Image not available
Illustrative purposes only
LCC110P
Solid State Relay, SPDT, 120 mA, Surface Mount, Gull Wing
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: LITTELFUSE
- Product type:
- SVHC: To Be Advised
- Load Current: 120mA
- Product Range: -
- Relay Mounting: Surface Mount
- Switching Mode: -
- Relay Terminals: Gull Wing
- Control Voltage Max: -
- Control Voltage Min: -
- Contact Configuration: SPDT
- Operating Voltage Max: -
- Operating Voltage Min: -
| Delivery and price | |
|---|---|
| Units per pack | 50 |
| Price | 4.19 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
> I FiLXyY NTEGRATED CIRCUITS DIVISION 5S a **LCC110 350V, 120mA 1-Form-C Relay** |**Parameters**|**Ratings**|**Units**| |---|---|---| |Blocking Voltage|350|VP| |Load Current|120|mArms/ mADC| |On-Resistance (max)|35|| ## **Featurges** ## **Description** LCC110P is a 350V, 120mA, 35 1-Form-C relay. This device is ideal for applications where a signal needs to be switched between two different lines. The small 8-lead package makes it an ideal space-saving replacement for a 1-Form-C electromechanical relay (EMR). - 3750Vrms Input/Output Isolation - 1-Form-C Solid State Relay - Low Drive Power Requirements - Greater Reliability than Electromechanical Relays - FCC Compatible - VDE Compatible ## **Approvals** - UL Recognized Component: File E76270 - CSA Certified Component: Certificate 1175739 - TUV EN 62368-1: Certificate # B 082667 0008 - No EMI/RFI Generation - Small 8-pin Packages - Flammability Rating UL 94 V-0 - Surface Mount Tape & Reel Versions Available ## **Applications** - Telecommunications - Telecom Switching ## **Ordering Information** |**Part #**|**Description**| |---|---| |LCC110|8-Pin DIP (50/Tube)| |LCC110P|8-Pin Flatpack (50/Tube)| |LCC110PTR|8-Pin Flatpack Tape & Reel (1000/Reel)| |LCC110S|8-Pin Surface Mount (50/Tube)| |LCC110STR|8-Pin Surfact Mount Tape & Reel (1000/Reel)| - Tip/Ring Circuits - Modem Switching (Laptop, Notebook, Pocket Size) - Hook Switch - Dial Pulsing - Ground Start - Ringing Injection - Instrumentation - Multiplexers - Data Acquisition - Electronic Switching ## **Pin Configuration** **==> picture [201 x 71] intentionally omitted <==** **----- Start of picture text -----**<br> 1 8<br>Do Not Use<br>Normally Closed Pole<br>2 7<br>+ Control<br>3 6<br>– Control<br>Normally Open Pole<br>4 5<br>Do Not Use<br>**----- End of picture text -----**<br> - I/O Subsystems - Meters (Watt-Hour, Water, Gas) - Medical Equipment—Patient/Equipment Isolation - Security - Industrial Controls ## **Switching Characteristics for a 1-Form-C Device** **==> picture [114 x 67] intentionally omitted <==** **----- Start of picture text -----**<br> IF<br>90%<br>Form-A ILOAD 10%<br>t on t off<br>Form-B ILOAD 90%<br>10%<br>t off t on<br>**----- End of picture text -----**<br> **1** DS-LCC110-R08 **www.ixysic.com** **LCC110** INTEGRATED CIRCUITS DIVISION ## **Absolute Maximum Ratings @ 25ºC** |**Parameter**|**Min**|**Max**|**Unit**| |---|---|---|---| |Blocking Voltage|-|350|VP| |Reverse Input Voltage|-|5|V| |Input control