LQH2HPH1R5MGRL

P1/9 

Spec No. JELF243A-9160-01 

**CHIP COIL (CHIP INDUCTOR) for Automotive powertrain/safety equipment LQH2HPH□□□□GR□ Murata Standard Reference Specification [AEC-Q200]** 

## **1. Scope** 

This reference specification applies to Chip Coil (Chip Inductor) LQH2HPH□□□□GR□ series based on AEC-Q200. 

## **1.1 Specific applications:** 

- Automotive powertrain/safety equipment: Products that can be used for automotive equipment related to running, turning, stopping, safety devices, etc., or equipment whose structure, equipment, and performance are legally required to meet technical standards for safety assurance or environmental protection. 

- Automotive infotainment/comfort equipment: Products that can be used for automotive equipment such as car navigation systems and car audio systems that do not directly relate to human life and whose structure, equipment, and performance are not specifically required by law to meet technical standards for safety assurance or environmental protection. 

- Medical equipment (GHTF Class C) *Except for implant/surgery/auto injector: Products that can be used for medical equipment of Class C of the international classification class GHTF and whose malfunction is considered to pose a relatively high risk to the human body. 

- Medical equipment (GHTF Class A and B): Products that can be used for medical equipment regulated by Class A and Class B of the international classification class GHTF and whose functions do not directly relate to the protection of human life and property. 

## **1.2 Unsuitable application:** 

Applications listed in “Limitation of applications” in this product specification. 

## **2. Part Numbering** 

(Ex.) 

|(Ex.)||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|LQ|H||2H||PH||R47||M||GR||L|
|Product ID|Type||Dimension|Dimension|Application and||Inductance||Tolerance||Category||Packaging|
||||(L × W)||characteristic||||||||L: taping|
||||||(H:for automotive||||||||*B: bulk|
||||||electronics)|||||||||



- *B: Bulk packing is also available. 

- (The product sealed on the carrier tape is stored in a plastic bag.) 

## **3. Part Number and Rating** 

Operating temperature range -40°C to +125°C Storage temperature range -40°C to +125°C 

