LFCPNX-50-8BFG484C
FPGA, SRAM, 263 I/O's, 50 Logic Cells, 28nm, Surface Mount, BGA-484, CertusPro-NX Series
- Manufacturer: LATTICE SEMICONDUCTOR
- Product type: FPGAs
- SVHC: No SVHC (25-Jun-2025)
- FPGA Type: SRAM based FPGA
- IC Mounting: Surface Mount
- No. of Pins: 484Pins
- Speed Grade: 8
- Product Range: CertusPro-NX Series
- Qualification: -
- No.of User I/Os: 263I/O's
- IC Case / Package: BGA
- No. of Logic Cells: 50Logic Cells
- Process Technology: 28nm
- Operating Temperature Max: 85°C
- Operating Temperature Min: 0°C
| Delivery and price | |
|---|---|
| Units per pack | 25 |
| Price | 73.18 € |
| Current stock | 100+ |
| Lead time | 30 days |
## Os
## **CertusPro-NX Family**
## **Data Sheet**
FPGA-DS-02086-2.0
August 2024
**CertusPro-NX Family Data Sheet**
## **Disclaimers**
Lattice makes no warranty, representation, or guarantee regarding the accuracy of information contained in this document or the suitability of its products for any particular purpose. All information herein is provided AS IS, with all faults, and all associated risk is the responsibility entirely of the Buyer. The information provided herein is for informational purposes only and may contain technical inaccuracies or omissions, and may be otherwise rendered inaccurate for many reasons, and Lattice assumes no obligation to update or otherwise correct or revise this information. Products sold by Lattice have been subject to limited testing and it is the Buyer's responsibility to independently determine the suitability of any products and to test and verify the same. LATTICE PRODUCTS AND SERVICES ARE NOT DESIGNED, MANUFACTURED, OR TESTED FOR USE IN LIFE OR SAFETY CRITICAL SYSTEMS, HAZARDOUS ENVIRONMENTS, OR ANY OTHER ENVIRONMENTS REQUIRING FAIL-SAFE PERFORMANCE, INCLUDING ANY APPLICATION IN WHICH THE FAILURE OF THE PRODUCT OR SERVICE COULD LEAD TO DEATH, PERSONAL INJURY, SEVERE PROPERTY DAMAGE OR ENVIRONMENTAL HARM (COLLECTIVELY, "HIGH-RISK USES"). FURTHER, BUYER MUST TAKE PRUDENT STEPS TO PROTECT AGAINST PRODUCT AND SERVICE FAILURES, INCLUDING PROVIDING APPROPRIATE REDUNDANCIES, FAIL-SAFE FEATURES, AND/OR SHUT-DOWN MECHANISMS. LATTICE EXPRESSLY DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY OF FITNESS OF THE PRODUCTS OR SERVICES FOR HIGH-RISK USES. The information provided in this document is proprietary to Lattice Semiconductor, and Lattice reserves the right to make any changes to the information in this document or to any products at any time without notice.
## **Inclusive Language**
This document was created consistent with Lattice Semiconductor’s inclusive language policy. In some cases, the language in underlying tools and other items may not yet have been updated. Please refer to Lattice’s inclusive language FAQ 6878 for a cross reference of terms. Note in some cases such as register names and state names it has been necessary to continue to utilize older terminology for compatibility.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
2
**CertusPro-NX Family Data Sheet**
## **Contents**
|**Contents**|**Contents**|**Contents**|
|---|---|---|
|Contents ............................................................................................................................................................................... 3|||
|Acronyms in This Document ............................................................................................................................................... 12|||
|1.|Description.................................................................................................................................................................. 14||
||1.1.|Features ............................................................................................................................................................ 15|
|2.|Architecture ................................................................................................................................................................ 18||
||2.1.|Overview ........................................................................................................................................................... 18|
||2.2.|PFU Blocks ......................................................................................................................................................... 21|
||2.2.1.|Slice ............................................................................................................................................................... 21|
||2.2.2.|Modes of Operation ...................................................................................................................................... 24|
||2.3.|Routing .............................................................................................................................................................. 25|
||2.4.|Clocking Structure ............................................................................................................................................. 25|
||2.4.1.|Global PLL ..................................................................................................................................................... 25|
||2.4.2.|Clock Distribution Network ........................................................................................................................... 26|
||2.4.3.|Primary Clocks .............................................................................................................................................. 27|
||2.4.4.|Edge Clock ..................................................................................................................................................... 28|
||2.4.5.|Clock Dividers ................................................................................................................................................ 28|
||2.4.6.|Clock Center Multiplexer Blocks ................................................................................................................... 29|
||2.4.7.|Dynamic Clock Select .................................................................................................................................... 29|
||2.4.8.|Dynamic Clock Control .................................................................................................................................. 30|
||2.4.9.|DDRDLL ......................................................................................................................................................... 30|
||2.5.|SGMII TX/RX ...................................................................................................................................................... 32|
||2.6.|sysMEM Memory .............................................................................................................................................. 33|
||2.6.1.|sysMEM Memory Block ................................................................................................................................ 33|
||2.6.2.|Bus Size Matching ......................................................................................................................................... 33|
||2.6.3.|RAM Initialization and ROM Operation ........................................................................................................ 34|
||2.6.4.|Memory Cascading ....................................................................................................................................... 34|
||2.6.5.|Single, Dual, and Pseudo-Dual Port Modes .................................................................................................. 34|
||2.6.6.|Memory Output Reset .................................................................................................................................. 34|
||2.7.|Large RAM ......................................................................................................................................................... 34|
||2.8.|sysDSP ............................................................................................................................................................... 35|
||2.8.1.|sysDSP Approach Compared to General DSP................................................................................................ 35|
||2.8.2.|sysDSP Architecture Features ....................................................................................................................... 35|
||2.9.|Programmable I/O (PIO).................................................................................................................................... 38|
||2.10.|Programmable I/O Cell (PIC) ............................................................................................................................. 38|
||2.10.1.<br>Input Register Block .................................................................................................................................. 39||
||2.10.2.<br>Output Register Block ............................................................................................................................... 40||
||2.11.|Tri-state Register Block ..................................................................................................................................... 42|
||2.12.|DDR Memory Support ....................................................................................................................................... 43|
||2.12.1.<br>DQS Grouping for DDR Memory ............................................................................................................... 43||
||2.12.2.<br>DLL Calibrated DQS Delay and Control Block (DQSBUF)........................................................................... 44||
||2.13.|sysI/O Buffer ..................................................................................................................................................... 46|
||2.13.1.<br>Supported sysI/O Standards ..................................................................................................................... 46||
||2.13.2.<br>sysI/O Banking Scheme ............................................................................................................................ 47||
||2.13.3.<br>sysI/O Buffer Configurations .................................................................................................................... 49||
||2.13.4.<br>MIPI D-PHY Support.................................................................................................................................. 49||
||2.14.|Analog Interface ADC ........................................................................................................................................ 49|
||2.14.1.<br>Analog to Digital Converters..................................................................................................................... 49||
||2.14.2.<br>Continuous Time Comparators................................................................................................................. 50||
||2.14.3.<br>Internal Junction Temperature Monitoring Diode ................................................................................... 50||
||2.15.|IEEE 1149.1-Compliant Boundary Scan Testability ........................................................................................... 50|
||2.16.|Device Configuration ......................................................................................................................................... 50|
||2.16.1.<br>Enhanced Configuration Options ............................................................................................................. 51||
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
3
**CertusPro-NX Family Data Sheet**
||2.17.|Single Event Upset (SEU) Handling .................................................................................................................... 51|
|---|---|---|
||2.18.|On-chip Oscillator .............................................................................................................................................. 52|
||2.19.|User I²C IP .......................................................................................................................................................... 52|
||2.20.|Pin Migration ..................................................................................................................................................... 52|
||2.21.|SESDES and Physical Coding Sublayer ............................................................................................................... 53|
||2.21.1.<br>SERDES Block ............................................................................................................................................ 55||
||2.21.2.<br>MPCS......................................................................................................................................................... 55||
||2.21.3.<br>Peripheral Component Interconnect Express (PCIe) ................................................................................ 57||
||2.21.4.<br>LMMI (Lattice Memory Map Interface) Bus ............................................................................................. 59||
||2.22.|Cryptographic Engine ........................................................................................................................................ 59|
||2.23.|TraceID .............................................................................................................................................................. 59|
|3.|DC and Switching Characteristics for Commercial and Industrial ............................................................................... 60|DC and Switching Characteristics for Commercial and Industrial ............................................................................... 60|
||3.1.|Absolute Maximum Ratings .............................................................................................................................. 60|
||3.2.|Recommended Operating Conditions ............................................................................................................... 60|
||3.3.|Power Supply Ramp Rates ................................................................................................................................. 61|
||3.4.|Power up Sequence ........................................................................................................................................... 61|
||3.5.|On-chip Programmable Termination ................................................................................................................ 62|
||3.6.|Hot Socketing Specifications ............................................................................................................................. 63|
||3.7.|ESD Performance ............................................................................................................................................... 63|
||3.8.|DC Electrical Characteristics .............................................................................................................................. 63|
||3.9.|Supply Currents ................................................................................................................................................. 65|
||3.10.|sysI/O Recommended Operating Conditions .................................................................................................... 65|
||3.11.|sysI/O Single-Ended DC Electrical Characteristics ............................................................................................. 67|
||3.12.|sysI/O Differential DC Electrical Characteristics ................................................................................................ 69|
||3.12.1.<br>LVDS .......................................................................................................................................................... 69||
||3.12.2.<br>LVDS25E (Output Only) ............................................................................................................................. 69||
||3.12.3.<br>SubLVDS (Input Only)................................................................................................................................ 70||
||3.12.4.<br>SubLVDSE/SubLVDSEH (Output Only) ...................................................................................................... 70||
||3.12.5.<br>SLVS .......................................................................................................................................................... 71||
||3.12.6.<br>Soft MIPI D-PHY ........................................................................................................................................ 72||
||3.12.7.<br>Differential HSTL15D (As Output) ............................................................................................................. 75||
||3.12.8.<br>Differential SSTL135D, SSTL15D (As Output) ............................................................................................ 75||
||3.12.9.<br>Differential HSUL12D (As Output) ............................................................................................................ 75||
||3.12.10.<br>Differential LVSTLD (As Output) ............................................................................................................... 75||
||3.12.11.<br>Differential LVCMOS25D, LVCMOS33D, LVTTL33D (As Output) ............................................................... 75||
||3.13.|Maximum sysI/O Buffer Speed.......................................................................................................................... 76|
||3.14.|Typical Building Block Function Performance ................................................................................................... 78|
||3.15.|Derating Timing Tables ...................................................................................................................................... 79|
||3.16.|External Switching Characteristics .................................................................................................................... 79|
||3.17.|sysCLOCK PLL Timing (VCC= 1.0 V) ..................................................................................................................... 88|
||3.18.|Internal Oscillators Characteristics .................................................................................................................... 89|
||3.19.|User I2C Characteristics ..................................................................................................................................... 89|
||3.20.|Analog-Digital Converter (ADC) Block Characteristics ....................................................................................... 89|
||3.21.|Comparator Block Characteristics ..................................................................................................................... 90|
||3.22.|Digital Temperature Readout Characteristics ................................................................................................... 91|
||3.23.|SERDES High-Speed Data Transmitter ............................................................................................................... 91|
||3.24.|SERDES High-Speed Data Receiver .................................................................................................................... 93|
||3.25.|Input Data Jitter Tolerance ................................................................................................................................ 93|
||3.26.|SERDES External Reference Clock ...................................................................................................................... 95|
||3.27.|PCI Express Electrical and Timing Characteristics.............................................................................................. 96|
||3.27.1.<br>PCIe (2.5 Gbps) ......................................................................................................................................... 96||
||3.27.2.<br>PCIe (5 Gbps) ............................................................................................................................................ 97||
||3.27.3.<br>PCIe (8 Gbps) ............................................................................................................................................ 99||
||3.28.|SGMII Characteristics ...................................................................................................................................... 100|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
4
**CertusPro-NX Family Data Sheet**
||3.28.1.<br>SGMII Specifications ............................................................................................................................... 100|3.28.1.<br>SGMII Specifications ............................................................................................................................... 100|
|---|---|---|
||3.29.|sysCONFIG Port Timing Specifications ............................................................................................................ 101|
||3.30.|JTAG Port Timing Specifications ...................................................................................................................... 108|
||3.31.|Switching Test Conditions ............................................................................................................................... 109|
|4.|DC and Switching Characteristics for Automotive .................................................................................................... 110|DC and Switching Characteristics for Automotive .................................................................................................... 110|
||4.1.|Absolute Maximum Ratings ............................................................................................................................ 110|
||4.2.|Recommended Operating Conditions ............................................................................................................. 110|
||4.3.|Power Supply Ramp Rates .............................................................................................................................. 111|
||4.4.|Power up Sequence ........................................................................................................................................ 112|
||4.5.|On-chip Programmable Termination .............................................................................................................. 112|
||4.6.|Hot Socketing Specifications ........................................................................................................................... 113|
||4.7.|ESD Performance ............................................................................................................................................ 113|
||4.8.|DC Electrical Characteristics ............................................................................................................................ 113|
||4.9.|Supply Currents ............................................................................................................................................... 115|
||4.10.|sysI/O Recommended Operating Conditions .................................................................................................. 115|
||4.11.|sysI/O Single-Ended DC Electrical Characteristics ........................................................................................... 117|
||4.12.|sysI/O Differential DC Electrical Characteristics .............................................................................................. 119|
||4.12.1.<br>LVDS ........................................................................................................................................................ 119||
||4.12.2.<br>LVDS25E (Output Only) .......................................................................................................................... 119||
||4.12.3.<br>SubLVDS (Input Only) ............................................................................................................................. 120||
||4.12.4.<br>SubLVDSE/SubLVDSEH (Output Only) .................................................................................................... 120||
||4.12.5.<br>SLVS ........................................................................................................................................................ 121||
||4.12.6.<br>Soft MIPI D-PHY ...................................................................................................................................... 122||
||4.12.7.<br>Differential HSTL15D (As Output) ........................................................................................................... 125||
||4.12.8.<br>Differential SSTL135D, SSTL15D (As Output) .......................................................................................... 125||
||4.12.9.<br>Differential HSUL12D (As Output) .......................................................................................................... 125||
||4.12.10.<br>Differential LVSTLD (As Output) ............................................................................................................. 125||
||4.12.11.<br>Differential LVCMOS25D, LVCMOS33D, LVTTL33D (As Output) ............................................................. 125||
||4.13.|Maximum sysI/O Buffer Speed ....................................................................................................................... 125|
||4.14.|Typical Building Block Function Performance ................................................................................................. 128|
||4.15.|Derating Timing Tables .................................................................................................................................... 129|
||4.16.|External Switching Characteristics .................................................................................................................. 129|
||4.17.|sysCLOCK PLL Timing (VCC= 1.0 V) ................................................................................................................... 138|
||4.18.|Internal Oscillators Characteristics.................................................................................................................. 139|
||4.19.|User I2C Characteristics ................................................................................................................................... 139|
||4.20.|Analog-Digital Converter (ADC) Block Characteristics..................................................................................... 139|
||4.21.|Comparator Block Characteristics ................................................................................................................... 140|
||4.22.|Digital Temperature Readout Characteristics ................................................................................................. 140|
||4.23.|SERDES High-Speed Data Transmitter ............................................................................................................. 141|
||4.24.|SERDES High-Speed Data Receiver .................................................................................................................. 142|
||4.25.|Input Data Jitter Tolerance.............................................................................................................................. 143|
||4.26.|SERDES External Reference Clock ................................................................................................................... 144|
||4.27.|PCI Express Electrical and Timing Characteristics ........................................................................................... 145|
||4.27.1.<br>PCIe (2.5 Gbps) ....................................................................................................................................... 145||
||4.27.2.<br>PCIe (5 Gbps) .......................................................................................................................................... 147||
||4.28.|SGMII Characteristics ...................................................................................................................................... 148|
||4.28.1.<br>SGMII Specifications ............................................................................................................................... 148||
||4.29.|sysCONFIG Port Timing Specifications ............................................................................................................ 149|
||4.30.|JTAG Port Timing Specifications ...................................................................................................................... 156|
||4.31.|Switching Test Conditions ............................................................................................................................... 157|
|5.|Pinout Information ................................................................................................................................................... 158||
||5.1.|Signal Descriptions .......................................................................................................................................... 158|
||5.2.|Pin Information Summary ............................................................................................................................... 163|
|6.|Ordering Information ............................................................................................................................................... 167||
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
5
**CertusPro-NX Family Data Sheet**
|6.1.|Part Number Description ................................................................................................................................ 167|
|---|---|
|6.2.|Ordering Part Numbers ................................................................................................................................... 168|
|6.2.1.|Commercial ................................................................................................................................................. 168|
|6.2.2.|Commercial (“01A” Die Version) ................................................................................................................. 169|
|6.2.3.|Industrial ..................................................................................................................................................... 169|
|6.2.4.|Industrial (“01A” Die Version) ..................................................................................................................... 170|
|6.2.5.|Automotive ................................................................................................................................................. 170|
|References ........................................................................................................................................................................ 171||
|Technical Support Assistance ........................................................................................................................................... 172||
|Revision History ................................................................................................................................................................ 173||
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
6
**CertusPro-NX Family Data Sheet**
## **Figures**
|Figure 2.1. Simplified Block Diagram, LFCPNX-50 Device (Top Level) ................................................................................ 19|Figure 2.1. Simplified Block Diagram, LFCPNX-50 Device (Top Level) ................................................................................ 19|
|---|---|
|Figure 2.2. Simplified Block Diagram, LFCPNX-100 Device (Top Level) .............................................................................. 20|Figure 2.2. Simplified Block Diagram, LFCPNX-100 Device (Top Level) .............................................................................. 20|
|Figure 2.3. PFU Diagram ..................................................................................................................................................... 21|Figure 2.3. PFU Diagram ..................................................................................................................................................... 21|
|Figure 2.4. Slice Diagram .................................................................................................................................................... 22|Figure 2.4. Slice Diagram .................................................................................................................................................... 22|
|Figure 2.5. Slice Configuration for LUT4 and LUT5 ............................................................................................................. 23|Figure 2.5. Slice Configuration for LUT4 and LUT5 ............................................................................................................. 23|
|Figure 2.6. General Purpose PLL Diagram .......................................................................................................................... 26|Figure 2.6. General Purpose PLL Diagram .......................................................................................................................... 26|
|Figure 2.7. Clocking Network .............................................................................................................................................. 27|Figure 2.7. Clocking Network .............................................................................................................................................. 27|
|Figure 2.8. Edge Clock Sources per Bank ............................................................................................................................ 28|Figure 2.8. Edge Clock Sources per Bank ............................................................................................................................ 28|
|Figure 2.9. DCS_CMUX Block Diagram ................................................................................................................................ 29|Figure 2.9. DCS_CMUX Block Diagram ................................................................................................................................ 29|
|Figure 2.10. DCS Waveforms .............................................................................................................................................. 30|Figure 2.10. DCS Waveforms .............................................................................................................................................. 30|
|Figure 2.11. DLLDEL Function Diagram ............................................................................................................................... 31|Figure 2.11. DLLDEL Function Diagram ............................................................................................................................... 31|
|Figure 2.12. CertusPro-NX DDRDLL Architecture................................................................................................................ 31|Figure 2.12. CertusPro-NX DDRDLL Architecture................................................................................................................ 31|
|Figure 2.13. SGMII CDR IP ................................................................................................................................................... 32|Figure 2.13. SGMII CDR IP ................................................................................................................................................... 32|
|Figure 2.14. Memory Core Reset ........................................................................................................................................ 34|Figure 2.14. Memory Core Reset ........................................................................................................................................ 34|
|Figure 2.15. Comparison of General DSP and CertusPro-NX Approaches .......................................................................... 35|Figure 2.15. Comparison of General DSP and CertusPro-NX Approaches .......................................................................... 35|
|Figure 2.16. CertusPro-NX DSP Functional Block Diagram ................................................................................................. 37|Figure 2.16. CertusPro-NX DSP Functional Block Diagram ................................................................................................. 37|
|Figure 2.17. A Group of Two High Performance Programmable I/O Cells.......................................................................... 38|Figure 2.17. A Group of Two High Performance Programmable I/O Cells.......................................................................... 38|
|Figure 2.18. Wide Range Programmable I/O Cells ............................................................................................................. 39|Figure 2.18. Wide Range Programmable I/O Cells ............................................................................................................. 39|
|Figure 2.19. Input Register Block for PIO on Top, Left, and Right Sides ............................................................................. 40|Figure 2.19. Input Register Block for PIO on Top, Left, and Right Sides ............................................................................. 40|
|Figure 2.20. Input Register Block for PIO on Bottom Side .................................................................................................. 40|Figure 2.20. Input Register Block for PIO on Bottom Side .................................................................................................. 40|
|Figure 2.21. Output Register Block on Top, Left, and Right Sides ...................................................................................... 41|Figure 2.21. Output Register Block on Top, Left, and Right Sides ...................................................................................... 41|
|Figure 2.22. Output Register Block on Bottom Side ........................................................................................................... 41|Figure 2.22. Output Register Block on Bottom Side ........................................................................................................... 41|
|Figure 2.23. Tri-state Register Block on Top, Left, and Right Sides .................................................................................... 42|Figure 2.23. Tri-state Register Block on Top, Left, and Right Sides .................................................................................... 42|
|Figure 2.24. Tri-state Register Block on Bottom Side ......................................................................................................... 42|Figure 2.24. Tri-state Register Block on Bottom Side ......................................................................................................... 42|
|Figure 2.25. DQS Grouping on the Bottom Edge ................................................................................................................ 43|Figure 2.25. DQS Grouping on the Bottom Edge ................................................................................................................ 43|
|Figure 2.26. DQS Control and Delay Block (DQSBUF) ......................................................................................................... 44|Figure 2.26. DQS Control and Delay Block (DQSBUF) ......................................................................................................... 44|
|Figure 2.27. sysI/O Banking ................................................................................................................................................ 47|Figure 2.27. sysI/O Banking ................................................................................................................................................ 47|
|Figure 2.28. SERDES/PCS Overall Structure ........................................................................................................................ 53|Figure 2.28. SERDES/PCS Overall Structure ........................................................................................................................ 53|
|Figure 2.29. Single-channel Block Diagram for SERDES Block ............................................................................................ 55|Figure 2.29. Single-channel Block Diagram for SERDES Block ............................................................................................ 55|
|Figure 2.30. Simplified Channel Block Diagram for MPCS Block ......................................................................................... 56|Figure 2.30. Simplified Channel Block Diagram for MPCS Block ......................................................................................... 56|
|Figure 2.31. Simplified Channel Block Diagram for MPCS 8b10b Sub-Block ...................................................................... 56|Figure 2.31. Simplified Channel Block Diagram for MPCS 8b10b Sub-Block ...................................................................... 56|
|Figure 2.32. Simplified Channel Block Diagram for MPCS 64b66b Sub-Block .................................................................... 56|Figure 2.32. Simplified Channel Block Diagram for MPCS 64b66b Sub-Block .................................................................... 56|
|Figure 2.33. Simplified Channel Block Diagram for MPCS SERDES-only Sub-Block ............................................................ 57|Figure 2.33. Simplified Channel Block Diagram for MPCS SERDES-only Sub-Block ............................................................ 57|
|Figure 2.34. PCIe Core ........................................................................................................................................................ 58|Figure 2.34. PCIe Core ........................................................................................................................................................ 58|
|Figure 2.35. PCIe Soft IP Wrapper ...................................................................................................................................... 58|Figure 2.35. PCIe Soft IP Wrapper ...................................................................................................................................... 58|
|Figure 2.36. Cryptographic Engine Block Diagram .............................................................................................................. 59|Figure 2.36. Cryptographic Engine Block Diagram .............................................................................................................. 59|
|Figure 3.1. On-chip Termination ......................................................................................................................................... 62|Figure 3.1. On-chip Termination ......................................................................................................................................... 62|
|Figure 3.2. LVDS25E Output Termination Example ............................................................................................................ 70|Figure 3.2. LVDS25E Output Termination Example ............................................................................................................ 70|
|Figure 3.3. SubLVDS Input Interface ................................................................................................................................... 70|Figure 3.3. SubLVDS Input Interface ................................................................................................................................... 70|
|Figure 3.4. SubLVDS Output Interface ................................................................................................................................ 71|Figure 3.4. SubLVDS Output Interface ................................................................................................................................ 71|
|Figure 3.5. SLVS Interface ................................................................................................................................................... 72|Figure 3.5. SLVS Interface ................................................................................................................................................... 72|
|Figure 3.6. MIPI Interface ................................................................................................................................................... 73|Figure 3.6. MIPI Interface ................................................................................................................................................... 73|
|Figure 3.7. Receiver RX.CLK.Centered Waveforms ............................................................................................................. 85|Figure 3.7. Receiver RX.CLK.Centered Waveforms ............................................................................................................. 85|
|Figure 3.8. Receiver RX.CLK.Aligned and DDR Memory Input Waveforms ......................................................................... 86|Figure 3.8. Receiver RX.CLK.Aligned and DDR Memory Input Waveforms ......................................................................... 86|
|Figure 3.9. Transmit TX.CLK.Centered and DDR Memory Output Waveforms ................................................................... 86|Figure 3.9. Transmit TX.CLK.Centered and DDR Memory Output Waveforms ................................................................... 86|
|Figure 3.10. Transmit TX.CLK.Aligned Waveforms ............................................................................................................. 86|Figure 3.10. Transmit TX.CLK.Aligned Waveforms ............................................................................................................. 86|
|Figure 3.11. DDRX71 Video Timing Waveforms ................................................................................................................. 87|Figure 3.11. DDRX71 Video Timing Waveforms ................................................................................................................. 87|
|Figure 3.12. Receiver DDRX71_RX Waveforms .................................................................................................................. 87|Figure 3.12. Receiver DDRX71_RX Waveforms .................................................................................................................. 87|
|Figure 3.13. Transmitter DDRX71_TX Waveforms .............................................................................................................. 88|Figure 3.13. Transmitter DDRX71_TX Waveforms .............................................................................................................. 88|
|Figure 3.14. Configuration Error Notification (1) .............................................................................................................. 103|Figure 3.14. Configuration Error Notification (1) .............................................................................................................. 103|
|Figure 3.15. Master SPI POR/REFRESH Timing ................................................................................................................. 103|Figure 3.15. Master SPI POR/REFRESH Timing ................................................................................................................. 103|
|Figure 3.16. Slave SPI/I|Figure 3.16. Slave SPI/I2C/I3C POR/REFRESH Timing ........................................................................................................ 104|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
7
**CertusPro-NX Family Data Sheet**
|Figure 3.17. Master SPI PROGRAMN Timing .................................................................................................................... 104|Figure 3.17. Master SPI PROGRAMN Timing .................................................................................................................... 104|
|---|---|
|Figure 3.18. Slave SPI/I|Figure 3.18. Slave SPI/I2C/I3C PROGRAMN Timing ........................................................................................................... 105|
|Figure 3.19. Master SPI Configuration Timing .................................................................................................................. 105|Figure 3.19. Master SPI Configuration Timing .................................................................................................................. 105|
|Figure 3.20. Slave SPI Configuration Timing ..................................................................................................................... 106|Figure 3.20. Slave SPI Configuration Timing ..................................................................................................................... 106|
|Figure 3.21. I|Figure 3.21. I2C/I3C Configuration Timing ........................................................................................................................ 106|
|Figure 3.22. Master SPI Wake-Up Timing ......................................................................................................................... 107|Figure 3.22. Master SPI Wake-Up Timing ......................................................................................................................... 107|
|Figure 3.23. Slave SPI/I|Figure 3.23. Slave SPI/I2C/I3C Wake-Up Timing ................................................................................................................ 107|
|Figure 3.24. JTAG Port Timing Waveforms ....................................................................................................................... 108|Figure 3.24. JTAG Port Timing Waveforms ....................................................................................................................... 108|
|Figure 3.25. Output Test Load, LVTTL and LVCMOS Standards ........................................................................................ 109|Figure 3.25. Output Test Load, LVTTL and LVCMOS Standards ........................................................................................ 109|
|Figure 4.1. On-chip Termination ....................................................................................................................................... 112|Figure 4.1. On-chip Termination ....................................................................................................................................... 112|
|Figure 4.2. LVDS25E Output Termination Example .......................................................................................................... 120|Figure 4.2. LVDS25E Output Termination Example .......................................................................................................... 120|
|Figure 4.3. SubLVDS Input Interface ................................................................................................................................. 120|Figure 4.3. SubLVDS Input Interface ................................................................................................................................. 120|
|Figure 4.4. SubLVDS Output Interface .............................................................................................................................. 121|Figure 4.4. SubLVDS Output Interface .............................................................................................................................. 121|
|Figure 4.5. SLVS Interface ................................................................................................................................................. 122|Figure 4.5. SLVS Interface ................................................................................................................................................. 122|
|Figure 4.6. MIPI Interface ................................................................................................................................................. 123|Figure 4.6. MIPI Interface ................................................................................................................................................. 123|
|Figure 4.7. Receiver RX.CLK.Centered Waveforms ........................................................................................................... 135|Figure 4.7. Receiver RX.CLK.Centered Waveforms ........................................................................................................... 135|
|Figure 4.8. Receiver RX.CLK.Aligned and DDR Memory Input Waveforms ....................................................................... 135|Figure 4.8. Receiver RX.CLK.Aligned and DDR Memory Input Waveforms ....................................................................... 135|
|Figure 4.9. Transmit TX.CLK.Centered and DDR Memory Output Waveforms ................................................................. 135|Figure 4.9. Transmit TX.CLK.Centered and DDR Memory Output Waveforms ................................................................. 135|
|Figure 4.10. Transmit TX.CLK.Aligned Waveforms ............................................................................................................ 136|Figure 4.10. Transmit TX.CLK.Aligned Waveforms ............................................................................................................ 136|
|Figure 4.11. DDRX71 Video Timing Waveforms ................................................................................................................ 136|Figure 4.11. DDRX71 Video Timing Waveforms ................................................................................................................ 136|
|Figure 4.12. Receiver DDRX71_RX Waveforms ................................................................................................................. 137|Figure 4.12. Receiver DDRX71_RX Waveforms ................................................................................................................. 137|
|Figure 4.13. Transmitter DDRX71_TX Waveforms ............................................................................................................ 137|Figure 4.13. Transmitter DDRX71_TX Waveforms ............................................................................................................ 137|
|Figure 4.14. Configuration Error Notification (2) .............................................................................................................. 151|Figure 4.14. Configuration Error Notification (2) .............................................................................................................. 151|
|Figure 4.15. Master SPI POR/REFRESH Timing .................................................................................................................. 151|Figure 4.15. Master SPI POR/REFRESH Timing .................................................................................................................. 151|
|Figure 4.16. Slave SPI/I|Figure 4.16. Slave SPI/I2C/I3C POR/REFRESH Timing ........................................................................................................ 152|
|Figure 4.17. Master SPI PROGRAMN Timing .................................................................................................................... 152|Figure 4.17. Master SPI PROGRAMN Timing .................................................................................................................... 152|
|Figure 4.18. Slave SPI/I|Figure 4.18. Slave SPI/I2C/I3C PROGRAMN Timing ........................................................................................................... 153|
|Figure 4.19. Master SPI Configuration Timing .................................................................................................................. 153|Figure 4.19. Master SPI Configuration Timing .................................................................................................................. 153|
|Figure 4.20. Slave SPI Configuration Timing ..................................................................................................................... 154|Figure 4.20. Slave SPI Configuration Timing ..................................................................................................................... 154|
|Figure 4.21. I|Figure 4.21. I2C/I3C Configuration Timing ........................................................................................................................ 154|
|Figure 4.22. Master SPI Wake-Up Timing ......................................................................................................................... 155|Figure 4.22. Master SPI Wake-Up Timing ......................................................................................................................... 155|
|Figure 4.23. Slave SPI/I|Figure 4.23. Slave SPI/I2C/I3C Wake-Up Timing ................................................................................................................ 155|
|Figure 4.24. JTAG Port Timing Waveforms ....................................................................................................................... 156|Figure 4.24. JTAG Port Timing Waveforms ....................................................................................................................... 156|
|Figure 4.25. Output Test Load, LVTTL and LVCMOS Standards ........................................................................................ 157|Figure 4.25. Output Test Load, LVTTL and LVCMOS Standards ........................................................................................ 157|
|Figure 6.1. Top Marking Diagram ..................................................................................................................................... 168|Figure 6.1. Top Marking Diagram ..................................................................................................................................... 168|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
8
**CertusPro-NX Family Data Sheet**
## **Tables**
|Table 1.1. CertusPro-NX Family Selection Guide ................................................................................................................ 17|Table 1.1. CertusPro-NX Family Selection Guide ................................................................................................................ 17|
|---|---|
|Table 2.1. Resources and Modes Available per Slice .......................................................................................................... 21|Table 2.1. Resources and Modes Available per Slice .......................................................................................................... 21|
|Table 2.2. Slice Signal Descriptions|Table 2.2. Slice Signal Descriptions1................................................................................................................................... 23|
|Table 2.3. Number of Slices Required to Implement Distributed RAM|Table 2.3. Number of Slices Required to Implement Distributed RAM1............................................................................. 24|
|Table 2.4. sysMEM Block Configurations ............................................................................................................................ 33|Table 2.4. sysMEM Block Configurations ............................................................................................................................ 33|
|Table 2.5. Maximum Number of Elements in a sysDSP Block ............................................................................................ 37|Table 2.5. Maximum Number of Elements in a sysDSP Block ............................................................................................ 37|
|Table 2.6. Input Block Port Description .............................................................................................................................. 39|Table 2.6. Input Block Port Description .............................................................................................................................. 39|
|Table 2.7. Output Block Port Description ........................................................................................................................... 41|Table 2.7. Output Block Port Description ........................................................................................................................... 41|
|Table 2.8. Tri-state Block Port Description ......................................................................................................................... 42|Table 2.8. Tri-state Block Port Description ......................................................................................................................... 42|
|Table 2.9. DQSBUF Port List Description ............................................................................................................................ 44|Table 2.9. DQSBUF Port List Description ............................................................................................................................ 44|
|Table 2.10. Single-Ended I/O Standards ............................................................................................................................. 46|Table 2.10. Single-Ended I/O Standards ............................................................................................................................. 46|
|Table 2.11. Differential I/O Standards ................................................................................................................................ 46|Table 2.11. Differential I/O Standards ................................................................................................................................ 46|
|Table 2.12. Single-Ended I/O Standards Support on Various Sides .................................................................................... 48|Table 2.12. Single-Ended I/O Standards Support on Various Sides .................................................................................... 48|
|Table 2.13. Differential I/O Standards Supported on Various Sides ................................................................................... 48|Table 2.13. Differential I/O Standards Supported on Various Sides ................................................................................... 48|
|Table 2.14. CertusPro-NX SERDES Standard Support ......................................................................................................... 54|Table 2.14. CertusPro-NX SERDES Standard Support ......................................................................................................... 54|
|Table 2.15. Number of SERDES/PCS Channel per CertusPro-NX Device ............................................................................. 54|Table 2.15. Number of SERDES/PCS Channel per CertusPro-NX Device ............................................................................. 54|
|Table 3.1. Absolute Maximum Ratings ............................................................................................................................... 60|Table 3.1. Absolute Maximum Ratings ............................................................................................................................... 60|
|Table 3.2. Recommended Operating Conditions|Table 3.2. Recommended Operating Conditions1, 2, 3......................................................................................................... 60|
|Table 3.3. Power Supply Ramp Rates ................................................................................................................................. 61|Table 3.3. Power Supply Ramp Rates ................................................................................................................................. 61|
|Table 3.4. Power-On Reset|Table 3.4. Power-On Reset1................................................................................................................................................ 62|
|Table 3.5. On-Chip Termination Options for Input Modes ................................................................................................. 62|Table 3.5. On-Chip Termination Options for Input Modes ................................................................................................. 62|
|Table 3.6. Hot Socketing Specifications for GPIO ............................................................................................................... 63|Table 3.6. Hot Socketing Specifications for GPIO ............................................................................................................... 63|
|Table 3.7. DC Electrical Characteristics – Wide Range (Over Recommended Operating Conditions) ................................ 63|Table 3.7. DC Electrical Characteristics – Wide Range (Over Recommended Operating Conditions) ................................ 63|
|Table 3.8. DC Electrical Characteristics – High Speed (Over Recommended Operating Conditions)|Table 3.8. DC Electrical Characteristics – High Speed (Over Recommended Operating Conditions)1................................ 64|
|Table 3.9. Capacitors – Wide Range (Over Recommended Operating Conditions) ............................................................ 64|Table 3.9. Capacitors – Wide Range (Over Recommended Operating Conditions) ............................................................ 64|
|Table 3.10. Capacitors – High Performance (Over Recommended Operating Conditions) ................................................ 64|Table 3.10. Capacitors – High Performance (Over Recommended Operating Conditions) ................................................ 64|
|Table 3.11. Single Ended Input Hysteresis – Wide Range (Over Recommended Operating Conditions) ........................... 64|Table 3.11. Single Ended Input Hysteresis – Wide Range (Over Recommended Operating Conditions) ........................... 64|
|Table 3.12. Single Ended Input Hysteresis – High Performance (Over Recommended Operating Conditions) ................. 65|Table 3.12. Single Ended Input Hysteresis – High Performance (Over Recommended Operating Conditions) ................. 65|
|Table 3.13. sysI/O Recommended Operating Conditions ................................................................................................... 65|Table 3.13. sysI/O Recommended Operating Conditions ................................................................................................... 65|
|Table 3.14. sysI/O DC Electrical Characteristics – Wide Range I/O (Over Recommended Operating Conditions) ............. 67|Table 3.14. sysI/O DC Electrical Characteristics – Wide Range I/O (Over Recommended Operating Conditions) ............. 67|
|Table 3.15. sysI/O DC Electrical Characteristics – High Performance I/O (Over Recommended Operating Conditions) ... 67|Table 3.15. sysI/O DC Electrical Characteristics – High Performance I/O (Over Recommended Operating Conditions) ... 67|
|Table 3.16. I/O Resistance Characteristics (Over Recommended Operating Conditions) .................................................. 68|Table 3.16. I/O Resistance Characteristics (Over Recommended Operating Conditions) .................................................. 68|
|Table 3.17. V|Table 3.17. VINMaximum Overshoot/Undershoot Allowance – Wide Range1, 2................................................................ 68|
|Table 3.18. V|Table 3.18. VINMaximum Overshoot/Undershoot Allowance – High Performance1, 2....................................................... 68|
|Table 3.19. LVDS DC Electrical Characteristics (Over Recommended Operating Conditions)|Table 3.19. LVDS DC Electrical Characteristics (Over Recommended Operating Conditions)1........................................... 69|
|Table 3.20. LVDS25E DC Conditions .................................................................................................................................... 69|Table 3.20. LVDS25E DC Conditions .................................................................................................................................... 69|
|Table 3.21. SubLVDS Input DC Electrical Characteristics (Over Recommended Operating Conditions) ............................ 70|Table 3.21. SubLVDS Input DC Electrical Characteristics (Over Recommended Operating Conditions) ............................ 70|
|Table 3.22. SubLVDS Output DC Electrical Characteristics (Over Recommended Operating Conditions).......................... 71|Table 3.22. SubLVDS Output DC Electrical Characteristics (Over Recommended Operating Conditions).......................... 71|
|Table 3.23. SLVS Input DC Characteristics (Over Recommended Operating Conditions) ................................................... 71|Table 3.23. SLVS Input DC Characteristics (Over Recommended Operating Conditions) ................................................... 71|
|Table 3.24. SLVS Output DC Characteristics (Over Recommended Operating Conditions) ................................................ 72|Table 3.24. SLVS Output DC Characteristics (Over Recommended Operating Conditions) ................................................ 72|
|Table 3.25. Soft D-PHY Input Timing and Levels ................................................................................................................. 73|Table 3.25. Soft D-PHY Input Timing and Levels ................................................................................................................. 73|
|Table 3.26. Soft D-PHY Output Timing and Levels .............................................................................................................. 74|Table 3.26. Soft D-PHY Output Timing and Levels .............................................................................................................. 74|
|Table 3.27. Soft D-PHY Clock Signal Specification .............................................................................................................. 75|Table 3.27. Soft D-PHY Clock Signal Specification .............................................................................................................. 75|
|Table 3.28. Soft D-PHY Data-Clock Timing Specifications ................................................................................................... 75|Table 3.28. Soft D-PHY Data-Clock Timing Specifications ................................................................................................... 75|
|Table 3.29. Maximum I/O Buffer Speed|Table 3.29. Maximum I/O Buffer Speed1, 2, 3, 4, 7.................................................................................................................. 76|
|Table 3.30. Pin-to-Pin Performance|Table 3.30. Pin-to-Pin Performance1.................................................................................................................................. 78|
|Table 3.31. Register-to-Register Performance|Table 3.31. Register-to-Register Performance1, 3, 4............................................................................................................. 78|
|Table 3.32. External Switching Characteristics (V|Table 3.32. External Switching Characteristics (VCC= 1.0 V) ............................................................................................... 79|
|Table 3.33. sysCLOCK PLL Timing (V|Table 3.33. sysCLOCK PLL Timing (VCC= 1.0 V).................................................................................................................... 88|
|Table 3.34. Internal Oscillators (V|Table 3.34. Internal Oscillators (VCC= 1.0 V) ....................................................................................................................... 89|
|Table 3.35. User I|Table 3.35. User I2C Specifications (VCC= 1.0 V).................................................................................................................. 89|
|Table 3.36. ADC Specifications|Table 3.36. ADC Specifications1.......................................................................................................................................... 89|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
9
**CertusPro-NX Family Data Sheet**
|Table 3.37. Comparator Specifications ............................................................................................................................... 90|Table 3.37. Comparator Specifications ............................................................................................................................... 90|
|---|---|
|Table 3.38. DTR Specifications|Table 3.38. DTR Specifications1, 2........................................................................................................................................ 91|
|Table 3.39. Serial Output Timing and Levels ....................................................................................................................... 91|Table 3.39. Serial Output Timing and Levels ....................................................................................................................... 91|
|Table 3.40. Channel Output Jitter ....................................................................................................................................... 92|Table 3.40. Channel Output Jitter ....................................................................................................................................... 92|
|Table 3.41. Serial Input Data Specifications ........................................................................................................................ 93|Table 3.41. Serial Input Data Specifications ........................................................................................................................ 93|
|Table 3.42. Receiver Total Jitter Tolerance Specification|Table 3.42. Receiver Total Jitter Tolerance Specification1.................................................................................................. 93|
|Table 3.43. External Reference Clock Specification for SDQx_REFCLKP/N|Table 3.43. External Reference Clock Specification for SDQx_REFCLKP/N1........................................................................ 95|
|Table 3.44. External Reference Clock Specification for SD_EXTx_REFCLKP/N|Table 3.44. External Reference Clock Specification for SD_EXTx_REFCLKP/N1.................................................................. 95|
|Table 3.45. PCIe (2.5 Gbps) ................................................................................................................................................. 96|Table 3.45. PCIe (2.5 Gbps) ................................................................................................................................................. 96|
|Table 3.46. PCIe (5 Gbps) .................................................................................................................................................... 97|Table 3.46. PCIe (5 Gbps) .................................................................................................................................................... 97|
|Table 3.47. PCIe (8 Gbps) .................................................................................................................................................... 99|Table 3.47. PCIe (8 Gbps) .................................................................................................................................................... 99|
|Table 3.48. SGMII .............................................................................................................................................................. 100|Table 3.48. SGMII .............................................................................................................................................................. 100|
|Table 3.49. sysCONFIG Port Timing Specifications ........................................................................................................... 101|Table 3.49. sysCONFIG Port Timing Specifications ........................................................................................................... 101|
|Table 3.50. JTAG Port Timing Specifications ..................................................................................................................... 108|Table 3.50. JTAG Port Timing Specifications ..................................................................................................................... 108|
|Table 3.51. Test Fixture Required Components, Non-Terminated Interfaces|Table 3.51. Test Fixture Required Components, Non-Terminated Interfaces1................................................................. 109|
|Table 4.1. Absolute Maximum Ratings ............................................................................................................................. 110|Table 4.1. Absolute Maximum Ratings ............................................................................................................................. 110|
|Table 4.2. Recommended Operating Conditions|Table 4.2. Recommended Operating Conditions1, 2, 3....................................................................................................... 110|
|Table 4.3. Power Supply Ramp Rates ............................................................................................................................... 111|Table 4.3. Power Supply Ramp Rates ............................................................................................................................... 111|
|Table 4.4. Power-On Reset|Table 4.4. Power-On Reset1.............................................................................................................................................. 112|
|Table 4.5. On-Chip Termination Options for Input Modes ............................................................................................... 112|Table 4.5. On-Chip Termination Options for Input Modes ............................................................................................... 112|
|Table 4.6. Hot Socketing Specifications for GPIO ............................................................................................................. 113|Table 4.6. Hot Socketing Specifications for GPIO ............................................................................................................. 113|
|Table 4.7. DC Electrical Characteristics – Wide Range (Over Recommended Operating Conditions) .............................. 113|Table 4.7. DC Electrical Characteristics – Wide Range (Over Recommended Operating Conditions) .............................. 113|
|Table 4.8. DC Electrical Characteristics – High Speed (Over Recommended Operating Conditions) ............................... 114|Table 4.8. DC Electrical Characteristics – High Speed (Over Recommended Operating Conditions) ............................... 114|
|Table 4.9. Capacitors – Wide Range (Over Recommended Operating Conditions) .......................................................... 114|Table 4.9. Capacitors – Wide Range (Over Recommended Operating Conditions) .......................................................... 114|
|Table 4.10. Capacitors – High Performance (Over Recommended Operating Conditions) .............................................. 114|Table 4.10. Capacitors – High Performance (Over Recommended Operating Conditions) .............................................. 114|
|Table 4.11. Single Ended Input Hysteresis – Wide Range (Over Recommended Operating Conditions) ......................... 114|Table 4.11. Single Ended Input Hysteresis – Wide Range (Over Recommended Operating Conditions) ......................... 114|
|Table 4.12. Single Ended Input Hysteresis – High Performance (Over Recommended Operating Conditions) ............... 115|Table 4.12. Single Ended Input Hysteresis – High Performance (Over Recommended Operating Conditions) ............... 115|
|Table 4.13. sysI/O Recommended Operating Conditions ................................................................................................. 115|Table 4.13. sysI/O Recommended Operating Conditions ................................................................................................. 115|
|Table 4.14. sysI/O DC Electrical Characteristics – Wide Range I/O (Over Recommended Operating Conditions) ........... 117|Table 4.14. sysI/O DC Electrical Characteristics – Wide Range I/O (Over Recommended Operating Conditions) ........... 117|
|Table 4.15. sysI/O DC Electrical Characteristics – High Performance I/O (Over Recommended Operating Conditions) . 117|Table 4.15. sysI/O DC Electrical Characteristics – High Performance I/O (Over Recommended Operating Conditions) . 117|
|Table 4.16. I/O Resistance Characteristics (Over Recommended Operating Conditions) ................................................ 118|Table 4.16. I/O Resistance Characteristics (Over Recommended Operating Conditions) ................................................ 118|
|Table 4.17. V|Table 4.17. VINMaximum Overshoot/Undershoot Allowance – Wide Range1, 2.............................................................. 118|
|Table 4.18. V|Table 4.18. VINMaximum Overshoot/Undershoot Allowance – High Performance1, 2..................................................... 118|
|Table 4.19. LVDS DC Electrical Characteristics (Over Recommended Operating Conditions)|Table 4.19. LVDS DC Electrical Characteristics (Over Recommended Operating Conditions)1......................................... 119|
|Table 4.20. LVDS25E DC Conditions .................................................................................................................................. 119|Table 4.20. LVDS25E DC Conditions .................................................................................................................................. 119|
|Table 4.21. SubLVDS Input DC Electrical Characteristics (Over Recommended Operating Conditions) ........................... 120|Table 4.21. SubLVDS Input DC Electrical Characteristics (Over Recommended Operating Conditions) ........................... 120|
|Table 4.22. SubLVDS Output DC Electrical Characteristics (Over Recommended Operating Conditions) ........................ 121|Table 4.22. SubLVDS Output DC Electrical Characteristics (Over Recommended Operating Conditions) ........................ 121|
|Table 4.23. SLVS Input DC Characteristics (Over Recommended Operating Conditions) ................................................. 121|Table 4.23. SLVS Input DC Characteristics (Over Recommended Operating Conditions) ................................................. 121|
|Table 4.24. SLVS Output DC Characteristics (Over Recommended Operating Conditions) .............................................. 121|Table 4.24. SLVS Output DC Characteristics (Over Recommended Operating Conditions) .............................................. 121|
|Table 4.25. Soft D-PHY Input Timing and Levels ............................................................................................................... 123|Table 4.25. Soft D-PHY Input Timing and Levels ............................................................................................................... 123|
|Table 4.26. Soft D-PHY Output Timing and Levels ............................................................................................................ 124|Table 4.26. Soft D-PHY Output Timing and Levels ............................................................................................................ 124|
|Table 4.27. Soft D-PHY Clock Signal Specification ............................................................................................................. 125|Table 4.27. Soft D-PHY Clock Signal Specification ............................................................................................................. 125|
|Table 4.28. Soft D-PHY Data-Clock Timing Specifications ................................................................................................. 125|Table 4.28. Soft D-PHY Data-Clock Timing Specifications ................................................................................................. 125|
|Table 4.29. Maximum I/O Buffer Speed|Table 4.29. Maximum I/O Buffer Speed1, 2, 3, 4, 7................................................................................................................ 125|
|Table 4.30. Pin-to-Pin Performance|Table 4.30. Pin-to-Pin Performance1................................................................................................................................ 128|
|Table 4.31. Register-to-Register Performance|Table 4.31. Register-to-Register Performance1, 3, 4........................................................................................................... 128|
|Table 4.32. External Switching Characteristics (V|Table 4.32. External Switching Characteristics (VCC= 1.0 V) ............................................................................................. 129|
|Table 4.33. sysCLOCK PLL Timing (V|Table 4.33. sysCLOCK PLL Timing (VCC= 1.0 V) .................................................................................................................. 138|
|Table 4.34. Internal Oscillators (V|Table 4.34. Internal Oscillators (VCC= 1.0 V) ..................................................................................................................... 139|
|Table 4.35. User I|Table 4.35. User I2C Specifications (VCC= 1.0 V) ................................................................................................................ 139|
|Table 4.36. ADC Specifications|Table 4.36. ADC Specifications1........................................................................................................................................ 139|
|Table 4.37. Comparator Specifications ............................................................................................................................. 140|Table 4.37. Comparator Specifications ............................................................................................................................. 140|
|Table 4.38. DTR Specifications|Table 4.38. DTR Specifications1, 2...................................................................................................................................... 140|
|Table 4.39. Serial Output Timing and Levels ..................................................................................................................... 141|Table 4.39. Serial Output Timing and Levels ..................................................................................................................... 141|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
10
**CertusPro-NX Family Data Sheet**
|Table 4.40. Channel Output Jitter ..................................................................................................................................... 141|Table 4.40. Channel Output Jitter ..................................................................................................................................... 141|
|---|---|
|Table 4.41. Serial Input Data Specifications ..................................................................................................................... 142|Table 4.41. Serial Input Data Specifications ..................................................................................................................... 142|
|Table 4.42. Receiver Total Jitter Tolerance Specification|Table 4.42. Receiver Total Jitter Tolerance Specification1................................................................................................ 143|
|Table 4.43. External Reference Clock Specification for SDQx_REFCLKP/N|Table 4.43. External Reference Clock Specification for SDQx_REFCLKP/N1..................................................................... 144|
|Table 4.44. External Reference Clock Specification for SD_EXTx_REFCLKP/N|Table 4.44. External Reference Clock Specification for SD_EXTx_REFCLKP/N1................................................................ 144|
|Table 4.45. PCIe (2.5 Gbps) ............................................................................................................................................... 145|Table 4.45. PCIe (2.5 Gbps) ............................................................................................................................................... 145|
|Table 4.46. PCIe (5 Gbps) .................................................................................................................................................. 147|Table 4.46. PCIe (5 Gbps) .................................................................................................................................................. 147|
|Table 4.47. SGMII .............................................................................................................................................................. 148|Table 4.47. SGMII .............................................................................................................................................................. 148|
|Table 4.48. sysCONFIG Port Timing Specifications ........................................................................................................... 149|Table 4.48. sysCONFIG Port Timing Specifications ........................................................................................................... 149|
|Table 4.49. JTAG Port Timing Specifications ..................................................................................................................... 156|Table 4.49. JTAG Port Timing Specifications ..................................................................................................................... 156|
|Table 4.50. Test Fixture Required Components, Non-Terminated Interfaces|Table 4.50. Test Fixture Required Components, Non-Terminated Interfaces1................................................................ 157|
|Table 5.1. Signal Description ............................................................................................................................................ 158|Table 5.1. Signal Description ............................................................................................................................................ 158|
|Table 5.2. Pin Information Summary ................................................................................................................................ 163|Table 5.2. Pin Information Summary ................................................................................................................................ 163|
|Table 6.1. Commercial Part Numbers ............................................................................................................................... 168|Table 6.1. Commercial Part Numbers ............................................................................................................................... 168|
|Table 6.2. Commercial Part Numbers - 01A Die Version .................................................................................................. 169|Table 6.2. Commercial Part Numbers - 01A Die Version .................................................................................................. 169|
|Table 6.3. Industrial Part Numbers ................................................................................................................................... 169|Table 6.3. Industrial Part Numbers ................................................................................................................................... 169|
|Table 6.4. Industrial Part Numbers - 01A Die Version ...................................................................................................... 170|Table 6.4. Industrial Part Numbers - 01A Die Version ...................................................................................................... 170|
|Table 6.5. Automotive Part Numbers ............................................................................................................................... 170|Table 6.5. Automotive Part Numbers ............................................................................................................................... 170|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
11
**CertusPro-NX Family Data Sheet**
## **Acronyms in This Document**
|**Acronym **<br>~~ed~~<br>~~pe~~|**Definition**|
|---|---|
|ADC<br>~~ed~~<br>~~pe~~|Analogto Digital Convertor|
|AES<br>~~pe~~<br>~~a~~|Advanced Encryption Standard|
|ALU<br>~~a~~|Arithmetic Logic Unit|
|BGA<br>~~a~~|Ball Grid Array|
|CDR<br>~~a~~<br>~~pe~~|Clock and Data Recovery|
|CMUX<br>~~pe~~|Center MUX|
|CRC<br>~~pe~~<br>~~a~~|Cycle RedundancyCode|
|CSI<br>~~a~~|Camera Serial Interface|
|DCC<br>~~a~~|Dynamic Clock Control|
|DCS<br>~~a~~|Dynamic Clock Select|
|DDR<br>~~a~~|Double Data Rate|
|DLL<br>~~a~~|DelayLocked Loop|
|DQS<br>~~a~~|DQ Strobe|
|DRAM<br>~~a~~<br>~~pe~~<br>~~pe~~|Dynamic RAM<br>~~pe~~|
|DSI<br>~~pe~~<br>~~pe~~|DisplaySerial Interface|
|DSP<br>~~pe~~<br>~~pe~~|Digital Signal Processing|
|EBR<br>~~pe~~<br>~~a~~<br>~~a~~|Embedded Block RAM<br>|
|ECC<br>~~a~~<br>~~a~~|Error Correction Coding<br>|
|ECDSA<br>~~ape~~<br>~~pe~~|Elliptic Curve Digital Signature Algorithm<br>~~pe~~|
|ECLK<br>~~pe~~<br>~~pe~~|Edge Clock|
|ECLKDIV<br>~~pe~~<br>~~pe~~|Edge Clock Divider|
|eDP/DP<br>~~pe~~<br>~~a~~<br>~~a~~|Embedded DisplayPort/DisplayPort|
|FD-SOI<br>~~a~~<br>~~aa~~|FullyDepleted Silicon on Insulator|
|FFT<br>~~aa~~|Fast Fourier Transform|
|FIFO<br>~~a~~<br>~~a~~<br>~~pe~~|First In First Out<br>|
|FIR<br>~~pe~~|Finite Impulse Response<br>|
|GPIO<br>~~peA~~|General Purpose I/O<br>~~A~~|
|GPLL<br>~~A~~<br>~~a~~|Global Phase Locked Loop<br>~~A~~<br>~~a~~|
|HFOSC<br>~~a~~<br>~~a~~|High FrequencyOscillator<br>~~a~~<br>~~a~~|
|HMAC<br>~~a~~<br>~~a~~<br>~~pe~~|Hash-based Message Authentication Code<br>~~a~~<br>~~a~~<br>|
|HP<br>~~pe~~|High Performance<br>|
|HS<br>~~peA~~|High Speed<br>~~A~~|
|I2C<br>~~A~~<br>~~a~~|Inter-Integrated Circuit<br>~~A~~<br>~~a~~|
|I3C<br>~~a~~<br>~~a~~|Improved Inter-Integrated Circuit<br>~~a~~<br>~~a~~|
|IP<br>~~a~~<br>~~a~~<br>~~pe~~|Intellectual Property<br>~~a~~<br>~~a~~|
|LC<br>~~pe~~|Logic Cell|
|LOL<br>~~pe~~<br>~~a~~<br>~~ee~~|Loss Of Lock|
|LFOSC<br>~~a~~<br>~~ee~~<br>~~ee~~|Low FrequencyOscillator|
|LMMI<br>~~ee~~<br>~~ee~~<br>~~a~~|Lattice MemoryMapped Interface|
|LP<br>~~ee~~<br>~~a~~<br>~~pe~~|Low Power|
|LSB<br>~~a~~<br>~~pe~~<br>~~pe~~|Least Significant Bit|
|LPDDR<br>~~pe~~<br>~~pe~~|Low Power Double Data Rate|
|LRAM<br>~~pe~~<br>~~a~~<br>~~ee~~|Large Random Access Memory|
|LVCMOS<br>~~a~~<br>~~ee~~|Low-Voltage ComplementaryMetal Oxide Semiconductor|
|LVDS<br>~~ee~~<br>~~Ef~~|Low-Voltage Differential Signaling<br>~~Ef~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
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|**Acronym **<br>~~pe~~<br>~~=~~|**Definition**<br>~~=~~|
|---|---|
|LVPECL<br>~~pe~~<br>~~a~~<br>~~pe~~<br>~~=~~|Low Voltage Positive Emitter Coupled Logic<br>~~=~~|
|LVTTL<br>~~pe~~<br>~~ee~~<br>~~=~~|Low Voltage Transistor-Transistor Logic<br>~~=~~|
|LUT<br>~~pe~~<br>~~ee~~<br>~~=~~|Look UpTable<br>~~=~~|
|MAC<br>~~ee~~<br>~~a~~<br>~~=~~|Multiplyand Accumulate<br>~~=~~|
|MPCS<br>~~a~~<br>~~pe~~<br>~~=~~|Multi-Protocol PCS<br>~~=~~|
|MSPS<br>~~pe~~<br>~~pe~~<br>~~=~~|Million Samples Per Second<br>~~=~~|
|MUX<br>~~pe~~<br>~~pe~~<br>~~pe~~<br>~~=~~|Multiplexer<br>~~=~~|
|OSC<br>~~pe~~<br>~~pe~~<br>~~ee~~<br>~~=~~|Oscillator<br>~~=~~|
|PCI<br>~~pe~~<br>~~ee~~<br>~~=~~|Peripheral Component Interconnect<br>~~=~~|
|PCS<br>~~ee~~<br>~~a~~<br>~~pe~~<br>~~=~~|Physical CodingSublayer<br>~~=~~|
|PCLK<br>~~pe~~<br>~~pe~~<br>~~=~~|PrimaryClock<br>~~=~~|
|PCLKDIV<br>~~pe~~<br>~~pe~~<br>~~a~~<br>~~=~~|PrimaryClock Divider<br>~~=~~|
|PDPR<br>~~pe~~<br>~~a~~<br>~~=~~|Pseudo Dual Port RAM<br>~~=~~|
|PFU<br>~~a~~<br>~~a~~<br>~~ee=~~|Programmable Functional Unit<br>~~=~~|
|PIC<br>~~ee=~~|Programmable I/O Cell<br>~~=~~|
|PLL<br>~~ee=~~<br>~~ee~~|Phase Locked Loop<br>~~=~~|
|POR<br>~~=~~<br>~~ee~~<br>~~ee~~|Power On Reset<br>~~=~~|
|PTAT<br>~~=~~<br>~~ee~~<br>~~ee~~|Proportional To Absolute Temperature<br>~~=~~|
|RAM<br>~~=~~<br>~~ee~~<br>~~a~~<br>~~ee~~|Random-access Memory<br>~~=~~|
|ROM<br>~~=~~<br>~~ee~~<br>~~ee~~|Read OnlyMemory<br>~~=~~|
|RST<br>~~=~~<br>~~ee~~<br>~~ee~~|Reset<br>~~=~~|
|SAR<br>~~=~~<br>~~ee~~<br>~~a~~<br>~~ee~~|Successive Approximation Register<br>~~=~~|
|SCI<br>~~=~~<br>~~a~~<br>~~ee~~|SerDes Client Interface<br>~~=~~|
|SCL<br>~~=~~<br>~~ee~~<br>~~a~~<br>~~ee~~|Serial Clock<br>~~=~~|
|SDA<br>~~=~~<br>~~ee~~|Serial Data<br>~~=~~|
|SEC<br>~~=~~<br>~~ee~~<br>~~a~~|Soft Error Correction<br>~~=~~<br>~~a~~|
|SED<br>~~=~~<br>~~I~~|Soft Error Detection<br>~~=~~<br>~~I~~|
|SER<br>~~=~~<br>~~I~~<br>~~a~~<br>~~pe~~|Soft Error Rate<br>~~=~~<br>~~I~~<br>~~a~~|
|SEU<br>~~=~~<br>~~a~~<br>~~pe~~|Single Event Upset<br>~~=~~<br>~~a~~|
|SGMII<br>~~=~~<br>~~pe~~<br>~~a~~|Serial Gigabit Media Independent Interface<br>~~=~~|
|SHA<br>~~=~~<br>~~a~~<br>~~a~~|Secure Hash Algorithm<br>~~=~~|
|SLVS<br>~~=~~<br>~~a~~|Scalable Low-Voltage Signaling<br>~~=~~|
|SLVS-EC<br>~~=~~<br>~~a~~<br>~~a~~<br>~~pe~~|Scalable Low-Voltage SignalingEmbedded Clock<br>~~=~~|
|SPI<br>~~=~~<br>~~a~~<br>~~pe~~|Serial Peripheral Interface<br>~~=~~|
|SSPI<br>~~=~~<br>~~pe~~<br>~~a~~|Slave Serial Peripheral Interface<br>~~=~~|
|SPR<br>~~=~~<br>~~a~~<br>~~a~~|Single Port RAM<br>~~=~~|
|SRAM<br>~~=~~<br>~~a~~|Static Random-Access Memory<br>~~=~~|
|TAP<br>~~=~~<br>~~a~~<br>~~a~~|Test Access Port<br>~~=~~|
|TDM<br>~~=~~<br>~~a~~<br>~~a~~<br>~~pe~~|Time Division Multiplexing<br>~~=~~|
|Tx<br>~~=~~<br>~~a~~<br>~~pe~~|Transmitter<br>~~=~~|
|TLP<br>~~=~~<br>~~pe~~<br>~~a~~|Transaction Layer Packet<br>~~=~~|
|UCFG<br>~~=~~<br>~~a~~|User Configuration Space Register Interface<br>~~=~~|
|Rx<br>~~=~~<br>~~a~~<br>~~a~~|Receiver<br>~~=~~<br>|
|WR<br>~~=~~<br>~~aEf~~|Wide Range<br>~~=~~<br>~~Ef~~|
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**CertusPro-NX Family Data Sheet**
## **1. Description**
The CertusPro™-NX family of low-power general purpose FPGAs featuring 10G SerDes, LPDDR4 memory interface support and up to 100k logic cells can be used in a wide range of applications across multiple markets. It is built on the Lattice Nexus FPGA platform, using low-power 28 nm FD-SOI technology. It combines the extreme flexibility of an FPGA with the low power and high reliability (due to extremely low SER) of FD-SOI technology, and offers small footprint package options as well as 0.8 mm and 1.0 mm ball-pitch package options.
CertusPro-NX supports a variety of interfaces including PCI Express® (Gen1, Gen2, and Gen3), Ethernet (up to 10G), SLVS-EC, CoaXPress, eDP/DP, LVDS, Generic 8b10b, LVCMOS (0.9–3.3 V), and more.
Processing features of CertusPro-NX include up to 100k logic cells, 156 multipliers (18 × 18), 7.3 Mb of embedded memory (consisting of EBR and LRAM blocks), distributed memory and DRAM interfaces (supporting DDR3, DDR3L, LPDDR2, and LPDDR4 up to 1066 Mbps × 64bit data width).
CertusPro-NX FPGAs support fast configuration of the reconfigurable SRAM-based logic fabric, ultra-fast configuration of its programmable sysI/O™ and the TransFR™ field upgrade feature. Design security features, such as AES-256 encryption and ECDSA authentication, are also supported. In addition to the high reliability inherent to FD-SOI technology (due to its extremely low SER), active reliability features such as built-in frame-based Soft Error Detection (SED)/Soft Error Correction (SEC) (for SRAM-based logic fabric), and ECC (for EBR and LRAM) are also supported in CertusPro-NX devices. Dual 1 MSPS 12-bit Analog to Digital Convertors (ADCs) are available on-chip for system monitoring functions.
The Lattice Radiant™ design software allows large complex user designs to be efficiently implemented in CertusPro-NX FPGA family. Synthesis library support for CertusPro-NX devices is available for popular logic synthesis tools. Radiant tools use the synthesis tool output along with constraints from its floor planning tools to place and route the user design in CertusPro-NX device. The tools extract timing from the routing and back-annotate it into the design for timing verification.
Lattice provides many pre-engineered Intellectual Property (IP) modules for CertusPro-NX family. By using these configurable soft IP cores as standardized blocks, you are free to concentrate on the unique aspects of user design, increasing productivity.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **1.1. Features**
- Available in Commercial, Industrial, and Automotive temperature grades
- Programmable architecture
- 50k to 100k logic cells
- 96 to 156 multipliers (18 × 18) in sysDSP™ blocks
- 3.8 to 7.3 Mb of embedded memory (including EBR and LRAM)
- 170 to 299 programmable sysI/O (High Performance and Wide Range I/O)
- Programmable sysI/O designed to support wide variety of interfaces
- High Performance (HP) I/O supported on bottom I/O banks
- Supports up to 1.8 V VCCIO
- Mixed voltage support (1.0 V, 1.2 V, 1.5 V, and 1.8 V)
- High-speed differential up to 1.5 Gbps
- Supports LVDS, Soft D-PHY Transmitter (Tx)/Receiver (Rx), LVDS 7:1 Tx/Rx, SLVS Tx/Rx, subLVDS Rx
- Supports SGMII (Gb Ethernet):
- Two channels (Tx/Rx) at 1.25 Gbps
- Dedicated DDR3/DDR3L and LPDDR2/LPDDR4 memory support with DQS logic, up to 1066 Mbps data rate and ×64bit data width
- Wide Range (WR) I/O supported on left, right, and top I/O Banks
- Supports up to 3.3 V VCCIO
- Mixed voltage support: 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V
- Programmable slew rate: slow, medium, and fast
- Controlled impedance mode
- Emulated LVDS support
- Hot Socketing Support
- Embedded SerDes
- From 625 Mbps up to 10.3125 Gbps per channel, with up to 8 channels
- Multiple Protocol PCS support
- PCIe hard IP supports:
- Gen1, Gen2, and Gen3
- Endpoint
- Multi-function up to four functions
- Up to four lanes
- Ethernet
- 10GBASE-R at 10.3125 Gbps
- SGMII at 1.25 Gbps
- XAUI at 3.125 Gbps per lane
- SLVS-EC at 1.25 Gbps, 2.5 Gbps and 5 Gbps
- DP/eDP at 1.62 Gbps (RBR), 2.7 Gbps (HBR), 5.4 Gbps (HBR2) and 8.1 Gbps (HBR3)
- CoaXPress at 1.25 Gbps, 2.5 Gbps, 3.125 Gbps, 5 Gbps and 6.25 Gbps
- Generic 8b10b at multiple data rates
- SerDes-only mode allows direct 8-bit or 10-bit interface to FPGA logic
- Power modes – Low Power mode and High Performance modes
- User selectable
- Low Power mode for power saving and/or thermal challenges
- High Performance mode for faster processing
- Small footprint package options
- 9 mm × 9 mm to 27 mm × 27 mm package size
- Two channels of Clock Data Recovery (CDR) up to 1.25 Gbps to support SGMII on HP I/O
- CDR for Rx
- 8b/10b decoding
- Independent Loss of Lock (LOL) detector for each CDR block
- sysCLOCK™ analog PLLs
- Three in 50k LC, and four in 100k LC
- Six outputs per PLL
- Fractional N
- Programmable and dynamic phase control
- Support spread spectrum clocking
- sysDSP enhanced DSP blocks
- Hardened pre-adder
- Dynamic shift for AI/ML support
- Four 18 × 18, eight 9 × 9, two 18 × 36, or 36 × 36 multipliers
- Advanced 18 × 36, two 18 × 18, or four 8 × 8 MAC per sysDSP blocks
- Flexible memory resources
- Up to 3.7 Mb sysMEM™ Embedded Block RAM (EBR) available
- Programmable width
- Error Correction Coding (ECC)*
- First In First Out (FIFO)
- 344 kbits to 639 kbits distributed RAM
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
- Large RAM Blocks
- 0.5 Mbits per block
- Up to seven (3.5 Mbit total) per device
- Internal bus interface support
- APB control bus
- AHB-Lite for data bus
- AXI4-streaming
- Configuration – Fast, Secure
- SPI – ×1, ×2, ×4 up to 150 MHz
- Master and Slave SPI support
- JTAG
- I[2] C and I3C
- Ultrafast I/O configuration for instant-on support (using Early I/O Release feature)
- Less than 30 ms full device configuration for LFCPNX-100 device
- Cryptographic engine
- Bitstream encryption – using AES-256
- Bitstream authentication – using ECDSA
- Hashing algorithms – SHA, HMAC
- Single Event Upset (SEU) Mitigation Support
- Extremely low Soft Error Rate (SER) due to FD-SOI technology
- Soft Error Detect – Embedded hard macro
- Soft Error Correction – Transparent to user design operation
- Soft Error Injection – Emulate SEU event to debug system error handling
- Dual ADC – 1 MSPS, 12-bit Successive Approximation Register (SAR), with Simultaneous Sampling*
- Three Continuous-time Comparators
- System-level support
- IEEE 1149.1 and IEEE 1532 compliant
- Reveal Logic Analyzer
- On-chip oscillator for device initialization and general use
- 1.0 V core power supply
***** Available in Commercial/Industrial –8 and –9 speed grades and Automotive –7 and –8 speed grades.
- True Random Number Generator
- AES 128/256 Encryption
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**Table 1.1. CertusPro-NX Family Selection Guide**
|**Device**<br>~~DO~~|**LFCPNX-50**<br>~~DO~~|**LFCPNX-100**<br>~~DO~~|
|---|---|---|
|Logic Cells1<br>~~DO~~|52k<br>~~DO~~|96k<br>~~DO~~|
|Embedded Memory (EBR)Blocks(18 kb)<br>~~GC~~|96<br>~~GC~~|208<br>~~GC~~|
|Embedded Memory (EBR)Bits(kb)<br>~~GO~~|1,728<br>~~GO~~|3,744<br>~~GO~~|
|Distributed RAM Bits(kb)<br>~~Ge~~|344<br>~~Ge~~|639<br>~~Ge~~|
|Large Memory (LRAM)Blocks(512 kb)<br>~~GO~~|4<br>~~GO~~|7<br>~~GO~~|
|Large Memory (LRAM)Bits(kb)<br>~~GO~~|2,048<br>~~GO~~|3,584<br>~~GO~~|
|18 X 18 Multipliers<br>~~GC~~|96<br>~~GC~~|156<br>~~GC~~|
|ADC Blocks3<br>~~GO~~|2<br>~~GO~~|2<br>~~GO~~|
|450 MHz High FrequencyOscillator<br>~~Ge~~|1<br>~~Ge~~|1<br>~~Ge~~|
|32 kHz Low Power Oscillator<br>~~GO~~|1<br>~~GO~~|1<br>~~GO~~|
|GPLL<br>~~GO~~|3<br>~~GO~~|4<br>~~GO~~|
|PCIe Gen3 hard IP|1|14|
|SerDes(Quad/Channels)<br>~~GO~~|1/4<br>~~GO~~|2/82<br>~~GO~~|
|**Packages(Size, Ball Pitch)**<br>~~GO~~<br>~~Ge~~|**Total I/O(Wide Range, High Performance, ADC6)/SerDes Lanes**<br>~~GO~~<br>~~Ge~~||
|ASG256(9 mm × 9 mm, 0.5 mm)<br>~~GC~~|165(75, 84, 6)/4<br>~~GC~~|165(75, 84, 6)/4<br>~~GC~~|
|CBG256(14 mm × 14 mm, 0.8 mm)<br>~~Ge~~|165(75, 84, 6)/4<br>~~Ge~~|165(75, 84, 6)/4<br>~~Ge~~|
|BBG484(19 mm × 19 mm, 0.8 mm)7<br>~~eG~~|269(167, 96, 6)/4<br>~~eG~~|305(167, 132, 6)/8<br>~~eG~~|
|BFG484(23 mm × 23 mm, 1.0 mm)8<br>~~eG~~<br>~~eG~~|269(167, 96, 6)/45<br>~~eG~~<br>~~eG~~|305(167, 132, 6)/45<br>~~eG~~<br>~~eG~~|
|LFG672(27 mm × 27 mm, 1.0 mm) <br>~~eG~~<br>~~DC~~|—<br>~~eG~~<br>~~DC~~|305(167, 132, 6)/85<br>~~eG~~<br>~~DC~~|
## **Notes:**
1. Logic Cells = LUTs × 1.2 effectiveness.
2. Some packages only with one Quad and four channels.
3. Available in Commercial/Industrial –8 and –9 speed grades and Automotive –7 and –8 speed grades.
4. For LFCPNX-100, PCIe Link Layer of Hard IP is only applicable to QUAD0.
5. Only available in Commercial and Industrial temperature grades.
6. Each ADC pin count reflects using dedicated complement pair and VRef.
7. BBG package can support SerDes standards with data rate up to 6.25 Gbps.
8. BFG package can support SerDes standards with data rate up to 5.5 Gbps.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **2. Architecture**
## **2.1. Overview**
Each CertusPro-NX device contains an array of logic blocks surrounded by Programmable I/O Cells (PIC). Interspersed between the rows of logic blocks are rows of sysMEM Embedded Block RAM (EBR) and rows of sysDSP Digital Signal Processing blocks, as shown in Figure 2.1 and Figure 2.2. For example, the LFCPNX-100 devices have three rows of DSP blocks and contain four rows of sysMEM EBR blocks. In addition, LFCPNX-100 devices include seven large SRAM blocks. The sysMEM EBR blocks are large, dedicated 18 kbits fast memory blocks and have built-in ECC and FIFO support. Each sysMEM block can be configured to a single, pseudo dual or true dual port memory in a variety of depths and widths as RAM or ROM. Each DSP block supports a variety of multiplier and adder configurations with one 108-bit or two 54-bit accumulators supported, which are the building blocks for complex signal processing capabilities.
Each PIC block encompasses two PIOs (PIO pairs) with their respective sysI/O buffers. The sysI/O buffers of the CertusPro-NX devices are arranged in eight banks allowing the implementation of a wide variety of I/O standards. The Wide Range (WR) I/O banks that are located on the top, left and right sides of the device provide flexible ranges of general purpose I/O configurations up to 3.3 V VCCIO. The banks located on the bottom side of the device are dedicated to High Performance (HP) interfaces such as LVDS, MIPI, DDR3, LPDDR2, and LPDDR4 supporting up to 1.8 V VCCIO.
The Programmable Functional Unit (PFU) contains the building blocks for logic, arithmetic, RAM, and ROM functions. The PFU block is optimized for flexibility, allowing complex designs to be implemented quickly and efficiently. Logic Blocks are arranged in a two-dimensional array. The registers in the PFU and sysI/O blocks in CertusPro-NX devices can be configured to be SET or RESET. After power up and device configuration, it enters into user mode with these registers SET/RESET according to the user design, allowing the device to power up in a known state for predictable system function.
The CertusPro-NX FPGAs feature up to 8 embedded 10 Gbps SerDes channels. Each SerDes channel contains independent 8b/10b encoding/decoding, polarity adjust and elastic buffer logic. Each group of four SerDes channels, along with its Physical Coding Sublayer (PCS) block, creates a Quad. The functionality of the SerDes/PCS Quads can be controlled by SRAM cell settings during device configuration or by registers that are addressable during device operation. The registers in every Quad can be programmed via the Lattice Memory Mapped Interface (LMMI). These Quads (up to two) are located at the top of the device. The FPGA also includes one hard PCIe link layer IP block which supports PCIe Gen1, Gen2, and Gen3.
In addition, CertusPro-NX devices provide various system level functional and interface hard IP such as I[2] C, SGMII/CDR, and ADC blocks. CertusPro-NX devices also provide security features to help protect user designs and deliver more robust reliability by offering the enhanced frame-based SED/SEC functions.
Other blocks provided include PLLs, DLLs, and configuration functions. The PLL and DLL blocks are located at the corners of each device. CertusPro-NX devices also include LMMI, which is a Lattice standard interface for simple read and write operations to control the internal IP.
Every device in the family has a JTAG port. This family also provides an on-chip oscillator and soft error detection (SED) capability. The CertusPro-NX devices use 1.0 V as their core voltage.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [452 x 324] intentionally omitted <==**
**----- Start of picture text -----**<br>
PLL SERDES/PCS X4 PCIe LL(X4+X1 ) I/O Bank (Bank 0) OSC Configuration & Security<br>Large<br>RAM<br>I/O Bank I/O Bank<br>(Bank 7) (Bank 1)<br>ALU<br>Large<br>RAM<br>I/O Bank<br>(Bank 6) I/O Bank<br>(Bank 2)<br>ADC<br>(2Ch)<br>CDR<br>(2Ch)<br>PLL I/O Bank (Bank 5) I/O Bank (Bank 4) I/O Bank (Bank 3) PLL<br>**----- End of picture text -----**<br>
**Figure 2.1. Simplified Block Diagram, LFCPNX-50 Device (Top Level)**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [450 x 362] intentionally omitted <==**
**----- Start of picture text -----**<br>
PLL SERDES/PCS X4 PCIe LL(X4+X1) SERDES/PCS X4 LargeRAM LargeRAM LargeRAM LargeRAM I/O Bank (Bank 0) OSC Configuration & Security PLL<br>Large<br>RAM<br>I/O Bank I/O Bank<br>(Bank 7) (Bank 1)<br>ALU<br>Large<br>RAM<br>I/O Bank<br>(Bank 6) Large I/O Bank<br>RAM (Bank 2)<br>ADC<br>(2Ch)<br>CDR<br>(2Ch)<br>PLL I/O Bank (Bank 5) I/O Bank (Bank 4) I/O Bank (Bank 3) PLL<br>**----- End of picture text -----**<br>
**Figure 2.2. Simplified Block Diagram, LFCPNX-100 Device (Top Level)**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **2.2. PFU Blocks**
The core of the CertusPro-NX device consists of PFU blocks. Each PFU block consists of four interconnected slices numbered 0–3, as shown in Figure 2.3. Each slice contains two LUTs. All the interconnections to and from PFU blocks are from routing.
The PFU block can be used to perform Logic, Arithmetic, Distributed RAM or ROM functions. Table 2.1 shows the functions each slice can perform in either Distributed SRAM or non-Distributed SRAM modes.
**==> picture [411 x 246] intentionally omitted <==**
**----- Start of picture text -----**<br>
From<br>Routing<br>+<br>LUT4 & LUT4 & LUT4 & LUT4 & LUT4 & LUT4 & LUT4 & LUT4 &<br>CARRY CARRY CARRY CARRY CARRY CARRY CARRY CARRY<br>i - i e rk ee a<br>Slice 0 Slice 1 Slice 2 Slice 3<br>D D D D D D D D<br>FF FF FF FF FF FF FF FF<br>UE EEE<br>To<br>Routing<br>=<br>Figure 2.3. PFU Diagram<br>**----- End of picture text -----**<br>
## **2.2.1. Slice**
Each slice contains two LUT4s feeding two registers. In Distributed SRAM mode, Slice 0 and Slice 1 are configured as distributed memory and Slice 2 is not available as it is used to support Slice 0 and Slice 1, while Slice 3 is available as Logic or ROM. Table 2.1 shows the capability of the slices along with the operation modes they can enable. In addition, each Slice contains logic that allows the LUTs to be combined to perform a LUT5 function. There is control logic to perform set/reset functions (programmable as synchronous/asynchronous), clock select, chip-select, and wider RAM/ROM functions.
**Table 2.1. Resources and Modes Available per Slice**
|**Slice**|**PFU(Used as Distributed SRAM)**|**PFU(Used as Distributed SRAM)**|**PFU(Not used as Distributed SRAM)**|**PFU(Not used as Distributed SRAM)**|
|---|---|---|---|---|
||**Resources**|**Modes**|**Resources**|**Modes**|
|Slice 0|2 LUT4s and 2 Registers|RAM|2 LUT4s and 2 Registers|Logic, Ripple, ROM|
|Slice 1|2 LUT4s and 2 Registers|RAM|2 LUT4s and 2 Registers|Logic, Ripple, ROM|
|Slice 2|2 LUT4s and 2 Registers|RAM|2 LUT4s and 2 Registers|Logic, Ripple, ROM|
|Slice 3|2 LUT4s and 2 Registers|Logic, Ripple, ROM|2 LUT4s and 2 Registers|Logic, Ripple, ROM|
Figure 2.4 shows an overview of the internal logic of the slice. The registers in the slice can be configured for positive or negative edge clocking.
Each slice has 17 input signals: 16 signals from routing and one from the carry-chain (from the adjacent slice or PFU). Three of them are used for FF control and shared between two slices (0/1 or 2/3). There are five outputs: four to routing and one to carry-chain (to the adjacent PFU). Signals associated with all the slices can be found in Figure 2.4 and Table 2.2. Figure 2.5 shows the slice signals that support a LUT5 or two LUT4 functions. F0 can be configured to have a LUT4 or LUT5 output, while F1 can be configured as a LUT4 output only.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [381 x 550] intentionally omitted <==**
**----- Start of picture text -----**<br>
FCO<br>(To different SLICE/PFU)<br>A1<br>B1 F1<br>LUT5<br>C1 LUT4 and F0<br>D1 Carry<br>DI1 Q1<br>M1<br>FF<br>A0<br>B0<br>C0 LUT4<br>D0<br>DI0 Q0<br>M0/SEL<br>FF<br>Common to<br>SLICE 0/1 OR 2/3<br>CE<br>FF<br>CLKIN<br>CTRL<br>LSR<br>(From different SLICE/PFU)<br>FCI<br>*Note: In RAM mode, LUT4s use the following signals:<br> QWD0/1<br> QWDN0/1<br> QWAS00~03, QWAS10~13<br>**----- End of picture text -----**<br>
**Figure 2.4. Slice Diagram**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [376 x 120] intentionally omitted <==**
**----- Start of picture text -----**<br>
A1<br>F1<br>B1<br>LUT4<br>C1<br>D1<br>1<br>F0<br>0<br>**----- End of picture text -----**<br>
**==> picture [15 x 8] intentionally omitted <==**
**----- Start of picture text -----**<br>
SEL<br>**----- End of picture text -----**<br>
**==> picture [371 x 81] intentionally omitted <==**
**----- Start of picture text -----**<br>
A0<br>B0<br>LUT4<br>C0 Note: In RAM mode, LUT4s use the following signals:<br>QWD0/1<br>D0 QWDN0/1<br>QWAS00~03, QWAS10~13<br>**----- End of picture text -----**<br>
**Figure 2.5. Slice Configuration for LUT4 and LUT5**
**Table 2.2. Slice Signal Descriptions[1]**
|**Function**<br>~~eG~~<br>~~eG~~|**Type **<br>~~eG~~<br>~~eG~~|**Signal Names**<br>~~eG~~<br>~~eG~~|**Description**<br>~~Ge~~<br>~~Ge~~|
|---|---|---|---|
|Input<br>~~eG~~<br>~~eG~~|Data signal<br>~~eG~~<br>~~eG~~|A0, B0, C0, D0<br>~~eG ~~<br>~~eG~~|Inputs to LUT4.<br> ~~Ge~~<br>~~Ge~~|
|Input<br>~~eG~~<br>~~Ge~~|Data signal<br>~~eG~~<br>~~Ge~~|A1, B1, C1, D1<br>~~eG ~~<br>~~Ge~~|Inputs to LUT4.<br> ~~Ge~~<br>~~Ge~~|
|Input<br>~~Ge~~<br>~~OG~~|Data signal<br>~~Ge~~<br>~~OG~~|M0, M1<br>~~Ge~~<br>~~OG~~|Direct input to FF from fabric.<br>~~Ge~~<br>~~OG~~|
|Input<br>~~OG~~<br>~~OG~~<br>~~Ce~~|Control signal<br>~~OG~~<br>~~OG~~<br>~~Ce~~|SEL<br>~~OG~~<br>~~OG~~<br>~~Ce~~|LUT5 mux control input.<br>~~OG~~<br>~~OG~~<br>~~Ge~~|
|Input<br>~~OG~~<br>~~Ce~~<br>~~Ge~~|Data signal<br>~~OG~~<br>~~Ce~~<br>~~Ge~~|DI0, DI1<br>~~OG~~<br>~~Ce~~<br>~~Ge~~|Inputs to FF from LUT4 F0/F1 outputs.<br>~~OG~~<br>~~Ge~~<br>~~Ge~~|
|Input<br>~~Ce~~<br>~~Ge~~<br>~~Ge~~|Control signal<br>~~Ce~~<br>~~Ge~~<br>~~Ge~~|CE<br>~~Ce ~~<br>~~Ge~~<br>~~Ge~~|Clock Enable.<br> ~~Ge~~<br>~~Ge~~<br>~~Ge~~|
|Input<br>~~Ge~~<br>~~Ge~~|Control signal<br>~~Ge~~<br>~~Ge~~|LSR<br>~~Ge ~~<br>~~Ge~~|Local Set/Reset.<br> ~~Ge~~<br>~~Ge~~|
|Input<br>~~Ge~~<br>~~Ge~~|Control signal<br>~~Ge~~<br>~~Ge~~|CLKIN<br>~~Ge ~~<br>~~Ge~~|System Clock.<br> ~~Ge~~<br>~~Ge~~|
|Input<br>~~Ge~~<br>~~OG~~<br>~~Ce~~|Inter-PFU signal<br>~~Ge~~<br>~~OG~~<br>~~Ce~~|FCI<br>~~Ge~~<br>~~OG~~<br>~~Ce~~|Fast Carry-in.<br>~~Ge~~<br>~~OG~~<br>~~Ge~~|
|Output<br>~~OG~~<br>~~Ce~~<br>~~Ge~~|Data signals<br>~~OG~~<br>~~Ce~~<br>~~Ge~~|F0<br>~~OG~~<br>~~Ce~~<br>~~Ge~~|LUT4/LUT5 output signal.<br>~~OG~~<br>~~Ge~~<br>~~Ge~~|
|Output<br>~~Ce~~<br>~~Ge~~<br>~~Ge~~|Data signals<br>~~Ce~~<br>~~Ge~~<br>~~Ge~~|F1<br>~~Ce ~~<br>~~Ge~~<br>~~Ge~~|LUT4 output signal.<br> ~~Ge~~<br>~~Ge~~<br>~~Ge~~|
|Output<br>~~Ge~~<br>~~Ge~~|Data signals<br>~~Ge~~<br>~~Ge~~|Q0, Q1<br>~~Ge ~~<br>~~Ge~~|Register outputs.<br> ~~Ge~~<br>~~Ge~~|
|Output<br>~~Ge~~<br>~~a~~|Inter-PFU signal<br>~~Ge~~<br>~~F~~|FCO<br>~~Ge ~~<br>~~F~~|Fast carrychain output.<br> ~~Ge~~|
**Note** :
1. See Figure 2.4 for connection details.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-DS-02086-2.0
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**CertusPro-NX Family Data Sheet**
## **2.2.2. Modes of Operation**
Slices 0-2 have up to four potential modes of operation: Logic, Ripple, RAM, and ROM. Slice 3 is not needed for the RAM mode. It can be used in Logic, Ripple, or ROM mode.
## **Logic Mode**
In Logic mode, the LUTs in each slice are configured as 4-input combinatorial lookup tables. A LUT4 can have 16 possible input combinations. Any four input logic functions can be generated by programming this lookup table. Since there are two LUT4s per slice, an LUT5 can be constructed within one slice.
## **Ripple Mode**
The Ripple mode supports the efficient implementation of small arithmetic functions. In the Ripple mode, the following functions can be implemented by each slice:
- Addition 2-bit
- Subtraction 2-bit
- Add/Subtract 2-bit using dynamic control
- Up counter 2-bit
- Down counter 2-bit
- Up/Down counter with asynchronous clear 2-bit using dynamic control
- Up/Down counter with preload (sync) 2-bit using dynamic control
- Comparator functions of A and B inputs 2-bit
- A greater-than-or-equal-to B
- A not-equal-to B
- A less-than-or-equal-to B
- Up/Down counter with A greater-than-or-equal-to B comparator 2-bit using dynamic control
- Up/Down counter with A less-than-or-equal-to B comparator 2-bit using dynamic control
- Multiplier support Ai×Bj+1 + Ai+1×Bj in one logic cell with two logic cells per slice
- Serial divider 2-bit mantissa, shift 1 bit/cycle
- Serial multiplier 2-bit, shift 1 bit/cycle or 2 bits/cycle
The Ripple mode includes an optional configuration that performs arithmetic using fast carry chain methods. In this configuration (also referred to as CCU2 mode), two additional signals, Carry Generate and Carry Propagate, are generated on a per-slice basis to allow fast arithmetic functions to be constructed by concatenating Slices.
## **RAM Mode**
In the RAM mode, a 16 × 4-bit distributed single or pseudo dual port RAM can be constructed in one PFU using each LUT block in Slice 0 and Slice 1 as a 16 × 2-bit memory in each slice. Slice 2 is used to provide memory address and control signals. The CertusPro-NX devices support distributed memory initialization.
The Lattice design tools support the creation of a variety of different sized memories. Where appropriate, the software constructs these using distributed memory primitives that represent the capabilities of the PFU. Table 2.3 lists the number of slices required to implement different distributed RAM primitives. For more information about using RAM in CertusPro-NX devices, refer to Memory Usage Guide for Nexus Platform (FPGA-TN-02094).
## **Table 2.3. Number of Slices Required to Implement Distributed RAM[1]**
||**SPR 16 × 4**|**PDPR 16 × 4**|
|---|---|---|
|Number of slices|3|3|
**Note** :
1. SPR = Single Port RAM, PDPR = Pseudo Dual Port RAM
## **ROM Mode**
The ROM mode uses the LUT logic; hence, Slice 0 through Slice 3 can be used in ROM mode. Preloading is accomplished through the programming interface during PFU configuration.
For more information, refer to Memory Usage Guide for Nexus Platform (FPGA-TN-02094).
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**CertusPro-NX Family Data Sheet**
## **2.3. Routing**
There are many resources provided in the CertusPro-NX devices to route signals individually or as buses with related control signals. The routing resources consist of switching circuitry, buffers, and metal interconnect (routing) segments.
The CertusPro-NX family has an enhanced routing architecture that produces a compact design. Lattice Radiant software tool takes the output of the synthesis tool and places and routes the design.
## **2.4. Clocking Structure**
The CertusPro-NX clocking structure consists of clock synthesis blocks (sysCLOCK PLLs), balanced clock tree networks (PCLK and ECLK) and efficient clock logic modules: Clock Dividers (PCLKDIV and ECLKDIV), Dynamic Clock Select (DCS), Dynamic Clock Control (DCC), and DDRDLLs. Each of these functions is described as follows.
## **2.4.1. Global PLL**
The Global PLLs (GPLL) provide the ability to synthesize clock frequencies. The devices in the CertusPro-NX family support three to four full-featured general purpose GPLLs.
The architecture of the GPLL is shown in Figure 2.6. A description of the GPLL functionality follows.
1. REFCLK is the reference frequency input to the PLL. The REFCLK source can come from external CLK inputs or from internal routing. The CLKI input feeds into the input Clock Divider block.
2. CLKFB is the feedback signal to the GPLL, which can come from a path internal to the PLL or from FPGA routing. The feedback divider is used to multiply the reference frequency and thus synthesize a higher or lower frequency clock output.
3. The PLL has six clock outputs, CLKOP, CLKOS, CLKOS2, CLKOS3, CLKOS4, and CLKOS5. Each output has its own output divider, thus allowing the GPLL to generate different frequencies for each output. The output dividers can have a value from 1 to 128. Each GPLL output can be used to drive the primary clock. Each bottom side GPLL output can be used to drive the edge clock networks.
4. The setup and hold times of the device can be improved by programming a phase shift into the output clocks which advances or delays the output clock with reference to the un-shifted output clock. This phase shift can be either programmed during the configuration or can be adjusted dynamically using the DIRSEL, DIR, DYNROTATE, and LOADREG ports.
5. The LOCK signal is asserted when the GPLL determines it has achieved lock and de-asserted if a loss of lock is detected. The LOCK signal is asynchronous to the PLL clock outputs.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [376 x 299] intentionally omitted <==**
**----- Start of picture text -----**<br>
REFCLK (To bypass muxes)<br>Lock LOCK<br>Detect<br>VCO CLKOP<br>Divider CLKOP<br>(1-128)<br>CLKI Divider MREFCLK Phase VCO CLKOS<br>Detector, Divider CLKOS<br>VCO, and (1-128)<br>Mash Loop Filter<br>Modulator VCO CLKOS2<br>Divider CLKOS2<br>FBKSEL (1-128)<br>CLKFB Feedback<br>Divider N VCO CLKOS3<br>Divider CLKOS3<br>(1-128)<br>PHASESEL[1:0] Dynamic VCO CLKOS4Divider CLKOS4<br>PHASEDIR Phase (1-128)<br>PHASESTEP Adjust<br>PHASELOADREG<br>VCO CLKOS5<br>Divider CLKOS5<br>(1-128)<br>Internal Feedback<br>CLKOP, CLKOS, CLKOS2-5<br>ENCLKOP<br>ENCLKOS<br>ENCLKOS2<br>— — — ll<br>ENCLKOS3<br>ENCLKOS4<br>ENCLKOS5<br>RST<br>PLLPD_EN_N<br>**----- End of picture text -----**<br>
**Figure 2.6. General Purpose PLL Diagram**
For more details on the PLL, refer to the sysCLOCK PLL Design and Usage Guide for Nexus Platform (FPGA-TN-02095).
## **2.4.2. Clock Distribution Network**
There are two main clock distribution networks for any member of the CertusPro-NX product family, namely Primary Clock (PCLK) and Edge Clock (ECLK). These clock networks can be driven from many different sources, such as Clock Pins, PLL outputs, DLLDEL outputs, Clock Divider outputs, SerDes/PCS clocks, and user logic. There are Clock Divider blocks, ECLKDIV and PCLKDIV, to provide a slower clock from these clock sources.
CertusPro-NX family supports glitchless Dynamic Clock Control (DCC) for the PCLK Clock to save dynamic power. There are also Dynamic Clock Selection logic to allow a glitchless selection between two clocks for the PCLK network (DCS). An overview of the Clocking network for the CertusPro-NX device is shown in Figure 2.7. The Upper Right PLL in Figure 2.7 is only for LFCPNX-100 Logic Cell devices.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [459 x 276] intentionally omitted <==**
**----- Start of picture text -----**<br>
PLL SerDes BANK 0 PCLK OSC PLL<br>6 2 2 6<br>ee<br>TMID<br>16 DCC<br>16 Primary Sources<br>Primary Primary<br>Clocks 16 Fabric Fabric 16 Clocks<br>Entry Entry<br>12 12 Primary Sources MUXDCS MUXDCS 12 Primary Sources 12<br>12 DCC 12 DCC<br>DCS DCS<br>MUX MUX<br>if 16 Fabric Entry Fabric Entry 16 nk<br>Primary Primary<br>Clocks 18 Primary Sources Clocks<br>li 18 DCC<br>BMID<br>7 L<br>6 4 4 4 4 4 4 6<br>PLL BANK 5 PCLK ECLK BANK 4 PCLK ECLK BANK 3 PCLK ECLK PLL<br>Sores) oe Soc<br>3<br>BANK 1 PCLK<br>RMID<br>3<br>BANK 2 PCLK<br>3<br>BANK 7 PCLK<br>LMID<br>3<br>BANK 6 PCLK<br>CDR<br>**----- End of picture text -----**<br>
**Figure 2.7. Clocking Network**
## **2.4.3. Primary Clocks**
The CertusPro-NX device family provides low-skew, high fan-out clock distribution to all synchronous elements in the FPGA fabric through the Primary Clock Network. The CertusPro-NX PCLK clock network is a balanced clock structure which is designed to minimize the clock skew across all destinations in the FPGA core.
The primary clock network is divided into four clock domains. Each of these domains has 16 clocks that can be distributed to the fabric in the domain.
The Lattice Radiant software can automatically route each clock to one of the domains up to a maximum of 16 clocks per domain. The user can change how the clocks are routed by specifying a preference in the Lattice Radiant software to locate the clock to a specific domain. The CertusPro-NX device provides the user with a maximum of 64 unique clock input sources that can be routed to the primary Clock network.
Primary clock sources are:
- Dedicated clock input pins
- PLL outputs
- PCLKDIV, ECLKDIV outputs
- Internal FPGA fabric entries (with minimum general routing)
- SGMII-CDR, SerDes/PCS clocks
- OSC clock
These sources routed to each of the four clock switches are called Mid Mux. They are LMID, RMID, TMID, and BMID. The outputs of the Mid MUX are routed to the center of the FPGA where additional clock switches (DCS MUX) are used to route the primary clock sources to primary clock distribution to the CertusPro-NX fabric. These routing multiplexers are shown in Figure 2.7. Potentially there are 64 unique clock domains that can be used in the CertusPro-NX device. For more information about the primary clock tree and connections, refer to sysCLOCK PLL Design and Usage Guide for Nexus Platform (FPGA-TN-02095).
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **2.4.4. Edge Clock**
CertusPro-NX FPGAs have a number of high-speed edge clocks that are intended for use with the PIO in the implementation of high-speed interfaces. There are four ECLK networks per bank I/O on the bottom side of the device. The Edge clock network is powered by a separate power domain (to reduce power noise injection from the core and reduce overall noise induced jitter) while controlled by the same logic that gates the FPGA core and PCLK domains for power management.
Each Edge Clock can be sourced from the following:
- Dedicated PIO Clock input pins (PCLK)
- DLLDEL output (PIO Clock delayed by 90°)
- Bottom PLL outputs (CLKOP, CLKOS, CLKOS2, CLKOS3, CLKOS4, and CLKOS5)
- Internal Nodes
Figure 2.8 illustrates various ECLK sources. Bank 3 is an ECLK source example. Bank 4 and Bank 5 are similar.
**==> picture [404 x 167] intentionally omitted <==**
**----- Start of picture text -----**<br>
Bank 3 PCLK From Banks 4, 5<br>Pin (even) 2 ECLKSYNC<br>DLLDEL<br>Bottom 6<br>Left GPLL<br>Bank 3 ECLK<br>Tree<br>From Fabric<br>ECLKSYNC<br>ECLKDIV BMID<br>Bottom 6<br>Right GPLL<br>Bank 3 PCLK 2<br>Pin (odd)<br>To Banks 4,5 Muxes<br>**----- End of picture text -----**<br>
**Figure 2.8. Edge Clock Sources per Bank**
The edge clocks have low injection delay and low skew. They are typically used for DDR Memory or Generic DDR interfaces. For detailed information on Edge Clock connections, refer to sysCLOCK PLL Design and Usage Guide for Nexus Platform (FPGA-TN-02095).
## **2.4.5. Clock Dividers**
CertusPro-NX FPGAs have two distinct types of clock divider, Primary and Edge. There are two (2) Primary Clock Dividers (PCLKDIV) which are located in the DCS_CMUX block(s) and at the center of the device. There are 12 ECLKDIV dividers per device, which are located near the bottom high-speed I/O banks.
PCLKDIV supports ÷2, ÷4, ÷8, ÷16, ÷32, ÷64, ÷128, and ÷1 (bypass) operation. As shown in Figure 2.9, the PCLKDIV is fed from a DCSMUX within the DCS_CMUX block. The clock divider output drives one input of the Dynamic Clock Select (DCS) within the DCS_CMUX block. The Reset (RST) control signal is asynchronous and forces all outputs to low. The divider output starts at the next cycle after the reset is synchronously released.
ECLKDIV, as shown in Figure 2.8, is intended to generate a slower-speed system clock from a high-speed edge clock. The block operates in a ÷2, ÷3.5, ÷4, or ÷5 mode and maintains a known phase relationship between the divided down clock and the high-speed clock based on the release of its reset signal. The ECLKDIV can be fed from selected PLL outputs, external primary clock pins (with or without DLLDEL Delay) or from routing. The clock divider outputs feed into the Bottom Mid-mux (BMID). The Reset (RST) control signal is asynchronous and forces all outputs to low. The divider output starts at the next cycle after the reset is synchronously released.
For further information on clock dividers, refer to sysCLOCK PLL Design and Usage Guide for Nexus Platform (FPGA-TN-02095).
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **2.4.6. Clock Center Multiplexer Blocks**
All clock sources are selected and combined for primary clock routing through the Dynamic Clock Selector Center Multiplexer logic (DCS_CMUX). There is one DCS_CMUX block per device. The DCS_CMUX block contains four DCSMUX blocks, two PCLKDIV, two DCS blocks, and four CMUX blocks. See Figure 2.9 for a representative DCS_CMUX block diagram.
The heart of the DCS_CMUX is the Center Multiplexer (CMUX) block. It can accept up to 64 feed clock sources, Mid-muxes RMID, LMID, TMID, BMID, and DCC to drive up to 16 primary clock trunk lines.
**==> picture [476 x 319] intentionally omitted <==**
**----- Start of picture text -----**<br>
There are two Dynamic Clock Select (DCS) blocks in the DCS_CMUX. For each DCS block, there can be up to two clock<br>inputs. Only one of the two clock inputs can be driven by the Primary Clock Divider (PCLKDIV). For more information<br>about the DCS_CMUX, refer to sysCLOCK PLL Design and Usage Guide for Nexus Platform (FPGA-TN-02095).<br>16 16 16 16<br>16x (partial 16x (partial 16x (partial 16x (partial<br>(16/64):1) (16/64):1) (16/64):1) (16/64):1)<br>CMUX CMUX CMUX CMUX<br>16 16 16 16<br>DCS_CMUX dcs2cmux0 dcs2cmux1<br>; DCS Te DCS<br>62 dcs1 dcs0 dcs3 dcs2<br>PCLKDIV PCLKDIV<br>DCSMUX(62:1) DCSMUX(62:1) DCSMUX(62:1) DCSMUX(62:1)<br>62 62 62 62<br>62 62 62 62<br>62<br>‘gs<br>Figure 2.9. DCS_CMUX Block Diagram<br>2.4.7. Dynamic Clock Select<br>**----- End of picture text -----**<br>
The Dynamic Clock Select (DCS) is a smart multiplexer function available in the primary clock routing. It switches between two independent input clock sources. Depending on the operational modes, DCS switches between two independent input clock sources either with or without any glitches. This is achieved regardless of when the selected signal is toggled. Both input clocks must be running to achieve a functioning glitchless DCS output clock, but running clocks are not required when being used as a normal non-glitchless clock multiplexer.
Two DCS blocks per device feed all clock domains. The DCS blocks are located in the DCS_CMUX block. The inputs to the DCS blocks come from MIDMUX outputs and user logic clocks via DCC elements. The DCS elements are located at the center of the PLC array core. The output of the DCS is connected to the inputs of Primary Clock Center MUXs (CMUX).
Figure 2.10 shows the timing waveforms of the default DCS operating mode. The DCS block can be programmed to other modes. For more information about the DCS, refer to sysCLOCK PLL Design and Usage Guide for Nexus Platform (FPGA-TN-02095).
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [329 x 192] intentionally omitted <==**
**----- Start of picture text -----**<br>
CLK0<br>clk0<br>pos<br>CLK1<br>SA<br>clk1 clk1<br>pos neg<br>SEL<br>clk0<br>neg<br>DCSOUT<br>5<br>**----- End of picture text -----**<br>
**Figure 2.10. DCS Waveforms**
## **2.4.8. Dynamic Clock Control**
The Dynamic Clock Control (DCC), Domain Clock enable/disable feature allows internal logic control of the domain primary clock network. When a clock network is disabled, the clock signal is static and does not toggle. All the logic fed by that clock also does not toggle, reducing the overall power consumption of the device. The disable function is glitchless, and does not increase the clock latency to the primary clock network.
Four additional DCC elements control the clock inputs from the CertusPro-NX domain logic to the Center MUX elements (DSC_CMUX).
This DCC controls the clock sources from the Primary CLOCK MIDMUX before they are fed to the Primary Center MUXs that drive the domain clock network. For more information about the DCC, refer to sysCLOCK PLL Design and Usage Guide for Nexus Platform (FPGA-TN-02095).
## **2.4.9. DDRDLL**
CertusPro-NX has two identical DDRDLL blocks located in the lower left and the lower right corners of the device. Each DDRDLL, the master DLL block, can generate a 9-bit phase shift value corresponding to a 90-degree phase shift of the reference clock input, and provide this value to every DQS block and DLLDEL slave delay element. The reference clock can be from either PLL or an input pin. The DQSBUF uses this value to control the delay of the DQS inputs from a DDR memory interface to achieve a 90-degree shift in order to clock DQ inputs at the center of the data eye.
The code is also sent to another slave DLL, DLLDEL, which takes a primary clock input and generates a 90-degree shift clock output to drive the clocking structure. This is useful to interface edge-aligned Generic DDR, where 90-degree clocking needs to be created. Not all primary clock inputs have associated DLLDEL control. Figure 2.11 shows DDRDLL connectivity to a DLLDEL block. The connectivity to DQSBUF blocks is similar.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [427 x 181] intentionally omitted <==**
**----- Start of picture text -----**<br>
To both BMID and<br>ECLKINMUX<br>PCLK Input<br>+<br>- DLLDEL<br>9 Right DDRDLL<br>9<br>Left DDRDLL<br>code1 code2<br>**----- End of picture text -----**<br>
**Figure 2.11. DLLDEL Function Diagram**
Each DDRDLL can generate a delay value based on the reference clock frequency. The slave DLLs (DQSBUF and DLLDEL) use the value (code) to either create phase shifted inputs from the DDR memory or create a 90-degree shifted clock. Figure 2.12 shows the connections between the DDRDLL and the slave DLLs.
**==> picture [472 x 169] intentionally omitted <==**
**----- Start of picture text -----**<br>
Left Right<br>DDRDLL DDRDLL<br>| |<br>Digital Delay Code (L) Digital Delay Code (R)<br>Refclk Sel Refclk Sel<br>DLLDEL DQS0 DQS1 ... DLLDEL DQS0 DQS1 ... DLLDEL DQS0 DQS1 ...<br>BANK5 ECLK BANK4 ECLK BANK3 ECLK<br>Figure 2.12. CertusPro-NX DDRDLL Architecture<br>bel | iil iil<br>**----- End of picture text -----**<br>
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **2.5. SGMII TX/RX**
The CertusPro-NX device utilizes different components/resources for the transmit and receive paths of SGMII. For the SGMII transmit path, Generic DDR I/O with X5 gearing are used. For more information, refer to GDDRX5_TX.ECLK.Aligned interface on the CertusPro-NX High-Speed I/O Interface (FPGA-TN-02244).
For the SGMII receive path, one of the two available hardened CDR (Clock and Data Recovery) Components can be used. There are three main blocks in each CDR: the CDR, deserializer, and FIFO. Each CDR features two loops. The first loop is locked to the reference clock. Once locked, the loop switches to the data path loop where the CDR tracks the data signals to generate the correcting signals that are needed to achieve and maintain phase lock with the data. The data is then passed through a deserializer which deserializes the data to 10-bit parallel data. The 10-bit parallel data is then sent to the FIFO bridge, which allows the CDR to interface with the rest of the FPGA.
Figure 2.13 shows a block diagram of the SGMII CDR IP.
The two hardened blocks are located at the bottom left of the chip and use the high speed I/O Bank 5 for the differential pair input. It is recommended that the reference clock should be entered through a GPIO that has connection to the PLL on the lower left corner as well.
For more information about how to implement the hardened CDR for SGMII solution, refer to the SGMII and Gb Ethernet PCS IP Core (FPGA-IPUG-02077).
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SGMII CDR IP<br>**----- End of picture text -----**<br>
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lmmi_dk<br>lmmi_request<br>|<br>lmmi_wrdn<br>lmmi_rdata[7:0]<br>lmmi_offset[3:0]<br>lmmi_rdata_valid<br>lmmi_wdata[7:0] ——|ne | lmmi_ready<br>lmmi_reset<br>ip_ready<br>||<br>sgmii_cdr_icnst<1:0> : )<br>x| rxd<9:0> sgmii_rxd<9:0><br>sgmii_in rxd_des<br>DUAL_LOOP<br>DESERIALIZER FIFO<br>- CDR<br>rclk_des<br>dco_calib_rst | |<br>dco_facq_rst |<br>rrst | |<br>|<br>| |<br>| sgmii_pclk<br>sgmii_refclk(125 MHz)<br>| |<br>| sgmii_rclk<br>**----- End of picture text -----**<br>
**Figure 2.13. SGMII CDR IP**
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**CertusPro-NX Family Data Sheet**
## **2.6. sysMEM Memory**
The CertusPro-NX devices contain a number of sysMEM Embedded Block RAM (EBR). The EBR consists of an 18 kb RAM with memory core, dedicated input registers, and output registers as well as optional pipeline registers at the outputs. Each EBR includes functionality to support true dual-port, pseudo dual-port, single-port RAM, ROM, and built in FIFO. In CertusPro-NX device, the unused EBR block is powered down to minimize power consumption.
