IRF7904TRPBF
Dual MOSFET, N Channel, 30 V, 30 V, 11 A, 11 A, 8600 µohm
- Manufacturer: INFINEON
- Product type: Dual MOSFETs
- Transistor Polarity:Dual N Channel; Continuous Drain Current Id:11A; Drain Source Voltage Vds:30V; On Resistance Rds(on):0.0086ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs
- MSL: MSL 1 - Unlimited
- SVHC: No SVHC (23-Jan-2024)
- No. of Pins: 8Pins
- Channel Type: N Channel
- Product Range: HEXFET Series
- Qualification: -
- Transistor Case Style: SOIC
- Operating Temperature Max: 150°C
- Power Dissipation N Channel: 2W
- Power Dissipation P Channel: 2W
- Drain Source Voltage Vds N Channel: 30V
- Drain Source Voltage Vds P Channel: 30V
- Continuous Drain Current Id N Channel: 11A
- Continuous Drain Current Id P Channel: 11A
- Drain Source On State Resistance N Channel: 8600µohm
- Drain Source On State Resistance P Channel: 8600µohm
| Delivery and price | |
|---|---|
| Units per pack | 5000 |
| Price | 0.318 € |
| Current stock | 10+ |
| Lead time | 30 days |
## IRF7904PbF
HEXFET ® Power MOSFET
## **Applications**
Dual SO-8 MOSFET for POL Converters in Notebook Computers, Servers, Graphics Cards, Game Consoles and Set-Top Box
|**VDSS**|**RDS(on) max**|**ID**|
|---|---|---|
|**30V**|**Q1 16.2m @VGS = 10V**<br>Q|**7.6A**<br>~~So~~|
||**Q2 10.8m @VGS = 10V**<br>Q|**11A**|
## **Benefits**
: Very Low RLow Gate ChargeDS(on) at 4.5V VGS Fully Characterized Avalanche Voltage e and Current 20V VGS Max. Gate Rating : Improved Body Diode Reverse Recovery 100% Tested for RG Lead-Free
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SO-8<br>**----- End of picture text -----**<br>
## **Absolute Maximum Ratings**
||**Parameter**<br>~~SS~~|**Q1 Max.**<br>~~SS~~|**Q2 Max.**<br>~~SS~~|**Units**|
|---|---|---|---|---|
|VDS|Drain-to-Source Voltage<br>~~SS~~|30<br>~~SS~~||V|
|VGS<br>~~———~~|Gate-to-Source Voltage<br>~~SS~~<br>~~ee~~<br>~~———~~|± 20<br>~~SS~~<br>~~ee~~<br>~~ee~~|||
|ID@ TA= 25°C<br>~~———~~|Continuous Drain Current, VGS@ 10V<br>~~SS~~<br>~~ee~~<br>~~a~~<br>~~———~~|7.6<br>~~SS~~<br>~~ee~~<br>~~a~~<br>~~ee~~|11<br>~~SS~~<br>~~ee~~<br>~~a~~|A<br>~~—}——}+——,|~~|
|ID@ TA= 70°C<br>~~———~~<br>~~a~~|Continuous Drain Current, VGS@ 10V<br>~~———~~<br>~~a~~|6.1<br>~~ee~~|8.9||
