LBEE0ZZ2FP-546

_Datasheet_ 

## TM ® Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module 

NXP Chipset RW610 for 802.11a/b/g/n/ac/ax + Bluetooth LE 5.4 Datasheet - Rev. 2.1 

- Design Name: Type 2FP 

 P/N: LBEE0ZZ2FP 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## Table of Contents 

About This Document ............................................................................................................... 4 Audience & Purpose ................................................................................................................. 4 Document Conventions ............................................................................................................. 4 1 Scope .................................................................................................................................... 5 2 Key Features ......................................................................................................................... 5 3 Ordering Information .............................................................................................................. 5 4 Product Overview .................................................................................................................. 6 4.1 Block Diagram ............................................................................................................... 6 4.2 Microcontroller (MCU) ................................................................................................... 7 4.3 Memory and Flash ........................................................................................................ 7 4.4 Peripheral Interfaces ..................................................................................................... 7 4.5 Built-in Security Features .............................................................................................. 7 4.6 Type 2FR and Type 2FP ............................................................................................... 8 5 Certification Information ......................................................................................................... 9 5.1 Radio Certification ......................................................................................................... 9 5.2 Bluetooth Qualification .................................................................................................. 9 6 Dimensions, Marking, and Terminal Configurations ............................................................. 10 6.1 Structure ..................................................................................................................... 11 7 Module Pin Descriptions ...................................................................................................... 12 7.1 Pin Descriptions .......................................................................................................... 14 7.2 Pin States ................................................................................................................... 17 8 Absolute Maximum Ratings ................................................................................................. 17 9 Operating Condition ............................................................................................................. 17 9.1 External Sleep Clock Specifications ............................................................................ 18 9.2 Digital I/O Requirements ............................................................................................. 18 10 DC/RF Characteristics ....................................................................................................... 19 10.1 Wi-Fi Radio Specification .......................................................................................... 19 10.1.1 Wi-Fi Receiver Performance - 2.4 GHz ............................................................. 19 10.1.2 Wi-Fi Receiver Performance - 5 GHz ............................................................... 19 10.1.3 Wi-Fi Transmitter Performance - 2.4 GHz ......................................................... 20 10.1.4 Wi-Fi Transmitter Performance - 5 GHz ............................................................ 20 10.2 Bluetooth LE Radio Specification .............................................................................. 21 10.2.1 Bluetooth LE Receiver Performance ................................................................. 21 10.2.2 Bluetooth LE Transmitter Performance ............................................................. 21 11 Land Pattern ...................................................................................................................... 23 

©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

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Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

|12 Reference Circuit ............................................................................................................... 23|12 Reference Circuit ............................................................................................................... 23|
|---|---|
|13 Tape and Reel Packing ...................................................................................................... 23|13 Tape and Reel Packing ...................................................................................................... 23|
||13.1 Dimensions of Tape (Plastic Tape)............................................................................ 23|
||13.2 Dimensions of Reel ................................................................................................... 24|
||13.3 Taping Diagrams ....................................................................................................... 25|
||13.4 Leader and Tail Tape ................................................................................................ 26|
||13.5 Packaging (Humidity Proof Packing) ......................................................................... 27|
|14 Notice ................................................................................................................................ 28|14 Notice ................................................................................................................................ 28|
||14.1 Handling Conditions .................................................................................................. 28|
||14.2 Standard PCB Design (Land Pattern and Dimensions) ............................................. 28|
||14.3 Notice for Chip Placer ............................................................................................... 29|
||14.4 Soldering Conditions ................................................................................................. 29|
||14.5 Cleaning .................................................................................................................... 29|
||14.6 Operational Environment Conditions ......................................................................... 29|
|15 Preconditions to Use Our Products .................................................................................... 30|15 Preconditions to Use Our Products .................................................................................... 30|
|16 References ........................................................................................................................ 32|16 References ........................................................................................................................ 32|
||16.1 RW610 Wireless MCU with Integrated Wi-Fi 6 and Bluetooth Low Energy 5.4 Product|
||data sheet, Rev. 7, 6 February 2024, NXP ........................................................................ 32|
||16.2 Type 2FR EVK Schematic, Murata ............................................................................ 32|
||16.3 Type 2FR EVK BOM, Murata .................................................................................... 32|



## Figures 

|Figure 1: Block Diagram ........................................................................................................... 6|Figure 1: Block Diagram ........................................................................................................... 6|
|---|---|
|Figure 2: Dimensions, Markings, and Terminal Configurations ............................................... 10|Figure 2: Dimensions, Markings, and Terminal Configurations ............................................... 10|
|Figure 3: Structure .................................................................................................................. 11|Figure 3: Structure .................................................................................................................. 11|
|Figure 4: Pin Assignments - Top View .................................................................................... 12|Figure 4: Pin Assignments - Top View .................................................................................... 12|
|Figure 5: Dimensions of Tape (Plastic Tape) .......................................................................... 23|Figure 5: Dimensions of Tape (Plastic Tape) .......................................................................... 23|
|Figure 6: Dimensions of Reel (Unit: Millimeters) ..................................................................... 24|Figure 6: Dimensions of Reel (Unit: Millimeters) ..................................................................... 24|
|Figure 7: Taping Diagrams ..................................................................................................... 25|Figure 7: Taping Diagrams ..................................................................................................... 25|
|Figure 8: Leader and Tail Tape ............................................................................................... 26|Figure 8: Leader and Tail Tape ............................................................................................... 26|
|Figure 9: Peeling Force ........................................................................................................... 27|Figure 9: Peeling Force ........................................................................................................... 27|
|Figure 10: Humidity Proof Packing .......................................................................................... 27|Figure 10: Humidity Proof Packing .......................................................................................... 27|
|Figure 11:  Reflow Soldering Standard Conditions (Example) ................................................. 29|Figure 11:  Reflow Soldering Standard Conditions (Example) ................................................. 29|



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

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Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## Tables 

