 

▶ For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**2** 

**for General Electronic Equipment** 

## METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM ME SERIES） 

## ■PARTS NUMBER 

## * Operating Temp.：-40～+125℃（Including self-generated heat） 

|M<br>E<br>①<br>①Series n|K<br>K|K<br>K|2<br>0<br>1<br>6  T<br>③<br>④|T|1<br>R<br>0|1<br>R<br>0|1<br>R<br>0|
|---|---|---|---|---|---|---|---|
||②<br>ame|||||||
|Code|||Series name|||Code<br>（example）|Nominal inductance［μH］|
|ME|||Metal Wire-wound ChipP|||||
|②Dimensions（T）||||||R47|0.47|
|||||||1R0|1.0|
|Code||||||4R7|4.7|
|KK||||||※R＝Decimal point<br>⑥Inductance tolerance||
|③Dimensions（L×W||||||||
|Code|||Dimensions（L×W）［mm］|||Code|Inductance tolerance|
|2016|||2.0×1.6<br>2.5×2.0<br>Packaging<br>Taping|||M|±20％|
|2520||||||⑦Special code||
|④Packaging||||||||
|||||||Code|Special code|
|Code||||||△|Standard|
|T||||||||



**==> picture [50 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
⑧Internal code<br>**----- End of picture text -----**<br>


## ■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY 

|T|T||~~e~~|||Recommended Land Patterns<br>Surface Mounting<br>・Mounting and soldering conditio<br>・Applicable soldering process to<br>A<br>A<br>B<br>C|Recommended Land Patterns<br>Surface Mounting<br>・Mounting and soldering conditio<br>・Applicable soldering process to<br>A<br>A<br>B<br>C|ns s<br>the|hould be chec<br>seproducts is|ked beforehand.<br>reflow solderingonly.|ked beforehand.<br>reflow solderingonly.||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||||||||
||||||||||Type|A|B|C|
||||~~e~~||||||2016|0.7|0.8|1.8|
|||L||W|||||||||
||||||||||2520|0.9|1.0|2.2|
||||||||||||||
|||Type||L|W|T|e|||Standard quantity［pcs］|||
|||||||||||Taping|||
|M||EKK2016|2.0±0.2<br>（0.079±0.008）||1.6±0.2<br>（0.063±0.008）|1.0 max<br>（0.039 max）|0.5±0.3<br>（0.020±0.012）|||3000|||
|M||EKK2520|2.5±0.2<br>（0.098±0.008）||2.0±0.2<br>（0.079±0.008）|1.0 max<br>（0.039 max）|0.65±0.3<br>（0.026±0.012）|||3000|||
||||||||||||||



▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**34** 

**for General Electronic Equipment** 

■PARTS NUMBER 

## ●MEKK2016 type 

## 【Thickness：1.0mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※）［ｍA］（max.）|Rated current ※）［ｍA］（max.）|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MEKK2016TR47M|RoHS|0.47|±20％|-|0.030|4,500|4,300|1|
|MEKK2016TR68M|RoHS|0.68|±20％|-|0.052|3,800|3,300|1|
|MEKK2016T1R0M|RoHS|1.0|±20％|-|0.060|3,600|3,100|1|
|MEKK2016T2R2M|RoHS|2.2|±20％|-|0.150|2,400|1,900|1|



## ●MEKK2520 type 【Thickness：1.0mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※）［ｍA］（max.）|Rated current ※）［ｍA］（max.）|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MEKK2520TR33M|RoHS|0.33|±20％|-|0.022|6,400|5,100|1|
|MEKK2520TR47M|RoHS|0.47|±20％|-|0.025|5,900|4,800|1|
|MEKK2520T1R0M|RoHS|1.0|±20％|-|0.053|4,300|3,300|1|
|MEKK2520T1R5M|RoHS|1.5|±20％|-|0.069|3,200|2,800|1|
|MEKK2520T2R2M|RoHS|2.2|±20％|-|0.097|3,100|2,400|1|
|MEKK2520T4R7M|RoHS|4.7|±20％|-|0.240|1,600|1,500|1|



※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃) 

- ※） The temperature rise current value（Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃) 

- ※） The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value. ※） Idc2 Measurement board data Material:FR4 

Board dimensions：100×50×1.6t ㎜ 

Pattern dimensions：45×45 ㎜ (Double side board) 

Pattern thickness：70μm 

▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**35** 

**for General Electronic Equipment** 

## METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM ME-H SERIES） 

## ■PARTS NUMBER 

## * Operating Temp.：-40～+125℃（Including self-generated heat） 

||M|E||K|K||2|0|1|<br>6  Ｈ||1|R|0||M||△||△|△|△＝Blank space|△＝Blank space||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||①|||②||||③||④|||⑤|||⑥||⑦||⑧|||||
|①Series name||||||||||||||||||||⑤Nominal inductance|||||
|||Code<br>ME|||||Metal|Series name<br>Wire-wound ChipPower Inductor||||||||||||||Code<br>（example）||Nominal inductance［μH］|
|||||||||||||||||||||||R47||0.47|
|②Dimensions（T）||||||||||||||||||||||1R0||1.0|
|||Code||||||Dimensions（T）［mm］||||||||||||||2R2||2.2|
|||HK||||||||0.8||||||||||※R＝Decimal point|||||
|||KK||||||||1.0|||||||||||||||
|||||||||||||||||||||⑥Inductance tolerance|||||
|③Dimensions（L×W）||||||||||||||||||||||Code||Inductance tolerance|
|||Code||||||Dimensions（L×W）［mm］||||||||||||||M||±20％|
|||2012||||||||2.0×1.2|||||||||||||||
|||2016||||||||2.0×1.6||||||||||⑦Special code|||||
|||2520||||||||2.5×2.0||||||||||||Code||Special code|
|||||||||||||||||||||||△||Standard|
|④Packaging|||||||||||||||||||||||||
|||Code||||||||Packaging||||||||||⑧Internal code|||||
|||H|||||Taping（special specification）||||||||||||||||||



## ■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY 

|L<br>T|~~e~~<br>W||Recommended Land Patterns<br>Surface Mounting<br>・Mounting and soldering conditio<br>・Applicable soldering process to<br>A<br>A<br>B<br>C|Recommended Land Patterns<br>Surface Mounting<br>・Mounting and soldering conditio<br>・Applicable soldering process to<br>A<br>A<br>B<br>C|ns s<br>the|hould be chec<br>seproducts is|ked beforehand.<br>reflow solderingonly.|ked beforehand.<br>reflow solderingonly.||
|---|---|---|---|---|---|---|---|---|---|
|||||||Type|A|B|C|
|||||||2012|0.7|0.8|1.4|
|||||||2016|0.7|0.8|1.8|
|||||||2520|0.9|1.0|2.2|
|||||||||||
|Type|L|W|T|e|||Standard quantity［pcs］|||
||||||||Taping|||
|MEHK2012H|2.0±0.2<br>（0.079±0.008）|1.2±0.2<br>（0.047±0.008）|0.8 max<br>（0.031 max）|0.5±0.3<br>（0.020±0.012）|||3000|||
|MEKK2012H|2.0±0.2<br>（0.079±0.008）|1.2±0.2<br>（0.047±0.008）|1.0 max<br>（0.039 max）|0.5±0.3<br>（0.020±0.012）|||3000|||
|MEKK2016H|2.0±0.2<br>（0.079±0.008）|1.6±0.2<br>（0.063±0.008）|1.0 max<br>（0.039 max）|0.5±0.3<br>（0.020±0.012）|||3000|||
|MEKK2520H|2.5±0.2<br>（0.098±0.008）|2.0±0.2<br>（0.079±0.008）|1.0 max<br>（0.039 max）|0.65±0.3<br>（0.026±0.012）|||3000|||
|||||||||||



▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**36** 

**for General Electronic Equipment** 

■PARTS NUMBER 

|●MEHK2012H type<br>【Thickness：0.8mm max.】|●MEHK2012H type<br>【Thickness：0.8mm max.】|●MEHK2012H type<br>【Thickness：0.8mm max.】|●MEHK2012H type<br>【Thickness：0.8mm max.】|●MEHK2012H type<br>【Thickness：0.8mm max.】|●MEHK2012H type<br>【Thickness：0.8mm max.】||||
|---|---|---|---|---|---|---|---|---|
|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※）［ｍA］（max.）||Measuring<br>frequency［MHz］|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MEHK2012HR47M|RoHS|0.47|±20％|-|0.035|4,100|3,700|1|
|●MEKK2012H type<br>【Thickness：1.0mm max.】|||||||||
|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※） ［ｍA］（max.）||Measuring<br>frequency［MHz］|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MEKK2012HR47M|RoHS|0.47|±20％|-|0.030|4,500|4,200|1|
|●MEKK2016H type<br>【Thickness：1.0mm max.】|||||||||
|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※） ［ｍA］（max.）||Measuring<br>frequency［MHz］|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MEKK2016HR47M|RoHS|0.47|±20％|-|0.026|5,300|4,700|1|
|MEKK2016H1R0M|RoHS|1.0|±20％|-|0.048|4,000|3,500|1|
|MEKK2016H2R2M|RoHS|2.2|±20％|-|0.100|2,300|2,300|1|
|●MEKK2520H type<br>【Thickness：1.0mm max.】|||||||||
|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※）［ｍA］（max.）||Measuring<br>frequency［MHz］|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MEKK2520H1R0M|RoHS|1|±20％|-|0.039|4,400|3,800|1|



- ※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃) 

- ※） The temperature rise current value（Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃) 

- ※） The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value. 

- ※） Idc2 Measurement board data Material:FR4 

Board dimensions：100×50×1.6t ㎜ 

Pattern dimensions：45×45 ㎜ (Double side board) 

Pattern thickness：70μm 

▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**37** 

METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOIL[TM] ME SERIES／MCOIL[TM] ME-H SERIES) 

## ■PACKAGING 

**==> picture [358 x 247] intentionally omitted <==**

**----- Start of picture text -----**<br>
①Minimum Quantity<br>Standard Quantity [pcs]<br>Type<br>Tape ＆ Reel<br>MEHK2012  3000<br>MEKK2012  3000<br>MEKK2016  3000<br>MEKK2520  3000<br>②Tape Material<br>●Embossed Tape<br>Top tape<br>= |<br>Do KG ‘ee Chip Filled<br>|<br>Sprocket hole<br>| [s<br>Base tape  Chip cavity  Chip<br>**----- End of picture text -----**<br>


③Taping dimensions 

**==> picture [207 x 155] intentionally omitted <==**

**----- Start of picture text -----**<br>
●Embossed tape 8mm wide (0.315 inches wide)<br>φ1.5＋0.1/－0 1.75±0.1<br>Sprocket hole (φ0.059＋0.004/-0) : (0.069±0.004）<br>>| A<br>B<br>ir e }a a<br>an a<br>F 4.0±0.1<br>(0.157±0.004)<br>2.0±0.05<br>(0.079±0.002)<br>3.5±0.1 8.0±0.2<br>(0.138±0.004)<br>(0.315±0.008)<br>**----- End of picture text -----**<br>


|Type|Chipcavity|Chipcavity|Insertionpitch|Tape thickness|Tape thickness|
|---|---|---|---|---|---|
||A|B|F|T|K|
|MEHK2012|1.45±0.1<br>（0.057±0.004）|2.25±0.1<br>（0.089±0.004）|4.0±0.1<br>（0.157±0.004）|0.25±0.05<br>（0.009±0.002）|1.1±0.1<br>（0.043±0.004）|
|MEKK2012|1.45±0.1<br>（0.057±0.004）|2.25±0.1<br>（0.089±0.004）|4.0±0.1<br>（0.157±0.004）|0.25±0.05<br>（0.009±0.002）|1.1±0.1<br>（0.043±0.004）|
|MEKK2016|1.9±0.1<br>（0.075±0.004）|2.45±0.1<br>（0.097±0.004）|4.0±0.1<br>（0.157±0.004）|0.25±0.05<br>（0.009±0.002）|1.2±0.1<br>（0.047±0.004）|
|MEKK2520|2.4±0.1<br>（0.094±0.004）|2.9±0.1<br>（0.114±0.004）|4.0±0.1<br>（0.157±0.004）|0.25±0.05<br>（0.009±0.002）|1.1±0.1<br>（0.043±0.004）|



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_ME_pack_e-E08R01 

**==> picture [414 x 362] intentionally omitted <==**

**----- Start of picture text -----**<br>
④Leader and Blank portion<br>Blank portions  Chip cavity  Blank portions  Leader<br>—. 9a?’ 4@@$]+->-*—<br>O_O_O O_O_O O_O O_O Direction of tape feed<br>OO 0-00 O----- - 0 O----0 0 —><br>|———>| 160 mm or more  <——>| 160 mm ～ 200 mm<br>—<br>400 mm ～ 560 mm<br>⑤Reel size<br>oe W<br>| if. an \<br>yi 4 \ a o<br>613405" f 7" +,’ ]<br>2.5or less<br>(0.098inchds<br>. or [less)]<br>Reel size (Reference values)<br>Type<br>φD  φd  W<br>MEHK2012<br>MEKK2012  180+0/-3  60+1/-0  10.0±1.5<br>MEKK2016  （7.087+0/-0.118）  （2.36+0.039/0）  （0.394±0.059）<br>MEKK2520<br>                                                   Unit：mm（inch）<br>**----- End of picture text -----**<br>


## ⑥Top Tape Strength 

The top The top tape requires a peel-off force of 0.1 to 1.0N in the direction of the arrow as illustrated below. 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_ME_pack_e-E08R01 

METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOIL[TM] ME SERIES／MCOIL[TM] ME-H SERIES) 

## ■RELIABILITY DATA 

|1. Operating Temperature Range|1. Operating Temperature Range||||||
|---|---|---|---|---|---|---|
||ME series||||||
|Specified Value|||－40～＋125℃||||
||ME-H series||||||
|Test Methods and<br>Remarks|Including self-generated heat|Including self-generated heat|||||
||||||||
|2. Storage Temperature Range|||||||
||ME series||||||
|Specified Value|||－40～＋85℃||||
||ME-H series||||||
|Test Methods and<br>Remarks|0 to 40℃ for the product with taping.||||||
||||||||
|3. Rated current|||||||
||ME series||||||
|Specified Value|||Within the specified tolerance||||
||ME-H series||||||
||||||||
|4. Inductance|||||||
||ME series||||||
|Specified Value|||Within the specified tolerance||||
||ME-H series||||||
|Test Methods and|Measuring equipment|: LCR Meter （HP 4294A or equivalent）|||||
|Remarks|Measuring frequency|: 1MHz、0.5V|||||
||||||||
|5. DC Resistance|||||||
||ME series||||||
|Specified Value|||Within the specified tolerance||||
||ME-H series||||||
|Test Methods and<br>Remarks|Measuring equipment|: DC ohmmeter （HIOKI 3227 or equivalent）|||||
||||||||
|6. Self resonance frequency|||||||
||ME series||||||
|Specified Value|||－||||
||ME-H series||||||
||||||||
|7. Temperature characteristic|||||||
||ME series||||||
|Specified Value|||Inductance change : Within ±15%|Inductance change : Within ±15%|||
||ME-H series||||||
|Test Methods and|Measurement of inductance shall be taken at temperature range within －40℃～＋125℃.||Measurement of inductance shall be taken at temperature range within －40℃～＋125℃.||||
|Remarks|With reference to inductance value at ＋20℃., change rate shall be calculated.||||||
||||||||
|8. Resistance to flexure of substrate|||||||
||ME series||||||
|Specified Value|||No damage||||
||ME-H series||||||
||The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating|||The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating|The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating||
||until deflection of the test board reaches to 2 mm.||||||
||Test board size|: 100×40×1.0 mm|: 100×40×1.0 mm|Force Rod|10|20|
|Test Methods and|Test board material<br>Solder cream thickness|: Glass epoxy-resin<br>Solder cream thickness<br>: 0.12 mm||||R230)|
|Remarks|||||||



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_ME_reli_e-E08R01 

9. Insulation resistance : between wires ME series Specified Value ME-H series 10. Insulation resistance : between wire and over-coating ME series Specified Value ME-H series 

11. Withstanding voltage : between wire and over-coating ME series Specified Value ME-H series 

12. Adhesion of terminal electrode ME series Specified Value No abnormality. ME-H series The test samples shall be soldered to the test board by the reflow. Test Methods and Applied force : 10N to X and Y directions. Remarks Duration : 5s. Solder cream thickness : 0.12mm. ~~i~~ 13. Resistance to vibration ME series Inductance change : Within ±10% Specified Value ME-H series No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. Then it shall be submitted to below test conditions. Frequency Range 10～55Hz Test Methods and Total Amplitude 1.5mm (May not exceed acceleration 196m/s[2] ) Remarks Sweeping Method 10Hz to 55Hz to 10Hz for 1min. X Time Y For 2 hours on ach X, Y, and Z axis. Z Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. ~~ss~~ 14. Solderability ME series Specified Value At least 90％ of surface of terminal electrode is covered by new solder. ~~_~~ ME-H series The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table. Flux : Methanol solution containing rosin 25%. Test Methods and Solder Temperature 245±5℃ Remarks Time 5±0.5 sec. ※Immersion depth : All sides of mounting terminal shall be immersed. ~~——~~ 15. Resistance to soldering heat ME series Inductance change : Within ±10% Specified Value ME-H series No significant abnormality in appearance. The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 2 times. Test Methods and Test board material : Glass epoxy-resin Remarks Test board thickness : 1.0mm Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. ~~TT~~ ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_ME_reli_e-E08R01 

**==> picture [540 x 675] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||
|---|---|---|
|16. Thermal shock|
|ME series|Inductance change : Within ±10%|
|Specified Value|
|ME-H series|No significant abnormality in appearance.|
|The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified|
|time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles.|
|Conditions of 1 cycle|
|Step|Temperature (℃)|Duration (min)|
|Test Methods and|
|1|－40±3|30±3|
|Remarks|
|2|Room temperature|Within 3|
|3|＋85±2|30±3|
|4|Room temperature|Within 3|
|Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.|
|=|
|17. Damp heat|
|ME series|Inductance change : Within ±10%|
|Specified Value|
|ME-H series|No significant abnormality in appearance.|
|The test samples shall be soldered to the test board by the reflow.|
|The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table.|
|Test Methods and|
|Temperature|60±2℃|
|Remarks|
|Humidity|90～95%RH|
|Time|500＋24/－0 hour|
|Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.|
|==|
|18. Loading under damp heat|
|ME series|Inductance change : Within ±10%|
|Specified Value|
|ME-H series|No significant abnormality in appearance.|
|The test samples shall be soldered to the test board by the reflow.|
|The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current|
|continuously as shown in below table.|
|Test Methods and|
|Temperature|60±2℃|
|Remarks|
|Humidity|90～95％RH|
|Applied current|Rated current|
|=S—|Time|500＋24/－0 hour|
|Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.|
|19. Low temperature life test|
|ME series|Inductance change : Within ±10%|
|Specified Value|
|ME-H series|No significant abnormality in appearance.|
|The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown|
|Test Methods and|in below table.|
|Remarks|Temperature|－40±2℃|
|Time|500＋24/－0 hour|
|Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.|
|—|
|20. High temperature life test|
|ME series|Inductance change : Within ±10%|
|Specified Value|
|ME-H series|No significant abnormality in appearance.|
|The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown|
|Test Methods and|in below table.|
|Remarks|Temperature|125±2℃|
|Time|500＋24/－0 hour|
|Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.|
|==|
|21. Loading at high temperature life test|
|ME series|
|Specified Value|－|
|ME-H series|

**----- End of picture text -----**<br>


▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_ME_reli_e-E08R01 

## 22. Standard condition 

|Specified Value|ME series|Standard test condition :<br>Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.<br>When there is any question concerning measurement result: In order to provide correlation<br>data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.<br>Inductance is in accordance with our measured value.|
|---|---|---|
||ME-H series||



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_ME_reli_e-E08R01 

METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOIL[TM] ME SERIES／MCOIL[TM] ME-H SERIES) 

## ■PRECAUTIONS 

|Precautions|◆Operating environment<br>1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,<br>telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical<br>equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear<br>control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or<br>damage. For such uses, contact TAIYO YUDEN Sales Department in advance.|
|---|---|