|Customer<br>Part number|Murata<br>Part number|Inductance<br>~~a~~|Inductance<br>~~a~~|DC<br>resistance<br>(Ω)|Self-<br>resonant<br>frequency<br>(MHz min.)|Rated current*1<br>(mA)<br>~~as~~|Rated current*1<br>(mA)<br>~~as~~|Rated current*1<br>(mA)<br>~~as~~|ESD<br>rank|
|---|---|---|---|---|---|---|---|---|---|
|||Nominal<br>value<br>(μH)|Tolerance|||Based on<br>inductanc<br>e change|Based on temperature<br>rise*2|||
||||||||Ambient<br>temperature<br>85°C|Ambient<br>temperature<br>105°C||
|~~a~~<br>~~RR~~|LQH2HPHR47MGRL<br>~~es~~<br>~~DR~~|0.47<br>~~es~~<br>~~ee~~|±20%<br>~~GG~~|0.045±20%<br>~~GG~~<br>~~GG~~|120<br>~~GG~~<br>~~QQ~~|2900<br>~~GG~~<br>~~QQ~~|2520<br>~~CO~~|1470|5A|
|~~a~~<br>~~RR~~<br>~~pe~~|LQH2HPHR68MGRL<br>~~es~~<br>~~DR~~<br>|0.68<br>~~es~~<br>~~ee~~<br>|±20%<br>~~GG~~<br>|0.055±20%<br>~~GG~~<br>~~GG~~<br>|110<br>~~GG~~<br>~~QQ~~<br>|2430<br>~~GG~~<br>~~QQ~~<br>|2330<br>~~CO~~<br>|1350<br>|5A<br>|
|~~RR~~<br>~~pe~~<br>~~Rs~~|LQH2HPH1R0MGRL<br>~~DR~~<br><br>|1.0<br>~~ee~~<br><br>~~ee~~<br>|±20%<br>~~GG~~<br><br>~~GG~~<br>|0.068±20%<br>~~GG ~~<br><br>~~GG~~<br>|100<br> ~~QQ~~<br><br>~~QQ~~<br>|2130<br>~~QQ~~<br><br>~~QQ~~<br>|2100<br>~~CO~~<br><br>~~QQ~~<br>|1200<br><br>~~GO~~<br>|5A<br><br>|
|~~peDe~~<br>~~Rs~~|LQH2HPH1R5MGRL<br>~~De~~<br>|1.5<br>~~De~~<br>~~ee~~<br>|±20%<br>~~De~~<br>~~GG~~<br>|0.087±20%<br>~~De~~<br>~~GG~~<br>|90<br>~~De~~<br>~~QQ~~<br>|1700<br>~~De~~<br>~~QQ~~<br>|1850<br>~~De~~<br>~~QQ~~<br>|1110<br>~~De~~<br>~~GO~~<br>|5A<br>~~De~~<br>|
|~~Rs~~|LQH2HPH2R2MGRL<br>~~GG~~|2.2<br>~~ee~~<br>~~GG~~|±20%<br>~~GG~~<br>~~GG~~|0.134±20%<br>~~GG~~<br>~~GG~~|80<br>~~QQ~~<br>~~GG~~|1550<br>~~QQ~~<br>~~GG~~|1470<br>~~QQ~~<br>~~GG~~|850<br>~~GO~~<br>~~GG~~|5A<br>~~GG~~|
|~~Rs~~<br>~~a~~<br>~~a~~|LQH2HPH3R3MGRL<br><br>~~se~~<br>|3.3<br>~~ee~~<br><br>~~se~~<br>~~es~~<br>|±20%<br>~~GG~~<br><br>~~Qe~~<br>|0.225±20%<br>~~GG ~~<br><br>~~Qe~~<br>~~Qe~~<br>|70<br> ~~QQ~~<br><br>~~Qe~~<br>~~GC~~<br>|1230<br>~~QQ~~<br><br>~~GC~~<br>|1100<br>~~QQ~~<br><br>~~GC~~<br>|660<br>~~GO~~<br><br>~~GC~~<br>|5A<br><br>|
|~~ee~~<br>~~a~~|LQH2HPH4R7MGRL<br>~~ee~~<br>|4.7<br>~~ee~~<br>~~es~~<br>|±20%<br>~~ee~~<br>~~Qe~~<br>|0.300±20%<br>~~ee~~<br>~~Qe~~<br>|50<br>~~ee~~<br>~~GC~~<br>|1090<br>~~ee~~<br>~~GC~~<br>|1000<br>~~ee~~<br>~~GC~~<br>|570<br>~~ee~~<br>~~GC~~<br>|5A<br>~~ee~~<br>|
|~~a~~<br>~~Rs~~|LQH2HPH6R8MGRL<br>~~Be~~<br>|6.8<br>~~es ~~<br>~~Be~~<br>~~ee~~<br>|±20%<br> ~~Qe~~<br>~~QO~~<br>~~GG~~<br>|0.395±20%<br>~~Qe ~~<br>~~QO~~<br>~~GG~~<br>|40<br> ~~GC~~<br>~~QO~~<br>~~QQ~~<br>|830<br>~~GC~~<br>~~QO~~<br>~~QQ~~<br>|860<br>~~GC~~<br>~~QO~~<br>~~QQ~~<br>|490<br>~~GC~~<br>~~QO~~<br>~~GO~~<br>|5A<br>~~QO~~<br>|
|~~De~~<br>~~Rs~~|LQH2HPH100MGRL<br>~~De~~<br>|10<br>~~De~~<br>~~ee~~<br>|±20%<br>~~De~~<br>~~GG~~<br>|0.560±20%<br>~~De~~<br>~~GG~~<br>|30<br>~~De~~<br>~~QQ~~<br>|700<br>~~De~~<br>~~QQ~~<br>|710<br>~~De~~<br>~~QQ~~<br>|430<br>~~De~~<br>~~GO~~<br>|5A<br>~~De~~<br>|
|~~Rs~~|LQH2HPH150MGRL<br>~~GG~~|15<br>~~ee~~<br>~~GG~~|±20%<br>~~GG~~<br>~~GG~~|0.925±20%<br>~~GG~~<br>~~GG~~|20<br>~~QQ~~<br>~~GG~~|570<br>~~QQ~~<br>~~GG~~|560<br>~~QQ~~<br>~~GG~~|310<br>~~GO~~<br>~~GG~~|5A<br>~~GG~~|
|~~Rs~~<br>~~a~~|LQH2HPH220MGRL<br><br>~~Ds~~|22<br>~~ee~~<br><br>~~Ds~~|±20%<br>~~GG~~<br><br>~~QQ~~|1.360±20%<br>~~GG ~~<br><br>~~QQ~~|15<br> ~~QQ~~<br><br>~~QQ~~|460<br>~~QQ~~<br><br>~~QQ~~|430<br>~~QQ~~<br><br>~~QQ~~|250<br>~~GO~~<br><br>~~QQ~~|5A<br><br>~~QQ~~|