## **2.6.1. sysMEM Memory Block**
The sysMEM block can implement single port, dual port or pseudo dual port memories. Each block can be used in a variety of depths and widths as listed in Table 2.4. FIFOs can be implemented using the built-in read and write address counters and programmable full, almost full, empty, and almost empty flags. The EBR block facilitates parity checking by supporting an optional parity bit for each data byte. EBR blocks provide byte-enable support for configurations with 18-bit and 36-bit data widths. For more information, refer to Memory Usage Guide for Nexus Platform (FPGA-TN-02094).
EBR also provides a built-in ECC engine in Commercial/Industrial –8 and –9 speed grades and Automotive –7 and –8 speed grades. See ordering information for more details. The ECC engine supports a write data width of 32 bits, and it can be cascaded for larger data widths such as ×64. The ECC parity generator creates and stores parity data for each 32-bit word written. When a read operation is performed, it compares the data with its associated parity data and reports back if any Single Event Upset (SEU) event has disturbed the data. Any single bit data disturb is automatically corrected at the data output. In addition, two dedicated error flags indicate when a single-bit or two-bit error has occurred.
**Table 2.4. sysMEM Block Configurations**
|**Memory Mode**|**Configurations**|
|---|---|
|Single Port|16,384 × 1|
||8,192 × 2|
||4,096 × 4|
||2,048 × 9|
||1,024 × 18|
||512 × 36|
|True Dual Port|16,384 × 1|
||8,192 × 2|
||4,096 × 4|
||2,048 × 9|
||1,024 × 18|
|Pseudo Dual Port|16,384 × 1|
||8,192 × 2|
||4,096 × 4|
||2,048 × 9|
||1,024 × 18|
||512 × 36|
## **2.6.2. Bus Size Matching**
All the multi-port memory modes support different widths on each of the ports, except that the ECC mode only supports a write data width of 32 bits. The RAM bits are mapped LSB word 0 to MSB word 0, LSB word 1 to MSB word 1, and so on. Although the word size and number of words for each port varies, this mapping scheme applies to each port.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **2.6.3. RAM Initialization and ROM Operation**
If desired, the contents of the RAM can be pre-loaded during the device configuration. By preloading the RAM block during the chip configuration cycle and disabling the write controls, the sysMEM block can also be utilized as a ROM.
## **2.6.4. Memory Cascading**
Larger and deeper blocks of RAM can be created using EBR sysMEM Blocks. Typically, the Lattice design tools cascade memory transparently, based on specific design inputs.
## **2.6.5. Single, Dual, and Pseudo-Dual Port Modes**
In all the sysMEM RAM modes, the input data and address for the ports are registered at the input of the memory array. The output data of the memory is optionally registered at the output.
## **2.6.6. Memory Output Reset**
The EBR utilizes latches at the A and B output ports. These latches can be reset asynchronously or synchronously. RSTA and RSTB are local signals, which reset the output latches associated with Port A and Port B, respectively. The Global Reset signal, GSRN, can reset both ports. The output data latches and the associated resets for both ports are shown in Figure 2.14. The optional Pipeline Registers at the outputs of both ports are also reset in the same way.
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**----- Start of picture text -----**<br>
Memory Core D SET Q Port A[17:0]<br>ae LCLR<br>Output Data<br> Latches<br>D SET Q Port B[17:0]<br>LCLR<br>ae<br>RSTA<br>Te<br>RSTB<br>=> ><br>GSRN<br>Programmable Disable<br>**----- End of picture text -----**<br>
**Figure 2.14. Memory Core Reset**
For further information on the sysMEM EBR block, see the list of technical documentation in the References section.
## **2.7. Large RAM**
The CertusPro-NX device includes additional memory resources in the form of Large Random Access Memory (LRAM) blocks.
LRAM is designed to work as Single-Port RAM, Dual-Port RAM, Pseudo Dual-Port RAM, and ROM memories. It is meant to function as additional memory resources beyond what is available in the EBR and PFU.
Each individual Large RAM block contains 0.5 Mbit of memory and has a programmable data width of up to 32 bits. Cascading Large RAM blocks allows data widths of up to 64 bits. Additionally, there is the ability to use either Error Correction Coding (ECC) or byte enable.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **2.8. sysDSP**
The CertusPro-NX family provides an enhanced sysDSP architecture, making it ideally suitable for low-cost, high-performance Digital Signal Processing (DSP) applications. Typical functions used in these applications are Finite Impulse Response (FIR) filters, Fast Fourier Transforms (FFT) functions, Correlators, Reed-Solomon/Turbo/Convolution encoders, and decoders. These complex signal processing functions use similar building blocks, such as multiply-adders and multiply-accumulators.
## **2.8.1. sysDSP Approach Compared to General DSP**
Conventional general-purpose DSP chips typically contain one to four Multiply and Accumulate (MAC) units with fixed data-width multipliers; this leads to limited parallelism and limited throughput. Their throughput is increased by higher clock speeds. In the CertusPro-NX device family, many DSP blocks can be used to support different data widths. This allows the user to use high parallel implementations of DSP functions. The user can optimize DSP performance versus area by choosing appropriate levels of parallelism. Figure 2.15 compares the full serial implementation to the mixed parallel and serial implementation.
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Operand Operand Operand<br>A A A<br>Operand Operand Operand<br>B B B<br>Operand Operand<br>A B<br>X X X m/k<br>loops<br>Single M loops Multiplier Multiplier<br>Multiplier<br>Multiplier X 0 1 k<br>Accumulator<br>(k adds) +<br>Function Implemented in<br>General-purpose DSP<br>m/k<br>accumulate<br>Output<br>Function Implemented in<br>Certus-NX Family<br>**----- End of picture text -----**<br>
**Figure 2.15. Comparison of General DSP and CertusPro-NX Approaches**
## **2.8.2. sysDSP Architecture Features**
The CertusPro-NX sysDSP block contains two sysDSP slices. The sysDSP Slice has been significantly enhanced to provide functions needed for advanced processing applications. These enhancements provide improved flexibility and resource utilization.
The CertusPro-NX sysDSP block containing two sysDSP slices supports many functions including:
- Symmetry support. The primary target application is wireless. 1D Symmetry is useful for many applications that use FIR filters when their coefficients have symmetry or asymmetry characteristics. The main motivation for using 1D symmetry is cost/size optimization. The expected size reduction is up to 2x.
- Odd Mode – Filter with Odd number of taps.
- Even Mode – Filter with Even number of taps.
- Two-dimensional (2D) Symmetry Mode – Supports 2D filters for mainly video applications.
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**CertusPro-NX Family Data Sheet**
- Dual-multiplier architecture. Lower accumulator overhead to half and the latency to half compared to single multiplier architecture.
- Fully cascadable DSP across slices. Support for symmetric, asymmetric, and non-symmetric filters.
- Multiply (36 × 36, two 18 × 36, four 18 × 18, or eight 9 × 9).
- Multiply Accumulate (supports one 18 × 36 multiplier result accumulation, two 18 × 18 multiplier result accumulation or four 9 × 9 multiplier result accumulation).
- Two Multiplies feeding one Accumulate per cycle for increased processing with lower latency (two 18 × 18 Multiplies feed into an accumulator that can accumulate up to 54 bits).
- Pipeline registers.
- 1D Symmetry support. The coefficients of FIR filters have symmetry or negative symmetry characteristics.
- Odd Mode – Filter with Odd number of taps.
- Even Mode – Filter with Even number of taps.
- 2D Symmetry support. The coefficients of 2D FIR filters have symmetry or negative symmetry characteristics.
- 3 × 3 and 3 × 5 – Internal DSP Slice support.
- 5 × 5 and larger size 2D blocks – Semi-internal DSP Slice support.
- Flexible saturation and rounding options to satisfy a diverse set of applications situations.
- Flexible cascading DSP blocks.
- Minimizes fabric use for common DSP functions.
- Enables implementation of FIR Filter or similar structures using dedicated sysDSP slice resources only.
- Provides matching pipeline registers.
- Can be configured to continue cascading from one row of the sysDSP slices to another for longer cascade chains.
- RTL Synthesis friendly synchronous reset on all registers, while still supporting asynchronous reset for legacy users.
- Dynamic MUX selection to allow Time Division Multiplexing (TDM) of resources for applications that require processor-like flexibility that enables different functions for each clock cycle.
For most cases, as shown in Figure 2.16, the CertusPro-NX sysDSP block is backwards-compatible with the LatticeECP3™ sysDSP block, such that, legacy applications can be targeted to CertusPro-NX sysDSP, except for the ALU related function. Figure 2.16 is the diagram of sysDSP block.
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**CertusPro-NX Family Data Sheet**
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Input Input Input Input Input Input Input Input<br>B1 B1 B1 B1 B1 B1 B1 B1<br>Input J Input Input | Input j Input | Input f Input tj Input Input ft) Input Input tt Input Input Input Input Input<br>C B2 C B2 C B2 C B2 C B2 C B2 C B2 C B2<br>9 + 9 9 + 9 9 + 9 9 + 9 9 + 9 9 + 9 9 + 9 9 + 9<br>Input Input Input Input Input Input Input Input<br>REG REG REG REG REG REG REG REG<br>A1 A1 A1 A1 A1 A1 A1 A1<br>Input Input Input Input Input Input Input Input<br>A2 A2 A2 A2 A2 A2 A2 A2<br>9 × 9 9 × 9 9 × 9 9 × 9 9 × 9 9 × 9 9 × 9 9 × 9<br>CQCQOOOICOVCCODCOS<br>18 × 18 18 × 18 18 × 18 18 × 18<br>rr<br>18 × 36 (CSA) 18 × 36 (CSA)<br>ee ee<br>36 × 36 (CSA)<br>Pt<br>REG 18 REG 18 REG 18 REG 18 REG 18 REG 18 REG 18 REG 18<br>| ft<br>ACC54 ACC54<br>po<br>Output Register Output Register<br>**----- End of picture text -----**<br>
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**----- Start of picture text -----**<br>
Note : All registers inside the DSP Block are bypassable via configuration setting.<br>**----- End of picture text -----**<br>
**Figure 2.16. CertusPro-NX DSP Functional Block Diagram**
The CertusPro-NX sysDSP block supports the following four basic elements:
- MULT (Multiply)
- MAC (Multiply, Accumulate)
- MULTADDSUB (Multiply, Addition/Subtraction)
- MULTADDSUBSUM (Multiply, Addition/Subtraction, Summation)
Table 2.5 shows the capabilities of CertusPro-NX sysDSP block versus the above elements.
**Table 2.5. Maximum Number of Elements in a sysDSP Block**
|**Width of Multiply**|**×9**|**×18**|**×36**|
|---|---|---|---|
|MULT|8|4|1|
|MAC|2|2|—|
|MULTADDSUB|2|2|—|
|MULTADDSUBSUM|2|2|—|
Some options are available in the four elements. The input register in all the elements can be directly loaded or can be loaded as a shift register from previous operand registers. By selecting _dynamic operation,_ the following operations are possible:
- In the Add/Sub option, the Accumulator can be switched between addition and subtraction on every cycle.
- The loading of operands can switch between parallel and serial operations.
For further information, refer to sysDSP Usage Guide for Nexus Platform (FPGA-TN-02096).
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**CertusPro-NX Family Data Sheet**
## **2.9. Programmable I/O (PIO)**
The programmable logic associated with an I/O is called a Programmable I/O (PIO). Each individual PIO is connected to its respective sysI/O buffers and pads.
On all CertusPro-NX devices, two adjacent PIOs can be combined to provide a complementary output driver pair.
## **2.10. Programmable I/O Cell (PIC)**
The programmable I/O cells (PIC) provide I/O function and necessary gearing logic associated with PIO. CertusPro-NX device has two types of PICs: base PICs and gearing PICs.
Base PICs contain three blocks: an input register block, an output register block, and a tri-state register block. These blocks contain registers for operating in a variety of modes along with the necessary clock and selection logic (Figure 2.17 and Figure 2.18). Base PICs cover the top and left/right bank. Gearing PICs contain gearing logic and edge monitor used for locating the center of data window. Gearing PICs cover the bottom banks to support DDR operation.
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PIC<br>PIO A<br>Input<br>Register Block<br>Output and Pin<br>Tristate<br>A<br>Register Block<br>Core<br>Logic/ Input and Output<br>Gearbox<br>Routing<br>PIO B<br>Input<br>| iell<br>Register Block<br>Output and Pin<br>‘T “ih Tristate<br>B<br>Register Block<br>i<br>**----- End of picture text -----**<br>
**Figure 2.17. A Group of Two High Performance Programmable I/O Cells**
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**CertusPro-NX Family Data Sheet**
**==> picture [281 x 280] intentionally omitted <==**
**----- Start of picture text -----**<br>
PIC<br>PIO A<br>Input<br>Register Block |<br>Output and<br>Pin<br>Tristate<br>A<br>Register Block<br>ot<br>Core<br>Logic/<br>Routing<br>PIO B<br>Input<br>Register Block<br>Output and<br>|Ht Tristate Pin<br>B<br>Register Block<br>- o a -<br>pd]<br>**----- End of picture text -----**<br>
**Figure 2.18. Wide Range Programmable I/O Cells**
## **2.10.1. Input Register Block**
The input register blocks for the PIO on all edges contain the delay elements and the registers that can be used to condition high-speed interface signals before they are passed to the device core. In addition, the input register blocks for the PIO on the bottom edges include the built-in FIFO logic to interface to DDR and LPDDR memory. Table 2.6 lists all the ports for the input register block.
**Table 2.6. Input Block Port Description**
|**Name**|**Type **|**Description**|
|---|---|---|
|D|Input|High-speed data input.|
|Q[1:0]/Q[3:0]/Q[6:0]/Q[7:0]/Q[9:0]|Output|Low speed data to the device core.|
|RST|Input|Reset to the output block.|
|SCLK|Input|Slow speed system clock.|
|ECLK|Input|High-speed edge clock.|
|DQS|Input|Clock from DQS Control Block used to clock DDR memorydata.|
|ALIGNWD|Input|Data alignment signal from device core.|
The Input register block on the bottom side includes the gearing logic and the registers to implement IDDRX1, IDDRX2, IDDRX4, IDDRX5 gearing functions. With two PICs sharing the DDR register path, it can also implement the IDDRX71 function used for 7:1 LVDS interfaces. It uses three sets of registers – shift, update, and transfer to implement gearing and the clock domain transfer. The first stage registers sample the high-speed input data by the high-speed edge clock on its rising and falling edges. The second stage registers perform data alignment based on the control signals. The third stage pipeline registers pass the data to the device core synchronized to the low-speed system clock. For more information on gearing function, refer to CertusPro-NX High-Speed I/O Interface (FPGA-TN-02216).
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**CertusPro-NX Family Data Sheet**
## **Input FIFO**
The CertusPro-NX PIO has a dedicated input FIFO per single-ended pin for input data register for DDR Memory interfaces. The FIFO resides before the gearing logic. It transfers data from DQS domain to continuous ECLK domain. On the write side of the FIFO, it is clocked by DQS clock, which is the delayed version of the DQS Strobe signal from DDR memory. On the Read side of FIFO, it is clocked by ECLK. ECLK may be any high-speed clock with identical frequency as DQS, the frequency of the memory chip. Each DQS group has one FIFO control block. It distributes FIFO read/write pointers to every PIC in the same DQS group. DQS grouping and the DQS Control Block are described in DDR Memory Support section.
Figure 2.19 shows the input register block for the PIO on the top, left, and right edges.
**==> picture [449 x 113] intentionally omitted <==**
**----- Start of picture text -----**<br>
INCK<br>INFF<br>D Programmable<br>Delay Cell<br>INFF Q<br>SCLK IDDRX1* Q[1:0]<br>RST<br>**----- End of picture text -----**<br>
**==> picture [206 x 9] intentionally omitted <==**
**----- Start of picture text -----**<br>
*Note: IDDRX1 supported on Left and Right sides only.<br>**----- End of picture text -----**<br>
**Figure 2.19. Input Register Block for PIO on Top, Left, and Right Sides**
Figure 2.20 shows the input register block for the PIO located on the bottom edge.
**==> picture [417 x 187] intentionally omitted <==**
**----- Start of picture text -----**<br>
IN CK<br>IN FF<br>Programmable<br>D<br>Delay Cell<br>IN FF Q<br>Generic<br>IDDRX1<br>FIFO IDDRX2 Q[1:0]/<br>IDDRX4 Q[3:0]/<br>Delayed DQS ECLK IDDRX5 Q[6:0]*/<br>IDDRX71* Q[7:0]/<br>Q[9:0]<br>Memory<br>ECLK<br>IDDRX2<br>SCLK<br>RST<br>ALIGNWD<br>**----- End of picture text -----**<br>
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**----- Start of picture text -----**<br>
*For 7:1 LVDS interface only. It is required to use PIO pair pins (PIOA/B or PIOC/D).<br>**----- End of picture text -----**<br>
**Figure 2.20. Input Register Block for PIO on Bottom Side**
## **2.10.2. Output Register Block**
The output register block registers signals from the core of the device before they are passed to the sysI/O buffers.
CertusPro-NX output data path has programmable registers and output gearing logic. On the bottom side, the output register block can support 1×, 2×, 4×, 5×, and 7:1 gearing enabling high speed DDR and DDR memory interfaces. On the left and right sides, the banks support 1 gearing. The CertusPro-NX output data path diagram is shown in Figure 2.21
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**CertusPro-NX Family Data Sheet**
and Figure 2.22. The programmable delay cells are also available in the output data path. Table 2.7 lists all the ports for the output register block.
**==> picture [487 x 600] intentionally omitted <==**
**----- Start of picture text -----**<br>
For a detailed description of the output register block modes and usage, user can refer to CertusPro-NX High-Speed I/O<br>Interface (FPGA-TN-02216).<br>Programmable<br>D Delay Cell<br>Q<br>OUTFF<br>RST<br>SCLK Generic<br>ODDRX1*<br>D[1:0]<br>*Note: ODDRX1 supported on Left and Right sides only.<br>er<br>Figure 2.21. Output Register Block on Top, Left, and Right Sides<br>Programmable<br>D Delay Cell<br>Q<br>OUTFF<br>RST Generic<br>SCLK ODDRX1/<br>ODDRX2/<br>ECLK ODDRX4<br>DQSW ODDRX5<br>ODDR71*<br>DQSW270<br>Memory<br>Q[1:0]/Q[3:0]/ ODDRX2 *For 7:1 LVDS interface only. It is required to use PIO pair pins PIOA/B.<br>OSHX2<br>Q[6:0]*/<br>Q[7:0]/ i) =)<br>Q[9:0]<br>Figure 2.22. Output Register Block on Bottom Side<br>Table 2.7. Output Block Port Description<br>Name Type Description<br>Q Output High-speed data output.<br>D Input Data from core to output SDR register.<br>Q[1:0]/Q[3:0]/Q[6:0]/Q[7:0]/Q[9:0] Input Low speed data from device core to output DDR register.<br>RST Input Reset to the output block.<br>SCLK Input Slow speed system clock.<br>ECLK Input High-speed edge clock.<br>DQSW Input Clock from DQS Control Block used to generate DDR memory DQS output.<br>DQSW270 Input Clock from DQS Control Block used to generate DDR memory DQ output.<br>**----- End of picture text -----**<br>
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **2.11. Tri-state Register Block**
The tri-state register block registers tristate control signals from the core of the device before they are passed to the sysI/O buffers. The block contains a register for SDR operation. In SDR, the TD input feeds one of the flip-flops that can feed the output. In DDR, operations used mainly for DDR memory interfaces can be implemented on the bottom side of the device. In addition, two inputs feed the tristate registers clocked by both ECLK and SCLK. Table 2.8 lists all the ports for the tristate register block.
Figure 2.23 and Figure 2.24 show the Tristate Register Block functions on the device. For a detailed description of the tristate register block modes and usage, user can refer to CertusPro-NX High-Speed I/O Interface (FPGA-TN-02216).
**==> picture [325 x 361] intentionally omitted <==**
**----- Start of picture text -----**<br>
TQ<br>TD<br>RST TSFF<br>SCLK<br><a<br>Figure 2.23. Tri-state Register Block on Top, Left, and Right Sides<br>TQ<br>TD<br>TSFF<br>RST<br>SCLK<br>ECLK<br>TSHX2<br>DQSW<br>DQSW270<br>T[1:0]<br>**----- End of picture text -----**<br>
**Figure 2.24. Tri-state Register Block on Bottom Side**
**Table 2.8. Tri-state Block Port Description**
|**Name**<br>~~SS~~|**Type **<br>~~SS~~|**Description**<br>~~SS~~|
|---|---|---|
|TD<br>~~SS~~|Input<br>~~SS~~|Tri-state input to tri-state SDR register.<br>~~SS~~|
|RST<br>~~SS~~|Input<br>~~SS~~|Reset to the tri-state block.<br>~~SS~~|
|T[1:0]<br>~~SS~~|Input<br>~~SS~~|Tri-state input to TSHX2 function.<br>~~SS~~|
|SCLK<br>~~SS~~|Input<br>~~SS~~|Slow speed system clock.<br>~~SS~~|
|ECLK<br>~~SS~~|Input<br>~~SS~~|High-speed edge clock.<br>~~SS~~|
|DQSW<br>~~SS~~|Input<br>~~SS~~|Clock from DQS Control Block used togenerate DDR memoryDQS output.<br>~~SS~~|
|DQSW270<br>~~SS~~|Input<br>~~SS~~|Clock from DQS Control Block used togenerate DDR memoryDQ output.<br>~~SS~~|
|TQ<br>~~SS~~|Output<br>~~SS~~|Output of the Tri-state block.<br>~~SS~~|
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**CertusPro-NX Family Data Sheet**
## **2.12. DDR Memory Support**
## **2.12.1. DQS Grouping for DDR Memory**
Some PICs have additional circuitry to allow the implementation of high-speed source synchronous and DDR3/DDR3L, LPDDR2, or LPDDR4 memory interfaces. The support varies by the edge of the device detailed below.
PICs in the bottom side have fully functional elements supporting DDR3/DDR3L, LPDDR2, or LPDDR4 memory interfaces. Every 12 PIOs on the bottom side are grouped into one DQS group, as shown in Figure 2.25. Within each DQS group, there are two pre-placed pins for DQS and DQS# signals. The rest of the pins in the DQS group can be used as DQ signals and DM signal. The number of pins in each DQS group bonded out is package dependent. DQS groups with less than 11 pins bonded out can only be used for LPDDR2 Command/ Address buses. In DQS groups with more than 11 pins bonded out, pre-defined pins are assigned to be used as virtual VCCIO, by driving them HIGH to make extra connections to the VCCIO power supply. These soft connections to VCCIO help reduce SSO noise. For details, refer to CertusPro-NX High-Speed I/O Interface (FPGA-TN-02216).
**==> picture [378 x 334] intentionally omitted <==**
**----- Start of picture text -----**<br>
Aa a a De i i |<br>| \ I \ \ ! I I<br>\|!I|I | I I<br>||1I|\ | 1 i | !<br>||'\I1||\| | || \I i | I |\<br>| 1 | | 1 i | !<br>|<br>||I1 | | \ | | |<br>DQS<br>PIO B PIO A PIO B PIO B<br>sysIO Buffer sysIO Buffer sysIO Buffer sysIO Buffer Delay sysIO Buffer<br>Pad A Pad B (C) Pad B (C) Pad B Pad A (T)<br>PIO A PIO B PIO A PIO B PIO A DQSBUF PIO B PIO A PIO A<br>sysIO Buffer sysIO Buffer sysIO Buffer sysIO Buffer sysIO Buffer sysIO Buffer sysIO Buffer<br>Pad B Pad A (T) Pad B Pad A Pad A (T) Pad A Pad B (C)<br>**----- End of picture text -----**<br>
**Figure 2.25. DQS Grouping on the Bottom Edge**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **2.12.2. DLL Calibrated DQS Delay and Control Block (DQSBUF)**
To support DDR memory interfaces (DDR3/DDR3L, LPDDR2/4), the DQS strobe signal from the memory must be used to capture the data (DQ) in the PIC registers during memory reads. This signal is output from the DDR memory device aligned to data transitions and must be time shifted before it can be used to capture data in the PIC. This time shift is achieved by using the DQSBUF programmable delay line in the DQS Delay Block within DQS read circuit. The DQSBUF is implemented as a slave delay line and works in conjunction with a master DDRDLL.
This block also includes a slave delay line to generate delayed clocks used during writing to generate DQ and DQS with correct phases within one DQS group. There is a third delay line inside this block used to provide write leveling for DDR write if needed.
Each of the read and write side delays can be dynamically shifted using margin control signals from the core logic. The FIFO Control Block included here generates the Read and Write Pointers for the FIFO inside the Input Register Block. These pointers are generated to control the DQS to ECLK domain crossing using the FIFO module.
Figure 2.26 shows the main functional blocks of the DQSBUF, and Table 2.9 lists all the ports.
**==> picture [327 x 229] intentionally omitted <==**
**----- Start of picture text -----**<br>
DQSI BTDETECT<br>Preamble/Postamble Management<br>PAUSE BURSTDETECT<br>a<br>RDCLKSEL[3:0] DATAVALID<br>RDDIR<br>RDLOADN FIFO Control and Data Valid DQSW<br>READ[3:0] Generation DQSWRD<br>READMOVE RDPNTR[2:0]<br>RST |<br>SCLK READCOUT<br>Slave Delay Line (RD) with DQSR90<br>SELCLK Adjustment/Margin Test<br>WRDIR<br>|<br>WRLOAD_N DQSW270<br>WRLVDIR<br>WRCOUT<br>WRLVLOAD_N Slave Delay (WR) with<br>Adjustment/Margin Test and Write Leveling WRLVCOUT<br>WRLVMOVE<br>——<br>WRMOVE<br>ECLKIN<br>WRPNTR[2:0]<br>RSTSMCNT<br>DLLCODE[8:0]<br>**----- End of picture text -----**<br>
**Figure 2.26. DQS Control and Delay Block (DQSBUF)**
**Table 2.9. DQSBUF Port List Description**
|**Name**|**Type **|**Description**|
|---|---|---|
|DQSI|Input|DQS signal from I/O through the PIC.|
|PAUSE|Input|To stopECLK for DDR3 Write levelingand DLL code update.|
|RDCLKSEL[3:0]|Input|Select read clock source andpolaritycontrol(from CIB).|
|RDDIR|Input|0 – to increase the code.<br>1 – to decrease the code for DDR read.|
|RDLOADN|Input|1b0 – When mc1_mt_en_read=1b1 and read_load_n=1b0 the read_move<br>pulse needs to be generated to the load the preload value consisting of the<br>{mc1_sign_read, mc1_s_read [8:0]} value.<br>1b1 – When counter has preload value, read_move pulse can be used to<br>increment and decrement the counter based on the read_direction signal<br>value and mc1_mt_en_write should be set 1b1.|
|READ[3:0]|Input|Read signal for DDR read mode(from CIB).|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|**Name**<br>~~GG~~|**Type **<br>~~GG~~|**Description**<br>~~GG~~|
|---|---|---|
|READMOVE<br>~~a~~|Input<br>~~Se~~|Move pulse needs to be at least 1 sclk cycle and should be greater than 5ns at<br>TT corner. Pulse is used along with the eclk to generate the internal 'mov'<br>signal to update the counter by one value. The count up or down is<br>determined bythe read_directionport.|
|RST<br>~~a~~<br>~~ee ee~~|Input<br>~~Se~~<br>~~ee~~|DQS reset control for both DDR/CDR modes(from CIB).|
|SCLK<br>~~a~~<br>~~ee ee~~|Input<br>~~Se~~<br>~~ee~~|SCLK from SCLK tree(CIB).|
|SELCLK<br>~~ee ee~~|Input<br>~~ee~~|Select the clock to be used between the output of the read section's delay<br>cell or sclk.|
|WRDIR|Input|0 – to increase the code.<br>1 – to decrease the code for DDR write.|
|WRLOAD_N|Input|1b0 – When mc1_mt_en_write=1b1 and write_load_n=1b0 the write_move<br>pulse needs to be generated to the load the preload value consisting of the<br>{mc1_sign_write, mc1_s_write [8:0]} value.<br>1b1 – When counter has preload value, write_move pulse can be used to<br>increment and decrement the counter based on the write_direction signal<br>value and mc1_mt_en_write should be set 1b1.|
|WRLVDIR|Input|0 – to increase the code.<br>1 – to decrease the code for DDR write leveling.|
|WRLVLOAD_N|Input|1b0 – 9-bit counter in reset operation.<br>1b1 – When mc1_mt_en_write_leveling=1b1 and write_leveling_load_n=1b1<br>the counter can be incremented/decremented based on the direction signal<br>usingthe write_leveling_move signal.|
|WRLVMOVE|Input|Move pulse needs to be at least 1 sclk cycle and should be greater than 5 ns<br>at TT corner. Pulse is used along with the eclk to generate the internal 'mov'<br>signal to update the counter by one value. The count up or down is<br>determined bythe write_leveling_directionport.|
|WRMOVE<br>~~ee~~|Input<br>~~eG~~|Move pulse needs to be at least 1 sclk cycle and should be greater than 5ns at<br>TT corner. Pulse is used along with the eclk to generate the internal 'mov'<br>signal to update the counter by one value. The count up or down is<br>determined bythe write_directionport.<br>~~eG~~|
|ECLKIN<br>~~ee~~|Input<br>~~eG~~|ECLK from four different ECLK tree output.<br>~~eG~~|
|RSTSMCNT<br>~~ee~~<br>~~ee~~|Input<br>~~eG~~<br>~~eG~~|Signal to reset the smoothing counters used for the Read, Write, and Write<br>levelingdelays.<br>~~eG~~<br>~~eG~~|
|DLLCODE[8:0]<br>~~ee~~<br>~~ee~~|Input<br>~~eG~~<br>~~eG~~|DLL code selected from the DLL code routingmux.<br>~~eG~~<br>~~eG~~|
|BTDETECT<br>~~ee~~<br>~~ee~~|Output<br>~~eG~~<br>~~eG~~|READ burst detect output(to CIB).<br>~~eG~~<br>~~eG~~|
|BURSTDETECT<br>~~ee~~<br>~~ee~~|Output<br>~~eG~~<br>~~eG~~|The burst_det_sclk signal is generated using burst_det and is asserted on the<br>risingedge of SCLK.<br>~~eG~~<br>~~eG~~|
|DATAVALID<br>~~ee~~<br>~~ee~~|Output<br>~~eG~~<br>~~eG~~|Data Valid Flagfor READ mode(to CIB).<br>~~eG~~<br>~~eG~~|
|DQSW<br>~~ee~~<br>~~ee~~|Output<br>~~eG~~<br>~~eG~~|ECLKphase shifted or delayed,goes to the dqsw tree through the PIC.<br>~~eG~~<br>~~eG~~|
|DQSWRD<br>~~ee~~<br>~~ee~~|Output<br>~~eG~~|The read training clock adjusted in the write section. The read_clk_sel[3:0]<br>determines the selected delayand read enableposition.<br>~~eG~~|
|RDPNTR[2:0]<br>~~ee~~<br>~~ee~~|Output|FIFO control READpointer(3-bits)to FIFO in PIC(through each tree to IOL).|
|READCOUT<br>~~ee~~<br>~~ee~~|Output|Margin test output flagfor READ to indicate the under-flow or over-flow.|
|DQSR90<br>~~ee~~|Output|DQSI phase shifted or delayed by 90-degree output (through DQSR tree to<br>IOL).|
|DQSW270<br>~~ee~~|Output|ECLK phase shifted or delayed by 270-degree output (through DQSW270 tree<br>to IOL).|
|WRCOUT<br>~~ee~~|Output|Margin test output flagfor WRITE to indicate the under-flow or over-flow.|
|WRLVCOUT<br>~~ee~~|Output|Margin test output flag for WRITE LEVELING to indicate the under-flow or<br>over-flow.|
|WRPNTR[2:0]<br>~~a~~|Output|FIFO control WRITEpointer(3-bits)to FIFO in PIC(through each tree to IOL).|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-DS-02086-2.0
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**CertusPro-NX Family Data Sheet**
## **2.13. sysI/O Buffer**
Each I/O is associated with a flexible buffer referred to as a sysI/O buffer. These buffers are arranged around the periphery of the device in groups referred to as banks. The sysI/O buffers allow the user to implement a wide variety of standards that are found in today’s systems including LVDS, HSUL, SSTL Class I and II, LVSTL, LVCMOS, LVTTL, and MIPI.
The CertusPro-NX family contains multiple Programmable I/O Cell (PIC) blocks. Each PIC contains two Programmable I/O, PIOA and PIOB. Each PIO includes a sysI/O buffer and I/O logic. Two adjacent PIO can be joined to provide a differential I/O pair referred to as True and Comp, where True Pad is associated with the positive side of the differential I/O, and the complement with the negative.
The top, left, and right-side banks support I/O standards from 3.3 V to 1.0 V, while the bottom supports I/O standards from 1.8 V to 1.0 V. Every pair of I/O on the bottom bank also have a true LVDS and SLVS Tx Driver. In addition, the bottom bank supports single-ended input termination. Both static and dynamic terminations are supported. Dynamic termination is used to support the DDR/LPDDR interface standards. For more information about DDR implementation in I/O Logic and DDR memory interface support, refer to CertusPro-NX High-Speed I/O Interface (FPGA-TN-02216).
## **2.13.1. Supported sysI/O Standards**
CertusPro-NX sysI/O buffers support both single-ended and differential standards. Single-ended standards can be further subdivided into internal ratioed standards such as LVCMOS, LVTTL, and external referenced standards such as HSUL, SSTL, and LVSTL. The buffers support the LVTTL, LVCMOS 1.0 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V standards. The supported differential standards include LVDS, SLVS, differential LVCMOS, differential SSTL, differential LVSTL, and differential HSUL. For better support of video standards, subLVDS and MIPI_D-PHY are also supported. Table 2.10 and Table 2.11 provide a list of sysI/O standards supported in CertusPro-NX devices.
**Table 2.10. Single-Ended I/O Standards**
|**Standard**<br>~~COO~~|**Input**<br>~~COO~~|**Output**<br>~~COO~~|**Bi-directional**<br>~~COO~~|
|---|---|---|---|
|LVTTL33<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|
|LVCMOS33<br>~~a~~|Yes|Yes|Yes|
|LVCMOS25<br>~~a~~<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|
|LVCMOS18<br>~~OO~~<br>~~a ~~|Yes<br>~~OO~~<br> ~~CO~~|Yes<br>~~OO~~<br>~~CO~~|Yes<br>~~OO~~<br>~~CO~~|
|LVCMOS15<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|
|LVCMOS12<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|
|LVCMOS10<br>~~a~~|Yes|No|No|
|HSTL15 I<br>~~a~~<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|
|SSTL 15 I<br>~~OO~~<br>~~OO~~|Yes<br>~~OO~~<br>~~OO~~|Yes<br>~~OO~~<br>~~OO~~|Yes<br>~~OO~~<br>~~OO~~|
|SSTL 135 I<br>~~OO~~<br>~~OO~~|Yes<br>~~OO~~<br>~~OO~~|Yes<br>~~OO~~<br>~~OO~~|Yes<br>~~OO~~<br>~~OO~~|
|HSUL12<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|
|LVSTL_I<br>~~a~~|Yes|Yes|Yes|
|LVSTL_II<br>~~a~~<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|
|LVCMOS18H<br>~~OO~~<br>~~OO~~|Yes<br>~~OO~~<br>~~OO~~|Yes<br>~~OO~~<br>~~OO~~|Yes<br>~~OO~~<br>~~OO~~|
|LVCMOS15H<br>~~OO~~<br>~~OO~~|Yes<br>~~OO~~<br>~~OO~~|Yes<br>~~OO~~<br>~~OO~~|Yes<br>~~OO~~<br>~~OO~~|
|LVCMOS12H<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|Yes<br>~~OO~~|
|LVCMOS10H<br>~~a~~|Yes|Yes|Yes|
|LVCMOS10R<br>~~a~~<br>~~CO~~|Yes<br>~~CO~~|—<br>~~CO~~|Yes1<br>~~CO~~|
1. Output is supported by LVCMOS10H.
**Table 2.11. Differential I/O Standards**
|**Standard**|**Input**|**Output**|**Bi-directional**|
|---|---|---|---|
|LVDS|Yes|Yes|Yes|
|SUBLVDS|Yes|No|—|
|SLVS|Yes|Yes|—|
|SUBLVDSE|—|Yes|—|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|**Standard**|**Input**|**Output**|**Bi-directional**|
|---|---|---|---|
|SUBLVDSEH|—|Yes|—|
|LVDSE|—|Yes|—|
|MIPI_D-PHY|Yes|Yes|Yes|
|HSTL15D_I|Yes|Yes|Yes|
|SSTL15D_I|Yes|Yes|Yes|
|SSTL15D_II|Yes|Yes|Yes|
|SSTL135D_I|Yes|Yes|Yes|
|SSTL135D_II|Yes|Yes|Yes|
|HSUL12D|Yes|Yes|Yes|
|LVSTLD_I|Yes|Yes|Yes|
|LVSTLD_II|Yes|Yes|Yes|
|LVTTL33D|—|Yes|—|
|LVCMOS33D|—|Yes|—|
|LVCMOS25D|—|Yes|—|
## **2.13.2. sysI/O Banking Scheme**
CertusPro-NX devices have up to eight banks in total. One bank on the top, two on the left and the right, and three on the bottom. The higher density a CertusPro-NX device has, the more pins are included in each bank. Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7 can support up to VCCIO 3.3 V, while Bank 3, Bank 4, and Bank 5 can support up to VCCIO 1.8 V. In addition, Bank 3, Bank 4, and Bank 5 support two VREF inputs for flexibility to receive two different referenced input levels on the same bank. Figure 2.27 shows the location of each bank.
**==> picture [419 x 300] intentionally omitted <==**
**----- Start of picture text -----**<br>
VCCIO(0)<br>GND<br>[<br>Bank 0<br>GND GND<br>VCCIO(7) Bank 7 Bank 1 VCCIO(1)<br>+<br>GND GND<br>VCCIO(6) Bank 6 Bank 2 VCCIO(2)<br>e<br>Bank 5 Bank 4 Bank 3<br>o<br>GND GND GND<br>MM Th<br>VCCIO(5) VREF1(5) VREF2(5) VCCIO(4) VREF1(4) VREF2(4) VCCIO(3) VREF1(3) VREF2(3)<br>**----- End of picture text -----**<br>
**Figure 2.27. sysI/O Banking**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **Typical sysI/O Behavior During Power-up**
The internal Power-On-Reset (POR) signal is deactivated when VCC and VCCAUX have reached satisfactory levels. After the POR signal is deactivated, the FPGA core logic becomes active. The user needs to ensure that all other VCCIO banks are active with valid input logic levels to properly control the output logic states of all the I/O banks that are critical to the application. For more information about controlling the output logic state with valid input logic levels during power-up in CertusPro-NX devices, see the list of technical documentation in References section.
VCC and VCCAUX supply the power to the FPGA core fabric, whereas VCCIO supplies power to the I/O buffers. In order to simplify the system design while providing consistent and predictable I/O behavior, it is recommended that the I/O buffers be powered-up prior to the FPGA core fabric. For the different power supply voltage level by the I/O banks, refer to CertusPro-NX High-Speed I/O Interface (FPGA-TN-02216) for detailed information.
## **VREF1 and VREF2**
Bank 3, Bank 4, and Bank 5 can support two separate VREF input voltages, VREF1 and VREF2. To assign a VREF driver, use IO_Type = VREF1_DRIVER or VREF2_DRIVER. To assign VREF to a buffer, use VREF1_LOAD or VREF2_LOAD.
## **sysI/O Standards Supported by I/O Bank**
All banks can support multiple I/O standards under the VCCIO rules discussed above. Table 2.12 and Table 2.13 summarize the I/O standards supported on various sides of the CertusPro-NX device.
**Table 2.12. Single-Ended I/O Standards Support on Various Sides**
|**Standard**<br>**Top**<br>**Left**<br>**Right**<br>**Bottom**<br>~~pf~~|
|---|
|LVTTL33<br>Yes<br>Yes<br>Yes<br>—<br>LVCMOS33<br>Yes<br>Yes<br>Yes<br>—<br>LVCMOS25<br>Yes<br>Yes<br>Yes<br>—<br>LVCMOS18<br>Yes<br>Yes<br>Yes<br>—<br>~~aGG~~<br>~~aa~~|
|LVCMOS15<br>Yes<br>Yes<br>Yes<br>—<br>~~a~~|
|LVCMOS12<br>Yes<br>Yes<br>Yes<br>—<br>LVCMOS10<br>Yes<br>Yes<br>Yes<br>—<br>LVCMOS18H<br>—<br>—<br>—<br>Yes<br>LVCMOS15H<br>—<br>—<br>—<br>Yes<br>LVCMOS12H<br>—<br>—<br>—<br>Yes<br>LVCMOS10H<br>—<br>—<br>—<br>Yes<br>LVCMOS10R<br>—<br>—<br>—<br>Yes<br>HSTL15 I<br>—<br>—<br>—<br>Yes<br>~~aGG~~<br>~~aa~~<br>~~a~~<br>~~a~~<br>~~eeGG~~<br>~~a~~|
|SSTL 15 I, II<br>—<br>—<br>—<br>Yes<br>~~a~~|
|SSTL 135 I, II<br>—<br>—<br>—<br>Yes<br>LVSTL I, II<br>—<br>—<br>—<br>Yes<br>HSUL12<br>—<br>—<br>—<br>Yes<br>~~a~~<br>~~a~~<br>~~a GG~~|
|**Table 2.13. Differential I/O Standards Supported on Various Sides**|
|**Standard**<br>**Top**<br>**Left**<br>**Right**<br>**Bottom**<br>LVDS<br>—<br>—<br>—<br>Yes<br>~~a~~<br>~~(O~~<br>~~a~~|
|SUBLVDS<br>—<br>—<br>—<br>Yes<br>~~a~~|
|SLVS<br>—<br>—<br>—<br>Yes<br>~~a~~|
|SUBLVDSE<br>Yes<br>Yes<br>Yes<br>—<br>SUBLVDSEH<br>—<br>—<br>—<br>Yes<br>LVDSE<br>Yes<br>Yes<br>Yes<br>—<br>MIPI_D-PHY<br>—<br>—<br>—<br>Yes<br>~~a GG~~<br>~~a~~<br>~~a~~<br>~~a~~|
|HSTL15D_I<br>—<br>—<br>—<br>Yes<br>SSTL15D_I<br>—<br>—<br>—<br>Yes<br>~~aGG~~|
|SSTL15D_II<br>—<br>—<br>—<br>Yes<br>~~a~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|**Standard**|**Top**|**Left**|**Right**|**Bottom**|
|---|---|---|---|---|
|SSTL135D_I|—|—|—|Yes|
|SSTL135D_II|—|—|—|Yes|
|LVSTLD_I|—|—|—|Yes|
|LVSTLD_II|—|—|—|Yes|
|HSUL12D|—|—|—|Yes|
|LVTTL33D|Yes|Yes|Yes|—|
|LVCMOS33D|Yes|Yes|Yes|—|
|LVCMOS25D|Yes|Yes|Yes|—|
## **Hot Socketing**
The CertusPro-NX devices have been carefully designed to ensure predictable behavior during power-up and power-down. During power-up and power-down sequences, the I/O remains in tri-state until the power supply voltage is high enough to ensure reliable operation. In addition, leakage into I/O pins is controlled within specified limits. Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7 fully support hot socketing. Bank 3, Bank 4, and Bank 5 do not support hot socketing.
## **2.13.3. sysI/O Buffer Configurations**
This section describes various sysI/O features available on the CertusPro-NX device. Refer to sysI/O Usage Guide for Nexus Platform (FPGA-TN-02067) for detailed information.
## **2.13.4. MIPI D-PHY Support**
The programmable I/O of the CertusPro-NX device can be configured as a soft MIPI D-PHYs. The Soft D-PHY can be configured to support either Camera Serial Interface (CSI-2) or Display Serial Interface (DSI) applications as either transmitter or receiver. Below is a summary of the features supported by the Soft D-PHY.
- Transmit and receive function compliant to the MIPI Alliance D-PHY Specification version 1.2.
- High-Speed (HS) and Low-Power (LP) mode support.
- Supports continuous clock mode or low power non-continuous clock mode.
- Up to 6 Gbps per port (1500 Mbps data rate per lane) in ASG/CBG/LFG package.
- Up to 5 Gbps per port (1250 Mbps data rate per lane) in other packages.
- Supports up to 4 data lanes and one clock lane per port.
## **2.14. Analog Interface ADC**
The CertusPro-NX family can provide an analog interface consisting of two Analog to Digital Convertors (ADC), three continuous time comparators, and an internal junction temperature monitoring diode. This feature is available in Commercial/Industrial –8 and –9 speed grades and Automotive –7 and –8 speed grades. The two ADCs can operate either sequentially or simultaneously.
## **2.14.1. Analog to Digital Converters**
The architecture of each ADC is based upon a 12-bit, 1 MSPS SAR architecture converter. ADC supports both continuous and single shot conversion modes.
Each ADC is supported with a twelve-channel analog MUX that is used to select the input from one of the following: dedicated input, dual-function I/O, internal voltage rails, or an internal temperature sensing diode. The input signal can be converted in either uni-polar or bi-polar mode.
The reference voltage is selectable between the 1.2 V internal reference generator and an external reference. An external reference is recommended for any applications that incorporate the ADC. The ADC can convert up to a 1.8 V input signal with a 1.8 V external reference voltage. ADC has an auto-calibration function that calibrates the gain and offset of the SAR (not the internal 1.2 V internal reference).
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
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**CertusPro-NX Family Data Sheet**
## **2.14.2. Continuous Time Comparators**
The continuous-time comparator can be used to monitor a dedicated input pair or a GPIO input pair. The output of the comparator is provided as continuous and latched data. Each comparator uses a separate external threshold to provide system flexibility.
## **2.14.3. Internal Junction Temperature Monitoring Diode**
On-die junction temperature can be monitored using the internal junction temperature monitoring diode. The Proportional to Absolute Temperature (PTAT) diode voltage can be monitored by ADC to provide a digital temperature readout. Refer to ADC Usage Guide for Nexus Platform (FPGA-TN-02129) for more details.
## **2.15. IEEE 1149.1-Compliant Boundary Scan Testability**
All CertusPro-NX devices, except for the “01A” Die Version, have boundary scan cells that are accessed through an IEEE 1149.1 compliant Test Access Port (TAP). This allows the functional testing of the circuit board on which the device is mounted, which can provide a serial scan path that can access all critical logic nodes. Internal registers are linked internally, allowing test data to be shifted in and loaded directly onto test nodes, or allowing test data to be captured and shifted out for verification. TAP consists of dedicated I/O including TDI, TDO, TCK, and TMS. TAP uses VCCIO1 for power supply. TAP is supported for VCCIO1 = 1.8 V – 3.3 V
For more information, refer to sysCONFIG Usage Guide for Nexus Platform (FPGA-TN-02099).
## **2.16. Device Configuration**
All CertusPro-NX devices contain various ports that can be used for device configuration, including a Test Access Port (TAP). The TAP supports both the IEEE Standard 1149.1 Boundary Scan specification and the IEEE Standard 1532 In-System Configuration specification. JTAG_EN is the only dedicated configuration pin _._ PROGRAMN/INITN/DONE are enabled by default, but can be turned into GPIO. The remaining sysCONFIG pins are used as dual function pins. Refer to sysCONFIG Usage Guide for Nexus Platform (FPGA-TN-02099) for more information about using the dual-use pins as general purpose I/O.
There are various ways to configure a CertusPro-NX device:
- JTAG (TAP)
- Master Serial Peripheral Interface (SPI) – to load from external SPI flash using ×1, ×2, and ×4 (QSPI) interfaces.
- • Inter-Integrated Circuit Bus (I[2] C)
- Improved Inter-Integrated Circuit Bus (I3C)
- Slave SPI from a system host.
- Lattice Memory Mapped Interface (LMMI). Refer to Lattice Memory Mapped Interface (LMMI) and Lattice Interrupt Interface (LINTR) User Guide (FPGA-UG-02039) for more details.
- JTAG, SSPI, MSPI, I[2] C, and I3C are supported for VCCIO = 1.8 V – 3.3 V
On power-up, based on the voltage level (high or low) of the PROGRAMN pin, the FPGA SRAM is configured by the appropriate sysCONFIG port. If PROGRAMN pin is _low_ , the FPGA is in Slave configuration mode (Slave SPI, Slave I[2] C, or Slave I3C) waiting for the correct Slave Configuration port activation key. PROGRAMN must be driven high within 50 ns of the end of transmission of the Slave Configuration port activation key, that is, the de-assertion of SCSN. If no slave port is declared active before the PROGRAMN pin is sensed HIGH, the FPGA is in Master SPI booting mode. In Master SPI booting mode, the FPGA boots from an external SPI flash. Once a configuration port is activated, it remains active throughout that configuration cycle. The IEEE 1149.1 port can be activated any time after power-up by enabling the JTAG_EN pin and sending the appropriate command through the TAP port.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **2.16.1. Enhanced Configuration Options**
CertusPro-NX devices have enhanced configuration features such as:
- Early I/O release
- Bitstream decryption and authentication
- Decompression support
- TransFR I/O
- Watchdog Timer support
- Dual and Multi-boot image support
## **Early I/O Release**
Early I/O Release is a new configuration feature in which certain I/O banks are released earlier so that customer systems have minimal disruption. For more details, refer to sysCONFIG Usage Guide for Nexus Platform (FPGA-TN-02099).
## **Transparent Field Reconfiguration (TransFR)**
TransFR I/O (TFR) is a unique Lattice technology that allows the user to update logic in the field without interrupting system operation. TransFR I/O allows I/O states to be frozen during device configuration. This allows the device to be field updated with a minimum of system disruption and downtime.
## **Watchdog Timer**
Watchdog Timer is a new configuration feature that helps to add a programmable timer option for timeout applications.
## **Dual-boot and Multi-boot Image Support**
Dual-boot and multi-boot images are supported for applications requiring reliable remote updates of configuration data for the system FPGA. After the system is running with a basic configuration, a new boot image can be downloaded remotely and stored in a separate location in the configuration storage device. Any time after the update to the CertusPro-NX device, this device can be re-booted from this new configuration file. If there is a problem, such as corrupt data during downloading or incorrect version number with this new boot image, the CertusPro-NX device can revert to the original backup golden configuration and try again. All these actions can be done without power cycling the system. For more information, refer to sysCONFIG Usage Guide for Nexus Platform (FPGA-TN-02099).
## **2.17. Single Event Upset (SEU) Handling**
CertusPro-NX devices are unique in the underlying technology used to build these devices, which is much more robust and less prone to soft errors.
CertusPro-NX devices have an improved, hardware implemented, Soft Error Detection (SED) circuit that can be used to detect SRAM errors so they can be corrected. Two layers of SED implemented in CertusPro-NX family can make the device more robust and reliable.
The SED hardware in CertusPro-NX devices is part of the Configuration block. The SED module in CertusPro-NX is an enhanced version as compared to the SED modules implemented in other Lattice devices. The configuration data is divided into frames so that the entire FPGA can be programmed precisely with ease. The SED hardware reads data from the FPGAs configuration memory and performs an Error Correcting Code (ECC) calculation on every frame of the configuration data. Once an error is detected, a notification is generated and the SED resumes operation. For single-bit errors, the corrected value is rewritten to the particular frame using ECC information. If more than one-bit error is detected within one frame of configuration data, an error message is generated. CertusPro-NX devices also have dedicated logic to perform Cycle Redundancy Code (CRC) checks for the entire bitstream, which runs in parallel along with ECC.
After the ECC is calculated on all frames of configuration data, CRC is calculated and checked for the entire bitstream. ECC and CRC checks do not include the contents of RAMs (EBR, Large SRAM and distributed RAM memory). For further information on SED support, refer to Soft Error Detection (SED)/Correction (SEC) Usage Guide for Nexus Platform (FPGA-TN-02076).
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **2.18. On-chip Oscillator**
The CertusPro-NX device features two on-chip oscillators. Both oscillators are controlled with internal generated current.
The low frequency oscillator (LFOSC) is tailored for low power operation and runs at nominal frequency of 32 kHz. The LFOSC always runs and can be used to perform always-on functions with the lowest possible power. The high frequency oscillator (HFOSC) runs at normal frequency of 450 MHz, but can be divided down to a range of 256 MHz to 2 MHz by user attributes.
## **2.19. User I²C IP**
The CertusPro-NX device has one hard I²C interface, which can be configured either as a master (controller) or as slave (responder). The pins for the I²C interface are pre-assigned.
The interface core has the option to delay either the input or the output data (SDA), or both, by 50 ns nominal, using dedicated on-chip delay elements. This provides an easier interface to any external I[2] C components. In addition, 50 ns glitch filters are available for both SDA and SCL.
When the interface is configured as a master (controller), it can control other devices on the I[2] C bus through the preassigned pins. When the core is configured as a slave (responder), the device can provide, for example, I/O expansion to an I²C Master (controller). The I²C core supports the following functionalities:
- Master (controller) and slave (responder) operation
- 7-bit and 10-bit addressing
- Multi-Master (controller) arbitration
- Clock stretching
- Up to 1 MHz data transfer speed including Standard-mode, Fast-mode, and Fast-mode plus
- General call
- Optional receive and transmit data FIFOs with programmable sizes
- Optional 50 ns delay on input or output data (SDA), or both
- Hard-connection and Programmable I/O connection
- Programmable to a mode compliant with I3C requirements on legacy I[2] C Slave devices
- Fast-mode and Fast-mode plus
- Disable clock stretching
- 50 ns SCL and SDA glitch filters
- Programmable 7-bit address
For further information on the user I²C, refer to I[2] C Hardened IP Usage Guide for Nexus Platform (FPGA-TN-02142).
## **2.20. Pin Migration**
The CertusPro-NX family is designed to ensure that different density devices in the same family and in the same package have the same pinout. Furthermore, architecture ensures a high success rate when performing design migration from lower density devices to higher density devices. In many cases, it is also possible to shift a low resource utilization design targeted for a high-density device to a lower density device. However, the exact details of the final resource utilization impact the likelihood of success in each case. An example is that some user I/O may become No Connects in smaller devices in the same package. Refer to the CertusPro-NX Pin Migration Tables and Lattice Radiant software for specific restrictions and limitations.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **2.21. SESDES and Physical Coding Sublayer**
CertusPro-NX FPGAs feature up to eight channels of embedded SerDes/PCS arranged in quad blocks at the top of the device (Figure 2.1 and Figure 2.2). Each channel supports data rates up to 10.3125 Gbps. Here, only devices with –9 speed grade can support 10G SERDES usages, such as 10GBASE-R. Figure 2.2 shows the position of the quad blocks for the LFCPNX-100 family. Table 2.14 shows the SERDES standards supported by CertusPro-NX devices. Table 2.15 shows the number of the available SERDES/PCS channels for each CertusPro-NX device.
CertusPro-NX SERDES are organized in quads of four. Each CertusPro-NX SERDES quad includes four dedicated SERDES for high speed, full duplex serial data transfer. Each quad also contains one PCI Express PCS hard block. The PCI Express PCS is designed only for PCI Express. Each CertusPro-NX device contains one PCI Express hard Link Layer block. The PCI Express Link Layer block contains one ×1 engine and one ×4 engine. The ×4 PCI Express Link Layer engine can be configured in ×1, ×2 or ×4 mode. The PCI Express Link Layer block, PCI Express PCS block and SERDES channels constitute the complete PCI Express Hard IP block.
CertusPro-NX devices also have a generic purpose Multi-protocol PCS (MPCS) and related support logic. CertusPro-NX device also has protocol specific logic to support the standards listed below (Table 2.14). All PCS fabric interface logic for dedicated protocol support can also be bypassed to allow raw 8-bit or 10-bit interfaces to the FPGA fabric. Even though the SERDES/PCS blocks are arranged in quads, multiple baud rates can be supported within a quad with the use of a dedicated, per channel, Tx PLL. Additionally, multiple quads can be linked together to form larger data pipes. For information on how to use the SERDES/PCS blocks to support specific protocols, as well as on how to combine multiple protocols and baud rates within a device, refer to CertusPro-NX SerDes/PCS Usage Guide (FPGA-TN-02245).
Each SERDES channel integrates a CDR/PLL for Receiver and a PLL for Transmitter, and each channel can be configured to connect to the PCI Express PCS or the MPCS independently.
**==> picture [398 x 254] intentionally omitted <==**
**----- Start of picture text -----**<br>
FPGA Core<br>——————EEE<br>LMMI TLP UCFG LMMI MPCS EPCS<br>hn hn<br>PCI Express Link Layer (x1 + x4)<br>MPCS x4<br>PCI Express PCS<br>PMA (SERDES) PMA (SERDES) PMA (SERDES) PMA (SERDES)<br>Channel 0 Channel 1 Channel 2 Channel 3<br>Tx PLL Rx CDR Tx PLL Rx CDR Tx PLL Rx CDR Tx PLL Rx CDR<br>**----- End of picture text -----**<br>
**Figure 2.28. SERDES/PCS Overall Structure**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
The CertusPro-NX SERDES/PCS supports a range of popular serial protocols including:
- PCI Express Gen1 (2.5 Gbps), Gen 2 (5.0 Gbps), and Gen3 (8.0 Gbps, -9 speed only)
- Ethernet
- 10GBASE-R at 10.3125 Gbps, -9 speed only
- SGMII
- XAUI at 3.125 Gbps per lane
- SLVS-EC at 1.25 Gbps, 2.5 Gbps and 5 Gbps
- DP/eDP at 1.62 Gbps (RBR), 2.7 Gbps (HBR), 5.4 Gbps (HBR2), and 8.1 Gbps (HBR3)
- CoaXPress at 1.25 Gbps, 2.5 Gbps, 3.125 Gbps, 5 Gbps, and 6.25 Gbps
- Generic 8b10b with multiple data rates supported
- SERDES-only mode allowing a direct 8-bit or 10-bit interface to FPGA logic
**Table 2.14. CertusPro-NX SERDES Standard Support**
|**Standard**|**Data Rate**<br>**(Mbps)**|**System Reference**<br>**Clock(MHz)**<br>~~GO~~|**FPGA Clock (MHz)**<br>~~GO~~|**Number of**<br>**Link Width**|**Encoding Style**|
|---|---|---|---|---|---|
|PCI Express Gen1<br>~~eG~~|2500<br>~~eG~~|100<br>~~eG~~<br>~~GO~~<br>~~OO~~|125<br>~~eG~~<br>~~GO~~<br>~~OO~~|×1, ×2, ×4<br>~~eG~~|8b10b<br>~~eG~~|
|PCI Express Gen2<br>~~eG~~<br>~~eG~~|5000<br>~~eG~~<br>~~eG~~|100<br>~~eG~~<br>~~GO~~<br>~~eG~~<br>~~OO~~<br>~~Gn~~|125<br>~~eG~~<br>~~GO~~<br>~~eG~~<br>~~OO~~<br>~~Gn~~|×1, ×2, ×4<br>~~eG~~<br>~~eG~~|8b10b<br>~~eG~~<br>~~eG~~|
|PCI Express Gen3<br>~~eG~~<br>~~eG~~|8000<br>~~eG~~<br>~~eG~~|100<br>~~eG~~<br>~~OO~~<br>~~eG~~<br>~~Gn~~<br>~~Ge~~|250<br>~~eG~~<br>~~OO~~<br>~~eG~~<br>~~Gn~~<br>~~Ge~~|×1, ×2, ×4<br>~~eG~~<br>~~eG~~|128b130b<br>~~eG~~<br>~~eG~~|
|Ethernet SGMII<br>~~eG~~|1250<br>~~eG~~|125<br>~~Gn~~<br>~~eG~~<br>~~Ge~~|125<br>~~Gn~~<br>~~eG~~<br>~~Ge~~|×1<br>~~eG~~|8b10b<br>~~eG~~|
|Ethernet XAUI<br>~~pf~~|3125<br>~~pf~~|156.25<br>~~Ge~~<br>~~pf~~<br>~~OO~~|156.25<br>~~Ge~~<br>~~pf~~<br>~~OO~~|×4<br>~~pf~~|8b10b<br>~~pf~~|
|10GBASE-R<br>~~pf~~<br>~~eG~~|10312.5<br>~~pf~~<br>~~eG~~|161.1328125<br>~~pf~~<br>~~eG~~<br>~~OO~~<br>~~OO~~|156.25<br>~~pf~~<br>~~eG~~<br>~~OO~~<br>~~OO~~|×1<br>~~pf~~<br>~~eG~~|64b66b<br>~~pf~~<br>~~eG~~|
|SLVS-EC Grade1<br>~~eG~~<br>~~eG~~|1250<br>~~eG~~<br>~~eG~~|125<br>~~eG~~<br>~~OO~~<br>~~eG~~<br>~~OO~~<br>~~Gn~~|125<br>~~eG~~<br>~~OO~~<br>~~eG~~<br>~~OO~~<br>~~Gn~~|×1~×8<br>~~eG~~<br>~~eG~~|8b10b<br>~~eG~~<br>~~eG~~|
|SLVS-EC Grade2<br>~~eG~~<br>~~eG~~|2500<br>~~eG~~<br>~~eG~~<br>~~ee~~|125<br>~~eG~~<br>~~OO~~<br>~~eG~~<br>~~Gn~~<br>~~Ge~~|125<br>~~eG~~<br>~~OO~~<br>~~eG~~<br>~~Gn~~<br>~~Ge~~|×1~×8<br>~~eG~~<br>~~eG~~|8b10b<br>~~eG~~<br>~~eG~~|
|SLVS-EC Grade3<br>~~eG~~|5000<br>~~eG~~<br>~~ee~~|125<br>~~Gn~~<br>~~eG~~<br>~~Ge~~|125<br>~~Gn~~<br>~~eG~~<br>~~Ge~~|×1~×8<br>~~eG~~|8b10b<br>~~eG~~|
|CoaXPress|1250<br>~~ee~~|125<br>~~Ge~~|125<br>~~Ge~~|×1~×4|8b10b|
||2500<br>~~ee~~<br>~~se~~|125<br>~~Ge~~<br>~~se~~|125<br>~~Ge~~<br>~~se~~|×1~×4<br>~~se~~|8b10b<br>~~se~~|
||3125<br>~~se~~<br>~~se~~<br>~~es~~|156.25<br>~~se~~<br>~~se~~<br>~~eG~~|156.25<br>~~se~~<br>~~se~~<br>~~eG~~|×1~×4<br>~~se~~<br>~~se~~<br>~~eG~~|8b10b<br>~~se~~<br>~~se~~<br>~~eG~~|
||5000<br>~~se~~<br>~~es~~|125<br>~~se~~<br>~~eG~~|125<br>~~se~~<br>~~eG~~<br>~~Ge~~|×1~×4<br>~~se~~<br>~~eG~~<br>~~Ge~~|8b10b<br>~~se~~<br>~~eG~~|
||6250<br>~~es~~<br>~~se~~|156.25<br>~~eG~~<br>~~se~~<br>~~Ge~~|156.25<br>~~eG~~<br>~~se~~<br>~~Ge~~<br>~~Ge~~|×1~×4<br>~~eG~~<br>~~se~~<br>~~Ge~~|8b10b<br>~~eG~~<br>~~se~~|
|DP/eDP RBR<br>~~eG~~|1620<br>~~eG~~|108<br>~~eG~~<br>~~Ge~~|162<br>~~Ge~~<br>~~eG~~<br>~~Ge~~|×1, ×2, ×4<br>~~Ge~~<br>~~eG~~<br>~~GO~~|8b10b<br>~~eG~~|
|DP/eDP HBR<br>~~eG~~|2700<br>~~eG~~|135<br>~~Ge~~<br>~~eG~~<br>~~OO~~|135<br>~~Ge~~<br>~~eG~~<br>~~OO~~|×1, ×2, ×4<br>~~eG~~<br>~~GO~~|8b10b<br>~~eG~~|
|DP/eDP HBR2<br>~~eG~~<br>~~eG~~|5400<br>~~eG~~<br>~~eG~~|135<br>~~eG~~<br>~~eG~~<br>~~OO~~|135<br>~~eG~~<br>~~eG~~<br>~~OO~~|×1, ×2, ×4<br>~~eG~~<br>~~GO~~<br>~~eG~~|8b10b<br>~~eG~~<br>~~eG~~|
|DP/eDP HBR3<br>~~eG~~<br>~~eG~~|8100<br>~~eG~~<br>~~eG~~|135<br>~~eG~~<br>~~OO~~<br>~~eG~~<br>~~Ge~~|202.5<br>~~eG~~<br>~~OO~~<br>~~eG~~<br>~~Ge~~|×1, ×2, ×4<br>~~eG~~<br>~~eG~~|8b10b<br>~~eG~~<br>~~eG~~|
|10-Bit SERDES<br>~~eG~~|625 – 8100<br>~~eG~~|—<br>~~eG~~<br>~~Ge~~<br>~~Ge~~|—<br>~~eG~~<br>~~Ge~~<br>~~Ge~~|×1~×8<br>~~eG~~|None<br>~~eG~~|
|8-Bit SERDES<br>~~eG~~|625 – 8100<br>~~eG~~|—<br>~~Ge~~<br>~~eG~~<br>~~Ge~~|—<br>~~Ge~~<br>~~eG~~<br>~~Ge~~|×1~×8<br>~~eG~~|None<br>~~eG~~|
|Generic 8b10b<br>~~GC~~|625 – 8100<br>~~GC~~|—<br>~~Ge~~<br>~~GC~~|—<br>~~Ge~~<br>~~GC~~|×1~×8<br>~~GC~~|8b10b<br>~~GC~~|
**Notes** :
1. Flip-chip package (ASG/CBG/LFG) can support standards with data rate up to 10.3125 Gbps.
2. BBG package can support standards with data rate up to 6.25 Gbps.
3. BFG package can support standards with data rate up to 5.5 Gbps.
**Table 2.15. Number of SERDES/PCS Channel per CertusPro-NX Device**
|**Package **|**LFCPNX-50**|**LFCPNX-100**|
|---|---|---|
|ASG256|4|4|
|CBG256|4|4|
|BBG484|4|8|
|BFG484|4|4|
|LFG672|—|8|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **2.21.1. SERDES Block**
A SERDES receiver channel can receive the serial differential data stream, equalize the signal, perform Clock and Data Recovery (CDR) and de-serialize the data stream before passing the 8- or 10-bit data to the PCS logic. The SERDES transmitter channel can receive parallel 8- or 10-bit data from the PCS block or directly from the fabric, serialize the data and transmit the serial bit stream through the differential drivers. Figure 2.29 shows a single-channel SERDES/PCS block. Each SERDES channel provides a recovered clock and a SERDES transmit clock to the PCS block and to the FPGA core logic. Each transmit channel and receiver channel shares the same power supply (VCCSD). VCCPLLSD provides power to the SERDES PLL, and VCCAUXSD provides power to the SERDES Auxiliary block.
**==> picture [422 x 297] intentionally omitted <==**
**----- Start of picture text -----**<br>
AMPLITUDE,<br>PRE & POST CURSOR<br>SETINGS<br>TXDP<br>TX DATA<br>SERIALIZER TRANSMITTER<br>5,10,16,20 TXDN<br>_ OE<br>TX CLK<br>TX BIT CLK IMPEDANCE REXT<br>CALIBRATOR<br>TX PLL<br>REF CLK<br>RX WITH PROGRAMMABLE<br>CTLE, DFE AND EYE<br>MONITOR<br>CDR PLL RXDP<br>RECEIVER<br>RX BIT CLK RXDN<br>RX CLK<br>EQUALIZATION<br> CONTROL<br>RX DATA DESERIALIZER AD<br>NEAR-END LOOPBACK 5,10,16,20<br>CONTROL<br>ACTIVITY DETECT = : T if<br>**----- End of picture text -----**<br>
**Figure 2.29. Single-channel Block Diagram for SERDES Block**
## **2.21.2. MPCS**
As shown in Figure 2.30, Figure 2.31, Figure 2.32, and Figure 2.33, the PCS receives the parallel digital data from the deserializer and selects the polarity, performs word alignment, decodes (8b10b), provides the clock tolerance compensation and transfers the clock domain from the recovered clock to the FPGA clock via the down sampled FIFO. For the transmit channel, the PCS block receives the parallel data from the FPGA core, encodes it with 8b10b or 64b66b, selects the polarity and passes the 8/10/66 bits data to the transmit-SERDES channel. The PCS also provides bypass modes that allow a direct 8-bit or 10-bit interface from the SERDES to the FPGA logic. The PCS interface to the FPGA can also be programmed to run at 1/2 speed for a 2× bus width interface to the FPGA logic.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [428 x 571] intentionally omitted <==**
**----- Start of picture text -----**<br>
MPCS<br>Quad Register<br>SerDes Channel<br>Controller<br>Fabric<br>8b/10b PCS<br>SerDes<br>64b/66b PCS<br>Data Path of SerDes-only Mode<br>- | ——<br>awe<br>Figure 2.30. Simplified Channel Block Diagram for MPCS Block<br>8b10b PCS<br>TX Path<br>Tx lane-to-lane 8b/10b<br>SerDes — Deskew Encoder TX FIFO a Fabric<br>Side<br>Side RX Path<br>AlignerWord Decoder10b/8b AlignerLane Elastic Buffer RX FIFO<br>cote<br>Figure 2.31. Simplified Channel Block Diagram for MPCS 8b10b Sub-Block<br>64b66b PCS<br>TX Path<br>20b data Gear BoxTX block66b Scrambler + 64b data2b sync 64b/66b Encoder& + 64b TXD8b TXC FIFOTX + 64b TXD8b TXC<br>TX FSM<br>SerDes Fabric<br>Side RX Path<br>8b RXC<br>20b data RX block66b AlignerBlock + 64b data2b sync De- + 64b data2b sync 64b/66b Decoder + 64b RXD8b RXC Compen-Clock + 64b RXD<br>Gear Box & Scrambler & sation<br>Sync FSM RX FSM FIFO<br>BER<br>Monitor<br>**----- End of picture text -----**<br>
**Figure 2.32. Simplified Channel Block Diagram for MPCS 64b66b Sub-Block**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [395 x 201] intentionally omitted <==**
**----- Start of picture text -----**<br>
Transmit Path<br>PM FIFO TX FIFO<br>Tx User<br>SerDes Tx Logic<br>(Fabric)<br>tx_usr_clk<br>/2,<br>tx_pcs_clk tx_pcs_clka /1 tx_pcs_clkb tx_out_clk<br>tx_lalign_clk<br>Receive Path<br>RX FIFO<br>Rx User<br>SerDes Rx Logic<br>(Fabric)<br>rx_usr_clk<br>/2,<br>/1 rx_out_clk<br>rx_pcs_clk<br>**----- End of picture text -----**<br>
**Figure 2.33. Simplified Channel Block Diagram for MPCS SERDES-only Sub-Block**
## **2.21.3. Peripheral Component Interconnect Express (PCIe)**
The CertusPro-NX device features one hardened PCIe block on the top side of the device. The PCIe block implements all the three layers defined by the PCI Express Specification: Physical, Data Link, and Transaction, as shown in Figure 2.34. Below is a summary of the features supported by the PCIe bock:
- Gen 1 (2.5 Gbps), Gen 2 (5.0 Gbps) and Gen 3 (8.0 Gbps) speed
- PCIe Express Base Specification 3.0 compliant including compliance with earlier PCI Express Specifications
- Multi-function support with up to four physical functions
- Endpoint
- Type 0 configuration registers in Endpoint mode
- Complete error-handling support
- 32-bit core data width
- Many power management features including power budgeting
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [487 x 688] intentionally omitted <==**
**----- Start of picture text -----**<br>
PCI Express Core<br>PHY TX<br>Tx<br>Tx Tx<br>Data VC0_TX<br>PHY Trans<br>Link<br>Layer Layer<br>Layer<br>Rx<br>PHY RX Rx Rx VC0_RX<br>Data<br>PHY Trans<br>Link<br>Layer Layer<br>Layer<br>Power Management<br>Error Reporting (AER)<br>CLK, CONFIGURATION, AND MANAGEMENT<br>11 CONFIGURATION REGISTERS LMMI<br>Figure 2.34. PCIe Core<br>The hardened PCIe block can be instantiated with the primitive PCIe through Lattice Radiant software, however, it is<br>not recommended to directly instantiate the PCIe primitive itself. It is highly recommended to generate the PCIe<br>Endpoint Soft IP through the Radiant IP Catalog and IP Block Wizard instead. In Figure 2.35, the PCIe core is configured<br>as Endpoint using a Soft IP wrapper that provides useful functions such as bridging support for bus interfaces and DMA<br>applications. In addition to the standard Transaction Layer Packet (TLP) interface, the data interface can also be<br>configured to be AXI4 or AHB-Lite as well. The PCIe hardened block also features a register interface for LMMI and User<br>Configuration Space Register Interface (UCFG). The PCIe block has many registers that contain information about the<br>current status of the PCIe block as well as the capability to dynamically switch PCIe settings. One easy way to access<br>these registers is through the Reveal Controller Tool.<br>For more information about the PCIe soft IP, refer to the PCIe IP Core document.<br>Top<br>Soft Logic PCIe Hard IP rxp_i/<br>Rx TLP rxn_i<br>AHB-Lite/<br>AXI-4 Data Interface Conversion Tx TLP<br>Transactio txp_o/<br>Link Layer PHY Layer txn_o<br>n Layer<br>LMMI<br>AHB-Lite/<br>APB Register Interface UCFG refclkp_i/<br>Conversion refclkn_i<br>=i<br>Figure 2.35. PCIe Soft IP Wrapper<br>© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.<br>All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.<br>PHY Interface (PIPE)<br>**----- End of picture text -----**<br>
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**CertusPro-NX Family Data Sheet**
## **2.21.4. LMMI (Lattice Memory Map Interface) Bus**
The LMMI is an IP interface that allows the SERDES/PCS Quad block to be controlled by registers rather than the configuration memory cells. It is a simple register configuration interface that allows SERDES/PCS configuration without power cycling the device.
## **2.22. Cryptographic Engine**
The CertusPro-NX family of devices supports several cryptographic features that help secure the design. Some of the key cryptographic features include Advanced Encryption Standard (AES) encryption, Hashing Algorithms, and true random number generation (TRNG). The CertusPro-NX device also features bitstream encryption (using AES-256) for protecting confidential FPGA bitstream data, and bitstream authentication (using ECDSA) that maintains bitstream integrity.
The Cryptographic Engine (CRE) is the main block, which is responsible for bitstream encryption as well as authentication of the CertusPro-NX device. Once the bitstream is authenticated and the device is ready for user functions, the CRE is available to implement various cryptographic functions in FPGA design. To enable specific cryptographic function, the CRE must be configured by setting a few registers.
The Cryptographic Engine supports the following user-mode features:
- True Random Number Generation (TRNG)
- Secure Hashing Algorithm (SHA)-256 bit
- Message Authentication Codes (MACs) – HMAC
- Lattice Memory Mapped Interface (LMMI) to user logic
- High Speed Port (HSP) for FIFO-based streaming data transfer
**==> picture [441 x 134] intentionally omitted <==**
**----- Start of picture text -----**<br>
Cryptographic Engine (CRE)<br>Unique ID<br>Control Register<br>LMMI / True Random Number Generator (TRNG)<br>FPGA High Speed Port<br>Fabric CRE Registers Advanced Encryption Standard (AES)<br>SHA256<br>Bitstream Encryption<br>HMAC SHA256<br>Bitstream Authentication<br>**----- End of picture text -----**<br>
**Figure 2.36. Cryptographic Engine Block Diagram**
## **2.23. TraceID**
Each CertusPro-NX device contains a unique (per device) TraceID that can be used for tracking purposes or for IP security applications. The TraceID is 64 bits long. Eight out of 64 bits are user programmable. The remaining 56 bits are factory-programmed. The TraceID is accessible through the SPI, I[2] C, or JTAG interfaces. For further information on TraceID, refer to Using TraceID (FPGA-TN-02084).
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **3. DC and Switching Characteristics for Commercial and Industrial**
All specifications in this section are characterized within recommended operating conditions unless otherwise specified.
## **3.1. Absolute Maximum Ratings**
**Table 3.1. Absolute Maximum Ratings**
|**Symbol**<br>~~GO~~|**Parameter**<br>~~GO~~|**Min**<br>~~GO~~|**Max**<br>~~GO~~|**Unit**<br>~~GO~~|
|---|---|---|---|---|
|VCC, VCCECLK<br>~~GG~~|SupplyVoltage<br>~~GG~~|–0.5<br>~~GG~~|1.10<br>~~GG~~|V<br>~~GG~~|
|VCCAUX, VCCAUXA, VCCAUXH3,<br>VCCAUXH4,VCCAUXH5<br>~~a~~<br>~~a~~|Supply Voltage<br>|–0.5<br>~~GG~~<br>|1.98<br>~~GG~~<br>|V<br>|
|VCCIO0, 1, 2, 6, 7<br>~~ee~~<br>~~a~~|I/O SupplyVoltage<br>~~ee~~<br>|–0.5<br>~~ee~~<br>~~GG~~<br>|3.63<br>~~ee~~<br>~~GG~~<br>|V<br>~~ee~~<br>|
|VCCIO3, 4, 5<br>~~a~~|I/O SupplyVoltage<br>~~GO~~|–0.5<br>~~GG~~<br>~~GO~~|1.98<br>~~GG~~<br>~~GO~~|V<br>~~GO~~|
|VCCPLLSD*<br>~~a ~~<br>~~I~~|SERDES Block PLL SupplyVoltage<br> ~~GO~~<br>~~I~~|–0.5<br>~~GG~~<br>~~GO~~<br>~~I~~|1.98<br>~~GG~~<br>~~GO~~<br>~~I~~|V<br>~~GO~~<br>~~I~~|
|VCCSD*<br>~~I~~<br>~~I~~|SERDES SupplyVoltage<br>~~I~~<br>~~I~~|–0.5<br>~~I~~<br>~~I~~<br>~~OG~~|1.10<br>~~I~~<br>~~I~~<br>~~OG~~|V<br>~~I~~<br>~~I~~|
|VCCSDCK<br>~~I~~<br>~~fe~~|SERDES Clock Buffer SupplyVoltage<br>~~I~~<br>~~fe~~|–0.5<br>~~I~~<br>~~fe~~<br>~~OG~~|1.10<br>~~I~~<br>~~fe~~<br>~~OG~~|V<br>~~I~~<br>~~fe~~|
|VCCADC18<br>~~GG~~|ADC Block 1.8 V SupplyVoltage<br>~~GG~~|–0.5<br>~~OG~~<br>~~GG~~|1.98<br>~~OG~~<br>~~GG~~|V<br>~~GG~~|
|VCCAUXSDQ*<br>~~a~~<br>~~a~~|SERDES AUX SupplyVoltage<br>~~GO~~<br>~~ee~~|–0.5<br>~~GO~~|1.98<br>~~GO~~|V<br>~~GO~~|
|—<br>~~a ~~<br>~~a~~|Input or I/O Voltage Applied, Bank 0, Bank 1,<br>Bank 2,Bank 6,Bank 7<br> ~~GO~~<br>~~ee~~|–0.5<br>~~GO~~|3.63<br>~~GO~~|V<br>~~GO~~|
|—<br>~~a~~<br>~~a~~|Input or I/O Voltage Applied, Bank 3, Bank 4,<br>Bank 5<br>~~ee~~|–0.5|1.98|V|
|—<br>~~a~~|Voltage Applied on SERDES Pins<br>~~GO~~|–0.5<br>~~GO~~|1.98<br>~~GO~~|V<br>~~GO~~|
|TA<br>~~a ~~<br>~~I~~|Storage Temperature(Ambient)<br> ~~GO~~<br>~~I~~|–65<br>~~GO~~<br>~~I~~|+150<br>~~GO~~<br>~~I~~|°C<br>~~GO~~<br>~~I~~|
|TJ<br>~~I~~<br>~~GG~~|Junction Temperature<br>~~I~~<br>~~GG~~|—<br>~~I~~<br>~~GG~~|+125<br>~~I~~<br>~~GG~~|°C<br>~~I~~<br>~~GG~~|
**Notes** :
- Stress above those listed under the _Absolute Maximum Ratings_ may cause permanent damage to the device. Functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
- Compliance with the Lattice Thermal Management document is required.
- All voltages are referenced to GND.
- All VCCAUX should be connected on PCB.
## **3.2. Recommended Operating Conditions**
**Table 3.2. Recommended Operating Conditions[1, 2, 3]**
|**Symbol**|**Parameter**|**Conditions**|**Min**|**Typ. **|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|VCC,VCCECLK|Core SupplyVoltage|VCC= 1.0|0.955|1.00|1.05|V|
|VCCAUX|Auxiliary Supply Voltage|Bank 0, Bank 1, Bank 2, Bank 6,<br>Bank 7|1.71|1.80|1.89|V|
|VCCAUXH3/4/5|AuxiliarySupplyVoltage|Bank 3, Bank 4, Bank 5|1.71|1.80|1.89|V|
|VCCAUXA|Auxiliary Supply Voltage<br>for core logic|—|1.71|1.80|1.89|V|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|**Symbol**<br>~~po~~|**Parameter**<br>~~po~~|**Conditions**<br>~~po~~|**Min**<br>~~po~~<br>~~ee~~|**Typ. **<br>~~po~~<br>~~ee~~|**Max**<br>~~po~~<br>~~ee~~|**Unit**<br>~~po~~|
|---|---|---|---|---|---|---|
|VCCIO|I/O Driver Supply Voltage|VCCIO= 3.3 V, Bank 0, Bank 1,<br>Bank 2, Bank 6, Bank 7<br>~~a~~|3.135<br>~~a~~<br>~~ee~~<br>~~e~~~~**e**~~|3.30<br>~~a~~<br>~~ee~~<br>~~ee~~|3.465<br>~~a~~<br>~~ee~~<br>~~ee~~|V<br>~~a~~<br>~~ee~~|
|||VCCIO= 2.5 V, Bank 0, Bank 1,<br>Bank 2, Bank 6, Bank 7<br>~~ee~~|2.375<br>~~ee ~~<br>~~ee~~<br>~~e~~~~**e**~~|2.50<br> ~~ee~~<br>~~ee~~<br>~~ee~~|2.625<br>~~ee~~<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|||VCCIO= 1.8 V, All Banks<br>~~e~~|1.71<br>~~e~~~~**e** ~~<br>~~e~~|1.80<br> ~~ee ~~|1.89<br> ~~ee~~|V<br>~~ee~~|
|||VCCIO= 1.5 V, All Banks4<br>~~ee~~|1.425<br>~~ee~~<br>~~e~~~~**e**~~|1.50<br>~~ee~~<br>~~ee~~|1.575<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|||VCCIO= 1.35 V, All Banks (For<br>DDR3L Only)<br>~~ee~~|1.2825<br>~~ee~~<br>~~e~~~~**e**~~|1.35<br>~~ee~~<br>~~ee~~|1.4175<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|||VCCIO= 1.2 V, All Banks4<br>~~e~~|1.14<br>~~e~~~~**e** ~~<br>~~e~~<br>~~ee~~|1.20<br> ~~ee ~~<br>~~ee~~|1.26<br> ~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|||VCCIO= 1.0 V, Bank 3, Bank 4,<br>Bank 5<br>~~ee~~|0.95<br>~~ee~~<br>~~ee~~|1.00<br>~~ee~~<br>~~ee~~|1.05<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|**ADC External Power Supplies**<br>~~ee ee~~|||||||
|VCCADC18<br>~~po~~|ADC 1.8 V Power Supply<br>~~po~~|—<br>~~po~~|1.71<br>~~po~~|1.80<br>~~po~~|1.89<br>~~po~~|V<br>~~po~~|
|**SERDES Block External Power Supplies**|||||||
|VCCSD*<br>~~a~~|Supply Voltage for SERDES<br>Block and SERDES I/O<br>~~ee~~|—<br>~~ee~~|0.95<br>~~ee~~|1.00<br>~~ee~~|1.05<br>~~ee~~|V<br>~~ee~~|
|VCCSDCK<br>~~a~~|Supply Voltage for SERDES<br>Clock Buffer|—|0.95|1.00|1.05|V|
|VCCPLLSD*<br>~~a~~|SERDES Block PLL Supply<br>Voltage|—|1.71|1.80|1.89|V|
|VCCAUXSDQ*<br>~~a~~|SERDES Block Auxiliary<br>SupplyVoltage|—|1.71|1.80|1.89|V|
|**Operating Temperature**|||||||
|tJCOM<br>~~a~~|Junction Temperature,<br>Commercial Operation<br>~~ee~~|—<br>~~ee~~|0<br>~~ee~~|—<br>~~ee~~|85<br>~~ee~~|°C<br>~~ee~~|
|tJIND<br>~~a~~<br>~~a~~|Junction Temperature,<br>Industrial Operation<br>~~ee~~|—<br>~~ee~~|–40<br>~~ee~~|—<br>~~ee~~|100<br>~~ee~~|°C<br>~~ee~~|
1. For correct operation, all supplies must be held in their valid operation voltage range.
2. All supplies with the same voltage should be from the same voltage source. Proper isolation filters are needed to properly isolate noise from each other.
3. Common supply rails must be tied together except SERDES.
4. MSPI (Bank 0) and JTAG, SSPI, I[2] C, and I3C (Bank 1) ports are supported for VCCIO = 1.8 V to 3.3 V.
5. For 10G SERDES usages, VCC voltage should be within the range from 0.97 V to 1.05 V.
## **3.3. Power Supply Ramp Rates**
|**Table 3.3. Power Supply Ramp Rates**<br>**Symbol**<br>**Parameter**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>tRAMP<br>Power Supplyramprates for all supplies1<br>0.1<br>—<br>50<br>V/ms<br>~~Se~~|**Table 3.3. Power Supply Ramp Rates**<br>**Symbol**<br>**Parameter**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>tRAMP<br>Power Supplyramprates for all supplies1<br>0.1<br>—<br>50<br>V/ms<br>~~Se~~|**Table 3.3. Power Supply Ramp Rates**<br>**Symbol**<br>**Parameter**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>tRAMP<br>Power Supplyramprates for all supplies1<br>0.1<br>—<br>50<br>V/ms<br>~~Se~~|**Table 3.3. Power Supply Ramp Rates**<br>**Symbol**<br>**Parameter**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>tRAMP<br>Power Supplyramprates for all supplies1<br>0.1<br>—<br>50<br>V/ms<br>~~Se~~|**Table 3.3. Power Supply Ramp Rates**<br>**Symbol**<br>**Parameter**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>tRAMP<br>Power Supplyramprates for all supplies1<br>0.1<br>—<br>50<br>V/ms<br>~~Se~~|
|---|---|---|---|---|
|**Notes**:|||||
|1.<br>Assume monotonic ramp rates.|||||
2. All supplies need to be in the operating range as defined in Recommended Operating Conditions when the device has completed configuration and entering into User Mode. Supplies that are not in the operating range needs to be adjusted to faster ramp rate, or user must delay configuration or wake up.
## **3.4. Power up Sequence**
Power-On-Reset (POR) puts the CertusPro-NX device into a reset state. There is no power up sequence required for the CertusPro-NX device.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**Table 3.4. Power-On Reset[1]**
|**Symbol**|**Parameter**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|VPORUP|Power-On-Reset ramp-up trip<br>point (Monitoring VCC, VCCAUX,<br>VCCIO0and VCCIO1)|VCC|0.73|—|0.83|V|
|||VCCAUX|1.34|—|1.62|V|
|||VCCIO0, VCCIO1|0.89|—|1.05|V|
|VPORDN|Power-On-Reset ramp-down trip<br>point (Monitoring VCCand VCCAUX)|VCC|0.51|—|0.81|V|
|||VCCAUX|1.38|—|1.59|V|
## **Note:**
1. VCCIO0 does not have a Power-On-Reset ramp down detection. VCCIO0 must remain within the Recommended Operating Conditions to ensure proper operation.
## **3.5. On-chip Programmable Termination**
The CertusPro-NX devices support a variety of programmable on-chip terminations options, including:
- Dynamically switchable Single-Ended Termination with programmable resistor values of 50 Ω, 75 Ω, or 150 Ω. Termination to ground for LPDDR4, and termination to VCCIO/2 for all other non-LPDDR4.
- Common mode termination of 100 Ω for differential inputs.
V CCIO
Zo = 50
**==> picture [492 x 140] intentionally omitted <==**
**----- Start of picture text -----**<br>
TERM<br>Zo = 50 , 75 , or 150<br>control<br>Zo<br>Zo +<br>2Zo<br>Zo +<br>Zo<br>VREF<br>OFF-chip ON-chip OFF-chip ON-chip<br>4S Sit<br>Parallel Single-Ended Input Differential Input<br>**----- End of picture text -----**<br>
## **Figure 3.1. On-chip Termination**
See Table 3.5 for termination options for input modes.
**Table 3.5. On-Chip Termination Options for Input Modes**
|**IO_TYPE**|**Differential Termination Resistor1**|**Terminate to VCCIO/2***|
|---|---|---|
|subLVDS|100, OFF|OFF|
|SLVS|100, OFF|OFF|
|MIPI_DPHY|100|OFF|
|HSTL15D_I|100, OFF|OFF|
|SSTL15D_I|100, OFF|OFF|
|SSTL135D_I|100, OFF|OFF|
|HSUL12D|100, OFF|OFF|
|LVSTLD_I|OFF|OFF, 40, 48, 60, 80, 120|
|LVSTLD_II|OFF|OFF, 80, 120|
|LVCMOS15H|OFF|OFF|
|LVCMOS12H|OFF|OFF|
|LVCMOS10H|OFF|OFF|
|LVCMOS12H|OFF|OFF|
|LVCMOS10H|OFF|OFF|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|**IO_TYPE**|**Differential Termination Resistor1**|**Terminate to VCCIO/2***|
|---|---|---|
|LVCMOS18H|OFF|OFF, 40, 50, 60, 75|
|HSTL15_I|OFF|50|
|SSTL15_I|OFF|OFF, 40, 50, 60, 75|
|SSTL135_I|OFF|OFF, 40, 50, 60, 75|
|HSUL12|OFF|OFF, 40, 50, 60, 75|
|LVSTL_I|OFF|OFF, 40, 48, 60, 80, 120|
|LVSTL_II|OFF|OFF, 80, 120|
**Note** :
1. Single-ended Terminate Resistor (to ground for LPDDR4, to VCCIO/2 for all other non-LPDDR4) and Differential Resistor when turned on can only have one setting per bank. Only left and right banks have this feature. Use of Single-ended Terminate Resistor (to ground for LPDDR4, to VCCIO/2 for all other non-LPDDR4) and Differential Termination Resistor are mutually exclusive in an I/O bank.
Tolerance for single-ended termination resistor is -10/60%, while for differential termination resistor is -15/15%.
Refer to sysI/O Usage Guide for Nexus Platform (FPGA-TN-02067) for on-chip termination usage and value ranges.
## **3.6. Hot Socketing Specifications**
**Table 3.6. Hot Socketing Specifications for GPIO**
|**Symbol**|**Parameter**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|IDK|Input or I/O Leakage Current for<br>Wide Range I/O (excluding<br>MCLK/MCSN/MOSI/INITN/DONE)|0 < VIN< VIH(max)<br>0 < VCC< VCC(max)<br>0 < VCCIO< VCCIO(max)<br>0 < VCCAUX< VCCAUX(max)|–1.5|—|1.5|mA|
**Notes** :
1. IDK is additive to IPU, IPD, or IBH.
2. Hot socketing specification is defined at a device junction temperature of 85C or below. When the device junction temperature is above 85C, the IDK current can exceed the above specification limit.
3. Going beyond the hot socketing ranges specified here can cause exponentially higher leakage currents and potential reliability issues. A total of 64 mA per 8 I/O should not be exceeded.
## **3.7. ESD Performance**
Refer to the CertusPro-NX Product Family Qualification Summary for complete qualification data, including ESD performance.
## **3.8. DC Electrical Characteristics**
**Table 3.7. DC Electrical Characteristics – Wide Range (Over Recommended Operating Conditions)**
|**Symbol**<br>~~pf~~|**Parameter**<br>~~pf~~|**Condition**<br>~~pf~~|**Min**<br>~~pf~~|**Typ**<br>~~pf~~|**Max**<br>~~pf~~|**Unit**<br>~~pf~~|
|---|---|---|---|---|---|---|
|IIL, IIH1<br>~~a~~|Input or I/O Leakage current<br>(Commercial/Industrial)<br>~~a ee~~|0 ≤ VIN≤ VCCIO<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|10<br>~~ee~~|µA<br>~~ee~~|
|IIH2<br>~~a a~~|Input or I/O Leakage current<br>~~a~~|VCCIO≤ VIN≤ VIH (max)<br>~~GG~~|—<br>~~GG~~|—<br>~~GG~~|100<br>~~GG~~|µA<br>~~GG~~|
|IPU<br>~~a~~|I/O Weak Pull-up Resistor<br>Current<br>~~ee~~|0 ≤ VIN≤ 0.7 × VCCIO<br>~~ee~~|–30<br>~~ee~~|—<br>~~ee~~|–150<br>~~ee~~|µA<br>~~ee~~|
|IPD<br>~~a~~|I/O Weak Pull-down Resistor<br>Current<br>~~ee~~|VIL(max) ≤ VIN≤ VCCIO<br>~~ee~~|30<br>~~ee~~|—<br>~~ee~~|150<br>~~ee~~|µA<br>~~ee~~|
|IBHLS<br>~~GO~~|Bus Hold Low SustainingCurrent<br>~~GO~~|VIN= VIL (max)<br>~~GO~~|30<br>~~GO~~|—<br>~~GO~~|—<br>~~GO~~|µA<br>~~GO~~|
|IBHHS<br>~~GO~~<br>~~a~~|Bus Hold High SustainingCurrent<br>~~GO~~<br>~~GD~~|VIN= 0.7 × VCCIO<br>~~GO~~<br>~~GD~~|–30<br>~~GO~~<br>~~GD~~|—<br>~~GO~~<br>~~GD~~|—<br>~~GO~~<br>~~GD~~|µA<br>~~GO~~<br>~~GD~~|
|IBHLO<br>~~a~~<br>~~a~~|Bus hold low Overdrive Current<br>~~GD~~<br>~~GD~~|0 ≤ VIN≤ VCCIO<br>~~GD~~<br>~~GD~~|—<br>~~GD~~<br>~~GD~~|—<br>~~GD~~<br>~~GD~~|150<br>~~GD~~<br>~~GD~~|µA<br>~~GD~~<br>~~GD~~|
|IBHHO<br>~~a~~<br>~~a ~~|Bus hold high Overdrive Current<br>~~GD~~<br> ~~a~~|0 ≤ VIN≤ VCCIO<br>~~GD~~<br>~~GD~~|—<br>~~GD~~<br>~~GD~~|—<br>~~GD~~<br>~~GD~~|–150<br>~~GD~~<br>~~GD~~|µA<br>~~GD~~<br>~~GD~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-DS-02086-2.0
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**CertusPro-NX Family Data Sheet**
|**Symbol**|**Parameter**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|VBHT|Bus Hold TripPoints|—|VIL(max)|—|VIH(min)|V|
## **Notes** :
1. Input or I/O leakage current is measured with the pin configured as an input or as an I/O with the output tri-stated. Bus Maintenance circuits are disabled.
2. The input leakage current IIH is the worst-case input leakage per GPIO when the pad signal is high and also higher than the bank VCCIO. This is considered a mixed mode input.
**Table 3.8. DC Electrical Characteristics – High Speed (Over Recommended Operating Conditions)[1]**
|**Symbol**|**Parameter**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|IIL, IIH1|Input or I/O Leakage|0 ≤ VIN≤ VCCIO|—|—|10|µA|
|IPU|I/O Weak Pull-up Resistor<br>Current|0 ≤ VIN≤ 0.7 × VCCIO|–30|—|–150|µA|
|IPD|I/O Weak Pull-down Resistor<br>Current|VIL(max) ≤ VIN≤ VCCIO|30|—|150|µA|
|IBHLS|Bus Hold Low SustainingCurrent|VIN= VIL (max)|30|—|—|µA|
|IBHHS|Bus Hold High SustainingCurrent|VIN= 0.7 × VCCIO|–30|—|—|µA|
|IBHLO|Bus hold low Overdrive Current|0 ≤ VIN≤ VCCIO|—|—|150|µA|
|IBHHO|Bus hold high Overdrive Current|0 ≤ VIN≤ VCCIO|—|—|–150|µA|
|VBHT|Bus Hold TripPoints|—|VIL(max)|—|VIH(min)|V|
## **Note:**
1. Input or I/O leakage current is measured with the pin configured as an input or as an I/O with the output tri-stated. Bus Maintenance circuits are disabled.
**Table 3.9. Capacitors – Wide Range (Over Recommended Operating Conditions)**
|**Symbol**<br>**Parameter**<br>**Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>C11<br>I/O Capacitance1<br>VCCIO= 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V,<br>VCC= typ., VIO= 0 to VCCIO+ 0.2V<br>—<br>6<br>—<br>pF<br>C21<br>Dedicated Input Capacitance1<br>VCCIO= 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V,<br>VCC= typ., VIO= 0 to VCCIO+ 0.2 V<br>—<br>6<br>—<br>pF<br>~~——a~~|**Symbol**<br>**Parameter**<br>**Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>C11<br>I/O Capacitance1<br>VCCIO= 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V,<br>VCC= typ., VIO= 0 to VCCIO+ 0.2V<br>—<br>6<br>—<br>pF<br>C21<br>Dedicated Input Capacitance1<br>VCCIO= 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V,<br>VCC= typ., VIO= 0 to VCCIO+ 0.2 V<br>—<br>6<br>—<br>pF<br>~~——a~~|
|---|---|
|**Note**:||
|1.<br>TA25oC, f = 1.0 MHz.||
|**Table 3.10. Capacitors – High Performance(Over Recommended Operating Conditions)**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>C11<br>I/O Capacitance1<br>VCCIO = 1.8 V, 1.5 V, 1.2 V, VCC = typ.,<br>VIO = 0 to VCCIO+ 0.2 V<br>—<br>6<br>—<br>pF<br>C21<br>Dedicated Input Capacitance1<br>VCCIO = 1.8 V, 1.5 V, 1.2 V, VCC = typ.,<br>VIO = 0 to VCCIO+ 0.2 V<br>—<br>6<br>—<br>pF<br>C31<br>SERDES I/O Capacitance<br>VCCSD*= 1.0 V, VCC = typ., VIO = 0 to<br>VCCSD*+ 0.2 V<br>—<br>5<br>—<br>pF<br>~~Seaman~~||
|**Note:**||
|1.<br>TA25oC, f = 1.0 MHz.||
|**Table 3.11. Single Ended Input Hysteresis – Wide Range (Over Recommended Operating Conditions)**||
|**IO_TYPE**<br>**VCCIO**<br>**TYP Hysteresis**<br>LVCMOS33<br>3.3 V<br>250 mV<br>LVCMOS25<br>3.3 V<br>200 mV<br>2.5 V<br>250 mV<br>LVCMOS18<br>1.8 V<br>180 mV<br>LVCMOS15<br>1.5 V<br>50 mV<br>LVCMOS12<br>1.2 V<br>0<br>LVCMOS10<br>1.2 V<br>0<br>~~=>~~||
|© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed atwww.latticesemi.com/legal.||
|All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.||
|FPGA-DS-02086-2.0|64|
64
**CertusPro-NX Family Data Sheet**
**Table 3.12. Single Ended Input Hysteresis – High Performance (Over Recommended Operating Conditions)**
|**IO_TYPE**|**VCCIO**|**TYP Hysteresis**|
|---|---|---|
|LVCMOS18H|1.8 V|180 mV|
|LVCMOS15H|1.8 V|50 mV|
||1.5 V|150 mV|
|LVCMOS12H|1.2 V|0|
|LVCMOS10H|1.0 V|0|
|MIPI-LP-RX|1.2 V|>25 mV|
## **3.9. Supply Currents**
For estimating and calculating current, use Power Calculator in Lattice Design Software.
This operating and peak current is design dependent and can be calculated in Lattice Design Software. Some blocks can be placed into low current standby modes. Refer to Power Management and Calculation for Certus-NX, CertusPro-NX, and MachXO5-NX Devices (FPGA-TN-02257).
## **3.10. sysI/O Recommended Operating Conditions**
**Table 3.13. sysI/O Recommended Operating Conditions**
|**Standard**<br>~~ee~~|**Support Banks**<br>~~ee~~|**VCCIO(Input)**<br>~~ee~~|**VCCIO(Output)**<br>~~ee~~|
|---|---|---|---|
|||**Typ.**<br>~~ee~~<br>~~a~~|**Typ. **<br>~~ee~~<br>~~a~~|
|**Single-Ended**<br>~~ee~~<br>~~a~~||||
|LVCMOS33<br>~~Ce~~|0, 1, 2, 6, 7<br>~~Ce ~~|3.3<br> ~~GC~~|3.3<br>~~GC~~|
|LVTTL33<br>~~Ge~~|0, 1, 2, 6, 7<br>~~Ge~~|3.3<br>~~Ge~~<br>~~OO~~|3.3<br>~~Ge~~|
|LVCMOS25¹,²<br>~~Ge~~<br>~~eG~~<br>~~Ge~~|0, 1, 2, 6, 7<br>~~Ge~~<br>~~eG~~<br>~~Ge~~|2.5, 3.3<br>~~Ge~~<br>~~eG~~<br>~~OO~~<br>~~OO~~<br>|2.5<br>~~Ge~~<br>~~eG~~<br>|
|LVCMOS18¹,²<br>~~eG~~<br>~~eG~~<br>~~Ge~~|0, 1, 2, 6, 7<br>~~eG~~<br>~~eG~~<br>~~Ge~~|1.5, 1.8, 2.5, 3.3<br>~~eG~~<br>~~OO~~<br>~~eG~~<br>~~OO~~<br>|1.8<br>~~eG~~<br>~~eG~~<br>|
|LVCMOS18H<br>~~eG~~<br>~~Ge~~|3, 4, 5<br>~~eG~~<br>~~Ge ~~|1.8<br>~~eG~~<br>~~OO~~<br> ~~GG~~|1.8<br>~~eG~~<br>~~GG~~|
|LVCMOS15¹,²<br>~~Ge~~|0, 1, 2, 6, 7<br>~~Ge ~~|1.2, 1.5, 1.8, 2.5, 3.3<br> ~~GC~~|1.5<br>~~GC~~|
|LVCMOS15H¹<br>~~Ge~~|3, 4, 5<br>~~Ge ~~|1.5, 1.8<br> ~~GC~~|1.5<br>~~GC~~|
|LVCMOS12¹,²<br>~~Ce~~<br>~~eG~~|0, 1, 2, 6, 7<br>~~Ce~~<br>~~eG~~|1.2, 1.5, 1.8, 2.5, 3.3<br>~~Ce~~<br>~~GO~~|1.2<br>~~Ce~~<br>~~GO~~|
|LVCMOS12H¹<br>~~Ce~~<br>~~eG~~|3, 4, 5<br>~~Ce~~<br>~~eG~~|1.2, 1.5, 1.8<br>~~Ce~~<br>~~GO~~|1.2<br>~~Ce~~<br>~~GO~~|
|LVCMOS10¹<br>~~eG~~<br>~~Ge~~|0, 1, 2, 6, 7<br>~~eG ~~<br>~~Ge ~~|1.2, 1.5, 1.8, 2.5, 3.3<br> ~~GO~~<br> ~~GG~~|—<br>~~GO~~<br>~~GG~~|
|LVCMOS10H¹<br>~~Ge~~|3, 4, 5<br>~~Ge ~~|1.0, 1.2, 1.357, 1.5, 1.8<br> ~~GC~~|1.0<br>~~GC~~|
|LVCMOS10R¹<br>~~Ge~~|3, 4, 5<br>~~Ge ~~|1.0, 1.2, 1.357, 1.5, 1.8<br> ~~GC~~|—<br>~~GC~~|
|SSTL135_I, SSTL135_II3<br>~~Ce~~<br>~~eG~~|3, 4, 5<br>~~Ce~~<br>~~eG~~|1.357<br>~~Ce~~<br>~~GO~~|1.35<br>~~Ce~~<br>~~GO~~|
|SSTL15_I, SSTL15_II3<br>~~Ce~~<br>~~eG~~|3, 4, 5<br>~~Ce~~<br>~~eG~~|1.58<br>~~Ce~~<br>~~GO~~|1.58<br>~~Ce~~<br>~~GO~~|
|HSTL15_I3<br>~~eG~~<br>~~Ge~~|3, 4, 5<br>~~eG ~~<br>~~Ge ~~|1.58<br> ~~GO~~<br> ~~GG~~|1.58<br>~~GO~~<br>~~GG~~|
|HSUL123<br>~~Ge~~|3, 4, 5<br>~~Ge ~~|1.2<br> ~~GC~~|1.2<br>~~GC~~|
|LVSTL_I, LVSTL_II3<br>~~Ge~~|3, 4, 5<br>~~Ge ~~|1.1<br> ~~GC~~|1.1<br>~~GC~~|
|MIPI D-PHY(LP Mode)6<br>~~Ge~~|3, 4, 5<br>~~Ge~~|1.2<br>~~Ge~~|1.2<br>~~Ge~~|
|**Differential6**<br>~~Ge~~||||
|LVDS<br>~~Ge~~|3, 4, 5<br>~~Ge~~|1.2, 1.35, 1.5, 1.8<br>~~CO~~|1.8<br>~~CO~~|
|LVDSE5<br>~~Ge~~<br>~~Ge~~|0, 1, 2, 6, 7<br>~~Ge ~~<br>~~Ge ~~|—<br> ~~CO~~<br> ~~GO~~|2.5<br>~~CO~~<br>~~GO~~|
|subLVDS<br>~~Ge~~|3, 4, 5<br>~~Ge ~~|1.2, 1.35, 1.5, 1.8<br> ~~GC~~|—<br>~~GC~~|
|subLVDSE5<br>~~Ge~~|0, 1, 2, 6, 7<br>~~Ge~~|—<br>~~Ge~~|1.8<br>~~Ge~~|
|subLVDSEH5<br>~~Ge~~|3, 4, 5<br>~~Ge~~|—<br>~~Ge~~|1.8<br>~~Ge~~|
|SLVS6<br>~~Ge~~|3, 4, 5<br>~~Ge ~~|1.2, 1.357, 1.5, 1.84<br> ~~GC~~|1.2, 1.5, 1.84<br>~~GC~~|
|MIPI D-PHY(HS Mode)6<br>~~Ge~~|3, 4, 5<br>~~Ge~~|1.1, 1.2<br>~~Ge~~|1.1, 1.2<br>~~Ge~~|
FPGA-DS-02086-2.0
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**CertusPro-NX Family Data Sheet**
|**Standard**|**Support Banks**|**VCCIO(Input)**|**VCCIO(Output)**|
|---|---|---|---|
|||**Typ.**|**Typ. **|
|LVCMOS33D5|0, 1, 2, 6, 7|—|3.3|
|LVTTL33D5|0, 1, 2, 6, 7|—|3.3|
|LVCMOS25D5|0, 1, 2, 6, 7|—|2.5|
|SSTL135D_I, SSTL135D_II5|3, 4, 5|1.357, 1.5, 1.8|1.357|
|SSTL15D_I, SSTL15D_II5|3, 4, 5|1.5, 1.8|1.5|
|HSTL15D_I5|3, 4, 5|1.5, 1.8|1.5|
|HSUL12D5|3, 4, 5|1.2, 1.357, 1.5, 1.8|1.2|
|LVSTLD_I, LVSTLD_II5|3, 4, 5|1.1|1.1|
## **Notes** :
1. Single-ended input can mix into I/O Banks with VCCIO different from the standard requires due to some of these input standards use internal supply voltage source (VCC, VCCAUX) to power the input buffer, which makes them to be independent of VCCIO voltage. For more details, refer to sysI/O Usage Guide for Nexus Platform (FPGA-TN-02067). The following is a brief guideline to follow:
- a. Weak pull-up on the I/O must be set to OFF.
- b. Bank 3, Bank 4, and Bank 5 I/O can only mix into banks with VCCIO higher or equal than the pin standard, due to clamping diode on the pin in these banks. Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7 do not have this restriction.
- c. LVCMOS25 uses VCCIO supply on input buffer in Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7. It can be supported with VCCIO = 3.3 V to meet the VIH and VIL requirements, but there is additional current drawn on VCCIO. Hysteresis has to be disabled when using 3.3 V supply voltage.
- d. LVCMOS15 uses VCCIO supply on input buffer in Bank 3, Bank 4, and Bank 5. It can be supported with VCCIO = 1.8 V to meet the VIH and VIL requirements, but there is additional current drawn on VCCIO.
2. Single-ended LVCMOS inputs can be mixed into I/O Banks with different VCCIO, providing weak pull-up not being used. For additional information on Mixed I/O in Bank VCCIO, refer to sysI/O Usage Guide for Nexus Platform (FPGA-TN-02067) **.**
3. These inputs use differential input comparator in Bank 3, Bank 4, and Bank 5. The differential input comparator uses VCCAUXH power supply. These inputs require the VREF pin to provide the reference voltage in the Bank. Refer to sysI/O Usage Guide for Nexus Platform (FPGA-TN-02067) for details **.**
4. All differential inputs use differential input comparator in Bank 3, Bank 4, and Bank 5. The differential input comparator uses VCCAUXH power supply. There is no differential input signaling supported in Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7.
5. These outputs are emulating differential output pair with single-ended output drivers with true and complement outputs driving on each of the corresponding true and complement output pair pins. The common mode voltage VCM is ½ × VCCIO. Refer to sysI/O Usage Guide for Nexus Platform (FPGA-TN-02067) for details **.**
6. Soft MIPI D-PHY HS using sysI/O is supported with SLVS input and output that can be placed in banks with VCCIO voltage shown in SLVS. D-PHY with HS and LP modes supported needs to be placed in banks with VCCIO voltage = 1.2 V. Soft MIPI D-PHY LP input and output using sysI/O are supported with LVCMOS12.
