LXA15T600

Fast / Ultrafast Diode, Qspeed, 600 V, 15 A, Single, 3.1 V, 25 ns, 95 A

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Manufacturer: POWER INTEGRATIONS
Product type: Fast & Ultrafast Recovery Rectifier Diodes
Repetitive Reverse Voltage Vrrm Max:600V; Forward Current If(AV):15A; Diode Configuration:Single; Forward Voltage VF Max:3.1V; Reverse Recovery Time trr Max:25ns; Forward Surge Cur
SVHC: No SVHC (21-Jan-2025)
No. of Pins: 2 Pin
Product Range: Qspeed X Series
Qualification: -
Diode Case Style: TO-220AC
Diode Configuration: Single
Forward Voltage Max: 3.1V
Forward Surge Current: 95A
Reverse Recovery Time: 25ns
Average Forward Current: 15A
Operating Temperature Max: 150°C
Repetitive Peak Reverse Voltage: 600V

Delivery and price
Units per pack	5000
Price	0.791 €
Current stock	10+
Lead time	30 days

Datasheet

## **LXA15T600 Qspeed[™]** Family 

## **600 V, 15 A X-Series PFC Diode** 

## **Product Summary** 

|IF(AVG)|15|A|
|---|---|---|
|VRRM|600|V|
|QRR(Typat 125 °C)|120|nC|
|IRRM (Typat 125 °C)|4.6|A|
|Softness tb/ta(Typat 125 °C)|0.45||



## **General Description** 

This device has the lowest QRR of any 600 V Silicon diode. Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers. 

## **Applications** 

## **Pin Assignment** 

- Power Factor Correction (PFC) boost diode 

- Motor drive circuits 

- DC-AC inverters 

## **Features** 

- Low QRR, low IRRM, low tRR 

- High dIF/dt capable (1000 A/µs) 

- Soft recovery 

## **Benefits** 

**==> picture [72 x 29] intentionally omitted <==**

**----- Start of picture text -----**<br>
A C<br>TO-220AC<br>**----- End of picture text -----**<br>


## RoHS Compliant 

Package uses Lead-free plating and Green mold compound. Halogen free per IEC 61249-2-21. 

- Increases efficiency 

- Eliminates need for snubber circuits 

- Reduces EMI filter component size & count 

- Enables extremely fast switching 

## **Absolute Maximum Ratings** 

Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. 

|**Symbol**|**Parameter**|**Conditions**|**Rating**|**Units**|
|---|---|---|---|---|
|VRRM|Peak repetitive reverse voltage||600|V|
|IF(AVG)|Average forward current|TJ= 150 °C,TC= 101 °C|15|A|
|IFSM|Non-repetitivepeak surge current|60 Hz,½ cycle|95|A|
|IFSM|Non-repetitivepeak surge current|½ cycle of t=28µs Sinusoid,TC=25 °C|350|A|
|TJ(MAX)|Maximumjunction temperature||150|°C|
|TSTG|Storage temperature||–55 to 150|°C|
||Lead solderingtemperature|Leads at 1.6 mm from case,10 sec|300|°C|
|PD|Power dissipation|TC= 25 °C|96|W|



## **Thermal Resistance** 

|**Symbol**|**Resistance from:**|**Conditions**|**Rating**|**Units**|
|---|---|---|---|---|
|RθJA|Junction to ambient|TO-220|62|°C/W|
|RθJC|Junction to case|TO-220|1.3|°C/W|



