LXA08T600

Fast / Ultrafast Diode, Qspeed, 600 V, 8 A, Single, 2.94 V, 34 ns, 60 A

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.

Manufacturer: POWER INTEGRATIONS
Product type: Fast & Ultrafast Recovery Rectifier Diodes
Repetitive Reverse Voltage Vrrm Max:600V; Forward Current If(AV):8A; Diode Configuration:Single; Forward Voltage VF Max:2.94V; Reverse Recovery Time trr Max:34ns; Forward Surge Curr
SVHC: No SVHC (21-Jan-2025)
No. of Pins: 2 Pin
Product Range: Qspeed X Series
Qualification: -
Diode Case Style: TO-220AC
Diode Configuration: Single
Forward Voltage Max: 2.94V
Forward Surge Current: 60A
Reverse Recovery Time: 34ns
Average Forward Current: 8A
Operating Temperature Max: 150°C
Repetitive Peak Reverse Voltage: 600V

Delivery and price
Units per pack	500
Price	0.513 €
Current stock	500+
Lead time	30 days

Datasheet

**600 V, 8 A X-Series PFC Diode** 

## **LXA08T600, LXA08B600 Qspeed[™]** Family 

## **Product Summary** 

|IF(AVG)|8|A|
|---|---|---|
|VRRM|600|V|
|QRR(Typat 125 °C)|82|nC|
|IRRM (Typat 125 °C)|3.5|A|
|Softness tB/tA(Typat 125 °C)|0.55||



## **General Description** 

This device has the lowest QRR of any 600 V silicon diode. Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers. 

## **Applications** 

- Power Factor Correction (PFC) boost diode 

## **Pin Assignment** 

- Motor drive circuits 

- DC-AC inverters 

**==> picture [181 x 57] intentionally omitted <==**

**----- Start of picture text -----**<br>
K K<br>K e NC K 6<br>A A<br>**----- End of picture text -----**<br>


**TO-220AC TO-263AB LXA08T600 LXA08B600** 

## **Features** 

- Low QRR, low IRRM, low tRR 

- High dIF/dt capable (1000 A/ µ s) 

- Soft recovery 

## **Benefits** 

- Increases efficiency 

- Eliminates need for snubber circuits 

## **A** >t **K** 

- Reduces EMI filter component size and count 

- Enables extremely fast switching 

## RoHS Compliant 

Package uses Lead-free plating and Green mold compound. Halogen free per IEC 61249-2-21. 

## **Absolute Maximum Ratings** 

Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. 

|**Symbol**|**Parameter**|**Conditions**|**Rating**|**Units**|
|---|---|---|---|---|
|VRRM|Peak repetitive reverse voltage||600|V|
|IF(AVG)|Average forward current|TJ= 150 °C, TC= 122 °C (220AC, 263AB)|8|A|
|IFSM|Non-repetitivepeak surge current|60 Hz,½ cycle|60|A|
|IFSM|Non-repetitivepeak surge current|½ cycle of t = 28µs Sinusoid,TC= 25 °C|350|A|
|TJ(MAX)|Maximumjunction temperature||150|°C|
|TSTG|Storage temperature||–55 to 150|°C|
||Lead solderingtemperature|Leads at 1.6 mm from case,10 sec|300|°C|
|PD|Power dissipation|TC= 25 °C. (TO-220AC, TO-263AB)|83|W|



January 2016 

www.power.com 

ee **LXA08T600, LXA08B600** 

## **Thermal Resistance** 

|**Symbol**|**Resistance from:**|**Conditions**|**Rating**|**Units**|
|---|---|---|---|---|
|RθJA|Junction to ambient|TO-220AC(Only)|62|°C/W|
|RθJC|Junction to case|TO-220AC,TO-263AB|1.5|°C/W|