7. VCCIO = 1.35 V is only supported in Bank 3, Bank 4, and Bank 5, for use with DDR3L interface in the bank. These Input and Output standards can fit into the same bank with the VCCIO = 1.35 V.
8. LVCMOS15 input uses VCCIO supply voltage. If VCCIO is 1.8 V, the DC levels for LVCMOS15 are still met, but there could be increase in input buffer current.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
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**CertusPro-NX Family Data Sheet**
## **3.11. sysI/O Single-Ended DC Electrical Characteristics**
**Table 3.14. sysI/O DC Electrical Characteristics – Wide Range I/O (Over Recommended Operating Conditions)**
|**Input/Output**<br>**Standard**<br>~~rTP~~|**VIL¹ **<br>~~TT~~|**VIL¹ **<br>~~TT~~|**VIH¹ **<br>~~TT~~|**VIH¹ **<br>~~TT~~|**VOL Max**<br>**(V)**<br>~~rTP~~<br>~~le~~|**VOH Min²**<br>**(V)**<br>~~rTP~~<br>~~le~~|**IOL(mA)**<br>~~rTP~~<br>~~le~~|**IOH(mA)**<br>~~rTP~~<br>~~le~~|
|---|---|---|---|---|---|---|---|---|
||**Min**<br>**(V)**<br>~~rTP~~|**Max (V)**<br>~~rTP~~<br>~~TT~~|**Min (V)**<br>~~rTP~~<br>~~TT~~|**Max (V)**<br>~~rTP~~<br>~~TT~~|||||
|LVTTL33<br>LVCMOS33<br>~~rTP~~|—<br>~~rTP~~|0.8<br>~~rTP~~<br>~~TT~~|2.0<br>~~rTP~~<br>~~TT~~|3.4655<br>~~rTP~~<br>~~TT~~|0.4<br>~~rTP~~<br>~~le~~|VCCIO – 0.4<br>~~rTP~~<br>~~le~~|2, 4, 8, 12,<br>16,<br>“50RS”3<br>~~rTP~~<br>~~le~~|–2, –4,<br>–8,<br>–12, –16,<br>“50RS”3<br>~~rTP~~<br>~~le~~|
|LVCMOS25<br>~~**p**f~~|—<br>~~f~~<br>||0.7<br>~~TT~~<br>~~|~~|1.7<br>~~TT~~<br>~~fp~~|3.4655<br>~~TT ~~<br>~~fp~~|0.4<br> ~~le~~<br>~~fp|]~~|VCCIO – 0.45<br>~~le~~<br>~~|]~~|2, 4, 8, 10,<br>“50RS”3<br>~~le~~<br>~~|]~~|–2, –4,<br>–8,<br>–10,<br>“50RS”3<br>~~le~~<br>~~|]~~|
|LVCMOS18<br>~~**p**f~~|—<br>~~f~~<br>||0.35 × VCCIO<br>~~|~~|0.65 × VCCIO<br>~~fp~~|3.4655<br>~~fp~~|0.4<br>~~fp|]~~|VCCIO – 0.45<br>~~|]~~|2, 4, 8,<br>“50RS”3<br>~~|]~~|–2, –4,<br>–8,<br>“50RS”3<br>~~|]~~|
|LVCMOS15<br>~~**p**f~~|—<br>~~f~~<br>||0.35 × VCCIO<br>~~|~~|0.65 × VCCIO<br>~~fp~~|3.4655<br>~~fp~~|0.4<br>~~fp|]~~|VCCIO – 0.4<br>~~|]~~|2, 4<br>~~|]~~|–2, –4<br>~~|]~~|
|LVCMOS12<br>~~**p**f~~<br>~~eG~~|—<br>~~f~~<br>|<br>~~eG~~|0.35 × VCCIO<br>~~| ~~<br>~~Ge~~|0.65 × VCCIO<br> ~~fp~~<br>~~GG~~|3.4655<br>~~fp~~<br>~~o~~<br>~~GG~~|0.4<br>~~fp |]~~<br>~~o~~<br>~~GG~~|VCCIO – 0.4<br>~~|]~~<br>~~o~~<br>~~GG~~|2, 4<br>~~|]~~<br>~~o~~<br>~~GG~~|–2, –4<br>~~|]~~<br>~~o~~<br>~~GG~~|
|LVCMOS10<br>~~eG~~|—<br>~~eG~~|0.35 × VCCIO<br>~~Ge~~|0.65 × VCCIO<br>~~GG~~|3.4655<br>~~GG~~|No O/P Support<br>~~GG~~||||
**Notes** :
1. VCCIO for input level refers to the supply rail level associated with a given input standard.
2. VCCIO for the output levels refer to the VCCIO of the CertusPro-NX device.
3. Selecting “50RS” in driver strength is to select 50 Ω series impedance driver.
4. For electro-migration, the combined DC current sourced or sinked by I/O pads between two consecutive VCCIO or GND pad connections, or between the last VCCIO or GND in an I/O bank and the end of an I/O bank, as shown in the Logic Signal Connections table (also shown as I/O grouping) shall not exceed a maximum of n × 8 mA. _n_ is the number of I/O pads between the two consecutive bank VCCIO or GND connections or between the last VCCIO and GND in a bank and the end of a bank. I/O Grouping can be found in the Data Sheet Pin Summary Tables, which can also be generated from the Lattice Radiant software.
5. If the input clamp is OFF, VIH (Max) in Banks 0, 1, 2, 6, and 7 can go up to 3.465 V. Otherwise, the input voltage cannot be higher than VCCIO + 0.3 V.
**Table 3.15. sysI/O DC Electrical Characteristics – High Performance I/O (Over Recommended Operating Conditions)**
|**Input/Output**<br>**Standard**<br>~~ptt~~|**VIL¹ **|**VIL¹ **|**VIH¹ **|**VIH¹ **|**VOL Max (V)**<br>~~te~~|**VOH Min² (V)**|**IOL (mA)**|**IOH (mA)**|
|---|---|---|---|---|---|---|---|---|
||**Min(V)**<br>~~ptt~~|**Max(V)**<br>~~ptt~~<br>~~|~~|**Min(V)**<br>~~te~~|**Max(V)**<br>~~te~~|||||
|LVCMOS18H<br>~~ptt~~|—<br>~~ptt~~|0.35 × VCCIO<br>~~ptt~~<br>~~|~~|0.65 × VCCIO<br>~~te~~|VCCIO+ 0.3<br>~~te~~|0.4<br>~~te~~|VCCIO – 0.45|2, 4, 8, 12,<br>“50RS”3|–2, –4,<br>–8,<br>–12,<br>“50RS”3|
|LVCMOS15H<br>~~ptt~~<br>~~aa~~|—<br>~~ptt~~<br>~~aa~~|0.35 × VCCIO<br>~~ptt~~<br>~~| ~~<br>~~aa~~|0.65 × VCCIO<br> ~~te~~<br>~~aa~~|VCCIO+ 0.3<br>~~te~~<br>~~aa~~|0.4<br>~~te~~|VCCIO – 0.4|2, 4, 8,<br>“50RS”3|–2, –4,<br>–8, “50RS”3|
|LVCMOS12H<br>~~a~~<br>~~po~~|—<br>~~a~~|0.35 × VCCIO<br>~~aa~~|0.65 × VCCIO|VCCIO+ 0.3|0.4|VCCIO – 0.4|2, 4, 8,<br>“50RS”3|–2, –4,<br>–8, “50RS”3|
|LVCMOS10H<br><br>~~po~~<br>~~po~~|—<br>|0.35 × VCCIO<br>~~a~~|0.65 × VCCIO|VCCIO+ 0.3|0.27 × VCCIO|0.75 × VCCIO|2, 4|–2, –4|
|SSTL15_I<br><br>~~po~~<br>~~po~~|—<br>|VREF – 0.10<br>~~a~~|VREF + 0.1|VCCIO+ 0.3|0.30|VCCIO – 0.30|7.5|–7.5|
|SSTL15_II<br>~~po~~<br>~~a~~<br>~~po~~|—|VREF – 0.10|VREF + 0.1|VCCIO+ 0.3|0.30|VCCIO – 0.30|8.8|–8.8|
|HSTL15_I<br>~~a~~<br>~~po~~<br>~~po~~|—|VREF – 0.10|VREF + 0.1|VCCIO+ 0.3|0.40|VCCIO – 0.40|8|–8|
|SSTL135_I<br>~~po~~<br>~~po~~<br>~~po~~|—|VREF – 0.09|VREF + 0.09|VCCIO+ 0.3|0.27|VCCIO – 0.27|6.75|–6.75|
|SSTL135_II<br>~~po~~<br>~~po~~|—|VREF – 0.09|VREF + 0.09|VCCIO+ 0.3|0.27|VCCIO– 0.27|8|–8|
|LVCMOS10R<br>~~po~~<br>~~pt~~|—<br>~~pt~~<br>~~|~~|VREF – 0.10<br>~~|~~|VREF + 0.10<br>~~|~~|VCCIO+ 0.3<br>~~tf}~~|—<br>~~tf}~~|—<br>~~tf}~~|—<br>|—<br>|
|HSUL12<br>~~pt~~|—<br>~~pt~~<br>~~|~~|VREF – 0.10<br>~~|~~|VREF + 0.10<br>~~|~~|VCCIO+ 0.3<br>~~tf}~~|0.3<br>~~tf}~~|VCCIO – 0.3<br>~~tf}Pf~~|8.0, 7.5, 6.25,<br>5<br>~~Pf~~|–8.0,<br>–7.5,<br>–6.25, –5<br>~~Pf~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
67
**CertusPro-NX Family Data Sheet**
|**Input/Output**<br>**Standard**|**VIL¹ **|**VIL¹ **|**VIH¹ **|**VIH¹ **|**VOL Max (V)**|**VOH Min² (V)**|**IOL (mA)**|**IOH (mA)**|
|---|---|---|---|---|---|---|---|---|
||**Min(V)**|**Max(V)**|**Min(V)**|**Max(V)**|||||
|LVSTL_I|–0.2|0.35 × VCCIO|0.65 × VCCIO|VCCIO+ 0.2|0.1 × VCCIO|0.3 × VCCIO|2, 4, 6, 8, 10|–2, –4,<br>–6, –8,<br>–10|
|LVSTL_II|–0.2|0.35 × VCCIO|0.65 × VCCIO|VCCIO+ 0.2|0.1 × VCCIO|0.36 × VCCIO|4, 6|–4, –6|
**Notes** :
1. VCCIO for input level refers to the supply rail level associated with a given input standard.
2. VCCIO for the output levels refer to the VCCIO of the CertusPro-NX device.
3. Select “50RS” in driver strength is selecting the 50Ω series impedance driver.
|4.<br>For electro-migration, the combined DC current sourced or sinked by I/O pads between two consecutive VCCIOor GND pad|
|---|
|connections, or between the last VCCIOor GND in an I/O bank and the end of an I/O bank, as shown in the Logic Signal|
|Connections table (also shown as I/O grouping) shall not exceed a maximum of n × 8 mA._n_is the number of I/O pads between|
|the two consecutive bank VCCIOor GND connections or between the last VCCIOand GND in a bank and the end of a bank. I/O|
|Grouping can be found in the Data Sheet Pin Summary Tables, which can also be generated from the Lattice Radiant software.|
|**Table 3.16. I/O Resistance Characteristics(Over Recommended Operating Conditions)**<br>**Parameter**<br>**Description**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>50RS<br>Output Drive Resistance when 50RS<br>Drive Strength Selected<br>VCCIO= 1.8 V, 2.5 V, or 3.3 V<br>—<br>50<br>—<br>Ω<br>RDIFF<br>Input Differential Termination<br>Resistance<br>Bank 3, Bank 4, and Bank 5, for I/O<br>selected to be differential<br>—<br>100<br>—<br>Ω<br>SE Input<br>Termination<br>Input Single Ended Termination<br>Resistance<br>Bank 3, Bank 4, and Bank 5 for I/O<br>selected to be Single Ended<br>36<br>40<br>64<br>Ω<br>46<br>50<br>80<br>56<br>60<br>96<br>71<br>75<br>120<br>~~--—-—~~|
|**Table 3.17. VIN Maximum Overshoot/Undershoot Allowance – Wide Range1, 2**<br>**AC Voltage Overshoot**<br>**% of UI at –40 °C to 100 °C**<br>**AC Voltage Undershoot**<br>**% of UI at –40 °C to 100 °C**<br>VCCIO+ 0.4<br>100.0%<br>–0.4<br>100.0%<br>VCCIO+ 0.5<br>100.0%<br>–0.5<br>44.2%<br>VCCIO+ 0.6<br>94.0%<br>–0.6<br>10.1%<br>VCCIO+ 0.7<br>21.0%<br>–0.7<br>1.3%<br>VCCIO+ 0.8<br>10.2%<br>–0.8<br>0.3%<br>VCCIO+ 0.9<br>2.5%<br>–0.9<br>0.1%<br>~~ae~~|
|**Notes**:|
|1.<br>The peak overshoot or undershoot voltage and the duration above VCCIO+ 0.2 V or below GND – 0.2 V must not exceed the|
|values in this table.|
2. For UI less than 20 µs.
**Table 3.18. VIN Maximum Overshoot/Undershoot Allowance – High Performance[1, 2] AC Voltage Overshoot % of UI at –40 °C to 100 °C AC Voltage Undershoot % of UI at –40 °C to 100 °C** VCCIO + 0.5 100.0% –0.5 100.0% VCCIO + 0.6 47.3% –0.6 47.3% VCCIO + 0.7 10.9% –0.7 10.9% VCCIO + 0.8 2.7% –0.8 2.7% VCCIO + 0.9 0.7% –0.9 0.7% ~~——————~~ **Notes** : 1. The peak overshoot or undershoot voltage and the duration above VCCIO + 0.2 V or below GND – 0.2 V must not exceed the values in this table.
2. For UI less than 20 µs.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **3.12. sysI/O Differential DC Electrical Characteristics**
## **3.12.1. LVDS**
LVDS input buffer on CertusPro-NX device is operating with VCCAUX = 1.8 V, and the LVDS input voltage cannot exceed the VCCIO voltage of the related bank. LVDS output buffer is powered by the Bank VCCIO at 1.8 V.
LVDS can only be supported in Bank 3, Bank 4, and Bank 5. LVDS25 output can be emulated with LVDS25E in Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7. This is described in the LVDS25E (Output Only) section.
**Table 3.19. LVDS DC Electrical Characteristics (Over Recommended Operating Conditions)[1 ]**
|**Parameter**<br>~~a~~|**Description**<br>~~a~~|**Test Conditions**<br>~~a~~|**Min**<br>~~a~~|**Typ**<br>~~a~~|**Max**<br>~~a~~|**Unit**<br>~~a~~|
|---|---|---|---|---|---|---|
|VINP, VINM<br>~~a~~|Input Voltage<br>~~a~~|—<br>~~a~~|0<br>~~a~~|—<br>~~a~~|1.603<br>~~a~~|V<br>~~a~~|
|VICM<br>~~a~~|Input Common Mode Voltage<br>~~a~~|Half the sum of the two Inputs<br>~~a~~|0.05<br>~~a~~|—<br>~~a~~|1.552<br>~~a~~|V<br>~~a~~|
|VTHD<br>~~ee~~<br>~~ee~~|Differential Input Threshold<br>~~ee~~<br>|Difference between the two Inputs<br>~~ee~~<br>|±100<br>~~ee~~<br>|—<br>~~ee~~<br>|—<br>~~ee~~<br>|mV<br>~~ee~~<br>|
|IIN<br>~~ee~~|Input Current<br>|Power On or Power Off<br>|—<br>|—<br>|±10<br>|µA<br>|
|VOH<br>~~eea~~|Output High Voltage for VOPor VOM<br>~~a~~|RT= 100 Ω<br>~~a~~|—<br>~~a~~|1.425<br>~~a~~|1.60<br>~~a~~|V<br>~~a~~|
|VOL<br>~~a~~|Output Low Voltage for VOPor VOM<br>~~a~~|RT= 100 Ω<br>~~a~~|0.9 V<br>~~a~~|1.075<br>~~a~~|—<br>~~a~~|V<br>~~a~~|
|VOD<br>~~a~~|Output Voltage Differential<br>~~a~~|(VOP– VOM), RT= 100 Ω<br>~~a~~|250<br>~~a~~|350<br>~~a~~|450<br>~~a~~|mV<br>~~a~~|
|VOD<br>~~a~~<br>~~a~~|Change in VODBetween High and<br>Low<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|50<br>~~a~~<br>~~a~~|mV<br>~~a~~<br>~~a~~|
|VOCM<br>~~a~~<br>~~a~~|Output Common Mode Voltage<br>~~a~~<br>|(VOP+ VOM)/2, RT= 100 Ω<br>~~a~~<br>|1.125<br>~~a~~<br>~~ee~~<br>|1.25<br>~~a~~<br>~~ee~~<br>|1.375<br>~~a~~<br>|V<br>~~a~~<br>|
|VOCM<br>~~a~~<br>~~a~~<br>~~a~~|Change in VOCM, VOCM(Max) –<br>VOCM(Min)<br>~~a~~<br>~~a~~<br>~~ee~~<br>|—<br>~~a~~<br>~~a~~<br>~~ee~~<br>|—<br>~~a~~<br>~~a~~<br>~~ee~~<br>~~ee~~<br><br>~~ee~~|—<br>~~a~~<br>~~a~~<br>~~ee~~<br>~~ee~~<br><br>~~ee~~|50<br>~~a~~<br>~~a~~<br>~~ee~~<br>|mV<br>~~a~~<br>~~a~~<br>~~ee~~<br>|
|ISAB<br>~~a~~<br>~~a ee~~|Output Short Circuit Current<br>~~a~~<br>~~ee~~<br>~~ee~~|VOD= 0 V Driver outputs shorted to<br>each other<br>~~a~~<br>~~ee~~<br>~~ee~~|—<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|—<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|12<br>~~a~~<br>~~ee~~<br>~~ee~~|mA<br>~~a~~<br>~~ee~~<br>~~ee~~|
|VOS<br>~~a ee~~<br>~~a~~|Change in VOSbetween H and L<br>~~ee~~<br>~~a~~|—<br>~~ee~~<br>~~a~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~a~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~a~~|50<br>~~ee~~<br>~~a~~|mV<br>~~ee~~<br>~~a~~|
1. LVDS input or output are supported in Bank 3, Bank 4, and Bank 5. LVDS input uses VCCAUXH on the differential input comparator, and can be located in any VCCIO voltage bank. LVDS output uses VCCIO on the differential output driver, and can only be located in bank with VCCIO = 1.8 V.
2. VICM is depending on VID, input differential voltage, so the voltage on pin cannot exceed VINP/INM(Min/Max) requirements. VICM(Min) = VINP/INM(Min) + ½VID, VICM(Max) = VINP/INM(Max) – ½VID. Values in the table are based on minimum VID of +/- 100 mV.
3. VINP/INM(Max) must be less than or equal to VCCIO in all cases.
## **3.12.2. LVDS25E (Output Only)**
Three sides of the CertusPro-NX devices, Top, Left and Right, support LVDS25 outputs with emulated complementary LVCMOS outputs in conjunction with a parallel resistor across the driver outputs. The scheme shown in Figure 3.2 is one possible solution for point-to-point signals.
**Table 3.20. LVDS25E DC Conditions**
|**Parameter**<br>~~a~~|**Description**<br>~~a~~<br>~~a~~|**Typical**<br>~~a~~<br>~~a~~|**Unit**<br>~~a~~|
|---|---|---|---|
|VCCIO<br>~~a~~<br>~~a~~|Output Driver Supply (±5%)<br>~~a~~<br>~~a~~|2.50<br>~~a~~<br>~~a~~|V<br>~~a~~|
|ZOUT<br>~~a ~~|Driver Impedance<br> ~~a~~|20|Ω|
|RS<br>~~a~~|Driver Series Resistor (±1%)|158|Ω|
|RP<br>~~a~~<br>~~a~~|Driver Parallel Resistor (±1%)|140|Ω|
|RT<br>~~a~~|Receiver Termination (±1%)|100|Ω|
|VOH<br>~~a~~<br>~~a~~|Output High Voltage|1.43|V|
|VOL<br>~~a a~~|Output Low Voltage<br>~~a~~|1.07|V|
|VOD<br>~~a~~|Output Differential Voltage|0.35|V|
|VCM<br>~~a~~<br>~~a ~~|Output Common Mode Voltage<br> ~~a~~|1.25|V|
|ZBACK<br>~~a~~|Back Impedance<br>~~a~~<br>~~a~~|100.5|Ω|
|IDC<br>~~a~~<br>~~a~~|DC Output Current<br>~~a~~<br>~~a~~<br>~~a~~|–6.03|mA|
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
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**CertusPro-NX Family Data Sheet**
**==> picture [361 x 130] intentionally omitted <==**
**----- Start of picture text -----**<br>
VCCIO = 2.5 V (±5%)<br>RS = 158<br>(±1%)<br>8 mA<br>LVCMOS25<br>RS = 140 RS = 100<br>VCCIO = 2.5 V (±5%) (±1%) (±1%)<br>RS = 158<br>(±1%)<br>8 mA<br>LVCMOS25<br>Transmission line, Zo = 100 differential<br>ON-chip OFF-chip ON-chip OFF-chip<br>**----- End of picture text -----**<br>
**Figure 3.2. LVDS25E Output Termination Example**
## **3.12.3. SubLVDS (Input Only)**
SubLVDS is a reduced-voltage form of LVDS signaling, very similar to LVDS (Figure 3.3). It is a standard used in many camera types of applications. Similar to LVDS, the CertusPro-NX devices can support the subLVDS input signaling with the same LVDS input buffer, and the subLVDS input voltage cannot exceed the VCCIO voltage of the related bank. The output for subLVDS is implemented in subLVDSE/subLVDSEH with a pair of LVCMOS18 output drivers. See the SubLVDSE/SubLVDSEH (Output Only) section for more details.
**Table 3.21. SubLVDS Input DC Electrical Characteristics (Over Recommended Operating Conditions)**
**==> picture [487 x 262] intentionally omitted <==**
**----- Start of picture text -----**<br>
Parameter Description Test Conditions Min Typ Max [1] Unit<br>VID Input Differential Threshold Voltage Over VICM range 70 150 200 mV<br>o VICM Input Common Mode Voltage Half the sum of the two Inputs e 0.4 0.9 1.4 V<br>Note :<br>1. VICM+½VID cannot exceed the bank VCCIO in all cases.<br>Sub-LVDS Driver PCB Traces, Connectors or Cables<br>Z0 = 50<br>+ +<br>RT = 100<br>100 differential ± 1%*<br>– –<br>Z0 = 50<br>Off-chip On-chip<br>**----- End of picture text -----**<br>
**Figure 3.3. SubLVDS Input Interface**
## **3.12.4. SubLVDSE/SubLVDSEH (Output Only)**
SubLVDS output uses a pair of LVCMOS18 drivers with True and Complement outputs (Figure 3.4). The VCCIO of the bank used for subLVDSE or subLVDSEH needs to be powered by 1.8 V. SubLVDSE is for Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7; and subLVDSEH is for Bank 3, Bank 4, and Bank 5.
Performance of the subLVDSE/subLVDSEH driver is limited to the performance of LVCMOS18.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**Table 3.22. SubLVDS Output DC Electrical Characteristics (Over Recommended Operating Conditions)**
**==> picture [487 x 469] intentionally omitted <==**
**----- Start of picture text -----**<br>
Parameter Description Test Conditions Min Typ Max Unit<br>VOD Output Differential Voltage Swing — — 150 — mV<br>a VOCM Output Common Mode Voltage Half the sum of the two Outputs — 0.9 — V<br>VCCIO = +1.8 V PCB Traces, Connectors or Cables<br>Z0 = 50<br>Rs = 267 ±1%<br>+ +<br>SubLVDS Output<br>SubLVDSE Rp = 121 ±1% 100 differential RT = 100 ±1% Sub-LVDS Recevier<br>SubLVDSEH<br>– –<br>Rs = 267 ±1%<br>Z0 = 50<br>SS<br>0<br>On-chip Off-chip On-chip Off-chip<br>Figure 3.4. SubLVDS Output Interface<br>3.12.5. SLVS<br>Scalable Low-Voltage Signaling (SLVS) is based on a point-to-point signaling method defined in the JEDEC JESD8-13<br>(SLVS-400) standard. This standard evolved from the traditional LVDS standard with smaller voltage swings and a lower<br>common-mode voltage. The 200 mV (400 mV p-p) SLVS swing contributes to a reduction in power.<br>The CertusPro-NX devices receive SLVS differential input with the LVDS input buffer (Table 3.23). This LVDS(Table 3.23). This LVDS). This LVDS input buffer<br>is designed to cover a wide input common mode range that can meet the SLVS input standard specified by the JEDEC<br>standard.<br>Table 3.23. SLVS Input DC Characteristics (Over Recommended Operating Conditions)<br>Parameter Description Test Conditions Min Typ Max Unit<br>VID Input Differential Threshold Voltage Over VICM range 70 — — mV<br>VICM Input Common Mode Voltage Half the sum of the two 70 200 330 mV<br>a<br>**----- End of picture text -----**<br>
The CertusPro-NX devices receive SLVS differential input with the LVDS input buffer (Table 3.23). This LVDS(Table 3.23). This LVDS). This LVDS input buffer is designed to cover a wide input common mode range that can meet the SLVS input standard specified by the JEDEC standard.
The SLVS output on the CertusPro-NX device is supported with the LVDS drivers found in Bank 3, Bank 4, and Bank 5. The LVDS driver on the CertusPro-NX device is a current controlled driver (Figure 3.5). It can be configured as LVDS driver or configured with the 100 Ω differential termination with center-tap set to VOCM at 200 mV. This means the differential output driver can be placed into bank with VCCIO = 1.2 V, 1.5 V, or 1.8 V, even if it is powered by VCCIO. See Table 3.24 for more details.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**Table 3.24. SLVS Output DC Characteristics (Over Recommended Operating Conditions)**
**Parameter Description Test Conditions Min Typ Max Unit** 1.2, 1.5, VCCIO Bank VCCIO — –5% 1.8 +5% V VOD Output Differential Voltage Swing — 140 200 270 mV VOCM Output Common Mode Voltage Half the sum of the two Outputs 150 200 250 mV ~~—Se~~ ZOS Single-Ended Output Impedance — 37.5 50 62.5 Ω SLVS Receiver 100 Diff SLVS Z0=50 On Chip SLVS Driver LVDS Z0=50
**Figure 3.5. SLVS Interface**
## **3.12.6. Soft MIPI D-PHY**
When Soft D-PHY is implemented inside the FPGA logic, the I/O interface needs to use sysI/O buffers to connect to external D-PHY pins.
The CertusPro-NX sysI/O provides support for SLVS, as described in SLVS section, plus the LVCMOS12 input/output buffers together to support the High Speed (HS) and Low Power (LP) modes as defined in MIPI Alliance Specification for D-PHY.
To support MIPI D-PHY with SLVS (LVDS) and LVCMOS12, the bank VCCIO cannot be set to 1.5 V or 1.8 V. It must connect to 1.2 V, or 1.1 V (Figure 3.6).
All other DC parameters are the same as listed in SLVS section. DC parameters for the LP driver and receiver are the same as listed in LVCMOS12.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|+<br>–<br>+<br>LP Data_P<br>LPenable<br>HSenable<br>HS Data<br>LVCMOS12<br>SLVS<br>Z0=50<br>MIPI Receiver<br>100 Diff<br>LP Data_N<br>LPenable<br>LVCMOS12<br>–<br>~~hah~~<br>~~—~~<br>~~>~~|+<br>–<br>+<br>LP Data_P<br>LPenable<br>HSenable<br>HS Data<br>LVCMOS12<br>SLVS<br>Z0=50<br>MIPI Receiver<br>100 Diff<br>LP Data_N<br>LPenable<br>LVCMOS12<br>–<br>~~hah~~<br>~~—~~<br>~~>~~|+<br>–<br>+<br>LP Data_P<br>LPenable<br>HSenable<br>HS Data<br>LVCMOS12<br>SLVS<br>Z0=50<br>MIPI Receiver<br>100 Diff<br>LP Data_N<br>LPenable<br>LVCMOS12<br>–<br>~~hah~~<br>~~—~~<br>~~>~~|+<br>–<br>+<br>LP Data_P<br>LPenable<br>HSenable<br>HS Data<br>LVCMOS12<br>SLVS<br>Z0=50<br>MIPI Receiver<br>100 Diff<br>LP Data_N<br>LPenable<br>LVCMOS12<br>–<br>~~hah~~<br>~~—~~<br>~~>~~|+<br>–<br>+<br>LP Data_P<br>LPenable<br>HSenable<br>HS Data<br>LVCMOS12<br>SLVS<br>Z0=50<br>MIPI Receiver<br>100 Diff<br>LP Data_N<br>LPenable<br>LVCMOS12<br>–<br>~~hah~~<br>~~—~~<br>~~>~~|+<br>–<br>+<br>LP Data_P<br>LPenable<br>HSenable<br>HS Data<br>LVCMOS12<br>SLVS<br>Z0=50<br>MIPI Receiver<br>100 Diff<br>LP Data_N<br>LPenable<br>LVCMOS12<br>–<br>~~hah~~<br>~~—~~<br>~~>~~|+<br>–<br>+<br>LP Data_P<br>LPenable<br>HSenable<br>HS Data<br>LVCMOS12<br>SLVS<br>Z0=50<br>MIPI Receiver<br>100 Diff<br>LP Data_N<br>LPenable<br>LVCMOS12<br>–<br>~~hah~~<br>~~—~~<br>~~>~~|+<br>–<br>+<br>LP Data_P<br>LPenable<br>HSenable<br>HS Data<br>LVCMOS12<br>SLVS<br>Z0=50<br>MIPI Receiver<br>100 Diff<br>LP Data_N<br>LPenable<br>LVCMOS12<br>–<br>~~hah~~<br>~~—~~<br>~~>~~|+<br>–<br>+<br>LP Data_P<br>LPenable<br>HSenable<br>HS Data<br>LVCMOS12<br>SLVS<br>Z0=50<br>MIPI Receiver<br>100 Diff<br>LP Data_N<br>LPenable<br>LVCMOS12<br>–<br>~~hah~~<br>~~—~~<br>~~>~~|+<br>–<br>+<br>LP Data_P<br>LPenable<br>HSenable<br>HS Data<br>LVCMOS12<br>SLVS<br>Z0=50<br>MIPI Receiver<br>100 Diff<br>LP Data_N<br>LPenable<br>LVCMOS12<br>–<br>~~hah~~<br>~~—~~<br>~~>~~|+<br>–<br>+<br>LP Data_P<br>LPenable<br>HSenable<br>HS Data<br>LVCMOS12<br>SLVS<br>Z0=50<br>MIPI Receiver<br>100 Diff<br>LP Data_N<br>LPenable<br>LVCMOS12<br>–<br>~~hah~~<br>~~—~~<br>~~>~~||
|---|---|---|---|---|---|---|---|---|---|---|---|
|+<br>+<br>Z0=50<br>MIPI Driver<br>On-Chip<br>MIPI_LP_RX<br>RXLP_P<br>HS Data<br>LVDS<br>MIPI_LP_RX<br>RXLP_N<br>–<br>–<br>~~=<}~~<br>~~—~~<br>~~-~~||||||||||||
|**Figure 3.6. MIPI Interface**||||**Figure 3.6. MIPI Interface**||||||||
|**Table 3.25. Soft D-PHY Input Timing and Levels**||||||||||||
|**Symbol**<br>**Description**||||**Conditions**|**Min**|||**Typ**||**Max**|**Unit**|
|**High Speed(Differential) Input DC Specifications**||||||||||||
|VCMRX(DC)<br>Common-mode Voltage in High-Speed Mode||||—|70|||—|—|330|mV|
|VIDTH<br>Differential Input HIGH Threshold||||—|70|||—|—|—|mV|
|VIDTL<br>Differential Input LOW Threshold||||—|—|||—|—|–70|mV|
|VIHHS<br>Input HIGH Voltage(for HS mode)||||—|—|||—|—|460|mV|
|VILHS<br>Input LOW Voltage||||—|–40|||—|—|—|mV|
|VTERM-EN<br>Single-ended voltage for HS Termination Enable4||||—|—|||—|—|450|mV|
|ZID<br>Differential Input Impedance||||—|80|||100||125|Ω|
|**High Speed(Differential) Input AC Specifications**||||||||||||
|ΔVCMRX(HF)1<br>Common-mode Interference(>450 MHz)||||—|—|||—|—|100|mV|
|ΔVCMRX(LF)2, 3<br>Common-mode Interference(50 MHz - 450 MHz)||||—|–50|||—|—|50|mV|
|CCM<br>Common-mode Termination||||—||||||60|pF|
|**Low Power(Single-Ended) Input DC Specifications**||||||||||||
|VIH<br>Low Power Mode Input HIGH Voltage||||—|740|||—|—|—|mV|
|VIL<br>Low Power Mode Input LOW Voltage||||—|—|||—|—|480|mV|
|VIL-ULP<br>Ultra Low Power Input LOW Voltage||||—|—|||—|—|300|mV|
|VHYST<br>Low Power Mode Input Hysteresis||||—|25|||—|—|—|mV|
**Table 3.25. Soft D-PHY Input Timing and Levels**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|**Symbol**|**Description**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|℮SPIKE|Input Pulse Rejection|—|—|—|300|V∙ps|
|TMIN-RX|Minimum Pulse Width Response|—|20|—|—|ns|
|VINT|Peak Interference Amplitude|—|—|—|200|mV|
|fINT|Interference Frequency|—|450|—|—|MHz|
## **Notes** :
1. This is peak amplitude of sine wave modulated to the receiver inputs.
2. Input common-mode voltage difference compared to average common-mode voltage on the receiver inputs.
3. Exclude any static ground shift of 50 mV.
4. High Speed Differential RTERM is enabled when both DP and DN are below this voltage.
**Table 3.26. Soft D-PHY Output Timing and Levels**
|**Symbol**<br>~~CO~~|**Description**<br>~~CO~~|**Conditions**<br>~~CO~~|**Min**<br>~~CO~~|**Typ**<br>~~CO~~|**Max**<br>~~CO~~|**Unit**<br>~~CO~~|
|---|---|---|---|---|---|---|
|**High Speed(Differential) Output DC Specifications**|||||||
|VCMTX<br>~~GGG~~|Common-mode Voltage in High Speed Mode<br>~~GGG~~|—<br>~~GGG~~|150<br>~~GGG~~|200<br>~~GGG~~|250<br>~~GGG~~|mV<br>~~GGG~~|
||ΔVCMTX(1,0)|<br>~~a~~|VCMTXMismatch Between Differential HIGH<br>and LOW<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|7<br>~~ee~~|mV<br>~~ee~~|
||VOD|<br>~~a~~<br>~~GO~~|Output Differential Voltage<br>~~ee~~<br>~~GO~~||D-PHY-P – D-PHY-N|<br>~~ee~~<br>~~GO~~|140<br>~~ee~~<br>~~GO~~|200<br>~~ee~~<br>~~GO~~|270<br>~~ee~~<br>~~GO~~|mV<br>~~ee~~<br>~~GO~~|
||ΔVOD|<br>~~GO~~<br>~~a~~|VODMismatch Between Differential HIGH and<br>LOW<br>~~GO~~<br>|—<br>~~GO~~<br>|—<br>~~GO~~<br>|—<br>~~GO~~<br>|25<br>~~GO~~<br>|mV<br>~~GO~~<br>|
|VOHHS<br>~~aGO~~|Single-Ended Output HIGH Voltage<br>~~GO~~|—<br>~~GO~~|—<br>~~GO~~|—<br>~~GO~~|410<br>~~GO~~|mV<br>~~GO~~|
|ZOS<br>~~GO~~<br>~~pp~~|Single Ended Output Impedance<br>~~GO~~<br>~~pp~~|—<br>~~GO~~<br>~~pp~~|37.5<br>~~GO~~<br>~~pp~~|50<br>~~GO~~<br>~~pp~~|80<br>~~GO~~<br>~~pp~~|Ω<br>~~GO~~<br>~~pp~~|
|ΔZOS<br>~~a~~|ZOSmismatch<br>~~a~~|—<br>~~GCG~~|—<br>~~GCG~~|—<br>~~GCG~~|20|%|
|**High Speed(Differential) Output AC Specifications**|||||||
|ΔVCMTX(LF)<br>~~OOO~~|Common-Mode Variation, 50 MHz – 450 MHz<br>~~OOO~~|—<br>~~OOO~~|—<br>~~OOO~~|—<br>~~OOO~~|25<br>~~OOO~~|mVRMS<br>~~OOO~~|
|ΔVCMTX(HF)<br>~~OOO~~<br>~~GO~~<br>~~pe~~|Common-Mode Variation, above 450 MHz<br>~~OOO~~<br>~~GO~~<br>~~—y————~~|—<br>~~OOO~~<br>~~GO~~<br>~~y————~~|—<br>~~OOO~~<br>~~GO~~<br>~~y————~~|—<br>~~OOO~~<br>~~GO~~<br>~~y————~~|15<br>~~OOO~~<br>~~GO~~<br>~~y————~~|mVRMS<br>~~OOO~~<br>~~GO~~<br>~~y————~~|
|tR<br>~~GO~~<br>~~pe~~<br>~~Bf~~|Output 20% - 80% Rise Time<br>~~GO~~<br>~~—y————~~<br>~~Bf~~|0.08 Gbps ≤ tR≤ 1.00 Gbps<br>~~GO~~<br>~~y————~~|—<br>~~GO~~<br>~~y————~~<br>~~ee~~|—<br>~~GO~~<br>~~y————~~<br>~~ee~~|0.30<br>~~GO~~<br>~~y————~~|UI<br>~~GO~~<br>~~y————~~|
|||1.00 Gbps < tR≤ 1.50 Gbps<br>~~y————~~<br>~~ee~~<br>~~—}~~|—<br>~~y————~~<br>~~ee~~<br>~~ee~~<br>~~—}—~~|—<br>~~y————~~<br>~~ee~~<br>~~ee~~<br>~~——~~|0.434<br>~~y————~~<br>~~ee~~<br>~~——~~|UI<br>~~y————~~<br>~~ee~~<br>~~—~~|
|tF<br>~~pe ~~<br>~~Bf~~|Output 80% - 20% Fall Time<br> ~~—y————~~<br>~~Bf~~|0.08 Gbps ≤ tF≤ 1.00 Gbps<br>~~y————~~<br>~~—}~~|—<br>~~y————~~<br>~~ee~~<br>~~—}—~~|—<br>~~y————~~<br>~~ee~~<br>~~——~~|0.30<br>~~y————~~<br>~~——~~|UI<br>~~y————~~<br>~~—~~|
|||1.00 Gbps < tF≤ 1.50 Gbps<br>~~—}~~<br>~~po~~|—<br>~~ee~~<br>~~—}—~~<br>~~po~~|—<br>~~ee~~<br>~~——~~<br>~~po~~|0.419<br>~~——~~<br>~~po~~|UI<br>~~—~~<br>~~po~~|
|**Low Power(Single-Ended) Output DC Specifications**<br>~~ee~~<br>~~Bf~~<br>~~—} — —— —~~<br>~~po~~|||||||
|VOH<br>~~GO~~|Low Power Mode Output HIGH Voltage<br>~~GO~~|0.08 Gbps – 1.5 Gbps<br>~~GO~~|1.07<br>~~GO~~|1.2<br>~~GO~~|1.3<br>~~GO~~|V<br>~~GO~~|
|VOL<br>~~GGG~~|Low Power Mode Input LOW Voltage<br>~~GGG~~|—<br>~~GGG~~|–50<br>~~GGG~~|—<br>~~GGG~~|50<br>~~GGG~~|mV<br>~~GGG~~|
|ZOLP<br>~~GG~~|Output Impedance in Low Power Mode<br>~~GG~~|—<br>~~GG~~|110<br>~~GG~~|—<br>~~GG~~|—<br>~~GG~~|Ω<br>~~GG~~|
|**Low Power(Single-Ended) Output AC Specifications**|||||||
|tRLP<br>~~GO~~|15% - 85% Rise Time<br>~~GO~~|—<br>~~GO~~|—<br>~~GO~~|—<br>~~GO~~|25<br>~~GO~~|ns<br>~~GO~~|
|tFLP<br>~~GO~~<br>~~GC~~|85% - 15% Fall Time<br>~~GO~~<br>~~GC~~|—<br>~~GO~~<br>~~GC~~|—<br>~~GO~~<br>~~GC~~|—<br>~~GO~~<br>~~GC~~|25<br>~~GO~~<br>~~GC~~|ns<br>~~GO~~<br>~~GC~~|
|tREOT<br>~~GGG~~<br>~~i~~|HS – LP Mode Rise and Fall Time, 30% - 85%<br>~~GGG~~<br>~~i~~|—<br>~~GGG~~<br>~~eee~~|—<br>~~GGG~~<br>~~eee~~|—<br>~~GGG~~<br>~~eee~~|35<br>~~GGG~~<br>~~eee~~|ns<br>~~GGG~~<br>~~eee~~|
|TLP-PULSE-TX<br>~~i~~|Pulse Width of the LP Exclusive-OR Clock<br>~~i~~|First LP XOR clock pulse<br>after STOP state or Last<br>pulse before STOP state<br>~~eee~~|40<br>~~eee~~|—<br>~~eee~~|—<br>~~eee~~|ns<br>~~eee~~|
|||All otherpulses<br>~~eee~~|20<br>~~eee~~|—<br>~~eee~~|—<br>~~eee~~|ns<br>~~eee~~|
|TLP-PER-TX<br>~~i~~<br>~~GCG~~|Period of the LP Exclusive-OR Clock<br>~~i~~<br>~~GCG~~|—<br>~~eee~~<br>~~GCG~~|90<br>~~eee~~<br>~~GCG~~|—<br>~~eee~~<br>~~GCG~~|—<br>~~eee~~<br>~~GCG~~|ns<br>~~eee~~<br>~~GCG~~|
|CLOAD<br>~~a~~|Load Capacitance<br>~~a~~|—<br>~~a~~|0<br>~~a~~|—<br>~~a~~|70<br>~~a~~|pF<br>~~a~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**Table 3.27. Soft D-PHY Clock Signal Specification**
|**Symbol**|**Description**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Clock Signal Specification**|||||||
|UI<br>Instantaneous|UIINST|—|—|—|12.5|ns|
|UI Variation|∆UI|UI ≥ 1 ns|–10%|—|10%|UI|
|||0.667 ns < UI < 1 ns|–5%|—|5%|UI|
**Table 3.28. Soft D-PHY Data-Clock Timing Specifications**
|**Symbol**|**Description**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Data-Clock Timing Specifications**|||||||
|TSKEW[TX]|Data to Clock Skew|0.08 Gbps ≤ TSKEW[TX]≤ 1.00 Gbps|–0.15|—|0.15|UIINST|
|||1.00 Gbps < TSKEW[TX]≤ 1.50 Gbps|–0.20|—|0.20|UIINST|
|TSETUP[RX]|Input Data Setup Before CLK|0.08 Gbps ≤ TSETUP[RX]≤ 1.00 Gbps|0.15|—|—|UI|
|||1.00 Gbps < TSETUP[RX]≤ 1.50 Gbps|0.20|—|—|UI|
|THOLD[RX]|Input Data Hold After CLK|0.08 Gbps ≤ THOLD[RX]≤ 1.00 Gbps|0.15|—|—|UI|
|||1.00 Gbps < THOLD[RX]≤ 1.50 Gbps|0.20|—|—|UI|
## **3.12.7. Differential HSTL15D (As Output)**
Differential HSTL outputs are implemented as a pair of complementary single-ended HSTL outputs.
## **3.12.8. Differential SSTL135D, SSTL15D (As Output)**
Differential SSTL is used for differential clock in DDR3/DDR3L memory interface. All differential SSTL outputs are implemented as a pair of complementary single-ended SSTL outputs. All allowable single-ended output classes (class I and class II) are supported.
## **3.12.9. Differential HSUL12D (As Output)**
Differential HSUL is used for differential clocks in LPDDR2 memory interface. All differential HSUL outputs are implemented as a pair of complementary single-ended HSUL12 outputs. All allowable single-ended drive strengths are supported.
## **3.12.10. Differential LVSTLD (As Output)**
Differential LVSTL is used for differential clock in LPDDR4 memory interface. All differential LVSTL outputs are implemented as a pair of complementary single-ended LVSTL outputs. All allowable single-ended drive strengths are supported.
## **3.12.11. Differential LVCMOS25D, LVCMOS33D, LVTTL33D (As Output)**
Differential LVCMOS and LVTTL outputs are implemented as a pair of complementary single-ended outputs. All allowable single-ended output drive strengths are supported.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **3.13. Maximum sysI/O Buffer Speed**
Over recommended operating conditions.
**Table 3.29. Maximum I/O Buffer Speed[1, 2, 3, 4, 7 ]**
|**Buffer**<br>~~a~~|**Description**|**Banks**|**Max**|**Unit**|
|---|---|---|---|---|
|**Maximum sysI/O Input Frequency**<br>~~pe~~|||||
|**Single-Ended**|||||
|LVCMOS33<br>~~a~~|LVCMOS33, VCCIO = 3.3 V<br>~~C~~|0, 1, 2, 6, 7<br>~~C~~|200|MHz|
|LVTTL33<br>~~OO~~|LVTTL33, VCCIO = 3.3 V<br>~~OO~~|0, 1, 2, 6, 7<br>~~OO~~|200<br>~~OO~~|MHz<br>~~OO~~|
|LVCMOS25<br>~~OO~~|LVCMOS25, VCCIO = 2.5 V<br>~~OO~~|0, 1, 2, 6, 7<br>~~OO~~|200<br>~~OO~~|MHz<br>~~OO~~|
|LVCMOS185<br>~~a~~|LVCMOS18, VCCIO = 1.8 V<br>~~GO~~|0, 1, 2, 6, 7<br>~~GO~~|200|MHz|
|LVCMOS18H<br>~~a~~|LVCMOS18, VCCIO = 1.8 V<br>~~GO~~|3, 4, 5<br>~~GO~~|200|MHz|
|LVCMOS155<br>~~GO~~|LVCMOS15, VCCIO = 1.5 V<br>~~GO~~|0, 1, 2, 6, 7<br>~~GO~~|100<br>~~GO~~|MHz<br>~~GO~~|
|LVCMOS15H5<br>~~a~~|LVCMOS15, VCCIO = 1.5 V<br>~~O~~|3, 4, 5<br>~~O~~|150<br>~~O~~|MHz<br>~~O~~|
|LVCMOS125<br>~~a~~|LVCMOS12, VCCIO = 1.2 V|0, 1, 2, 6, 7|50|MHz|
|LVCMOS12H5<br>~~a~~<br>~~a~~|LVCMOS12, VCCIO = 1.2 V<br>~~GO~~|3, 4, 5<br>~~GO~~|100<br>~~GO~~|MHz<br>~~GO~~|
|LVCMOS105<br>~~GO~~|LVCMOS 1.0, VCCIO = 1.2 V<br>~~GO~~|0, 1, 2, 6, 7<br>~~GO~~|50<br>~~GO~~|MHz<br>~~GO~~|
|LVCMOS10H5<br>~~GG~~|LVCMOS 1.0, VCCIO = 1.0 V<br>~~GG~~|3, 4, 5<br>~~GG~~|50<br>~~GG~~|MHz<br>~~GG~~|
|LVCMOS10R<br>~~GG~~<br>~~OO~~|LVCMOS 1.0, VCCIO independent<br>~~GG~~<br>~~OO~~|3, 4, 5<br>~~GG~~<br>~~OO~~|50<br>~~GG~~<br>~~OO~~|MHz<br>~~GG~~<br>~~OO~~|
|SSTL15_I, SSTL15_II<br>~~OO~~<br>~~OO~~|SSTL_15, VCCIO = 1.5 V<br>~~OO~~<br>~~OO~~|3, 4, 5<br>~~OO~~<br>~~OO~~|1066<br>~~OO~~<br>~~OO~~|Mbps<br>~~OO~~<br>~~OO~~|
|SSTL135_I, SSTL135_II<br>~~OO~~<br>~~a~~|SSTL_135, VCCIO = 1.35 V<br>~~OO~~<br>~~GO~~|3, 4, 5<br>~~OO~~<br>~~GO~~|1066<br>~~OO~~<br>~~GO~~|Mbps<br>~~OO~~<br>~~GO~~|
|LVSTL_I, LVSTL_II<br>~~GO~~|LVSTL, VCCIO = 1.1 V<br>~~GO~~|3, 4, 5<br>~~GO~~|1066<br>~~GO~~|Mbps<br>~~GO~~|
|HSUL12<br>~~GG~~|HSUL_12, VCCIO = 1.2 V<br>~~GG~~|3, 4, 5<br>~~GG~~|1066<br>~~GG~~|Mbps<br>~~GG~~|
|HSTL15<br>~~GG~~<br>~~OO~~|HSTL15, VCCIO = 1.5 V<br>~~GG~~<br>~~OO~~|3, 4, 5<br>~~GG~~<br>~~OO~~|250<br>~~GG~~<br>~~OO~~|Mbps<br>~~GG~~<br>~~OO~~|
|MIPI D-PHY(LP Mode)<br>~~OO~~<br>~~a~~|MIPI, Low Power Mode, VCCIO = 1.2 V<br>~~OO~~|3, 4, 5<br>~~OO~~|10<br>~~OO~~|Mbps<br>~~OO~~|
|**Differential**<br>~~a~~|||||
|LVDS<br>~~GO~~|LVDS, VCCIOindependent<br>~~GO~~|3, 4, 5<br>~~GO~~|1250<br>~~GO~~|Mbps<br>~~GO~~|
|subLVDS<br>~~CO~~|subLVDS, VCCIOindependent<br>~~CO~~|3, 4, 5<br>~~CO~~<br>~~ee ee~~|1250<br>~~CO~~<br>~~ee~~|Mbps<br>~~CO~~<br>~~ee~~|
|SLVS|SLVS similar to MIPI HS, VCCIOindependent<br>caBGA256, csBGA289, caBGA400<br>~~ee~~|3, 4, 5<br>~~ee~~<br>~~ee ee~~<br>~~ee~~|1250<br>~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~<br>~~ee~~|
||SLVS similar to MIPI HS, VCCIOindependent<br>csfBGA121<br>~~ee~~<br>~~ee~~|3, 4, 5<br>~~ee~~<br>~~ee ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|1500<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|MIPI D-PHY (HS Mode)|MIPI, High Speed Mode, VCCIO= 1.2 V3<br>caBGA256, csBGA289, caBGA400<br>~~ee~~<br>~~ee~~|3, 4, 5<br>~~ee~~<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|1250<br>~~ee~~<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~<br>~~ee~~|
||MIPI, High Speed Mode, VCCIO= 1.2 V3<br>csfBGA121<br>~~ee~~<br>~~ee~~|3, 4, 5<br>~~ee~~<br>~~ee ~~<br>~~ee~~<br>~~ee~~|15008<br>~~ee~~<br> ~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~<br>~~ee~~|
|SSTL15D<br>~~OO~~|Differential SSTL15, VCCIOindependent<br>~~OO~~|3, 4, 5<br>~~ee ~~<br>~~OO~~|1066<br> ~~ee~~<br>~~OO~~|Mbps<br>~~OO~~|
|SSTL135D<br>~~OO~~<br>~~a~~|Differential SSTL135, VCCIOindependent<br>~~OO~~|3, 4, 5<br>~~OO~~<br>~~GG~~|1066<br>~~OO~~<br>~~GG~~|Mbps<br>~~OO~~|
|LVSTLD_I, LVSTLD_II<br>~~Ce~~<br>~~a~~|Differential LVSTL, VCCIOindependent<br>~~Ce~~|3, 4, 5<br>~~Ce~~<br>~~GG~~|1066<br>~~Ce~~<br>~~GG~~|Mbps<br>~~Ce~~|
|HUSL12D<br>~~Ce~~<br>~~a~~|Differential HSUL12, VCCIOindependent<br>~~Ce~~|3, 4, 5<br>~~Ce~~<br>~~GG~~|1066<br>~~Ce~~<br>~~GG~~|Mbps<br>~~Ce~~|
|HSTL15D<br>~~a~~<br>~~a~~|Differential HSTL15, VCCIOindependent|3, 4, 5<br>~~GG~~|250<br>~~GG~~|Mbps|
|**Maximum sysI/O Output Frequency**<br>~~a~~|||||
|**Single-Ended**|||||
|LVCMOS33(all drive strengths)<br>~~GG~~|LVCMOS33, VCCIO = 3.3 V<br>~~GG~~|0, 1, 2, 6, 7<br>~~GG~~|200<br>~~GG~~|MHz<br>~~GG~~|
|LVCMOS33(RS50)<br>~~GG~~<br>~~a~~|LVCMOS33, VCCIO = 3.3 V, RSERIES= 50 Ω<br>~~GG~~|0, 1, 2, 6, 7<br>~~GG~~|200<br>~~GG~~|MHz<br>~~GG~~|
|LVTTL33(all drive strengths)<br>~~a~~<br>~~a~~|LVTTL33, VCCIO = 3.3 V|0, 1, 2, 6, 7|200|MHz|
|LVTTL33(RS50)<br>~~a~~<br>~~CO~~|LVTTL33, VCCIO = 3.3 V, RSERIES= 50 Ω<br>~~CO~~|0, 1, 2, 6, 7<br>~~CO~~|200<br>~~CO~~|MHz<br>~~CO~~|
|LVCMOS25(all drive strengths)<br>~~GO~~|LVCMOS25, VCCIO = 2.5 V<br>~~GO~~|0, 1, 2, 6, 7<br>~~GO~~<br>~~GD~~|200<br>~~GO~~<br>~~GD~~|MHz<br>~~GO~~|
|LVCMOS25(RS50)<br>~~fe~~|LVCMOS25, VCCIO = 2.5 V, RSERIES= 50 Ω<br>~~fe~~|0, 1, 2, 6, 7<br>~~fe~~<br>~~GD~~|200<br>~~fe~~<br>~~GD~~|MHz<br>~~fe~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-DS-02086-2.0
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**CertusPro-NX Family Data Sheet**
|**Buffer**<br>~~CO~~|**Description**<br>~~CO~~|**Banks**<br>~~CO~~|**Max**<br>~~CO~~|**Unit**<br>~~CO~~|
|---|---|---|---|---|
|LVCMOS18(all drive strengths)<br>~~CO~~|LVCMOS18, VCCIO = 1.8 V<br>~~CO~~|0, 1, 2, 6, 7<br>~~CO~~<br>~~O~~|200<br>~~CO~~|MHz<br>~~CO~~|
|LVCMOS18(RS50)<br>~~a~~|LVCMOS18, VCCIO = 1.8 V, RSERIES= 50 Ω<br>~~a~~|0, 1, 2, 6, 7<br>~~a~~<br>~~O~~|200<br>~~a~~|MHz<br>~~a~~|
|LVCMOS18H(all drive strengths)<br>~~CO~~|LVCMOS18, VCCIO = 1.8 V<br>~~CO~~|3, 4, 5<br>~~O~~<br>~~CO~~|200<br>~~CO~~|MHz<br>~~CO~~|
|LVCMOS18H(RS50)<br>~~OO~~|LVCMOS18, VCCIO = 1.8 V, RSERIES= 50 Ω<br>~~OO~~|3, 4, 5<br>~~OO~~|200<br>~~OO~~|MHz<br>~~OO~~|
|LVCMOS15(all drive strengths)<br>~~OO~~|LVCMOS15, VCCIO = 1.5 V<br>~~OO~~|0, 1, 2, 6, 7<br>~~OO~~|100<br>~~OO~~|MHz<br>~~OO~~|
|LVCMOS15H(all drive strengths)<br>~~CG~~|LVCMOS15, VCCIO = 1.5 V<br>~~CG~~|3, 4, 5<br>~~CG~~<br>~~O~~|150<br>~~CG~~|MHz<br>~~CG~~|
|LVCMOS12(all drive strengths)<br>~~a~~|LVCMOS12, VCCIO = 1.2 V<br>~~a~~|0, 1, 2, 6, 7<br>~~a~~<br>~~O~~<br>~~O~~|50<br>~~a~~|MHz<br>~~a~~|
|LVCMOS12H(all drive strengths)<br>~~a~~|LVCMOS12, VCCIO = 1.2 V<br>~~a~~|3, 4, 5<br>~~O~~<br>~~a~~<br>~~O~~|100<br>~~a~~|MHz<br>~~a~~|
|LVCMOS10H(all drive strengths)<br>~~CO~~|LVCMOS12, VCCIO = 1.2 V<br>~~CO~~|3, 4, 5<br>~~O~~<br>~~CO~~|50<br>~~CO~~|MHz<br>~~CO~~|
|SSTL15_I, SSTL15_II<br>~~OO~~|SSTL_15, VCCIO = 1.5 V<br>~~OO~~|3, 4, 5<br>~~OO~~|1066<br>~~OO~~|Mbps<br>~~OO~~|
|SSTL135_I, SSTL135_II<br>~~CG~~|SSTL_135, VCCIO = 1.35 V<br>~~CG~~|3, 4, 5<br>~~CG~~<br>~~O~~|1066<br>~~CG~~|Mbps<br>~~CG~~|
|LVSTL_I, LVSTL_II<br>~~a~~|LVSTL, VCCIO = 1.1 V<br>~~a~~|3, 4, 5<br>~~a~~<br>~~O~~|1066<br>~~a~~|Mbps<br>~~a~~|
|HSUL12(all drive strengths)<br>~~GG~~|HSUL_12, VCCIO = 1.2 V<br>~~GG~~|3, 4, 5<br>~~O~~<br>~~GG~~|1066<br>~~GG~~|Mbps<br>~~GG~~|
|HSTL15<br>~~a~~|HSTL15, VCCIO = 1.5 V<br>~~G~~|3, 4, 5<br>~~G~~|250|Mbps|
|MIPI D-PHY(LP Mode)<br>~~CO~~|MIPI, Low Power Mode, VCCIO = 1.2 V<br>~~CO~~|3, 4, 5<br>~~CO~~|10<br>~~CO~~|Mbps<br>~~CO~~|
|**Differential**<br>~~pe~~|||||
|LVDS<br>~~pe~~<br>~~OO~~|LVDS, VCCIO= 1.8 V<br>~~pe~~<br>~~OO~~|3, 4, 5<br>~~pe~~<br>~~OO~~|1250<br>~~pe~~<br>~~OO~~|Mbps<br>~~pe~~<br>~~OO~~|
|LVDS25E6<br>~~OO~~<br>~~CO~~|LVDS25, Emulated, VCCIO = 2.5 V<br>~~OO~~<br>~~CO~~|0, 1, 2, 6, 7<br>~~OO~~<br>~~CO~~|400<br>~~OO~~<br>~~CO~~|Mbps<br>~~OO~~<br>~~CO~~|
|SubLVDSE6<br>~~CO~~<br>~~GO~~|subLVDS, Emulated, VCCIO= 1.8 V<br>~~CO~~<br>~~GO~~|0, 1, 2, 6, 7<br>~~CO~~<br>~~GO~~|400<br>~~CO~~<br>~~GO~~|Mbps<br>~~CO~~<br>~~GO~~|
|SubLVDSEH6<br>~~CO~~|subLVDS, Emulated, VCCIO= 1.8 V<br>~~CO~~|3, 4, 5<br>~~CO~~<br>~~ee~~|800<br>~~CO~~<br>~~ee~~|Mbps<br>~~CO~~|
|SLVS|SLVS similar to MIPI, VCCIO= 1.2 V<br>caBGA256, csBGA289, caBGA400<br>~~ee~~|3, 4, 5<br>~~ee~~<br>~~ee~~<br>~~ee~~|1250<br>~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~<br>~~ee~~|
||SLVS similar to MIPI, VCCIO= 1.2 V<br>csfBGA121<br>~~ee~~|3, 4, 5<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|1500<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~<br>~~ee~~|
|MIPI D-PHY (HS Mode)|MIPI, High Speed Mode, VCCIO= 1.2 V3<br>caBGA256, csBGA289, caBGA400<br>~~ee~~<br>~~ee~~|3, 4, 5<br>~~ee~~<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|1250<br>~~ee~~<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~<br>~~ee~~<br>~~ee~~|
||MIPI, High Speed Mode, VCCIO= 1.2 V3<br>csfBGA121<br>~~ee~~<br>~~ee~~|3, 4, 5<br>~~ee~~<br>~~ee ~~<br>~~ee~~<br>~~ee~~|15008<br>~~ee~~<br> ~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~<br>~~ee~~|
|SSTL15D<br>~~CO~~|Differential SSTL15, VCCIO= 1.5 V<br>~~ee~~<br>~~CO~~|3, 4, 5<br>~~ee~~<br>~~ee ~~<br>~~CO~~|1066<br>~~ee~~<br> ~~ee~~<br>~~CO~~|Mbps<br>~~ee~~<br>~~CO~~|
|SSTL135D<br>~~OO~~|Differential SSTL135, VCCIO= 1.35 V<br>~~OO~~|3, 4, 5<br>~~OO~~|1066<br>~~OO~~|Mbps<br>~~OO~~|
|LVSTLD<br>~~OO~~<br>~~a~~|Differential LVSTL, VCCIO= 1.1 V<br>~~OO~~|3, 4, 5<br>~~OO~~<br>~~GG~~|1066<br>~~OO~~<br>~~GG~~|Mbps<br>~~OO~~|
|HUSL12D<br>~~fe~~<br>~~a~~|Differential HSUL12, VCCIO= 1.2 V<br>~~fe~~|3, 4, 5<br>~~fe~~<br>~~GG~~|1066<br>~~fe~~<br>~~GG~~|Mbps<br>~~fe~~|
|HSTL15D<br>~~fe~~<br>~~a~~|Differential HSTL15, VCCIO= 1.5 V<br>~~fe~~|3, 4, 5<br>~~fe~~<br>~~GG~~|250<br>~~fe~~<br>~~GG~~|Mbps<br>~~fe~~|
**Notes** :
1. Maximum I/O speed is the maximum switching rate of the I/O operating within the guidelines of the defining standard. The actual interface speed performance using the I/O also depends on other factors, such as internal and external timing.
2. These numbers are characterized but not tested on every device.
3. Performance is specified in MHz, as defined in clock rate when the sysI/O is used as pin. For data rate performance, this can be converted to Mbps, which equals to 2 times the clock rate.
4. LVCMOS and LVTTL are measured with load specified in Table 3.51.
5. These LVCMOS inputs can be placed in different VCCIO voltage. Performance may vary. Please refer to Lattice Design software.
6. These emulated outputs performance is based on externally properly terminated as described in the LVDS25E (Output Only) and SubLVDSE/SubLVDSEH (Output Only) sections.
7. All speeds are measured with fast slew.
8. Subject to verification when package becomes available.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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## **3.14. Typical Building Block Function Performance**
Following building block functions (Table 3.30 and Table 3.31) can be generated using Lattice Design Software tool. Exact performance may vary with the device and the design software tool version. The design software tool uses internal parameters that have been characterized but are not tested on every device.
**Table 3.30. Pin-to-Pin Performance[1]**
|**Function**|**Typ. @ VCC = 1.0 V**|**Unit**|
|---|---|---|
|16-bit Decoder (I/O configured with LVCMOS18, Left and Right Banks)|5.5|ns|
|16-bit Decoder (I/O configured with HSTL15_I, Bottom Banks)|5.1|ns|
|16:1 Mux (I/O configured with LVCMOS18, Left and Right Banks)|6|ns|
|16:1 Mux (I/O configured with HSTL15_I, Bottom Banks)|6.1|ns|
## **Note** :
1. These functions are generated using Lattice Radiant software. Exact performance may vary with the device and the design software tool version. The design software tool uses internal parameters that are characterized but not tested on every device.
## **Table 3.31. Register-to-Register Performance[1, 3, 4]**
|**Function**<br>~~I~~|**Typ. @ VCC = 1.0 V**<br>|**Unit**<br>|
|---|---|---|
|**Basic Functions**<br>~~IEn~~|||
|16-bit Adder<br>~~En~~<br>~~eC~~|5002<br>~~En~~<br>~~eC~~|MHz<br>~~En~~<br>~~eC~~|
|32-bit Adder<br>~~eC~~<br>~~a~~|496<br>~~eC~~<br>~~a~~<br>~~G~~|MHz<br>~~eC~~<br>~~a~~|
|16-bit Counter<br>~~a~~|402<br>~~a~~<br>~~G~~|MHz<br>~~a~~|
|32-bit Counter<br>~~a~~<br>~~De~~|371<br>~~a~~<br>~~G~~<br>~~De~~|MHz<br>~~a~~<br>~~De~~|
|**Embedded Memory Functions**<br>~~|~~|||
|512 × 36 Single Port RAM, with Output Register<br>~~eG~~|5002<br>~~eG~~<br>~~G~~|MHz<br>~~eG~~|
|1024 × 18 True-Dual Port RAM using same clock, with EBR Output Registers<br>~~a~~|5002<br>~~a~~<br>~~G~~<br>~~D~~|MHz<br>~~a~~|
|1024 × 18 True-Dual Port RAM using asynchronous clocks, with EBR Output<br>~~a~~<br>~~a~~|5002<br>~~a~~<br>~~G~~<br>~~a~~<br>~~D~~|MHz<br>~~a~~<br>~~a~~|
|**Large Memory Functions**<br>~~a~~<br>~~D~~<br>~~Pe~~|||
|32 k × 32 Single Port RAM, with Output Register<br>~~DO~~|375<br>~~DO~~|MHz<br>~~DO~~|
|32 k × 32 Single Port RAM with ECC, with Output Register<br>~~DO~~<br>~~eG~~|350<br>~~DO~~<br>~~eG~~<br>~~D~~|MHz<br>~~DO~~<br>~~eG~~|
|32 k × 32 True-Dual Port RAM using same clock, with Output Registers<br>~~a~~|200<br>~~a~~<br>~~D~~|MHz<br>~~a~~|
|**Distributed Memory Functions**<br>~~a~~<br>~~D~~<br>~~pe~~|||
|16 × 4 Single Port RAM (One PFU)<br>~~pe~~<br>~~eG~~|5002<br>~~pe~~<br>~~eG~~|MHz<br>~~pe~~<br>~~eG~~|
|16 × 2 Pseudo-Dual Port RAM (One PFU)<br>~~eG~~<br>~~eG~~|5002<br>~~eG~~<br>~~eG~~|MHz<br>~~eG~~<br>~~eG~~|
|16 × 4 Pseudo-Dual Port (Two PFUs)<br>~~De~~|5002<br>~~De~~|MHz<br>~~De~~|
|**DSP Functions**|||
|9 × 9 Multiplier with Input Output Registers<br>~~De~~|376<br>~~De~~|MHz<br>~~De~~|
|18 × 18 Multiplier with Input/Output Registers<br>~~CO~~|287<br>~~CO~~|MHz<br>~~CO~~|
|36 × 36 Multiplier with Input/Output Registers<br>~~CO~~<br>~~eG~~|200<br>~~CO~~<br>~~eG~~<br>~~C~~|MHz<br>~~CO~~<br>~~eG~~|
|MAC 18 × 18 with Input/Output Registers<br>~~a~~|203<br>~~a~~<br>~~C~~|MHz<br>~~a~~|
|MAC 18 × 18 with Input/Pipelined/Output Registers<br>~~a~~<br>~~a~~|287<br>~~a~~<br>~~C~~<br>~~a~~|MHz<br>~~a~~<br>~~a~~|
|MAC 36 × 36 with Input/Output Registers<br>~~GO~~|119<br>~~GO~~|MHz<br>~~GO~~|
|MAC 36 × 36 with Input/Pipelined/Output Registers<br>~~GO~~<br>~~pf~~|155<br>~~GO~~<br>~~pf~~|MHz<br>~~GO~~<br>~~pf~~|
**Notes** :
1. The Clock port is configured with LVDS I/O type. Performance Grade: 9_High-Performance_1.0V.
2. Limited by the Minimum Pulse Width of the component
3. These functions are generated using Lattice Radiant design software. Exact performance may vary with the device and the design software tool version. The design software tool uses internal parameters that have been characterized but are not tested on every device.
4. For the Pipelined designs, the number of pipeline stages used are 2.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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## **3.15. Derating Timing Tables**
Logic timing provided in the following sections of this data sheet and the Lattice Radiant design software are worst case numbers in the operating range. Actual delays at nominal temperature and voltage for best case process can be much better than the values given in the tables. The Lattice Radiant design software can provide logic timing numbers at a particular temperature and voltage.
## **3.16. External Switching Characteristics**
Over recommended commercial operating conditions.
**Table 3.32. External Switching Characteristics (VCC = 1.0 V)**
|**Parameter**<br>~~Se~~|**Description**<br>~~Se~~|–**9**<br>~~Se~~<br>~~ee~~|–**9**<br>~~Se~~<br>~~ee~~|–**8**<br>~~Se~~<br>~~eeee~~|–**8**<br>~~Se~~<br>~~eeee~~|–**7**<br>~~Se~~<br>~~ee~~|–**7**<br>~~Se~~<br>~~ee~~|**Unit**<br>~~Se~~|
|---|---|---|---|---|---|---|---|---|
|||**Min**<br>~~Se~~<br>~~ee~~|**Max**<br>~~Se~~<br>~~ee~~|**Min**<br>~~Se~~<br>~~ee~~|**Max**<br>~~Se~~<br>~~ee~~|**Min**<br>~~Se~~<br>~~ee~~|**Max**<br>~~Se~~<br>~~ee~~||
|**Clocks**<br>~~ee ee~~<br>~~Re~~|||||||||
|**Primary Clock**<br>~~pt~~|||||||||
|fMAX_PRI<br>~~pt~~<br>~~GG~~|Frequencyfor PrimaryClock<br>~~pt~~<br>~~GG~~|—<br>~~pt~~<br>~~GG~~|400<br>~~pt~~<br>~~GG~~|—<br>~~pt~~<br>~~GG~~|325.2<br>~~pt~~<br>~~GG~~|—<br>~~pt~~<br>~~GG~~|276<br>~~pt~~<br>~~GG~~|MHz<br>~~pt~~<br>~~GG~~|
|tW_PRI<br>~~GG~~<br>~~ee~~|Clock Pulse Width for Primary<br>Clock<br>~~GG~~<br>~~ee~~|1.100<br>~~GG~~<br>~~ee~~|—<br>~~GG~~<br>~~ee~~|1.325<br>~~GG~~<br>~~ee~~|—<br>~~GG~~<br>~~ee~~|1.594<br>~~GG~~<br>~~ee~~|—<br>~~GG~~<br>~~ee~~|ns<br>~~GG~~<br>~~ee~~|
|tSKEW_PRI5<br>~~ee~~<br>~~a~~|Primary Clock Skew Within a<br>Device<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|450<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|554<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|653<br>~~ee~~<br>~~ee~~|ps<br>~~ee~~<br>~~ee~~|
|**Edge Clock**<br>~~a ee~~|||||||||
|fMAX_EDGE<br>~~aa~~|Frequency for Edge Clock<br>Tree<br>~~aa~~|—<br>~~aa~~|800<br>~~aa~~|—|650.4|—|551.7|MHz|
|tW_EDGE<br>~~a~~|Clock Pulse Width for Edge<br>Clock<br>~~aee~~|0.513<br>~~ee~~|—<br>~~ee~~|0.65<br>~~ee~~|—<br>~~ee~~|0.743<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|
|tSKEW_EDGE5<br>~~a~~|Edge Clock Skew Within a<br>Device<br>~~a ~~|—<br> ~~ee~~|120<br>~~ee~~|—<br>~~ee~~|148<br>~~ee~~|—<br>~~ee~~|174<br>~~ee~~|ps<br>~~ee~~|
|**Generic SDR Input**<br>~~RT~~|||||||||
|**General I/O Pin Parameters Using Dedicated Primary Clock Input without PLL**|||||||||
|tCO<br>~~a ~~|Clock to Output - PIO Output<br>Register<br> ~~ee~~|—<br>~~ee~~|8.36<br>~~ee~~|—<br>~~ee~~|8.53<br>~~ee~~|—<br>~~ee~~|8.67<br>~~ee~~|ns<br>~~ee~~|
|tSU<br>~~a ~~|Clock to Data Setup - PIO<br>Input Register<br> ~~ee~~|0<br>~~ee~~|—<br>~~ee~~|0<br>~~ee~~|—<br>~~ee~~|0<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|
|tH(LTR)<br>~~a ~~|Clock to Data Hold - PIO Input<br>Register<br> ~~ee~~|3.73<br>~~ee~~|—<br>~~ee~~|3.83<br>~~ee~~|—<br>~~ee~~|3.93<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|
|tH(Bottom)|Clock to Data Hold - PIO Input<br>Register|4.65|—|4.75|—|4.84|—|ns|
|tSU_DEL|Clock to Data Setup - PIO<br>Input Register with Data Input<br>Delay|1.84|—|1.84|—|1.84|—|ns|
|tH_DEL(LTR)|Clock to Data Hold - PIO Input<br>Register with Data Input<br>Delay|0.22|—|0.22|—|0.22|—|ns|
|tH_DEL(Bottom)|Clock to Data Hold - PIO Input<br>Register with Data Input<br>Delay|1.77|—|1.77|—|1.77|—|ns|
|**General I/O Pin Parameters Using Dedicated Primary Clock Input with PLL**|||||||||
|tCOPLL<br>~~a~~|Clock to Output - PIO Output<br>Register|—|4.55|—|4.67|—|5.51|ns|
|tSUPLL<br>~~a~~<br>~~a~~|Clock to Data Setup - PIO<br>Input Register|1.33|—|1.33|—|1.33|—|ns|
|tHPLL(LTR)<br>~~a~~<br>~~a~~|Clock to Data Hold - PIO Input<br>Register|0.98|—|1.21|—|1.42|—|ns|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Parameter**<br>~~ee~~<br>~~ey~~|**Description**<br>~~ee~~|–**9**<br>~~ee~~<br>~~ES~~<br>~~a~~<br>~~ee~~|–**9**<br>~~ee~~<br>~~ES~~<br>~~a~~<br>~~ee~~|–**8**<br>~~ee~~<br>~~ES~~<br>~~eeee~~|–**8**<br>~~ee~~<br>~~ES~~<br>~~eeee~~|–**7**<br>~~ee~~<br>~~SH~~<br>~~eeee~~|–**7**<br>~~ee~~<br>~~SH~~<br>~~eeee~~|**Unit**<br>~~ee~~<br>~~SH~~|
|---|---|---|---|---|---|---|---|---|
|||**Min**<br>~~ee~~<br>~~a~~|**Max**<br>~~ee~~<br>~~ES~~<br>~~ee~~|**Min**<br>~~ee~~<br>~~ES~~<br>~~ee~~|**Max**<br>~~ee~~<br>~~ES~~<br>~~ee~~|**Min**<br>~~ee~~<br>~~SH~~<br>~~ee~~|**Max**<br>~~ee~~<br>~~SH~~<br>~~ee~~||
|tHPLL(Bottom)<br>~~ey~~|Clock to Data Hold - PIO Input<br>Register|1.87<br>~~a~~|—<br>~~ES~~<br>~~ee~~|1.87<br>~~ES~~<br>~~ee~~|—<br>~~ES~~<br>~~ee~~|1.87<br>~~SH~~<br>~~ee~~|—<br>~~SH~~<br>~~ee~~|ns<br>~~SH~~|
|tSU_DELPLL<br>~~ey~~|Clock to Data Setup - PIO<br>Input Register with Data Input<br>Delay|4.74|—<br>~~ee~~|4.74<br>~~ee~~|—<br>~~ee~~|4.74<br>~~ee~~|—<br>~~ee~~|ns|
|tH_DELPLL<br>~~ey~~|Clock to Data Hold - PIO Input<br>Register with Data Input<br>Delay|0|—<br>~~ee ~~|0<br> ~~ee ~~|—<br> ~~ee ~~|0<br> ~~ee ~~|—<br> ~~ee~~|ns|
|**General I/O Pin Parameters Using Dedicated Edge Clock Input without PLL**<br>~~eee~~<br>~~ee~~<br>~~eeeeeeeeeeee~~|||||||||
|tCO<br>~~ee~~<br>~~ee~~|Clock to Output - PIO Output<br>Register<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—|ns|
|tSU<br>~~ee~~<br>~~ee~~<br>~~es~~|Clock to Data Setup - PIO<br>Input Register<br>~~ee ~~<br>~~ee~~|—<br> ~~ee ~~<br>~~ee~~|—<br> ~~ee ~~<br>~~ee~~|0<br> ~~ee ~~<br>~~ee~~|—<br> ~~ee ~~<br>~~ee~~|0<br> ~~ee~~<br>~~ee~~|—|ns|
|tHD<br>~~ee~~<br>~~es~~|Clock to Data Hold - PIO Input<br>Register<br>~~ee ~~|—<br> ~~ee ~~|—<br> ~~ee ~~|—<br> ~~ee ~~|—<br> ~~ee ~~|—<br> ~~ee~~|—|ns|
|tSU_DEL<br>~~es~~|Clock to Data Setup - PIO<br>Input Register with Data Input<br>Delay|—|—|—|—|—|—|ns|
|tH_DEL<br>~~es~~|Clock to Data Hold - PIO Input<br>Register with Data Input<br>Delay|0|—|0|—|0|—|ns|
|**General I/O Pin Parameters Using Dedicated Edge Clock Input with PLL**<br>~~Ree~~<br>~~a~~<br>~~eeeeee~~<br>~~eee~~|||||||||
|tCOPLL<br>~~Ree~~<br>~~a~~<br>~~ee~~|Clock to Output - PIO Output<br>Register<br>~~Ree~~<br>~~ee~~<br>~~ee~~|—<br>~~Ree~~<br>~~ee~~<br>~~ee~~|—<br>~~Ree~~<br>~~ee~~<br>~~ee~~|—<br>~~Ree~~<br>~~ee~~<br>~~ee~~|—<br>~~Ree~~<br>~~ee~~<br>~~ee ee~~|—<br>~~Ree~~<br>~~ee~~|—<br>~~Ree~~<br>~~eee~~<br>~~ee~~|ns<br>~~Ree~~<br>~~eee~~<br>~~ee~~|
|tSUPLL<br>~~a~~<br>~~ee~~<br>~~es~~|Clock to Data Setup - PIO<br>Input Register<br>~~ee ~~<br>~~ee~~|—<br> ~~ee ~~<br>~~ee~~|—<br> ~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee ee~~|—<br>~~ee~~|—<br>~~eee~~<br>~~ee~~|ns<br>~~eee~~<br>~~ee~~|
|tHPLL<br>~~ee~~<br>~~es~~|Clock to Data Hold - PIO Input<br>Register<br>~~ee ~~|—<br> ~~ee ~~|—<br> ~~ee~~|—<br>~~ee~~|—<br>~~ee ee~~|—<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|
|tSU_DELPLL<br>~~es~~|Clock to Data Setup - PIO<br>Input Register with Data Input<br>Delay|—|—|—|—|—|—|ns|
|tH_DELPLL<br>~~es~~|Clock to Data Hold - PIO Input<br>Register with Data Input<br>Delay|0|—|0|—|0|—|ns|
|**Generic DDR Input/Output**<br>~~Ree~~|||||||||
|**Generic DDRX1 Inputs/Outputs with Clock and Data Centered at Pin (GDDRX1_RX/TX.SCLK.Centered) using PCLK Clock Input –**<br>**Bank0, 1, 2, 6, 7 –Figure 3.7 and Figure 3.9**<br>~~[eee~~<br>~~Be~~<br>~~a~~<br>~~eeeees~~|||||||||
|tSU_GDDR1<br>~~[eee~~<br>~~Be~~<br>~~es~~|Input Data Setup Before CLK<br>~~[eee~~<br>~~rns~~|0.917<br>~~[eee~~<br>~~a~~|—<br>~~[eee~~<br>~~ee~~|0.917<br>~~[eee~~<br>~~ee~~|—<br>~~[eee~~<br>~~es~~|0.917<br>~~[eee~~|—<br>~~[eee~~|ns<br>~~[eee~~|
|||0.275<br>~~a~~<br>~~rns~~|—<br>~~ee~~<br>~~rns~~|0.275<br>~~ee~~<br>~~I~~|—<br>~~es~~<br>~~ns~~|0.275<br>~~ID~~|—<br>~~I~~|UI|
|tHO_GDDR1<br>~~Be~~<br>~~es~~|Input Data Hold After CLK<br>~~rns~~|0.917<br>~~a~~<br>~~rns~~|—<br>~~ee ~~<br>~~rns~~|0.917<br> ~~ee ~~<br>~~I~~|—<br> ~~es~~<br>~~ns~~|0.917<br>~~ID~~|—<br>~~I~~|ns|
|tDVB_GDDR1<br>~~es~~<br>~~pp~~|Output Data Valid Before CLK<br>Output<br>~~rns~~<br>~~pp~~|1.134<br>~~rns ~~<br>~~pp~~<br>~~ee~~|—<br> ~~rns ~~<br>~~pp~~<br>~~es~~|1.113<br> ~~I~~<br>~~pp~~<br>~~es es es~~|—<br>~~ns ~~<br>~~pp~~<br>~~es es~~|1.014<br> ~~ID ~~<br>~~pp~~<br>~~es es~~|—<br> ~~I~~<br>~~pp~~|ns|
|||–0.533<br>~~pp~~<br>~~ee~~|—<br>~~pp~~<br>~~es~~|–0.554<br>~~pp~~<br>~~es es es~~|—<br>~~pp~~<br>~~es es~~|–0.653<br>~~pp~~<br>~~es es~~|—<br>~~pp~~|ns + ½UI|
|tDQVA_GDDR1<br>~~pp~~<br>~~fp~~<br>~~Po~~<br>~~rs~~|Output Data Valid After CLK<br>Output<br>~~pp~~<br>~~fp~~<br>~~ee~~<br>|1.217<br>~~pp~~<br>~~ee~~<br>~~fp~~<br>~~a~~|—<br>~~pp~~<br>~~es~~<br>~~ee~~|1.113<br>~~pp~~<br>~~es es es~~<br>~~ee~~|—<br>~~pp~~<br>~~es es~~<br>~~es~~|1.014<br>~~pp~~<br>~~es es~~|—<br>~~pp~~|ns|
|||–0.45<br>~~fp~~<br>~~a~~<br>~~ee~~<br>|—<br>~~ee~~<br>|–0.554<br>~~ee~~<br>|—<br>~~es~~<br>|–0.653<br>|—<br>|ns + ½UI|
|fDATA_GDDRX1<br>~~fp~~<br>~~Po~~<br>~~rs~~<br>~~ee~~|Input/Output Data Rate<br>~~fp~~<br>~~ee~~<br>~~Gr~~|—<br>~~fp~~<br>~~a~~<br>~~ee~~<br>~~ry~~|300<br>~~ee~~<br>~~rs~~|—<br>~~ee~~<br>~~I~~|300<br>~~es~~<br>~~I~~|—<br>~~I~~|300<br>~~ED~~|Mbps|
|fMAX_GDDRX1<br>~~Po~~<br>~~rs~~<br>~~ee~~|Frequencyof PCLK<br>~~ee~~<br>~~Gr~~<br>~~ee~~|—<br>~~a~~<br>~~ee~~<br>~~ry~~<br>~~ee~~|150<br>~~ee ~~<br>~~rs~~<br>~~ee~~|—<br> ~~ee ~~<br>~~I~~<br>~~ee~~|150<br> ~~es~~<br>~~I~~<br>~~ee~~|—<br>~~I~~<br>~~ee~~|150<br>~~ED~~<br>~~ee~~|MHz<br>~~ee~~|
|½ UI<br>~~rs~~<br>~~ee~~|Half of Data Bit Time, or 90<br>degrees<br>~~ee~~<br>~~Gr~~<br>~~ee~~|1.667<br>~~ee~~<br>~~ry~~<br>~~ee~~<br>~~ID~~|—<br>~~rs~~<br>~~ee~~|1.667<br>~~I~~<br>~~ee~~|—<br>~~I~~<br>~~ee~~|1.667<br>~~I~~<br>~~ee~~|—<br>~~ED~~<br>~~ee~~|ns<br>~~ee~~|
|Output TX to Input RX Marginper Edge<br>~~Gr ~~<br>~~ee~~<br>~~ee ~~<br>~~rs~~||0.300<br> ~~ry ~~<br> ~~ee ~~<br>~~rs~~<br>~~ID~~|—<br> ~~rs ~~<br> ~~ee ~~<br>~~rs~~|0.197<br> ~~I~~<br> ~~ee~~<br>~~rs~~|—<br>~~I ~~<br>~~ee~~<br>~~rs~~|0.097<br> ~~I ~~<br>~~ee~~<br>~~rs~~|—<br> ~~ED~~<br>~~ee~~<br>~~rs~~|ns<br>~~ee~~<br>~~rs~~|
|**Generic DDRX1 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX1_RX/TX.SCLK.Aligned) using PCLK Clock Input –**<br>**Bank0, 1, 2, 6, 7 –Figure 3.8 andFigure 3.10**<br>~~rs~~<br>~~ID~~<br>~~[Lee~~|||||||||
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-DS-02086-2.0
80
**CertusPro-NX Family Data Sheet**
|**Parameter**<br>~~ee~~|**Description**<br>~~ce~~|–**9**<br>~~ce~~<br>~~aee~~|–**9**<br>~~ce~~<br>~~aee~~|–**8**<br>~~eeee~~<br>~~ee~~|–**8**<br>~~eeee~~<br>~~ee~~|–**7**<br>~~eee~~<br>~~ee~~|–**7**<br>~~eee~~<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|---|---|---|
|||**Min**<br>~~ce~~<br>~~a~~|**Max**<br>~~ce~~<br>~~ee~~|**Min**<br>~~ee~~<br>~~ee~~|**Max**<br>~~ee~~|**Min**<br>~~eee~~<br>~~ee~~|**Max**<br>~~eee~~<br>~~ee~~||
|tDVA_GDDR1<br>~~ee~~<br>~~PL~~<br>~~Bf~~|Input Data Valid After CLK<br>~~ce~~<br>~~PL~~<br>~~Bf~~|—<br>~~ce~~<br>~~a ~~<br>~~a~~<br>|–0.917<br>~~ce ~~<br> ~~ee~~<br>~~ee~~|—<br> ~~ee ~~<br>~~ee~~<br>~~ee~~|–0.917<br> ~~ee ~~<br>~~ee~~|—<br> ~~eee~~<br>~~ee~~<br>~~ee~~|–0.917<br>~~eee~~<br>~~ee~~<br>~~ee~~|ns + ½UI<br>~~ee~~<br>~~ee~~|
|||—<br>~~a~~<br>|0.75<br>~~ee~~|—<br>~~ee~~|0.75<br>~~ee~~|—<br>~~ee~~|0.75<br>~~ee~~|ns<br>~~ee~~|
|||—<br>~~a~~<br>~~**a**~~|0.225<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|0.225<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|0.225<br>~~ee~~<br>~~ee~~|UI<br>~~ee~~<br>~~ee~~|
|tDVE_GDDR1<br><br>~~Bf~~|Input Data Hold After CLK<br><br>~~Bf~~|0.917<br>~~**a**~~|—<br>~~ee~~|0.917<br>~~ee~~|—<br>~~ee~~|0.917<br>~~ee~~|—<br>~~ee~~|ns + ½UI<br>~~ee~~|
|||2.583<br>~~**a**~~<br>~~a~~|—<br>~~ee~~|2.583<br>~~ee~~|—<br>~~ee~~|2.583<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|
|||0.775<br>~~**a**~~|—<br>~~ee~~|0.775<br>~~ee~~|—<br>~~ee~~|0.775<br>~~ee~~|—<br>~~ee~~|UI<br>~~ee~~|
|tDIA_GDDR1<br><br>~~Bf~~<br>~~a~~|Output Data Invalid After CLK<br>Output<br><br>~~Bf~~|—<br>~~**a**~~|0.554<br>~~ee~~|—<br>~~ee~~|0.554<br>~~ee~~|—<br>~~ee~~|0.653<br>~~ee~~|ns<br>~~ee~~|
|tDIB_GDDR1<br>~~a ~~<br>~~a~~|Output Data Invalid Before<br>CLK Output<br> ~~ee~~<br>~~GO~~|—<br>~~ee~~<br>~~GO~~|0.45<br>~~ee~~|—<br>~~ee~~<br>~~GOO~~|0.554<br>~~ee~~<br>~~GOO~~|—<br>~~ee~~<br>~~GOO~~|0.653<br>~~ee~~|ns<br>~~ee~~|
|fDATA_GDDRX1<br>~~a~~<br>~~a~~|Input/Output Data Rate<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|300|—<br>~~GOO~~<br>~~GOO~~|300<br>~~GOO~~<br>~~GOO~~|—<br>~~GOO~~<br>~~GOO~~|300|Mbps|
|fMAX_GDDRX1<br>~~a~~<br>~~a~~|Frequencyfor PCLK<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|150|—<br>~~GOO~~<br>~~GOO~~|150<br>~~GOO~~<br>~~GOO~~|—<br>~~GOO~~<br>~~GOO~~|150|MHz|
|½ UI<br>~~a~~<br>~~a~~|Half of Data Bit Time, or 90<br>degrees<br>~~GO~~|1.667<br>~~GO~~|—|1.667<br>~~GOO~~<br>~~GO~~|—<br>~~GOO~~<br>~~GO~~|1.667<br>~~GOO~~<br>~~GO~~|—<br>~~GO~~|ns|
|Output TX to Input RX Marginper Edge<br>~~GO~~||0.300<br>~~GO~~|—<br>~~GO~~|0.197<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|0.097<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|ns<br>~~GO~~|
|**Generic DDRX1 Inputs/Outputs with Clock and Data Centered at Pin (GDDRX1_RX/TX.SCLK.Centered) using PCLK Clock Input –**<br>**Bank3, 4, 5 –Figure 3.7 and Figure 3.9**<br>~~GO~~<br>~~ee~~|||||||||
|tSU_GDDR1<br>~~ee~~<br>~~a~~|Input Data Setup Before CLK<br>~~ee~~|0.917<br>~~ee~~|—|0.917|—|0.917|—|ns|
|||0.275<br>~~ee~~|—|0.275|—<br>~~GO~~|0.275<br>~~GO~~|—|UI|
|tHO_GDDR1<br>~~ee~~<br>~~OO~~<br>~~a~~|Input Data Hold After CLK<br>~~ee~~<br>~~OO~~<br>~~GO~~|0.917<br>~~ee~~<br>~~OO~~<br>~~O~~|—<br>~~OO~~|0.917<br>~~OO~~<br>~~GOO~~|—<br>~~OO~~<br>~~GO~~<br>~~GOO~~|0.917<br>~~OO~~<br>~~GO~~<br>~~GOO~~|—<br>~~OO~~|ns<br>~~OO~~|
|fDATA_IN_GDDRX1<br>~~OO~~<br>~~a~~|Input Data Rate<br>~~OO~~<br>~~GO~~|—<br>~~OO~~<br>~~O~~|300<br>~~OO~~|—<br>~~OO~~<br>~~GOO~~|300<br>~~OO~~<br>~~GO~~<br>~~GOO~~|—<br>~~OO~~<br>~~GO~~<br>~~GOO~~|300<br>~~OO~~|Mbps<br>~~OO~~|
|tDVB_GDDR1<br>~~a~~|Output Data Valid Before CLK<br>Output<br>~~GO~~<br>~~a~~|0.670<br>~~O~~<br>~~a~~|—<br>~~a~~|0.631<br>~~GOO~~<br>~~a~~|—<br>~~GOO~~|0.744<br>~~GOO~~|—|ns|
|||–0.330<br>~~a~~<br>~~a~~|—<br>~~a~~|–0.369<br>~~a~~|—|–0.435|—|ns + ½UI|
|tDQVA_GDDR1<br>~~a~~<br>~~a~~<br>~~a~~|Output Data Valid After CLK<br>Output<br>~~a~~|0.700<br>~~a~~<br>~~a~~<br>~~ee~~|—<br>~~a~~|0.631<br>~~a~~|—|0.744|—|ns|
|||–0.300<br>~~ee~~|—|–0.369|—<br>~~CO~~|–0.435<br>~~CO~~|—|ns + ½UI|
|fDATA_OUT_GDDRX1<br>~~a~~<br>~~a ~~<br>~~a~~|Output Data Rate<br> ~~Ge~~<br>~~GO~~|—<br>~~ee~~<br>~~Ge~~<br>~~GO~~|500<br>~~Ge~~|—<br>~~Ge~~<br>~~GOO~~|500<br>~~Ge~~<br>~~CO~~<br>~~GOO~~|—<br>~~Ge~~<br>~~CO~~<br>~~GOO~~|424<br>~~Ge~~|Mbps<br>~~Ge~~|
|fMAX_GDDRX1<br>~~a~~|Frequencyof PCLK<br>~~GO~~|—<br>~~GO~~|250|—<br>~~GOO~~|250<br>~~CO~~<br>~~GOO~~|—<br>~~CO~~<br>~~GOO~~|212|MHz|
|½ UI<br>~~ee~~|Half of Data Bit Time, or 90<br>degrees<br>~~GO~~<br>~~ee~~|1.000<br>~~GO~~<br>~~ee~~|—<br>~~ee~~|1.000<br>~~GOO~~<br>~~ee~~|—<br>~~GOO~~<br>~~ee~~|1.179<br>~~GOO~~<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|
|Output TX to Input RX Marginper Edge<br>~~a~~||0.150<br>~~a~~|—<br>~~a~~|0.081<br>~~a~~|—<br>~~a~~|0.095<br>~~a~~|—<br>~~a~~|ns<br>~~a~~|
|**Generic DDRX1 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX1_RX/TX.SCLK.Aligned) using PCLK Clock Input –**<br>**Bank3, 4, 5 –Figure 3.8 andFigure 3.10**<br>~~a~~<br>~~EEE~~|||||||||
|tDVA_GDDR1<br>~~EEE~~<br>~~SS~~<br>~~Bf~~|Input Data Valid After CLK<br>~~EEE~~<br>~~SS~~<br>~~Bf~~|—<br>~~EEE~~<br>~~SS~~|–0.917<br>~~EEE~~|—<br>~~EEE~~|–0.917<br>~~EEE~~|—<br>~~EEE~~|–0.917<br>~~EEE~~|ns + ½UI<br>~~EEE~~|
|||—<br>~~SS~~<br>~~a~~|0.75<br>~~ee~~|—<br>~~ee~~|0.75<br>~~ee~~|—<br>~~ee~~|0.75<br>~~ee~~|ns<br>~~ee~~|
|||—<br>~~SS~~<br>~~a~~<br>|0.225<br>~~ee~~|—<br>~~ee~~|0.225<br>~~ee~~|—<br>~~ee~~|0.225<br>~~ee~~|UI<br>~~ee~~|
|tDVE_GDDR1<br>~~Bf~~<br>~~a~~|Input Data Hold After CLK<br>~~Bf~~<br>|0.917<br>~~a~~|—<br>~~ee~~|0.917<br>~~ee~~|—<br>~~ee~~|0.917<br>~~ee~~|—<br>~~ee~~|ns + ½UI<br>~~ee~~|
|||2.583<br><br>~~ee~~<br>|—<br>~~ee~~<br>|2.583<br>~~ee~~<br>|—<br>~~ee~~<br>|2.583<br>~~ee~~<br>|—<br>~~ee~~<br>|ns<br>~~ee~~<br>|
|||0.775<br><br>~~ee~~<br>|—<br>~~ee~~<br>|0.775<br>~~ee~~<br>|—<br>~~ee~~<br>|0.775<br>~~ee~~<br>|—<br>~~ee~~<br>|UI<br>~~ee~~<br>|
|fDATA_IN_GDDRX1<br>~~Bf~~<br>~~a~~|Input Data Rate<br>~~Bf~~<br>~~ee~~|—<br><br>~~ee~~<br>~~ee~~|300<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|300<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|300<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~<br>~~ee~~|
|tDIA_GDDR1<br>~~a~~<br>~~a~~|Output Data Invalid After<br>CLK Output<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.300<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|0.369<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|0.435<br>~~ee~~<br>~~ee~~|ns<br>~~ee~~<br>~~ee~~|
|tDIB_GDDR1<br>~~a ~~<br>~~a~~<br>~~a~~|Output Data Invalid Before<br>CLK Output<br> ~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|0.300<br>~~ee~~|—<br>~~ee~~<br>~~GOO~~|0.369<br>~~ee~~<br>~~GOO~~|—<br>~~ee~~<br>~~GOO~~|0.435<br>~~ee~~|ns<br>~~ee~~|
|fDATA_OUT_GDDRX1<br>~~a~~<br>~~a ~~<br>~~a~~|Output Data Rate<br>~~ee~~<br> ~~Ge~~|—<br>~~ee~~<br>~~Ge~~|500<br>~~Ge~~|—<br>~~Ge~~<br>~~GOO~~|500<br>~~Ge~~<br>~~GOO~~|—<br>~~Ge~~<br>~~GOO~~|424<br>~~Ge~~|Mbps<br>~~Ge~~|
|fMAX_GDDRX1<br>~~a~~|Frequencyfor PCLK<br>~~GO~~|—<br>~~GO~~|250|—<br>~~GOO~~<br>~~GO~~|250<br>~~GOO~~<br>~~GO~~|—<br>~~GOO~~<br>~~GO~~|212|MHz|
|½ UI<br>~~es~~|Half of Data Bit Time, or 90<br>degrees<br>~~es~~|1.000<br>~~es~~|—<br>~~es~~|1.000<br>~~es~~|—<br>~~es~~|1.179<br>~~es~~|—<br>~~es~~|ns<br>~~es~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-DS-02086-2.0
81
**CertusPro-NX Family Data Sheet**
|**Parameter**<br>~~ee~~|**Description**<br>~~ec~~|–**9**<br>~~ec~~|–**9**<br>~~ec~~|–**8**<br>~~eeee~~<br>~~ee~~|–**8**<br>~~eeee~~<br>~~ee~~|–**7**<br>~~ee~~<br>~~ee~~|–**7**<br>~~ee~~<br>~~ee~~|**Unit**|
|---|---|---|---|---|---|---|---|---|
|||**Min**<br>~~ec~~<br>~~a ee~~|**Max**<br>~~ec~~<br>~~ee~~|**Min**<br>~~ee~~<br>~~ee~~|**Max**<br>~~ee~~<br>~~ee~~<br>~~ee~~|**Min**<br>~~ee~~<br>~~ee~~<br>~~ee~~|**Max**<br>~~ee~~<br>~~ee~~<br>~~ee~~||
|Output TX to Input RX Marginper Edge<br>~~ee~~<br>~~ec~~<br>~~pO~~||0.150<br>~~ec~~<br>~~pO~~|—<br>~~ec~~<br>~~pO~~|0.081<br>~~ee ~~<br>~~pO~~|—<br> ~~ee ~~<br>~~ee~~<br>~~pO~~|0.095<br> ~~ee~~<br>~~ee~~<br>~~pO~~|—<br>~~ee~~<br>~~ee~~<br>~~pO~~|ns<br>~~pO~~|
|**Generic DDRX2 Inputs/Outputs with Clock and Data Centered at Pin (GDDRX2_RX/TX.ECLK.Centered) using PCLK Clock Input –**<br>**Figure 3.7 and Figure 3.9**<br>~~ee~~<br>~~ceee eeeee~~|||||||||
|tSU_GDDRX2<br>~~ee~~|Data Setup before CLK Input<br>~~ce~~|0.209<br>~~ce~~|—<br>~~ce~~|0.209<br>~~ee eee~~|—<br>~~eee~~|0.206<br>~~eee~~|—<br>~~eee~~|ns<br>~~ee~~|
|||0.209<br>~~ce~~<br>~~a ee~~|—<br>~~ce~~<br>~~ee~~|0.209<br>~~ee eee~~<br>~~ee~~|—<br>~~eee~~<br>~~ee~~|0.175<br>~~eee~~<br>~~ee~~|—<br>~~eee~~<br>~~ee~~|UI<br>~~ee~~<br>~~ee~~|
|tHO_GDDRX2<br>~~ee~~<br>~~a~~|Data Hold after CLK Input<br>~~ce~~<br>~~GO~~|0.213<br>~~ce~~<br>~~GO~~|—<br>~~ce ~~|0.213<br> ~~ee eee~~<br>~~GO~~|—<br>~~eee~~<br>~~GO~~|0.206<br>~~eee~~<br>~~GO~~|—<br>~~eee ~~|ns<br> ~~ee~~|
|tDVB_GDDRX2<br>~~py~~<br>~~ee~~|Output Data Valid Before CLK<br>Output<br>~~py~~<br>~~cece~~|0.360<br>~~py~~|—<br>~~py~~|0.352<br>~~py~~|—<br>~~py~~|0.415<br>~~py~~|—<br>~~py~~|ns<br>~~py~~|
|||–0.140<br>~~py~~<br>~~a~~<br>~~cece~~|—<br>~~py~~<br>~~cece~~|–0.148<br>~~py~~<br>~~ee eee~~|—<br>~~py~~<br>~~eee~~|–0.174<br>~~py~~<br>~~eee~~|—<br>~~py~~<br>~~eee~~|ns + ½UI<br>~~py~~<br>~~ee~~|
|tDQVA_GDDRX2<br>~~ee~~|Output Data Valid After CLK<br>Output<br>~~cece~~|0.38<br>~~a~~<br>~~cece~~|—<br>~~cece~~|0.352<br>~~ee eee~~|—<br>~~eee~~|0.415<br>~~eee~~|—<br>~~eee~~|ns<br>~~ee~~|
|||–0.12<br>~~a~~<br>~~cece~~<br>~~a ee~~|—<br>~~cece~~<br>~~ee~~|–0.148<br>~~ee eee~~<br>~~ee~~|—<br>~~eee~~<br>~~ee~~|–0.174<br>~~eee~~<br>~~ee~~|—<br>~~eee~~<br>~~ee~~|ns + ½UI<br>~~ee~~<br>~~ee~~|
|fDATA_GDDRX2<br>~~ee~~<br>~~a~~<br>~~a~~|Input/Output Data Rate<br>~~cece~~<br>~~GO~~<br>|—<br>~~a~~<br>~~cece~~<br>~~GO~~<br>|1000<br>~~cece ~~<br>|—<br> ~~ee eee~~<br>~~GO~~<br>~~GOO~~<br>|1000<br>~~eee~~<br>~~GO~~<br>~~GOO~~<br>|—<br>~~eee~~<br>~~GO~~<br>~~GOO~~<br>|848<br>~~eee ~~<br>~~GOO~~<br>|Mbps<br> ~~ee~~<br>|
|fMAX_GDDRX2<br>~~Ge~~<br>~~a~~|Frequencyfor ECLK<br>~~Ge~~<br>|—<br>~~Ge~~<br>|500<br>~~Ge~~<br>|—<br>~~Ge~~<br>~~GOO~~<br>|500<br>~~Ge~~<br>~~GOO~~<br>|—<br>~~Ge~~<br>~~GOO~~<br>|424<br>~~Ge~~<br>~~GOO~~<br>|MHz<br>~~Ge~~<br>|
|½ UI<br>~~a~~|Half of Data Bit Time, or 90<br>degrees<br>~~ee~~|0.5<br>~~ee~~|—<br>~~ee~~|0.5<br>~~GOO~~<br>~~ee~~|—<br>~~GOO~~<br>~~ee~~|0.589<br>~~GOO~~<br>~~ee~~|—<br>~~GOO~~<br>~~ee~~|ns<br>~~ee~~|
|fPCLK<br>~~a ~~<br>~~a~~|PCLK frequency<br> ~~ee~~<br>~~QO~~|—<br>~~ee~~<br>~~QO~~|250<br>~~ee~~|—<br>~~GOO~~<br>~~ee~~|250<br>~~GOO~~<br>~~ee~~|—<br>~~GOO~~<br>~~ee~~|212.1<br>~~GOO~~<br>~~ee~~|MHz<br>~~ee~~|
|Output TX to Input RX Marginper Edge<br>~~a~~<br>~~QO~~||0.230<br>~~QO~~|—|0.202|—|0.239|—|—|
|**Generic DDRX2 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX2_RX/TX.ECLK.Aligned) using PCLK Clock Input –**<br>**Figure 3.8 andFigure 3.10**<br>~~______~~|||||||||
|tDVA_GDDRX2<br>~~______~~|Input Data Valid After CLK<br>~~_____~~|—<br>~~_____~~<br>~~a~~|–0.275<br>~~_____~~|—<br>~~_____~~|–0.275<br>~~_____~~|—<br>~~_____~~|–0.324<br>~~_____~~|ns + ½UI<br>~~_____~~|
|||—<br>~~a~~|0.225|—|0.225|—|0.265|ns|
|||—<br>~~a~~|0.225|—|0.225|—|0.225|UI|
|tDVE_GDDRX2|Input Data Hold After CLK|0.275<br>~~a~~<br>~~ee~~|—<br>~~ee~~|0.275<br>~~ee ee~~|—<br>~~ee~~|0.324|—|ns + ½UI|
|||0.775<br>~~a~~<br>~~ee~~|—<br>~~ee~~|0.775<br>~~ee ee~~|—<br>~~ee~~|0.914|—|ns|
|||0.775<br>~~ee~~<br>~~a~~|—<br>~~ee~~<br>~~ee~~|0.775<br>~~ee ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|0.775<br>~~ee~~|—<br>~~ee~~|UI<br>~~ee~~|
|tDIA_GDDRX2<br>~~a~~|Output Data Invalid After CLK<br>Output<br>~~ee~~|—<br>~~ee~~|0.12<br>~~ee~~|—<br>~~ee~~|0.148<br>~~ee~~|—<br>~~ee~~|0.174<br>~~ee~~|ns<br>~~ee~~|
|tDIB_GDDRX2<br>~~a ~~<br>~~a~~|Output Data Invalid Before<br>CLK Output<br> ~~ee~~|—<br>~~ee~~|0.12<br>~~ee~~|—<br>~~ee~~|0.148<br>~~ee~~|—<br>~~ee~~|0.174<br>~~ee~~|ns<br>~~ee~~|
|fDATA_GDDRX2<br>~~a~~<br>~~a~~|Input/Output Data Rate<br>~~GO~~|—<br>~~GO~~|1000|—<br>~~GO~~|1000<br>~~GO~~|—<br>~~GO~~|848|Mbps|
|fMAX_GDDRX2<br>~~a~~|Frequencyfor ECLK<br>~~GO~~|—<br>~~GO~~|500|—<br>~~GC~~|500<br>~~GC~~|—<br>~~GC~~|424|MHz|
|½ UI<br>~~a~~|Half of Data Bit Time, or 90<br>degrees<br>~~a~~|0.5<br>~~a~~|—<br>~~a~~|0.5<br>~~a~~|—<br>~~a~~|0.589<br>~~a~~|—<br>~~a~~|ns<br>~~a~~|
|fPCLK<br>~~Ge~~|PCLK frequency<br>~~Ge~~|—<br>~~Ge~~|250<br>~~Ge~~|—<br>~~Ge~~|250<br>~~Ge~~|—<br>~~Ge~~|212.1<br>~~Ge~~|MHz<br>~~Ge~~|
|Output TX to Input RX Marginper Edge<br>~~Ge~~<br>~~DO~~||0.105<br>~~Ge~~<br>~~DO~~|—<br>~~Ge~~<br>~~DO~~|0.077<br>~~Ge~~<br>~~DO~~|—<br>~~Ge~~<br>~~DO~~|0.091<br>~~Ge~~<br>~~DO~~|—<br>~~Ge~~<br>~~DO~~|ns<br>~~Ge~~<br>~~DO~~|
|**Generic DDRX4 Inputs/Outputs with Clock and Data Centered at Pin (GDDRX4_RX/TX.ECLK.Centered) using PCLK Clock Input –**<br>**Figure 3.7 andFigure 3.9**<br>~~DO~~|||||||||
|tSU_GDDRX4<br>~~a~~<br>~~a~~|Input Data Set-Up Before CLK<br>~~GO~~|0.210<br>~~a~~|—<br>~~ee~~|0.210<br>~~ee~~|—<br>~~ee~~|0.244<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~<br>~~ee~~|
|||0.315<br>~~a~~<br>~~O~~|—<br>~~ee~~|0.252<br>~~ee~~<br>~~GOO~~|—<br>~~ee~~<br>~~GOO~~|0.252<br>~~ee~~<br>~~GOO~~|—<br>~~ee~~|UI<br>~~ee~~<br>~~ee~~|
|tHO_GDDRX4<br>~~a~~|Input Data Hold After CLK<br>~~GO~~|0.254<br>~~O~~|—|0.254<br>~~GOO~~|—<br>~~GOO~~|0.244<br>~~GOO~~|—|ns<br>~~ee~~|
|tDVB_GDDRX4<br>~~fp~~|Output Data Valid Before CLK<br>Output<br>~~GO~~<br>~~fp~~|0.193<br>~~O~~<br>~~fp~~|—<br>~~fp~~|0.269<br>~~GOO~~|—<br>~~GOO~~|0.309<br>~~GOO~~|—|ns|
|||–0.140<br>~~fp~~<br>~~po~~|—<br>~~fp~~<br>~~po~~|–0.148<br>~~po~~|—<br>~~po~~|–0.174<br>~~po~~|—<br>~~po~~|ns + ½UI<br>~~po~~|
|tDQVA_GDDRX4<br>~~fp~~<br>~~fp~~|Output Data Valid After CLK<br>Output<br>~~fp~~<br>~~fp~~|0.213<br>~~fp~~<br>~~po~~<br>~~fp~~|—<br>~~fp~~<br>~~po~~|0.269<br>~~po~~|—<br>~~po~~|0.309<br>~~po~~|—<br>~~po~~|ns<br>~~po~~|
|||–0.12<br>~~fp~~<br>~~a~~|—|–0.148|—|–0.174|—|ns + ½UI|
|fDATA_GDDRX4<br>~~a~~|Input/Output Data Rate<br>~~GO~~|—<br>~~GO~~|1500|—<br>~~GO~~|1200<br>~~GO~~|—<br>~~GO~~|1034|Mbps|
|fMAX_GDDRX4<br>~~a~~|Frequencyfor ECLK<br>~~GO~~|—<br>~~GO~~|750|—<br>~~GO~~|600<br>~~GO~~|—<br>~~GO~~|517|MHz|
|½ UI<br>~~ee~~|Half of Data Bit Time, or 90<br>degrees<br>~~ee~~|0.333<br>~~ee~~|—<br>~~ee~~|0.417<br>~~ee~~|—<br>~~ee~~|0.483<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|
|fPCLK<br>~~Ge~~|PCLK frequency<br>~~Ge~~|—<br>~~Ge~~|187.5<br>~~Ge~~|—<br>~~Ge~~|150<br>~~Ge~~|—<br>~~Ge~~|129.3<br>~~Ge~~|MHz<br>~~Ge~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-DS-02086-2.0
82
**CertusPro-NX Family Data Sheet**
|**Parameter**<br>~~ee~~|**Description**<br>~~ee~~|–**9**<br>~~ee~~|–**9**<br>~~ee~~|–**8**<br>~~eeee~~<br>~~ee~~|–**8**<br>~~eeee~~<br>~~ee~~|–**7**<br>~~ee~~<br>~~ee~~|–**7**<br>~~ee~~<br>~~ee~~|**Unit**|
|---|---|---|---|---|---|---|---|---|
|||**Min**<br>~~ee~~<br>~~a ee~~|**Max**<br>~~ee~~<br>~~ee~~|**Min**<br>~~ee~~<br>~~ee~~<br>~~GO~~|**Max**<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~GO~~|**Min**<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~GO~~|**Max**<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~GO~~||
|Output TX to Input RX Marginper Edge<br>~~ee~~<br>~~ee~~<br>~~GO~~||0.080<br>~~ee~~<br>~~GO~~|—<br>~~ee ~~<br>~~GO~~|0.102<br> ~~ee ~~<br>~~GO~~<br>~~GO~~|—<br> ~~ee ~~<br>~~ee~~<br>~~GO~~<br>~~GO~~|0.116<br> ~~ee~~<br>~~ee~~<br>~~GO~~<br>~~GO~~|—<br>~~ee~~<br>~~ee~~<br>~~GO~~<br>~~GO~~|ns<br>~~GO~~|
|**Generic DDRX4 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX4_RX/TX.ECLK.Aligned) using PCLK Clock Input, Left**<br>**and Right sides Only –Figure 3.8 and Figure 3.10**<br>~~GO~~<br>~~ee~~|||||||||
|tDVA_GDDRX4<br>~~pf~~|Input Data Valid After CLK<br>~~pf~~|—<br>~~**a**~~|–0.216|—|–0.229|—|–0.265|ns + ½UI|
|||—<br>~~**a**~~|0.117|—|0.188|—|0.218|ns|
|||—<br>~~**a**~~|0.176|—|0.225|—|0.225|UI|
|tDVE_GDDRX4<br>~~PT~~|Input Data Hold After CLK<br>~~PT~~|0.227<br>~~**a**~~|—|0.229|—|0.266|—|ns + ½UI|
|||0.560<br>~~**a**~~|—|0.646|—|0.749|—|ns|
|||0.840<br>~~**a**~~|—|0.775|—|0.775|—|UI|
|tDIA_GDDRX4<br>~~a~~|Output Data Invalid After CLK<br>Output|—|0.12|—|0.148|—|0.174|ns|
|tDIB_GDDRX4<br>~~a~~<br>~~a~~|Output Data Invalid Before<br>CLK Output<br>~~ee~~<br>~~GO~~|—<br>~~ee~~<br>~~GO~~|0.12<br>~~ee~~<br>~~eG~~|—<br>~~ee~~<br>~~eG~~|0.148<br>~~ee~~<br>~~eG~~|—<br>~~ee~~<br>~~GO~~|0.174<br>~~ee~~|ns<br>~~ee~~|
|fDATA_GDDRX4<br>~~a~~<br>~~a~~<br>~~a~~|Input/Output Data Rate<br>~~ee~~<br>~~GO~~<br>|—<br>~~ee~~<br>~~GO~~<br>|1500<br>~~ee~~<br>~~eG~~<br>|—<br>~~ee~~<br>~~eG~~<br>~~GOO~~<br>|1200<br>~~ee~~<br>~~eG~~<br>~~GOO~~<br>|—<br>~~ee~~<br>~~GO~~<br>~~GOO~~<br>|1034<br>~~ee~~<br>~~GOO~~<br>|Mbps<br>~~ee~~<br>|
|fMAX_GDDRX4<br>~~a~~<br>~~Ge~~<br>~~a~~|Frequencyfor ECLK<br>~~GO~~<br>~~Ge~~<br>|—<br>~~GO~~<br>~~Ge~~<br>|750<br>~~eG~~<br>~~Ge~~<br>|—<br>~~eG~~<br>~~Ge~~<br>~~GOO~~<br>|600<br>~~eG ~~<br>~~Ge~~<br>~~GOO~~<br>|—<br> ~~GO~~<br>~~Ge~~<br>~~GOO~~<br>|517<br>~~Ge~~<br>~~GOO~~<br>|MHz<br>~~Ge~~<br>|
|½ UI<br>~~a ~~|Half of Data Bit Time, or 90<br>degree<br> ~~ee~~|0.333<br>~~ee~~|—<br>~~ee~~|0.417<br>~~GOO~~<br>~~ee~~|—<br>~~GOO~~<br>~~ee~~<br>~~CO~~|0.483<br>~~GOO~~<br>~~ee~~<br>~~CO~~|—<br>~~GOO~~<br>~~ee~~<br>~~CO~~|ns<br>~~ee~~|
|fPCLK<br>~~a ~~|PCLK frequency<br> ~~Ge~~|—<br>~~Ge~~|187.5<br>~~Ge~~|—<br>~~Ge~~|150<br>~~Ge~~<br>~~CO~~|—<br>~~Ge~~<br>~~CO~~|129.3<br>~~Ge~~<br>~~CO~~|MHz<br>~~Ge~~|
|Output TX to Input RX Marginper Edge<br>~~ee~~||0.030<br>~~ee~~|—<br>~~ee~~|0.040<br>~~ee~~|—<br>~~CO~~<br>~~ee~~|0.044<br>~~CO~~<br>~~ee~~|—<br>~~CO~~<br>~~ee~~|ns<br>~~ee~~|
|**Generic DDRX5 Inputs/Outputs with Clock and Data Centered at Pin (GDDRX5_RX/TX.ECLK.Centered) using PCLK Clock Input –**<br>**Figure 3.7 and Figure 3.9**<br>~~ee~~<br>~~_____________~~<br>~~a~~<br>~~—_—————eEEe~~|||||||||
|tSU_GDDRX5<br>~~_____________~~<br>~~a~~<br>~~a~~<br>~~a~~|Input Data Set-Up Before CLK<br>~~_____________~~<br>~~—_—————eEEe~~<br>~~**GO**~~|0.231<br>~~_____________~~<br>~~—_—————eEEe~~<br>~~ee~~|—<br>~~_____________~~<br>~~—_—————eEEe~~|0.231<br>~~_____________~~<br>~~—_—————eEEe~~|—<br>~~_____________~~<br>~~—_—————eEEe~~|0.224<br>~~_____________~~<br>~~—_—————eEEe~~|—<br>~~_____________~~<br>~~—_—————eEEe~~|ns<br>~~_____________~~<br>~~—_—————eEEe~~|
|||0.289<br>~~—_—————eEEe~~<br>~~ee~~<br>~~**GO**~~|—<br>~~—_—————eEEe~~|0.277<br>~~—_—————eEEe~~<br>~~GOO~~|—<br>~~—_—————eEEe~~<br>~~GOO~~|0.224<br>~~—_—————eEEe~~<br>~~GOO~~|—<br>~~—_—————eEEe~~|UI<br>~~—_—————eEEe~~|
|tHO_GDDRX5<br>~~a~~<br>~~a~~<br>~~a~~|Input Data Hold After CLK<br>~~—_—————eEEe~~<br>~~**GO**~~|0.229<br>~~—_—————eEEe~~<br>~~ee~~<br>~~**GO**~~|—<br>~~—_—————eEEe~~|0.229<br>~~—_—————eEEe~~<br>~~GOO~~|—<br>~~—_—————eEEe~~<br>~~GOO~~|0.224<br>~~—_—————eEEe~~<br>~~GOO~~|—<br>~~—_—————eEEe~~|ns<br>~~—_—————eEEe~~|
|tWINDOW_GDDRX5C<br>~~a~~|Input Data Valid Window<br>~~**GO**~~|—<br>~~**GO**~~|—|—<br>~~GOO~~<br>~~GO~~|—<br>~~GOO~~<br>~~GO~~|—<br>~~GOO~~<br>~~GO~~|—|ns|
|tDVB_GDDRX5<br>~~ee~~<br>~~pp~~|Output Data Valid Before CLK<br>Output<br>~~ee~~<br>~~pp~~|0.249<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|0.269<br>~~ee~~|—<br>~~ee~~|0.326<br>~~ee~~|—<br>~~ee~~|ns|
|||–0.151<br>~~ee~~<br>~~ee~~<br>~~pp~~|—<br>~~ee~~<br>~~ee~~<br>~~pp~~|–0.148<br>~~ee~~<br>~~pp~~|—<br>~~ee~~<br>~~pp~~|–0.174<br>~~ee~~<br>~~pp~~|—<br>~~ee~~<br>~~ap~~|ns + ½UI<br>~~ap~~|
|tDQVA_GDDRX5<br>~~ee~~<br>~~pp~~|Output Data Valid After CLK<br>Output<br>~~ee~~<br>~~pp~~|0.249<br>~~ee~~<br>~~ee ~~<br>~~pp~~|—<br>~~ee~~<br> ~~ee~~<br>~~pp~~|0.269<br>~~ee~~<br>~~pp~~|—<br>~~ee~~<br>~~pp~~|0.326<br>~~ee ~~<br>~~pp~~|—<br> ~~ee~~<br>~~ap~~|ns<br>~~ap~~|
|||–0.151<br>~~pp~~<br>~~a~~|—<br>~~pp~~|–0.148<br>~~pp~~<br>~~GO~~|—<br>~~pp~~<br>~~GO~~|–0.174<br>~~pp~~<br>~~GO~~|—<br>~~ap~~<br>~~GO~~|ns + ½UI<br>~~ap~~|
|fDATA_GDDRX5<br>~~pp~~<br>~~GO~~|Input/Output Data Rate<br>~~pp~~<br>~~GO~~|—<br>~~pp~~<br>~~GO~~|1250<br>~~pp~~<br>~~GO~~|—<br>~~pp~~<br>~~GO~~<br>~~GO~~|1200<br>~~pp~~<br>~~GO~~<br>~~GO~~|—<br>~~pp~~<br>~~GO~~<br>~~GO~~|1000<br>~~ap~~<br>~~GO~~<br>~~GO~~|Mbps<br>~~ap~~<br>~~GO~~|
|fMAX_GDDRX5<br>~~Ge~~|Frequencyfor ECLK<br>~~Ge~~|—<br>~~Ge~~|625<br>~~Ge~~|—<br>~~GO~~<br>~~Ge~~|600<br>~~GO~~<br>~~Ge~~|—<br>~~GO~~<br>~~Ge~~|500<br>~~GO~~<br>~~Ge~~|MHz<br>~~Ge~~|
|½ UI<br>~~Ge~~<br>~~a~~|Half of Data Bit Time, or 90<br>degrees<br>~~Ge~~|0.400<br>~~Ge~~|—<br>~~Ge~~|0.417<br>~~Ge~~|—<br>~~Ge~~|0.500<br>~~Ge~~|—<br>~~Ge~~|ns<br>~~Ge~~|
|fPCLK<br>~~a~~<br>~~a~~|PCLK frequency<br>~~OO~~|—<br>~~OO~~|125|—<br>~~GO~~<br>~~GO~~|120<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|100<br>~~GO~~|MHz|
|Output TX to Input RX Marginper Edge<br>~~a~~<br>~~OO~~<br>~~DO~~||0.12<br>~~OO~~<br>~~DO~~|—<br>~~DO~~|0.102<br>~~GO~~<br>~~DO~~<br>~~GO~~|—<br>~~GO~~<br>~~DO~~<br>~~GO~~|0.126<br>~~GO~~<br>~~DO~~<br>~~GO~~|—<br>~~DO~~<br>~~GO~~|ns<br>~~DO~~|
|**Generic DDRX5 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX5_RX/TX.ECLK.Aligned) using PCLK Clock Input –**<br>**Figure 3.8 andFigure 3.10**<br>~~DO~~<br>~~GO~~<br>~~__________~~|||||||||
|tDVA_GDDRX5<br>~~__________~~<br>~~pf~~<br>~~SS~~|Input Data Valid After CLK<br>~~__________~~<br>~~pf~~|—<br>~~__________~~<br>~~a~~|–0.220<br>~~__________~~|—<br>~~__________~~|–0.229<br>~~__________~~|—<br>~~__________~~|–0.275<br>~~__________~~|ns + ½UI<br>~~__________~~|
|||—<br>~~a~~|0.18|—|0.188|—|0.225|ns|
|||—<br>~~a~~~~**a**~~|0.225|—|0.225|—|0.225|UI|
|tDVE_GDDRX5<br>~~SS~~<br>~~a~~|Input Data Hold After CLK<br>~~GO~~|0.22<br>~~**a**~~|—|0.229|—|0.275|—|ns + ½UI|
|||0.62<br>~~**a**~~<br>~~a~~|—<br>~~ee~~|0.646<br>~~ee~~|—<br>~~ee~~|0.775<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|
|||0.775<br>~~**a**~~<br>~~a ~~<br>~~GO~~|—<br> ~~ee~~<br>~~ee~~|0.775<br>~~ee~~<br>~~ee~~<br>~~GOO~~|—<br>~~ee~~<br>~~ee~~<br>~~GOO~~|0.775<br>~~ee~~<br>~~ee~~<br>~~GOO~~|—<br>~~ee~~<br>~~ee~~|UI<br>~~ee~~<br>~~ee~~|
|tWINDOW_GDDRX5A<br>~~SS~~<br>~~a~~|Input Data Valid Window<br>~~GO~~|—<br>~~**a**~~<br>~~GO~~|—|—<br>~~GOO~~|—<br>~~GOO~~|—<br>~~GOO~~|—|ns|
|tDIA_GDDRX5<br>~~a~~<br>~~ee~~|Output Data Invalid After CLK<br>Output<br>~~GO~~<br>~~ee~~|—<br>~~GO~~<br>~~ee~~|0.12<br>~~ee~~|—<br>~~GOO~~<br>~~ee~~|0.148<br>~~GOO~~<br>~~ee~~|—<br>~~GOO~~<br>~~ee~~|0.174<br>~~ee~~|ns<br>~~ee~~|
|tDIB_GDDRX5<br>~~ee~~|Output Data Invalid Before<br>CLK Output<br>~~ee~~|—<br>~~ee~~|0.12<br>~~ee~~|—<br>~~ee~~<br>~~GO~~|0.148<br>~~ee~~<br>~~GO~~|—<br>~~ee~~<br>~~GO~~|0.174<br>~~ee~~<br>~~GO~~|ns<br>~~ee~~|
|fDATA_GDDRX5<br>~~FO~~|Input/Output Data Rate<br>~~FO~~|—<br>~~FO~~|1250<br>~~FO~~|—<br>~~FO~~<br>~~GO~~|1200<br>~~FO~~<br>~~GO~~|—<br>~~FO~~<br>~~GO~~|1000<br>~~FO~~<br>~~GO~~|Mbps<br>~~FO~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
83
**CertusPro-NX Family Data Sheet**
|**Parameter**<br>~~a~~|**Description**|–**9**<br>~~eeee~~|–**9**<br>~~eeee~~|–**8**<br>~~ee~~<br>~~ee~~|–**8**<br>~~ee~~<br>~~ee~~|–**7**<br>~~ee~~|–**7**<br>~~ee~~|**Unit**|
|---|---|---|---|---|---|---|---|---|
|||**Min**<br>~~ee~~|**Max**<br>~~ee~~|**Min**<br>~~ee~~|**Max**<br>~~ee~~<br>~~ee~~|**Min**<br>~~ee~~|**Max**<br>~~ee~~||
|fMAX_GDDRX5<br>~~a~~<br>~~po~~|Frequencyfor ECLK<br>~~po~~|—<br>~~ee~~<br>~~po~~|625<br>~~ee~~<br>~~po~~|—<br>~~ee~~<br>~~po~~|600<br>~~ee~~<br>~~ee~~<br>~~po~~|—<br>~~ee~~<br>~~po~~|500<br>~~ee~~<br>~~po~~|MHz<br>~~po~~|
|½ UI<br>~~a ~~<br>~~po~~|Half of Data Bit Time, or 90<br>degrees<br> ~~ee~~|0.400<br>~~ee~~|—<br>~~ee~~|0.417<br>~~ee~~|—<br>~~ee~~|0.500<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|
|fPCLK<br>~~po~~|PCLK frequency|—|125|—<br>~~GO~~|120<br>~~GO~~|—<br>~~GO~~|100<br>~~GO~~|MHz|
|Output TX to Input RX Marginper Edge<br>~~po~~<br>~~FO~~||0.06<br>~~FO~~|—<br>~~FO~~|0.04<br>~~FO~~<br>~~GO~~|—<br>~~FO~~<br>~~GO~~|0.051<br>~~FO~~<br>~~GO~~|—<br>~~FO~~<br>~~GO~~|ns<br>~~FO~~|
|**Soft D-PHY DDRX4 Inputs/Outputs with Clock and Data Centered at Pin, using PCLK Clock Input**<br>~~GO~~<br>~~Pn~~<br>~~ee~~|||||||||
|tSU_GDDRX4_MP<br>~~ee~~<br>~~ee~~|Input Data Set-Up Before CLK<br>~~ee~~|0.133<br>~~ee~~|—<br>~~ee~~|0.167<br>~~ee~~|—<br>~~ee~~|0.193<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|
|||0.2<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|0.2<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~<br>~~CO~~|0.2<br>~~ee~~<br>~~ee~~<br>~~CO~~|—<br>~~ee~~<br>~~ee~~|UI<br>~~ee~~<br>~~ee~~|
|tHO_GDDRX4_MP<br>~~ee~~<br>~~a ~~<br>~~ee~~|Input Data Hold After CLK<br>~~ee~~<br> ~~GG~~<br>~~ee~~|0.133<br>~~ee~~<br>~~GG~~<br>~~ee~~|—<br>~~ee~~<br>~~GG~~<br>~~ee~~|0.167<br>~~ee~~<br>~~GG~~|—<br>~~ee~~<br>~~GG~~<br>~~CO~~|0.193<br>~~ee~~<br>~~GG~~<br>~~CO~~<br>~~eee~~|—<br>~~ee~~<br>~~GG~~<br>~~eee~~|ns<br>~~ee~~<br>~~GG~~<br>~~eee~~|
|tDVB_GDDRX4_MP<br>~~ee~~|Output Data Valid Before CLK<br>Output<br>~~ee~~|0.133<br>~~ee~~|—<br>~~ee~~|0.167|—<br>~~CO~~|0.193<br>~~CO~~<br>~~eee~~|—<br>~~eee~~|ns<br>~~eee~~|
|||0.2<br>~~ee~~<br>~~a~~|—<br>~~ee~~<br>~~a~~|0.2<br>~~a~~|—<br>~~CO~~<br>~~a~~|0.2<br>~~CO~~<br>~~eee~~<br>~~a~~|—<br>~~eee~~<br>~~a~~|UI<br>~~eee~~<br>~~a~~|
|tDQVA_GDDRX4_MP<br>~~ee~~<br>~~a~~<br>~~ee~~|Output Data Valid After CLK<br>Output<br>~~ee~~<br>~~a~~<br>|0.133<br>~~ee~~<br>~~a~~<br>~~ee~~|—<br>~~ee~~<br>~~a~~|0.167<br>~~a~~|—<br>~~CO~~<br>~~a~~|0.193<br>~~CO~~<br>~~eee~~<br>~~a~~|—<br>~~eee~~<br>~~a~~|ns<br>~~eee~~<br>~~a~~|
|||0.2<br>~~a~~<br>~~ee~~|—<br>~~a~~|0.2<br>~~a~~|—<br>~~a~~|0.2<br>~~a~~|—<br>~~a~~|UI<br>~~a~~|
|fDATA_GDDRX4_MP<br>~~a~~<br>~~ee~~<br>~~ee~~|Input Data Bit Rate for MIPI<br>PHY<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~ee~~|1500<br>~~a~~|—<br>~~a~~|1200<br>~~a~~|—<br>~~a~~|1034<br>~~a~~|Mbps<br>~~a~~|
|½ UI<br>~~ee~~<br>~~ee~~|Half of Data Bit Time, or 90<br>degrees<br>~~a~~|0.333<br>~~ee~~|—|0.417|—|0.483|—|ns|
|fPCLK<br><br>~~ee~~<br>~~a~~|PCLK frequency<br>~~a~~<br>~~QO~~|—<br>~~QO~~|187.5|—<br>~~CO~~|150<br>~~CO~~|—<br>~~CO~~|129.3<br>~~CO~~|MHz|
|Output TX to Input RX Marginper Edge<br>~~a~~<br>~~ee~~<br>~~a~~<br>~~QO~~<br>~~Ce~~||0.067<br>~~QO~~<br>~~Ce~~|—<br>~~Ce~~|0.083<br>~~Ce~~<br>~~CO~~|—<br>~~Ce~~<br>~~CO~~|0.097<br>~~Ce~~<br>~~CO~~|—<br>~~Ce~~<br>~~CO~~|ns<br>~~Ce~~|
|**Video DDRX71 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX71_RX.ECLK) using PLL Clock Input – Figure 3.12and**<br>**Figure 3.13**<br>~~CO~~<br>~~a~~<br>~~eeeeeeee~~|||||||||
|tRPBi_DVA<br>~~a~~<br>~~a~~|Input Valid Bit "i" switch from<br>CLK Rising Edge ("i" = 0 to 6, 0<br>aligns with CLK)<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~of~~|0.264<br>~~ee~~<br>~~of~~<br>~~|~~|—<br>~~ee~~<br>~~|~~|0.264<br>~~ee~~<br>~~|~~|—<br>~~ee~~|0.300<br>~~ee~~|UI<br>~~ee~~|
|||—<br>~~ee~~<br>~~of~~<br>~~ce~~|–0.250<br>~~ee~~<br>~~of~~<br>~~|~~<br>~~ee~~|—<br>~~ee~~<br>~~|~~<br>~~ee~~|–0.250<br>~~ee~~<br>~~|~~<br>~~ee ee~~|—<br>~~ee~~<br>~~ee~~|–0.249<br>~~ee~~<br>~~ee~~|ns+(½+i)×UI<br>~~ee~~<br>~~ee~~|
|tRPBi_DVE<br>~~a~~<br>~~a~~|Input Hold Bit "i" switch from<br>CLK Rising Edge ("i" = 0 to 6, 0<br>aligns with CLK)<br>~~ee ~~<br>~~ee~~|0.761<br> ~~ee~~<br>~~of~~<br>~~ce~~|—<br>~~ee ~~<br>~~of~~<br>~~|~~<br>~~ee~~|0.761<br> ~~ee~~<br>~~|~~<br>~~ee~~|—<br>~~ee ~~<br>~~|~~<br>~~ee ee~~|0.700<br> ~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|UI<br>~~ee~~<br>~~ee~~|
|||0.276<br>~~of~~<br>~~ce~~|—<br>~~of~~<br>~~|~~<br>~~ee~~|0.276<br>~~|~~<br>~~ee~~|—<br>~~|~~<br>~~ee ee~~|0.249<br>~~ee~~|—<br>~~ee~~|ns+(½+i)×UI<br>~~ee~~|
|tTPBi_DOV<br>~~a~~<br>~~eee~~|Data Output Valid Bit "i"<br>switch from CLK Rising Edge<br>("i" = 0 to 6, 0 aligns with CLK)<br>~~ee ~~<br>~~eee~~|—<br>~~of~~<br> ~~ce ~~<br>~~eee~~|0.159<br>~~of~~<br>~~|~~<br> ~~ee ~~<br>~~eee~~|—<br>~~|~~<br> ~~ee~~<br>~~eee~~|0.159<br>~~|~~<br>~~ee ee~~<br>~~eee~~|—<br>~~ee~~<br>~~eee~~|0.187<br>~~ee~~<br>~~eee~~|ns+i×UI<br>~~ee~~<br>~~eee~~|
|tTPBi_DOI|Data Output Invalid Bit "i"<br>switch from CLK Rising Edge<br>("i" = 0 to 6, 0 aligns with CLK)|–0.159|—|–0.159|—|–0.187|—|ns+(i+ 1) ×UI|
|tTPBi_skew_UI<br>~~a~~<br>~~a~~|TX skew in UI<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|0.15|—<br>~~GO~~<br>~~GOO~~|0.15<br>~~GO~~<br>~~GOO~~|—<br>~~GO~~<br>~~GOO~~|0.15|UI|
|tB<br>~~a~~<br>~~ee~~|Serial Data Bit Time, = 1UI<br>~~GO~~<br>~~Ge~~|1.058<br>~~GO~~|—|1.058<br>~~GOO~~|—<br>~~GOO~~|1.247<br>~~GOO~~|—|ns|
|fDATA_TX71<br>~~a~~<br>~~ee~~|DDR71 Serial Data Rate<br>~~GO~~<br>~~Ge~~|—<br>~~GO~~|945|—<br>~~GOO~~|945<br>~~GOO~~|—<br>~~GOO~~|802|Mbps|
|fMAX_TX71<br>~~ee~~<br>~~a~~|DDR71 ECLK Frequency<br>~~Ge~~<br>~~GO~~|—<br>~~GO~~|473|—<br>~~GO~~<br>~~GO~~|473<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|401<br>~~GO~~|MHz|
|fCLKIN<br>~~a~~<br>~~QO~~|7:1 Clock(PCLK)Frequency<br>~~GO~~<br>~~QO~~|—<br>~~GO~~<br>~~QO~~|135<br>~~QO~~|—<br>~~GO~~<br>~~QO~~<br>~~GO~~<br>~~GO~~|135<br>~~GO~~<br>~~QO~~<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~QO~~<br>~~GO~~<br>~~GO~~|114.5<br>~~QO~~<br>~~GO~~<br>~~GO~~|MHz<br>~~QO~~|
|Output TX to Input RX Marginper Edge<br>~~QO~~<br>~~GO~~||0.159<br>~~QO~~<br>~~GO~~|—<br>~~QO~~<br>~~GO~~|0.159<br>~~QO~~<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~QO~~<br>~~GO~~<br>~~GO~~<br>~~GO~~|0.187<br>~~QO~~<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~QO~~<br>~~GO~~<br>~~GO~~<br>~~GO~~|ns<br>~~QO~~<br>~~GO~~|
|**Memory Interface**<br>~~GO~~<br>~~PR~~<br>~~ee~~|||||||||
|**DDR3/DDR3L/LPDDR2 READ(DQ Input Data are Aligned to DQS) –Figure 3.8**<br>~~ee~~|||||||||
|tDVBDQ_DDR3tDVBDQ_DDR3L<br>tDVBDQ_LPDDR2<br>~~ee~~|Data Output Valid before DQS<br>Input|—|–0.235|—|–0.235|—|–0.277|ns + ½UI|
|tDVADQ_DDR3tDVADQ_DDR3L<br>tDVADQ_LPDDR2<br>~~ee~~<br>~~a~~<br>~~ee~~|Data Output Valid after DQS<br>Input|0.235|—|0.235|—|0.277|—|ns + ½UI|
|fDATA_DDR3fDATA_DDR3L<br>fDATA_LPDDR2<br>~~ee~~<br>~~ee~~|DDR Memory Data Rate|—|1066|—|1066|—|904|Mbps|
|fMAX_ECLK_DDR3fMAX_ECLK_DDR3L<br>fMAX_ECLK_LPDDR2<br>~~ee~~<br>~~ee~~|DDR Memory ECLK Frequency|—|533|—|533|—|452|MHz|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|**Parameter**<br>~~ee~~|**Description**<br>~~ee~~|–**9**<br>~~ee~~|–**9**<br>~~ee~~|–**8**<br>~~ee~~|–**8**<br>~~ee~~|–**7**<br>~~ee~~|–**7**<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|---|---|---|
|||**Min**<br>~~ee~~|**Max**<br>~~ee~~|**Min**<br>~~ee~~|**Max**<br>~~ee~~|**Min**<br>~~ee~~|**Max**<br>~~ee~~||
|fMAX_SCLK_DDR3fMAX_SCLK_DDR3L<br>fMAX_SCLK_LPDDR2<br>~~——EeEE~~|DDR Memory SCLK Frequency<br>~~——EeEE~~|—<br>~~——EeEE~~|133.3<br>~~——EeEE~~|—<br>~~——EeEE~~|133.3<br>~~——EeEE~~|—<br>~~——EeEE~~|113<br>~~——EeEE~~|MHz<br>~~——EeEE~~|
|**DDR3/DDR3L/LPDDR2 WRITE(DQ Output Data are Centered to DQS) –Figure 3.11**<br>~~——EeEE~~<br>~~a~~<br>~~ee~~<br>~~ee~~|||||||||
|tDQVBS_DDR3tDQVBS_DDR3L<br>tDQVBS_LPDDR2<br>~~a~~|Data Output Valid before DQS<br>Output<br>~~ee~~|—<br>~~ee~~|–0.235|—<br>~~ee~~|–0.235<br>~~ee~~|—|–0.277|ns + ½UI|
|tDQVAS_DDR3tDQVAS_DDR3L<br>tDQVAS_LPDDR2<br>~~a~~<br>~~a~~|Data Output Valid after DQS<br>Output<br>~~ee~~<br>~~ee~~|0.235<br>~~ee~~<br>~~ee~~|—<br>~~ee~~|0.235<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|0.277<br>~~ee~~|—<br>~~ee~~|ns + ½UI<br>~~ee~~|
|fDATA_DDR3fDATA_DDR3L<br>fDATA_LPDDR2<br>~~a~~|DDR Memory Data Rate<br>~~ee~~|—<br>~~ee~~|1066<br>~~ee~~|—<br>~~ee~~|1066<br>~~ee~~|—<br>~~ee~~|904<br>~~ee~~|Mbps<br>~~ee~~|
|fMAX_ECLK_DDR3fMAX_ECLK_DDR3L<br>fMAX_ECLK_LPDDR2<br>~~a~~<br>~~re~~|DDR Memory ECLK Frequency<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~eee~~|533<br>~~ee~~<br>~~eee~~|—<br>~~ee~~<br>~~eee~~|533<br>~~ee~~<br>~~eee~~|—<br>~~ee~~<br>~~eee~~<br>~~eee~~|452<br>~~ee~~<br>~~eee~~<br>~~eee~~|MHz<br>~~ee~~<br>~~eee~~<br>~~eee~~|
|fMAX_SCLK_DDR3fMAX_SCLK_DDR3L<br>fMAX_SCLK_LPDDR2<br>~~re~~|DDR Memory SCLK Frequency<br>~~ee~~|—<br>~~eee~~|133.3<br>~~eee~~|—<br>~~eee~~|133.3<br>~~eee~~|—<br>~~eee~~<br>~~eee~~|113<br>~~eee~~<br>~~eee~~|MHz<br>~~eee~~<br>~~eee~~|
|**LPDDR4**<br>~~re eeeee~~<br>~~eee~~<br>~~OG~~|||||||||
|fDATA_LPDDR4<br>~~ee~~<br>~~es~~|DDR MemoryData Rate<br>~~ee~~|—<br>~~ee~~|1066<br>~~ee~~<br>~~OG~~<br>~~OG~~|—<br>~~ee~~<br>~~OG~~<br>~~OG~~|1066<br>~~ee~~<br>~~OG~~<br>~~OG~~|—<br>~~ee~~<br>~~OG~~<br>~~OG~~|904<br>~~ee~~|Mb/s<br>~~ee~~|
|fMAX_ECLK_LPDDR4<br>~~se~~<br>~~es~~|DDR MemoryECLK Frequency<br>~~se~~|—<br>~~se~~|533<br>~~OG~~<br>~~se~~<br>~~OG~~|—<br>~~OG~~<br>~~se~~<br>~~OG~~|533<br>~~OG~~<br>~~se~~<br>~~OG~~|—<br>~~OG~~<br>~~se~~<br>~~OG~~|452<br>~~se~~|MHz<br>~~se~~|
|fMAX_SCLK_LPDDR4<br>~~es~~|DDR MemorySCLK Frequency|—|133.3<br>~~OG~~|—<br>~~OG~~|133.3<br>~~OG~~|—<br>~~OG~~|113|MHz|
1. Commercial timing numbers are shown. Industrial numbers are typically slower and can be extracted from the Lattice Radiant software.