2. PCB Design ◆Land pattern design Precautions 1. Please refer to a recommended land pattern. ◆Land pattern design Technical Surface Mounting considerations ・ Mounting and soldering conditions should be checked beforehand. ・ Applicable soldering process to this products is reflow soldering only. 3. Considerations for automatic placement ◆Adjustment of mounting machine Precautions 1. Excessive impact load should not be imposed on the products when mounting onto the PC boards. 2. Mounting and soldering conditions should be checked beforehand. Technical ◆Adjustment of mounting machine considerations 1. When installing products, care should be taken not to apply distortion stress as it may deform the products. ~~—————~~ 4. Soldering ◆Reflow soldering 1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified. 2. The product shall be used reflow soldering only. Precautions 3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering. ◆Lead free soldering 1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering heat, soldering etc sufficiently. ◆Reflow soldering 1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. Recommended reflow condition (Pb free solder) 300 5sec max Peak：250＋0/－5℃ 150～180℃ Technical 200 considerations 30±10sec 100 100～120sec 230℃ min 0 Heating Time［sec］ 5. Cleaning ◆Cleaning conditions Precautions 1. Washing by supersonic waves shall be avoided. Technical ◆Cleaning conditions considerations 1. If washed by supersonic waves, the products might be broken. 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_ME_prec_e-E09R01 

|6. Handling||
|---|---|
|Precautions|◆Handling<br>1. Keep the product away from all magnets and magnetic objects.<br>◆Breakaway PC boards (splitting along perforations)<br>1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.<br>2. Board separation should not be done manually, but by using the appropriate devices.<br>◆Mechanical considerations<br>1. Please do not give the product any excessive mechanical shocks.<br>2. Please do not add any shock and power to a product in transportation.<br>◆Pick-up pressure<br>1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.<br>◆Packing<br>1. Please avoid accumulation of a packing box as much as possible.|
|Technical<br>considerations|◆Handling<br>1. There is a case that a characteristic varies with magnetic influence.<br>◆Breakaway PC boards (splitting along perforations)<br>1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.<br>◆Mechanical considerations<br>1. There is a case to be damaged by a mechanical shock.<br>2. There is a case to be broken by the handling in transportation.<br>◆Pick-up pressure<br>1. Damage and a characteristic can vary with an excessive shock or stress.<br>◆Packing<br>1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.|



|Precautions|◆Storage<br>1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the<br>storage area should be controlled.<br>・ Recommended conditions<br>Ambient temperature : 0～40℃<br>Humidity : Below 70% RH<br>・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may<br>decrease as time passes.<br>For this reason, product should be used within 6 months from the time of delivery.<br>In case of storage over 6 months, solderability shall be checked before actual usage.|
|---|---|
|Technical<br>considerations|◆Storage<br>1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes<br>and deterioration of taping/packaging materials may take place.|



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_ME_prec_e-E09R01 

**for General Electronic Equipment** 

## METAL MULTILAYER CHIP POWER INDUCTORS（MCOILTM MC SERIES） 

## * Operating Temp.：-40～+125℃(Including self-generated heat) 

## ■PARTS NUMBER 

|M<br>C|K<br>K|K<br>K|2<br>0<br>1<br>2  T<br>③<br>④|1<br>R<br>0<br>M <br> <br>⑤<br>⑥<br>e<br> power inductor|M|△ △ △△|△ △ △△|△ △ △△|
|---|---|---|---|---|---|---|---|---|
|①<br>①Series n|②<br>ame||||||||
|Code|||Series nam|e|||Code<br>（example）|Nominal inductance［μH］|
|MC|||Metal base multilayer chip|power inductor|||||
||||||||R24|0.24|
||||||||R47|0.47|
||||||||1R0|1.0|
||||||||※R＝Decimal point||



||Code<br>（example）||Nominal|inductance［μH］|
|---|---|---|---|---|
||R24|||0.24|
||R47|||0.47|
||1R0|||1.0|
|※R＝Decimal point|||||



## ②Thickness 

|Code|Thickness［mm］|Thickness［mm］|
|---|---|---|
|EK|0.50|max|
|EE|0.55|max|
|FK|0.60|max|
|FE|0.65|max|
|HK|0.80|max|
|KK|1.0|max|
|③Dimensions（L×W）|||
|Code|Type（inch）|Dimensions<br>（L×W）［mm］|
|1005|1005(0402)|1.0×0.5|
|1210|1210(0504)|1.25 x 1.05|
|1608|1608（0603）|1.6×0.8|
|2012|2012（0805）|2.0×1.25|
|2016|2016(0806)|2.0×1.6|



## ⑥Inductance tolerance 

|Code|Inductance tolerance|
|---|---|
|M|±20％|
|⑦Special code||
|Code|Special code|
|△△△△|Standard|
|△N△△|Polarity Marking|
|HN△△||
|KN△△||
|G△△△|5 surface terminal|
|J G △B||



|④Packaging||
|---|---|
|Code|Packaging|
|Ｔ|Taping|



■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY 

**==> picture [473 x 81] intentionally omitted <==**

**----- Start of picture text -----**<br>
Standard                  Ｐolarity Marking                                         5 surface terminal<br>W W W W<br>L L L L<br>T T T T<br>e e e e<br>**----- End of picture text -----**<br>


||||||Standardquantity［pcs］<br>Paper tape<br>Embossed tape<br>10000<br>5000<br>－<br>4000<br>－<br>4000<br>－<br>4000<br>－<br>－<br>3000<br>4000<br>－<br>－<br>3000<br>4000<br>－<br>Unit：mm（inch）|Standardquantity［pcs］<br>Paper tape<br>Embossed tape<br>10000<br>5000<br>－<br>4000<br>－<br>4000<br>－<br>4000<br>－<br>－<br>3000<br>4000<br>－<br>－<br>3000<br>4000<br>－<br>Unit：mm（inch）|
|---|---|---|---|---|---|---|
|Type|L|W|T|e|Standardquantity［pcs］||
||||||Paper tape|Embossed tape|
|MCEE1005<br>(0402)|1.0±0.2<br>（0.039±0.008）|0.5±0.2<br>（0.020±0.008）|0.55 max<br>（0.022 max）|0.25±0.15<br>（0.010±0.006）|10000||
|MCEK1210<br>(0504)|1.25±0.1<br>（0.049±0.004）|1.05±0.1<br>（0.041±0.004）|0.50 max<br>（0.020 max）|0.30±0.2<br>（0.012±0.008）|5000|－|
|MCFK1608<br>(0603)|1.6±0.2<br>（0.063±0.008）|0.8±0.2<br>（0.031±0.008）|0.60 max<br>（0.024 max）|0.3±0.2<br>（0.012±0.008）|4000|－|
|MCFE1608<br>（0603）|1.6±0.2<br>（0.063±0.008）|0.8±0.2<br>（0.031±0.008）|0.65 max<br>（0.026 max）|0.3±0.2<br>（0.012±0.008）|4000|－|
|MCHK1608<br>（0603）|1.6±0.2<br>（0.063±0.008）|0.8±0.2<br>（0.031±0.008）|0.80 max<br>（0.031 max）|0.4±0.2<br>（0.016±0.008）|4000|－|
|MCKK1608<br>（0603）|1.6±0.2<br>（0.063±0.008）|0.8±0.2<br>（0.031±0.008）|1.0 max<br>（0.039 max）|0.3±0.2<br>（0.012±0.008）|－|3000|
|MCHK2012<br>（0805）|2.0±0.2<br>（0.079±0.008）|1.25±0.2<br>（0.049±0.008）|0.80 max<br>（0.031 max）|0.5±0.3<br>（0.02±0.012）|4000|－|
|MCKK2012<br>（0805）|2.0±0.2<br>（0.079±0.008）|1.25±0.2<br>（0.049±0.008）|1.0 max<br>（0.039 max）|0.5±0.3<br>（0.02±0.012）|－|3000|
|MCFE2016<br>(0806)|2.0±0.2<br>（0.079±0.008）|1.6±0.2<br>（0.063±0.008）|0.65 max<br>（0.026 max）|0.5±0.3<br>（0.02±0.012）|4000|－|
||||||||



▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**38** 

**for General Electronic Equipment** 

■PARTS NUMBER 

## ●MC1005 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance<br>［mΩ］|DC Resistance<br>［mΩ］|Rated<br>current(Idc1)<br>［A］（max.）|Rated<br>current(Idc2)<br>［A］（max.）|Measuring<br>frequency<br>［MHz］|Thickness<br>［mm］（max.）|
|---|---|---|---|---|---|---|---|---|---|
|||||（max.）|（typ.）|||||
|MCEE1005TR10MHN|RoHS|0.10|±20％|50|41|2.00|2.00|1|0.55|
|MCEE1005TR22MHN|RoHS|0.22|±20％|80|65|1.60|1.60|1|0.55|
|MCEE1005TR47MHN|RoHS|0.47|±20％|140|114|1.20|1.20|1|0.55|
|MCEE1005T1R0MHN|RoHS|1.0|±20％|300|244|1.00|0.80|1|0.55|
|●MC1210||||||||||
|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance<br>［mΩ］||Rated<br>current(Idc1)<br>［A］（max.）|Rated<br>current(Idc2)<br>［A］（max.）|Measuring<br>frequency<br>［MHz］|Thickness<br>［mm］（max.）|
|||||（max.）|（typ.）|||||
|MCEK1210TR47MHN|RoHS|0.47|±20％|82|70|2.30|1.60|1|0.50|
|MCEK1210T1R0MHN|RoHS|1.0|±20％|179|157|1.50|1.10|1|0.50|
|MCEK1210T1R5MHN|RoHS|1.5|±20％|240|200|1.20|0.90|1|0.50|



## ●MC1608 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance<br>［mΩ］|DC Resistance<br>［mΩ］|Rated<br>current(Idc1)<br>［A］（max.）|Rated<br>current(Idc2)<br>［A］（max.）|Measuring<br>frequency<br>［MHz］|Thickness<br>［mm］（max.）|
|---|---|---|---|---|---|---|---|---|---|
|||||（max.）|（typ.）|||||
|MCFK1608TR24M|RoHS|0.24|±20％|50|40|2.30|2.10|1|0.60|
|MCFK1608TR47M|RoHS|0.47|±20％|85|69|1.90|1.60|1|0.60|
|MCFK1608T1R0M|RoHS|1.0|±20％|224|182|1.50|0.90|1|0.60|
|MCFE1608TR24MG|RoHS|0.24|±20％|100|75|2.60|1.50|1|0.65|
|MCFE1608TR47MG|RoHS|0.47|±20％|150|114|2.00|1.20|1|0.65|
|MCFE1608T1R0MG|RoHS|1.0|±20％|340|270|1.40|0.80|1|0.65|
|MCHK1608TR24MKN|RoHS|0.24|±20％|24|20|4.30|3.70|1|0.80|
|MCHK1608TR47MKN|RoHS|0.47|±20％|43|38|3.30|2.70|1|0.80|
|MCHK1608TR56MKN|RoHS|0.56|±20％|55|45|2.70|2.60|1|0.80|
|MCHK1608T1R0MKN|RoHS|1.0|±20％|110|89|2.20|1.60|1|0.80|
|MCHK1608T1R5MKN|RoHS|1.5|±20％|200|160|1.70|1.30|1|0.80|
|MCHK1608T2R2MKN|RoHS|2.2|±20％|292|237|1.50|1.20|1|0.80|
|MCKK1608TR24M N|RoHS|0.24|±20％|38|35|2.80|2.60|1|1.00|
|MCKK1608TR47M N|RoHS|0.47|±20％|55|44|2.40|2.00|1|1.00|
|MCKK1608T1R0M N|RoHS|1.0|±20％|123|100|2.00|1.30|1|1.00|



## ●MC2012 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance<br>［mΩ］|DC Resistance<br>［mΩ］|Rated<br>current(Idc1)<br>［A］（max.）|Rated<br>current(Idc2)<br>［A］（max.）|Measuring<br>frequency<br>［MHz］|Thickness<br>［mm］（max.）|
|---|---|---|---|---|---|---|---|---|---|
|||||（max.）|（typ.）|||||
|MCHK2012TR24M|RoHS|0.24|±20％|24|19|4.32|3.60|1|0.80|
|MCHK2012TR47M|RoHS|0.47|±20％|36|30|3.21|3.15|1|0.80|
|MCHK2012T1R0M|RoHS|1.0|±20％|111|90|2.26|1.47|1|0.80|
|MCKK2012TR24M|RoHS|0.24|±20％|25|20|6.20|4.00|1|1.00|
|MCKK2012TR47M|RoHS|0.47|±20％|39|32|4.50|3.10|1|1.00|
|MCKK2012T1R0M|RoHS|1.0|±20％|90|73|3.60|2.10|1|1.00|
|●MC2016||||||||||
|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance<br>［mΩ］||Rated<br>current(Idc1)<br>［A］（max.）|Rated<br>current(Idc2)<br>［A］（max.）|Measuring<br>frequency<br>［MHz］|Thickness<br>［mm］（max.）|
|||||（max.）|（typ.）|||||
|MCFE2016TR47MJG B|RoHS|0.47|±20％|45|40|4.0|3.20|1|0.65|
|MCFE2016TR68MJG B|RoHS|0.68|±20％|60|50|3.0|2.50|1|0.65|
|MCFE2016T1R0MJG B|RoHS|1.0|±20％|70|60|2.8|2.30|1|0.65|



|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|（max.）<br>（typ.）<br>DC Resistance<br>［mΩ］|（max.）<br>（typ.）<br>DC Resistance<br>［mΩ］|Rated<br>current(Idc1)<br>［A］（max.）|Rated<br>current(Idc2)<br>［A］（max.）|Measuring<br>frequency<br>［MHz］|Thickness<br>［mm］（max.）|
|---|---|---|---|---|---|---|---|---|---|
|MCFE2016TR47MJG B|RoHS|0.47|±20％|45|40|4.0|3.20|1|0.65|
|MCFE2016TR68MJG B|RoHS|0.68|±20％|60|50|3.0|2.50|1|0.65|
|MCFE2016T1R0MJG B|RoHS|1.0|±20％|70|60|2.8|2.30|1|0.65|



- ※Idc1 is the DC value at which the initial L value is decreased within 30% by the application of DC bias. （at 20℃） 

- ※Idc2 is the DC value at which the temperature of element is increased within 40℃ by the application of DC bias. （at 20℃） 

▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**39** 

Multilayer chip inductors Multilayer chip inductors for high frequency, Multilayer chip bead inductors Multilayer common mode choke coils（MC series F type） Metal Multilayer Chip Power Inductors (MCOIL[TM] MC series) 

## ■PACKAGING 

①Minimum Quantity 

**==> picture [328 x 565] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||||||
|---|---|---|---|---|---|---|---|
|●Tape & Reel Packaging|
|Thickness|Standard Quantity|［pcs］|
|Type|
|mm（inch）|Paper Tape|Embossed Tape|
|CK 1608|（0603）|aee|0.8|（0.031）|eee|4000|－|
|0.85|（0.033）|4000|－|
|CK 2125 （0805）|ee|ee|
|ee|1.25|（0.049）|－|2000|
|ee|0.85|（0.033）|4000|－|
|CKS2125 （0805）|
|ee|1.25|（0.049）|－|2000|
|CKP1608|（0603）|ee|0.95 max|（0.037 max）|4000|－|
|CKP2012|（0805）|ee|1.0 max|（0.039 max）|－|3000|
|CKP2016|（0806）|ee|1.0 max|（0.039 max）|－|3000|
|ee|0.8 max|（0.031 max）|ee|－|3000|
|CKP2520 （1008）|ee|1.0 max|（0.039 max）|－|3000|
|ee|1.2 max|（0.047 max）|－|2000|
|LK 1005|（0402）|ee|0.5|（0.020）|10000|－|
|LK 1608|（0603）|ee|0.8|（0.031）|4000|－|
|ee|0.85|（0.033）|4000|－|
|LK 2125 （0805）|
|ee|1.25|（0.049）|－|2000|
|HK 0603|（0201）|ee|0.3|（0.012）|15000|－|
|HK 1005|（0402）|ee|0.5|（0.020）|10000|－|
|HK 1608|（0603）|ee|0.8|（0.031）|4000|－|
|ee|0.85|（0.033）|－|4000|
|HK 2125 （0805）|
|ee|1.0|（0.039）|－|3000|
|HKQ0603S （0201）|ee|0.3 （0.012）|15000|－|
|HKQ0603U|（0201）|ee|0.3|（0.012）|15000|－|
|AQ 105|（0402）|ee|0.5|（0.020）|10000|－|
|BK 0603|（0201）|ee|0.3|（0.012）|15000|ee|－|
|BK 1005|（0402）|ee|0.5|（0.020）|10000|－|
|BKH0603|（0201）|ee|0.3|（0.012）|15000|－|
|BKH1005|（0402）|ee|0.5|（0.020）|10000|－|
|BK 1608|（0603）|ee|0.8|（0.031）|4000|－|
|ee|0.85|（0.033）|4000|－|
|BK 2125 （0805）|
|ee|1.25|（0.049）|－|2000|
|BK 2010|（0804）|ee|0.45|（0.018）|4000|－|
|BK 3216|（1206）|ee|0.8|（0.031）|－|4000|
|BKP0603|（0201）|ee|0.3|（0.012）|15000|－|
|BKP1005|（0402）|ee|0.5|（0.020）|10000|－|
|BKP1608|（0603）|ee|0.8|（0.031）|4000|－|
|BKP2125|（0805）|ee|0.85（0.033）|4000|－|
|MCF0605|（0202）|ee|0.3|（0.012）|15000|－|
|MCF0806|（0302）|ee|0.4|（0.016）|－|10000|
|MCF1210|（0504）|ee|0.55（0.022）|－|5000|
|MCF2010|（0804）|ee|0.45（0.018）|ee|－|4000|
|MCEE1005|（0402）|ee|0.55 max|（0.022 max）|10000|－|
|MCEK1210|（0504)|ee|0.5 max|（0.020 max）|5000|－|
|MCFK1608|（0603）|ee|0.6 max|（0.024 max）|4000|－|
|MCFE1608|（0603）|ee|0.65 max|（0.026 max）|4000|－|
|MCHK1608|（0603)|ee|0.8 max|（0.031 max）|4000|－|
|MCKK1608|（0603）|ee|1.0 max|（0.039 max）|-|3000|
|MCHK2012|（0806）|ee|0.8 max|（0.031 max）|4000|－|
|MCKK2012|（0805）|ee|1.0 max|（0.039 max）|-|3000|
|MCFE2016|（0806)|po|0.65 max|（0.026 max）|4000|－|

**----- End of picture text -----**<br>


▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_mlci_pack_e-E09R01 

**==> picture [408 x 490] intentionally omitted <==**

**----- Start of picture text -----**<br>
②Taping material<br>●Card board carrier tape<br>Top tape  CK  1608  BK  0603<br>CKP  1608  BK  1005<br>CK  2125  BK  1608<br>CKS  2125  BK  2125<br>'<\ —— LK  1005  BK  2010<br>LK  1608  BKP  0603<br>Base tape  LK  2125  BKP  1005<br>HK  0603  BKP  1608<br>HK  1005  BKP  2125<br>Sprocket hole  HK  1608  BKH  0603<br>HKQ  0603  BKH  1005<br>inom on;<br>AQ  105  MCF  0605<br>Bottom tape  Chip cavity  MC  1005<br>MC  1210<br>MC  1608<br>Chip Filled  MC  2012<br>MC  2016<br>coa8<br>Chip<br>●Embossed Tape<br>Top tape<br>CK  2125  BK  2125<br>CKS  2125  BK  3216<br>CKP  2012  MCF  0806<br>CKP  2016  MCF  1210<br>CKP  2520  MCF  2010<br>LK  2125  MC  1608<br>HK  2125  MC  2012<br>Sprocket hole<br>Om y:<br>Base tape  Chip cavity<br>Chip Filled<br>cao<br>Chip<br>**----- End of picture text -----**<br>


▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_mlci_pack_e-E09R01 

## ③Taping Dimensions 

- ●Paper tape (8mm wide)                      Unit：mm（inch） 

φ1.5＋0.1/－0 1.75±0.1 Sprocket hole (φ0.059＋0.004/-0) (0.069±0.004） ~~at le~~ T 7 Fy ~~Is~~ A a B ~~f~~ a ~~a~~ U ~~a a~~ F 4.0±0.1 

(0.157±0.004) 2.0±0.05 

(0.079±0.002) 

