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LBA110
SOLID STATE RELAY
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: IXYS SEMICONDUCTOR
- Product type: MOSFET Solid State Relays
- Contact Form:SPST-NO (1 Form A), SPST-NC (1 Form B); Load Type:AC / DC; Load Voltage Max:350V; Load Current:120mA; MOSFET Relay Package Style:DIP-8; Relay Mounting:Through Hole; Rel 31M8476
- SVHC: No SVHC (17-Jan-2023)
- Load Type: AC / DC
- Contact Form: SPST-NO (1 Form A), SPST-NC (1 Form B)
- Load Current: 120mA
- Product Range: OptoMOS Series
- Relay Mounting: Through Hole
- Relay Terminals: PC Pin
- Load Voltage Max: 350V
- Isolation Voltage: 3.75kV
- I/O Capacitance Typ: 3pF
- On State Resistance Max: 35ohm
- MOSFET Relay Package Style: DIP-8
- Off State Leakage Current Max: 1µA
| Delivery and price | |
|---|---|
| Units per pack | 500 |
| Price | 3.11 € |
| Current stock | 10+ |
| Lead time | 30 days |
> I CIXYS NTEGRATED CIRCUITS DIVISION
**LBA110 Dual Pole OptoMOS[®] Relay**
**Parameter Ratings Units** Blocking Voltage 350 VP Load Current 120 mArms / mADC On-Resistance (max) 35 ~~—~~
## **Features**
- 3750Vrms Input/Output Isolation
- 100% Solid State
- Low Drive Power Requirements (TTL/CMOS Compatible)
- Arc-Free With No Snubbing Circuits
- FCC Compatible
- VDE Compatible
- No EMI/RFI Generation
- Machine Insertable, Wave Solderable
## **Applications**
- Telecommunications
- Telecom Switching
- Tip/Ring Circuits
- Modem Switching (Laptop, Notebook, Pocket Size)
- Hook Switch
- Dial Pulsing
- Ground Start
## **Description**
LBA110 comprises two independent 350V, 120mA, 35 solid state relays: one single-pole, normally open (1-Form-A) relay and one single-pole, normally closed (1-Form-B) relay.
LBA110 is designed to provide an ideal solution where a complementary Form-A/Form-B relay pair is required.
## **Approvals**
- UL Recognized Component: File E76270
- CSA Certified Component: Certificate 1175739
- EN/IEC 60950-1 Certified Component
- TUV Certificate B 09 07 49410 004
## **Ordering Information**
|**Part #**|**Description**|
|---|---|
|LBA110|8-Pin DIP (50/Tube)|
|LBA110S|8-Pin Surface Mount (50/Tube)|
|LBA110STR|8-Pin Surface Mount (1,000/Reel)|
|LBA110P|8-Pin Flat Pack (50/Tube)|
|LBA110PTR|8-Pin Flat Pack (1,000/Reel)|
- Ringing Injection
- Instrumentation
- Multiplexers
- Data Acquisition
## **Pin Configuration**
- Electronic Switching
- I/O Subsystems
- Meters (Watt-Hour, Water, Gas)
- Medical Equipment-Patient/Equipment Isolation
- Security
- Aerospace
+ Control - Normally Closed – Control - Normally Closed + Control - Normally Open – Control - Normally Open
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1 8<br>2 7 Normally Closed Pole<br>3 6<br>Normally Open Pole<br>4 5<br>**----- End of picture text -----**<br>
- Industrial Controls
## **Switching Characteristics of Switching Characteristics of Normally Open Devices Normally Closed Devices**
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Form-A Form-B<br>IF IF<br>90% ILOAD 90%<br>ILOAD 10% 10%<br>ton toff toff ton<br>**----- End of picture text -----**<br>
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DS-LBA110-R09
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**www.ixysic.com**
**LBA110**
INTEGRATED CIRCUITS DIVISION
## **Absolute Maximum Ratings @ 25ºC**
|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|Blocking Voltage|350|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak (10ms)|50|mA|
||1|A|
|Input Power Dissipation1|150|mW|