株式会社 村田製作所 

P2/9 

Spec No. JELF243A-9160-01 

|||Inductance|Inductance||||Rated current*1<br>(mA)||
|---|---|---|---|---|---|---|---|---|
|Customer<br>Part number|Murata<br>Part number|Nominal<br>value<br>(μH)|Tolerance|DC<br>resistance<br>(Ω)|Self-<br>resonant<br>frequency<br>(MHz min.)|Based on<br>inductanc<br>e change|Based on temperature<br>rise*2<br>Ambient<br>temperature<br>Ambient<br>temperature|ESD<br>rank|
||||||||85°C<br>105°C||



*1 Keep the temperature (ambient temperature plus self-generation of heat) under 125°C. 

*2 As shown in the diagram below, derating is applied to the rated current based on the operating temperature 

ESD Rank Maximum Withstand Voltage 5A 8000 V (DC) to < 12,000 V (AD) 

## **4. Testing Conditions** 

|**4. Testing Conditionsg Conditions Conditions**||
|---|---|
|Unless otherwise specified|Temperature: ordinary temperature (15°C to 35°C)<br>Humidity: ordinaryhumidity [25% to 85%(RH)]|
|In case of doubt|Temperature: 20°C±2°C<br>Humidity: 60% to 70% (RH)<br>Atmosphericpressure: 86 kPa to 106 kPa|



## **5. Appearance and Dimensions** 

**==> picture [136 x 134] intentionally omitted <==**

**----- Start of picture text -----**<br>
■ Equivalent Circuit<br>no polarity<br>Unit mass (typical value): 0.019 g<br>**----- End of picture text -----**<br>


## **6. Marking** 

No marking. 

株式会社 村田製作所 

P3/9 

~~a~~ Spec No. JELF243A-9160-01 

## **7. Electrical Performance** 

|No.|Item|Specification|Test method|
|---|---|---|---|
|7.1 Inductance|7.1 Inductance|Meet chapter 3 ratings.|Measuring equipment: Keysight 4192 or the<br>equivalent<br>Measuring frequency: 1 M Hz|
|7.2 DC resistance|7.2 DC resistance|Meet chapter 3 ratings.|Measuringequipment: digital multimeter|
|7.3 Self-resonant|7.3 Self-resonant<br>frequency|Meet chapter 3 ratings.|Measuring equipment: Keysight E4991A or the<br>equivalent|
|7.4 Rated current|7.4 Rated current<br>(Based on<br>inductance<br>change)|When rated current is applied to the<br>products, inductance will be within<br>±30% of initial inductance value range.|Apply the rated current specified in chapter 3 at<br>ordinary temperature.|
|7.5 Rated current|7.5 Rated current<br>(Based on<br>temperature rise)|Temperature rise caused by self-<br>generated heat shall be limited to 40°C<br>max.(ambient temperature under<br>85°C)<br>Temperature rise caused by self-<br>generated heat shall be limited to 20°C<br>max.(ambient temperature under 85°C<br>to 105°C)|Apply the rated current specified in chapter 3.|