Current<br>Peak (10ms)|-<br>-|50|mA| |||1|A| |Input Power Dissipation1|-|150|mW| |Total Power Dissipation2|-|800|mW| |Isolation Voltage, Input to Output|3750|-|Vrms| |Operating Temperature, Ambient|-40|+85|ºC| |Storage Temperature|-40|+125|ºC| _Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ _Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 1 Derate linearly 1.33mW / ºC. 2 Derate output power linearly 6.67mW / ºC. ## **Electrical Characteristics @ 25ºC** |**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**| |---|---|---|---|---|---|---| |**Output Characteristics**||||||| |Blocking Voltage|IL=1A|VDRM|350|-|-|VP| |Load Current1<br>Continuous<br>Peak<br>~~a~~|-|IL|-|-|120|mArms/ mADC| ||t=10ms|ILPK|-|-|±350|mAP| |On-Resistance2<br>~~a~~<br>~~rr~~|IL=120mA|RON|-|23|35|| |Off-State Leakage Current<br>~~rr~~|VL=350VP|ILEAK|-|-|1|µA| |Switching Speeds<br>Turn-On<br>Turn-Off<br>~~rr~~|IF=8mA, VL=10V|ton|-|-|4|ms| |||toff|-|-|4|| |Output Capacitance<br>~~rr~~|VL=50V, f=1MHz|COUT|-|25|-|pF| |**Input Characteristics**<br>~~rr~~||||||| |Input Control Current to Activate|IL=120mA|IF|-|-|8|mA| |Input Control Current to Deactivate|-|IF|0.4|0.7|-|mA| |Input Voltage Drop|IF=10mA|VF|0.9|1.42|1.56|V| |Reverse Input Current|VR=5V|IR|-|-|10|A| |**Common Characteristics**||||||| |Capacitance, Input to Output|-|CI/O|-|3|-|pF| 1 If both poles operate simultaneously, then load current must be derated in order not to exceed package power dissipation value. 2 Measurement taken within one second of on-time. **www.ixysic.com** R08 **2** call INTEGRATED CIRCUITS DIVISION **LCC110** ~~a~~ ## **COMMON PERFORMANCE DATA*** **==> picture [493 x 125] intentionally omitted <==** **----- Start of picture text -----**<br> Typical LED Forward Voltage Drop Typical LED Forward Voltage Drop Typical Leakage vs. Temperature<br>(N=50, IF=10mA) vs. Temperature Measured across Pins 5&6 or 7&8<br>30 1.8 0.020<br>25 EL ef | 1.7 EF tT UTC CUT 0.018 es<br>0.016<br>1.6<br>20 Tmo) 1.5 Ra IIFF=10mA=5mA 0.0140.012 eee<br>15 1.4 I F =2mA 0.010<br>10 i 1.3 OSS 0.008<br>0.006<br>1.2<br>5 el ———-—. 0.004 7<br>1.1 0.002<br>0 [ |T ini| a | 1.0 Se 0 ee<br>1.416 1.418 1.420 1.422 1.424 -50 -25 0 25 50 75 100 -40 -20 0 20 40 60 80 100<br>LED Forward Voltage Drop (V) Temperature (ºC) Temperature (ºC)<br>A)<br>Leakage (<br>Device Count (N)<br>LED Forward Voltage Drop (V)<br>**----- End of picture text -----**<br> ## **Energy Rating Curve** **==> picture [159 x 105] intentionally omitted <==** **----- Start of picture text -----**<br> 1.0<br>0.9<br>0.8 EE TTT TTI TTT Tl<br>0.7 a a a<br>0.60.5 EINEa aa TTTTaTE TIM TT<br>0.40.3 EETIMTINTTT<br>0.20.1 EneTI aTIMTMaTTITEMSSTTTTTTTINT TT TTI TTUT<br>0 ELEM CETTE CTT EVIE EET ETE ee ETE<br>10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Time<br>Load Current (A)<br>**----- End of picture text -----**<br> ## **FORM-A RELAY PERFORMANCE DATA*** **==> picture [149 x 132] intentionally omitted <==** **----- Start of picture text -----**<br> Form-A<br>Typical On-Resistance Distribution<br>(N=50, IF=8mA, IL=120mADC)F=8mA, IL=120mADC)=8mA, IL=120mADC)L=120mADC)=120mADC)DC))<br>35<br>30<br>PDL