CK、CKS、CKP、LK、HK、HKQ、AQ、BK、BKP、BKH series 

|Type<br>HK 0603 （0201）||Thickness<br>Chipcavity<br>Ａ<br>~~—_———~~<br>~~a~~|Thickness<br>Chipcavity<br>Ａ<br>~~—_———~~<br>~~a~~|Thickness<br>Chipcavity<br>Ａ<br>~~—_———~~<br>~~a~~|Ｂ||Insertion Pitch<br>Ｆ|Tape Thickness<br>Ｔ|
|---|---|---|---|---|---|---|---|---|
|HKQ0603S （0201）|||||||||
|HKQ0603U （0201）||0.3|0.40||0.70||2.0±0.05|0.45max|
|BK 0603 （0201）||（0.012）|（0.016）||（0.028）||（0.079±0.002）|（0.018max）|
|BKH0603 （0201）|||||||||
|BKP0603（0201）|||||||||
|LK 1005 （0402）|||||||||
|HK 1005 （0402）<br>BK 1005 （0402）<br>BKH1005 （0402）||0.5<br>（0.020）|0.65<br>（0.026）||1.15<br>（0.045）||2.0±0.05<br>（0.079±0.002）|0.8max<br>（0.031max）|
|BKP1005（0402）|||||||||
|CK 1608 （0603）|||||||||
|LK 1608 （0603）<br>HK 1608 （0603）<br>BK 1608 （0603）<br>BKP1608（0603）||0.8<br>（0.031）|1.0<br>（0.039）||1.8<br>（0.071）||4.0±0.1<br>（0.157±0.004）|1.1max<br>（0.043max）|
|CKP1608 （0603）||0.95 max<br>（0.037max）|||||||
|BK 2010 （0804）||0.45<br>（0.018）|1.2<br>（0.047）||2.17<br>（0.085）||4.0±0.1<br>（0.157±0.004）|0.8max<br>（0.031max）|
|CK 2125 （0805）|||||||||
|CKS2125 （0805）<br>LK 2125 （0805）<br>BK 2125 （0805）||0.85<br>（0.033）|1.5<br>（0.059）||2.3<br>（0.091）||4.0±0.1<br>（0.157±0.004）|1.1max<br>（0.043max）|
|BKP2125（0805）|||||||||
|AQ 105 （0402）||0.5<br>（0.020）|0.75<br>（0.030）||1.15<br>（0.045）||2.0±0.05<br>（0.079±0.002）|0.8max<br>（0.031max）|
|||||||||Unit : mm（inch）|
|MC series F type|||||||||
|Type||Thickness|Chipcavity<br>Ａ||Ｂ||Insertion Pitch<br>Ｆ|Tape Thickness<br>Ｔ|
|MCF0605 （0202）||0.3<br>（0.012）|0.62<br>（0.024）||0.77<br>（0.030）||2.0±0.05<br>（0.079±0.002）|0.45max<br>（0.018max）|
|||||||||Unit : mm（inch）|
|MCOILTMMC series|||||||||
|Type|Thickness<br>~~Po ~~||Chipcavity<br>Insertion Pitch<br>Ａ<br>Ｂ<br>Ｆ<br> ~~Rf~~<br>~~ee~~|||||Tape Thickness<br>Ｔ|
|MCEE1005 （0402）||0.55 max<br>（0.021 max）|0.8<br>(0.031)||1.3<br>(0.051)||2.0±0.05<br>（0.079±0.002）|0.64max<br>(0.025max)|
|MCEK1210 （0504）||0.5 max<br>（0.020 max）|1.3<br>（0.051）||1.55<br>（0.061）||4.0±0.1<br>（0.157±0.004）|0.64max<br>(0.025max)|
|MCFK1608 （0603）||0.6 max<br>（0.024 max）|1.1<br>（0.043）||1.9<br>（0.075）||4.0±0.1<br>（0.157±0.004）|0.72max<br>(0.028max)|
|MCFE1608 （0603）||0.65 max<br>（0.026 max）|1.1<br>（0.043）||1.9<br>（0.075）||4.0±0.1<br>（0.157±0.004）|0.72max<br>(0.028max)|
|MCHK1608 （0603）||0.8 max<br>（0.031 max）|1.2<br>（0.047）||2.0<br>（0.079）||4.0±0.1<br>（0.157±0.004）|0.9max<br>(0.035max)|
|MCHK2012 （0805）||0.8 max<br>（0.031 max）|1.65<br>（0.065）||2.4<br>（0.094）||4.0±0.1<br>（0.157±0.004）|0.9max<br>（0.035max）|
|MCFE2016 （0806)||0.65 max<br>（0.026 max）|1.95<br>(0.077)||2.3<br>（0.091）||4.0±0.1<br>（0.157±0.004）|0.72max<br>(0.028max)|
|||||||||Unit : mm（inch）|



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_mlci_pack_e-E09R01 

**==> picture [266 x 138] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||
|---|---|---|---|---|
|●Embossed Tape (8mm wide)                     Unit：mm（inch）|
|φ1.5＋0.1/－0|1.75±0.1|
|Sprocket hole|(φ0.059＋0.004/-0)|(0.069±0.004）|
|A|
|OB|Gh|d|q.|.|
|B|
|BB|E}|||A|
|Pn Da|||
|F|4.0±0.1|
|(0.157±0.004)|
|2.0±0.05|
|(0.079±0.002)|

**----- End of picture text -----**<br>


## CK、CKS、CKP、LK、HK、BK series 

**==> picture [517 x 241] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||||
|---|---|---|---|---|---|
|Chip cavity|Insertion Pitch|Tape Thickness|
|Type|Thickness|
|Ａ|Ｂ|Ｆ|K|T|
|0.85|1.5max|
|（0.033）|（0.059 max）|
|HK 2125 （0805）|
|1.0|2.0 max|
|1.5|
|（0.039）|2.3|4.0±0.1|（0.079 max）|0.3max|
|（0.059）|
|CK 2125 （0805）|（0.091）|（0.157±0.004）|（0.012 max）|
|CKS2125 （0805）|1.25|2.0 max|
|LK 2125 （0805）|（0.049）|（0.079 max）|
|BK 2125|（0805）|
|0.8|1.9|3.5|4.0±0.1|1.4 max|0.3 max|
|BK 3216 （1206）|
|（0.031）|（0.075）|（0.138）|（0.157±0.004）|（0.055 max）|（0.012 max）|
|1.0 max|1.55|2.3|4.0±0.1|1.3 max|0.3 max|
|CKP2012 （0805）|
|（0.039 max）|（0.061）|（0.091）|（0.157±0.004）|（0.051 max）|（0.012 max）|
|1.0 max|1.8|2.2|4.0±0.1|1.3 max|0.25 max|
|CKP2016 （0806）|
|（0.039 max）|（0.071）|（0.087）|（0.157±0.004）|（0.051 max）|（0.01 max）|
|0.8 max|1.4 max|
|（0.031 max）|（0.055 max）|
|1.0 max|2.3|2.8|4.0±0.1|1.4 max|0.3 max|
|CKP2520 （1008）|
|（0.039 max）|（0.091）|（0.110）|（0.157±0.004）|（0.055 max）|（0.012 max）|
|1.2 max|1.7 max|
|（0.047 max）|（0.067 max）|
|単位 : mm（inch）|

**----- End of picture text -----**<br>


MC series F type 

**==> picture [514 x 178] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||||
|---|---|---|---|---|---|
|Chip cavity|Insertion Pitch|Tape Thickness|
|Type|Thickness|
|Ａ|Ｂ|Ｆ|K|T|
|0.4|0.75|0.95|2.0±0.05|0.55 max|0.3 max|
|MCF0806 （0302）|
|（0.016）|（0.030）|（0.037）|（0.079±0.002）|（0.022 max）|（0.012 max）|
|0.55|1.15|1.40|4.0±0.1|0.65 max|0.3 max|
|MCF1210 （0504）|
|（0.022）|（0.045）|（0.055）|（0.157±0.004）|（0.026 max）|（0.012 max）|
|0.45|1.1|2.3|4.0±0.1|0.85 max|0.3 max|
|MCF2010 （0804）|
|（0.018）|（0.043）|（0.091）|（0.157±0.004）|（0.033 max）|（0.012 max）|
|Unit : mm（inch）|
|[[TM]]|MC series|
|Chip cavity|Insertion Pitch|Tape Thickness|
|Type|Thickness|
|Ａ|Ｂ|Ｆ|K|T|
|1.0 max|1.1|1.95|4.0±0.1|1.5 max|0.3 max|
|MCKK1608 （0603）|
|（0.039 max）|（0.043）|(0.077)|（0.157±0.004）|（0.059 max）|（0.012 max）|
|1.0 max|1.55|2.35|4.0±0.1|1.45 max|0.3 max|
|MCKK2012 （0805）|
|（0.039 max）|（0.061）|（0.093）|（0.157±0.004）|（0.057 max）|（0.012 max）|
|Unit : mm（inch）|

**----- End of picture text -----**<br>


MCOIL[[TM]] MC series 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_mlci_pack_e-E09R01 

**==> picture [244 x 120] intentionally omitted <==**

**----- Start of picture text -----**<br>
④LEADER AND BLANK PORTION<br>Blank portion   Chip cavity   Blank portion    Leader<br>—_—— SS, -S a er "7<br>oo O O<br>li OU Of /|<br>160mm or more  100mm or more<br>(6.3inches or more)  (3.94inches or more)<br>— ee 400mm or more<br>Direction of tape feed  (15.7inches or more)<br>**----- End of picture text -----**<br>


## ⑤Reel Size 

**==> picture [515 x 308] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||||
|---|---|---|---|---|---|
|t|
|E|
|C|
|B|A|
|R|D|
|W|
|A|B|C|D|E|R|
|φ178±2.0|φ50 or more|φ13.0±0.2|φ21.0±0.8|2.0±0.5|1.0|
|t|W|
|4mm width tape|1.5max.|5±1.0|
|8mm width tape|2.5max.|10±1.5|
|(Unit : mm)|
|⑥Top tape strength|
|The top tape requires a peel-off force of 0.1 to 0.7N (*) in the direction of the arrow as illustrated below.   *) MCOIL|[TM]|MC series is 0.1 to 1.0N.|
|Pull direction|
|0～15°|Top tape|
|en es|
|TT.|CSSD|
|Base tape|

**----- End of picture text -----**<br>


▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_mlci_pack_e-E09R01 

## Multilayer chip inductors 

## Multilayer chip inductors for high frequency, Multilayer chip bead inductors Multilayer common mode choke coils（MC series F type） Metal Multilayer Chip Power Inductors (MCOIL[TM] MC series) 

## ■RELIABILITY DATA 

|1. OperatingTemperature Range|1. OperatingTemperature Range||
|---|---|---|
||BK series<br>BKH series<br>~~Pp~~<br>~~po~~|－55～＋125℃|
||BKP series<br>~~po~~|－55～＋125℃(BKP0603: -55～+85℃)|
||MCF series<br>~~po~~|－40～＋85℃|
||CK series<br>~~pO~~||
|Specified Value|CKS series<br>CKP series<br>~~po~~<br>~~po~~|－40～＋85℃|
||LK series<br>~~po~~||
||HK0603,HK1005<br>~~po~~|－55～＋125℃|
||HK1608,HK2125<br>~~po~~|－40～＋85℃|
||HKQ0603<br>AQ105<br>~~po~~<br>~~po~~|－55～＋125℃|
||MCOILTMMC series<br>~~pT~~|－40～＋125℃（Includingself-generated heat）|
||||
|2. Storage Temperature Range|||
||BK series<br>BKH series<br>~~pO~~<br>~~po~~|－55～＋125℃|
||BKP series<br>~~po~~|－55～＋125℃(BKP0603: -55～+85℃)|
||MCF series<br>~~po~~|－40～＋85℃|
||CK series<br>~~po~~||
|Specified Value|CKS series<br>CKP series<br>~~pO~~<br>~~po~~|－40～＋85℃|
||LK series<br>~~po~~||
||HK0603,HK1005<br>~~po~~|－55～＋125℃|
||HK1608,HK2125<br>~~po~~|－40～＋85℃|
||HKQ0603<br>AQ105<br>~~po~~<br>~~po~~|－55～＋125℃|
||MCOILTMMC series<br>~~po~~|－40～＋85℃|
||||
|3. Rated Current|||
||BK series<br>BKH series<br>~~po~~<br>~~po~~|The temperature of the element is increased within 20℃.|
||BKP series<br>~~po~~|The temperature of the element is increased within 40℃|
||MCF series<br>~~po~~|Refer to each specification.|
||CK series<br>CKS series<br>~~po~~<br>~~po~~|The temperature of the element is increased within 20℃.|
|Specified Value|CKP series<br>LK series<br>~~pO~~<br>~~po~~|The temperature of the element is increased within 40℃<br>The decreasing-rate of inductance value is within 5 %|
||HK0603,HK1005<br>~~pO~~||
||HK1608,HK2125<br>~~pO~~|The decreasing-rate of inductance value is within 5 %, or the temperature of the element is|
||HKQ0603<br>~~po~~|increased within 20℃|
||AQ105<br>~~po~~||
||MCOILTMMC series|Idc1:  The decreasing-rate of inductance value is within 30 %<br>Idc2:  The temperature of the element is increased within 40℃|



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http: //www.ty-top.com/) . 

i_mlci_reli_e-E09R01 

|4. Impedance||||
|---|---|---|---|
||BK series|||
|Specified Value|BKH series<br>BKP series||Refer to each specification.|
||MCF series|||
||BK0603 series, BKP0603 series|||
||Measuring frequency|:  100±1MHz|:  100±1MHz|
||Measuring equipment|:  4991A（or its equivalent）|:  4991A（or its equivalent）|
||Measuring jig|:  16193A（or its equivalent）, 16197A（or its equivalent）|:  16193A（or its equivalent）, 16197A（or its equivalent）|
||BK(except 0603) series, BKP(except 0603) series|||
||Measuring frequency|:  100±1MHz|:  100±1MHz|
||Measuring equipment|:  4291A（or its equivalent）, 4195A（or its equivalent）|:  4291A（or its equivalent）, 4195A（or its equivalent）|
|Test Methods and|Measuring jig|:  16192A（or its equivalent）, HW: 16193A（or its equivalent）|:  16192A（or its equivalent）, HW: 16193A（or its equivalent）|
|Remarks||||
||BKH series|||
||Measuring frequency|:  100±1MHz, 1GHz±1MHz|:  100±1MHz, 1GHz±1MHz|
||Measuring equipment|:  4991A（or its equivalent）|:  4991A（or its equivalent）|
||Measuring jig|:  16193A（or its equivalent）, 16197A（or its equivalent）|:  16193A（or its equivalent）, 16197A（or its equivalent）|
||MCF series|||
||Measuring frequency|:  100±1MHz|:  100±1MHz|
||Measuringequipment|:  4291A|:  4291A（or its equivalent）|
|||||
|5. Inductance||||
||CK series|||
||CKS series|||
||CKP series|||
||LK series|||
|Specified Value|HK0603,HK1005||Refer to each specification.|
||HK1608,HK2125|||
||HKQ0603|||
||AQ105|||
||MCOILTMMC series|||
||CK、CKS、LK series|||
||Measuring frequency||:  Refer to each specification.|
||Measuring equipment /jig||:  1608,2125⇒4294A＋16092A（or its equivalent）|
||||1005⇒4291A＋16193A（or its equivalent）|
||Measuring current||:  047～4.7μH ⇒1mArms 、 5.6～33μH ⇒0.1mArms|
||CKP、MCOILTMMC series|||
||Measuring frequency||:  1MHz|
||Measuring equipment||:  4285A（or its equivalent）|
|Test Methods and|HK0603、HK1005、AQ series|||
|Remarks|Measuring frequency||:  100MHz|
||Measuring equipment /jig||:  HK0603⇒ E4991A+16197A（or its equivalent） , AQ105⇒4291A＋16197A（or its equivalent）|
||||HK1005⇒ 4291A＋16193A（or its equivalent）|
||HK1608、HK2125 series|||
||Measuring frequency||:  ～100nH⇒100MHz 、120nH～⇒50MHz|
||Measuring equipment /jig||:  4291A＋16092A（or its equivalent）|
||HKQ series|||
||Measuring frequency||:  500MHz|
||Measuringequipment /jig||:  E4991A＋16197A（or its equivalent）|



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http: //www.ty-top.com/) . 

i_mlci_reli_e-E09R01 

|6. Q|||||
|---|---|---|---|---|
||LK series||||
||HK0603,HK1005||||
|Specified Value|HK1608,HK2125|||Refer to each specification.|
||HKQ0603||||
||AQ105||||
||LK series||||
||Measuring frequency|:  Refer to each specification.|:  Refer to each specification.||
||Measuring equipment /jig :  1608,2125⇒4294A＋16092A（or its equivalent）、 1005⇒4291A＋16193A（or its equivalent）|Measuring equipment /jig :  1608,2125⇒4294A＋16092A（or its equivalent）、 1005⇒4291A＋16193A（or its equivalent）|Measuring equipment /jig :  1608,2125⇒4294A＋16092A（or its equivalent）、 1005⇒4291A＋16193A（or its equivalent）||
||Measuring current|:  047～4.7μH ⇒1mArms 、 5.6～33μH ⇒0.1mArms|:  047～4.7μH ⇒1mArms 、 5.6～33μH ⇒0.1mArms||
||HK0603、HK1005、AQ series||||
||Measuring frequency||:  100MHz||
|Test Methods and<br>Remarks|Measuring equipment /jig||:  HK0603⇒E4991A＋16197A（or its equivalent） , AQ105⇒4291A＋16197A（or its equivalent）<br>HK1005⇒4291A＋16193A（or its equivalent）||
||HK1608、HK2125 series||||
||Measuring frequency||:  ～100nH⇒100MHz 、120nH～⇒50MHz||
||Measuring equipment /jig||:  4291A＋16092A（or its equivalent）||
||HKQ series||||
||Measuring frequency||:  500MHz||
||Measuringequipment /jig||:  E4991A＋16197A（or its equivalent）||
||||||
|7. DC Resistance|||||
||BK series||||
||BKH series||||
||BKP series||||
||MCF series||||
||CK series||||
||CKS series||||
|Specified Value|CKP series|||Refer to each specification.|
||LK series||||
||HK0603,HK1005||||
||HK1608,HK2125||||
||HKQ0603||||
||AQ105||||
||MCOILTMMC series||||
|Test Methods and<br>Remarks|Measuring equipment: IWATSU VOAC7512, HIOKI RM3545 (or its equivalent)||||
||||||
|8. Self Resonance Frequency（SRF）|||||
||CK series<br>CKS series<br>~~pO~~<br>~~po~~|||Refer to each specification.|
||LK series<br>~~po~~||||
||HK0603,HK1005<br>~~po~~||||
||HK1608,HK2125<br>~~po~~|||Refer to each specification.|
||HKQ0603<br>~~po~~||||
||AQ105<br>~~po~~||||
||LK、CK series :||||
||Measuring equipment|:  4195A（or its equivalent）|:  4195A（or its equivalent）|:  4195A（or its equivalent）|
|Test Methods and|Measuring jig|:  16092A（or its equivalent）|:  16092A（or its equivalent）||
|Remarks|||||
||HK、HKQ、AQ series :||||
||Measuringequipment|:  8719C|:  8719C（or its e|or its equivalent）|



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http: //www.ty-top.com/) . 

i_mlci_reli_e-E09R01 

**==> picture [527 x 733] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||
|---|---|---|
|9. Resistance to Flexure of Substrate|
|BK series|
|BKH series|
|BKP series|
|MCF series|
|CK series|
|CKS series|
|Specified Value|CKP series|No mechanical damage.|
|LK series|
|HK0603, HK1005|
|HK1608, HK2125|
|HKQ0603|
|AQ105|
|MCOIL|[TM]|MC series|
|Warp|:  2mm（BK series、BKP、BKH1005、CK、CKS、CKP、LK、HK、HKQ0603S、HKQ0603U、AQ series、MCF1210、MC|
|series）|
|:  1mm（BKH0603、MCF series without 1210 size,）|
|Testing board|:  glass epoxy-resin substrate|
|Thickness|:  0.8mm|
|20|
|Test Methods and|
|Remarks|R-230|
|Board|Warp|
|||
|Deviation±1|
|45|45|
|H|er|
|（Unit：mm）|
|10. Solderability|
|BK series|
|BKH series|
|BKP series|
|MCF series|
|CK series|
|CKS series|
|Specified Value|CKP series|At least 90％ of terminal electrode is covered by new solder.|
|LK series|
|HK0603, HK1005|
|HK1608, HK2125|
|HKQ0603|
|AQ105|
|MCOIL|[TM]|MC series|
|Solder temperature|: 230±5℃ (JIS Z 3282 H60A or H63A)|
|Test Methods and|
|Solder temperature|: 245±3℃ (Sn/3.0Ag/0.5Cu)|
|Remarks|
|Duration|: 4±1 sec.|
|11. Resistance to Soldering|
|BK series|
|Appearance: No significant abnormality|
|BKH series|
|Impedance change: Within ±30％|
|BKP series|
|Appearance: No significant abnormality|
|MCF series|
|Impedance change: Within ±20％|
|Appearance: No significant abnormality|
|CK series|
|Inductance change:  R10～4R7⇒Within ±10％、 6R8～100⇒Within ±15％|
|OC|
|Appearance: No significant abnormality|
|CKS series|
|Inductance change: Within ±20％|
|Appearance: No significant abnormality|
|Specified Value|CKP series|
|Inductance change: Within ±30％|
|OC|
|Appearance: No significant abnormality|
|LK series|Inductance change: 1005⇒Within ±15％|
|1608,2125⇒ 47N～4R7:  Within ±10％  5R6～330:  Within ±15％|
|HK0603, HK1005|
|HK1608, HK2125|Appearance: No significant abnormality|
|HKQ0603|Inductance change:  Within ±5％|
|AQ105|
|Appearance: No significant abnormality|
|MCOIL|[TM]|MC series|
|Inductance change:  Within ±10％|
|OC|

**----- End of picture text -----**<br>


> ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http: //www.ty-top.com/) . 

