MBRS230LT3G

## MBRS230L, NRVBS230L 

## Surface Mount Schottky Power Rectifier **SMB Power Surface Mount Package** 

This device employs the Schottky Barrier principle in a metal−to−silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. 

## **Features** 

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**SCHOTTKY BARRIER RECTIFIER 2.0 AMPERES 30 VOLTS** 

- Compact Package with J−Bend Leads Ideal for Automated Handling 

- Highly Stable Oxide Passivated Junction 

- Guardring for Over−Voltage Protection 

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SMB<br>CASE 403A<br>**----- End of picture text -----**<br>


- Low Forward Voltage Drop 

- NRVBS Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

## **MARKING DIAGRAM** 

- These Devices are Pb−Free and are RoHS Compliant 

## **Mechanical Characteristics** 

- Case: Molded Epoxy 

- Epoxy Meets UL 94, V−0 @ 0.125 in. 

- Weight: 95 mg (approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Maximum Temperature of 260°C/10 Seconds for Soldering 

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ALYW<br>2BL3<br>A = Assembly Location<br>L = Wafer Lot<br>Y = Year<br>W = Work Week<br>= Pb−Free Package<br>**----- End of picture text -----**<br>


(Note: Microdot may be in either location) 

- Available in 12 mm Tape, 2500 Units per 13″ Reel, Add “T3” Suffix to Part Number 

- Cathode Polarity Band 

**ORDERING INFORMATION** 

**Device Package Shipping**[†] MBRS230LT3G SMB 2500 / Tape & Reel (Pb−Free) NRVBS230LT3G SMB 2500 / Tape & Reel (Pb−Free) ~~===~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: **MBRS230LT3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2015 **July, 2015 − Rev. 4** 

**MBRS230L, NRVBS230L** 

## **MAXIMUM RATINGS** 

|**Rating**|**Symbol**|**Value**|**Unit**|
|---|---|---|---|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|30|V|
|Average Rectified Forward Current<br>(At Rated VR, TC= 110°C)|IO|2.0|A|
|Peak Repetitive Forward Current<br>(At Rated VR, Square Wave, 20 kHz, TC= 105°C)|IFRM|4.0|A|
|Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz)|IFSM|40|A|
|Storage/Operating Case Temperature|Tstg, TC|−55 to +175|°C|
|Operating Junction Temperature|TJ|−55 to +125|°C|
|Voltage Rate of Change<br>(Rated VR, TJ= 25°C)|dv/dt|10,000|V/�s|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**|||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**||**Unit**|
|Thermal Resistance,<br>Junction−to−Lead (Note 1)<br>Thermal Resistance,<br>Junction−to−Ambient (Note 1)|R�JL<br>R�JA|18.6<br>135||°C/W|
|**ELECTRICAL CHARACTERISTICS**|||||
|Maximum Instantaneous Forward Voltage (Note 2)<br>(IF= 2.0 A)<br>see Figure 2<br>(IF= 4.0 A)|VF|**TJ = 25**°**C**|**TJ = 125**°**C**|V|
|||0.50<br>0.60|0.45<br>0.63||
|Maximum Instantaneous Reverse Current (Note 2)<br>(VR= 30 V)<br>see Figure 4<br>(VR= 15 V)|IR|**TJ = 25**°**C**|**TJ = 125**°**C**|mA|
|||1<br>0.31|75<br>35||



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Minimum pad size (0.108 ″ X 0.085 ″ ) for each lead on FR4 board. 2. Pulse Test: Pulse Width ≤ 250 � s, Duty Cycle ≤ 2.0%. 

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10<br>1<br>TJ = 125 ° C<br>0.1<br>100 ° C 25 ° C −55 ° C<br>0.01<br>0 0.1 0.2 0.3 0.4 0.5 0.6<br>vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)<br>, INSTANTANEOUS FORWARD CURRENT (AMPS)<br>iF<br>**----- End of picture text -----**<br>


**Figure 1. Typical Forward Voltage** 

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10<br>TJ = 125 ° C<br>1<br>100 ° C<br>25 ° C<br>0.1<br>0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8<br>VF, MAXIMUM INSTANTANEOUS FORWARD<br>VOLTAGE (VOLTS)<br>, INSTANTANEOUS FORWARD CURRENT (AMPS)<br>IF<br>**----- End of picture text -----**<br>


**Figure 2. Maximum Forward Voltage** 

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**2** 

**MBRS230L, NRVBS230L** 

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100E−3 100E−3<br>TJ = 125 ° C<br>10E−3 TJ = 125 ° C 10E−3 TJ = 100 ° C<br>TJ = 100 ° C<br>1E−3<br>1E−3<br>100E−6<br>TJ = 25 ° C<br>10E−6 TJ = 25 ° C 100E−6<br>1E−6 10E−6<br>0 5 10 15 20 25 30 0 5 10 15 20 25 30<br>VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current<br>3.5 1.8<br>dc FREQ = 20 kHz dc<br>3.0 1.6 SQUARE<br>WAVE<br>1.4<br>Ipk/Io =  �<br>2.5<br>SQUARE WAVE 1.2 Ipk/Io = 5.0<br>2.0 Ipk/Io =  � 1.0 Ipk/Io = 10<br>Ipk/Io = 20<br>0.8<br>1.5 Ipk/Io = 5.0<br>0.6<br>1.0 Ipk/Io = 10<br>0.4<br>Ipk/Io = 20<br>0.5 0.2 TJ = 125 ° C<br>0 0<br>0 20 40 60 80 100 120 140 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5<br>TC, CASE TEMPERATURE ( ° C) IO, AVERAGE FORWARD CURRENT (AMPS)<br>Figure 5. Current Derating Per Leg Figure 6. Forward Power Dissipation Per Leg<br>1<br>R � J  Lead = 18.6<br>0.1<br>R � J Ambient = 150<br>0.01<br>0.001<br>0.0001<br>0.0001 0.001 0.01 0.1 1.0 10 100 1000<br>t, TIME (s)<br>, REVERSE CURRENT (AMPS)<br>IR<br>, MAXIMUM REVERSE CURRENT (AMPS)<br>IR<br>, AVERAGE FORWARD CURRENT (AMPS)IO , AVERAGE POWER DISSIPATION (WATTS)FO<br>P<br>(NORMALIZED)<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 7. Thermal Response** 

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**3** 

**MBRS230L, NRVBS230L** 

## **PACKAGE DIMENSIONS** 

**SMB** CASE 403A−03 ISSUE J 

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HE<br>NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.<br>E 2. CONTROLLING DIMENSION: INCH.<br>3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>A 1.95 2.30 2.47 0.077 0.091 0.097<br>re = b D fy A1 0.05 0.10 0.20 0.002 0.004 0.008<br>b 1.96 2.03 2.20 0.077 0.080 0.087<br>c 0.15 0.23 0.31 0.006 0.009 0.012<br>D 3.30 3.56 3.95 0.130 0.140 0.156<br>E 4.06 4.32 4.60 0.160 0.170 0.181<br>U. POLARITY INDICATOROPTIONAL AS NEEDED H E 5.21 5.44 5.60 0.205 0.214 0.220<br>L 0.76 1.02 1.60 0.030 0.040 0.063<br>L1 0.51 REF 0.020 REF<br>S S<br>A<br>A1<br>L a L1 c<br>**----- End of picture text -----**<br>


## **SOLDERING FOOTPRINT*** 

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2.261<br>0.089<br>PT<br>L 2.743<br>0.108<br>Lo<br>2.159<br>0.085 mm<br>SCALE 8:1<br>cs (-) inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

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**MBRS230LT3/D** 

**4**