MBKK2012T2R2M

**for General Electronic Equipment** 

## **Notice for TAIYO YUDEN roducts p** 

Please read this notice before using the TAIYO YUDEN products. 

## REMINDERS 

- **Product Information in this Catalog** 

   - Product information in this catalog is as of October January 2021. All of the 2020 . All of the contents specified herein and production status of the products listed in this catalog are subject to change without notice due to technical improvement of our products, etc.  Therefore, please check for the latest information carefully before practical application or use of our products. 

Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or equipment incorporating our products, which are caused under the conditions other than those specified in this catalog or individual product specification sheets. 

- **Approval of Product Specifications** 

Please contact TAIYO YUDEN for further details of product specifications as the individual product specification sheets are available. When using our products, please be sure to approve our product specifications or make a written agreement on the product specification with TAIYO YUDEN in advance. 

- **Pre-Evaluation in the Actual Equipment and Conditions** 

Please conduct validation and verification of our products in actual conditions of mounting and operating environment before using our products. 

## ■ **Limited Application** 

**1. Equipment Intended for Use** 

The products listed in this catalog are intended for generalpurpose and standard use in general electronic equipment (e.g., AV equipment, OA equipment, home electric appliances, office equipment, information and communication equipment including, without limitation, mobile phone, and PC) and other equipment specified in this catalog or the individual product specification sheets. 

TAIYO YUDEN has the line-up of the products intended for use in automotive electronic equipment, telecommunications infrastructure and industrial equipment, or medical devices classified as GHTF Classes A to C (Japan Classes I to III). Therefore, when using our products for these equipment, please check available applications specified in this catalog or the individual product specification sheets and use the corresponding products. 

## **2. Equipment Requiring Inquiry** 

Please be sure to contact TAIYO YUDEN for further information before using the products listed in this catalog for the following equipment (excluding intended equipment as specified in this catalog or the individual product specification sheets) which may cause loss of human life, bodily injury, serious property damage and/or serious public impact due to a failure or defect of the products and/or malfunction attributed thereto. 

- (1) Transportation equipment (automotive powertrain control system, train control system, and ship control system, etc.) 

- (2) Traffic signal equipment 

- (4) Power generation control equipment (nuclear power, hydroelectric power, thermal power plant control system, etc.) 

- (5) Undersea equipment (submarine repeating equipment, underwater work equipment, etc.) 

- (6) Military equipment 

- (7) Any other equipment requiring extremely high levels of safety and/or reliability equal to the equipment listed above 

- *Notes: 

1. There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g., in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN. Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment. 

2. Implantable medical devices contain not only internal unit which is implanted in a body, but also external unit which is connected to the internal unit. 

## **4. Limitation of Liability** 

Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog for any equipment that is not intended for use by TAIYO YUDEN, or any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above. 

## ■ **Safety Design** 

When using our products for high safety and/or reliability-required equipment or circuits, please fully perform safety and/or reliability evaluation. In addition, please install (i) systems equipped with a protection circuit and a protection device and/or (ii) systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault for a failsafe design to ensure safety. 

## ■ **Intellectual Property Rights** 

Information contained in this catalog is intended to convey examples of typical performances and/or applications of our products and is not intended to make any warranty with respect to the intellectual property rights or any other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights. 

## ■ **Limited Warranty** 

Please note that the scope of warranty for our products is limited to the delivered our products themselves and TAIYO YUDEN shall not be in any way responsible for any damages resulting from a failure or defect in our products. Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in accordance with such agreement. 

- (3) Disaster prevention equipment, crime prevention equipment 

- (5) Highly public information network equipment, dataprocessing equipment (telephone exchange, and base station, etc.) 

- (6) Any other equipment requiring high levels of quality and/or reliability equal to the equipment listed above 

## **3. Equipment Prohibited for Use** 

- Please do not incorporate our products into the following equipment requiring extremely high levels of safety and/or reliability. 