i_mlci_reli_e-E09R01 

|12. Thermal Shock<br>~~—)~~|~~—)~~||
|---|---|---|
|Specified Value<br>~~—)~~|BK series<br>~~—)~~|Appearance: No significant abnormality<br>Impedance change:  Within ±30％|
||BKH series||
||BKP series||
||MCF series|Appearance: No significant abnormality<br>Impedance change:  Within ±20％|
||CK series|Appearance: No significant abnormality<br>Inductance change: Within ±20％|
||CKS series||
||CKP series|Appearance: No significant abnormality<br>Inductance change:  Within ±30％|
||LK series|Appearance: No significant abnormality<br>Inductance change:  Within ±10％ Q change:  Within ±30％|
||HK0603,HK1005|Appearance: No significant abnormality<br>Inductance change:  Within ±10％ Q change:  Within ±20％|
||HK1608,HK2125||
||HKQ0603||
||AQ105||
||MCOILTMMC series|Appearance: No significant abnormality<br>Inductance change:  Within ±10％|
|Test Methods and<br>Remarks|BK、BKP（0603 を除く）、BKH、HK0603、HK1005、HKQ、AQ series<br>Conditions for 1 cycle<br>Step<br>temperature（℃）<br>time（min.）<br>1<br>-55 ＋0/－3<br>30±3<br>2<br>Room temperature<br>2～3<br>3<br>+125 ＋3/－0<br>30±3<br>4<br>Room temperature<br>2～3<br>Number of cycles:  5<br>Recovery:  2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）<br>BKP0603 series<br>Conditions for 1 cycle<br>Step<br>temperature（℃）<br>time（min.）<br>1<br>-55 ＋0/－3<br>30±3<br>2<br>Room temperature<br>2～3<br>3<br>+85 ＋3/－0<br>30±3<br>4<br>Room temperature<br>2～3<br>Number of cycles:  5<br>Recovery:  2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）<br>MCF、CK、CKS、CKP 、LK、HK1608、HK2125、MCOILTMMC＊series<br>Conditions for 1 cycle<br>Step<br>temperature（℃）<br>time（min.）<br>1<br>-40 ＋0/－3<br>30±3<br>2<br>Room temperature<br>2～3<br>3<br>+85 ＋3/－0<br>30±3<br>4<br>Room temperature<br>2～3<br>Number of cycles:  5（* MCOILTMMC series: 100)<br>Recovery:  2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）<br>~~———~~<br>~~———~~<br>~~———~~||



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http: //www.ty-top.com/) . 

i_mlci_reli_e-E09R01 

13. Damp Heat（ Steady state） 

|Specified Value|BK series<br>~~po~~|Appearance: No significant abnormality<br>Impedance change:  Within ±30％|
|---|---|---|
||BKH series<br>~~po~~<br>~~po~~||
||BKP series<br>~~po~~<br>~~po~~||
||MCF series|Appearance: No significant abnormality<br>Impedance change:  Within ±20％|
||CK series<br>~~po~~|Appearance: No significant abnormality<br>Inductance change:  Within ±20％|
||CKS series<br>~~po~~||
||CKP series|Appearance: No significant abnormality<br>Inductance change:  Within ±30％|
||LK series|Appearance: No significant abnormality<br>Inductance change:  1005,1608⇒Within ±10％  2125⇒Within ±20％<br>Q change:  Within ±30％|
||HK0603,HK1005<br>~~pO~~|Appearance: No significant abnormality<br>Inductance change:  Within ±10％ Q change:  Within ±20％|
||HK1608,HK2125<br>~~pO~~||
||HKQ0603<br>~~po~~||
||AQ105<br>~~po~~<br>~~po~~||
||MCOILTMMC series|Appearance: No significant abnormality<br>Inductance change:  Within ±10％|
|Test Methods and<br>Remarks|BK、BKP、BKH、LK、CK、CKS、CKP、MCF series<br>Temperature  :  40±2℃<br>Humidity<br>:  90 to 95％RH<br>Duration<br>:  500 +24/-0 hrs<br>Recovery<br>:  2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）<br>HK、HKQ、AQ、MCOILTMMC series<br>Temperature<br>:  60±2℃<br>Humidity<br>:  90 to 95％RH<br>Duration<br>:  500 +24/-0 hrs<br>Recovery<br>:  2 to 3 hrs of recoveryunder the standard condition after the removal from test chamber.（See Note 1）||



|Specified Value|BK series<br>~~pT~~|Appearance: No significant abnormality<br>Impedance change:  Within ±30％|
|---|---|---|
||BKH series<br>~~pO~~||
||BKP series<br>~~po~~||
||CK series<br>~~pO~~|Appearance: No significant abnormality<br>Inductance change:  Within ±20％|
||CKS series<br>~~po~~||
||CKP series|Appearance: No significant abnormality<br>Inductance change:  Within ±30％|
||LK series|Appearance: No significant abnormality<br>Inductance change:  1005⇒Within ±10％<br>1608⇒0.047～12.0μH:  Within ±10％  15.0～33.0μH:  Within ±15％<br>2125⇒Within ±20％<br>Q change:  Within ±30％|
||HK0603,HK1005<br>~~po~~|Appearance: No significant abnormality<br>Inductance change:  Within ±10％ Q change:  Within ±20％|
||HK1608,HK2125<br>~~po~~||
||HKQ0603<br>~~pO~~||
||AQ105<br>~~po~~||
||MCOILTMMC series|Appearance: No significant abnormality<br>Inductance change:  Within ±10％|
|Test Methods and<br>Remarks|BK、BKP、BKH、LK、CK、CKS、CKP series<br>Temperature<br>: 40±2℃<br>Humidity<br>: 90 to 95％RH<br>Applied current<br>: Rated current<br>Duration<br>: 500 +24/-0 hrs<br>Recovery<br>: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）<br>HK、HKQ、AQ、MCOILTMMC*series<br>Temperature<br>: 60±2℃<br>Humidity<br>: 90 to 95％RH<br>Applied current<br>: Rated current (*MCOILTMMC series ; Idc2max)<br>Duration<br>: 500 +24/-0 hrs<br>Recovery<br>: 2 to 3 hrs of recoveryunder the standard condition after the removal from test chamber.（See Note 1）||



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http: //www.ty-top.com/) . 

i_mlci_reli_e-E09R01 

|15. Loadingat High Tem|h Temperature||
|---|---|---|
|Specified Value|BK series<br>~~po~~|Appearance: No significant abnormality<br>Impedance change:  Within ±30％|
||BKH series<br>~~po~~<br>~~po~~||
||BKP series<br>~~po~~<br>~~po~~||
||MCF series|Appearance: No significant abnormality<br>Impedance change:  Within ±20％|
||CK series<br>~~po~~|Appearance: No significant abnormality<br>Inductance change:  Within ±20％|
||CKS series<br>~~po~~||
||CKP series|Appearance: No significant abnormality<br>Inductance change:  Within ±30％|
||LK series|Appearance: No significant abnormality<br>Inductance change:  1005⇒Within ±10％<br>1608⇒0.047～12.0μH:  Within ±10％  15.0～33.0μH:  Within ±15％<br>2125⇒Within ±20％<br>Q change:  Within ±30％|
||HK0603,HK1005<br>~~pO~~|Appearance: No significant abnormality<br>Inductance change:  Within ±10％ Q change:  Within ±20％|
||HK1608,HK2125<br>~~pO~~<br>~~po~~||
||HKQ0603<br>~~po~~||
||AQ105<br>~~po~~||
||MCOILTMMC series※|Appearance: No significant abnormality<br>Inductance change:  Within ±10％|
|Test Methods and<br>Remarks|BK、BKP（except 0603）＊、BKH、HK0603、HK1005＊、HKQ、AQ series<br>Temperature<br>:  125±2℃<br>Applied current :  Rated current （* BKP series and HK1005 series apply the rated current of 125℃.）<br>Duration<br>:  500 +24/-0 hrs<br>Recovery<br>:  2 to 3 hrs of recovery under the standard condition after the removal from test chamber. （See Note 1）<br>BKP0603、MCF、CK、CKS、CKP 、LK、HK1608、HK2125、MCOILTMMC＊＊series<br>Temperature<br>:  85±2℃<br>Applied current :  Rated current（** MCOILTMMC series ; Idc2max）<br>Duration<br>:  500 +24/-0 hrs<br>Recovery<br>:  2 to 3 hrs of recoveryunder the standard condition after the removal from test chamber.（See Note 1）||



(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition. 

"standard condition" referred to herein is defined as follows: 

5 to 35℃ of temperature, 45 to 85% relative humidity. 

When there are questions concerning measurement results: 

In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http: //www.ty-top.com/) . 

i_mlci_reli_e-E09R01 

Metal Multilayer Chip Power Inductors (MCOIL[TM ] MC series) 

## ■PRECAUTIONS 

1. Circuit Design ◆Verification of operating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. 

2. When inductors are used in places where dew condensation develops and/or where corrosive gas such as hydrogen sulfide, sulfurous acid, or chlorine exists in the air, characteristic deterioration may occur. Please do not use inductors under such environmental 

Precautions conditions. ◆Operating Current（Verification of Rated current） 1. The operating current including inrush current for inductors must always be lower than their rated values. 2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect. 

◆Temperature rise Temperature rise of power choke coil depends on the installation condition in end products. Make sure that temperature rise of power choke coils in actual end products is within the specified temperature range. 

**==> picture [537 x 546] intentionally omitted <==**

**----- Start of picture text -----**<br>
2. PCB Design<br>◆Pattern configurations（Design of Land-patterns）<br>When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor<br>performance. Therefore, the following items must be carefully considered in the design of solder land patterns:<br>（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or<br>cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder<br>pads which in turn determines the amount of solder necessary to form the fillets.<br>Precautions  （2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's<br>soldering point is separated by solder-resist.<br>◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）<br>After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing<br>processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered<br>boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to minimize<br>stress.<br>◆Pattern configurations（Design of Land-patterns）<br>The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts. Examples of<br>improper pattern designs are also shown.<br>（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs<br>（Unit：mm）<br>A  B  A<br>1608  1608<br>Type  1005  1210  2012  2016<br>(Except MCHK)  (MCHK)<br>A  0.4  0.45  0.45  0.65  0.5  0.7<br>C<br>B  0.5  0.6  1.0  0.6  1.2  0.8<br>C  0.7  1.15  1.0  1.0  1.45  1.8<br>soars f it<br>（２）Examples of good and bad solder application<br>Item  Not recommended  Recommended<br>Lead wire of component  Solder-resist<br>Technical<br>Mixed mounting of SMD and<br>considerations<br>leaded components<br>Ta a<br>Chassis<br>Solder (for grounding)  Solder-resist<br>Component placement close to<br>the chassis<br>Electrode pattern<br>|<br>Lead wire of component<br>Be Boe<br>Soldering iron<br>Hand-soldering of leaded  Solder-resist<br>components near mounted<br>components<br>P= 4a<br>▶  This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.<br>For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .<br>**----- End of picture text -----**<br>


i_mlci_MC_prec_e-E09R01 

**==> picture [461 x 332] intentionally omitted <==**

**----- Start of picture text -----**<br>
Solder-resist<br>Horizontal component<br>placement<br>◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）<br>1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical<br>stresses from board warp or deflection.<br>Item  Not recommended  Recommended<br>Position the component at a<br>right angle to the direction of<br>Deflection of the board<br>the mechanical stresses that<br>i are anticipated.<br>1<br>2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending<br>on inductor layout.<br>An example below should be counted for better design.<br>E<br>D<br>ial 7<br>Perforation<br>C<br>‘Me oeoe<br>A<br>B<br>A Slit  / a<br>Magnitude of stress  A＞B＝C＞D＞E<br>**----- End of picture text -----**<br>


- ◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards） 

3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure. 

## 3. Considerations for automatic placement 

**==> picture [530 x 305] intentionally omitted <==**

**----- Start of picture text -----**<br>
◆Adjustment of mounting machine<br>Precautions  1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.<br>2. The maintenance and inspection of the mounter should be conducted periodically.<br>◆Adjustment of mounting machine<br>1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the<br>following points should be considered before lowering the pick-up nozzle:<br>（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the<br>board.<br>（2） The pick-up pressure should be adjusted between 1 and 3N static loads.<br>（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be<br>used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:<br>Item  Improper method  Proper method<br>RsGe<br>chipping<br>Technical  Single-sided mounting  or cracking<br>considerations<br>——_T |__— supporting pins  —Sy<br>or back-up pins<br>aes<br>Double-sided mounting<br>Toy chipping  saa supporting pins  VET) INE<br>or cracking  or back-up pins<br>oo<br>2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical<br>impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance,<br>inspection and replacement of the pin should be conducted periodically.<br>**----- End of picture text -----**<br>


- This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_mlci_MC_prec_e-E09R01 

|4. Soldering|
|---|
|◆Reflow soldering|
|・ Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.|
|・ The product shall be used reflow soldering only.|
|・ Please do not add any stress to a product until it returns in normal temperature after reflow soldering.|
|Precautions<br>◆Lead free soldering<br>・ When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering|
|heat, soldering etc sufficiently.|
|◆The conditions for Reworking with soldering irons|
|・Put the soldering iron on the land-pattern and don’t touch it to the inductor directly.|
|Soldering iron's temperature below 350 degC , Duration 3 seconds or less|
|◆Reflow soldering|
|・ If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently|
|degrade the reliability of the products.|
|Recommended reflow condition (Pb free solder)|
|Technical<br>considerations<br>5sec max<br>40sec max<br>230℃ min<br>90±30sec<br>Peak：260+0/-5℃<br>150～180<br>300<br>200<br>100<br>0<br>Temperature［℃］<br>~~t~~s|
|Heating Time［sec］|
|The allowable number of reflow soldering is 3 times.|
||
|5. Cleaning|
|Precautions<br>◆Cleaning conditions<br>・ Washing by supersonic waves shall be avoided.|
|Technical<br>◆Cleaning conditions|
|considerations<br>・ If washed by supersonic waves, the products might be broken.|
||
|6. Resin coatingand mold|
|1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or|
|while left under normal storage conditions resulting in the deterioration of the inductor's performance.|
|Precautions<br>2. Thermal expansion and thermal shrinkage characteristics of resins may lead to the deterioration of inductors’performance.<br>3. When a resin hardening temperature is higher than inductor operating temperature, the stresses generated by the excessive heat may|
|lead to damage in inductors.|
|4. In prior to use, please make the reliability evaluation with the product mounted in your application set.|
||
|7. Handling|
|◆Breakaway PC boards（splitting along perforations）|
|1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection|
|or twisting to the board.|
|2. Board separation should not be done manually, but by using the appropriate devices.|
|◆General handling precautions|
|・Always wear static control bands to protect against ESD.|
|・ Keep the inductors away from all magnets and magnetic objects.|
|Precautions<br>・ Use non-magnetic tweezers when handling inductors.<br>・ Any devices used with the inductors（ soldering irons, measuring instruments） should be properly grounded.|
|・ Keep bare hands and metal products（i.e., metal desk）away from inductor electrodes or conductive areas that lead to chip electrodes.|
|・ Keep inductors away from items that generate magnetic fields such as speakers or coils.|
|◆Mechanical considerations|
|Be careful not to subject the inductors to excessive mechanical shocks.|
|（1） If inductors are dropped on the floor or a hard surface they should not be used.|
|（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other|
|boards or components.|



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_mlci_MC_prec_e-E09R01 

## 8. Storage conditions 

|Precautions|◆Storage<br>To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control<br>temperature and humidity in the storage area. Humidity should especially be kept as low as possible.<br>・Recommended conditions<br>Ambient temperature: 30℃ or below   Humidity: 70% RH or below<br>The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of inductor is deteriorated as time<br>passes, so inductors should be used within 6 months from the time of delivery.<br>・Inductor should be kept where no chlorine or sulfur exists in the air.|
|---|---|
|Technical<br>considerations|◆Storage<br>If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of<br>terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6<br>months from the time of delivery. If exceeding the above period, please check solderability before using the inductors.|



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_mlci_MC_prec_e-E09R01 

**for General Electronic Equipment** 

## METAL CORE SMD POWER INDUCTORS（MCOILTM MD SERIES） 

## ■PARTS NUMBER 

*Operating Temp.：-40～+125℃（Including self-generated heat） 

||M|D||K|K||1|6|1|<br>6  T||1|R|0||M||M||△|△|△＝Blank space|△＝Blank space||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||①|||②||||③||④|||⑤|||⑥||⑦||⑧|||||
|①Series name||||||||||||||||||||⑤Nominal inductance|||||
|||Code<br>MD||||||Metal|Series name<br>base coil specification|||||||||||||Code<br>（example）||Nominal inductance［μH］|
|||||||||||||||||||||||R47||0.47|
|②Dimensions（H）||||||||||||||||||||||1R0||1.0|
|||Code||||||Dimensions（H）［mm］||||||||||||||4R7||4.7|
|||JE||||||||0.95||||||||||※R＝Decimal point|||||
|||KK||||||||1.0|||||||||||||||
|||MK||||||||1.2||||||||||⑥Inductance tolerance|||||
|||PK||||||||1.4||||||||||||Code||Inductance tolerance|
|||WK||||||||2.0||||||||||||M||±20％|
|||||||||||||||||||||||N||±30％|
|③Dimensions（L×W）|||||||||||||||||||||||||
|||Code||||||Dimensions（L×W）［mm］||||||||||||⑦Special code|||||
|||1616||||||||1.6×1.6||||||||||||Code||Special code|
|||2020||||||||2.0×2.0||||||||||||F||Ferrite coating|
|||3030||||||||3.0×3.0||||||||||||M||Metal coating|
|||4040||||||||4.0×4.0|||||||||||||||
|||5050||||||||4.9×4.9||||||||||⑧Internal code|||||
|④Packaging|||||||||||||||||||||||||
|||Code||||||||Packaging|||||||||||||||
|||T||||||||Taping|||||||||||||||



■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY 

|Recommended Land Patterns<br>W<br>L<br>H<br>f<br>e<br>e<br>B<br>A<br>A<br>C|Type|A|B|C|
|---|---|---|---|---|
||1616|0.5|1.10|1.65|
||2020|0.65|1.35|2.0|
||<br>3030|<br>0.8|<br>2.2|<br>2.7|
||4040|1.2|2.8|3.7|
||5050|1.5|3.6|4.2|
|||||Unit：mm|



|Type|L|W|H|e|f|Standard quantity<br>［pcs］Taping|
|---|---|---|---|---|---|---|
|MDKK1616|1.64±0.1<br>(0.065±0.004)|1.64±0.1<br>(0.065±0.004)|1.0 max<br>(0.039 max)|0.40 +0.2/-0.1<br>(0.016 +0.008/-0.004)|1.0±0.2<br>(0.039±0.008)|2500|
|MDJE2020|2.0±0.15<br>(0.079±0.006)|2.0±0.15<br>(0.079±0.006)|0.95 max<br>(0.037 max)|0.50±0.2<br>(0.02±0.008)|1.25±0.2<br>(0.049±0.008)|2500|
|MDKK2020|2.0±0.15<br>(0.079±0.006)|2.0±0.15<br>(0.079±0.006)|1.0 max<br>(0.039 max)|0.50±0.2<br>(0.02±0.008)|1.25±0.2<br>(0.049±0.008)|2500|
|MDMK2020|2.0±0.15<br>(0.079±0.006)|2.0±0.15<br>(0.079±0.006)|1.2 max<br>(0.047 max)|0.50±0.2<br>(0.02±0.008)|1.25±0.2<br>(0.049±0.008)|2500|
|MDKK3030|3.0±0.1<br>(0.118±0.004)|3.0±0.1<br>(0.118±0.004)|1.0 max<br>(0.039 max)|0.90±0.2<br>(0.035±0.008)|1.9±0.2<br>(0.075±0.008)|2000|
|MDMK3030|3.0±0.1<br>(0.118±0.004)|3.0±0.1<br>(0.118±0.004)|1.2 max<br>(0.047 max)|0.90±0.2<br>(0.035±0.008)|1.9±0.2<br>(0.075±0.008)|2000|
|MDJE4040|4.0±0.2<br>(0.157±0.008)|4.0±0.2<br>(0.157±0.008)|0.95 max<br>(0.037 max)|1.1±0.2<br>(0.043±0.008)|2.5±0.2<br>(0.098±0.008)|1000|
|MDMK4040|4.0±0.2<br>(0.157±0.008)|4.0±0.2<br>(0.157±0.008)|1.2 max<br>(0.047 max)|1.1±0.2<br>(0.043±0.008)|2.5±0.2<br>(0.098±0.008)|1000|
|MDWK4040|4.0±0.2<br>(0.157±0.008)|4.0±0.2<br>(0.157±0.008)|2.0 max<br>(0.079 max)|1.1±0.2<br>(0.043±0.008)|2.5±0.2<br>(0.098±0.008)|700|
|MDPK5050|4.9±0.2<br>(0.193±0.008)|4.9±0.2<br>(0.193±0.008)|1.4 max<br>(0.055 max)|1.20±0.2<br>(0.047±0.008)|3.3±0.2<br>(0.130±0.008)|1000|
||||||||



▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**40** 

**for General Electronic Equipment** 

■PARTS NUMBER 

## ●MDKK1616 type 【Thickness：1.0mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance［Ω］|DC Resistance［Ω］|Rated current ※）［ｍA］|Rated current ※）［ｍA］|Rated current ※）［ｍA］|Rated current ※）［ｍA］|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|---|---|
|||||||Saturation current: Idc1||Temperature rise current: Idc2|||
|||||Max.|Typ.|Max.|Typ.|Max.|Typ.||
|MDKK1616TR47MM|RoHS|0.47|±20％|0.095|0.080|3,300|4,100|1,500|1,780|1|
|MDKK1616T1R0MM|RoHS|1.0|±20％|0.140|0.120|2,200|2,750|1,200|1,490|1|
|MDKK1616T1R5MM|RoHS|1.5|±20％|0.185|0.160|1,750|2,200|1,100|1,330|1|
|MDKK1616T2R2MM|RoHS|2.2|±20％|0.250|0.215|1,500|1,800|950|1,110|1|
|MDKK1616T3R3MM|RoHS|3.3|±20％|0.515|0.450|1,150|1,450|650|730|1|
|MDKK1616T4R7MM|RoHS|4.7|±20％|0.640|0.550|950|1,200|550|630|1|
|MDKK1616T6R8MM|RoHS|6.8|±20％|0.820|0.710|630|880|520|600|1|
|MDKK1616T100MM|RoHS|10|±20％|1.120|0.970|550|800|450|500|1|
|MDKK1616T150MM|RoHS|15|±20％|1.800|1.600|460|640|400|440|1|