## **8. Q200 Requirement** 

|**Performance(based on Table 5 for Magnetics Inductors/Transformer)**<br>**AEC-Q200 Rev.D issued June 1. 2010**<br>~~oo~~|**Performance(based on Table 5 for Magnetics Inductors/Transformer)**<br>**AEC-Q200 Rev.D issued June 1. 2010**<br>~~oo~~|**Performance(based on Table 5 for Magnetics Inductors/Transformer)**<br>**AEC-Q200 Rev.D issued June 1. 2010**<br>~~oo~~|**Performance(based on Table 5 for Magnetics Inductors/Transformer)**|
|---|---|---|---|
|AEC-Q200<br>~~oo~~|||Murata Specification / Deviation|
|No.<br>~~oo~~|No.<br>Stress<br>~~oo~~|Test Method<br>~~oo~~||
|3 High temperature<br>~~oo~~<br>~~{+>~~|3 High temperature<br>exposure<br>~~oo~~<br>~~{+>~~|1000 h at 125°C<br>Set for 24 h at room condition, then<br>measured.<br>~~oo~~<br>~~{+>>~~|Appearance: No damage<br>Inductance change rate: within ±10%<br>~~>~~|
|4 Temperature cycling<br>~~{+>~~|4 Temperature cycling<br>~~{+>~~|1000 cycles<br>-40°C to +125°C<br>Set for 24 h at room condition, then<br>measured.<br>~~{+>>~~|Appearance: No damage<br>Inductance change rate: within ±10%<br>~~>~~|
|7 Biased humidity<br>~~{+>~~|7 Biased humidity<br>~~{+>~~|1000 h at 85°C, 85% (RH).<br>Unpowered.<br>Set for 24 h at room condition, then<br>measured.<br>~~{+> >~~|Appearance: No damage<br>Inductance change rate: within ±10%<br>~~>~~|
|8 Operational life<br>~~ee~~|8 Operational life<br>~~ee~~|Apply 85°C 1000 h<br>Set for 24 h at room condition, then<br>measured.<br>~~ee~~|Applying current: Rated current at test<br>temperature<br>Appearance: No damage<br>Inductance change rate: within ±10%<br>~~ee~~|
|9 External visual<br>~~ee~~|9 External visual<br>~~ee~~|Visual inspection<br>~~ee~~|No abnormalities<br>~~ee~~|
|10 Physical dimension<br>~~ee~~<br>~~a~~<br>~~>}~~|10 Physical dimension<br>~~ee~~<br>~~a~~<br>~~>}~~|Meet chapter 5, "Appearance and<br>Dimensions".<br>~~ee~~<br>~~a~~<br>~~>}~~|No defects<br>~~ee~~<br>~~a~~<br>~~>}~~|
|12 Resistance to<br>~~>}~~|12 Resistance to<br>solvents<br>~~>}~~|Per MIL-STD-202<br>Method 215<br>~~>}~~|Not applicable<br>~~>}~~|
|13 Mechanical shock<br>~~>}~~|13 Mechanical shock<br>~~>}~~|Per MIL-STD-202<br>Method 213<br>Condition C:<br>100 g's/6 ms/half sine<br>~~>}~~|Appearance: No damage<br>Inductance change rate: within ±10%<br>~~>}~~|
|14 Vibration<br>~~>}~~<br>~~a~~|14 Vibration<br>~~>}~~<br>~~a~~|5 g's for 20 min, 12 cycles each of 3<br>orientations<br>Test from 10 Hz to 2000 Hz<br>~~>}~~<br>~~a~~|Appearance: No damage<br>Inductance change rate: within ±10%<br>~~>}~~<br>~~a~~|
|15 Resistance<br>~~a~~|15 Resistance<br>to Soldering Heat<br>~~a~~|Per MIL-STD-202<br>Method 210<br>~~a~~|Appearance: No damage<br>Inductance change rate: within ±10%<br>Deviation for AEC-Q200<br>Pre-heating: 80-100°C<br>Pre-heatingtime: 60±30sec.<br>~~a~~|
|17 ESD|17 ESD|Per AEC-Q200-002|ESD Rank: Refer to chapter 3, "Part Number<br>and Rating".<br>Appearance: No damage<br>Inductance change rate: within ±10%|



