LAA110

> I OIXYS NTEGRATED CIRCUITS DIVISION @ 

**LAA110L Dual Single-Pole, Current-Limited OptoMOS[®] Relay** 

**Parameter Ratings Units** Blocking Voltage 350 VP Load Current 120 mArms / mADC On-Resistance (max) 35  ~~——-~~ 

## **Features** 

- 3750Vrms Input/Output Isolation 

- Current Limiting Device 

- Low Drive Power Requirements (TTL/CMOS Compatible) 

- No Moving Parts 

- High Reliability 

- Arc-Free With No Snubbing Circuits 

- No EMI/RFI Generation 

- Machine Insertable, Wave Solderable 

- Surface Mount and Tape & Reel Versions Available 

- Small 8-Pin Package 

## **Description** 

LAA110L is a dual normally open (1-Form-A) Solid State Relay that has two independently controlled, optically coupled MOSFET switches with an additional current limiting circuit. The MOSFET switches and photovoltaic die use optically coupled MOSFET technology to provide 3750Vrms of input/output isolation. 

The optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. 

This dual switch OptoMOS relay provides a more compact design solution than discrete single-pole relays in a variety of applications, and saves board space by incorporating both switches in a single 8-Pin package. 

## **Approvals** 

## **Applications** 

- Telecom Switching 

- Tip/Ring Circuits 

- Modem Switching (Laptop, Notebook, Pocket Size) 

   - UL Recognized Component: File # E76270 

   - CSA Certified Component: Certificate # 1175739 

   - EN/IEC 60950-1 Certified Component: 

   - TUV Certificate B 09 07 49410 004 

- Hook Switch 

- Dial Pulsing 

- Ground Start 

- Ringing Injection 

- Instrumentation 

- Multiplexers 

- Data Acquisition 

- Electronic Switching 

- I/O Subsystems 

## **Ordering Information** 

|**Part #**|**Description**|
|---|---|
|LAA110L|8-Pin DIP (50/Tube)|
|LAA110LS|8-Pin Surface Mount (50/Tube)|
|LAA110LSTR|8-Pin Surface Mount (1,000/Reel)|
|LAA110PL|8-Pin Flat Pack (50/Tube)|
|LAA110PLTR|8-Pin Flat Pack (1,000/Reel)|



- Meters (Watt-Hour, Water, Gas) 

- Medical Equipment-Patient/Equipment Isolation 

- Security 

- Aerospace 

- Industrial Controls 

## **Pin Configuration** 

1 8 + Control - Switch #1 Load - Switch #1 2 7 – Control - Switch #1 Load - Switch #1 3 6 + Control - Switch #2 Load - Switch #2 4 5 – Control - Switch #2 Load - Switch #2 

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Switching Characteristics of<br>Normally Open (Form A) Devices<br>Form-A<br>IF<br>90%<br>ILOAD 10%<br>ton toff<br>Et<br>**----- End of picture text -----**<br>


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DS-LAA110L-R09 

**1** 

**www.ixysic.com** 

**LAA110L** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|Blocking Voltage|350|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak (10ms)|50|mA|
||1|A|
|Input Power Dissipation1|150|mW|
|Total Power Dissipation2|800|mW|
|Isolation Voltage, Input to Output|3750|Vrms|
|Operational Temperature|-40 to +85|°C|
|Storage Temperature|-40 to +125|°C|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

1  Derate linearly 1.33 mW / ºC 

2  Derate linearly 6.67 mW / ºC 

## **Electrical Characteristics @ 25ºC** 

|**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**|||||||
|Load Current, Continuous1|-|IL|-|-|120|mArms/ mADC|
|Load Current Limiting|VL=8V, IF=5mA|ICL|±130|±170|±210|mA|
|On-Resistance2|IL=120mA|RON|-|30|35||
|Off-State Leakage Current|VL=350VP|ILEAK|-|-|1|A|
|Switching Speeds<br>Turn-On<br>Turn-Off|IF=5mA, VL=10V|ton|-|-|3|ms|
|||toff|-|-|3|ms|
|Output Capacitance|VL=50V, f=1MHz|COUT|-|25|-|pF|
|**Input Characteristics**|||||||
|Input Control Current to Activate|IL=120mA|IF|-|-|5|mA|
|Input Control Current to Deactivate|-|-|0.4|0.7|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.2|1.4|V|
|Reverse Input Current|VR=5V|IR|-|-|10|A|
|**Common Characteristics**|||||||
|Input to Output Capacitance|-|CI/O|-|3|-|pF|



1  If both poles operate, then the load current must be derated so that it does not exceed the package power dissipation value. 