- (1) Aerospace equipment (artificial satellite, rocket, etc.) (2) Aviation equipment *1 

## ■ **TAIYO YUDEN’s Official Sales Channel** 

The contents of this catalog are applicable to our products which are purchased from our sales offices or authorized distributors (hereinafter “TAIYO YUDEN’s official sales channel”). Please note that the contents of this catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN’s official sales channel. 

## ■ **Caution for Export** 

Some of our products listed in this catalog may require specific procedures for export according to “U.S. Export Administration ”“ ” Regulations , Foreign Exchange and Foreign Trade Control Law of Japan, and other applicable regulations. Should you have any questions on this matter, please contact our sales staff. 

- (3) Medical devices classified as GHTF Class D (Japan Class IV), implantable medical devices *2 

▶ For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**2** 

**for General Electronic Equipment** 

METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM MB SERIES） 

## ■PARTS NUMBER 

**==> picture [234 x 182] intentionally omitted <==**

**----- Start of picture text -----**<br>
M B  K K  1 6  0  8 T 1 R 0  M △<br>①  ②  ③  ④  ⑤  ⑥ ⑦<br>①Series name<br>Code  Series name<br>MB  Metal Wire-Wound chip power inductor<br>②Dimensions（T）<br>Code  Dimensions（T）［mm］<br>KK  1.0<br>MK  1.2<br>③Dimensions（L×W）<br>Dimensions<br>Code  Type（inch）<br>（L×W）［mm］<br>1608  1608（0603） 1.6×0.8<br>2012  2012（0805） 2.0×1.25<br>2520  2520（1008） 2.5×2.0<br>**----- End of picture text -----**<br>


* Operating Temp.：-40～+105℃（Including self-generated heat） 

**==> picture [208 x 206] intentionally omitted <==**

**----- Start of picture text -----**<br>
△＝Blank space<br>④Packaging<br>Code  Packaging<br>T  Taping<br>⑤Nominal inductance<br>Code<br>Nominal inductance［μH］<br>（example）<br>R24  0.24<br>1R0  1.0<br>4R7  4.7<br>※R＝Decimal point<br>⑥Inductance tolerance<br>Code  Inductance tolerance<br>M  ±20％<br>N  ±30％<br>⑦Internal code<br>**----- End of picture text -----**<br>


■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY 

|Y|Y|Y|||||||||
|---|---|---|---|---|---|---|---|---|---|---|
|Recommended Land|||Patterns||||||||
|Surface Mounting|||||||||||
|・Mounting and soldering||||||conditions should be checked beforehand.|||||
|・Applicable soldering process to theseproducts is||||||||reflow solderingonly.|||
||||||||Type|A|B|C|
|||||||C|1608|0.55|0.70|1.00|
||||||||2012|0.60|1.00|1.45|
|A<br>B|||A||||2520|0.60|1.50|2.00|
|||||||||||Unit：mm|



|||||||||||ITY|ITY||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||||Recommended Land Patterns<br>Surface Mounting|||||||||
|T||L|||||W||・Mounting and soldering conditio<br>・Applicable soldering process to<br>A<br>A<br>B<br>C|||ns s<br>the|hould be chec<br>seproducts is|ked beforehand.<br>reflow solderingonly.|||||
||||||||||||||||||||
||||||||||||||||||||
||||||||||||||Type|A||B|C||
||||||||||||||1608|0.55||0.70|1.00||
|||e|||||||||||2012|0.60||1.00|1.45||
||||||||||||||2520|0.60||1.50|2.00||
||||||||||||||||||Unit：mm||
||||||||||||||||||||
|||Type|||||L|W|T||e|||Standardquantity［pcs］|||||
||||||||||||||Paper|tape|Embosse||d tape||
|M||BKK1608|||1.6±0.2<br>（0.063±0.008）|||0.8±0.2<br>（0.031±0.008）|1.0 max<br>（0.040 max）||0.45±0.15<br>（0.016±0.006）||－||300||0||
|M||BKK2012|||2.0±0.2<br>（0.079±0.008）|||1.25±0.2<br>（0.049±0.008）|1.0 max<br>（0.040 max）||0.5±0.2<br>（0.020±0.008）||－||300||0||
|M||BMK2520|||2.5±0.2<br>（0.098±0.008）|||2.0±0.2<br>（0.079±0.008）|1.2 max<br>（0.047 max）||0.5±0.2<br>（0.020±0.008）||－||300||0||
||||||||||||||||Unit：mm（inch）||||



▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**47** 

## **for General Electronic Equipment** 

■PARTS NUMBER 

●MBKK1608（0603） type 【Thickness：1.0mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※）［ｍA］（max.）|Rated current ※）［ｍA］（max.）|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MBKK1608TR24N|RoHS|0.24|±30％|-|0.049|1,650|2,300|1.0|
|MBKK1608TR47N|RoHS|0.47|±30％|-|0.104|1,100|1,400|1.0|
|MBKK1608TR68N|RoHS|0.68|±30％|-|0.120|950|1,200|1.0|
|MBKK1608T1R0M|RoHS|1.0|±20％|-|0.150|800|1,150|1.0|
|MBKK1608T1R5M|RoHS|1.5|±20％|-|0.200|650|1,000|1.0|
|MBKK1608T2R2M|RoHS|2.2|±20％|-|0.345|520|750|1.0|
|MBKK1608T3R3M|RoHS|3.3|±20％|-|0.512|450|600|1.0|
|MBKK1608T4R7M|RoHS|4.7|±20％|-|0.730|370|500|1.0|



●MBKK2012（0805） type 【Thickness：1.0mm max.】 

|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※） ［ｍA］（max.）|Rated current ※） ［ｍA］（max.）|Measuring<br>frequency［MHz］|
|---|---|---|---|---|---|---|---|---|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MBKK2012TR24N|RoHS|0.24|±30％|-|0.041|3,000|2,400|1.0|
|MBKK2012TR47N|RoHS|0.47|±30％|-|0.078|2,000|1,650|1.0|
|MBKK2012TR68N|RoHS|0.68|±30％|-|0.090|1,800|1,500|1.0|
|MBKK2012T1R0M|RoHS|1.0|±20％|-|0.106|1,500|1,450|1.0|
|MBKK2012T1R5M|RoHS|1.5|±20％|-|0.173|1,200|1,100|1.0|
|MBKK2012T2R2M|RoHS|2.2|±20％|-|0.290|900|850|1.0|
|MBKK2012T3R3M|RoHS|3.3|±20％|-|0.500|700|650|1.0|
|MBKK2012T4R7M|RoHS|4.7|±20％|-|0.615|600|600|1.0|



|●MBMK2520（1008）type<br>【Thickness：1.2mm max.】|●MBMK2520（1008）type<br>【Thickness：1.2mm max.】|●MBMK2520（1008）type<br>【Thickness：1.2mm max.】|●MBMK2520（1008）type<br>【Thickness：1.2mm max.】|●MBMK2520（1008）type<br>【Thickness：1.2mm max.】|●MBMK2520（1008）type<br>【Thickness：1.2mm max.】||||
|---|---|---|---|---|---|---|---|---|
|Parts number|EHS|Nominal inductance<br>［μH］|Inductance tolerance|Self-resonant<br>frequency<br>［MHｚ］（min.）|DC Resistance<br>［Ω］（max.）|Rated current ※） ［ｍA］（max.）||Measuring<br>frequency［MHz］|
|||||||Saturation current<br>Idc1|Temperature rise current<br>Idc2||
|MBMK2520TR24N|RoHS|0.24|±30％|-|0.026|4,750|3,500|1.0|
|MBMK2520TR47N|RoHS|0.47|±30％|-|0.042|3,900|2,600|1.0|
|MBMK2520TR68N|RoHS|0.68|±30％|-|0.058|3,150|2,150|1.0|
|MBMK2520T1R0M|RoHS|1.0|±20％|-|0.072|2,350|1,850|1.0|
|MBMK2520T1R5M|RoHS|1.5|±20％|-|0.106|2,050|1,500|1.0|
|MBMK2520T2R2M|RoHS|2.2|±20％|-|0.159|1,800|1,250|1.0|
|MBMK2520T3R3M|RoHS|3.3|±20％|-|0.260|1,400|970|1.0|
|MBMK2520T4R7M|RoHS|4.7|±20％|-|0.380|1,150|800|1.0|



