MBRF30L45CTG
Schottky Rectifier, 45 V, 15 A, Dual Common Cathode, TO-220FP, 3 Pins, 610 mV
- Manufacturer: ONSEMI
- Product type: Schottky Rectifier Diodes
- SVHC: No SVHC (15-Jan-2018)
- No. of Pins: 3Pins
- Product Range: -
- Qualification: -
- Diode Mounting: Through Hole
- Diode Case Style: TO-220FP
- Diode Configuration: Dual Common Cathode
- Forward Voltage Max: 610mV
- Forward Surge Current: 190A
- Average Forward Current: 15A
- Operating Temperature Max: 150°C
- Repetitive Peak Reverse Voltage: 45V
| Delivery and price | |
|---|---|
| Units per pack | 300 |
| Price | 0.901 € |
| Current stock | 10+ |
| Lead time | 30 days |
## Switch-mode Power Rectifier 45 V, 30 A ## MBR30L45CTG, MBRF30L45CTG **www.onsemi.com** ## **Features and Benefits** - Low Forward Voltage - Low Power Loss/High Efficiency - High Surge Capacity **DUAL SCHOTTKY BARRIER RECTIFIERS 30 AMPERES, 45 VOLTS** - 150°C Operating Junction Temperature - 30 A Total (15 A Per Diode Leg) - Guard−Ring for Stress Protection ## **Applications** - Power Supply − Output Rectification - Power Management - Instrumentation ## **Mechanical Characteristics:** - Case: Epoxy, Molded - Epoxy Meets UL 94 V−0 @ 0.125 in - Weight (Approximately): 1.9 Grams - Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 1 2, 4 3 ~~eae~~ **MARKING DIAGRAMS** 4 O ~~O~~ **==> picture [154 x 62] intentionally omitted <==** **----- Start of picture text -----**<br> AYWW<br>B30L45G<br>TO−220<br>A K A<br>CASE 221A<br>PLASTIC<br>1<br>2<br>3<br>**----- End of picture text -----**<br> - Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds - Shipped 50 Units Per Plastic Tube - This is a Pb−Free Device* ## **MAXIMUM RATINGS** **==> picture [96 x 28] intentionally omitted <==** **----- Start of picture text -----**<br> TO−220<br>B30L45G<br>FULLPAK YWW<br>CASE 221D<br>**----- End of picture text -----**<br> Please See the Table on the Following Page B30L45 = Device Code A = Assembly Location Y = Year WW = Work Week AKA = Polarity Designator G = Pb−Free Device ## **ORDERING INFORMATION** - *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. |**Device**|**Package**|**Shipping**| |---|---|---| |MBR30L45CTG|TO−220<br>(Pb−Free)|50 Units/Rail| |MBRF30L45CTG|TO−220FP<br>(Pb−Free)|50 Units/Rail| Publication Order Number: **MBR30L45CT/D** **1** © Semiconductor Components Industries, LLC, 2016 **May, 2024 − Rev. 5** ## **MBR30L45CTG, MBRF30L45CTG** ## **MAXIMUM RATINGS** (Per Diode Leg) |**MAXIMUM RATINGS**(Per Diode Leg)|||| |---|---|---|---| |**Rating**|**Symbol**|**Value**|**Unit**| |Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|45|V| |Average Rectified Forward Current<br>(Rated VR) TC= 137°C|IF(AV)|15|A| |Peak Repetitive Forward Current<br>(Rated VR, Square Wave, 20 kHz)|IFRM|30|A| |Nonrepetitive Peak Surge Current<br>(Surge applied at rated load conditions halfwave, single phase, 60 Hz)|IFSM|190|A| |Operating Junction Temperature (Note 1)|TJ|−55 to +150|°C| |Storage Temperature|Tstg|�55 to +175|°C| |Voltage Rate of Change (Rated VR)|dv/dt|10,000|V/�s| |ESD Ratings:<br>Machine Model = C<br>Human Body Model = 3B||> 400<br>> 8000|V| |**THERMAL CHARACTERISTICS**|||| |Maximum Thermal