June 2015 

www.power.com 

## **LXA15T600** 

## **Electrical Specifications at TJ= 25 ° C (unless otherwise specified)** 

|**Symbol**|**Parameter**|**Conditions**|**Conditions**|**Min**|**Min**|**Typ**|**Typ**|**Max**|**Max**|**Units**|**Units**|
|---|---|---|---|---|---|---|---|---|---|---|---|
|**DC Characteristics**||||||||||||
|IR<br>~~i~~|Reverse current<br>~~i~~|VR= 600 V,TJ= 25 °C<br>~~es~~|||-<br>~~es~~||-<br>~~es~~||250<br>~~es~~||µA<br>~~es~~|
|||VR= 600 V,TJ= 125 °C<br>~~es~~<br>~~—~~|||-<br>~~es~~<br>~~—~~||1.7<br>~~es~~<br>~~—~~||-<br>~~es~~||mA<br>~~es~~|
|VF<br>~~ee~~|Forward voltage<br>~~ee~~|IF= 15 A,TJ= 25 °C<br>~~ee~~<br>~~—~~|||-<br>~~ee~~<br>~~—~~||2.5<br>~~ee~~<br>~~—~~||3.1<br>~~ee~~||V<br>~~ee~~|
|||IF= 15 A,TJ= 150 °C<br>~~ee~~<br>~~—~~<br>~~es~~|||-<br>~~ee~~<br>~~—~~<br>~~es~~||2.2<br>~~ee~~<br>~~—~~<br>~~es~~||-<br>~~ee~~<br>~~es~~||V<br>~~ee~~<br>~~es~~|
|CJ<br>~~Cn~~|Junction capacitance<br>~~Cn~~|VR= 10 V,1 MHz<br>~~—~~<br>|||-<br>~~—~~<br>||71<br>~~—~~<br>||-<br>||pF<br>|
|**Dynamic Characteristics**<br>~~Cn~~<br>~~eeeee~~~~**e**ee~~<br>~~ee~~||||||||||||
|tRR<br>~~Cnes~~|Reverse recovery time<br>~~Cnes~~|dI/dt =200 A/µs<br>VR=400 V, IF=15 A<br>~~es~~|TJ=25 °C<br>~~es~~<br>~~ee~~||-<br>~~es~~<br>~~ee~~<br>~~ee~~||25<br>~~es~~<br>~~ee~~<br>~~e~~||-<br>~~es~~<br>~~e~~~~**e**~~<br>~~e~~||ns<br>~~es~~<br>~~ee~~|
||||TJ=125 °C<br>~~es~~<br>~~ee~~||-<br>~~es~~<br>~~ee~~<br>~~ee~~||39<br>~~es~~<br>~~ee~~<br>~~e~~||-<br>~~es~~<br>~~e~~~~**e**~~<br>~~e~~||ns<br>~~es~~<br>~~ee~~|
|QRR<br>~~ee~~<br>~~eof~~|Reverse recovery charge<br>~~ee~~<br>~~eof~~|dI/dt =200 A/µs<br>VR=400 V, IF=15 A<br>~~ee~~<br>~~eof~~|TJ=25 °C<br>~~ee~~<br>~~ee~~<br>||-<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>||43<br> ~~ee ~~<br>~~e~~<br>~~ee~~<br>||67<br> ~~e~~~~**e** ~~<br>~~e~~<br>~~ee~~||nC<br> ~~ee~~<br>~~ee~~|
||||TJ=125 °C<br>~~ee~~<br>~~es~~<br>||-<br>~~ee~~<br>~~es~~<br>~~ee~~<br>||120<br>~~ee~~<br>~~es~~<br>||-<br>~~ee~~<br>~~es~~||nC<br>~~ee~~<br>~~es~~|
|IRRM<br>~~eof~~|Maximum reverse<br>recovery current<br>~~eof~~|dI/dt =200 A/µs<br>VR=400 V, IF=15 A<br>~~eof~~|TJ=25 °C<br>~~ee ee~~||-<br>~~ee~~<br>~~ee~~||2.7<br>~~ee~~||3.6||A|
||||TJ=125 °C<br>~~ee ee~~||-<br>~~ee~~<br>~~ee~~||4.6<br>~~ee~~||-||A|
|S<br>|Softness factor =<br>a<br>b<br>t<br>t<br>|dI/dt =200 A/µs<br>VR=400 V, IF=15 A<br>|TJ=25 °C<br>~~ee ee~~||-<br>~~ee ~~||0.7<br> ~~ee~~||-|||
||||TJ=125 °C||-||0.45||-|||



**Note to component engineers** :  X-Series diodes employ Schottky technologies in their design and construction. Therefore, Component Engineers should plan their test setups to be similar to those for traditional Schottky test setups.  (For additional details, see Application Note AN-300.) 