2. General I/O timing numbers are based on LVCMOS18, 1.8 V, 8 mA, Fast Slew Rate, 0 pF load. Generic DDR timing are numbers based on LVDS I/O. DDR3 timing numbers are based on SSTL15. LPDDR2 timing numbers are based on HSUL12.
Uses LVDS I/O standard for measurements.
3. Maximum clock frequencies are tested under best case conditions. System performance may vary depending on the user environment.
4. All numbers are generated with the Lattice Radiant software.
5. This clock skew is not the internal clock network skew. The Nexus family devices have very low internal clock network skew that can be approximated to 0 ps. These tSKEW values measured externally at system level includes additional skew added by the I/O, wire bonding and package ball.
**==> picture [309 x 110] intentionally omitted <==**
**----- Start of picture text -----**<br>
Rx CLK (in)<br>Rx DATA (in)<br>a)<br>tSU/tDVBDQ tSU/tDVBDQ<br>tHD/tDVADQ tHD/tDVADQ<br>**----- End of picture text -----**<br>
**Figure 3.7. Receiver RX.CLK.Centered Waveforms**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
||1/2 UI|1/2 UI||1/2 UI|1/2 UI|||
|---|---|---|---|---|---|---|---|
|Rx CLK (in)<br>or DQS Input|1 UI|||||||
|Rx DATA (in)<br>or DQ Input|tSU<br>~~no~~n~~c~~n|||||||
||tSU|||||||
||||tHD|||tHD||
**Figure 3.8. Receiver RX.CLK.Aligned and DDR Memory Input Waveforms**
**==> picture [473 x 324] intentionally omitted <==**
**----- Start of picture text -----**<br>
1/2 UI 1/2 UI 1/2 UI 1/2 UI<br>Tx CLK (out)<br>or DQS Output<br>Tx DATA (out)<br>or DQ Output<br>{8<br>tDVB/tDQVBS tDVB/tDQVBS<br>tDVA/tDQVA tDVA/tDQVAS<br>Figure 3.9. Transmit TX.CLK.Centered and DDR Memory Output Waveforms<br>1 UI<br>Tx CLK (out)<br>Tx DATA (out)<br>tDIB || tDIB |<br>tDIA tDIA<br>**----- End of picture text -----**<br>
**Figure 3.10. Transmit TX.CLK.Aligned Waveforms**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **Receiver – Shown for one LVDS Channel**
|0!<br>~~a~~|0x<br>0x<br>0x<br>0x<br>0x<br>0x<br>0x<br>~~XOX 1X 2K 3X 4X 5X 6X~~<br>0!<br>4!<br>~~a~~<br>il<br>il<br>~~I~~<br>~~I~~<br>i<br>I<br>il<br>1|Bit #<br>10 – 1<br>11 – 2<br>12 – 3<br>13 – 4<br>14 – 5<br>15 – 6<br>16 – 7<br>~~6X OK AK 2K SK 4K SK CK~~<br>4!<br>2!<br>~~a~~<br>il<br>i<br>~~I~~<br>~~I~~<br>~~I~~<br>i<br>I<br>I<br>1<br>1|Bit #<br>20 – 8<br>21 – 9<br>22 – 10<br>23 – 11<br>24 – 12<br>25 – 13<br>26 – 14<br>~~CK OK 1K 2K 3K 4K 5K OK~~<br>2!<br>3)<br>~~a~~<br>i<br>1<br>~~I~~<br>~~I~~<br>~~I~~<br>~~t~~<br>i<br>I<br>I<br>1<br>1|Bit #<br>30 – 15<br>31 – 16<br>32 – 17<br>33 – 18<br>34 – 19<br>35 – 20<br>36 – 21<br>~~OK OK 1K 2K 3X 4X 5X 6X~~<br>4<br>~~a~~<br>1<br>1<br>~~I~~<br>~~I~~<br>~~I~~<br>~~t~~<br>~~f~~<br>i<br>f<br>1<br>1|Bit #<br>40 – 22<br>41 – 23<br>42 – 24<br>43 – 25<br>44 – 26<br>45 – 27<br>46 – 28<br>~~6X 0)~~<br>4<br>~~a~~<br>1<br>~~I~~<br>~~I~~<br>~~I~~<br>~~t~~<br>~~f~~<br>i<br>f<br>1|
|---|---|---|---|---|---|
|**For each channel:**<br>**7-bit Output Words**<br>~~a~~<br>il<br>il||||||
## **Transmitter – Shown for one LVDS Channel**
|I<br>0!|Bit #<br>10 – 8<br>11 – 9<br>12 – 10<br>13 – 11<br>14 – 12<br>15 – 13<br>16 – 14<br>~~(OKAY 2K SK AXE EON~~<br>il<br>I<br>il<br>0!<br>1|<br>~~**I**~~<br>~~I~~<br>il<br>il<br>il<br>I<br>I|Bit #<br>20 – 15<br>21 – 16<br>22 – 17<br>23 – 18<br>24 – 19<br>25 – 20<br>26 – 21<br>~~EON A ZK SY AEX EK~~<br>il<br>il<br>i<br>1|<br>2<br>|<br>~~**I**~~<br>~~I~~<br>~~I~~<br>il<br>1<br>il<br>i<br>il<br>I<br>I<br>I<br>i|Bit #<br>30 – 22<br>31 – 23<br>32 – 24<br>33 – 25<br>34 – 26<br>35 – 27<br>36 – 28<br>~~EK OKAYS~~<br>~~EN EK~~<br>il<br>i]<br>i<br>i<br>|<br>3)<br>~~**I**~~<br>~~I~~<br>~~I~~<br>~~I~~<br>1<br>i<br>i<br>1<br>I<br>1<br>I<br>I<br>i<br>I|~~EK ONAN EK SY AEX EO)~~<br>il<br>4|<br>~~**I**~~<br>~~I~~<br>~~I~~<br>~~I~~<br>~~f~~<br>i<br>1<br>1<br>1<br>1<br>1<br>I<br>I<br>i<br>I<br>i<br>l|~~EO)~~<br>il<br>4|<br>~~**I**~~<br>~~I~~<br>~~I~~<br>~~I~~<br>~~f~~<br>1<br>1<br>1<br>I<br>I<br>i<br>I<br>i<br>l|
|---|---|---|---|---|---|
|Bit #<br>00 – 1<br>00 – 2<br>00 – 3<br>00 – 4<br>00 – 5<br>00 – 6<br>00 – 7<br>~~**I**~~<br>I<br>I<br>I||||||
**Figure 3.11. DDRX71 Video Timing Waveforms**
**==> picture [444 x 174] intentionally omitted <==**
**----- Start of picture text -----**<br>
Bit 0 Bit 1 Bit i<br>1 1/2 UI 1 I 1/2 UI 1<br>1<br>CLK (in) if 1 UI 1 '! 1 1<br>I H 1{! H<br>If ! t<br>1 t 1 H 1 I<br>DATA (in)<br>1 i] I 1<br>1i{<br>{ tSU_0 H H H 1<br>tHD_0<br>t tSU_i 1 1<br>tHD_i<br>**----- End of picture text -----**<br>
**Figure 3.12. Receiver DDRX71_RX Waveforms**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [393 x 196] intentionally omitted <==**
**----- Start of picture text -----**<br>
Bit 0 Bit 1 Bit i<br>1 UI<br>CLK (out)<br>DATA (out)<br>tDIB_0 X00 N VR OC<br>tDIA_0<br>tDIB_i<br>tDIA_i<br>**----- End of picture text -----**<br>
**Figure 3.13. Transmitter DDRX71_TX Waveforms**
## **3.17. sysCLOCK PLL Timing (VCC = 1.0 V)**
Over recommended operating conditions.
**Table 3.33. sysCLOCK PLL Timing (VCC = 1.0 V)**
|**Parameter**<br>~~ee~~|**Descriptions**<br>~~ee~~|**Conditions**<br>~~ee~~|**Min**<br>~~ee~~|**Typ. **<br>~~ee~~<br>~~oe oe~~|**Max**<br>~~ee~~<br>~~oe~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|---|
|fIN<br>~~ee~~|Input Clock Frequency (CLKI, CLKFB)<br>~~ee~~|—<br>~~ee~~<br>~~oe~~|18<br>~~ee~~<br>~~oe~~|—<br>~~ee~~<br>~~oe oe~~<br>~~oe oe~~|500<br>~~ee~~<br>~~oe~~<br>~~oe~~|MHz<br>~~ee~~|
|fOUT<br>~~ee~~<br>~~a~~|Output Clock Frequency<br>~~ee~~<br>~~a~~|—<br>~~ee~~<br>~~a~~<br>~~oe~~|6.25<br>~~ee~~<br>~~a~~<br>~~oe~~|—<br>~~ee~~<br>~~oe oe~~<br>~~a~~<br>~~oe oe~~|800<br>~~ee~~<br>~~oe~~<br>~~a~~<br>~~oe~~|MHz<br>~~ee~~<br>~~a~~|
|fVCO<br>~~a~~|PLL VCO Frequency<br>~~a~~|—<br>~~a~~<br>~~oe~~|800<br>~~a~~<br>~~oe~~|—<br>~~a~~<br>~~oe oe~~|1600<br>~~a~~<br>~~oe~~|MHz<br>~~a~~|
|fPFD<br>~~a~~|Phase Detector Input Frequency<br>~~a~~|Without Fractional-N Enabled<br>~~oe~~<br>~~a~~|18<br>~~oe ~~<br>~~a~~|—<br> ~~oe oe~~<br>~~a~~|500<br>~~oe~~<br>~~a~~|MHz<br>~~a~~|
|||With Fractional-N Enabled<br>~~a~~|18<br>~~a~~|—<br>~~a~~|100<br>~~a~~|MHz<br>~~a~~|
|**AC Characteristics**<br>~~a~~|||||||
|tDT<br>~~a~~|Output Clock DutyCycle<br>~~a~~|—<br>~~a~~|45<br>~~a~~|—<br>~~a~~|55<br>~~a~~|%<br>~~a~~|
|tPH4<br>~~————~~|Output Phase Accuracy<br>~~————~~|—<br>~~————~~|–5<br>~~————~~|—<br>~~————~~|5<br>~~————~~|%<br>~~————~~|
|tOPJIT1<br>~~————~~|Output Clock Period Jitter<br>~~————~~|fOUT≥ 200 MHz<br>~~————~~|—<br>~~————~~|—<br>~~————~~|250<br>~~————~~|psp-p<br>~~————~~|
|||fOUT< 200 MHz<br>~~————~~|—<br>~~————~~|—<br>~~————~~|0.05<br>~~————~~|UIPP<br>~~————~~|
||Output Clock Cycle-to-Cycle Jitter<br>~~————~~<br>~~ee~~|fOUT≥ 200 MHz<br>~~————~~<br>~~ee~~|—<br>~~————~~<br>~~ee~~|—<br>~~————~~<br>~~ee~~|250<br>~~————~~<br>~~ee~~|psp-p<br>~~————~~<br>~~ee~~|
|||fOUT< 200 MHz<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|0.05<br>~~ee~~|UIPP<br>~~ee~~|
||Output Clock Phase Jitter<br>~~===~~|fPFD≥ 200 MHz<br>~~===~~|—<br>~~===~~|—<br>~~===~~|250<br>~~===~~|psp-p<br>~~===~~|
|||60 MHz ≤ fPFD< 200 MHz<br>~~===~~|—<br>~~===~~|—<br>~~===~~|350<br>~~===~~|psp-p<br>~~===~~|
|||30 MHz ≤ fPFD< 60 MHz<br>~~===~~<br>~~ee~~|—<br>~~===~~|—<br>~~===~~<br>~~ee~~|450<br>~~===~~<br>~~ee~~|psp-p<br>~~===~~<br>~~ee~~|
|||18 MHz ≤ fPFD< 30 MHz<br>~~===~~<br>~~ee~~|—<br>~~===~~|—<br>~~===~~<br>~~ee~~|650<br>~~===~~<br>~~ee~~|psp-p<br>~~===~~<br>~~ee~~|
||Output Clock Period Jitter (Fractional-N)<br>~~===~~<br>~~ee~~|fOUT≥ 200 MHz<br>~~===~~<br>~~ee~~<br>~~ee~~|—<br>~~===~~<br>~~ee~~|—<br>~~===~~<br>~~ee~~<br>~~ee~~|350<br>~~===~~<br>~~ee~~<br>~~ee~~|psp-p<br>~~===~~<br>~~ee~~<br>~~ee~~|
|||fOUT< 200 MHz<br>~~ee~~<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|0.07<br>~~ee~~<br>~~ee~~|UIPP<br>~~ee~~<br>~~ee~~|
||Output Clock Cycle-to-Cycle Jitter<br>(Fractional-N)<br>~~ee~~|fOUT≥ 200 MHz<br>~~ee~~<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|400<br>~~ee~~<br>~~ee~~|psp-p<br>~~ee~~<br>~~ee~~|
|||fOUT< 200 MHz<br>~~ee~~<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|0.08<br>~~ee~~<br>~~ee~~|UIPP<br>~~ee~~<br>~~ee~~|
|fBW3<br>~~a~~<br>~~—~~|PLL LoopBandwidth<br>~~ee~~<br>~~OO~~<br>~~ee~~|—<br>~~ee~~<br>~~OO~~<br>~~ee~~|0.45<br>~~ee~~<br>~~OO~~<br>~~ee~~|—<br>~~ee~~<br>~~OO~~<br>~~oe~~|13<br>~~ee~~<br>~~OO~~<br>~~ee~~|MHz<br>~~ee~~<br>~~OO~~|
|tLOCK2<br>~~a ~~<br>~~—~~|PLL Lock-in Time<br> ~~OO~~<br>~~ee~~|—<br>~~OO~~<br>~~ee~~|—<br>~~OO~~<br>~~ee~~|—<br>~~OO~~<br>~~oe~~|10<br>~~OO~~<br>~~ee~~|ms<br>~~OO~~|
|tUNLOCK<br>~~—~~<br>~~**a**~~|PLL Unlock Time(from RESETgoes HIGH)<br>~~ee~~<br>~~a~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~|—<br>~~oe~~|50<br>~~ee~~<br>~~ee~~|ns<br>~~ee~~|
|tIPJIT<br>~~—~~<br>~~**a**~~|Input Clock Period Jitter<br>~~ee~~<br>~~a~~|fPFD≥ 20 MHz<br>~~ee~~<br>~~ee~~|—<br>~~ee ~~|—<br> ~~oe ~~|500<br> ~~ee~~<br>~~ee~~|psp-p<br>~~ee~~|
|||fPFD< 20 MHz<br>~~ee~~|—<br>~~D~~|—|0.01<br>~~ee~~|UIPP<br>~~ee~~|
|tHI<br>~~**a** ~~|Input Clock High Time<br> ~~a~~|90% to 90%<br>~~ee~~|0.5<br>~~D~~|—|—<br>~~ee~~|ns<br>~~ee~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-DS-02086-2.0
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**CertusPro-NX Family Data Sheet**
|**Parameter**<br>~~SS~~|**Descriptions**<br>~~SS~~|**Conditions**<br>~~SS~~|**Min**<br>~~SS~~|**Typ. **<br>~~SS~~|**Max**<br>~~SS~~|**Unit**<br>~~SS~~|
|---|---|---|---|---|---|---|
|tLO<br>~~SS~~|Input Clock Low Time<br>~~SS~~|10% to 10%<br>~~SS~~|0.5<br>~~SS~~|—<br>~~SS~~|—<br>~~SS~~|ns<br>~~SS~~|
|tRST<br>~~SS~~|RST/ Pulse Width<br>~~SS~~|—<br>~~SS~~|1<br>~~SS~~|—<br>~~SS~~|—<br>~~SS~~|ms<br>~~SS~~|
|fSSC_MOD<br>~~SS~~|Spread Spectrum Clock Modulation<br>Frequency<br>~~SS~~|—<br>~~SS~~|20<br>~~SS~~|—<br>~~SS~~|200<br>~~SS~~|kHz<br>~~SS~~|
|fSSC_MOD_AMP<br>~~SS~~|Spread Spectrum Clock Modulation<br>Amplitude Range<br>~~SS~~|—<br>~~SS~~|0.25<br>~~SS~~|—<br>~~SS~~|2.00<br>~~SS~~|%<br>~~SS~~|
|fSSC_MOD_STEP<br>~~SS~~|Spread Spectrum Clock Modulation<br>Amplitude StepSize<br>~~SS~~|—<br>~~SS~~|—<br>~~SS~~|0.25<br>~~SS~~|—<br>~~SS~~|%<br>~~SS~~|
2. Output clock is valid after tLOCK for PLL reset and dynamic delay adjustment.
3. Result from Lattice Radiant software.
4. CLKOS as compared to CLKOP output for one phase step at the maximum VCO frequency.
|**3.18. Internal Oscillators Characteristics**<br>**Table 3.34. Internal Oscillators(VCC = 1.0 V)**<br>**Symbol**<br>**Parameter Description**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>fCLKHF<br>HFOSC Clock Frequency<br>418.5<br>450<br>481.5<br>MHz<br>fCLKLF<br>LFOSC Clock Frequency<br>25.6<br>32<br>38.4<br>kHz<br>DCHCLKHF<br>HFOSC DutyCycle(Clock High Period)<br>45<br>50<br>55<br>%<br>DCHCLKLF<br>LFOSC DutyCycle(Clock High Period)<br>45<br>50<br>55<br>%<br>**3.19. User I2C Characteristics**<br>~~pp brn~~|**3.18. Internal Oscillators Characteristics**<br>**Table 3.34. Internal Oscillators(VCC = 1.0 V)**<br>**Symbol**<br>**Parameter Description**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>fCLKHF<br>HFOSC Clock Frequency<br>418.5<br>450<br>481.5<br>MHz<br>fCLKLF<br>LFOSC Clock Frequency<br>25.6<br>32<br>38.4<br>kHz<br>DCHCLKHF<br>HFOSC DutyCycle(Clock High Period)<br>45<br>50<br>55<br>%<br>DCHCLKLF<br>LFOSC DutyCycle(Clock High Period)<br>45<br>50<br>55<br>%<br>**3.19. User I2C Characteristics**<br>~~pp brn~~|
|---|---|
|**Table 3.35. User I2C Specifications(VCC = 1.0 V)**<br>**Symbol**<br>**Parameter**<br>**Description**<br>**STD Mode**<br>**FAST Mode**<br>**FAST Mode Plus2**<br>**Unit**<br>**Min**<br>**Typ**<br>**Max**<br>**Min**<br>**Typ**<br>**Max**<br>**Min**<br>**Typ**<br>**Max**<br>fscl<br>SCL Clock<br>Frequency<br>—<br>—<br>100<br>—<br>—<br>400<br>—<br>—<br>1000<br>kHz<br>TDELAY<br>Optional delay<br>through delayblock<br>—<br>62<br>—<br>—<br>62<br>—<br>—<br>62<br>—<br>ns<br>~~Seeasasseeeme~~||
|**Notes**:||
|1.<br>Refer to the I2C Specification for timing requirements. User design should set constraints in Lattice Design Software to meet this||
|industrial I2C Specification.||
2. Fast Mode Plus maximum speed may be achieved by using external pull up resistor on I[2] C bus. Internal pull up may not be sufficient to support the maximum speed.
## **3.20. Analog-Digital Converter (ADC) Block Characteristics**
|**Table 3.36. ADC Specifications1 **<br>**Symbol**<br>**Description**<br>**Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>VREFINT_ADC<br>ADC Internal Reference<br>Voltage4<br>—<br>1.142<br>1.2<br>1.262<br>V<br>VREFEXT_ADC<br>ADC External Reference<br>Voltage<br>—<br>1.0<br>—<br>1.8<br>V<br>NRES_ADC<br>ADC Resolution<br>—<br>—<br>12<br>—<br>bit<br>ENOBADC<br>Effective Number of Bits<br>—<br>9.9<br>11<br>—<br>bit<br>~~EE~~|
|---|
|© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed atwww.latticesemi.com/legal.|
|All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.|
|FPGA-DS-02086-2.0<br>89|
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**CertusPro-NX Family Data Sheet**
|**Symbol**<br>~~ee~~|**Description**|**Condition**<br>~~ee~~<br>~~a~~|**Min**<br>~~ee~~<br>~~ee~~|**Typ**<br>~~ee~~<br>~~ee~~|**Max**<br>~~ee~~<br>~~ee~~|**Unit**<br>~~ee~~<br>~~ee~~|
|---|---|---|---|---|---|---|
|VSR_ADC<br>~~ee~~<br>~~Cp~~|ADC Input Range<br>~~Cp~~|Bipolar Mode, Internal VREF<br>~~ee~~<br>~~a~~<br>~~a~~|VCM_ADC ―<br>VREFINT_ADC/4<br>~~ee~~<br>~~ee~~<br>~~ee~~|VCM_ADC<br>~~ee~~<br>~~ee~~<br>~~ee~~|VCM_ADC+<br>VREFINT_ADC/4<br>~~ee~~<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|||Bipolar Mode, External VREF<br>~~a~~<br>~~a~~<br>~~a~~|VCM_ADC ―<br>VREFEXT_ADC/4<br>~~ee~~<br>~~ee~~<br>~~ee~~|VREFEXT_ADC<br>~~ee ~~<br>~~ee~~<br>~~eee~~|VCM_ADC+<br>VREFEXT_ADC/4<br> ~~ee~~<br>~~ee~~<br>~~eee~~|V<br>~~ee~~<br>~~ee~~<br>~~eee~~|
|||Uni-polar Mode, Internal<br>VREF<br>~~a~~<br>~~a~~<br>|0<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>|—<br> ~~ee ~~<br>~~eee~~<br>~~eee~~<br>|VREFINT_ADC<br> ~~ee~~<br>~~eee~~<br>~~eee~~<br>|V<br>~~ee~~<br>~~eee~~<br>~~eee~~<br>|
|||Uni-polar Mode, External<br>VREF<br>~~a~~<br>|0<br>~~ee~~<br>~~ee~~<br>|—<br>~~eee~~<br>~~eee~~<br>|VREFEXT_ADC<br>~~eee~~<br>~~eee~~<br>|V<br>~~eee~~<br>~~eee~~<br>|
|VCM_ADC<br>~~Cp~~<br>~~a~~|ADC Input Common Mode<br>Voltage (for fully differential<br>signals)<br>~~Cp ~~<br>|Internal VREF<br>|—<br>~~ee~~<br><br>~~ee~~|½VREFINT_ADC<br>~~eee~~<br><br>~~ee~~|—<br>~~eee~~<br><br>~~ee~~|V<br>~~eee~~<br>|
|||External VREF<br> ~~es~~|—<br>~~ee~~<br>~~es~~<br>~~ee~~|½VREFEXT_ADC<br>~~eee~~<br>~~es~~<br>~~ee~~|—<br>~~eee~~<br>~~es~~<br>~~ee~~|V<br>~~eee~~<br>~~es~~|
|fCLK_ADC<br>~~Cp~~<br>~~a ~~<br>~~a~~|ADC Clock Frequency<br>~~Cp ~~<br> ~~a~~<br>~~a~~|—<br> <br>~~ee~~|—<br>~~ee~~<br><br>~~ee ~~<br>~~ee~~|25<br>~~eee~~<br><br> ~~ee ~~|50<br>~~eee~~<br><br> ~~ee~~<br>~~ee~~|MHz<br>~~eee~~<br><br>~~ee~~|
|fINPUT_ADC<br>~~a~~<br>~~ee~~|ADC Input Frequency<br>~~a~~|@ Sampling Frequency =<br>1 Mbps<br>~~ee~~|—<br>~~ee~~|—|500<br>~~ee~~|kHz<br>~~ee~~|
|FSADC<br>~~a ~~<br>~~ee~~|ADC SamplingRate<br> ~~a~~|—<br>~~ee ~~|—<br> ~~ee~~|1|—<br>~~ee~~|MS/s<br>~~ee~~|
|NTRACK_ADC<br>~~ee~~<br>~~a~~<br>~~a~~|ADC Input TrackingTime<br>~~a~~<br>|—<br>~~ee~~|4<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|cycle3|
|RIN_ADC<br>~~a~~<br>~~a~~<br>~~a~~|ADC Input Equivalent<br>Resistance<br>~~a~~<br>|—<br>~~ee~~|—<br>~~ee~~|116<br>~~ee~~|—<br>~~ee~~|kΩ|
|tCAL_ADC<br>~~a~~<br>~~a ~~<br>~~a~~|ADC Calibration Time<br>~~a~~<br> ~~a~~<br>~~ee~~|—<br>~~ee ~~<br>~~ee~~|—<br> ~~ee~~<br>~~ee~~|—<br>~~ee ~~<br>~~ee~~|6500<br> ~~ee~~<br>~~eee~~|cycle3<br>~~eee~~|
|LOUTPUT_ADC<br>~~a~~<br>~~**a**~~|ADC Conversion Time<br>~~ee~~<br>~~ee~~|Includes minimum tracking<br>time of four cycles<br>~~ee~~<br>~~ee~~|25<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~eee~~<br>~~eee~~|cycle3<br>~~eee~~<br>~~eee~~|
|DNLADC<br>~~a ~~<br>~~**a**~~|ADC Differential<br>Nonlinearity<br> ~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|–1<br>~~ee~~<br>~~ee~~|—<br>~~ee ~~<br>~~ee~~|1<br> ~~eee~~<br>~~eee~~|LSB<br>~~eee~~<br>~~eee~~|
|INLADC<br>~~**a** ~~<br><br>~~a~~|ADC Integral Nonlinearity<br> ~~ee~~<br>~~a~~<br>~~ee~~|—<br>~~ee~~<br>~~a~~<br>~~ee~~|–2<br>~~ee~~<br>~~ee~~|—<br>~~ee ~~<br>~~ee~~|2.21<br> ~~eee~~<br>~~eee~~|LSB<br>~~eee~~<br>~~eee~~|
|SFDRADC<br>~~a~~<br>~~a~~<br>~~a~~|ADC Spurious Free Dynamic<br>Range<br>~~aee~~<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~|67.7<br>~~ee~~<br>~~ee~~|77<br>~~ee~~<br>~~ee~~|—<br>~~eee~~<br>~~ee~~|dBc<br>~~eee~~<br>~~ee~~|
|THDADC<br><br>~~a~~<br>~~a~~|ADC Total Harmonic<br>Distortion<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|–76<br>~~ee ~~<br>~~ee~~|–66.8<br> ~~eee~~<br>~~ee~~|dB<br>~~eee~~<br>~~ee~~|
|SNRADC<br>~~a ~~<br>~~a~~|ADC Signal to Noise Ratio<br>~~ee~~<br> ~~a~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|61.9<br>~~ee~~<br>~~ee~~|68<br>~~ee ~~<br>~~ee~~|—<br> ~~ee~~<br>~~ee~~|dB<br>~~ee~~<br>~~ee~~|
|SNDRADC<br>~~a~~<br>~~a~~|ADC Signal to Noise Plus<br>Distortion Ratio<br>~~ee~~<br>~~ee~~|—<br>~~ee~~|61.7<br>~~ee~~|67<br>~~ee~~|—<br>~~ee~~|dB<br>~~ee~~|
|ERRGAIN_ADC<br>~~a~~<br>~~a~~<br>~~i~~|ADC Gain Error<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee~~|–0.5<br>~~ee~~|—<br>~~ee ~~|0.5<br> ~~ee~~|% FSADC<br>~~ee~~|
|ERROFFSET_ADC<br>~~a ~~<br>~~ia~~|ADC Offset Error<br> ~~ee~~<br>~~a~~|—<br>~~ee~~|–2<br>~~ee~~|—<br>~~ee~~|2|LSB|
|CIN_ADC<br>~~ia~~|ADC Input Equivalent<br>Capacitance<br>~~a~~|—<br>~~ee~~|—<br>~~ee~~|2<br>~~ee~~|—|pF|
**Notes** :
1. ADC is available in select speed grades. See ordering information.
2. Not tested; guaranteed by design.
3. ADC Sample Clock cycles. See ADC User Guide for Nexus Platform (FPGA-TN-02129) for more details.
4. Internal voltage reference is only for internal testing purpose. It is not recommended for customer design. User should always use the part with external reference voltage.
## **3.21. Comparator Block Characteristics**
**Table 3.37. Comparator Specifications**
|**Symbol**|**Description**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|
|fIN_COMP|Comparator Input Frequency|—|—|10|MHz|
|VIN_COMP|Comparator Input Voltage|0|—|VCCADC18|V|
|VOFFSET_COMP|Comparator Input Offset|–23|—|24|mV|
|VHYST_COMP|Comparator Input Hysteresis|10|—|31|mV|
|VLATENCY_COMP|Comparator Latency|—|—|31|ns|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
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**CertusPro-NX Family Data Sheet**
## **3.22. Digital Temperature Readout Characteristics**
Digital temperature Readout (DTR) is implemented in one of the internal Analog-Digital-Converter (ADC) channel.
**Table 3.38. DTR Specifications**[1, 2]
|**Symbol**|**Description**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|DTRRANGE|DTR Detect Temperature<br>Range|—|–40|—|125|°C|
|DTRACCURACY|DTR Accuracy|with external voltage<br>reference range of 1.0 V<br>to 1.8 V|–13|±4|13|°C|
|DTRRESOLUTION|DTR Resolution|with external voltage<br>reference|–0.3|—|0.3|°C|
**Notes** :
1. External voltage reference (VREF) should be 0.1% accurate or better. DTR sensitivity to VREF is -4.1 °C per VREF per-cent (for example, if the VREF is 1 % low, then the DTR will read +4.1 °C high).
2. DTR is available in Commercial/Industrial –8 and –9 speed grades and Automotive –7 and –8 speed grades.
## **3.23. SERDES High-Speed Data Transmitter**
**Table 3.39. Serial Output Timing and Levels**
|**Symbol**<br>~~DO~~|**Description**<br>~~DO~~|**Condition**<br>~~DO~~|**Min**<br>~~DO~~<br>~~DO~~|**Typ**<br>~~DO~~<br>~~(OO~~|**Max**<br>~~DO~~|**Unit**<br>~~DO~~|
|---|---|---|---|---|---|---|
|**Transmitter 10.3125 Gbps**<br>~~DO~~<br>~~DO~~<br>~~(OO~~|||||||
|VTX-DIFF-PP<br>~~a~~|Peak-Peak Differential voltage on<br>selected amplitude1, 2<br>~~ee~~|—<br>~~ee~~|800<br>~~ee~~|1000<br>~~ee~~|1200<br>~~ee~~|mV,<br>p-p<br>~~ee~~|
|VTX-CM-DC<br>~~a~~|Output common mode voltage1, 2|—|400|500|600|mV,<br>p-p|
|VTX-EH<br>~~a~~<br>~~a~~|Transmitter Eye Height1, 2|—|200|320|—|mV,<br>p-p|
|VTX-EW<br>~~a~~<br>~~a~~|Transmitter Eye width(alljitter sources)<br>~~GG~~|—<br>~~GG~~|50<br>~~GG~~|60<br>~~GG~~|—<br>~~GG~~|ps<br>~~GG~~|
|TTX-R<br>~~GG~~|Transmitter Eye Rise time(20% to 80%)<br>~~GG~~|—<br>~~GG~~|54<br>~~GG~~|—<br>~~GG~~|72<br>~~GG~~|ps<br>~~GG~~|
|TTX-F<br>~~a~~|Transmitter Eye Fall time(80% to 20%)<br>~~a~~|—<br>~~a~~|44<br>~~a~~|—<br>~~a~~|89<br>~~a~~|ps<br>~~a~~|
|**Transmitter 5 Gbps**<br>~~a~~|||||||
|VTX-DIFF-PP<br>~~a~~|Peak-Peak Differential voltage on<br>selected amplitude1, 2<br>~~a~~|—<br>~~a~~|800<br>~~a~~|1000<br>~~a~~|1200<br>~~a~~|mV,<br>p-p<br>~~a~~|
|VTX-CM-DC<br>~~a~~<br>~~a~~|Output common mode voltage1, 2<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|400<br>~~a~~<br>~~a~~|500<br>~~a~~<br>~~a~~|600<br>~~a~~<br>~~a~~|mV,<br>p-p<br>~~a~~<br>~~a~~|
|VTX-EH<br>~~a~~<br>~~a~~|Transmitter Eye Height1, 2<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|630<br>~~a~~<br>~~a~~|740<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|mV,<br>p-p<br>~~a~~<br>~~a~~|
|VTX-EW<br>~~a~~<br>~~DO~~|Transmitter Eye width(alljitter sources)<br>~~a~~<br>~~DO~~|—<br>~~a~~<br>~~DO~~|170<br>~~a~~<br>~~DO~~|180<br>~~a~~<br>~~DO~~|—<br>~~a~~<br>~~DO~~|ps<br>~~a~~<br>~~DO~~|
|TTX-R<br>~~DO~~<br>~~GG~~|Transmitter Eye Rise time(20% to 80%)<br>~~DO~~<br>~~GG~~|—<br>~~DO~~<br>~~GG~~|56<br>~~DO~~<br>~~GG~~|—<br>~~DO~~<br>~~GG~~|66<br>~~DO~~<br>~~GG~~|ps<br>~~DO~~<br>~~GG~~|
|TTX-F<br>~~GG~~|Transmitter Eye Fall time(80% to 20%)<br>~~GG~~|—<br>~~GG~~|56<br>~~GG~~|—<br>~~GG~~|66<br>~~GG~~|ps<br>~~GG~~|
|**Transmitter 1.25 Gbps**|||||||
|VTX-DIFF-PP<br>~~a~~|Peak-Peak Differential voltage on<br>selected amplitude1, 2<br>~~ee~~|—<br>~~ee~~|800<br>~~ee~~|1000<br>~~ee~~|1200<br>~~ee~~|mV,<br>p-p<br>~~ee~~|
|VTX-CM-DC<br>~~a~~|Output common mode voltage1, 2|—|400|500|600|mV,<br>p-p|
|VTX-EH<br>~~a~~<br>~~es~~|Transmitter Eye Height1, 2|—|645|800|—|mV,<br>p-p|
|VTX-EW<br>~~es~~|Transmitter Eye width(alljitter sources)|—|770|780|—|ps|
|TTX-R<br>~~es~~<br>~~a DG~~|Transmitter Eye Rise time(20% to 80%)<br>~~DG~~|—<br>~~DG~~|65<br>~~DG~~|—<br>~~DG~~|80<br>~~DG~~|ps<br>~~DG~~|
|TTX-F<br>~~a DG~~<br>~~DD~~|Transmitter Eye Fall time(80% to 20%)<br>~~DG~~<br>~~DD~~|—<br>~~DG~~<br>~~DD~~|63<br>~~DG~~<br>~~DD~~|—<br>~~DG~~<br>~~DD~~|80<br>~~DG~~<br>~~DD~~|ps<br>~~DG~~<br>~~DD~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
91
**CertusPro-NX Family Data Sheet**
|**Symbol**<br>~~a ~~|**Description**<br> ~~a~~|**Condition**<br>~~GG~~|**Min**<br>~~GG~~|**Typ**<br>~~GG~~|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Transmitter All Rates**<br>~~Pe~~|||||||
|TTX-CM-AC-P|RMS AC peak common-mode output<br>voltage|—<br>~~GG~~|—<br>~~GG~~|—<br>~~GG~~|20|mV|
|ZTX_DIFF-DC<br>~~a~~|DC Differential Impedance<br>~~a~~|—<br>~~a~~<br>~~GG~~|80<br>~~a~~<br>~~GG~~|—<br>~~a~~<br>~~GG~~|120<br>~~a~~|Ω<br>~~a~~|
|RLTX_DIFF|Tx Differential Return Loss (with package<br>included)|50 MHz < freq< 1.25 GHz<br>~~GG~~<br>~~po~~|10<br>~~GG~~<br>~~po~~|—<br>~~GG~~<br>~~po~~|—<br>~~po~~|dB<br>~~po~~|
|||1.25 GHz < freq< 2.5 GHz<br>~~po~~|8<br>~~po~~|—<br>~~po~~|—<br>~~po~~|dB<br>~~po~~|
|||2.5 GHz < freq< 4 GHz<br>~~po~~|4<br>~~po~~|—<br>~~po~~|—<br>~~po~~|dB<br>~~po~~|
|||4GHz < freq<= 5 GHz<br>~~eG~~|4<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|dB<br>~~eG~~|
|RLTX_COM|Tx Common mode Return Loss (with<br>package included)|50 MHz < freq< 2.5 GHz<br>~~po~~|6<br>~~po~~|—<br>~~po~~|—<br>~~po~~|dB<br>~~po~~|
|||2.5 GHz < freq<= 4 GHz<br>~~a~~|3|—|—|dB|
|||4GHz < freq<= 5 GHz<br>~~pO~~|3<br>~~pO~~|—<br>~~pO~~|—<br>~~pO~~|dB<br>~~pO~~|
**Notes** :
1. Measured with 50 Ω Tx Driver impedance at VCCHTX±5%. Fixture de-embedded.
2. Refer to CertusPro-NX SerDes/PCS Usage Guide (FPGA-TN-02245) for settings of Tx amplitude.
**Table 3.40. Channel Output Jitter**
|**Symbol**<br>~~a G~~|**Description**<br>~~G~~|**Min**<br>~~G~~|**Typ**<br>~~G~~<br>~~(~~|**Max**<br>~~G~~<br>~~(~~|**Unit**<br>~~G~~|
|---|---|---|---|---|---|
|**Transmitter 10.3125 Gbps**2<br>~~a G~~<br>~~(~~||||||
|TTX-DJ<br>~~eG~~<br>~~es~~|10.3125 Transmitter Gbps Deterministic Jitter2<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|35<br>~~eG~~|ps, p-p<br>~~eG~~|
|TTX-RJ<br>~~eG~~<br>~~es~~<br>~~es~~|10.3125 Transmitter Gbps Random Jitter2<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|1<br>~~eG~~|ps, RMS<br>~~eG~~|
|TTX-TJ<br>~~es~~<br>~~es~~|10.3125 Transmitter Gbps Total Jitter2|—|—|55|ps, p-p|
|**Transmitter 8 Gbps**1<br>~~es~~<br>~~ee~~||||||
|TTX-UTJ<br>~~ee~~|8 Gbps Transmitter EyeTx Uncorrelated Total Jitter1|—|—|31.25|ps, p-p|
|TTX-UDJDD<br>~~ee~~<br>~~OO~~|8 Gbps Transmitter EyeTx Uncorrelated Deterministic Jitter1<br>~~OO~~|—<br>~~OO~~|—<br>~~OO~~|12<br>~~OO~~|ps, p-p<br>~~OO~~|
|TTX-UPW-TJ<br>~~OO~~<br>~~a~~|8 Gbps Transmitter EyeTx Uncorrelated PW Total Jitter1<br>~~OO~~<br>|—<br>~~OO~~<br>|—<br>~~OO~~<br>|24<br>~~OO~~<br>|ps, p-p<br>~~OO~~<br>|
|TTX-UPW-DJDD<br>~~OO~~|8 Gbps Transmitter EyeTx Uncorrelated PW Deterministic Jitter1<br>~~OO~~|—<br>~~OO~~|—<br>~~OO~~|10<br>~~OO~~|ps, p-p<br>~~OO~~|
|TTX-DJDD<br>~~OO~~<br>~~a~~|8 Gbps Transmitter EyeTx Deterministic Jitter1<br>~~OO~~<br>|—<br>~~OO~~<br>|—<br>~~OO~~<br>|18<br>~~OO~~<br>|ps, p-p<br>~~OO~~<br>|
|TTX-RJ<br>~~eC~~|8 Gbps Transmitter EyeTx RMS jitter < 1.5 MHz1<br>~~eC~~|—<br>~~eC~~|—<br>~~eC~~|1<br>~~eC~~|ps, RMS<br>~~eC~~|
|**Transmitter 5 Gbps**3<br>~~eC~~<br>~~|~~||||||
|TTX-DJ<br>~~eG~~<br>~~ee~~|5 Gbps Transmitter Deterministic Jitter3<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|22<br>~~eG~~|ps, p-p<br>~~eG~~|
|TTX-RJ<br>~~eG~~<br>~~ee~~|5 Gbps Transmitter Random Jitter3<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|1<br>~~eG~~|ps, RMS<br>~~eG~~|
|TTX-TJ<br>~~ee~~<br>~~eC~~|5 Gbps Transmitter Total Jitter3<br>~~eC~~|—<br>~~eC~~|—<br>~~eC~~|38<br>~~eC~~|ps, p-p<br>~~eC~~|
|**Transmitter 3.125 Gbps**3<br>~~eC~~<br>~~|~~<br>~~ee~~||||||
|TTX-DJ<br>~~ee~~<br>~~ee~~|3.125 Transmitter Gbps Deterministic Jitter3|—|—|20|ps, p-p|
|TTX-RJ<br>~~ee~~<br>~~ee~~|3.125 Transmitter Gbps Random Jitter3|—|—|1|ps, RMS|
|TTX-TJ<br>~~ee~~<br>~~a ~~|3.125 Transmitter Gbps Total Jitter3<br> ~~eG~~|—<br>~~eG~~|—<br>~~eG~~|40<br>~~eG~~|ps, p-p<br>~~eG~~|
|**Transmitter 2.5 Gbps**3<br>~~pe~~<br>~~es~~||||||
|TTX-DJ<br>~~pe~~<br>~~es~~|2.5 Transmitter Gbps Deterministic Jitter3<br>~~pe~~|—<br>~~pe~~|—<br>~~pe~~|20<br>~~pe~~|ps, p-p<br>~~pe~~|
|TTX-RJ<br>~~es~~<br>~~OO~~<br>~~es~~|2.5 Transmitter Gbps Random Jitter3<br>~~OO~~<br>~~eG~~|—<br>~~OO~~<br>~~eG~~|—<br>~~OO~~<br>~~eG~~|1<br>~~OO~~<br>~~eG~~|ps, RMS<br>~~OO~~<br>~~eG~~|
|TTX-TJ<br>~~OO~~<br>~~es~~|2.5 Transmitter Gbps Total Jitter3<br>~~OO~~<br>~~eG~~|—<br>~~OO~~<br>~~eG~~|—<br>~~OO~~<br>~~eG~~|40<br>~~OO~~<br>~~eG~~|ps, p-p<br>~~OO~~<br>~~eG~~|
|**Transmitter 1.25 Gbps**3<br>~~eseG~~<br>~~Pn~~<br>~~ee~~||||||
|TTX-DJ<br>~~Pn~~<br>~~ee~~|1.25 Transmitter Gbps Deterministic Jitter3<br>~~Pn~~|—<br>~~Pn~~|—<br>~~Pn~~|20<br>~~Pn~~|ps, p-p<br>~~Pn~~|
|TTX-RJ<br>~~ee~~<br>~~a~~|1.25 Transmitter Gbps Random Jitter3<br>|—<br><br>~~F~~|—<br>|1<br>|ps, RMS<br>|
|TTX-TJ<br>~~ee~~|1.25 Transmitter Gbps Total Jitter3<br>~~ee~~|—<br>~~ee~~<br>~~F~~|—<br>~~ee~~|40<br>~~ee~~|ps, p-p<br>~~ee~~|
1. 8.0 Gbps complies with PCIe 3.0 standards, and the jitter is decomposed as in the table. The pattern used was the PCIe compliance CJPAT.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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2. 10.3125 Gbps rates were taken with the DCA-J at PRBS 2N^15 - 1 as it has the highest density that would align without resorting to external common clock triggering.
- 10 Gb/s was characterized on the transmitter side (DCA-J). The spec calls out for all TX measurements to be taken while a plesio-chronous RX of the same channel is running;
- PRBS31 setting the second BERT to run PRBS31 and ran it into the RX on that channel, then the TX is running off of the BERT refclock/ppg, and using the internal generator instead of loopback.
3. All other rates were taken with the DCA-J at PRBS 2N^7 - 1.
## **3.24. SERDES High-Speed Data Receiver**
**Table 3.41. Serial Input Data Specifications**
|**Symbol**<br>~~pf~~<br>~~a~~|**Description**<br>~~pf~~<br>~~ee~~|**Condition**<br>~~pf~~<br>~~ee~~|**Min**<br>~~pf~~<br>~~ee~~|**Typ**<br>~~pf~~<br>~~ee~~|**Max**<br>~~pf~~|**Unit**<br>~~pf~~|
|---|---|---|---|---|---|---|
|VRX-DIFF-S<br>~~a~~|Differential input sensitivity1<br>~~ee~~|—<br>~~ee~~|100<br>~~ee~~|—<br>~~ee~~|1200|mV,<br>p-p|
|VRX-IN<br>~~a~~<br>~~a~~|Input levels<br>~~ee~~|—<br>~~ee ~~|25<br> ~~ee~~|—<br>~~ee~~|1300|mV,<br>p-p|
|RX_SSC<br>~~a~~<br>~~a~~<br>~~ee~~|JTOL BER with SSC (.5%Dev 33 kHz<br>Triangle Down Conv.)|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|–5000<br>~~ee~~|ppm<br>~~ee~~|
|ZRX-DIFF-DC<br>~~a~~<br>~~ee~~|Receiver DC differential impedance|—<br>~~ee~~|80<br>~~ee~~|—<br>~~ee~~|120<br>~~ee~~|Ω<br>~~ee~~|
|ZRX-HIGH_IMP-DC<br>~~ee~~|Receiver DC differential impedance when<br>powered down|termination_at_-150mv<br>~~ee~~|1K<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|KΩ<br>~~ee~~|
|||termination_at_0V<br>~~ee~~<br>~~ee~~|10K<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|KΩ<br>~~ee~~<br>~~ee~~|
|||termination_at_200mv<br>~~ee~~|20K<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|KΩ<br>~~ee~~|
|RLRX-DIFF|Receiver differential Return Loss, package<br>plus silicon|50 MHz < freq< 1.25 GHz<br>~~ee~~|10<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|dB<br>~~ee~~|
|||1.25 GHz < freq< 2.5 GHz<br>~~pO~~|8<br>~~pO~~|—<br>~~pO~~|—<br>~~pO~~|dB<br>~~pO~~|
|||2.5 GHz < freq< 4 GHz<br>~~pO~~<br>~~ee~~|5<br>~~pO~~<br>~~ee~~|—<br>~~pO~~<br>~~ee~~|—<br>~~pO~~<br>~~ee~~|dB<br>~~pO~~<br>~~ee~~|
|||4 GHz < freq<= 5 GHz<br>~~ee~~<br>~~ee~~|4<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|dB<br>~~ee~~<br>~~ee~~|
|RLRX-CM<br>~~pf~~|Receiver common mode Return Loss,<br>package plus silicon<br>~~pf~~|50 MHz < freq< 2.5 GHz<br>~~ee~~|6<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|dB<br>~~ee~~|
|||2.5 GHz < freq<= 4 GHz<br>~~ee~~|5<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|dB<br>~~ee~~|
|||4.0 GHz < freq<= 5 GHz<br>~~po~~<br>~~—————~~|4<br>~~po~~<br>~~—————~~|—<br>~~po~~<br>~~—————~~|—<br>~~po~~<br>~~—————~~|dB<br>~~po~~<br>~~—————~~|
|VRX-LOS3<br>~~pf~~|Los of signal Detect Threshold<br>~~pf~~|50 MHz < freq<= 1.25 GHz<br>~~po~~<br>~~—————~~|0.06<br>~~po~~<br>~~—————~~|—<br>~~po~~<br>~~—————~~|0.175<br>~~po~~<br>~~—————~~|V,p-p<br>~~po~~<br>~~—————~~|
|||1.25 GHz < freq< 1.5 GHz<br>~~po~~<br>~~—————~~<br>~~po~~|0.065<br>~~po~~<br>~~—————~~<br>~~po~~|—<br>~~po~~<br>~~—————~~<br>~~po~~|0.175<br>~~po~~<br>~~—————~~<br>~~po~~|V,p-p<br>~~po~~<br>~~—————~~<br>~~po~~|
1. Measured into 50 Ω Tx impedance at ±5%. With EQ but no stressors added. Fixture de-embedded for 10.3125 Gbps. This is a fixed BER Test with 26% margin.
2. Refer to PCIe RX stress test.
3. Loss of signal Detect Threshold has a frequency dependency that effects threshold voltage at temperature dependency where –40 °C is the worst case therefore the two conditions.
## **3.25. Input Data Jitter Tolerance**
The receiver ability to tolerate incoming signal jitter is very dependent on jitter type. High-speed serial interface standards have recognized the dependency on jitter type and have specifications to indicate tolerance levels for different jitter types as they relate to specific protocols. Sinusoidal jitter is a worst-case jitter type.
**Table 3.42. Receiver Total Jitter Tolerance Specification[1]**
|**Protocol**|**Description**|**Frequency**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|10GBASE-R|Deterministic|10.3125<br>Gbps|See 10GBASE-R Spec, CJPAT|—|—|—|UI|
||Random||See 10GBASE-R Spec, CJPAT|—|—|—|UI|
||Total||See 10GBASE-R Spec, CJPAT|—|—|0.7|UI|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Protocol**<br>~~pO~~<br>~~)~~|**Description**<br>~~pO~~<br>~~)~~|**Frequency**<br>~~pO~~|**Condition**<br>~~pO~~|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|PCIe<br>~~pO~~<br>~~)~~<br>~~|~~<br>~~)~~<br>~~)~~<br>~~|~~<br>~~|~~<br>~~)~~|Deterministic<br>~~pO~~<br>~~)~~<br>~~|~~|8 Gbps<br>~~pO~~<br>~~ee~~|See PCIe Spec<br>~~pO~~<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|UI<br>~~eG~~|
||Random<br>~~)~~<br>~~|~~<br>~~ee~~||See PCIe Spec<br>~~pO~~<br>~~eG~~<br>~~ee~~|—<br>~~eG~~<br>~~ee~~|—<br>~~eG~~<br>~~ee~~|—<br>~~eG~~<br>~~ee~~|ps, RMS<br>~~eG~~<br>~~ee~~|
||Total<br>~~|~~<br>~~ee~~<br>~~)~~||See PCIe Spec<br>~~eG~~<br>~~ee~~<br>~~eG~~|—<br>~~eG~~<br>~~ee~~<br>~~eG~~|—<br>~~eG~~<br>~~ee~~<br>~~eG~~|—<br>~~eG~~<br>~~ee~~<br>~~eG~~|UI<br>~~eG~~<br>~~ee~~<br>~~eG~~|
||Deterministic<br>~~ee~~<br>~~)~~<br>~~)~~|5 Gbps<br>~~ee ~~<br> <br>~~po~~|See PCIe Spec<br> ~~ee~~<br>~~eG~~<br>~~ee~~|—<br>~~ee~~<br>~~eG~~<br>~~ee~~|—<br>~~ee~~<br>~~eG~~<br>~~ee~~|—<br>~~ee~~<br>~~eG~~<br>~~ee~~|UI<br>~~ee~~<br>~~eG~~<br>~~ee~~|
||Random<br>~~)~~<br>~~)~~||See PCIe Spec<br>~~eG~~<br>~~ee~~|—<br>~~eG~~<br>~~ee~~|—<br>~~eG~~<br>~~ee~~|—<br>~~eG~~<br>~~ee~~|ps, RMS<br>~~eG~~<br>~~ee~~|
||Total<br>~~)~~<br>~~J ~~<br>~~|~~||See PCIe Spec<br>~~ee~~<br> ~~eG~~<br>~~po~~|—<br>~~ee~~<br>~~eG~~|—<br>~~ee~~<br>~~eG~~|0.4<br>~~ee~~<br>~~eG~~|UI<br>~~ee~~<br>~~eG~~|
||Deterministic<br>~~|~~<br>~~|~~|2.5 Gbps<br>~~po~~<br>~~ee~~|400 mV differential eye<br>~~po~~<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|UI<br>~~eG~~|
||Random<br>~~|~~<br>~~|~~<br>~~ee~~||400 mV differential eye<br>~~po~~<br>~~eG~~<br>~~ee~~|—<br>~~eG~~<br>~~ee~~|—<br>~~eG~~<br>~~ee~~|—<br>~~eG~~<br>~~ee~~|ps, RMS<br>~~eG~~<br>~~ee~~|
||Total<br>~~|~~<br>~~ee~~<br>~~)~~||400 mV differential eye<br>~~eG~~<br>~~ee~~<br>~~eG~~|—<br>~~eG~~<br>~~ee~~<br>~~eG~~|—<br>~~eG~~<br>~~ee~~<br>~~eG~~|0.4<br>~~eG~~<br>~~ee~~<br>~~eG~~|UI<br>~~eG~~<br>~~ee~~<br>~~eG~~|
|Ethernet<br>~~)~~<br>~~|~~<br>~~pT~~|Deterministic<br>~~ee~~<br>~~)~~|6.25 Gbps<br>~~ee ~~<br> <br>~~po~~<br>~~po~~|See RXAUI Spec, PRBS31<br> ~~ee~~<br>~~eG~~|—<br>~~ee~~<br>~~eG~~|—<br>~~ee~~<br>~~eG~~|—<br>~~ee~~<br>~~eG~~|UI<br>~~ee~~<br>~~eG~~|
||Random<br>~~)~~<br>~~J ~~<br>~~|~~||See RXAUI Spec, PRBS31<br>~~eG~~<br> ~~eG~~<br>~~po~~|—<br>~~eG~~<br>~~eG~~|—<br>~~eG~~<br>~~eG~~|—<br>~~eG~~<br>~~eG~~|ps, RMS<br>~~eG~~<br>~~eG~~|
||Total<br>~~|~~<br>~~|~~||See RXAUI Spec, PRBS31<br>~~po~~<br>~~po~~|—|—|0.4|UI|
||Deterministic<br>~~|~~<br>~~|~~|5 Gbps<br>~~po~~<br>~~po~~<br> <br> <br>|—<br>~~po~~<br>~~po~~|—|—|—|UI|
||Random<br>~~|~~<br>~~J ~~||—<br>~~po~~<br> ~~es~~|—<br>~~es~~|—<br>~~es~~|—<br>~~es~~|ps, RMS<br>~~es~~|
||Total<br>~~J ~~<br>~~pT~~||—<br> ~~es~~<br>~~pO~~|—<br>~~es~~<br>~~pO~~|—<br>~~es~~<br>~~pO~~|—<br>~~es~~<br>~~pO~~|UI<br>~~es~~<br>~~pO~~|
||Deterministic<br>~~pT~~<br>~~P|~~|3.125<br>Gbps<br> <br>~~P| ~~<br>~~P|~~|See XAUI Spec, CJPAT<br>~~pO~~<br>~~es~~|—<br>~~pO~~<br>~~es~~|—<br>~~pO~~<br>~~es~~|—<br>~~pO~~<br>~~es~~|UI<br>~~pO~~<br>~~es~~|
||Random<br>~~pT ~~<br>~~P|~~<br>~~P|~~||See XAUI Spec, CJPAT<br> ~~pO~~<br>~~es~~<br>~~es~~|—<br>~~pO~~<br>~~es~~<br>~~es~~|—<br>~~pO~~<br>~~es~~<br>~~es~~|—<br>~~pO~~<br>~~es~~<br>~~es~~|ps, RMS<br>~~pO~~<br>~~es~~<br>~~es~~|
||Total<br>~~P|~~<br>~~P|~~||See XAUI Spec, CJPAT<br> ~~es~~<br>~~es~~|—<br>~~es~~<br>~~es~~|—<br>~~es~~<br>~~es~~|0.35<br>~~es~~<br>~~es~~|UI<br>~~es~~<br>~~es~~|
||Deterministic<br>~~P|~~<br>~~J ~~|1.25 Gbps<br>~~P| ~~<br> <br> <br>~~ee~~<br>~~ee~~|400 mV differential eye<br> ~~es~~<br> ~~ee~~|—<br>~~es~~<br>~~ee~~|—<br>~~es~~<br>~~ee~~|—<br>~~es~~<br>~~ee~~|UI<br>~~es~~<br>~~ee~~|
||Random<br>~~J ~~<br>~~ee~~||400 mV differential eye<br> ~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|ps, RMS<br>~~ee~~<br>~~es~~|
||Total<br>~~ee~~<br>~~ee~~||400 mV differential eye<br>~~es~~<br>~~pO~~|—<br>~~es~~<br>~~pO~~|—<br>~~es~~<br>~~pO~~|0.7<br>~~es~~<br>~~pO~~|UI<br>~~es~~<br>~~pO~~|
|SLVS_EC<br>~~|~~<br>~~)~~|Deterministic<br>~~ee~~<br>~~ee~~<br>~~P|~~|5 Gbps<br>~~ee ~~<br>~~ee ~~<br>~~P| ~~<br>|400 mV differential eye<br> ~~es~~<br>~~pO~~<br>~~es~~|—<br>~~es~~<br>~~pO~~<br>~~es~~|—<br>~~es~~<br>~~pO~~<br>~~es~~|—<br>~~es~~<br>~~pO~~<br>~~es~~|UI<br>~~es~~<br>~~pO~~<br>~~es~~|
||Random<br>~~ee~~<br>~~P|~~||400 mV differential eye<br> ~~pO~~<br>~~es~~|—<br>~~pO~~<br>~~es~~|—<br>~~pO~~<br>~~es~~|—<br>~~pO~~<br>~~es~~|ps, RMS<br>~~pO~~<br>~~es~~|
||Total<br>~~P|~~<br>~~J ~~||400 mV differential eye<br> ~~es~~<br> ~~eG~~|—<br>~~es~~<br>~~eG~~|—<br>~~es~~<br>~~eG~~|0.5<br>~~es~~<br>~~eG~~|UI<br>~~es~~<br>~~eG~~|
||Deterministic<br>~~J ~~<br>~~|~~|2.5 Gbps<br> <br>~~ee~~<br>~~P|~~|400 mV differential eye<br> ~~eG~~<br>~~ee~~|—<br>~~eG~~<br>~~ee~~|—<br>~~eG~~<br>~~ee~~|—<br>~~eG~~<br>~~ee~~|UI<br>~~eG~~<br>~~ee~~|
||Random<br>~~|~~<br>~~ee~~||400 mV differential eye<br>~~ee~~<br>~~pO~~|—<br>~~ee~~<br>~~pO~~|—<br>~~ee~~<br>~~pO~~|—<br>~~ee~~<br>~~pO~~|ps, RMS<br>~~ee~~<br>~~pO~~|
||Total<br>~~|~~<br>~~ee~~<br>~~P|~~||400 mV differential eye<br>~~ee~~<br>~~pO~~<br>~~es~~|—<br>~~ee~~<br>~~pO~~<br>~~es~~|—<br>~~ee~~<br>~~pO~~<br>~~es~~|0.62<br>~~ee~~<br>~~pO~~<br>~~es~~|UI<br>~~ee~~<br>~~pO~~<br>~~es~~|
||Deterministic<br>~~ee~~<br>~~P|~~<br>~~J~~|1.25 Gbps<br>~~ee ~~<br>~~P| ~~<br>~~po~~<br>~~ee~~|400 mV differential eye<br> ~~pO~~<br>~~es~~<br>~~po~~|—<br>~~pO~~<br>~~es~~|—<br>~~pO~~<br>~~es~~|—<br>~~pO~~<br>~~es~~|UI<br>~~pO~~<br>~~es~~|
||Random<br>~~P|~~<br>~~J~~<br>~~ee~~||400 mV differential eye<br> ~~es~~<br>~~po~~<br>~~ee~~|—<br>~~es~~<br>~~ee~~|—<br>~~es~~<br>~~ee~~|—<br>~~es~~<br>~~ee~~|ps, RMS<br>~~es~~<br>~~ee~~|
||Total<br>~~J~~<br>~~ee~~<br>~~)~~||400 mV differential eye<br>~~po~~<br>~~ee~~<br>~~eG~~|—<br>~~ee~~<br>~~eG~~|—<br>~~ee~~<br>~~eG~~|0.7<br>~~ee~~<br>~~eG~~|UI<br>~~ee~~<br>~~eG~~|
|CoaXPress<br>~~)~~<br>~~|~~<br>~~|~~|Deterministic<br>~~ee~~<br>~~)~~<br>~~ee~~|6.25 Gbps<br>~~ee ~~<br>~~ee ~~<br>~~P|~~<br>~~po~~|—<br> ~~ee~~<br>~~eG~~<br>~~pO~~|—<br>~~ee~~<br>~~eG~~<br>~~pO~~|—<br>~~ee~~<br>~~eG~~<br>~~pO~~|—<br>~~ee~~<br>~~eG~~<br>~~pO~~|UI<br>~~ee~~<br>~~eG~~<br>~~pO~~|
||Random<br>~~)~~<br>~~ee~~<br>~~P|~~||—<br>~~eG~~<br>~~pO~~<br>~~ee~~|—<br>~~eG~~<br>~~pO~~<br>~~ee~~|—<br>~~eG~~<br>~~pO~~<br>~~ee~~|—<br>~~eG~~<br>~~pO~~<br>~~ee~~|ps, RMS<br>~~eG~~<br>~~pO~~<br>~~ee~~|
||Total<br>~~ee~~<br>~~P|~~<br>~~J~~||—<br> ~~pO~~<br>~~ee~~<br>~~po~~|—<br>~~pO~~<br>~~ee~~|—<br>~~pO~~<br>~~ee~~|—<br>~~pO~~<br>~~ee~~|UI<br>~~pO~~<br>~~ee~~|
||Deterministic<br>~~P|~~<br>~~J~~<br>~~ee~~|5 Gbps<br>~~P| ~~<br>~~po~~<br>~~ee~~<br>~~po~~<br>~~ee~~<br>~~ee~~|400 mV differential eye<br> ~~ee~~<br>~~po~~<br>~~po~~|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|UI<br>~~ee~~|
||Random<br>~~J~~<br>~~ee~~<br>~~ee~~||400 mV differential eye<br>~~po~~<br>~~po~~<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|ps, RMS<br>~~ee~~|
||Total<br>~~ee~~<br>~~ee~~<br>~~ee~~||400 mV differential eye<br>~~po~~<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|0.4<br>~~ee~~<br>~~es~~|UI<br>~~ee~~<br>~~es~~|
||Deterministic<br>~~ee~~<br>~~ee~~<br>~~P|~~|3.125<br>Gbps<br>~~ee ~~<br>~~ee ~~<br>~~P| ~~<br>~~P|~~<br>~~ee~~|400 mV differential eye<br> ~~ee~~<br>~~es~~<br>~~es~~|—<br>~~ee~~<br>~~es~~<br>~~es~~|—<br>~~ee~~<br>~~es~~<br>~~es~~|—<br>~~ee~~<br>~~es~~<br>~~es~~|UI<br>~~ee~~<br>~~es~~<br>~~es~~|
||Random<br>~~ee~~<br>~~P|~~<br>~~P|~~||400 mV differential eye<br> ~~es~~<br>~~es~~<br>~~es~~|—<br>~~es~~<br>~~es~~<br>~~es~~|—<br>~~es~~<br>~~es~~<br>~~es~~|—<br>~~es~~<br>~~es~~<br>~~es~~|ps, RMS<br>~~es~~<br>~~es~~<br>~~es~~|
||Total<br>~~P|~~<br>~~P|~~<br>~~ee~~||400 mV differential eye<br> ~~es~~<br>~~es~~<br>~~eG~~|—<br>~~es~~<br>~~es~~<br>~~eG~~|—<br>~~es~~<br>~~es~~<br>~~eG~~|0.35<br>~~es~~<br>~~es~~<br>~~eG~~|UI<br>~~es~~<br>~~es~~<br>~~eG~~|
||Deterministic<br>~~P|~~<br>~~ee~~|2.5 Gbps<br>~~P| ~~<br>~~ee ~~<br> <br>~~P|~~|400 mV differential eye<br> ~~es~~<br>~~eG~~|—<br>~~es~~<br>~~eG~~|—<br>~~es~~<br>~~eG~~|—<br>~~es~~<br>~~eG~~|UI<br>~~es~~<br>~~eG~~|
||Random<br>~~ee~~<br>~~J ~~<br>~~|~~||400 mV differential eye<br> ~~eG~~<br> ~~eG~~<br>~~po~~|—<br>~~eG~~<br>~~eG~~<br>~~po~~|—<br>~~eG~~<br>~~eG~~<br>~~po~~|—<br>~~eG~~<br>~~eG~~<br>~~po~~|ps, RMS<br>~~eG~~<br>~~eG~~<br>~~po~~|
||Total<br>~~|~~<br>~~P|~~||400 mV differential eye<br>~~po~~<br>~~es~~|—<br>~~po~~<br>~~es~~|—<br>~~po~~<br>~~es~~|0.4<br>~~po~~<br>~~es~~|UI<br>~~po~~<br>~~es~~|
||Deterministic<br>~~|~~<br>~~P|~~<br>~~P|~~|1.25 Gbps<br>~~P| ~~<br>~~P| ~~<br>~~po~~|400 mV differential eye<br>~~po~~<br>~~es~~<br>~~es~~|—<br>~~po~~<br>~~es~~<br>~~es~~|—<br>~~po~~<br>~~es~~<br>~~es~~|—<br>~~po~~<br>~~es~~<br>~~es~~|UI<br>~~po~~<br>~~es~~<br>~~es~~|
||Random<br>~~P|~~<br>~~P|~~<br>~~|~~||400 mV differential eye<br> ~~es~~<br>~~es~~<br>~~po~~|—<br>~~es~~<br>~~es~~|—<br>~~es~~<br>~~es~~|—<br>~~es~~<br>~~es~~|ps, RMS<br>~~es~~<br>~~es~~|
||Total<br>~~P|~~<br>~~|~~||400 mV differential eye<br> ~~es~~<br>~~po~~|—<br>~~es~~|—<br>~~es~~|0.7<br>~~es~~|UI<br>~~es~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**==> picture [487 x 182] intentionally omitted <==**
**----- Start of picture text -----**<br>
Protocol Description Frequency Condition Min Typ Max Unit<br>pO<br>Deterministic — — — — UI<br>) pO<br>Random 8.1 Gbps — — — — ps, RMS<br>| eG<br>Total — — — 0.62 UI<br>ee ee<br>Deterministic — — — — UI<br>) eG<br>Random 5.4 Gbps — — — — ps, RMS<br>) ee<br>Total — — — 0.636 UI<br>J eG<br>DP/eDP<br>Deterministic — — — — UI<br>| po<br>Random 2.7 Gbps — — — — ps, RMS<br>| eG<br>Total — — — 0.548 UI<br>ee ee<br>Deterministic — — — — UI<br>) eG<br>J Random 1.62 Gbps eG — — — — ps, RMS<br>Total — — — 0.778 UI<br>| po<br>**----- End of picture text -----**<br>
**Note** :
1. Jitter tolerance measurements are done with protocol compliance tests: 10.3125Gbps – 10G Base-R, 3.125 Gbps - XAUI Standard, 8/5/2.5 Gbps - PCIe Standard, 1.25 Gbps SGMII Standard.
## **3.26. SERDES External Reference Clock**
The external reference clock selection and its interface are a critical part of system applications for this product. Table 3.43 and Table 3.44 specify the reference clock requirements, over the full range of operating conditions. For other characteristics like jitter, the clock requirements of the target protocol should be used when determining the reference clock source.
**Table 3.43. External Reference Clock Specification for SDQx_REFCLKP/N[1]**
|**Symbol**|**Description**|**Min**|**Type**|**Max**|**Unit**|
|---|---|---|---|---|---|
|FREF|Frequency range|74.25|100|162|MHz|
|FREF-PPM|Frequency tolerance|–300|—|300|ppm|
|VREF-IN-DIFF|Input swing, differential clock|300|—|—|mV, p-p differential|
|VREF-IN|DC Input levels|–0.3|—|1.15|V|
|DREF|Duty cycle|40|—|60|%|
|ZREF-IN-TERM-DIFF2|Differential input termination|—|—|—|Ω|
**Notes** :
1. Support HCSL I/O standard, DC coupling only.
2. No termination.
**Table 3.44. External Reference Clock Specification for SD_EXTx_REFCLKP/N[1]**
|**Symbol**<br>~~pO~~|**Description**<br>|**Min**<br>|**Type**<br>|**Max**<br>|**Unit**<br>|
|---|---|---|---|---|---|
|FREF<br>~~pOpO~~|Frequency range<br>~~pO~~|74.25<br>~~pO~~|—<br>~~pO~~|162<br>~~pO~~|MHz<br>~~pO~~|
|FREF-PPM<br>~~a~~<br>~~es~~|Frequency tolerance<br>~~a~~|–300<br>~~GG~~|—<br>~~GG~~|300<br>~~GG~~|ppm<br>~~GG~~|
|VREF-IN-DIFF<br>~~a ~~<br>~~es~~|Input swing, differential clock<br> ~~a~~|200<br>~~GG~~|—<br>~~GG~~|2 × VCCAUX<br>~~GG~~|mV, p-p differential<br>~~GG~~|
|VREF-IN<br>~~es~~<br>~~a~~<br>~~Re~~|DC Input levels<br>~~a~~<br>~~GG~~|0<br>~~GG~~<br>~~GG~~|—<br>~~GG~~<br>~~GG~~|2<br>~~GG~~<br>~~GG~~|V<br>~~GG~~<br>~~GG~~|
|DREF<br>~~Re~~|Duty cycle<br>~~GG~~|40<br>~~GG~~|—<br>~~GG~~|60<br>~~GG~~|%<br>~~GG~~|
|TREF-R<br>~~Re~~<br>~~pO~~<br>~~pO~~|Rise time (20% to 80%)<br>~~GG~~<br>~~pO~~|200<br>~~GG~~<br>~~pO~~|500<br>~~GG~~<br>~~pO~~|1000<br>~~GG~~<br>~~pO~~|ps<br>~~GG~~<br>~~pO~~|
|TREF-F<br>~~pO~~<br>~~pO~~|Fall time (80% to 20%)<br>~~pO~~|200<br>~~pO~~|500<br>~~pO~~|1000<br>~~pO~~|ps<br>~~pO~~|
|ZREF-IN-TERM-DIFF2<br>~~pO~~<br>~~a~~|Differential input termination|70|100|130|Ω|
**Notes** :
1. Support LVDS and HCSL I/O standards.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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2. Can be configured as HiZ.
## **3.27. PCI Express Electrical and Timing Characteristics**
## **3.27.1. PCIe (2.5 Gbps)**
Over recommended operating conditions.
**Table 3.45. PCIe (2.5 Gbps)**
**==> picture [487 x 527] intentionally omitted <==**
**----- Start of picture text -----**<br>
|||||||||||
|---|---|---|---|---|---|---|---|---|---|
|Symbol|Description|Condition|Min.|Typ.|Max.|Unit|
|Po|
|||Transmitter|[1]|
|fe|UI|Unit Interval|—|399.88|400|400.12|ps|
|fe|BWTX|Tx PLL bandwidth|—|GCCO|1.5|—|22|MHz|
|fe|PKGTX|Tx PLL Peaking|—|—|—|3|dB|
|Differential p-p Tx voltage|
|VTX-DIFF-PP|—|0.8|—|1.2|Vp-p|
|a|swing|CO|
|Low power differential p-p Tx|
|VTX-DIFF-PP-LOW|—|0.4|—|1.2|Vp-p|
|a|voltage swing|
|Tx de-emphasis level ratio at|
|VTX-DE-RATIO-3.5dB|3.5 dB|—|3|—|4|dB|
|a|
|fe|TTX-RISE-FALL|Transmitter rise and fall time|—|OC|0.125|—|—|UI|
|Transmitter Eye, including all|
|TTX-EYE|jitter sources|—|0.75|—|—|UI|
|Max. time between jitter|
|TTX-EYE-MEDIAN-to-MAX-JITTER|median and max deviation|—|—|—|0.125|UI|
|from the median|
|o>|
|Tx Differential Return Loss,|
|a|RLTX-DIFF|including|pkg and silicon|—|10|—|—|dB|
|Tx Common Mode Return|50 MHz < freq <|
|a|RLTX-CM|Loss, including|pkg and silicon|2.5 GHz|6|—|—|dB|
|GG|ZTX-DIFF-DC|DC differential Impedance|—|80|—|120|Ω|
|Tx AC peak common mode|
|VTX-CM-AC-P|—|—|—|20|mV, RMS|
|a|voltage, RMS|
|Transmitter short-circuit|
|ITX-SHORT|—|—|—|90|mA|
|current|
|a|
|Transmitter DC common-|
|VTX-DC-CM|mode voltage|—|0|—|1.2|V|
|Electrical Idle Output peak|
|a|VTX-IDLE-DIFF-AC-p|voltage|—|—|—|20|mV|
|Voltage change allowed during|
|VTX-RCV-DETECT|Receiver Detect|—|—|—|600|mV|
|a|
|GG|TTX-IDLE-MIN|Min. time in Electrical Idle|—|20|—|—|ns|
|Max. time from EI Order Set to|
|TTX-IDLE-SET-TO-IDLE|valid Electrical Idle|—|—|—|8|ns|
|a|
|Max. time from Electrical Idle|
|a|TTX-IDLE-TO-DIFF-DATA|to valid differential output|—|—|—|8|ns|
|Receiver|[2]|
|fe|UI|Unit Interval|—|OC|399.88|400|400.12|ps|
|Differential Rx peak-peak|
|VRX-DIFF-PP|—|0.175|—|1.2|Vp-p|
|a|voltage|
|Ge|TRX-EYE|[3]|Receiver eye opening time|—|GG|0.4|—|—|UI|
**----- End of picture text -----**<br>
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Symbol**<br>~~a~~|**Description**<br>~~a~~|**Condition**<br>~~a~~|**Min.**<br>~~a~~|**Typ. **<br>~~a~~|**Max.**<br>~~a~~|**Unit**<br>~~a~~|
|---|---|---|---|---|---|---|
|TRX-EYE-MEDIAN-to-MAX-JITTER3<br>~~a~~<br>~~ee~~|Max time delta between<br>median and deviation from<br>median<br>~~a~~|—<br>~~a~~|—<br>~~a~~|—<br>~~a~~|0.3<br>~~a~~|UI<br>~~a~~|
|RLRX-DIFF<br>~~ee~~|Receiver differential Return<br>Loss,packageplus silicon|—|10|—|—|dB|
|RLRX-CM<br>~~ee~~|Receiver common mode<br>Return Loss, package plus<br>silicon|—|6|—|—|dB|
|ZRX-DC<br>~~ee~~<br>~~a~~<br>~~es~~|Receiver DC single ended<br>impedance|—|40|—|60|Ω|
|ZRX-DIFF-DC<br>~~es~~|Receiver DC differential<br>impedance|—|80|—|120|Ω|
|ZRX-HIGH-IMP-DC<br>~~es~~|Receiver DC single ended<br>impedance when powered<br>down|—|200k|—|—|Ω|
|VRX-CM-AC-P3<br>~~es~~<br>~~a~~|Rx AC peak common mode<br>voltage|—|—|—|150|mV, peak|
|VRX-IDLE-DET-DIFF-PP<br>~~a~~<br>~~a~~|Electrical Idle Detect<br>Threshold|—|65|—|175|mVp-p|
## **Notes:**
1. Refer to PCI Express Base Specification Revision 3.0 Table 4.18 test condition and requirement for respective parameters.
2. Refer to PCI Express Base Specification Revision 3.0 Table 4.24 test condition and requirement for respective parameters.
3. Spec compliant requirement.
## **3.27.2. PCIe (5 Gbps)**
Over recommended operating conditions.
