MCR68-2G
SCR THYRISTOR, 12A, 50V, TO-220AB
- Manufacturer: LITTELFUSE
- Product type: Thyristors - SCRs
- No. of Pins: 3Pins
- Thyristor Mounting: Through Hole
- Holding Current Max: 50mA
- On State RMS Current: 12A
- Thyristor Case Style: TO-220AB
- Average On State Current: 8A
- Gate Trigger Current Max: 30mA
- Gate Trigger Voltage Max: 1.5V
- Operating Temperature Max: 125°C
- Peak Non Repetitive Surge Current: 100A
- Peak Repetitive Off State Voltage: 50V
| Delivery and price | |
|---|---|
| Units per pack | 10000 |
| Price | 0.442 € |
| Current stock | 500+ |
| Lead time | 7 days |
## MCR68−2 ## Silicon Controlled Rectifiers **Reverse Blocking Thyristors** Designed for overvoltage protection in crowbar circuits. ## **Features** ## **http://onsemi.com** - Glass-Passivated Junctions for Greater Parameter Stability and Reliability **SCRs 12 AMPERES RMS 50 VOLTS** - Center-Gate Geometry for Uniform Current Spreading Enabling High Discharge Current - Small Rugged, Thermowatt Package Constructed for Low Thermal Resistance and Maximum Power Dissipation and Durability - High Capacitor Discharge Current, 300 Amps **==> picture [125 x 73] intentionally omitted <==** **----- Start of picture text -----**<br> G<br>A opr0 K<br>MARKING<br>DIAGRAM<br>**----- End of picture text -----**<br> - Pb−Free Package is Available* **MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise noted) **Rating Symbol Value Unit MARKING** Peak Repetitive Off−State Voltage (Note 1)(TJ = 40 to +125 ° C, Gate Open) VVDRM,RRM 50 V **DIAGRAM** MCR68−2 Peak Discharge Current (Note 2) ITM 300 A ~~TT~~ On-State RMS Current(180 ° Conduction Angles; TC = 85 ° C) IT(RMS) 12 A AY WW Average On-State Current(180 ° Conduction Angles; TC = 85 ° C) IT(AV) 8.0 A MCR68−2GAKA ~~Oe~~ Peak Non-Repetitive Surge Current ITSM 100 A **TO−220AB** (1/2 Cycle, Sine Wave, 60 Hz, TJ = 125 ° C) 1 **CASE 221A−07** Circuit Fusing Considerations (t = 8.3 ms) I[2] t 40 A[2] s 2 3 **STYLE 3** ~~rr~~ i TT Forward Peak Gate Current IGM 2.0 A ~~es~~ (t ≤ 1.0 s, TC = 85 ° C) ~~ee ee~~ A = Assembly Location Forward Peak Gate Power PGM 20 W Y = Year (t ≤ 1.0 s, TC = 85 ° C) WW = Work Week ~~ee~~ G = Pb−Free Package Forward Average Gate Power(t = 8.3 ms, TC = 85 ° C) PG(AV) 0.5 W AKA = Diode Polarity Operating Junction Temperature Range TJ −40 to +125 ° C Storage Temperature Range Tstg −40 to +150 ° C **PIN ASSIGNMENT** 1 Cathode Mounting Torque − 8.0 in. lb. 2 Anode Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not 3 Gate normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and ~~ee ee ee =—~~ 4 Anode reliability may be affected. 1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall **ORDERING INFORMATION** not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the **Device Package Shipping** voltage ratings of the devices are exceeded. |**Device**|**Package**|**Shipping**| |---|---|---| |MCR68−2|TO−220AB|500 Units / Box| |MCR68−2G|TO−220AB<br>(Pb−Free)|500 Units / Box| 2. Ratings apply for tw = 1 ms. See Figure 1 for ITM capability for various duration of an exponentially decaying current waveform, tw is defined as 5 time constants of an exponentially decaying current pulse. - *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. **Preferred** devices are recommended choices for future use and best overall value. Publication Order Number: **1** © Semiconductor Components Industries, LLC, 2005 **December, 2005 − Rev. 2** **MCR68/D** **MCR68−2** ## **THERMAL CHARACTERISTICS** |**THERMAL CHARACTERISTICS**|||| |---|---|---|---| |**Characteristic**|**Symbol**|**Max**|**Unit**| |Thermal Resistance, Junction−to−Case|R�JC|2.0|°C/W| |Thermal Resistance, Junction−to−Ambient|R�JA|60|°C/W| |Maximum Lead Temperature for Soldering Purposes 1/8″from Case for 10 Seconds|TL|260|°C| |**ELECTRICAL CHARACTERISTICS** (TC= 25°C unless otherwise noted.)