Resistance<br>(MBR30L45CTG)<br>Junction−to−Case<br>Junction−to−Ambient<br>(MBRF30L45CTG)<br>Junction−to−Case|R�JC<br>R�JA<br>R�JC|1.9<br>45<br>2.2|°C/W| |**ELECTRICAL CHARACTERISTICS**(Per Diode Leg)|||| |Maximum Instantaneous Forward Voltage (Note 2)<br>(IF= 15 A, TC= 25°C)<br>(IF= 15 A, TC= 125°C)<br>(IF= 30 A, TC= 25°C)<br>(IF= 30 A, TC= 125°C)|vF|0.50<br>0.44<br>0.61<br>0.60|V| |Maximum Instantaneous Reverse Current (Note 2)<br>(Rated DC Voltage, TC= 25°C)<br>(Rated DC Voltage, TC= 125°C)|iR|0.65<br>250|mA| Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R � JA. 2. Pulse Test: Pulse Width = 300 � s, Duty Cycle ≤ 2.0%. **==> picture [50 x 49] intentionally omitted <==** **www.onsemi.com** **2** **MBR30L45CTG, MBRF30L45CTG** ## **TYPICAL CHARACTERISTICS** **==> picture [490 x 593] intentionally omitted <==** **----- Start of picture text -----**<br> 100 100<br>10 10<br>150 ° C 125 ° C 150 ° C 125 ° C<br>1 1<br>75 ° C 75 ° C<br>25 ° C 25 ° C<br>0.1 0.1<br>0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9<br>VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, MAXIMUM FORWARD VOLTAGE (V)<br>Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage<br>1E+00 1E+00<br>150 ° C 150 ° C<br>1E−01 1E−01<br>125 ° C<br>125 ° C<br>1E−02 1E−02<br>75 ° C<br>1E−03 1E−03 75 ° C<br>1E−04 25 ° C 1E−04<br>25 ° C<br>1E−05 1E−05<br>0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50<br>VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V)<br>Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current<br>30<br>25 dc<br>20<br>Square Wave<br>15<br>10<br>5<br>0<br>100 105 110 115 120 125 130 135 140 145 150 155<br>TC, CASE TEMPERATURE ( ° C)<br>CURRENT (A) CURRENT (A)<br>, INSTANTANEOUS FORWARD , INSTANTANEOUS FORWARD<br>IF IF<br>, REVERSE CURRENT (A) , REVERSE CURRENT (A)<br>IR IR<br>, AVERAGE FORWARD CURRENT (A)<br>IF<br>**----- End of picture text -----**<br> **Figure 5. Current Derating** **www.onsemi.com** **3** **MBR30L45CTG, MBRF30L45CTG** ## **TYPICAL CHARACTERISTICS** **==> picture [490 x 603] intentionally omitted <==** **----- Start of picture text -----**<br> 28 10000<br>26<br>24 Square Wave<br>22<br>20<br>18<br>16<br>14 dc 1000<br>12<br>10<br>8<br>6<br>4<br>2<br>0 100<br>0 5 10 15 20 25 30 0 5 10 15 20 25 30 35 40 45<br>Io, AVERAGE FORWARD CURRENT (A) VR, REVERSE VOLTAGE (V)<br>Figure 6. Forward Power Dissipation Figure 7. Typical Capacitance<br>100<br>D = 0.5<br>10<br>0.2<br>0.1<br>0.05<br>1<br>0.01 P(pk)<br>0.1 t 1<br>t2<br>SINGLE PULSE DUTY CYCLE, D = t 1 /t 2<br>0.01<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>Figure 8. Thermal Response Junction−to−Ambient for MBR30L45CTG<br>10<br>D = 0.5<br>1<br>0.2<br>0.1<br>0.05<br>P(pk)<br>0.1<br>0.01 t1<br>t 2<br>SINGLE PULSE DUTY CYCLE, D = t1/t2<br>0.01<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>, AVERAGE POWER DISSIPATION (W)<br>PFO C, CAPACITANCE (pF)<br>R(t), TRANSIENT THERMAL RESISTANCE<br>R(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br> **Figure 9. Thermal Response Junction−to−Case for MBR30L45CTG** **www.onsemi.com** **4** **MBR30L45CTG, MBRF30L45CTG** **==> picture [490 x 175] intentionally omitted <==** **----- Start of picture text -----**<br> 