## **Electrical Specifications at TJ = 25 ° C (unless otherwise specified)** 

|**Symbol**|**Parameter**|**Conditions**|**Conditions**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|---|
|**DC Characteristics**<br>~~eenseeeeeeeee~~||||||||
|IR<br>~~ee~~|Reverse current<br>~~eens~~|VR= 600 V,TJ= 25 °C<br>~~a~~<br>~~ns~~||-<br>~~a~~<br>~~eee~~|-<br>~~a~~<br>~~ee~~|250<br>~~a~~<br>~~ee~~|µA<br>~~a~~<br>~~ee~~|
|||VR= 600 V,TJ= 125 °C<br>~~ns~~||-<br>~~eee~~|0.85<br>~~ee~~|-<br>~~ee~~|mA<br>~~ee~~|
|VF<br>~~ee~~<br>~~Pf~~|Forward voltage<br>~~eens~~<br>~~Pf ~~|IF= 8 A,TJ= 25 °C<br>~~ns ~~<br>~~a~~||-<br> ~~eee ~~<br>~~a~~|2.35<br> ~~ee ~~<br>~~a~~|2.94<br> ~~ee ~~<br>~~a~~|V<br> ~~ee~~<br>~~a~~|
|||IF= 8 A,TJ= 150 °C<br> ~~a~~||-<br>~~a~~|2.1<br>~~a~~|-<br>~~a~~|V<br>~~a~~|
|CJ|Junction capacitance|VR= 10 V,1 MHz||-|40|-|pF|
|**Dynamic Characteristics**<br>~~ce~~||||||||
|tRR<br>~~a~~|Reverse recovery time<br>~~a~~|dI/dt = 200 A/µs<br>VR= 400 V, IF= 8 A<br>~~a~~|TJ= 25 °C<br>~~a~~|-<br>~~a~~|21.5<br>~~a~~|34<br>~~a~~|ns<br>~~a~~|
||||TJ= 125 °C<br>~~a~~<br>~~es~~|-<br>~~a~~<br>~~es~~<br>~~es~~|33<br>~~a~~<br>~~es~~<br>~~ee~~|53<br>(1)<br>~~a~~<br>~~es~~<br>~~ee~~|ns<br>~~a~~<br>~~es~~<br>~~ee~~|
|QRR<br>~~et~~|Reverse recovery charge<br>~~et~~|dI/dt = 200 A/µs<br>VR= 400 V, IF= 8 A<br>~~et~~<br>~~ee~~|TJ= 25 °C<br>~~et~~|-<br>~~es~~<br>~~et~~<br>~~es~~|31<br>~~ee ~~<br>~~et~~<br>~~ee~~|48<br> ~~ee ~~<br>~~et~~<br>~~ee~~|nC<br> ~~ee~~<br>~~et~~<br>~~ee~~|
||||TJ= 125 °C<br>~~et~~<br>~~es~~<br>~~ee~~|-<br>~~et~~<br>~~es~~<br>~~es~~<br>~~ee~~|82<br>~~et~~<br>~~es~~<br>~~ee~~<br>~~ee~~|130<br>(1)<br>~~et~~<br>~~es~~<br>~~ee~~<br>~~ee~~|nC<br>~~et~~<br>~~es~~<br>~~ee~~<br>~~ee~~|
|IRRM<br>~~ee~~<br>~~i~~|Maximum reverse<br>recovery current<br>~~ee~~<br>~~i~~|dI/dt = 200 A/µs<br>VR= 400 V, IF= 8 A<br>~~ee~~<br>~~ee~~|TJ= 25 °C<br>~~ee~~<br>~~ee~~|-<br>~~es ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|2.2<br> ~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|2.8<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|A<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|
||||TJ= 125 °C<br>~~ee~~<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~ee~~<br>~~es~~<br>~~ee~~|3.5<br>~~ee~~<br>~~ee~~<br>~~es~~<br>~~ee~~|4.5<br>(1)<br>~~ee~~<br>~~ee~~<br>~~es~~<br>~~ee~~|A<br>~~ee~~<br>~~ee~~<br>~~es~~<br>~~ee~~|
|S<br>~~i~~|Softness factor =<br>A<br>B<br>t<br>t<br>~~i~~|dI/dt = 200 A/µs<br>VR= 400 V, IF= 8 A<br>~~ee~~|TJ= 25 °C<br>~~ee ~~|-<br> ~~ee~~<br>~~ee~~|0.74<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~|
||||TJ= 125 °C|-<br>~~ee ~~|0.55<br> ~~ee ~~|-<br> ~~ee ~~|~~ee~~|



(1) = Statistical limit. Not tested in production. 

