MBRS3201T3G

## Schottky Power Rectifier, Surface Mount, Fast Soft-Recovery 200 V, 3.0A 

## **SMC Power Surface Mount Package** 

## MBRS3201T3G, NRVBS3201T3G 

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**SCHOTTKY RECTIFIER 3 AMPS, 200 VOLTS** 

## **Features** 

- Lower Forward Voltage than any Ultrafast Rectifier: VF < 0.59 V at 150°C 

- Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns 

- Soft Recovery Characteristics: Softness Factor (tb/ta) ≥ 1 

- Highly Stable Over Temperature 

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SMC  2−LEAD<br>CASE 403AC<br>**----- End of picture text -----**<br>


- NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **MARKING DIAGRAM** 

## **Benefits** 

- Significantly Reduced EMI 

- Eliminates the Need of Snubber Circuits 

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AYWW<br>B321<br>**----- End of picture text -----**<br>


- Low Switching and Heat Losses 

- Improved Thermal Management 

## **Applications** 

- Engine and Convenience Control Systems 

- Motor Controls 

- Battery Chargers and Switching Power Supplies 

## **Mechanical Characteristics** 

- Small Compact Surface Mount Package with J-Bend Leads 

- Rectangular Package for Automated Handling 

- Weight: 217 mg (Approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- ESD Ratings: 

   - ♦ Machine Model = A 

   - ♦ Human Body Model = 1C 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Maximum for 10 Seconds 

- Polarity: Polarity Band on Plastic Body Indicates Cathode Lead 

|B321|= Specific Device Code|
|---|---|
|A|= Assembly Location**|
|Y|= Year|
|WW|= Work Week|
||= Pb−Free Package|



(Note: Microdot may be in either location) 

- **The Assembly Location code (A) is front side optional. In cases where the Assembly Location is stamped in the package, the front side assembly code may be blank. 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MBRS3201T3G|SMC 2−LEAD<br>(Pb−Free)|2500 /<br>Tape & Reel|
|NRVBS3201T3G*|SMC 2−LEAD<br>(Pb−Free)|2500 /<br>Tape & Reel|



- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

Publication Order Number: **MBRS3201T3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2012 **August, 2021 − Rev. 7** 

**MBRS3201T3G, NRVBS3201T3G** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|200|V|
|Average Rectified Forward Current (Rated VR, TC= 70°C)|IF(AV)|3|A|
|Nonrepetitive Peak Surge Current (83 ms, half−sine)|IFSM|100|A|
|Operating Junction Temperature|TJ<br>−|55 to +150|°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance, Junction−to−Lead|R�JL|12|°C/W|
|Thermal Resistance, Junction−to−Ambient|R�JA|60|°C/W|



## **ELECTRICAL CHARACTERISTICS** 

|**ELECTRICAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Maximum Instantaneous Forward Voltage<br>(IF= 3 A, TJ= 25°C)<br>(IF= 3 A, TJ= 150°C)|VF|0.84<br>0.59|V|
|Maximum Instantaneous Reverse Current (Rated VR)<br>(Rated DC Voltage, TJ= 25°C)<br>(Rated DC Voltage, TJ= 150°C)|IR|1.0<br>5.0|mA<br>mA|
|Maximum Reverse Recovery Time<br>(IF= 1 A, di/dt = 100 A/us, VR= 30 V)|trr|35|ns|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

## **TYPICAL ELECTRICAL CHARACTERISTICS** 

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100 100<br>10 10<br>25 ° C 25 ° C<br>1.0 150 ° C 1.0 150 ° C<br>100 ° C<br>100 ° C<br>0.1 0.1<br>0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2<br>VF, INSTANTANEOUS VOLTAGE (V) VF, INSTANTANEOUS VOLTAGE (V)<br>, FORWARD CURRENT (A) , FORWARD CURRENT (A)<br>IF IF<br>**----- End of picture text -----**<br>