LLELL<br>25<br>20 ISTee<br>15 2<br>10<br>500 ansnss 6666§$fsé6h|| -_<br>19.5 20.5 21.5 22.5 23.5 24.5 25.5<br>On-Resistance ( )<br>Device Count (N)<br>**----- End of picture text -----**<br> **==> picture [487 x 282] intentionally omitted <==** **----- Start of picture text -----**<br> Form-A Form-A Form-A<br>Typical Turn-On Time Typical Turn-Off Time Typical On-Resistance Distribution<br>(N=50, IF=8mA, IL=120mADC) (N=50, IF=8mA, IL=120mADC) (N=50, IF=8mA, IL=120mADC)F=8mA, IL=120mADC)=8mA, IL=120mADC)L=120mADC)=120mADC)DC))<br>25 25 35<br>30<br>20 20 FT PDL LLELL<br>25<br>15 15 FeT fe| t ft|] 20 eeISTee<br>10 10 ms |Be 15 2<br>10<br>5 5<br>0 0 mmiiil Pe il 500 ansnss 6666§$fsé6h|| -_<br>1.2 2.0 2.8 3.6 4.4 5.2 0.05 0.14 0.23 0.32 0.41 0.50 19.5 20.5 21.5 22.5 23.5 24.5 25.5<br>Turn-On Time (ms) Turn-Off Time (ms) On-Resistance ( )<br>Form-A Form-A Form-A<br>Typical IF for Switch Operation Typical IF for Switch Dropout Typical Blocking Voltage Distribution<br>(N=50, IL=120mADC) (N=50, IL=120mADC) (N=50)<br>25 25 35<br>20 20 F l 30 PDL LLLL<br>25<br>15 15 7 || 20 ee<br>10 10 ;imi fee| lt 15 Te|<br>10<br>5 5<br>0 0 |mi | i ll li 50 |a |) I}<br>1.2 2.0 2.8 3.6 4.4 5.2 1.2 2.0 2.8 3.6 4.4 5.2 400 420 440 460 480 500 520<br>LED Current (mA) LED Current (mA) Blocking Voltage (VP)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>**----- End of picture text -----**<br> **Form-A Typical Blocking Voltage Distribution (N=50)** *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. **www.ixysic.com** R08 **3** call INTEGRATED CIRCUITS DIVISION **LCC110** ~~eee~~ ## **FORM-A RELAY PERFORMANCE DATA*** **==> picture [497 x 584] intentionally omitted <==** **----- Start of picture text -----**<br> Form-A Form-A Form-A<br>Typical Turn-On Time Typical IF for Switch Operation Typical Turn-On Time<br>vs. LED Forward Current vs. Temperature vs. Temperature<br>1.0 (IL=120mADC) 6 (IL=120mADC) 1.4 (IL=120mADC)<br>0.9 5 1.2 IFI=10mAF=8mA<br>0.8 SERREFLLLLLLLLL Eeeee 4 F.toELT2ASF 1.0 (EEA IF=20mA Nea<br>0.7<br>PTET tt 7 0.8 Se<br>0.6 3<br>SOE EE Tere pt tT re TT 0.6 Nae<br>0.5<br>0.4 PTYSENC-EEE+FTT TT et 2 Ft> ert | 0.4 a ae<br>0.3 1 0.2<br>FIN 4 6 Per<br>0.2 FL SELELL SL 0 F t TT Tt 0 PfFELLpta<br>0 5 10 15 20 25 30 35 40 45 50 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>LED Forward Current (mA) Temperature (ºC) Temperature (ºC)<br>Form-A Form-A Form-A<br>Typical Turn-Off Time Typical IF for Switch Dropout Typical Turn-Off Time<br>vs. LED Forward Current vs. Temperature vs. Temperature<br>0.25 (IL=120mADC) 6 (IL=120mADC) 0.40 (IF=5mA, IL=120mADC)<br>0.35<br>0.20 FL ET ETT TT 5 FE TT TT Ne eee<br>0.30<br>4<br>0.15 POOR 0.25<br>Tr) EEC AR<br>3 0.20<br>0.10 POOP ($s. 2 H@RSOS 0.15 IN<br>0.10<br>0.05<br>1<br>0.05<br>0 TTL 0 F— L tt 0 e e eee<br>0 5 10 15 20 25 30 35 40 45 50 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>LED Forward Current (mA) Temperature (ºC) Temperature (ºC)<br>Form-A<br>Typical On-Resistance Form-A Form-A<br>vs. Temperature Typical Load Current