**Note to component engineers** : X-Series diodes employ Schottky technologies in their design and construction. Therefore, Component Engineers should plan their test setups to be similar to those for traditional Schottky test setups.  (For additional details, see Application Note AN-300.) 

**==> picture [207 x 78] intentionally omitted <==**

**----- Start of picture text -----**<br>
IF tRR<br>dIF/dt<br>tA tB ><br>0 A<br>0.2xIRRM<br>IRRM<br>**----- End of picture text -----**<br>


**Figure 1.  Reverse Recovery Definitions.** 

**Figure 2.  Reverse Recovery Test Circuit.** 

**2** a 

**2** Rev 1.12 01/16 

~~Pe~~ **LXA08T600, LXA08B600** 

## **Electrical Specifications at TJ = 25 ° C (unless otherwise specified)** 

**==> picture [447 x 505] intentionally omitted <==**

**----- Start of picture text -----**<br>
24 160<br>22<br>a ee ee ee a ee 140 P| | | Pe ET<br>20<br>18 Tj=125C 120<br>a aa a<br>16<br>14 a fo 100 P| ft rt rE<br>12 80<br>10 /| Tj=25C<br>8 7, 60<br>6 S ESS || Fee 40<br>4<br>20<br>2 a a > pS tf | |<br>0 et 0 i ee<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 20 40 60 80 100 120 140 160 180<br>VF (V) VR (V)<br>Figure 3.  Typical IF vs. VF. Figure 4.  Typical CJ vs. VR.<br>dI/dt=1000A/us<br>160140 P| | [ | []t 4035 dI/dt=200A/us eae<br>dI/dt=500A/us<br>120 30<br>dI/dt=500A/us<br>100 25<br>80 20<br>dI/dt=200A/us<br>60 15<br>dI/dt=1000A/us<br>4020 [am “i | | [| [| | | | [| 105 [/y(7; || [| [| hUmT|  rT|<br>0 2 4 6 8 10 12 14 0 2 4 6 8 10 12 14<br>IF (A) IF (A)<br>Figure 5.  Typical QRR vs. IF at TJ = 125 °C. Figure 6.  Typical tRR vs. IF at TJ = 125 °C.<br>25 100<br>90<br>20 >~ TO-220 & TO-263 | || 80 a<br>70 TO-220 & TO-263<br>15 oo ~ 60 CePRee<br>50<br>FullPak<br>10 40<br>—_ > 30 SS FullPak<br>5 20<br>10<br>0 aN 0 a ee ee<br>25 50 75 100 125 150 25 50 75 100 125 150<br>o o<br>Case Temperature, TC ( C) Case Temperature, TC ( C)<br>(A)IF  C(pF)j<br> (nC)  (ns)<br>QRR tRR<br> (A)<br>IF(AV) P (W)<br>**----- End of picture text -----**<br>


**Figure 7.  DC Current Derating Curve.** 

**Figure 8.  Power Derating Curve.** 

Rev 1.12 01/16 

**3** 

pl **LXA08T600, LXA08B600** 

**==> picture [209 x 145] intentionally omitted <==**

**----- Start of picture text -----**<br>
55<br>50 Duty=10%<br>45 NOM Duty=30%<br>40 Duty=50%<br>35 NOY DC<br>30<br>25<br>20<br>15 EK<br>10<br>5 oN<br>0 SN<br>25 50 75 100 125 150<br>T C(°C)<br>(PEAK) (A)<br>IF<br>**----- End of picture text -----**<br>


**Figure 9.  IF(PEAK) vs. TC, f = 70 kHz, TO-220 and TO-263.** 

**==> picture [411 x 287] intentionally omitted <==**

**----- Start of picture text -----**<br>
LXA08T600, LXA08B600<br>1<br>D= 0.5<br>D = 0.3<br>D= 0.1<br>0.1<br>D= 0.05<br>D= 0.02<br>D= 0.01<br>0.01<br>D= 0.005<br>D= 0.002<br>Single Pulse<br>YG _<br>0.001<br>1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>t1(sec)<br>Zth(j-c)/Rth(j-c)<br>**----- End of picture text -----**<br>