|Table 1: Document Conventions ............................................................................................... 4|Table 1: Document Conventions ............................................................................................... 4|
|---|---|
|Table 2: Sample Ordering Information ...................................................................................... 5|Table 2: Sample Ordering Information ...................................................................................... 5|
|Table 3: Comparison of Type 2FR and Type 2FP ..................................................................... 8|Table 3: Comparison of Type 2FR and Type 2FP ..................................................................... 8|
|Table 4: Radio Certification Information .................................................................................... 9|Table 4: Radio Certification Information .................................................................................... 9|
|Table 5: Markings (Top View) ................................................................................................. 10|Table 5: Markings (Top View) ................................................................................................. 10|
|Table 6: Markings (Bottom View) ............................................................................................ 10|Table 6: Markings (Bottom View) ............................................................................................ 10|
|Table 7: Type 2FP Terminal Descriptions ............................................................................... 13|Table 7: Type 2FP Terminal Descriptions ............................................................................... 13|
|Table 8: Type 2FP Pin Descriptions ........................................................................................ 14|Table 8: Type 2FP Pin Descriptions ........................................................................................ 14|
|Table 9: Pin Power Down States (PDn = 0) ............................................................................ 17|Table 9: Pin Power Down States (PDn = 0) ............................................................................ 17|
|Table 10: Absolute Maximum Rating ...................................................................................... 17|Table 10: Absolute Maximum Rating ...................................................................................... 17|
|Table 11: Operating Conditions .............................................................................................. 17|Table 11: Operating Conditions .............................................................................................. 17|
|Table 12: External Sleep Clock Specifications ........................................................................ 18|Table 12: External Sleep Clock Specifications ........................................................................ 18|
|Table 13: Digital I/O Requirement Parameters - 1.8V Operation ............................................. 18|Table 13: Digital I/O Requirement Parameters - 1.8V Operation ............................................. 18|
|Table 14: Digital I/O Requirement Parameters - 3.3V Operation ............................................. 18|Table 14: Digital I/O Requirement Parameters - 3.3V Operation ............................................. 18|
|Table 16: Wi-Fi Receiver Performance - 2.4 GHz ................................................................... 19|Table 16: Wi-Fi Receiver Performance - 2.4 GHz ................................................................... 19|
|Table 17: Wi-Fi Receiver Performance - 5 GHz ...................................................................... 19|Table 17: Wi-Fi Receiver Performance - 5 GHz ...................................................................... 19|
|Table 18: Wi-Fi Transmitter Performance - 2.4 GHz ............................................................... 20|Table 18: Wi-Fi Transmitter Performance - 2.4 GHz ............................................................... 20|
|Table 19: Wi-Fi Transmitter Performance - 5 GHz .................................................................. 20|Table 19: Wi-Fi Transmitter Performance - 5 GHz .................................................................. 20|
|Table 20: Bluetooth LE Receiver Performance ....................................................................... 21|Table 20: Bluetooth LE Receiver Performance ....................................................................... 21|
|Table 21: Bluetooth LE Transmitter Performance ................................................................... 21|Table 21: Bluetooth LE Transmitter Performance ................................................................... 21|
|Table 22: Taping Specifications .............................................................................................. 25|Table 22: Taping Specifications .............................................................................................. 25|



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

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Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## About This Document 

Murata’s Type 2FP is a small and very high-performance module based on NXP RW610 combo chipset, supporting IEEE 802.11 a/b/g/n/ac/ax + Bluetooth LE 5.4. This data sheet describes Type 2FP module in detail. 

## Audience & Purpose 

The intended audience includes any customer looking to integrate this module into their product. In particular RF, hardware, software, and systems engineers. 

## Document Conventions 

**Table** 1 describes the document conventions. 

## **Table 1: Document Conventions** 

|**Conventions**|**Description**|
|---|---|
||**Warning Note**<br>Indicates very important note. Users are strongly recommended to review.|
||**Info Note**<br>Intended for informational purposes. Users should review.|
||**Menu Reference**<br>Indicates menu navigation instructions.<br>**Example**:  InsertTablesQuick TablesSave Selection to Gallery|
||**External Hyperlink**<br>This symbol indicates a hyperlink to an external document or website.<br>**Example**:Murata<br>Click on the text to open the external link.|
||**Internal Hyperlink**<br>This symbol indicates a hyperlink within the document.<br>**Example**:Scope<br>Click on the text to open the link.|
|Console input/output or<br>code snippet|**Console I/O or Code Snippet**<br>This text**_Style_**denotes console input/output or a code snippet.|
|_# Console I/O comment_<br>_// Code snippet comment_|**Console I/O or Code Snippet Comment**<br>This text**_Style_**denotes a console input/output or code snippet comment.<br>•<br>Console I/O comment (preceded by “#”) is for informational purposes<br>only and does not denote actual console input/output.<br>•<br>Code Snippet comment(preceded by“//”)mayexist in the original code.|



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

4 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## 1 Scope 

This specification characterizes the Type 2FP hostless tri-radio IEEE 802.11 a/b/g/n/ac/ax + Bluetooth LE 5.4 IoT module. 

## 2 Key Features 

- 6 NXP RW610 inside 

- 6 260 MHz Arm™ Cortex™ -M33 

- 6 Supports IEEE 802.11a/b/g/n/ac/ax specification: Dual band 2.4 GHz and 5 GHz Wi-Fi 6 

- 6 SISO with 20 MHz channels; up to MCS9 data rates 

- 6 Supports Bluetooth specification version 5.4 

- 6 1.2 MB SRAM; 16MB Flash; External PSRAM interface for system memory expansion up to 128 MB 

- 6 64 GPIOs, FlexSPI, SDIO 3.0, Ethernet, USB, USART, I2C, SPI, I2S, PCM, ACOMP, DAC, ADC, JTAG 

- 6 RF signal from pin pad 

- 6 Temperature Range: -40 °C to 85 °C 

- 6 Dimensions: 12.0 mm x 11.0 mm x 1.55 mm (maximum) 

- 6 Weight: 0.54 g 

- 6 MSL: 3 

- 6 Surface-mount type 

- 6 RoHS compliant 

- 6 Total FIT: 56.11 

- 6 NXP EdgeLock™ security technology 

- 6 NXP RW610 is PSA Certified Level 3 

## 3 Ordering Information 

The part number and associated ordering information is shown in **Table 2** . 

**Table 2: Sample Ordering Information** 

|**Ordering Part Number**|**Description**|
|---|---|
|LBEE0ZZ2FP-SMP|Type 2FP module sample|
|LBEE0ZZ2FP-546|Type 2FP module|
|LBES0ZZ2FR-EVK|Type 2FR EVK|



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

5 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## 4 Product Overview 

Type 2FP is a highly integrated wireless module based on NXP RW610 Wireless MCU. It measures just 12mm x 11mm and delivers class-leading integration, efficiency, and multiple radio capabilities. Type 2FP supports dual-band Wi-Fi 6, Bluetooth® Low Energy (LE) 5.4, and ethernet. This versatility ensures seamless connectivity and operational efficiency. Further, it supports Matter Network over Wi-Fi, Thread, and ethernet. This simplifies device interoperability and management. 

## 4.1 Block Diagram 

**Figure 1** shows the block diagram. 

## **Figure 1: Block Diagram** 

**==> picture [485 x 402] intentionally omitted <==**

**----- Start of picture text -----**<br>
Type 2FP<br>RW610 BGA<br>LPF<br>WLAN 5G Tx/Rx  VCC33<br>Y S o<br>DPX<br>RF-CNTL<br>Sleep clock<br>(Optional)<br>SPDT<br>LPF<br>i WLAN 2.4G Tx/Rx  — —<br>V e e he VIO<br>LPF<br>Bluetooth LE<br>GPIO<br>en ee =<br>Jumper selection<br>for single/dual<br>antenna<br>Cortex-M33 260 MHz<br>USB<br>FLASH<br>40 MHz<br>**----- End of picture text -----**<br>


> ©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 6 ~~|~~ 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## 4.2 Microcontroller (MCU) 

The NXP RW610 wireless SoC integrates an Arm Cortex-M33 MCU for user applications, see RW610 datasheet . 