|IDM<br>~~———~~<br>~~a~~|Pulsed Drain Current<br>~~———~~<br>~~a~~<br>~~—}——}+——,~~|61<br>~~ee~~<br>~~—}——}+——,~~|89<br>~~—}——}+——,~~||
|PD@TA= 25°C<br>~~———~~<br>~~a~~|Power Dissipation<br>~~———~~<br>~~a~~<br>~~—}——}+——,~~|1.4<br>~~ee~~<br>~~—}——}+——,~~|2.0<br>~~—}——}+——,~~|W<br>~~—}——}+——,|~~|
|PD@TA= 70°C|Power Dissipation<br>~~—}——}+——,~~<br>~~a~~|0.9<br>~~—}——}+——,~~<br>~~a~~|1.3<br>~~—}——}+——,~~<br>~~a~~||
||Linear Derating Factor<br>~~—}——}+——,~~<br>~~a~~<br>~~eG~~|0.011<br>~~—}——}+——,~~<br>~~a~~<br>~~eG~~|0.016<br>~~—}——}+——,~~<br>~~a~~<br>~~eG~~|W/°C<br>~~—}——}+——, |~~<br>~~eG~~|
|TJ<br>TSTG|Operating Junction and<br>Storage Temperature Range<br>~~eG~~|-55 to + 150<br>~~eG~~||°C<br>~~eG~~|
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07/10/06
**Static @ TJ = 25°C (unless otherwise specified)**
|**Static @ TJ = 25°C (unless otherwise specified)J = 25°C (unless otherwise specified) = 25°C (unless otherwise specified)**|**Static @ TJ = 25°C (unless otherwise specified)J = 25°C (unless otherwise specified) = 25°C (unless otherwise specified)**|||||||
|---|---|---|---|---|---|---|---|
||**Parameter**|~~ee~~|**Min.**<br>~~ee~~|**Typ.**<br>~~ee~~|**Max.**<br>~~ee~~|**Units**<br>~~ee~~|**Conditions**|
|BVDSS|Drain-to-Source Breakdown Voltage<br>~~Pree~~|Q1&Q2<br>~~Pree~~<br>~~ee~~|30<br>~~Pree~~<br>~~ee~~|–––<br>~~Pree~~<br>~~ee~~|–––<br>~~Pree~~<br>~~ee~~|V<br>~~Pree~~<br>~~ee~~|VGS= 0V,ID= 250µA<br>~~Pree~~|
|∆ΒVDSS/∆TJ<br>~~Po~~<br>~~a~~|Breakdown Voltage Temp. Coefficient<br>~~es~~<br>~~Po~~<br>~~a~~|Q1<br>~~es~~<br>~~ee~~|–––<br>~~es~~<br>~~ee~~|0.024<br>~~es~~<br>~~ee~~|–––<br>~~es~~<br>~~ee~~|V/°C<br>~~es~~<br>~~ee~~<br><br>|Reference to 25°C, ID= 1mA<br>~~es~~<br>~~z~~<br>~~ESS~~<br>|
|||Q2<br>~~es~~<br>~~ee~~<br>~~SEES~~<br>|–––<br>~~es~~<br>~~ee~~<br>~~—~~<br>~~SEES~~<br>|0.024<br>~~es~~<br>~~ee~~<br>~~—~~<br>~~SEES~~<br>|–––<br>~~es~~<br>~~ee~~<br>~~—~~<br>~~SEES~~<br>|||
|RDS(on)<br>~~Po~~<br>~~a~~|Static Drain-to-Source On-Resistance<br>~~Po~~<br>~~a~~|Q1<br>~~ee~~<br>~~SEES~~<br>|–––<br>~~ee ~~<br>~~—~~<br>~~SEES~~<br>|11.4<br> ~~ee~~<br>~~—~~<br>~~SEES~~<br>|16.2<br>~~ee ~~<br>~~—~~<br>~~SEES~~<br>|mΩ<br> ~~ee~~<br><br>|VGS= 10V,ID= 7.6A<br>~~z~~<br>~~ESS~~<br>|
||||–––<br>~~—~~<br>~~SEES~~<br>|14.5<br>~~—~~<br>~~SEES~~<br>|20.5<br>~~—~~<br>~~SEES~~<br>||VGS= 4.5V,ID= 6.1A<br>~~z~~<br>~~ESS~~<br>|
