MBRF20H150CTG

## MBRF20H150CTG, MBR20H150CTG 

## Switch-mode Power Rectifier 150 V, 20 A 

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## **Features and Benefits** 

- Low Forward Voltage 

- Low Power Loss/High Efficiency 

- High Surge Capability 

## **SCHOTTKY BARRIER RECTIFIER 20 AMPERES, 150 VOLTS** 

- 20 A Total (10 A Per Diode Leg) 

- Guard−Ring for Stress Protection 

- These Devices are Pb−Free and are RoHS Compliant 

## **Applications** 

- Power Supply − Output Rectification 

- Power Management 

- Instrumentation 

## **Mechanical Characteristics:** 

- Case: Epoxy, Molded 

- Epoxy Meets UL 94 V−0 @ 0.125 in 

- Weight (Approximately): 1.9 Grams (TO−220 & TO−220FP) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 

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1<br>2, 4<br>3 “as<br>4<br>1 2 1 i 2<br>3 3<br>TO−220 FULLPAK TO−220<br>CASE 221AH CASE 221A<br>STYLE 6<br>MARKING DIAGRAMS<br>ro u se AYWW<br>AYWW B20H150G<br>B20H150G AKA<br>AKA<br>TT<br>TO−220 TO−220FP<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>B20H150 = Device Code<br>G = Pb−Free Device<br>AKA = Polarity Designator<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

See detailed ordering and shipping information on page 1 of this data sheet. 

Publication Order Number: **MBRF20H150CT/D** 

**1** 

© Semiconductor Components Industries, LLC, 2016 **July, 2016 − Rev. 4** 

**MBRF20H150CTG, MBR20H150CTG** 

## **MAXIMUM RATINGS** (Per Diode Leg) 

|**MAXIMUM RATINGS**(Per Diode Leg)||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|150|V|
|Average Rectified Forward Current<br>(Per Leg)<br>(Rated VR) TC= 134°C<br>(Per Device)|IF(AV)|10<br>20|A|
|Nonrepetitive Peak Surge Current<br>(Surge applied at rated load conditions halfwave, single phase, 60 Hz)|IFSM|180|A|
|Operating Junction Temperature (Note 1)|TJ|−20 to +150|°C|
|Storage Temperature|Tstg|−65 to +150|°C|
|Voltage Rate of Change (Rated VR)|dv/dt|10,000|V/�s|
|ESD Ratings:<br>Machine Model = C<br>Human Body Model = 3B||> 400<br>> 8000|V|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R � JA. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Maximum Thermal Resistance<br>(MBR20H150CTG)<br>− Junction−to−Case<br>− Junction−to−Ambient<br>(MBRF20H150CTG)<br>− Junction−to−Case|R�JC<br>R�JA<br>R�JC|2.0<br>45<br>2.5|°C/W|



## **ELECTRICAL CHARACTERISTICS** (Per Diode Leg) 

|**ELECTRICAL CHARACTERISTICS**(Per Diode Leg)|||||
|---|---|---|---|---|
|**Rating**|**Symbol**|**Typ**|**Max**|**Unit**|
|Maximum Instantaneous Forward Voltage (Note 2)<br>(IF= 5 A, TC= 25°C)<br>(IF= 5 A, TC= 125°C)<br>(IF= 10 A, TC= 25°C)<br>(IF= 10 A, TC= 125°C)|vF|0.72<br>0.57<br>0.87<br>0.65|0.60<br>0.68|V|
|Maximum Instantaneous Reverse Current (Note 2)<br>(Rated DC Voltage, TC= 25°C)<br>(Rated DC Voltage, TC= 125°C)|iR||50<br>30|�A<br>mA|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Pulse Test: Pulse Width = 300 � s, Duty Cycle ≤ 2.0%. 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**|||
|---|---|---|
|**Device Order Number**|**Package Type**|**Shipping**|
|MBRF20H150CTG|TO−220FP<br>(Pb−Free)|50 Units / Rail|
|MBR20H150CTG|TO−220<br>(Pb−Free)|50 Units / Rail|