※）The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃) 

- ※）The temperature rise current value (Idc2) is the DC current value having temperature increase by 40℃. (at 20℃) 

- ※）The rated current value is following either Idc1 or Idc2, which is the lower one. 

▶ This catalog contains the typical specification only due to the limitation of space.  When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 

**21** 

**48** 

METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOIL[TM] MB SERIES／MCOIL[TM] MB-H SERIES) 

■PACKAGING 

**==> picture [505 x 512] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||
|---|---|---|---|---|
|①Minimum Quantity|
|Standard Quantity|[pcs]|
|Type|
|Tape ＆ Reel|
|MBKK1608／MBKK1608H|3000|
|MBKK2012|3000|
|MBMK2520／MBMK2520H|3000|
|②Tape Material|
|●Embossed Tape|
|Top tape|
|\ _||[oo|
|nog)|SJ|
|Chip Filled|
|NN|es|
|||Sprocket hole|
|['&|OOdd|
|||
|Base tape|Chip cavity|Chip|
|③Taping dimensions|
|●Embossed tape 8mm wide (0.315 inches wide)|
|φ1.5＋0.1/－0|1.75±0.1|
|Sprocket hole|(φ0.059＋0.004/-0)|(0.069±0.004）|at|
|:|
|<>|A|
|B|
|+p|~|
|F|4.0±0.1|
|(0.157±0.004)|
|2.0±0.05|a|
|(0.079±0.002)|Electrode（bottom view）|
|Chip cavity|Insertion pitch|Tape thickness|
|Type|
|A|B|F|T|K|
|1.1|1.9|4.0±0.1|0.25±0.05|1.2 max|
|MBKK1608／MBKK1608H|
|(0.043)|(0.075)|(0.157±0.004)|(0.010±0.002)|(0.047 max)|
|1.45|2.2|4.0±0.1|0.25±0.05|1.2 max|
|MBKK2012|
|(0.057)|(0.087)|(0.157±0.004)|(0.010±0.002)|(0.047 max)|
|2.3|2.8|4.0±0.1|0.3±0.05|1.45 max|
|MBMK2520／MBMK2520H|
|(0.091)|(0.110)|(0.157±0.004)|(0.012±0.002)|(0.057 max)|
|Unit：mm（inch）|
|④Leader and Blank portion|

**----- End of picture text -----**<br>


- This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MB_pack_e-E06R01 

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**----- Start of picture text -----**<br>
⑤Reel size<br>— W<br>| iy . Z ‘Ss \<br>a “TTyi JT4 \  -ae - — os]|e o=<br>\oi3t0.5" f 70 4! ]<br>2.5 or less<br>(0.098inchds<br>. or less)<br>Reel size (Reference values)<br>Type<br>φD  φd  W<br>MBKK1608／MBKK1608H<br>180+0/-3  60+1/-0  10.0±1.5<br>MBKK2012<br>（7.087+0/-0.118）  （2.36+0.039/0）  （0.394±0.059）<br>MBMK2520／MBMK2520H<br>Unit：mm（inch）<br>⑥Top Tape Strength<br>**----- End of picture text -----**<br>


The top The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below. 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MB_pack_e-E06R01 

METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOIL[TM] MB SERIES／MCOIL[TM] MB-H SERIES) 