**Table 3.46. PCIe (5 Gbps)**
|**Symbol**<br>~~es~~|**Description**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Transmit1**<br>~~es~~<br>~~pn~~|||||||
|UI<br>~~Ge~~|Unit Interval<br>~~Ge~~|—<br>~~Ge~~|199.94<br>~~Ge~~|200<br>~~Ge~~|200.06<br>~~Ge~~|ps<br>~~Ge~~|
|BWTX-PKG-PLL1<br>~~a~~|Tx PLL bandwidth<br>correspondingto PKGTX-PLL1<br>~~a~~|—<br>~~a~~|8<br>~~a~~|—<br>~~a~~|16<br>~~a~~|MHz<br>~~a~~|
|BWTX-PKG-PLL2<br>~~a~~|Tx PLL bandwidth<br>correspondingto PKGTX-PLL2<br>~~a~~|—<br>~~a~~|5<br>~~a~~|—<br>~~a~~|16<br>~~a~~|MHz<br>~~a~~|
|PKGTX-PLL1<br>~~a~~|Tx PLL Peaking<br>correspondingto PKGTX-PLL1<br>~~a~~<br>~~a~~|—<br>~~a~~|—<br>~~a~~|—<br>~~a~~|3<br>~~a~~|dB<br>~~a~~|
|PKGTX-PLL2<br>~~a~~|Tx PLL Peaking<br>correspondingto PKGTX-PLL2<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|1<br>~~a~~<br>~~a~~|dB<br>~~a~~<br>~~a~~|
|VTX-DIFF-PP<br>~~a~~<br>~~a~~|Differential p-p Tx voltage<br>swing<br>~~a~~<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~<br>~~a~~|0.8<br>~~a~~<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~<br>~~a~~|1.2<br>~~a~~<br>~~a~~<br>~~a~~|V, p-p<br>~~a~~<br>~~a~~<br>~~a~~|
|VTX-DIFF-PP-LOW<br>~~a~~<br>~~a~~|Low power differential p-p Tx<br>voltage swing<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|0.4<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|1.2<br>~~a~~<br>~~a~~|V, p-p<br>~~a~~<br>~~a~~|
|VTX-DE-RATIO-3.5dB<br>~~a~~<br>~~a~~|Tx de-emphasis level ratio at<br>3.5 dB<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|3<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|4<br>~~a~~<br>~~a~~|dB<br>~~a~~<br>~~a~~|
|VTX-DE-RATIO-6dB<br>~~a~~<br>~~a~~|Tx de-emphasis level ratio at 6<br>dB<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|5.5<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|6.5<br>~~a~~<br>~~a~~|dB<br>~~a~~<br>~~a~~|
|TMIN-PULSE<br>~~a~~|Instantaneous lone pulse<br>width<br>~~a~~|—<br>~~a~~|0.9<br>~~a~~|—<br>~~a~~|—<br>~~a~~|UI<br>~~a~~|
|TTX-RISE-FALL<br>~~GG~~|Transmitter rise and fall time<br>~~GG~~|—<br>~~GG~~|0.15<br>~~GG~~|—<br>~~GG~~|—<br>~~GG~~|UI<br>~~GG~~|
|TTX-EYE<br>~~GG~~<br>~~a ~~|Transmitter Eye, including all<br>jitter sources<br>~~GG~~<br> ~~a~~|—<br>~~GG~~|0.75<br>~~GG~~|—<br>~~GG~~|—<br>~~GG~~|UI<br>~~GG~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Symbol**<br>~~ee ee~~<br>~~ee~~|**Description**<br>~~ee~~<br>~~ee~~|**Test Conditions**<br>~~es~~|**Min**<br>~~ee~~|**Typ**<br>~~ee~~|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|TTX-DJ<br>~~ee ee~~<br>~~ee~~<br>~~es~~|Tx deterministic jitter ><br>1.5 MHz<br>~~ee~~<br>~~ee~~<br>~~es Se~~|—<br>~~es~~<br>~~Se~~|—<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~ee~~|0.15|UI|
|TTX-RJ<br>~~ee~~<br>~~es~~|Tx RMS jitter < 1.5 MHz<br>~~ee ~~<br>~~es Se~~|—<br> ~~es ~~<br>~~Se~~|—<br> ~~ee ~~<br>~~es~~|—<br> ~~ee~~<br>~~ee~~|3|ps,<br>RMS|
|TRF-MISMATCH<br>~~es~~<br>~~a~~|Tx rise/fall time mismatch<br>~~es Se~~|—<br>~~Se~~<br>~~————EE~~|—<br>~~es ~~<br>~~————EE~~|—<br> ~~ee~~<br>~~————EE~~|0.1<br>~~————EE~~|UI<br>~~————EE~~|
|RLTX-DIFF<br>~~a~~<br>~~a~~<br>~~ee~~|Tx Differential Return Loss,<br>including package and silicon<br>~~ee~~<br>|50 MHz < freq< 1.25 GHz<br>~~————EE~~|10<br>~~————EE~~|—<br>~~————EE~~|—<br>~~————EE~~|dB<br>~~————EE~~|
|||1.25 GHz < freq< 2.5 GHz<br>~~————EE~~<br>~~ee~~<br>|8<br>~~————EE~~<br>~~ee~~|—<br>~~————EE~~<br>~~ee~~<br>~~ee~~|—<br>~~————EE~~<br>~~ee~~<br>~~ee~~|dB<br>~~————EE~~<br>~~ee~~<br>~~ee~~|
|RLTX-CM<br>~~a~~<br>~~a~~<br>~~ee~~<br>~~ee~~|Tx Common Mode Return Loss,<br>including package and silicon<br>~~ee~~<br>~~et~~<br>|50 MHz < freq < 2.5 GHz<br>~~————EE~~<br>~~ee~~<br>~~et~~<br>|6<br>~~————EE~~<br>~~ee~~<br>|—<br>~~————EE~~<br>~~ee~~<br>~~ee~~<br>|—<br>~~————EE~~<br>~~ee~~<br>~~ee~~|dB<br>~~————EE~~<br>~~ee~~<br>~~ee~~|
|ZTX-DIFF-DC<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~es~~|DC differential Impedance<br>~~ee~~<br>~~et~~<br>~~ee~~|—<br>~~ee~~<br>~~et~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~|120<br>~~ee~~<br>~~ee~~<br>~~ee~~|Ω<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|VTX-CM-AC-PP<br>~~ee~~<br>~~ee~~<br>~~es~~<br>~~a~~|Tx AC peak common mode<br>voltage, peak-peak<br>~~et~~<br>~~ee~~<br>~~es~~|—<br>~~et~~<br>~~es~~<br>~~es~~|—<br>~~es~~<br>~~es~~|—<br>~~ee~~<br>~~ee~~<br>~~es~~|150<br>~~ee~~<br>~~ee~~|mV,<br>p-p<br>~~ee~~<br>~~ee~~|
|ITX-SHORT<br><br>~~ee ~~<br>~~es~~<br>~~a~~<br>~~a~~|Transmitter short-circuit<br>current<br>~~et~~<br> ~~ee~~<br>~~es~~<br>~~ee~~|—<br>~~et~~<br>~~es~~<br>~~es~~<br>~~Ge~~|—<br>~~es~~<br>~~es~~<br>~~ee ee~~|—<br>~~ee~~<br>~~es~~<br>~~ee~~|90<br>~~ee~~<br>~~ee~~|mA<br>~~ee~~<br>~~ee~~|
|VTX-DC-CM<br> <br>~~es~~<br>~~a~~<br>~~a~~<br>~~a~~|Transmitter DC common-mode<br>voltage<br> ~~ee ~~<br>~~es~~<br>~~ee~~<br>~~ee~~|—<br> ~~es ~~<br>~~es ~~<br>~~Ge~~<br>~~Ge~~|0<br> ~~es ~~<br> ~~es ~~<br>~~ee ee~~<br>~~ee ee~~|—<br> ~~ee~~<br> ~~es~~<br>~~ee~~<br>~~ee~~|1.2<br>~~ee~~<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|VTX-IDLE-DIFF-DC<br>~~a~~<br>~~a~~<br>~~a~~|Electrical Idle Output DC<br>voltage<br>~~ee~~<br>~~ee~~<br>~~ee~~|—<br>~~Ge~~<br>~~Ge~~<br>~~Ge~~|0<br>~~ee ee~~<br>~~ee ee~~<br>~~ee ee~~|—<br>~~ee ~~<br>~~ee~~<br>~~ee~~|5<br> ~~ee ~~<br>~~ee~~<br>~~ee~~|mV<br> ~~ee~~<br>~~ee~~<br>~~ee~~|
|VTX-IDLE-DIFF-AC-p<br>~~a~~<br>~~a~~<br>~~a~~|Electrical Idle Differential<br>Outputpeak voltage<br>~~ee~~<br>~~ee~~<br>~~ee Ge~~|—<br>~~Ge~~<br>~~Ge~~<br>~~Ge~~|—<br>~~ee ee~~<br>~~ee ee~~<br>~~ee ee~~|—<br>~~ee ~~<br>~~ee~~<br>~~ee~~|20<br> ~~ee ~~<br>~~ee~~<br>~~ee~~|mV<br> ~~ee~~<br>~~ee~~<br>~~ee~~|
|VTX-RCV-DETECT<br>~~a~~<br>~~a~~|Voltage change allowed during<br>Receiver Detect<br>~~ee~~<br>~~ee Ge~~|—<br>~~Ge~~<br>~~Ge~~|—<br>~~ee ee~~<br>~~ee ee~~|—<br>~~ee ~~<br>~~ee~~|600<br> ~~ee ~~<br>~~ee~~|mV<br> ~~ee~~<br>~~ee~~|
|TTX-IDLE-MIN<br>~~a~~<br>~~a~~|Min. time in Electrical Idle<br>~~ee Ge~~<br>~~ee Ge~~|—<br>~~Ge~~<br>~~Ge~~|20<br>~~ee ee~~<br>~~ee~~|—<br>~~ee ~~<br>~~ee~~|—<br> ~~ee ~~<br>~~ee~~|ns<br> ~~ee~~<br>~~ee~~|
|TTX-IDLE-SET-TO-IDLE<br>~~a~~<br>~~a~~|Max. time from EI Order Set to<br>valid Electrical Idle<br>~~ee Ge~~<br>~~ee Ge~~|—<br>~~Ge~~<br>~~Ge~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|8<br>~~ee~~<br>~~ee~~|ns<br>~~ee~~<br>~~ee~~|
|TTX-IDLE-TO-DIFF-DATA<br>~~a~~<br>~~a~~<br>~~Re~~|Max. time from Electrical Idle<br>to valid differential output<br>~~ee Ge~~<br>~~ee Ge~~|—<br>~~Ge~~<br>~~Ge~~|—<br>~~ee ~~<br>~~ee~~|—<br> ~~ee~~<br>~~ee~~|8<br>~~ee ~~<br>~~ee~~|ns<br> ~~ee~~<br>~~ee~~|
|LTX-SKEW<br>~~a~~<br>~~Re~~|Lane-to-lane output skew<br>~~ee Ge~~|—<br>~~Ge~~|—<br>~~ee ~~|—<br> ~~ee~~|500 + 4 UI<br>~~ee ~~|ps<br> ~~ee~~|
|**Receive2**<br>~~Re~~<br>~~Ree~~|||||||
|UI<br>~~Ree~~<br>~~a~~<br>~~a~~|Unit Interval<br>~~Ree~~<br>~~et~~<br>~~ee~~|—<br>~~Ree~~<br>~~et~~<br>~~es~~|199.94<br>~~Ree~~<br>~~ee~~|200<br>~~Ree~~<br>~~ee~~|200.06<br>~~Ree~~<br>~~ee~~|ps<br>~~Ree~~<br>~~ee~~|
|VRX-DIFF-PP<br>~~a~~<br>~~a~~<br>~~a~~|Differential Rx peak-peak<br>voltage<br>~~et~~<br>~~ee~~<br>~~ee~~|—<br>~~et~~<br>~~es~~<br>~~es~~|0.343<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|1.2<br>~~ee~~<br>~~ee~~|V, p-p<br>~~ee~~<br>~~ee~~|
|TRX-RJ-RMS<br>~~a~~<br>~~a~~<br>~~a~~|Receiver random jitter<br>tolerance(RMS)<br>~~ee~~<br>~~ee~~<br>~~ee~~|1.5 MHz – 100 MHz<br>Random noise<br>~~es ~~<br>~~es~~<br>~~es~~|—<br> ~~ee ~~<br>~~ee~~<br>~~ee~~|—<br> ~~ee~~<br>~~ee~~<br>~~ee~~|4.2<br>~~ee ~~<br>~~ee~~<br>~~ee~~|ps,<br>RMS<br> ~~ee~~<br>~~ee~~<br>~~ee~~|
|TRX-DJ<br>~~a~~<br>~~a~~|Receiver deterministic jitter<br>tolerance<br>~~ee~~<br>~~ee~~|—<br>~~es ~~<br>~~es~~|—<br> ~~ee ~~<br>~~ee~~|—<br> ~~ee~~<br>~~ee~~|88<br>~~ee ~~<br>~~ee~~|ps<br> ~~ee~~<br>~~ee~~|
|RLRX-DIFF<br>~~a~~<br>~~a~~|Receiver differential Return<br>Loss, package plus silicon<br>~~ee~~<br>~~a~~|50 MHz < freq< 1.25 GHz<br>~~es ~~<br>~~EEE~~|10<br> ~~ee ~~<br>~~EEE~~|—<br> ~~ee~~<br>~~EEE~~|—<br>~~ee ~~<br>~~EEE~~|dB<br> ~~ee~~<br>~~EEE~~|
|||1.25 GHz < freq< 2.5 GHz<br>~~EEE~~|8<br>~~EEE~~|—<br>~~EEE~~|—<br>~~EEE~~|dB<br>~~EEE~~|
|RLRX-CM|Receiver common mode<br>Return Loss, package plus<br>silicon|—|6|—|—|dB|
|ZRX-DC<br>~~a~~|Receiver DC single ended<br>impedance<br>~~a~~|—<br>~~a~~|40<br>~~a~~|—<br>~~a~~|60<br>~~a~~|Ω<br>~~a~~|
|ZRX-HIGH-IMP-DC<br>~~a~~<br>~~a~~|Receiver DC single ended<br>impedance when powered<br>down<br>~~a~~<br>~~ee es~~|—<br>~~a~~<br>~~es~~|200k<br>~~a~~<br>~~ee~~|—<br>~~a~~<br>~~ee~~|—<br>~~a~~|Ω<br>~~a~~|
|VRX-CM-AC-P3<br>~~a~~<br>~~a~~<br>~~a~~<br>~~a~~|Rx AC peak common mode<br>voltage<br>~~a~~<br>~~a~~<br>~~ee es~~<br>~~ee es~~<br>|—<br>~~a~~<br>~~a~~<br>~~es~~<br>~~es~~<br>|—<br>~~a~~<br>~~a~~<br>~~ee~~<br>~~ee~~<br>|—<br>~~a~~<br>~~a~~<br>~~ee~~<br>~~ee~~<br>|150<br>~~a~~<br>~~a~~<br>|mV,<br>peak<br>~~a~~<br>~~a~~<br>|
|VRX-IDLE-DET-DIFF-PP<br>~~a~~<br>~~a~~<br>~~a~~|Electrical Idle Detect Threshold<br>~~a~~<br>~~ee es~~<br>~~ee es~~<br>|—<br>~~a~~<br>~~es~~<br>~~es~~<br>|65<br>~~a~~<br>~~ee~~<br>~~ee~~<br><br>~~rs~~|—<br>~~a~~<br>~~ee~~<br>~~ee~~<br>|1753<br>~~a~~<br>|mV,<br>p-p<br>~~a~~<br>|
|LRX-SKEW<br>~~a~~<br>~~a ~~|Receiver lane-lane skew<br>~~ee es~~<br>~~ee es~~<br> ~~en~~|—<br>~~es ~~<br>~~es ~~<br>~~en~~|—<br> ~~ee ~~<br> ~~ee ~~<br>~~en~~<br>~~rs~~|—<br> ~~ee~~<br> ~~ee~~<br>~~en~~|8<br>~~en~~|ns<br>~~en~~|
98
**CertusPro-NX Family Data Sheet**
## **Notes:**
1. Refer to PCI Express Base Specification Revision 3.0 Table 4.18 test condition and requirement for respective parameters.
2. Refer to PCI Express Base Specification Revision 3.0 Table 4.24 test condition and requirement for respective parameters.
3. Spec compliant requirement.
## **3.27.3. PCIe (8 Gbps)**
Over recommended operating conditions.
**Table 3.47. PCIe (8 Gbps)**
|**Symbol**<br>~~es~~|**Description**<br>~~(O(n~~|**Test Conditions**<br>~~(O(n~~|**Min**<br>~~(O(n~~|**Typ**<br>~~(O(n~~|**Max**<br>~~(O(n~~|**Unit**<br>~~(O(n~~|
|---|---|---|---|---|---|---|
|**Transmit1**<br>~~es(O(n~~<br>~~es errrnnn~~<br>~~UDI~~|||||||
|UI<br>~~es errr~~<br>~~a~~|Unit Interval<br>~~errr~~<br>~~ee ee~~|—<br>~~nnn~~<br>~~ee~~|124.99<br>~~UD~~<br>~~ee~~|125<br>~~I~~<br>~~ee~~|125.007<br>~~ee~~|ps<br>~~ee~~|
|BWTX-PKG-PLL1<br>~~es errr~~<br>~~a~~<br>~~a~~|Tx PLL bandwidth<br>correspondingto PKGTX-PLL1<br>~~errr ~~<br>~~ee ee~~<br>~~ee~~|—<br> ~~nnn~~<br>~~ee~~<br>~~ee~~|8<br>~~UD ~~<br>~~ee~~<br>~~ee~~|—<br> ~~I~~<br>~~ee~~<br>~~ee~~|16<br>~~ee~~<br>~~ee~~|MHz<br>~~ee~~<br>~~ee~~|
|BWTX-PKG-PLL2<br>~~a~~<br>~~a~~<br>~~a~~|Tx PLL bandwidth<br>correspondingto PKGTX-PLL2<br>~~ee ee~~<br>~~ee~~<br>|—<br>~~ee ~~<br>~~ee~~<br>|5<br> ~~ee ~~<br>~~ee~~<br>|—<br> ~~ee ~~<br>~~ee~~<br>~~ee~~<br>|16<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>|MHz<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|
|PKGTX-PLL1<br>~~a~~<br>~~a~~<br>~~a~~<br>~~a~~|Tx PLL Peaking<br>correspondingto PKGTX-PLL1<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~<br><br>~~ee~~|—<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br><br>~~ee~~|3<br> ~~ee ~~<br>~~ee~~<br>~~ee~~<br><br>~~eee~~|dB<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br><br>~~eee~~|
|PKGTX-PLL2<br>~~a ~~<br>~~a ~~<br>~~a~~<br>~~a~~|Tx PLL Peaking<br>correspondingto PKGTX-PLL2<br> ~~ee~~<br> ~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|1<br>~~ee~~<br> ~~ee ~~<br>~~ee~~<br>~~eee~~<br>~~ee~~|dB<br>~~ee~~<br> ~~ee~~<br>~~ee~~<br>~~eee~~<br>~~ee~~|
|VTX-DIFF-PP<br>~~a~~<br>~~a~~<br>~~a~~|Differential p-p Tx voltage<br>swing<br>~~ee~~<br>~~**ee**~~|—<br>~~ee~~<br>~~**ee**~~|0.8<br>~~ee~~<br>~~ee~~<br>~~**ee**~~|—<br>~~ee~~<br>~~ee~~<br>~~**ee**~~|1.3<br>~~eee~~<br>~~ee~~<br>~~**ee**~~|V, p-p<br>~~eee~~<br>~~ee~~<br>~~**ee**~~|
|VTX-EIEOS-RS<br>~~a~~<br>~~a~~<br>~~a~~|Min swing during EIEOS for<br>reduced swing<br>~~ee~~<br>~~**ee**~~|—<br>~~ee~~<br>~~**ee**~~|0.232<br>~~ee ~~<br>~~ee~~<br>~~**ee**~~|—<br> ~~ee ~~<br>~~ee~~<br>~~**ee**~~|—<br> ~~eee~~<br>~~ee~~<br>~~**ee**~~|V, p-p<br>~~eee~~<br>~~ee~~<br>~~**ee**~~|
|TTX-EYE<br>~~a~~<br>~~a~~|Transmitter Eye, including all<br>jitter sources<br>~~ee ~~<br>~~**ee**~~|—<br> ~~ee~~<br>~~**ee**~~|0.75<br>~~ee ~~<br>~~**ee**~~|—<br> ~~ee ~~<br>~~**ee**~~|—<br> ~~ee ~~<br>~~**ee**~~|UI<br> ~~ee~~<br>~~**ee**~~|
|TTX-UTJ<br>~~a~~|Transmitter EyeTx<br>uncorrelated totaljitter<br>~~**ee**~~|10-12BER<br>~~**ee** ~~|—<br> ~~**ee**~~|—<br>~~**ee** ~~|31.25<br> ~~**ee** ~~|ps PP<br> ~~**ee**~~|
|TTX-UDJDD<br>~~PP~~|Transmitter EyeTx<br>uncorrelated deterministic<br>jitter<br>~~PP~~|—<br>|—<br>|—<br>|12<br>|ps PP<br>|
|TTX-UPW-TJ<br>~~PP~~|Transmitter EyeTx Total<br>uncorrelated PWJ<br>~~PPEEE~~|10-12BER<br>~~EEE~~|—<br>~~EEE~~|—<br>~~EEE~~|24<br>~~EEE~~|ps PP<br>~~EEE~~|
|TTX-UPW-DJDD<br>~~PP~~<br>~~a~~|Transmitter EyeTx<br>uncorrelated deterministic<br>jitter<br>~~PPEEE~~<br>~~ee~~|—<br>~~EEE~~<br>~~ee~~|—<br>~~EEE~~<br>~~ee~~|—<br>~~EEE~~<br>~~ee~~|10<br>~~EEE~~<br>~~ee~~|ps PP<br>~~EEE~~<br>~~ee~~|
|TTX-DDJD<br>~~PP~~<br>~~a~~<br>~~a~~|Transmitter EyeTx Data<br>dependentjitter<br>~~PP~~<br>~~ee~~<br>~~ee~~|—<br><br>~~ee~~<br>~~ee~~|—<br><br>~~ee~~<br>~~ee~~|—<br><br>~~ee~~<br>~~ee~~|18<br><br>~~ee~~<br>~~ee~~|ps PP<br><br>~~ee~~<br>~~ee~~|
|TTX-RJ<br>~~a~~<br>~~a~~<br>~~2~~|Tx RMS jitter < 1.5 MHz<br>~~ee ~~<br>~~ee~~|P0-P9 EQ States<br> ~~ee ~~<br>~~ee~~|—<br> ~~ee ~~<br>~~ee~~<br>~~Gs~~|—<br> ~~ee ~~<br>~~ee~~<br>~~Gs~~|1<br> ~~ee ~~<br>~~ee~~|ps,<br>RMS<br> ~~ee~~<br>~~ee~~|
|RLTX-DIFF<br>~~a~~<br>~~2~~<br>~~a~~|Tx Differential Return Loss,<br>including package and silicon<br>~~ee ~~<br>|50 MHz < freq< 1.25 GHz<br> ~~ee ~~<br>~~es~~|10<br> ~~ee ~~<br>~~es~~<br>~~Gs~~|—<br> ~~ee ~~<br>~~es~~<br>~~Gs~~|—<br> ~~ee ~~<br>~~es~~|dB<br> ~~ee~~<br>~~es~~|
|||1.25 GHz < freq< 2.5 GHz<br>|8<br>~~Gs~~<br>~~Gs~~<br>|—<br>~~Gs~~<br>~~Gs ee~~<br>|—<br>~~ee~~<br>|dB<br>|
|||2.5 GHz < freq< 4 GHz<br>~~ee~~<br>|4<br>~~Gs~~<br>~~ee~~<br>~~Gs~~<br>|—<br>~~Gs~~<br>~~ee~~<br>~~Gs ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>|dB<br>~~ee~~<br>|
|RLTX-CM<br>~~2~~<br>~~a~~<br>~~es~~|Tx Common Mode Return Loss,<br>including package and silicon<br>~~EE~~<br>~~nn~~|50 MHz < freq< 2.5 GHz<br>~~ee~~<br>~~EE~~|6<br>~~Gs~~<br>~~ee~~<br>~~Gs~~<br>~~EE~~|—<br>~~Gs~~<br>~~ee~~<br>~~Gs ee~~<br>~~EE~~|—<br>~~ee~~<br>~~ee~~<br>~~EE~~|dB<br>~~ee~~<br>~~EE~~|
|||2.5 GHz < freq< 4 GHz<br>~~EE~~<br>~~nn~~|3<br>~~Gs~~<br>~~EE~~<br>~~I~~|—<br>~~Gs ee~~<br>~~EE~~<br>~~I~~|—<br>~~ee~~<br>~~EE~~<br>~~I~~|dB<br>~~EE~~|
|ZTX-DIFF-DC<br><br>~~es~~<br>~~pf~~|DC differential Impedance<br>~~EE~~<br>~~nn~~<br>~~pf~~|—<br>~~EE~~<br>~~nn~~<br>~~ee~~|80<br>~~EE~~<br>~~I~~<br>~~ee~~|—<br>~~EE~~<br>~~I~~<br>~~ee~~|120<br>~~EE~~<br>~~I~~<br>~~ee~~|Ω<br>~~EE~~<br>~~ee~~|
|VTX-CM-AC-PP<br><br>~~es~~<br>~~pf~~<br>~~a~~|Tx AC peak common mode<br>voltage, peak-peak<br>~~EE~~<br>~~nn ~~<br>~~pf~~<br>~~ee ee~~|4 GHz LPF<br>~~EE~~<br> ~~nn ~~<br>~~ee~~|—<br>~~EE~~<br> ~~I ~~<br>~~ee~~<br>~~eee~~|—<br>~~EE~~<br> ~~I ~~<br>~~ee~~<br>~~**e**~~|150<br>~~EE~~<br> ~~I~~<br>~~ee~~<br>~~**e**ee~~|mV,<br>p-p<br>~~EE~~<br>~~ee~~<br>~~ee~~|
|||30 kHz to 500 MHz<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~eee~~<br>~~Ge~~|—<br>~~ee~~<br>~~**e**~~<br>~~e~~|50<br>~~ee~~<br>~~**e**ee~~<br>~~ee~~|mV,<br>p-p<br>~~ee~~<br>~~ee~~|
|ITX-SHORT<br>~~pf~~<br>~~a~~|Transmitter short-circuit<br>current<br>~~pf ~~<br>~~ee ee~~|—<br> ~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~eee ~~<br>~~Ge~~|—<br>~~ee~~<br> ~~**e**~~<br>~~e~~|—<br>~~ee~~<br>~~**e**ee~~<br>~~ee~~|mA<br>~~ee~~<br>~~ee~~|
FPGA-DS-02086-2.0
99
**CertusPro-NX Family Data Sheet**
|**Symbol**<br>~~po~~|**Description**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|VTX-DC-CM<br>~~po~~<br>~~a~~|Transmitter DC common-mode<br>voltage(Allowed)|—|0|—|1.2|V|
|VTX-IDLE-DIFF-DC<br>~~a~~|Electrical Idle Output DC<br>voltage|—|0|—|5|mV|
|VTX-IDLE-DIFF-AC-p<br>~~a~~|Electrical Idle Differential<br>Outputpeak voltage|—|—|—|20|mV|
|VTX-RCV-DETECT<br>~~a~~<br>~~eG~~|Voltage change allowed during<br>Receiver Detect<br>~~eG~~|—<br>~~GG~~|—<br>~~GG~~|—<br>~~CO~~|600|mV|
|TTX-IDLE-MIN<br>~~eG~~|Min. time in Electrical Idle<br>~~eG~~|—<br>~~GG~~|20<br>~~GG~~|—<br>~~CO~~|—|ns|
|TTX-IDLE-SET-TO-IDLE<br>~~eG~~<br>~~a~~|Max. time from EI Order Set to<br>valid Electrical Idle<br>~~eG~~|—<br>~~GG~~|—<br>~~GG ~~|—<br> ~~CO~~|8|ns|
|TTX-IDLE-TO-DIFF-DATA<br>~~a~~|Max. time from Electrical Idle<br>to valid differential output|—|—|—|8|ns|
|**Receive2**|||||||
|UI<br>~~CGC~~|Unit Interval<br>~~CGC~~|—<br>~~CGC~~|124.99<br>~~CGC~~|125<br>~~CGC~~|125.007<br>~~CGC~~|ps<br>~~CGC~~|
|TRX-JTOL-BP-MASK<br>~~CGC~~<br>~~a~~|JTOL Bandpass Masks<br>(Optional)<br>~~CGC~~|Sin sweeps with DJ and RJ<br>~~CGC~~|—<br>~~CGC~~|0 error<br>in 3e9<br>~~CGC~~|—<br>~~CGC~~|BER<br>~~CGC~~|
|TRX-eye-stress<br>~~a~~<br>~~a~~|RX input stress test (Amplitude<br>and Jitter stress tolerance)<br>|—<br>|—<br>|0 error<br>in 1e12<br>|—<br>|BER<br>|
|RLRX-DIFF<br>~~aSs~~|Receiver differential Return<br>Loss, package plus silicon<br>~~Ss~~|50 MHz < freq< 1.25 GHz<br>~~Ss~~|10<br>~~Ss~~|—<br>~~Ss~~|—<br>~~Ss~~|dB<br>~~Ss~~|
|||1.25 GHz < freq< 2.5 GHz<br>~~Ss~~<br>~~a~~|8<br>~~Ss~~|—<br>~~Ss~~|—<br>~~Ss~~|dB<br>~~Ss~~|
|||2.5 GHz < freq< 4 GHz<br>~~Ss~~<br>~~po~~|5<br>~~Ss~~<br>~~po~~<br>~~ee~~|—<br>~~Ss~~<br>~~po~~<br>~~ee~~|—<br>~~Ss~~<br>~~po~~|dB<br>~~Ss~~<br>~~po~~|
|RLRX-CM<br>~~a ee~~<br>~~a~~|Receiver common mode<br>Return Loss, package plus<br>silicon<br>~~ee~~<br>|50 MHz < freq< 2.5 GHz<br>~~ee~~<br>|6<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>|dB<br>~~ee~~<br>~~ee~~<br>|
|||2.5 GHz < freq <= 4 GHz<br>~~ee~~<br>~~ee~~<br>|5<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|dB<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|
|ZRX-DIFF-DC<br>~~a ee~~|Receiver DC differential<br>impedance<br>~~ee~~|—<br>~~ee~~|80<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee ~~<br>~~ee~~|120<br> ~~ee~~<br>~~ee~~|Ω<br>~~ee~~<br>~~ee~~|
|ZRX-HIGH-IMP-DC<br>~~2~~|Receiver DC differential<br>impedance when powered<br>down|termination_at_-150mV<br>~~a~~|1K|—|—|KΩ|
|||termination_at_0V<br>~~a~~|10K|—|—|KΩ|
|||termination_at_200mV<br>~~a~~<br>~~ee~~|20K<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|KΩ<br>~~ee~~|
|VRX-IDLE-DET-DIFF-PP<br>~~2~~<br>~~a~~|Electrical Idle Detect Threshold|Max bit rate of 3 Gbps<br>(1.5 GHz)3<br>~~a~~<br>~~ee~~|65<br>~~ee~~|—<br>~~ee~~|175<br>~~ee~~|mV, pp<br>~~ee~~|
## **Notes:**
1. Refer to PCI Express Base Specification Revision 3.0 Table 4.18 test condition and requirement for respective parameters.
2. Refer to PCI Express Base Specification Revision 3.0 Table 4.24 test condition and requirement for respective parameters.
3. VRX-IDLE-DET-DIFF-PP must use proportionally lower Idle bit rate to accommodate the detector Max Frequency of 1.5GHz.
## **3.28. SGMII Characteristics**
## **3.28.1. SGMII Specifications**
Over recommended operating conditions.
**Table 3.48. SGMII**
|**Symbol**|**Description**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|fDATA|SGMII Data Rate|—|—|1250|—|MHz|
|fREFCLK|SGMII Reference Clock Frequency (Data<br>Rate/10)|—|—|125|—|MHz|
|JTOL_DET|Jitter Tolerance, Deterministic|Periodic jitter <<br>300 kHz||—|0.11|UI|
|JTOL_TOL|Jitter Tolerance, Total|Periodic jitter <<br>300 kHz||—|0.31|UI|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
100
**CertusPro-NX Family Data Sheet**
|**Symbol**|**Description**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Δf/f|Data Rate and Reference Clock Accuracy|—|–300|—|300|ppm|
**Note** :
1. JTOT can meet the following jitter mask specifications:
- 0 to 3.5 kHz: 10 UI;
- 3.5 to 700 kHz: log-log slope 10 UI to 0.05 UI;
- above 700 kHz: 0.05 UI.
## **3.29. sysCONFIG Port Timing Specifications**
Over recommended operating conditions.
**Table 3.49. sysCONFIG Port Timing Specifications**
|**Symbol**<br>~~a De~~|**Parameter**<br>~~De~~|**Device**<br>~~DO~~|**Min**<br>~~DO~~|**Typ. **<br>~~DO~~|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Master SPI POR/REFRESH Timing**<br>~~a De~~<br>~~DO~~<br>~~pn~~|||||||
|tICFG<br>~~a ee~~|REFRESH command executed, to the rising<br>edge of INITN<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|30<br>~~ee~~|µs<br>~~ee~~|
|tVMC<br>~~a~~|Time from rising edge of INITN to the valid<br>Master MCLK<br>|—<br>|—<br>|—<br>|5<br>|µs<br>|
|fMCLK_DEF<br>|Default MCLK frequency (Before MCLK<br>frequencyselection in bitstream)<br>|—<br><br>~~ee~~|—<br><br>~~eee~~|3.5<br><br>~~eee~~|—<br><br>~~eee~~|MHz<br><br>~~eee~~|
|tICFG_POR<br>~~ee~~|Time during POR, from VCC, VCCAUX, VCCIO0, or<br>VCCIO1(whichever is the last) pass POR trip<br>voltage, to the risingedge if INITN<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~eee~~|—<br>~~ee~~<br>~~eee~~|5<br>~~ee~~<br>~~eee~~|ms<br>~~ee~~<br>~~eee~~|
|**Slave SPI/I2C/I3C POR/REFRESH Timing**<br>~~ee eee~~|||||||
|tMSPI_INH|Time during POR, from VCC, VCCAUX, VCCIO0or<br>VCCIO1(whichever is the last) pass POR trip<br>voltage, or REFRESH command executed, to<br>pull PROGRAMN LOW to prevent entering<br>MSPI mode|—|—|—|1|µs|
|tACT_PROGRAMN_H<br>~~a~~|Minimum time driving PROGRAMN HIGH after<br>last activation clock|—|50|—|—|ns|
|tCONFIG_CCLK<br>~~a~~<br>~~a~~|Minimum time to start driving CCLK (SSPI)<br>after PROGRAMN HIGH|—|50|—|—|ns|
|tCONFIG_SCL<br>~~a ~~|Minimum time to start driving SCL (I2C/I3C)<br>after PROGRAMN HIGH<br> ~~a~~|—|50|—|—|ns|
|**PROGRAMN Configuration Timing**|||||||
|tPROGRAMN_L<br>~~a~~|PROGRAMN LOW pulse accepted|—|50|—|—|ns|
|tPROGRAMN_H<br>~~a~~<br>~~a~~<br>~~es~~|PROGRAMN HIGH pulse accepted<br>~~eC~~|—<br>~~eC~~|60<br>~~eC~~|—<br>~~eC~~|—<br>~~eC~~|ns<br>~~eC~~|
|tPROGRAMN_RJ<br>~~a~~<br>~~es~~|PROGRAMN LOWpulse rejected<br>~~eC~~|—<br>~~eC~~|—<br>~~eC~~|—<br>~~eC~~|25<br>~~eC~~|ns<br>~~eC~~|
|tINIT_LOW<br>~~es~~<br>~~GO~~|PROGRAMN LOW to INITN LOW<br>~~eC~~<br>~~GO~~|—<br>~~eC~~<br>~~GO~~|—<br>~~eC~~<br>~~GO~~|—<br>~~eC~~<br>~~GO~~|100<br>~~eC~~<br>~~GO~~|ns<br>~~eC~~<br>~~GO~~|
|tINIT_HIGH<br>~~eG~~|PROGRAMN LOW to INITN HIGH<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|40<br>~~eG~~|µs<br>~~eG~~|
|tDONE_LOW<br>~~eG~~<br>~~CO~~|PROGRAMN LOW to DONE LOW<br>~~eG~~<br>~~CO~~|—<br>~~eG~~<br>~~CO~~|—<br>~~eG~~<br>~~CO~~|—<br>~~eG~~<br>~~CO~~|55<br>~~eG~~<br>~~CO~~|µs<br>~~eG~~<br>~~CO~~|
|tDONE_HIGH<br>~~CO~~<br>~~OO~~|PROGRAMN HIGH to DONE HIGH<br>~~CO~~<br>~~OO~~|—<br>~~CO~~<br>~~OO~~|—<br>~~CO~~<br>~~OO~~|—<br>~~CO~~<br>~~OO~~|2<br>~~CO~~<br>~~OO~~|s<br>~~CO~~<br>~~OO~~|
|tIODISS<br>~~OO~~<br>~~GO~~|PROGRAMN LOW to I/O Disabled<br>~~OO~~<br>~~GO~~|—<br>~~OO~~<br>~~GO~~|—<br>~~OO~~<br>~~GO~~|—<br>~~OO~~<br>~~GO~~|125<br>~~OO~~<br>~~GO~~|ns<br>~~OO~~<br>~~GO~~|
|**Master SPI**|||||||
|fMCLK1<br>~~a~~|Max selected MCLK output frequency<br>~~eC~~|—<br>~~eC~~|—<br>~~eC~~|150<br>~~eC~~|165<br>~~eC~~|MHz<br>~~eC~~|
|fMCLK_DC<br>~~a~~|MCLK output clock dutycycle|—|40<br>~~C~~|—|60|%|
|tMCLKH<br>~~a~~<br>~~OO~~|MCLK output clockpulse width HIGH<br>~~OO~~|—<br>~~OO~~|3<br>~~C~~<br>~~OO~~|—<br>~~OO~~|—<br>~~OO~~|ns<br>~~OO~~|
|tMCLKL<br>~~OO~~<br>~~a ~~|MCLK output clockpulse width LOW<br>~~OO~~<br> ~~CO~~|—<br>~~OO~~<br>~~CO~~|3<br>~~OO~~<br>~~CO~~|—<br>~~OO~~<br>~~CO~~|—<br>~~OO~~<br>~~CO~~|ns<br>~~OO~~<br>~~CO~~|
|tSU_MSI<br>~~eG~~|MSI to MCLK setuptime<br>~~eG~~|—<br>~~eG~~|3<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|ns<br>~~eG~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Symbol**<br>~~a ~~<br>~~es~~|**Parameter**<br> ~~CG~~<br>~~a~~|**Device**<br>~~CG~~<br>~~CO~~|**Min**<br>~~CG~~<br>~~CO~~|**Typ. **<br>~~CG~~<br>~~CO~~|**Max**<br>~~CG~~|**Unit**<br>~~CG~~|
|---|---|---|---|---|---|---|
|tHD_MSI<br>~~es~~|MSI to MCLK hold time<br>~~a~~|—<br>~~CO~~<br>~~CO~~|0.5<br>~~CO~~<br>~~CO~~|—<br>~~CO~~<br>~~CO~~|—|ns|
|tCO_MSO<br>~~es~~<br>~~en~~|MCLK to MSO delay<br>~~a~~<br>~~en~~|—<br>~~CO~~<br>~~en~~<br>~~CO~~|—<br>~~CO~~<br>~~en~~<br>~~CO~~|—<br>~~CO~~<br>~~en~~<br>~~CO~~|12<br>~~en~~|ns<br>~~en~~|
|**Slave SPI**<br>~~CO~~<br>~~pn~~<br>~~a~~<br>~~ee~~|||||||
|fCCLK_W<br>~~a~~|CCLK input clock frequency<br>(For write transaction)2<br>~~ee~~|—|—|—|135|MHz|
|fCCLK_R<br>~~a~~<br>~~a~~|CCLK input clock frequency<br>(For read transaction)3<br>~~ee~~|—|—|—|—4|MHz|
|tCCLKH<br>~~a~~<br>~~ee~~|CCLK input clockpulse width HIGH<br>~~eG~~<br>|—<br>~~eG~~<br>|3.5<br>~~eG~~<br>|—<br>~~eG~~<br>|—<br>~~eG~~<br>|ns<br>~~eG~~<br>|
|tCCLKL<br><br>~~ee~~<br>~~a~~|CCLK input clockpulse width LOW<br>~~eG~~<br>~~GO~~<br>~~ee~~|—<br>~~eG~~<br>~~GO~~<br>~~ee~~|3.5<br>~~eG~~<br>~~GO~~<br>~~ee~~|—<br>~~eG~~<br>~~GO~~|—<br>~~eG~~<br>~~GO~~|ns<br>~~eG~~<br>~~GO~~|
|tVMC_SLAVE<br><br>~~ee~~<br>~~a~~|Time from rising edge of INITN to Slave CCLK<br>driven<br>~~eG~~<br><br>~~ee~~|—<br>~~eG~~<br><br>~~ee~~|50<br>~~eG~~<br><br>~~ee~~|—<br>~~eG~~<br>|—<br>~~eG~~<br>|ns<br>~~eG~~<br>|
|tVMC_MASTER<br>~~a~~<br>~~GG~~|CCLK input clock dutycycle<br>~~ee~~<br>~~GG~~|—<br>~~ee~~<br>~~GG~~|40<br>~~ee~~<br>~~GG~~|—<br>~~GG~~|60<br>~~GG~~|%<br>~~GG~~|
|tSU_SSI<br>~~GO~~<br>~~es~~|SSI to CCLK setuptime<br>~~GO~~<br>~~eG~~|—<br>~~GO~~<br>~~eG~~|3.2<br>~~GO~~<br>~~eG~~|—<br>~~GO~~<br>~~eG~~|—<br>~~GO~~<br>~~eG~~|ns<br>~~GO~~<br>~~eG~~|
|tHD_SSI<br>~~es~~<br>~~es~~|SSI to CCLK hold time<br>~~eG~~<br>~~a~~|—<br>~~eG~~<br>~~GO~~|1.9<br>~~eG~~<br>~~GO~~|—<br>~~eG~~<br>~~GO~~|—<br>~~eG~~|ns<br>~~eG~~|
|tCO_SSO<br>~~es~~<br>~~es~~|CCLK fallingedge to valid SSO output<br>~~eG~~<br>~~a~~|—<br>~~eG~~<br>~~GO~~|3.05<br>~~eG~~<br>~~GO~~|—<br>~~eG~~<br>~~GO~~|165<br>~~eG~~|ns<br>~~eG~~|
|tEN_SSO<br>~~es~~<br>~~GO~~|CCLK fallingedge to SSO output enabled<br>~~a~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|3.05<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|165<br>~~GO~~|ns<br>~~GO~~|
|tDIS_SSO<br>~~GO~~<br>~~GO~~<br>~~es~~|CCLK fallingedge to SSO output disabled<br>~~GO~~<br>~~GO~~<br>~~Ge~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|3.05<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|165<br>~~GO~~<br>~~GO~~|ns<br>~~GO~~<br>~~GO~~|
|tHIGH_SCSN<br>~~GO~~<br>~~es~~<br>~~es~~|SCSN HIGH time<br>~~GO~~<br>~~Ge~~<br>~~a~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|74<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~GO~~|ns<br>~~GO~~|
|tSU_SCSN<br>~~es~~<br>~~es~~<br>~~ee~~|SCSN to CCLK setuptime<br>~~Ge~~<br>~~a~~<br>~~a~~|—<br>~~GO~~<br>~~GO~~<br>~~DO~~|3.5<br>~~GO~~<br>~~GO~~<br>~~DO~~|—<br>~~GO~~<br>~~GO~~<br>~~DO~~|—|ns|
|tHD_SCSN<br>~~es~~<br>~~ee~~|SCSN to CCLK hold time<br>~~a~~<br>~~a~~|—<br>~~GO~~<br>~~DO~~|1.6<br>~~GO~~<br>~~DO~~|—<br>~~GO~~<br>~~DO~~|—|ns|
|**I2C/I3C**<br>~~eea~~<br>~~DO~~<br>~~pT~~|||||||
|fSCL_I2C<br>~~pT~~<br>~~CO~~|SCL input clock frequencyfor I2C<br>~~pT~~<br>~~CO~~|—<br>~~pT~~<br>~~CO~~|—<br>~~pT~~<br>~~CO~~|—<br>~~pT~~<br>~~CO~~|1<br>~~pT~~<br>~~CO~~|MHz<br>~~pT~~<br>~~CO~~|
|fSCL_I3C<br>~~CO~~<br>~~GO~~<br>~~es~~|SCL input clock frequency for I3C<br>~~CO~~<br>~~GO~~<br>~~Ge~~|—<br>~~CO~~<br>~~GO~~<br>~~GO~~|—<br>~~CO~~<br>~~GO~~<br>~~GO~~|—<br>~~CO~~<br>~~GO~~<br>~~GO~~|12<br>~~CO~~<br>~~GO~~|MHz<br>~~CO~~<br>~~GO~~|
|tSCLH_I2C<br>~~GO~~<br>~~es~~<br>~~es~~|SCL input clockpulse width HIGH for I2C<br>~~GO~~<br>~~Ge~~<br>~~a~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|400<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~GO~~|ns<br>~~GO~~|
|tSCLL_I2C<br>~~es~~<br>~~es~~|SCL input clockpulse width LOW for I2C<br>~~Ge~~<br>~~a~~|—<br>~~GO~~<br>~~GO~~|400<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|—|ns|
|tSU_SDA_I2C<br>~~es~~<br>~~GO~~<br>~~ee~~|SDA to SCL setuptime for I2C<br>~~a~~<br>~~GO~~<br>|—<br>~~GO~~<br>~~GO~~<br>|250<br>~~GO~~<br>~~GO~~<br>|—<br>~~GO~~<br>~~GO~~<br>|—<br>~~GO~~<br>|ns<br>~~GO~~<br>|
|tHD_SDA_I2C<br>~~GO~~<br>~~ee~~<br>~~a~~|SDA to SCL hold time for I2C<br>~~GO~~<br><br>|—<br>~~GO~~<br><br>|50<br>~~GO~~<br><br>~~CO~~<br>|—<br>~~GO~~<br><br>~~CO~~<br>|—<br>~~GO~~<br><br>|ns<br>~~GO~~<br><br>|
|tSU_SDA_I3C<br>~~eeGe~~<br>~~a~~|SDA to SCL setuptime for I3C<br>~~Ge~~<br>|—<br>~~Ge~~<br>|30<br>~~Ge~~<br>~~CO~~<br>|—<br>~~Ge~~<br>~~CO~~<br>|—<br>~~Ge~~<br>|ns<br>~~Ge~~<br>|
|tHD_SDA_I3C<br>~~Ge~~<br>~~a ~~|SDA to SCL hold time for I3C<br>~~Ge~~<br> ~~GO~~|—<br>~~Ge~~<br>~~GO~~|30<br>~~Ge~~<br>~~CO~~<br>~~GO~~|—<br>~~Ge~~<br>~~CO~~<br>~~GO~~|—<br>~~Ge~~<br>~~GO~~|ns<br>~~Ge~~<br>~~GO~~|
|tCO_SDA<br>~~CC~~|SCL fallingedge to valid SDA output<br>~~CC~~|—<br>~~CC~~|—<br>~~CC~~|—<br>~~CC~~|200<br>~~CC~~|ns<br>~~CC~~|
|tEN_SDA<br>~~CO~~|SCL fallingedge to SDA output enabled<br>~~CO~~|—<br>~~CO~~<br>~~CO~~|—<br>~~CO~~<br>~~CO~~|—<br>~~CO~~<br>~~CO~~|200<br>~~CO~~|ns<br>~~CO~~|
|tDIS_SDA<br>~~CO~~<br>~~Ce~~|SCL fallingedge to SDA output disabled<br>~~CO~~<br>~~Ce~~|—<br>~~CO~~<br>~~Ce~~<br>~~CO~~|—<br>~~CO~~<br>~~Ce~~<br>~~CO~~|—<br>~~CO~~<br>~~Ce~~<br>~~CO~~|200<br>~~CO~~<br>~~Ce~~|ns<br>~~CO~~<br>~~Ce~~|
|**Wake-Up Timing**<br>~~Ce~~<br>~~CO~~|||||||
|tDONE_HIGH<br>~~a~~|Last configuration clock cycle to DONE going<br>HIGH|—|—|—|60|μs|
|tFIO_EN<br>~~a~~<br>~~a~~|User I/O enabled in EarlyI/O Mode<br>~~GO~~|—<br>~~GO~~|—<br>~~GO~~|38096<br>~~GO~~|—<br>~~GO~~|cycle<br>~~GO~~|
|tIOEN<br>~~CC~~<br>~~Re~~|Configure clock to user I/O enabled<br>~~CC~~|—<br>~~CC~~|130<br>~~CC~~<br>~~D~~|—<br>~~CC~~|—<br>~~CC~~|ns<br>~~CC~~|
|tMCLKZ<br>~~Re~~|Master MCLK to Hi-Z|—|—<br>~~D~~|—|2.5|µs|
**Notes** :
1. fMCLK has a dependency on HFOSC and is 1/3 of fCLKHF.
2. Supported input clock frequency for bursting in configuration bitstream to the device.
3. Supported input clock frequency for reading out data transactions from the device.
4. Refer to the following equations to determine the supported input clock frequency for read transaction. Assumption: The skew between CCLK and SSO on board is zero.
½ 𝐶𝐶𝐿𝐾 – 𝑡𝐶𝑂(𝑚𝑎𝑥) – 𝑇𝑠𝑢 > 0
𝐶𝐶𝐿𝐾 > 2(𝑡𝐶𝑂(𝑚𝑎𝑥) + 𝑇𝑠𝑢)
CCLK – Input clock period. fCCLK_R = 1/CCLK. tCO (max) – Equivalent to tCO_SSO or tEN_SSO max value.
Tsu – Setup time requirement for host controller I/O.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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For customer that can only use single clock for read/write operation, the Fmax is limited by the Fmax for read operation. For example: tCO (max) = 30 ns and Tsu = 2 ns.
**==> picture [122 x 9] intentionally omitted <==**
**==> picture [104 x 29] intentionally omitted <==**
**==> picture [118 x 20] intentionally omitted <==**
For the customer that wants to do the programming at 135 MHz or faster than Fmax for read operation:
- Have a mechanism in the host controller to switch between read clock and write clock for read/write transaction. For example, refer to SPI specification to switch between read and write clock by changing the SPI Baud Rate Register (SPIBR) if standard SPI controller is used as the host.
- Implementing a mechanism to adjust/calibrate the sampling clock edge when the valid data becomes available.
5. Based on SLOW (default) slew rate control on Config output pins.
**==> picture [458 x 91] intentionally omitted <==**
**----- Start of picture text -----**<br>
tINIT_HIGH tPROGRAM_H MSPI<br>Configuration<br>PROGRAMN tPROGRAM_L SSPI/I2C/I3C<br>tIN ITL Configuration tINIT_HI GH Configuration<br>Error<br>INITN tINIT_HIGH Restart<br>Configuration<br>Configuration<br>DONE Started<br>**----- End of picture text -----**<br>
- tIN ITL = SRAM memory initialization period
**Figure 3.14. Configuration Error Notification (1)**
**==> picture [397 x 195] intentionally omitted <==**
**----- Start of picture text -----**<br>
REFRESH Command<br>VCC/VCCAUX/<br>VCCIO0/VCCIO1 tICFG<br>INITN<br>DONE<br>PROGRAMN fMCLK_DEF<br>tVMC<br>MCLK<br>MSI<br>**----- End of picture text -----**<br>
**Figure 3.15. Master SPI POR/REFRESH Timing**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**==> picture [382 x 207] intentionally omitted <==**
**----- Start of picture text -----**<br>
REFRESH Command<br>VCC/VCCAUX/<br>VCCIO0/VCCIO1<br>tICFG<br>INITN<br>DONE<br>tM SPI_IN H Slave Activation tACT_PROGRAMN_H<br>PROGRAMN<br>fCCLK tCONFIG_CCLK<br>CCLK<br>SSI<br>fSCL tACT_PROG RA MN_H<br>SCL tCON FIG_SCL<br>SDA<br>**----- End of picture text -----**<br>
**Figure 3.16. Slave SPI/I[2] C/I3C POR/REFRESH Timing**
**==> picture [433 x 210] intentionally omitted <==**
**----- Start of picture text -----**<br>
tINIT_HIGH<br>PROGRAMN tPROGRAMN_RJ<br>tINIT_LOW<br>INITN<br>ane<br>DONE<br>oo<br>tDONE_LOW<br>tVMC fMCLK_def<br>MCLK<br>MSI<br>tIODISS<br>USER I/O<br>**----- End of picture text -----**<br>
**Figure 3.17. Master SPI PROGRAMN Timing**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**==> picture [440 x 513] intentionally omitted <==**
**----- Start of picture text -----**<br>
CertusPro-NX Family fALAT<br>Data Sheet<br>tPROGRAMN_RJ<br>PROGRAMN<br>tINIT_HIGH<br>tINIT_LOW<br>INITN<br>tDONE_LOW tACT_PROGRAMN_H<br>DONE<br>tCONFIG_CCLK<br>CCLK<br>SSI<br>fSCL tACT_PROGRAMN_H<br>tCONFIG_SCL<br>SCL<br>SDA<br>Slave Activation<br>tIODISS<br>USER I/O<br>=<br>Figure 3.18. Slave SPI/I [2] C/I3C PROGRAMN Timing<br>fMCLK<br>tMCLKH<br>MCLK fMCLKL<br>tSU_MISO tHD_MISO<br>MSI<br>tCO_MOSI<br>\KKXXKK/ \XXXKXK /<br>MSO<br>**----- End of picture text -----**<br>
**Figure 3.19. Master SPI Configuration Timing**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [411 x 503] intentionally omitted <==**
**----- Start of picture text -----**<br>
fCCLK<br>tCCLKH<br>CCLK<br>tCCLKL<br>tSU_SS I tHD_SSI<br>SSI<br>=<br>tSU_SCSN tHD_SCSN<br>SCSN<br>——<br>tHIGH_SCS N<br>tCO_SSO<br>SSO<br>tEN_SSO tDIS_SSO<br>SSO<br>ee<br>Figure 3.20. Slave SPI Configuration Timing<br>fSCL<br>tSCLH<br>SCL<br>tSCLL<br>tSU_SDA tHD_SDA<br>SDA (input)<br>tCO_SDA<br>SDA (output)<br>tDIS_SDA<br>tEN_SDA<br>SDA (output)<br>ie e s<br>Figure 3.21. I [2] C/I3C Configuration Timing<br>**----- End of picture text -----**<br>
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [418 x 504] intentionally omitted <==**
**----- Start of picture text -----**<br>
CRESET_B<br>INITN<br>tDONE_HIGH Device Wake-Up<br>DONE<br>CONFIG tMWC<br>Starts fMCLK_def fMCLK tMCLKZ<br>MCLK<br>tFIO_EN<br>USER I/O tIOEN<br>(FAST I/O)<br>tIOEN<br>USER I/O<br>Figure 3.22. Master SPI Wake-Up Timing<br>CRESET_B<br>INITN<br>tDONE_HIGH Device Wake-Up<br>DONE<br>CONFIG<br>Starts<br>CCLK/SCL<br>tFIO_EN<br>USER I/O tIOEN<br>(FAST I/O)<br>tIOEN<br>‘ell<br>USER I/O<br>ee<br>Figure 3.23. Slave SPI/I [2] C/I3C Wake-Up Timing<br>**----- End of picture text -----**<br>
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **3.30. JTAG Port Timing Specifications**
Over recommended operating conditions.
## **Table 3.50. JTAG Port Timing Specifications**
|**Symbol**|**Parameter**|**Min**|**Typ. **|**Max**|**Unit**|
|---|---|---|---|---|---|
|fMAX|TCK clock frequency|—|—|25|MHz|
|tBTCPH|TCK[BSCAN]clockpulse width high|20|—|—|ns|
|tBTCPL|TCK[BSCAN]clockpulse width low|20|—|—|ns|
|tBTS|TCK[BSCAN]setuptime|5|—|—|ns|
|tBTH|TCK [BSCAN] hold time|5|—|—|ns|
|tBTRF|TCK[BSCAN]rise/fall time1|1000|—|—|mV/ns|
|tBTCO|TAP controller fallingedge of clock to valid output|—|—|14|ns|
|tBTCODIS|TAP controller fallingedge of clock to valid disable|—|—|14|ns|
|tBTCOEN|TAP controller fallingedge of clock to valid enable|—|—|14|ns|
|tBTCRS|BSCAN test capture register setuptime|8|—|—|ns|
|tBTCRH|BSCAN test capture register hold time|25|—|—|ns|
|tBUTCO|BSCAN test update register, fallingedge of clock to valid output|—|—|25|ns|
|tBTUODIS|BSCAN test update register, fallingedge of clock to valid disable|—|—|25|ns|
|tBTUPOEN|BSCAN test update register, fallingedge of clock to valid enable|—|—|25|ns|
**Note** :
1. Based on default I/O setting of slow slew rate.
**==> picture [417 x 307] intentionally omitted <==**
**----- Start of picture text -----**<br>
TMS<br>TDI<br>tBTS tBTH<br>tBTCPH tBTCPL tBTCP<br>TCK<br>tBTCOEN tBTCO tBTCODIS<br>TDO V dilaD aat V dilaD aat<br>tBTCRH<br>tBTCRS<br>Data to be<br>Captured Data Captured<br>from I/O<br>tBTUPOEN tBUTCO tBTUODIS<br>Data to be<br>driven out V dilaD aat V dilaD aat<br>to I/O<br>**----- End of picture text -----**<br>
**Figure 3.24. JTAG Port Timing Waveforms**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **3.31. Switching Test Conditions**
Figure 3.25 shows the output test load that is used for AC testing. The specific values for resistance, capacitance, voltage, and other test conditions are listed in Table 3.51.
**==> picture [190 x 122] intentionally omitted <==**
**----- Start of picture text -----**<br>
V T<br>R1<br>DUT Test Point<br>R2 CL*<br>:<br>**----- End of picture text -----**<br>
## *CL Includes Test Fixture and Probe Capacitance
**Figure 3.25. Output Test Load, LVTTL and LVCMOS Standards**
**Table 3.51. Test Fixture Required Components, Non-Terminated Interfaces[1]**
|**Test Condition**|**R1**|**R2**|**CL**|**Timing Ref.**|**VT**|
|---|---|---|---|---|---|
|LVTTL and other LVCMOS settings (L ≥ H, H ≥ L)|||0 pF|LVCMOS 3.3 = 1.5 V|—|
|||||LVCMOS 2.5 = VCCIO/2|—|
|||||LVCMOS 1.8 = VCCIO/2|—|
|||||LVCMOS 1.5 = VCCIO/2|—|
|||||LVCMOS 1.2 = VCCIO/2|—|
|LVCMOS 2.5 I/O(Z ≥ H)||1 MΩ|0pF|VCCIO/2|—|
|LVCMOS 2.5 I/O(Z ≥ L)|1 MΩ||0pF|VCCIO/2|VCCIO|
|LVCMOS 2.5 I/O(H ≥ Z)||100|0pF|VOH– 0.10|—|
|LVCMOS 2.5 I/O(L ≥ Z)|100||0pF|VOL+ 0.10|VCCIO|
**Note** :
1. Output test conditions for all other interfaces are determined by the respective standards.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **4. DC and Switching Characteristics for Automotive**
All specifications in this section are characterized within recommended operating conditions unless otherwise specified.
## **4.1. Absolute Maximum Ratings**
**Table 4.1. Absolute Maximum Ratings**
|**Symbol**<br>~~a~~|**Parameter**|**Min**|**Max**|**Unit**|
|---|---|---|---|---|
|VCC, VCCECLK<br>~~a~~|SupplyVoltage<br>~~ee~~|–0.5<br>~~ee~~|1.10<br>~~ee~~|V<br>~~ee~~|
|VCCAUX, VCCAUXA,<br>VCCAUXH3, VCCAUXH4,<br>VCCAUXH5<br>~~a~~<br>~~a~~|Supply Voltage<br>~~ee~~|–0.5<br>~~ee~~|1.98<br>~~ee~~|V<br>~~ee~~|
|VCCIO0, 1, 2, 6, 7<br>~~a~~|I/O SupplyVoltage<br>~~ee ~~|–0.5<br> ~~ee ~~|3.63<br> ~~ee~~|V<br>~~ee~~|
|VCCIO3, 4, 5<br>~~a~~|I/O SupplyVoltage<br>|–0.5<br>|1.98<br>|V<br>|
|VCCPLLSD*<br>~~aGO~~|SERDES Block PLL SupplyVoltage<br>~~GO~~|–0.5<br>~~GO~~|1.98<br>~~GO~~|V<br>~~GO~~|
|VCCSD*<br>~~GO~~<br>~~a~~|SERDES SupplyVoltage<br>~~GO~~|–0.5<br>~~GO~~|1.10<br>~~GO~~|V<br>~~GO~~|
|VCCSDCK<br>~~a~~|SERDES Clock Buffer SupplyVoltage<br>|–0.5<br><br>~~GO~~|1.10<br><br>~~GO~~|V<br>|
|VCCADC18<br>~~Ge~~|ADC Block 1.8 V SupplyVoltage<br>~~Ge~~|–0.5<br>~~Ge~~<br>~~GO~~|1.98<br>~~Ge~~<br>~~GO~~|V<br>~~Ge~~|
|VCCAUXSDQ*<br>~~Ge~~<br>~~GO~~|SERDES AUX SupplyVoltage<br>~~Ge~~<br>~~GO~~|–0.5<br>~~Ge~~<br>~~GO~~<br>~~GO~~|1.98<br>~~Ge~~<br>~~GO~~<br>~~GO~~|V<br>~~Ge~~<br>~~GO~~|
|—<br>~~GO~~<br>~~a ee~~|Input or I/O Voltage Applied, Bank 0,<br>Bank 1, Bank 2, Bank 6, Bank 7<br>~~GO~~<br>~~ee~~|–0.5<br>~~GO~~<br>~~ee~~|3.63<br>~~GO~~<br>~~ee~~|V<br>~~GO~~<br>~~ee~~|
|—<br>~~a ee~~<br>~~a ee~~|Input or I/O Voltage Applied, Bank 3,<br>Bank 4, Bank 5<br>~~ee~~<br>~~ee~~|–0.5<br>~~ee~~<br>~~ee~~|1.98<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|—<br>~~a ee~~<br>~~GO~~|Voltage Applied on SERDES Pins<br>~~ee~~<br>~~GO~~|–0.5<br>~~ee~~<br>~~GO~~|1.98<br>~~ee~~<br>~~GO~~|V<br>~~ee~~<br>~~GO~~|
|TA<br>~~GO~~<br>~~a~~|Storage Temperature(Ambient)<br>~~GO~~|–65<br>~~GO~~|+150<br>~~GO~~|°C<br>~~GO~~|
|TJ<br>~~a~~|Junction Temperature|—|+125|°C|
**Notes** :
- Stress above those listed under the _Absolute Maximum Ratings_ may cause permanent damage to the device. Functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
- Compliance with the Lattice Thermal Management document is required.
- All voltages are referenced to GND.
- All VCCAUX should be connected to PCB.
## **4.2. Recommended Operating Conditions**
**Table 4.2. Recommended Operating Conditions[1, 2, 3]**
|**Symbol**|**Parameter**|**Conditions**|**Min**|**Typ. **|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|VCC,VCCECLK|Core SupplyVoltage|VCC= 1.0|0.955|1.00|1.05|V|
|VCCAUX|Auxiliary Supply Voltage|Bank 0, Bank 1, Bank 2, Bank 6,<br>Bank 7|1.71|1.80|1.89|V|
|VCCAUXH3/4/5|AuxiliarySupplyVoltage|Bank 3, Bank 4, Bank 5|1.71|1.80|1.89|V|
|VCCAUXA|Auxiliary Supply Voltage for<br>core logic|—|1.71|1.80|1.89|V|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|**Symbol**<br>~~DG~~|**Parameter**<br>~~DG~~|**Conditions**<br>~~DG~~<br>~~ee~~|**Min**<br>~~DG~~<br>~~CO~~|**Typ. **<br>~~DG~~<br>~~CO~~|**Max**<br>~~DG~~|**Unit**<br>~~DG~~|
|---|---|---|---|---|---|---|
|VCCIO|I/O Driver Supply Voltage|VCCIO= 3.3 V, Bank 0, Bank 1,<br>Bank 2, Bank 6, Bank 7<br>~~ee~~|3.135<br>~~CO~~<br>~~ee~~|3.30<br>~~CO~~<br>~~ee~~|3.465<br>~~ee~~|V<br>~~ee~~|
|||VCCIO= 2.5 V, Bank 0, Bank 1,<br>Bank 2, Bank 6, Bank 7<br>~~ee~~<br>~~a~~|2.375<br>~~CO~~<br>~~eee~~|2.50<br>~~CO~~<br>~~eee~~|2.625<br>~~eee~~|V<br>~~eee~~|
|||VCCIO= 1.8 V, All Banks<br>~~Ge~~|1.71<br>~~Ge~~|1.80<br>~~Ge~~|1.89<br>~~Ge~~|V<br>~~Ge~~|
|||VCCIO= 1.5 V, All Banks4<br>~~es~~|1.425<br>~~es~~|1.50<br>~~es~~<br>~~ee~~|1.575<br>~~es~~|V<br>~~es~~|
|||VCCIO= 1.35 V, All Banks (For<br>DDR3L Only)<br>~~ee~~|1.2825<br>~~ee~~|1.35<br>~~ee~~<br>~~ee~~|1.4175<br>~~ee~~|V<br>~~ee~~|
|||VCCIO= 1.2 V, All Banks4<br>~~es~~|1.14<br>~~es~~<br>~~ee~~|1.20<br>~~ee~~<br>~~es~~<br>~~ee~~|1.26<br>~~es~~<br>~~ee~~|V<br>~~es~~<br>~~ee~~|
|||VCCIO= 1.0 V, Bank 3, Bank 4,<br>Bank 5<br>~~ee~~|0.95<br>~~ee~~<br>~~ee~~|1.00<br>~~ee~~<br>~~ee~~|1.05<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|**ADC External Power Supplies**<br>~~ee ee ee~~<br>~~aa~~<br>~~Ge~~<br>~~GC~~|||||||
|VCCADC18<br>~~a~~|ADC 1.8 V Power Supply<br>~~a~~|—<br>~~Ge~~|1.71<br>~~GC~~|1.80<br>~~GC~~|1.89|V|
|**SERDES Block External Power Supplies**<br>~~a a~~<br>~~Ge~~<br>~~GC~~|||||||
|VCCSD*<br>~~a~~|Supply Voltage for SERDES<br>Block and SERDES I/O|—|0.95|1.00|1.05|V|
|VCCSDCK<br>~~a~~|Supply Voltage for SERDES<br>Clock Buffer|—|0.95|1.00|1.05|V|
|VCCPLLSD*<br>~~a~~|SERDES Block PLL Supply<br>Voltage|—|1.71|1.80|1.89|V|
|VCCAUXSDQ*<br>~~a ~~|SERDES Block Auxiliary<br>SupplyVoltage<br> ~~a ~~|—<br> ~~ee~~|1.71<br>~~ee~~|1.80<br>~~ee~~|1.89<br>~~ee~~|V<br>~~ee~~|
|**Operating Temperature**|||||||
|tJAUTO<br>~~a~~|Junction Temperature,<br>Automotive Operation|—|–40|—|125|°C|
**Notes** :
1. For correct operation, all supplies must be held in their valid operation voltage range.
2. All supplies with the same voltage should be from the same voltage source. Proper isolation filters are needed to properly isolate noise from each other.
3. Common supply rails must be tied together except SERDES.
4. MSPI (Bank 0) and JTAG, SSPI, I[2] C, and I3C (Bank 1) ports are supported for VCCIO = 1.8 V to 3.3 V.
5. For 10G SERDES usages, VCC voltage should be within the range from 0.97 V to 1.05 V.
## **4.3. Power Supply Ramp Rates**
**Table 4.3. Power Supply Ramp Rates**
**Symbol Parameter Min Typ Max Unit** ~~Se~~ tRAMP Power Supply ramp rates for all supplies[1 ] 0.1 — 50 V/ms **Notes** :
1. Assume monotonic ramp rates.
2. All supplies need to be in the operating range as defined in Recommended Operating Conditions when the device has completed configuration and entering User Mode. Supplies that are not in the operating range need to be adjusted to faster ramp rate, or user must delay configuration or wake up.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **4.4. Power up Sequence**
Power-On-Reset (POR) puts the CertusPro-NX device into a reset state. There is no power up sequence required for the CertusPro-NX device.
**Table 4.4. Power-On Reset[1]**
**Symbol Parameter Condition Min Typ Max Unit** Power-On-Reset ramp-up trip VCC 0.72 — 0.84 V VPORUP point (Monitoring VCC, VCCAUX, VCCAUX 1.30 — 1.64 V VCCIO0 and VCCIO1) VCCIO0, VCCIO1 0.87 — 1.07 V Power-On-Reset ramp-down trip VCC 0.48 — 0.85 V VPORDN point (Monitoring VCC and VCCAUX) VCCAUX 1.36 — 1.64 V **Note** : 1. VCCIO0 does not have a Power-On-Reset ramp down detection. VCCIO0 must remain within the Recommended Operating ~~-}[er]~~ Conditions to ensure proper operation.
## **4.5. On-chip Programmable Termination**
The CertusPro-NX devices support a variety of programmable on-chip terminations options, including:
- Dynamically switchable Single-Ended Termination with programmable resistor values of 50 Ω, 75 Ω, or 150 Ω. Termination to ground for LPDDR4, and termination to VCCIO/2 for all other non-LPDDR4.
**==> picture [477 x 213] intentionally omitted <==**
**----- Start of picture text -----**<br>
• Common mode termination of 100 Ω for differential inputs.<br>V CCIO Zo = 50<br>TERM<br>Zo = 50 , 75 , or 150<br>control<br>Zo<br>Zo +<br>2Zo<br>Zo +<br>Zo<br>VREF<br>OFF-chip ON-chip OFF-chip ON-chip<br>= ib<br>Parallel Single-Ended Input Differential Input<br>Figure 4.1. On-chip Termination<br>See Table 4.5 for termination options for input modes.<br>**----- End of picture text -----**<br>
**Table 4.5. On-Chip Termination Options for Input Modes**
|**IO_TYPE**|**Differential Termination Resistor1, 2, 3**|**Terminate to VCCIO/21, 2, 3**|
|---|---|---|
|subLVDS|100, OFF|OFF|
|SLVS|100, OFF|OFF|
|MIPI_DPHY|100|OFF|
|HSTL15D_I|100, OFF|OFF|
|SSTL15D_I|100, OFF|OFF|
|SSTL135D_I|100, OFF|OFF|
|HSUL12D|100, OFF|OFF|
|LVSTLD_I|OFF|OFF, 40, 48, 60, 80, 120|
|LVSTLD_II|OFF|OFF, 80, 120|
|LVCMOS15H|OFF|OFF|
|LVCMOS12H|OFF|OFF|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**IO_TYPE**<br>~~===~~|**Differential Termination Resistor1, 2, 3**<br>~~===~~|**Terminate to VCCIO/21, 2, 3**<br>~~===~~|
|---|---|---|
|LVCMOS10H<br>~~===~~|OFF<br>~~===~~|OFF<br>~~===~~|
|LVCMOS12H<br>~~===~~|OFF<br>~~===~~|OFF<br>~~===~~|
|LVCMOS10H<br>~~===~~|OFF<br>~~===~~|OFF<br>~~===~~|
|LVCMOS18H<br>~~===~~|OFF<br>~~===~~|OFF, 40, 50, 60, 75<br>~~===~~|
|HSTL15_I<br>~~===~~|OFF<br>~~===~~|50<br>~~===~~|
|SSTL15_I<br>~~===~~|OFF<br>~~===~~|OFF, 40, 50, 60, 75<br>~~===~~|
|SSTL135_I<br>~~===~~|OFF<br>~~===~~|OFF, 40, 50, 60, 75<br>~~===~~|
|HSUL12<br>~~===~~|OFF<br>~~===~~|OFF, 40, 50, 60, 75<br>~~===~~|
|LVSTL_I<br>~~===~~|OFF<br>~~===~~|OFF, 40, 48, 60, 80, 120<br>~~===~~|
|LVSTL_II<br>~~===~~|OFF<br>~~===~~|OFF, 80, 120<br>~~===~~|
2. Use of Single-ended Terminate Resistor (to ground for LPDDR4, to VCCIO/2 for all other non-LPDDR4) and Differential Termination Resistor are mutually exclusive in an I/O bank.
3. Tolerance for single-ended termination resistor is -10/60%, while for differential termination resistor is -15/15%.
Refer to sysI/O Usage Guide for Nexus Platform (FPGA-TN-02067) for on-chip termination usage and value ranges.
## **4.6. Hot Socketing Specifications**
**Table 4.6. Hot Socketing Specifications for GPIO**
**Symbol Parameter Condition Min Typ Max Unit** 0 < VIN < VIH(max) Input or I/O Leakage Current for 0 < VCC < VCC(max) IDK Wide Range I/O (excluding –1.5 — 1.5 mA 0 < VCCIO < VCCIO(max) MCLK/MCSN/MOSI/INITN/DONE) ~~oor~~ 0 < VCCAUX < VCCAUX(max) **Notes** : 1. IDK is additive to IPU, IPD, or IBH.
2. Hot socketing specification is defined at a device junction temperature of 85C or below. When the device junction temperature is above 85 C, the IDK current can exceed the above specification limit.
3. Going beyond the hot socketing ranges specified here can cause exponentially higher leakage currents and potential reliability issues. A total of 64 mA per 8 I/O should not be exceeded.
## **4.7. ESD Performance**
Refer to the CertusPro-NX Product Family Qualification Summary for complete qualification data, including ESD performance.
## **4.8. DC Electrical Characteristics**
**Table 4.7. DC Electrical Characteristics – Wide Range (Over Recommended Operating Conditions)**
|**Symbol**<br>~~ee~~|**Parameter**<br>~~ee~~|**Condition**<br>~~ee~~|**Min**<br>~~ee~~|**Typ**<br>~~ee~~|**Max**<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|---|
|IIL, IIH1<br>~~ee~~|Input or I/O Leakage current<br>(Automotive)<br>~~ee~~|0 ≤ VIN≤ VCCIO<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|10<br>~~ee~~|µA<br>~~ee~~|
|IIH2<br>~~ee~~|Input or I/O Leakage current<br>~~ee~~|VCCIO≤ VIN≤ VIH (max)<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|100<br>~~ee~~|µA<br>~~ee~~|
|IPU<br>~~ee~~|I/O Weak Pull-up Resistor<br>Current<br>~~ee~~|0 ≤ VIN≤ 0.7 × VCCIO<br>~~ee~~|–30<br>~~ee~~|—<br>~~ee~~|–150<br>~~ee~~|µA<br>~~ee~~|
|IPD<br>~~ee~~|I/O Weak Pull-down Resistor<br>Current<br>~~ee~~|VIL(max) ≤ VIN≤ VCCIO<br>~~ee~~|30<br>~~ee~~|—<br>~~ee~~|150<br>~~ee~~|µA<br>~~ee~~|
|IBHLS<br>~~ee~~|Bus Hold Low SustainingCurrent<br>~~ee~~|VIN= VIL (max)<br>~~ee~~|30<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|µA<br>~~ee~~|
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**CertusPro-NX Family Data Sheet**
|**Symbol**|**Parameter**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|IBHHS|Bus Hold High SustainingCurrent|VIN= 0.7 × VCCIO|–30|—|—|µA|
|IBHLO|Bus hold low Overdrive Current|0 ≤ VIN≤ VCCIO|—|—|150|µA|
|IBHHO|Bus hold high Overdrive Current|0 ≤ VIN≤ VCCIO|—|—|–150|µA|
|VBHT|Bus Hold TripPoints|—|VIL(max)|—|VIH(min)|V|
**Notes** :
1. Input or I/O leakage current is measured with the pin configured as an input or as an I/O with the output tri-stated. Bus Maintenance circuits are disabled.
2. The input leakage current IIH is the worst-case input leakage per GPIO when the pad signal is high and higher than the bank VCCIO. This is considered a mixed mode input.
**Table 4.8. DC Electrical Characteristics – High Speed (Over Recommended Operating Conditions)**
|**Symbol**|**Parameter**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|IIL, IIH1|Input or I/O Leakage|0 ≤ VIN≤ VCCIO|—|—|10|µA|
|IPU|I/O Weak Pull-up Resistor<br>Current|0 ≤ VIN≤ 0.7 × VCCIO|–30|—|–150|µA|
|IPD|I/O Weak Pull-down Resistor<br>Current|VIL(max) ≤ VIN≤ VCCIO|30|—|150|µA|
|IBHLS|Bus Hold Low SustainingCurrent|VIN= VIL (max)|30|—|—|µA|
|IBHHS|Bus Hold High SustainingCurrent|VIN= 0.7 × VCCIO|–30|—|—|µA|
|IBHLO|Bus hold low Overdrive Current|0 ≤ VIN≤ VCCIO|—|—|150|µA|
|IBHHO|Bus hold high Overdrive Current|0 ≤ VIN≤ VCCIO|—|—|–150|µA|
|VBHT|Bus Hold TripPoints|—|VIL(max)|—|VIH(min)|V|
**Note** :
1. Input or I/O leakage current is measured with the pin configured as an input or as an I/O with the output tri-stated. Bus Maintenance circuits are disabled.
**Table 4.9. Capacitors – Wide Range (Over Recommended Operating Conditions) Symbol Parameter Condition Min Typ Max Unit** VCCIO = 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V, C1[1 ] I/O Capacitance[1] — 6 — pF VCC = typ., VIO = 0 to VCCIO + 0.2 V VCCIO = 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V, C2[1 ] Dedicated Input Capacitance[1] — 6 — pF ~~ST~~ VCC = typ., VIO = 0 to VCCIO + 0.2 V **Note** : 1. TA 25[o] C, f = 1.0 MHz. **Table 4.10. Capacitors – High Performance (Over Recommended Operating Conditions) Symbol Parameter Condition Min Typ Max Unit** VCCIO = typ., VIO = 1.8 V, 1.5 V, 1.2 V, C1[1 ] I/O Capacitance[1] — 6 — pF VCC = typ., VIO = 0 to VCCIO + 0.2 V VCCIO = 1.8 V, 1.5 V, 1.2 V, VCC = typ., C2[1 ] Dedicated Input Capacitance[1] — 6 — pF VIO = 0 to VCCIO + 0.2 V VCCSD* = 1.0 V, VCC = typ., VIO = 0 to C3[1 ] SERDES I/O Capacitance — 5 — pF VCCSD* + 0.2 V ~~ee~~ **Note:** 1. TA 25[o] C, f = 1.0 MHz. **Table 4.11. Single Ended Input Hysteresis – Wide Range (Over Recommended Operating Conditions) IO_TYPE VCCIO TYP Hysteresis** LVCMOS33 3.3 V 250 mV 3.3 V 200 mV LVCMOS25 2.5 V 250 mV LVCMOS18 1.8 V 180 mV LVCMOS15 1.5 V 50 mV ~~—~~ © 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-DS-02086-2.0 114
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**CertusPro-NX Family Data Sheet**
|**IO_TYPE**|**VCCIO**|**TYP Hysteresis**|
|---|---|---|
|LVCMOS12|1.2 V|0|
|LVCMOS10|1.2 V|0|
**Table 4.12. Single Ended Input Hysteresis – High Performance (Over Recommended Operating Conditions)**
|**IO_TYPE**|**VCCIO**|**TYP Hysteresis**|
|---|---|---|
|LVCMOS18H|1.8 V|180 mV|
|LVCMOS15H|1.8 V|50 mV|
||1.5 V|150 mV|
|LVCMOS12H|1.2 V|0|
|LVCMOS10H|1.0 V|0|
|MIPI-LP-RX|1.2 V|>25 mV|
## **4.9. Supply Currents**
For estimating and calculating current, use Power Calculator in Lattice Design Software.
This operating and peak current is design dependent and can be calculated in Lattice Design Software. Some blocks can be placed into low current standby modes. Refer to Power Management and Calculation for Certus-NX, CertusPro-NX, and MachXO5-NX Devices (FPGA-TN-02257).
## **4.10. sysI/O Recommended Operating Conditions**
**Table 4.13. sysI/O Recommended Operating Conditions**
|**Standard**<br>~~ee~~|**Support Banks**|**VCCIO(Input)**<br>~~ee~~<br>~~es ee~~|**VCCIO(Output)**<br>~~ee~~<br>~~ee~~|
|---|---|---|---|
|||**Typ.**<br>~~ee~~<br>~~es ee~~|**Typ. **<br>~~ee~~<br>~~ee~~|
|**Single-Ended**<br>~~ee~~<br>~~ee~~<br>~~es ee~~<br>~~eGGO~~||||
|LVCMOS33<br>~~eG~~|0, 1, 2, 6, 7<br>~~eG~~|3.3<br>~~GO~~|3.3<br>~~GO~~|
|LVTTL33<br>~~eG~~<br>~~Ge~~|0, 1, 2, 6, 7<br>~~eG ~~<br>~~Ge ~~|3.3<br> ~~GO~~<br> ~~GG~~|3.3<br>~~GO~~<br>~~GG~~|
|LVCMOS25¹,²<br>~~Ge~~|0, 1, 2, 6, 7<br>~~Ge ~~|2.5, 3.3<br> ~~GC~~|2.5<br>~~GC~~|
|LVCMOS18¹,²<br>~~Ce~~<br>~~eG~~|0, 1, 2, 6, 7<br>~~Ce~~<br>~~eG~~|1.2, 1.5, 1.8, 2.5, 3.3<br>~~Ce~~<br>~~GO~~|1.8<br>~~Ce~~<br>~~GO~~|
|LVCMOS18H<br>~~Ce~~<br>~~eG~~<br>~~eG~~|3, 4, 5<br>~~Ce~~<br>~~eG~~<br>~~eG~~|1.8<br>~~Ce~~<br>~~GO~~<br>~~GO~~|1.8<br>~~Ce~~<br>~~GO~~<br>~~GO~~|
|LVCMOS15¹,²<br>~~eG~~<br>~~eG~~|0, 1, 2, 6, 7<br>~~eG ~~<br>~~eG~~|1.2, 1.5, 1.8, 2.5, 3.3<br> ~~GO~~<br>~~GO~~|1.5<br>~~GO~~<br>~~GO~~|
|LVCMOS15H¹<br>~~eG~~<br>~~Ge~~|3, 4, 5<br>~~eG ~~<br>~~Ge ~~|1.5, 1.8<br> ~~GO~~<br> ~~GG~~|1.5<br>~~GO~~<br>~~GG~~|
|LVCMOS12¹,²<br>~~Ge~~|0, 1, 2, 6, 7<br>~~Ge ~~|1.2, 1.5, 1.8, 2.5, 3.3<br> ~~GC~~|1.2<br>~~GC~~|
|LVCMOS12H¹<br>~~Ge~~|3, 4, 5<br>~~Ge ~~|1.2, 1.5, 1.8<br> ~~GC~~|1.2<br>~~GC~~|
|LVCMOS10¹<br>~~Ce~~<br>~~eG~~|0, 1, 2, 6, 7<br>~~Ce~~<br>~~eG~~|1.2, 1.5, 1.8, 2.5, 3.3<br>~~Ce~~<br>~~GO~~|—<br>~~Ce~~<br>~~GO~~|
|LVCMOS10H¹<br>~~Ce~~<br>~~eG~~|3, 4, 5<br>~~Ce~~<br>~~eG~~|1.0, 1.2, 1.357, 1.5, 1.8<br>~~Ce~~<br>~~GO~~|1.0<br>~~Ce~~<br>~~GO~~|
|LVCMOS10R¹<br>~~eG~~<br>~~Ge~~|3, 4, 5<br>~~eG ~~<br>~~Ge ~~|1.0, 1.2, 1.357, 1.5, 1.8<br> ~~GO~~<br> ~~GG~~|—<br>~~GO~~<br>~~GG~~|
|SSTL135_I, SSTL135_II3<br>~~Ge~~|3, 4, 5<br>~~Ge ~~|1.357<br> ~~GC~~|1.35<br>~~GC~~|
|SSTL15_I, SSTL15_II3<br>~~Ge~~|3, 4, 5<br>~~Ge ~~|1.58<br> ~~GO~~|1.58<br>~~GO~~|
|HSTL15_I3<br>~~Ge~~|3, 4, 5<br>~~Ge~~|1.58<br>~~Ge~~|1.58<br>~~Ge~~|
|HSUL123<br>~~Ge~~<br>~~Ge~~|3, 4, 5<br>~~Ge~~<br>~~Ge~~|1.2<br>~~Ge~~<br>~~OG~~|1.2<br>~~Ge~~<br>~~OG~~|
|LVSTL_I, LVSTL_II3<br>~~Ge~~<br>~~Ge~~|3, 4, 5<br>~~Ge ~~<br>~~Ge ~~|1.1<br> ~~OG~~<br> ~~GO~~|1.1<br>~~OG~~<br>~~GO~~|
|MIPI D-PHY(LP Mode)6<br>~~Ge~~|3, 4, 5<br>~~Ge ~~|1.2<br> ~~GG~~|1.2<br>~~GG~~|
|**Differential6**||||
|LVDS<br>~~Ge~~|3, 4, 5<br>~~Ge~~|1.2, 1.357, 1.5, 1.8<br>~~Ge~~|1.8<br>~~Ge~~|
|LVDSE5<br>~~Ge~~<br>~~Ge~~|0, 1, 2, 6, 7<br>~~Ge~~<br>~~Ge~~|—<br>~~Ge~~<br>~~OG~~|2.5<br>~~Ge~~<br>~~OG~~|
|subLVDS<br>~~Ge~~<br>~~Ge~~|3, 4, 5<br>~~Ge ~~<br>~~Ge ~~|1.2, 1.357, 1.5, 1.8<br> ~~OG~~<br> ~~GF~~|—<br>~~OG~~<br>~~GF~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
115
**CertusPro-NX Family Data Sheet**
|**Standard**<br>~~ee~~|**Support Banks**<br>~~a~~|**VCCIO(Input)**<br>~~ee eee~~|**VCCIO(Output)**<br>~~eee~~|
|---|---|---|---|
|||**Typ.**<br>~~ee eee~~<br>~~a~~|**Typ. **<br>~~eee~~<br>~~a~~|
|subLVDSE5<br>~~ee ~~<br>~~Ge~~|0, 1, 2, 6, 7<br> ~~a~~<br>~~Ge ~~|—<br>~~ee eee~~<br> ~~GG~~|1.8<br>~~eee~~<br>~~GG~~|
|subLVDSEH5<br>~~Ge~~|3, 4, 5<br>~~Ge ~~|—<br> ~~GG~~|1.8<br>~~GG~~|
|SLVS6<br>~~Ge~~<br>~~eG~~|3, 4, 5<br>~~Ge ~~<br>~~eG~~|1.2, 1.357, 1.5, 1.84<br> ~~GG~~<br>~~GC~~|1.2, 1.5, 1.84<br>~~GG~~<br>~~GC~~|
|MIPI D-PHY(HS Mode)6<br>~~eG~~<br>~~eG~~|3, 4, 5<br>~~eG~~<br>~~eG~~|1.1, 1.2<br>~~GC~~<br>~~GC~~|1.1, 1.2<br>~~GC~~<br>~~GC~~|
|LVCMOS33D5<br>~~eG~~<br>~~eG~~|0, 1, 2, 6, 7<br>~~eG ~~<br>~~eG~~|—<br> ~~GC~~<br>~~GC~~|3.3<br>~~GC~~<br>~~GC~~|
|LVTTL33D5<br>~~eG~~<br>~~Ge~~|0, 1, 2, 6, 7<br>~~eG ~~<br>~~Ge ~~|—<br> ~~GC~~<br> ~~GG~~|3.3<br>~~GC~~<br>~~GG~~|
|LVCMOS25D5<br>~~Ge~~|0, 1, 2, 6, 7<br>~~Ge ~~|—<br> ~~GO~~|2.5<br>~~GO~~|
|SSTL135D_I, SSTL135D_II5<br>~~Ge~~<br>~~eG~~|3, 4, 5<br>~~Ge ~~<br>~~eG~~|1.357, 1.5, 1.8<br> ~~GG~~<br>~~GC~~|1.357<br>~~GG~~<br>~~GC~~|
|SSTL15D_I, SSTL15D_II5<br>~~eG~~<br>~~eG~~|3, 4, 5<br>~~eG~~<br>~~eG~~|1.5, 1.8<br>~~GC~~<br>~~GC~~|1.5<br>~~GC~~<br>~~GC~~|
|HSTL15D_I5<br>~~eG~~<br>~~eG~~|3, 4, 5<br>~~eG ~~<br>~~eG~~|1.5, 1.8<br> ~~GC~~<br>~~GC~~|1.5<br>~~GC~~<br>~~GC~~|
|HSUL12D5<br>~~eG~~<br>~~Ge~~|3, 4, 5<br>~~eG ~~<br>~~Ge ~~|1.2, 1.357, 1.5, 1.8<br> ~~GC~~<br> ~~GG~~|1.2<br>~~GC~~<br>~~GG~~|
|LVSTLD_I, LVSTLD_II5<br>~~De~~|3, 4, 5<br>~~De ~~|1.1<br> ~~DC~~|1.1<br>~~DC~~|
**Notes** :
1. Single-ended input can mix into I/O Banks with VCCIO different from the standard requires due to some of these input standards use internal supply voltage source (VCC, VCCAUX) to power the input buffer, which makes them to be independent of VCCIO voltage. For more details, refer to sysI/O Usage Guide for Nexus Platform (FPGA-TN-02067). The following is a brief guideline to follow:
- a. Weak pull-up on the I/O must be set to OFF.
- b. Bank 3, Bank 4, and Bank 5 I/O can only mix into banks with VCCIO higher than the pin standard, due to clamping diode on the pin in these banks. Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7 do not have this restriction.
- c. LVCMOS25 uses VCCIO supply on input buffer in Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7. It can be supported with VCCIO = 3.3 V to meet the VIH and VIL requirements, but there is additional current drawn on VCCIO. Hysteresis must be disabled when using 3.3 V supply voltage.
- d. LVCMOS15 uses VCCIO supply on input buffer in Bank 3, Bank 4, and Bank 5. It can be supported with VCCIO = 1.8 V to meet the VIH and VIL requirements, but there is additional current drawn on VCCIO.
2. Single-ended LVCMOS inputs can be mixed into I/O Banks with different VCCIO, providing weak pull-up not being used. For additional information on Mixed I/O in Bank VCCIO, refer to sysI/O Usage Guide for Nexus Platform (FPGA-TN-02067) **.**
3. These inputs use differential input comparator in Bank 3, Bank 4, and Bank 5. The differential input comparator uses VCCAUXH power supply. These inputs require the VREF pin to provide the reference voltage in the Bank. Refer to sysI/O Usage Guide for Nexus Platform (FPGA-TN-02067) for details **.**
4. All differential inputs use differential input comparator in Bank 3, Bank 4, and Bank 5. The differential input comparator uses VCCAUXH power supply. There is no differential input signaling supported in Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7.
5. These outputs are emulating differential output pair with single-ended output drivers with true and complement outputs driving on each of the corresponding true and complement output pair pins. The common mode voltage VCM is ½ × VCCIO. Refer to sysI/O Usage Guide for Nexus Platform (FPGA-TN-02067) for details **.**
6. Soft MIPI D-PHY HS using sysI/O is supported with SLVS input and output that can be placed in banks with VCCIO voltage shown in SLVS. D-PHY with HS and LP modes supported needs to be placed in banks with VCCIO voltage = 1.2 V. Soft MIPI D-PHY LP input and output using sysI/O are supported with LVCMOS12.
7. VCCIO = 1.35 V is only supported in Bank 3, Bank 4, and Bank 5, for use with DDR3L interface in the bank. These Input and Output standards can fit into the same bank with the VCCIO = 1.35 V.
8. LVCMOS15 input uses VCCIO supply voltage. If VCCIO is 1.8 V, the DC levels for LVCMOS15 are still met, but there could be increase in input buffer current.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
116
**CertusPro-NX Family Data Sheet**
## **4.11. sysI/O Single-Ended DC Electrical Characteristics**
**Table 4.14. sysI/O DC Electrical Characteristics – Wide Range I/O (Over Recommended Operating Conditions)**
|**Input/Output**<br>**Standard**|**VIL¹ **|**VIL¹ **|**VIH¹ **|**VIH¹ **|**VOL Max (V)**|**VOH Min² (V)**|**IOL(mA)**|**IOH(mA)**|
|---|---|---|---|---|---|---|---|---|
||**Min(V)**|**Max(V)**|**Min(V)**|**Max(V)**|||||
|LVTTL33<br>LVCMOS33|—|0.8|2.0|3.4655|0.4|VCCIO – 0.4|2, 4, 8,<br>12, 16,<br>“50RS”3|–2, –4,<br>–8,<br>–12, –16,<br>“50RS”3|
|LVCMOS25|—|0.7|1.7|3.4655|0.4|VCCIO – 0.45|2, 4, 8,<br>10,<br>“50RS”3|–2, –4,<br>–8,<br>–10,<br>“50RS”3|
|LVCMOS18|—|0.35 × VCCIO|0.65 × VCCIO|3.4655|0.4|VCCIO – 0.45|2, 4, 8,<br>“50RS”3|–2, –4,<br>–8,<br>“50RS”3|
|LVCMOS15<br>~~po~~|—<br>~~po~~|0.35 × VCCIO<br>~~po~~|0.65 × VCCIO<br>~~po~~|3.4655<br>~~po~~|0.4<br>~~po~~|VCCIO – 0.4<br>~~po~~|2, 4<br>~~po~~|–2, –4<br>~~po~~|
|LVCMOS12<br>~~po~~|—<br>~~po~~|0.35 × VCCIO<br>~~po~~|0.65 × VCCIO<br>~~po~~|3.4655<br>~~po~~|0.4<br>~~po~~|VCCIO – 0.4<br>~~po~~|2, 4<br>~~po~~|–2, –4<br>~~po~~|
|LVCMOS10<br>~~pT~~|—<br>~~pT~~|0.35 × VCCIO<br>~~pT~~|0.65 × VCCIO<br>~~pT~~|3.4655<br>~~pT~~|No O/P Support<br>~~pT~~||||
**Notes** :
1. VCCIO for input level refers to the supply rail level associated with a given input standard.
2. VCCIO for the output levels refer to the VCCIO of the CertusPro-NX device.
3. Selecting “50RS” in driver strength is to select 50 Ω series impedance driver.
4. For electro-migration, the combined DC current sourced or sinked by I/O pads between two consecutive VCCIO or GND pad connections, or between the last VCCIO or GND in an I/O bank and the end of an I/O bank, as shown in the Logic Signal Connections table (also shown as I/O grouping) shall not exceed a maximum of n × 8 mA. _n_ is the number of I/O pads between the two consecutive bank VCCIO or GND connections or between the last VCCIO and GND in a bank and the end of a bank. I/O Grouping can be found in the Data Sheet Pin Summary Tables, which can also be generated from the Lattice Radiant software.
5. If the input clamp is OFF, VIH (Max) in Banks 0, 1, 2, 6, and 7 can go up to 3.465 V. Otherwise, the input voltage cannot be higher than VCCIO + 0.3 V.
**Table 4.15. sysI/O DC Electrical Characteristics – High Performance I/O (Over Recommended Operating Conditions)**
|**Input/Output**<br>**Standard**|**VIL¹ **|**VIL¹ **|**VIH¹ **|**VIH¹ **|**VOL Max (V)**|**VOH Min² (V)**|**IOL (mA)**|**IOH (mA)**|
|---|---|---|---|---|---|---|---|---|
||**Min(V)**|**Max(V)**|**Min(V)**|**Max(V)**|||||
|LVCMOS18H|—|0.35 × VCCIO|0.65 × VCCIO|VCCIO+ 0.3|0.4|VCCIO– 0.45|2, 4, 8,<br>12,<br>“50RS”3|–2, –4,<br>–8,<br>–12,<br>“50RS”3|
|LVCMOS15H|—|0.35 × VCCIO|0.65 × VCCIO|VCCIO+ 0.3|0.4|VCCIO– 0.4|2, 4, 8,<br>“50RS”3|–2, –4,<br>–8,<br>“50RS”3|
|LVCMOS12H<br>~~po~~|—|0.35 × VCCIO|0.65 × VCCIO|VCCIO+ 0.3|0.4|VCCIO– 0.4|2, 4, 8,<br>“50RS”3|–2, –4,<br>–8,<br>“50RS”3|
|LVCMOS10H<br>~~po~~<br>~~Re~~<br>~~Re~~|—<br>~~GG~~|0.35 × VCCIO<br>~~GG~~|0.65 × VCCIO<br>~~GG~~|VCCIO+ 0.3<br>~~GG~~|0.27 × VCCIO<br>~~GG~~<br>~~GG~~|0.75 × VCCIO<br>~~GG~~<br>~~GG~~|2, 4<br>~~GG~~<br>~~GG~~|–2, –4<br>~~GG~~|
|SSTL15_I<br>~~po~~<br>~~Re~~<br>~~Re~~|—<br>~~GG~~|VREF– 0.10<br>~~GG~~|VREF+ 0.1<br>~~GG~~|VCCIO+ 0.3<br>~~GG~~|0.30<br>~~GG~~<br>~~GG~~|VCCIO– 0.30<br>~~GG~~<br>~~GG~~|7.5<br>~~GG~~<br>~~GG~~|–7.5<br>~~GG~~|
|SSTL15_II<br>~~Re~~<br>~~Re~~<br>~~po~~|—<br>~~GG~~|VREF– 0.10<br>~~GG~~<br>~~Ge~~|VREF+ 0.1<br>~~GG~~<br>~~Ge GG~~|VCCIO+ 0.3<br>~~GG~~<br>~~GG~~|0.30<br>~~GG~~<br>~~GG~~<br>~~GG~~|VCCIO– 0.30<br>~~GG~~<br>~~GG~~<br>~~GG~~|8.8<br>~~GG~~<br>~~GG~~<br>~~GG~~|–8.8<br>~~GG~~<br>~~GG~~|
|HSTL15_I<br>~~Re~~<br>~~po~~|—|VREF– 0.10<br>~~Ge~~|VREF+ 0.1<br>~~Ge GG~~|VCCIO+ 0.3<br>~~GG~~|0.40<br>~~GG~~<br>~~GG~~|VCCIO– 0.40<br>~~GG~~<br>~~GG~~|8<br>~~GG~~<br>~~GG~~|–8<br>~~GG~~|
|SSTL135_I<br>~~po~~<br>~~a~~<br>~~po~~|—<br>~~a~~<br>~~po~~|VREF– 0.09<br>~~Ge~~<br>~~GG~~<br>|VREF+ 0.09<br>~~Ge GG~~<br>~~GG~~<br>|VCCIO+ 0.3<br>~~GG~~<br>~~GG~~<br>|0.27<br>~~GG~~<br>~~GO~~<br>|VCCIO– 0.27<br>~~GG~~<br>~~GO~~<br>|6.75<br>~~GG~~<br>|–6.75<br>~~GG~~<br>|
|SSTL135_II<br>~~a~~<br>~~po~~|—<br>~~a~~<br>~~po~~|VREF– 0.09<br>~~GG~~<br>|VREF+ 0.09<br>~~GG~~<br>|VCCIO+ 0.3<br>~~GG~~<br>|0.27<br>~~GO~~<br>|VCCIO– 0.27<br>~~GO~~<br>|8<br>|–8<br>|
|LVCMOS10R<br>~~po~~|—<br>~~po~~|VREF– 0.10<br>|VREF+ 0.10<br><br>~~ee~~|VCCIO+ 0.3<br><br>~~ee~~|—<br><br>~~ee~~|—<br><br>~~eee~~|—<br><br>~~eee~~|—<br><br>~~eee~~|
|HSUL12<br>~~ee~~|—<br>~~ee~~|VREF– 0.10<br>~~ee~~|VREF+ 0.10<br>~~ee~~<br>~~ee~~|VCCIO+ 0.3<br>~~ee~~<br>~~ee~~|0.3<br>~~ee~~<br>~~ee~~|VCCIO– 0.3<br>~~ee~~<br>~~eee~~|8.0, 7.5,<br>6.25, 5<br>~~ee~~<br>~~eee~~|–8.0,<br>–7.5,<br>–6.25, –5<br>~~ee~~<br>~~eee~~|
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
FPGA-DS-02086-2.0
117
**CertusPro-NX Family Data Sheet**
|**Input/Output**<br>**Standard**|**VIL¹ **|**VIL¹ **|**VIH¹ **|**VIH¹ **|**VOL Max (V)**|**VOH Min² (V)**|**IOL (mA)**|**IOH (mA)**|
|---|---|---|---|---|---|---|---|---|
||**Min(V)**|**Max(V)**|**Min(V)**|**Max(V)**|||||
|LVSTL_I|–0.2|0.35 × VCCIO|0.65 × VCCIO|VCCIO+ 0.2|0.1 × VCCIO|0.3 × VCCIO|2, 4, 6, 8,<br>10|–2, –4,<br>–6, –8,<br>–10|
|LVSTL_II|–0.2|0.35 × VCCIO|0.65 × VCCIO|VCCIO+ 0.2|0.1 × VCCIO|0.36 × VCCIO|4, 6|–4, –6|
**Notes** :
1. VCCIO for input level refers to the supply rail level associated with a given input standard.
2. VCCIO for the output levels refer to the VCCIO of the CertusPro-NX device.
3. Select “50RS” in driver strength is selecting the 50Ω series impedance driver.
4. For electro-migration, the combined DC current sourced or sinked by I/O pads between two consecutive VCCIO or GND pad connections, or between the last VCCIO or GND in an I/O bank and the end of an I/O bank, as shown in the Logic Signal Connections table (also shown as I/O grouping) shall not exceed a maximum of n × 8 mA. _n_ is the number of I/O pads between the two consecutive bank VCCIO or GND connections or between the last VCCIO and GND in a bank and the end of a bank. I/O Grouping can be found in the Data Sheet Pin Summary Tables, which can also be generated from the Lattice Radiant software. **Table 4.16. I/O Resistance Characteristics (Over Recommended Operating Conditions) Parameter Description Test Conditions Min Typ Max Unit** 50RS Output Drive Resistance when 50RS VCCIO = 1.8 V, 2.5 V, or 3.3 V — 50 — Ω Drive Strength Selected Input Differential Termination Bank 3, Bank 4, and Bank 5, for RDIFF Resistance I/O selected to be differential — 100 — Ω 36 40 64 SE Input Input Single Ended Termination Bank 3, Bank 4, and Bank 5 for I/O 46 50 80 Ω Termination Resistance selected to be Single Ended 56 60 96 71 75 120 ~~ee~~ **Table 4.17. VIN Maximum Overshoot/Undershoot Allowance – Wide Range[1, 2] AC Voltage Overshoot % of UI at –40 °C to 125 °C AC Voltage Undershoot % of UI at –40 °C to 125 °C** VCCIO + 0.4 100.0% –0.4 100.0% VCCIO + 0.5 100.0% –0.5 44.2% VCCIO + 0.6 94.0% –0.6 10.1% VCCIO + 0.7 21.0% –0.7 1.3% VCCIO + 0.8 10.2% –0.8 0.3% VCCIO + 0.9 2.5% –0.9 0.1% ~~ee~~ **Notes** : 1. The peak overshoot or undershoot voltage and the duration above VCCIO + 0.2 V or below GND – 0.2 V must not exceed the values in this table.
2. For UI less than 20 µs.
**Table 4.18. VIN Maximum Overshoot/Undershoot Allowance – High Performance[1, 2] AC Voltage Overshoot % of UI at –40 °C to 125 °C AC Voltage Undershoot % of UI at –40 °C to 125 °C** VCCIO + 0.5 100.0% –0.5 100.0% VCCIO + 0.6 47.3% –0.6 47.3% VCCIO + 0.7 10.9% –0.7 10.9% VCCIO + 0.8 2.7% –0.8 2.7% VCCIO + 0.9 0.7% –0.9 0.7% ~~=————~~ **Notes** : 1. The peak overshoot or undershoot voltage and the duration above VCCIO + 0.2 V or below GND – 0.2 V must not exceed the values in this table.
2. For UI less than 20 µs.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
118
**CertusPro-NX Family Data Sheet**
## **4.12. sysI/O Differential DC Electrical Characteristics**
## **4.12.1. LVDS**
LVDS input buffer on CertusPro-NX device is operating with VCCAUX = 1.8 V, and the LVDS input voltage cannot exceed the VCCIO voltage of the related bank. LVDS output buffer is powered by the Bank VCCIO at 1.8 V.
LVDS can only be supported in Bank 3, Bank 4, and Bank 5. LVDS25 output can be emulated with LVDS25E in Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7. This is described in the LVDS25E (Output Only) section.
**Table 4.19. LVDS DC Electrical Characteristics (Over Recommended Operating Conditions)[1 ]**
|**Parameter**<br>~~a~~|**Description**<br>~~a~~|**Test Conditions**<br>~~a~~|**Min**<br>~~a~~|**Typ**<br>~~a~~|**Max**<br>~~a~~|**Unit**<br>~~a~~|
|---|---|---|---|---|---|---|
|VINP, VINM<br>~~a~~|Input Voltage<br>~~a~~|—<br>~~a~~|0<br>~~a~~|—<br>~~a~~|1.603<br>~~a~~|V<br>~~a~~|
|VICM<br>~~a~~<br>~~**e**e~~|Input Common Mode Voltage<br>~~a~~|Half the sum of the two Inputs<br>~~a~~|0.05<br>~~a~~|—<br>~~a~~|1.552<br>~~a~~|V<br>~~a~~|
|VTHD<br>~~**e**e~~|Differential Input Threshold|Difference between the two Inputs|±100|—|—|mV|
|IIN<br>~~**e**e~~|Input Current|Power On or Power Off<br>~~e~~|—<br>~~e~~|—<br>~~e~~|±10<br>~~e~~|µA<br>~~e~~|
|VOH<br>~~a~~|Output High Voltage for VOPor VOM<br>~~a~~|RT= 100 Ω<br>~~a~~|—<br>~~a~~|1.425<br>~~a~~|1.60<br>~~a~~|V<br>~~a~~|
|VOL<br>~~ee~~|Output Low Voltage for VOPor VOM<br>~~ee~~|RT= 100 Ω<br>~~ee~~|0.9 V<br>~~ee~~|1.075<br>~~ee~~|—<br>~~ee~~|V<br>~~ee~~|
|VOD<br>~~a~~|Output Voltage Differential<br>~~a~~|(VOP– VOM), RT= 100 Ω<br>~~a~~|250<br>~~a~~|350<br>~~a~~|450<br>~~a~~|mV<br>~~a~~|
|VOD<br>~~a~~<br>~~a~~|Change in VODBetween High and<br>Low<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|50<br>~~a~~<br>~~a~~|mV<br>~~a~~<br>~~a~~|
|VOCM<br>~~a~~|Output Common Mode Voltage<br>~~a~~|(VOP+ VOM)/2, RT= 100 Ω<br>~~a~~|1.125<br>~~a~~|1.25<br>~~a~~|1.375<br>~~a~~|V<br>~~a~~|
|VOCM<br>~~a~~<br>~~a~~|Change in VOCM, VOCM(Max) –<br>VOCM(Min)<br>~~a~~<br>~~a~~<br>~~ee~~|—<br>~~a~~<br>~~a~~<br>~~ee~~|—<br>~~a~~<br>~~a~~<br>~~ee~~|—<br>~~a~~<br>~~a~~<br>~~ee~~|50<br>~~a~~<br>~~a~~<br>~~ee~~|mV<br>~~a~~<br>~~a~~<br>~~ee~~|
|ISAB<br>~~a~~<br>~~a~~|Output Short Circuit Current<br>~~a~~<br>~~ee~~<br>~~ee~~|VOD= 0 V Driver outputs shorted to<br>each other<br>~~a~~<br>~~ee~~<br>~~ee~~|—<br>~~a~~<br>~~ee~~<br>~~ee~~|—<br>~~a~~<br>~~ee~~<br>~~ee~~|12<br>~~a~~<br>~~ee~~<br>~~ee~~|mA<br>~~a~~<br>~~ee~~<br>~~ee~~|
|VOS<br>~~a~~<br>~~a~~|Change in VOSbetween H and L<br>~~ee~~<br>~~a~~|—<br>~~ee~~<br>~~a~~|—<br>~~ee~~<br>~~a~~|—<br>~~ee~~<br>~~a~~|50<br>~~ee~~<br>~~a~~|mV<br>~~ee~~<br>~~a~~|
**Notes** :
1. LVDS input or output are supported in Bank 3, Bank 4, and Bank 5. LVDS input uses VCCAUXH on the differential input comparator, and can be located in any VCCIO voltage bank. LVDS output uses VCCIO on the differential output driver, and can only be located in bank with VCCIO = 1.8 V.
2. VICM depends on VID, input differential voltage, so the voltage on pin cannot exceed VINP/INM(Min/Max) requirements. VICM(Min) = VINP/INM(Min) + ½VID, VICM(Max) = VINP/INM(Max) – ½VID. Values in the table is based on minimum VID of +/- 100 mV.
3. VINP/INM(Max) must be less than or equal to VCCIO in all cases.
## **4.12.2. LVDS25E (Output Only)**
Three sides of the CertusPro-NX devices, Top, Left and Right, support LVDS25 outputs with emulated complementary LVCMOS outputs in conjunction with a parallel resistor across the driver outputs. The scheme shown in Figure 4.2 is one possible solution for point-to-point signals.
**Table 4.20. LVDS25E DC Conditions**
|**Parameter**<br>~~a~~|**Description**<br>~~a~~<br>~~a~~|**Typical**<br>~~a~~<br>~~a~~|**Unit**<br>~~a~~|
|---|---|---|---|
|VCCIO<br>~~a~~<br>~~a~~|Output Driver Supply (±5%)<br>~~a~~<br>~~a~~|2.50<br>~~a~~<br>~~a~~|V<br>~~a~~|
|ZOUT<br>~~a ~~|Driver Impedance<br> ~~a~~|20|Ω|
|RS<br>~~a~~|Driver Series Resistor (±1%)|158|Ω|
|RP<br>~~a~~<br>~~a~~|Driver Parallel Resistor (±1%)|140|Ω|
|RT<br>~~a~~|Receiver Termination (±1%)|100|Ω|
|VOH<br>~~a~~<br>~~a~~|Output High Voltage|1.43|V|
|VOL<br>~~a a~~|Output Low Voltage<br>~~a~~|1.07|V|
|VOD<br>~~a~~|Output Differential Voltage|0.35|V|
|VCM<br>~~a~~<br>~~a ~~|Output Common Mode Voltage<br> ~~a~~|1.25|V|
|ZBACK<br>~~a~~|Back Impedance<br>~~a~~<br>~~a~~|100.5|Ω|
|IDC<br>~~a~~<br>~~a~~|DC Output Current<br>~~a~~<br>~~a~~<br>~~a~~|–6.03|mA|
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
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**==> picture [338 x 124] intentionally omitted <==**
**----- Start of picture text -----**<br>
VCCIO = 2.5 V (±5%)<br>RS = 158<br>(±1%)<br>8 mA<br>LVCMOS25<br>RS = 140 RS = 100<br>VCCIO = 2.5 V (±5%) (±1%) (±1%)<br>RS = 158<br>(±1%)<br>8 mA<br>LVCMOS25<br>Transmission line, Zo = 100 differential<br>ON-chip OFF-chip ON-chip OFF-chip<br>**----- End of picture text -----**<br>
**Figure 4.2. LVDS25E Output Termination Example**
## **4.12.3. SubLVDS (Input Only)**
SubLVDS is a reduced-voltage form of LVDS signaling, very similar to LVDS (Figure 4.3). It is a standard used in many camera types of applications. Similar to LVDS, the CertusPro-NX devices can support the subLVDS input signaling with the same LVDS input buffer, and the subLVDS input voltage cannot exceed the VCCIO voltage of the related bank. The output for subLVDS is implemented in subLVDSE/subLVDSEH with a pair of LVCMOS18 output drivers. See the SubLVDSE/SubLVDSEH (Output Only) section for more details.
