MCOT096064B1V-GM

Electra House, 32 Southtown Road Great Yarmouth, Norfolk NR31 0DU, England 

Telephone +44 (0)1493 602602 Fax +44 (0)1493 665111 Email:sales@midasdisplays.com www.midasdisplays.com 

|MCOT096064B1V-GM|MCOT096064B1V-GM|96 x 64|96 x 64|Green||
|---|---|---|---|---|---|
|**Specification**||||||
|Version:5|||Date:19/03/2018|||
|**Revision**||||||
|3<br>4<br>1<br>2<br>5|06/04/2014<br>09/02/2015<br>08/12/2015<br>01/06/2016<br>23/01/2018||First Release.<br>Modify Thickness,Modify Luminance, Modify VCC.<br>Modify Life Time.<br>Modify Static Electricity Test.<br>Modify Reliability Test Condition.|||



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fResoution—<—~—SC“‘CSSSCCOCOCOCC~* 96 x 64<br>Green on Black<br>[Appearance<br>3V<br>Logic Voltage =, Va<br>Parallel / SPI / I [2] C<br>fInterface<br>24.90 x 22.95 x 1.65 mm<br>Module Size | [es]<br>Operating Temperature Box -40°C ~ +80°C 2 Quantity | Weight<br>OBY<br>[ C onstruction<br>* - For full design functionality, please use this<br>**----- End of picture text -----**<br>


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White on Black<br>Blue on Black<br>Yellow<br>**----- End of picture text -----**<br>


## Contents 

1.General Specification 

- 2.Module Classification Information 

- 3.Interface Pin Function 

- 4.Contour Drawing & Block Diagram 

5.Absolute Maximum Ratings 

- 6.Electrical Characteristics 

- 7.Optical Characteristics 

8.OLED Lifetime 

9.Reliability 

10.Inspection specification 

- 11.Precautions in use of OLED Modules 

## **1.General Specification** 

The Features is described as follow: 

- Module dimension: 24.90 x 22.95 x 1.65 mm 

- Active area: 19.946 x 13.418 mm 

- Dot Matrix: 96 x 64 

- Dot size: 0.186 x 0.188 mm 

- Dot pitch: 0.208 x 0.210 mm 

- Display Mode: Passive Matrix 

- Duty: 1/64 Duty 

- Display Color: OLED , Green 

- Controller IC: SSD1305Z 

- Interface: 6800,8080,SPI,I2C 

- Size: 0.95 inch 

## **3.Interface Pin Function** 

|**Pin**<br>**Number**|**Symbol I/O**|**Symbol I/O**|**Function**|
|---|---|---|---|
|1.|N.C.<br>(GND)|-|Reserved Pin(Supporting Pin)<br>The supporting pins can reduce the influences from stresses on the<br>function pins. These pins must be connected to external ground.|
|2.|VCC|P|Power Supply for OLED Panel<br>This is the most positive voltage supply pin of the chip.It must be<br>supplied externally.|
|3.|VSS|P|Ground of Logic Circuit<br>This is a ground pin. It also acts as a reference for the logic pins. It<br>must be connected to external ground.|
|4.|VDD|P|Power Supply for Logic Circuit<br>This is a voltage supply pin. It must be connected to external source.|
|5.|VDDIO|P|Power supply for interface logic level.<br>It should be match with MCU interface voltage level. VDDIO must<br>always be equal or lower than VDD.|
|6.|BS1<br>BS2|I|Communicating Protocol Select<br>These pins are MCU interface selection input. See the following<br>table:<br>68XX-parallel 80XX-parallel Serial<br>I2C<br>BS1<br>0<br>1<br>0<br>1<br>BS2<br>1<br>1<br>0<br>0|
|7.||||
|8.|CS#|I|Chip Select<br>This pin is the chip select input. The chip is enabled for MCU<br>communication only when CS# is pulled low.|
|9.|RES#|I|Power Reset for Controller and Driver<br>This pin is reset signal input. When the pin is low, initialization of the<br>chip is executed.|
|10.<br>~~lz~~|D/C#<br>~~lz~~|I<br>~~lz~~|Data/ Command Control<br>This pin is Data/Command control pin. When the pin is pulled high,<br>the input at D7~D0 is treated as display data. When the pin is pulled<br>low, the input at D7~D0 will be transferred to the command register.<br>For detail relationship to MCU interface signals, please refer to the<br>Timing Characteristics Diagrams.<br>When the pin is pulled high and serial interface mode is selected,<br>the data at SDIN is treated as data. When it is pulled low, the data at<br>SDIN will be transferred to the command register. In I2C mode, this<br>pin acts as SA0 for slave address selection.<br>~~lz~~|
|11.<br>~~iy~~|R/W#<br>~~iy~~|I<br>~~iy~~|Read/ Write Selector Write<br>This pin is MCU interface input. When interfacing to a68XX-series<br>microprocessor, this pin will be used as Read/Write (R/W#) selection<br>input. Pull this pin to “High” for read mode and pull it to “Low” for<br>write mode.<br>When 80XXinterface mode is selected, this pin will be the Write<br>(WR#) input. Data write operation is initiated when this pin is pulled<br>low and the CS# is pulled low.<br>~~iy~~|



