L373S-150-1.5

## Thermal Interface Materials 

## TGlobal 

- Thermal gap fillers from 1.5 W/m K to 4.8 W/m K with and without PSA adhesive. 

- Soft materials highly compressible, easy to assemble, and provide good electrical insulation. 

- Shock and vibration absorber 

- Typically used on electrical components, : IC, CPU and MOS, and connection between boards to enclosure walls to help heat conduction. 

- Typical applications include heat dissipation from LEDs, motherboards, power supplies, LCD TVs, notebooks, hubs, hand sets, memory modules, hard drives 

## [PIC03.jpg] 

## Technical specifications: 

|PartNumber|Width<br>&<br>Length<br>(mm)|Thickness<br>(mm)|Thermal<br>Conductivity<br>(W/m K)|Insulation<br>Strength<br>(kV / mm)|Shore<br>Hardness<br>A|
|---|---|---|---|---|---|
|L37-5-150-0.5A|150|0.5|1.6|7|15|
|L37-5-150-1.0A|150|1.0|1.6|7|15|
|L37-5-150-1.5A|150|1.5|1.6|7|15|
|L37-5-150-2.0A|150|2.0|1.6|7|15|
|H482-150-0.5A|150|0.5|2.2|5|10|
|H482-150-1.0A|150|1.0|2.2|5|10|
|H482-150-1.5A|150|1.5|2.2|5|10|
|H482-150-2.0A|150|2.0|2.2|5|10|
|L373-150-0.5A|150|0.5|1.7|10|5|
|L373-150-1.0A|150|1.0|1.7|10|5|
|L373-150-1.5A|150|1.5|1.7|10|5|
|L373-150-2.0A|150|2.0|1.7|10|5|
|L373S-150-0.5|150|0.5|1.4|10|5|
|L373S-150-1.0<br>L373S-150-1.5<br>L373S-150-2.0<br>H486-150-0.5A<br>H486-150-1.0A<br>H486-150-1.5A<br>H486-150-2.0A<br>H486A-150-0.5<br>H486A-150-1.0<br>H486R-150-0.5<br>H486R-150-1.0|150<br>150<br>150<br>150<br>150<br>150<br>150<br>150<br>150<br>150<br>150|1.0<br>1.5<br>2.0<br>0.5<br>1.0<br>1.5<br>2.0<br>0.5<br>1.0<br>0.5<br>1.0|1.4<br>1.4<br>1.4<br>3.2<br>3.2<br>3.2<br>3.2<br>4.0<br>4.0<br>4.8<br>4.8|10<br>10<br>10<br>7<br>7<br>7<br>7<br>5<br>5<br>5<br>5|5<br>5<br>5<br>20<br>20<br>20<br>20<br>20<br>20<br>30<br>30|



[PIC07.jpg] 

[PIC-08.jpg] 

## Li-98 Double sided adhesive 

- Thermally conductive tape used as alternative to mechanical attachments such as pins or clips for small heat sinks 

## Graphite interface material 

- High thermal conductivity graphite material for interface between metal to metal contacts and for heat sinking. 

- High electrical conductivity, provides benefit in EMI properties 

- Thicker graphite interface materials can act as a thermal spreader material due to high in plane thermal conductivity >140 W/m K 

- Grade 100 has density of 1 g / cubic cm, and grade 165 is 1.65 g/ cubic cm for improved thermal conductivity 

- A – adhesive option one side, P is electrical insulation coating 

- Operating temperature -50 to +150 degC across range 

|Part Number|Width &<br>Length<br>(mm)|Thickness<br>(mm)|Thermal<br>conductivity,<br>z-axis<br>(W/m K)|
|---|---|---|---|
|T62-150-013-165G|150|0.13|20|
|T621-150-016-165GA|150|0.16|15|
|T622-150-020-165GAP|150|0.20|5|
|T62-150-025-165G|150|0.25|20|
|T62-150-025-100G|150|0.25|20|
|T62-150-025-100GA|150|0.25|15|
|T62-150-025-165GP|150|0.25|5|
|T62-150-050-165G|150|0.50|20|
|T62-150-050-165GP|150|0.50|5|
|T62-150-050-100G|150|0.50|20|
|T62-150-050-100GA|150|0.50|15|



## [T62 Graphite.jpg]