ISM97-3251BH-50.000MHZ

**3.2mm x 2.5mm Ceramic SMD Package Oscillator, CMOS** 

**ISM97 Series** 

- **Product Features: Typical Applications:** ● Low Jitter, Non-PLL Based Output ● Fibre Channel 

- Compatible with Lead free Processing 

- Pb-free, Halogen-free, and Antimony-free 

- RoHS and REACH compliant 

- Server & Storage 

- Sonet / SDH 

- 802.11 / WiFi 

- T1/E1, T3/E3 

- System Clock 

|**ELECTRICALSPECIFICATIONS**|**ELECTRICALSPECIFICATIONS**|**ELECTRICALSPECIFICATIONS**||
|---|---|---|---|
|**Frequency Range**||1.000MHz to 156.250MHz||
|**Frequency Stability**||±10ppm Maximum<br>±15ppm Maximum<br>±20ppm Maximum<br>±25ppm Maximum<br>±50ppm Maximum<br>±100ppm Maximum|Inclusive of Calibration Tolerance at 25°C,<br>Frequency Stability over Operating Temperature<br>Range, Supply Voltage Change, Output Load<br>Change, and First Year Aging at 25°C.|
|**Operating Temperature Range**||0°C to +70°C, -10°C to +60°C, -10°C to +70°C, -20°C to<br>+70°C, -30°C to +75°C, or -40°C to +85°C||
|**Supply Voltage (Vdd)**||1.8V, 2.5V, 2.7V, 3.0V, 3.3V, 1.62V - 3.63V|±5%|
|**Input Current**||20mA Maximum||
|**Output Logic Type **||CMOS||
|**Output Drive Capability**||15pF Maximum<br>30pF Maximum||
|**Aging**||±3ppm/year Maximum|at +25°C|
|**Duty Cycle**||50 ±5(%) or 50 ±10(%)|Measured at 50% of waveform|
|**Rise / Fall Time**||6nSec Maximum|Measured from 20% to 80% of waveform|
|**Output Voltage Logic High **||90% of Vdd Minimum||
|**Output Voltage Logic Low**||10% of Vdd Maximum||
|**Pin 1 Connection**||Tri-State (High Impedance)||
|**Input Voltage Logic High**||70% of Vdd Minimum or No Connect to Enable Output||
|**Input Voltage Logic Low**||30% of Vdd Maximum to Disable Output(High Impedance)||
|**Standby Current**||10µA Maximum|Disabled Output, High Impedance|
|**Startup Time**||10mSec Maximum||
|**RMS Phase Jitter**||1pSec Maximum|12kHz to 20MHz offset frequency|
|**Period Jitter (RMS)**||5pSec Maximum|20k adjacentperiods|
|**Period Jitter (pk-pk)**||50pSec Maximum|100k adjacent periods|
|**NOTES:**|●All minimum and maximum limits are specified over temperature and rated operating voltage with 15pF output unless otherwise stated.<br>●A 0.1µF bypass capacitor is recommended between Vdd(pad 4)and GND(pad 2)to minimizepower supplynoise.|||



|**ABSOLUTE MAXIMUM LIMITS**|**ABSOLUTE MAXIMUM LIMITS**|
|---|---|
|**Storage Temperature Range**|-55°C to +125°C|
|**Supply Voltage Range **|-0.3Vdc to Vdd +0.3Vdc|
|**Electrostatic Discharge **|2000V Maximum|
|**Solder Temperature**|260°C Maximum|
|**Junction Temperature**|150°C Maximum|
|**NOTE:**If the part is used beyond absolute maximum ratings, it may cause internal destruction. The part should be used under the recommended<br>operatingconditions or the reliabilityof thispart maybe damaged if those conditions are exceeded.||



Rev:  08/16/18_E 

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ● ~~ee~~ www.ilsiamerica.com Specifications subject to change without notice 

Page 1 of 4 

**3.2mm x 2.5mm Ceramic SMD Package Oscillator, CMOS** 

**ISM97 Series** 

|**ENVIRONMENTALSPECIFICATIONS**|**ENVIRONMENTALSPECIFICATIONS**|
|---|---|
|**Mechanical Shock**|MIL-STD-202, Method 213|
|**Mechanical Vibration**|MIL-STD-202, Method 204|
|**Resistance to Soldering Heat**|MIL-STD-202, Method 210|
|**Solderability**|J-STD-002|
|**Gross Leak**|MIL-STD-883, Method 1014|
|**Fine Leak**|MIL-STD-883, Method 1014|
|**Moisture Sensitivity Level**|MSL 1 (+260°C)|