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**2** 

**MBRF20H150CTG, MBR20H150CTG** 

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100 100<br>TJ = 125 ° C TJ = 100 ° C TJ = 125 ° C TJ = 100 ° C<br>TJ = 25 ° C TJ = 25 ° C<br>10 10<br>1 1<br>0.1 0.1<br>0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4<br>VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V)<br>Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage<br>1.0E−02 1.0E−01<br>TJ = 125 ° C TJ = 125 ° C<br>1.0E−03 1.0E−02<br>1.0E−04 TJ = 100 ° C 1.0E−03 TJ = 100 ° C<br>1.0E−05 1.0E−04<br>TJ = 25 ° C<br>1.0E−06 1.0E−05 TJ = 25 ° C<br>1.0E−07 1.0E−06<br>0 10 20 30 40 50 60 70 80 90 100110120130140150 0 10 20 30 40 50 60 70 80 90 100110120130140150<br>VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V)<br>Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current<br>18 18<br>16 dc 16 TJ = 150 ° C<br>14 14<br>SQUARE<br>12 SQUARE WAVE 12<br>10 10<br>8 8 dc<br>6 6<br>4 4<br>2 2<br>0 0<br>110 115 120 125 130 135 140 145 150 155 0 2 4 6 8 10 12 14 16 18 20<br>TC, CASE TEMPERATURE ( ° C) IO, AVERAGE FORWARD CURRENT (AMPS)<br>, INSTANTANEOUS FORWARD CURRENT (A) , INSTANTANEOUS FORWARD CURRENT (A)<br>IF IF<br>, REVERSE CURRENT (A) , REVERSE CURRENT (A)<br>IR IR<br>(WATTS)<br>, AVERAGE POWER DISSIPATION<br>FO<br>P<br>, AVERAGE FORWARD CURRENT (AMPS)<br>IF<br>**----- End of picture text -----**<br>


**Figure 5. Current Derating** 

**Figure 6. Forward Power Dissipation** 

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**3** 

**MBRF20H150CTG, MBR20H150CTG** 

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1000<br>TJ = 25 ° C<br>100<br>10<br>0 50 100 150<br>VR, REVERSE VOLTAGE (V)<br>Figure 7. Capacitance<br>100<br>D = 0.5<br>10<br>0.2<br>0.1<br>0.05<br>1<br>0.01 P(pk)<br>0.1 t 1<br>t2<br>SINGLE PULSE DUTY CYCLE, D = t 1 /t 2<br>0.01<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>Figure 8. Thermal Response Junction−to−Ambient for MBR20H150CTG<br>10<br>D = 0.5<br>1<br>0.2<br>0.1<br>0.05<br>P(pk)<br>0.1<br>0.01 t1<br>t 2<br>SINGLE PULSE DUTY CYCLE, D = t1/t2<br>0.01<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>C, CAPACITANCE (pF)<br>R(t), TRANSIENT THERMAL RESISTANCE<br>R(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 9. Thermal Response Junction−to−Case for MBR20H150CTG** 

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**4** 

**MBRF20H150CTG, MBR20H150CTG** 

0 

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10<br>D = 0.5<br>1<br>0.2<br>0.1<br>0.05<br>0.1<br>0.01<br>P(pk)<br>0.01 t 1<br>SINGLE PULSE t2<br>DUTY CYCLE, D = t 1 /t 2<br>0.001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>R(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 10. Thermal Response Junction−to−Case for MBRF20H150CTG** 

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**5** 

**MBRF20H150CTG, MBR20H150CTG** 

## **PACKAGE DIMENSIONS** 

**TO−220** CASE 221A−09 ISSUE AH 

NOTES: 