vs. Load Voltage Maximum Load Current<br>(IF=8mA, IL=120mADC) (IF=8mA) vs. Temperature<br>40 150 180<br>> 3530 aLLL 100 160140 NG<br>25 ee FT 50 S\N<br>a eee 120 FT SSSA TE<br>20 0<br>ee 100 FOOSS<br>15 pot | | | Ld -50 SS<br>80<br>10 FTLPELLL 1 rt tT USS<br>50 aee ee -100-150 6040 PPEELEETIT EI<br>-40 -20 0 20 40 60 80 100 -3 -2 -1 0 1 2 3 -40 -20 0 20 40 60 80 100 120<br>Temperature (ºC) Load Voltage (V) Temperature (ºC)<br>Form-A<br>Typical Blocking Voltage<br>vs. Temperature<br>420<br>415 e ee<br>410 FooT UT hUh| UE ae<br>405 Fo Cr<br>400395 Fo2 |oT h |l| [hvdTLrvmLhUdT] hd] UTA hd<br>390 Fo ae eee<br>385 F |[7I]| | fl[| ht| lhl|<br>380 ra | | | [| | |<br>375 z w ti| | | tT |<br>-40 -20 0 20 40 60 80 100<br>Temperature (ºC)<br>IIIFFF=20mA=10mA=8mA<br>Turn-On Time (ms) LED Current (mA) Turn-On Time (ms)<br>Turn-Off Time (ms) LED Current (mA) Turn-Off Time (ms)<br>)<br>On-Resistance ( Load Current (mA) Load Current (mA)<br>)P<br>Blocking Voltage (V<br>**----- End of picture text -----**<br> *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. **www.ixysic.com** R08 **4** eT INTEGRATED CIRCUITS DIVISION **LCC110** ~~a~~ ## **FORM-B RELAY PERFORMANCE DATA*** **==> picture [498 x 577] intentionally omitted <==** **----- Start of picture text -----**<br> Form-B Form-B Form-B<br>Typical Turn-On Time Typical Turn-Off Time Typical On-Resistance Distribution<br>(N=50, IF=8mA, IL=120mADC) (N=50, IF=8mA, IL=120mADC) (N=50, IF=0mA, IL=120mADC)<br>30 30 30<br>25 Fe tT | hd| hE LT 25 25 FT tT | ct cE<br>20 FeoT huT hcT hT | 20 20 FeT | lc tt<br>151050 mimmii7iiTh2a i ~Aneera ll i 151050 151050 2aaF s6esUl |e| hld|ld|||mTzzhf<br>0.03 0.05 0.07 0.09 0.11 0.13 0.21 0.28 0.35 0.42 0.49 0.56 25.5 26.5 27.5 28.5 29.5 30.5 31.5<br>Turn-On Time (ms) Turn-Off Time (ms) On-Resistance ( )<br>Form-B Form-B Form-B<br>Typical IF for Switch Operation Typical IF for Switch Dropout Typical Blocking Voltage Distribution<br>(N=50, IL=120mADC) (N=50, IL=120mADC) (N=50, IF=8mA)<br>30 25 30<br>25 20 FT | fl Ld 25 ETL |<br>20 20<br>15<br>15 a0 S200 15 oon<br>10 2]<br>10 | eee 10<br>5 5 miil =e 5 | |<br>0 0 | En $ 0 # é$ewsine<br>1.2 2.0 2.8 3.6 4.4 5.2 1.2 2.0 2.8 3.6 4.4 5.2 365 375 385 395 405 415 425<br>LED Current (mA) LED Current (mA) Blocking Voltage (VP)<br>Form-B Form-B Form-B<br>Typical Turn-On Time Typical IF for Switch Operation Typical Turn-On Time<br>vs. LED Forward Current vs. Temperature vs. Temperature<br>0.075 (IL=120mADC) 6 (IL=120mADC) 0.25 (IF=8mA, IL=120mADC)<br>0.074 PITT TET TTT C 5 UE EEE TT 0.20<br>4<br>0.073 PLETE Ea C OE 0.15 ET<br>3 ana NER<br>0.072 0.10<br>2<br>0.071 PLEPPTEEA 1 ere CO 0.05 LEE<br>0.070 ee 0 eee e 0 ee<br>0 5 10 15 20 25 30 35 40 45 50 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>LED Forward Current (mA) Temperature (ºC) Temperature (ºC)<br>Form-B Form-B Form-B<br>Typical Turn-Off Time Typical IF for Switch Dropout Typical Turn-Off Time<br>vs. LED Forward Current vs. Temperature vs. Temperature<br>0.40 (IL=120mADC) 6 (IL=120mADC) 1.0 (IL=120mADC)<br>0.9<br>0.35 FTLILIILL0 5 COE eC 0.8<br>0.30 4 