|12.|E/RD#|I|Read/Write Enable or Read<br>This pin is MCU interface input. When interfacing to a68XX-series<br>microprocessor, this pin will be used as the Enable (E) signal.<br>Read/write operation is initiated when this pin is pulled high and the<br>CS# is pulled low.<br>When connecting to an 80XX-microprocessor, this pin receives the<br>Read (RD#) signal. Data read operation is initiated when this pin is<br>pulled low and CS# is pulled low.|
|---|---|---|---|
|13.|D0~D7|I/O|Host Data In put/ Output Bus<br>These pins are 8-bit bi-directional data bus to be connected to the<br>microprocessor’s data bus. When serial mode is selected, D1 will be<br>the serial data input SDIN and D0 will be the serial clock input<br>SCLK. When I2Cmode is selected, D2 & D1 should be tired together<br>and serve as SDAout & SDAin in application and D0 is the serial<br>clock input SCL.|
|14.||||
|15.||||
|16.||||
|17.||||
|18.||||
|19.||||
|20.||||
|21.|IREF|I|Current Reference for Brightness Adjustment<br>This pin is segment current reference pin. A resistor should be<br>connected between this pin and VSS. Set the current lower than<br>10μA.|
|22.|VCOMH|O|Voltage Output High Level for COM Signal<br>This pin is the input pin for the voltage output high level for COM<br>signals. A capacitor should be connected between this pin and VSS.|
|23.|VCC|P|Power Supply for OLED Panel<br>This is the most positive voltage supply pin of the chip.It must be<br>supplied externally.|
|24.|VLSS|P|Ground of Analog Circuit<br>This is an analog ground pin. It should be connected to VSS<br>externally.|
|25.|N.C.<br>(GND)|-|Reserved Pin(Supporting Pin)<br>The supporting pins can reduce the influences from stresses on the<br>function pins. These pins must be connected to external ground.|



## **4.Contour Drawing & Block Diagram** 

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## **FUNCTION BLOCK DIAGRAM** 

*For more information, please refer to Application Note provided by Midas. 

