MBRS130T3G

## MBRS130T3G, NRVBS130T3G 

## Surface Mount Schottky Power Rectifier 

This device employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. 

## **Features** 

- Small Compact Surface Mountable Package with J−Bend Leads 

## **http://onsemi.com** 

**SCHOTTKY BARRIER RECTIFIER 1.0 AMPERE 30 VOLTS** 

- Rectangular Package for Automated Handling 

- Highly Stable Oxide Passivated Junction 

- Very Low Forward Voltage Drop (0.6 Volts Max @ 1.0 A, TJ = 25°C) 

- Excellent Ability to Withstand Reverse Avalanche Energy Transients 

- Guardring for Stress Protection 

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SMB<br>CASE 403A<br>**----- End of picture text -----**<br>


- NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

## **MARKING DIAGRAM** 

- These are Pb−Free Devices 

## **Mechanical Characteristics** 

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AYWW<br>B13<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br>


- Case: Epoxy, Molded 

- Weight: 95 mg (approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 

|Lead and Mounting Surface Temperature for Soldering Purposes:<br>260°C Max. for 10 Seconds°C Max. for 10 SecondsC Max. for 10 Seconds<br> Shipped in 12 mm Tape and Reel, 2500 units per reel<br> Cathode Polarity Band<br>**MAXIMUM RATINGS**<br>**Rating**<br>**Symbol**<br>Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage<br>VRRM<br>VRWM<br>VR<br>Average Rectified Forward Current<br>IF(AV)|Lead and Mounting Surface Temperature for Soldering Purposes:<br>260°C Max. for 10 Seconds°C Max. for 10 SecondsC Max. for 10 Seconds<br> Shipped in 12 mm Tape and Reel, 2500 units per reel<br> Cathode Polarity Band<br>**MAXIMUM RATINGS**<br>**Rating**<br>**Symbol**<br>Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage<br>VRRM<br>VRWM<br>VR<br>Average Rectified Forward Current<br>IF(AV)|Lead and Mounting Surface Temperature for Soldering Purposes:<br>Shipped in 12 mm Tape and Reel, 2500 units per reel<br>**Value**<br>30<br>1.0|Lead and Mounting Surface Temperature for Soldering Purposes:<br>Shipped in 12 mm Tape and Reel, 2500 units per reel<br>**Value**<br>30<br>1.0|Lead and Mounting Surface Temperature for Soldering Purposes:<br>**Unit**<br>V<br>A|**Device**<br>**Package**<br>**Shipping**†<br>**ORDERING INFORMATION**<br>MBRS130T3G<br>SMB<br>(Pb−Free)<br>2500 / Tape & Reel<br>NRVBS130T3G<br>SMB<br>(Pb−Free)<br>2500 / Tape & Reel<br>= Pb−Free Package<br>(Note: Microdot may be in either location)~~-~~|**Device**<br>**Package**<br>**Shipping**†<br>**ORDERING INFORMATION**<br>MBRS130T3G<br>SMB<br>(Pb−Free)<br>2500 / Tape & Reel<br>NRVBS130T3G<br>SMB<br>(Pb−Free)<br>2500 / Tape & Reel<br>= Pb−Free Package<br>(Note: Microdot may be in either location)~~-~~|
|---|---|---|---|---|---|---|
|(TL= 115°C)|||||†For information on tape and reel specifications,||
|Non−Repetitive Peak Surge Current|IFSM||40|A|including part orientation and tape sizes, please<br>refer to our Tape and Reel Packaging Specifications||
|(Surge Applied at Rated Load Conditions|||||Brochure, BRD8011/D.||
|Halfwave, Single Phase, 60 Hz)|||||||
|Operating Junction Temperature|TJ||−65 to +125|°C|||



- Shipped in 12 mm Tape and Reel, 2500 units per reel 

- Cathode Polarity Band 

## **MAXIMUM RATINGS** 

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance, Junction−to−Lead<br>(TL= 25°C)|R JL|12|°C/W|



Publication Order Number: **MBRS130T3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2013 **December, 2013 − Rev. 8** 