|Total Power Dissipation2|800|mW|
|Isolation Voltage, Input to Output|3750|Vrms|
|Operational Temperature|-40 to +85|°C|
|Storage Temperature|-40 to +125|°C|
_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
## **Electrical Characteristics @ 25ºC**
|**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**<br>~~ee~~|||||||
|Load Current<br>Continuous1<br>Peak<br>~~ee~~|-<br>~~ee~~|IL<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|120<br>~~ee~~|mArms/ mADC<br>~~ee~~|
||t = 10ms<br>~~ee~~|ILPK<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|±350<br>~~ee~~|mAP<br>~~ee~~|
|On-resistance<br>~~ee~~|IL=120mA<br>~~ee~~|RON<br>~~ee~~|-<br>~~ee~~|25<br>~~ee~~|35<br>~~ee~~|<br>~~ee~~|
|Off-State Leakage Current<br>~~es~~|VL=350VP<br>~~es~~|ILEAK<br>~~es~~|-<br>~~es~~|-<br>~~es~~|1<br>~~es~~|A<br>~~es~~|
|Switching Speeds<br>Turn-On<br>Turn-Off<br>~~es~~|IF=5mA, VL=10V<br>~~es~~|ton<br>~~es~~|-<br>~~es~~|-<br>~~es~~|3<br>~~es~~|ms<br>~~es~~|
|||toff<br>~~es~~|-<br>~~es~~|-<br>~~es~~|3<br>~~es~~||
|Output Capacitance|VL=50V, f=1MHz|COUT|-|25|-|pF|
|**Input Characteristics**|||||||
|Input Control Current to Activate|IL=120mA|IF|-|-|2|mA|
|Input Control Current to Deactivate|-|IF|0.4|0.7|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.2|1.4|V|
|Reverse Input Current|VR=5V|IR|-|-|10|A|
|**Common Characteristics**|||||||
|Input to Output Capacitance|-|CI/O|-|3|-|pF|
1 If both poles operate the load current must be derated so as not to exceed the package power dissipation value.
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**www.ixysic.com**
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all INTEGRATED CIRCUITS DIVISION **LBA110** ~~a~~
## **Form-A/Form-B PERFORMANCE DATA @25ºC (Unless Otherwise Noted)***
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Typical LED Forward Voltage Drop Typical LED Forward Voltage Drop<br>(N=50, IF=5mA) vs. Temperature<br>35 1.8<br>30<br>1.6<br>RT | | | tt |<br>25<br>1.4<br>20 SSSSEEEn<br>15 1.2 SS IIFF=50mA=30mA<br>10 IF=20mA<br>5 1.0 Pt [DSSS] IIFF=10mA=5mA<br>0 0.8 PL [ELLE]<br>1.17 1.19 1.21 1.23 1.25 -40 -20 0 20 40 60 80 100 120<br>LED Forward Voltage Drop (V) Temperature (ºC)<br>Device Count (N)<br>LED Forward Voltage Drop (V)<br>**----- End of picture text -----**<br>
## **Form-A PERFORMANCE DATA @25ºC (Unless Otherwise Noted)***
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Form-A Form-A Form-A<br>Typical Turn-On Time Typical Turn-Off Time Typical On-Resistance Distribution<br>(N=50, IF=5mA, IL=120mADC) (N=50, IF=5mA, IL=120mADC) (N=50, IF=5mA, IL=120mADC)<br>25 25 35<br>20 20 TTDI) 30 Pee<br>25<br>15 15 Soe (§ 20 $<br>10 10 = "i 15 eeeHE<br>10<br>5 5<br>0 0 ZhllklhdlhhlhLeHann 50 #$#$£éifsFennEHHs<br>0.45 0.75 1.05 1.35 1.65 0.12 0.20 0.28 0.36 0.44 0.52 0.60 19.5 20.5 21.5 22.5 23.5 24.5 25.5<br>Turn-On Time (ms) Turn-Off Time (ms) On-Resistance ( )<br>Form-A Form-A Form-A<br>Typical IF for Switch Operation Typical IF for Switch Dropout Typical Blocking Voltage Distribution<br>(N=50, IL=120mADC) (N=50, IL=120mADC) (N=50)<br>25 25 35<br>30<br>20 20<br>PTET TT?) 25 -ECLCLLLL,-eS<br>15 15 ee 20 eee<br>10 10 ||wie 15<br>10<br>5 5 a | lUC ULLeg<br>0 0 Bane|| ae| 50 aaos|| a<br>0.65 0.91 1.17 1.43 1.69 1.95 0.39 0.65 0.91 1.17 1.43 1.69 1.95 400 420 440 460 480 500 520<br>LED Current (mA) LED Current (mA) Blocking Voltage (VP)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>**----- End of picture text -----**<br>
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.