- 260 MHz Arm Cortex-M33 with TrustZone-M 

- CoreMark® score: 1,033; 3.97 CoreMark/MHz 

- 1.2 MB integrated SRAM 

## 4.3 Memory and Flash 

Type 2FP module integrates 16MB flash memory through FlexSPI interface to RW610. The module supports external flash or external memory through FlexSPI interface. 

For detail, please refer to RW610 datasheet  and 2FR EVK Schematic . 

## 4.4 Peripheral Interfaces 

Type 2FP supports total 64 GPIOs and rich peripheral interfaces for user application. 

- Up to five configurable universal serial interface modules (FlexComm interfaces). Configurable as SPI/I2C/I2S/UART 

- SDIO 3.0 

- High Speed USB 2.0 On-The-Go (OTG) with integrated PHY 

- IEEE 1588 RMII/Fast Ethernet interface 

- QVGA (320 x 240) LCD interface supporting SPI and 8080 interfaces 

- 16-bit ADC and 10-bit DAC 

- 32-bit general purpose timers/PWM 

- 4 x digital microphone support 

For detail, please refer to RW610 datasheet . 

## 4.5 Built-in Security Features 

Type 2FP inherited all the built-in advanced security features from RW610 chip. 

- NXP EdgeLock™ Assurance 

- NXP EdgeLock 2GO Trust Provisioning 

- Trusted execution environment (TEE) based on Arm TrustZone-M 

- Hardware root of trust 

- Hardware cryptography accelerators (symmetric, asymmetric, secure hash, KDF, etc.) 

- True Random Number Generator (TRNG) 

- Physically Unclonable Function (PUF) 

- OTP-based device configuration and life cycle management 

- Secure boot, software update and debug 

©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

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Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

- On-chip tamper detection for voltage level and glitch, temperature and reset 

For detail, please refer to RW610 datasheet . 

## 4.6 Type 2FR and Type 2FP 

Type 2FR and Type 2FP family are based on NXP RW61x family IC. The **Table 3** below shows the comparison of these two modules. Type 2FR and Type 2FP are drop-in replacement for each other. 

**Table 3: Comparison of Type 2FR and Type 2FP** 

||**Type 2FR**|**Type 2FP**|
|---|---|---|
|IC|NXP RW612|NXP RW610|
|Radios|Dual band Wi-Fi 6(802.11ax)<br>Bluetooth LE 5.4/ IEEE 15.4|Dual band Wi-Fi 6(802.11ax)<br>Bluetooth LE 5.4|
|Dimensions|12.0 mm x 11.0 mm x 1.55 mm(maximum)||
|Footprint|Share the same footprint||
|Pin-out|Share the samepin-out||
|Antenna|Support the same antenna selections||
|Software|Same SDK from NXP||



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

8 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## 5 Certification Information 

This section describes the radio and Bluetooth certification. 

## 5.1 Radio Certification 

**Table 4** describes the radio certification information. 

**Table 4: Radio Certification Information** 

|**Country**|**ID**|**Country Code**|
|---|---|---|
|US|FCC ID: HSW2FP|US|
|Canada|IC ID: 4492A-2FP|CA|
|Europe||DE|
|Japan|TELEC ID: 201-250307|JP|



## 5.2 Bluetooth Qualification 

QDID: Q321062 

DID/DN: D068386 

©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

9 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## 6 Dimensions, Marking, and Terminal Configurations 

This section provides information about dimensions, markings, and terminal configuration for Type 2FP and the related parameters. **Figure 2** shows the dimensions, marking, and terminal configurations. 

**Figure 2: Dimensions, Markings, and Terminal Configurations** 

**==> picture [435 x 219] intentionally omitted <==**

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**Table 5** describes the marking labels for the top and bottom view as shown in **Figure 2** . 

**Table 5: Markings (Top View)** 

|**Labels**|**Meaning**|
|---|---|
|A|Module Part Number|
|B|Inspection Number|
|C|Serial Number|
|D|2D code|
|E|Murata Logo|
|F|Pin 1 Marking|



**Table 6** describes the markings. 

**Table 6: Markings (Bottom View)** 

|**Labels**|**Dimensions**|**Labels**|**Dimensions**|**Labels**|**Dimensions**|
|---|---|---|---|---|---|
|L|12.0 +/- 0.20|W|11.0 +/- 0.20|||
|T|1.55 maximum|T1|0.04 typical (Bump)|||
|a1|0.20 +/- 0.20|b1|0.20 +/- 0.20|c1|0.60 +/- 0.10|
|a2|1.35 +/- 0.20|b2|0.25 +/- 0.20|c2|0.30 +/- 0.10|



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

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Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

|a3|2.55 +/- 0.20|b3|2.05 +/- 0.20|d1|0.30 +/- 0.10|
|---|---|---|---|---|---|
|a4|3.90 +/- 0.20|b4|4.15 +/- 0.20|d2|0.75 +/- 0.10|



## 6.1 Structure 

## **Figure 3** shows the module structure. 

## **Figure 3: Structure** 

**==> picture [395 x 113] intentionally omitted <==**

**----- Start of picture text -----**<br>
Power<br>Diplexer  SPDT  Inductor  X’tal  RW61x<br>Resin Mold<br>1.55 mm  Shield<br>(maximum)<br>PWD<br>Substrate<br>Solder Bump<br>**----- End of picture text -----**<br>


The sides of the module are GND shielded. In order to avoid contact between the GND shield and the electrodes on the mother board, please carefully evaluate the standoff before use the module. 

©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

11 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## 7 Module Pin Descriptions 

This section has the Pin descriptions of Type 2FP and pin assignments layout descriptions. Type 2FP pin-assignment top view is presented in **Figure 4** . 

**Figure 4: Pin Assignments - Top View** 

©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

12 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## The pin names/terminal names are listed in **Table 7.** 