**Figure 1. Typical Forward Voltage** 

**Figure 2. Maximum Forward Voltage** 

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**2** 

**MBRS3201T3G, NRVBS3201T3G** 

## **TYPICAL ELECTRICAL CHARACTERISTICS** (continued) 

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1E−1 1.0E−01<br>1E−2<br>1.0E−02<br>1E−3 150 ° C<br>TC = 150 ° C<br>1E−4<br>1.0E−03<br>1E−5 100 ° C T C  = 25 ° C<br>1E−6 1.0E−04<br>1E−7<br>1.0E−05<br>1E−8 25 ° C<br>1E−9 1.0E−06<br>0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200<br>VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V)<br>, REVERSE CURRENT (A)<br>IR<br>, MAXIMUM REVERSE CURRENT (A)<br>IR<br>**----- End of picture text -----**<br>


**Figure 3. Typical Reverse Current** 

**Figure 4. Maximum Reverse Current** 

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1000<br>100<br>10<br>1.0<br>0 20 40 60 80 100 120 140 160 180 200<br>VR, REVERSE VOLTAGE (V)<br>Figure 5. Typical Capacitance<br>4.0<br>7<br>3.5<br>6<br>3.0 DC<br>5<br>2.5 SQUARE<br>4 SQUAREWAVE<br>2.0<br>DC<br>3<br>1.5<br>2<br>1.0<br>0.5 1<br>0 0<br>0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 80 90 100 110 120 130 140 150 160<br>IO, AVERAGE FORWARD CURRENT TL, LEAD TEMPERATURE ( ° C)<br>C, CAPACITANCE (pF)<br>, AVERAGE POWER DISSIPATION (W)<br>, AVERAGE FORWARD CURRENT (A)<br>FO IF<br>P<br>**----- End of picture text -----**<br>


**Figure 6. Power Dissipation** 

**Figure 7. Derating Curve** 

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**3** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SMC 2−LEAD** CASE 403AC ISSUE B 

## **SCALE 1:1** 

DATE 27 JUL 2017 

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HE<br>E<br>=<br>_ D<br>HD<br>A1 _ c<br>— a DETAIL A<br>TOP VIEW<br>DETAIL A<br>|<br>A2 A<br>L no s Todt b<br>SIDE VIEW END VIEW<br>RECOMMENDED<br>SOLDERING FOOTPRINT*<br>8.750<br>0.344<br>oe<br>3.790<br>2X<br>7 0.149<br>2X 2.250 mm SCALE 4:1<br>ot 0.089 inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

NOTES: 

1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994. 

2. CONTROLLING DIMENSION: INCHES. 

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.254mm PER SIDE. 

4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H. 

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5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA<br>DETERMINED BY DIMENSION L.<br>MILLIMETERS INCHES<br>DIM MIN MAX MIN MAX<br>A 1.95 2.61 0.077 0.103<br>A1 0.05 0.20 0.002 0.008<br>——— A2 1.90 2.41 0.075 0.095<br>b 2.90 3.20 0.114 0.126<br>c 0.15 0.41 0.006 0.016<br>D 5.55 6.25 0.219 0.246<br>EE. E 6.60 7.15 0.260 0.281<br>H E 7.75 8.15 0.305 0.321<br>L 0.75 1.60 0.030 0.063<br>GENERIC<br>MARKING DIAGRAM*<br>**----- End of picture text -----**<br>


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AYWW<br>XXXX<br>XXXX = Specific Device Code<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>(Note: Microdot may be in either location) , = Pb−Free Package<br>*This information is generic. Please refer to<br>device data sheet for actual part marking.<br>Pb−Free indicator, “G” or microdot “ ”, |<br>may or may not be present.<br>**----- End of picture text -----**<br>


|**DOCUMENT NUMBER:**|**98AON97675F**|
|---|---|
|**DESCRIPTION:**|**SMC 2−LEAD**|



Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

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