MBRS540T3G

## MBRS540T3G, NRVBS540T3G 

## Surface Mount Schottky Power Rectifier 

The MBRS540T3 employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. 

## **http://onsemi.com** 

**SCHOTTKY BARRIER RECTIFIER 5.0 AMPERES, 40 VOLTS** 

## **Features** 

- Small Compact Surface Mountable Package with J−Bend Leads 

- Rectangular Package for Automated Handling 

- Highly Stable Oxide Passivated Junction 

- Excellent Ability to Withstand Reverse Avalanche Energy Transients 

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SMC<br>CASE 403<br>**----- End of picture text -----**<br>


- Guard−Ring for Stress Protection 

- NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These are PB−Free Packages* 

## **Mechanical Characteristics** 

- Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 @ 0.125 in 

- Weight: 217 mg (Approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 

- Polarity: Notch in Plastic Body Indicates Cathode Lead 

- ESD Rating: 

   - ♦ Machine Model, C (> 400 V) 

   - ♦ Human Body Model, 3B (> 8000 V) 

- Device Meets MSL 1 Requirements 

## **MARKING  DIAGRAM** 

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AYWW<br>B540<br>B540 = Specific Device Code<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>= Pb−Free Package<br>**----- End of picture text -----**<br>


(Note: Microdot may be in either location) 

**ORDERING INFORMATION** 

**Device Package Shipping**[†] MBRS540T3G SMC 2,500 / (Pb−Free) Tape & Reel NRVBS540T3G SMC 2,500 / (Pb−Free) Tape & Reel ~~=~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MBRS540T3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2013 **July, 2013 − Rev. 8** 

**MBRS540T3G, NRVBS540T3G** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|40|V|
|Average Rectified Forward Current<br>(At Rated VR, TC= 105°C)|IF(AV)|5|A|
|Peak Repetitive Forward Current<br>(At Rated VR, Square Wave, 20 KHz, TC= 80°C)|IFRM|10|A|
|Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)|IFSM|190|A|
|Storage Temperature Range|Tstg|−65 to +150|°C|
|Operating Junction Temperature (Note 1)|TJ|−65 to +150|°C|
|Voltage Rate of Change (Rated VR)|dv/dt|10,000|V/�s|



Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R � JA. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance,<br>Junction−to−Lead (Note 2)<br>Thermal Resistance,<br>Junction−to−Ambient (Note 2)|R�JL<br>R�JA|12<br>111|°C/W|



2. Rating applies when surface mounted on the minimum pad size recommended. 

## **ELECTRICAL CHARACTERISTICS** 

|**ELECTRICAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Maximum Instantaneous Forward Voltage (Note 3)<br>(iF= 5.0 A, TC= 25°C)|VF|0.50|V|
|Maximum Instantaneous Reverse Current (Note 3)<br>(Rated dc Voltage, TC= 25°C)<br>(Rated dc Voltage, TC= 100°C)|iR|0.3<br>15|mA|



3. Pulse Test: Pulse Width ≤ 300 � s, Duty Cycle ≤ 2.0%. 

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**2** 

**MBRS540T3G, NRVBS540T3G** 

## **TYPICAL CHARACTERISTICS** 

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10 10<br>TJ = 125 ° C TJ = 125 ° C<br>1 1 TJ = 100 ° C<br>T J  = 25 ° C<br>T J = −40 ° C<br>TJ = −40 ° C<br>TJ = 100 ° C TJ = 25 ° C TJ = −55 ° C TJ = −55 ° C<br>0.1 0.1<br>0.10 0.20 0.30 0.40 0.50 0.60 0.10 0.20 0.30 0.40 0.50 0.60 0.70<br>VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, MAXIMUM INSTANTANEOUS FORWARD<br>VOLTAGE (V)<br>Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage<br>100E−3 100E−3<br>10E−3 TJ = 125 ° C TJ = 125 ° C<br>1E−3 TJ = 100 ° C 10E−3<br>TJ = 100 ° C<br>100E−6<br>1E−3<br>10E−6<br>1E−6 TJ = 25 ° C TJ = 25 ° C<br>100E−6<br>100E−9 TJ = −55 ° C TJ = −55 ° C<br>10E−9<br>10E−6<br>1E−9<br>100E−12 1E−6<br>0 10 20 30 40 0 10 20 30 40<br>VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V)<br>CURRENT (A) CURRENT (A)<br>, INSTANTANEOUS FORWARD , INSTANTANEOUS FORWARD<br>iF iF<br>, REVERSE CURRENT (A)<br>IR<br>, MAXIMUM REVERSE CURRENT (A)<br>IR<br>**----- End of picture text -----**<br>