## **5.Absolute Maximum Ratings** 

|**Parameter**|**Symbol**|**Min**|**Max**|**Unit**|**Notes**|
|---|---|---|---|---|---|
|Supply Voltage for Logic|VDD|-0.3|4|V|1, 2|
|Supply Voltage for Display|VCC|0|15|V|1, 2|
|Operating Temperature|TOP|-40|+80|°C|-|
|Storage Temperature|TSTG|-40|+85|°C|-|



Note 1: All the above voltages are on the basis of “VSS = 0V”. Note 2: When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur. Also, for normal operations, it is desirable to use this module under the conditions according to Section6 “Electrical Characteristics”. If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate 

## **6.Electrical Characteristics** 

|**Item**|**Symbol**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Supply Voltage for Logic|VDD|－|2.8|3.0|3.3|V|
|Supply Voltage for Display|VCC|－|9.5|10.0|10.5|V|
|Input High Volt.|VIH|－|0.8×VDD|－|VDDIO|V|
|Input Low Volt.|VIL|－|0|－|0.2×VDD|V|
|Output High Volt.|VOH|－|0.9×VDD|－|VDDIO|V|
|Output Low Volt.|VOL|－|0|－|0.1×VDD|V|
|50% Check Board operating<br>Current|ICC|VCC=10.0V|5.8|6.0|7.5|mA|



## **7.Optical Characteristics** 

|**Item**|**Symbol**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|View Angle|(V)θ|－|160|－|－|deg|
||(H)φ|－|160|－|－|deg|
|Contrast Ratio|CR|Dark|2000:1|－|－|－|
|Response Time|T rise|－|－|10|－|μs|
||T fall|－|－|10|－|μs|
|Display with 50% check Board Brightness|||60|80|－|cd/m2|
|CIEx(Green)||(CIE1931)|0.24|0.28|0.32|－|
|CIEy(Green)||(CIE1931)|0.59|0.63|0.67|－|



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Yellowish<br>green<br>a Yellow<br>\Ae ae green<br>Ne<br>\e<br>Bluish  green<br>x<br>x<br>blue Greenish  X  Purplish pink<br>**----- End of picture text -----**<br>


## **8.OLED Lifetime** 

|ITEM|Conditions|Min|Typ|Remark|
|---|---|---|---|---|
|Operating<br>Life Time|Ta=25**℃**<br>/ Initial 50% check board<br>brightness Typical Value|40,000 Hrs|-|Note|



## Notes: 

1. Life time is defined the amount of time when the luminance has decayed to <50% of the initial value. 

2. This analysis method uses life data obtained under accelerated conditions to extrapolate an estimated probability density function ( _pdf_ ) for the product under normal use conditions. 

3. Screen saving mode will extend OLED lifetime. 

## **9.Reliability** 

## **Content of Reliability Test** 

## **Environmental Test** 

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|---|---|---|---|---|
|**Environmental Test**|||||
|**Test Item**|**Content of Test**|**Test Condition**|**Applicable**<br>**Standard**||
|High<br>Temperature<br>storage|Endurance test applying the high<br>storage temperature for a long time.|85°C<br>240hrs|——||
|Low<br>Temperature<br>storage|Endurance test applying the low storage<br>temperature for a long time.|Endurance test applying the low storage<br>-40°C<br>240hrs|——||
|High<br>Temperature<br>Operation|Endurance test applying the electric<br>stress (Voltage & Current) and the<br>thermal stress to the element for a long<br>time.|80°C<br>240hrs|——||
|Low<br>Temperature<br>Operation|Endurance test applying the electric<br>stress under low temperature for a long<br>time.|-40°C<br>240hrs|——||
|High<br>Temperature/<br>Humidity<br>Storage|Endurance test applying the high<br>temperature and high humidity storage<br>for a long time.|60°C,90%RH<br>240hrs|——||
|High<br>Temperature/<br>Humidity<br>Operation|Endurance test applying the high<br>temperature and high humidity<br>Operation for a long time.|60°C,90%RH<br>120hrs|——||
|Temperature<br>Cycle|Endurance test applying the low and<br>high temperature cycle.<br>-40°C    25°C     80°C<br>30min    5min     30min<br>1cycle|-40°C /80°C<br>30 cycles|——||
|Mechanical Test|||||
|Vibration test|Endurance test applying the vibration<br>during transportation and using.|Frequency:10~55Hz<br>amplitude:1.5mm<br>Time:0.5hrs/axis<br>Test axis:X,Y,Z|——||
|Others|||||
|Static<br>electricity test|Endurance test applying the electric<br>stress to the terminal.|Air Discharge model<br>±4kv,10 times||——|



*** Supply voltage for OLED system =Operating voltage at 25°C 

## **Test and measurement conditions** 

1. All measurements shall not be started until the specimens attain to temperature stability. After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH. 