**Table 4.21. SubLVDS Input DC Electrical Characteristics (Over Recommended Operating Conditions)**
|**Parameter**<br>~~——_————~~|**Description**<br>~~——_————~~|**Test Conditions**<br>~~——_————~~|**Min**<br>~~——_————~~|**Typ**<br>~~——_————~~|**Max1**<br>~~——_————~~|**Unit**<br>~~——_————~~|
|---|---|---|---|---|---|---|
|VID<br>~~——_————~~|Input Differential Threshold Voltage<br>~~——_————~~|Over VICMrange<br>~~——_————~~|70<br>~~——_————~~|150<br>~~——_————~~|200<br>~~——_————~~|mV<br>~~——_————~~|
|VICM<br>~~——_————~~|Input Common Mode Voltage<br>~~——_————~~|Half the sum of the two Inputs<br>~~——_————~~|0.4<br>~~——_————~~|0.9<br>~~——_————~~|1.4<br>~~——_————~~|V<br>~~——_————~~|
**==> picture [361 x 163] intentionally omitted <==**
**----- Start of picture text -----**<br>
Sub-LVDS Driver PCB Traces, Connectors or Cables<br>Z0 = 50<br>+ +<br>RT = 100<br>100 differential ± 1%*<br>– –<br>Z0 = 50<br>Off-chip On-chip<br>**----- End of picture text -----**<br>
**Figure 4.3. SubLVDS Input Interface**
## **4.12.4. SubLVDSE/SubLVDSEH (Output Only)**
SubLVDS output uses a pair of LVCMOS18 drivers with True and Complement outputs (Figure 4.4). VCCIO of the bank used for subLVDSE or subLVDSEH needs to be powered by 1.8 V. SubLVDSE is for Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7; and subLVDSEH is for Bank 3, Bank 4, and Bank 5.
Performance of the subLVDSE/subLVDSEH driver is limited to the performance of LVCMOS18.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**Table 4.22. SubLVDS Output DC Electrical Characteristics (Over Recommended Operating Conditions)**
**==> picture [481 x 303] intentionally omitted <==**
**----- Start of picture text -----**<br>
Parameter Description Test Conditions Min Typ Max Unit<br>VOD Output Differential Voltage Swing — — 150 — mV<br>VOCM Output Common Mode Voltage Half the sum of the two Outputs — 0.9 — V<br>VCCIO = +1.8 V PCB Traces, Connectors or Cables<br>Z0 = 50<br>Rs = 267 ±1%<br>+ +<br>SubLVDS Output<br>SubLVDSE Rp = 121 ±1% 100 differential RT = 100 ±1% Sub-LVDS Recevier<br>SubLVDSEH<br>– –<br>Rs = 267 ±1%<br>Z0 = 50<br>0<br>iia On-chip Off-chip On-chip Off-chip<br>Figure 4.4. SubLVDS Output Interface<br>4.12.5. SLVS<br>**----- End of picture text -----**<br>
Scalable Low-Voltage Signaling (SLVS) is based on a point-to-point signaling method defined in the JEDEC JESD8-13 (SLVS-400) standard. This standard evolved from the traditional LVDS standard with smaller voltage swings and a lower common-mode voltage. The 200 mV (400 mV p-p) SLVS swing contributes to a reduction in power.
The CertusPro-NX devices receive SLVS differential input with the LVDS input buffer (Table 4.23). This LVDS input buffer is designed to cover wide input common mode range that can meet the SLVS input standard specified by the JEDEC standard.
|**Parameter**<br>~~a~~|**Description**<br>~~a~~|**Test Conditions**<br>~~a~~|**Min**<br>~~a~~|**Typ**<br>~~a~~|**Max**<br>~~a~~|**Unit**<br>~~a~~|
|---|---|---|---|---|---|---|
|VID<br>~~a~~|Input Differential Threshold Voltage<br>~~a~~|Over VICMrange<br>~~a~~|70<br>~~a~~|—<br>~~a~~|—<br>~~a~~|mV<br>~~a~~|
|VICM<br>~~a~~|Input Common Mode Voltage<br>~~a~~|Half the sum of the two Inputs<br>~~a~~|70<br>~~a~~|200<br>~~a~~|330<br>~~a~~|mV<br>~~a~~|
The SLVS output on the CertusPro-NX device is supported with the LVDS drivers found in Bank 3, Bank 4, and Bank 5. The LVDS driver on the CertusPro-NX device is a current controlled driver (Figure 4.5). It can be configured as LVDS driver or configured with the 100 Ω differential termination with center-tap set to VOCM at 200 mV. This means the differential output driver can be placed into bank with VCCIO = 1.2 V, 1.5 V, or 1.8 V, even if it is powered by VCCIO. See Table 4.24 for more details.
|**Table 4.24. SLVS Output DC Characteristics(Over Recommended Operating Conditions)**<br>**Parameter**<br>**Description**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>VCCIO<br>Bank VCCIO<br>—<br>–5%<br>1.2, 1.5,<br>1.8<br>+5%<br>V<br>VOD<br>Output Differential Voltage Swing<br>—<br>140<br>200<br>270<br>mV<br>VOCM<br>Output Common Mode Voltage<br>Half the sum of the two Outputs<br>150<br>200<br>250<br>mV<br>ZOS<br>Single-Ended Output Impedance<br>—<br>37.5<br>50<br>62.5<br>Ω<br>~~=~~|
|---|
|© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed atwww.latticesemi.com/legal.|
|All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.|
|FPGA-DS-02086-2.0<br>121|
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**CertusPro-NX Family Data Sheet**
**==> picture [370 x 174] intentionally omitted <==**
**----- Start of picture text -----**<br>
SLVS Receiver<br>100<br>Diff<br>SLVS Z0=50<br>On Chip SLVS Driver<br>LVDS Z0=50<br>**----- End of picture text -----**<br>
**Figure 4.5. SLVS Interface**
## **4.12.6. Soft MIPI D-PHY**
When Soft D-PHY is implemented inside the FPGA logic, the I/O interface needs to use sysI/O buffers to connect to external D-PHY pins.
The CertusPro-NX sysI/O provides support for SLVS, as described in SLVS section, plus the LVCMOS12 input/output buffers together to support the High Speed (HS) and Low Power (LP) modes as defined in MIPI Alliance Specification for D-PHY.
To support MIPI D-PHY with SLVS (LVDS) and LVCMOS12, the bank VCCIO cannot be set to 1.5 V or 1.8 V. It must connect to 1.2 V, or 1.1 V (Figure 4.6).
All other DC parameters are the same as listed in SLVS section. DC parameters for the LP driver and receiver are the same as listed in LVCMOS12.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**==> picture [475 x 664] intentionally omitted <==**
**----- Start of picture text -----**<br>
|||||||||
|---|---|---|---|---|---|---|---|
|LVCMOS12|
|LP Data_P|
|LPenable|
|HSenable|MIPI Receiver|
|100 Diff|
|+|+|
|HS Data|Z0=50|
|–|–|
|SLVS|
|—|>|
|LPenable|
|LP Data_N|
|LVCMOS12|
|hah|
|MIPI_LP_RX|
|On-Chip|
|RXLP_P|
|MIPI Driver|
|+|+|
|HS Data|Z0=50|
|–|–|
|LVDS|
|—|-|
|MIPI_LP_RX|
|RXLP_N|
|=<}|
|Figure 4.6. MIPI Interface|
|Table 4.25. Soft D-PHY Input Timing and Levelsput Timing and Levelsut Timing and Levelsg and Levels and Levels|
|Symbol|Description|Conditions|Min|Typ|Max|Unit|
|High Speed (Differential) Input DC Specifications|
|VCMRX(DC)|Common-mode Voltage in High-Speed Mode|—|70|—|330|mV|
|VIDTH|Differential Input HIGH Threshold|—|70|—|—|mV|
|VIDTL|Differential Input LOW Threshold|—|—|—|–70|mV|
|VIHHS|Input HIGH Voltage (for HS mode)|—|—|—|460|mV|
|VILHS|Input LOW Voltage|—|–40|—|—|mV|
|VTERM-EN|Single-ended voltage for HS Termination Enable|[4]|—|—|—|450|mV|
|ZID|Differential Input Impedance|—|80|100|125|Ω|
|High Speed (Differential) Input AC Specifications|
|ΔVCMRX(HF)|[1]|Common-mode Interference (> 450 MHz)|—|—|—|100|mV|
|ΔVCMRX(LF)|[2, 3]|Common-mode Interference (50 MHz – 450 MHz)|—|–50|—|50|mV|
|CCM|Common-mode Termination|—|60|pF|
|Low Power (Single-Ended) Input DC Specifications|
|VIH|Low Power Mode Input HIGH Voltage|—|820|—|—|mV|
|VIL|Low Power Mode Input LOW Voltage|—|—|—|480|mV|
|VIL-ULP|Ultra Low Power Input LOW Voltage|—|—|—|300|mV|
|VHYST|Low Power Mode Input Hysteresis|—|25|—|—|mV|
**----- End of picture text -----**<br>
**Table 4.25. Soft D-PHY Input Timing and Levelsput Timing and Levelsut Timing and Levelsg and Levels and Levels**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|**Symbol**|**Description**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|℮SPIKE|Input Pulse Rejection|—|—|—|300|V∙ps|
|TMIN-RX|Minimum Pulse Width Response|—|20|—|—|ns|
|VINT|Peak Interference Amplitude|—|—|—|200|mV|
|fINT|Interference Frequency|—|450|—|—|MHz|
**Notes** :
1. This is peak amplitude of sine wave modulated to the receiver inputs.
2. Input common-mode voltage difference compared to average common-mode voltage on the receiver inputs.
3. Exclude any static ground shift of 50 mV.
4. High Speed Differential RTERM is enabled when both DP and DN are below this voltage.
**Table 4.26. Soft D-PHY Output Timing and Levels**
|**Symbol**<br>~~sD~~|**Description**<br>~~sD~~|**Conditions**<br>~~sD~~|**Min**<br>~~sD~~<br>~~GO~~|**Typ**<br>~~sD~~<br>~~GO~~|**Max**<br>~~sD~~|**Unit**<br>~~sD~~|
|---|---|---|---|---|---|---|
|**High Speed(Differential) Output DC Specifications**<br>~~GO~~<br>~~pe~~|||||||
|VCMTX<br>~~GO~~|Common-mode Voltage in High-Speed Mode<br>~~GO~~|—<br>~~GO~~|150<br>~~GO~~|200<br>~~GO~~|250<br>~~GO~~|mV<br>~~GO~~|
||ΔVCMTX(1,0)|<br>~~a~~<br>~~a~~|VCMTXMismatch Between Differential HIGH<br>and LOW<br><br>|—<br><br>|—<br><br>~~DO~~<br>|—<br><br>~~DO~~<br>|7<br><br>|mV<br><br>|
||VOD|<br>~~aGO~~<br>~~a~~|Output Differential Voltage<br>~~GO~~<br>||D-PHY-P – D-PHY-N|<br>~~GO~~<br>|130<br>~~GO~~<br>~~DO~~<br>|200<br>~~GO~~<br>~~DO~~<br>|270<br>~~GO~~<br>|mV<br>~~GO~~<br>|
||ΔVOD|<br>~~GO~~<br>~~a~~|VODMismatch Between Differential HIGH and<br>LOW<br>~~GO~~<br>|—<br>~~GO~~<br>|—<br>~~GO~~<br>~~DO~~<br><br>~~DO~~|—<br>~~GO~~<br>~~DO~~<br><br>~~DO~~|56<br>~~GO~~<br>|mV<br>~~GO~~<br>|
|VOHHS<br>~~aGO~~|Single-Ended Output HIGH Voltage<br>~~GO~~|—<br>~~GO~~|—<br>~~DO~~<br>~~GO~~<br>~~DO~~|—<br>~~DO~~<br>~~GO~~<br>~~DO~~|435<br>~~GO~~|mV<br>~~GO~~|
|ZOS<br>~~GO~~<br>~~GO~~|Single Ended Output Impedance<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|37.5<br>~~GO~~<br>~~DO~~<br>~~GO~~|50<br>~~GO~~<br>~~DO~~<br>~~GO~~|80<br>~~GO~~<br>~~GO~~|Ω<br>~~GO~~<br>~~GO~~|
|ΔZOS<br>~~GO~~|ZOSmismatch<br>~~GO~~|—<br>~~GO~~|—<br>~~GO~~|—<br>~~GO~~|20<br>~~GO~~|%<br>~~GO~~|
|**High Speed(Differential) Output AC Specifications**|||||||
|ΔVCMTX(LF)<br>~~eC~~<br>~~a~~|Common-Mode Variation, 50 MHz – 450 MHz<br>~~eC~~|—<br>~~eC~~|—<br>~~eC~~<br>~~DO~~|—<br>~~eC~~<br>~~DO~~|25<br>~~eC~~|mVRMS<br>~~eC~~|
|ΔVCMTX(HF)<br>~~eC~~<br>~~GO~~<br>~~a~~|Common-Mode Variation, above 450 MHz<br>~~eC~~<br>~~GO~~|—<br>~~eC~~<br>~~GO~~|—<br>~~eC~~<br>~~GO~~<br>~~DO~~|—<br>~~eC~~<br>~~GO~~<br>~~DO~~|15<br>~~eC~~<br>~~GO~~|mVRMS<br>~~eC~~<br>~~GO~~|
|tR<br>~~GO~~<br>~~a~~|Output 20% - 80% Rise Time<br>~~GO~~|0.08 Gbps ≤ tR≤ 1.00 Gbps<br>~~GO~~|—<br>~~GO~~<br>~~DO~~|—<br>~~GO~~<br>~~DO~~|0.30<br>~~GO~~|UI<br>~~GO~~|
|tF<br>~~a~~|Output 80% - 20% Fall Time<br>~~ee~~|0.08 Gbps ≤ tF≤ 1.00 Gbps<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|0.45<br>~~ee~~|UI<br>~~ee~~|
|**Low Power(Single-Ended) Output DC Specifications**|||||||
|VOH<br>~~Ce~~|Low Power Mode Output HIGH Voltage<br>~~Ce~~|0.08 Gbps – 1.5 Gbps<br>~~GG~~|1.07<br>~~GG~~|1.2<br>~~GG~~<br>~~I~~|1.3<br>~~I~~|V|
|VOL<br>~~Ce~~<br>~~sO~~|Low Power Mode Input LOW Voltage<br>~~Ce~~<br>~~sO~~|—<br>~~GG~~<br>~~sO~~|–50<br>~~GG~~<br>~~sO~~|—<br>~~GG~~<br>~~sO~~<br>~~I~~|50<br>~~sO~~<br>~~I~~|mV<br>~~sO~~|
|ZOLP<br>~~sO~~<br>~~GO~~|Output Impedance in Low Power Mode<br>~~sO~~<br>~~GO~~|—<br>~~sO~~<br>~~GO~~|110<br>~~sO~~<br>~~GO~~|—<br>~~sO~~<br>~~I~~<br>~~GO~~|—<br>~~sO~~<br>~~I~~<br>~~GO~~|Ω<br>~~sO~~<br>~~GO~~|
|**Low Power(Single-Ended) Output AC Specifications**<br>~~GO~~<br>~~pe~~<br>~~OO~~|||||||
|tRLP<br>~~eG~~|15% - 85% Rise Time<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~<br>~~OO~~|—<br>~~eG~~<br>~~OO~~|25<br>~~eG~~<br>~~OO~~|ns<br>~~eG~~|
|tFLP<br>~~GC~~<br>~~Pf,~~|85% - 15% Fall Time<br>~~GC~~<br>~~Pf,~~|—<br>~~GC~~|—<br>~~OO~~<br>~~GC~~|—<br>~~OO~~<br>~~GC~~<br>~~I~~|25<br>~~OO~~<br>~~GC~~<br>~~I~~|ns<br>~~GC~~|
|tREOT<br>~~GC~~<br>~~sO~~<br>~~Pf,~~|HS – LP Mode Rise and Fall Time, 30% - 85%<br>~~GC~~<br>~~sO~~<br>~~Pf,~~<br>~~Ur~~|—<br>~~GC~~<br>~~sO~~<br>~~UrEE~~|—<br>~~GC~~<br>~~sO~~<br>~~EE~~|—<br>~~GC~~<br>~~sO~~<br>~~I~~|35<br>~~GC~~<br>~~sO~~<br>~~I~~|ns<br>~~GC~~<br>~~sO~~|
|TLP-PULSE-TX<br>~~sO~~<br>~~Pf,~~|Pulse Width of the LP Exclusive-OR Clock<br>~~sO~~<br>~~Pf,~~<br>~~Ur~~|First LP XOR clock pulse<br>after STOP state or Last<br>pulse before STOP state<br>~~sO~~<br>~~UrEE~~|40<br>~~sO~~<br>~~EE~~|—<br>~~sO~~<br>~~I~~|—<br>~~sO~~<br>~~I~~|ns<br>~~sO~~|
|||All otherpulses<br>~~UrEE~~|20<br>~~EE~~|—<br>~~I~~|—<br>~~I~~|ns|
|TLP-PER-TX<br>~~Pf,~~<br>~~RG~~|Period of the LP Exclusive-OR Clock<br>~~Pf,~~<br>~~Ur~~<br>~~RG~~|—<br>~~Ur EE~~<br>~~RG~~|90<br>~~EE~~<br>~~RG~~|—<br>~~I~~<br>~~RG~~|—<br>~~I~~<br>~~RG~~|ns<br>~~RG~~|
|CLOAD<br>~~RG~~<br>~~FO~~|Load Capacitance<br>~~RG~~<br>~~FO~~|—<br>~~RG~~<br>~~FO~~|0<br>~~RG~~<br>~~FO~~|—<br>~~RG~~<br>~~FO~~|70<br>~~RG~~<br>~~FO~~|pF<br>~~RG~~<br>~~FO~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
**Table 4.27. Soft D-PHY Clock Signal Specification**
|**Symbol**|**Description**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Clock Signal Specification**|||||||
|UI Instantaneous|UIINST|—|—|—|12.5|ns|
|UI Variation|∆UI|UI ≥ 1 ns|–10%|—|10%|UI|
|||0.667 ns < UI < 1 ns|–5%|—|5%|UI|
|**Symbol**<br>~~——=~~|**Description**<br>~~——=~~|**Conditions**<br>~~——=~~|**Min**<br>~~——=~~|**Typ**<br>~~——=~~|**Max**<br>~~——=~~|**Unit**<br>~~——=~~|
|---|---|---|---|---|---|---|
|**Data-Clock Timing Specifications**<br>~~——=~~|||||||
|TSKEW[TX]<br>~~——=~~|Data to Clock Skew<br>~~——=~~|0.08 Gbps ≤ TSKEW[TX]≤ 1.00 Gbps<br>~~——=~~|–0.15<br>~~——=~~|—<br>~~——=~~|0.15<br>~~——=~~|UIINST<br>~~——=~~|
|TSETUP[RX]<br>~~——=~~|Input Data SetupBefore CLK<br>~~——=~~|0.08 Gbps ≤ TSETUP[RX]≤ 1.00 Gbps<br>~~——=~~|0.24<br>~~——=~~|—<br>~~——=~~|—<br>~~——=~~|UI<br>~~——=~~|
|THOLD[RX]<br>~~——=~~|Input Data Hold After CLK<br>~~——=~~|0.08 Gbps ≤ THOLD[RX]≤ 1.00 Gbps<br>~~——=~~|0.23<br>~~——=~~|—<br>~~——=~~|—<br>~~——=~~|UI<br>~~——=~~|
## **4.12.7. Differential HSTL15D (As Output)**
Differential HSTL outputs are implemented as a pair of complementary single-ended HSTL outputs.
## **4.12.8. Differential SSTL135D, SSTL15D (As Output)**
Differential SSTL is used for differential clock in DDR3/DDR3L memory interface. All differential SSTL outputs are implemented as a pair of complementary single-ended SSTL outputs. All allowable single-ended output classes (class I and class II) are supported.
## **4.12.9. Differential HSUL12D (As Output)**
Differential HSUL is used for differential clock in LPDDR2 memory interface. All differential HSUL outputs are implemented as a pair of complementary single-ended HSUL12 outputs. All allowable single-ended drive strengths are supported.
## **4.12.10. Differential LVSTLD (As Output)**
Differential LVSTL is used for differential clock in LPDDR4 memory interface. All differential LVSTL outputs are implemented as a pair of complementary single-ended LVSTL outputs. All allowable single-ended drive strengths are supported.
## **4.12.11. Differential LVCMOS25D, LVCMOS33D, LVTTL33D (As Output)**
Differential LVCMOS and LVTTL outputs are implemented as a pair of complementary single-ended outputs. All allowable single-ended output drive strengths are supported.
## **4.13. Maximum sysI/O Buffer Speed**
Over recommended operating conditions.
**Table 4.29. Maximum I/O Buffer Speed[1, 2, 3, 4, 7 ]**
|**Buffer**<br>~~—————~~|**Description**<br>~~—————~~|**Banks**<br>~~—————~~|**Max**<br>~~—————~~|**Unit**<br>~~—————~~|
|---|---|---|---|---|
|**Maximum sysI/O Input Frequency**<br>~~—————~~|||||
|**Single-Ended**<br>~~—————~~|||||
|LVCMOS33<br>~~—————~~|LVCMOS33, VCCIO = 3.3 V<br>~~—————~~|0, 1, 2, 6, 7<br>~~—————~~|200<br>~~—————~~|MHz<br>~~—————~~|
|LVTTL33<br>~~—————~~|LVTTL33, VCCIO = 3.3 V<br>~~—————~~|0, 1, 2, 6, 7<br>~~—————~~|200<br>~~—————~~|MHz<br>~~—————~~|
|LVCMOS25<br>~~—————~~|LVCMOS25, VCCIO = 2.5 V<br>~~—————~~|0, 1, 2, 6, 7<br>~~—————~~|200<br>~~—————~~|MHz<br>~~—————~~|
|LVCMOS185<br>~~—————~~|LVCMOS18, VCCIO = 1.8 V<br>~~—————~~|0, 1, 2, 6, 7<br>~~—————~~|200<br>~~—————~~|MHz<br>~~—————~~|
|LVCMOS18H<br>~~—————~~|LVCMOS18, VCCIO = 1.8 V<br>~~—————~~|3, 4, 5<br>~~—————~~|200<br>~~—————~~|MHz<br>~~—————~~|
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**CertusPro-NX Family Data Sheet**
|**Buffer**<br>~~GO~~|**Description**<br>~~GO~~|**Banks**<br>~~GO~~<br>~~CO~~|**Max**<br>~~GO~~<br>~~CO~~|**Unit**<br>~~GO~~|
|---|---|---|---|---|
|LVCMOS155<br>~~eG~~|LVCMOS15, VCCIO = 1.5 V<br>~~eG~~|0, 1, 2, 6, 7<br>~~eG~~<br>~~CO~~|100<br>~~eG~~<br>~~CO~~|MHz<br>~~eG~~|
|LVCMOS15H5<br>~~GC~~|LVCMOS15, VCCIO = 1.5 V<br>~~GC~~|3, 4, 5<br>~~CO~~<br>~~GC~~|150<br>~~CO~~<br>~~GC~~|MHz<br>~~GC~~|
|LVCMOS125<br>~~GG~~<br>~~a~~|LVCMOS12, VCCIO = 1.2 V<br>~~GG~~<br>~~Ge~~|0, 1, 2, 6, 7<br>~~GG~~<br>~~OO~~|50<br>~~GG~~<br>~~OO~~|MHz<br>~~GG~~|
|LVCMOS12H5<br>~~a~~<br>~~a~~|LVCMOS12, VCCIO = 1.2 V<br>~~Ge~~<br>~~Ge~~|3, 4, 5<br>~~OO~~<br>~~OO~~|100<br>~~OO~~<br>~~OO~~|MHz|
|LVCMOS105<br>~~a~~<br>~~a~~|LVCMOS 1.0, VCCIO = 1.2 V<br>~~Ge~~<br>~~Ge~~|0, 1, 2, 6, 7<br>~~OO~~<br>~~OO~~<br>~~GO~~|50<br>~~OO~~<br>~~OO~~<br>~~GO~~|MHz|
|LVCMOS10H5<br>~~a~~<br>~~eG~~|LVCMOS 1.0, VCCIO = 1.0 V<br>~~Ge~~<br>~~eG~~|3, 4, 5<br>~~OO~~<br>~~eG~~<br>~~GO~~|50<br>~~OO~~<br>~~eG~~<br>~~GO~~|MHz<br>~~eG~~|
|LVCMOS10R<br>~~GC~~|LVCMOS 1.0, VCCIO independent<br>~~GC~~|3, 4, 5<br>~~GO~~<br>~~GC~~|50<br>~~GO~~<br>~~GC~~|MHz<br>~~GC~~|
|SSTL15_I, SSTL15_II<br>~~GC~~|SSTL_15, VCCIO = 1.5 V<br>~~GC~~|3, 4, 5<br>~~GC~~|1066<br>~~GC~~|Mbps<br>~~GC~~|
|SSTL135_I, SSTL135_II<br>~~GG~~<br>~~a~~|SSTL_135, VCCIO = 1.35 V<br>~~GG~~<br>~~Ge~~|3, 4, 5<br>~~GG~~<br>~~OO~~|1066<br>~~GG~~<br>~~OO~~|Mbps<br>~~GG~~|
|LVSTL_I, LVSTL_II<br>~~a~~|LVSTL, VCCIO = 1.1 V<br>~~Ge~~|3, 4, 5<br>~~OO~~<br>~~GO~~|1066<br>~~OO~~<br>~~GO~~|Mbps|
|HSUL12<br>~~a~~<br>~~eG~~|HSUL_12, VCCIO = 1.2 V<br>~~Ge~~<br>~~eG~~|3, 4, 5<br>~~OO~~<br>~~eG~~<br>~~GO~~|1066<br>~~OO~~<br>~~eG~~<br>~~GO~~|Mbps<br>~~eG~~|
|HSTL15<br>~~GC~~|HSTL15, VCCIO = 1.5 V<br>~~GC~~|3, 4, 5<br>~~GO~~<br>~~GC~~<br>~~CO~~|250<br>~~GO~~<br>~~GC~~<br>~~CO~~|Mbps<br>~~GC~~|
|MIPI D-PHY(LP Mode)<br>~~eG~~|MIPI, Low Power Mode, VCCIO = 1.2 V<br>~~eG~~|3, 4, 5<br>~~eG~~<br>~~CO~~|10<br>~~eG~~<br>~~CO~~|Mbps<br>~~eG~~|
|**Differential**<br>~~CO~~<br>~~BSa~~|||||
|LVDS<br>~~BS~~|LVDS, VCCIOindependent, Wire Bondpackage<br>~~a~~|3, 4, 5<br>~~a~~|1250<br>~~a~~|Mbps<br>~~a~~|
||LVDS, VCCIOindependent, FlipChip package<br>~~a~~|3, 4, 5<br>~~a~~<br>~~ee~~|1500<br>~~a~~<br>~~ee~~|Mbps<br>~~a~~|
|subLVDS<br>~~BS ~~|subLVDS, VCCIOindependent, Wire Bond<br>package<br> ~~a~~<br>~~ee~~|3, 4, 5<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|1250<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~a~~<br>~~ee~~|
||subLVDS, VCCIOindependent, Flip Chip<br>package<br>~~ee~~<br>~~ee~~|3, 4, 5<br>~~ee~~<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|1500<br>~~ee~~<br> ~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~<br>~~ee~~|
|SLVS|SLVS similar to MIPI HS, VCCIOindependent<br>Wire Bondpackage<br>~~ee~~|3, 4, 5<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|1250<br> ~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~|
||SLVS similar to MIPI HS, VCCIOindependent<br>FlipChip package<br>~~ee~~<br>~~ee~~|3, 4, 5<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|1500<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~<br>~~ee~~|
|MIPI D-PHY (HS Mode)<br>~~a~~|MIPI, High Speed Mode, VCCIO= 1.2 V3<br>Wire Bondpackage<br>~~ee~~<br>~~ee~~|3, 4, 5<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|1250<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~<br>~~ee~~|
||MIPI, High Speed Mode, VCCIO= 1.2 V3<br>FlipChip package<br>~~ee~~<br>~~ee~~|3, 4, 5<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|15008<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~<br>~~ee~~|
|SSTL15D<br>~~a~~|Differential SSTL15, VCCIOindependent<br>~~GC~~|3, 4, 5<br>~~ee~~<br>~~GC~~|1066<br>~~ee~~<br>~~GC~~|Mbps<br>~~GC~~|
|SSTL135D<br>~~a~~|Differential SSTL135, VCCIOindependent<br>~~GC~~|3, 4, 5<br>~~GC~~|1066<br>~~GC~~|Mbps<br>~~GC~~|
|LVSTLD_I, LVSTLD_II<br>~~CC~~|Differential LVSTL, VCCIOindependent<br>~~CC~~|3, 4, 5<br>~~CC~~|1066<br>~~CC~~|Mbps<br>~~CC~~|
|HUSL12D<br>~~CC~~<br>~~eG~~|Differential HSUL12, VCCIOindependent<br>~~CC~~<br>~~eG~~|3, 4, 5<br>~~CC~~<br>~~eG~~|1066<br>~~CC~~<br>~~eG~~|Mbps<br>~~CC~~<br>~~eG~~|
|HSTL15D<br>~~eG~~<br>~~eG~~|Differential HSTL15, VCCIOindependent<br>~~eG~~<br>~~eG~~|3, 4, 5<br>~~eG~~<br>~~eG~~|250<br>~~eG~~<br>~~eG~~|Mbps<br>~~eG~~<br>~~eG~~|
|**Maximum sysI/O Output Frequency**<br>~~eG~~|||||
|**Single-Ended**|||||
|LVCMOS33(all drive strengths)<br>~~pf~~|LVCMOS33, VCCIO = 3.3 V<br>~~pf~~|0, 1, 2, 6, 7<br>~~pf~~|200<br>~~pf~~|MHz<br>~~pf~~|
|LVCMOS33(RS50)<br>~~pf~~<br>~~eG~~|LVCMOS33, VCCIO = 3.3 V, RSERIES= 50 Ω<br>~~pf~~<br>~~eG~~|0, 1, 2, 6, 7<br>~~pf~~<br>~~eG~~|200<br>~~pf~~<br>~~eG~~|MHz<br>~~pf~~<br>~~eG~~|
|LVTTL33(all drive strengths)<br>~~eG~~<br>~~eG~~|LVTTL33, VCCIO = 3.3 V<br>~~eG~~<br>~~eG~~|0, 1, 2, 6, 7<br>~~eG~~<br>~~eG~~|200<br>~~eG~~<br>~~eG~~|MHz<br>~~eG~~<br>~~eG~~|
|LVTTL33(RS50)<br>~~eG~~<br>~~GC~~|LVTTL33, VCCIO = 3.3 V, RSERIES= 50 Ω<br>~~eG~~<br>~~GC~~|0, 1, 2, 6, 7<br>~~eG~~<br>~~GC~~|200<br>~~eG~~<br>~~GC~~|MHz<br>~~eG~~<br>~~GC~~|
|LVCMOS25(all drive strengths)<br>~~a~~|LVCMOS25, VCCIO = 2.5 V<br>~~GC~~|0, 1, 2, 6, 7<br>~~GC~~|200<br>~~GC~~|MHz<br>~~GC~~|
|LVCMOS25(RS50)<br>~~a~~|LVCMOS25, VCCIO = 2.5 V, RSERIES= 50 Ω<br>~~GG~~|0, 1, 2, 6, 7<br>~~GG~~|200<br>~~GG~~|MHz<br>~~GG~~|
|LVCMOS18(all drive strengths)<br>~~a~~<br>~~a~~|LVCMOS18, VCCIO = 1.8 V<br>~~GG~~<br>~~a~~<br>~~G~~|0, 1, 2, 6, 7<br>~~GG~~<br>~~G~~|200<br>~~GG~~|MHz<br>~~GG~~|
|LVCMOS18(RS50)<br>~~a~~<br>~~a~~|LVCMOS18, VCCIO = 1.8 V, RSERIES= 50 Ω<br>~~a~~<br>~~G~~<br>~~a~~<br>~~G~~|0, 1, 2, 6, 7<br>~~G~~<br>~~GO~~|200<br>~~GO~~|MHz|
|LVCMOS18H(all drive strengths)<br>~~a~~<br>~~Ge~~|LVCMOS18, VCCIO = 1.8 V<br>~~a~~<br>~~G~~<br>~~Ge~~|3, 4, 5<br>~~Ge~~<br>~~GO~~<br>~~CO~~|200<br>~~Ge~~<br>~~GO~~<br>~~CO~~|MHz<br>~~Ge~~|
|LVCMOS18H(RS50)<br>~~Ge~~|LVCMOS18, VCCIO = 1.8 V, RSERIES= 50 Ω<br>~~Ge~~|3, 4, 5<br>~~GO~~<br>~~Ge~~<br>~~CO~~<br>~~CO~~|200<br>~~GO~~<br>~~Ge~~<br>~~CO~~<br>~~CO~~|MHz<br>~~Ge~~|
|LVCMOS15(all drive strengths)<br>~~Ge~~|LVCMOS15, VCCIO = 1.5 V<br>~~Ge~~|0, 1, 2, 6, 7<br>~~CO~~<br>~~Ge~~<br>~~CO~~|100<br>~~CO~~<br>~~Ge~~<br>~~CO~~|MHz<br>~~Ge~~|
|LVCMOS15H(all drive strengths)<br>~~OO~~|LVCMOS15, VCCIO = 1.5 V<br>~~OO~~|3, 4, 5<br>~~CO~~<br>~~OO~~|150<br>~~CO~~<br>~~OO~~|MHz<br>~~OO~~|
|LVCMOS12(all drive strengths)<br>~~OO~~<br>~~a~~|LVCMOS12, VCCIO = 1.2 V<br>~~OO~~<br>~~G~~|0, 1, 2, 6, 7<br>~~OO~~|50<br>~~OO~~|MHz<br>~~OO~~|
|LVCMOS12H(all drive strengths)<br>~~a~~<br>~~GD~~|LVCMOS12, VCCIO = 1.2 V<br>~~G~~<br>~~GD~~|3, 4, 5<br>~~GD~~|100<br>~~GD~~|MHz<br>~~GD~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|**Buffer**<br>~~Ge~~|**Description**<br>~~Ge~~|**Banks**<br>~~Ge~~<br>~~CO~~|**Max**<br>~~Ge~~<br>~~CO~~|**Unit**<br>~~Ge~~|
|---|---|---|---|---|
|LVCMOS10H(all drive strengths)<br>~~eG~~|LVCMOS12, VCCIO = 1.2 V<br>~~eG~~|3, 4, 5<br>~~eG~~<br>~~CO~~|50<br>~~eG~~<br>~~CO~~|MHz<br>~~eG~~|
|SSTL15_I, SSTL15_II<br>~~GO~~|SSTL_15, VCCIO = 1.5 V<br>~~GO~~|3, 4, 5<br>~~CO~~<br>~~GO~~|1066<br>~~CO~~<br>~~GO~~|Mbps<br>~~GO~~|
|SSTL135_I, SSTL135_II<br>~~a~~|SSTL_135, VCCIO = 1.35 V<br>~~GO~~|3, 4, 5<br>~~GO~~|1066<br>~~GO~~|Mbps<br>~~GO~~|
|LVSTL_I, LVSTL_II<br>~~a~~|LVSTL, VCCIO = 1.1 V<br>~~a~~<br>~~O~~|3, 4, 5<br>~~O~~|1066|Mbps|
|HSUL12(all drive strengths)<br>~~a~~|HSUL_12, VCCIO = 1.2 V<br>~~a~~<br>~~O~~|3, 4, 5|1066|Mbps|
|HSTL15<br>~~GC~~|HSTL15, VCCIO = 1.5 V<br>~~GC~~|3, 4, 5<br>~~GC~~<br>~~FO~~|250<br>~~GC~~<br>~~FO~~|Mbps<br>~~GC~~|
|MIPI D-PHY(LP Mode)<br>~~eG~~|MIPI, Low Power Mode, VCCIO = 1.2 V<br>~~eG~~|3, 4, 5<br>~~eG~~<br>~~FO~~|10<br>~~eG~~<br>~~FO~~|Mbps<br>~~eG~~|
|**Differential**<br>~~FO~~|||||
|LVDS<br>~~a ~~|LVDS, VCCIO= 1.8 V Wire Bondpackage<br>~~a~~|3, 4, 5<br>~~a~~|1250<br>~~a~~|Mbps<br>~~a~~|
||LVDS, VCCIO= 1.8 V FlipChip package<br> ~~a~~|3, 4, 5<br>~~a~~|1500<br>~~a~~|Mbps<br>~~a~~|
|LVDS25E6<br>~~GC~~|LVDS25, Emulated, VCCIO = 2.5 V<br>~~GC~~|0, 1, 2, 6, 7<br>~~GC~~|400<br>~~GC~~|Mbps<br>~~GC~~|
|SubLVDSE6<br>~~GO~~|subLVDS, Emulated, VCCIO= 1.8 V<br>~~GO~~|0, 1, 2, 6, 7<br>~~GO~~|400<br>~~GO~~|Mbps<br>~~GO~~|
|SubLVDSEH6<br>~~GC~~|subLVDS, Emulated, VCCIO= 1.8 V<br>~~GC~~|3, 4, 5<br>~~GC~~|800<br>~~GC~~|Mbps<br>~~GC~~|
|SLVS|SLVS similar to MIPI, VCCIO= 1.2 V<br>Wire Bondpackage|3, 4, 5<br>~~ee~~|1250<br>~~ee~~|Mbps|
||SLVS similar to MIPI, VCCIO= 1.2 V<br>FlipChip package<br>~~ee~~|3, 4, 5<br>~~ee~~<br>~~ee~~|1500<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~|
|MIPI D-PHY (HS Mode)<br>~~ee~~|MIPI, High Speed Mode, VCCIO= 1.2 V3<br>Wire Bondpackage<br>~~ee~~|3, 4, 5<br>~~ee~~<br>~~ee~~<br>~~ee~~|1250<br>~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~|
||MIPI, High Speed Mode, VCCIO= 1.2 V3<br>FlipChip package<br>~~ee~~<br>~~ee~~|3, 4, 5<br>~~ee~~<br>~~ee~~<br>~~ee~~|15008<br>~~ee~~<br>~~ee~~<br>~~ee~~|Mbps<br>~~ee~~<br>~~ee~~|
|SSTL15D<br>~~GDC~~|Differential SSTL15, VCCIO= 1.5 V<br>~~GDC~~|3, 4, 5<br>~~ee~~<br>~~GDC~~|1066<br>~~ee~~<br>~~GDC~~|Mbps<br>~~GDC~~|
|SSTL135D<br>~~GDC~~<br>~~Ge~~<br>~~ee~~|Differential SSTL135, VCCIO= 1.35 V<br>~~GDC~~<br>~~Ge~~<br>~~GC~~|3, 4, 5<br>~~GDC~~<br>~~Ge~~<br>~~GC~~|1066<br>~~GDC~~<br>~~Ge~~<br>~~GC~~|Mbps<br>~~GDC~~<br>~~Ge~~|
|LVSTLD<br>~~Ge~~<br>~~ee~~|Differential LVSTL, VCCIO= 1.1 V<br>~~Ge~~<br>~~GC~~|3, 4, 5<br>~~Ge~~<br>~~GC~~|1066<br>~~Ge~~<br>~~GC~~|Mbps<br>~~Ge~~|
|HUSL12D<br>~~ee~~<br>~~GC~~|Differential HSUL12, VCCIO= 1.2 V<br>~~GC~~<br>~~GC~~|3, 4, 5<br>~~GC~~<br>~~GC~~|1066<br>~~GC~~<br>~~GC~~|Mbps<br>~~GC~~|
|HSTL15D<br>~~a~~|Differential HSTL15, VCCIO= 1.5 V<br>~~GD~~|3, 4, 5<br>~~GD~~|250<br>~~GD~~|Mbps<br>~~GD~~|
**Notes** :
1. Maximum I/O speed is the maximum switching rate of the I/O operating within the guidelines of the defining standard. The actual interface speed performance using the I/O also depends on other factors, such as internal and external timing.
2. These numbers are characterized but not tested on every device.
3. Performance is specified in MHz, as defined in clock rate when the sysI/O is used as pin. For data rate performance, this can be converted to Mbps, which equals to 2 times the clock rate.
4. LVCMOS and LVTTL are measured with load specified in Table 4.50.
5. These LVCMOS inputs can be placed in different VCCIO voltage. Performance may vary. Please refer to Lattice Design software.
6. These emulated outputs performance is based on externally properly terminated as described in the LVDS25E (Output Only) and SubLVDSE/SubLVDSEH (Output Only) sections.
7. All speeds are measured with fast slew.
8. Subject to verification when package becomes available.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
127
**CertusPro-NX Family Data Sheet**
## **4.14. Typical Building Block Function Performance**
Following building block functions (Table 4.30 and Table 4.31) can be generated using Lattice Design Software tool. Exact performance may vary with the device and the design software tool version. The design software tool uses internal parameters that have been characterized but are not tested on every device.
## **Table 4.30. Pin-to-Pin Performance[1]**
|**Function**|**Typ. @ VCC = 1.0 V**|**Unit**|
|---|---|---|
|16-bit Decoder(I/O configured with LVCMOS18, Left and Right Banks)|5.5|ns|
|16-bit Decoder(I/O configured with HSTL15_I, Bottom Banks)|5.1|ns|
|16:1 Mux(I/O configured with LVCMOS18, Left and Right Banks)|6|ns|
|16:1 Mux(I/O configured with HSTL15_I, Bottom Banks)|6.1|ns|
## **Note** :
1. These functions are generated using Lattice Radiant Design Software. Exact performance may vary with the device and the design software tool version. The design software tool uses internal parameters that have been characterized but are not tested on every device.
**Table 4.31. Register-to-Register Performance[1, 3, 4]**
|**Function**<br>~~a~~|**Typ. @ VCC = 1.0 V**<br>~~a~~|**Unit**<br>~~a~~|
|---|---|---|
|**Basic Functions**<br>~~a~~|||
|16-bit Adder<br>~~a~~|5002<br>~~a~~|MHz<br>~~a~~|
|32-bit Adder<br>~~a~~|496<br>~~a~~|MHz<br>~~a~~|
|16-bit Counter<br>~~a~~|402<br>~~a~~|MHz<br>~~a~~|
|32-bit Counter<br>~~eC~~|371<br>~~eC~~|MHz<br>~~eC~~|
|**Embedded Memory Functions**<br>~~eC~~|||
|512 × 36 Single Port RAM, with Output Register<br>~~a~~|5002<br>~~a~~|MHz<br>~~a~~|
|1024 × 18 True-Dual Port RAM usingsame clock, with EBR Output Registers<br>~~a~~|5002<br>~~a~~<br>~~ee~~|MHz<br>~~a~~|
|1024 × 18 True-Dual Port RAM using asynchronous clocks, with EBR Output<br>Registers<br>~~ee~~|5002<br>~~ee~~<br>~~ee~~|MHz<br>~~ee~~|
|**Large Memory Functions**<br>~~ee~~<br>~~pt~~|||
|32 k × 32 Single Port RAM, with Output Register<br>~~a~~|375<br>~~a~~|MHz<br>~~a~~|
|32 k × 32 Single Port RAM with ECC, with Output Register<br>~~a~~<br>~~a~~|350<br>~~a~~<br>~~a~~|MHz<br>~~a~~<br>~~a~~|
|32 k × 32 True-Dual Port RAM usingsame clock, with Output Registers<br>~~a~~<br>~~a~~|200<br>~~a~~<br>~~a~~|MHz<br>~~a~~<br>~~a~~|
|**Distributed Memory Functions**<br>~~a~~|||
|16 × 4 Single Port RAM(One PFU)<br>~~a~~|5002<br>~~a~~|MHz<br>~~a~~|
|16 × 2 Pseudo-Dual Port RAM(One PFU)<br>~~a~~|5002<br>~~a~~|MHz<br>~~a~~|
|16 × 4 Pseudo-Dual Port(Two PFUs)<br>~~DO~~|5002<br>~~DO~~|MHz<br>~~DO~~|
|**DSP Functions**<br>~~DO~~|||
|9 × 9 Multiplier with Input/Output Registers<br>~~a~~|340<br>~~a~~|MHz<br>~~a~~|
|18 × 18 Multiplier with Input/Output Registers<br>~~a~~|260<br>~~a~~|MHz<br>~~a~~|
|36 × 36 Multiplier with Input/Output Registers<br>~~a~~|184<br>~~a~~|MHz<br>~~a~~|
|MAC 18 × 18 with Input/Output Registers<br>~~DO~~|189<br>~~DO~~|MHz<br>~~DO~~|
|MAC 18 × 18 with Input/Pipelined/Output Registers<br>~~DO~~<br>~~a~~|260<br>~~DO~~<br>~~a~~|MHz<br>~~DO~~<br>~~a~~|
|MAC 36 × 36 with Input/Output Registers<br>~~a~~<br>~~a~~|111<br>~~a~~<br>~~a~~|MHz<br>~~a~~<br>~~a~~|
|MAC 36 × 36 with Input/Pipelined/Output Registers<br>~~a~~|145<br>~~a~~|MHz<br>~~a~~|
1. The Clock port is configured with LVDS I/O type. Performance Grade: 8_High-Performance_1.0V.
2. Limited by the Minimum Pulse Width of the component
3. These functions are generated using Lattice Radiant design software. Exact performance may vary with the device and the design software tool version. The design software tool uses internal parameters that have been characterized but are not tested on every device.
4. For the Pipelined designs, the number of pipeline stages used are 2.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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## **4.15. Derating Timing Tables**
Logic timing provided in the following sections of this data sheet and the Lattice Radiant design software are worst case numbers in the operating range. Actual delays at nominal temperature and voltage for best case process can be much better than the values given in the tables. The Lattice Radiant design software can provide logic timing numbers at a particular temperature and voltage.
## **4.16. External Switching Characteristics**
Over recommended automotive operating conditions.
**Table 4.32. External Switching Characteristics (VCC = 1.0 V)**
|**Parameter**<br>~~a~~|**Description**<br>~~a~~|**–8**<br>~~a~~<br>~~te~~|**–8**<br>~~a~~<br>~~te~~|**–7**<br>~~a~~<br>~~teee~~|**–7**<br>~~a~~<br>~~teee~~|**Unit**<br>~~a~~|
|---|---|---|---|---|---|---|
|||**Min**<br>~~a~~<br>~~te~~|**Max**<br>~~a~~<br>~~te~~|**Min**<br>~~a~~<br>~~te~~|**Max**<br>~~a~~<br>~~ee~~||
|**Clocks**<br>~~te ee~~|||||||
|**Primary Clock**<br>~~ee~~|||||||
|fMAX_PRI<br>~~ee~~|Frequencyfor PrimaryClock<br>~~ee~~|—<br>~~ee~~|325.2<br>~~ee~~|—<br>~~ee~~|276<br>~~ee~~|MHz<br>~~ee~~|
|tW_PRI<br>~~ee~~<br>~~Ce~~|Clock Pulse Width for PrimaryClock<br>~~ee~~<br>~~Ce~~|1.322<br>~~ee~~<br>~~GG~~|—<br>~~ee~~<br>~~GG~~|1.558<br>~~ee~~<br>~~GG~~|—<br>~~ee~~|ns<br>~~ee~~|
|tSKEW_PRI5<br>~~GG~~|PrimaryClock Skew Within a Device<br>~~GG~~|—<br>~~GG~~|554<br>~~GG~~|—<br>~~GG~~|653<br>~~GG~~|ps<br>~~GG~~|
|**Edge Clock**<br>~~**G**G~~<br>~~fe~~|||||||
|fMAX_EDGE<br>~~Ge~~<br>~~fe~~|Frequencyfor Edge Clock Tree<br>~~Ge~~<br>~~fe~~|—<br>~~Ge~~<br>~~**G**G~~|650.4<br>~~Ge~~<br>~~G~~|—<br>~~Ge~~|551.7<br>~~Ge~~|MHz<br>~~Ge~~|
|tW_EDGE<br>~~Ge~~<br>~~fe~~|Clock Pulse Width for Edge Clock<br>~~Ge~~<br>~~fe~~|0.615<br>~~Ge~~<br>~~**G**G~~|—<br>~~Ge~~<br>~~G~~<br>~~G~~|0.725<br>~~Ge~~<br>~~G~~|—<br>~~Ge~~|ns<br>~~Ge~~|
|tSKEW_EDGE5<br>~~fe~~<br>~~GG~~|Edge Clock Skew Within a Device<br>~~fe~~<br>~~GG~~|—<br>~~**G**G~~<br>~~GG~~|148<br>~~G~~<br>~~G~~<br>~~GG~~|—<br>~~G~~<br>~~GG~~|174<br>~~GG~~|ps<br>~~GG~~|
|**Generic SDR Input**|||||||
|**General I/O Pin Parameters Using Dedicated Primary Clock Input without PLL**|||||||
|tCO<br>~~a~~|Clock to Output - PIO Output<br>Register|—|8.76|—|8.76|ns|
|tSU<br>~~a~~|Clock to Data Setup - PIO Input<br>Register|0|—|0|—|ns|
|tH(LTR)<br>~~a~~|Clock to Data Hold - PIO Input<br>Register<br>~~ee~~|4.01<br>~~ee~~|—<br>~~ee~~|4.01<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|
|tH(Bottom)<br>~~a~~|Clock to Data Hold - PIO Input<br>Register|4.92|—|4.92|—|ns|
|tSU_DEL<br>~~a~~|Clock to Data Setup - PIO Input<br>Register with Data Input Delay|1.86|—|1.86|—|ns|
|tH_DEL(LTR)<br>~~a~~|Clock to Data Hold - PIO Input<br>Register with Data Input Delay|0.27|—|0.27|—|ns|
|tH_DEL(Bottom)<br>~~a~~|Clock to Data Hold - PIO Input<br>Register with Data Input Delay|1.86|—|1.86|—|ns|
|**General I/O Pin Parameters Using Dedicated Primary Clock Input with PLL**|||||||
|tCOPLL<br>~~a~~|Clock to Output - PIO Output<br>Register|—|4.72|—|5.57|ns|
|tSUPLL<br>~~a~~|Clock to Data Setup - PIO Input<br>Register|1.41|—|1.41|—|ns|
|tHPLL(LTR)<br>~~a~~|Clock to Data Hold - PIO Input<br>Register|1.22|—|1.44|—|ns|
|tHPLL(Bottom)<br>~~a~~|Clock to Data Hold - PIO Input<br>Register|1.98|—|1.98|—|ns|
|tSU_DELPLL<br>~~ee~~|Clock to Data Setup - PIO Input<br>Register with Data Input Delay<br>~~ee~~|4.99<br>~~ee~~|—<br>~~ee~~|4.99<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|
|tH_DELPLL<br>~~a~~|Clock to Data Hold - PIO Input<br>Register with Data Input Delay|0|—|0|—|ns|
|**Generic DDR Input/Output**|||||||
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Parameter**|**Description**|**–8**|**–8**|**–7**|**–7**|**Unit**|
|---|---|---|---|---|---|---|
|||**Min**|**Max**|**Min**|**Max**||
|**Generic DDRX1 Inputs/Outputs with Clock and Data Centered at Pin (GDDRX1_RX/TX.SCLK.Centered) using PCLK Clock Input –**<br>**Bank0, 1, 2, 6, 7 –Figure 4.7 and Figure 4.9**<br>~~___~~|||||||
|tSU_GDDR1<br>~~a~~|Input Data Setup Before CLK<br>~~a~~|0.917<br>~~a~~|—<br>~~a~~|0.917<br>~~a~~|—<br>~~a~~|ns<br>~~a~~|
|||0.275<br>~~a~~<br>~~a~~|—<br>~~a~~|0.275<br>~~a~~|—<br>~~a~~|UI<br>~~a~~|
|tHO_GDDR1<br>~~a~~|Input Data Hold After CLK<br>~~GOO~~|0.917<br>~~GOO~~|—<br>~~GOO~~|0.917<br>~~GOO~~|—<br>~~GOO~~|ns<br>~~GOO~~|
|tDVB_GDDR1<br>~~ee~~|Output Data Valid Before CLK<br>Output<br>~~ee~~|0.905<br>~~ee~~<br>~~es~~|—<br>~~ee~~|0.905<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|
|||–0.762<br>~~ee~~<br>~~es~~|—<br>~~ee~~|–0.762<br>~~ee~~|—<br>~~ee~~|ns + ½UI<br>~~ee~~|
|tDQVA_GDDR1<br>~~a~~|Output Data Valid After CLK Output<br>~~a~~|0.905<br>~~es~~<br>~~a~~|—<br>~~a~~|0.905<br>~~a~~|—<br>~~a~~|ns<br>~~a~~|
|||–0.762<br>~~a~~<br>~~a~~|—<br>~~a~~|–0.762<br>~~a~~|—<br>~~a~~|ns + ½UI<br>~~a~~|
|fDATA_GDDRX1<br>~~a~~|Input/Output Data Rate<br>~~GOO~~|—<br>~~GOO~~|300<br>~~GOO~~|—<br>~~GOO~~|300<br>~~GOO~~|Mbps<br>~~GOO~~|
|fMAX_GDDRX1<br>~~a ~~|Frequencyof PCLK<br> ~~OO~~|—<br>~~OO~~|150<br>~~OO~~|—<br>~~OO~~|150<br>~~OO~~|MHz<br>~~OO~~|
|½ UI<br>~~a ~~|Half of Data Bit Time, or 90 degrees<br> ~~GC~~|1.667<br>~~GC~~|—<br>~~GC~~|1.667<br>~~GC~~|—<br>~~GC~~|ns<br>~~GC~~|
|Output TX to Input RX Marginper Edge<br>~~CO~~||0.191<br>~~CO~~|—<br>~~CO~~|0.091<br>~~CO~~|—<br>~~CO~~|ns<br>~~CO~~|
|**Generic DDRX1 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX1_RX/TX.SCLK.Aligned) using PCLK Clock Input –**<br>**Bank0, 1, 2, 6, 7 –Figure 4.8 andFigure 4.10**<br>~~CO~~|||||||
|tDVA_GDDR1|Input Data Valid After CLK<br>~~po~~|—<br>~~po~~|–0.917<br>~~po~~|—<br>~~po~~|–0.917<br>~~po~~|ns + ½UI<br>~~po~~|
|||—<br>~~a~~<br>~~po~~|0.75|—|0.75|ns|
|||—<br>~~po~~<br>~~ee~~|0.225|—|0.225|UI|
|tDVE_GDDR1|Input Data Hold After CLK<br>~~po~~|0.917<br>~~po~~<br>~~ee~~<br>~~ee~~|—<br>~~es~~|0.917|—|ns + ½UI|
|||2.583<br>~~ee~~<br>~~ee~~|—<br>~~es~~|2.583|—|ns|
|||0.775<br>~~ee~~<br>~~a~~|—<br>~~es~~|0.775|—|UI|
|tDIA_GDDR1|Output Data Invalid After CLK<br>Output|—|0.559|—|0.659|ns|
|tDIB_GDDR1|Output Data Invalid Before CLK<br>Output|—|0.559|—|0.659|ns|
|fDATA_GDDRX1<br>~~pf~~|Input/Output Data Rate<br>~~pf~~|—<br>~~pf~~|300<br>~~pf~~|—<br>~~pf~~|300<br>~~pf~~|Mbps<br>~~pf~~|
|fMAX_GDDRX1<br>~~pf~~|Frequencyfor PCLK<br>~~pf~~|—<br>~~pf~~|150<br>~~pf~~|—<br>~~pf~~|150<br>~~pf~~|MHz<br>~~pf~~|
|½ UI<br>~~a~~|Half of Data Bit Time, or 90 degrees<br>~~a~~|1.667<br>~~eG~~|—<br>~~eG~~|1.667<br>~~GO~~|—<br>~~GO~~|ns|
|Output TX to Input RX Marginper Edge<br>~~a~~<br>~~a~~<br>~~OO~~||0.191<br>~~eG~~<br>~~OO~~|—<br>~~eG~~<br>~~OO~~|0.091<br>~~GO~~<br>~~OO~~|—<br>~~GO~~<br>~~OO~~|ns<br>~~OO~~|
|**Generic DDRX1 Inputs/Outputs with Clock and Data Centered at Pin (GDDRX1_RX/TX.SCLK.Centered) using PCLK Clock Input –**<br>**Bank3, 4, 5 –Figure 4.7 and Figure 4.9**<br>~~OO~~<br>~~——————~~|||||||
|tSU_GDDR1<br>~~——————~~|Input Data Setup Before CLK<br>~~——————~~|0.917<br>~~——————~~|—<br>~~——————~~|0.917<br>~~——————~~|—<br>~~——————~~|ns<br>~~——————~~|
|||0.275<br>~~——————~~<br>~~a~~|—<br>~~——————~~|0.275<br>~~——————~~|—<br>~~——————~~|UI<br>~~——————~~|
|tHO_GDDR1<br>~~pf~~|Input Data Hold After CLK<br>~~pf~~|0.917<br>~~pf~~|—<br>~~pf~~|0.917<br>~~pf~~|—<br>~~pf~~|ns<br>~~pf~~|
|fDATA_IN_GDDRX1<br>~~pf~~|Input Data Rate<br>~~pf~~|—<br>~~pf~~|300<br>~~pf~~|—<br>~~pf~~|300<br>~~pf~~|Mbps<br>~~pf~~|
|tDVB_GDDR1<br>~~a~~|Output Data Valid Before CLK<br>Output<br>~~a~~|1.278<br>~~a~~<br>~~es~~|—<br>~~a~~<br>~~es~~|1.227<br>~~a~~|—<br>~~a~~|ns<br>~~a~~|
|||–0.389<br>~~a~~<br>~~es~~|—<br>~~a~~<br>~~es~~|–0.440<br>~~a~~|—<br>~~a~~|ns + ½UI<br>~~a~~|
|tDQVA_GDDR1<br>~~a~~|Output Data Valid After CLK Output<br>~~a~~|1.294<br>~~a~~<br>~~es~~|—<br>~~a~~<br>~~es~~|1.227<br>~~a~~|—<br>~~a~~|ns<br>~~a~~|
|||–0.373<br>~~a~~|—|–0.439|—|ns + ½UI|
|fDATA_OUT_GDDRX1<br>~~pf~~<br>~~ee~~<br>~~a~~|Output Data Rate<br>~~pf~~<br>~~eG~~<br>|—<br>~~pf~~<br>~~eG~~<br>|300<br>~~pf~~<br>~~eG~~<br>|—<br>~~pf~~<br>~~eG~~<br>~~GO~~<br>|300<br>~~pf~~<br>~~eG~~<br>~~GO~~<br>|Mbps<br>~~pf~~<br>~~eG~~<br>|
|fMAX_GDDRX1<br>~~ee~~<br>~~a~~|Frequencyof PCLK<br>~~eG~~<br>|—<br>~~eG~~<br>|150<br>~~eG~~<br>|—<br>~~eG~~<br>~~GO~~<br>|150<br>~~eG~~<br>~~GO~~<br>|MHz<br>~~eG~~<br>|
|½ UI<br>~~ee~~<br>~~a~~|Half of Data Bit Time, or 90 degrees<br>~~eG~~<br>~~CO~~|1.667<br>~~eG~~<br>~~CO~~|—<br>~~eG~~<br>~~CO~~|1.667<br>~~eG~~<br>~~GO~~<br>~~CO~~|—<br>~~eG~~<br>~~GO~~<br>~~CO~~|ns<br>~~eG~~<br>~~CO~~|
|Output TX to Input RX Marginper Edge<br>~~a CO~~<br>~~GC~~||0.377<br>~~CO~~<br>~~GC~~|—<br>~~CO~~<br>~~GC~~|0.311<br>~~GO~~<br>~~CO~~<br>~~GC~~|—<br>~~GO~~<br>~~CO~~<br>~~GC~~|ns<br>~~CO~~<br>~~GC~~|
|**Generic DDRX1 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX1_RX/TX.SCLK.Aligned) using PCLK Clock Input –**<br>**Bank3, 4, 5 –Figure 4.8 andFigure 4.10**<br>~~es~~|||||||
|tDVA_GDDR1|Input Data Valid After CLK|—<br>~~es~~|–0.917|—|–0.917|ns + ½UI|
|||—<br>~~es~~<br>~~ee~~<br>~~es~~|0.75<br>~~ee~~<br>~~es~~|—<br>~~ee~~|0.75<br>~~ee~~|ns<br>~~ee~~|
|||—<br>~~ee~~<br>~~es~~|0.225<br>~~ee~~<br>~~es~~|—<br>~~ee~~|0.225<br>~~ee~~|UI<br>~~ee~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Parameter**<br>~~e~~|**Description**<br>~~e~~|**–8**<br>~~**e**e~~<br>~~e~~|**–8**<br>~~**e**e~~<br>~~e~~|**–7**<br>~~ee~~<br>|**–7**<br>~~ee~~<br>|**Unit**<br>|
|---|---|---|---|---|---|---|
|||**Min**<br>~~**e**e~~<br>~~e~~|**Max**<br>~~e~~<br>|**Min**<br>~~ee~~<br>|**Max**<br>~~ee~~<br>||
|tDVE_GDDR1<br><br>~~ee~~|Input Data Hold After CLK<br>|0.917<br>~~ee~~|—<br>~~ee~~|0.917<br>~~ee~~|—<br>~~ee~~|ns + ½UI<br>~~ee~~|
|||2.583<br>~~a~~<br>~~ee~~|—|2.583|—|ns|
|||0.775<br>~~ee~~|—|0.775|—|UI|
|fDATA_IN_GDDRX1<br>~~pf~~<br>~~ee~~|Input Data Rate<br>~~pf~~|—<br>~~ee~~<br>~~pf~~|300<br>~~pf~~|—<br>~~pf~~|300<br>~~pf~~|Mbps<br>~~pf~~|
|tDIA_GDDR1<br>~~ee~~|Output Data Invalid After CLK<br>Output|—|0.373|—|0.439|ns|
|tDIB_GDDR1<br>~~ee~~<br>~~a ~~|Output Data Invalid Before CLK<br>Output<br> ~~a~~|—|0.373|—|0.439|ns|
|fDATA_OUT_GDDRX1<br>~~pf~~|Output Data Rate<br>~~pf~~|—<br>~~pf~~<br>~~Ge~~|300<br>~~pf~~|—<br>~~pf~~|300<br>~~pf~~|Mbps<br>~~pf~~|
|fMAX_GDDRX1<br>~~Ge~~|Frequencyfor PCLK<br>~~Ge~~|—<br>~~Ge~~<br>~~Ge~~<br>~~Ge~~|150<br>~~Ge~~|—<br>~~Ge~~|150<br>~~Ge~~|MHz<br>~~Ge~~|
|½ UI<br>~~Ge~~|Half of Data Bit Time, or 90 degrees<br>~~Ge~~|1.667<br>~~Ge~~<br>~~Ge~~<br>~~Ge~~|—<br>~~Ge~~|1.667<br>~~Ge~~|—<br>~~Ge~~|ns<br>~~Ge~~|
|Output TX to Input RX Marginper Edge<br>~~OO~~||0.377<br>~~Ge~~<br>~~OO~~|—<br>~~OO~~|0.311<br>~~OO~~|—<br>~~OO~~|ns<br>~~OO~~|
|**Generic DDRX2 Inputs/Outputs with Clock and Data Centered at Pin (GDDRX2_RX/TX.ECLK.Centered) using PCLK Clock Input –**<br>**Figure 4.7 and Figure 4.9**<br>~~OO~~|||||||
|tSU_GDDRX2<br>~~a~~<br>~~a~~<br>~~oO~~|Data Setup before CLK Input<br>~~apo~~<br>|0.270<br>~~po~~<br>|—<br>|0.270<br>|—<br>|ns<br>|
|||0.162<br>~~po~~<br>|—<br>|0.162<br><br>~~GO~~|—<br><br>~~GO~~|UI<br>|
|tHO_GDDRX2<br><br>~~a~~<br>~~oO~~|Data Hold after CLK Input<br>~~po~~<br>~~eG~~|0.270<br>~~po~~<br>~~eG~~|—<br>~~eG~~|0.270<br>~~eG~~<br>~~GO~~|—<br>~~eG~~<br>~~GO~~|ns<br>~~eG~~|
|tDVB_GDDRX2<br><br>~~a ~~<br>~~oO~~|Output Data Valid Before CLK<br>Output<br>~~po~~<br> ~~eG~~|0.684<br>~~po~~<br>~~eG~~|—<br>~~eG~~|0.684<br>~~eG~~<br>~~GO~~|—<br>~~eG~~<br>~~GO~~|ns<br>~~eG~~|
|||–0.149<br>~~po~~|—<br>~~po~~|–0.176<br>~~GO~~<br>~~po~~|—<br>~~GO~~<br>~~po~~|ns + ½UI<br>~~po~~|
|tDQVA_GDDRX2<br>~~oO~~<br>~~a ~~|Output Data Valid After CLK Output<br> ~~GOO~~|0.684<br>~~GOO~~|—<br>~~GOO~~|0.658<br>~~GO~~<br>~~GOO~~|—<br>~~GO~~<br>~~GOO~~|ns<br>~~GOO~~|
|~~oO~~<br>~~pf~~|~~pf~~|–0.149<br>~~pf~~|—<br>~~pf~~|–0.176<br>~~GO~~<br>~~pf~~|—<br>~~GO~~<br>~~pf~~|ns + ½UI<br>~~pf~~|
|fDATA_GDDRX2<br>~~a~~|Input/Output Data Rate<br>~~GO~~|—<br>~~GO~~|600<br>~~GO~~|—<br>~~GO~~|600<br>~~GO~~|Mbps<br>~~GO~~|
|fMAX_GDDRX2<br>~~a ~~<br>~~OO~~|Frequencyfor ECLK<br> ~~GO~~<br>~~OO~~|—<br>~~GO~~<br>~~OO~~|300<br>~~GO~~<br>~~OO~~|—<br>~~GO~~<br>~~OO~~|300<br>~~GO~~<br>~~OO~~|MHz<br>~~GO~~<br>~~OO~~|
|½ UI<br>~~OO~~<br>~~pf~~|Half of Data Bit Time, or 90 degrees<br>~~OO~~<br>~~pf~~|0.833<br>~~OO~~<br>~~pf~~|—<br>~~OO~~<br>~~pf~~|0.833<br>~~OO~~<br>~~pf~~|—<br>~~OO~~<br>~~pf~~|ns<br>~~OO~~<br>~~pf~~|
|fPCLK<br>~~a ~~|PCLK frequency<br> ~~GOO~~|—<br>~~GOO~~|247.52<br>~~GOO~~|—<br>~~GOO~~|209.97<br>~~GOO~~|MHz<br>~~GOO~~|
|Output TX to Input RX Marginper Edge<br>~~CO~~||0.434<br>~~CO~~|—<br>~~CO~~|0.408<br>~~CO~~|—<br>~~CO~~|ns<br>~~CO~~|
|**Generic DDRX2 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX2_RX/TX.ECLK.Aligned) using PCLK Clock Input –**<br>**Figure 4.8 andFigure 4.10**|||||||
|tDVA_GDDRX2|Input Data Valid After CLK|—<br>~~po~~<br>~~ee~~|–0.458<br>~~po~~<br>~~es~~|—<br>~~po~~|–0.458<br>~~po~~|ns + ½UI<br>~~po~~|
|||—<br>~~po~~<br>~~ee~~<br>~~es~~|0.375<br>~~po~~<br>~~es~~<br>~~es~~|—<br>~~po~~|0.375<br>~~po~~|ns<br>~~po~~|
|||—<br>~~ee~~<br>~~es~~|0.225<br>~~es~~<br>~~es~~|—|0.225|UI|
|tDVE_GDDRX2<br>~~ee~~|Input Data Hold After CLK<br>~~a~~|0.458<br>~~es~~<br>~~a~~|—<br>~~es~~|0.458|—|ns + ½UI|
|||1.292<br>~~a~~|—|1.292|—|ns|
|||0.775<br>~~a~~|—|0.775|—|UI|
|tDIA_GDDRX2<br>~~ee~~|Output Data Invalid After CLK<br>Output<br>~~a~~|—<br>~~a~~|0.149|—|0.176|ns|
|tDIB_GDDRX2<br>~~ee ~~<br>~~a~~<br>~~ee~~<br>~~a~~|Output Data Invalid Before CLK<br>Output<br> ~~a~~<br>~~eG~~<br>|—<br>~~eG~~<br>|0.149<br>~~eG~~<br>|—<br>~~eG~~<br>~~GO~~<br>|0.176<br>~~eG~~<br>~~GO~~<br>|ns<br>~~eG~~<br>|
|fDATA_GDDRX2<br>~~ee~~<br>~~a~~|Input/Output Data Rate<br>~~eG~~<br>|—<br>~~eG~~<br>|600<br>~~eG~~<br>|—<br>~~eG~~<br>~~GO~~<br>|600<br>~~eG~~<br>~~GO~~<br>|Mbps<br>~~eG~~<br>|
|fMAX_GDDRX2<br>~~ee~~<br>~~a~~|Frequencyfor ECLK<br>~~eG~~<br>~~DCO~~|—<br>~~eG~~<br>~~DCO~~|300<br>~~eG~~<br>~~DCO~~|—<br>~~eG~~<br>~~GO~~<br>~~DCO~~|300<br>~~eG~~<br>~~GO~~<br>~~DCO~~|MHz<br>~~eG~~<br>~~DCO~~|
|½ UI<br>~~a ~~<br>~~a ~~|Half of Data Bit Time, or 90 degrees<br> ~~DCO~~<br> ~~GC~~|0.833<br>~~DCO~~<br>~~GC~~|—<br>~~DCO~~<br>~~GC~~|0.833<br>~~GO~~<br>~~DCO~~<br>~~GC~~|—<br>~~GO~~<br>~~DCO~~<br>~~GC~~|ns<br>~~DCO~~<br>~~GC~~|
|fPCLK<br>~~GOO~~|PCLK frequency<br>~~GOO~~|—<br>~~GOO~~|247.52<br>~~GOO~~|—<br>~~GOO~~|209.97<br>~~GOO~~|MHz<br>~~GOO~~|
|Output TX to Input RX Marginper Edge<br>~~CO~~||0.226<br>~~CO~~|—<br>~~CO~~|0.199<br>~~CO~~|—<br>~~CO~~|ns<br>~~CO~~|
|**Generic DDRX4 Inputs/Outputs with Clock and Data Centered at Pin (GDDRX4_RX/TX.ECLK.Centered) using PCLK Clock Input –**<br>**Figure 4.7 andFigure 4.9**<br>~~———~~|||||||
|tSU_GDDRX4<br>~~———~~<br>~~a~~|Input Data Set-Up Before CLK<br>~~———~~<br>~~po~~<br>|0.253<br>~~———~~<br>~~po~~<br>|—<br>~~———~~<br>|0.253<br>~~———~~<br>|—<br>~~———~~<br>|ns<br>~~———~~<br>|
|||0.253<br>~~———~~<br>~~po~~<br>|—<br>~~———~~<br>|0.253<br>~~———~~<br>|—<br>~~———~~<br>|UI<br>~~———~~<br>|
|tHO_GDDRX4<br>~~———~~<br>~~a ~~|Input Data Hold After CLK<br>~~———~~<br>~~po~~<br> ~~CO~~|0.239<br>~~———~~<br>~~po~~<br>~~CO~~|—<br>~~———~~<br>~~CO~~|0.239<br>~~———~~<br>~~CO~~|—<br>~~———~~<br>~~CO~~|ns<br>~~———~~<br>~~CO~~|
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
131
**CertusPro-NX Family Data Sheet**
|**Parameter**<br>~~a ~~|**Description**<br> ~~s~~|**–8**<br>~~e~~~~**e**~~<br>~~s~~|**–8**<br>~~e~~~~**e**~~<br>~~s~~|**–7**<br>~~ee~~|**–7**<br>~~ee~~|**Unit**|
|---|---|---|---|---|---|---|
|||**Min**<br>~~e~~~~**e**~~<br>~~s~~|**Max**<br>~~**e**~~|**Min**<br>~~ee~~|**Max**<br>~~ee~~||
|tDVB_GDDRX4<br>~~es~~|Output Data Valid Before CLK<br>Output<br>~~es~~|0.351<br>~~po~~|—<br>~~po~~|0.324<br>~~po~~|—<br>~~po~~|ns<br>~~po~~|
|||–0.149<br>~~po~~|—<br>~~po~~|–0.176<br>~~po~~|—<br>~~po~~|ns + ½UI<br>~~po~~|
|tDQVA_GDDRX4<br>~~ee~~|Output Data Valid After CLK Output<br>~~ee~~|0.351<br>~~ee~~|—|0.324|—|ns|
|||–0.149<br>~~ee~~|—|–0.176|—|ns + ½UI|
|fDATA_GDDRX4<br>~~ee~~<br>~~pf~~|Input/Output Data Rate<br>~~ee~~<br>~~pf~~|—<br>~~ee~~<br>~~pf~~|1000<br>~~pf~~|—<br>~~pf~~|1000<br>~~pf~~|Mbps<br>~~pf~~|
|fMAX_GDDRX4<br>~~fe~~|Frequencyfor ECLK<br>~~fe~~|—<br>~~GG~~|500<br>~~GG~~|—<br>~~GG~~|500|MHz|
|½ UI<br>~~fe~~|Half of Data Bit Time, or 90 degrees<br>~~fe~~|0.5<br>~~GG~~|—<br>~~GG~~|0.5<br>~~GG~~|—|ns|
|fPCLK<br>~~a~~<br>~~OC~~|PCLK frequency<br>~~GOO~~|—<br>~~GOO~~<br>~~a~~|125<br>~~GOO~~|—<br>~~GOO~~|125<br>~~GOO~~|MHz<br>~~GOO~~|
|Output TX to Input RX Marginper Edge<br>~~OC~~||0.151<br>~~a~~|—|0.124|—|ns|
|**Generic DDRX4 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX4_RX/TX.ECLK.Aligned) using PCLK Clock Input, Left**<br>**and Right sides Only –Figure 4.8 and Figure 4.10**<br>~~OC~~<br>~~a~~|||||||
|tDVA_GDDRX4<br>~~OC~~|Input Data Valid After CLK|—<br>~~a~~<br>~~ee~~|–0.275<br>~~ee~~|—<br>~~ee~~|–0.275<br>~~ee~~|ns + ½UI<br>~~ee~~|
|||—<br>~~a~~<br>~~ee~~<br>~~ee~~|0.225<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~ee~~|0.225<br>~~ee~~<br>~~ee~~|ns<br>~~ee~~<br>~~ee~~|
|||—<br>~~ee ~~<br>~~ee~~|0.225<br> ~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~ee~~|0.225<br>~~ee~~<br>~~ee~~|UI<br>~~ee~~<br>~~ee~~|
|tDVE_GDDRX4|Input Data Hold After CLK|0.275<br>~~ee ~~<br>~~a~~|—<br> ~~es~~|0.275<br>~~ee~~|—<br>~~ee~~|ns + ½UI<br>~~ee~~|
|||0.775<br>~~a~~|—|0.775|—|ns|
|||0.775|—|0.775|—|UI|
|tDIA_GDDRX4<br>~~a~~|Output Data Invalid After CLK<br>Output|—|0.149|—|0.176|ns|
|tDIB_GDDRX4<br>~~ee~~|Output Data Invalid Before CLK<br>Output<br>~~eG~~|—<br>~~eG~~|0.149<br>~~eG~~|—<br>~~eG~~<br>~~GO~~|0.176<br>~~eG~~<br>~~GO~~|ns<br>~~eG~~|
|fDATA_GDDRX4<br>~~ee~~|Input/Output Data Rate<br>~~eG~~|—<br>~~eG~~|1000<br>~~eG~~|—<br>~~eG~~<br>~~GO~~|1000<br>~~eG~~<br>~~GO~~|Mbps<br>~~eG~~|
|fMAX_GDDRX4<br>~~ee~~<br>~~GO~~|Frequencyfor ECLK<br>~~eG~~<br>~~GO~~|—<br>~~eG~~<br>~~GO~~|500<br>~~eG~~<br>~~GO~~|—<br>~~eG~~<br>~~GO~~<br>~~GO~~|500<br>~~eG~~<br>~~GO~~<br>~~GO~~|MHz<br>~~eG~~<br>~~GO~~|
|½ UI<br>~~GO~~<br>~~a ~~|Half of Data Bit Time, or 90 degree<br>~~GO~~<br> ~~CO~~|0.5<br>~~GO~~<br>~~CO~~|—<br>~~GO~~<br>~~CO~~|0.5<br>~~GO~~<br>~~CO~~|—<br>~~GO~~<br>~~CO~~|ns<br>~~GO~~<br>~~CO~~|
|fPCLK<br>~~pf~~|PCLK frequency<br>~~pf~~|—<br>~~pf~~|125<br>~~pf~~|—<br>~~pf~~|125<br>~~pf~~|MHz<br>~~pf~~|
|Output TX to Input RX Marginper Edge<br>~~CO~~||0.076<br>~~CO~~|—<br>~~CO~~|0.049<br>~~CO~~|—<br>~~CO~~|ns<br>~~CO~~|
|**Generic DDRX5 Inputs/Outputs with Clock and Data Centered at Pin (GDDRX5_RX/TX.ECLK.Centered) using PCLK Clock Input –**<br>**Figure 4.7 and Figure 4.9**<br>~~———~~|||||||
|tSU_GDDRX5<br>~~———~~<br>~~a~~|Input Data Set-Up Before CLK<br>~~———~~<br>|0.233<br>~~———~~<br>~~es~~<br>|—<br>~~———~~<br>~~es~~<br>|0.233<br>~~———~~<br>|—<br>~~———~~<br>|ns<br>~~———~~<br>|
|||0.233<br>~~———~~<br>~~es~~<br>|—<br>~~———~~<br>~~es~~<br>|0.233<br>~~———~~<br>|—<br>~~———~~<br>|UI<br>~~———~~<br>|
|tHO_GDDRX5<br>~~———~~<br>~~a~~|Input Data Hold After CLK<br>~~———~~<br>~~OO~~|0.245<br>~~———~~<br>~~es~~<br>~~OO~~|—<br>~~———~~<br>~~es~~<br>~~OO~~|0.245<br>~~———~~<br>~~OO~~|—<br>~~———~~<br>~~OO~~|ns<br>~~———~~<br>~~OO~~|
|tWINDOW_GDDRX5C<br>~~a ~~<br>~~GO~~|Input Data Valid Window<br> ~~OO~~<br>~~GO~~|0.4<br>~~es ~~<br>~~OO~~<br>~~GO~~|—<br> ~~es~~<br>~~OO~~<br>~~GO~~|0.4<br>~~OO~~<br>~~GO~~|—<br>~~OO~~<br>~~GO~~|ns<br>~~OO~~<br>~~GO~~|
|tDVB_GDDRX5<br>~~a~~|Output Data Valid Before CLK<br>Output<br>~~a~~|0.351<br>~~a~~|—<br>~~a~~|0.324<br>~~a~~|—<br>~~a~~|ns<br>~~a~~|
|||–0.149<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|–0.176<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|ns + ½UI<br>~~a~~<br>~~a~~|
|tDQVA_GDDRX5<br>~~a~~<br>~~a~~|Output Data Valid After CLK Output<br>~~a~~<br>~~a~~|0.351<br>~~a~~<br>~~a~~<br>~~a~~<br>~~es~~|—<br>~~a~~<br>~~a~~<br>~~a~~<br>~~es~~|0.324<br>~~a~~<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~<br>~~a~~|ns<br>~~a~~<br>~~a~~<br>~~a~~|
|||–0.149<br>~~a~~<br>~~es~~|—<br>~~a~~<br>~~es~~|–0.176<br>~~a~~|—<br>~~a~~|ns + ½UI<br>~~a~~|
|fDATA_GDDRX5<br>~~a~~<br>~~GO~~|Input/Output Data Rate<br>~~a~~<br>~~GO~~|—<br>~~a~~<br>~~es~~<br>~~GO~~|1000<br>~~a~~<br>~~es~~<br>~~GO~~|—<br>~~a~~<br>~~GO~~|1000<br>~~a~~<br>~~GO~~|Mbps<br>~~a~~<br>~~GO~~|
|fMAX_GDDRX5<br>~~pf~~|Frequencyfor ECLK<br>~~pf~~|—<br>~~pf~~|500<br>~~pf~~|—<br>~~pf~~|500<br>~~pf~~|MHz<br>~~pf~~|
|½ UI<br>~~pf~~|Half of Data Bit Time, or 90 degrees<br>~~pf~~|0.500<br>~~pf~~<br>~~Oe~~|—<br>~~pf~~<br>~~Oe~~|0.500<br>~~pf~~<br>~~GO~~|—<br>~~pf~~<br>~~GO~~|ns<br>~~pf~~|
|fPCLK<br>~~a~~|PCLK frequency<br>~~a~~|—<br>~~a~~<br>~~Oe~~|100<br>~~a~~<br>~~Oe~~|—<br>~~a~~<br>~~GO~~|100<br>~~a~~<br>~~GO~~|MHz<br>~~a~~|
|Output TX to Input RX Marginper Edge<br>~~a~~<br>~~ee~~||0.151<br>~~a~~<br>~~Oe~~<br>~~ee~~|—<br>~~a~~<br>~~Oe~~<br>~~ee~~|0.124<br>~~a~~<br>~~GO~~<br>~~ee~~|—<br>~~a~~<br>~~GO~~<br>~~ee~~|ns<br>~~a~~<br>~~ee~~|
|**Generic DDRX5 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX5_RX/TX.ECLK.Aligned) using PCLK Clock Input –**<br>**Figure 4.8 andFigure 4.10**<br>~~ee~~|||||||
|tDVA_GDDRX5<br>~~ee~~|Input Data Valid After CLK<br>~~ee~~|—<br>~~ee~~<br>~~a~~<br>~~ee~~|–0.275<br>~~ee~~|—<br>~~ee~~|–0.275<br>~~ee~~|ns + ½UI<br>~~ee~~|
|||—<br>~~ee~~|0.225|—|0.225|ns|
|||—<br>~~ee~~<br>~~pO~~|0.225<br>~~pO~~|—<br>~~pO~~|0.225<br>~~pO~~|UI<br>~~pO~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
132
**CertusPro-NX Family Data Sheet**
|**Parameter**<br>~~e~~|**Description**<br>~~e~~|**–8**<br>~~**e**e~~<br>~~e~~|**–8**<br>~~**e**e~~<br>~~e~~|**–7**<br>~~ee~~|**–7**<br>~~ee~~|**Unit**|
|---|---|---|---|---|---|---|
|||**Min**<br>~~**e**e~~<br>~~e~~|**Max**<br>~~e~~|**Min**<br>~~ee~~|**Max**<br>~~ee~~||
|tDVE_GDDRX5<br><br>~~ee~~|Input Data Hold After CLK<br>|0.275<br>~~a~~|—|0.275|—|ns + ½UI|
|||0.775<br>~~a~~<br>~~ee~~|—|0.775|—|ns|
|||0.775<br>~~ee~~|—|0.775|—|UI|
|tWINDOW_GDDRX5A<br>~~ee~~|Input Data Valid Window|0.550<br>~~ee~~|—|0.550|—|ns|
|tDIA_GDDRX5<br>~~ee~~|Output Data Invalid After CLK<br>Output|—<br>~~ee~~|0.149|—|0.176|ns|
|tDIB_GDDRX5<br>~~ee~~|Output Data Invalid Before CLK<br>Output|—<br>~~ee~~|0.149|—|0.176|ns|
|fDATA_GDDRX5<br>~~pf~~|Input/Output Data Rate<br>~~pf~~|—<br>~~pf~~<br>~~CG~~|1000<br>~~pf~~<br>~~CG~~|—<br>~~pf~~|1000<br>~~pf~~|Mbps<br>~~pf~~|
|fMAX_GDDRX5<br>~~Ce~~|Frequencyfor ECLK<br>~~Ce~~|—<br>~~Ce~~<br>~~CG~~<br>~~GG~~|500<br>~~Ce~~<br>~~CG~~<br>~~GG~~|—<br>~~Ce~~|500<br>~~Ce~~|MHz<br>~~Ce~~|
|½ UI<br>~~Ce~~|Half of Data Bit Time, or 90 degrees<br>~~Ce~~|0.500<br>~~CG~~<br>~~Ce~~<br>~~GG~~|—<br>~~CG~~<br>~~Ce~~<br>~~GG~~|0.500<br>~~Ce~~|—<br>~~Ce~~|ns<br>~~Ce~~|
|fPCLK<br>~~pf~~|PCLK frequency<br>~~pf~~|—<br>~~GG~~<br>~~pf~~|100<br>~~GG~~<br>~~pf~~|—<br>~~pf~~|100<br>~~pf~~|MHz<br>~~pf~~|
|Output TX to Input RX Marginper Edge<br>~~CO~~||0.076<br>~~CO~~|—<br>~~CO~~|0.049<br>~~CO~~|—<br>~~CO~~|ns<br>~~CO~~|
|**Soft D-PHY DDRX4 Inputs/Outputs with Clock and Data Centered at Pin, using PCLK Clock Input**|||||||
|tSU_GDDRX4_MP<br>~~pr~~|Input Data Set-Up Before CLK<br>~~pr~~|0.240<br>~~pr~~<br>~~ee~~|—<br>~~pr~~<br>~~es~~|0.240<br>~~pr~~|—<br>~~pr~~|ns<br>~~pr~~|
|||0.240<br>~~pr~~<br>~~ee~~|—<br>~~pr~~<br>~~es~~|0.240<br>~~pr~~|—<br>~~pr~~|UI<br>~~pr~~|
|tHO_GDDRX4_MP<br>~~pr~~<br>~~pf~~|Input Data Hold After CLK<br>~~pr~~<br>~~pf~~|0.230<br>~~pr~~<br>~~ee~~<br>~~pf~~|—<br>~~pr~~<br>~~es~~<br>~~pf~~|0.230<br>~~pr~~<br>~~pf~~|—<br>~~pr~~<br>~~pf~~|ns<br>~~pr~~<br>~~pf~~|
|tDVB_GDDRX4_MP<br>~~a~~|Output Data Valid Before CLK<br>Output<br>~~a~~<br>~~po~~|0.300<br>~~a~~<br>~~po~~|—<br>~~a~~|0.300<br>~~a~~|—<br>~~a~~|ns<br>~~a~~|
|||0.300<br>~~a~~<br>~~po~~|—<br>~~a~~|0.300<br>~~a~~|—<br>~~a~~|UI<br>~~a~~|
|tDQVA_GDDRX4_MP|Output Data Valid After CLK Output<br>~~po~~|0.300<br>~~po~~<br>~~ee~~|—<br>~~es~~|0.300|—|ns|
|||0.300<br>~~ee~~|—<br>~~es~~|0.300|—|UI|
|fDATA_GDDRX4_MP<br>~~pf~~|Input Data Bit Rate for MIPI PHY<br>~~pf~~|—<br>~~ee~~<br>~~pf~~|1000<br>~~es~~<br>~~pf~~|—<br>~~pf~~|1000<br>~~pf~~|Mbps<br>~~pf~~|
|½ UI<br>~~a ~~|Half of Data Bit Time, or 90 degrees<br> ~~GOO~~|0.500<br>~~GOO~~|—<br>~~GOO~~|0.500<br>~~GOO~~|—<br>~~GOO~~|ns<br>~~GOO~~|
|fPCLK<br>~~pf~~|PCLK frequency<br>~~pf~~|—<br>~~pf~~<br>~~eG~~|125<br>~~pf~~<br>~~eG~~|—<br>~~pf~~<br>~~GO~~|125<br>~~pf~~<br>~~GO~~|MHz<br>~~pf~~|
|Output TX to Input RX Marginper Edge<br>~~a~~||0.100<br>~~a~~<br>~~eG~~|—<br>~~a~~<br>~~eG~~|0.100<br>~~a~~<br>~~GO~~|—<br>~~a~~<br>~~GO~~|ns<br>~~a~~|
|**Video DDRX71 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX71_RX.ECLK) using PLL Clock Input –Figure 4.12 and**<br>**Figure 4.13**<br>~~a~~<br>~~eG~~<br>~~GO~~<br>~~es~~<br>~~es~~|||||||
|tRPBi_DVA|Input Valid Bit "i" switch from CLK<br>Rising Edge ("i" = 0 to 6, 0 aligns<br>with CLK)|—<br>~~es~~|0.237<br>~~es~~<br>~~|~~|—<br>~~|~~<br>~~|~~|0.277<br>~~|ft~~|UI<br>~~ft~~|
|||—<br>~~es~~<br>~~|~~|–0.278<br>~~es~~<br>~~|~~<br>~~|~~|—<br>~~|~~<br>~~|~~<br>~~|~~|–0.278<br>~~|~~<br>~~|ft~~|ns+(½+i)×UI<br>~~|~~<br>~~ft~~|
|tRPBi_DVE<br>~~a~~|Input Hold Bit "i" switch from CLK<br>Rising Edge ("i" = 0 to 6, 0 aligns<br>with CLK)<br>~~ee~~|0.748<br>~~p~~|—<br>~~|~~<br>~~p~~|0.711<br>~~|~~<br>~~|~~<br>~~po~~|—<br>~~| ft~~<br>~~o~~|UI<br>~~ft~~<br>~~o~~|
|||0.262<br>~~p~~<br>~~ee~~|—<br>~~p~~<br>~~ee~~|0.263<br>~~po~~<br>~~ee~~|—<br>~~o~~|ns+(½+i)×UI<br>~~o~~|
|tTPBi_DOV<br>~~a~~|Data Output Valid Bit "i" switch<br>from CLK Rising Edge ("i" = 0 to 6, 0<br>aligns with CLK)<br>~~ee~~|—<br>~~ee~~|0.159<br>~~ee~~|—<br>~~ee~~|0.187|ns+i×UI|
|tTPBi_DOI<br>~~a~~|Data Output Invalid Bit "i" switch<br>from CLK Rising Edge ("i" = 0 to 6, 0<br>aligns with CLK)<br>~~ee~~|–0.159<br>~~ee ~~|—<br> ~~ee~~|–0.187<br>~~ee~~|—|ns+(i+ 1) ×UI|
|tTPBi_skew_UI<br>~~GO~~|TX skew in UI<br>~~GO~~|—<br>~~GO~~|0.15<br>~~GO~~|—<br>~~GO~~|0.15<br>~~GO~~|UI<br>~~GO~~|
|tB<br>~~GO~~<br>~~pf~~|Serial Data Bit Time, = 1UI<br>~~GO~~<br>~~pf~~|1.058<br>~~GO~~<br>~~pf~~|—<br>~~GO~~<br>~~pf~~|1.247<br>~~GO~~<br>~~pf~~|—<br>~~GO~~<br>~~pf~~|ns<br>~~GO~~<br>~~pf~~|
|fDATA_TX71<br>~~pf~~<br>~~a ~~|DDR71 Serial Data Rate<br>~~pf~~<br> ~~GG~~|—<br>~~pf~~<br>~~GG~~|945<br>~~pf~~<br>~~GG~~|—<br>~~pf~~<br>~~GG~~|802<br>~~pf~~<br>~~GG~~|Mbps<br>~~pf~~<br>~~GG~~|
|fMAX_TX71<br>~~GC~~|DDR71 ECLK Frequency<br>~~GC~~|—<br>~~GC~~|473<br>~~GC~~|—<br>~~GC~~<br>~~GO~~|401<br>~~GC~~<br>~~GO~~|MHz<br>~~GC~~|
|fCLKIN<br>~~eG~~|7:1 Clock(PCLK)Frequency<br>~~eG~~|—<br>~~eG~~|133.7<br>~~eG~~|—<br>~~eG~~<br>~~GO~~|113.4<br>~~eG~~<br>~~GO~~|MHz<br>~~eG~~|
|Output TX to Input RX Marginper Edge<br>~~eG~~<br>~~CO~~||0.159<br>~~eG~~<br>~~CO~~|—<br>~~eG~~<br>~~CO~~|0.187<br>~~eG~~<br>~~GO~~<br>~~CO~~|—<br>~~eG~~<br>~~GO~~<br>~~CO~~|ns<br>~~eG~~<br>~~CO~~|
|**Memory Interface**<br>~~CO~~|||||||
|**DDR3/DDR3L/LPDDR2 READ(DQ Input Data are Aligned to DQS) – Figure 4.8**|||||||
|tDVBDQ_DDR3tDVBDQ_DDR3L<br>tDVBDQ_LPDDR2|Data Output Valid before DQS Input|—|–0.235|—|–0.277|ns + ½UI|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
133
**CertusPro-NX Family Data Sheet**
|**Parameter**<br>~~a~~|**Description**|**–8**<br>~~ee~~|**–8**<br>~~ee~~|**–7**<br>~~ee~~|**–7**<br>~~ee~~|**Unit**|
|---|---|---|---|---|---|---|
|||**Min**<br>~~ee~~|**Max**<br>~~ee~~|**Min**<br>~~ee~~|**Max**<br>~~ee~~||
|tDVADQ_DDR3tDVADQ_DDR3L<br>tDVADQ_LPDDR2<br>~~a~~<br>~~es~~|Data Output Valid after DQS Input|0.235|—|0.277|—|ns + ½UI|
|fDATA_DDR3fDATA_DDR3L<br>fDATA_LPDDR2<br>~~es~~|DDR Memory Data Rate|—|1066|—|904|Mbps|
|fMAX_ECLK_DDR3<br>fMAX_ECLK_DDR3L<br>fMAX_ECLK_LPDDR2<br>~~es~~|DDR Memory ECLK Frequency|—|533|—|452|MHz|
|fMAX_SCLK_DDR3<br>fMAX_SCLK_DDR3L<br>fMAX_SCLK_LPDDR2<br>~~es~~|DDR Memory SCLK Frequency|—|133.3|—|113|MHz|
|**DDR3/DDR3L/LPDDR2 WRITE(DQ Output Data are Centered to DQS) –Figure 4.11**<br>~~pt~~|||||||
|tDQVBS_DDR3tDQVBS_DDR3L<br>tDQVBS_LPDDR2<br>~~a~~|Data Output Valid before DQS<br>Output|—|–0.235|—|–0.277|ns + ½UI|
|tDQVAS_DDR3tDQVAS_DDR3L<br>tDQVAS_LPDDR2<br>~~a a~~<br>~~es~~|Data Output Valid after DQS Output<br>~~a~~|0.235|—|0.277|—|ns + ½UI|
|fDATA_DDR3fDATA_DDR3L<br>fDATA_LPDDR2<br>~~a~~<br>~~es~~|DDR Memory Data Rate<br>~~a~~|—|1066|—|904|Mbps|
|fMAX_ECLK_DDR3<br>fMAX_ECLK_DDR3L<br>fMAX_ECLK_LPDDR2<br>~~a~~<br>~~es~~|DDR Memory ECLK Frequency<br>~~a~~|—|533|—|452|MHz|
|fMAX_SCLK_DDR3<br>fMAX_SCLK_DDR3L<br>fMAX_SCLK_LPDDR2<br>~~a~~<br>~~es~~|DDR Memory SCLK Frequency<br>~~a~~|—|133.3|—|113|MHz|
|**LPDDR4**|||||||
|fDATA_LPDDR4<br>~~pf~~|DDR MemoryData Rate<br>~~pf~~|—<br>~~pf~~|1066<br>~~pf~~|—<br>~~pf~~|904<br>~~pf~~|Mb/s<br>~~pf~~|
|fMAX_ECLK_LPDDR4<br>~~pf~~|DDR MemoryECLK Frequency<br>~~pf~~|—<br>~~pf~~|533<br>~~pf~~|—<br>~~pf~~|452<br>~~pf~~|MHz<br>~~pf~~|
|fMAX_SCLK_LPDDR4<br>~~a~~|DDR MemorySCLK Frequency<br>~~eG~~|—<br>~~eG~~|133.3<br>~~eG~~|—<br>~~eG~~|113<br>~~eG~~|MHz<br>~~eG~~|
**Notes** :
1. Automotive timing numbers are shown.
2. General I/O timing numbers are based on LVCMOS18, 1.8 V, 8 mA, Fast Slew Rate, 0 pF load. Generic DDR timing are numbers based on LVDS I/O.
- DDR3 timing numbers are based on SSTL15. LPDDR2 timing numbers are based on HSUL12. Uses LVDS I/O standard for measurements.
3. Maximum clock frequencies are tested under best case conditions. System performance may vary depending on the user environment.
4. All numbers are generated with the Lattice Radiant software.
5. This clock skew is not the internal clock network skew. The Nexus family devices have very low internal clock network skew that can be approximated to 0 ps. These tSKEW values measured externally at system level includes additional skew added by the I/O, wire bonding and package ball.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**==> picture [311 x 111] intentionally omitted <==**
**----- Start of picture text -----**<br>
Rx CLK (in)<br>Rx DATA (in)<br>tSU/tDVBDQ tSU/tDVBDQ<br>tHD/tDVADQ tHD/tDVADQ<br>**----- End of picture text -----**<br>
**Figure 4.7. Receiver RX.CLK.Centered Waveforms**
**==> picture [439 x 352] intentionally omitted <==**
**----- Start of picture text -----**<br>
1/2 UI 1/2 UI<br>Rx CLK (in)<br>1 UI<br>or DQS Input<br>Rx DATA (in)<br>or DQ Input<br>a tSU C c<br>tSU<br>tHD<br>tHD<br>Figure 4.8. Receiver RX.CLK.Aligned and DDR Memory Input Waveforms<br>1/2 UI 1/2 UI 1/2 UI 1/2 UI<br>Tx CLK (out)<br>or DQS Output<br>Tx DATA (out)<br>or DQ Output<br>tDVB/tDQVBS tDVB/tDQVBS<br>tDVA/tDQVA tDVA/tDQVAS<br>**----- End of picture text -----**<br>
**Figure 4.9. Transmit TX.CLK.Centered and DDR Memory Output Waveforms**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**==> picture [310 x 122] intentionally omitted <==**
**----- Start of picture text -----**<br>
1 1 UI 1<br>Tx CLK (out) '<br>e e1 | t<br>1t<br>t<br>tt<br>t<br>tt<br>t i}<br>t 1<br>Tx DATA (out)<br>t1<br>t t 1 1<br>t 1 1 1 1 1<br>tDIB tot ot tDIB toto<br>t1t<br>t i] t tDIA I t 1 tDIA<br>**----- End of picture text -----**<br>
**Figure 4.10. Transmit TX.CLK.Aligned Waveforms**
**Receiver – Shown for one LVDS Channel**
|0!<br>~~ia~~|0x<br>0x<br>0x<br>0x<br>0x<br>0x<br>0x<br>~~OX AX 2X SK 4X SK SX~~<br>0!<br>1!<br>~~ia~~|Bit #<br>10 – 1<br>11 – 2<br>12 – 3<br>13 – 4<br>14 – 5<br>15 – 6<br>16 – 7<br>~~SX OX 1X 2K SK 4X SK OX~~<br>1!<br>2<br>|<br>~~ia~~|Bit #<br>20 – 8<br>21 – 9<br>22 – 10<br>23 – 11<br>24 – 12<br>25 – 13<br>26 – 14<br>~~OX OX 1X 2K SK 4X SX OX~~<br>|<br>3}|Bit #<br>30 – 15<br>31 – 16<br>32 – 17<br>33 – 18<br>34 – 19<br>35 – 20<br>36 – 21<br>~~OX OX 1X 2X SK 4X SX 6X~~<br>3}<br>4)|Bit #<br>40 – 22<br>41 – 23<br>42 – 24<br>43 – 25<br>44 – 26<br>45 – 27<br>46 – 28<br>~~6X 0)~~<br>4)|
|---|---|---|---|---|---|
|**For each channel:**<br>**7-bit Output Words**<br>~~ia~~||||||
## **Transmitter – Shown for one LVDS Channel**
|# of Bits||||1<br>2|1<br>3|1<br>4|1<br>4|1<br>5<br>6<br>7||8|9|10<br>11|11 1213|1213<br>14|1213<br>14 15 16|17 18|18 19 20 21|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|Clock Out<br>Data Out<br>756 Mb/s|i)<br>0!|||~~CON AX ~~|~~2X ~~|~~SX ~~||~~ANE EXON ~~<br>i}<br>1!|||~~AN ~~|~~ZNSE ~~||~~ENON~~<br>i}<br>2||~~ZY ~~|~~AEX EX~~|
|108 MHz||||||||||||||||||
|||i)<br>1||||||||<br>1<br>1||||||<br>1<br>1||||
|Bit #||||||||Bit #|||||Bit #||||Bit #|
|**For each channel:**<br>00 – 1|00 – 1|||||||10 – 8|||||20 – 15|20 – 15|||30 – 22|
|**7-bit Output Words**<br>**to FPGA Fabric**<br>00 – 2<br>00 – 3<br>00 – 4|00 – 2<br>00 – 3<br>00 – 4|i)<br>1||||||11 – 9<br>12 – 10<br>13 – 11|i}<br>1||||21 – 16<br>22 – 17<br>23 – 18|21 – 16<br>22 – 17<br>23 – 18<br>i}<br>1|||31 – 23<br>32 – 24<br>33 – 25|
|00 – 5<br>00 – 6|00 – 5<br>00 – 6|i)<br>1||||||14 – 12<br>15 – 13|1<br>1||||24 – 19<br>25 – 20|24 – 19<br>25 – 20<br>1<br>1|||34 – 26<br>35 – 27|
|00 – 7|00 – 7|||||||16 – 14|||||26 – 21|26 – 21|||36 – 28|
**Figure 4.11. DDRX71 Video Timing Waveforms**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**==> picture [396 x 420] intentionally omitted <==**
**----- Start of picture text -----**<br>
Bit 0 Bit 1 Bit i<br>1/2 UI 1/2 UI<br>CLK (in) 1 UI<br>DATA (in)<br>ee tSU_0 ee om )<br>tHD_0<br>tSU_i<br>tHD_i<br>Figure 4.12. Receiver DDRX71_RX Waveforms<br>Bit 0 Bit 1 Bit i<br>1 UI<br>CLK (out)<br>DATA (out)<br>tDIB_0 oe<br>tDIA_0<br>tDIB_i<br>tDIA_i<br>**----- End of picture text -----**<br>
**Figure 4.13. Transmitter DDRX71_TX Waveforms**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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## **4.17. sysCLOCK PLL Timing (VCC = 1.0 V)**
Over recommended operating conditions.
## **Table 4.33. sysCLOCK PLL Timing (VCC = 1.0 V)**
|**Parameter**<br>~~Re~~|**Descriptions**<br>~~eG~~|**Conditions**<br>~~eG~~|**Min**<br>~~eG~~|**Typ. **<br>~~eG~~|**Max**<br>~~eG~~|**Unit**<br>~~eG~~|
|---|---|---|---|---|---|---|
|fIN<br>~~Re~~<br>~~eG~~|Input Clock Frequency (CLKI, CLKFB)<br>~~eG~~<br>~~eG~~|—<br>~~eG~~<br>~~eG~~|18<br>~~eG~~<br>~~eG~~|—<br>~~eG~~<br>~~eG~~|500<br>~~eG~~<br>~~eG~~|MHz<br>~~eG~~<br>~~eG~~|
|fOUT<br>~~eG~~|Output Clock Frequency<br>~~eG~~|—<br>~~eG~~|6.25<br>~~eG~~|—<br>~~eG~~|800<br>~~eG~~|MHz<br>~~eG~~|
|fVCO<br>~~eG~~|PLL VCO Frequency<br>~~eG~~|—<br>~~eG~~|800<br>~~eG~~|—<br>~~eG~~|1600<br>~~eG~~|MHz<br>~~eG~~|
|fPFD<br>~~a~~|Phase Detector Input Frequency<br>~~a~~|Without Fractional-N<br>Enabled<br>~~a~~|18<br>~~a~~<br>~~ee~~|—<br>~~a~~|500<br>~~a~~|MHz<br>~~a~~|
|||With Fractional-N Enabled<br>~~a~~<br>~~ee~~|18<br>~~a~~<br>~~ee~~<br>~~ee~~|—<br>~~a~~<br>~~ee~~|100<br>~~a~~<br>~~ee~~|MHz<br>~~a~~<br>~~ee~~|
|**AC Characteristics**<br>~~ee~~<br>~~Re~~<br>~~eeeG~~|||||||
|tDT<br>~~ee~~|Output Clock DutyCycle<br>~~eG~~|—<br>~~eG~~|45<br>~~eG~~|—<br>~~eG~~|55<br>~~eG~~|%<br>~~eG~~|
|tPH4<br>~~ee~~<br>~~eG~~|Output Phase Accuracy<br>~~eG~~<br>~~eG~~|—<br>~~eG~~<br>~~eG~~|–5<br>~~eG~~<br>~~eG~~|—<br>~~eG~~<br>~~eG~~|5<br>~~eG~~<br>~~eG~~|%<br>~~eG~~<br>~~eG~~|
|tOPJIT1|Output Clock Period Jitter<br>~~eee~~|fOUT≥ 200 MHz<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~|250<br>~~ee~~|psp-p<br>~~ee~~|
|||fOUT< 200 MHz<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.05<br>~~ee~~<br>~~ee~~<br>~~ee~~|UIPP<br>~~ee~~<br>~~ee~~<br>~~ee~~|
||Output Clock Cycle-to-Cycle Jitter<br>~~eee~~<br>~~eee~~|fOUT≥ 200 MHz<br>~~ee~~<br>~~ee~~<br>~~eee~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~eee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~<br>~~eee~~<br>~~ee~~<br>~~ee~~|250<br>~~ee~~<br>~~ee~~<br>~~eee~~<br>~~ee~~<br>~~ee~~|psp-p<br>~~ee~~<br>~~ee~~<br>~~eee~~<br>~~ee~~|
|||fOUT< 200 MHz<br>~~eee~~<br>~~ee~~|—<br>~~eee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|—<br>~~eee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.05<br>~~eee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|UIPP<br>~~eee~~<br>~~ee~~<br>~~ee~~|
||Output Clock Phase Jitter|fPFD≥ 200 MHz<br>~~ee~~|—<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br> ~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|250<br>~~ee~~<br>~~ee~~<br>~~ee~~|psp-p<br>~~ee~~<br>~~ee~~|
|||60 MHz ≤ fPFD< 200 MHz<br>~~ee~~|—<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|—<br> ~~ee~~<br>~~ee~~<br>~~ee~~|400<br>~~ee~~|psp-p<br>~~ee~~|
|||30 MHz ≤ fPFD< 60 MHz<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br> ~~ee~~<br>~~ee~~|500<br>~~ee~~<br>~~ee~~|psp-p<br>~~ee~~<br>~~ee~~|
|||18 MHz ≤ fPFD< 30 MHz<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~|725<br>~~ee~~<br>~~ee~~<br>~~ee~~|psp-p<br>~~ee~~<br>~~ee~~<br>~~ee~~|
||Output Clock Period Jitter (Fractional-N)<br>~~ee~~<br>~~ee~~|fOUT≥ 200 MHz<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|350<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|psp-p<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|
|||fOUT< 200 MHz<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>~~ee ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|0.07<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|UIPP<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|
||Output Clock Cycle-to-Cycle Jitter<br>(Fractional-N)<br>~~ee ~~|fOUT≥ 200 MHz<br> ~~eee~~|—<br>~~ee ee~~<br>~~eee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~<br>~~eee~~<br>~~ee~~|400<br>~~ee~~<br>~~eee~~|psp-p<br>~~ee~~<br>~~eee~~|
|||fOUT< 200 MHz<br> <br>~~ee~~|—<br>~~ee ee~~<br><br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br><br>~~ee~~<br>~~ee~~|0.08<br><br>~~ee~~|UIPP<br><br>~~ee~~|
|fBW3<br>~~eG~~<br>~~ee~~|PLL LoopBandwidth<br>~~ee ~~<br>~~eG~~<br>~~Ge~~|—<br> <br>~~ee~~<br>~~eG~~<br>~~Ge~~|0.45<br>~~ee ee~~<br><br>~~ee~~<br>~~ee ~~<br>~~eG~~<br>~~Ge~~|—<br>~~ee~~<br><br>~~ee~~<br> ~~ee~~<br>~~eG~~<br>~~Ge~~|13<br><br>~~ee~~<br>~~eG~~<br>~~Ge~~|MHz<br><br>~~ee~~<br>~~eG~~<br>~~Ge~~|
|tLOCK2<br>~~eG~~<br>~~ee~~<br>~~ee~~|PLL Lock-in Time<br>~~eG~~<br>~~Ge~~<br>~~eG~~|—<br>~~eG~~<br>~~Ge~~<br>~~eG~~|—<br>~~eG~~<br>~~Ge~~<br>~~eG~~|—<br>~~eG~~<br>~~Ge~~<br>~~eG~~|10<br>~~eG~~<br>~~Ge~~<br>~~eG~~|ms<br>~~eG~~<br>~~Ge~~<br>~~eG~~|
|tUNLOCK<br>~~ee~~<br>~~ee~~<br>~~es~~|PLL Unlock Time(from RESETgoes HIGH)<br>~~Ge~~<br>~~eG~~<br>~~eee~~|—<br>~~Ge~~<br>~~eG~~<br>~~eee~~|—<br>~~Ge~~<br>~~eG~~<br>~~eee~~|—<br>~~Ge~~<br>~~eG~~<br>~~eee~~|50<br>~~Ge~~<br>~~eG~~<br>~~eee~~|ns<br>~~Ge~~<br>~~eG~~<br>~~eee~~|
|tIPJIT<br>~~ee~~<br>~~es~~<br>~~ee~~|Input Clock Period Jitter<br>~~eG~~<br>~~eee~~<br>|fPFD≥ 20 MHz<br>~~eG~~<br>~~eee~~<br>|—<br>~~eG~~<br>~~eee~~<br>~~ee~~<br>|—<br>~~eG~~<br>~~eee~~<br>~~ee~~<br>|500<br>~~eG~~<br>~~eee~~<br>|psp-p<br>~~eG~~<br>~~eee~~<br>|
|||fPFD< 20 MHz<br>~~eee~~<br>~~ee~~<br>|—<br>~~eee~~<br>~~ee~~<br>~~ee~~<br>|—<br>~~eee~~<br>~~ee~~<br>~~ee~~<br>|0.01<br>~~eee~~<br>~~ee~~<br>|UIPP<br>~~eee~~<br>~~ee~~<br>|
|tHI<br>~~es~~<br>~~ee~~<br>~~ee~~|Input Clock High Time<br>~~eee~~<br>~~eG~~<br>|90% to 90%<br>~~eee~~<br>~~ee~~<br>~~eG~~<br>|0.5<br>~~eee~~<br>~~ee~~<br>~~ee~~<br>~~eG~~<br>|—<br>~~eee~~<br>~~ee~~<br>~~ee~~<br>~~eG~~<br>|—<br>~~eee~~<br>~~ee~~<br>~~eG~~<br>|ns<br>~~eee~~<br>~~ee~~<br>~~eG~~<br>|
|tLO<br>~~ee~~<br>~~ee~~<br>~~ee~~|Input Clock Low Time<br>~~eG~~<br>~~Ge~~<br>|10% to 10%<br>~~eG~~<br>~~Ge~~<br>|0.5<br>~~ee ~~<br>~~eG~~<br>~~Ge~~<br>|—<br> ~~ee~~<br>~~eG~~<br>~~Ge~~<br>|—<br>~~eG~~<br>~~Ge~~<br>|ns<br>~~eG~~<br>~~Ge~~<br>|
|tRST<br><br>~~ee~~<br>~~ee~~|RST/ Pulse Width<br>~~eG~~<br>~~Ge~~<br>~~eG~~|—<br>~~eG~~<br>~~Ge~~<br>~~eG~~|1<br>~~eG~~<br>~~Ge~~<br>~~eG~~|—<br>~~eG~~<br>~~Ge~~<br>~~eG~~|—<br>~~eG~~<br>~~Ge~~<br>~~eG~~|ms<br>~~eG~~<br>~~Ge~~<br>~~eG~~|
|fSSC_MOD<br><br>~~ee~~<br>~~a~~|Spread Spectrum Clock Modulation<br>Frequency<br>~~Ge~~<br>|—<br>~~Ge~~<br>|20<br>~~Ge~~<br>|—<br>~~Ge~~<br>|200<br>~~Ge~~<br>|kHz<br>~~Ge~~<br>|
|fSSC_MOD_AMP<br>~~a~~|Spread Spectrum Clock Modulation<br>Amplitude Range|—|0.25|—|2.00|%|
|fSSC_MOD_STEP<br>~~a~~|Spread Spectrum Clock Modulation<br>Amplitude StepSize|—|—|0.25|—|%|
**Notes** :
1. Jitter sample is taken over 10,000 samples for Period jitter, and 1,000 samples for Cycle-to-Cycle jitter of the primary PLL output with clean reference clock with no additional I/O toggling.