0.70.6 IFI=10mAF=8mA<br>SRG 3 ft |) pa 0.5 on IF=20mA oe<br>0.25 0.4<br>JN 2 eee 0.3 eee<br>0.20 PLET PPP 1 PC 0.2 ee<br>0.1<br>0.15 ee 0 eeee 0 eeee<br>0 5 10 15 20 25 30 35 40 45 50 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>LED Forward Current (mA) Temperature (ºC) Temperature (ºC)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>Turn-On Time (ms) LED Current (mA) Turn-On Time (ms)<br>Turn-Off Time (ms) LED Current (mA) Turn-Off Time (ms)<br>**----- End of picture text -----**<br> *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. **www.ixysic.com** R08 **5** aaa INTEGRATED CIRCUITS DIVISION **LCC110** ~~a~~ ## **FORM-B RELAY PERFORMANCE DATA*** **==> picture [492 x 288] intentionally omitted <==** **----- Start of picture text -----**<br> Form-B Form-B<br>Typical On-Resistance Form-B Maximum Load Current<br>vs. Temperature Typical Load Current vs. Load Voltage vs. Temperature<br>60 (IF=0mA, IL=120mADC) 150 (IF=0mA) 180 (IF=0mA)<br>50 FT | cE | Tf 100 Ft | dE dT Ld TdT Lhd 160 Ki | | tt ft<br>a 40 50 140<br>120<br>30 0<br>100<br>20 -50<br>80<br>10 Ft tT tT | Tt -100 Fiat 60 Fro<br>0 FEE EE -150 7A 40 PEE EEE<br>-40 -20 0 20 40 60 80 100 -4 -3 -2 -1 0 1 2 3 4 -40 -20 0 20 40 60 80 100 120<br>Temperature (ºC) Load Voltage (V) Temperature (ºC)<br>Form-B<br>Typical Blocking Voltage<br>vs. Temperature<br>(IF=8mA)<br>420415 eeae<br>410 ee<br>405 ET ae<br>400 Eo | hE Uh<br>395 rE || Jat| hv| |<br>390385 EEa | || i|| || [tl |<br>380 rll tT | tt<br>-40 -20 0 20 40 60 80 100<br>Temperature (ºC)<br>)<br>On-Resistance ( Load Current (mA) Load Current (mA)<br>)P<br>Blocking Voltage (V<br>**----- End of picture text -----**<br> *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. **www.ixysic.com** R08 **6** **LCC110** INTEGRATED CIRCUITS DIVISION ## **Manufacturing Information** ## **Moisture Sensitivity** All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of % the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a **Moisture Sensitivity Level (MSL)** classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . **Device Moisture Sensitivity Level (MSL) Classifi cation** LCC110S / LCC110P MSL 1 ~~—————————~~ ## **ESD Sensitivity** This product is ESD Sensitive, and should be handled according to the industry standard **JESD-625** . ## **Soldering Profile** Provided in the table below is the **IPC/JEDEC J-STD-020** Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. |**Device**<br>**Classifi cation Temperature (Tc)**<br>**Dwell Time (tP)**<br>**Max Refl ow Cycles**<br>LCC110S<br>250ºC<br>30 seconds<br>3<br>LCC110P<br>260ºC<br>30 seconds<br>3<br>~~a~~|**Device**<br>**Classifi cation Temperature (Tc)**<br>**Dwell Time (tP)**<br>**Max Refl ow Cycles**<br>LCC110S<br>250ºC<br>30 seconds<br>3<br>LCC110P<br>260ºC<br>30 seconds<br>3<br>~~a~~| |---|---| |For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is|| |provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder|| |wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the|| |last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below.