## ■RELIABILITY DATA 

1. Operating Temperature Range MB series －40～＋105℃ Specified Value MB-H series －40～＋125℃ Test Methods and Including self-generated heat Remarks 2. Storage Temperature Range MB series Specified Value －40～＋85℃ MB-H series Test Methods and 0 to 40℃ for the product with taping. Remarks ~~ee~~ 3. Rated current MB series Specified Value Within the specified tolerance MB-H series ~~a~~ 4. Inductance MB series Specified Value Within the specified tolerance MB-H series Test Methods and Measuring equipment : LCR Meter （HP 4285A or equivalent） Remarks Measuring frequency : 1MHz、1V ~~ee~~ 5. DC Resistance MB series Specified Value Within the specified tolerance MB-H series Test Methods and Measuring equipment : DC ohmmeter （HIOKI 3227 or equivalent） Remarks ~~ee~~ 6. Self resonance frequency MB series Specified Value － MB-H series ~~—————~~ 7. Temperature characteristic MB series Specified Value Inductance change : Within ±15% MB-H series MB series : Measurement of inductance shall be taken at temperature range within －40℃～＋105℃. Test Methods and With reference to inductance value at ＋20℃., change rate shall be calculated. Remarks MB-H series : Measurement of inductance shall be taken at temperature range within －40℃～＋125℃. With reference to inductance value at ＋20℃., change rate shall be calculated. 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MB_reli_e-E06R01 

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||||||
|---|---|---|---|---|
|8. Resistance to flexure of substrate|
|MB series|
|Specified Value|No damage|
|MB-H series|
|The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating|
|until deflection of the test board reaches to 2 mm.|
|Test board size|: 100×40×1.0 mm (1608：0.8mm)|Force Rod|10,|20|
|Test board material|: Glass epoxy-resin|
|R230|
|Test Methods and|Solder cream thickness|: 0.1 mm|
|Remarks|

**----- End of picture text -----**<br>


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|||
|---|---|
|9. Insulation resistance : between wires|
|MB series|
|Specified Value|－|
|MB-H series|
|10. Insulation resistance : between wire and core|
|MB series|DC25V 100kΩ min|
|Specified Value|
|MB-H series|DC50V 100kΩ min|
|11. Withstanding voltage : between wire and core|
|MB series|
|Specified Value|－|
|MB-H series|

**----- End of picture text -----**<br>


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|||||
|---|---|---|---|
|12. Adhesion of terminal electrode|
|MB series|
|Specified Value|No abnormality.|
|MB-H series|
|The test samples shall be soldered to the test board by the reflow.|
|Test Methods and|Applied force|: 10N (1608：5N) to X and Y directions.|
|Remarks|Duration|: 5s.|
|Solder cream thickness|: 0.1mm.|
|13. Resistance to vibration|
|MB series|Inductance change : Within ±10%|
|Specified Value|
|MB-H series|No significant abnormality in appearance.|
|The test samples shall be soldered to the test board by the reflow.|
|Then it shall be submitted to below test conditions.|
|Frequency Range|10～55Hz|
|Total Amplitude|1.5mm (May not exceed acceleration 196m/s|[2]|)|
|Test Methods and|
|Sweeping Method|10Hz to 55Hz to 10Hz for 1min.|
|Remarks|
|X|
|Time|Y|For 2 hours on each X, Y, and Z axis.|
|Z|
|Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.|

**----- End of picture text -----**<br>


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||||
|---|---|---|
|14. Solderability|
|MB series|
|Specified Value|At least 90％ of surface of terminal electrode is covered by new solder.|
|MB-H series|
|The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.|
|Flux : Methanol solution containing rosin 25%.|
|Test Methods and|Solder Temperature|245±5℃|
|Remarks|Immersing speed|25mm/s|
|Time|5±0.5 sec.|
|※Immersion depth : All sides of mounting terminal shall be immersed.|