|||||| |---|---|---|---|---|---| |**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**| |**OFF CHARACTERISTICS**|||||| |Peak Repetitive Forward or Reverse Blocking Current<br>(VAK= Rated VDRMor VRRM, Gate Open)<br>TJ= 25°C<br>TJ= 125°C|IDRM, IRRM|−<br>−|−<br>−|10<br>2.0|�A<br>mA| |**ON CHARACTERISTICS**|||||| |Peak Forward On-State Voltage<br>(ITM= 24 A) (Note 3)<br>(ITM= 300 A, tw= 1 ms) (Note 4)|VTM|−<br>−|−<br>6.0|2.2<br>−|V| |Gate Trigger Current (Continuous dc)<br>(VD= 12 V, RL= 100�)|IGT|2.0|7.0|30|mA| |Gate Trigger Voltage (Continuous dc)<br>(VD= 12 V, RL= 100�)|VGT|−|0.65|1.5|V| |Gate Non−Trigger Voltage<br>(VD= 12 Vdc, RL= 100�, TJ= 125°C)|VGD|0.2|0.40|−|V| |Holding Current<br>(VD= 12 V, Initiating Current = 200 mA, Gate Open)|IH|3.0|15|50|mA| |Latching Current<br>(VD= 12 Vdc, IG= 150 mA)|IL|−|−|60|mA| |Gate Controlled Turn-On Time (Note 5)<br>(VD= Rated VDRM, IG= 150 mA)<br>(ITM= 24 A Peak)|tgt|−|1.0|−|�s| |**DYNAMIC CHARACTERISTICS**|||||| |Critical Rate-of-Rise of Off-State Voltage<br>(VD= Rated VDRM, Gate Open, Exponential Waveform, TJ= 125°C)|dv/dt|10|−|−|V/�s| |Critical Rate-of-Rise of On-State Current<br>IG= 150 mA<br>TJ= 125°C|di/dt|−|−|75|A/�s| 3. Pulse duration � 300 � s, duty cycle � 2%. 4. Ratings apply for tw = 1 ms. See Figure 1 for ITM capability for various durations of an exponentially decaying current waveform. tw is defined as 5 time constants of an exponentially decaying current pulse. 5. The gate controlled turn-on time in a crowbar circuit will be influenced by the circuit inductance. **http://onsemi.com** **2** **MCR68−2** ## **Voltage Current Characteristic of SCR** **==> picture [491 x 611] intentionally omitted <==** **----- Start of picture text -----**<br> + Current<br>Anode +<br>Symbol Parameter VTM<br>VDRM Peak Repetitive Off State Forward Voltage<br>on state<br>IDRM Peak Forward Blocking Current<br>VRRM Peak Repetitive Off State Reverse Voltage IRRM at VRRM IH<br>IRRM Peak Reverse Blocking Current<br>VTM Peak On State Voltage + Voltage<br>IH Holding Current Reverse Blocking Region IDRM at VDRM<br>(off state) Forward Blocking Region<br>(off state)<br>Reverse Avalanche Region<br>Anode −<br>1000<br>1.0<br>300<br>200 0.8<br>0.6<br>100<br>ITM<br>0.4<br>50<br>tw 0.2<br>tw = 5 time constants<br>20 0<br>0.5 1.0 2.0 5.0 10 20 50 25 50 75 100 125<br>tw, PULSE CURRENT DURATION (ms) TC, CASE TEMPERATURE (°C)<br>Figure 1. Peak Capacitor Discharge Current Figure 2. Peak Capacitor Discharge Current<br>Derating<br>125 20<br>120 18 Half Wave<br>115<br>110 dc 14 dc<br>105<br>100 10<br>Half Wave<br>95 8.0 TJ = 125°C<br>90<br>85 4.0<br>80 2.0<br>75<br>1.0 2.0 5.0 8.0 10 1.0 2.0 4.0 5.0 8.0 10<br>IT(AV), AVERAGE ON-STATE CURRENT (AMPS) IT(AV), AVERAGE ON-STATE CURRENT (AMPS)<br>NORMALIZED PEAK CURRENT<br>I , PEAK DISCHARGE CURRENT (AMPS)TM<br>°<br>CASE TEMPERATURE ( C)<br>C<br>T , MAXIMUM (AV)<br>P , AVERAGE POWER DISSIPATION (WATTS)<br>**----- End of picture text -----**<br> **Figure 3. Current Derating** **Figure 4. Maximum Power Dissipation** **http://onsemi.com** **3** **MCR68−2** **==> picture [513 x 176] intentionally omitted <==** **----- Start of picture text -----**<br> 1<br>0.7<br>0.5<br>0.3<br>0.2<br>Z�JC(t) = R�JC • r(t)<br>0.1<br>0.07<br>0.05<br>0.03<br>0.02<br>0.01<br>0.1 0.2 0.3 0.5 1 2 3 5 10 20 30 50 100 200 300 500 1 k 2 k 3 k 5 k 10 k<br>t, TIME (ms)<br>r(t), TRANSIENT THERMAL RESISTANCE(NORMALIZED)<br>**----- End of picture text -----**<br> **Figure 5. Thermal Response** **==> picture [507 x 399] intentionally omitted <==** **----- Start of picture text -----**<br> 10<br>1.4<br>5.0<br>VD = 12 Volts<br>3.0 RL = 100 � 1.2 VD = 12 Volts<br>2.0 RL = 100 �<br>1.0 1.0<br>0.5<br>0.8<br>0.3<br>0.2<br>0.5<br>−60 −40 −20 0 20 40 60 80 100 120 140 −60 −40 −20 0 20 40 60 80 100 120 140<br>TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)<br>Figure 6. Gate Trigger Current Figure 7. Gate Trigger Voltage<br>3.0<br>2.0<br>VD = 12 Volts<br>ITM = 100 mA<br>1.0<br>0.8<br>0.5<br>0.3<br>−60 −40 −20 0 20 40 60 80 100 120 140<br>TJ, JUNCTION TEMPERATURE (°C)<br>NORMALIZED GATE TRIGGER CURRENT NORMALIZED GATE TRIGGER VOLTAGE<br>NORMALIZED HOLD CURRENT<br>**----- End of picture text -----**<br> **Figure 8. Holding Current** **http://onsemi.com** **4** **MCR68−2** ## **PACKAGE DIMENSIONS** **TO−220AB** CASE 221A−07 ISSUE AA **==> picture [241 x 190] intentionally omitted <==** **----- Start of picture text -----**<br> −T− SEATINGPLANE<br>B F C<br>T<br>S<br>4<br>Q A<br>1 2 3 U<br>H<br>K<br>Z<br>L R<br>V i J<br>G<br>D<br>N<br>**----- End of picture text -----**<br> |NOTES:|NOTES:||||||| |---|---|---|---|---|---|---|---| |1. DIMENSIONING AND TOLERANCING PER ANSI|||DIMENSIONING AND TOLERANCING PER ANSI||||| |Y14.5M, 1982.