|| |Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering|| |process.|| |**Device**<br>~~———————————~~|**Maximum Pin Temperature**<br>~~———————————~~|**Maximum Body Temperature**<br>~~———————————~~|**Maximum Dwell Time**<br>~~———————————~~|**Wave Cycles**<br>~~———————————~~| |---|---|---|---|---| |LCC110<br>~~———————————~~|260ºC<br>~~———————————~~|250ºC<br>~~———————————~~|10 seconds*<br>~~———————————~~|1<br>~~———————————~~| *Total cumulative duration of all waves. ## **Board Wash** IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. **www.ixysic.com** R08 **7** **LCC110** INTEGRATED CIRCUITS DIVISION ## **Mechanical Dimensions** ## **LCC110** ## **LCC110S** ## **LCC110P** 9.652 ± 0.381 7.620 ± 0.254 **PCB Hole Pattern** 2.540 ± 0.127 (0.380 ± 0.015) (0.300 ± 0.010) (0.100 ± 0.005) 8-0.762 DIA. 2.540 ± 0.127 ~~—l~~ (8-0.030 DIA.) (0.100 ± 0.005) 9.144 ± 0.508 6.350 ± 0.127 (0.360 ± 0.020) (0.250 ± 0.005) ~~~~~ | ae Pin 1 3.302 ± 0.051 0.457 ± 0.076 (0.130 ± 0.002) (0.018 ± 0.003) 7.239 TYP. 7.620 ± 0.127 (0.285) (0.300 ± 0.005) 7.620 ± 0.127 ~~v~~ a 4.064 TYP(0.160) ~~L~~ 0.254 ± 0.0127 ~~4~~ (0.300 ± 0.005) ~~J~~ (0.010 ± 0.0005) Dimensions mm m 0.813 ± 0.102 aT - (inches) ~~I~~ (0.032 ± 0.004) 9.652 ± 0.381 **PCB Land Pattern** (0.100 ± 0.005)2.540 ± 0.127 (0.380 ± 0.015) 3.302 ± 0.051 (0.025 ± 0.005)0.635 ± 0.127 2.54 (0.130 ± 0.002) (0.10) 6.350 ± 0.127 9.525 ± 0.254 (0.250 ± 0.005) (0.375 ± 0.010) 1.65 8.90 7.620 ± 0.254 (0.0649) (0.3503) Pin 1 (0.300 ± 0.010) ~~i~~ 0.457 ± 0.076 0.254 ± 0.0127 (0.018 ± 0.003) (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions 0.813 ± 0.102 mm ~~mz~~ L (0.032 ± 0.004) (inches) 2.286 MAX. **PCB Land Pattern** (0.090 MAX.) 2.540 ± 0.127 0 MIN / 0.102 MAX (0.100 ± 0.005) (0 MIN / 0.004 MAX) 2.54 (0.10) (0.250 ± 0.005)6.350 ± 0.127 (0.370 ± 0.005)9.398 ± 0.127 (0.300 ± 0.010)7.620 ± 0.254 (0.025 ± 0.005)0.635 ± 0.127 8.70 Pin 1 0.203 ± 0.013 (0.0610)1.55 (0.3425) 9.652 ± 0.381 (0.008 ± 0.0005) 1 ae ~~s a~~ (0.380 ± 0.015) 0.65 2.159 ± 0.025 (0.0255) (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) Dimensions 0.864 ± 0.120 mm ~~re~~ a (0.034 ± 0.004) (inches) **www.ixysic.com** R08 **8** **LCC110** INTEGRATED CIRCUITS DIVISION ## **LCC110STR Tape & Reel** **==> picture [390 x 155] intentionally omitted <==** **----- Start of picture text -----**<br> 2.0<br>(0.08)<br>4.0<br>(0.16)<br>330.2 DIA.<br>(13.00 DIA.)<br>7.5<br>(0.30)<br>Top Cover<br>Tape Thickness Bo=10.30<br>0.102 MAX. (0.406)<br>(0.004 MAX.) 16.0±0.3<br>(0.63±0.012)<br>“Hee<br>Ao=10.30 P1=12.00<br>K0 =4.90 (0.406) (0.472)<br>(0.193)<br>Dimensions<br>K1 =4.20 User Direction of Feed mm<br>(0.165) (inches)<br>Embossed Carrier<br>NOTES:<br>1. Dimensions carry tolerances of EIA Standard 481-2<br>**----- End of picture text -----**<br> 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm Embossment **LCC110PTR Tape & Reel** **==> picture [399 x 155] intentionally omitted <==** **----- Start of picture text -----**<br> 2.00 4.00<br>330.2 DIA. (0.079) (0.157)<br>(13.00 DIA.)