**----- End of picture text -----**<br>


▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MB_reli_e-E06R01 

|15. Resistance to solderingheat||||
|---|---|---|---|
|Specified Value<br>MB series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>MB-H series||||
|The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 3 times.||||
|Test Methods and<br>Test board material<br>: Glass epoxy-resin||||
|Remarks<br>Test board thickness<br>: 1.0mm||||
|Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.||||
|||||
|16. Thermal shock||||
|Specified Value<br>MB series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>MB-H series<br>Test Methods and<br>Remarks<br>MB series:<br>The test samples shall be soldered to the test board by the reflow.<br>The test samples shall be placed at specified temperature for<br>specified time by step 1 to step 4 as shown in below table in<br>sequence. The temperature cycle shall be repeated 100 cycles.<br>Conditions of 1 cycle<br>Step<br>Temperature (℃)<br>Duration (min)<br>1<br>－40±3<br>30±3<br>2<br>Room temperature<br>Within 3<br>3<br>＋85±2<br>30±3<br>4<br>Room temperature<br>Within 3<br>Recovery : At least 2hrs of recovery under the standard condition<br>after the test, followed by the measurement within 48hrs.<br>MB-H series:<br>The test samples shall be soldered to the test board by the reflow.<br>The test samples shall be placed at specified temperature for<br>specified time by step 1 to step 4 as shown in below table in<br>sequence. The temperature cycle shall be repeated 100 cycles.<br>Conditions of 1 cycle<br>Step<br>Temperature (℃)<br>Duration (min)<br>1<br>－40±3<br>30±3<br>2<br>Room temperature<br>Within 3<br>3<br>＋125±2<br>30±3<br>4<br>Room temperature<br>Within 3<br>Recovery : At least 2hrs of recovery under the standard condition<br>after the test, followed by the measurement within 48hrs.<br>~~ee~~||||
|17. Dampheat||||
|Specified Value<br>MB series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>MB-H series<br>Test Methods and<br>Remarks<br>MB series:<br>The test samples shall be soldered to the test board by the reflow.<br>The test samples shall be placed in thermostatic oven set at<br>specified temperature and humidityas shown in below table.<br>Temperature<br>60±2℃<br>Humidity<br>90～95%RH<br>Time<br>1000＋24/－0 hour<br>Recovery : At least 2hrs of recovery under the standard condition<br>after the test, followed by the measurement within 48hrs.<br>MB-H series:<br>The test samples shall be soldered to the test board by the reflow.<br>The test samples shall be placed in thermostatic oven set at<br>specified temperature and humidityas shown in below table.<br>Temperature<br>85±2℃<br>Humidity<br>85%RH<br>Time<br>1000＋24/－0 hour<br>Recovery : At least 2hrs of recovery under the standard condition<br>after the test, followed by the measurement within 48hrs.<br>~~as~~||||
|18. Loadingunder dampheat||||
|Specified Value<br>MB series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>MB-H series<br>Test Methods and<br>Remarks<br>MB series:<br>The test samples shall be soldered to the test board by the reflow.<br>The test samples shall be placed in thermostatic oven set at<br>specified temperature and humidity and applied the rated current<br>continuouslyas shown in below table.<br>Temperature<br>60±2℃<br>Humidity<br>90～95％RH<br>Applied current<br>Rated current<br>Time<br>1000＋24/－0 hour<br>Recovery : At least 2hrs of recovery under the standard condition<br>after the test, followed by the measurement within 48hrs.<br>MB-H series:<br>The test samples shall be soldered to the test board by the reflow.<br>The test samples shall be placed in thermostatic oven set at<br>specified temperature and humidity and applied the rated current<br>continuouslyas shown in below table.<br>Temperature<br>85±2℃<br>Humidity<br>85％RH<br>Applied current<br>Rated current<br>Time<br>1000＋24/－0 hour<br>Recovery : At least 2hrs of recovery under the standard condition<br>after the test, followed by the measurement within 48hrs.<br>19. Low temperature life test<br>Specified Value<br>MB series<br>Inductance change : Within ±10%<br>No significant abnormality in appearance.<br>MB-H series<br>Test Methods and<br>Remarks<br>The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown<br>in below table.<br>Temperature<br>－40±2℃<br>Time<br>1000＋24/－0 hour<br>Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.<br>~~== =~~<br>~~——~~||||
|||||
|▶This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.||||
|For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .||||