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**www.ixysic.com**
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**LBA110**
INTEGRATED CIRCUITS DIVISION
## **Form-A PERFORMANCE DATA @25ºC (Unless Otherwise Noted)***
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Form-A Form-A Form-A<br>Typical Turn-On Time Typical Turn-Off Time Typical IF for Switch Operation<br>vs. LED Forward Current vs. LED Forward Current vs. Temperature<br>1.0 (IL=120mADC) 0.220 (IL=120mADC) 2.5 (IL=120mADC)<br>0.9 0.215<br>0.8 SO 0.210 2.0<br>0.7 PINT fT fT tt tt 0.205 eeCLL TZ<br>0.6 1.5<br>AEE EEA 0.200 = PE TT [TAT]<br>0.5<br>CAC EEE 0.195 {tt tie 7<br>0.4 1.0<br>0.3 FORE 0.190 ptt pet tf tt Pi |Prttd<br>0.2 = —————— 0.185 7 0.5 pitty]| [|<br>0.1 0.180<br>0 Lt tt tt tt tT tf 0 Ltt PT tT ET tT Tt 0<br>0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50 -40 -20 0 20 40 60 80 100<br>LED Forward Current (mA) LED Forward Current (mA) Temperature (ºC)<br>Form-A Form-A Form-A<br>Typical IF for Switch Dropout Typical Turn-On Time Typical Turn-Off Time<br>vs. Temperature vs. Temperature vs. Temperature<br>2.5 (IL=120mADC) 1.4 (IL=120mADC) 0.40 (IF=5mA, IL=120mADC)<br>1.2 | | [| [| | [ot | 0.35 NRE ft f ft ft ff<br>2.0 1.0 IF=5mA 0.30<br>1.5 0.8 PT | [pr IF=10mA 0.25 }N | ft ft tt<br>ed ee 0.20 ee ee<br>1.0 0.6 = IF=20mA 0.15<br>0.4 == 0.10<br>0.5<br>0.2<br>Lf ft 0.05 ee<br>0 0 PEEP 0 eee<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Form-A Form-A Form-A<br>Typical On-Resistance vs. Temperature Typical Load Current vs. Load Voltage Maximum Load Current<br>60 (IF=5mA, IL=120mADC) 150 (IF=5mA) 180 vs. Temperature<br>160<br>50 CoOOCnT 100 «=e 140<br>40 50 120<br>i oe ee2 pt ttt TAT SS<br>100<br>3020 a -500 8060 IIIFFF=20mA=10mA=5mA<br>Peer Ae 40 eee<br>10 Sc -100 2<br>20<br>0 -150 0<br>-40 Ft -20 ttt 0 20 40 60 tt 80 100 -4 | -3 i7T -2 -1 tT 0 tt 1 2 Yt 3 4 -40 a -20 0 20 40 60 80 100 120<br>Temperature (ºC) Load Voltage (V) Temperature (ºC)<br>Form-A Form-A<br>Typical Blocking Voltage Typical Leakage vs. Temperature<br>vs. Temperature Measured Across Pins 5&6 Energy Rating Curve<br>480 0.016 1.0<br>0.014 0.9<br>470 TP 0.8 iN<br>0.012<br>460 SttgA OO 0.7<br>0.010 0.6<br>tt Seer I<br>450 0.008 0.5<br>SERS 0.006 GREER 0.4 ERIE<br>440 0.3<br>pt ett tt 0.004 TST 1 00 DG SU TY<br>0.2<br>430<br>so 0.002 cee 0.1<br>420 “i | i | i tf 0 Cee 0 EC<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 10μs 100μs 1ms 10ms 100ms 1s 10s 100s<br>Temperature (ºC) Temperature (ºC) Time<br>Turn-On Time (ms) Turn-Off Time (ms) LED Current (mA)<br>LED Current (mA) Turn-On Time (ms) Turn-Off Time (ms)<br>On-Resistance () Load Current (mA) Load Current (mA)<br>)P<br>Leakage (µA)<br>Blocking Voltage (V Load Current (A)<br>**----- End of picture text -----**<br>
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.