10<br>D = 0.5<br>1<br>0.2<br>0.1<br>0.05<br>0.1<br>0.01<br>P(pk)<br>0.01 t 1<br>SINGLE PULSE t2<br>DUTY CYCLE, D = t 1 /t 2<br>0.001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>R(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br> **Figure 10. Thermal Response Junction−to−Case for MBRF30L45CTG** **==> picture [61 x 50] intentionally omitted <==** **==> picture [42 x 70] intentionally omitted <==** **==> picture [133 x 160] intentionally omitted <==** **==> picture [127 x 113] intentionally omitted <==** FULLPAK is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. **www.onsemi.com** **5** MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** **==> picture [316 x 39] intentionally omitted <==** **----- Start of picture text -----**<br> TO−220−3 10.10x15.12x4.45, 2.54P<br>CASE 221A<br>ISSUE AL<br>DATE 05 FEB 2025<br>**----- End of picture text -----**<br> |STYLE 1:||STYLE 2:|||STYLE 3:||STYLE 4:||| |---|---|---|---|---|---|---|---|---|---| |PIN 1.|BASE|PIN 1.|BASE||PIN 1.|CATHODE|PIN 1.|MAIN TERMINAL 1|| |2.|COLLECTOR|2.|EMITTER||2.|ANODE|2.|MAIN TERMINAL 2|| |3.|EMITTER|3.|COLLECTOR||3.|GATE|3.|GATE|| |4.|COLLECTOR|4.|EMITTER||4.|ANODE|4.|MAIN TERMINAL 2|| |STYLE 5:||STYLE 6:|||STYLE 7:||STYLE 8:||| |PIN 1.|GATE|PIN 1.|ANODE||PIN 1.|CATHODE|PIN 1.|CATHODE|| |2.|DRAIN|2.|CATHODE||2.|ANODE|2.|ANODE|| |3.|SOURCE|3.|ANODE||3.|CATHODE|3.|EXTERNAL TRIP/DELAY|| |4.|DRAIN|4.|CATHODE||4.|ANODE|4.|ANODE|| |STYLE 9:||STYLE 10:|||STYLE 11:||STYLE 12:||| |PIN 1.|GATE|PIN 1.|GATE||PIN 1.|DRAIN|PIN 1.|MAIN TERMINAL 1|| |2.|COLLECTOR|2.|SOURCE||2.|SOURCE|2.|MAIN TERMINAL 2|| |3.|EMITTER|3.|DRAIN||3.|GATE|3.|GATE|| |4.|COLLECTOR|4.|SOURCE||4.|SOURCE|4.|NOT CONNECTED|| |**DOCUMENT NUMBER:**|**98ASB42148B**|||Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.|||||| |**DESCRIPTION:**|**TO−220−3 10.10x15.12x4.45, 2.54P**||||||||**PAGE 1 OF 1**| **onsemi** and are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. www.onsemi.com © Semiconductor Components Industries, LLC, 1994 MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** **TO−220 FULLPAK** CASE 221D−03 ISSUE K **==> picture [79 x 7] intentionally omitted <==** **----- Start of picture text -----**<br> DATE 27 FEB 2009<br>**----- End of picture text -----**<br> **==> picture [437 x 186] intentionally omitted <==** **----- Start of picture text -----**<br> NOTES:<br>−T− SEATINGPLANE 1. DIMENSIONING AND TOLERANCING PER ANSI<br>Y14.5M, 1982.<br>−B− C 2. CONTROLLING DIMENSION: INCH<br>F 3. 221D-01 THRU 221D-02 OBSOLETE, NEW<br>S STANDARD 221D-03.<br>Q U INCHES MILLIMETERS<br>SCALE 1:1 DIM MIN MAX MIN MAX<br>A A 0.617 0.635 15.67 16.12<br>B 0.392 0.419 9.96 10.63<br>1 2 3 C 0.177 0.193 4.50 4.90<br>D 0.024 0.039 0.60 1.00<br>H F 0.116 0.129 2.95 3.28<br>−Y− G 0.100 BSC 2.54 BSC<br>K<br>H 0.118 0.135 3.00 3.43<br>J 0.018 0.025 0.45 0.63<br>K 0.503 0.541 12.78 13.73<br>G J L 0.048 0.058 1.23 1.47<br>N 0.200 BSC 5.08 BSC<br>N R Q 0.122 0.138 3.10 3.50<br>L R 0.099 0.117 2.51 2.96<br>S 0.092 0.113 2.34 2.87<br>D 3 PL U 0.239 0.271 6.06 6.88<br>0.25 (0.010) M B M Y<br>**----- End of picture text -----**<br> **==> picture [241 x 213] intentionally omitted <==** **----- Start