**Figure 3. Typical Reverse Current** 

**Figure 4. Maximum Reverse Current** 

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9 4.5<br>dc freq = 20 kHz<br>8 4<br>SQUARE<br>7 3.5 dc<br>WAVE<br>6 SQUARE WAVE 3<br>5 2.5<br>Ipk/IO =  �<br>4 Ipk/IO = 5 2 Ipk/IO =  �<br>3 1.5 Ipk/IO = 5<br>2 1<br>Ipk/IO = 10<br>1 0.5<br>Ipk/IO = 20<br>0 0<br>25 50 75 100 125 150 0 1 2 3 4 5 6 7 8 9<br>TL, LEAD TEMPERATURE ( ° C) IO, AVERAGE FORWARD CURRENT (A)<br>CURRENT (A)<br>, AVERAGE FORWARD<br>IO<br>, AVERAGE POWER DISSIPATION (W)<br>FO<br>P<br>**----- End of picture text -----**<br>


**Figure 5. Current Derating** 

**Figure 6. Forward Power Dissipation** 

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**3** 

**MBRS540T3G, NRVBS540T3G** 

## **TYPICAL CHARACTERISTICS** 

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1000 125<br>TJ = 25  ° C R � JA = 12  ° C/W<br>115<br>105 R � JA = 47  ° C/W<br>95 R � JA = 81  ° C/W<br>85<br>R � JA = 111  ° C/W<br>75<br>65 R � JA = 136  ° C/W<br>100 55<br>0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40 45<br>VR, REVERSE VOLTAGE (V) VR, DC REVERSE VOLTAGE (V)<br>Figure 7. Capacitance Figure 8. Typical Operating Temperature<br>Derating<br>1000<br>100 D = 0.5<br>0.2<br>10<br>0.1 P(pk)<br>0.05<br>0.02 Test Type > min pad 1 oz<br>1<br>0.01 t1 R�JC = min pad 1 oz C/W<br>t2<br>SINGLE PULSE DUTY CYCLE, D = t1/t2<br>0.1<br>0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t, TIME (s)<br>C)<br>°<br>C, CAPACITANCE (pF)<br>, DERATED OPERATING TEMPERATURE (<br>J<br>T<br>r(t), TRANSIENT THERMAL RESPONSE (C/W)<br>**----- End of picture text -----**<br>


**Figure 9. Thermal Response − MBRS540T3G, NRVBS540T3G on min pad** 

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100<br>D = 0.5<br>0.2<br>10<br>0.1<br>0.05 P(pk)<br>1 0.02<br>Test Type > min pad 1 oz<br>0.01 t1 R�JC = min pad 1 oz C/W<br>t2<br>SINGLE PULSE DUTY CYCLE, D = t1/t2<br>0.1<br>0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t, TIME (s)<br>r(t), TRANSIENT THERMAL RESPONSE (C/W)<br>**----- End of picture text -----**<br>


**Figure 10. Thermal Response − MBRS540T3G, NRVBS540T3G on 1” pad** 

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**4** 

**MBRS540T3G, NRVBS540T3G** 

## **PACKAGE DIMENSIONS** 

**SMC** CASE 403−03 ISSUE E 

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HE NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.<br>E 2. CONTROLLING DIMENSION: INCH.<br>3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.<br>4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03.<br>MILLIMETERS INCHES<br>=e | DIM  -_~—,—_ MIN NOM MAX MIN NOM MAX<br>b D A 1.90 2.13 2.41 0.075 0.084 0.095<br>A1 0.05 0.10 0.15 0.002 0.004 0.006<br>b 2.92 3.00 3.07 0.115 0.118 0.121<br>c 0.15 0.23 0.30 0.006 0.009 0.012<br>=<br>D 5.59 5.84 6.10 0.220 0.230 0.240<br>E 6.60 6.86 7.11 0.260 0.270 0.280<br>H E 7.75 7.94 8.13 0.305 0.313 0.320<br>L 0.76 1.02 1.27 0.030 0.040 0.050<br>L1 0.51 REF 0.020 REF<br>A<br>c a A1<br>a L L1 4 —_—<br>SOLDERING FOOTPRINT*<br>4.343<br>0.171<br>4<br>-<br>3.810<br>0.150<br>2.794<br>a<br>0.110<br>SCALE 4:1 mm<br>_ inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

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**MBRS540T3/D** 

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