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**www.ixysic.com**
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all INTEGRATED CIRCUITS DIVISION **LBA110** ~~eee~~
## **Form-B PERFORMANCE DATA @25ºC (Unless Otherwise Noted)***
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Form-B Form-B Form-B<br>Typical Turn-On Time Typical Turn-Off Time Typical On-Resistance Distribution<br>(N=50, IF=5mA, IL=120mADC) (N=50, IF=5mA, IL=120mADC) (N=50, IF=5mA, IL=120mADC)<br>25 25 25<br>20 ee ee ie 20 ee ee ee 20<br>15105 eeaeBall| 1510 e 5 eee! fae | | ee| eeee 15105 ee |l|lee| eeoe<br>0 /IHEREE | 0 HEE || | 0 6OhUrRE<br>0.25 0.35 0.45 0.55 0.65 0.75 0.24 0.40 0.56 0.72 0.88 1.04 25.5 26.5 27.5 28.5 29.5 30.5 31.5<br>Turn-On Time (ms) Turn-Off Time (ms) On-Resistance ( )<br>Form-B Form-B Form-B<br>Typical IF for Switch Operation Typical IF for Switch Dropout Typical Blocking Voltage Distribution<br>(N=50, IL=120mADC) (N=50, IL=120mADC) (N=50)<br>25 25 30<br>20 ee 20 eee 25 eee<br>20<br>15 Pi eT [eee] ey hE 15 TT 15 Re<br>10 10<br>50 SE"BeasHitt| 50 {Setasén § $i | es 1050 ~~ 6=©6—6h—eee 8aSee<br>0.7 0.9 1.1 1.3 1.5 1.7 1.9 0.7 0.9 1.1 1.3 1.5 1.7 1.9 365 375 385 395 405 415 425<br>LED Current (mA) LED Current (mA) Blocking Voltage (VP)<br>Form-B Form-B Form-B<br>Typical Turn-On Time Typical Turn-Off Time Typical IF for Switch Operation<br>vs. LED Forward Current vs. LED Forward Current vs. Temperature<br>0.42 (IL=120mADC) 0.7 (IL=120mADC) 3.0 (IL=120mADC)<br>0.41 0.6 2.5<br>0.40 0.5<br>ooo RE 2.0 EEE<br>0.39<br>0.4<br>0.38 eevee =A 1.5 ere<br>0.3<br>0.37 TOE LIN | Ty tty ae<br>1.0<br>0.2<br>0.36<br>0.35 SA 0.1 eeeHH ESS 0.5 ee<br>0.34 a 0 FLEE EEEEe ey 0 Ft} tt i tf<br>0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50 -40 -20 0 20 40 60 80 100<br>LED Forward Current (mA) LED Forward Current (mA) Temperature (ºC)<br>Form-B Form-B Form-B<br>Typical IF for Switch Dropout Typical Turn-On Time Typical Turn-Off Time<br>vs. Temperature vs. Temperature vs. Temperature<br>3.0 (IL=120mADC) 0.7 (IF=5mA, IL=120mADC) 1.2 (IL=120mADC)<br>2.5 P| | | | dT | 0.6 Nee 1.0 Ft; | | dT dT IF=5mA<br>0.5<br>2.0 0.8<br>1.5 Ceerer = 0.4 REAEEERR 0.6 poor IF=10mA<br>ee 0.3<br>1.0 0.4<br>0.2 IF=20mA<br>0.5 0.1 0.2<br>0 Ft tT tT dt dt | 0 Ft trer ry 0 —rrrt | | |<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>Turn-On Time (ms) Turn-Off Time (ms) LED Current (mA)<br>LED Current (mA) Turn-On Time (ms) Turn-Off Time (ms)<br>**----- End of picture text -----**<br>
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.