**Table 7: Type 2FP Terminal Descriptions** 

|**No.**|**Terminal Name**|**No.**|**Terminal Name**|**No.**|**Terminal Name**|
|---|---|---|---|---|---|
|1|GND|48|GPIO_19|95|GPIO_38|
|2|VIO_RF|49|GPIO_11|96|GPIO_27|
|3|GND|50|GND|97|GPIO_24|
|4|RF_CNTL_0|51|VIO_1|98|GPIO_28|
|5|GND|52|GND|99|GPIO_26|
|6|RF_MAIN|53|RF_CNTL_1|100|GPIO_15|
|7|GND|54|GND|101|GPIO_21|
|8|GPIO_58|55|RF_CNTL_2|102|GPIO_16|
|9|GPIO_2|56|GND|103|GPIO_10|
|10|GPIO_4|57|BT_OUT|104|GPIO_1|
|11|PDn|58|GND|105|GPIO_9|
|12|GPIO_47|59|RF_CNTL_3|106|GPIO_14|
|13|GPIO_30|60|GPIO_6|107|GND|
|14|GPIO_32|61|GPIO_5|108|GPIO_8|
|15|GPIO_31|62|GPIO_12|109|GPIO_55|
|16|GND|63|GPIO_51|110|GND|
|17|VIO_6|64|GPIO_52|111|GPIO_45|
|18|GND|65|GPIO_7|112|GPIO_54|
|19|VDD18|66|GND|113|GPIO_53|
|20|GND|67|BT_IN|114|GND|
|21|GPIO_62|68|GND|115|GPIO_44|
|22|GPIO_56|69|EXT_REQ|116|GPIO_50|
|23|GPIO_3|70|EXT_GNT|117|GND|
|24|GPIO_57|71|EXT_PRI|118|GND|
|25|GND|72|EXT_FREQ|119|GND|
|26|VCC33|73|GPIO_43|120|GND|
|27|VCC33|74|GPIO_42|121|GND|
|28|GND|75|GPIO_46|122|GND|
|29|USB_DP|76|GPIO_60|123|GND|
|30|USB_DM|77|GPIO_59|124|GND|
|31|GND|78|GPIO_34|125|GND|
|32|USB_ID|79|GPIO_33|126|GND|
|33|USB_VBUS|80|CS_Int_Flash|127|GND|
|34|VIO_3|81|GPIO_49|128|GND|
|35|GND|82|GPIO_48|129|GND|
|36|VIO_2|83|GPIO_63|130|GND|
|37|VIO_5|84|GND|131|GND|
|38|GPIO_40|85|GPIO_61|132|GND|
|39|GPIO_41|86|GND|133|GND|
|40|GPIO_39|87|GPIO_25|134|GND|
|41|GPIO_37|88|GPIO_22|135|GND|
|42|GPIO_29|89|GND|136|GND|
|43|GPIO_13|90|GND|137|GND|
|44|GPIO_17|91|GND|138|GND|
|45|GPIO_20|92|GPIO_23|139|GND|
|46|GPIO_18|93|GPIO_36|140|GND|
|47|GPIO_0|94|GPIO_35|||



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

13 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## 7.1 Pin Descriptions 

## **Table 8** lists the pin descriptions of Type 2FP. 

## **Table 8: Type 2FP Pin Descriptions** 

|**No.**|**Pin name**|**Connection to IC**|**Connection to IC**|**Type**|**Supply**<br>**Domain**|**Description**|
|---|---|---|---|---|---|---|
|||**Ball**<br>**#**|**Ball Name**||||
|1|GND|||Power|||
|2|VIO_RF|R6|VIO_RF|Power|||
|3|GND|||Power|||
|4|RF_CNTL_0|N3|RF_CNTL0|I/O|VIO_RF|Wi-Fi RF front-end control line 0|
|5|GND|||Power|||
|6|RF_MAIN|||RF||Main RFport|
|7|GND|||Power|||
|8|GPIO_58|G11|GPIO[58]|I/O|VIO_6||
|9|GPIO_2|F10|GPIO[2]|I/O|VIO_6||
|10|GPIO_4|F8|GPIO[4]|I/O|VIO_6||
|11|PDn|E9|PDN|I/O|||
|12|GPIO_47|E13|GPIO[47]|I/O|VIO_6||
|13|GPIO_30|F3|GPIO[30]|I/O|VIO_4||
|14|GPIO_32|F2|GPIO[32]|I/O|VIO_4||
|15|GPIO_31|D3|GPIO[31]|I/O|VIO_4||
|16|GND|||Power|||
|17|VIO_6|B15|VIO_6|Power|||
|18|GND|||Power|||
|19|VDD18|B12|VDD18|Power||Power from internal DCDC 1.8V for<br>appropriate IO domain|
|20|GND|||Power|||
|21|GPIO_62|B14|GPIO[62]|I/O|VIO_6||
|22|GPIO_56|A14|GPIO[56]|I/O|VIO_6||
|23|GPIO_3|C13|GPIO[3]|I/O|VIO_6||
|24|GPIO_57|B13|GPIO[57]|I/O|VIO_6||
|25|GND|||Power|||
|26|VCC33|R8,<br>R15,<br>B10,<br>A10,<br>B8|VPA[R8],<br>VPA[R15],<br>VBAT[B10],<br>VBAT(A10),<br>AVDD33_USB|Power||Main power supply|
|27|VCC33|R8,<br>R15,<br>B10,<br>A10,<br>B8|VPA[R8],<br>VPA[R15],<br>VBAT[B10],<br>VBAT(A10),<br>AVDD33_USB|Power||Main power supply|
|28|GND|||Power|||
|29|USB_DP|D8|USB_DP|I/O|||
|30|USB_DM|C7|USB_DM|I/O|||
|31|GND|||Power|||
|32|USB_ID|B7|USB_ID|I/O|||
|33|USB_VBUS|D6|USB_VBUS|Power|||
|34|VIO_3|A5|VIO_3|Power|||
|35|GND|||Power|||
|36|VIO_2|F1|VIO_2|Power|||
|37|VIO_5|A4|VIO_5|Power|||



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

14 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

|**No.**|**Pin name**|**Connection to IC**|**Connection to IC**|**Type**|**Supply**<br>**Domain**|**Description**|
|---|---|---|---|---|---|---|
|||**Ball**<br>**#**|**Ball Name**||||
|38|GPIO_40|A1|GPIO[40]|I/O|VIO_5||
|39|GPIO_41|B1|GPIO[41]|I/O|VIO_5||
|40|GPIO_39|A2|GPIO[39]|I/O|VIO_5||
|41|GPIO_37|B2|GPIO[37]|I/O|VIO_5||
|42|GPIO_29|D2|GPIO[29]|I/O|VIO_4||
|43|GPIO_13|G5|GPIO[13]|I/O|VIO_2||
|44|GPIO_17|H2|GPIO[17]|I/O|VIO_2||
|45|GPIO_20|K2|GPIO[20]|I/O|VIO_2||
|46|GPIO_18|K3|GPIO[18]|I/O|VIO_2||
|47|GPIO_0|M1|GPIO[0]|I/O|VIO_1||
|48|GPIO_19|L3|GPIO[19]|I/O|VIO_2||
|49|GPIO_11|M2|GPIO[11]|I/O|VIO_1||
|50|GND|||Power|||
|51|VIO_1|K1|VIO_1|Power|||
|52|GND|||Power|||
|53|RF_CNTL_1|P5|RF_CNTL1|I/O|VIO_RF||
|54|GND|||Power|||
|55|RF_CNTL_2|P6|RF_CNTL2|I/O|VIO_RF||
|56|GND|||Power|||
|57|BT_OUT|||RF||BT/Zigbee from RW610|
|58|GND|||Power|||
|59|RF_CNTL_3|P7|RF_CNTL3|I/O|VIO_RF||
|60|GPIO_6|L5|GPIO[6]|I/O|VIO_1||
|61|GPIO_5|L7|GPIO[5]|I/O|VIO_1||
|62|GPIO_12|N8|GPIO[12]|I/O|VIO_RF||
|63|GPIO_51|M8|GPIO[51]|I/O|VIO_1||
|64|GPIO_52|K8|GPIO[52]|I/O|VIO_1||
|65|GPIO_7|L9|GPIO[7]|I/O|VIO_1||
|66|GND|||Power|||
|67|BT_IN|||RF||BT/Zigbee to RF main|
|68|GND|||Power|||
|69|EXT_REQ|M12|EXT_REQ|I/O|AVDD18||
|70|EXT_GNT|L13|EXT_GNT|I/O|AVDD18||
|71|EXT_PRI|K13|EXT_PRI|I/O|AVDD18||
|72|EXT_FREQ|J13|EXT_FREQ/WCI-<br>2_SOUT|I/O|AVDD18||
|73|GPIO_43|H12|GPIO[43]|I/O|VIO_6||
|74|GPIO_42|G13|GPIO[42]|I/O|VIO_6||
|75|GPIO_46|F12|GPIO[46]|I/O|VIO_6||
|76|GPIO_60|E11|GPIO[60]|I/O|VIO_6||
|77|GPIO_59|D12|GPIO[59]|I/O|VIO_6||
|78|GPIO_34|E3|GPIO[34]|I/O|VIO_4||
|79|GPIO_33|G3|GPIO[33]|I/O|VIO_4||
|80|CS_Int_Flash|||I/O||Connect to GPIO_28 for internal flash<br>CS|
|81|GPIO_49|D14|GPIO[49]|I/O|VIO_6||
|82|GPIO_48|D13|GPIO[48]|I/O|VIO_6||
|83|GPIO_63|A15|GPIO[63]|I/O|VIO_6||
|84|GND|||Power|||
|85|GPIO_61|A13|GPIO[61]|I/O|VIO_6||
|86|GND|||Power|||