**Figure 10.  Normalized Maximum Transient Thermal Impedance, TO-220 and TO-263.** 

**4** Rev 1.12 01/16 

~~Pe~~ **LXA08T600, LXA08B600** 

## **Dimensional Outline Drawings** 

|~~ee~~|**Millimeters**<br>~~ee~~<br>~~ee~~|**Millimeters**<br>~~ee~~<br>~~ee~~|
|---|---|---|
|**Dim**<br>~~ee~~<br>~~es~~|**MIN**<br>~~ee~~<br>~~es~~<br>~~ee~~<br>~~ee~~|**MAX**<br>~~ee~~<br>~~es~~|
|**A**<br>~~es~~|4.32<br>~~ee~~<br>~~es~~<br>~~ee~~<br>~~ee~~|4.70<br>~~es~~|
|**A1**<br>~~es~~|1.14<br>~~ee~~<br>~~es~~<br>~~ee~~|1.40<br>~~es~~|
|**A2**<br>~~es~~|2.03<br>~~es~~<br>~~ee~~<br>~~ee~~|2.79<br>~~es~~|
|**C**<br>~~ee~~|0.34<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.610<br>~~ee~~|
|**D**<br>~~ee~~<br>~~es~~|9.65<br>~~ee~~<br>~~ee~~<br>~~es~~<br>~~ee~~<br>~~ee~~|10.67<br>~~ee~~<br>~~es~~|
|**E**<br>~~es~~<br>~~es~~|2.49<br>~~es~~<br>~~ee~~<br>~~es~~<br>~~ee~~|2.59<br>~~es~~<br>~~es~~|
|**E1**<br>~~es~~|4.98<br>~~es~~<br>~~ee~~|5.18<br>~~es~~|
|**F**|0.508<br>~~ee~~|1.016|
|**F1**<br>~~es~~|1.14<br>~~es~~<br>~~ee~~<br>~~ee~~|1.78<br>~~es~~|
|**H**<br>~~es~~<br>~~es~~|14.71<br>~~es~~<br>~~ee~~<br>~~es~~<br>~~ee~~|16.51<br>~~es~~<br>~~es~~|
|**H1**|5.84<br>~~ee~~<br>~~ee~~|6.55|
|**H2**<br>~~es~~|8.51<br>~~es~~<br>~~ee~~<br>~~ee~~|9.25<br>~~es~~|
|**H3**<br>~~es~~|3.53<br>~~ee~~<br>~~es~~<br>~~ee~~<br>~~ee~~|3.96<br>~~es~~|
|**H4**<br>~~es~~|2.54<br>~~ee~~<br>~~es~~<br>~~ee~~<br>~~ee~~|3.05<br>~~es~~|
|**L**<br>~~es~~|12.70<br>~~ee~~<br>~~es~~<br>~~ee~~|14.22<br>~~es~~|
|**L1**<br>~~es~~|-<br>~~es~~<br>~~ee~~|6.35<br>~~es~~|



## **TO-220AC** 

**5** | 

ee **LXA08T600, LXA08B600** 

## **TO-263AB** 

||**Millimeters**|**Millimeters**|
|---|---|---|
|**Dim**|**MIN**|**MAX**|
|**A**|4.40|4.70|
|**A1**<br>~~es~~|0.00<br>~~ee~~|0.25|
|**A2**<br>~~es~~<br>~~es~~|2.59<br>~~ee~~<br>~~es~~<br>~~ee~~|2.79<br>~~es~~|
|**b**<br>~~es ~~<br>~~es~~|0.77<br> ~~ee~~<br>~~es~~<br>~~ee~~|0.90<br>~~es~~|
|**b2**<br>~~es~~|1.23<br>~~es~~<br>~~ee~~|1.36<br>~~es~~|
|**c2**|1.22|1.32|
|**D**|9.05<br>~~ee~~|9.25|
|**E**<br>~~es~~|10.06<br>~~es~~<br>~~ee~~|10.26<br>~~es~~|
|**e**|2.54 BSC<br>~~ee~~|2.54 BSC|
|**H**|14.70|15.50|
|**L**|2.00<br>~~ee~~|2.60|
|**L1**<br>~~es~~<br>~~ee~~|1.17<br>~~es~~<br>~~ee~~<br>~~ee~~|1.40<br>~~es~~<br>~~ee~~|
|**L2**<br>~~es~~<br>~~ee~~|–<br>~~es~~<br>~~ee~~<br>~~ee~~|1.75<br>~~es~~<br>~~ee~~|
|**L3**<br>~~ee~~<br>~~es~~|0.25 BSC<br>~~ee~~<br>~~ee~~<br>~~es~~<br>~~ee~~|0.25 BSC<br>~~ee~~<br>~~es~~|
|**L4**<br>~~es~~|2.00 BSC<br>~~es~~<br>~~ee~~|2.00 BSC<br>~~es~~|
|**Θ**<br>~~es~~|0°<br>~~ee~~<br>~~es~~<br>~~ee~~|8°<br>~~es~~|
|**Θ1**<br>~~es~~|5°<br>~~es~~<br>~~ee~~<br>~~ee~~|9°<br>~~es~~|
|**Θ2**<br>~~es~~|1°<br>~~ee~~<br>~~es~~<br>~~ee~~|5°<br>~~es~~|