2. All-pixels-on is used as operation test pattern. 

3. The degradation of Polarizer are ignored for High Temperature storage, High Temperature/ Humidity Storage, Temperature Cycle 

**Evaluation criteria** 

1. The function test is OK. 

2. No observable defects. 

3. Luminance: > 50% of initial value. 

4. Current consumption: within ± 50% of initial value. 

## **APPENDIX:** 

## **RESIDUE IMAGE** 

Because the pixels are lighted in different time, the luminance of active pixels may reduce or differ from inactive pixels. Therefore, the residue image will occur. To avoid the residue image, every pixel needs to be lighted up uniformly. 

## **10.Inspection specification** 

|NO|Item|Criterion|AQL|
|---|---|---|---|
|01|Electrical<br>Testing|1.1 Missing vertical, horizontal segment, segment contrast defect.<br>1.2 Missing character , dot or icon.<br>1.3 Display malfunction.<br>1.4 No function or no display.<br>1.5 Current consumption exceeds product specifications.<br>1.6 OLED viewing angle defect.<br>1.7 Mixed product types.<br>1.8 Contrast defect.|0.65|
|02|Black or<br>white<br>spots on<br>OLED<br>(display<br>only)<br>~~N4i~~|2.1 White and black spots on display≦0.25mm, no more than three<br>white or black spots present.<br>2.2 Densely spaced: No more than two spots or lines within 3mm.<br>~~N4i as~~|2.5<br>~~as~~|
|03|OLED<br>black<br>spots,<br>white<br>spots,<br>contamin<br>ation<br>(non-disp<br>lay)<br>~~N4i~~|3.1 Round type :<br>As following drawing<br>Φ=( x + y ) / 2<br>SIZE<br>Acceptable QTY<br>Φ**≦**0.10<br>Accept no dense<br>0.10**＜**Φ**≦**0.20<br>2<br>0.20**＜**Φ**≦**0.25<br>1<br>0.25**＜**Φ<br>0<br>~~N4i as~~|2.5<br>~~as~~|
||~~N4i~~<br>~~a=~~|3.2 Line type : (As followingdrawing)<br>Length<br>Width<br>Acceptable Q TY<br>---<br>W**≦**0.02<br>Accept no dense<br>L**≦**3.0<br>0.02**＜**W**≦**0.03<br>2<br>L**≦**2.5<br>0.03**＜**W**≦**0.05<br>---<br>0.05**＜**W<br>As round type<br>~~N4i as~~<br>~~a=~~|2.5<br>~~as~~<br>~~a=~~|
|04|Polarizer<br>bubbles<br>~~a=~~|If bubbles are visible, judge<br>using black spot<br>specifications, not easy to<br>find, must check in specify<br>direction.<br>Size Φ<br>Acceptable Q TY<br>Φ**≦**0.20<br>Accept no dense<br>0.20**＜**Φ**≦**0.50<br>3<br>0.50**＜**Φ**≦**1.00<br>2<br>1.00**＜**Φ<br>0<br>Total Q TY<br>3<br>~~a=~~|2.5<br>~~a=~~|
|05<br>~~a~~|Scratches|Follow NO.3 OLED black spots, white spots, contamination.||