**MBRS130T3G, NRVBS130T3G** 

## **ELECTRICAL CHARACTERISTICS** 

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Rating Symbol Value Unit<br>Maximum Instantaneous Forward Voltage (Note 1) VF 0.6 V<br>(iF = 1.0 A, TJ = 25 ° C)<br>Maximum Instantaneous Reverse Current (Note 1) iR mA<br>(Rated dc Voltage, TJ = 25 ° C) 1.0<br>(Rated dc Voltage, TJ = 100 ° C) 10<br>1. Pulse Test: Pulse Width = 300  � s, Duty Cycle  ≤ 2.0%.<br>100<br>50<br>0.71 TC = 100°C 3020 TJ = 125°C<br>0.5 10 100°C<br>5<br>0.3 3<br>2 75°C<br>0.2 1<br>0.5<br>0.1 0.3<br>0.07 T C  = 25°C 0.10.2 25°C<br>0.05<br>0.05<br>0.03<br>0.03<br>0.02<br>0.02 0.01<br>0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 0 4 8 12 16 20 24 28 32 36 40<br>vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>IR , REVERSE CURRENT (mA)<br>iF, INSTANTANEOUS FORWARD CURRENT (AMPS)<br>**----- End of picture text -----**<br>


**Figure 1. Typical Forward Voltage** 

**Figure 2. Typical Reverse Current** 

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200<br>180 NOTE: TYPICAL CAPACITANCE<br>160 AT 0 V = 160 pF<br>140<br>120<br>100<br>80<br>60<br>40<br>20<br>00 4 8 12 16 20 24 28 32 36 40<br>VR, REVERSE VOLTAGE (VOLTS)<br>Figure 3. Typical Capacitance<br>10 5<br>DC<br>9 RATED VOLTAGE APPLIED T J  = 125°C SQUARE<br>° WAVE<br>8 R � T JC J = 125 = 12 °C/WC 4 π<br>7<br>5<br>6 3<br>CAPACITANCE<br>5<br>LOAD 10<br>4 2<br>3 SQUARE WAVE DC IIAVPK = 20<br>2 1<br>1<br>0 0<br>30 40 50 60 70 80 90 100 110 120 130 0 1 2 3 4 5<br>TC, CASE TEMPERATURE (°C) IF(AV), AVERAGE FORWARD CURRENT (AMPS)<br>Figure 4. Current Derating (Case) Figure 5. Power Dissipation<br>C, CAPACITANCE (pF)<br>IF(AV), AVERAGE FORWARD CURRENT (AMPS) PF(AV), AVERAGE POWER DISSIPATION (WATTS)<br>**----- End of picture text -----**<br>


**Figure 5. Power Dissipation** 

**http://onsemi.com** 

**2** 

**MBRS130T3G, NRVBS130T3G** 

## **PACKAGE DIMENSIONS** 

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SMB<br>CASE 403A−03<br>ISSUE J<br>HE<br>NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.<br>E 2. CONTROLLING DIMENSION: INCH.<br>3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>= S———— A 1.95 2.30 2.47 0.077 0.091 0.097<br>b D A1 0.05 0.10 0.20 0.002 0.004 0.008<br>b 1.96 2.03 2.20 0.077 0.080 0.087<br>c 0.15 0.23 0.31 0.006 0.009 0.012<br>D 3.30 3.56 3.95 0.130 0.140 0.156<br>E 4.06 4.32 4.60 0.160 0.170 0.181<br>Lt. POLARITY INDICATOROPTIONAL AS NEEDED H E 5.21 5.44 5.60 0.205 0.214 0.220<br>L 0.76 1.02 1.60 0.030 0.040 0.063<br>L1 0.51 REF 0.020 REF<br>A<br>A1<br>ee L L1 c [oo,] — a<br>SOLDERING FOOTPRINT*<br>2.261<br>0.089<br>PO<br>. 2.743<br>0.108<br>\.<br>2.159<br>0.085 mm<br>SCALE 8:1<br>cs (-) inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

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## **LITERATURE FULFILLMENT** : 

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**http://onsemi.com** 

**MBRS130T3/D** 

**3**