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

15 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

|**No.**|**Pin name**|**Connection to IC**|**Connection to IC**|**Type**|**Supply**<br>**Domain**|**Description**|
|---|---|---|---|---|---|---|
|||**Ball**<br>**#**|**Ball Name**||||
|87|GPIO_25|E7|GPIO[25]|I/O|VIO_3||
|88|GPIO_22|B6|GPIO[22]|I/O|VIO_3||
|89|GND|||Power|||
|90|GND|||Power|||
|91|GND|||Power|||
|92|GPIO_23|B5|GPIO[23]|I/O|VIO_3||
|93|GPIO_36|B4|GPIO[36]|I/O|VIO_5||
|94|GPIO_35|B3|GPIO[35]|I/O|VIO_5||
|95|GPIO_38|C3|GPIO[38]|I/O|VIO_5||
|96|GPIO_27|C5|GPIO[27]|I/O|VIO_3||
|97|GPIO_24|E5|GPIO[24]|I/O|VIO_3||
|98|GPIO_28|F4|GPIO[28]|I/O|VIO_4|For external or internal flash CS|
|99|GPIO_26|F6|GPIO[26]|I/O|VIO_3||
|100|GPIO_15|H3|GPIO[15]|I/O|VIO_2||
|101|GPIO_21|H4|GPIO[21]|I/O|VIO_2||
|102|GPIO_16|J3|GPIO[16]|I/O|VIO_2||
|103|GPIO_10|M3|GPIO[10]|I/O|VIO_1||
|104|GPIO_1|N2|GPIO[1]|I/O|VIO_1||
|105|GPIO_9|M4|GPIO[9]|I/O|VIO_1||
|106|GPIO_14|K4|GPIO[14]|I/O|VIO_2||
|107|GND|||Power|||
|108|GPIO_8|M6|GPIO[8]|I/O|VIO_1||
|109|GPIO_55|K6|GPIO[55]|I/O|VIO_1||
|110|GND|||Power|||
|111|GPIO_45|H10|GPIO[45]|I/O|VIO_6||
|112|GPIO_54|M10|GPIO[54]|I/O|VIO_1||
|113|GPIO_53|L11|GPIO[53]|I/O|VIO_1||
|114|GND|||Power|||
|115|GPIO_44|J11|GPIO[44]|I/O|VIO_6||
|116|GPIO_50|K12|GPIO[50]|I/O|VIO_6||
|117|GND|||Power|||
|118|GND|||Power|||
|119|GND|||Power|||
|120|GND|||Power|||
|121|GND|||Power|||
|122|GND|||Power|||
|123|GND|||Power|||
|124|GND|||Power|||
|125|GND|||Power|||
|126|GND|||Power|||
|127|GND|||Power|||
|128|GND|||Power|||
|129|GND|||Power|||
|130|GND|||Power|||
|131|GND|||Power|||
|132|GND|||Power|||
|133|GND|||Power|||
|134|GND|||Power|||
|135|GND|||Power|||
|136|GND|||Power|||



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

16 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

|**No.**|**Pin name**|**Connection to IC**|**Connection to IC**|**Type**|**Supply**<br>**Domain**|**Description**|
|---|---|---|---|---|---|---|
|||**Ball**<br>**#**|**Ball Name**||||
|137|GND|||Power|||
|138|GND|||Power|||
|139|GND|||Power|||
|140|GND|||Power|||



## 7.2 Pin States 

**Table 9: Pin Power Down States (PDn = 0)** 

|**Pin**|**Power down state (PDn = 0)**|
|---|---|
|RF_CNTL_0|Drive low|
|RF_CNTL_1|Drive high|
|RF_CNTL_2|Drive low|
|RF_CNTL_3|Drive high|
|GPIO_0 ~ GPIO_63|Tristate|



## 8 Absolute Maximum Ratings 

**Table 10** Shows the absolute maximum rating values. 

**Table 10: Absolute Maximum Rating** 

|**Parameter**|**Parameter**|**Minimum**|**Maximum**|**Unit**|
|---|---|---|---|---|
|Storage Temperature||-40|+125||
|Supply Voltage|VCC33||3.96|V|
|I/O Voltage|3.3 I/O Supply||3.96|V|
||1.8 I/O Supply||2.16|V|



## 9 Operating Condition 

**Table 11** shows the operating conditions for Type 2FP module. 

**Table 11: Operating Conditions** 

|**Parameter**|**Parameter**|**Minimum**|**Typical**|**Maximum**|**Unit**|
|---|---|---|---|---|---|
|Operating Temperature||-40||+85|C|
|Supply Voltage||3.14|3.3|3.46|V|
|I/O Voltage|3.3 I/O Supply|3.14|3.3|3.46|V|
||1.8 I/O Supply|1.71|1.8|1.89|V|



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

17 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## 9.1 External Sleep Clock Specifications 

**Table 12** describes the external sleep clock specifications. 

**Table 12: External Sleep Clock Specifications** 

|**Parameter**|**Minimum**|**Typical**|**Maximum**|**Unit**|
|---|---|---|---|---|
|Clock frequency range/accuracy<br>•<br>CMOS input clock signal type<br>•<br>±250 ppm (initial, aging,<br>temperature)||32.768||KHz|
|Phase noise requirement (@ 100 kHz)||-125||dBc/Hz|
|Cycle jitter||1.5||ns (RMS)|
|Slew Rate Limit (10-90%)|||100|ns|
|Duty Cycle Tolerance|20||80|%|



## 9.2 Digital I/O Requirements 

Digital I/O requirement parameters for 1.8V operation are listed in **Table 13** . 