R09
**www.ixysic.com**
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eT INTEGRATED CIRCUITS DIVISION **LBA110** ~~Fe~~
## **Form-B PERFORMANCE DATA @25ºC (Unless Otherwise Noted)***
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Form-B Form-B Form-B<br>Typical On-Resistance vs. Temperature Typical Load Current vs. Load Voltage Maximum Load Current vs. Temperature<br>60 (IF=5mA, IL=120mADC) 150 (IF=5mA) 180 (IF=0mA)<br>160<br>50 100<br>es Pt | | tT ft ft P| | | tt] 140 eee<br>40 | | | | | [| | | 50 Pt | | | YY 120 se<br>100<br>30 0<br>80<br>20 -—+7T [| |] | | -50 Pt pee 60 es<br>40<br>10 -100<br>Pt | ft tf ft PiA Lt 20 be} pe<br>0 Ft ttt et ft -150 7 Tt tt tt 0 es<br>-40 -20 0 20 40 60 80 100 -4 -3 -2 -1 0 1 2 3 4 -40 -20 0 20 40 60 80 100 120<br>Temperature (ºC) Load Voltage (V) Temperature (ºC)<br>Form-B<br>Form-B Typical Leakage vs. Temperature<br>Typical Blocking Voltage Measured Across Pins 5&6<br>vs. Temperature (IF=5mA) Energy Rating Curve<br>415 0.016 1.0<br>410 Tol bo 0.014 ToT LLL bd 0.9 NC<br>0.8<br>405 0.012<br>0.7<br>400 |et| | | pet ft 0.010 AA4 0.6 CONINCONCCCCCCC<br>395 | | | |e | | 0.008 | | | | by | 0.5 CO<br>390 SSeceee) 0.006 Fee 0.40.3<br>385 0.004<br>0.2<br>380 a 0.002 ce 0.1 a a<br>375 “lt | ft | ft ft 0 | | | | | [ | | 0 0 00<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 10μs 100μs 1ms 10ms 100ms 1s 10s 100s<br>Temperature (ºC) Temperature (ºC) Time<br>)<br>On-Resistance ( Load Current (mA) Load Current (mA)<br>)P<br>Leakage (µA)<br>Blocking Voltage (V Load Current (A)<br>**----- End of picture text -----**<br>
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.
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**www.ixysic.com**
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**LBA110**
INTEGRATED CIRCUITS DIVISION
## **Manufacturing Information**
## **Moisture Sensitivity**
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to ) the latest version of the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a **Moisture Sensitivity Level (MSL) rating** as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** .
|**Device**<br>~~SS~~|**Moisture Sensitivity Level (MSL) Rating**<br>~~SS~~|
|---|---|
|LBA110 / LBA110S / LBA110P<br>~~SS~~|MSL 1<br>~~SS~~|
## **ESD Sensitivity**
This product is **ESD Sensitive** , and should be handled according to the industry standard **JESD-625** .
## **Reflow Profile**
This product has a maximum body temperature and time rating as shown below. All other guidelines of **J-STD-020** must be observed.
|**Device**<br>~~a~~|**Maximum Temperature x Time**<br>~~a~~|
|---|---|
|LBA110 / LBA110S<br>~~a~~|250ºC for 30 seconds<br>~~a~~|
|LBA110P<br>~~a~~|260ºC for 30 seconds<br>~~a~~|
## **Board Wash**
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.