|**Mechanical Mounting Method**|**Maximum Torque / Pressure specification**|
|---|---|
|Screw through hole inpackage tab|1 Newton Meter(nm)or 8.8 inch-pounds(lb-in)|
|Clampagainstpackage body|12.3 kilogram-forceper square centimeter(kgf/cm2)or 175 lbf/in2|



**Soldering time and temperature:** This product has been designed for use with hightemperature, lead-free solder.  The component leads can be subjected to a maximum temperature of 300 °C, for up to 10 seconds.  See Application Note AN-303, for more details. 

## **Ordering Information** 

|**Part Number**|**Package**|**Packing**|
|---|---|---|
|LXA08T600|TO-220AC|50 units/tube|
|LXA08B600|TO-263AB|800 units/reel|



**The information contained in this document is subject to change without notice.** 

**6** 

Rev 1.12 01/16 

**LXA08T600, LXA08B600** 

|**Revision**|**Notes**|**Date**|
|---|---|---|
|1.9|Released by Qspeed.|06/10|
|1.10|Converted to Power Integrations document.|01/11|
|1.10|StopPoint of tRRerror corrected due to typo in Figure 1.|11/13|
|1.10|Added Footnote(1)to Electrical Specifications Table.|09/14|
|1.11|Updated with new Brand Style.|06/15|
|1.12|Removed LXA08FP600parts.|01/16|



| **7** | 

**LXA08T600, LXA08B600** 

## **For the latest updates, visit our website: www.power.com** 

Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability.  Power Integrations does not assume any liability arising from the use of any device or circuit described herein.  POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. 

## **Patent Information** 

The products and applications illustrated herein (including transformer construction and circuits’ external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations.  A complete list of Power Integrations’ patents may be found at www.power.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.power.com/ip.htm. 

## **Life Support Policy** 

POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS.  As used herein: 

1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user. 

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 

The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, LYTSwitch, InnoSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS, HiperLCS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, FluxLink, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies.  ©Copyright 2016 Power Integrations, Inc. 

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**8** | | Rev 1.12 01/16

Updated at June 4, 2026

Power Integrations is a leading innovator in semiconductor technologies dedicated to high-voltage power conversion. Renowned for advancing the clean-power ecosystem, the company designs highly integrated chips that maximize energy efficiency across a vast range of consumer and industrial applications. Through proprietary advancements like PowiGaN gallium-nitride technology and EcoSmart energy-efficiency solutions, their components deliver exceptional performance while significantly reducing global energy waste. A major focus of their product lineup includes discrete semiconductors, particularly fast and ultrafast recovery rectifier diodes. These essential components provide the high-speed switching and exceptional reliability required for modern power supply designs. By minimizing power loss and thermal output, they ensure efficient power transmission in demanding, high-efficiency circuit environments. Furthermore, Power Integrations is a premier manufacturer of specialized LED lighting components. Their advanced AC/DC LED driver ICs offer engineers streamlined, energy-efficient solutions for solid-state lighting applications. By integrating critical control and protection features into a single footprint, these drivers reduce the overall component count and accelerate the development of reliable, high-performance commercial and consumer lighting systems.

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