2. Output clock is valid after tLOCK for PLL reset and dynamic delay adjustment.
3. Result from Lattice Radiant software.
4. CLKOS as compared to CLKOP output for one phase step at the maximum VCO frequency.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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## **4.18. Internal Oscillators Characteristics**
**Table 4.34. Internal Oscillators (VCC = 1.0 V)**
|**Symbol**|**Parameter Description**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|
|fCLKHF|HFOSC Clock Frequency|418.5|450|481.5|MHz|
|fCLKLF|LFOSC Clock Frequency|18.2|32|45.8|kHz|
|DCHCLKHF|HFOSC DutyCycle (Clock High Period)|43|50|57|%|
|DCHCLKLF|LFOSC Duty Cycle (Clock High Period)|45|50|55|%|
## **4.19. User I[2] C Characteristics**
**Table 4.35. User I[2] C Specifications (VCC = 1.0 V)**
|**Symbol**|**Parameter**<br>**Description**|**STD Mode**|**STD Mode**|**STD Mode**|**FAST Mode**|**FAST Mode**|**FAST Mode**|**FAST Mode Plus2**|**FAST Mode Plus2**|**FAST Mode Plus2**|**Unit**|
|---|---|---|---|---|---|---|---|---|---|---|---|
|||**Min**|**Typ**|**Max**|**Min**|**Typ**|**Max**|**Min**|**Typ**|**Max**||
|fscl|SCL Clock<br>Frequency|—|—|100|—|—|400|—|—|1000|kHz|
|TDELAY|Optional delay<br>through delayblock|—|62|—|—|62|—|—|62|—|ns|
**Notes** :
1. Refer to the I[2] C Specification for timing requirements. User design should set constraints in Lattice Design Software to meet this industrial I[2] C Specification.
2. Fast Mode Plus maximum speed may be achieved by using external pull up resistor on I[2] C bus. Internal pull up may not be sufficient to support the maximum speed.
## **4.20. Analog-Digital Converter (ADC) Block Characteristics**
**Table 4.36. ADC Specifications[1]**
|**Symbol**<br>~~CC~~<br>~~a~~|**Description**<br>~~CC~~<br>~~ee~~|**Condition**<br>~~CC~~<br>~~ee~~|**Min**<br>~~CC~~<br>~~ee~~|**Typ**<br>~~CC~~<br>~~ee~~|**Max**<br>~~CC~~<br>~~ee~~|**Unit**<br>~~CC~~<br>~~ee~~|
|---|---|---|---|---|---|---|
|VREFINT_ADC<br>~~a~~<br>~~**a**~~|ADC Internal Reference<br>Voltage<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|1.142<br>~~ee~~<br>~~ee~~|1.2<br>~~ee~~<br>~~ee~~|1.262<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|VREFEXT_ADC<br>~~a ~~<br>~~**a**~~|ADC External Reference<br>Voltage<br> ~~ee~~<br>~~ee~~|—<br>~~ee ~~<br>~~ee~~|1.0<br> ~~ee ~~<br>~~ee~~|—<br> ~~ee ~~<br>~~ee~~|1.8<br> ~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|NRES_ADC<br>~~**a**~~|ADC Resolution<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|12<br>~~ee~~|—<br>~~ee~~|bit<br>~~ee~~|
|ENOBADC<br>~~a~~|Effective Number of Bits<br>~~a~~|—<br>~~re~~|9.9<br>~~eee~~|11<br>~~eee~~|—<br>~~eee~~|bit<br>~~eee~~|
|VSR_ADC<br>~~a~~<br>~~i~~|ADC Input Range<br>~~a~~|Bipolar Mode, Internal VREF<br>~~re~~<br>~~a~~|VCM_ADC ―<br>VREFINT_ADC/4<br>~~eee~~<br>~~eee~~|VCM_ADC<br>~~eee~~<br>~~eee~~|VCM_ADC+<br>VREFINT_ADC/4<br>~~eee~~<br>~~eee~~|V<br>~~eee~~<br>~~eee~~|
|||Bipolar Mode, External VREF<br>~~re ~~<br>~~a~~|VCM_ADC ―<br>VREFEXT_ADC/4<br> ~~eee~~<br>~~eee~~|VREFEXT_ADC<br>~~eee ~~<br>~~eee~~|VCM_ADC+<br>VREFEXT_ADC/4<br> ~~eee~~<br>~~eee~~<br>~~ee~~|V<br>~~eee~~<br>~~eee~~<br>~~ee~~|
|||Uni-polar Mode, Internal<br>VREF<br>~~a~~<br>~~ee~~|0<br>~~eee~~<br>~~ee~~|—<br>~~eee ~~<br>~~ee~~<br>~~ee~~|VREFINT_ADC<br> ~~eee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|V<br>~~eee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|||Uni-polar Mode, External<br>VREF<br>~~ee~~<br>~~ee~~|0<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~|VREFEXT_ADC<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|VCM_ADC<br>~~i~~<br>~~eS~~|ADC Input Common Mode<br>Voltage (for fully differential<br>signals)<br>|Internal VREF<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|½VREFINT_ADC<br>~~ee~~<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|||External VREF<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|½VREFEXT_ADC<br>~~ee~~<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|fCLK_ADC<br>~~i~~<br>~~eS~~|ADC Clock Frequency<br>~~a~~|—<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|25<br>~~ee ~~<br>~~ee~~<br>~~ee~~|40<br> ~~ee~~<br>~~ee~~<br>~~ee~~|MHz<br>~~ee~~<br>~~ee~~|
|DCCLK_ADC<br>~~eS ~~<br>~~a~~|ADC Clock DutyCycle<br> ~~a~~<br>~~a~~<br>~~a~~|—<br>~~a~~|48<br>~~ee ~~|50<br> ~~ee ~~|52<br> ~~ee~~|%|
|fINPUT_ADC<br>~~a~~|ADC Input Frequency<br>~~a~~<br>~~a~~|—|—|—|500|kHz|
|FSADC<br>~~a~~|ADC SamplingRate<br>~~a~~<br>~~a~~|—<br>~~a~~|—|1|—|MS/s|
|NTRACK_ADC<br>~~a~~|ADC Input TrackingTime<br>~~a~~|—|4|—|—|cycle3|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-DS-02086-2.0
139
**CertusPro-NX Family Data Sheet**
|**Symbol**<br>~~pO~~|**Description**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RIN_ADC<br>~~pO~~<br>~~a~~|ADC Input Equivalent<br>Resistance<br>|—<br>|—<br>|116<br>|—<br>|KΩ<br>|
|tCAL_ADC<br>~~GG~~|ADC Calibration Time<br>~~GG~~|—<br>~~GG~~|—<br>~~GG~~|—<br>~~GG~~|6500<br>~~GG~~|cycle3<br>~~GG~~|
|LOUTPUT_ADC<br>~~a~~|ADC Conversion Time<br>~~a~~|Includes minimum tracking<br>time of four cycles<br>~~a~~|25<br>~~a~~|—<br>~~a~~|—<br>~~a~~|cycle3<br>~~a~~|
|DNLADC<br>~~a~~<br>~~a~~|ADC Differential<br>Nonlinearity<br>~~a~~|—<br>~~a~~|–1<br>~~a~~<br>~~GO~~|—<br>~~a~~<br>~~GO~~|1<br>~~a~~<br>~~GO~~|LSB<br>~~a~~|
|INLADC<br>~~a~~<br>~~a~~|ADC Integral Nonlinearity<br>~~a~~|—<br>~~a~~|–2<br>~~a~~<br>~~GO~~|—<br>~~a~~<br>~~GO~~|2.21<br>~~a~~<br>~~GO~~|LSB<br>~~a~~|
|SFDRADC<br>~~a~~|ADC Spurious Free Dynamic<br>Range|—|65.8<br>~~GO~~|77<br>~~GO~~|—<br>~~GO~~|dBc|
|THDADC<br>~~a~~|ADC Total Harmonic<br>Distortion|—|—|–76|–66.4|dB|
|SNRADC<br>~~a ~~|ADC Signal to Noise Ratio<br> ~~a~~|—<br>~~GG~~|61.6<br>~~GG~~|68<br>~~GG~~|—<br>~~GG~~|dB<br>~~GG~~|
|SNDRADC<br>~~a~~|ADC Signal to Noise Plus<br>Distortion Ratio|—|61.5|67|—|dB|
|ERRGAIN_ADC<br>~~a~~<br>~~Ge~~|ADC Gain Error<br>~~Ge~~|—<br>~~GG~~|–0.5<br>~~GG~~|—<br>~~GG~~|0.5<br>~~GG~~|% FSADC<br>~~GG~~|
|ERROFFSET_ADC<br>~~GG~~|ADC Offset Error<br>~~GG~~|—<br>~~GG~~|–2<br>~~GG~~|—<br>~~GG~~|2<br>~~GG~~|LSB<br>~~GG~~|
|CIN_ADC<br>~~a~~|ADC Input Equivalent<br>Capacitance|—|—|2|—|pF|
**Notes** :
1. ADC is available in select speed grades. See ordering information.
2. Not tested; guaranteed by design.
3. ADC Sample Clock cycles. See ADC User Guide for Nexus Platform (FPGA-TN-02129) for more details.
## **4.21. Comparator Block Characteristics**
**Table 4.37. Comparator Specifications**
|**Symbol**|**Description**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|
|fIN_COMP|Comparator Input Frequency|—|—|10|MHz|
|VIN_COMP|Comparator Input Voltage|0|—|VCCADC18|V|
|VOFFSET_COMP|Comparator Input Offset|–34.3|—|36.44|mV|
|VHYST_COMP|Comparator Input Hysteresis|10|—|31.62|mV|
|VLATENCY_COMP|Comparator Latency|—|—|31.24|ns|
## **4.22. Digital Temperature Readout Characteristics**
Digital temperature Readout (DTR) is implemented in one of the internal Analog-Digital-Converter (ADC) channels.
**Table 4.38. DTR Specifications**[1, 2]
|**Symbol**|**Description**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|DTRRANGE|DTR Detect Temperature<br>Range|—|–40|—|125|°C|
|DTRACCURACY|DTR Accuracy|with external voltage<br>reference range of 1.0 V<br>to 1.8 V|–16|±6|16|°C|
|DTRRESOLUTION|DTR Resolution|with external voltage<br>reference|–0.3|—|0.3|°C|
**Notes** :
1. External voltage reference (VREF) should be 0.1% accurate or better. DTR sensitivity to VREF is -4.1 °C per VREF per-cent (for example, if the VREF is 1 % low, then the DTR will read +4.1 °C high).
2. DTR is available in select speed grades. See ordering information.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
140
**CertusPro-NX Family Data Sheet**
## **4.23. SERDES High-Speed Data Transmitter**
**Table 4.39. Serial Output Timing and Levels**
|**Symbol**<br>~~a~~|**Description**<br>~~a~~|**Condition**<br>~~a~~|**Min**<br>~~a~~|**Typ**<br>~~a~~|**Max**<br>~~a~~|**Unit**<br>~~a~~|
|---|---|---|---|---|---|---|
|**Transmitter 5 Gbps**<br>~~a~~|||||||
|VTX-DIFF-PP<br>~~a~~|Peak-Peak Differential voltage on<br>selected amplitude1, 2<br>~~a~~<br>~~ee~~|—<br>~~a~~<br>~~ee~~|800<br>~~a~~<br>~~ee~~|1000<br>~~a~~<br>~~ee~~|1300<br>~~a~~<br>~~ee~~|mV,<br>p-p<br>~~a~~<br>~~ee~~|
|VTX-CM-DC<br>~~a~~|Output common mode voltage1, 2|—|400|500|650|mV,<br>p-p|
|VTX-EH<br>~~a~~|Transmitter Eye Height1, 2<br>|—<br>|565<br>|740<br>|—<br>|mV,<br>p-p<br>|
|VTX-EW<br>~~ee~~|Transmitter Eye width(alljitter sources)<br>~~ee~~|—<br>~~ee~~|170<br>~~ee~~|180<br>~~ee~~|—<br>~~ee~~|ps<br>~~ee~~|
|TTX-R<br>~~a~~|Transmitter Eye Rise time(20% to 80%)<br>~~a~~|—<br>~~a~~|56<br>~~a~~|—<br>~~a~~|70<br>~~a~~|ps<br>~~a~~|
|TTX-F<br>~~a~~|Transmitter Eye Fall time(80% to 20%)<br>~~a~~|—<br>~~a~~|56<br>~~a~~|—<br>~~a~~|70<br>~~a~~|ps<br>~~a~~|
|**Transmitter 1.25 Gbps**<br>~~a~~<br>~~a~~<br>~~ee~~<br>~~a~~|||||||
|VTX-DIFF-PP<br>~~a~~<br>~~a~~<br>~~a~~|Peak-Peak Differential voltage on<br>selected amplitude1, 2<br>~~a~~<br>~~a~~<br>~~a~~<br>|—<br>~~a~~<br>~~a~~<br>~~ee~~<br>|800<br>~~a~~<br>~~a~~<br>~~ee~~<br>|1000<br>~~a~~<br>~~a~~<br>|1300<br>~~a~~<br>~~a~~<br>|mV,<br>p-p<br>~~a~~<br>~~a~~<br>|
|VTX-CM-DC<br>~~a~~<br>~~a~~|Output common mode voltage1, 2<br>~~a~~<br>~~a~~<br>|—<br>~~a~~<br>~~ee~~<br>|400<br>~~a~~<br>~~ee~~<br>|500<br>~~a~~<br>|650<br>~~a~~<br>|mV,<br>p-p<br>~~a~~<br>|
|VTX-EH<br>~~a~~|Transmitter Eye Height1, 2<br>~~ee~~|—<br>~~ee~~|645<br>~~ee~~|800<br>~~ee~~|—<br>~~ee~~|mV,<br>p-p<br>~~ee~~|
|VTX-EW<br>~~a~~|Transmitter Eye width(alljitter sources)<br>~~a~~|—<br>~~a~~|770<br>~~a~~|780<br>~~a~~|—<br>~~a~~|ps<br>~~a~~|
|TTX-R<br>~~a~~<br>~~a~~|Transmitter Eye Rise time(20% to 80%)<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|63<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|81<br>~~a~~<br>~~a~~|ps<br>~~a~~<br>~~a~~|
|TTX-F<br>~~a~~<br>~~a~~|Transmitter Eye Fall time(80% to 20%)<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|63<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|81<br>~~a~~<br>~~a~~|ps<br>~~a~~<br>~~a~~|
|**Transmitter All Rates**<br>~~a~~|||||||
|TTX-CM-AC-P<br>~~a~~|RMS AC peak common-mode output<br>voltage<br>~~a~~<br>~~ee~~|—<br>~~a~~<br>~~ee~~|—<br>~~a~~<br>~~ee~~|—<br>~~a~~<br>~~ee~~|20<br>~~a~~<br>~~ee~~|mV<br>~~a~~<br>~~ee~~|
|ZTX_DIFF-DC<br>~~a~~|DC Differential Impedance<br>~~a~~|—<br>~~a~~|80<br>~~a~~|—<br>~~a~~|120<br>~~a~~|Ω<br>~~a~~|
|RLTX_DIFF<br>~~Pf~~|Tx Differential Return Loss (with package<br>included)<br>~~Pf~~|50 MHz < freq< 1.25 GHz<br>~~**a**~~|10<br>~~**a**~~<br>~~a~~|—<br>~~**a**~~|—<br>~~**a**~~|dB<br>~~**a**~~|
|||1.25 GHz < freq< 2.5 GHz<br>~~**a**~~|8<br>~~**a**~~<br>~~a~~<br>~~a~~|—<br>~~**a**~~|—<br>~~**a**~~|dB<br>~~**a**~~|
|||2.5 GHz < freq< 4 GHz<br>~~**a**~~<br>~~a~~|4<br>~~**a**~~<br>~~a~~<br>~~a~~<br>~~aa~~|—<br>~~**a**~~<br>~~a~~|—<br>~~**a**~~<br>~~a~~|dB<br>~~**a**~~<br>~~a~~|
|||4GHz < freq<= 5 GHz<br>~~**a**~~<br>~~a~~|4<br>~~**a**~~<br>~~a~~<br>~~aa~~|—<br>~~**a**~~<br>~~a~~|—<br>~~**a**~~<br>~~a~~|dB<br>~~**a**~~<br>~~a~~|
|RLTX_COM<br>~~0~~|Tx Common mode Return Loss (with<br>package included)|50 MHz < freq< 2.5 GHz<br>~~ee~~|6<br>~~a~~<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|dB<br>~~ee~~|
|||2.5 GHz < freq<= 4 GHz<br>~~ee~~|3<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|dB<br>~~ee~~|
|||4GHz < freq<= 5 GHz<br>~~ee~~<br>~~a~~|3<br>~~ee~~<br>~~a~~|—<br>~~ee~~<br>~~a~~|—<br>~~ee~~<br>~~a~~|dB<br>~~ee~~<br>~~a~~|
**Notes** :
1. Measured with 50 Ω Tx Driver impedance at VCCHTX±5%. Fixture de-embedded.
2. Refer to CertusPro-NX SerDes/PCS Usage Guide (FPGA-TN-02245) for settings of Tx amplitude.
**Table 4.40. Channel Output Jitter**
|**Symbol**<br>~~a~~|**Description**<br>~~a~~<br>~~a~~|**Min**<br>~~a~~<br>~~a~~|**Typ**<br>~~a~~<br>~~a~~|**Max**<br>~~a~~<br>~~a~~|**Unit**<br>~~a~~<br>~~a~~|
|---|---|---|---|---|---|
|**Transmitter 8 Gbps**1<br>~~a~~||||||
|TTX-UTJ<br>~~a~~|8 Gbps Transmitter EyeTx Uncorrelated Total Jitter1<br>~~a~~<br>~~a~~|—<br>~~a~~|—<br>~~a~~|31.25<br>~~a~~|ps, p-p<br>~~a~~|
|TTX-UDJDD<br>~~a~~|8 Gbps Transmitter EyeTx Uncorrelated Deterministic<br>~~a~~|—<br>~~a~~|—<br>~~a~~|12<br>~~a~~|ps, p-p<br>~~a~~|
|TTX-UPW-TJ<br>~~a~~<br>~~a~~|8 Gbps Transmitter EyeTx Uncorrelated PW Total Jitter1<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|24<br>~~a~~<br>~~a~~|ps, p-p<br>~~a~~<br>~~a~~|
|TTX-UPW-DJDD<br>~~a~~|8 Gbps Transmitter EyeTx Uncorrelated PW Deterministic<br>~~a~~|—<br>~~a~~|—<br>~~a~~|10<br>~~a~~|ps, p-p<br>~~a~~|
|TTX-DJDD<br>~~a~~<br>~~a~~|8 Gbps Transmitter EyeTx Deterministic Jitter1<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|18<br>~~a~~<br>~~a~~|ps, p-p<br>~~a~~<br>~~a~~|
|TTX-RJ<br>~~a~~|8 Gbps Transmitter EyeTx RMS jitter < 1.5 MHz1<br>~~a~~|—<br>~~a~~|—<br>~~a~~|1<br>~~a~~|ps, RMS<br>~~a~~|
|**Transmitter 5 Gbps**3<br>~~a~~<br>~~a~~||||||
|TTX-DJ<br>~~a~~|5 Gbps Transmitter Deterministic Jitter3<br>~~a~~|—<br>~~a~~|—<br>~~a~~|22<br>~~a~~|ps, p-p<br>~~a~~|
|TTX-RJ<br>~~a~~<br>~~a~~|5 Gbps Transmitter Random Jitter3<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|1<br>~~a~~<br>~~a~~|ps, RMS<br>~~a~~<br>~~a~~|
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-DS-02086-2.0
141
**CertusPro-NX Family Data Sheet**
|**Symbol**<br>~~a~~|**Description**<br>~~a~~|**Min**<br>~~a~~<br>~~a~~|**Typ**<br>~~a~~|**Max**<br>~~a~~|**Unit**<br>~~a~~|
|---|---|---|---|---|---|
|TTX-TJ<br>~~a~~|5 Gbps Transmitter Total Jitter3<br>~~a~~|—<br>~~a~~<br>~~a~~|—<br>~~a~~|38<br>~~a~~|ps, p-p<br>~~a~~|
|**Transmitter 3.125 Gbps**3<br>~~a~~||||||
|TTX-DJ<br>~~a~~|3.125 Transmitter Gbps Deterministic Jitter3<br>~~a~~|—<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|20<br>~~a~~<br>~~a~~|ps, p-p<br>~~a~~|
|TTX-RJ<br>~~a~~|3.125 Transmitter Gbps Random Jitter3<br>~~a~~|—<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|1<br>~~a~~<br>~~a~~|ps, RMS<br>~~a~~|
|TTX-TJ<br>~~a~~|3.125 Transmitter Gbps Total Jitter3<br>~~a~~|—<br>~~a~~<br>~~a~~|—<br>~~a~~<br>~~a~~|40<br>~~a~~<br>~~a~~|ps, p-p<br>~~a~~|
|**Transmitter 2.5 Gbps**3<br>~~a~~||||||
|TTX-DJ<br>~~a~~|2.5 Transmitter Gbps Deterministic Jitter3<br>~~a~~|—<br>~~a~~|—<br>~~a~~|20<br>~~a~~|ps, p-p<br>~~a~~|
|TTX-RJ<br>~~a~~|2.5 Transmitter Gbps Random Jitter3<br>~~a~~|—<br>~~a~~|—<br>~~a~~|1<br>~~a~~|ps, RMS<br>~~a~~|
|TTX-TJ<br>~~a~~|2.5 Transmitter Gbps Total Jitter3<br>~~a~~|—<br>~~a~~|—<br>~~a~~|40<br>~~a~~|ps, p-p<br>~~a~~|
|**Transmitter 1.25 Gbps**3<br>~~a~~||||||
|TTX-DJ<br>~~a~~|1.25 Transmitter Gbps Deterministic Jitter3<br>~~a~~|—<br>~~a~~|—<br>~~a~~|20<br>~~a~~|ps, p-p<br>~~a~~|
|TTX-RJ<br>~~a~~|1.25 Transmitter Gbps Random Jitter3<br>~~a~~|—<br>~~a~~|—<br>~~a~~|1<br>~~a~~|ps, RMS<br>~~a~~|
|TTX-TJ<br>~~a~~|1.25 Transmitter Gbps Total Jitter3<br>~~a~~|—<br>~~a~~|—<br>~~a~~|40<br>~~a~~|ps, p-p<br>~~a~~|
1. 8.0 Gbps complies with PCIe 3.0 standards, and the jitter is decomposed as in the table. The pattern used was the PCIe compliance CJPAT.
2. 10.3125 Gbps rates were taken with the DCA-J at PRBS 2N^15 - 1 as it has the highest density that would align without resorting to external common clock triggering;
- 10 Gb/s was characterized on the transmitter side (DCA-J). The spec calls out for all TX measurements to be taken while a plesio-chronous RX of the same channel is running;
- PRBS31 setting the second BERT to run PRBS31 and ran it into the RX on that channel, then the TX is running off of the BERT refclock/ppg, and using the internal generator instead of loopback.
3. All other rates were taken with the DCA-J at PRBS 2N^7 - 1.
## **4.24. SERDES High-Speed Data Receiver**
|**Symbol**<br>~~es~~|**Description**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|VRX-DIFF-S<br>~~es~~<br>~~a~~<br>~~a~~|Differential input sensitivity1<br>~~ee~~<br>|—<br>~~ee~~<br>|100<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>|1200<br>~~ee~~<br>~~ee~~<br>|mV,<br>p-p<br>~~ee~~<br>~~ee~~<br>|
|VRX-IN<br>~~a~~<br>~~a~~<br>~~a~~<br>~~a~~|Input levels<br>~~ee~~<br>~~ee~~<br><br>|—<br>~~ee~~<br>~~ee~~<br><br>|25<br>~~ee~~<br>~~ee~~<br><br>|—<br>~~ee~~<br>~~ee~~<br>~~ee~~<br><br>~~ee~~<br>|1300<br>~~ee~~<br>~~ee~~<br>~~ee~~<br><br>~~ee~~<br>|mV,<br>p-p<br>~~ee~~<br>~~ee~~<br>~~ee~~<br><br>~~ee~~<br>|
|RX_SSC<br>~~a~~<br>~~a~~<br>~~a~~|JTOL BER with SSC (.5%Dev 33 kHz<br>Triangle Down Conv.)<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|–5000<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|ppm<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|
|ZRX-DIFF-DC<br>~~a~~<br>~~a~~|Receiver DC differential impedance<br>~~ee~~<br>|—<br>~~ee~~<br>|80<br>~~ee~~<br>|—<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|120<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|Ω<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|
|ZRX-HIGH_IMP-DC<br>~~apf~~|Receiver DC differential impedance when<br>powered down<br>~~pf~~|termination_at_-150mv<br>~~ee~~|1K<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~<br>~~ee~~|KΩ<br>~~ee~~<br>~~ee~~|
|||termination_at_0V<br>~~ee~~|10K<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|KΩ<br>~~ee~~|
|||termination_at_200mv<br>~~ee~~<br>~~a~~|20K<br>~~ee~~<br>~~es ~~<br>~~a~~|—<br>~~ee~~<br> ~~ee ~~<br>~~a~~|—<br>~~ee~~<br> ~~ee~~<br>~~a~~|KΩ<br>~~ee~~<br>~~a~~|
|RLRX-DIFF<br>~~pf~~<br>~~===~~<br>~~—~~|Receiver differential Return Loss, package<br>plus silicon<br>~~pf~~<br>~~===~~<br>~~———_——~~|50 MHz < freq< 1.25 GHz<br>~~ee~~<br>~~a~~<br>~~===~~|10<br>~~ee~~<br>~~a~~<br>~~===~~<br>~~**e**~~|—<br>~~ee~~<br>~~a~~<br>~~===~~<br>~~**e**e~~|—<br>~~ee~~<br>~~a~~<br>~~===~~|dB<br>~~ee~~<br>~~a~~<br>~~===~~|
|||1.25 GHz < freq< 2.5 GHz<br>~~===~~<br>~~ee~~<br>|8<br>~~===~~<br>~~ee~~<br>~~**e**~~<br>~~**e**s a~~|—<br>~~===~~<br>~~ee~~<br>~~**e**e~~<br>~~a~~|—<br>~~===~~<br>~~ee~~|dB<br>~~===~~<br>~~ee~~|
|||2.5 GHz < freq< 4 GHz<br>~~===~~<br>~~ee~~<br>~~e~~<br>|5<br>~~===~~<br>~~ee~~<br>~~**e**~~<br>~~e~~~~**e**s a~~<br>~~es~~|—<br>~~===~~<br>~~ee~~<br>~~**e**e~~<br>~~a~~<br>~~ee~~|—<br>~~===~~<br>~~ee~~<br>~~a~~|dB<br>~~===~~<br>~~ee~~|
|||4 GHz < freq<= 5 GHz<br>~~===~~<br><br>~~e~~<br>~~_——~~|3.5<br>~~===~~<br>~~**e**s a~~<br>~~ees~~<br>~~_——~~|—<br>~~===~~<br>~~a~~<br>~~ee~~<br>~~_——~~|—<br>~~===~~<br>~~a~~|dB<br>~~===~~|
|RLRX-CM<br>~~—~~<br>~~es~~|Receiver common mode Return Loss,<br>package plus silicon<br>~~———_——~~<br>|50 MHz < freq< 2.5 GHz<br><br>~~_——~~|6<br>~~es ~~<br>~~_——~~<br>~~**e**e~~|—<br> ~~ee ~~<br>~~_——~~<br>~~a~~|—<br> ~~a~~|dB|
|||2.5 GHz < freq<= 4 GHz<br>~~_——~~<br>~~ee~~<br>|5<br>~~_——~~<br>~~ee~~<br>~~**e**e~~<br>~~**e**e~~<br>|—<br>~~_——~~<br>~~ee~~<br>~~a~~<br>~~e~~~~**e**~~|—<br>~~ee~~|dB<br>~~ee~~|
|||4.0 GHz < freq<= 5 GHz<br>~~_——~~<br>~~ee~~<br>~~e~~<br>|3.5<br>~~_——~~<br>~~ee~~<br>~~**e**e ~~<br>~~e~~<br>~~**e**e~~<br>|—<br>~~_——~~<br>~~ee~~<br> ~~a~~<br>~~e~~~~**e**~~|—<br>~~ee~~|dB<br>~~ee~~|
|VRX-LOS3<br>~~—~~<br>~~es~~|Los of signal Detect Threshold<br>~~———_——~~<br>~~ee~~|50 MHz < freq<= 1.25 GHz<br>~~_——~~<br>~~e~~<br>~~ee~~|0.06<br>~~_——~~<br>~~e~~<br>~~**e**e~~<br>~~ee~~<br>~~s~~|—<br>~~_——~~<br>~~e~~~~**e**~~<br>~~e~~|0.175<br>~~ee~~|V,p-p|
|||1.25 GHz < freq< 1.5 GHz<br>~~ee~~<br>~~ee~~|0.065<br>~~**e**e~~<br>~~ee~~<br>~~ee~~<br>~~s~~|—<br>~~e~~~~**e**~~<br>~~ee~~<br>~~e~~|0.175<br>~~ee~~<br>~~ee~~|V,p-p<br>~~ee~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
142
**CertusPro-NX Family Data Sheet**
2. Refer to PCIe RX stress test.
3. Loss of signal Detect Threshold has a frequency dependency that effects threshold voltage at temperature dependency where –40 °C is the worst case therefore the two conditions.
## **4.25. Input Data Jitter Tolerance**
The receiver’s ability to tolerate incoming signal jitter is very dependent on jitter type. High-speed serial interface standards have recognized the dependency on jitter type and have specifications to indicate tolerance levels for different jitter types as they relate to specific protocols. Sinusoidal jitter is considered to be a worst-case jitter type.
**Table 4.42. Receiver Total Jitter Tolerance Specification[1]**
|**Protocol**<br>~~pO~~<br>~~|~~|**Description**<br>~~pO~~<br>~~|~~|**Frequency**<br>~~pO~~|**Condition**<br>~~pO~~<br>~~eG~~|**Min**<br>~~pO~~<br>~~eG~~|**Typ**<br>~~pO~~<br>~~eG~~|**Max**<br>~~pO~~<br>~~eG~~|**Unit**<br>~~pO~~<br>~~eG~~|
|---|---|---|---|---|---|---|---|
|PCIe<br>~~|~~|Deterministic<br>~~|~~|5 Gbps<br> <br>~~po~~|See PCIe Spec<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|UI<br>~~eG~~|
||Random<br>~~|~~<br>~~J ~~||See PCIe Spec<br>~~eG~~<br> ~~eG~~|—<br>~~eG~~<br>~~eG~~|—<br>~~eG~~<br>~~eG~~|—<br>~~eG~~<br>~~eG~~|ps, RMS<br>~~eG~~<br>~~eG~~|
||Total<br>~~|~~<br>~~J~~||See PCIe Spec<br>~~eG~~<br>~~po~~|—<br>~~eG~~|—<br>~~eG~~|0.4<br>~~eG~~|UI<br>~~eG~~|
||Deterministic<br>~~J~~|2.5 Gbps<br>~~po~~<br> <br>~~ee~~<br>~~ee~~|400 mV differential eye<br>~~po~~|—|—|—|UI|
||Random<br>~~J~~<br>~~J ~~<br>~~ee~~||400 mV differential eye<br>~~po~~<br> ~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|ps, RMS<br>~~ee~~<br>~~es~~|
||Total<br>~~ee~~<br>~~ee~~||400 mV differential eye<br>~~es~~<br>~~pO~~|—<br>~~es~~<br>~~pO~~|—<br>~~es~~<br>~~pO~~|0.4<br>~~es~~<br>~~pO~~|UI<br>~~es~~<br>~~pO~~|
|Ethernet<br>~~pT~~<br>~~|~~<br>~~)~~|Deterministic<br>~~ee~~<br>~~ee~~<br>~~P|~~|6.25 Gbps<br>~~ee ~~<br>~~ee ~~<br>~~P| ~~<br>|See RXAUI Spec, PRBS31<br> ~~es~~<br>~~pO~~<br>~~es~~|—<br>~~es~~<br>~~pO~~<br>~~es~~|—<br>~~es~~<br>~~pO~~<br>~~es~~|—<br>~~es~~<br>~~pO~~<br>~~es~~|UI<br>~~es~~<br>~~pO~~<br>~~es~~|
||Random<br>~~ee~~<br>~~P|~~||See RXAUI Spec, PRBS31<br> ~~pO~~<br>~~es~~|—<br>~~pO~~<br>~~es~~|—<br>~~pO~~<br>~~es~~|—<br>~~pO~~<br>~~es~~|ps, RMS<br>~~pO~~<br>~~es~~|
||Total<br>~~P|~~<br>~~J ~~||See RXAUI Spec, PRBS31<br> ~~es~~<br> ~~eG~~|—<br>~~es~~<br>~~eG~~|—<br>~~es~~<br>~~eG~~|0.4<br>~~es~~<br>~~eG~~|UI<br>~~es~~<br>~~eG~~|
||Deterministic<br>~~J ~~|5 Gbps<br> <br> <br><br>~~P|~~|—<br> ~~eG~~|—<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|UI<br>~~eG~~|
||Random<br>~~J ~~<br>~~pT~~||—<br> ~~ee~~<br>~~pO~~|—<br>~~ee~~<br>~~pO~~|—<br>~~ee~~<br>~~pO~~|—<br>~~ee~~<br>~~pO~~|ps, RMS<br>~~ee~~<br>~~pO~~|
||Total<br>~~pT~~<br>~~P|~~||—<br>~~pO~~<br>~~es~~|—<br>~~pO~~<br>~~es~~|—<br>~~pO~~<br>~~es~~|—<br>~~pO~~<br>~~es~~|UI<br>~~pO~~<br>~~es~~|
||Deterministic<br>~~pT ~~<br>~~P|~~<br>~~P|~~|3.125<br>Gbps<br> <br>~~P| ~~<br>~~P| ~~<br>|See XAUI Spec, CJPAT<br> ~~pO~~<br>~~es~~<br>~~es~~|—<br>~~pO~~<br>~~es~~<br>~~es~~|—<br>~~pO~~<br>~~es~~<br>~~es~~|—<br>~~pO~~<br>~~es~~<br>~~es~~|UI<br>~~pO~~<br>~~es~~<br>~~es~~|
||Random<br>~~P|~~<br>~~P|~~||See XAUI Spec, CJPAT<br> ~~es~~<br>~~es~~|—<br>~~es~~<br>~~es~~|—<br>~~es~~<br>~~es~~|—<br>~~es~~<br>~~es~~|ps, RMS<br>~~es~~<br>~~es~~|
||Total<br>~~P|~~<br>~~J ~~<br>~~|~~||See XAUI Spec, CJPAT<br> ~~es~~<br> ~~eG~~<br>~~ee~~|—<br>~~es~~<br>~~eG~~<br>~~ee~~|—<br>~~es~~<br>~~eG~~<br>~~ee~~|0.35<br>~~es~~<br>~~eG~~<br>~~ee~~|UI<br>~~es~~<br>~~eG~~<br>~~ee~~|
||Deterministic<br>~~|~~<br>~~ee~~|1.25 Gbps<br>~~ee ~~|400 mV differential eye<br>~~ee~~<br>~~pO~~|—<br>~~ee~~<br>~~pO~~|—<br>~~ee~~<br>~~pO~~|—<br>~~ee~~<br>~~pO~~|UI<br>~~ee~~<br>~~pO~~|
||Random<br>~~|~~<br>~~ee~~<br>~~)~~||400 mV differential eye<br>~~ee~~<br>~~pO~~<br>~~ee~~|—<br>~~ee~~<br>~~pO~~<br>~~ee~~|—<br>~~ee~~<br>~~pO~~<br>~~ee~~|—<br>~~ee~~<br>~~pO~~<br>~~ee~~|ps, RMS<br>~~ee~~<br>~~pO~~<br>~~ee~~|
||Total<br>~~ee~~<br>~~)~~||400 mV differential eye<br> ~~pO~~<br>~~ee~~|—<br>~~pO~~<br>~~ee~~|—<br>~~pO~~<br>~~ee~~|0.7<br>~~pO~~<br>~~ee~~|UI<br>~~pO~~<br>~~ee~~|
|SLVS_EC<br>~~)~~|Deterministic<br>~~)~~<br>~~J~~<br>~~J~~|5 Gbps<br> <br>~~po~~<br>~~ee~~<br>~~ee~~|400 mV differential eye<br>~~ee~~<br>~~es~~<br>~~po~~|—<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|UI<br>~~ee~~<br>~~es~~|
||Random<br>~~J ~~<br>~~J~~<br>~~ee~~||400 mV differential eye<br> ~~es~~<br>~~po~~<br>~~ee~~|—<br>~~es~~<br>~~ee~~|—<br>~~es~~<br>~~ee~~|—<br>~~es~~<br>~~ee~~|ps, RMS<br>~~es~~<br>~~ee~~|
||Total<br>~~J~~<br>~~ee~~<br>~~ee~~||400 mV differential eye<br>~~po~~<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|0.5<br>~~ee~~<br>~~es~~|UI<br>~~ee~~<br>~~es~~|
||Deterministic<br>~~ee~~<br>~~ee~~<br>~~P|~~|2.5 Gbps<br>~~ee ~~<br>~~ee ~~<br>~~P| ~~<br>~~P|~~<br>~~po~~|400 mV differential eye<br> ~~ee~~<br>~~es~~<br>~~es~~|—<br>~~ee~~<br>~~es~~<br>~~es~~|—<br>~~ee~~<br>~~es~~<br>~~es~~|—<br>~~ee~~<br>~~es~~<br>~~es~~|UI<br>~~ee~~<br>~~es~~<br>~~es~~|
||Random<br>~~ee~~<br>~~P|~~<br>~~P|~~||400 mV differential eye<br> ~~es~~<br>~~es~~<br>~~ee~~|—<br>~~es~~<br>~~es~~<br>~~ee~~|—<br>~~es~~<br>~~es~~<br>~~ee~~|—<br>~~es~~<br>~~es~~<br>~~ee~~|ps, RMS<br>~~es~~<br>~~es~~<br>~~ee~~|
||Total<br>~~P|~~<br>~~P|~~<br>~~J~~||400 mV differential eye<br> ~~es~~<br>~~ee~~<br>~~po~~|—<br>~~es~~<br>~~ee~~|—<br>~~es~~<br>~~ee~~|0.62<br>~~es~~<br>~~ee~~|UI<br>~~es~~<br>~~ee~~|
||Deterministic<br>~~P|~~<br>~~J~~<br>~~ee~~|1.25 Gbps<br>~~P| ~~<br>~~po~~<br>~~ee~~<br>~~po~~<br>~~ee~~<br>~~ee~~|400 mV differential eye<br> ~~ee~~<br>~~po~~<br>~~po~~|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|UI<br>~~ee~~|
||Random<br>~~J~~<br>~~ee~~<br>~~ee~~||400 mV differential eye<br>~~po~~<br>~~po~~<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|ps, RMS<br>~~ee~~|
||Total<br>~~ee~~<br>~~ee~~<br>~~ee~~||400 mV differential eye<br>~~po~~<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|—<br>~~ee~~<br>~~es~~|0.7<br>~~ee~~<br>~~es~~|UI<br>~~ee~~<br>~~es~~|
|CoaXPress<br>~~|~~<br>~~|~~|Deterministic<br>~~ee~~<br>~~ee~~<br>~~P|~~|6.25 Gbps<br>~~ee ~~<br>~~ee ~~<br>~~P| ~~<br>~~J~~|—<br> ~~ee~~<br>~~es~~<br>~~es~~|—<br>~~ee~~<br>~~es~~<br>~~es~~|—<br>~~ee~~<br>~~es~~<br>~~es~~|—<br>~~ee~~<br>~~es~~<br>~~es~~|UI<br>~~ee~~<br>~~es~~<br>~~es~~|
||Random<br>~~ee~~<br>~~P|~~||—<br> ~~es~~<br>~~es~~|—<br>~~es~~<br>~~es~~|—<br>~~es~~<br>~~es~~|—<br>~~es~~<br>~~es~~|ps, RMS<br>~~es~~<br>~~es~~|
||Total<br>~~P|~~<br>~~J~~||—<br> ~~es~~<br>~~J~~<br>~~I~~|—<br>~~es~~<br>~~J~~<br>~~I~~|—<br>~~es~~<br>~~J~~<br>~~I~~|—<br>~~es~~<br>~~J~~<br>~~I~~|UI<br>~~es~~<br>~~J~~<br>~~I~~|
||Deterministic<br>~~|~~|5 Gbps<br>~~|~~<br> <br>~~P|~~|400 mV differential eye<br>~~|~~<br>~~OC~~|—<br>~~|~~<br>~~OC~~|—<br>~~|~~<br>~~OC~~|—<br>~~|~~<br>~~OC~~|UI<br>~~|~~<br>~~OC~~|
||Random<br>~~J ~~<br>~~|~~||400 mV differential eye<br> ~~eG~~<br>~~po~~|—<br>~~eG~~<br>~~po~~|—<br>~~eG~~<br>~~po~~|—<br>~~eG~~<br>~~po~~|ps, RMS<br>~~eG~~<br>~~po~~|
||Total<br>~~|~~<br>~~P|~~||400 mV differential eye<br>~~po~~<br>~~es~~|—<br>~~po~~<br>~~es~~|—<br>~~po~~<br>~~es~~|0.4<br>~~po~~<br>~~es~~|UI<br>~~po~~<br>~~es~~|
||Deterministic<br>~~|~~<br>~~P|~~|3.125<br>Gbps<br>~~P| ~~<br> <br>|400 mV differential eye<br>~~po~~<br>~~es~~|—<br>~~po~~<br>~~es~~|—<br>~~po~~<br>~~es~~|—<br>~~po~~<br>~~es~~|UI<br>~~po~~<br>~~es~~|
||Random<br>~~P|~~<br>~~J ~~||400 mV differential eye<br> ~~es~~<br> ~~eG~~|—<br>~~es~~<br>~~eG~~|—<br>~~es~~<br>~~eG~~|—<br>~~es~~<br>~~eG~~|ps, RMS<br>~~es~~<br>~~eG~~|
||Total<br>~~J ~~||400 mV differential eye<br> ~~eG~~|—<br>~~eG~~|—<br>~~eG~~|0.35<br>~~eG~~|UI<br>~~eG~~|
||Deterministic<br>~~i~~<br>~~|~~|2.5 Gbps<br> ~~ee~~<br>~~po~~|400 mV differential eye<br>~~ee~~<br>~~po~~|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|UI<br>~~ee~~|
||Random<br>~~i ~~<br>~~|~~||400 mV differential eye<br>~~ee~~<br>~~po~~|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|ps, RMS<br>~~ee~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-DS-02086-2.0
143
**CertusPro-NX Family Data Sheet**
|**Protocol**<br>~~pO~~|**Description**<br>~~pO~~|**Frequency**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|~~pO~~<br>~~|~~<br>~~/~~<br>~~)~~|Total<br>~~pO~~<br>~~sf~~<br>~~|~~|~~sf~~<br>~~po~~|400 mV differential eye<br>~~sf~~<br>~~po~~|—<br>~~GC~~|—<br>~~GC~~|0.4<br>~~GC~~|UI<br>~~GC~~|
||Deterministic<br>~~|~~<br>~~ee~~|1.25 Gbps<br>~~po~~<br>~~ee ~~|400 mV differential eye<br>~~po~~<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|UI<br>~~ee~~|
||Random<br>~~|~~<br>~~ee~~<br>~~/~~||400 mV differential eye<br>~~po~~<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|ps, RMS<br>~~ee~~<br>~~ee~~|
||Total<br>~~ee~~<br>~~/~~<br>~~)~~||400 mV differential eye<br> ~~ee~~<br>~~ee~~<br>~~eG~~|—<br>~~ee~~<br>~~ee~~<br>~~eG~~|—<br>~~ee~~<br>~~ee~~<br>~~eG~~|0.7<br>~~ee~~<br>~~ee~~<br>~~eG~~|UI<br>~~ee~~<br>~~ee~~<br>~~eG~~|
|DP/eDP<br>~~/~~<br>~~)~~<br>~~|~~<br>~~|~~<br>~~)~~<br>~~|~~<br>~~pT~~|Deterministic<br>~~/~~<br>~~)~~|8.1 Gbps<br> <br>~~po~~<br>~~po~~|—<br>~~ee~~<br>~~eG~~|—<br>~~ee~~<br>~~eG~~|—<br>~~ee~~<br>~~eG~~|—<br>~~ee~~<br>~~eG~~|UI<br>~~ee~~<br>~~eG~~|
||Random<br>~~)~~<br>~~J ~~<br>~~|~~||—<br>~~eG~~<br> ~~eG~~<br>~~po~~|—<br>~~eG~~<br>~~eG~~|—<br>~~eG~~<br>~~eG~~|—<br>~~eG~~<br>~~eG~~|ps, RMS<br>~~eG~~<br>~~eG~~|
||Total<br>~~|~~<br>~~|~~||—<br>~~po~~<br>~~po~~|—|—|0.62|UI|
||Deterministic<br>~~|~~<br>~~|~~<br>~~ee~~|5.4 Gbps<br>~~po~~<br>~~po~~<br>~~ee ~~|—<br>~~po~~<br>~~po~~<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|UI<br>~~ee~~|
||Random<br>~~|~~<br>~~ee~~<br>~~)~~||—<br>~~po~~<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|ps, RMS<br>~~ee~~<br>~~ee~~|
||Total<br>~~ee~~<br>~~)~~||—<br> ~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|0.636<br>~~ee~~<br>~~ee~~|UI<br>~~ee~~<br>~~ee~~|
||Deterministic<br>~~)~~<br>~~J ~~<br>~~|~~|2.7 Gbps<br> <br>~~po~~|—<br>~~ee~~<br> ~~eG~~<br>~~eG~~|—<br>~~ee~~<br>~~eG~~<br>~~eG~~|—<br>~~ee~~<br>~~eG~~<br>~~eG~~|—<br>~~ee~~<br>~~eG~~<br>~~eG~~|UI<br>~~ee~~<br>~~eG~~<br>~~eG~~|
||Random<br>~~|~~||—<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|ps, RMS<br>~~eG~~|
||Total<br>~~|~~<br>~~|~~<br>~~J~~||—<br>~~eG~~<br>~~eG~~<br>~~po~~|—<br>~~eG~~<br>~~eG~~|—<br>~~eG~~<br>~~eG~~|0.548<br>~~eG~~<br>~~eG~~|UI<br>~~eG~~<br>~~eG~~|
||Deterministic<br>~~J~~|1.62 Gbps<br>~~po~~<br> <br>~~po~~|—<br>~~po~~|—|—|—|UI|
||Random<br>~~J~~<br>~~J ~~<br>~~pT~~||—<br>~~po~~<br> ~~ee~~<br>~~po~~|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|ps, RMS<br>~~ee~~|
||Total<br>~~pT~~||—<br>~~po~~|—|—|0.778|UI|
**Note** :
1. Jitter tolerance measurements are done with protocol compliance tests: 10.3125Gbps – 10G Base-R, 3.125 Gbps - XAUI Standard, 8/5/2.5 Gbps - PCIe Standard, 1.25 Gbps SGMII Standard.
## **4.26. SERDES External Reference Clock**
The external reference clock selection and its interface are a critical part of system applications for this product. Table 3.43 and Table 3.44 specify the reference clock requirements, over the full range of operating conditions. For other characteristics like jitter, the clock requirements of the target protocol should be used when determining the reference clock source.
**Table 4.43. External Reference Clock Specification for SDQx_REFCLKP/N[1]**
|**Symbol**|**Description**|**Min**|**Type**|**Max**|**Unit**|
|---|---|---|---|---|---|
|FREF|Frequency range|74.25|100|162|MHz|
|FREF-PPM|Frequency tolerance|–300|—|300|ppm|
|VREF-IN-DIFF|Input swing, differential clock|300|—|—|mV, p-p differential|
|VREF-IN|DC Input levels|–0.3|—|1.15|V|
|DREF|Duty cycle|40|—|60|%|
|ZREF-IN-TERM-DIFF2|Differential input termination|—|—|—|Ω|
**Notes** :
1. Support HCSL I/O standard, DC coupling only.
2. No termination.
**Table 4.44. External Reference Clock Specification for SD_EXTx_REFCLKP/N[1]**
|**Symbol**|**Description**|**Min**|**Type**|**Max**|**Unit**|
|---|---|---|---|---|---|
|FREF|Frequency range|74.25|—|162|MHz|
|FREF-PPM|Frequency tolerance|–300|—|300|ppm|
|VREF-IN-DIFF|Input swing, differential clock|200|—|2 × VCCAUX|mV, p-p differential|
|VREF-IN|DC Input levels|0|—|2|V|
|DREF|Duty cycle|40|—|60|%|
|TREF-R|Rise time (20% to 80%)|200|500|1000|ps|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Symbol**|**Description**|**Min**|**Type**|**Max**|**Unit**|
|---|---|---|---|---|---|
|TREF-F|Fall time (80% to 20%)|200|500|1000|ps|
|ZREF-IN-TERM-DIFF2|Differential input termination|70|100|130|Ω|
**Notes** :
1. Support LVDS and HCSL I/O standards.
2. Can be configured as HiZ.
## **4.27. PCI Express Electrical and Timing Characteristics**
## **4.27.1. PCIe (2.5 Gbps)**
Over recommended operating conditions.
**Table 4.45. PCIe (2.5 Gbps)**
|**Symbol**<br>~~DCO~~|**Description**<br>~~DCO~~|**Condition**<br>~~DCO~~|**Min.**<br>~~DCO~~|**Typ. **<br>~~DCO~~|**Max.**<br>~~DCO~~|**Unit**<br>~~DCO~~|
|---|---|---|---|---|---|---|
|**Transmitter1**<br>~~eeGD~~|||||||
|UI<br>~~ee~~|Unit Interval<br>~~GD~~|—<br>~~GD~~|399.88<br>~~GD~~|400<br>~~GD~~|400.12<br>~~GD~~|ps<br>~~GD~~|
|BWTX<br>~~ee~~<br>~~fe~~|Tx PLL bandwidth<br>~~GD~~<br>~~fe~~|—<br>~~GD~~<br>~~OC~~|1.5<br>~~GD~~<br>~~OC~~|—<br>~~GD~~<br>~~OC~~|22<br>~~GD~~|MHz<br>~~GD~~|
|PKGTX<br>~~fe~~<br>~~fe~~|Tx PLL Peaking<br>~~fe~~<br>~~fe~~|—<br>~~OC~~<br>~~OC~~|—<br>~~OC~~<br>~~OC~~|—<br>~~OC~~<br>~~OC~~|3|dB|
|VTX-DIFF-PP<br>~~fe~~<br>~~a~~|Differential p-p Tx voltage<br>swing<br>~~fe~~|—<br>~~OC~~|0.8<br>~~OC~~|—<br>~~OC~~|1.2|Vp-p|
|VTX-DIFF-PP-LOW<br>~~a~~<br>~~a~~|Low power differential p-p Tx<br>voltage swing|—|0.4|—|1.2|Vp-p|
|VTX-DE-RATIO-3.5dB<br>~~a~~<br>~~a~~|Tx de-emphasis level ratio at<br>3.5 dB|—|3|—|4|dB|
|TTX-RISE-FALL<br>~~a~~<br>~~fe~~|Transmitter rise and fall time<br>~~fe~~|—<br>~~OC~~|0.125<br>~~OC~~|—<br>~~OC~~|—|UI|
|TTX-EYE<br>~~fe~~|Transmitter Eye, including all<br>jitter sources<br>~~fe~~|—<br>~~OC~~|0.75<br>~~OC~~|—<br>~~OC~~|—|UI|
|TTX-EYE-MEDIAN-to-MAX-JITTER|Max. time between jitter<br>median and max deviation<br>from the median|—|—|—|0.125|UI|
|RLTX-DIFF<br>~~a~~|Tx Differential Return Loss,<br>including pkgand silicon|—|10|—|—|dB|
|RLTX-CM<br>~~a~~<br>~~a~~<br>~~a~~|Tx Common Mode Return<br>Loss, including pkgand silicon|50 MHz < freq <<br>2.5 GHz<br>~~CO~~|6<br>~~CO~~|—<br>~~CO~~|—|dB|
|ZTX-DIFF-DC<br>~~a~~<br>~~fe~~<br>~~a~~|DC differential Impedance<br>~~fe~~|—<br>~~fe~~<br>~~CO~~|80<br>~~fe~~<br>~~CO~~|—<br>~~fe~~<br>~~CO~~|120<br>~~fe~~|Ω<br>~~fe~~|
|VTX-CM-AC-P<br>~~fe~~<br>~~a~~|Tx AC peak common mode<br>voltage, RMS<br>~~fe~~|—<br>~~fe~~<br>~~CO~~|—<br>~~fe~~<br>~~CO~~|—<br>~~fe~~<br>~~CO~~|20<br>~~fe~~|mV, RMS<br>~~fe~~|
|ITX-SHORT<br>~~a~~<br>~~a~~|Transmitter short-circuit<br>current|—<br>~~CO~~|—<br>~~CO~~|—<br>~~CO~~|90|mA|
|VTX-DC-CM<br>~~a~~<br>~~a~~|Transmitter DC common-<br>mode voltage|—|0|—|1.2|V|
|VTX-IDLE-DIFF-AC-p<br>~~a~~<br>~~a~~|Electrical Idle Output peak<br>voltage<br>|—<br>|—<br>|—<br>|20<br>|mV<br>|
|VTX-RCV-DETECT<br>~~aes~~|Voltage change allowed during<br>Receiver Detect<br>~~es~~|—<br>~~es~~|—<br>~~es~~|—<br>~~es~~|600<br>~~es~~|mV<br>~~es~~|
|TTX-IDLE-MIN<br>~~es~~<br>~~fe~~|Min. time in Electrical Idle<br>~~es~~<br>~~fe~~|—<br>~~es~~<br>~~GC~~|20<br>~~es~~<br>~~GC~~|—<br>~~es~~<br>~~GC~~|—<br>~~es~~|ns<br>~~es~~|
|TTX-IDLE-SET-TO-IDLE<br>~~fe~~<br>~~es~~|Max. time from EI Order Set to<br>valid Electrical Idle<br>~~fe~~<br>~~es~~|—<br>~~GC~~<br>~~es~~|—<br>~~GC~~<br>~~es~~|—<br>~~GC~~<br>~~es~~|8<br>~~es~~|ns<br>~~es~~|
|TTX-IDLE-TO-DIFF-DATA<br>~~es~~<br>~~a~~|Max. time from Electrical Idle<br>to valid differential output<br>~~es~~|—<br>~~es~~|—<br>~~es~~|—<br>~~es~~|8<br>~~es~~|ns<br>~~es~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Symbol**<br>~~a ~~|**Description**<br> ~~GG~~|**Condition**<br>~~GG~~|**Min.**<br>~~GG~~|**Typ. **<br>~~GG~~|**Max.**<br>~~GG~~|**Unit**<br>~~GG~~|
|---|---|---|---|---|---|---|
|**Receiver2**|||||||
|UI<br>~~Ge~~|Unit Interval<br>~~Ge~~|—<br>~~Ge~~|399.88<br>~~Ge~~|400<br>~~Ge~~|400.12<br>~~Ge~~|ps<br>~~Ge~~|
|VRX-DIFF-PP<br>~~a~~|Differential Rx peak-peak<br>voltage|—|0.175|—|1.2|Vp-p|
|TRX-EYE3|Receiver eye openingtime|—|0.4|—|—|UI|
|TRX-EYE-MEDIAN-to-MAX-JITTER3<br>~~ee~~|Max time delta between<br>median and deviation from<br>median|—|—|—|0.3|UI|
|RLRX-DIFF<br>~~ee~~|Receiver differential Return<br>Loss,packageplus silicon|—|10|—|—|dB|
|RLRX-CM<br>~~ee~~|Receiver common mode<br>Return Loss, package plus<br>silicon|—|6|—|—|dB|
|ZRX-DC<br>~~ee~~<br>~~a~~<br>~~es~~|Receiver DC single ended<br>impedance|—|40|—|60|Ω|
|ZRX-DIFF-DC<br>~~es~~|Receiver DC differential<br>impedance|—|80|—|120|Ω|
|ZRX-HIGH-IMP-DC<br>~~es~~|Receiver DC single ended<br>impedance when powered<br>down|—|200k|—|—|Ω|
|VRX-CM-AC-P3<br>~~es~~<br>~~a~~|Rx AC peak common mode<br>voltage|—|—|—|150|mV, peak|
|VRX-IDLE-DET-DIFF-PP<br>~~a a~~|Electrical Idle Detect<br>Threshold<br>~~a~~|—<br>~~a~~|65<br>~~a~~|—<br>~~a~~|175<br>~~a~~|mVp-p<br>~~a~~|
## **Notes:**
1. Refer to PCI Express Base Specification Revision 3.0 Table 4.18 test condition and requirement for respective parameters.
2. Refer to PCI Express Base Specification Revision 3.0 Table 4.24 test condition and requirement for respective parameters.
3. Spec compliant requirement.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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## **4.27.2. PCIe (5 Gbps)**
Over recommended operating conditions.
## **Table 4.46. PCIe (5 Gbps)**
|**Symbol**<br>~~eG~~|**Description**<br>~~eG~~|**Test Conditions**<br>~~eG~~|**Min**<br>~~eG~~<br>~~GO~~|**Typ**<br>~~eG~~<br>~~GO~~|**Max**<br>~~eG~~<br>~~CO~~|**Unit**<br>~~eG~~|
|---|---|---|---|---|---|---|
|**Transmit1**<br>~~GO~~<br>~~CO~~|||||||
|UI<br>~~a ~~|Unit Interval<br> ~~GG~~|—<br>~~GG~~|199.94<br>~~GG~~|200<br>~~GG~~|200.06<br>~~GG~~|ps<br>~~GG~~|
|BWTX-PKG-PLL1<br>~~a~~|Tx PLL bandwidth<br>correspondingto PKGTX-PLL1|—|8|—|16|MHz|
|BWTX-PKG-PLL2<br>~~a~~<br>~~a~~|Tx PLL bandwidth<br>correspondingto PKGTX-PLL2<br>~~ee~~|—<br>~~ee~~|5<br>~~ee~~|—<br>~~ee~~|16|MHz|
|PKGTX-PLL1<br>~~a~~<br>~~a~~<br>~~a~~|Tx PLL Peaking<br>correspondingto PKGTX-PLL1<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee~~<br>~~e~~~~**e**~~<br>|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|3|dB|
|PKGTX-PLL2<br>~~a~~<br>~~a~~|Tx PLL Peaking<br>correspondingto PKGTX-PLL2<br>~~ee~~<br>~~ee~~<br>|—<br>~~ee ~~<br>~~e~~~~**e**~~<br>|—<br> ~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|1|dB|
|VTX-DIFF-PP<br>~~a~~|Differential p-p Tx voltage<br>swing<br>~~ee~~<br>~~e~~|—<br>~~e~~~~**e** ~~<br>~~e~~|0.8<br> ~~ee~~|—<br>~~ee~~|1.2|V, p-p|
|VTX-DIFF-PP-LOW<br>~~a~~|Low power differential p-p Tx<br>voltage swing|—|0.4|—|1.2|V, p-p|
|VTX-DE-RATIO-3.5dB<br>~~a~~|Tx de-emphasis level ratio at<br>3.5 dB|—|3|—|4|dB|
|VTX-DE-RATIO-6dB<br>~~a~~|Tx de-emphasis level ratio at 6<br>dB|—|5.5|—|6.5|dB|
|TMIN-PULSE<br>~~a~~|Instantaneous lone pulse<br>width|—|0.9|—|—|UI|
|TTX-RISE-FALL<br>~~DOO~~|Transmitter rise and fall time<br>~~DOO~~|—<br>~~DOO~~|0.15<br>~~DOO~~|—<br>~~DOO~~|—<br>~~DOO~~|UI<br>~~DOO~~|
|TTX-EYE<br>~~DOO~~<br>~~eG~~|Transmitter Eye, including all<br>jitter sources<br>~~DOO~~<br>~~eG~~|—<br>~~DOO~~<br>~~eG~~|0.75<br>~~DOO~~<br>~~eG~~|—<br>~~DOO~~<br>~~eG~~|—<br>~~DOO~~<br>~~eG~~|UI<br>~~DOO~~<br>~~eG~~|
|TTX-DJ<br>~~a~~|Tx deterministic jitter > 1.5<br>MHz<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|0.15<br>~~ee~~|UI<br>~~ee~~|
|TTX-RJ<br>~~a ee~~|Tx RMS jitter < 1.5 MHz<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|3<br>~~ee~~|ps,<br>RMS<br>~~ee~~|
|TRF-MISMATCH<br>~~GG~~<br>~~a~~|Tx rise/fall time mismatch<br>~~GG~~|—<br>~~GG~~|—<br>~~GG~~<br>~~ee eee~~|—<br>~~GG~~<br>~~eee~~|0.1<br>~~GG~~<br>~~eee~~|UI<br>~~GG~~<br>~~eee~~|
|RLTX-DIFF<br>~~GG~~<br>~~a~~<br>~~a~~<br>~~a~~|Tx Differential Return Loss,<br>including package and silicon<br>~~GG~~<br>~~es~~<br>~~ee~~<br>|50 MHz < freq< 1.25 GHz<br>~~GG~~<br>~~es~~|10<br>~~GG~~<br>~~es~~<br>~~ee eee~~|—<br>~~GG~~<br>~~es~~<br>~~eee~~|—<br>~~GG~~<br>~~es~~<br>~~eee~~|dB<br>~~GG~~<br>~~es~~<br>~~eee~~|
|||1.25 GHz < freq< 2.5 GHz<br>~~es~~<br>|8<br>~~es~~<br>~~ee eee~~<br>|—<br>~~es~~<br>~~eee~~<br>|—<br>~~es~~<br>~~eee~~<br>|dB<br>~~es~~<br>~~eee~~<br>|
|RLTX-CM<br>~~a~~<br>~~a~~<br>~~a~~|Tx Common Mode Return Loss,<br>including package and silicon<br>~~es~~<br>~~ee~~<br>|50 MHz < freq < 2.5 GHz<br>~~es~~<br>|6<br>~~es~~<br>~~ee eee~~<br>|—<br>~~es~~<br>~~eee~~<br>|—<br>~~es~~<br>~~eee~~<br>|dB<br>~~es~~<br>~~eee~~<br>|
|ZTX-DIFF-DC<br>~~a~~<br>~~a ~~<br>~~a~~|DC differential Impedance<br>~~ee~~<br> ~~GG~~<br>~~ee~~|—<br>~~GG~~<br>~~ee~~|—<br>~~ee eee~~<br>~~GG~~<br>~~eee~~|—<br>~~eee~~<br>~~GG~~<br>~~eee~~|120<br>~~eee~~<br>~~GG~~<br>~~eee~~|Ω<br>~~eee~~<br>~~GG~~|
|VTX-CM-AC-PP<br>~~a~~|Tx AC peak common mode<br>voltage, peak-peak<br>~~ee~~|—<br>~~ee~~|—<br>~~eee~~|—<br>~~eee~~|150<br>~~eee~~|mV,<br>p-p|
|ITX-SHORT<br>~~a ~~<br>~~a ee~~|Transmitter short-circuit<br>current<br> ~~ee~~<br>~~ee~~|—<br>~~ee ~~<br>~~ee~~|—<br> ~~eee~~<br>~~ee~~|—<br>~~eee~~<br>~~ee~~|90<br>~~eee~~<br>~~ee~~|mA<br>~~ee~~|
|VTX-DC-CM<br>~~a~~|Transmitter DC common-mode<br>voltage|—|0|—|1.2|V|
|VTX-IDLE-DIFF-DC<br>~~a ~~|Electrical Idle Output DC<br>voltage<br> ~~a~~|—|0|—|5|mV|
|VTX-IDLE-DIFF-AC-p<br>~~aa~~|Electrical Idle Differential<br>Outputpeak voltage<br>~~aa~~|—<br>~~aa~~|—|—|20|mV|
|VTX-RCV-DETECT<br>~~a~~|Voltage change allowed during<br>Receiver Detect<br>~~a~~<br>~~a~~|—|—|—|600|mV|
|TTX-IDLE-MIN<br>~~a ~~|Min. time in Electrical Idle<br> ~~GG~~|—<br>~~GG~~|20<br>~~GG~~|—<br>~~GG~~|—<br>~~GG~~|ns<br>~~GG~~|
|TTX-IDLE-SET-TO-IDLE<br>~~a~~|Max. time from EI Order Set to<br>valid Electrical Idle|—|—|—|8|ns|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Symbol**<br>~~ee ee~~<br>~~ee~~|**Description**<br>~~ee~~<br>~~es~~|**Test Conditions**<br>~~es~~|**Min**<br>~~ee~~|**Typ**<br>~~ee~~|**Max**<br>~~ee~~|**Unit**|
|---|---|---|---|---|---|---|
|TTX-IDLE-TO-DIFF-DATA<br>~~ee ee~~<br>~~ee~~<br>~~a~~|Max. time from Electrical Idle<br>to valid differential output<br>~~ee~~<br>~~es~~<br>~~rrr~~|—<br>~~es~~<br>~~rrr~~|—<br>~~ee~~<br>~~It~~|—<br>~~ee~~<br>~~RO~~|8<br>~~ee~~<br>~~I~~|ns|
|LTX-SKEW<br>~~ee ~~<br>~~a~~|Lane-to-lane output skew<br> ~~es~~<br>~~rrr~~|—<br>~~es ~~<br>~~rrr~~|—<br> ~~ee~~<br>~~It~~|—<br>~~ee~~<br>~~RO~~|500 + 4 UI<br>~~ee~~<br>~~I~~|500 + 4 UI<br>ps|
|**Receive2**<br>~~a~~<br>~~rrr~~<br>~~It RO~~<br>~~I~~<br>~~Pee~~<br>~~eeer~~<br>~~tttsner~~<br>~~UUsI~~<br>~~I~~|||||||
|UI<br>~~ee~~<br>~~a~~|Unit Interval<br>~~er~~<br>~~ttts~~<br>~~ee ee~~|—<br>~~ner~~<br>~~ee~~|199.94<br>~~UUs~~<br>~~ee~~|200<br>~~I~~<br>~~ee~~|200.06<br>~~I~~<br>~~ee~~|ps<br>~~ee~~|
|VRX-DIFF-PP<br>~~ee~~<br>~~a~~<br>~~a~~|Differential Rx peak-peak<br>voltage<br>~~er~~<br>~~ttts ~~<br>~~ee ee~~<br>~~ee ee~~|—<br> ~~ner~~<br>~~ee~~<br>~~ee~~|0.343<br>~~UUs ~~<br>~~ee~~<br>~~ee~~|—<br> ~~I~~<br>~~ee~~<br>~~ee~~|1.2<br>~~I~~<br>~~ee~~<br>~~ee~~|V, p-p<br>~~ee~~<br>~~ee~~|
|TRX-RJ-RMS<br>~~a ~~<br>~~a~~<br>~~a~~|Receiver random jitter<br>tolerance(RMS)<br> ~~ee ee~~<br>~~ee ee~~<br>~~ee ee~~|1.5 MHz – 100 MHz<br>Random noise<br>~~ee ~~<br>~~ee~~<br>~~ee~~|—<br> ~~ee ~~<br>~~ee~~<br>~~ee~~|—<br> ~~ee ~~<br>~~ee~~<br>~~ee~~|4.2<br> ~~ee~~<br>~~ee~~<br>~~ee~~|ps,<br>RMS<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|TRX-DJ<br>~~a ~~<br>~~a~~<br>~~—————EEEE~~|Receiver deterministic jitter<br>tolerance<br> ~~ee ee~~<br>~~ee ee~~<br>~~—————EEEE~~|—<br>~~ee ~~<br>~~ee~~<br>~~—————EEEE~~|—<br> ~~ee ~~<br>~~ee~~<br>~~—————EEEE~~|—<br> ~~ee ~~<br>~~ee~~<br>~~—————EEEE~~|88<br> ~~ee~~<br>~~ee~~<br>~~—————EEEE~~|ps<br>~~ee~~<br>~~ee~~<br>~~—————EEEE~~|
|RLRX-DIFF<br>~~a ~~<br>~~—————EEEE~~|Receiver differential Return<br>Loss, package plus silicon<br> ~~ee ee~~<br>~~—————EEEE~~|50 MHz < freq< 1.25 GHz<br>~~ee ~~<br>~~—————EEEE~~|10<br> ~~ee ~~<br>~~—————EEEE~~|—<br> ~~ee ~~<br>~~—————EEEE~~|—<br> ~~ee~~<br>~~—————EEEE~~|dB<br>~~ee~~<br>~~—————EEEE~~|
|||1.25 GHz < freq< 2.5 GHz<br>~~—————EEEE~~|8<br>~~—————EEEE~~|—<br>~~—————EEEE~~|—<br>~~—————EEEE~~|dB<br>~~—————EEEE~~|
|RLRX-CM<br>~~—————EEEE~~<br>~~a~~|Receiver common mode<br>Return Loss, package plus<br>silicon<br>~~—————EEEE~~|—<br>~~—————EEEE~~|6<br>~~—————EEEE~~|—<br>~~—————EEEE~~|—<br>~~—————EEEE~~|dB<br>~~—————EEEE~~|
|ZRX-DC|Receiver DC single ended<br>impedance|—|40|—|60|Ω|
|ZRX-HIGH-IMP-DC<br>~~ee~~|Receiver DC single ended<br>impedance when powered<br>down<br>~~ee~~|—<br>~~ee~~|200k<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|Ω<br>~~ee~~|
|VRX-CM-AC-P3<br>~~ee~~<br>~~ee~~|Rx AC peak common mode<br>voltage<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|150<br>~~ee~~<br>~~ee~~|mV,<br>peak<br>~~ee~~<br>~~ee~~|
|VRX-IDLE-DET-DIFF-PP<br>~~ee~~<br>~~ee~~<br>~~ee~~|Electrical Idle Detect Threshold<br>~~ee~~<br>~~ee~~|—<br>~~ee ~~<br>~~ee~~|65<br> ~~ee ~~<br>~~ee~~|—<br> ~~ee~~<br>~~ee~~|1753<br>~~ee ~~<br>~~ee~~|mV,<br>p-p<br> ~~ee~~<br>~~ee~~|
|LRX-SKEW<br>~~ee~~<br>~~ee~~|Receiver lane-lane skew<br>~~ee~~|—<br>~~ee ~~|—<br> ~~ee ~~|—<br> ~~ee~~|8<br>~~ee ~~|ns<br> ~~ee~~|
## **Notes:**
1. Refer to PCI Express Base Specification Revision 3.0 Table 4.18 test condition and requirement for respective parameters.
2. Refer to PCI Express Base Specification Revision 3.0 Table 4.24 test condition and requirement for respective parameters.
3. Spec compliant requirement.
## **4.28. SGMII Characteristics**
## **4.28.1. SGMII Specifications**
Over recommended operating conditions.
**Table 4.47. SGMII**
|**Symbol**|**Description**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|fDATA|SGMII Data Rate|—|—|1250|—|MHz|
|fREFCLK|SGMII Reference Clock Frequency (Data<br>Rate / 10)|—|—|125|—|MHz|
|JTOL_DET|Jitter Tolerance, Deterministic|Periodic jitter <<br>300 kHz||—|0.11|UI|
|JTOL_TOL|Jitter Tolerance, Total|Periodic jitter <<br>300 kHz||—|0.31|UI|
|Δf/f|Data Rate and Reference Clock Accuracy|—|–300|—|300|ppm|
**Note** :
1. JTOT can meet the following jitter mask specifications:
- 0 to 3.5 kHz: 10 UI;
- 3.5 to 700 kHz: log-log slope 10 UI to 0.05 UI;
- above 700 kHz: 0.05 UI.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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## **4.29. sysCONFIG Port Timing Specifications**
Over recommended operating conditions.
## **Table 4.48. sysCONFIG Port Timing Specifications**
|**Symbol**<br>~~a~~|**Parameter**<br>|**Device**<br>|**Min**<br>|**Typ. **<br>|**Max**<br>|**Unit**<br>|
|---|---|---|---|---|---|---|
|**Master SPI POR/REFRESH Timing**<br>~~pn~~|||||||
|tICFG<br>~~a~~|REFRESH command executed, to the rising<br>edge of INITN|—|—|—|5|µs|
|tVMC<br>~~a~~|Time from rising edge of INITN to the valid<br>Master MCLK<br>|—<br>|—<br>|—<br>|5<br>|µs<br>|
|fMCLK_DEF<br>~~ee~~|Default MCLK frequency (Before MCLK<br>frequencyselection in bitstream)<br>~~ee~~|—<br>~~eee~~|—<br>~~eee~~|3.5<br>~~eee~~|—<br>~~eee~~|MHz<br>~~eee~~|
|tICFG_POR<br>~~ee~~|Time during POR, from VCC, VCCAUX, VCCIO0, or<br>VCCIO1(whichever is the last) pass POR trip<br>voltage, to the risingedge if INITN<br>~~ee~~|—<br>~~eee~~|—<br>~~eee~~|—<br>~~eee~~|5<br>~~eee~~|ms<br>~~eee~~|
|**Slave SPI/I2C/I3C POR/REFRESH Timing**<br>~~ee eee~~|||||||
|tMSPI_INH|Time during POR, from VCC, VCCAUX, VCCIO0or<br>VCCIO1(whichever is the last) pass POR trip<br>voltage, or REFRESH command executed, to<br>pull PROGRAMN LOW to prevent entering<br>MSPI mode|—|—|—|1|µs|
|tACT_PROGRAMN_H<br>~~a~~|Minimum time driving PROGRAMN HIGH after<br>last activation clock|—|50|—|—|ns|
|tCONFIG_CCLK<br>~~a~~|Minimum time to start driving CCLK (SSPI)<br>after PROGRAMN HIGH|—|50|—|—|ns|
|tCONFIG_SCL<br>~~a~~|Minimum time to start driving SCL (I2C/I3C)<br>after PROGRAMN HIGH<br>~~ee~~|—<br>~~ee~~|50<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|
|**PROGRAMN Configuration Timing**|||||||
|tPROGRAMN_L<br>~~eG~~|PROGRAMN LOWpulse accepted<br>~~eG~~|—<br>~~eG~~|50<br>~~eG~~|—<br>~~eG~~|—<br>~~eG~~|ns<br>~~eG~~|
|tPROGRAMN_H<br>~~eG~~<br>~~GO~~<br>~~es~~|PROGRAMN HIGHpulse accepted<br>~~eG~~<br>~~GO~~<br>~~eC~~|—<br>~~eG~~<br>~~GO~~<br>~~eC~~|60<br>~~eG~~<br>~~GO~~<br>~~eC~~|—<br>~~eG~~<br>~~GO~~<br>~~eC~~|—<br>~~eG~~<br>~~GO~~<br>~~eC~~|ns<br>~~eG~~<br>~~GO~~<br>~~eC~~|
|tPROGRAMN_RJ<br>~~GO~~<br>~~es~~|PROGRAMN LOWpulse rejected<br>~~GO~~<br>~~eC~~|—<br>~~GO~~<br>~~eC~~|—<br>~~GO~~<br>~~eC~~|—<br>~~GO~~<br>~~eC~~|25<br>~~GO~~<br>~~eC~~|ns<br>~~GO~~<br>~~eC~~|
|tINIT_LOW<br>~~es~~<br>~~GO~~|PROGRAMN LOW to INITN LOW<br>~~eC~~<br>~~GO~~|—<br>~~eC~~<br>~~GO~~|—<br>~~eC~~<br>~~GO~~|—<br>~~eC~~<br>~~GO~~|100<br>~~eC~~<br>~~GO~~|ns<br>~~eC~~<br>~~GO~~|
|tINIT_HIGH<br>~~GO~~<br>~~es~~|PROGRAMN LOW to INITN HIGH<br>~~GO~~|—<br>~~GO~~|—<br>~~GO~~<br>~~G~~|—<br>~~GO~~|50<br>~~GO~~|µs<br>~~GO~~|
|tDONE_LOW<br>~~es~~|PROGRAMN LOW to DONE LOW|—<br>~~OO~~|—<br>~~G~~<br>~~OO~~|—<br>~~OO~~|55|µs|
|tDONE_HIGH<br>~~es~~<br>~~Ge~~|PROGRAMN HIGH to DONE HIGH<br>~~Ge~~|—<br>~~Ge~~<br>~~OO~~<br>~~Ge~~|—<br>~~G~~<br>~~Ge~~<br>~~OO~~<br>~~Ge~~|—<br>~~Ge~~<br>~~OO~~<br>~~Ge~~|2<br>~~Ge~~|s<br>~~Ge~~|
|tIODISS<br>~~Ge~~<br>~~a~~|PROGRAMN LOW to I/O Disabled<br>~~Ge~~<br>~~a~~|—<br>~~Ge~~<br>~~OO~~<br>~~a~~<br>~~Ge~~|—<br>~~Ge~~<br>~~OO~~<br>~~a~~<br>~~Ge~~|—<br>~~Ge~~<br>~~OO~~<br>~~a~~<br>~~Ge~~|125<br>~~Ge~~<br>~~a~~|ns<br>~~Ge~~<br>~~a~~|
|**Master SPI**<br>~~Ge~~<br>~~esa~~<br>~~GO~~|||||||
|fMCLK1<br>~~es~~<br>~~es~~|Max selected MCLK output frequency<br>~~a~~|—<br>~~GO~~|—<br>~~GO~~<br>~~G~~|112.5<br>~~GO~~|124|MHz|
|fMCLK_DC<br>~~es~~<br>~~es~~|MCLK output clock dutycycle<br>~~a~~|—<br>~~GO~~<br>~~OO~~|40<br>~~GO~~<br>~~G~~<br>~~OO~~|—<br>~~GO~~<br>~~OO~~|60|%|
|tMCLKH<br>~~es~~<br>~~Ge~~<br>~~**e**s~~|MCLK output clockpulse width HIGH<br>~~Ge~~<br>|—<br>~~Ge~~<br>~~OO~~<br>~~OO~~<br>|3.5<br>~~G~~<br>~~Ge~~<br>~~OO~~<br>~~OO~~<br>|—<br>~~Ge~~<br>~~OO~~<br>~~OO~~<br>|—<br>~~Ge~~<br>|ns<br>~~Ge~~<br>|
|tMCLKL<br>~~Ge~~<br>~~Ge~~<br>~~**e**s~~|MCLK output clockpulse width LOW<br>~~Ge~~<br>~~Ge~~<br>|—<br>~~Ge~~<br>~~OO~~<br>~~Ge~~<br>~~OO~~<br>|3.5<br>~~Ge~~<br>~~OO~~<br>~~Ge~~<br>~~OO~~<br>|—<br>~~Ge~~<br>~~OO~~<br>~~Ge~~<br>~~OO~~<br>|—<br>~~Ge~~<br>~~Ge~~<br>|ns<br>~~Ge~~<br>~~Ge~~<br>|
|tSU_MSI<br>~~Ge~~<br>~~**e**s~~|MSI to MCLK setuptime<br>~~Ge~~<br>~~eC~~|—<br>~~Ge~~<br>~~OO~~<br>~~eC~~|3<br>~~Ge~~<br>~~OO~~<br>~~eC~~|—<br>~~Ge~~<br>~~OO~~<br>~~eC~~|—<br>~~Ge~~<br>~~eC~~|ns<br>~~Ge~~<br>~~eC~~|
|tHD_MSI<br>~~**e**s~~<br>~~es~~|MSI to MCLK hold time<br><br>~~G~~|—<br>~~OO~~<br><br>~~G~~|0.5<br>~~OO~~<br><br>~~G~~<br>~~F~~|—<br>~~OO~~<br><br>~~G~~|—<br><br>~~G~~|ns<br><br>~~G~~|
|tCO_MSO<br>~~es~~|MCLK to MSO delay|—|—<br>~~F~~|—|12|ns|
|**Slave SPI**<br>~~es~~<br>~~F~~|||||||
|fCCLK_W<br>~~a~~|CCLK input clock frequency<br>(For write transaction)2<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|—<br>~~ee~~|120<br>~~ee~~|MHz<br>~~ee~~|
|fCCLK_R<br>~~a~~<br>~~a~~|CCLK input clock frequency<br>(For read transaction)3<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—<br>~~ee~~<br>~~ee~~|—4<br>~~ee~~<br>~~ee~~|MHz<br>~~ee~~<br>~~ee~~|
|tCCLKH<br>~~eC~~|CCLK input clockpulse width HIGH<br>~~eC~~|—<br>~~eC~~|3.5<br>~~eC~~|—<br>~~eC~~|—<br>~~eC~~|ns<br>~~eC~~|
|tCCLKL<br>~~a~~|CCLK input clockpulse width LOW|—|3.5<br>~~F~~|—|—|ns|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Symbol**|**Parameter**|**Device**|**Min**|**Typ. **|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|tVMC_SLAVE<br>~~a~~<br>~~ee~~|Time from rising edge of INITN to Slave CCLK<br>driven<br>~~ee~~<br>~~GO~~|—<br>~~ee~~<br>~~GO~~|50<br>~~ee~~<br>~~GO~~|—<br>~~ee~~<br>~~GO~~|—<br>~~ee~~<br>~~GO~~|ns<br>~~ee~~<br>~~GO~~|
|tVMC_MASTER<br>~~ee~~|CCLK input clock dutycycle<br>~~GO~~|—<br>~~GO~~|40<br>~~GO~~|—<br>~~GO~~|60<br>~~GO~~|%<br>~~GO~~|
|tSU_SSI<br>~~ee~~<br>~~GG~~|SSI to CCLK setuptime<br>~~GO~~<br>~~GG~~|—<br>~~GO~~<br>~~GG~~|3.2<br>~~GO~~<br>~~GG~~|—<br>~~GO~~<br>~~GG~~|—<br>~~GO~~<br>~~GG~~|ns<br>~~GO~~<br>~~GG~~|
|tHD_SSI<br>~~GG~~|SSI to CCLK hold time<br>~~GG~~|—<br>~~GG~~|1.9<br>~~GG~~|—<br>~~GG~~|—<br>~~GG~~|ns<br>~~GG~~|
|tCO_SSO<br>~~GO~~|CCLK fallingedge to valid SSO output<br>~~GO~~|—<br>~~GO~~|3.05<br>~~GO~~|—<br>~~GO~~|305<br>~~GO~~|ns<br>~~GO~~|
|tEN_SSO<br>~~a eG~~<br>~~ee~~|CCLK fallingedge to SSO output enabled<br>~~eG~~<br>~~GO~~|—<br>~~eG~~<br>~~GO~~|3.0<br>~~eG~~<br>~~GO~~|—<br>~~eG~~<br>~~GO~~|305<br>~~eG~~<br>~~GO~~|ns<br>~~eG~~<br>~~GO~~|
|tDIS_SSO<br>~~ee~~|CCLK fallingedge to SSO output disabled<br>~~GO~~|—<br>~~GO~~|3.0<br>~~GO~~|—<br>~~GO~~|305<br>~~GO~~|ns<br>~~GO~~|
|tHIGH_SCSN<br>~~ee~~<br>~~GG~~|SCSN HIGH time<br>~~GO~~<br>~~GG~~|—<br>~~GO~~<br>~~GG~~|74<br>~~GO~~<br>~~GG~~|—<br>~~GO~~<br>~~GG~~|—<br>~~GO~~<br>~~GG~~|ns<br>~~GO~~<br>~~GG~~|
|tSU_SCSN<br>~~GG~~<br>~~es~~|SCSN to CCLK setuptime<br>~~GG~~<br>~~Ce~~|—<br>~~GG~~<br>~~GO~~|3.5<br>~~GG~~<br>~~GO~~|—<br>~~GG~~<br>~~GO~~|—<br>~~GG~~|ns<br>~~GG~~|
|tHD_SCSN<br>~~es~~|SCSN to CCLK hold time<br>~~Ce~~|—<br>~~GO~~|1.6<br>~~GO~~|—<br>~~GO~~|—|ns|
|**I2C/I3C**<br>~~esCe~~<br>~~GO~~<br>~~pn~~<br>~~eseG~~|||||||
|fSCL_I2C<br>~~es~~<br>~~ee~~|SCL input clock frequencyfor I2C<br>~~eG~~<br>~~Ge~~|—<br>~~eG~~<br>~~GO~~|—<br>~~eG~~<br>~~GO~~|—<br>~~eG~~<br>~~GO~~|1<br>~~eG~~|MHz<br>~~eG~~|
|fSCL_I3C<br>~~es~~<br>~~ee~~|SCL input clock frequency for I3C<br>~~eG~~<br>~~Ge~~|—<br>~~eG~~<br>~~GO~~|—<br>~~eG~~<br>~~GO~~|—<br>~~eG~~<br>~~GO~~|12<br>~~eG~~|MHz<br>~~eG~~|
|tSCLH_I2C<br>~~ee~~<br>~~GO~~<br>~~es~~|SCL input clockpulse width HIGH for I2C<br>~~Ge~~<br>~~GO~~<br>~~Ge~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|400<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~GO~~|ns<br>~~GO~~|
|tSCLL_I2C<br>~~GO~~<br>~~es~~<br>~~es~~|SCL input clockpulse width LOW for I2C<br>~~GO~~<br>~~Ge~~<br>~~a~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|400<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~GO~~|ns<br>~~GO~~|
|tSU_SDA_I2C<br>~~es~~<br>~~es~~|SDA to SCL setuptime for I2C<br>~~Ge~~<br>~~a~~|—<br>~~GO~~<br>~~GO~~|250<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|—|ns|
|tHD_SDA_I2C<br>~~es~~<br>~~GO~~|SDA to SCL hold time for I2C<br>~~a~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|50<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|—<br>~~GO~~|ns<br>~~GO~~|
|tSU_SDA_I3C<br>~~GO~~<br>~~GO~~|SDA to SCL setuptime for I3C<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|30<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|ns<br>~~GO~~<br>~~GO~~|
|tHD_SDA_I3C<br>~~GO~~<br>~~GO~~<br>~~es~~|SDA to SCL hold time for I3C<br>~~GO~~<br>~~GO~~<br>~~Ge~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|30<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~|ns<br>~~GO~~<br>~~GO~~|
|tCO_SDA<br>~~GO~~<br>~~es~~<br>~~es~~|SCL fallingedge to valid SDA output<br>~~GO~~<br>~~Ge~~<br>~~a~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~<br>~~GO~~|200<br>~~GO~~|ns<br>~~GO~~|
|tEN_SDA<br>~~es~~<br>~~es~~<br>~~es~~|SCL fallingedge to SDA output enabled<br>~~Ge~~<br>~~a~~<br>~~a~~|—<br>~~GO~~<br>~~GO~~|—<br>~~GO~~<br>~~GO~~<br>~~DO~~|—<br>~~GO~~<br>~~GO~~<br>~~DO~~|200|ns|
|tDIS_SDA<br>~~es~~<br>~~es~~|SCL fallingedge to SDA output disabled<br>~~a~~<br>~~a~~|—<br>~~GO~~|—<br>~~GO~~<br>~~DO~~|—<br>~~GO~~<br>~~DO~~|200|ns|
|**Wake-Up Timing**<br>~~esa~~<br>~~DO~~|||||||
|tDONE_HIGH<br>~~ee~~|Last configuration clock cycle to DONE going<br>HIGH|—|—|—|60|μs|
|tFIO_EN<br>~~ee~~|User I/O enabled in EalyI/O Mode|—|—|38096|—|cycle|
|tIOEN<br>~~ee~~<br>~~a ~~<br>~~ee~~|Configure clock to user I/O enabled<br> ~~GO~~<br>~~FO~~|—<br>~~GO~~<br>~~FO~~|150<br>~~GO~~<br>~~FO~~|—<br>~~GO~~<br>~~FO~~|—<br>~~GO~~<br>~~FO~~|ns<br>~~GO~~<br>~~FO~~|
|tMCLKZ<br>~~ee~~|Master MCLK to Hi-Z<br>~~FO~~|—<br>~~FO~~|—<br>~~FO~~|—<br>~~FO~~|2.5<br>~~FO~~|µs<br>~~FO~~|
**Notes** :
1. fMCLK has a dependency on HFOSC and is 1/3 of fCLKHF.
2. Supported input clock frequency for bursting in configuration bitstream to the device.
3. Supported input clock frequency for reading out data transactions from the device.
4. Refer to the following equations to determine the supported input clock frequency for read transaction. Assumption: The skew between CCLK and SSO on board is zero.
**==> picture [129 x 9] intentionally omitted <==**
**==> picture [122 x 9] intentionally omitted <==**
CCLK – Input clock period. fCCLK_R = 1/CCLK.
tCO (max) – Equivalent to tCO_SSO or tEN_SSO max value.
Tsu – Setup time requirement for host controller I/O.
For customer that can only use single clock for read/write operation, the Fmax is limited by the Fmax for read operation. For example: tCO (max) = 30 ns and Tsu = 2 ns.
**==> picture [122 x 10] intentionally omitted <==**
**==> picture [104 x 10] intentionally omitted <==**
𝐶𝐶𝐿𝐾 > 64 𝑛𝑠
1 𝑓𝐶𝐶𝐿𝐾𝑅 = = 15.62𝑀𝐻𝑧 64 𝑛𝑠
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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For the customer that wants to do the programming at 135 MHz or faster than Fmax for read operation:
Have a mechanism in the host controller to switch between read clock and write clock for read/write transaction. For example, refer to SPI specification to switch between read and write clock by changing the SPI Baud Rate Register (SPIBR) if standard SPI controller is used as the host.
Implementing a mechanism to adjust/calibrate the sampling clock edge when the valid data becomes available. 5. Based on SLOW (default) slew rate control on Config output pins.
**==> picture [475 x 95] intentionally omitted <==**
**----- Start of picture text -----**<br>
tINIT_HIGH tPROGRAM_H MSPI<br>Configuration<br>PROGRAMN<br>tPROGRAM_L SSPI/I2C/I3C<br>tIN ITL Configuration tINIT_HI GH Configuration<br>Error<br>INITN<br>tINIT_HIGH Restart<br>Configuration<br>Configuration<br>DONE Started<br>**----- End of picture text -----**<br>
- tIN ITL = SRAM memory initialization period
**Figure 4.14. Configuration Error Notification (2)**
**==> picture [394 x 219] intentionally omitted <==**
**----- Start of picture text -----**<br>
REFRESH Command<br>VCC/VCCAUX/<br>VCCIO0/VCCIO1 tICFG<br>INITN<br>DONE<br>PROGRAMN fMCLK_DEF<br>tVMC<br>MCLK<br>MSI<br>Figure 4.15. Master SPI POR/REFRESH Timing<br>**----- End of picture text -----**<br>
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**==> picture [398 x 217] intentionally omitted <==**
**----- Start of picture text -----**<br>
REFRESH Command<br>VCC/VCCAUX/<br>VCCIO0/VCCIO1<br>tICFG<br>INITN<br>DONE<br>tM SPI_IN H Slave Activation tACT_PROGRAMN_H<br>PROGRAMN<br>fCCLK tCONFIG_CCLK<br>CCLK<br>SSI<br>fSCL tACT_PROG RA MN_H<br>SCL tCON FIG_SCL<br>SDA<br>**----- End of picture text -----**<br>
**Figure 4.16. Slave SPI/I[2] C/I3C POR/REFRESH Timing**
**==> picture [433 x 210] intentionally omitted <==**
**----- Start of picture text -----**<br>
tINIT_HIGH<br>PROGRAMN tPROGRAMN_RJ<br>tINIT_LOW<br>INITN<br>{|| —___—<br>DONE<br>ae<br>tDONE_LOW<br>tVMC fMCLK_def<br>MCLK<br>- hi<br>MSI<br>tIODISS<br>USER I/O<br>**----- End of picture text -----**<br>
**Figure 4.17. Master SPI PROGRAMN Timing**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**==> picture [377 x 263] intentionally omitted <==**
**----- Start of picture text -----**<br>
tPROGRAMN_RJ<br>PROGRAMN<br>tINIT_HIGH<br>tINIT_LOW<br>INITN<br>tDONE_LOW tACT_PROGRAMN_H<br>DONE<br>tCONFIG_CCLK<br>CCLK<br>SSI<br>fSCL tACT_PROGRAMN_H<br>SCL tCONFIG_SCL<br>SDA<br>Slave Activation<br>tIODISS<br>USER I/O<br>**----- End of picture text -----**<br>
**Figure 4.18. Slave SPI/I[2] C/I3C PROGRAMN Timing**
**==> picture [279 x 142] intentionally omitted <==**
**----- Start of picture text -----**<br>
fMCLK<br>tMCLKH<br>MCLK fMCLKL<br>tSU_MISO tHD_MISO<br>MSI<br>tCO_MOSI<br>MSO<br>**----- End of picture text -----**<br>
**Figure 4.19. Master SPI Configuration Timing**
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**==> picture [417 x 258] intentionally omitted <==**
**----- Start of picture text -----**<br>
fCCLK<br>tCCLKH<br>CCLK<br>tCCLKL<br>tSU_SSI tHD_SSI<br>SSI<br>tSU_SCSN tHD_SCSN<br>SCSN<br>tHIGH_SCS N<br>tCO_SSO<br>SSO<br>as<br>tEN_SSO tDIS_SSO<br>SSO<br>e e e<br>**----- End of picture text -----**<br>
## **Figure 4.20. Slave SPI Configuration Timing**
**==> picture [410 x 214] intentionally omitted <==**
**----- Start of picture text -----**<br>
fSCL<br>tSCLH<br>SCL<br>tSCLL<br>tSU_SDA tHD_SDA<br>SDA (input)<br>tCO_SDA<br>SDA (output)<br>tDIS_SDA<br>tEN_SDA<br>SDA (output)<br>e l e s<br>Figure 4.21. I [2] C/I3C Configuration Timing<br>**----- End of picture text -----**<br>
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**==> picture [385 x 191] intentionally omitted <==**
**----- Start of picture text -----**<br>
CRESET_B<br>INITN<br>tDONE_HIGH Device Wake-Up<br>DONE<br>CONFIG tMWC<br>Starts fMCLK_def fMCLK tMCLKZ<br>MCLK<br>tFIO_EN<br>USER I/O tIOEN<br>(FAST I/O)<br>tIOEN<br>USER I/O<br>**----- End of picture text -----**<br>
**Figure 4.22. Master SPI Wake-Up Timing**
**==> picture [450 x 221] intentionally omitted <==**
**----- Start of picture text -----**<br>
CRESET_B<br>INITN<br>tDONE_HIGH Device Wake-Up<br>DONE<br>CONFIG<br>Starts<br>CCLK/SCL<br>tFIO_EN<br>USER I/O tIOEN<br>(FAST I/O)<br>tIOEN<br>USER I/O<br>ee<br>**----- End of picture text -----**<br>
**Figure 4.23. Slave SPI/I[2] C/I3C Wake-Up Timing**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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## **4.30. JTAG Port Timing Specifications**
Over recommended operating conditions.
**Table 4.49. JTAG Port Timing Specifications**
|**Symbol**|**Parameter**|**Min**|**Typ. **|**Max**|**Unit**|
|---|---|---|---|---|---|
|fMAX|TCK clock frequency|—|—|25|MHz|
|tBTCPH|TCK[BSCAN]clockpulse width high|20|—|—|ns|
|tBTCPL|TCK[BSCAN]clockpulse width low|20|—|—|ns|
|tBTS|TCK[BSCAN]setuptime|5|—|—|ns|
|tBTH|TCK [BSCAN] hold time|5|—|—|ns|
|tBTRF|TCK[BSCAN]rise/fall time1|100|—|—|mV/ns|
|tBTCO|TAP controller fallingedge of clock to valid output|—|—|14|ns|
|tBTCODIS|TAP controller fallingedge of clock to valid disable|—|—|14|ns|
|tBTCOEN|TAP controller fallingedge of clock to valid enable|—|—|14|ns|
|tBTCRS|BSCAN test capture register setuptime|8|—|—|ns|
|tBTCRH|BSCAN test capture register hold time|25|—|—|ns|
|tBUTCO|BSCAN test update register, fallingedge of clock to valid output|—|—|25|ns|
|tBTUODIS|BSCAN test update register, fallingedge of clock to valid disable|—|—|25|ns|
|tBTUPOEN|BSCAN test update register, fallingedge of clock to valid enable|—|—|25|ns|
**Note** :
1. Based on default I/O setting of slow slew rate.
**==> picture [417 x 307] intentionally omitted <==**
**----- Start of picture text -----**<br>
TMS<br>TDI<br>tBTS tBTH<br>tBTCPH tBTCPL tBTCP<br>TCK<br>tBTCOEN tBTCO tBTCODIS<br>TDO V dilaD aat V dilaD aat<br>tBTCRH<br>tBTCRS<br>Data to be<br>Captured Data Captured<br>from I/O<br>tBTUPOEN tBUTCO tBTUODIS<br>Data to be<br>driven out V dilaD aat V dilaD aat<br>to I/O<br>**----- End of picture text -----**<br>
**Figure 4.24. JTAG Port Timing Waveforms**
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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## **4.31. Switching Test Conditions**
Figure 4.25 shows the output test load that is used for AC testing. The specific values for resistance, capacitance, voltage, and other test conditions are listed in Table 4.50.
**==> picture [190 x 125] intentionally omitted <==**
**----- Start of picture text -----**<br>
V T<br>R1<br>DUT Test Point<br>R2 CL*<br>: a<br>**----- End of picture text -----**<br>
*CL Includes Test Fixture and Probe Capacitance
## **Figure 4.25. Output Test Load, LVTTL and LVCMOS Standards**
**Table 4.50. Test Fixture Required Components, Non-Terminated Interfaces[1]**
|**Test Condition**|**R1**|**R2**|**CL**|**Timing Ref.**|**VT**|
|---|---|---|---|---|---|
|LVTTL and other LVCMOS settings (L ≥ H, H ≥ L)|||0 pF|LVCMOS 3.3 = 1.5 V|—|
|||||LVCMOS 2.5 = VCCIO/2|—|
|||||LVCMOS 1.8 = VCCIO/2|—|
|||||LVCMOS 1.5 = VCCIO/2|—|
|||||LVCMOS 1.2 = VCCIO/2|—|
|LVCMOS 2.5 I/O(Z ≥ H)||1 MΩ|0pF|VCCIO/2|—|
|LVCMOS 2.5 I/O(Z ≥ L)|1 MΩ||0pF|VCCIO/2|VCCIO|
|LVCMOS 2.5 I/O(H ≥ Z)||100|0pF|VOH– 0.10|—|
|LVCMOS 2.5 I/O(L ≥ Z)|100||0pF|VOL+ 0.10|VCCIO|
**Note** :
1. Output test conditions for all other interfaces are determined by the respective standards.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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## **5. Pinout Information**
## **5.1. Signal Descriptions**
**Table 5.1. Signal Description**
|**Signal Name**<br>~~**p**O~~|**Bank**|**Type **|**Description**|
|---|---|---|---|
|**Power and GND**<br>~~**p**O~~<br>~~t~~||||
|VSS<br>~~Ge~~|—<br>~~Ge ~~|GND<br> ~~GG~~|Ground for internal FPGA logic and I/O.<br>~~GG~~|
|VSSSD<br>~~pf~~|—<br>~~pf~~|GND<br>~~pf~~|Ground for the SERDES block.<br>~~pf~~|
|VSSADC<br>~~pp~~|—<br>~~pp~~|GND<br>~~pp~~|Ground for ADC block.<br>~~pp~~|
|VCC,VCCECLK|—|Power|Power supply pins for core logic. VCCis connected to 1.0 V (nom.) supply<br>voltage. Power On Reset(POR)monitors this supplyvoltage.|
|VCCAUXA<br>~~a~~|—<br>~~ee~~|Power<br>~~ee~~|Auxiliary power supply pin for internal analog circuitry. This supply is<br>connected to 1.8 V (nom.) supply voltage. POR monitors this supply<br>voltage.<br>~~ee~~|
|VCCAUX<br>~~a ~~|—<br> ~~ee~~|Power<br>~~ee~~|Auxiliary power supply pin for I/O Bank 0, Bank 1, Bank 2, Bank 6, and<br>Bank 7. This supply is connected to 1.8 V (nom.) supply voltage, and is<br>used forgeneratingstable drive current for the I/O.<br>~~ee~~|
|VCCAUXHx|3–5|Power|Auxiliary power supply pin for I/O Bank 3, Bank 4, and Bank 5. This<br>supply is connected to 1.8 V (nom.) supply voltage, and is used for<br>generating stable current for the differential input comparators and<br>stable drive current for the I/O.|
|VCCIOx|0–7|Power|Power supply pins for I/O bank x.<br>For x = 0, 1, 2, 6, and 7, VCCIOcan be connected to (nom.) 1.2 V, 1.5 V, 1.8<br>V, 2.5 V, or 3.3 V.<br>For x = 3, 4, and 5, VCCIOcan be connected to (nom.) 1.0 V, 1.2 V, 1.35 V,<br>1.5 V, or 1.8 V.<br>There are dedicated and shared configuration pins in Bank 0 and Bank 1.<br>POR monitors these banks supplyvoltages.|
|VCCADC18|—|Power|1.8 V(nom.) power supplyfor the ADC block.|
|VCCSDx<br>~~pf~~|—<br>~~pf~~|Power<br>~~pf~~|1.0 V(nom.) power supplyfor the SERDES block.<br>~~pf~~|
|VCCSDCK<br>~~pf~~<br>~~pf~~|—<br>~~pf~~<br>~~pf~~|Power<br>~~pf~~<br>~~pf~~|1.0 V(nom.) power supplyfor SERDES clock buffer.<br>~~pf~~<br>~~pf~~|
|VCCPLLSDx<br>~~pf~~<br>~~pf~~|—<br>~~pf~~<br>~~pf~~|Power<br>~~pf~~<br>~~pf~~|1.8 V(nom.) power supplyfor the PLL in the SERDES block.<br>~~pf~~<br>~~pf~~|
|VCCAUXSDQx<br>~~De~~|—<br>~~De ~~|Power<br> ~~GG~~|1.8 V(nom.)auxiliary power supplyfor the SERDES block.<br>~~GG~~|
|**Dedicated Pins**<br>~~pt~~||||
|**Dedicated Configuration I/O Pin**||||
|JTAG_EN|1|Input|LVCMOS input pin. This input selects the JTAG shared GPIO to be used<br>for JTAG:<br>0 = GPIO<br>1 = JTAG|
|**Dedicated ADC I/O Pins**||||
|ADC_REFA, ADC_REFB<br>~~a~~|—<br>~~ee~~|Input<br>~~ee~~|ADC reference voltage, for each of the two ADC converters. If not used,<br>tie toground.|
|ADC_DP/NA, ADC_DP/NB<br>~~a~~|—|Input|Dedicated ADC input pairs, for each of the two ADC converters. If not<br>used, tie toground.|
|**Dedicated SERDES I/O Pins**<br>~~**p**e~~||||
|SDx_RXDP/N<br>~~**p**e~~|—|Input|SERDES data differential inputpairs.|
|SDx_TXDP/N<br>~~**p**e~~|—|Output|SERDES data differential outputpairs.<br>~~f~~|
|SDQy_REFCLKP/N<br>~~pf~~|—<br>~~pf~~|Input<br>~~pf~~|SERDES reference clock differential inputpairs for Quady.<br>~~f~~<br>~~pf~~|
|SD_EXTy_REFCLKP/N<br>~~DG~~|—<br>~~DG~~|Input<br>~~DG~~|Shared SERDES external reference clock inputpairs.<br>~~DG~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Signal Name**|**Bank**|**Type **|**Description**|
|---|---|---|---|
|SDx_REXT|—|Input|SERDES external reference resistor input. Resistor connects between this<br>pin and SDx_REFRET pin. This is used to adjust the on-chip differential<br>termination impedance, based on the external resistance value:<br>REXT= 909Ω, RDIFF= 80Ω<br>REXT= 976Ω, RDIFF= 85Ω<br>REXT= 1.02 kΩ, RDIFF= 90 Ω<br>REXT= 1.15 kΩ,RDIFF= 100 Ω|
|SDx_REFRET|—|Input|SERDES reference return input. These pins should be AC coupled to the<br>VCCPLLSDxsupply.|
|**Misc Pins**||||
|NC||—|No connect.|
|RESERVED||—|This pin is reserved and should not be connected to anything on the<br>board.|
|**General Purpose I/O Pins**||||
|P[T/B/L/R] [Number]_[A/B]|T = 0<br>R = 1, 2<br>B = 3, 4, 5<br>L = 6. 7|Input,<br>Output,<br>Bi-Dir|Programmable User I/O:<br>[T/B/L/R] indicates the package pin/ball is in T (Top), B (Bottom),<br>L (Left), or R (Right) edge of the device.<br>[Number] identifies the PIO [A/B] pair.<br>[A/B] shows the package pin/ball is A or B signal in the pair. PIOs A and B<br>are grouped as a pair.<br>Each A/B pair in the bottom banks supports true differential input and<br>output buffers. When configured as differential input, differential<br>termination of 100 Ω can be selected.<br>Each A/B pair in the top, left and right banks does not support true<br>differential input or output buffer. It supports all single-ended inputs<br>and outputs and can be used for emulated differential output buffer.<br>Some of these user programmable I/O are used during configuration,<br>depending on the configuration mode. User needs to make appropriate<br>connections on the board to isolate the two different functions<br>before/after configuration.<br>Some of these user programmable I/O are shared with special function<br>pins. These pins, when not used as special purpose pins, can be<br>programmed as I/O for user logic.<br>During configuration, the user-programmable I/O are tri-stated with an<br>internal weak pull-down resistor enabled. If any pin is not used (or not<br>bonded to a package pin), it is tri-stated and defaults to have weak<br>pull-down enabled after configuration.|
|**Shared Configuration Pins1, 2**<br>1.<br>These pins can be used for configuration during configuration mode. When configuration is completed, these pins can be used<br>as GPIO, or shared function in GPIO. When these pins are used in dual function, user needs to isolate the signal paths for the<br>dual functions on the board.<br>2.<br>The pins used are defined by the configuration modes detected. Slave SPI or I2C/I3C modes are detected during slave<br>activation. Pins that are not used in the selected configuration mode are tri-stated during configuration and can connect<br>directlyas GPIO in user function.||||
|PRxxx/SDA/USER_SDA|1|Input,<br>Output,<br>Bi-Dir|Configuration:<br>I2C/I3C Mode: SDA signal<br>User Mode:<br>PRxxx: GPIO<br>User_SDA: SDA signal for I2C/I3C interface|
|PRxxx/SCL/USER_SCL|1|Input,<br>Output,<br>Bi-Dir|Configuration:<br>I2C/I3C Mode: SCL signal<br>User Mode:<br>PRxxx: GPIO<br>User_SDA: SCL signal for I2C/I3C interface|
**Shared Configuration Pins[1, 2 ]**
1. These pins can be used for configuration during configuration mode. When configuration is completed, these pins can be used as GPIO, or shared function in GPIO. When these pins are used in dual function, user needs to isolate the signal paths for the dual functions on the board.
