MC36232

## **Surface Mountable PTC Resettable Fuse** 

## **Specifications** 

Application : All high-density boards. Product Features :  Small surface mountable, solid state, faster time to trip than standard SMD devices, lower resistance than standard SMD devices. Max. Voltage : 6V to 60V. Compliant Temperature Range : -40°C to 85°C Approval : UL Approved 

## **Electrical Characteristics (23°C)** 

|**Hold**<br>**Current**<br>~~ee~~<br>~~ee~~|**Trip**<br>**Current**<br>~~ee~~|**Rated**<br>**Voltage**<br>~~ee~~|**Max.**<br>**Current**<br>~~ee~~|**Typical**<br>**Power**<br>~~ee~~<br>~~ee~~|**Max. Time to trip**<br>~~ee~~<br>~~ee~~|**Max. Time to trip**<br>~~ee~~<br>~~ee~~|**Resistance**<br>~~ee~~<br>~~eeee~~|**Resistance**<br>~~ee~~<br>~~eeee~~|**Part Number**|
|---|---|---|---|---|---|---|---|---|---|
||||||**Current**<br>~~ee~~<br>~~ee~~|**Time**<br>~~ee~~<br>~~ee~~<br>~~ee~~|**RMin**<br>~~ee~~<br>~~ee~~<br>~~ee~~|**R1Max**<br>~~ee~~<br>~~ee~~<br>~~ee~~||
|**Ih, A**<br>~~ee~~<br>~~ee~~<br>~~ee~~|**It, A**<br>~~ee~~<br>~~se~~<br>~~es~~|**Vmax, V DC**<br>~~ee~~<br>~~se~~<br>~~Ge~~|**Imax, A**<br>~~ee~~<br>~~se~~<br>~~sO~~|**Pd, W**<br>~~ee~~<br>~~se~~<br>~~sO~~|**Amperes**<br>~~ee~~<br>~~sO~~|**Seconds**<br>~~ee~~<br>~~ee~~|**Ω**<br>~~ee~~<br>~~ee~~|**Ω**<br>~~ee~~<br>~~ee~~||
|0.75<br>~~ee~~<br>~~ee~~<br>~~a~~|1.5<br>~~es~~<br>~~es~~|24<br>~~Ge~~<br>~~es es~~|40<br>~~sO~~<br>~~es~~|1<br>~~sO~~<br>~~ss~~|8<br>~~sO~~<br>~~ss~~|0.2<br>~~ee ~~|0.11<br> ~~ee ~~|0.29<br> ~~ee~~|MC36218|
|0.75<br>~~ee~~<br>~~a~~<br>~~ee~~|1.5<br>~~es~~<br>~~es~~<br>~~es ee~~|33<br>~~Ge~~<br>~~es es~~<br>~~ee~~|40<br>~~sO~~<br>~~es~~|1<br>~~sO~~<br>~~ss~~|8<br>~~sO~~<br>~~ss~~|0.2|0.11|0.4|MC36219|
|1.1<br>~~a~~<br>~~ee~~<br>~~Re~~|2.2<br>~~es~~<br>~~es ee~~<br>~~sn~~|24<br>~~es es~~<br>~~ee~~<br>~~sn~~|100<br>~~es ~~<br>~~ns~~|1<br> ~~ss~~<br>~~(OS~~|8<br>~~ss~~<br>~~(OS~~|0.5<br>~~(OS~~|0.06<br>~~(OS~~|0.2<br>~~(OS~~|MC36225<br>~~(OS~~|
|1.5<br>~~ee~~<br>~~Re~~<br>~~a~~|3<br>~~es ee~~<br>~~sn~~<br>~~a~~|12<br>~~ee~~<br>~~sn~~<br>~~es ee~~|100<br>~~ns~~<br>~~ee~~|1<br>~~(OS~~<br>~~es~~|8<br>~~(OS~~<br>~~es~~|0.5<br>~~(OS~~|0.04<br>~~(OS~~|0.11<br>~~(OS~~|MC36231<br>~~(OS~~|
|1.5<br>~~Re ~~<br>~~a~~<br>~~ee~~|3<br> ~~sn~~<br>~~a~~<br>~~ee~~|24<br>~~sn~~<br>~~es ee~~<br>~~ee~~|100<br>~~ns~~<br>~~ee~~<br>~~es~~|1<br>~~(OS~~<br>~~es~~|8<br>~~(OS~~<br>~~es~~<br>~~I~~|1.5<br>~~(OS~~<br>~~I~~|0.04<br>~~(OS~~|0.12<br>~~(OS~~|MC36232<br>~~(OS~~|
|1.6<br>~~a ~~<br>~~ee~~<br>~~a~~|3.2<br> ~~a~~<br>~~ee~~<br>~~es~~|16<br>~~es ee~~<br>~~ee~~<br>~~es~~|100<br>~~ee~~<br>~~es~~<br>~~es Qs~~|1<br>~~es~~<br>~~Qs~~|8<br>~~es~~<br>~~I~~|1<br>~~I~~|0.03|0.1|MC36235|
|2<br>~~ee ~~<br>~~a~~<br>~~ee~~|3.5<br> ~~ee~~<br>~~es~~<br>~~ee~~|8<br>~~ee~~<br>~~es~~<br>~~es ee~~|100<br>~~es~~<br>~~es Qs~~<br>~~ee~~|1<br>~~Qs~~<br>~~se~~|8<br>~~I~~<br>~~se~~|2<br>~~I~~<br>~~se~~|0.02|0.07|MC36238|
|2.6<br>~~a~~<br>~~ee~~<br>~~es~~|5<br>~~es ~~<br>~~ee~~<br>~~es es~~|13.2<br> ~~es ~~<br>~~es ee~~<br>~~es~~|100<br> ~~es Qs~~<br>~~ee~~<br>~~DD~~|1.3<br>~~Qs~~<br>~~se~~<br>~~DD~~|8<br>~~se~~<br>~~GS~~|5<br>~~se~~<br>~~GS~~|0.015<br>~~GO~~|0.05<br>~~OD~~|MC36242|
|2.6<br>~~ee~~<br>~~es~~|5<br>~~ee~~<br>~~es es~~|16<br>~~es ee~~<br>~~es~~|100<br>~~ee ~~<br>~~DD~~|1.3<br> ~~se~~<br>~~DD~~|8<br>~~se~~<br>~~GS~~|5<br>~~se~~<br>~~GS~~|0.015<br>~~GO~~|0.05<br>~~OD~~|MC36243|



