LXA04T600
Fast / Ultrafast Diode, Qspeed, 600 V, 4 A, Single, 2.96 V, 18.5 ns, 30 A
- Manufacturer: POWER INTEGRATIONS
- Product type: Fast & Ultrafast Recovery Rectifier Diodes
- No. of Pins: 2 Pin
- Product Range: Qspeed X Series
- Diode Case Style: TO-220AC
- Diode Configuration: Single
- Forward Voltage Max: 2.96V
- Forward Surge Current: 30A
- Reverse Recovery Time: 18.5ns
- Average Forward Current: 4A
- Operating Temperature Max: 150°C
- Repetitive Peak Reverse Voltage: 600V
| Delivery and price | |
|---|---|
| Units per pack | 1 |
| Price | 0.262 € |
| Current stock | 10+ |
| Lead time | 30 days |
**LXA04T600, LXA04B600 Qspeed[™]** Family ## **600 V, 4 A X-Series PFC Diode** **Product Summary** IF(AVG) 4 A VRRM 600 V QRR (Typ at 125 °C) 50 nC IRRM (Typ at 125 °C) 2.6 A ~~===~~ Softness tb/ta (Typ at 125 °C) 0.8 **Pin Assignment K K NC K K A A** ## **General Description** This device has the lowest QRR of any 600 V Silicon diode. Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers. ## **Applications** - Power Factor Correction (PFC) Boost Diode - Motor drive circuits - DC-AC Inverters ## **Features** - Low QRR, Low IRRM, Low tRR - High dIF/dt capable (1000 A/µs) - Soft recovery ## **TO-220AC TO-263AB** ## **Benefits** **LXA04T600 LXA04B600** - Increases efficiency ## **A** ## **K** ## RoHS Compliant - Eliminates need for snubber circuits - Reduces EMI filter component size & count - Enables extremely fast switching Package uses Lead-free plating and Green mold compound. Halogen free per IEC 61249-2-21. ## **Absolute Maximum Ratings** Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. |**Symbol**|**Parameter**|**Conditions**|**Rating**|**Units**| |---|---|---|---|---| |VRRM|Peak repetitive reverse voltage||600|V| |IF(AVG)|Average forward current|TJ= 150 °C,TC= 127 °C|4|A| |IFSM|Non-repetitivepeak surge current|60 Hz,½ cycle|30|A| |IFSM|Non-repetitivepeak surge current|½ cycle of t=28μs Sinusoid,TC=25 °C|350|A| |TJ(MAX)|Maximumjunction temperature||150|°C| |TSTG|Storage temperature||–55 to 150|°C| ||Lead solderingtemperature|Leads at 1.6 mm from case,10 sec|300<br>~~ee~~|°C| |PD|Power dissipation|TC= 25 °C<br>~~ee~~|52<br>~~ee~~<br>~~ee~~|W<br>~~ee~~| |VRRM|Peak repetitive reverse voltage|~~ee~~|600<br>~~ee~~<br>~~ee~~|V<br>~~ee~~| ## **Thermal Resistance** |**Symbol**|**Resistance from:**|**Conditions**|**Rating**|**Units**| |---|---|---|---|---| |RJA|Junction to ambient|TO-220(Only)|62|°C/W| |RJC|Junction to case||2.4|°C/W| November 2013 www.powerint.com **LXA04T600, LXA04B600** ## **Electrical Specifications** at TJ= 25 C (unless otherwise specified) |**Symbol**|**Parameter**|**Conditions**|**Conditions**|**Min**|**Typ**|**Max**|**Units**| |---|---|---|---|---|---|---|---| |**DC Characteristics**|||||||| |IR|Reverse current|VR= 600V, TJ= 25 °C||-|-|250|A| |||VR= 600V,TJ= 125 °C||-|0.45|-|mA| |VF|Forward voltage|IF= 4A,TJ= 25 °C||-|2.42|2.96|V| |||IF= 4A,TJ= 150 °C||-|2.10|-|V| |CJ|Junction capacitance|VR= 10V,1 MHz||-|21|-|pF| |**Dynamic Characteristics**<br>~~———————~~|||||||| |tRR<br>~~———————~~|Reverse recovery time<br>~~———————~~|dI/dt =200 A/s<br>VR=400 V, IF=4 A<br>~~———————~~|TJ=25 °C<br>~~———————~~|-<br>~~———————~~|18.5<br>~~———————~~|-<br>~~———————~~|ns<br>~~———————~~| ||||TJ=125 °C<br>~~———————~~|-<br>~~———————~~|27.5<br>~~———————~~|-<br>~~———————~~|ns<br>~~———————~~| |QRR<br>~~=~~|Reverse recovery charge<br>~~=~~|dI/dt =200A/s<br>VR=400 V, IF=4 A<br>~~=~~|TJ=25 °C<br>~~=~~|-<br>~~=~~|21.1<br>~~=~~|29.0<br>~~=~~|nC<br>~~=~~| ||||TJ=125 °C<br>~~=~~|-<br>~~=~~|50.0<br>~~=~~|-<br>~~=~~|nC<br>~~=~~| |IRRM<br>~~=~~|Maximum reverse<br>recovery current<br>~~=~~|dI/dt =200 A/s<br>VR=400 V, IF=4 A<br>~~=~~|TJ=25 °C<br>~~=~~|-<br>~~=~~|1.75<br>~~=~~|2.3<br>~~=~~|A<br>~~=~~| ||||TJ=125 °C<br>~~=~~|-<br>~~=~~|2.6<br>~~=~~|-<br>~~=~~|A<br>~~=~~| |S<br>~~=~~|Softness