株式会社 村田製作所 

P4/9 

Spec No. JELF243A-9160-01 

|Spec No. JELF243A-9160-01-9160-019160-01-0101|Spec No. JELF243A-9160-01-9160-019160-01-0101|Spec No. JELF243A-9160-01-9160-019160-01-0101|P4/9|
|---|---|---|---|
|AEC-Q200<br>~~es~~|||Murata Specification / Deviation<br>~~es~~|
|No.<br>~~es~~|No.<br>Stress<br>~~es~~|Test Method<br>~~es~~||
|18 Solderability|18 Solderability|Per J-STD-002|95% or more of the outer electrode shall be<br>covered<br>with new solder seamlessly.<br>Deviation for AEC-Q200<br>Method b: Not applicable<br>Pre-heating: 150°C/60s|
|19 Electrical|19 Electrical<br>Characterization|Measured: inductance|No defects|
|20 Flammability|20 Flammability|Per UL-94|Not applicable|
|21 Board Flex|21 Board Flex|Epoxy-PCB (1.6 mm)<br>Deflection 2 mm (min.)<br>60 s minimum holding time|Appearance:No damage<br>Inductance change rate: within ±10%<br>Deviation for AEC-Q200<br>Holdingtime: 5 s|
|22 Terminal Strength|22 Terminal Strength|Per AEC-Q200-006<br>A force of 17.7 N for 60 s|Appearance: No damage|



## **9. Specification of Packaging** 

## **9.1 Appearance and dimensions of tape (8 mm width/plastic tape)** 

|A|2.3±0.1|
|---|---|
|B|2.8±0.1|
|t|1.1±0.1|
|t'|(0.25)|



* The dimensions of the cavity are measured at its bottom. 

## **9.2 Taping specifications** 

|Packing quantity<br>(Standardquantity)|3000 pcs/reel|
|---|---|
|Packing method|The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and<br>bottom tape when the cavities of the carrier tape arepunched type).|
|Feed hole position|The feed holes on the carrier tape are on the right side when the cover tape (top tape when the<br>cavities of the carrier tape arepunched type)ispulled toward the user.|
|Joint|The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched<br>type)are seamless.|
|Number of missing<br>products|Number of missing products within 0.025% of the number per reel or 1 pc., whichever is<br>greater, and are not continuous. The specifiedquantity per reel is kept.|



## **9.3 Break down force of tape** 

|**9.3 Break down force of tapepee **||
|---|---|
|Cover tape(or toptape)|5 N min.|
|Bottom tape(onlywhen the cavities of the carrier tape arepunched type)|5 N min.|



## **9.4 Peeling off force of tape** 

|**9.4 Peeling off force of tapeg off force of tape off force of tape**|**9.4 Peeling off force of tapeg off force of tape off force of tapepee **|
|---|---|
|Speed ofpeelingoff|300 mm/min|
|Peelingoff force|0.1 N to 0.7 N(The lower limit is for typical value.)|



株式会社 村田製作所 

P5/9 

Spec No. JELF243A-9160-01 

## **9.5 Dimensions of leader section, trailer section and reel** 

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.) . _ trailer — - 

## **9.6 Marking for reel** 

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc. 

*1 Expression of inspection No.: (1) Factory code □□ ○○○○  (2) Date (1) (2) (3) First digit: year/last digit of year Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No. *2 Expression of RoHS marking: (1) RoHS regulation conformity ROHSY () (2) Murata classification number (1) (2) 

## **9.7 Marking on outer box (corrugated box)** 

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc. 

## **9.8 Specification of outer box** 

|||||||||Dimensions of outer box|Dimensions of outer box|Dimensions of outer box|Dimensions of outer box||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||Label||(mm)<br>W<br>D|||H|Standard reel quantity<br>in outer box (reel)|
|H||||||||186<br>186|||93|5|
||||||D||* Above outer box size is typical. It depends on a|* Above outer box size is typical. It depends on a||* Above outer box size is typical. It depends on a|||
|||W||||||quantityof an order.|||of an order.||



## **10.** A **Caution** 

## **10.1 Limitation of applications** 

The products listed in the product specification (hereinafter the product(s) is called as the “Product(s)”) are designed and manufactured for applications specified in the product specification (hereinafter called as the “Specific Application”). We shall not warrant anything in connection with the Products including fitness, performance, adequateness, safety, or quality, in the case of applications listed in from (1) to (11) written at the end of this precautions, which may generally require high performance, function, quality, management of production or safety. Therefore, the Product shall be applied in compliance with the specific application. 