i_wound_MB_reli_e-E06R01 

20. High temperature life test MB series Inductance change : Within ±10% Specified Value MB-H series No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown Test Methods and in below table. Remarks Temperature 85±2℃ Time 1000＋24/－0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 21. Loading at high temperature life test MB series Specified Value － MB-H series ~~eee~~ 22. Standard condition Standard test condition : MB series Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity. Specified Value When there is any question concerning measurement result: In order to provide correlation MB-H series data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity. Inductance is in accordance with our measured value. 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MB_reli_e-E06R01 

METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOIL[TM] MB SERIES／MCOIL[TM] MB-H SERIES) 

## ■PRECAUTIONS 

1. Circuit Design 

◆Operating environment 

1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical 

Precautions equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. 

## 2. PCB Design 

|Precautions|◆Land pattern design<br>1. Please refer to a recommended land pattern.|
|---|---|
||◆Land pattern design|
|Technical|Surface Mounting|
|considerations|・ Mounting and soldering conditions should be checked beforehand.|
||・ Applicable soldering process to this products is reflow soldering only.|



## 3. Considerations for automatic placement 

|Precautions|◆Adjustment of mounting machine<br>1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.<br>2. Mounting and soldering conditions should be checked beforehand.|
|---|---|
|Technical<br>considerations|◆Adjustment of mounting machine<br>1. When installing products, care should be taken not to apply distortion stress as it may deform the products.|



4. Soldering ◆Reflow soldering 1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified. 2. The product shall be used reflow soldering only. 

- Precautions 3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering. ◆Lead free soldering 1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering heat, soldering etc sufficiently. 

- ◆Reflow soldering 

1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. Recommended reflow condition (Pb free solder) 300 5sec max Peak：260+0/-5℃ 150～180 Technical 200 considerations 40sec max 100 90±30sec 230℃ min 0 Heating Time［sec］ 

5. Cleaning ◆Cleaning conditions Precautions 1. Washing by supersonic waves shall be avoided. Technical ◆Cleaning conditions considerations 1. If washed by supersonic waves, the products might be broken. ~~—————————~~ 

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MB_prec_e-E06R01 

|6. Handling||
|---|---|
|Precautions|◆Handling<br>1. Keep the product away from all magnets and magnetic objects.<br>◆Breakaway PC boards (splitting along perforations)<br>1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.<br>2. Board separation should not be done manually, but by using the appropriate devices.<br>◆Mechanical considerations<br>1. Please do not give the product any excessive mechanical shocks.<br>2. Please do not add any shock and power to a product in transportation.<br>◆Pick-up pressure<br>1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.<br>◆Packing<br>1. Please avoid accumulation of a packing box as much as possible.|
|Technical<br>considerations|◆Handling<br>1. There is a case that a characteristic varies with magnetic influence.<br>◆Breakaway PC boards (splitting along perforations)<br>1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.<br>◆Mechanical considerations<br>1. There is a case to be damaged by a mechanical shock.<br>2. There is a case to be broken by the handling in transportation.<br>◆Pick-up pressure<br>1. Damage and a characteristic can vary with an excessive shock or stress.<br>◆Packing<br>1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.|



|Precautions|◆Storage<br>1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the<br>storage area should be controlled.<br>・ Recommended conditions<br>Ambient temperature : 0～40℃<br>Humidity : Below 70% RH<br>・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may<br>decrease as time passes.<br>For this reason, product should be used within 6 months from the time of delivery.<br>In case of storage over 6 months, solderability shall be checked before actual usage.|
|---|---|
|Technical<br>considerations|◆Storage<br>1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes<br>and deterioration of taping/packaging materials may take place.|



▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 

i_wound_MB_prec_e-E06R01