## ●MDJE2020 type 【Thickness：0.95mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance［Ω］|DC Resistance［Ω］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|---|---|
|||||||Saturation current: Idc1||Temperature rise current: Idc2|||
|||||Max.|Typ.|Max.|Typ.|Max.|Typ.||
|MDJE2020T1R0MM|RoHS|1.0|±20％|0.121|0.106|3,100|3,800|1,550|1,800|1|
|MDJE2020T2R2MM|RoHS|2.2|±20％|0.266|0.230|1,550|1,900|1,050|1,200|1|
|MDJE2020T3R3MM|RoHS|3.3|±20％|0.340|0.290|1,350|1,600|950|1,100|1|
|MDJE2020T4R7MM|RoHS|4.7|±20％|0.475|0.410|1,200|1,550|850|950|1|
|MDJE2020T6R8MM|RoHS|6.8|±20％|0.630|0.550|800|1,100|750|850|1|
|MDJE2020T100MM|RoHS|10|±20％|1.040|0.910|700|900|550|600|1|



## ●MDKK2020 type 【Thickness：1.0mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance［Ω］|DC Resistance［Ω］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|---|---|
|||||||Saturation current: Idc1||Temperature rise current: Idc2|||
|||||Max.|Typ.|Max.|Typ.|Max.|Typ.||
|MDKK2020TR47MM|RoHS|0.47|±20％|0.046|0.040|3,500|4,150|2,200|2,500|1|
|MDKK2020TR68MM|RoHS|0.68|±20％|0.060|0.052|3,200|3,650|2,000|2,100|1|
|MDKK2020T1R0MM|RoHS|1.0|±20％|0.085|0.074|2,900|3,400|1,700|1,900|1|
|MDKK2020T1R5MM|RoHS|1.5|±20％|0.133|0.115|1,900|2,250|1,350|1,500|1|
|MDKK2020T2R2MM|RoHS|2.2|±20％|0.165|0.139|1,650|1,950|1,200|1,350|1|
|MDKK2020T3R3MM|RoHS|3.3|±20％|0.275|0.240|1,300|1,550|940|1,050|1|
|MDKK2020T4R7MM|RoHS|4.7|±20％|0.435|0.375|1,050|1,250|750|850|1|
|MDKK2020T100MM|RoHS|10|±20％|0.690|0.600|750|900|630|680|1|
|MDKK2020T150MM|RoHS|15|±20％|1.180|1.020|550|750|480|550|1|



## ●MDMK2020 type 【Thickness：1.2mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance［Ω］|DC Resistance［Ω］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|---|---|
|||||||Saturation current: Idc1||Temperature rise current: Idc2|||
|||||Max.|Typ.|Max.|Typ.|Max.|Typ.||
|MDMK2020TR47MM|RoHS|0.47|±20％|0.046|0.040|4,200|4,800|2,300|2,450|1|
|MDMK2020TR68MM|RoHS|0.68|±20％|0.058|0.050|3,500|4,100|2,000|2,200|1|
|MDMK2020T1R0MM|RoHS|1.0|±20％|0.064|0.056|2,550|2,900|1,900|2,050|1|
|MDMK2020T1R5MM|RoHS|1.5|±20％|0.086|0.075|2,000|2,300|1,650|1,750|1|
|MDMK2020T2R2MM|RoHS|2.2|±20％|0.109|0.095|1,750|2,000|1,450|1,550|1|
|MDMK2020T3R3MM|RoHS|3.3|±20％|0.178|0.155|1,350|1,550|1,150|1,200|1|
|MDMK2020T4R7MM|RoHS|4.7|±20％|0.242|0.210|1,150|1,300|950|1,050|1|



## ●MDKK3030 type 【Thickness：1.0mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance［Ω］|DC Resistance［Ω］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|---|---|
|||||||Saturation current: Idc1||Temperature rise current: Idc2|||
|||||Max.|Typ.|Max.|Typ.|Max.|Typ.||
|MDKK3030TR47MM|RoHS|0.47|±20％|0.039|0.033|5,400|6,500|3,900|4,500|1|
|MDKK3030T1R0MM|RoHS|1.0|±20％|0.086|0.074|4,400|5,200|2,400|2,800|1|
|MDKK3030T1R5MM|RoHS|1.5|±20％|0.100|0.087|3,000|3,500|2,100|2,400|1|
|MDKK3030T2R2MM|RoHS|2.2|±20％|0.144|0.125|2,500|3,000|1,900|2,200|1|
|MDKK3030T3R3MM|RoHS|3.3|±20％|0.248|0.215|2,000|2,400|1,350|1,500|1|
|MDKK3030T4R7MM|RoHS|4.7|±20％|0.345|0.300|1,700|2,000|1,150|1,300|1|
|MDKK3030T6R8MM|RoHS|6.8|±20％|0.437|0.380|1,400|1,700|1,000|1,150|1|
|MDKK3030T100MM|RoHS|10|±20％|0.575|0.500|1,100|1,300|850|1,000|1|



## ●MDMK3030 type 【Thickness：1.2mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance［Ω］|DC Resistance［Ω］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|---|---|
|||||||Saturation current: Idc1||Temperature rise current: Idc2|||
|||||Max.|Typ.|Max.|Typ.|Max.|Typ.||
|MDMK3030TR30MM|RoHS|0.30|±20％|0.020|0.017|7,600|9,200|5,500|6,400|1|
|MDMK3030TR33MM|RoHS|0.33|±20％|0.020|0.017|6,400|8,700|5,500|6,400|1|
|MDMK3030TR47MM|RoHS|0.47|±20％|0.027|0.023|6,300|7,500|4,700|5,500|1|
|MDMK3030T1R0MM|RoHS|1.0|±20％|0.050|0.043|4,300|5,100|3,300|3,900|1|
|MDMK3030T1R5MM|RoHS|1.5|±20％|0.074|0.064|3,400|4,100|2,500|3,000|1|
|MDMK3030T2R2MM|RoHS|2.2|±20％|0.112|0.097|2,800|3,600|2,100|2,400|1|
|MDMK3030T3R3MM|RoHS|3.3|±20％|0.167|0.145|2,100|2,700|1,650|1,900|1|
|MDMK3030T4R7MM|RoHS|4.7|±20％|0.263|0.228|1,800|2,300|1,350|1,550|1|



▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**41** 

## **for General Electronic Equipment** 

■PARTS NUMBER 

## ●MDJE4040 type 【Thickness：0.95mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance［Ω］|DC Resistance［Ω］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|---|---|
|||||||Saturation current: Idc1||Temperature rise current: Idc2|||
|||||Max.|Typ.|Max.|Typ.|Max.|Typ.||
|MDJE4040TR47MM|RoHS|0.47|±20％|0.040|0.035|6,000|7,900|4,000|4,500|1|
|MDJE4040T1R0MM|RoHS|1.0|±20％|0.069|0.060|4,700|5,700|3,000|3,500|1|
|MDJE4040T1R5MM|RoHS|1.5|±20％|0.084|0.073|3,000|4,000|2,700|3,100|1|
|MDJE4040T2R2MM|RoHS|2.2|±20％|0.115|0.100|2,400|3,100|2,400|2,700|1|
|MDJE4040T3R3MM|RoHS|3.3|±20％|0.200|0.175|2,000|2,600|1,800|2,000|1|
|MDJE4040T4R7MM|RoHS|4.7|±20％|0.250|0.220|1,900|2,300|1,600|1,900|1|
|MDJE4040T6R8MM|RoHS|6.8|±20％|0.370|0.320|1,500|1,800|1,300|1,500|1|
|MDJE4040T100MM|RoHS|10|±20％|0.510|0.440|1,400|1,700|1,100|1,300|1|



## ●MDMK4040F type 【Thickness：1.2mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance［Ω］|DC Resistance［Ω］|Rated current※） ［ｍA］|Rated current※） ［ｍA］|Rated current※） ［ｍA］|Rated current※） ［ｍA］|Measuring<br>frequency［kHz］|
|---|---|---|---|---|---|---|---|---|---|---|
|||||||Saturation current: Idc1||Temperature rise current: Idc2|||
|||||Max.|Typ.|Max.|Typ.|Max.|Typ.||
|MDMK4040TR47MF|RoHS|0.47|±20％|0.029|0.025|7,500|10,000|4,600|5,400|100|
|MDMK4040T1R0MF|RoHS|1.0|±20％|0.047|0.041|5,200|7,500|3,500|4,200|100|
|MDMK4040T1R2MF|RoHS|1.2|±20％|0.047|0.041|4,200|6,200|3,500|4,200|100|
|MDMK4040T1R5MF|RoHS|1.5|±20％|0.065|0.056|3,700|5,400|3,300|3,600|100|
|MDMK4040T2R2MF|RoHS|2.2|±20％|0.092|0.080|3,200|4,500|2,500|2,900|100|



## ●MDMK4040 type 【Thickness：1.2mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance［Ω］|DC Resistance［Ω］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|---|---|
|||||||Saturation current: Idc1||Temperature rise current: Idc2|||
|||||Max.|Typ.|Max.|Typ.|Max.|Typ.||
|MDMK4040TR68MM|RoHS|0.68|±20％|0.029|0.025|6,700|7,800|5,000|5,700|1|
|MDMK4040T1R0MM|RoHS|1.0|±20％|0.036|0.031|5,000|6,200|4,500|5,100|1|
|MDMK4040T1R5MM|RoHS|1.5|±20％|0.065|0.056|4,500|5,600|3,200|3,600|1|
|MDMK4040T2R2MM|RoHS|2.2|±20％|0.079|0.069|3,800|4,500|2,800|3,200|1|
|MDMK4040T3R3MM|RoHS|3.3|±20％|0.130|0.113|3,200|4,000|2,200|2,500|1|
|MDMK4040T4R7MM|RoHS|4.7|±20％|0.160|0.140|2,500|3,000|1,900|2,200|1|
|MDMK4040T6R8MM|RoHS|6.8|±20％|0.230|0.200|1,900|2,200|1,600|1,800|1|
|MDMK4040T100MM|RoHS|10|±20％|0.330|0.280|1,700|2,000|1,400|1,600|1|



## ●MDWK4040 type 【Thickness：2.0mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance［Ω］|DC Resistance［Ω］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|---|---|
|||||||Saturation current: Idc1||Temperature rise current: Idc2|||
|||||Max.|Typ.|Max.|Typ.|Max.|Typ.||
|MDWK4040TR33NM|RoHS|0.33|±30％|0.013|0.011|16,000|21,000|7,800|8,800|1|
|MDWK4040TR47NM|RoHS|0.47|±30％|0.013|0.011|10,000|15,000|7,800|8,800|1|
|MDWK4040TR56NM|RoHS|0.56|±30％|0.016|0.014|9,000|13,000|6,500|7,500|1|
|MDWK4040TR68MM|RoHS|0.68|±20％|0.016|0.014|8,000|12,000|7,300|8,300|1|
|MDWK4040T1R0MM|RoHS|1.0|±20％|0.027|0.023|7,000|9,400|5,100|5,800|1|
|MDWK4040T1R5MM|RoHS|1.5|±20％|0.041|0.035|7,000|9,400|4,100|4,700|1|
|MDWK4040T2R2MM|RoHS|2.2|±20％|0.054|0.047|5,400|7,500|3,500|4,000|1|
|MDWK4040T3R3MM|RoHS|3.3|±20％|0.075|0.066|3,700|5,200|3,000|3,300|1|
|MDWK4040T4R7MM|RoHS|4.7|±20％|0.107|0.093|3,500|5,000|2,500|2,800|1|
|MDWK4040T6R8MM|RoHS|6.8|±20％|0.158|0.138|2,900|4,000|2,000|2,300|1|
|MDWK4040T100MM|RoHS|10|±20％|0.194|0.169|2,200|3,100|1,600|1,900|1|
|MDWK4040T220MM|RoHS|22|±20％|0.460|0.400|1,500|2,100|1,200|1,400|1|
|MDWK4040T330MM|RoHS|33|±20％|0.720|0.625|1,200|1,700|800|1,000|1|



## ●MDPK5050 type 【Thickness：1.4mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|DC Resistance［Ω］|DC Resistance［Ω］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Rated current ※） ［ｍA］|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|---|---|
|||||||Saturation current: Idc1||Temperature rise current: Idc2|||
|||||Max.|Typ.|Max.|Typ.|Max.|Typ.||
|MDPK5050T1R0MM|RoHS|1.0|±20％|0.040|0.034|8,500|10,000|4,300|4,700|1|
|MDPK5050T2R2MM|RoHS|2.2|±20％|0.055|0.047|4,100|5,000|3,600|4,200|1|
|MDPK5050T3R3MM|RoHS|3.3|±20％|0.086|0.073|3,800|4,500|2,900|3,400|1|
|MDPK5050T4R7MM|RoHS|4.7|±20％|0.102|0.088|3,500|4,200|2,500|3,000|1|
|MDPK5050T6R8MM|RoHS|6.8|±20％|0.138|0.12|2,700|3,200|2,200|2,500|1|
|MDPK5050T100MM|RoHS|10|±20％|0.225|0.19|2,200|2,600|1,700|2,000|1|



- ※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃) 

- ※） The temperature rise current value（Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃) 

- ※） The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value. 

▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**42** 

METAL CORE SMD POWER INDUCTORS (MCOIL[TM] MD SERIES） 

## ■PACKAGING 

**==> picture [497 x 619] intentionally omitted <==**

**----- Start of picture text -----**<br>
①Minimum Quantity<br>Standard Quantity [pcs]<br>Type<br>Tape ＆ Reel<br>MDKK1616  2500<br>MDJE2020<br>MDKK2020  2500<br>MDMK2020<br>MDKK3030<br>2000<br>MDMK3030<br>MDJE4040<br>1000<br>MDMK4040<br>MDWK4040  700<br>MDPK5050  1000<br>②Tape Material<br>●Embossed Tape<br>Top tape<br>= |<br>DDOjC( ‘ee Chip Filled<br>|<br>Sprocket hole<br>} /* HOddg<br>Base tape  Chip cavity  Chip<br>③Taping dimensions<br>●Embossed tape 8mm wide (0.315 inches wide)<br>φ1.5＋0.1/－0 1.75±0.1<br>Sprocket hole (φ0.059＋0.004/-0) (0.069±0.004） le T<br>:<br>OO G-D— po n<br>k—| A<br>B<br>K<br>F 4.0±0.1<br>Tt (0.157±0.004) th ig<br>2.0±0.05 ml<br>(0.079±0.002) Electrode（bottom view）<br>Chip cavity Insertion pitch  Tape thickness<br>Type<br>A  B  F  T  K<br>1.79±0.1  1.79±0.1  4.0±0.1  0.25±0.05  1.1±0.1<br>MDKK1616<br>(0.071±0.004)  (0.071±0.004)  (0.157±0.004)  (0.010±0.002)  (0.043±0.004)<br>MDJE2020<br>2.2±0.1  2.2±0.1  4.0±0.1  0.25±0.05  1.3±0.1<br>MDKK2020<br>（0.102±0.004）  （0.102±0.004）  （0.157±0.004）  （0.009±0.002）  （0.051±0.004）<br>MDMK2020<br>MDKK3030  3.2±0.1  3.2±0.1  4.0±0.1  0.3±0.05  1.4±0.1<br>MDMK3030  (0.126±0.004)  (0.126±0.004)  (0.157±0.004)  (0.012±0.002)  (0.055±0.004)<br>Unit：mm（inch）<br>3.5±0.1 8.0±0.2<br>(0.138±0.004) (0.315±0.008)<br>**----- End of picture text -----**<br>


▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_smd_MD_pack_e-E09R01 

## ●Embossed tape 12mm wide (0.47 inches wide) 

**==> picture [494 x 233] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||||||
|---|---|---|---|---|---|---|---|---|
|φ1.5＋0.1/－0|1.75±0.1|
|Sprocket|hole|(φ0.059＋0.004/-0)|(0.069±0.004）|
|a)|T|
|;|
|OO|G--O-O--O-|a|e|
|A|
|k—||
|B|
|I|e -|epee pe|7|-|s|5|7|,|
|K|
|EN:|Pan|Pa|>||L|toed.|
|F|2.0±0.1|4.0±0.1|
|(0.079±0.004)|(0.157±0.004)|Electrode（bottom view）|
|Chip cavity|Insertion pitch|Tape thickness|
|Type|
|A|B|F|T|K|
|MDJE4040|4.3±0.1|4.3±0.1|8.0±0.1|0.3±0.05|1.6±0.1|
|MDMK4040|（0.169±0.004）|（0.169±0.004）|（0.315±0.004）|（0.012±0.002）|（0.063±0.004）|
|4.3±0.1|4.3±0.1|8.0±0.1|0.3±0.05|2.3±0.1|
|MDWK4040|
|（0.169±0.004）|（0.169±0.004）|（0.315±0.004）|（0.012±0.002）|（0.091±0.004）|
|5.25±0.1|5.25±0.1|8.0±0.1|0.3±0.1|1.6±0.1|
|MDPK5050|
|（0.207±0.004）|（0.207±0.004）|（0.315±0.004）|（0.012±0.004）|（0.063±0.004）|
|Unit：mm（inch）|

**----- End of picture text -----**<br>


## ④Leader and Blank portion 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_smd_MD_pack_e-E09R01 

⑤Reel size 

|Type|φD|Reel size (Reference values)<br>φd|Reel size (Reference values)<br>φd|Reel size (Reference values)|Reel size (Reference values)||W|W|
|---|---|---|---|---|---|---|---|---|
|MDKK1616|||||||||
|MDJE2020|||||||||
|MDKK2020|180±0.5||60±1.0|||10.0±1.5|||
|MDMK2020|（7.087±0.019）||（2.36±0.04）|（2.36±0.04）||（0.394±0.059）|||
|MDKK3030|||||||||
|MDMK3030|||||||||
|MDJE4040|||||||||
|MDMK4040|180±3.0||60±2.0|||14.0±1.5|||
|MDWK4040|（7.087±0.118）||（2.36±0.08）|（2.36±0.08）||（0.551±0.059）|||
|MDPK5050|||||||||
|||||||Unit：mm（inch）|||
|⑥TopTape Strength|||||||||
|Top tape strength|||||||||
|Type|Peel-off strength|th|||||||
|MDKK1616|||||||||
|MDJE2020|||||||||
|MDKK2020<br>MDMK2020<br>MDKK3030|0.1N～1.0N|||165||a,<br>|\|2|
|MDMK3030|||||||||
|MDJE4040|||||||||
|MDMK4040<br>MDWK4040|0.1N～1.3N||||||||
|MDPK5050|||||||||



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_smd_MD_pack_e-E09R01 

METAL CORE SMD POWER INDUCTORS (MCOIL[TM] MD SERIES） 

## ■RELIABILITY DATA 

1. Operating Temperature Range Specified Value MD series －40～＋125℃ Test Methods and Including self-generated heat Remarks 2. Storage Temperature Range Specified Value MD series －40～＋85℃ Test Methods and －5 to 40℃ for the product with taping. Remarks 

## 3. Rated current 

|3. Rated current||||
|---|---|---|---|
|Specified Value|MD series||Within the specified tolerance|
|||||
|4. Inductance||||
|Specified Value|MD series||Within the specified tolerance|
|Test Methods and|Measuring equipment|: LCR Meter （HP 4285A or equivalent）||
|Remarks|Measuring condition|: Please see item list.||
|||||
|5. DC Resistance||||
|Specified Value|MD series||Within the specified tolerance|
|Test Methods and<br>Remarks|Measuring equipment|: DC ohmmeter （HIOKI 3227 or equivalent）||
|||||
|6. Self resonance frequency||||
|Specified Value|MD series||－|



## 7. Temperature characteristic 

|Specified Value|MD series<br>Inductance change : Within ±10%|
|---|---|
|Test Methods and|Measurement of inductance shall be taken at temperature range within －40℃～＋125℃.|
|Remarks|With reference to inductance value at ＋20℃., change rate shall be calculated.|



## 8. Resistance to flexure of substrate 

|Specified Value|MD series||No damage|||||||
|---|---|---|---|---|---|---|---|---|---|
||The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating|||The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating||The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating|||The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating|
||until deflection of the test board reaches to 2 mm.|||||||||
||Test board size|: 100×40×1.0 mm|: 100×40×1.0 mm|Force||Rod|10 <2,|||
|Test Methods and|Test board material|: Glass epoxy-resin|||||'R230||||
|Remarks|Solder cream thickness|: 0.10 mm|||||as y|||
|||||||||ss|Board|||
|||||RS||||“4”TestSample<br>| | |<br>45+2mm pig fSt2mm||||
|||||||||||
|9. Insulation resistance : between wires||||||||||
|Specified Value|MD series||－|||||||
|||||||||||
|10. Insulation resistance : between wire and core||||||||||
|Specified Value|MD series||－|||||||
|||||||||||
|11. Withstandingvoltage : between wire and core||||||||||
|Specified Value|MD series||－|||||||