WE DISCLAIM ANY LOSS AND DAMAGES ARISING FROM OR IN CONNECTION WITH THE PRODUCTS INCLUDING BUT NOT LIMITED TO THE CASE SUCH LOSS AND DAMAGES CAUSED BY THE UNEXPECTED ACCIDENT, IN EVENT THAT (i) THE PRODUCT IS APPLIED FOR THE PURPOSE WHICH IS NOT SPECIFIED AS 

株式会社 村田製作所 

P6/9 

Spec No. JELF243A-9160-01 

THE SPECIFIC APPLICATION FOR THE PRODUCT, AND/OR (ii) THE PRODUCT IS APPLIED FOR ANY FOLLOWING APPLICATION PURPOSES FROM (1) TO (11) (EXCEPT THAT SUCH APPLICATION PURPOSE IS UNAMBIGUOUSLY SPECIFIED AS SPECIFIC APPLICATION FOR THE PRODUCT IN OUR CATALOG 

SPECIFICATION FORMS, DATASHEETS, OR OTHER DOCUMENTS OFFICIALLY ISSUED BY US*). 

- (1) Aircraft equipment 

- (2) Aerospace equipment 

- (3) Undersea equipment 

- (4) Power plant control equipment 

- (5) Medical equipment 

- (6) Transportation equipment 

- (7) Traffic control equipment 

- (8) Disaster prevention/security equipment 

- (9) Industrial data-processing equipment 

- (10) Combustion/explosion control equipment 

- (11) Equipment with complexity and/or required reliability equivalent to the applications listed in the above. 

For exploring information of the Products which will be compatible with the particular purpose other than those specified in the product specification, please contact our sales offices, distribution agents, or trading companies with which you make a deal, or via our web contact form. 

Contact form: https://www.murata.com/contactform 

- We may design and manufacture particular Products for applications listed in (1) to (11). Provided that, in such case we shall unambiguously specify such Specific Application in the product specification without any exception. Therefore, any other documents and/or performances, whether exist or non-exist, shall not be deemed as the evidence to imply that we accept the applications listed in (1) to (11). 

## **10.2 Precautions on rating** 

Avoid using in exceeded the rated temperature range, rated voltage, or rated current. Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault. 

## **10.3 Inrush current** 

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product, overheating could occur, resulting in wire breakage, burning, or other serious fault. 

## **10.4 Fail-safe** 

Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 

## **10.5 Corrosive gas** 

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 

## **11. Precautions for Use** 

This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand. 

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack. The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed. 

## **11.1 Land dimensions** 

The following diagram shows the recommended land dimensions for reflow soldering. 

**==> picture [137 x 69] intentionally omitted <==**

**----- Start of picture text -----**<br>
a  1.25<br>b  2.9<br>c  2.0<br>—<br>(in mm)<br>**----- End of picture text -----**<br>


株式会社 村田製作所 

P7/9 

~~ee~~ Spec No. JELF243A-9160-01 

~~ee~~ 

## **11.2 Flux and solder used** 

|Flux|• Use a rosin-based flux.<br>• Do not use a highly acidic flux with a halide content exceeding mass% (chlorine conversion value).<br>• Do not use a water-soluble flux.|
|---|---|
|Solder|• Use Sn-3.0Ag-0.5Cu solder.<br>• Standard thickness of solderpaste: 100μm to 150μm|



If you want to use a flux other than the above, please consult our technical department. 

## **11.3 Soldering conditions (reflow)** 

- Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 100°C max. 

- Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. 

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. 

- Standard soldering profile and the limit soldering profile is as follows. 

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. 

**==> picture [342 x 237] intentionally omitted <==**

**----- Start of picture text -----**<br>
Temp. 260℃<br>( ℃)<br>245℃±3℃<br>230℃<br>220℃<br>Limit Profile<br>180<br>150<br>30s～60s Standard Profile<br>60s max.<br>Y=<br>90s±30s Time. ( s)<br>|<br>Standard profile  Limit profile<br>Pre-heating 150°C to 180°C/90 s±30 s  150°C to 180°C/90 s±30 s<br>Heating Above 220°C/30 s to 60 s  Above 230°C/60 s max.<br>Peak temperature   245°C±3°C  260°C/10 s<br>Number of reflow cycles  2 times  2 times<br>**----- End of picture text -----**<br>