of picture text -----**<br> MARKING<br>DIAGRAMS<br>xxxxxxG AYWW<br>AYWW xxxxxxG<br>AKA<br>Bipolar Rectifier<br>xxxxxx = Specific Device Code A = Assembly Location<br>G = Pb−Free Package Y = Year<br>A = Assembly Location WW = Work Week<br>Y = Year xxxxxx = Device Code<br>WW = Work Week G = Pb−Free Package<br>AKA = Polarity Designator<br>**----- End of picture text -----**<br> **==> picture [180 x 63] intentionally omitted <==** **----- Start of picture text -----**<br> STYLE 1: STYLE 2: STYLE 3:<br>PIN 1. GATE PIN 1. BASE PIN 1. ANODE<br>2. DRAIN 2. COLLECTOR 2. CATHODE<br>3. SOURCE 3. EMITTER 3. ANODE<br>STYLE 4: STYLE 5: STYLE 6:<br>PIN 1. CATHODE PIN 1. CATHODE PIN 1. MT 1<br>2. ANODE 2. ANODE 2. MT 2<br>3. CATHODE 3. GATE 3. GATE<br>**----- End of picture text -----**<br> **==> picture [493 x 37] intentionally omitted <==** **----- Start of picture text -----**<br> Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>DOCUMENT NUMBER: 98ASB42514B Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.<br>DESCRIPTION: TO−220 FULLPAK PAGE 1 OF 1<br>**----- End of picture text -----**<br> **onsemi** and are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. www.onsemi.com © Semiconductor Components Industries, LLC, 2019 **onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. ## **ADDITIONAL INFORMATION** **TECHNICAL PUBLICATIONS** : **ONLINE SUPPORT** : www.onsemi.com/support **Technical Library:** www.onsemi.com/design/resources/technical−documentation **For additional information, please contact your local Sales Representative at onsemi Website:** www.onsemi.com www.onsemi.com/support/sales **==> picture [232 x 43] intentionally omitted <==**
Updated at June 4, 2026
onsemi is a premier global supplier of intelligent power and sensing technologies, driving disruptive innovations across the automotive, industrial, and cloud infrastructure markets. Recognized for their commitment to sustainability and reliable supply chains, the company accelerates advancements in vehicle electrification, industrial automation, and 5G networks by solving the industry's most complex design challenges. At the core of their portfolio is an industry-leading selection of discrete semiconductors. This extensive range features thousands of high-performance bipolar transistors, single and dual MOSFETs, and a comprehensive array of diodes, including Zener, Schottky, and fast-recovery rectifiers. Engineered for superior thermal performance and energy efficiency, these foundational components are critical for demanding power conversion, switching, and signal conditioning applications. Beyond essential discretes, onsemi provides a robust suite of advanced power management and circuit protection solutions. Their lineup includes intelligent power modules, single IGBTs, and transient voltage suppression (TVS) diodes designed to safeguard sensitive circuitry. Complimented by integrated passive filters, AC/DC LED driver ICs, and specialized sub-2.4GHz RF transceivers, onsemi equips engineers with the scalable, high-quality technologies needed to build a cleaner, smarter, and more connected world.
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