factor =<br>a<br>b<br>t<br>t<br>~~=~~|dI/dt =200 A/s<br>VR=400 , IF=4 A<br>~~=~~|TJ=25 °C<br>~~=~~|-<br>~~=~~|0.8<br>~~=~~|-<br>~~=~~|~~=~~| ||||TJ=125 °C<br>~~=~~|-<br>~~=~~|0.8<br>~~=~~|-<br>~~=~~|~~=~~| **==> picture [453 x 138] intentionally omitted <==** **----- Start of picture text -----**<br> VR<br>D1<br>L1 DUT<br>IF tRR 15V<br>dIF/dt Pulse generator + Rg<br>ta tb Q1<br>0<br>0.2xIRRM<br>Ng IRRM af<br>**----- End of picture text -----**<br> **Figure 1. Reverse Recovery Definitions** **Figure 2. Reverse Recovery Test Circuit** 2 www.powerint.com Rev 1.4 11/13 **LXA04T600, LXA04B600** ## **Electrical Specifications at TJ= 25** **C (unless otherwise specified)** **==> picture [455 x 506] intentionally omitted <==** **----- Start of picture text -----**<br> 16 100<br>14 90<br>80<br>12<br>70<br>10 60<br>Tj=125C<br>8 50<br>6 40<br>30<br>4 Tj=25C<br>20<br>2 10<br>0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 20 40 60 80 100 120 140 160 180<br>VF (V) VR (V)<br>Figure 3. Typical IF vs VF Figure 4. Typical Cj vs VR<br>100 40<br>90 dI F /dt=1000A/us dIF/dt=500A/us 35<br>80 30 dIF/dt=200A/us<br>70 dIF/dt=500A/us<br>25<br>60<br>50 dI F /dt=200A/us 20<br>40<br>15<br>30 10 dI F /dt=1000A/us<br>20<br>10 5<br>0 0<br>0 2 4 6 8 10 0 2 4 6 8 10<br>IF (A) IF (A)<br>Baca<br>Figure 5. Typical QRR vs IF at TJ = 125 °C Figure 6. Typical tRR vs IF at TJ = 125 °C<br>18 60<br>16<br>50<br>14<br>12 40<br>10<br>30<br>8<br>6 20<br>4<br>10<br>2<br>0 0<br>25 50 75 100 125 150 25 50 75 100 125 150<br>o o<br>Case Temperature, TC ( C) Case Temperature, TC ( C)<br>(A)IF (pF)Cj<br> (nC) (ns)<br>QRR tRR<br> (A)<br>IF(AV) P (W)<br>**----- End of picture text -----**<br> **Figure 7. DC Current Derating Curve** **Figure 8. Power Derating Curve** ## 3 Rev 1.4 11/13 www.powerint.com **LXA04T600, LXA04B600** **==> picture [258 x 157] intentionally omitted <==** **----- Start of picture text -----**<br> 30 duty cycle=10%<br>duty cycle=30%<br>25 duty cycle= 50%<br>DC<br>20<br>15<br>10<br>5<br>0<br>25 50 75 100 125 150<br>T C(°C)<br>(PEAK) (A)<br>IF<br>**----- End of picture text -----**<br> **Figure 9. IF(PEAK) vs TC, f=70 kHz** ## LXA04T600, LXA04B600 **==> picture [405 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 1<br>D= 0.5<br>D = 0.3<br>D= 0.1<br>0.1<br>D= 0.05<br>D= 0.02<br>D= 0.01<br>0.01<br>D=0.005 =<br>Pom<br>D=0.002 tif<br>Single Pulse ty<br>Notes:<br>1. Duty factor D = ty /t ><br>2. Peak Ty=P py x Zthic + Te<br>0.001<br>1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>t1(sec)<br>Zth(j-c)/Rth(j-c)<br>**----- End of picture text -----**<br> **Figure 10. Normalized Maximum Transient Thermal Impedance** 4 || www.powerint.com Rev 1.4 11/13 Pe **LXA04T600, LXA04B600** ## **Dimensional Outline Drawings** ## **TO-220AC** **==> picture [144 x 275] intentionally omitted <==** **----- Start of picture text -----**<br> Millimeters<br>es<br>Dim MIN MAX<br>ee<br>Dim MIN MAX<br>es<br>A 4.32 4.70<br>es<br>A1 1.14 1.40<br>es<br>A2 2.03 2.79<br>es<br>C 0.34 0.610<br>es<br>D 9.65 10.67<br>es<br>E 2.49 2.59<br>E1 4.98 5.18<br>es<br>F 0.508 1.016<br>es<br>F1 1.14 1.78<br>es<br>H 14.71 16.51<br>H1 5.84 6.55<br>H2 8.51 9.25<br>es H3 3.53 3.96<br>e<br>H4 2.54 3.05<br>es<br>L 12.70 14.22<br>es<br>L1 - 6.35<br>ee<br>**----- End of picture text -----**<br> ## **Mechanical Mounting Method** ## **Maximum Torque / Pressure specification** Screw through hole in package tab 1 Newton Meter (nm) or 8.8 inch-pounds (lb-in) Clamp against package body 12.3 kilogram-force per square centimeter (kgf/cm[2] ) or 175 lbf/in[2] **Soldering time and temperature:** This product has been designed for use with hightemperature, lead-free solder. The component leads can be subjected to a maximum temperature of 300 °C, for up to 10 seconds. See Application Note AN-303, for more details. Rev 1.4 11/13 www.powerint.com 5 ~~|~~ RE POWwEr Se **LXA04T600, LXA04B600** **==> picture [478 x 294] intentionally omitted <==** **----- Start of picture text -----**<br> TO-263AB re Millimeters<br>Dim MIN MAX<br>re<br>A ee 4.40 4.70<br>; re<br>A1 0.00 0.25<br>|; ee<br>A2 2.59 2.79<br>Po Ee es<br>a b 0.77 ee 0.90<br>b2 1.23 1.36<br>c2 1.22 1.32<br>Ordering Information “2 es D ee 9.05 9.25<br>E 10.06 10.26<br>e 2.54 BSC 2.54 BSC<br>H 14.70 15.50<br>é ; es<br>L 2.00 2.60<br>L1 1.17 1.40<br>= Oars GE aa ee 4 r L2 e – e 1.75<br>lh ee<br>RSET tiy;Lee |} J: ee L3 0.25 BSC ee 0.25 BSC<br>L4 2.00 BSC 2.00 BSC<br>li mk r Θ ee 0° 8°<br>LL | es Θ1 ee 5° 9°<br>Θ2 1° 5°<br>**----- End of picture text -----**<br> |**Part Number**|**Package **|**Packing**| |---|---|---| |LXA04T600|TO-220AC|50 units/tube| |LXA04B600|TO-263AB|800 units/reel| **The information contained in this document is subject to change without notice.** 6 www.powerint.com Rev 1.4 11/13 **LXA04T600, LXA04B600** |**Revision**|**Notes**|**Date**| |---|---|---| |1.3|Released by Qspeed|06/10| |1.4|Converted to Power Integrations Document|01/11| |1.4|Stop Point of tRRerror corrected due to typo in Figure 1|11/13| Rev 1.4 11/13 www.powerint.com 7 es **LXA04T600, LXA04B600** ## **For the latest updates, visit our website: www.powerint.com** Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. ## **PATENT INFORMATION** The products and applications illustrated herein (including transformer construction and circuits’ external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations’ patents may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm. The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, LYTSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS, HiperLCS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©Copyright 2013 Power Integrations, Inc. ## **Power Integrations Worldwide Sales Support Locations** ## **WORLD HEADQUARTERS** 5245 Hellyer Avenue San Jose, CA 95138, USA. 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Fl. 20099 Sesto San Giovanni (MI) Italy Phone: +39-024-550-8701 Fax: +39-028-928-6009 _e-mail: eurosales@powerint.com_ ## **SINGAPORE APPLICATIONS HOTLINE** World Wide +1-408-4149660 51 Newton Road, World Wide +1-408-414#19-01/05 Goldhill Plaza 9660 Singapore, 308900 Phone: +65-6358-2160 **APPLICATIONS FAX** Fax: +65-6358-2015 World Wide +1-408-414- _e-mail:_ 9760 _singaporesales@powerint.com_ 8 www.powerint.com
Updated at February 9, 2023
Power Integrations is a leading innovator in semiconductor technologies dedicated to high-voltage power conversion. Renowned for advancing the clean-power ecosystem, the company designs highly integrated chips that maximize energy efficiency across a vast range of consumer and industrial applications. Through proprietary advancements like PowiGaN gallium-nitride technology and EcoSmart energy-efficiency solutions, their components deliver exceptional performance while significantly reducing global energy waste. A major focus of their product lineup includes discrete semiconductors, particularly fast and ultrafast recovery rectifier diodes. These essential components provide the high-speed switching and exceptional reliability required for modern power supply designs. By minimizing power loss and thermal output, they ensure efficient power transmission in demanding, high-efficiency circuit environments. Furthermore, Power Integrations is a premier manufacturer of specialized LED lighting components. Their advanced AC/DC LED driver ICs offer engineers streamlined, energy-efficient solutions for solid-state lighting applications. By integrating critical control and protection features into a single footprint, these drivers reduce the overall component count and accelerate the development of reliable, high-performance commercial and consumer lighting systems.
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