**Table 13: Digital I/O Requirement Parameters - 1.8V Operation** 

|**Symbol**|**Parameter**|**Condition**|**Minimum**|**Typical**|**Maximum**|**Unit**|
|---|---|---|---|---|---|---|
|VIO|I/O pad supply voltage||1.71|1.8|1.89|V|
|VIH|Input high voltage||0.7 * VIO||VIO + 0.4|V|
|VIL|Input low voltage||-0.4||0.3 * VIO|V|
|VHYS|Input hysteresis||100|||mV|
|VOH|Output high voltage||VIO - 0.4|||V|
|VOL|Output low voltage||||0.4|V|



## Digital I/O requirement parameters for 3.3V operation are listed in **Table 14** . 

**Table 14: Digital I/O Requirement Parameters - 3.3V Operation** 

|**Symbol**|**Parameter**|**Condition**|**Minimum**|**Typical**|**Maximum**|**Unit**|
|---|---|---|---|---|---|---|
|VIO|I/O pad supply voltage||3.14|3.3|3.46|V|
|VIH|Input high voltage||0.7 * VIO||VIO + 0.4|V|
|VIL|Input low voltage||-0.4||0.3 * VIO|V|
|VHYS|Input hysteresis||100|||mV|
|VOH|Output high voltage||VIO - 0.4|||V|
|VOL|Output low voltage||||0.4|V|



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

18 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## 10 DC/RF Characteristics 

## 10.1 Wi-Fi Radio Specification 

## 10.1.1 Wi-Fi Receiver Performance - 2.4 GHz 

## **Conditions:** 25 °C, VCC33 = 3.3V, VIO_RF = 3.3V, at module pad 

The performance values are preliminary information subject to change based on the final device characterization results. 

**Table 15: Wi-Fi Receiver Performance - 2.4 GHz** 

|**Parameter**|**Condition**|**Minimum**|**Typical**|**Maximum**|**Unit**|
|---|---|---|---|---|---|
|RF frequencyrange||2400||2483.5|MHz|
|RF signal bandwidth||20||20|MHz|
|**Receivers Sensitivity**||||||
|Receiver Sensitivity 802.11b|20 MHz 1 Mbps||-98.2||dBm|
|Receiver Sensitivity 802.11b|20 MHz 11 Mbps||-90.9||dBm|
|Receiver Sensitivity 802.11g|20 MHz 6 Mbps||-92.9||dBm|
|Receiver Sensitivity802.11g|20 MHz 54 Mbps||-76.2||dBm|
|Receiver Sensitivity802.11n|20 MHz MCS0 Nss1 BCC||-92.9||dBm|
|Receiver Sensitivity 802.11n|20 MHz MCS7 Nss1 BCC||-74.2||dBm|
|Receiver Sensitivity 802.11ax|4x3.2 20 MHz MCS0 Nss1 BCC||-92.5||dBm|
|Receiver Sensitivity802.11ax|4x3.2 20 MHz MCS9 Nss1 BCC||-67.9||dBm|
|**Receiver Maximum Input Level (MIL)**||||||
|Receiver Maximum Input Level<br>DSS|802.11b DSSS MIL||-0.2||dBm|
|Receiver Maximum Input Level<br>OFDM|802.11b CCK MIL||-0.2||dBm|
|Receiver Maximum Input Level<br>OFDM|OFDM MIL||-5||dBm|



## 10.1.2 Wi-Fi Receiver Performance - 5 GHz 

**Conditions:** 25 °C, VCC33 = 3.3V, VIO_RF = 3.3V, at module pad 

The performance values are preliminary information subject to change based on the final device characterization results. 

**Table 16: Wi-Fi Receiver Performance - 5 GHz** 

|**Parameter**|**Condition**|**Minimum**|**Typical**|**Maximum**|**Unit**|
|---|---|---|---|---|---|
|RF FrequencyRange||4900||5895|MHz|
|RF Signal Bandwidth||20||20|MHz|
|**Receivers Sensitivity**||||||
|Receiver Sensitivity802.11a|20 MHz 6 Mbps||-92.3||dBm|



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

19 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

|Receiver Sensitivity802.11a|20 MHz 54 Mbps||-75.3||dBm|
|---|---|---|---|---|---|
|Receiver Sensitivity802.11n|20 MHz MCS0 Nss1 BCC||-91.5||dBm|
|Receiver Sensitivity802.11n|20 MHz MCS7 Nss1 BCC||-72.7||dBm|
|Receiver Sensitivity802.11ac|20 MHz MCS0 Nss1 BCC||-91.5||dBm|
|Receiver Sensitivity802.11ac|20 MHz MCS8 Nss1 BCC||-68.8||dBm|
|Receiver Sensitivity802.11ax|4x3.2 20 MHz MCS0 Nss1 BCC||-91.5||dBm|
|Receiver Sensitivity802.11ax|4x3.2 20 MHz MCS9 Nss1 BCC||-66.6||dBm|



## 10.1.3 Wi-Fi Transmitter Performance - 2.4 GHz 

## **Conditions:** 25 °C, VCC33 = 3.3V, VIO_RF = 3.3V, at module pad 

The performance values are preliminary information subject to change based on the final device characterization results. 

**Table 17: Wi-Fi Transmitter Performance - 2.4 GHz** 

|**Parameter**|**Condition**|**Minimum**|**Typical**|**Maximum**|**Unit**|
|---|---|---|---|---|---|
|RF FrequencyRange|2.4 GHz|2412||2484|MHz|
|Maximum Linear Output<br>Power With 20 MHz<br>Bandwidth|802.11b 1 Mbps||18||dBm|
||802.11b 11 Mbps||18||dBm|
||802.11g6 Mbps||18||dBm|
||802.11g54 Mbps||17||dBm|
||802.11n MCS7||16||dBm|
||802.11ax MCS9||15||dBm|
|Transmit Carrier Suppression|||-40||dBc|
|Transmit FrequencyError|||-20|20|PPM|
|Modulation Accuracy|802.11b 1 Mbps|||35|%|
||802.11b 11 Mbps|||35|%|
||802.11g6 Mbps|||-5|dB|
||802.11g54 Mbps|||-25|dB|
||802.11n MCS7|||-27|dB|
||802.11 ax MCS9|||-32|dB|



## 10.1.4 Wi-Fi Transmitter Performance - 5 GHz 

## **Conditions:** 25 °C, VCC33 = 3.3V, VIO_RF = 3.3V, at module pad 

The performance values are preliminary information subject to change based on the final device characterization results. 