## **11.4 Reworking with soldering iron** 

The following requirements must be met to rework a soldered product using a soldering iron. 

|Item|Requirement|
|---|---|
|Pre-heating|150°C/approx. 1 min|
|Tiptemperature of solderingiron|350°C max.|
|Power consumption of solderingiron|80 W max.|
|Tipdiameter of solderingiron|ø3 mm max.|
|Solderingtime|3 s(+1 s, -0 s)|
|Number of reworkingoperations|1 times max.|
|* Avoid a direct contact of the tip of the soldering iron with the product. Such a<br>direction contact may cause cracks in the ceramic body due to thermal<br>shock.||



## **11.5 Solder volume** 

Solder shall be used not to increase the volume too much. 

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of mechanical or electrical performance. 

## **11.6 Product's location** 

The following shall be considered when designing and laying out PCBs. 

- (1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board. [Products direction] 

Products shall be located in the sideways direction (length: a < b) to the mechanical stress. 

株式会社 村田製作所 

Spec No. JELF243A-9160-01 ~~ee~~ 

P8/9 

## Reference Only 

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**----- Start of picture text -----**<br>
a<br>pS! : b 4)<br>〈 Poor example 〉 〈 Good example 〉<br>**----- End of picture text -----**<br>


- (2) Components location on PCB separation 

It is effective to implement the following measures, to reduce stress in separating the board. 

It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. 

|Contents of measures|Stress level|
|---|---|
|(1) Turn the mounting direction of the component parallel to the<br>board separation surface.|(1) Turn the mounting direction of the component parallel to the<br>A > D*1|
|(2)Add slits in the board separationpart.|A > B|
|(3) Keep the mounting position of the component away from the<br>board separation surface.|(3) Keep the mounting position of the component away from the<br>A > C|
|*1 A > D is valid when stress is added vertically to the perforation as with hand separation.<br>If a cuttingdisc is used, stress will be diagonal to the PCB, therefore A > D is invalid.||



   - *1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. 

- (3) Mounting components near screw holes 

- When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. 

Mount the component in a position as far away from the screw holes as possible. 

## **11.7 Handling of substrate** 

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. 

Excessive mechanical stress may cause cracking in the product. 

Bending Twisting 

## **11.8 Cleaning** 

Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade this product. 

## **11.9 Storage and transportation** 

|Storage period|Use the product within 12 months after delivery.<br>Ifyou do not use theproduct for more than 12 months, check solderabilitybefore usingit.|
|---|---|



株式会社 村田製作所 

P9/9 

Spec No. JELF243A-9160-01 

|Spec No. JELF243A-9160-01-9160-019160-01-0101|Spec No. JELF243A-9160-01-9160-019160-01-0101<br>P9/9<br>Reference Only|
|---|---|
|Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.|Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.<br>The recommended temperature range is -10°C to +40°C. The recommended relative humidity<br>range is 15% to 85%.<br>Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor<br>solderability.<br>• Do not place the products directly on the floor; they should be placed on a palette so that they<br>are not affected by humidity or dust.<br>• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.<br>• Do not keep products in bulk packaging. Bulk storage could result in collisions between the<br>products or between the products and other parts, resulting in chipping or wire breakage.<br>• Avoid storingtheproduct byitself bare(i.e. exposed directlyto air).|
|Transportation|Excessive vibration and impact reduces the reliability of the products. Exercise caution when<br>handlingtheproducts.|



## **11.10 Resin coating (including moisture-proof coating)** 

When the product is coated/molded with resin, its electrical characteristics may change. 

A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. 

Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading to wire breakage. 

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 

## **11.11 Mounting conditions** 

Check the mounting condition before using. 

Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors, misalignment, or damage to the product. 

## **11.12 Operating environment** 

Do not use this product under the following environmental conditions as it may cause deterioration of product quality. (1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc) 

(2) In the atmosphere where liquid such as organic solvent, may splash on the products. 

(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew. 

## **11.13 Mounting density** 

If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures. If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality, resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating temperature for the product. 

## **11.14 Handling of product** 

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched to the winding portion and electrode to prevent the breaking of wire. 

･Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 

## **12.** A **Note** 

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 

(2) You are requested not to use our product deviating from the reference specifications. 

(3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. 

株式会社 村田製作所