2  Measurement taken within one second of on-time. 

R09 

**www.ixysic.com** 

**2** 

**LAA110L** 

INTEGRATED CIRCUITS DIVISION 

## **PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*** 

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Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time<br>(N=50, IF=5mA) (N=50, IF=5mA, IL=120mADC) (N=50, IF=5mA, IL=120mADC)<br>35 25 25<br>30<br>20 fe See 20 ee<br>25<br>20 15 15<br>15 10 SS ee 10<br>10<br>5 a.) ee. 5 l |lc<br>50 0 alt | § 0 85a<br>1.17 1.19 1.21 1.23 1.25 0.15 0.25 0.35 0.45 0.55 0.65 0.75 0.025 0.075 0.125 0.175 0.225<br>LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms)<br>Device Count (N) Device Count (N) Device Count (N)<br>**----- End of picture text -----**<br>


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Typical IF for Switch Operation Typical IF for Switch Dropout Typical On-Resistance Distribution<br>(N=50, IL=120mADC) (N=50, IL=120mADC) (N=50, IF=5mA, IL=120mADC)<br>25 25 35<br>20 TLL) 20 €6oCoaott$C 30 ee<br>25<br>15 oe Seen 15 eee 20 ee<br>10 So“ Sees 10 15<br>10<br>5 2S 5 | eee<br>0 HE.| Seen| 0 Beane| e | ee 50 _ fae| ldeee|<br>0.45 0.75 1.05 1.35 1.65 1.95 2.25 0.45 0.75 1.05 1.35 1.65 1.95 2.25 17.0 17.4 17.8 18.2 18.6 19.0 19.4<br>LED Current (mA) LED Current (mA) On-Resistance ( )<br>Device Count (N) Device Count (N) Device Count (N)<br>**----- End of picture text -----**<br>


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Typical Blocking Voltage Distribution<br>(N=50)<br>35<br>30<br>25 | | | | | [ [|<br>20 | | | | | [ {|<br>15 ae<br>10 | ee<br>5 | | |iiimi || hl<br>0 mn | i Ce<br>376.3 382.8 389.3 395.8 402.3 408.8 415.3<br>Blocking Voltage (VP)<br>Typical Turn-On Time Typical Turn-Off Time<br>Typical LED Forward Voltage Drop vs. LED Forward Current vs. LED Forward Current<br>1.8 vs. Temperature 1.0 (IL=120mADC) 0.35 (IL=120mADC)<br>0.9<br>1.6 PT TT[II] 0.8 FBeSeSeSe[§ €=C 0.30 LEE aoe<br>0.7 0.25<br>1.4 SSEEECCL) 0.6 «6REEEERRER 0.20 OEE<br>0.5<br>1.2 0.4 0.15<br>0.3 0.10<br>1.0 SSS 0.2 AEE eee<br>PTT Tre 0.1 SSSEEEERE = 0.05 BCE EEE<br>0.8 FCEELELE 0 =6ERBESEEES 0 0 CCRRRRRESS<br>-40 -20 0 20 40 60 80 100 120 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50<br>Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA)<br>IIIIIFFFFF=50mA=30mA=20mA=10mA=5mA<br>Device Count (N)<br>Turn-On Time (ms) Turn-Off Time (ms)<br>LED Forward Voltage Drop (V)<br>**----- End of picture text -----**<br>


*The Performance data shown in the graphs above is typical of device performance.  For guaranteed parameters not indicated in the written specifications, please contact our application department. 