2. The pins used are defined by the configuration modes detected. Slave SPI or I[2] C/I3C modes are detected during slave activation. Pins that are not used in the selected configuration mode are tri-stated during configuration and can connect directly as GPIO in user function.
||||Configuration:|
|---|---|---|---|
|||Input,|I2C/I3C Mode: SDA signal|
|PRxxx/SDA/USER_SDA|1|Output,|User Mode:|
|||Bi-Dir|PRxxx: GPIO|
||||User_SDA: SDA signal for I2C/I3C interface|
||||Configuration:|
|||Input,|I2C/I3C Mode: SCL signal|
|PRxxx/SCL/USER_SCL|1|Output,|User Mode:|
|||Bi-Dir|PRxxx: GPIO|
||||User_SDA: SCL signal for I2C/I3C interface|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Signal Name**|**Bank**|**Type **|**Description**|
|---|---|---|---|
|PRxxx/TDO/SSO|1|Input,<br>Output,<br>Bi-Dir|Configuration:<br>Slave SPI Mode: Slave serial output<br>User Mode:<br>PRxxx: GPIO<br>TDO: When JTAG_EN = 1, used as TDO signal for JTAG|
|PRxxx/TDI/SSI|1|Input,<br>Output,<br>Bi-Dir|Configuration:<br>Slave SPI Mode: Slave serial input<br>User Mode:<br>PRxxx: GPIO<br>TDI: When JTAG_EN = 1, used as TDI signal for JTAG|
|PRxxx/TMS/SCSN|1|Input,<br>Output,<br>Bi-Dir|Configuration:<br>Slave SPI Mode: Slave chip select<br>User Mode:<br>PRxxx: GPIO<br>TMS: When JTAG_EN = 1, used as TMS signal for JTAG|
|PRxxx/TCK/SCLK|1|Input,<br>Output,<br>Bi-Dir|Configuration:<br>Slave SPI Mode: Slave clock input<br>User Mode:<br>PRxxx: GPIO<br>TCK: When JTAG_EN = 1, used as TCK signal for JTAG|
|PTxxx/MCSNO|0|Input,<br>Output,<br>Bi-Dir|Configuration:<br>Master SPI Mode: Chip select output<br>User Mode:<br>PTxxx: GPIO|
|PTxxx/MD3|0|Input,<br>Output,<br>Bi-Dir|Configuration:<br>Master Quad SPI Mode: I/O3<br>User Mode:<br>PTxxx: GPIO|
|PTxxx/MD2|0|Input,<br>Output,<br>Bi-Dir|Configuration:<br>Master Quad SPI Mode: I/O2<br>User Mode:<br>PTxxx: GPIO|
|PTxxx/MSI/MD1|0|Input,<br>Output,<br>Bi-Dir|Configuration:<br>Master SPI Mode: Master serial input<br>Master Quad SPI Mode: I/O1<br>User Mode:<br>PTxxx: GPIO|
|PTxxx/MSO/MD0|0|Input,<br>Output,<br>Bi-Dir|Configuration:<br>Master SPI Mode: Master serial output<br>Master Quad SPI Mode: I/O0<br>User Mode:<br>PTxxx: GPIO|
|PTxxx/MCSN/PCLKT0_1|0|Input,<br>Output,<br>Bi-Dir|Configuration:<br>Master SPI Mode: Master chip select output<br>User Mode:<br>PTxxx: GPIO<br>PCLKT0_0: TopPCLK input|
|PTxxx/MCLK/PCLKT0_0|0|Input,<br>Output,<br>Bi-Dir|Configuration:<br>Master SPI Mode: Master clock output<br>User Mode:<br>PTxxx: GPIO<br>PCLKT0_1: TopPCLK input|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Signal Name**|**Bank**|**Type **|**Description**|
|---|---|---|---|
|PTxxx/PROGRAMN|0|Input,<br>Output,<br>Bi-Dir|Configuration:<br>PROGRAMN: Initiate configuration sequence when asserted LOW.<br>User Mode:|
||||PTxxx: GPIO|
||||Configuration:|
||||INITN: Open Drain I/O pin. This signal is driven to LOW when|
|PTxxx/INITN|0|Input,<br>Output,<br>Bi-Dir|configuration sequence is started, to indicate the device is in<br>initialization state. This signal is released after the initialization is<br>completed, and the configuration download can start. User can keep<br>driving this signal LOW to delay configuration download to start.|
||||User Mode:|
||||PTxxx: GPIO|
||||Configuration:|
||||DONE: Open Drain I/O pin. This signal is driven to LOW during|
|||Input,|configuration time. It is released to indicate the device has completed|
|PTxxx/DONE|0|Output,|configuration. User can keep driving this signal LOW to delay the device|
|||Bi-Dir|to wake up from configuration.|
||||User Mode:|
||||PTxxx: GPIO|
## **Shared User GPIO Pins[1, 2, 3, 4 ]**
1. Shared User GPIO pins are pins that can be used as GPIO, or functional pins that connect directly to specific functional blocks, when device enters User Mode.
2. Declaring on assigning the pin as GPIO or specific functional pin is done by configuration bitstream, except JTAG pins.
3. JTAG pins are controlled by JTAG_EN signal. When JTAG_EN = 1, the pins are used for JTAG interface. When JTAG = 0, the pins are used as GPIO or specific functional pin defined by configuration bitstream.
4. Refer to package pin file.
## **Shared JTAG Pins**
|**Shared JTAG Pins**||||
|---|---|---|---|
||||User Mode:|
|PRxxx/TDO/ yyyy|1|Input,<br>Output,<br>Bi-Dir|PRxxx: GPIO<br>TDO: When JTAG_EN = 1, used as TDO signal for JTAG.|
||||yyyy: Otherpossible selectable specific functionalpin.|
||||User Mode:|
|PRxxx/TDI/yyyy|1|Input,<br>Output,<br>Bi-Dir|PRxxx: GPIO<br>TDI: When JTAG_EN = 1, used as TDI signal for JTAG.|
||||yyyy: Otherpossible selectable specific functionalpin.|
||||User Mode:|
|PRxxx/TMS/ yyyy|1|Input,<br>Output,<br>Bi-Dir|PRxxx: GPIO<br>TMS: When JTAG_EN = 1, used as TMS signal for JTAG.|
||||yyyy: Otherpossible selectable specific functionalpin.|
||||User Mode:|
|PRxxx/TCK/ yyyy|1|Input,<br>Output,<br>Bi-Dir|PRxxx: GPIO<br>TCK: When JTAG_EN = 1, used as TCK signal for JTAG.|
||||Yyyy: Otherpossible selectable specific functionalpin.|
## **Shared CLOCK Pins[1]**
1. Some PCLK pins can also be used as GPLL reference clock input pin. Refer to sysCLOCK PLL Design and Usage Guide for Nexus Platform (FPGA-TN-02095).
||||||User Mode:|
|---|---|---|---|---|---|
||||||PBxxx: GPIO|
|PBxxx/PCLK[T,C][3,4,5]_[0-<br>3]/yyyy|3, 4, 5|3, 4, 5|3, 4, 5|Input,<br>Output,<br>Bi-Dir|PCLK: Primary clock or GPLL Refclk signal.<br>[T,C] = True/Complement when using differential signaling.<br>[3,4,5] = Bank|
||||||[0-3] Up to 4 signals in the bank.|
||||||yyyy: Otherpossible selectable specific functionalpin.|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|**Signal Name**|**Bank**|**Type **|**Description**|
|---|---|---|---|
|PTxxx/PCLKT0_[0-1]/yyyy|0|Input,<br>Output,<br>Bi-Dir|User Mode:<br>PTxxx: GPIO<br>PCLKT: Primary clock or GPLL Refclk signal (only single-ended).<br>[0-1] Up to two signals in the bank.<br>yyyy: Otherpossible selectable specific functionalpin.|
|PRxxx/PCLKT[1,2]_[0-2]/yyyy|1, 2|Input,<br>Output,<br>Bi-Dir|User Mode:<br>PRxxx: GPIO<br>PCLKT: Primary clock or GPLL Refclk signal (only single-ended).<br>[0-2] Up to three signals in the bank.<br>yyyy: Otherpossible selectable specific functionalpin.|
|PLxxx/PCLKT[6,7]_[0-2]/yyyy|6, 7|Input,<br>Output,<br>Bi-Dir|User Mode:<br>PLxxx: GPIO<br>PCLKT: Primary Clock or GPLL Refclk signal (only single-ended).<br>[0-2] Up to three signals in the bank.<br>yyyy: Otherpossible selectable specific functionalpin.|
|PBxxx/LRC_GPLL[T,C]_IN/yyyy|3|Input,<br>Output,<br>Bi-Dir|User Mode:<br>PBxxx: GPIO<br>LRC_GPLL: Lower Right GPLL Refclk signal (PLLCK).<br>[T,C] = True/Complement when using differential signaling.<br>yyyy: Otherpossible selectable specific functionalpin.|
|PBxxx/LLC_GPLL[T,C]_IN/yyyy|5|Input,<br>Output,<br>Bi-Dir|User Mode:<br>PBxxx: GPIO<br>LLC_GPLL: Lower Left GPLL Refclk signal (PLLCK).<br>[T,C] = True/Complement when using differential signaling.<br>yyyy: Otherpossible selectable specific functionalpin.|
|PLxxx/ULC_GPLLT_IN/yyyy|7|Input,<br>Output,<br>Bi-Dir|User Mode:<br>PLxxx: GPIO<br>ULC_GPLL: Upper Left GPLL Refclk signal (only single-ended) (PLLCK).<br>yyyy: Otherpossible selectable specific functionalpin.|
|PRxxx/URC_GPLLT_IN/yyyy|1|Input,<br>Output,<br>Bi-Dir|User Mode:<br>PRxxx: GPIO<br>URC_GPLL: Upper Right GPLL Refclk signal (Only Single Ended) (PLLCK).<br>yyyy: Otherpossible selectable specific functional.|
|PRxxx/yyyy|1|Input,<br>Output,<br>Bi-Dir|User Mode:<br>PRxxx: GPIO<br>yyyy: Otherpossible selectable specific functionalpin.|
|**Shared VREF Pins**||||
|PBxxx/VREF[3,4,5]_[1-2]/yyyy|3, 4, 5|Input,<br>Output,<br>Bi-Dir|User Mode:<br>PBxxx: GPIO<br>VREF: Reference voltage for DDR memory function.<br>[3,4,5] = Bank<br>[1-2] Up to VREFs for each bank.<br>yyyy: Otherpossible selectable specific functionalpin.|
|**Shared ADC Pins**<br>~~pT~~||||
|PBxxx/ADC_C[P,N]nn/yyyy<br>~~pT~~|3, 4, 5<br>~~pT~~|Input,<br>Output,<br>Bi-Dir<br>~~pT~~|User Mode:<br>PBxxx: GPIO<br>ADC_C: ADC channel inputs.<br>[P,N] = Positive or Negative input.<br>nn = ADC Channel number (0 – 15).<br>yyyy: Otherpossible selectable specific functionalpin.<br>~~pT~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Signal Name**|**Bank**|**Type **|**Description**|
|---|---|---|---|
|**Shared Comparator Pins**||||
|PBxxx/COMP[1-3][P,N]/yyyy|3, 5|Input,<br>Output,<br>Bi-Dir|User Mode:<br>PBxxx: GPIO<br>COMP: Differential comparator input.<br>[P,N] = Positive or Negative input.<br>[1-3] = Input to comparators 1-3.<br>yyyy: Otherpossible selectable specific functionalpin.|
|**Shared SGMII Pins**||||
|PBxxx/SGMII_RX[P,N][0-1]/yyyy|3, 5|Input,<br>Output,<br>Bi-Dir|User Mode:<br>PBxxx: GPIO<br>SGMII_RX: Differential SGMII RX input.<br>[P,N] = Positive or Negative input.<br>[0-1] = Input to SGMII RX0 or RX1<br>yyyy: Otherpossible selectable specific functionalpin.|
Note that not all signals are available as external pins in all packages. Refer to the Pinout List file for various package details.
## **5.2. Pin Information Summary**
**Table 5.2. Pin Information Summary**
|**Pin**<br>~~rece~~|**Pin**<br>~~rece~~|**LFCPNX-50**<br>~~a~~<br>~~receceeeeeee~~|**LFCPNX-50**<br>~~a~~<br>~~receceeeeeee~~|**LFCPNX-50**<br>~~a~~<br>~~receceeeeeee~~|**LFCPNX-50**<br>~~a~~<br>~~receceeeeeee~~|**LFCPNX-100**<br>~~a~~<br>~~eeeeeeeeeeee~~|**LFCPNX-100**<br>~~a~~<br>~~eeeeeeeeeeee~~|**LFCPNX-100**<br>~~a~~<br>~~eeeeeeeeeeee~~|**LFCPNX-100**<br>~~a~~<br>~~eeeeeeeeeeee~~|**LFCPNX-100**<br>~~a~~<br>~~eeeeeeeeeeee~~|
|---|---|---|---|---|---|---|---|---|---|---|
|||**ASG256**<br>~~rece~~|**CBG256**<br>~~cee~~|**BBG484**<br>~~eee~~|**BFG484**<br>~~ee~~|**ASG256**<br>~~eee~~|**CBG256**<br>~~ee~~|**BBG484**<br>~~eee~~|**BFG484**<br>~~ee~~|**LFG672**<br>~~ee~~|
|**User I/O Pins**<br>~~rece cee eee ee eee ee eee ee ee~~<br>~~po~~|||||||||||
|General Purpose<br>Inputs/Outputs<br>per Bank<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~|Bank 0<br>~~po~~<br>~~po~~|12|12|24|24|12|12|24|24|24|
||Bank 1<br>~~po~~<br>~~po~~<br>~~po~~|25|25|39|39|25|25|39|39|39|
||Bank 2<br>~~po~~<br>~~po~~<br>~~po~~|6|6|32|32|6|6|32|32|32|
||Bank 3<br>~~po~~<br>~~po~~<br>~~po~~|24|24|36|36|24|24|48|48|48|
||Bank 4<br>~~po~~<br>~~po~~<br>~~po~~|24|24|24|24|24|24|48|48|48|
||Bank 5<br>~~po~~<br>~~po~~<br>~~po~~|36|36|36|36|36|36|36|36|36|
||Bank 6<br>~~po~~<br>~~po~~<br>~~po~~|6|6|32|32|6|6|32|32|32|
||Bank 7<br>~~po~~<br>~~po~~|26|26|40|40|26|26|40|40|40|
|Total Single-Ended User I/O<br>~~po~~<br>~~po~~<br>~~po~~||159<br>~~po~~|159<br>~~po~~|263<br>~~po~~|263<br>~~po~~|159<br>~~po~~|159<br>~~po~~|299<br>~~po~~|299<br>~~po~~|299<br>~~po~~|
|Differential<br>Input/Output<br>Pairs<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~|Bank 0<br>~~po~~<br>~~po~~|6|6|12|12|6|6|12|12|12|
||Bank 1<br>~~po~~<br>~~po~~<br>~~po~~|12|12|19|19|12|12|19|19|19|
||Bank 2<br>~~po~~<br>~~po~~<br>~~po~~|3|3|16|16|3|3|16|16|16|
||Bank 3<br>~~po~~<br>~~po~~<br>~~po~~|12|12|18|18|12|12|24|24|24|
||Bank 4<br>~~po~~<br>~~po~~<br>~~po~~|12|12|12|12|12|12|24|24|24|
||Bank 5<br>~~po~~<br>~~po~~<br>~~Re~~|18<br>~~ee~~|18<br>~~ee~~|18<br>~~GC~~|18<br>~~GC~~|18<br>~~GC~~|18<br>~~GC~~|18<br>~~GC~~|18<br>~~GC~~|18<br>~~GC~~|
||Bank 6<br>~~po~~<br>~~Re~~<br>~~po~~|3<br>~~ee~~|3<br>~~ee~~|16<br>~~GC~~|16<br>~~GC~~|3<br>~~GC~~|3<br>~~GC~~|16<br>~~GC~~|16<br>~~GC~~|16<br>~~GC~~|
||Bank 7<br>~~Re ~~<br>~~po~~|13<br> ~~ee~~|13<br>~~ee~~|20<br>~~GC~~|20<br>~~GC~~|13<br>~~GC~~|13<br>~~GC~~|20<br>~~GC~~|20<br>~~GC~~|20<br>~~GC~~|
|Total Differential I/O<br>~~po~~<br>~~po~~||79<br>~~po~~|79<br>~~po~~|131<br>~~po~~|131<br>~~po~~|79<br>~~po~~|79<br>~~po~~|149<br>~~po~~|149<br>~~po~~|149<br>~~po~~|
|**Power Pins**<br>~~pO~~|||||||||||
|VCC,VCCECLK<br>~~pO~~<br>~~po~~||6|6|10|10|6|6|10|10|25|
|VCCAUXA<br>~~pO~~<br>~~po~~<br>~~**p**o~~||1|1|1|1|1|1|1|1|2|
|VCCAUX<br>~~po~~<br>~~**p**o~~||1|2|2|2|1|2|2|2|4|
|VCCAUXHx<br>~~**p**o~~<br>~~po~~||3|3|3|3<br>~~o~~|3<br>~~o~~|3<br>~~o~~|3<br>~~o~~|3<br>~~o~~|6<br>~~o~~|
|VCCAUXSDQx<br>~~po~~||1|1|2|2|1|1|2|2|2|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-DS-02086-2.0
163
**CertusPro-NX Family Data Sheet**
|**Pin**<br>~~a~~<br>~~po~~|**Pin**<br>~~a~~<br>~~po~~|**LFCPNX-50**<br>~~a~~<br>~~eecee~~<br>~~eee~~|**LFCPNX-50**<br>~~a~~<br>~~eecee~~<br>~~eee~~|**LFCPNX-50**<br>~~a~~<br>~~eecee~~<br>~~eee~~|**LFCPNX-50**<br>~~a~~<br>~~eecee~~<br>~~eee~~|**LFCPNX-100**<br>~~eeeeeeeee~~|**LFCPNX-100**<br>~~eeeeeeeee~~|**LFCPNX-100**<br>~~eeeeeeeee~~|**LFCPNX-100**<br>~~eeeeeeeee~~|**LFCPNX-100**<br>~~eeeeeeeee~~|
|---|---|---|---|---|---|---|---|---|---|---|
|||**ASG256**<br>~~a~~<br>~~ee~~<br>~~po~~|**CBG256**<br>~~a~~<br>~~cee~~|**BBG484**<br>~~a~~|**BFG484**<br>~~eee~~|**ASG256**<br>~~ee~~|**CBG256**<br>~~eee~~|**BBG484**<br>~~ee~~|**BFG484**<br>~~ee~~|**LFG672**|
|VCCIO<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~|Bank 0<br>~~po~~<br>~~po~~|1<br>~~ee ~~<br>~~po~~|1<br> ~~cee~~|1|1<br>~~eee ~~|1<br> ~~ee ~~|1<br> ~~eee ~~|1<br> ~~ee ~~|1<br> ~~ee~~|1|
||Bank 1<br>~~po~~<br>~~po~~<br>~~po~~|1<br>~~po~~|1|2|2|1|1|2|2|2|
||Bank 2<br>~~po~~<br>~~po~~<br>~~po~~|1<br>|1<br>|1<br>|1<br>|1<br>|1<br>|1<br>|1<br>|2<br>|
||Bank 3<br>~~po~~<br>~~po~~|2<br>|2<br>|3<br>|3<br>|2<br>|2<br>|3<br>|3<br>|3<br>|
||Bank 4<br>~~popT~~<br>~~po~~|2<br>~~pT~~|2<br>~~pT~~|3<br>~~pT~~|3<br>~~pT~~|2<br>~~pT~~|2<br>~~pT~~|3<br>~~pT~~|3<br>~~pT~~|3<br>~~pT~~|
||Bank 5<br>~~po~~<br>~~po~~|2|2|2|2|2|2|2|2|3|
||Bank 6<br>~~po~~<br>~~po~~<br>~~po~~|1|1|1|1|1|1|1|1|2|
||Bank 7<br>~~po~~<br>~~po~~|1|1|2|2|1|1|2|2|2|
|VCCSDx<br>~~po~~<br>~~po~~<br>~~**p**o~~||5<br>~~po~~|5<br>~~po~~|9<br>~~po~~|5<br>~~po~~|5<br>~~po~~|5<br>~~po~~|9<br>~~po~~|5<br>~~po~~|17<br>~~po~~|
|VCCPLLSDx<br>~~**p**o~~||4|4|8|4|4|4|8|4|8|
|VCCADC18<br>~~**p**o~~<br>~~po~~||1|1|1|1<br>~~o~~|1<br>~~o~~|1<br>~~o~~|1<br>~~o~~|1<br>~~o~~|1<br>~~o~~|
|Total Power Pins<br>~~po~~||33|34|51|43|33|34|51|43|83|
|**GND Pins**<br>~~po~~<br>~~pT~~<br>~~po~~|||||||||||
|VSS<br>~~po~~<br>~~po~~||13|12|23|23|13|12|23|23|46|
|VSSADC<br>~~po~~<br>~~po~~||1|1|1<br>~~eG~~|1<br>~~eG~~|1|1|1|1|1|
|VSSSDQ<br>~~po~~<br>~~ee~~||13<br>~~ee~~|13<br>~~ee~~|47<br>~~ee~~<br>~~eG~~|47<br>~~ee~~<br>~~eG~~|13<br>~~ee~~|13<br>~~ee~~|47<br>~~ee~~|47<br>~~ee~~|89<br>~~ee~~|
|Total GND Pins<br>~~ee~~<br>~~eG~~||27<br>~~ee~~<br>~~eG~~|26<br>~~ee~~<br>~~eG~~|71<br>~~ee~~<br>~~eG~~<br>~~eG~~|71<br>~~ee~~<br>~~eG~~<br>~~eG~~|27<br>~~ee~~<br>~~eG~~|26<br>~~ee~~<br>~~eG~~|71<br>~~ee~~<br>~~eG~~|71<br>~~ee~~<br>~~eG~~|136<br>~~ee~~<br>~~eG~~|
|**Dedicated Pins**<br>~~eG~~<br>~~pn~~|||||||||||
|Dedicated ADC Channels<br>(pairs)||2|2|2|2|2|2|2|2|2|
|Dedicated ADC Reference<br>Voltage Pins||2|2|2|2|2|2|2|2|2|
|Dedicated SERDES Pins<br>~~pO~~||30<br>~~pO~~|30<br>~~pO~~|30<br>~~pO~~|30<br>~~pO~~|30<br>~~pO~~|30<br>~~pO~~|56<br>~~pO~~|30<br>~~pO~~|56<br>~~pO~~|
|**Dedicated Misc Pins**<br>~~po~~|||||||||||
|JTAGEN<br>~~po~~||1|1|1|1|1|1|1|1|1|
|NC<br>~~po~~<br>~~GG~~||0<br>~~GG~~|0<br>~~GG~~|62<br>~~GG~~|70<br>~~GG~~|0<br>~~GG~~|0<br>~~GG~~|0<br>~~GG~~|34<br>~~GG~~|91<br>~~GG~~|
|RESERVED<br>~~GG~~<br>~~po~~||0<br>~~GG~~<br>~~po~~|0<br>~~GG~~<br>~~po~~|0<br>~~GG~~<br>~~po~~|0<br>~~GG~~<br>~~po~~|0<br>~~GG~~<br>~~po~~|0<br>~~GG~~<br>~~po~~|0<br>~~GG~~<br>~~po~~|0<br>~~GG~~<br>~~po~~|0<br>~~GG~~<br>~~po~~|
|Total Dedicated Pins<br>~~po~~||37<br>~~po~~|37<br>~~po~~|99<br>~~po~~|107<br>~~po~~|37<br>~~po~~|37<br>~~po~~|63<br>~~po~~|71<br>~~po~~|154<br>~~po~~|
|**Shared Pins**<br>~~po~~|||||||||||
|Shared<br>Configuration<br>Pins<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~|Bank 0<br>~~po~~<br>~~po~~|10|10|10|10|10|10|10|10|10|
||Bank 1<br>~~po~~<br>~~po~~<br>~~po~~|6|6|6|6|6|6|6|6|6|
||Bank 2<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 3<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 4<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 5<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 6<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 7<br>~~po~~<br>~~po~~<br>~~Re~~|0<br>~~ee~~|0<br>~~ee~~|0|0<br>~~eG~~|0<br>~~eG~~|0|0|0|0|
|Shared JTAG Pins<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~|Bank 0<br>~~po~~<br>~~Re~~<br>~~Re~~|0<br>~~ee~~<br>~~ee~~|0<br>~~ee~~<br>~~ee~~|0|0<br>~~eG~~<br>~~GO~~|0<br>~~eG~~<br>~~GO~~|0<br>~~GO~~|0|0|0|
||Bank 1<br>~~Re ~~<br>~~Re~~<br>~~po~~|4<br> ~~ee~~<br>~~ee~~|4<br>~~ee~~<br>~~ee~~|4|4<br>~~eG~~<br>~~GO~~|4<br>~~eG~~<br>~~GO~~|4<br>~~GO~~|4|4|4|
||Bank 2<br>~~Re ~~<br>~~po~~<br>~~po~~|0<br> ~~ee~~|0<br>~~ee~~|0|0<br>~~GO~~|0<br>~~GO~~|0<br>~~GO~~|0|0|0|
||Bank 3<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 4<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 5<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 6<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 7<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
164
**CertusPro-NX Family Data Sheet**
|**Pin**<br>~~ee~~<br>~~po~~|**Pin**<br>~~ee~~<br>~~po~~|**LFCPNX-50**<br>~~a~~<br>~~eeceseeeees~~|**LFCPNX-50**<br>~~a~~<br>~~eeceseeeees~~|**LFCPNX-50**<br>~~a~~<br>~~eeceseeeees~~|**LFCPNX-50**<br>~~a~~<br>~~eeceseeeees~~|**LFCPNX-100**<br>~~a~~<br>~~eeeeeeeeee~~|**LFCPNX-100**<br>~~a~~<br>~~eeeeeeeeee~~|**LFCPNX-100**<br>~~a~~<br>~~eeeeeeeeee~~|**LFCPNX-100**<br>~~a~~<br>~~eeeeeeeeee~~|**LFCPNX-100**<br>~~a~~<br>~~eeeeeeeeee~~|
|---|---|---|---|---|---|---|---|---|---|---|
|||**ASG256**<br>~~a~~<br>~~ee~~<br>~~po~~|**CBG256**<br>~~a~~<br>~~ces~~|**BBG484**<br>~~a~~<br>~~eee~~|**BFG484**<br>~~a~~<br>~~ees~~|**ASG256**<br>~~a~~<br>~~ee~~|**CBG256**<br>~~a~~<br>~~ee~~|**BBG484**<br>~~a~~<br>~~ee~~|**BFG484**<br>~~a~~<br>~~ee~~|**LFG672**<br>~~a~~<br>~~ee~~|
|Shared PCLK Pins<br>~~ee~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~|Bank 0<br>~~ee ~~<br>~~po~~<br>~~po~~|2<br>~~a~~<br> ~~ee ~~<br>~~po~~|2<br>~~a~~<br> ~~ces ~~|2<br>~~a~~<br> ~~eee ~~|2<br>~~a~~<br> ~~ees ~~|2<br>~~a~~<br> ~~ee ~~|2<br>~~a~~<br> ~~ee ~~|2<br>~~a~~<br> ~~ee ~~|2<br>~~a~~<br> ~~ee ~~|2<br>~~a~~<br> ~~ee~~|
||Bank 1<br>~~po~~<br>~~po~~<br>~~po~~|3<br>~~po~~|3|3|3|3|3|3|3|3|
||Bank 2<br>~~po~~<br>~~po~~<br>~~po~~|3<br>|3<br>|3<br>|3<br>|3<br>|3<br>|3<br>|3<br>|3<br>|
||Bank 3<br>~~po~~<br>~~po~~|8<br>|8<br>|8<br>|8<br>|8<br>|8<br>|8<br>|8<br>|8<br>|
||Bank 4<br>~~popT~~<br>~~po~~|8<br>~~pT~~|8<br>~~pT~~|8<br>~~pT~~|8<br>~~pT~~|8<br>~~pT~~|8<br>~~pT~~|8<br>~~pT~~|8<br>~~pT~~|8<br>~~pT~~|
||Bank 5<br>~~po~~<br>~~po~~|8|8|8|8|8|8|8|8|8|
||Bank 6<br>~~po~~<br>~~po~~<br>~~po~~|3<br>~~po~~|3|3|3|3|3|3|3|3|
||Bank 7<br>~~po~~<br>~~po~~<br>~~po~~|3<br>~~po~~<br>|3<br>|3<br>|3<br>|3<br>|3<br>|3<br>|3<br>|3<br>|
|Shared GPLL Pins<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~|Bank 0<br>~~po~~<br>~~po~~|0<br>~~po~~<br>|0<br>|0<br>|0<br>|0<br>|0<br>|0<br>|0<br>|0<br>|
||Bank 1<br>~~popT~~<br>~~po~~|2<br>~~pT~~|2<br>~~pT~~|2<br>~~pT~~|2<br>~~pT~~|2<br>~~pT~~|2<br>~~pT~~|2<br>~~pT~~|2<br>~~pT~~|2<br>~~pT~~|
||Bank 2<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 3<br>~~po~~<br>~~po~~<br>~~po~~|2|2|2|2|2|2|2|2|2|
||Bank 4<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 5<br>~~po~~<br>~~po~~<br>~~po~~|2<br>|2<br>|2<br>|2<br>|2<br>|2<br>|2<br>|2<br>|2<br>|
||Bank 6<br>~~po~~<br>~~po~~<br>~~ee~~|0<br><br>~~ee~~|0<br><br>~~ee~~|0<br><br>~~eG~~<br>|0<br><br>~~eG~~<br>|0<br><br>~~eG~~<br>|0<br><br>~~eG~~<br>|0<br>|0<br>|0<br>|
||Bank 7<br>~~poee~~<br>~~ee~~|2<br>~~ee~~<br>~~ee~~|2<br>~~ee~~<br>~~ee~~|2<br>~~ee~~<br>~~eG~~<br>|2<br>~~ee~~<br>~~eG~~<br>|2<br>~~ee~~<br>~~eG~~<br>|2<br>~~ee~~<br>~~eG~~<br>|2<br>~~ee~~|2<br>~~ee~~|2<br>~~ee~~|
|Shared VREF<br>Pins<br><br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~|Bank 0<br>~~ee~~<br>~~ee~~<br>~~po~~|0<br>~~ee~~<br>~~ee~~|0<br>~~ee~~<br>~~ee~~|0<br>~~ee~~<br>~~eG~~<br>~~eG~~|0<br>~~ee~~<br>~~eG~~<br>~~eG~~|0<br>~~ee~~<br>~~eG~~<br>~~eG~~|0<br>~~ee~~<br>~~eG~~<br>~~eG~~|0<br>~~ee~~|0<br>~~ee~~|0<br>~~ee~~|
||Bank 1<br>~~ee~~<br>~~po~~<br>~~po~~|0<br>~~ee~~|0<br>~~ee ~~|0<br>~~eG~~<br> ~~eG~~|0<br>~~eG~~<br>~~eG~~|0<br>~~eG~~<br>~~eG~~|0<br>~~eG~~<br>~~eG~~|0|0|0|
||Bank 2<br><br>~~po~~<br>~~po~~<br>~~po~~|0<br>|0<br>|0<br> ~~eG~~|0<br>~~eG~~|0<br>~~eG~~|0<br>~~eG~~|0|0|0|
||Bank 3<br>~~po~~<br>~~po~~<br>~~po~~|2|2|2|2|2|2|2|2|2|
||Bank 4<br>~~po~~<br>~~po~~<br>~~Re~~|2<br>~~ee~~|2<br>~~ee~~|2<br>~~eG~~|2<br>~~eG~~|2<br>~~eG~~|2<br>~~eG~~|2<br>~~eG~~|2<br>~~eG~~|2<br>~~eG~~|
||Bank 5<br>~~po~~<br>~~Re~~<br>~~po~~|2<br>~~ee~~|2<br>~~ee~~|2<br>~~eG~~|2<br>~~eG~~|2<br>~~eG~~|2<br>~~eG~~|2<br>~~eG~~|2<br>~~eG~~|2<br>~~eG~~|
||Bank 6<br>~~Re ~~<br>~~po~~<br>~~po~~|0<br> ~~ee~~|0<br>~~ee~~|0<br>~~eG~~|0<br>~~eG~~|0<br>~~eG~~|0<br>~~eG~~|0<br>~~eG~~|0<br>~~eG~~|0<br>~~eG~~|
||Bank 7<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
|Shared ADC<br>Channels (pairs)<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~|Bank 0<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 1<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 2<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 3<br>~~po~~<br>~~po~~<br>~~po~~|8|8|8|8|8|8|8|8|8|
||Bank 4<br>~~po~~<br>~~po~~<br>~~po~~|4|4|4|4|4|4|4|4|4|
||Bank 5<br>~~po~~<br>~~po~~<br>~~po~~|4|4|4|4|4|4|4|4|4|
||Bank 6<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 7<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
|Shared<br>Comparator<br>Channels (pairs)<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~|Bank 0<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 1<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 2<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 3<br>~~po~~<br>~~po~~<br>~~po~~|3|3|3|3|3|3|3|3|3|
||Bank 4<br>~~po~~<br>~~po~~<br>~~Re~~|0<br>~~ee~~|0<br>~~ee~~|0<br>~~GC~~|0<br>~~GC~~|0<br>~~GC~~|0<br>~~GC~~|0<br>~~GC~~|0<br>~~GC~~|0<br>~~GC~~|
||Bank 5<br>~~po~~<br>~~Re~~<br>~~po~~|3<br>~~ee~~|3<br>~~ee~~|3<br>~~GC~~|3<br>~~GC~~|3<br>~~GC~~|3<br>~~GC~~|3<br>~~GC~~|3<br>~~GC~~|3<br>~~GC~~|
||Bank 6<br>~~Re ~~<br>~~po~~<br>~~po~~|0<br> ~~ee~~|0<br>~~ee~~|0<br>~~GC~~|0<br>~~GC~~|0<br>~~GC~~|0<br>~~GC~~|0<br>~~GC~~|0<br>~~GC~~|0<br>~~GC~~|
||Bank 7<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
165
**CertusPro-NX Family Data Sheet**
|**Pin**<br>~~a~~<br>~~po~~|**Pin**<br>~~a~~<br>~~po~~|**LFCPNX-50**<br>~~a~~<br>~~eecee~~<br>~~eee~~|**LFCPNX-50**<br>~~a~~<br>~~eecee~~<br>~~eee~~|**LFCPNX-50**<br>~~a~~<br>~~eecee~~<br>~~eee~~|**LFCPNX-50**<br>~~a~~<br>~~eecee~~<br>~~eee~~|**LFCPNX-100**<br>~~eeeeeeeee~~|**LFCPNX-100**<br>~~eeeeeeeee~~|**LFCPNX-100**<br>~~eeeeeeeee~~|**LFCPNX-100**<br>~~eeeeeeeee~~|**LFCPNX-100**<br>~~eeeeeeeee~~|
|---|---|---|---|---|---|---|---|---|---|---|
|||**ASG256**<br>~~a~~<br>~~ee~~<br>~~po~~|**CBG256**<br>~~a~~<br>~~cee~~|**BBG484**<br>~~a~~|**BFG484**<br>~~eee~~|**ASG256**<br>~~ee~~|**CBG256**<br>~~eee~~|**BBG484**<br>~~ee~~|**BFG484**<br>~~ee~~|**LFG672**|
|Shared SGMII<br>Channels (pairs)<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~<br>~~po~~|Bank 0<br>~~po~~<br>~~po~~|0<br>~~ee ~~<br>~~po~~|0<br> ~~cee~~|0|0<br>~~eee ~~|0<br> ~~ee ~~|0<br> ~~eee ~~|0<br> ~~ee ~~|0<br> ~~ee~~|0|
||Bank 1<br>~~po~~<br>~~po~~<br>~~po~~|0<br>~~po~~|0|0|0|0|0|0|0|0|
||Bank 2<br>~~po~~<br>~~po~~<br>~~po~~|0<br>|0<br>|0<br>|0<br>|0<br>|0<br>|0<br>|0<br>|0<br>|
||Bank 3<br>~~po~~<br>~~po~~|0<br>|0<br>|0<br>|0<br>|0<br>|0<br>|0<br>|0<br>|0<br>|
||Bank 4<br>~~popT~~<br>~~po~~|0<br>~~pT~~|0<br>~~pT~~|0<br>~~pT~~|0<br>~~pT~~|0<br>~~pT~~|0<br>~~pT~~|0<br>~~pT~~|0<br>~~pT~~|0<br>~~pT~~|
||Bank 5<br>~~po~~<br>~~po~~|2|2|2|2|2|2|2|2|2|
||Bank 6<br>~~po~~<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
||Bank 7<br>~~po~~<br>~~po~~|0|0|0|0|0|0|0|0|0|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **6. Ordering Information**
Lattice provides a wide variety of services for its products including custom marking, factory programming, known good die, and application specific testing. Please contact sales representatives.
## **6.1. Part Number Description**
**==> picture [416 x 270] intentionally omitted <==**
**----- Start of picture text -----**<br>
LFCPNX - XXX - X X X X - XXX X - XXX<br>Device Family<br> CertusPro-NX FPGA<br>1<br>Revision (Optional)<br> 01A = Die Version<br>Grade<br>Logic Capacity C = Commercial<br> 50 = 50k Logic Cells I = Industrial<br>100 = 100k Logic Cells A = Automotive<br>Ball Count<br> 256<br> 484<br> 672<br>BOM<br> G = ROHS6/6<br>Ball Pitch(mm)<br> F = 1.00<br> B = 0.80<br> S = 0.50<br>Package Type<br> A = Fan Out WLCSP (FOWLP)<br> B = BGA(Wirebond)<br> L = fcBGA - LIDLESS<br> C = fcCSP<br>2<br>Speed (same number for HP and LP)<br> 7 = Slowest<br> 8<br> 9 = Fastest<br>**----- End of picture text -----**<br>
## **Notes** :
1. 01A die version does not support JTAG Boundary Scan feature.
2. Input comparator, ADC, EBR ECC, and DTR are only available in Commercial/Industrial –8 and –9 speed grades and Automotive –7 and –8 speed grades.
3. If the user application requires PCIe Channel 3, please refer to Alternate Ordering Part Numbers described in Lattice PCN# 01A-23.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
## **6.2. Ordering Part Numbers**
CertusPro-NX devices have either of the top-side markings as shown in the examples below.
**==> picture [192 x 62] intentionally omitted <==**
**----- Start of picture text -----**<br>
CertusPro - NX CertusPro - NX<br>LFCPNX-100<br>8LFG672C<br>Lot ID Lot ID<br>Barcode Barcode<br>COO COO<br>**----- End of picture text -----**<br>
**Figure 6.1. Top Marking Diagram**
## **6.2.1. Commercial**
|**Part Number**<br>~~**p**O~~|**Speed**|**Package **|**Pins**|**Temp. **|**Logic Cells(k)**|
|---|---|---|---|---|---|
|LFCPNX-50-7ASG256C<br>~~**p**O~~|–7|ASG256<br>~~f~~|256<br>~~f~~|Commercial<br>~~f~~|50<br>~~f~~|
|LFCPNX-50-8ASG256C<br>~~GG~~|–8<br>~~GG~~|ASG256<br>~~GG~~|256<br>~~GG~~|Commercial<br>~~GG~~|50<br>~~GG~~|
|LFCPNX-50-9ASG256C<br>~~GG~~|–9<br>~~GG~~|ASG256<br>~~GG~~|256<br>~~GG~~|Commercial<br>~~GG~~|50<br>~~GG~~|
|LFCPNX-50-7CBG256C<br>~~a~~|–7<br>~~eG~~|CBG256<br>~~eG~~|256<br>~~eG~~|Commercial<br>~~eG~~|50<br>~~eG~~|
|LFCPNX-50-8CBG256C<br>~~a ~~<br>~~a~~|–8<br> ~~eG~~<br>~~GO~~|CBG256<br>~~eG~~<br>~~GO~~|256<br>~~eG~~<br>~~GO~~|Commercial<br>~~eG~~<br>~~GO~~|50<br>~~eG~~<br>~~GO~~|
|LFCPNX-50-9CBG256C<br>~~a~~<br>~~a~~|–9<br>~~GO~~<br>~~GG~~|CBG256<br>~~GO~~<br>~~GG~~|256<br>~~GO~~<br>~~GG~~|Commercial<br>~~GO~~<br>~~GG~~|50<br>~~GO~~<br>~~GG~~|
|LFCPNX-50-7BBG484C<br>~~GG~~|–7<br>~~GG~~|BBG484<br>~~GG~~|484<br>~~GG~~|Commercial<br>~~GG~~|50<br>~~GG~~|
|LFCPNX-50-8BBG484C<br>~~GG~~|–8<br>~~GG~~|BBG484<br>~~GG~~|484<br>~~GG~~|Commercial<br>~~GG~~|50<br>~~GG~~|
|LFCPNX-50-9BBG484C<br>~~a~~|–9<br>~~eG~~|BBG484<br>~~eG~~|484<br>~~eG~~|Commercial<br>~~eG~~|50<br>~~eG~~|
|LFCPNX-50-7BFG484C<br>~~a ~~<br>~~a~~|–7<br> ~~eG~~<br>~~GO~~|BFG484<br>~~eG~~<br>~~GO~~|484<br>~~eG~~<br>~~GO~~|Commercial<br>~~eG~~<br>~~GO~~|50<br>~~eG~~<br>~~GO~~|
|LFCPNX-50-8BFG484C<br>~~a~~<br>~~a ~~<br>~~a~~|–8<br>~~GO~~<br> ~~GG~~|BFG484<br>~~GO~~<br>~~GG~~|484<br>~~GO~~<br>~~GG~~|Commercial<br>~~GO~~<br>~~GG~~<br>~~CO~~|50<br>~~GO~~<br>~~GG~~<br>~~CO~~|
|LFCPNX-50-9BFG484C<br>~~a~~<br>~~a~~<br>~~a~~|–9<br>~~GG~~<br>|BFG484<br>~~GG~~<br>|484<br>~~GG~~<br>|Commercial<br>~~GG~~<br>~~CO~~<br>~~CO~~<br>|50<br>~~GG~~<br>~~CO~~<br>~~CO~~<br>|
|LFCPNX-100-7ASG256C<br>~~a~~<br>~~a~~|–7<br>~~GG~~<br>|ASG256<br>~~GG~~<br>|256<br>~~GG~~<br>|Commercial<br>~~CO~~<br>~~GG~~<br>~~CO~~<br>|100<br>~~CO~~<br>~~GG~~<br>~~CO~~<br>|
|LFCPNX-100-8ASG256C<br>~~a~~|–8<br>~~GG~~|ASG256<br>~~GG~~|256<br>~~GG~~|Commercial<br>~~CO~~<br>~~GG~~|100<br>~~CO~~<br>~~GG~~|
|LFCPNX-100-9ASG256C<br>~~a ~~<br>~~GO~~|–9<br> ~~GG~~<br>~~GO~~|ASG256<br>~~GG~~<br>~~GO~~|256<br>~~GG~~<br>~~GO~~|Commercial<br>~~CO~~<br>~~GG~~<br>~~GO~~|100<br>~~CO~~<br>~~GG~~<br>~~GO~~|
|LFCPNX-100-7CBG256C<br>~~GO~~<br>~~GO~~<br>~~a~~|–7<br>~~GO~~<br>~~GO~~<br>~~Se~~|CBG256<br>~~GO~~<br>~~GO~~<br>~~GG~~|256<br>~~GO~~<br>~~GO~~<br>~~GG~~|Commercial<br>~~GO~~<br>~~GO~~|100<br>~~GO~~<br>~~GO~~|
|LFCPNX-100-8CBG256C<br>~~GO~~<br>~~a~~<br>~~a~~|–8<br>~~GO~~<br>~~Se~~<br>|CBG256<br>~~GO~~<br>~~GG~~<br>|256<br>~~GO~~<br>~~GG~~<br>|Commercial<br>~~GO~~<br>~~CO~~<br>|100<br>~~GO~~<br>~~CO~~<br>|
|LFCPNX-100-9CBG256C<br>~~a~~<br>~~a~~<br>~~a~~|–9<br>~~Se ~~<br>~~GG~~<br>|CBG256<br> ~~GG~~<br>~~GG~~<br>|256<br>~~GG~~<br>~~GG~~<br>|Commercial<br>~~GG~~<br>~~CO~~<br>|100<br>~~GG~~<br>~~CO~~<br>|
|LFCPNX-100-7BBG484C<br>~~a~~|–7<br>~~GG~~|BBG484<br>~~GG~~|484<br>~~GG~~|Commercial<br>~~CO~~<br>~~GG~~|100<br>~~CO~~<br>~~GG~~|
|LFCPNX-100-8BBG484C<br>~~a ~~<br>~~GO~~|–8<br> ~~GG~~<br>~~GO~~|BBG484<br>~~GG~~<br>~~GO~~|484<br>~~GG~~<br>~~GO~~|Commercial<br>~~CO~~<br>~~GG~~<br>~~GO~~|100<br>~~CO~~<br>~~GG~~<br>~~GO~~|
|LFCPNX-100-9BBG484C<br>~~GO~~<br>~~GO~~<br>~~a~~|–9<br>~~GO~~<br>~~GO~~<br>~~Se~~|BBG484<br>~~GO~~<br>~~GO~~<br>~~GG~~|484<br>~~GO~~<br>~~GO~~<br>~~GG~~|Commercial<br>~~GO~~<br>~~GO~~|100<br>~~GO~~<br>~~GO~~|
|LFCPNX-100-7BFG484C<br>~~GO~~<br>~~a~~<br>~~eG~~|–7<br>~~GO~~<br>~~Se~~<br>~~eG~~|BFG484<br>~~GO~~<br>~~GG~~<br>|484<br>~~GO~~<br>~~GG~~<br>|Commercial<br>~~GO~~<br>~~CO~~<br>|100<br>~~GO~~<br>~~CO~~<br>|
|LFCPNX-100-8BFG484C<br>~~a~~<br>~~a~~<br>~~eG~~|–8<br>~~Se ~~<br>~~GG~~<br>~~eG~~|BFG484<br> ~~GG~~<br>~~GG~~<br>|484<br>~~GG~~<br>~~GG~~<br>|Commercial<br>~~GG~~<br>~~CO~~<br>|100<br>~~GG~~<br>~~CO~~<br>|
|LFCPNX-100-9BFG484C<br>~~eG~~<br>~~ee~~<br>~~ee~~|–9<br>~~eG~~<br>~~**GO**~~|BFG484<br>~~GG~~<br>~~**GO**~~|484<br>~~GG~~<br>~~**GO**~~|Commercial<br>~~CO~~<br>~~GG~~|100<br>~~CO~~<br>~~GG~~|
|LFCPNX-100-7LFG672C<br>~~eG~~<br>~~ee~~<br>~~ee~~|–7<br>~~eG ~~<br>~~**GO**~~|LFG672<br> ~~GG~~<br>~~**GO**~~|672<br>~~GG~~<br>~~**GO**~~|Commercial<br>~~CO~~<br>~~GG~~|100<br>~~CO~~<br>~~GG~~|
|LFCPNX-100-8LFG672C<br><br>~~ee ~~<br>~~ee~~|–8<br> <br> ~~**GO**~~|LFG672<br> ~~GG~~<br>~~**GO**~~|672<br>~~GG~~<br>~~**GO**~~|Commercial<br>~~GG~~|100<br>~~GG~~|
|LFCPNX-100-9LFG672C<br> <br>~~ee~~<br>~~GG~~|–9<br> ~~**GO**~~<br>~~GG~~|LFG672<br>~~**GO**~~<br>~~GG~~|672<br>~~**GO**~~<br>~~GG~~|Commercial<br>~~GG~~|100<br>~~GG~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
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**CertusPro-NX Family Data Sheet**
## **6.2.2. Commercial (“01A” Die Version)**
**Table 6.2. Commercial Part Numbers - 01A Die Version**
|**Part Number1**<br>~~po~~<br>~~a~~|**Speed**<br>~~po~~|**Package **<br>~~po~~<br>~~GG~~|**Pins**<br>~~po~~<br>~~GG~~|**Temp. **<br>~~po~~<br>~~CO~~|**Logic Cells(k)**<br>~~po~~<br>~~CO~~|
|---|---|---|---|---|---|
|LFCPNX-100-7CBG256C01A<br>~~Ge~~<br>~~a~~|–7<br>~~Ge~~|CBG256<br>~~Ge~~<br>~~GG~~|256<br>~~Ge~~<br>~~GG~~|Commercial<br>~~Ge~~<br>~~CO~~|100<br>~~Ge~~<br>~~CO~~|
|LFCPNX-100-8CBG256C01A<br>~~a~~<br>~~GG~~|–8<br>~~GG~~|CBG256<br>~~GG~~<br>~~GG~~|256<br>~~GG~~<br>~~GG~~|Commercial<br>~~CO~~<br>~~GG~~|100<br>~~CO~~<br>~~GG~~|
|LFCPNX-100-9CBG256C01A<br>~~a GG~~|–9<br>~~GG~~|CBG256<br>~~GG~~|256<br>~~GG~~|Commercial<br>~~GG~~|100<br>~~GG~~|
|LFCPNX-100-7BBG484C01A<br>~~GG~~|–7<br>~~GG~~|BBG484<br>~~GG~~|484<br>~~GG~~|Commercial<br>~~GG~~|100<br>~~GG~~|
|LFCPNX-100-8BBG484C01A<br>~~GG~~|–8<br>~~GG~~|BBG484<br>~~GG~~|484<br>~~GG~~|Commercial<br>~~GG~~|100<br>~~GG~~|
|LFCPNX-100-9BBG484C01A<br>~~a~~<br>~~GG~~|–9<br>~~GG~~|BBG484<br>~~GG~~|484<br>~~GG~~|Commercial<br>~~GG~~|100<br>~~GG~~|
|LFCPNX-100-7LFG672C01A<br>~~a~~<br>~~GG~~|–7<br>~~GG~~|LFG672<br>~~GG~~|672<br>~~GG~~|Commercial<br>~~GG~~|100<br>~~GG~~|
|LFCPNX-100-8LFG672C01A<br>~~a GG~~|–8<br>~~GG~~|LFG672<br>~~GG~~|672<br>~~GG~~|Commercial<br>~~GG~~<br>~~DO~~|100<br>~~GG~~<br>~~DO~~|
|LFCPNX-100-9LFG672C01A<br>~~a~~<br>~~GG~~|–9<br>~~GG~~|LFG672<br>~~GG~~|672<br>~~GG~~|Commercial<br>~~GG~~<br>~~DO~~|100<br>~~GG~~<br>~~DO~~|
**Note** :
1. 01A die version does not support JTAG Boundary Scan feature.
## **6.2.3. Industrial**
**Table 6.3. Industrial Part Numbers**
|**Part Number**<br>~~pf~~|**Speed**<br>~~pf~~|**Package **<br>~~pf~~|**Pins**<br>~~pf~~<br>~~CO~~|**Temp. **<br>~~pf~~<br>~~CO~~|**Logic Cells(k)**<br>~~pf~~|
|---|---|---|---|---|---|
|LFCPNX-50-7ASG256I<br>~~Ge~~|–7<br>~~Ge~~|ASG256<br>~~Ge~~|256<br>~~Ge~~<br>~~CO~~|Industrial<br>~~Ge~~<br>~~CO~~|50<br>~~Ge~~|
|LFCPNX-50-8ASG256I<br>~~Ge~~<br>~~eG~~|–8<br>~~Ge~~<br>~~eG~~|ASG256<br>~~Ge~~<br>~~eG~~<br>~~GG~~|256<br>~~Ge~~<br>~~CO~~<br>~~eG~~<br>~~GG~~|Industrial<br>~~Ge~~<br>~~CO~~<br>~~eG~~|50<br>~~Ge~~<br>~~eG~~|
|LFCPNX-50-9ASG256I<br>~~eG~~<br>~~Ge~~|–9<br>~~eG~~<br>~~Ge~~|ASG256<br>~~eG~~<br>~~Ge~~<br>~~GG~~<br>~~GG~~|256<br>~~eG~~<br>~~Ge~~<br>~~GG~~<br>~~GG~~|Industrial<br>~~eG~~<br>~~Ge~~|50<br>~~eG~~<br>~~Ge~~|
|LFCPNX-50-7CBG256I<br>~~Ge~~|–7<br>~~Ge~~|CBG256<br>~~GG~~<br>~~Ge~~<br>~~GG~~<br>~~GG~~|256<br>~~GG~~<br>~~Ge~~<br>~~GG~~<br>~~GG~~|Industrial<br>~~Ge~~|50<br>~~Ge~~|
|LFCPNX-50-8CBG256I<br>~~Ge~~|–8<br>~~Ge~~|CBG256<br>~~GG~~<br>~~Ge~~<br>~~GG~~|256<br>~~GG~~<br>~~Ge~~<br>~~GG~~<br>~~GG~~|Industrial<br>~~Ge~~<br>~~GG~~|50<br>~~Ge~~|
|LFCPNX-50-9CBG256I<br>~~eG~~|–9<br>~~eG~~|CBG256<br>~~GG~~<br>~~eG~~|256<br>~~GG~~<br>~~eG~~<br>~~GG~~|Industrial<br>~~eG~~<br>~~GG~~|50<br>~~eG~~|
|LFCPNX-50-7BBG484I<br>~~eG~~<br>~~eG~~|–7<br>~~eG~~<br>~~eG~~|BBG484<br>~~eG~~<br>~~eG~~<br>~~GG~~|484<br>~~eG~~<br>~~GG~~<br>~~eG~~<br>~~GG~~|Industrial<br>~~eG~~<br>~~GG~~<br>~~eG~~|50<br>~~eG~~<br>~~eG~~|
|LFCPNX-50-8BBG484I<br>~~eG~~<br>~~Ge~~|–8<br>~~eG~~<br>~~Ge~~|BBG484<br>~~eG~~<br>~~Ge~~<br>~~GG~~<br>~~GC~~|484<br>~~eG~~<br>~~Ge~~<br>~~GG~~<br>~~GC~~|Industrial<br>~~eG~~<br>~~Ge~~|50<br>~~eG~~<br>~~Ge~~|
|LFCPNX-50-9BBG484I<br>~~Ge~~|–9<br>~~Ge~~|BBG484<br>~~GG~~<br>~~Ge~~<br>~~GC~~<br>~~GC~~|484<br>~~GG~~<br>~~Ge~~<br>~~GC~~<br>~~GC~~|Industrial<br>~~Ge~~|50<br>~~Ge~~|
|LFCPNX-50-7BFG484I<br>~~Ge~~|–7<br>~~Ge~~|BFG484<br>~~GC~~<br>~~Ge~~<br>~~GC~~|484<br>~~GC~~<br>~~Ge~~<br>~~GC~~<br>~~GO~~|Industrial<br>~~Ge~~<br>~~GO~~|50<br>~~Ge~~|
|LFCPNX-50-8BFG484I<br>~~Ge~~|–8<br>~~Ge~~|BFG484<br>~~GC~~<br>~~Ge~~|484<br>~~GC~~<br>~~Ge~~<br>~~GO~~|Industrial<br>~~Ge~~<br>~~GO~~|50<br>~~Ge~~|
|LFCPNX-50-9BFG484I<br>~~Ge~~<br>~~GG~~|–9<br>~~Ge~~<br>~~GG~~|BFG484<br>~~Ge~~<br>~~GG~~|484<br>~~Ge~~<br>~~GO~~<br>~~GG~~|Industrial<br>~~Ge~~<br>~~GO~~<br>~~GG~~|50<br>~~Ge~~<br>~~GG~~|
|LFCPNX-100-7ASG256I<br>~~GG~~<br>~~GG~~|–7<br>~~GG~~<br>~~GG~~|ASG256<br>~~GG~~<br>~~GG~~<br>~~GC~~|256<br>~~GG~~<br>~~GG~~<br>~~GC~~|Industrial<br>~~GG~~<br>~~GG~~|100<br>~~GG~~<br>~~GG~~|
|LFCPNX-100-8ASG256I<br>~~GG~~<br>~~Ge~~|–8<br>~~GG~~<br>~~Ge~~|ASG256<br>~~GG~~<br>~~Ge~~<br>~~GC~~<br>~~GC~~|256<br>~~GG~~<br>~~Ge~~<br>~~GC~~<br>~~GC~~|Industrial<br>~~GG~~<br>~~Ge~~|100<br>~~GG~~<br>~~Ge~~|
|LFCPNX-100-9ASG256I<br>~~Ge~~|–9<br>~~Ge~~|ASG256<br>~~GC~~<br>~~Ge~~<br>~~GC~~|256<br>~~GC~~<br>~~Ge~~<br>~~GC~~<br>~~GO~~|Industrial<br>~~Ge~~<br>~~GO~~|100<br>~~Ge~~|
|LFCPNX-100-7CBG256I<br>~~Ge~~|–7<br>~~Ge~~|CBG256<br>~~GC~~<br>~~Ge~~|256<br>~~GC~~<br>~~Ge~~<br>~~GO~~|Industrial<br>~~Ge~~<br>~~GO~~|100<br>~~Ge~~|
|LFCPNX-100-8CBG256I<br>~~Ge~~<br>~~GG~~|–8<br>~~Ge~~<br>~~GG~~|CBG256<br>~~Ge~~<br>~~GG~~|256<br>~~Ge~~<br>~~GO~~<br>~~GG~~|Industrial<br>~~Ge~~<br>~~GO~~<br>~~GG~~|100<br>~~Ge~~<br>~~GG~~|
|LFCPNX-100-9CBG256I<br>~~GG~~<br>~~GG~~|–9<br>~~GG~~<br>~~GG~~|CBG256<br>~~GG~~<br>~~GG~~<br>~~GC~~|256<br>~~GG~~<br>~~GG~~<br>~~GC~~|Industrial<br>~~GG~~<br>~~GG~~|100<br>~~GG~~<br>~~GG~~|
|LFCPNX-100-7BBG484I<br>~~GG~~<br>~~Ge~~|–7<br>~~GG~~<br>~~Ge~~|BBG484<br>~~GG~~<br>~~Ge~~<br>~~GC~~<br>~~GC~~|484<br>~~GG~~<br>~~Ge~~<br>~~GC~~<br>~~GC~~|Industrial<br>~~GG~~<br>~~Ge~~|100<br>~~GG~~<br>~~Ge~~|
|LFCPNX-100-8BBG484I<br>~~Ge~~|–8<br>~~Ge~~|BBG484<br>~~GC~~<br>~~Ge~~<br>~~GC~~|484<br>~~GC~~<br>~~Ge~~<br>~~GC~~<br>~~GO~~|Industrial<br>~~Ge~~<br>~~GO~~|100<br>~~Ge~~|
|LFCPNX-100-9BBG484I<br>~~Ge~~|–9<br>~~Ge~~|BBG484<br>~~GC~~<br>~~Ge~~|484<br>~~GC~~<br>~~Ge~~<br>~~GO~~|Industrial<br>~~Ge~~<br>~~GO~~|100<br>~~Ge~~|
|LFCPNX-100-7BFG484I<br>~~Ge~~<br>~~GG~~|–7<br>~~Ge~~<br>~~GG~~|BFG484<br>~~Ge~~<br>~~GG~~|484<br>~~Ge~~<br>~~GO~~<br>~~GG~~|Industrial<br>~~Ge~~<br>~~GO~~<br>~~GG~~|100<br>~~Ge~~<br>~~GG~~|
|LFCPNX-100-8BFG484I<br>~~GG~~<br>~~GG~~|–8<br>~~GG~~<br>~~GG~~|BFG484<br>~~GG~~<br>~~GG~~|484<br>~~GG~~<br>~~GG~~|Industrial<br>~~GG~~<br>~~GG~~|100<br>~~GG~~<br>~~GG~~|
|LFCPNX-100-9BFG484I<br>~~GG~~<br>~~GG~~|–9<br>~~GG~~<br>~~GG~~|BFG484<br>~~GG~~<br>~~GG~~<br>~~GC~~|484<br>~~GG~~<br>~~GG~~<br>~~GC~~|Industrial<br>~~GG~~<br>~~GG~~|100<br>~~GG~~<br>~~GG~~|
|LFCPNX-100-7LFG672I<br>~~eG~~|–7<br>~~eG~~|LFG672<br>~~eG~~<br>~~GC~~<br>~~GC~~|672<br>~~eG~~<br>~~GC~~<br>~~GC~~|Industrial<br>~~eG~~|100<br>~~eG~~|
|LFCPNX-100-8LFG672I<br>~~eG~~|–8<br>~~eG~~|LFG672<br>~~GC~~<br>~~eG~~<br>~~GC~~|672<br>~~GC~~<br>~~eG~~<br>~~GC~~|Industrial<br>~~eG~~|100<br>~~eG~~|
|LFCPNX-100-9LFG672I<br>~~pf~~|–9<br>~~pf~~|LFG672<br>~~GC~~<br>~~pf~~|672<br>~~GC~~<br>~~pf~~|Industrial<br>~~pf~~|100<br>~~pf~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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## **6.2.4. Industrial (“01A” Die Version)**
**Table 6.4. Industrial Part Numbers - 01A Die Version**
|**Part Number1**<br>~~pO~~|**Speed**|**Package **<br>~~GC~~|**Pins**<br>~~GC~~|**Temp. **|**Logic Cells(k)**|
|---|---|---|---|---|---|
|LFCPNX-100-7CBG256I01A<br>~~pO~~<br>~~Ge~~|–7<br>~~Ge~~|CBG256<br>~~Ge~~<br>~~GC~~|256<br>~~Ge~~<br>~~GC~~|Industrial<br>~~Ge~~|100<br>~~Ge~~|
|LFCPNX-100-8CBG256I01A<br>~~GG~~|–8<br>~~GG~~|CBG256<br>~~GC~~<br>~~GG~~|256<br>~~GC~~<br>~~GG~~|Industrial<br>~~GG~~|100<br>~~GG~~|
|LFCPNX-100-9CBG256I01A<br>~~GG~~|–9<br>~~GG~~|CBG256<br>~~GG~~|256<br>~~GG~~|Industrial<br>~~GG~~|100<br>~~GG~~|
|LFCPNX-100-7BBG484I01A<br>~~GG~~|–7<br>~~GG~~|BBG484<br>~~GG~~|484<br>~~GG~~|Industrial<br>~~GG~~|100<br>~~GG~~|
|LFCPNX-100-8BBG484I01A<br>~~GG~~|–8<br>~~GG~~|BBG484<br>~~GG~~<br>~~GC~~|484<br>~~GG~~<br>~~GC~~|Industrial<br>~~GG~~|100<br>~~GG~~|
|LFCPNX-100-9BBG484I01A<br>~~eG~~|–9<br>~~eG~~|BBG484<br>~~eG~~<br>~~GC~~|484<br>~~eG~~<br>~~GC~~|Industrial<br>~~eG~~|100<br>~~eG~~|
|LFCPNX-100-7LFG672I01A<br>~~GG~~|–7<br>~~GG~~|LFG672<br>~~GC~~<br>~~GG~~|672<br>~~GC~~<br>~~GG~~|Industrial<br>~~GG~~|100<br>~~GG~~|
|LFCPNX-100-8LFG672I01A<br>~~GG~~|–8<br>~~GG~~|LFG672<br>~~GG~~<br>~~Gf~~|672<br>~~GG~~<br>~~Gf~~|Industrial<br>~~GG~~|100<br>~~GG~~|
|LFCPNX-100-9LFG672I01A<br>~~Ge~~|–9<br>~~Ge~~|LFG672<br>~~Ge~~<br>~~Gf~~|672<br>~~Ge~~<br>~~Gf~~|Industrial<br>~~Ge~~|100<br>~~Ge~~|
**Note** :
1. 01A die version does not support JTAG Boundary Scan feature.
## **6.2.5. Automotive**
**Table 6.5. Automotive Part Numbers**
|**Part Number**<br>~~pO~~|**Speed**|**Package **|**Pins**<br>~~GO~~|**Temp. **<br>~~GO~~|**Logic Cells(k)**|
|---|---|---|---|---|---|
|LFCPNX-100-7ASG256A<br>~~pO~~<br>~~Ge~~|–7<br>~~Ge~~|ASG256<br>~~Ge~~|256<br>~~Ge~~<br>~~GO~~|Automotive<br>~~Ge~~<br>~~GO~~|100<br>~~Ge~~|
|LFCPNX-100-8ASG256A<br>~~Ge~~<br>~~eG~~|–8<br>~~Ge~~<br>~~eG~~|ASG256<br>~~Ge~~<br>~~eG~~|256<br>~~Ge~~<br>~~GO~~<br>~~eG~~|Automotive<br>~~Ge~~<br>~~GO~~<br>~~eG~~|100<br>~~Ge~~<br>~~eG~~|
|LFCPNX-100-7CBG256A<br>~~eG~~<br>~~GG~~|–7<br>~~eG~~<br>~~GG~~|CBG256<br>~~eG~~<br>~~GG~~<br>~~G~~~~**e**~~|256<br>~~eG~~<br>~~GG~~|Automotive<br>~~eG~~<br>~~GG~~|100<br>~~eG~~<br>~~GG~~|
|LFCPNX-100-8CBG256A<br>~~Ge~~|–8<br>~~Ge~~|CBG256<br>~~Ge~~<br>~~G~~~~**e**~~<br>~~Ge~~|256<br>~~Ge~~|Automotive<br>~~Ge~~|100<br>~~Ge~~|
|LFCPNX-100-7BBG484A<br>~~G~~|–7<br>~~G~~|BBG484<br>~~G~~~~**e**~~<br>~~G~~<br>~~Ge~~|484<br>~~GO~~|Automotive<br>~~GO~~|100|
|LFCPNX-100-8BBG484A<br>~~Ge~~|–8<br>~~Ge~~|BBG484<br>~~Ge~~<br>~~Ge~~|484<br>~~Ge~~<br>~~GO~~|Automotive<br>~~Ge~~<br>~~GO~~|100<br>~~Ge~~|
|LFCPNX-50-7ASG256A<br>~~Ge~~<br>~~eG~~|–7<br>~~Ge~~<br>~~eG~~|ASG256<br>~~Ge~~<br>~~eG~~<br>~~GC~~|256<br>~~Ge~~<br>~~GO~~<br>~~eG~~<br>~~GC~~|Automotive<br>~~Ge~~<br>~~GO~~<br>~~eG~~|50<br>~~Ge~~<br>~~eG~~|
|LFCPNX-50-8ASG256A<br>~~eG~~<br>~~eG~~|–8<br>~~eG~~<br>~~eG~~|ASG256<br>~~eG~~<br>~~eG~~<br>~~GC~~<br>~~GC~~|256<br>~~eG~~<br>~~eG~~<br>~~GC~~<br>~~GC~~|Automotive<br>~~eG~~<br>~~eG~~|50<br>~~eG~~<br>~~eG~~|
|LFCPNX-50-7CBG256A<br>~~eG~~|–7<br>~~eG~~|CBG256<br>~~GC~~<br>~~eG~~<br>~~GC~~|256<br>~~GC~~<br>~~eG~~<br>~~GC~~|Automotive<br>~~eG~~|50<br>~~eG~~|
|LFCPNX-50-8CBG256A<br>~~GG~~|–8<br>~~GG~~|CBG256<br>~~GC~~<br>~~GG~~|256<br>~~GC~~<br>~~GG~~<br>~~GO~~|Automotive<br>~~GG~~<br>~~GO~~|50<br>~~GG~~|
|LFCPNX-50-7BBG484A<br>~~Ge~~|–7<br>~~Ge~~|BBG484<br>~~Ge~~|484<br>~~Ge~~<br>~~GO~~|Automotive<br>~~Ge~~<br>~~GO~~|50<br>~~Ge~~|
|LFCPNX-50-8BBG484A<br>~~Ge~~<br>~~GG~~|–8<br>~~Ge~~<br>~~GG~~|BBG484<br>~~Ge~~<br>~~GG~~|484<br>~~Ge~~<br>~~GO~~<br>~~GG~~|Automotive<br>~~Ge~~<br>~~GO~~<br>~~GG~~|50<br>~~Ge~~<br>~~GG~~|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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## **References**
For more information, refer to the following documents:
- sysCLOCK PLL Design and Usage Guide for Nexus Platform (FPGA-TN-02095)
- sysDSP Usage Guide for Nexus Platform (FPGA-TN-02096)
- sysCONFIG Usage Guide for Nexus Platform (FPGA-TN-02099)
- CertusPro-NX SerDes/PCS Usage Guide (FPGA-TN-02245)
- sysI/O Usage Guide for Nexus Platform (FPGA-TN-02067)
- Soft Error Detection (SED)/Correction (SEC) Usage Guide for Nexus Platform (FPGA-TN-02076)
- Memory Usage Guide for Nexus Platform (FPGA-TN-02094)
- ADC Usage Guides for Nexus Platform (FPGA-TN-02129)
- CertusPro-NX High-Speed I/O Interface (FPGA-TN-02244)
- Power Management and Calculation for CertusPro-NX Devices (FPGA-TN-02257)
- CertusPro-NX 50k Pinout File (FPGA-SC-02045)
- CertusPro-NX 100k Pinout File (FPGA-SC-02022)
- Lattice Memory Mapped Interface and Lattice Interrupt Interface User Guide (FPGA-UG-02039)
- sub-LVDS Signaling Using Lattice Devices (FPGA-TN-02028)
- Multi-Boot Usage Guide for Nexus Platform (FPGA-TN-02145)
- I[2] C Hardened IP Usage Guide for Nexus Platform (FPGA-TN-02142)
For package information, refer to the following documents:
- PCB Layout Recommendations for BGA Packages (FPGA-TN-02024)
- Solder Reflow Guide for Surface Mount Devices (FPGA-TN-02041)
- Thermal Management (FPGA-TN-02044)
- Package Diagrams (FPGA-DS-02053)
- High-Speed PCB Design Considerations (FPGA-TN-02148)
- Advanced Configuration Security Usage Guide for Nexus Platform (FPGA-TN-02176)
- CertusPro-NX Hardware Checklist (FPGA-TN-02255)
For further information on interface standards, refer to the following websites:
- JEDEC Standards (LVTTL, LVCMOS, SSTL) – www.jedec.org
- PCI – www.pcisig.com
For more info on this FPGA device, refer to the following:
- CertusPro-NX FPGA web page
- Lattice Radiant Software FPGA web page
- Lattice Insights for Lattice Semiconductor training courses and learning plans
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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## **Technical Support Assistance**
Submit a technical support case through www.latticesemi.com/techsupport. For frequently asked questions, refer to the Lattice Answer Database at www.latticesemi.com/Support/AnswerDatabase.
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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## **Revision History**
## **Revision 2.0, August 2024**
|**Section**|**Change Summary**|
|---|---|
|All|Changed SerDes to SERDES across the document.|
|Description|Removed 2.5 Gbps from Ethernet of the Features.|
|DC and Switching Characteristics<br>for Commercial and Industrial|•<br>Table 3.13. sysI/O Recommended Operating Conditions:<br>removed 1.2 from LVCMOS18 VCCIO(Input) Typ.<br>•<br>Table 3.49. sysCONFIG Port Timing Specifications:<br>•<br>removed the original fCCLKsymbol and its related data;<br>•<br>newly added fCCLK_Wand fCCLK_Rsymbols and their related data;<br>•<br>for tCO_SSO, tEN_SSO, and tDIS_SSO,updated Min value to 3.0 and Max value to 16;<br>•<br>newly added tPROGRAMN_Land tPROGRAMN_Hsymbols and their related information;<br>•<br>removed tPROGRAMNsymbol;<br>•<br>newly added Notes 2, 3, 4, and 5.<br>•<br>Newly addedFigure 3.14. Configuration Error Notification (1).<br>•<br>Updated the following symbol names inFigure 3.20. Slave SPI Configuration Timing:<br>•<br>from tCO_MISOto tCO_SSO;<br>•<br>from tEN_MISOto tEN_SSO;<br>•<br>from tDIS_MISOto tDIS_SSO;<br>•<br>from tSU_MOSIto tSU_SSI;<br>•<br>from tHD_MOSIto tHD_SSI.|
|DC and Switching Characteristics<br>for Automotive|•<br>Table 4.32. External Switching Characteristics (VCC = 1.0 V):<br>removed_General I/O Pin Parameters Using Dedicated Edge Clock Input without PLL_and<br>_General I/O Pin Parameters Using Dedicated Edge Clock Input with PLL_parameters and<br>their related information.<br>•<br>Table 4.48. sysCONFIG Port Timing Specifications:<br>•<br>removed the original fCCLKsymbol and its related data;<br>•<br>newly added fCCLK_Wand fCCLK_Rsymbols and their related data;<br>•<br>for tCO_SSO, tEN_SSO, and tDIS_SSO,updated Min value to 3.0 and Max value to 30;<br>•<br>updated tINIT_HIGHMax to 50;<br>•<br>newly added tPROGRAMN_Land tPROGRAMN_Hsymbols and their related information;<br>•<br>removed tPROGRAMNsymbol;<br>•<br>newly added Notes 2, 3, 4, and 5.<br>•<br>Newly addedFigure 4.14. Configuration Error Notification (2).<br>•<br>Updated the following symbol names inFigure 4.20. Slave SPI Configuration Timing:<br>•<br>from tCO_MISOto tCO_SSO;<br>•<br>from tEN_MISOto tEN_SSO;<br>•<br>from tDIS_MISOto tDIS_SSO;<br>•<br>from tSU_MOSIto tSU_SSI;<br>•<br>from tHD_MOSIto tHD_SSI.|
## **Revision 1.9, April 2024**
|**Section**|**Change Summary**|
|---|---|
|Description|Changed to_Endpoint and Root Complex_to_Endpoint_to in the Features section.|
|Architecture|Changed_Endpoint and Root Complex_to_Endpoint_in the Peripheral Component Interconnect<br>Express(PCIe)section.|
|DC and Switching Characteristics<br>for Commercial and Industrial|•<br>Changed tACT_CRESETB_Nto tACT_PROGRAMN_Hin Figure 3.16. Slave SPI/I2C/I3C POR/REFRESH<br>Timing.<br>•<br>Made minor adjustment to Figure 3.18. Slave SPI/I2C/I3C PROGRAMN Timing removing<br>useless lines and arrows.|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Section**|**Change Summary**|
|---|---|
|Inclusive Language|Newlyadded section.|
|Description|•<br>Newly added Available in Commercial, Industrial, and Automotive temperature grades<br>to the Features section.<br>•<br>Changed_vRef_to_VRef_in Footnote 6 of Table 1.1. CertusPro-NX FamilySelection Guide.|
|DC and Switching Characteristics<br>for Commercial and Industrial|•<br>SubLVDS (Input Only) section:<br>removed “and follows the SMIA 1.0, Part 2: CCP2 Specification” from the description.<br>•<br>Table 3.36. ADC Specifications1:<br>•<br>added Note 4 for VREFINT_ADC symbol;<br>•<br>removed DCCLK_ADCsymbol;<br>•<br>updated the Condition to_@ sampling frequency = 1 Mbps_for fINPUT_ADCsymbol;<br>•<br>updated the Condition to_the condition not application_for the RIN_ADC symbol.<br>•<br>Table 3.49. sysCONFIG Port Timing Specifications:<br>changed the tFIO_ENparameter to_User I/O enabled in Early I/O Mode_and the Typ. value<br>to_38096_ _cycle_.<br>•<br>Updated Figure 3.16. Slave SPI/I2C/I3C POR/REFRESH Timing and Figure 3.18. Slave<br>SPI/I2C/I3C PROGRAMN Timing.|
|DC and Switching Characteristics<br>for Automotive|•<br>Removed the Note regarding the preliminary data.<br>•<br>Table 4.4. Power-On Reset1:<br>•<br>updated the Min data to 0.87 of VPORUPsymbol for VCCIO0, VCCIO1condition;<br>•<br>updated the Max data to 1.64 of VPORUPsymbol for VCCAUXcondition;<br>•<br>updated the Max data to 1.07 of VPORUPsymbol for VCCIO0, VCCIO1condition;<br>•<br>updated the Min data to 0.48 of VPORDNsymbol for VCCcondition;<br>•<br>updated the Min data to 1.36 of VPORDNsymbol for VCCAUXcondition;<br>•<br>updated the Max data to 0.85 VPORDNsymbol for VCCcondition;<br>•<br>updated the Max data to 1.64 VPORDNsymbol for VCCAUXcondition.<br>•<br>SubLVDS (Input Only) section:<br>removed “and follows the SMIA 1.0, Part 2: CCP2 Specification” from the description.<br>•<br>Table 4.32. External Switching Characteristics (VCC = 1.0 V):<br>•<br>updated the Min data to 1.322 for -8 Speed Grade, to 1.558 for -7 Speed Grade of<br>tW_PRIparameter;<br>•<br>updated the Min data to 0.615 for -8 Speed Grade, to 0.725 for -7 Speed Grade of<br>tW_EDGEparameter.<br>•<br>Table 4.39. Serial Output Timingand Levels:|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Section**|**Change Summary**|
|---|---|
||•<br>updated the Min data for VTX-EHsymbol of Transmitter 5 Gbps to 565;<br>•<br>updated the Max data for VTX-DIFF-PPof Transmitter 5 Gbps to 1300;<br>•<br>updated the Max data for VTX-CM-DCof Transmitter 5 Gbps to 650;<br>•<br>updated the Max data for TTX-Rof Transmitter 5 Gbps to 70;<br>•<br>updated the Max data for TTX-Fof Transmitter 5 Gbps to 70.<br>•<br>updated the Min data for TTX-Rsymbol of Transmitter 1.25 Gbps to 63;<br>•<br>updated the Max data for VTX-DIFF-PPsymbol of Transmitter 1.25 Gbps to 1300;<br>•<br>updated the Max data for VTX-CM-DCsymbol of Transmitter 1.25 Gbps to 650;<br>•<br>updated the Max data for TTX-Rsymbol of Transmitter 1.25 Gbps to 81;<br>•<br>updated the Max data for TTX-Fsymbol of Transmitter 1.25 Gbps to 81.<br>•<br>Table 4.41. Serial Input Data Specifications:<br>•<br>updated the Min data of RLRX-DIFFsymbol for 4 GHz < freq <= 5 GHz condition to<br>43.5;<br>•<br>updated the Min data of RLRX-CMsymbol for 4 GHz < freq <= 5 GHz condition to<br>43.5.<br>•<br>Table 4.48. sysCONFIG Port Timing Specifications:<br>•<br>updated the Max data to 120 for fCCLKsymbol of Slave SPI.<br>•<br>changed the tFIO_ENparameter to_User I/O enabled in Early I/O Mode_and the Typ.<br>value to_38096 cycle_.<br>•<br>Updated Figure 4.16. Slave SPI/I2C/I3C POR/REFRESH Timing and Figure 4.18. Slave<br>SPI/I2C/I3C PROGRAMN Timing.|
|Ordering Information|Table 6.3. Industrial Part Numbers:<br>Corrected the following part numbers to the current:<br>•<br>LFCPNX-50-7ASG256I<br>•<br>LFCPNX-50-8ASG256I<br>•<br>LFCPNX-50-9ASG256I<br>•<br>LFCPNX-50-7CBG256I<br>•<br>LFCPNX-50-8CBG256I<br>•<br>LFCPNX-50-9CBG256I<br>•<br>LFCPNX-50-7BBG484I<br>•<br>LFCPNX-50-8BBG484I<br>•<br>LFCPNX-50-9BBG484I<br>•<br>LFCPNX-50-7BFG484I<br>•<br>LFCPNX-50-8BFG484I<br>•<br>LFCPNX-50-9BFG484I|
**Revision 1.6, October 2023**
|**Section**|**Change Summary**|
|---|---|
|Disclaimers|Updated this section.|
|Description|•<br>Updated the below information in Table 1.1. CertusPro-NX Family Selection Guide:<br>•<br>Replaced the title of the cell from_SerDes Channels/I/O (Wide Range (WR) GPIO_<br>_(Top/Left/Right Banks) + High Performance (HP) GPIO (Bottom Banks) + ADC_<br>_dedicated inputs)_to_Total I/O (Wide Range, High Performance, ADC6) / SERDES_<br>_Lanes._<br>•<br>Added Footnote 6_Each ADC pin count reflects using dedicated complement pair and_<br>_vRef_.|
|DC and Switching Characteristics<br>for Commercial and Industrial|•<br>Updated below information in Table 3.5. On-Chip Termination Options for Input Modes:<br>•<br>Updated the Terminate to VCCIO/2 value of LVSTLD_I from_OFF_to_OFF, 40, 48, 60,_<br>_80, 120_.<br>•<br>Updated the Terminate to VCCIO/2 value of LVSTLD_II from_OFF_to_OFF, 80, 120_.<br>•<br>Updated below values for tINIT_HIGHunder PROGRAMN Configuration Timingin|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Section**|**Change Summary**|
|---|---|
||Table 3.49. sysCONFIG Port Timing Specifications .<br>•<br>max value from — to_40_.<br>•<br>Typ. Value from_40_to —.|
|DC and Switching Characteristics<br>for Automotive|•<br>Updated below information in Table 4.5. On-Chip Termination Options for Input Modes:<br>•<br>Updated the Terminate to VCCIO/2 value of LVSTLD_I from_OFF_to_OFF, 40, 48, 60,_<br>_80, 120_.<br>•<br>Updated the Terminate to VCCIO/2 value of LVSTLD_II from_OFF_to_OFF, 80, 120_.<br>•<br>Updated the max value to 40 for tINIT_HIGHunder PROGRAMN Configuration Timing in<br>Table 4.48. sysCONFIG Port Timing Specifications.<br>•<br>max value from — to_40_.<br>•<br>Typ. Value from_40_to —.|
|OrderingInformation|Added CPNX-50 industrialpart numbers in Table 6.3. Industrial Part Numbers.|
|Reference|Added webpage links for CertusPro-NX, Lattice Radiant, and Lattice Insights.|
## **Revision 1.5, July 2023**
|**Section**|**Change Summary**|
|---|---|
|All|Deleted all mentions of LPDDR3 in below sections:<br>•<br>Features<br>•<br>Overview<br>•<br>DQS Grouping for DDR Memory<br>•<br>Differential HSUL12D (As Output)<br>•<br>External Switching Characteristics<br>•<br>Differential HSUL12D (As Output)<br>•<br>External SwitchingCharacteristics|
|Description|Added Footnote 4 for LFCPNX-100 value of PCIe Gen3 hard IP device in Table 1.1. CertusPro-<br>NX FamilySelection Guide.|
|DC and Switching Characteristics<br>for Commercial and Industrial|•<br>Updated below details in Table 3.13. sysI/O Recommended Operating Conditions:<br>•<br>Deleted_1.357_from VCCIO(Input) values of LVCMOS12H¹.<br>•<br>Deleted_1.0_from VCCIO(Input) and 1.357from VCCIO(Output) values of SLVS6.<br>•<br>Added_1.1_to VCCIO(Input) and VCCIO(Output) values of MIPI D-PHY6.<br>•<br>Added_1.357, 1.5, 1.8_to VCCIOvalue of SSTL135D_I, SSTL135D_II5.<br>•<br>Added_1.5, 1.8_to VCCIO(Input) value of SSTL15D_I, SSTL15D_II5.<br>•<br>Added_1.5, 1.8_to VCCIO(Input) value of HSTL15D_I5.<br>•<br>Added_1.2, 1.357, 1.5, 1.8_to VCCIO(Input) value of HSUL12D5.<br>•<br>Added_1.1_to VCCIO(Input) value of LVSTLD_I, LVSTLD_II5.<br>•<br>Replaced_MIPI D-PHY LP Input6_to_MIPI D-PHY (LP Mode)6_.<br>•<br>Replaced_MIPI D-PHY6_with_MIPI D-PHY (HS Mode)6_.<br>•<br>Updated the link for Power Management and Calculation for Certus-NX, CertusPro-NX,<br>and MachXO5-NX Devices (FPGA-TN-02257) in Supply Currents section.<br>•<br>Replaced_(Output Only)_with_(As Output)_in the title of below sections from:<br>•<br>Differential HSTL15D (As Output)<br>•<br>Differential SSTL135D, SSTL15D (As Output)<br>•<br>Differential HSUL12D (As Output)<br>•<br>Differential LVSTLD (As Output)<br>•<br>Differential LVCMOS25D, LVCMOS33D, LVTTL33D (As Output)<br>•<br>Replaced the following details in Table 3.29. Maximum I/O Buffer Speed1, 2, 3, 4, 7:<br>•<br>_Wire Bond package_with_caBGA256, csBGA289, caBGA400_.<br>•<br>_Flip Chip package_with_csfBGA121_.|
|DC and Switching Characteristics<br>for Automotive|•<br>Updated below VCCIO (Input) and VCCIO (Output) values in Table 4.13. sysI/O<br>Recommended Operating Conditions:<br>•<br>Deleted_1.357_from VCCIO (Input)values of LVCMOS12H¹.|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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|**Section**|**Change Summary**|
|---|---|
||•<br>Deleted_1.0_from VCCIO(Input) and_1.357_from VCCIO(Output) values of SLVS6.|
||•<br>Added_1.1_to VCCIO(Input) and VCCIO(Output) values of MIPI D-PHY6.|
||•<br>Added_1.357, 1.5, 1.8_to VCCIOvalue of SSTL135D_I, SSTL135D_II5.|
||•<br>Added_1.5, 1.8_to VCCIO(Input) value of SSTL15D_I, SSTL15D_II5.|
||•<br>Added_1.5, 1.8_to VCCIO(Input) value of HSTL15D_I5.|
||•<br>Added_1.2, 1.357, 1.5, 1.8_to VCCIO(Input) value of HSUL12D5.|
||•<br>Added_1.1_to VCCIO(Input) value of LVSTLD_I, LVSTLD_II5.|
||•<br>Replaced_MIPI D-PHY LP Input6_to_MIPI D-PHY (LP Mode)6_.|
||•<br>Replaced_MIPI D-PHY6_with_MIPI D-PHY (HS Mode)6_.|
||•<br>Updated the link for Power Management and Calculation for Certus-NX, CertusPro-NX,|
||and MachXO5-NX Devices (FPGA-TN-02257) in Supply Currents section.|
||•<br>Update the title from (Output Only) to (As Output) of below sections:|
||•<br>Differential HSTL15D (As Output)|
||•<br>Differential SSTL135D, SSTL15D (As Output)|
||•<br>Differential HSUL12D (As Output)|
||•<br>Differential LVSTLD (As Output)|
||•<br>Differential LVCMOS25D, LVCMOS33D, LVTTL33D(As Output)|
|Ordering Part Information|•<br>Added table titles for Table 6.1. Commercial Part Numbers, Table 6.2. Commercial Part|
||Numbers - 01A Die Version, Table 6.3. Industrial Part Numbers, Table 6.4. Industrial Part|
||Numbers - 01A Die Version, and Table 6.5. Automotive Part Numbers.|
||•<br>Added LFCPNX-50 parts numbers in Table 6.1. Commercial Part Numbers section.|
||•<br>Added Note 3 information If the user application requires PCIe Channel 3, please refer|
||to Alternate Ordering Part Numbers described in Lattice PCN# 01A-23 in Part Number|
||Description section.|
|Technical Support Assistance|Added Technical Support Assistance section.|
|**Revision 1.4, March 2023**<br>**Section**<br>**Change Summary**<br>Acronyms in This Document<br>Removed MLVDS.<br>Architecture<br>Adjusted ClockingStructure to second level heading.<br>DC and Switching Characteristics<br>for Commercial and Industrial<br>Updated Table 3.13. sysI/O Recommended Operating Conditions. The modification in<br>footnote 1.b clarifies that Bank 3, Bank 4, and Bank 5 I/O can only mix into banks with VCCIO<br>higher or equal than thepin standard.<br>Pinout Information<br>•<br>Added table caption in Signal Descriptions section.<br>•<br>Updated Table 5.2. Pin Information Summary.<br>Addedpin count information for the LFCPNX-50 device.<br>References<br>Updated reference to the 50K Pinout file.<br>All<br>Minor adjustments in formattingand style.<br>~~—~~||
|**Revision 1.3, December 2022**<br>**Section**<br>**Change Summary**<br>All<br>Minor adjustments in formattingacross the document.<br>Description<br>Updated Table 1.1. CertusPro-NX Family Selection Guide to change 128 kHz device value to<br>32 kHz.<br>Architecture<br>•<br>Changed full-featured GPLL value to four in Global PLL section.<br>•<br>Updated 128 kHz device value to 32 kHz in On-chipOscillator section.<br>DC and Switching Characteristics<br>for Commercial and Industrial<br>•<br>Added table note for Differential termination in Table 3.5. On-Chip Termination Options<br>for Input Modes.<br>•<br>Updated Table 3.32. External Switching Characteristics (VCC = 1.0 V) to add table note<br>and table note reference to tSKEW_PRIand tSKEW_EDGE.<br>~~——~~||
|© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed atwww.latticesemi.com/legal.||
|All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.||
|FPGA-DS-02086-2.0|177|
177
**CertusPro-NX Family Data Sheet**
|**Section**|**Change Summary**|
|---|---|
|DC and Switching Characteristics<br>for Automotive|•<br>Added table note for Differential termination in Table 4.5. On-Chip Termination Options<br>for Input Modes.<br>•<br>Updated Table 4.32. External Switching Characteristics (VCC = 1.0 V)to add table note<br>and table note reference to tSKEW_PRIand tSKEW_EDGE.|
## **Revision 1.2, September 2022**
|**Section**|**Change Summary**|
|---|---|
|DC and Switching Characteristics<br>for Commercial and Industrial|•<br>Newly added Table 3.17. VIN Maximum Overshoot/Undershoot Allowance – Wide<br>Range1, 2 and Table 3.18. VIN Maximum Overshoot/Undershoot Allowance – High<br>Performance1, 2.<br>•<br>Updated Table 3.33. sysCLOCK PLL Timing (VCC = 1.0 V):<br>•<br>indicated Min value of_18_in fINparameter;<br>•<br>indicated Min value of_18_in fPFDparameters and removed footnote;<br>•<br>indicated tPHto Note 4;<br>•<br>removed the fPFD< 200 MHz condition from tOPJITparameter;<br>•<br>added conditions in tOPJITparameter to accurately reflect PLL jitter performance;<br>•<br>removed the original Note 3.|
|DC and Switching Characteristics<br>for Automotive|•<br>Newly added Table 4.17. VIN Maximum Overshoot/Undershoot Allowance – Wide<br>Range1, 2 and Table 4.18. VIN Maximum Overshoot/Undershoot Allowance – High<br>Performance1, 2.<br>•<br>Updated Table 4.33. sysCLOCK PLL Timing (VCC = 1.0 V):<br>•<br>indicated Min value of_18_in fINparameter;<br>•<br>indicated Min value of_18_in fPFDparameters and removed footnote;<br>•<br>indicated tPHto Note 4;<br>•<br>removed the fPFD< 200 MHz condition from tOPJITparameter;<br>•<br>added conditions in tOPJITparameter to accurately reflect PLL jitter performance;<br>•<br>removed the original Note 3.<br>•<br>Newlyadded the SGMII Characteristics section.|
## **Revision 1.1, August 2022**
|**Section**|**Change Summary**|
|---|---|
|Description|•<br>Updated to Available in Commercial/Industrial –8 and –9 speed grades and Automotive<br>–7 and –8 speed grades at the end of the Features section.<br>•<br>Table 1.1. CertusPro-NX Family Selection Guide:<br>•<br>updated Packages value for LFCPNX-50;<br>•<br>updated Note 3 contents;<br>•<br>newlyadded Note 4 and Note 5.|
|Architecture|•<br>Changed the section header to SGMII TX/RX and updated the contents in this section.<br>•<br>Modified the description in the Analog Interface ADC section.<br>•<br>Updated to “EBR also provides a built-in ECC engine in Commercial/Industrial –8 and –9<br>speed grades and Automotive –7 and –8 speed grades” in the sysMEM Memory Block<br>section.|
|DC and Switching Characteristics<br>for Commercial and Industrial|•<br>Changed the section header adding_for Commercial and Industrial_.<br>•<br>Updated Note 2 contents for Table 3.38. DTR Specifications.<br>•<br>Updated DSP functions and footnotes in Table 3.31. Register-to-Register Performance.<br>•<br>In the SGMII Characteristics section:<br>•<br>changed the subsection header to_SGMII Specifications_;<br>•<br>changed the Table 3.48. SGMII caption to the current.|
|DC and Switching Characteristics<br>for Automotive|Newly added section.|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
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**CertusPro-NX Family Data Sheet**
|**Section**|**Change Summary**|
|---|---|
|Ordering Information|•<br>Updated Figure 6.1. Top Marking Diagram adding Ball Count, and Automotive to Grade.<br>•<br>Newly added Automotive part numbers.<br>•<br>Updated Notes contents in the CertusPro-NX Part Number Description section.|
|All|•<br>Removed product name from headings and captions of figures and tables.<br>•<br>Minor changes in style and formatting.|
## **Revision 1.0, March 2022**
|**Section**|**Change Summary**|
|---|---|
|All|•<br>Production release.<br>•<br>Changed SERDES to SerDes across the document.<br>•<br>Changed CertusPro-NX 50k and CertusPro-NX 100k to LFCPNX-50 and LFCPNX-100.|
|Architecture|•<br>Changed DCS Dynamic Cock Select to Dynamic Clock Select [DCS] in the Clock Dividers<br>section.<br>•<br>Changed_DCS_MUX_ _block_to_DCS_CMUX_ _block_in the Dynamic Clock Select section.<br>•<br>Updated to EBR also provides a built-in ECC engine in select speed grades and newly<br>added See ordering information for more details” in the sysMEM Memory Block<br>section.<br>•<br>Changed_THSX2_to_TSHX2_in Figure 2.24. Tri-state Register Block on Bottom Side.<br>•<br>Changed port name from_D[1:0]_to_T[1:0]_in Table 2.8. Tri-state Block Port Description.<br>•<br>Updated input and output ports in Figure 2.26. DQS Control and Delay Block (DQSBUF)<br>and Table 2.9. DQSBUF Port List Description.<br>•<br>Changed_HTSL15 I_to_HSTL15 I_in Table 2.10. Single-Ended I/O Standards and in Table<br>2.12. Single-Ended I/O Standards Support on Various Sides.<br>•<br>Updated to “_In select speed grade, the CertusPro-NX family can provide an analog_<br>_interface consisting of two Analog to Digital Convertors (ADC)_” and newly added “_see_<br>_ordering information for more details_” in the Analog Interface ADC section.<br>•<br>Added “01A Die revision” NOT support for Boundary Scan Testability in the IEEE 1149.1-<br>Compliant Boundary Scan Testability section.<br>•<br>Newly added “Here, only devices with –9 speed grade can support 10G SerDes usages,<br>such as 10GBASE-R” to the SerDes and Physical Coding Sublayer section.<br>•<br>Changed_rxp_i/rxpn_i_to_rxp_i/rxn_i_,_txp_o/txpn_o_to_txp_o/txn_o_in Figure 2.35. PCIe<br>Soft IP Wrapper.|
|DC and Switching Characteristics|•<br>Table 3.2. Recommended Operating Conditions:<br>•<br>changed the Min value to 1.71 for VCCAUX, VCCAUXH3/4/5, and VCCAUXA;<br>•<br>newly added Note 5.<br>•<br>Table 3.4. Power-On Reset:<br>•<br>changed the Max value to 1.62 for VPOURUPin VCCAUXcondition;<br>•<br>changed the Max value to 1.59 for VPORDNin VCCAUXcondition.<br>•<br>In the On-chip Programmable Termination section:<br>•<br>added Termination to ground for LPDDR4, and termination to VCCIO/2 for all other<br>non-LPDDR4.<br>•<br>deleted “to VCCIO/2” from Figure 3.1. On-chip Termination.<br>•<br>Table 3.5. On-Chip Termination Options for Input Modes:<br>•<br>changed the Differential Termination Resistor data to_OFF_for LVSTLD_I and<br>LVSTLD_II IO-TYPE.<br>•<br>updated contents in Notes.<br>•<br>Table 3.7. DC Electrical Characteristics – Wide Range (Over Recommended Operating<br>Conditions):<br>•<br>updated Min and Max values for all the symbols, except for VBHTsymbol.<br>•<br>Table 3.8. DC Electrical Characteristics – High Speed (Over Recommended Operating<br>Conditions):<br>•<br>updated Min and Max values for all the symbols in, except for VBHTsymbol.|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|**Section**|**Change Summary**|
|---|---|
||•<br>Table 3.14. sysI/O DC Electrical Characteristics – Wide Range I/O (Over Recommended<br>Operating Conditions):<br>•<br>updated data value for all the Input/Output Standard;<br>•<br>newly added Note 3 and Note 5.<br>•<br>Table 3.15. sysI/O DC Electrical Characteristics – High Performance I/O (Over<br>Recommended Operating Conditions):<br>•<br>updated data value for all the Input/Output Standard;<br>•<br>newly added Note 3.<br>•<br>Updated to “and the LVDS input voltage cannot exceed the VCCIOvoltage of the related<br>bank” from the LVDS section.<br>•<br>Table 3.19. LVDS DC Electrical Characteristics (Over Recommended Operating<br>Conditions):<br>•<br>changed to_VINP/INM_in Note 2;<br>•<br>newly added Note 3.<br>•<br>Table 3.20. LVDS25E DC Conditions:<br>•<br>changed the typical value to –6.03 for IDCparameter.<br>•<br>Table 3.21. SubLVDS Input DC Electrical Characteristics (Over Recommended Operating<br>Conditions):<br>•<br>newly added Note.<br>•<br>In SubLVDS (Input Only) section:<br>•<br>Newly added and the subLVDS input voltage cannot exceed the VCCIOvoltage of the<br>related bank.<br>•<br>Table 3.24. SLVS Output DC Characteristics (Over Recommended Operating Conditions):<br>•<br>changed the Min value to 37.7 for ZOSparameter.<br>•<br>Table 3.25. Soft D-PHY Input Timing and Levels:<br>•<br>changed the Max value to 480 for VIHsymbol.<br>•<br>Table 3.26. Soft D-PHY Output Timing and Levels:<br>•<br>removed_Output 80% – 20% Fall Time_from the description of tRsymbol and tF<br>symbol;<br>•<br>changed the Max value to 7 for|ΔVCMTX(1,0)|symbol;<br>•<br>changed the Max value to 25 for|ΔVOD| symbol;<br>•<br>changed the Max value to 410 for VOHHSsymbol;<br>•<br>changed the Max value to 80 for ZOSsymbol;<br>•<br>changed the Max value to 0.434 for tRsymbol;<br>•<br>changed the Max value to 0.419 for tFsymbol.<br>•<br>Table 3.27. Soft D-PHY Clock Signal Specification:<br>•<br>changed the conditions to_UI ≥ 1 ns_and_0.667 ns < UI < 1 ns_for UI Variation<br>symbol.<br>•<br>Table 3.28. Soft D-PHY Data-Clock Timing Specifications:<br>•<br>changed the Min value to –0.15 and –0.20 for TSKEW[TX]symbol.<br>•<br>Table 3.29. Maximum I/O Buffer Speed:<br>•<br>changed the Max value to 250 for maximum sysI/O input frequency single-ended<br>buffer HSTL15;<br>•<br>changed the Max value to 250 for maximum sysI/O input frequency differential<br>buffer HSTL15D;<br>•<br>changed the Max value to 250 for maximum sysI/O output frequency single-ended<br>buffer HSTL15;<br>•<br>changed the Max value to 250 for maximum sysI/O output frequency differential<br>buffer HSTL15D.<br>•<br>Table 3.30. Pin-to-Pin Performance:<br>•<br>newly added Typ. @ VCC = 1.0 V value for all the four functions.<br>•<br>Table 3.31. Register-to-Register Performance:<br>•<br>newlyadded Typ.@VCC = 1.0 V value to 32-bit adder,16-bit counter,and 32-bit|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|**Section**|**Change Summary**|
|---|---|
||counter of Basic Functions;<br>•<br>newly added Typ. @ VCC = 1.0 V value to all the three Large Memory Functions;<br>•<br>newly added Typ. @ VCC = 1.0 V value to all the eight DSP Functions.<br>•<br>Table 3.32. External Switching Characteristics (VCC = 1.0 V):<br>•<br>globally added Min/Max values so-far available to all the parameters and updated<br>descriptions accordingly;<br>•<br>changed tHto tH(LTR), tH_DELto tH_DEL(LTR) in the General I/O Pin Parameters Using<br>Dedicated Primary Clock Input without PLL section;<br>•<br>newly added tH(Bottom) and tH_DEL(Bottom) parameters and their description,<br>Min/Max value, and unit to the General I/O Pin Parameters Using Dedicated<br>Primary Clock Input without PLL section;<br>•<br>changed tHPLLto tHPLL(LTR) in the General I/O Pin Parameters Using Dedicated<br>Primary Clock Input with PLL section;<br>•<br>newly added_tHPLL(Bottom)_parameter including its description, Min/Max value,<br>and unit to the_General I/O Pin Parameters Using Dedicated Primary Clock Input_<br>_with PLL_section;<br>•<br>changed the Generic DDRX1 Inputs/Outputs with Clock and Data Centered at Pin<br>(GDDRX1_RX/TX.SCLK.Centered) using PCLK Clock Input – Figure 3.7 and Figure 3.9<br>section adding for Bank0, 1, 2, 6, 7;<br>•<br>changed Generic DDRX1 Inputs/Outputs with Clock and Data Aligned at Pin<br>(GDDRX1_RX/TX.SCLK.Aligned) using PCLK Clock Input – Figure 3.8 and Figure 3.10<br>adding for Bank 0, 1, 2, 6, 7;<br>•<br>newly added the Generic DDRX1 Inputs/Outputs with Clock and Data Centered at<br>Pin (GDDRX1_RX/TX.SCLK.Centered) using PCLK Clock Input – Bank3, 4, 5 – Figure<br>3.7 and Figure 3.9 section including all its parameters, description, Min/Max value,<br>and unit;<br>•<br>newly added the Generic DDRX1 Inputs/Outputs with Clock and Data Aligned at<br>Pin (GDDRX1_RX/TX.SCLK.Aligned) using PCLK Clock Input – Bank3, 4, 5 – Figure 3.8<br>and Figure 3.10 section including all its parameters, Min/Max values, and unit;<br>•<br>newly added_LPDDR4_and all its related parameters data;<br>•<br>updated Note 2 contents changing to_LVCMOS18, 1.8 V, 8 mA_.<br>•<br>Table 3.33. sysCLOCK PLL Timing (VCC = 1.0 V):<br>•<br>globally updated the Min/Typ./Max values so-far available to all the parameters<br>and updated conditions accordingly;<br>•<br>removed mentioning SSC from the fPFDconditions;<br>•<br>moved fSSC_MOD, fSSC_MOD_AMP, fSSC_MOD_STEPparameters and their related information<br>to the AC Characteristics section;<br>•<br>newly added two Fractional-N related descriptions to the tOPJITparameter;<br>•<br>removed tSPOand tRSTRECparameters from the AC Characteristics section;<br>•<br>newly added Note 4.<br>•<br>Table 3.34. Internal Oscillators (VCC = 1.0 V):<br>•<br>updated Min and Max values for fCLKHFsymbol;<br>•<br>removed CLKK from Parameter Description of the fCLKHFand fCLKLFsymbols.<br>•<br>Table 3.36. ADC Specifications:<br>•<br>changed the NTRACK_ADCMin value to 4;<br>•<br>changed the ENOBADCMin value to 9.9.<br>•<br>updated the LOUTPUT_ADCcondition to Includes minimum tracking time of four<br>cycles.<br>•<br>changed the INLADCMax value to 2.21;<br>•<br>changed the SNRADCMin value to 61.9 and Max value to 68;<br>•<br>changed the SNDRADCMin value to 61.7;<br>•<br>newly added Notes.<br>•<br>Table 3.38. DTR Specifications:<br>•<br>updated the condition and the Min/Typ./Max values for DTRACCURACYsymbol;|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
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**CertusPro-NX Family Data Sheet**
|**Section**|**Change Summary**|
|---|---|
||•<br>newly added Notes.<br>•<br>Table 3.39. Serial Output Timing and Levels:<br>•<br>globally updated the whole table adding new symbols, adding conditions, updating<br>descriptions, Min/Typ./Max values, and units;<br>•<br>updated Note 1 adding_Fixture de-embedded_.<br>•<br>removed the original Note 3.<br>•<br>Table 3.40. Channel Output Jitter:<br>•<br>globally updated the whole table.<br>•<br>removed as it is good enough for 8b10b encoded data from Note 3.<br>•<br>Table 3.41. Serial Input Data Specifications:<br>•<br>globally updated the whole table.<br>•<br>Table 3.42. Receiver Total Jitter Tolerance Specification:<br>•<br>globally updated the whole table.<br>•<br>Table 3.43. External Reference Clock Specification for SDQx_REFCLKP/N1:<br>•<br>updated the original Table 3.41 splitting it into the current Table 3.43 and the<br>newly-added Table 3.44.<br>•<br>Table 3.45. PCIe (2.5 Gbps):<br>•<br>newly added PKGTXsymbol and its description, condition, Min/Typ./Max value, and<br>unit.<br>•<br>Table 3.46. PCIe (5 Gbps):<br>•<br>newly added LTX-SKEWand LRX-SKEWsymbols and their descriptions, conditions,<br>Min/Typ./Max values, and units.<br>•<br>updated the Max value to 175 and the unit to mV, p-p for VRX-IDLE-DET-DIFF-PPsymbol.<br>•<br>Updated the min value to 0.343 for VRX-DIFF-PPsymbol.<br>•<br>Table 3.47. PCIe (8 Gbps):<br>•<br>newly added VTX-EIEOS-RS, TTX-UTJ, TTX-UDJDD, TTX-UPW-TJ, TTX-UPW-DJDD, TTX-DDJD,<br>TRX-JTOL-BP-MASK, TRX-eye-stress, ZRX-DIFF-DCsymbols and their descriptions, test conditions,<br>Min/Typ./Max values, and units.<br>•<br>globally updated the test conditions, Min/Typ./Max values, and units for the rest<br>symbols.<br>•<br>removed VTX-DIFF-PP-LOW, VTX-DE-RATIO-3.5dB, VTX-DE-RATIO-6dB, TMIN-PULSE, TTX-RISE-FALL, TTX-DJ,<br>TRF-MISMATCH, VRX-DIFF-PP, TRX-RJ-RMS, TRX-DJ, ZRX-DC, and VRX-CM-AC-Psymbols and their<br>related information.<br>•<br>updated Note 3.<br>•<br>Table 3.48. SGMII:<br>•<br>updated test conditions and Max values for JTOL_DETand JTOL_TOLsymbols.<br>•<br>newly added Note.<br>•<br>Table 3.49. sysCONFIG Port Timing Specifications:<br>•<br>newly added tICFG_POR,fMCLK_DC, tVMC_SLAVE, tVMC_MASTER, tSCLH_I2C, tSCLL_I2C, tSU_SDA_I2C,<br>tHD_SDA_I2C, tSU_SDA_I3C, tHD_SDA_I3C, tDONE_HIGHsymbols and their parameters, devices,<br>Min/Typ./Max values, and units.<br>•<br>globally updated the parameter, device, Min/Typ./Max, and unit for the rest<br>symbols.<br>•<br>updated the Max value to 30 for tCO_SSOand tEN_SSOsymbols.<br>•<br>updated the Min value to 30 fortSU_SDA_I3Cand tHD_SDA_I3Csymbols.<br>•<br>removed tSCLH, tSCLL, tSU_SDA, tHD_SDA,fDONE_HIGH,tMWCsymbols and their related<br>information.<br>•<br>Table 3.50. JTAG Port Timing Specifications:<br>•<br>updated Min value for tBTS, tBTH, tBTRF, tBTCRS, and tBTCRHsymbols;<br>•<br>updated Max value for tBTCO, tBTCODIS, tBTCOEN, tBUTCO, tBTUODIS, and tBTUPOENsymbols;<br>•<br>newlyadded Note.|
|Pinout Information|Updated description for ADC_REF and ADC_DP/N in Signal Descriptions.|
|Ordering Information|•<br>CertusPro-NX Part Number Description:|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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**CertusPro-NX Family Data Sheet**
|**Section**|**Change Summary**|
|---|---|
||•<br>newly added Notes;<br>•<br>removed_A = Automotive_from Grade.<br>•<br>Newly added Figure 6.1. Top Marking Diagram to the Ordering Part Numbers section.<br>•<br>Newly added the Commercial (“01A” Die Version) and the Industrial (“01A” Die Version)<br>sections.|
## **Revision 0.81, August 2021**
|**Section**|**Change Summary**|
|---|---|
|All|•<br>Minor adjustments in formatting across the document.<br>•<br>Changed CertusPro-NX 50k and CertusPro-NX 100k to LFCPNX-50 and LFCPNX-100.|
|Architecture|•<br>Updated content in Output Register Block to remove top side support reference.<br>•<br>Updated Figure 2.19 and Figure 2.21 to add note for IDDRX1 and ODDRX1, respectively.<br>•<br>Updated notes in Table 2.14 to change SerDes line rate for BFG484 package to 5.5<br>GBps.<br>•<br>Updated PCIe IP Core document link in Peripheral Component Interconnect Express<br>(PCIe)section.|
|DC and Switching Characteristics|•<br>Updated LVSTL_I and LVSTL_II to removed note 8 reference in Table 3.13.<br>•<br>Updated two rows for fSSCin Table 3.33.<br>•<br>Updated figure 3.3 to move resistor to the on-chip side.<br>•<br>Updated SubLVDSE/SubLVDSEH (Output Only) section content to change Bank 5 and<br>Bank 6 to Bank 6 and Bank 7.|
|Pinout Summary|•<br>Updated table in Signal Descriptions to add PLLCK in PBxxx/LRC_GPLL, PBxxx/LLC_GPLL,<br>and PBxxx/ULC_GPLL and added row for PRxx/URC_GPLLT_IN.<br>•<br>Updatedpin information for BFG484 in CertusPro-NX Pin Information Summarytable.|
## **Revision 0.80, June 2021**
|**Section**|**Change Summary**|
|---|---|
|All|Preliminaryrelease.|
|**Revision 0.70, December 2020**||
|---|---|
|**Section**<br>All<br>~~a~~|**Change Summary**<br>Advance release.|
© 2020-2024 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02086-2.0
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www.latticesemi.com
Updated at April 17, 2026
Lattice Semiconductor is a premier developer of low-power, programmable design solutions, specializing in Field-Programmable Gate Arrays (FPGAs) and Programmable Logic Devices (PLDs). Recognized for driving innovation in cost-effective and power-efficient architectures, the company provides essential semiconductor components for consumer, mobile, and industrial design applications. Our selection of Lattice Semiconductor products is focused on their highly regarded FPGA integrated circuits. Devices from industry-leading families like the iCE40, MachXO, and LatticeECP series offer designers an exceptional combination of high system integration and industry-low power consumption. These FPGAs are engineered to handle complex tasks such as sensor management, custom connectivity, and advanced video processing while minimizing overall board footprint. To ensure seamless integration from concept to production, Lattice backs its hardware with a comprehensive support ecosystem. Engineers can accelerate their development cycles utilizing intuitive tools like the Lattice Diamond design software, paired with flexible IP cores and reference designs that reduce design risk and increase system reliability.
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