Ih = Hold current-maximum current at which the device will not trip at 23°C still air. 

It = Trip current-minimum current at which the device will always trip at 23°C still air. Vmax = Maximum voltage device can withstand without damage at its rated current (I maximum). Imax = Maximum fault current device can withstand without damage at rated voltage (V maximum). 

Pd =  Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23°C still air environment. 

RMin = Minimum device resistance at 23°C prior to tripping. R1Max = Maximum device resistance at 23°C measured 1 hour after tripping or reflow soldering of 260°C for 20 seconds. Termination pad characteristics 

Termination pad materials: Pure tin. 

## **FSMD Product Diagram** 

**==> picture [102 x 6] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1 Figure 2<br>**----- End of picture text -----**<br>


|**A(mm)**|**A(mm)**|**B(mm)**|**B(mm)**|**C(mm)**|**C(mm)**|**D(mm)**|**D(mm)**|**E(mm)**|**E(mm)**|**Figure**|**Part Number**|
|---|---|---|---|---|---|---|---|---|---|---|---|
|**Min.**|**Max.**|**Min.**|**Max.**|**Min.**|**Max.**|**Min.**|**Max.**|**Min.**|**Max.**|||
|4.37|4.73|3.07|3.41|0.8|1.55|0.25|0.95|0.25|0.65|2|MC36218|
|4.37|4.73|3.07|3.41|0.8|1.55|0.25|0.95|0.25|0.65|2|MC36219|



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## **Surface Mountable PTC Resettable Fuse** 