R09 

**www.ixysic.com** 

**3** 

all INTEGRATED CIRCUITS DIVISION **LAA110L** ~~Pe~~ 

## **PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*** 

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Typical Turn-On Time Typical Turn-Off Time<br>vs. Temperature vs. Temperature Typical On-Resistance vs. Temperature<br>(IL=120mADC) (IF=5mA, IL=120mADC) (IF=5mA, IL=120mADC)<br>2.0 1.0 60<br>1.8 0.9<br>1.6 SESEEES) 0.8 GEEEESS 50 Goo<br>1.41.21.0 \===== IIFFI=10mA=20mAF=5mA RTLee 0.70.60.5 OOeses a 4030 PtG | | tT ft<br>0.8 0.4<br>0.6 FTP 0.3 es a 20 po | |<br>0.4 0.2 10<br>0.20 SSSSSS TTL 0.10 |SSSS SS 0 ESSPitt | tt ft<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Typical Ivs. TemperatureF for Switch Operation Typical Ivs. TemperatureF for Switch Dropout Typical Load Current vs. Load Voltage<br>3.0 (IL=120mADC) 3.0 (IL=120mADC) 150 (IF=5mA)<br>2.5 Pt | | | fy 2.5 Pt | tT | tf 100 P| [ | | fo<br>2.0 2.0 50<br>1.5 1.5 0<br>Pt | | PA || | | Tr || [| [Pr]][|]<br>1.0 1.0 -50<br>0.5 Fr] [| [| [| f 0.5 —+— | | | -100 Lar | | | |<br>0 Pt | | tt ft 0 Pit; tt tt -150 Ft tT ft | ft<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -3 -2 -1 0 1 2 3<br>Temperature (ºC) Temperature (ºC) Load Voltage (V)<br>Maximum Load Current Typical Blocking Voltage  Typical Leakage vs. Temperature<br>vs. Temperature vs. Temperature Measured across Pins 5&6, 7&8<br>180 420 16<br>160 410 14<br>140 | | f f | | { ft | 400 ToD as 12 Ff fT f tlht Uy<br>120 a 7 10 ee 4<br>100 Poors 390<br>8060 a a IIFF=10mA=5mA C O 380370 EoeeosCee 86 ee<br>40 Ree a 4<br>20 es 360 La | | | [| | | 2 i<br>0 ee et | tT ft ft 0 Ft tT tt ht ht<br>-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Typical Current Limiting<br>vs. Temperature<br>(IF=5mA)<br>350<br>300 | | | | | ft ft<br>250<br>ef ft tt<br>200<br>p [ees | tt<br>150<br>pot ft PAT |<br>100 Ft | | | fo<br>50 | | | | | ff<br>0 | [tf | | | | tf<br>-40 -20 0 20 40 60 80 100<br>Temperature (ºC)<br>)<br>Turn-On Time (ms) Turn-Off Time (ms) On-Resistance (<br>LED Current (mA) LED Current (mA) Load Current (mA)<br>)P<br>Leakage (nA)<br>Load Current (mA) Blocking Voltage (V<br>Current (mA)<br>**----- End of picture text -----**<br>


*The Performance data shown in the graphs above is typical of device performance.  For guaranteed parameters not indicated in the written specifications, please contact our application department. 

R09 

**www.ixysic.com** 

**4** 

**LAA110L** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to ) the latest version of the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a **Moisture Sensitivity Level (MSL) rating** as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~—_—~~|**Moisture Sensitivity Level (MSL) Rating**<br>~~—_—~~|
|---|---|
|LAA110L / LAA110LS / LAA110PL<br>~~—_—~~|MSL 1<br>~~—_—~~|



## **ESD Sensitivity** 

This product is **ESD Sensitive** , and should be handled according to the industry standard **JESD-625** . 

## **Reflow Profile** 

This product has a maximum body temperature and time rating as shown below. All other guidelines of **J-STD-020** must be observed. 

|**Device**<br>~~a~~|**Maximum Temperature x Time**<br>~~a~~|
|---|---|
|LAA110L / LAA110LS<br>~~a~~|250ºC for 30 seconds<br>~~a~~|
|LAA110PL<br>~~a~~|260ºC for 30 seconds<br>~~a~~|



## **Board Wash** 

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. 