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_smd_MD_reli_e-E04R01 

|12. Adhesion of terminal electrode|||
|---|---|---|
|Specified Value<br>MD series<br>Shall not come off PC board<br>Test Methods and<br>Remarks<br>The test samples shall be soldered to the test board by the reflow.<br>Applied force<br>: 10N to X and Y directions.<br>Duration<br>: 5s.<br>Solder cream thickness<br>: 0.10mm.<br>~~fo~~|||
|13. Resistance to vibration|||
|Specified Value<br>MD series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>Test Methods and<br>Remarks<br>The test samples shall be soldered to the test board by the reflow.<br>Then it shall be submitted to below test conditions.<br>FrequencyRange<br>10～55Hz<br>Total Amplitude<br>1.5mm (Maynot exceed acceleration 196m/s2)<br>SweepingMethod<br>10Hz to 55Hz to 10Hz for 1min.<br>Time<br>X<br>For 2 hours on each X, Y, and Z axis.<br>Y<br>Z<br>Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.<br>~~_~~|||
|14. Solderability|||
|Specified Value<br>MD series<br>At least 90％ of surface of terminal electrode is covered by new solder.<br>Test Methods and<br>Remarks<br>The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.<br>Flux : Methanol solution containingrosin 25%.<br>Solder Temperature<br>245±5℃<br>Time<br>5±1.0 sec.<br>※Immersion depth : All sides of mounting terminal shall be immersed.<br>~~—~~|||
|15. Resistance to solderingheat|||
|Specified Value<br>MD series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>Test Methods and<br>Remarks<br>The test sample shall be exposed to reflow oven at 230±5℃ for 40 seconds, with peak temperature at 260±5℃ for 5 seconds, 2 times.<br>Test board material<br>: Glass epoxy-resin<br>Test board thickness<br>: 1.0mm<br>~~ns~~|||
|16. Thermal shock|||
|Specified Value<br>MD series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>Test Methods and<br>Remarks<br>The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified<br>time bystep1 to step4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles.<br>Conditions of 1 cycle<br>Step<br>Temperature (℃)<br>Duration (min)<br>1<br>－40±3<br>30±3<br>2<br>Room temperature<br>Within 3<br>3<br>＋85±2<br>30±3<br>4<br>Room temperature<br>Within 3<br>~~i_~~|||
|17. Dampheat|||
|Specified Value<br>MD series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.|||
|The test samples shall be soldered to the test board by the reflow.|||
|Test Methods and<br>Remarks<br>The test samples shall beplaced in thermostatic oven set at specified temperature and humidity as shown in below table.<br>Temperature<br>60±2℃<br>Humidity<br>90～95%RH<br>Time<br>500＋24/－0 hour<br>~~ae~~|||



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_smd_MD_reli_e-E04R01 

||18. Loadingunder dampheat|18. Loadingunder dampheat|18. Loadingunder dampheat||
|---|---|---|---|---|
|Specified Value<br>MD series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>Test Methods and<br>Remarks<br>The test samples shall be soldered to the test board by the reflow.<br>The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current<br>continuouslyas shown in below table.<br>Temperature<br>60±2℃<br>Humidity<br>90～95％RH<br>Applied current<br>Rated current<br>Time<br>500＋24/－0 hour<br>~~=~~|||||
||19. Low temperature life test||erature life test||
||Specified Value|MD series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.|||
||Test Methods and|The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown<br>in below table.|||
||Remarks|Temperature<br>－40±2℃<br>Time<br>500＋24/－0 hour<br>~~——~~|||
||||||
||20. High temperature life test||erature life test||
||Specified Value|MD series<br>－|||
||||||
||21. Loading at high temperature life test||||
||Specified Value|MD series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.|||
|||The test samples shall be soldered to the test board by the reflow.||The test samples shall be soldered to the test board by the reflow.|
||Test Methods and|The test samples shall be placed in thermostatic oven set at specified temperature and applied the rated current continuously as shown in<br>below table.|||
||Remarks|Temperature<br>85±2℃<br>Applied current<br>Rated current<br>Time<br>500＋24/－0 hour<br>~~—~~|||



22. Standard condition Standard test condition : Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity. Specified Value MD series When there is any question concerning measurement result: In order to provide correlation data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity. Inductance is in accordance with our measured value. ~~re~~ 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_smd_MD_reli_e-E04R01 

METAL CORE SMD POWER INDUCTORS (MCOIL[TM] MD SERIES） 

## ■PRECAUTIONS 

|1. Circuit Design|n|
|---|---|
||◆Operating environment|
||1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,|
|Precautions|telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical<br>equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear|
||control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or|
||damage. For such uses, contact TAIYO YUDEN Sales Department in advance.|
|||
|2. PCB Design||
|Precautions|◆Land pattern design<br>1. Please refer to a recommended land pattern.|
||◆Land pattern design|
|Technical|Surface Mounting|
|considerations|・ Mounting and soldering conditions should be checked beforehand.|
||・ Applicable soldering process to this products is reflow soldering only.|
|||
|3. Considerations for automatic placement||
||◆Adjustment of mounting machine|
|Precautions|1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.|
||2. Mounting and soldering conditions should be checked beforehand.|
|Technical|◆Adjustment of mounting machine|
|considerations|1. When installing products, care should be taken not to apply distortion stress as it may deform the products.|
|||
|4. Soldering||
||◆Reflow soldering|
||1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.|
||2. The product shall be used reflow soldering only.|
||3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.|
||◆Lead free soldering|
|Precautions|1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering<br>heat, soldering etc sufficiently.|
||◆Recommended conditions for using a soldering iron (NR10050 Type)|
||・ Put the soldering iron on the land-pattern.|
||・ Soldering iron's temperature - Below 350℃|
||・ Duration - 3 seconds or less|
||・ The soldering iron should not directly touch the inductor.|
||◆Reflow soldering|
||1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently|
||degrade the reliability of the products.|
||・NR30/40/50/60/80, NRV20/30, NRH24/30, NRS20/40/50/60/80 Type, NR10050 Type, NS101/125 Type|
||Recommended reflow condition (Pb free solder)|
||300<br>5sec max|
|Technical<br>considerations|2<br>Peak:<br>mS<br>150~180<br>eak<br>g<br>250+5/—0°C<br>§200- NY<br>|<br>ao|
||a<br>|<br>30+10sec<br>ge 100<br>90+30sec<br>| 230°C min|
||o<br>ke|
||0<br>Heating Time[sec]|
|||
|5. Cleaning||
|Precautions|◆Cleaning conditions<br>1. Washing by supersonic waves shall be avoided.|
|Technical|◆Cleaning conditions|
|considerations|1. If washed by supersonic waves, the products might be broken.|



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_smd_MD_prec_e-E02R01 

|6. Handling||
|---|---|
|Precautions|◆Handling<br>1. Keep the product away from all magnets and magnetic objects.<br>◆Breakaway PC boards (splitting along perforations)<br>1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.<br>2. Board separation should not be done manually, but by using the appropriate devices.<br>◆Mechanical considerations<br>1. Please do not give the product any excessive mechanical shocks.<br>2. Please do not add any shock and power to a product in transportation.<br>◆Pick-up pressure<br>1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.<br>◆Packing<br>1. Please avoid accumulation of a packing box as much as possible.<br>◆Board mounting<br>1. There shall be no pattern or via between terminals at the bottom of product.<br>2. Components which are located in peripheral of product shall not make contact with surface (top, side) of product.|
|Technical<br>considerations|◆Handling<br>1. There is a case that a characteristic varies with magnetic influence.<br>◆Breakaway PC boards (splitting along perforations)<br>1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.<br>◆Mechanical considerations<br>1. There is a case to be damaged by a mechanical shock.<br>2. There is a case to be broken by the handling in transportation.<br>◆Pick-up pressure<br>1. Damage and a characteristic can vary with an excessive shock or stress.<br>◆Packing<br>1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.<br>◆Board mounting<br>1. If there is pattern or via between terminals at the bottom of product, it may cause characteristics change.<br>2. If components which are located in peripheral of product make contact with surface (top, side) of product, it may cause damage or<br>characteristics change.|



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_smd_MD_prec_e-E02R01 

**for General Electronic Equipment** METAL CORE WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM MA SERIES） 

## ■PARTS NUMBER 

* Operating Temp.：-40～+105℃（Including self-generated heat） 

|M A||K|K||2|0|<br>1|<br>6|T|1|R|0||M||△||△|△|△＝Blank space|△＝Blank space||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|①||②|||||③||④|<br>⑤||||⑥||⑦||⑧|||||
|①Series name||||||||||||||||||⑤Nominal inductance|||||
|Code<br>MA|||Metal|||Series name<br>Core Wire-wound Chip||||<br>Power Inductor||||||||||Code<br>（example）||Nominal inductance［μH］|
|||||||||||||||||||||R47||0.47|
|②Dimensions（T）||||||||||||||||||||1R0||1.0|
|Code|||||||Dimensions（T）［mm］|||||||||||||4R7||4.7|
|KK||||||||1.0||||||||||※R＝Decimal point|||||
|MK||||||||1.2|||||||||||||||
|||||||||||||||||||⑥Inductance tolerance|||||
|③Dimensions（L×W）||||||||||||||||||||Code||Inductance tolerance|
|Code|||||Type（inch）||||Dimensions<br>（L×W）［mm］|||||||||||M||±20％|
|2016|||||2016（0806）|||||2.0×1.6||||||||⑦Special code|||||
|2520|||||2520（1008）|||||2.5×2.0||||||||||Code||Special code|
|||||||||||||||||||||△||Standard|
|④Packaging|||||||||||||||||||||||
|Code||||||||Packaging||||||||||⑧Internal code|||||
|T||||||||Taping|||||||||||||||



## ■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY 

|L<br>T<br>e|W||Recommended Land Patterns<br>Surface Mounting<br>・Mounting and soldering conditio<br>・Applicable soldering process to<br>A<br>A<br>B<br>C|Recommended Land Patterns<br>Surface Mounting<br>・Mounting and soldering conditio<br>・Applicable soldering process to<br>A<br>A<br>B<br>C|ns s<br>the|hould be chec<br>seproducts is|ked beforehand.<br>reflow solderingonly.|ked beforehand.<br>reflow solderingonly.||
|---|---|---|---|---|---|---|---|---|---|
|||||||Type|A|B|C|
|||||||2016|0.７|0.8|1.8|
|||||||2520|0.8|1.2|2.0|
|||||||||||
|Type|L|W|T|e|||Standard quantity［pcs］|||
||||||||Taping|||
|MAKK2016|2.0±0.1<br>（0.079±0.004）|1.6±0.1<br>（0.063±0.004）|1.0 max<br>（0.039 max）|0.5±0.3<br>（0.020±0.012）|||3000|||
|MAKK2520|2.5±0.2<br>（0.098±0.008）|2.0±0.2<br>（0.079±0.008）|1.0 max<br>（0.039 max）|0.5±0.3<br>（0.020±0.012）|||3000|||
|MAMK2520|2.5±0.2<br>（0.098±0.008）|2.0±0.2<br>（0.079±0.008）|1.2 max<br>（0.047 max）|0.5±0.3<br>（0.020±0.012）|||3000|||
|||||||||||



▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**43** 

## **for General Electronic Equipment** 

■PARTS NUMBER 

|●MAKK2016（0806）type<br>【Thickness：1.0mm max.】|●MAKK2016（0806）type<br>【Thickness：1.0mm max.】|●MAKK2016（0806）type<br>【Thickness：1.0mm max.】|●MAKK2016（0806）type<br>【Thickness：1.0mm max.】|●MAKK2016（0806）type<br>【Thickness：1.0mm max.】|●MAKK2016（0806）type<br>【Thickness：1.0mm max.】||||
|---|---|---|---|---|---|---|---|---|
|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※） ［ｍA］（max.）||Measuring<br>frequency［MHz］|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MAKK2016TR24M|RoHS|0.24|±20％|-|0.037|4,200|3,000|2|
|MAKK2016TR33M|RoHS|0.33|±20％|-|0.040|3,600|3,200|2|
|MAKK2016TR47M|RoHS|0.47|±20％|-|0.460|3,200|2,800|2|
|MAKK2016TR68M|RoHS|0.68|±20％|-|0.065|2,500|2,500|2|
|MAKK2016T1R0M|RoHS|1.0|±20％|-|0.075|2,200|2,200|2|
|MAKK2016T1R5M|RoHS|1.5|±20％|-|0.130|1,600|1,650|2|
|MAKK2016T2R2M|RoHS|2.2|±20％|-|0.160|1,500|1,500|2|
|MAKK2016T3R3M|RoHS|3.3|±20％|-|0.255|1,150|1,200|2|
|MAKK2016T4R7M|RoHS|4.7|±20％|-|0.380|1,000|950|2|



|●MAKK2520（1008）type<br>【Thickness：1.0mm max.】|●MAKK2520（1008）type<br>【Thickness：1.0mm max.】|●MAKK2520（1008）type<br>【Thickness：1.0mm max.】|●MAKK2520（1008）type<br>【Thickness：1.0mm max.】|●MAKK2520（1008）type<br>【Thickness：1.0mm max.】|●MAKK2520（1008）type<br>【Thickness：1.0mm max.】||||
|---|---|---|---|---|---|---|---|---|
|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※）［ｍA］（max.）||Measuring<br>frequency［MHz］|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MAKK2520TR33M|RoHS|0.33|±20％|-|0.038|4,700|3,500|2|
|MAKK2520TR47M|RoHS|0.47|±20％|-|0.046|3,900|3,200|2|
|MAKK2520TR68M|RoHS|0.68|±20％|-|0.059|3,700|2,900|2|
|MAKK2520T1R0M|RoHS|1.0|±20％|-|0.072|2,700|2,500|2|
|MAKK2520T1R5M|RoHS|1.5|±20％|-|0.125|2,300|1,800|2|
|MAKK2520T2R2M|RoHS|2.2|±20％|-|0.156|1,900|1,500|2|
|MAKK2520T3R3M|RoHS|3.3|±20％|-|0.200|1,550|1,300|2|
|MAKK2520T4R7M|RoHS|4.7|±20％|-|0.300|1,300|1,100|2|



|●MAMK2520（1008）type<br>【Thickness：1.2mm max.】|●MAMK2520（1008）type<br>【Thickness：1.2mm max.】|●MAMK2520（1008）type<br>【Thickness：1.2mm max.】|●MAMK2520（1008）type<br>【Thickness：1.2mm max.】|●MAMK2520（1008）type<br>【Thickness：1.2mm max.】|●MAMK2520（1008）type<br>【Thickness：1.2mm max.】||||
|---|---|---|---|---|---|---|---|---|
|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※） ［ｍA］（max.）||Measuring<br>frequency［MHz］|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MAMK2520TR47M|RoHS|0.47|±20％|-|0.039|4,200|3,400|2|
|MAMK2520TR68M|RoHS|0.68|±20％|-|0.048|3,200|3,200|2|
|MAMK2520T1R0M|RoHS|1.0|±20％|-|0.059|3,100|2,700|2|
|MAMK2520T2R2M|RoHS|2.2|±20％|-|0.110|2,000|1,900|2|
|MAMK2520T3R3M|RoHS|3.3|±20％|-|0.156|1,800|1,700|2|
|MAMK2520T4R7M|RoHS|4.7|±20％|-|0.260|1,500|1,300|2|



※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃) 

※） The temperature rise current value（Idc2) is the DC current value having temperature increase by 40℃. (at 20℃) 

- ※） The rated current value is following either Idc1 or Idc2, which is the lower one. 

▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**44** 

**for General Electronic Equipment** METAL CORE WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM MA-H SERIES） 

- Operating Temp.：-40～+125℃（Including self-generated heat） 

## ■PARTS NUMBER 

- Operating Temp.：-40～+105℃（Including self-generated heat）※1Parts Number reference 

|M A||K|K||2|0|<br>1|<br>6|H|1<br>R|0||M||△||△|△|△＝Blank space|△＝Blank space||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|①||②|||||③||④|<br>⑤|||⑥||⑦||⑧|||||
|①Series name|||||||||||||||||⑤Nominal inductance|||||
|Code<br>MA|||Metal|||Series name<br>Core Wire-wound Chip||||<br>Power Inductor|||||||||Code<br>（example）||Nominal inductance［μH］|
||||||||||||||||||||R47||0.47|
|②Dimensions（T）|||||||||||||||||||1R0||1.0|
|Code|||||||Dimensions（T）［mm］||||||||||||4R7||4.7|
|KK||||||||1.0|||||||||※R＝Decimal point|||||
|MK||||||||1.2||||||||||||||
||||||||||||||||||⑥Inductance tolerance|||||
|③Dimensions（L×W）|||||||||||||||||||Code||Inductance tolerance|
|Code|||||Type（inch）||||Dimensions<br>（L×W）［mm］||||||||||M||±20％|
|2016|||||2016（0806）|||||2.0×1.6|||||||⑦Special code|||||
|2520|||||2520（1008）|||||2.5×2.0|||||||||Code||Special code|
||||||||||||||||||||△||Standard|
|④Packaging||||||||||||||||||||||
|Code|||||Packaging|||or Special specification|||||||||⑧Internal code|||||
|H||||||Taping（High characteristics）||||||||||||||||



## ■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY 

|L<br>T<br>e|W||Recommended Land Patterns<br>Surface Mounting<br>・Mounting and soldering conditio<br>・Applicable soldering process to<br>A<br>A<br>B<br>C|Recommended Land Patterns<br>Surface Mounting<br>・Mounting and soldering conditio<br>・Applicable soldering process to<br>A<br>A<br>B<br>C|ns s<br>the|hould be chec<br>seproducts is|ked beforehand.<br>reflow solderingonly.|ked beforehand.<br>reflow solderingonly.||
|---|---|---|---|---|---|---|---|---|---|
|||||||Type|A|B|C|
|||||||2016|0.７|0.8|1.8|
|||||||2520|0.8|1.2|2.0|
|||||||||||
|Type|L|W|T|e|||Standard quantity［pcs］|||
||||||||Taping|||
|MAKK2016H|2.0±0.1<br>（0.079±0.004）|1.6±0.1<br>（0.063±0.004）|1.0 max<br>（0.039 max）|0.5±0.3<br>（0.020±0.012）|||3000|||
|MAKK2520H|2.5±0.2<br>（0.098±0.008）|2.0±0.2<br>（0.079±0.008）|1.0 max<br>（0.039 max）|0.5±0.3<br>（0.020±0.012）|||3000|||
|MAMK2520H|2.5±0.2<br>（0.098±0.008）|2.0±0.2<br>（0.079±0.008）|1.2 max<br>（0.047 max）|0.5±0.3<br>（0.020±0.012）|||3000|||
|||||||||||



▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**45** 

## **for General Electronic Equipment** 

■PARTS NUMBER 

|●MAKK2016H（0806） type<br>【Thickness：1.0mm max.】|●MAKK2016H（0806） type<br>【Thickness：1.0mm max.】|●MAKK2016H（0806） type<br>【Thickness：1.0mm max.】|●MAKK2016H（0806） type<br>【Thickness：1.0mm max.】|●MAKK2016H（0806） type<br>【Thickness：1.0mm max.】|●MAKK2016H（0806） type<br>【Thickness：1.0mm max.】||||
|---|---|---|---|---|---|---|---|---|
|<br>Parts number|<br>EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※） ［ｍA］（max.）||Measuring<br>frequency［MHz］|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MAKK2016HR22M|RoHS|0.22|±20％|-|0.026|5,800|4,000|2|
|MAKK2016HR24M|RoHS|0.24|±20％|-|0.026|5,800|4,000|2|
|MAKK2016HR33M|RoHS|0.33|±20％|-|0.030|4,700|3,500|2|
|MAKK2016HR47M|RoHS|0.47|±20％|-|0.036|4,300|3,300|2|
|MAKK2016HR68M|RoHS|0.68|±20％|-|0.050|3,200|2,700|2|
|MAKK2016H1R0M|RoHS|1.0|±20％|-|0.070|2,700|2,300|2|
|MAKK2016H1R5M|RoHS|1.5|±20％|-|0.105|2,100|1,800|2|



|●MAKK2520H（1008） type<br>【Thickness：1.0mm max.】|●MAKK2520H（1008） type<br>【Thickness：1.0mm max.】|●MAKK2520H（1008） type<br>【Thickness：1.0mm max.】|●MAKK2520H（1008） type<br>【Thickness：1.0mm max.】|●MAKK2520H（1008） type<br>【Thickness：1.0mm max.】|●MAKK2520H（1008） type<br>【Thickness：1.0mm max.】||||
|---|---|---|---|---|---|---|---|---|
|<br>Parts number|<br>EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※） ［ｍA］（max.）||Measuring<br>frequency［MHz］|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MAKK2520HR22M|RoHS|0.22|±20％|-|0.021|7500|4900|2|
|MAKK2520HR33M|RoHS|0.33|±20％|-|0.026|6200|4300|2|
|MAKK2520HR47M|RoHS|0.47|±20％|-|0.029|5700|4000|2|
|MAKK2520HR68M|RoHS|0.68|±20％|-|0.043|4300|3400|2|
|MAKK2520H1R0M|RoHS|1.0|±20％|-|0.053|3800|3000|2|
|MAKK2520H1R5M|RoHS|1.5|±20％|-|0.078|3000|2400|2|
|MAKK2520H2R2M|RoHS|2.2|±20％|-|0.120|2500|1800|2|
|MAKK2520H100M ※1|RoHS|10|±20％|-|0.650|1100|750|2|



|●MAMK2520H（1008） type<br>【Thickness：1.2mm max.】|●MAMK2520H（1008） type<br>【Thickness：1.2mm max.】|●MAMK2520H（1008） type<br>【Thickness：1.2mm max.】|●MAMK2520H（1008） type<br>【Thickness：1.2mm max.】|●MAMK2520H（1008） type<br>【Thickness：1.2mm max.】|●MAMK2520H（1008） type<br>【Thickness：1.2mm max.】||||
|---|---|---|---|---|---|---|---|---|
|<br>Parts number|<br>EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※）［ｍA］（max.）||Measuring<br>frequency［MHz］|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MAMK2520HR22M|RoHS|0.22|±20％|-|0.021|7500|5000|2|
|MAMK2520HR33M|RoHS|0.33|±20％|-|0.023|6600|4400|2|
|MAMK2520HR47M|RoHS|0.47|±20％|-|0.026|5800|4100|2|
|MAMK2520HR68M|RoHS|0.68|±20％|-|0.036|5100|3500|2|
|MAMK2520H1R0M|RoHS|1.0|±20％|-|0.045|4300|3100|2|
|MAMK2520H1R5M|RoHS|1.5|±20％|-|0.065|3300|2600|2|
|MAMK2520H2R2M|RoHS|2.2|±20％|-|0.090|2800|2200|2|



※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃) 

- ※） The temperature rise current value（Idc2) is the DC current value having temperature increase by 40℃. (at 20℃) 

※） The rated current value is following either Idc1 or Idc2, which is the lower one. 

▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**46** 

METAL CORE WIRE-WOUND CHIP POWER INDUCTORS (MCOIL[TM] MA SERIES / MCOIL[TM] MA-Ｈ SERIES) 

■PACKAGING 

**==> picture [497 x 645] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||||
|---|---|---|---|---|---|---|
|①Minimum Quantity|
|Standard Quantity|[pcs]|
|Type|
|Tape ＆ Reel|
|MAKK2016|3000|
|MAKK2520|3000|
|MAMK2520|3000|
|②Tape Material|
|●Embossed Tape|
|Top tape|
|DOC|ee|Chip Filled|
|/|Sprocket hole|
|||[Ss|OHoOdcd|
|Base tape|Chip cavity|Chip|
|③Taping dimensions|
|●Embossed tape 8mm wide (0.315 inches wide)|
|φ1.5＋0.1/－0|1.75±0.1|
|Sprocket hole|(φ0.059＋0.004/-0)|:|(0.069±0.004）|m|al|a|
|>||A|
|B|
|F|4.0±0.1|
|(0.157±0.004)|
|2.0±0.05|
|(0.079±0.002)|Electrode（bottom view）|
|Chip cavity|Insertion pitch|Tape thickness|
|Type|
|A|B|F|T|K|
|1.9±0.1|2.3±0.1|4.0±0.1|0.25±0.05|1.2 max|
|MAKK2016|
|（0.075±0.004）|（0.091±0.004）|（0.157±0.004）|（0.009±0.002）|（0.047 max）|
|2.3±0.1|2.8±0.1|4.0±0.1|0.3±0.05|1.25 max|
|MAKK2520|
|(0.091±0.004)|(0.110±0.004)|（0.157±0.004）|(0.012±0.002)|（0.049 max）|
|2.3±0.1|2.8±0.1|4.0±0.1|0.3±0.05|1.4 max|
|MAMK2520|
|(0.091±0.004)|(0.110±0.004)|(0.157±0.004)|(0.012±0.002)|(0.055 max)|
|Unit：mm（inch）|
|④Leader and Blank portion|
|Blank portions|Chip cavity|Blank portions|Leader|
|i|a|ca|
|O_O_O|O_O_O|O_O|O_O|Direction of tape feed|
|o°oo?--Po Deo?|_|
|160 mm or more|160 mm ～ 200 mm|
|400 mm ～ 560 mm|

**----- End of picture text -----**<br>


- This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MA_pack_e-E05R01 

**==> picture [327 x 249] intentionally omitted <==**

**----- Start of picture text -----**<br>
⑤Reel size<br>— W<br>| iy . Z ‘Ss \<br>a “TTyi JT4 \  -ae - — os]|e o=<br>\oi3t0.5" f 70 4! ]<br>2.5 or less<br>(0.098inchds<br>. or less)<br>Reel size (Reference values)<br>Type<br>φD  φd  W<br>MAKK2016<br>180+0/-3  60+1/-0  10.0±1.5<br>MAKK2520<br>（7.087+0/-0.118）  （2.36+0.039/0）  （0.394±0.059）<br>MAMK2520<br>Unit：mm（inch）<br>⑥Top Tape Strength<br>**----- End of picture text -----**<br>


The top The top tape requires a peel-off force of 0.1 to 1.2N in the direction of the arrow as illustrated below. 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MA_pack_e-E05R01 

METAL CORE WIRE-WOUND CHIP POWER INDUCTORS (MCOIL[TM] MA SERIES / MCOIL[TM] MA-Ｈ SERIES) 

## ■RELIABILITY DATA 

|1. Operating Temperature Range|1. Operating Temperature Range||||||
|---|---|---|---|---|---|---|
||MA series||－40～＋105℃||||
|Specified Value|MA-H series||－40～＋125℃||||
|Test Methods and<br>Remarks|Including self-generated heat|Including self-generated heat|||||
||||||||
|2. Storage Temperature Range|||||||
||MA series||||||
|Specified Value|||－40～＋85℃||||
||MA-H series||||||
|Test Methods and<br>Remarks|0 to 40℃ for the product with taping.||||||
||||||||
|3. Rated current|||||||
||MA series||||||
|Specified Value|||Within the specified tolerance||||
||MA-H series||||||
||||||||
|4. Inductance|||||||
||MA series||||||
|Specified Value|||Within the specified tolerance||||
||MA-H series||||||
|Test Methods and|Measuring equipment|: LCR Meter （HP 4285A or equivalent）|||||
|Remarks|Measuring frequency|: 2MHz、1V|||||
||||||||
|5. DC Resistance|||||||
||MA series||||||
|Specified Value|||Within the specified tolerance||||
||MA-H series||||||
|Test Methods and<br>Remarks|Measuring equipment|: DC ohmmeter （HIOKI 3227 or equivalent）|||||
||||||||
|6. Self resonance frequency|||||||
||MA series||||||
|Specified Value|||－||||
||MA-H series||||||
||||||||
|7. Temperature characteristic|||||||
||MA series||||||
|Specified Value|||Inductance change : Within ±15%|Inductance change : Within ±15%|||
||MA-H series||||||
|Test Methods and|Measurement of inductance shall be taken at temperature range within －40℃～＋85℃.||Measurement of inductance shall be taken at temperature range within －40℃～＋85℃.||||
|Remarks|With reference to inductance value at ＋20℃., change rate shall be calculated.||||||
||||||||
|8. Resistance to flexure of substrate|||||||
||MA series||||||
|Specified Value|||No damage||||
||MA-H series||||||
||The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating|||The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating|The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating||
||until deflection of the test board reaches to 2 mm.||||||
||Test board size|: 100×40×1.0 mm|: 100×40×1.0 mm|Force Rod|10|20|
|Test Methods and|Test board material<br>Solder cream thickness|: Glass epoxy-resin<br>Solder cream thickness<br>: 0.12 mm||||R230)|
|Remarks|||||||



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MA_reli_e-E08R01 

||9. Insulation resistance : between wires|||
|---|---|---|---|
||MA series|||
||Specified Value<br>－|||
||MA-H series|||
|||||
||10. Insulation resistance : between wire and core|||
||MA series|||
||Specified Value<br>－|||
||MA-H series|||
|||||
||11. Withstanding voltage : between wire and core|||
||MA series|||
||Specified Value<br>－|||
||MA-H series|||
|||||
||12. Adhesion of terminal electrode|||
|Specified Value<br>MA series<br>No abnormality.<br>MA-H series<br>Test Methods and<br>Remarks<br>The test samples shall be soldered to the test board by the reflow.<br>Applied force<br>: 10N to X and Y directions.<br>Duration<br>: 5s.<br>Solder cream thickness<br>: 0.12mm.<br>13. Resistance to vibration<br>~~i~~||||
||Specified Value<br>MA series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>MA-H series|||
||The test samples shall be soldered to the test board by the reflow.|The test samples shall be soldered to the test board by the reflow.||
||Test Methods and<br>Remarks<br>Then it shall be submitted to below test conditions.<br>FrequencyRange<br>10～55Hz<br>Total Amplitude<br>1.5mm (Maynot exceed acceleration 196m/s2)<br>SweepingMethod<br>10Hz to 55Hz to 10Hz for 1min.<br>Time<br>X<br>For 2 hours on each X, Y, and Z axis.<br>Y<br>Z<br>~~————~~|||
||Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.|||
|||||
||14. Solderability|||
|Specified Value<br>MA series<br>At least 90％ of surface of terminal electrode is covered by new solder.<br>MA-H series<br>Test Methods and<br>Remarks<br>The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.<br>Flux : Methanol solution containingrosin 25%.<br>Solder Temperature<br>245±5℃<br>Time<br>5±0.5 sec.<br>※Immersion depth : All sides of mounting terminal shall be immersed.<br>~~ae~~||||
||15. Resistance to solderingheat|||
|Specified Value<br>MA series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>MA-H series<br>Test Methods and<br>Remarks<br>The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 3 times.<br>Test board material<br>: Glass epoxy-resin<br>Test board thickness<br>: 1.0mm<br>Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.<br>~~ee~~||||



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MA_reli_e-E08R01 

**==> picture [540 x 675] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||
|---|---|---|
|16. Thermal shock|
|MA series|Inductance change : Within ±10%|
|Specified Value|
|MA-H series|No significant abnormality in appearance.|
|The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified|
|time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles.|
|Conditions of 1 cycle|
|Step|Temperature (℃)|Duration (min)|
|Test Methods and|
|1|－40±3|30±3|
|Remarks|
|2|Room temperature|Within 3|
|3|＋85±2|30±3|
|4|Room temperature|Within 3|
|Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.|
|=|
|17. Damp heat|
|MA series|Inductance change : Within ±10%|
|Specified Value|
|MA-H series|No significant abnormality in appearance.|
|The test samples shall be soldered to the test board by the reflow.|
|The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table.|
|Test Methods and|
|Temperature|60±2℃|
|Remarks|
|Humidity|90～95%RH|
|Time|500＋24/－0 hour|
|Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.|
|==|
|18. Loading under damp heat|
|MA series|Inductance change : Within ±10%|
|Specified Value|
|MA-H series|No significant abnormality in appearance.|
|The test samples shall be soldered to the test board by the reflow.|
|The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current|
|continuously as shown in below table.|
|Test Methods and|
|Temperature|60±2℃|
|Remarks|
|Humidity|90～95％RH|
|Applied current|Rated current|
|=S—|Time|500＋24/－0 hour|
|Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.|
|19. Low temperature life test|
|MA series|Inductance change : Within ±10%|
|Specified Value|
|MA-H series|No significant abnormality in appearance.|
|The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown|
|Test Methods and|in below table.|
|Remarks|Temperature|－40±2℃|
|Time|500＋24/－0 hour|
|Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.|
|—|
|20. High temperature life test|
|MA series|Inductance change : Within ±10%|
|Specified Value|
|MA-H series|No significant abnormality in appearance.|
|The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown|
|Test Methods and|in below table.|
|Remarks|Temperature|85±2℃|
|Time|500＋24/－0 hour|
|Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.|
|==|
|21. Loading at high temperature life test|
|MA series|
|Specified Value|－|
|MA-H series|

**----- End of picture text -----**<br>


▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MA_reli_e-E08R01 

22. Standard condition 

|Specified Value|MA series|Standard test condition :<br>Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.<br>When there is any question concerning measurement result: In order to provide correlation<br>data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.<br>Inductance is in accordance with our measured value.|
|---|---|---|
||MA-H series||



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MA_reli_e-E08R01 

METAL CORE WIRE-WOUND CHIP POWER INDUCTORS (MCOIL[TM] MA SERIES / MCOIL[TM] MA-Ｈ SERIES) 

## ■PRECAUTIONS 

1. Circuit Design 

◆Operating environment 

1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical 

Precautions equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. 

## 2. PCB Design 

|Precautions|◆Land pattern design<br>1. Please refer to a recommended land pattern.|
|---|---|
||◆Land pattern design|
|Technical|Surface Mounting|
|considerations|・ Mounting and soldering conditions should be checked beforehand.|
||・ Applicable soldering process to this products is reflow soldering only.|



## 3. Considerations for automatic placement 

|Precautions|◆Adjustment of mounting machine<br>1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.<br>2. Mounting and soldering conditions should be checked beforehand.|
|---|---|
|Technical<br>considerations|◆Adjustment of mounting machine<br>1. When installing products, care should be taken not to apply distortion stress as it may deform the products.|



4. Soldering ◆Reflow soldering 1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified. 2. The product shall be used reflow soldering only. 

Precautions 3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering. ◆Lead free soldering 1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering heat, soldering etc sufficiently. 

- ◆Reflow soldering 1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. Recommended reflow condition (Pb free solder) 300 5sec max 

- Technical aO© 200 150~180\ <— Peak:: 260+0/-5°C+0 /-5° 

- considerations 

|5. Cleaning||
|---|---|
|Precautions|◆Cleaning conditions<br>1. Washing by supersonic waves shall be avoided.|
|Technical|◆Cleaning conditions|
|considerations|1. If washed by supersonic waves, the products might be broken.|



- This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MA_prec_e-E06R01 

|6. Handling||
|---|---|
|Precautions|◆Handling<br>1. Keep the product away from all magnets and magnetic objects.<br>◆Breakaway PC boards (splitting along perforations)<br>1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.<br>2. Board separation should not be done manually, but by using the appropriate devices.<br>◆Mechanical considerations<br>1. Please do not give the product any excessive mechanical shocks.<br>2. Please do not add any shock and power to a product in transportation.<br>◆Pick-up pressure<br>1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.<br>◆Packing<br>1. Please avoid accumulation of a packing box as much as possible.|
|Technical<br>considerations|◆Handling<br>1. There is a case that a characteristic varies with magnetic influence.<br>◆Breakaway PC boards (splitting along perforations)<br>1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.<br>◆Mechanical considerations<br>1. There is a case to be damaged by a mechanical shock.<br>2. There is a case to be broken by the handling in transportation.<br>◆Pick-up pressure<br>1. Damage and a characteristic can vary with an excessive shock or stress.<br>◆Packing<br>1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.|



|Precautions|◆Storage<br>1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the<br>storage area should be controlled.<br>・ Recommended conditions<br>Ambient temperature : 0～40℃<br>Humidity : Below 70% RH<br>・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may<br>decrease as time passes.<br>For this reason, product should be used within 6 months from the time of delivery.<br>In case of storage over 6 months, solderability shall be checked before actual usage.|
|---|---|
|Technical<br>considerations|◆Storage<br>1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes<br>and deterioration of taping/packaging materials may take place.|



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MA_prec_e-E06R01 

**for General Electronic Equipment** 

METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM MB SERIES） 

## ■PARTS NUMBER 

**==> picture [234 x 182] intentionally omitted <==**

**----- Start of picture text -----**<br>
M B  K K  1 6  0  8 T 1 R 0  M △<br>①  ②  ③  ④  ⑤  ⑥ ⑦<br>①Series name<br>Code  Series name<br>MB  Metal Wire-Wound chip power inductor<br>②Dimensions（T）<br>Code  Dimensions（T）［mm］<br>KK  1.0<br>MK  1.2<br>③Dimensions（L×W）<br>Dimensions<br>Code  Type（inch）<br>（L×W）［mm］<br>1608  1608（0603） 1.6×0.8<br>2012  2012（0805） 2.0×1.25<br>2520  2520（1008） 2.5×2.0<br>**----- End of picture text -----**<br>


* Operating Temp.：-40～+105℃（Including self-generated heat） 

**==> picture [208 x 206] intentionally omitted <==**

**----- Start of picture text -----**<br>
△＝Blank space<br>④Packaging<br>Code  Packaging<br>T  Taping<br>⑤Nominal inductance<br>Code<br>Nominal inductance［μH］<br>（example）<br>R24  0.24<br>1R0  1.0<br>4R7  4.7<br>※R＝Decimal point<br>⑥Inductance tolerance<br>Code  Inductance tolerance<br>M  ±20％<br>N  ±30％<br>⑦Internal code<br>**----- End of picture text -----**<br>


■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY 

|Y|Y|Y|||||||||
|---|---|---|---|---|---|---|---|---|---|---|
|Recommended Land|||Patterns||||||||
|Surface Mounting|||||||||||
|・Mounting and soldering||||||conditions should be checked beforehand.|||||
|・Applicable soldering process to theseproducts is||||||||reflow solderingonly.|||
||||||||Type|A|B|C|
|||||||C|1608|0.55|0.70|1.00|
||||||||2012|0.60|1.00|1.45|
|A<br>B|||A||||2520|0.60|1.50|2.00|
|||||||||||Unit：mm|



|||||||||||ITY|ITY||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||||Recommended Land Patterns<br>Surface Mounting|||||||||
|T||L|||||W||・Mounting and soldering conditio<br>・Applicable soldering process to<br>A<br>A<br>B<br>C|||ns s<br>the|hould be chec<br>seproducts is|ked beforehand.<br>reflow solderingonly.|||||
||||||||||||||||||||
||||||||||||||||||||
||||||||||||||Type|A||B|C||
||||||||||||||1608|0.55||0.70|1.00||
|||e|||||||||||2012|0.60||1.00|1.45||
||||||||||||||2520|0.60||1.50|2.00||
||||||||||||||||||Unit：mm||
||||||||||||||||||||
|||Type|||||L|W|T||e|||Standardquantity［pcs］|||||
||||||||||||||Paper|tape|Embosse||d tape||
|M||BKK1608|||1.6±0.2<br>（0.063±0.008）|||0.8±0.2<br>（0.031±0.008）|1.0 max<br>（0.040 max）||0.45±0.15<br>（0.016±0.006）||－||300||0||
|M||BKK2012|||2.0±0.2<br>（0.079±0.008）|||1.25±0.2<br>（0.049±0.008）|1.0 max<br>（0.040 max）||0.5±0.2<br>（0.020±0.008）||－||300||0||
|M||BMK2520|||2.5±0.2<br>（0.098±0.008）|||2.0±0.2<br>（0.079±0.008）|1.2 max<br>（0.047 max）||0.5±0.2<br>（0.020±0.008）||－||300||0||
||||||||||||||||Unit：mm（inch）||||



▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**47** 

## **for General Electronic Equipment** 

■PARTS NUMBER 

●MBKK1608（0603） type 【Thickness：1.0mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※）［ｍA］（max.）|Rated current ※）［ｍA］（max.）|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MBKK1608TR24N|RoHS|0.24|±30％|-|0.049|1,650|2,300|1.0|
|MBKK1608TR47N|RoHS|0.47|±30％|-|0.104|1,100|1,400|1.0|
|MBKK1608TR68N|RoHS|0.68|±30％|-|0.120|950|1,200|1.0|
|MBKK1608T1R0M|RoHS|1.0|±20％|-|0.150|800|1,150|1.0|
|MBKK1608T1R5M|RoHS|1.5|±20％|-|0.200|650|1,000|1.0|
|MBKK1608T2R2M|RoHS|2.2|±20％|-|0.345|520|750|1.0|
|MBKK1608T3R3M|RoHS|3.3|±20％|-|0.512|450|600|1.0|
|MBKK1608T4R7M|RoHS|4.7|±20％|-|0.730|370|500|1.0|



●MBKK2012（0805） type 【Thickness：1.0mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※） ［ｍA］（max.）|Rated current ※） ［ｍA］（max.）|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MBKK2012TR24N|RoHS|0.24|±30％|-|0.041|3,000|2,400|1.0|
|MBKK2012TR47N|RoHS|0.47|±30％|-|0.078|2,000|1,650|1.0|
|MBKK2012TR68N|RoHS|0.68|±30％|-|0.090|1,800|1,500|1.0|
|MBKK2012T1R0M|RoHS|1.0|±20％|-|0.106|1,500|1,450|1.0|
|MBKK2012T1R5M|RoHS|1.5|±20％|-|0.173|1,200|1,100|1.0|
|MBKK2012T2R2M|RoHS|2.2|±20％|-|0.290|900|850|1.0|
|MBKK2012T3R3M|RoHS|3.3|±20％|-|0.500|700|650|1.0|
|MBKK2012T4R7M|RoHS|4.7|±20％|-|0.615|600|600|1.0|



|●MBMK2520（1008）type<br>【Thickness：1.2mm max.】|●MBMK2520（1008）type<br>【Thickness：1.2mm max.】|●MBMK2520（1008）type<br>【Thickness：1.2mm max.】|●MBMK2520（1008）type<br>【Thickness：1.2mm max.】|●MBMK2520（1008）type<br>【Thickness：1.2mm max.】|●MBMK2520（1008）type<br>【Thickness：1.2mm max.】||||
|---|---|---|---|---|---|---|---|---|
|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※） ［ｍA］（max.）||Measuring<br>frequency［MHz］|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MBMK2520TR24N|RoHS|0.24|±30％|-|0.026|4,750|3,500|1.0|
|MBMK2520TR47N|RoHS|0.47|±30％|-|0.042|3,900|2,600|1.0|
|MBMK2520TR68N|RoHS|0.68|±30％|-|0.058|3,150|2,150|1.0|
|MBMK2520T1R0M|RoHS|1.0|±20％|-|0.072|2,350|1,850|1.0|
|MBMK2520T1R5M|RoHS|1.5|±20％|-|0.106|2,050|1,500|1.0|
|MBMK2520T2R2M|RoHS|2.2|±20％|-|0.159|1,800|1,250|1.0|
|MBMK2520T3R3M|RoHS|3.3|±20％|-|0.260|1,400|970|1.0|
|MBMK2520T4R7M|RoHS|4.7|±20％|-|0.380|1,150|800|1.0|



※）The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃) 

- ※）The temperature rise current value (Idc2) is the DC current value having temperature increase by 40℃. (at 20℃) 

- ※）The rated current value is following either Idc1 or Idc2, which is the lower one. 

▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**48** 

**for General Electronic Equipment** 

METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM MB-H SERIES） 

## ■PARTS NUMBER 

* Operating Temp.：-40～+125℃（Including self-generated heat） 

**==> picture [453 x 209] intentionally omitted <==**

**----- Start of picture text -----**<br>
M B  K K  1 6  0  8 H 1 R 0  M △  △＝Blank space<br>①  ②  ③  ④  ⑤  ⑥ ⑦<br>①Series name  ④Packaging<br>Code  Series name  Code  Packaging<br>MB  Metal Wire-Wound chip power inductor  H  Taping（Special specification）<br>②Dimensions（T） ⑤Nominal inductance<br>Code  Dimensions（T）［mm］ Code<br>Nominal inductance［μH］<br>KK  1.0  （example）<br>MK  1.2  R24  0.24<br>1R0  1.0<br>③Dimensions（L×W） 4R7  4.7<br>Dimensions  ※R＝Decimal point<br>Code  Type（inch）<br>（L×W）［mm］<br>1608  1608（0603） 1.6×0.8  ⑥Inductance tolerance<br>2520  2520（1008） 2.5×2.0  Code  Inductance tolerance<br>M  ±20％<br>N  ±30％<br>⑦Internal code<br>**----- End of picture text -----**<br>


## ■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY 

|T|T|L|L|L|||W||Recommended Land Patterns<br>Surface Mounting<br>・Mounting and soldering conditio<br>・Applicable soldering process to<br>A<br>A<br>B<br>C|Recommended Land Patterns<br>Surface Mounting<br>・Mounting and soldering conditio<br>・Applicable soldering process to<br>A<br>A<br>B<br>C|ns s<br>the|hould be chec<br>seproducts is|ked beforehand.<br>reflow solderingonly.|ked beforehand.<br>reflow solderingonly.|ked beforehand.<br>reflow solderingonly.||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||||||||||||
||||||||||||||||||
|||||||||||||Type|A||B|C|
|||||||||||||1608|0.55||0.70|1.00|
|||e|||||||||||||||
|||||||||||||2520|0.60||1.50|2.00|
||||||||||||||||||
||||||||||||||||||
|||Type|||||L|W|T|e|||Standardquantity［pcs］||||
|||||||||||||Paper|tape|Embosse||d tape|
|M||BKK1608|||1.6±0.2<br>（0.063±0.008）|||0.8±0.2<br>（0.031±0.008）|1.0 max<br>（0.040 max）|0.45±0.15<br>（0.016±0.006）||－||300||0|
|M||BMK2520|||2.5±0.2<br>（0.098±0.008）|||2.0±0.2<br>（0.079±0.008）|1.2 max<br>（0.047 max）|0.5±0.2<br>（0.020±0.008）||－||300||0|
||||||||||||||||||



▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**49** 

## **for General Electronic Equipment** 

■PARTS NUMBER 

## ●MBKK1608H（0603） type 【Thickness：1.0mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※）［ｍA］（max.）|Rated current ※）［ｍA］（max.）|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MBKK1608HR24N|RoHS|0.24|±30％|-|0.049|1,650|2,300|1.0|
|MBKK1608HR47N|RoHS|0.47|±30％|-|0.104|1,100|1,400|1.0|
|MBKK1608HR68N|RoHS|0.68|±30％|-|0.120|950|1,200|1.0|
|MBKK1608H1R0M|RoHS|1.0|±20％|-|0.150|800|1,150|1.0|
|MBKK1608H1R5M|RoHS|1.5|±20％|-|0.200|650|1,000|1.0|
|MBKK1608H2R2M|RoHS|2.2|±20％|-|0.345|520|750|1.0|
|MBKK1608H3R3M|RoHS|3.3|±20％|-|0.512|450|600|1.0|
|MBKK1608H4R7M|RoHS|4.7|±20％|-|0.730|370|500|1.0|



## ●MBMK2520H（1008） type 【Thickness：1.2mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※） ［ｍA］（max.）|Rated current ※） ［ｍA］（max.）|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MBMK2520HR24N|RoHS|0.24|±30％|-|0.026|4,750|3,500|1.0|
|MBMK2520HR47N|RoHS|0.47|±30％|-|0.042|3,900|2,600|1.0|
|MBMK2520HR68N|RoHS|0.68|±30％|-|0.058|3,150|2,150|1.0|
|MBMK2520H1R0M|RoHS|1.0|±20％|-|0.072|2,350|1,850|1.0|
|MBMK2520H1R5M|RoHS|1.5|±20％|-|0.106|2,050|1,500|1.0|
|MBMK2520H2R2M|RoHS|2.2|±20％|-|0.159|1,800|1,250|1.0|
|MBMK2520H3R3M|RoHS|3.3|±20％|-|0.260|1,400|970|1.0|
|MBMK2520H4R7M|RoHS|4.7|±20％|-|0.380|1,150|800|1.0|



※）The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃) 

※）The temperature rise current value (Idc2) is the DC current value having temperature increase by 40℃. (at 20℃) 

- ※）The rated current value is following either Idc1 or Idc2, which is the lower one. 

▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**50** 

METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOIL[TM] MB SERIES／MCOIL[TM] MB-H SERIES) 

■PACKAGING 

**==> picture [505 x 512] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||
|---|---|---|---|---|
|①Minimum Quantity|
|Standard Quantity|[pcs]|
|Type|
|Tape ＆ Reel|
|MBKK1608／MBKK1608H|3000|
|MBKK2012|3000|
|MBMK2520／MBMK2520H|3000|
|②Tape Material|
|●Embossed Tape|
|Top tape|
|\ _||[oo|
|nog)|SJ|
|Chip Filled|
|NN|es|
|||Sprocket hole|
|['&|OOdd|
|||
|Base tape|Chip cavity|Chip|
|③Taping dimensions|
|●Embossed tape 8mm wide (0.315 inches wide)|
|φ1.5＋0.1/－0|1.75±0.1|
|Sprocket hole|(φ0.059＋0.004/-0)|(0.069±0.004）|at|
|:|
|<>|A|
|B|
|+p|~|
|F|4.0±0.1|
|(0.157±0.004)|
|2.0±0.05|a|
|(0.079±0.002)|Electrode（bottom view）|
|Chip cavity|Insertion pitch|Tape thickness|
|Type|
|A|B|F|T|K|
|1.1|1.9|4.0±0.1|0.25±0.05|1.2 max|
|MBKK1608／MBKK1608H|
|(0.043)|(0.075)|(0.157±0.004)|(0.010±0.002)|(0.047 max)|
|1.45|2.2|4.0±0.1|0.25±0.05|1.2 max|
|MBKK2012|
|(0.057)|(0.087)|(0.157±0.004)|(0.010±0.002)|(0.047 max)|
|2.3|2.8|4.0±0.1|0.3±0.05|1.45 max|
|MBMK2520／MBMK2520H|
|(0.091)|(0.110)|(0.157±0.004)|(0.012±0.002)|(0.057 max)|
|Unit：mm（inch）|
|④Leader and Blank portion|

**----- End of picture text -----**<br>


- This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MB_pack_e-E06R01 

**==> picture [333 x 249] intentionally omitted <==**

**----- Start of picture text -----**<br>
⑤Reel size<br>— W<br>| iy . Z ‘Ss \<br>a “TTyi JT4 \  -ae - — os]|e o=<br>\oi3t0.5" f 70 4! ]<br>2.5 or less<br>(0.098inchds<br>. or less)<br>Reel size (Reference values)<br>Type<br>φD  φd  W<br>MBKK1608／MBKK1608H<br>180+0/-3  60+1/-0  10.0±1.5<br>MBKK2012<br>（7.087+0/-0.118）  （2.36+0.039/0）  （0.394±0.059）<br>MBMK2520／MBMK2520H<br>Unit：mm（inch）<br>⑥Top Tape Strength<br>**----- End of picture text -----**<br>


The top The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below. 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MB_pack_e-E06R01 

METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOIL[TM] MB SERIES／MCOIL[TM] MB-H SERIES) 

## ■RELIABILITY DATA 

1. Operating Temperature Range MB series －40～＋105℃ Specified Value MB-H series －40～＋125℃ Test Methods and Including self-generated heat Remarks 2. Storage Temperature Range MB series Specified Value －40～＋85℃ MB-H series Test Methods and 0 to 40℃ for the product with taping. Remarks ~~ee~~ 3. Rated current MB series Specified Value Within the specified tolerance MB-H series ~~a~~ 4. Inductance MB series Specified Value Within the specified tolerance MB-H series Test Methods and Measuring equipment : LCR Meter （HP 4285A or equivalent） Remarks Measuring frequency : 1MHz、1V ~~ee~~ 5. DC Resistance MB series Specified Value Within the specified tolerance MB-H series Test Methods and Measuring equipment : DC ohmmeter （HIOKI 3227 or equivalent） Remarks ~~ee~~ 6. Self resonance frequency MB series Specified Value － MB-H series ~~—————~~ 7. Temperature characteristic MB series Specified Value Inductance change : Within ±15% MB-H series MB series : Measurement of inductance shall be taken at temperature range within －40℃～＋105℃. Test Methods and With reference to inductance value at ＋20℃., change rate shall be calculated. Remarks MB-H series : Measurement of inductance shall be taken at temperature range within －40℃～＋125℃. With reference to inductance value at ＋20℃., change rate shall be calculated. 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MB_reli_e-E06R01 

**==> picture [531 x 98] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||
|---|---|---|---|---|
|8. Resistance to flexure of substrate|
|MB series|
|Specified Value|No damage|
|MB-H series|
|The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating|
|until deflection of the test board reaches to 2 mm.|
|Test board size|: 100×40×1.0 mm (1608：0.8mm)|Force Rod|10,|20|
|Test board material|: Glass epoxy-resin|
|R230|
|Test Methods and|Solder cream thickness|: 0.1 mm|
|Remarks|

**----- End of picture text -----**<br>


**==> picture [296 x 143] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||
|---|---|
|9. Insulation resistance : between wires|
|MB series|
|Specified Value|－|
|MB-H series|
|10. Insulation resistance : between wire and core|
|MB series|DC25V 100kΩ min|
|Specified Value|
|MB-H series|DC50V 100kΩ min|
|11. Withstanding voltage : between wire and core|
|MB series|
|Specified Value|－|
|MB-H series|

**----- End of picture text -----**<br>


**==> picture [488 x 233] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||
|---|---|---|---|
|12. Adhesion of terminal electrode|
|MB series|
|Specified Value|No abnormality.|
|MB-H series|
|The test samples shall be soldered to the test board by the reflow.|
|Test Methods and|Applied force|: 10N (1608：5N) to X and Y directions.|
|Remarks|Duration|: 5s.|
|Solder cream thickness|: 0.1mm.|
|13. Resistance to vibration|
|MB series|Inductance change : Within ±10%|
|Specified Value|
|MB-H series|No significant abnormality in appearance.|
|The test samples shall be soldered to the test board by the reflow.|
|Then it shall be submitted to below test conditions.|
|Frequency Range|10～55Hz|
|Total Amplitude|1.5mm (May not exceed acceleration 196m/s|[2]|)|
|Test Methods and|
|Sweeping Method|10Hz to 55Hz to 10Hz for 1min.|
|Remarks|
|X|
|Time|Y|For 2 hours on each X, Y, and Z axis.|
|Z|
|Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.|

**----- End of picture text -----**<br>


**==> picture [471 x 102] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||
|---|---|---|
|14. Solderability|
|MB series|
|Specified Value|At least 90％ of surface of terminal electrode is covered by new solder.|
|MB-H series|
|The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.|
|Flux : Methanol solution containing rosin 25%.|
|Test Methods and|Solder Temperature|245±5℃|
|Remarks|Immersing speed|25mm/s|
|Time|5±0.5 sec.|
|※Immersion depth : All sides of mounting terminal shall be immersed.|

**----- End of picture text -----**<br>


▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MB_reli_e-E06R01 

|15. Resistance to solderingheat||||
|---|---|---|---|
|Specified Value<br>MB series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>MB-H series||||
|The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 3 times.||||
|Test Methods and<br>Test board material<br>: Glass epoxy-resin||||
|Remarks<br>Test board thickness<br>: 1.0mm||||
|Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.||||
|||||
|16. Thermal shock||||
|Specified Value<br>MB series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>MB-H series<br>Test Methods and<br>Remarks<br>MB series:<br>The test samples shall be soldered to the test board by the reflow.<br>The test samples shall be placed at specified temperature for<br>specified time by step 1 to step 4 as shown in below table in<br>sequence. The temperature cycle shall be repeated 100 cycles.<br>Conditions of 1 cycle<br>Step<br>Temperature (℃)<br>Duration (min)<br>1<br>－40±3<br>30±3<br>2<br>Room temperature<br>Within 3<br>3<br>＋85±2<br>30±3<br>4<br>Room temperature<br>Within 3<br>Recovery : At least 2hrs of recovery under the standard condition<br>after the test, followed by the measurement within 48hrs.<br>MB-H series:<br>The test samples shall be soldered to the test board by the reflow.<br>The test samples shall be placed at specified temperature for<br>specified time by step 1 to step 4 as shown in below table in<br>sequence. The temperature cycle shall be repeated 100 cycles.<br>Conditions of 1 cycle<br>Step<br>Temperature (℃)<br>Duration (min)<br>1<br>－40±3<br>30±3<br>2<br>Room temperature<br>Within 3<br>3<br>＋125±2<br>30±3<br>4<br>Room temperature<br>Within 3<br>Recovery : At least 2hrs of recovery under the standard condition<br>after the test, followed by the measurement within 48hrs.<br>~~ee~~||||
|17. Dampheat||||
|Specified Value<br>MB series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>MB-H series<br>Test Methods and<br>Remarks<br>MB series:<br>The test samples shall be soldered to the test board by the reflow.<br>The test samples shall be placed in thermostatic oven set at<br>specified temperature and humidityas shown in below table.<br>Temperature<br>60±2℃<br>Humidity<br>90～95%RH<br>Time<br>1000＋24/－0 hour<br>Recovery : At least 2hrs of recovery under the standard condition<br>after the test, followed by the measurement within 48hrs.<br>MB-H series:<br>The test samples shall be soldered to the test board by the reflow.<br>The test samples shall be placed in thermostatic oven set at<br>specified temperature and humidityas shown in below table.<br>Temperature<br>85±2℃<br>Humidity<br>85%RH<br>Time<br>1000＋24/－0 hour<br>Recovery : At least 2hrs of recovery under the standard condition<br>after the test, followed by the measurement within 48hrs.<br>~~as~~||||
|18. Loadingunder dampheat||||
|Specified Value<br>MB series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>MB-H series<br>Test Methods and<br>Remarks<br>MB series:<br>The test samples shall be soldered to the test board by the reflow.<br>The test samples shall be placed in thermostatic oven set at<br>specified temperature and humidity and applied the rated current<br>continuouslyas shown in below table.<br>Temperature<br>60±2℃<br>Humidity<br>90～95％RH<br>Applied current<br>Rated current<br>Time<br>1000＋24/－0 hour<br>Recovery : At least 2hrs of recovery under the standard condition<br>after the test, followed by the measurement within 48hrs.<br>MB-H series:<br>The test samples shall be soldered to the test board by the reflow.<br>The test samples shall be placed in thermostatic oven set at<br>specified temperature and humidity and applied the rated current<br>continuouslyas shown in below table.<br>Temperature<br>85±2℃<br>Humidity<br>85％RH<br>Applied current<br>Rated current<br>Time<br>1000＋24/－0 hour<br>Recovery : At least 2hrs of recovery under the standard condition<br>after the test, followed by the measurement within 48hrs.<br>19. Low temperature life test<br>Specified Value<br>MB series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>MB-H series<br>Test Methods and<br>Remarks<br>The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown<br>in below table.<br>Temperature<br>－40±2℃<br>Time<br>1000＋24/－0 hour<br>Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.<br>~~== =~~<br>~~——~~||||
|||||
|▶This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.||||
|For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .||||



i_wound_MB_reli_e-E06R01 

20. High temperature life test MB series Inductance change : Within ±10% Specified Value MB-H series No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown Test Methods and in below table. Remarks Temperature 85±2℃ Time 1000＋24/－0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 21. Loading at high temperature life test MB series Specified Value － MB-H series ~~eee~~ 22. Standard condition Standard test condition : MB series Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity. Specified Value When there is any question concerning measurement result: In order to provide correlation MB-H series data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity. Inductance is in accordance with our measured value. 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MB_reli_e-E06R01 

METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOIL[TM] MB SERIES／MCOIL[TM] MB-H SERIES) 

## ■PRECAUTIONS 

1. Circuit Design 

◆Operating environment 

1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical 

Precautions equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. 

## 2. PCB Design 

|Precautions|◆Land pattern design<br>1. Please refer to a recommended land pattern.|
|---|---|
||◆Land pattern design|
|Technical|Surface Mounting|
|considerations|・ Mounting and soldering conditions should be checked beforehand.|
||・ Applicable soldering process to this products is reflow soldering only.|



## 3. Considerations for automatic placement 

|Precautions|◆Adjustment of mounting machine<br>1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.<br>2. Mounting and soldering conditions should be checked beforehand.|
|---|---|
|Technical<br>considerations|◆Adjustment of mounting machine<br>1. When installing products, care should be taken not to apply distortion stress as it may deform the products.|



4. Soldering ◆Reflow soldering 1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified. 2. The product shall be used reflow soldering only. 

- Precautions 3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering. ◆Lead free soldering 1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering heat, soldering etc sufficiently. 

- ◆Reflow soldering 

1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. Recommended reflow condition (Pb free solder) 300 5sec max Peak：260+0/-5℃ 150～180 Technical 200 considerations 40sec max 100 90±30sec 230℃ min 0 Heating Time［sec］ 

5. Cleaning ◆Cleaning conditions Precautions 1. Washing by supersonic waves shall be avoided. Technical ◆Cleaning conditions considerations 1. If washed by supersonic waves, the products might be broken. ~~—————————~~ 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MB_prec_e-E06R01 

|6. Handling||
|---|---|
|Precautions|◆Handling<br>1. Keep the product away from all magnets and magnetic objects.<br>◆Breakaway PC boards (splitting along perforations)<br>1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.<br>2. Board separation should not be done manually, but by using the appropriate devices.<br>◆Mechanical considerations<br>1. Please do not give the product any excessive mechanical shocks.<br>2. Please do not add any shock and power to a product in transportation.<br>◆Pick-up pressure<br>1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.<br>◆Packing<br>1. Please avoid accumulation of a packing box as much as possible.|
|Technical<br>considerations|◆Handling<br>1. There is a case that a characteristic varies with magnetic influence.<br>◆Breakaway PC boards (splitting along perforations)<br>1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.<br>◆Mechanical considerations<br>1. There is a case to be damaged by a mechanical shock.<br>2. There is a case to be broken by the handling in transportation.<br>◆Pick-up pressure<br>1. Damage and a characteristic can vary with an excessive shock or stress.<br>◆Packing<br>1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.|



|Precautions|◆Storage<br>1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the<br>storage area should be controlled.<br>・ Recommended conditions<br>Ambient temperature : 0～40℃<br>Humidity : Below 70% RH<br>・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may<br>decrease as time passes.<br>For this reason, product should be used within 6 months from the time of delivery.<br>In case of storage over 6 months, solderability shall be checked before actual usage.|
|---|---|
|Technical<br>considerations|◆Storage<br>1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes<br>and deterioration of taping/packaging materials may take place.|



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

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