<br>7.50<br>Top Cover (0.295)<br>Tape Thickness0.102 MAX. Bo = 10.30 W = 16.00(0.63)<br>(0.004 MAX.) (0.406)<br>le<br>Ao = 10.30 P1 = 12.00<br>K0 = 2.70 (0.406) (0.472)<br>(0.106)<br>Dimensions<br>Embossed Carrier K1 (0.079)= 2.00 User Direction of Feed mm<br>(inches)<br>d y NOTES: rae<br>1. All dimensions carry tolerances of EIA Standard 481-2<br>Embossment 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2<br>3. Controlling dimension: mm<br>**----- End of picture text -----**<br> ## **For additional information please visit our website at: https://www.ixysic.com** **Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.** Specification: DS-LCC110-R08 ©Copyright 2021, Littelfuse, Inc. OptoMOS[®] is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 11/3/2021 **9**
Updated at June 10, 2026
Founded in 1927 and headquartered in Chicago, Illinois, Littelfuse is a premier global manufacturer of circuit protection, power control, and sensing technologies. Widely recognized for pioneering the first small, fast-acting protective fuse, the company has grown into an industry leader whose highly reliable components are essential to modern industrial, transportation, and consumer electronics applications worldwide. At the core of the Littelfuse portfolio is an expansive and industry-leading range of circuit protection solutions. This encompasses a massive selection of traditional fuses, fuse holders, and resettable PTC thermistor fuses designed to safely interrupt overcurrent conditions. To defend against electrical overstress, Littelfuse also provides advanced transient voltage suppression (TVS) technologies, including thousands of specialized TVS diodes, TVS varistors, and gas discharge tubes (GDTs) that ensure robust defense against voltage spikes and environmental hazards. Beyond its foundational protection components, Littelfuse manufactures a diverse array of discrete semiconductors, sensors, and switching devices. Engineers rely on their high-performance thyristors, including TRIACs and SCRs, alongside power-efficient Schottky diodes and MOSFETs for demanding power control applications. Complemented by precision proximity sensors and highly reliable reed and solid-state relays, Littelfuse delivers the critical building blocks required for secure, efficient, and complete system design.
About Novapart
Novapart is a B2B electronic component broker specialising in stock shortages and cost reduction. We source hard-to-find parts and identify compliant alternatives across a catalogue of 410,000+ components from 500+ manufacturers.
Learn more →Stock Shortage Specialist
When a component is unavailable, discontinued or has an unacceptable lead time, we tap into our network of vetted European and Asian distributors to source what you need — without compromising on quality or traceability.
Request a quote →Compliant Alternatives
We identify pin-to-pin, electrically equivalent substitutes that meet the same certifications (RoHS, AEC-Q100, REACH) as your original specification — validated against datasheets, not just part numbers. Often at a lower cost.
BOM Analysis service →