## Pb e3 © ors
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**www.ixysic.com**
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**LBA110**
INTEGRATED CIRCUITS DIVISION
## **MECHANICAL DIMENSIONS**
## **LBA110**
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9.652 ± 0.381 7.620 ± 0.254 PCB Hole Pattern<br>2.540 ± 0.127 (0.380 ± 0.015) (0.300 ± 0.010)<br>(0.100 ± 0.005) 8-0.800 DIA. 2.540 ± 0.127<br>(8-0.031 DIA.) (0.100 ± 0.005)<br>9.144 ± 0.508<br>6.350 ± 0.127 (0.360 ± 0.020)<br>(0.250 ± 0.005)<br>6.350 ± 0.127<br>(0.250 ± 0.005)<br>Pin 1 3.302 ± 0.051<br>0.457 ± 0.076 (0.130 ± 0.002)<br>(0.018 ± 0.003) 7.239 TYP. 7.620 ± 0.127<br>(0.285) (0.300 ± 0.005)<br>7.620 ± 0.127<br>8 4.064 TYP(0.160) , 0.254 ± 0.0127 toy (0.300 ± 0.005)<br>(0.010 ± 0.0005)<br>Dimensions<br>0.813 ± 0.102 mm<br>(0.032 ± 0.004) (inches)<br>f re _<br>9.652 ± 0.381 PCB Land Pattern<br>(0.380 ± 0.015) 0.635 ± 0.127<br>2.540 ± 0.127 3.302 ± 0.051 (0.025 ± 0.005) 2.54<br>(0.100 ± 0.005)<br>(0.130 ± 0.002) (0.10)<br>6.350 ± 0.127 9.525 ± 0.254<br>(0.250 ± 0.005) (0.375 ± 0.010) 1.65 8.90<br>7.620 ± 0.254 (0.0649) (0.3503)<br>Pin 1 (0.300 ± 0.010)<br>oo 0.457 ± 0.076 i 0.254 ± 0.0127<br>(0.018 ± 0.003) as (0.010 ± 0.0005) me 0.65 !<br>(0.0255)<br>4.445 ± 0.127<br>(0.175 ± 0.005)<br>Dimensions<br>0.813 ± 0.102 mm<br>Po (0.032 ± 0.004) = (inches)<br>**----- End of picture text -----**<br>
## **LBA110S**
## **LBA110P**
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2.286 MAX. PCB Land Pattern<br>(0.090 MAX.)<br>2.540 ± 0.127 0 MIN / 0.102 MAX<br>(0.100 ± 0.005) (0 MIN / 0.004 MAX) 2.54<br>(0.10)<br>(0.250 ± 0.005)6.350 ± 0.127 (0.370 ± 0.005)9.398 ± 0.127 (0.300 ± 0.010)7.620 ± 0.254 (0.025 ± 0.005)0.635 ± 0.127<br>8.70<br>1 Pin 1 0.203 ± 0.013 ae s (0.0610)1.55 (0.3425)<br>9.652 ± 0.381 (0.008 ± 0.0005)<br>(0.380 ± 0.015)<br>0.65<br>2.159 ± 0.025 (0.0255)<br>(0.085 ± 0.001)<br>0.457 ± 0.076<br>(0.018 ± 0.003) Dimensions<br>0.864 ± 0.120 mm<br>r= _<br>(0.034 ± 0.004) (inches)<br>**----- End of picture text -----**<br>
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**www.ixysic.com**
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**LBA110**
INTEGRATED CIRCUITS DIVISION
**MECHANICAL DIMENSIONS**
**LBA110STR Tape & Reel**
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330.2 DIA.<br>(13.00 DIA.)<br>Top Cover W=16.00<br>Tape Thickness Bo=10.30 (0.63)<br>0.102 MAX. (0.406)<br>(0.004 MAX.)<br>Ao=10.30 P=12.00<br>K0 =4.90 (0.406) (0.472)<br>(0.193)<br>K1 =4.20 User Direction of Feed<br>Embossed Carrier (0.165) Dimensions<br>mm<br>iee NOTES: (inches)<br>1. Dimensions carry tolerances of EIA Standard 481-2<br>Embossment 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2<br>LBA110PTR Tape & Reel<br>2.00 4.00<br>330.2 DIA. (0.079) (0.157)<br>(13.00 DIA.)<br>7.50 W = 16.00<br>(0.295) (0.63)<br>Top Cover<br>Tape Thickness Bo = 10.30<br>0.102 MAX.<br>(0.406)<br>(0.004 MAX.)<br>P = 12.00 Ao = 10.30<br>K0 = 2.70 (0.472) (0.406)<br>(0.106)<br>Dimensions<br>Embossed Carrier K1 (0.079)= 2.00 User Direction of Feed mm<br>(inches)<br>u n ne NOTES:<br>1. All dimensions carry tolerances of EIA Standard 481-2<br>Embossment 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2<br>**----- End of picture text -----**<br>
## **For additional information please visit our website at: www.ixysic.com**
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-LBA110-R09 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS[®] is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA.
**9**
12/22/2012
Updated at April 22, 2026
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