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a NO  Item  es Criterion  AQL<br>Symbols Define:<br>x: Chip length      y: Chip width     z: Chip thickness<br>k: Seal width       t: Glass thickness  a: OLED side length<br>L: Electrode pad length:<br>6.1 General glass chip :<br>6.1.1 Chip on panel surface and crack between panels:<br>z: Chip thickness  y: Chip width  x: Chip length<br>Chipped  Z ≦ 1/2t  Not over viewing area  x ≦ 1/8a  2.5<br>glass<br>1/2t ＜ z ≦ 2t  Not exceed 1/3k  x ≦ 1/8a<br>☉ If there are 2 or more chips, x is total length of each chip.<br>6.1.2 Corner crack:<br>06<br>‘eos<br>z: Chip thickness  y: Chip width  x: Chip length<br>Z ≦ 1/2t  Not over viewing area  x ≦ 1/8a<br>ate 1/2t ＜ z ≦ 2t  Not exceed 1/3k  (ae,— x ≦ 1/8a<br>☉ If there are 2 or more chips, x is the total length of each chip.<br>Symbols :<br>x: Chip length      y: Chip width     z: Chip thickness<br>k: Seal width       t: Glass thickness  a: OLED side length<br>L: Electrode pad length<br>6.2 Protrusion over terminal :<br>6.2.1 Chip on electrode pad :<br>Glass<br>crack  SESL 2.5<br>y: Chip width  x: Chip length  z: Chip thickness<br>y ≦ 0.5mm  x ≦ 1/8a  0  ＜  z  ≦  t<br>**----- End of picture text -----**<br>


|NO<br>~~a~~|Item|Criterion|AQL|
|---|---|---|---|
|06|Glass<br>crack|6.2.2 Non-conductive portion:<br>y: Chip width<br>x: Chip length<br>z: Chip thickness<br>y**≦**L<br>x**≦**1/8a<br>0**＜**z**≦**t<br>**☉**If the chipped area touches the ITO terminal, over 2/3 of the ITO<br>must remain and be inspected according to electrode terminal<br>specifications.<br>**☉**If the product will be heat sealed by the customer, the alignment<br>mark not be damaged.<br>6.2.3 Substrate protuberance and internal crack.<br>y: width<br>x: length<br>y**≦**1/3L<br>x**≦**a<br>L<br>L<br>y aeent nat<br>i}Z<br>yit ate<br>i}Z<br>AN >aaa<br>.<br>ered<br>xX<br>~~X~~<br>~~—SAD~~|2.5<br>X|
|07|Cracked<br>glass|The OLED with extensive crack is not acceptable.|2.5|
|08|Backlight<br>elements|8.1 Illumination source flickers when lit.<br>8.2 Spots or scratched that appear when lit must be judged. Using<br>OLED spot, lines and contamination standards.<br>8.3 Backlight doesn’t light or color wrong.|0.65<br>2.5<br>0.65|
|09|Bezel|9.1 Bezel may not have rust, be deformed or have fingerprints,<br>stains or other contamination.<br>9.2 Bezel must comply with job specifications.|2.5<br>0.65|



|NO|Item|Criterion|AQL|
|---|---|---|---|
|10|PCB , COB|10.1 COB seal may not have pinholes larger than 0.2mm or<br>contamination.<br>10.2 COB seal surface may not have pinholes through to the IC.<br>10.3 The height of the COB should not exceed the height<br>indicated in the assembly diagram.<br>10.4 There may not be more than 2mm of sealant outside the<br>seal area on the PCB. And there should be no more than<br>three places.<br>10.5 No oxidation or contamination PCB terminals.<br>10.6 Parts on PCB must be the same as on the production<br>characteristic chart. There should be no wrong parts,<br>missing parts or excess parts.<br>10.7 The jumper on the PCB should conform to the product<br>characteristic chart.<br>10.8 If solder gets on bezel tab pads, OLED pad, zebra pad or<br>screw hold pad, make sure it is smoothed down.|2.5<br>2.5<br>0.65<br>2.5<br>2.5<br>0.65<br>0.65<br>2.5|
|11|Soldering|11.1 No un-melted solder paste may be present on the PCB.<br>11.2 No cold solder joints, missing solder connections, oxidation<br>or icicle.<br>11.3 No residue or solder balls on PCB.<br>11.4 No short circuits in components on PCB.|2.5<br>2.5<br>2.5<br>0.65|
|12|General<br>appearance|12.1 No oxidation, contamination, curves or, bends on interface<br>Pin (OLB) of TCP.<br>12.2 No cracks on interface pin (OLB) of TCP.<br>12.3 No contamination, solder residue or solder balls on<br>product.<br>12.4 The IC on the TCP may not be damaged, circuits.<br>12.5 The uppermost edge of the protective strip on the interface<br>pin must be present or look as if it cause the interface pin to<br>sever.<br>12.6 The residual rosin or tin oil of soldering (component or chip<br>component) is not burned into brown or black color.<br>12.7 Sealant on top of the ITO circuit has not hardened.<br>12.8 Pin type must match type in specification sheet.<br>12.9 OLED pin loose or missing pins.<br>12.10 Product packaging must the same as specified on<br>packaging specification sheet.<br>12.11 Product dimension and structure must conform to product<br>specification sheet.|2.5<br>0.65<br>2.5<br>2.5<br>2.5<br>2.5<br>2.5<br>0.65<br>0.65<br>0.65<br>0.65|



