LA.02

## **SPECIFICATION** 

Part No. : **LA.02** Model : 2.4GHz Embedded Loop Chip Antenna Description :  1dBi 2400MHz to 2500MHz Wi-Fi/Bluetooth/Bluetooth LE/ ZigBee Features : 8*2*2mm Ceramic Antenna Surface Mount Low Profile Peak gain 1dBi 50 Ohm Impedance Components can be mounted on opposite side of board to the antenna 

RoHS  

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## **1. Introduction** 

The LA.02 is a 2.4GHz embedded loop chip antenna that has best in class efficiency, 66% on center frequency. It’s a miniature SMD ceramic component, designed to be mounted directly on the edge of the main device PCB and is suitable especially for very small space requirements for Bluetooth LE, Wi-Fi, 802.11 applications. The LA.02 uses this main PCB ground plane to increase antenna efficiency, requiring minimum ground-clearance around the antenna. The opposite side of the board on which the antenna is mounted does not need ground-clearance, allowing more space for components or signal routing. This antenna is delivered on tape and reel. 

## Typical applications 

- Telematics devices 

- Bluetooth LE Wearables 

- Bluetooth Headsets 

- Hand-held devices when Bluetooth/Wi-Fi functions are needed, e.g., smart phone. 

- IEEE802.11 b/g 

- ZigBee 

- Wireless PCMCIA cards or USB dongle 

Some frequency offset may happen as is normal with antennas embedded devices, so the antenna can be tuned for different PCB sizes and enclosures by simply changing the value of the matching circuit. Please contact your regional Taoglas sales office for support. 

Many module manufacturers specify peak gain limits for any antennas that are to be connected to that module. Those peak gain limits are based on free-space conditions. In practice, the peak gain of an antenna tested in free-space can degrade by at least 1 or 2dBi when put inside a device. So ideally you should go for a slightly higher peak gain antenna than mentioned on the module specification to compensate for this effect, giving you better performance. 

Upon testing of any of our antennas with your device and a selection of appropriate layout, integration technique, or cable, Taoglas can make sure any of our antennas’ peak gain will be below the peak gain limits. Taoglas can then issue a specification and/or report for the selected antenna in your device that will clearly show it complying with the peak gain limits, so you can be assured you are meeting regulatory requirements for that module. 

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For example, a module manufacturer may state that the antenna must have less than 2dBi peak gain, but you don’t need to select an embedded antenna that has a peak gain of less than 2dBi in free-space. This will give you a less optimized solution. It is better to go for a slightly higher free-space peak gain of 3dBi or more if available. Once that antenna gets integrated into your device, performance will degrade below this 2dBi peak gain due to the effects of GND plane, surrounding components, and device housing. If you want to be absolutely sure, contact Taoglas and we will test. Choosing a Taoglas antenna with a higher peak gain than what is specified by the module manufacturer and enlisting our help will ensure you are getting the best performance possible without exceeding the peak gain limits. 

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## **2. Specifications** 

The LA.02 is designed to mount at the center of the edge of an evaluation board that is 80 x 40mm.The antenna performance was measured with the LA.02 mounted on the evaluation board with SMA(F) connector. 

|**No**<br>~~[oo~~|**Parameter**|**Specification***|
|---|---|---|
|1<br>~~[oo~~|Center Frequency|2400-2500MHz|
|2|Dimensions|8*2*2mm|
|3|VSWR|2 max (Center Frequency)|
|4|Polarization|Linear|
|5<br>6|Bandwidth<br>Gain|100MHz min.<br>Peak 1dBi typ.|
|7|Efficiency|66% (Center Frequency)|
|8|Impedance|50|
|**Mechanical**<br>~~Lo~~|||
|9|Dimensions|8*2*2mm|
|10|Material|Ceramic|
|11|Weight|0.11 g|
|**Environmental**|||
|12<br>13<br>14<br>15|Operating Temperature<br>Storage Temperature<br>Temperature Coefficient（τf）<br>Recommended Reel Storage<br>Condition|-40°C+85°C<br>-40°C+105°C<br>020 ppm @-20ºC to +80ºC<br>5°C to 40°C<br>Relative Humidity 20% to 70%|



* The data was measured in a CTIA Authorized Test Lab. 