## Pb e3 © ors 

R09 

**www.ixysic.com** 

**5** 

**LAA110L** 

INTEGRATED CIRCUITS DIVISION 

## **MECHANICAL DIMENSIONS** 

## **LAA110L** 

9.652 ± 0.381 7.620 ± 0.254 **PCB Hole Pattern** 2.540 ± 0.127 (0.380 ± 0.015) (0.300 ± 0.010) (0.100 ± 0.005) 8-0.800 DIA. 2.540 ± 0.127 (8-0.031 DIA.) (0.100 ± 0.005) 9.144 ± 0.508 6.350 ± 0.127 (0.360 ± 0.020) (0.250 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 3.302 ± 0.051 0.457 ± 0.076 (0.130 ± 0.002) (0.018 ± 0.003) 7.239 TYP. 7.620 ± 0.127 (0.285) (0.300 ± 0.005) 7.620 ± 0.127 f 4.064 TYP(0.160) ~~Bs~~ 0.254 ± 0.0127 ~~tn~~ (0.300 ± 0.005) (0.010 ± 0.0005) Dimensions 0.813 ± 0.102 mm ~~ui~~ (0.032 ± 0.004) 7 (inches) 9.652 ± 0.381 **PCB Land Pattern** (0.380 ± 0.015) 0.635 ± 0.127 2.540 ± 0.127 3.302 ± 0.051 (0.025 ± 0.005) 2.54 (0.100 ± 0.005) (0.130 ± 0.002) (0.10) 6.350 ± 0.127 9.525 ± 0.254 (0.250 ± 0.005) (0.375 ± 0.010) 1.65 8.90 - (0.0649) (0.3503) 7.620 ± 0.254 Pin 1 (0.300 ± 0.010) 0.457 ± 0.076 0.254 ± 0.0127 (0.018 ± 0.003) ~~a~~ (0.010 ± 0.0005) ~~ro 0~~ 0.65 o ~~o~~ (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions 0.813 ± 0.102 mm ~~7f~~ (0.032 ± 0.004) - (inches) 2.286 MAX. **PCB Land Pattern** (0.090 MAX.) 2.540 ± 0.127 0 MIN / 0.102 MAX (0.100 ± 0.005) ~~e~~ L (0 MIN / 0.004 MAX) 2.54 (0.250 ± 0.005)6.350 ± 0.127 ~~=~~ (0.370 ± 0.005)9.398 ± 0.127 (0.300 ± 0.010)7.620 ± 0.254 (0.025 ± 0.005)0.635 ± 0.127 (0.10) 8.70 Pin 1 ~~, |~~ 0.203 ± 0.013 a ~~t~~ (0.0610)1.55 - H ~~t~~ (0.3425) ~~el~~ 9.652 ± 0.381 (0.008 ± 0.0005) t ~~t —~~ (0.380 ± 0.015) ~~1”~~ 0.65 0 0 2.159 ± 0.025 (0.0255) (0.085 ± 0.001) a ~~l~~ tT 0.457 ± 0.076 (0.018 ± 0.003) Dimensions 0.864 ± 0.120 mm ~~re~~ 7 (0.034 ± 0.004) (inches) 

## **LAA110LS** 

## **LAA110PL** 

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**6** 

**LAA110L** 

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INTEGRATED CIRCUITS DIVISION<br>MECHANICAL DIMENSIONS<br>LAA110LSTR Tape & Reel<br>330.2 DIA.<br>(13.00 DIA.)<br>Top Cover W=16.00<br>Tape Thickness Bo=10.30 (0.63)<br>0.102 MAX. (0.406)<br>(0.004 MAX.)<br>Ao=10.30 P=12.00<br>K0 =4.90 (0.406) (0.472)<br>(0.193)<br>K1 =4.20 User Direction of Feed<br>Embossed Carrier (0.165) Dimensions<br>mm<br>AFee NOTES: (inches)<br>1. Dimensions carry tolerances of EIA Standard 481-2<br>Embossment 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2<br>LAA110PLTR Tape & Reel<br>2.00 4.00<br>330.2 DIA. (0.079) (0.157)<br>(13.00 DIA.)<br>7.50 W = 16.00<br>(0.295) (0.63)<br>Top Cover<br>Tape Thickness Bo = 10.30<br>0.102 MAX.<br>(0.406)<br>(0.004 MAX.)<br>P = 12.00 Ao = 10.30<br>K0 = 2.70 (0.472) (0.406)<br>(0.106)<br>Dimensions<br>Embossed Carrier K1 (0.079)= 2.00 User Direction of Feed mm<br>(inches)<br>d y Cane NOTES:<br>1. All dimensions carry tolerances of EIA Standard 481-2<br>Embossment 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2<br>**----- End of picture text -----**<br>


## **For additional information please visit our website at: www.ixysic.com** 

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice.  Neither circuit patent licenses nor indemnity are expressed or implied.  Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. 

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage.  IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 

Specification:  DS-LAA110L-R09 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS[®] is a registered trademark of IXYS Integrated Circuits Division All rights reserved.  Printed in USA. 

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