## **MECHANICAL & SOLDER PAD LAYOUT DIMENSIONS** 

## **PART NUMBER GUIDE** 

|**Series**|||**Supply**<br>**Voltage**|**Operating**<br>**Temperature Range**|**Duty**<br>**Cycle**|**Output**<br>**Drive Capability**|**Frequency**<br>**Stability**|**Pin 1**<br>**Connection**|**Frequency**|
|---|---|---|---|---|---|---|---|---|---|
|ISM97-|||3 = 3.3V|1 = 0°C to +70°C|5 = 50 ±5%|1 = 15pF|E = ±10ppm|H = Tri-State|-25.000 MHz|
||||7 = 3.0V|8 = -10°C to +60°C|6 = 50 ±10%|6 = 30pF|D = ±15ppm|O = N/C||
||||2 = 2.7V|6 = -10°C to +70°C|||F = ±20ppm|||
||||6 = 2.5V|3 = -20°C to +70°C|||A = ±25ppm|||
||||1 = 1.8V|4 = -30°C to +75°C|||B = ±50ppm|||
||8 = 1.62V - 3.63V|8 = 1.62V - 3.63V|8 = 1.62V - 3.63V|2 = -40°C to +85°C|||C = ±100ppm|||



## **Sample Part Number: ISM97-3251BH-20.000 MHz** 

- Not all Frequency Stability options are available at all frequencies and Operating Temperature Ranges. 

- **NOTES:** ● Not all Output Drive Capability options are available at all frequencies. ● Not all Supply Voltage options are available at all frequencies. 

   - Please consult with Sales Department any other parameters or options. 

## **MARKING** 

**Line 1:** ILSI, Date Code (YWW) **Line 2:** Frequency **Pin 1 Dot** 

## **PACKAGE INFORMATION** 

**Termination =** e4 (Au over Ni over W base metallization) **Terminal Plating Thickness:** Gold (0.3µm to 1.0µm), Nickel (1.27µm to 8.89µm) 

Rev:  08/16/18_E 

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ● ~~ee~~ www.ilsiamerica.com Specifications subject to change without notice 

Page 2 of 4 

**ISM97 Series** 

## **3.2mm x 2.5mm Ceramic SMD Package Oscillator, CMOS** 

|**TAPE& REEL DIMENSIONS**|**TAPE& REEL DIMENSIONS**|
|---|---|
|4.00~<br>r<br>@1.50<br>+|<br>2.00—!<br>tr<br>~—<br>fe & C/O<br>6<br>Of-+|<br>|<br>3.50<br>78<br>i<br>:<br>“3<br>“as<br>TAPEWIDTH<br>|<br>am<br>! A.<br>4.<br>ad<br>©<br>a<br>d<br>REEL DIA enna Oe aan<br>36<br>SSI“<br>@1.00<br>1<br>|<br>LL PITCH a<br>1|**PITCH**<br>4.00<br>**TAPE WIDTH**<br>8.00<br>**REEL DIA**<br>180<br>**QTY PER REEL**<br>3,000<br>All Dimensions in Millimeters|



## **WAVEFORM: Enable/Disable Option** 

Rev:  08/16/18_E 

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ● ~~SS~~ www.ilsiamerica.com Specifications subject to change without notice 

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## **3.2mm x 2.5mm Ceramic SMD Package Oscillator, CMOS** 

## **ISM97 Series** 

|**SOLDER REFLOW PROFILE**|**SOLDER REFLOW PROFILE**|
|---|---|
|Critical Zone<br>Thto Tp<br>T,<br>Ramp-up<br>A<br>g¢ Ramp-down<br>T<br>:<br>Et CI/<br>wo T;Max<br>2<br>Wa<br>©<br>2<br>T;Min<br>7<br>.<br>/<br>a)TOY<br>/<br>t;Preheat<br>It<br>t25°C toPeak<br>tPp<br>Time (t)|TsmaxtoTL(Ramp-upRate)<br>3ºC / secondmax<br>Preheat<br>Temperature min (Ts min)<br>Temperature typ (Ts typ)<br>Temperature max (Ts max)<br>Time (Ts)<br>150ºC<br>175ºC<br>200ºC<br>60 to180 seconds<br>Ramp-upTate (TL toTp<br>3ºC / secondmax<br>Time Maintained Above<br>Temperature (TL)<br>Time (TL)<br>217ºC<br>60 to150 seconds<br>Peak Temperature (Tp)<br>260ºC max for 10<br>seconds<br>Time within 5ºC to Peak<br>Temperature (Tp)<br>20 to 40 seconds<br>Ramp-down Rate<br>6ºC / secondmax<br>Tune25ºC toPeak Temperature<br>8minutemax<br>Moisture SensitivityLevel(MSL)<br>Level 1|
|Units are backward compatible with +240°C reflow process||



## **PROPRIETARY AND CONFIDENTIAL** 

THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION, AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE NOR USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM ILSI America. 

Rev:  08/16/18_E 

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ● ~~ee~~ www.ilsiamerica.com Specifications subject to change without notice 

Page 4 of 4