|**A(mm)**|**A(mm)**|**B(mm)**|**B(mm)**|**C(mm)**|**C(mm)**|**D(mm)**|**D(mm)**|**E(mm)**|**E(mm)**|**Figure**|**Part Number**|
|---|---|---|---|---|---|---|---|---|---|---|---|
|**Min.**|**Max.**|**Min.**|**Max.**|**Min.**|**Max.**|**Min.**|**Max.**|**Min.**|**Max.**|||
|4.37|4.73|3.07|3.41|0.8|1.3|0.25|0.95|0.25|0.65|2|MC36225|
|4.37|4.73|3.07|3.41|0.6|1.1|0.25|0.95|0.25|0.65|2|MC36231|
|4.37|4.73|3.07|3.41|0.6|1.55|0.25|0.95|0.25|0.65|2|MC36232|
|4.37|4.73|3.07|3.41|0.6|1.35|0.25|0.95|0.25|0.65|2|MC36235|
|4.37|4.73|3.07|3.41|0.55|1.2|0.25|0.95|0.25|0.65|2|MC36238|
|4.37|4.73|3.07|3.41|0.8|1.55|0.25|0.95|0.25|0.65|2|MC36242|
|4.37|4.73|3.07|3.41|0.8|1.55|0.25|0.95|0.25|0.65|2|MC36243|



Dimensions : Millimetres 

## **Thermal Derating Curve** 

**==> picture [197 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
Thermal Derating Curve<br>200% aOT OOTOTTEoTTTEoTT—EoTEoE—>E=E=E=E>E—E=—E=—={xX{X—E;~<br>a<br>a<br>soy real T= tt<br>Petes<br>FO i<br>tony<br>5a<br>a<br>a<br>a<br>0%<br>-40 -20 Q 20 40<br>Ambient Temperature (°C)<br>Current<br>Percent of Rated Hold and Trip<br>**----- End of picture text -----**<br>


**A** =  MC36218, MC36219 MC36225, MC36231, MC36232, MC36235, MC36238, MC36242 MC36243 

**B** = - 

## **Typical Time-To-Trip at 23°C** 

**A** = - 

**==> picture [147 x 114] intentionally omitted <==**

**----- Start of picture text -----**<br>
SS [SEERA]<br>P—}—_1 [4] AN AAA AAA<br>ott__|_|_ TTT TIN AANA<br>PE EASA<br>oo |<br>SS<br>oon. | LTH [ TTT<br>O41 1<br>Fault current (A)<br>Time-to-trip (S)<br>**----- End of picture text -----**<br>


**D** = - **F** = MC36218, MC36219 **G** = MC36225 **H** = - **I** = MC36231, MC36232 **J** = MC36235 **M** = - **K** = MC36238 **L** = MC36242, MC36243 

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## **Surface Mountable PTC Resettable Fuse** 

## **Material Specification** 

Terminal pad material : Pure tin. 

Soldering characteristics : Meets EIA specification RS 186-9E, ANSI/J-std-002 category 3. 

## **Pad Layouts Solder Reflow and Rework Recommendations** 

The dimension in the table below provide the recommended pad layout for each 1812 device. 

## **Pad Dimensions** 

|**Device**|**A**<br>**Nominal**|**B**<br>**Nominal**|**C**<br>**Nominal**|
|---|---|---|---|
|All 1812 Series|3.45mm|1.78mm|3.5mm|



|neon||
|---|---|
|**Profile Feature**|**Pb-Free Assembly**|
|Average Ramp-UpRate(Ts maximum to Tp)|3°C/second maximum|
|Preheat:<br>Temperature Minimum (Ts minimum)<br>Temperature Maximum (Ts maximum)<br>Time(ts minimum to ts maximum)|150°C<br>200°C<br>60-180 seconds|
|Time maintained above:<br>Temperature (Tl)<br>Time(tl)|217°C<br>60-150 seconds|
|Peak/Classification Temperature(Tp):|260°C|
|Time within 5°C of actual Peak:<br>Temperature (tp)|20-40 seconds|
|Ramp-Down Rate:|6°C/second maximum|
|Time 25°C to Peak Temperature:|8 minutes maximum|



Note 1: All temperatures refer to of the package, measured on the package body surface. 

## **Solder reflow** 

Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components. 

1. Recommended max past thickness > 0.25mm. 

2. Devices can be cleaned using standard methods and aqueous solvent. 

3. Rework use standard industry practices. 

4. Storage Environment : < 30°C/60%RH. 

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## **Surface Mountable PTC Resettable Fuse** 

## **Caution** 

1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board. 

## **Reflow Profile** 

## **Part Number Table** 

|**Part Number Table**|||
|---|---|---|
|**Description**|**TUV**<br>**Approval**|**Part Number**|
|Surface Mountable PTC Resettable Fuse|Yes|MC36218|
|||MC36219|
|||MC36225|
|||MC36231|
|||MC36232|
||No|MC36235|
|||MC36238|
|||MC36242|
|||MC36243|



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