|**Check Item**|**Classification**|**Criteria**|
|---|---|---|
|No Display|Major||
|Missing Line|Major|BRREMRSETeeaaRs<br>ARRAS<br>Beas<br>QUEER<br>ERARES<br>DHE<br>RARIeAAE<br>BuRERSSRRRRANES<br>SHARE<br>RADA ee<br>a<br>EEE<br>BaaS3<br>SESaSSNes<br>ANGE FBR<br>Pebee Edel fehl<br>ST Pee<br>Banas<br>BSHARRHES<br>BED Peewee<br>~~GRREEBRR~~|
|Pixel Short|Major|~~GRREE BRR~~<br>~~HY~~<br>~~A~~<br>Aa<br>SS ESeeeaseee<br>AVR LESSER eWRS<br>ee eke Feel eee<br>Cee<br>Poo<br>Se<br>mal |<br>epee eh<br>A0NGGe GEOenan<br>~~BRUGGE.<GRESRER~~|
|Darker Short|Major|~~BRUGGE. <GRESRER~~<br>Bavseea.<br>“““SE8<br>SGQ00850an—._<br>7)<br>|)‘GES<br>Sade SeHGGGnue<br>u<br>i<br>a<br>RRS<br>EPSees”<br>SRRSeaWwe.... ...08<br>~~Eee,[pipeAakers Reputnp|~~|
|Wrong Display|Major|~~Eee, [pipe Aakers Reputnp |~~<br>Banas Be paaeee<br>aga8s BA<br>Geen<br>Tt| mTHt<br>Phebe<br>SeaEaE<br>anna ee Bie tye<br>SaGES<br>SERRRREE<br>Tite<br>BT<br>RADE RRS<br>Bos~~tlee~~<br>sp)|
|Un-uniform<br>B/A x 100% < 70%<br>A/C x 100% < 70%|Major|Bos ~~tl ee~~<br>sp)<br>SSR<br>SE MRsam<br>SBE<br>eSBI<br>fepatel<br>fered deol<br>hot torts (esp eetank ras]<br>ape(eete et op fretie [ey<br>ep JODPot<br>oe feane<br>2 aee<br>Be<br>age<br>Brst<br>Heese<br>AD<br>Nocmal<br>Be<br>Let<br>C Wie Light Fixel<br>pie El|



## **11.Precautions in use of OLED Modules** 

- (1) Avoid applying excessive shocks to module or making any alterations or modifications to it. 

- (2) Don’t make extra holes on the printed circuit board, modify its shape or change the components of OLED display module. 

- (3) Don’t disassemble the OLED display module. 

- (4) Don’t operate it above the absolute maximum rating. 

- (5) Don’t drop, bend or twist OLED display module. 

- (6) Soldering: only to the I/O terminals. 