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**3. Electrical Specification (80*40mm ground plane) 3.1 Return Loss (S11)** . TrTothal : yya A0 \\ ; f f Hh 3 « \J iT ll _LA 20 ~ 2350 2400 2450 2500 **3.2 Efficiency** + ” or a Seeort ae ~ Slat le MN - Je. **|** 7hs. _ **4** iLe.00 **_** LU **a** co **e** sae **_e** e..a. = |3300eeaAA2500 2 2) SPE-15-8-040/B/WY      Page 5 of 20 

**3.3 Peak Gain** 

**3.3 Average Gain** 

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## **4. Radiation Pattern** 

## **4.1 Measurement Setup** 

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## **4.2 2D Radiation Pattern** 

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X<br>0<br>——__<br>~ 30<br>60<br>\<br>Y<br>BP 90 | |<br>|<br>| \ / 120<br>180<br>(ap)<br>Z<br>0<br>——__ ~ 30<br>60<br>\<br>X<br>| 20| |<br>**----- End of picture text -----**<br>


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## **4.3 3D Gain pattern @2450MHz** 

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## **5. Layout Guide (Unit: mm)** 

Land pattern for soldering (grey marking areas) is as shown below. A matching circuit similar to the one shown in section 5.5 is also required. 

## **5.1 Top Copper** 

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## **5.2 Top Solder Paste** 

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## **5.3 Top Solder Mask** 

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## **5.4 Composite Diagram** 

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## **5.5 Matching Circuit** 

Like all antennas, surrounding components, enclosures, and changes to the GND plane dimensions can alter performance. A pi-matching network like the one shown below is required in case adjustments need to be made. The antenna evaluation board (EVB) has a similar matching network. The components on the EVB are a good starting point for a new design, but will need to be adjusted upon integration to as close as possible to 50 Ohm impedance for best performance. The zero ohm resistor is needed for the ability to solder down a coax pigtail to make measurements with a vector network analyzer. Contact your regional Taoglas sales office for support. 

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## **6. Antenna Drawings** 

**6.1 Antenna Main Body (Unit: mm)** 

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## **6.2 Antenna with Evaluation board LAD.02 (Unit: mm)** 

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## **6.3 Footprint on Taoglas Evaluation board (Unit: mm)** 

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## **7. Packaging** 

Unit: mm 

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## Unit: mm 

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## **8. Recommended Reflow Temp Profile** 

|**Phase**|**Profile features**|**Pb-Free Assembly**<br>**(SnAgCu)**|
|---|---|---|
|**PREHEAT**|**-Temperature Min(Tsmin)**<br>**-Temperature Max(Tsmax)**<br>**-Time(ts) form (Tsmin to**<br>**Tsmax)**|**150**℃<br>**200**℃<br>**60-120 seconds**|
|**RAMP-UP**|**Avg. Ramp-up Rate (Tsmax**<br>**to TP)**|**3**℃**/second(max)**|
|**REFLOW**|**-Temperature(TL)**<br>**-Total Time above TL (t L)**|**217**℃<br>**30-100 seconds**|
|**PEAK**|**-Temperature(TP)**<br>**-Time(tp)**|**260**℃<br>**5-10 second**|
|**RAMP-DOWN Rate**|**RAMP-DOWN Rate**|**6**℃**/ second max.**|
|**Time from 25**℃**to Peak Temperature**||**8 minutes max.**|
|**Composition of solderpaste**||**96.5Sn/3Ag/0.5Cu**|
|**Solder Paste Model**||**SHENMAO PF606-P26**|



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