|||||||| |2. CONTROLLING DIMENSION: INCH.|||||||| |3. DIMENSION Z DEFINES A ZONE WHERE ALL|||||||| |BODY AND LEAD IRREGULARITIES ARE||BODY AND LEAD IRREGULARITIES ARE||||BODY AND LEAD IRREGULARITIES ARE|| |ALLOWED.|||||||| |||INCHES||MILLIMETERS|||| ||DIM|MIN|MAX|MIN||MAX|| ||A|0.570|0.620|14.48||15.75|| ||B|0.380|0.405|9.66||10.28|| ||C|0.160|0.190|4.07||4.82|| ||D|0.025|0.035|0.64||0.88|| ||F|0.142|0.147|3.61||3.73|| ||G|0.095|0.105|2.42||2.66|| ||H|0.110|0.155|2.80||3.93|| ||J|0.014|0.022|0.36||0.55|| ||K|0.500|0.562|12.70||14.27|| ||L|0.045|0.060|1.15||1.52|| ||N|0.190|0.210|4.83||5.33|| ||Q|0.100|0.120|2.54||3.04|| ||R|0.080|0.110|2.04||2.79|| ||S|0.045|0.055|1.15||1.39|| ||T|0.235|0.255|5.97||6.47|| ||U|0.000|0.050|0.00||1.27|| ||V|0.045|−−−|1.15||−−−|| ||Z|−−−|0.080|−−−||2.04|| ||STYLE 3:||||||| ||PIN 1.<br>CATHODE||||||| |||2.<br>ANODE|||||| |||3.<br>GATE|||||| |||4.<br>ANODE|||||| **ON Semiconductor** and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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This literature is subject to all applicable copyright laws and is not for resale in any manner. ## **PUBLICATION ORDERING INFORMATION** **LITERATURE FULFILLMENT** : **N. American Technical Support** : 800−282−9855 Toll Free **ON Semiconductor Website** : http://onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA **Order Literature** : http://www.onsemi.com/litorder **Phone** : 480−829−7710 or 800−344−3860 Toll Free USA/Canada **Japan** : ON Semiconductor, Japan Customer Focus Center **Fax** : 480−829−7709 or 800−344−3867 Toll Free USA/Canada 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 For additional information, please contact your **Email** : orderlit@onsemi.com **Phone** : 81−3−5773−3850 local Sales Representative. ## **LITERATURE FULFILLMENT** : **MCR68/D** **http://onsemi.com 5**
Updated at February 9, 2023
Founded in 1927 and headquartered in Chicago, Illinois, Littelfuse is a premier global manufacturer of circuit protection, power control, and sensing technologies. Widely recognized for pioneering the first small, fast-acting protective fuse, the company has grown into an industry leader whose highly reliable components are essential to modern industrial, transportation, and consumer electronics applications worldwide. At the core of the Littelfuse portfolio is an expansive and industry-leading range of circuit protection solutions. This encompasses a massive selection of traditional fuses, fuse holders, and resettable PTC thermistor fuses designed to safely interrupt overcurrent conditions. To defend against electrical overstress, Littelfuse also provides advanced transient voltage suppression (TVS) technologies, including thousands of specialized TVS diodes, TVS varistors, and gas discharge tubes (GDTs) that ensure robust defense against voltage spikes and environmental hazards. Beyond its foundational protection components, Littelfuse manufactures a diverse array of discrete semiconductors, sensors, and switching devices. Engineers rely on their high-performance thyristors, including TRIACs and SCRs, alongside power-efficient Schottky diodes and MOSFETs for demanding power control applications. Complemented by precision proximity sensors and highly reliable reed and solid-state relays, Littelfuse delivers the critical building blocks required for secure, efficient, and complete system design.
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