- (7) Storage: please storage in anti-static electricity container and clean environment. 

- (8) It's pretty common to use "Screen Saver" to extend the lifetime and Don't use fix 

   - information for long time in real application. 

- (9) Don't use fixed information in OLED panel for long time, that will extend "screen burn" effect time. 

- (10) Midas has the right to change the passive components, including R2and R3 adjust resistors.  (Resistors, capacitors and other passive components will have different appearance and color caused by the different supplier.) 

(11) Midas have the right to change the PCB Rev. (In order to satisfy the supplying stability, management optimization and the best product performance...etc, under the premise of not affecting the electrical characteristics and external dimensions, Midas have the right to modify the version.) 

## **11.1 Handling Precautions** 

- (1) Since the display panel is being made of glass, do not apply mechanical impacts such us dropping from a high position. 

- (2) If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale nor lick the organic substance. 

- (3) If pressure is applied to the display surface or its neighborhood of the OLED display module, the cell structure may be damaged and be careful not to apply pressure to these sections. 

- (4) The polarizer covering the surface of the OLED display module is soft and easily scratched. Please be careful when handling the OLED display module. 

- (5) When the surface of the polarizer of the OLED display module has soil, clean the surface. It takes advantage of by using following adhesion tape. 

- Scotch Mending Tape No. 810 or an equivalent 

Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent Also, pay attention that the following liquid and solvent may spoil the polarizer: 

- Water 

- Ketone 

- Aromatic Solvents 

- (6) Hold OLED display module very carefully when placing OLED display module into the System housing. Do not apply excessive stress or pressure to OLED display module. And, do not over bend the film with electrode pattern layouts. These stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases. 

(7) Do not apply stress to the LSI chips and the surrounding molded sections. 

- (8) Do not disassemble nor modify the OLED display module. 

- (9) Do not apply input signals while the logic power is off. 

- (10) Pay sufficient attention to the working environments when handing OLED display modules to prevent occurrence of element breakage accidents by static electricity. 

- Be sure to make human body grounding when handling OLED display modules. 

- Be sure to ground tools to use or assembly such as soldering irons. 

- To suppress generation of static electricity, avoid carrying out assembly work under dry environments. 

- Protective film is being applied to the surface of the display panel of the OLED display module. Be careful since static electricity may be generated when exfoliating the protective film. 

- (11) Protection film is being applied to the surface of the display panel and removes the protection film before assembling it. At this time, if the OLED display module has been stored surface of the display panel after removed of the film. In such case, remove the residue material by the method introduced in the above Section 5. 

- (12) If electric current is applied when the OLED display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful to avoid the above. 

## **11.2 Storage Precautions** 

- (1) When storing OLED display modules, put them in static electricity preventive bags avoiding exposure to direct sun light nor to lights of fluorescent lamps. And, also, avoiding high temperature and high humidity environment or low temperature (less than 0°C) environments.(We recommend you to store these modules in the packaged state when they were shipped from Midas. At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them. 

- (2) If electric current is applied when water drops are adhering to the surface of the OLED display module, when the OLED display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above. 

## **11.3 Designing Precautions** 

- (1) The absolute maximum ratings are the ratings which cannot be exceeded for OLED display module, and if these values are exceeded, panel damage may be happen. 

- (2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specifications and, at the same time, to make the signal line cable as short as possible. 

- (3) We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VDD). (Recommend value: 0.5A) 

- (4) Pay sufficient attention to avoid occurrence of mutual noise interference with the neighboring devices. 

- (5) As for EMI, take necessary measures on the equipment side basically. 

- (6) When fastening the OLED display module, fasten the external plastic housing section. 

- (7) If power supply to the OLED display module is forcibly shut down by such errors as taking out the main battery while the OLED display panel is in operation, we cannot guarantee the quality of this OLED display module. Connection (contact) to any other potential than the above may lead to rupture of the IC. 

- (8) The limitation of FPC and Film bending.