**==> picture [234 x 185] intentionally omitted <==**

**----- Start of picture text -----**<br>
SEATING<br>−T− PLANE<br>B F C<br>T S<br>4<br>Q A<br>1 2 3 U<br>H<br>K<br>Z<br>L R<br>V J<br>G<br>D<br>N<br>**----- End of picture text -----**<br>


1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 

2. CONTROLLING DIMENSION: INCH. 

3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. 

|**DIM**|**INCHES**|**INCHES**|**MILLIMETERS**|**MILLIMETERS**|
|---|---|---|---|---|
||**MIN**<br>|**MAX**<br>|**MIN**<br>|**MAX**<br>|
|**A**|0.570|0.620|14.48|15.75|
|**B**|0380|0415|966|1053|
|**C**|.<br>0.160|.<br>0.190|.<br>4.07|.<br>4.83|
|**D**|0.025|0.038|0.64|0.96|
|**F**|0.142|0.161|3.61|4.09|
|**G**|0.095|0.105|2.42|2.66|
|**H**|0.110|0.161|2.80|4.10|
|**J**|0.014|0.024|0.36|0.61|
|**K**|0.500|0.562|12.70|14.27|
|**L**|0.045|0.060|1.15|1.52|
|**N**|0.190|0.210|4.83|5.33|
|**Q**|0100|0120|254|304|
|**R**|.<br>0.080|.<br>0.110|.<br>2.04|.<br>2.79|
|**S**|0.045|0.055|1.15|1.39|
|**T**|0.235|0.255|5.97|6.47|
|**U**|0.000|0.050|0.00|1.27|
|**V**|0.045|---|1.15|---|
|**Z**|---|0.080|---|2.04|
|STYLE<br>PIN|6:<br>1.<br>ANODE<br>2.<br>CATHODE<br>3.<br>ANODE<br>4.<br>CATHODE||||



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**MBRF20H150CTG, MBR20H150CTG** 

## **PACKAGE DIMENSIONS** 

**TO−220 FULLPACK, 3−LEAD** CASE 221AH ISSUE F 

**==> picture [455 x 348] intentionally omitted <==**

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A B SEATINGPLANE NOTES:1. DIMENSIONING AND TOLERANCING PER ASME<br>E Y14.5M, 1994.<br>E/2 P A 2. CONTROLLING DIMENSION: MILLIMETERS.<br>0.14 M B A M H1 A1 3.4. CONTOUR UNCONTROLLED IN THIS AREA.DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH AND GATE<br>PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO<br>EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE TO BE<br>Q MEASURED AT OUTERMOST EXTREME OF THE PLASTIC BODY.<br>D C 5. DIMENSION b2 DOES NOT INCLUDE DAMBAR PROTRUSION.<br>LEAD WIDTH INCLUDING PROTRUSION SHALL NOT EXCEED 2.00.<br>1 2 3 NOTE 3 6. CONTOURS AND FEATURES OF THE MOLDED PACKAGE BODY<br>MAY VARY WITHIN THE ENVELOP DEFINED BY DIMENSIONS A1<br>AND H1 FOR MANUFACTURING PURPOSES.<br>L L1 MILLIMETERS<br>DIM MIN MAX<br>A 4.30 4.70<br>1 A1 2.50 2.90<br>3X b c A2 2.50 2.90<br>3X ae b2 0.25 M B A M C i A2 b2b 0.541.10 0.841.40<br>c 0.49 0.79<br>e 7 H. _ SIDE VIEW . D 14.70 15.30<br>FRONT VIEW E 9.70 10.30<br>e 2.54 BSC<br>H1 6.60 7.10<br>L 12.50 14.73<br>L1 --- 2.80<br>P 3.00 3.40<br>SECTION D−D Boren : Q 2.80 3.20<br>A<br>NOTE 6<br>NOTE 6<br>H1<br>D D<br>A SECTION A−A<br>ALTERNATE CONSTRUCTION<br>**----- End of picture text -----**<br>


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