**Table 18: Wi-Fi Transmitter Performance - 5 GHz** 

|**Parameter**|**Condition**|**Minimum**|**Typical**|**Maximum**|**Unit**|
|---|---|---|---|---|---|
|RF FrequencyRange|5 GHz|4900||5895|MHz|
|Maximum linear output power with<br>20 MHz bandwidth|802.11a 6 Mbps||18||dBm|
||802.11a 54 Mbps||17||dBm|
||802.11n MCS7||16||dBm|
||802.11ax MCS9||13||dBm|



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

20 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

|**Parameter**|**Condition**|**Minimum**|**Typical**|**Maximum**|**Unit**|
|---|---|---|---|---|---|
|Transmit Carrier Suppression|||-40||dBc|
|Transmit FrequencyError||-20||20|PPM|
|Modulation Accuracy|802.11a 6 Mbps|||-5|dB|
||802.11a 54 Mbps|||-25|dB|
||802.11n MCS7|||-27|dB|
||802.11ax MCS9|||-32|dB|



## 10.2 Bluetooth LE Radio Specification 

## 10.2.1 Bluetooth LE Receiver Performance 

**Conditions** : 25 °C, VCC33 = 3.3V, VIO_RF = 3.3V, at module pad 

The performance values are preliminary information subject to change based on the final device characterization results. 

**Table 19: Bluetooth LE Receiver Performance** 

|**Parameter**|**Condition**|**Minimum**|**Typical**|**Maximum**|**Unit**|
|---|---|---|---|---|---|
|RF frequencyrange||2400||2483.5|MHz|
|**Receivers Sensitivity**||||||
|Bluetooth LE 1 Mbps|||-97.7||dBm|
|Bluetooth LE 2 Mbps|||-95.5||dBm|
|Bluetooth LR 125Kbps|||-106||dBm|
|Bluetooth LR 500 Kbps|||-99.3||dBm|
|**Receivers Maximum Input Level (MIL)**||||||
|Bluetooth LE 1 Mbps|||-3||dBm|
|Bluetooth LE 2 Mbps|||-3||dBm|
|Bluetooth LR 125 Kbps|||-3||dBm|
|Bluetooth LR 500 Kbps|||-3||dBm|



## 10.2.2 Bluetooth LE Transmitter Performance 

**Conditions:** 25 °C, VCC33 = 3.3V, VIO_RF = 3.3V, at module pad 

The performance values are preliminary information subject to change based on the final device characterization results. 

**Table 20: Bluetooth LE Transmitter Performance** 

|**Parameter**|**Condition**|**Minimum**|**Typical**|**Maximum**|**Unit**|
|---|---|---|---|---|---|
|Center Frequency||2400||2483.5|MHz|
|Channel Spacing|||2||MHz|
|Number of RF Channels|||40|||



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

21 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

|Max Output Power|||12||dBm|
|---|---|---|---|---|---|
|**Modulation Characteristics**||||||
|Δf1avg||225||275|kHz|
|Δf2max(at 99.9%)||185|||kHz|
|Δf2avg/ Δf1avg||0.8||||
|**Carrier Frequency Offset and Drift**||||||
|•<br>Frequency offset: | fn– fTX|||||150|kHz|
|•<br>Frequency drift: | f0– fn|||||50|kHz|
|•<br>Drift rate #0: | f1– f0|||||20|kHz|
|•<br>Drift rate #n: | fn– fn-5|||||20|kHz|



©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

22 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## 11 Land Pattern 

We recommend the host PCB land pattern be the same as the module pin pad pattern. 

## 12 Reference Circuit 

Please reference to 2FR EVK Schematic  and Type 2FR EVK BOM . 

## 13 Tape and Reel Packing 

This section contains the following topics: 

- Dimensions of Tape (Plastic tape) 

- Dimensions of Reel 

- Taping Diagrams 

- Leader and tail tape 

- Packaging 

## 13.1 Dimensions of Tape (Plastic Tape) 

**Figure 5** is a graphical representation of the tape dimension (plastic tape). 

**Figure 5: Dimensions of Tape (Plastic Tape)** 

**==> picture [456 x 190] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.0±0.1<br>φ1.5+0.1/-0.0 0.3±0.05<br>4.0±0.1<br>1.75±0.1<br>OCOOOO0000BVO00000000<br>11.5±0.1<br>24.0±0.3<br>12.5±0.05<br>a<br>φ1.5+0.1/-0.0 20.0±0. 11.5±0.05<br>1.8 ±0.1<br>feeding direction<br>**----- End of picture text -----**<br>


Cumulative tolerance of maximum 40 +/- 0.15 mm for every 10 pitches. 

©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

23 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## 13.2 Dimensions of Reel 

## **Figure 6** shows the reel dimensions. 

## **Figure 6: Dimensions of Reel (Unit: Millimeters)** 

©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

24 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## 13.3 Taping Diagrams 

**Figure 7** shows the taping diagrams. **Figure 7: Taping Diagrams** [3] [1] [2] [3] o ~~w :~~ [4] Feeding Hole Feeding Direction Pin 1 Marking Chip ~~r~~ e **Table 21: Taping Specifications Mark Description** 1 Feeding Hole. As specified in Dimensions of Tape (Plastic Tape) . 2 Hole for chip. As specified in Dimensions of Tape (Plastic Tape) . 3 Cover tape. 62 μm in thickness. 4 Base tape. As specified in  Dimensions of Tape (Plastic Tape) . ~~——————~~ 

©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

25 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## 13.4 Leader and Tail Tape 

The leader and tail tape are shown in **Figure 8** . 

## **Figure 8: Leader and Tail Tape** 

**==> picture [81 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
Feeding direction<br>**----- End of picture text -----**<br>


**==> picture [427 x 35] intentionally omitted <==**

**----- Start of picture text -----**<br>
Tail tape  Components  No components  Leader tape<br>(No components) (Cover tape alone)<br>40 to 200 mm  150 mm minimum  250 mm minimum<br>**----- End of picture text -----**<br>


- The tape for chips is wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. 

- The cover tape and base tape are not adhered at no components area for 250 mm minimum. 

- Tear off strength against pulling of cover tape: 5 N minimum. 

- Packaging unit: 1000 pcs./ reel 

- Material 

- Base tape: Plastic 

- Real: Plastic 

- Cover tape, cavity tape and reel are made the anti-static processing. 

- Peeling off force: 1.1 N maximum. in the direction of peeling as shown in **Figure 9** . 

©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

26 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

**Figure 9: Peeling Force** 

**==> picture [288 x 127] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.1 N maximum<br>5<br>165 to 180 °<br>Cover tape<br>a<br>v “& 4<br>Base tape<br>**----- End of picture text -----**<br>


## 13.5 Packaging (Humidity Proof Packing) 

## The packaging is shown in **Figure 10** . 

## **Figure 10: Humidity Proof Packing** 

**==> picture [313 x 215] intentionally omitted <==**

**----- Start of picture text -----**<br>
表示ラべルLabel<br>Desiccant<br>乾燥剤<br>Humidity<br> 湿度<br>Indicator インジケ－タ<br>A<br>表示ラベルLabel<br>Anti-humidity 防湿梱包袋<br>Plastic Bag<br>**----- End of picture text -----**<br>


Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. 