**==> picture [206 x 78] intentionally omitted <==**

**----- Start of picture text -----**<br>
IF tRR<br>dIF/d ta tb<br>0 id<br>0.2xIRRM<br>IRRM<br>**----- End of picture text -----**<br>


**Figure 1.  Reverse Recovery Definitions** 

**Figure 2.  Reverse Recovery Test Circuit** 

Rev 1 a **.22** 06/15 

S **LXA15T600** 

## **Electrical Specifications at TJ= 25 ° C (unless otherwise specified)** 

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50 250<br>45 225<br>40 200<br>35 Tj=125C 175<br>30 150<br>25 125<br>20 Tj=25C 100<br>15 75<br>10 iyA) 50 ERR<br>5 25<br>0 A 0 EEE EEE<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 20 40 60 80 100 120 140 160 180<br>| | Re<br>VF (V) VR (V)<br>Figure 3.   Typical IF vs VF Figure 4.  Typical Cj vs VR<br>250 50<br>225 dIF/dt=500A/us 45 dIF/dt=200A/us<br>200<br>40<br>175<br>35<br>150<br>30<br>125<br>100 dIF/dt=200A/us 25 dIF/dt=500A/us<br>75 20<br>50 15<br>0 5 10 15 20 25 30 35 0 5 10 15 20 25 30 35<br>IF (A) IF (A)<br>Figure 5.   Typical QRR vs IF at TJ = 125 °C Figure 6.   Typical tRR vs IF at TJ = 125 °C<br>35 100<br>90<br>30<br>80<br>25 70<br>60<br>20<br>50<br>SSaas<br>15 40<br>30<br>10<br>20<br>5 10<br>0 PEERS 0<br>25 50 75 100 125 150 25 50 75 100 125 150<br>Case Temperature, TC (oC) Case Temperature, TC (oC)C (oC) (oC)oC)C)<br>(A)IF  C(pF)j<br> (nC)  (ns)<br>QRR tRR<br> (A)IF(AV) P (W)<br>**----- End of picture text -----**<br>


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100<br>90<br>80<br>70<br>60<br>50<br>40<br>30<br>20<br>10<br>0<br>25 50 75 100 125 150<br>Case Temperature, TC (oC)C (oC) (oC)oC)C)<br>P (W)<br>**----- End of picture text -----**<br>


**Figure 8.   Power Derating Curve** 

**Figure 7.   DC Current Derating Curve** 

**3** 

Rev 1.2 06/15 

## **LXA15T600** 

**==> picture [258 x 157] intentionally omitted <==**

**----- Start of picture text -----**<br>
duty cycle=10%<br>55<br>duty cycle=30%<br>50 ee Nee<br>45 PNM duty cycle=50%<br>i ee) DC<br>40<br>35 Poee [NNO] XY& ae<br>30 are ave<br>Po<br>25 OK A<br>eee<br>20 ane<br>15 PNK<br>PR<br>10<br>5 ee [NN] A<br>0<br>25 50 75 100 125 150<br>T C(°C)<br>(PEAK) (A)<br>IF<br>**----- End of picture text -----**<br>


**Figure 9.   IF(PEAK) vs TC, f=70 kHz** 

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**----- Start of picture text -----**<br>
LXA15T600<br>1<br>D= 0.5<br>D = 0.3<br>D= 0.1<br>0.1<br>D= 0.05<br>D= 0.02<br>D= 0.01<br>0.01 D=0.005<br>D=0.002<br>Single Pulse<br>Go al<br>0.001<br>1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>t1(sec)<br>Zth(j-c)/Rth(j-c)<br>**----- End of picture text -----**<br>