©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

27 

Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## 14 Notice 

Please use this product within 6 months after receipt. 

- The product shall be stored without opening the packing under the ambient temperature from 5 to 35 °C and humidity from 20 ~ 70 %RH. 

Packing materials may be deformed at the temperature over 40 °C. 

- The product left more than 6 months after reception, it needs to be confirmed the solderability before used. 

- The product shall be stored in noncorrosive gas (Cl2, NH3, SO2, NOX, etc.). 

- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. 

This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020) 

- After the packing opened, the product shall be stored at <30 °C / <60 %RH and the product shall be used within 168 hours. 

- When the color of the indicator in the packing changed, the product shall be baked before soldering. 

   - ο **Baking condition:** 125 +5/-0 °C, 24 hours, 1 time 

The products must be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) is not heat-resistant. 

## 14.1 Handling Conditions 

Be careful in handling or transporting products because excessive stress or mechanical shock may break products. 

Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bare hands that may result in poor solder ability and destroy by static electrical charge. 

## 14.2 Standard PCB Design (Land Pattern and Dimensions) 

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. 

The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 

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## 14.3 Notice for Chip Placer 

When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from such damages, make sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. 

## 14.4 Soldering Conditions 

The recommendation conditions of soldering are as shown in **Figure 11** . 

Soldering must be carried out by the above-mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other soldering conditions. 

**Figure 11:  Reflow Soldering Standard Conditions (Example)** 

**==> picture [349 x 227] intentionally omitted <==**

**----- Start of picture text -----**<br>
Within 10 s<br>250 °C  >< Tpeak-5°C<br>220 °C<br>\ Cooling down<br>\<br>\ Slowly  XN<br>180 °C  N x NN<br>s<br>150 °C<br>Pre-heating<br>time(s)<br>Within 120 s  Within 60 s<br>**----- End of picture text -----**<br>


Please use the reflow within 2 times. 

Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 

## 14.5 Cleaning 

Since this Product is Moisture Sensitive, any cleaning is not recommended. If any cleaning process is done the customer is responsible for any issues or failures caused by the cleaning process. 

## 14.6 Operational Environment Conditions 

Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity, and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the 

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following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. 

- In an atmosphere containing corrosive gas (Cl2, NH3, SOX, NOX etc.). 

- In an atmosphere containing combustible and volatile gases. 

- Dusty place. 

- Direct sunlight place. 

- Water splashing place. 

- Humid place where water condenses. 

- Freezing place. 

If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. 

As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. 

## 15 Preconditions to Use Our Products 

PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. 

Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. 

All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. 

Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. 

WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. 

You agree that you will use any and all software or program code (including but not limited to hcd, firmware, nvram, and blob) we may provide or to be embedded into our product (“Software”) provided that you use the Software bundled with our product. YOU AGREE THAT THE SOFTWARE SHALL BE PROVIDED TO YOU “AS IS” BASIS, MURATA MAKES NO REPRESENTATIONS OR WARRANTIES THAT THE SOFTWARE IS ERROR-FREE OR WILL OPERATE WITHOUT INTERRUPTION. AND MORE, MURATA MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WITH RESPECT TO THE SOFTWARE. MURATA EXPRESSLY DISCLAIM ANY AND ALL WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE NOR THE WARRANTY OF TITLE OR NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. 

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Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. 

Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS. 

- Aircraft equipment. 

- Aerospace equipment. 

- Undersea equipment. 

- Power plant control equipment. 

- Medical equipment. 

- Transportation equipment (vehicles, trains, ships, elevator, etc.). 

- Traffic signal equipment. 

- Burning / explosion control equipment. 

- Disaster prevention / crime prevention equipment. 

- Application of similar complexity and/ or reliability requirements to the applications listed in the above. 

Even in the unlikely event that an abnormality or malfunction occurs in this product under operating conditions that conform to the specifications, be sure to add an appropriate fail-safe function to the system to prevent secondary accidents. 

We expressly prohibit you from analyzing, breaking, Reverse-Engineering, remodeling altering, and reproducing our product.  Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. 

We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. 

Please do not use our products, our technical information and other  data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc. 

Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. 

Customer acknowledges that Murata will, if requested by you, conduct a failure analysis for defect or alleged defect of Products only at the level required for consumer grade Products, and thus such analysis may not always be available or be in accordance with your request (for example, in cases where the defect was caused by components in Products supplied to Murata from a third party). 

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Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. 

When you are not able to return the signed version of specification sheet or approval sheet within 90 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. 

Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. 

We reject any liability or product warranty for engineering samples. 

In particular we disclaim liability for damages caused by 

- The use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you, 

- Deviation or lapse in function of engineering sample, 

- Improper use of engineering samples. 

We disclaim any liability for consequential and incidental damages. 

This Precondition to Use Our Products stipulated in this datasheet can only be modified, amended or altered by documents that explicitly reflect the mutual consent of both parties (including instances where one party explicitly indicates its acceptance of terms provided by the other party through clickthrough agreements). 

If you can’t agree the above contents, you should inquire our sales. 

## 16 References 

- 16.1 RW610 Wireless MCU with Integrated Wi-Fi 6 and Bluetooth Low Energy 5.4 Product data sheet, Rev. 7, 6 February 2024, NXP 

## 16.2 Type 2FR EVK Schematic, Murata 

- 16.3 Type 2FR EVK BOM, Murata 

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Type 2FP Hostless Wi-Fi 6 + Bluetooth LE 5.4 Dual-Radio Module Datasheet 

## Revision History 

|**Revision**|**Date**|**Author**|**Change Description**|
|---|---|---|---|
|1 (A)|September 20,<br>2024|TCF|Initial Release|
|2|Mar 17, 2025|YF|Updated following items:<br>•<br>Changed Revision rule<br>•<br>Updated section 2, Key Features (Added FIT,<br>Security)<br>•<br>Updated Figure 3 Structure image and warning.|
|2.1|April 29, 2025|YF|Updated the regulatory certificate information.<br>Correct spelling in block diagram. Updated Table 4: Radio<br>Certification Information,removed emptycolumn.|



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Copyright © Murata Manufacturing Co., Ltd. All rights reserved. The information and content in this document are provided “as-is” with no warranties of any kind and are for informational purpose only. Data and information have been carefully checked and are believed to be accurate; however, no liability or responsibility for any errors, omissions, or inaccuracies is assumed. 

Wi-Fi[®] is a registered trademark of Wi-Fi Alliance. The Bluetooth[®] word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. Other brand and product names are trademarks or registered trademarks of their respective owners. 

Specifications are subject to change without notice. 

©2024 by Murata Manufacturing Co., Ltd. ● May 22, 2025 ● SP-ZZ2FP ● Rev. 2.1 ● www.murata.com 

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