**Figure 10.  Normalized Maximum Transient Thermal Impedance** 

**4** Rev 1 a **.2** 06/15 

Po **LXA15T600** 

## **Dimensional Outline Drawings** 

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**----- Start of picture text -----**<br>
es Millimeters<br>Dim  MIN  MAX<br>esee<br>es A  4.32  ee 4.70<br>es A1  1.14  ee 1.40<br>es A2  2.03  ee 2.79<br>C  0.34  0.610<br>ee ee<br>D  9.65  10.67<br>E  2.49  2.59<br>ee ee<br>E1  4.98  5.18<br>esee<br>F  0.508  1.016<br>esee<br>F1  1.14  1.78<br>ee<br>eses H  14.71  16.51<br>es H1  ee 5.84  ee 6.55<br>H2  8.51  9.25<br>ee ee<br>H3  3.53  3.96<br>es H4  2.54  ee 3.05<br>es L  12.70  ee 14.22<br>es L1  ee -  6.35<br>**----- End of picture text -----**<br>


|**Mechanical Mounting Method**|**Maximum Torque/ Pressure specification**|
|---|---|
|Screw through hole inpackage tab|1 Newton Meter(nm)or 8.8 inch-pounds(lb-in)|
|Clampagainstpackage body|12.3 kilogram-forceper square centimeter(kgf/cm2)or 175 lbf/in2|



**Soldering time and temperature:** This product has been designed for use with high-temperature, leadfree solder.  The component leads can be subjected to a maximum temperature of 300 °C, for up to 10 seconds.  See Application Note AN-303, for more details. 

## **Ordering Information** 

|**Part Number**|**Package **|**Packing**|
|---|---|---|
|LXA15T600|TO-220AC|50 units/tube|



**The information contained in this document is subject to change without notice.** 

**5** — Rev 1.2 06/15 

## **LXA15T600** 

|**Revision**|**Notes**|**Date**|
|---|---|---|
|1.0|Released by Qspeed|08/09|
|1.1|Converted to Power Integrations Document|01/11|
|1.1|StopPoint of tRRerror corrected due to typo in Figure 1|11/13|
|1.2|Updated with new Brand Style.|06/15|



**6** Rev 1 a **.2** 06/15 

**LXA15T600** 

## **For the latest updates, visit our website: www.power.com** 

Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability.  Power Integrations does not assume any liability arising from the use of any device or circuit described herein.  POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. 

## **Patent Information** 

The products and applications illustrated herein (including transformer construction and circuits’ external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations.  A complete list of Power Integrations’ patents may be found at www.power.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.power.com/ip.htm. 

## **Life Support Policy** 

POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS.  As used herein: 

1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user. 

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 

The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, LYTSwitch, InnoSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS, HiperLCS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, FluxLink, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies.  ©Copyright 2015 Power Integrations, Inc. 

## **Power Integrations Worldwide Sales Support Locations** 

## **WORLD HEADQUARTERS** 

5245 Hellyer Avenue San Jose, CA 95138, USA. Main: +1-408-414-9200 Customer Service: Phone: +1-408-414-9665 Fax: +1-408-414-9765 e-mail: usasales@power.com 

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## **KOREA** 

## **UK** 

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## **ITALY** 

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**7** ~~r~~ 

**7** Rev 1.2 06/15

Updated at June 4, 2026

Power Integrations is a leading innovator in semiconductor technologies dedicated to high-voltage power conversion. Renowned for advancing the clean-power ecosystem, the company designs highly integrated chips that maximize energy efficiency across a vast range of consumer and industrial applications. Through proprietary advancements like PowiGaN gallium-nitride technology and EcoSmart energy-efficiency solutions, their components deliver exceptional performance while significantly reducing global energy waste. A major focus of their product lineup includes discrete semiconductors, particularly fast and ultrafast recovery rectifier diodes. These essential components provide the high-speed switching and exceptional reliability required for modern power supply designs. By minimizing power loss and thermal output, they ensure efficient power transmission in demanding, high-efficiency circuit environments. Furthermore, Power Integrations is a premier manufacturer of specialized LED lighting components. Their advanced AC/DC LED driver ICs offer engineers streamlined, energy-efficient solutions for solid-state lighting applications. By integrating critical control and protection features into a single footprint, these drivers reduce the overall component count and accelerate the development of reliable, high-performance commercial and consumer lighting systems.

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