|||Q2<br>~~SEES~~<br>|–––<br>~~—~~<br>~~SEES~~<br>|8.6<br>~~—~~<br>~~SEES~~<br>|10.8<br>~~—~~<br>~~SEES~~<br>||VGS= 10V,ID= 11A<br>~~z~~<br>~~ESS~~<br>|
||||–––<br>~~—~~<br>~~SEES~~<br>|10<br>~~—~~<br>~~SEES~~<br>|13<br>~~—~~<br>~~SEES~~<br>||VGS= 4.5V,ID= 8.8A<br>~~z~~<br>~~ESS~~<br>|
|VGS(th)<br>~~Po~~<br>~~a~~|Gate Threshold Voltage<br>~~Po~~<br>~~aae~~|Q1&Q2<br>~~SEES~~<br>~~ae~~|1.35<br>~~—~~<br>~~SEES~~<br>~~ae~~|–––<br>~~—~~<br>~~SEES~~<br>~~ae~~|2.25<br>~~—~~<br>~~SEES~~<br>~~ae~~|V<br><br>~~ae~~|Q1: VDS= VGS, ID= 25µA<br>Q2: VDS= VGS, ID= 50µA<br>~~z~~<br> ~~ESS~~<br>~~ae~~|
|GS(th)<br>∆VGS(th)/∆TJ<br>~~a~~|Gate Threshold Voltage Coefficient<br>~~aae~~|Q1<br>~~SEES~~<br>~~ae~~|–––<br>~~SEES~~<br>~~ae~~|-5.0<br>~~SEES~~<br>~~ae~~|–––<br>~~SEES ~~<br>~~ae~~|mV/°C<br> <br>~~ae~~||
|||Q2<br>~~ae~~|–––<br>~~ae~~|-5.0<br>~~ae~~|–––<br>~~ae~~|||
|IDSS<br>|Drain-to-Source Leakage Current<br>~~ae~~|Q1&Q2<br>~~ae~~|–––<br>~~ae~~|–––<br>~~ae~~|1.0<br>~~ae~~|µA<br>~~ae~~|VDS= 24V,VGS= 0V<br>~~ae~~|
|||Q1&Q2|–––|–––|150||VDS= 24V,VGS= 0V,TJ= 125°C|
|IGSS|Gate-to-Source Forward Leakage<br>~~—~~|Q1&Q2<br>~~—~~|–––<br>~~—~~|–––<br>~~—~~|100<br>~~—~~|nA<br>~~—~~|VGS= 20V<br>~~—~~|
||Gate-to-Source Reverse Leakage<br>~~—~~|Q1&Q2<br>~~—~~|–––<br>~~—~~|–––<br>~~—~~|-100<br>~~—~~||VGS= -20V<br>~~—~~|
|gfs|Forward Transconductance<br>~~—~~<br>~~a~~|Q1<br>~~—~~<br>~~a~~|17<br>~~—~~<br>~~a~~|–––<br>~~—~~<br>~~a~~|–––<br>~~—~~<br>~~a~~|S<br>~~—~~<br>~~a~~|VDS= 15V,ID= 6.1A<br>~~—~~<br>~~a~~|
|||Q2<br>~~a~~|23<br>~~a~~|–––<br>~~a~~|–––<br>~~a~~||VDS= 15V,ID= 8.8A<br>~~a~~|
|Qg|Total Gate Charge<br>~~a~~<br>~~TT~~|Q1<br>~~a~~<br>~~TT~~|–––<br>~~a~~<br>~~TT~~|7.5<br>~~a~~<br>~~TT~~|11<br>~~a~~<br>~~TT~~|nC<br>~~a~~|Q1<br>VDS= 15V<br>VGS= 4.5V, ID= 6.1A<br>Q2<br>VDS= 15V<br>VGS= 4.5V, ID= 8.8A<br>~~a~~|
|||Q2<br>~~TT~~|–––<br>~~TT~~|14<br>~~TT~~|21<br>~~TT~~|||
|Qgs1<br>~~OO~~|Pre-Vth Gate-to-Source Charge<br>~~Er~~<br>~~OO~~|Q1<br>~~Er~~|–––<br>~~Er~~|2.2<br>~~Er~~|–––<br>~~Er~~|||
|||Q2<br>~~Er~~|–––<br>~~Er~~|3.7<br>~~Er~~|–––<br>~~Er~~|||
|Qgs2<br>~~OO~~|Post-Vth Gate-to-Source Charge<br>~~OO~~|Q1|–––|0.6|–––|||
|||Q2|–––|1.1|–––|||
|Qgd<br>~~OO~~|Gate-to-Drain Charge<br>~~OO~~<br>~~Er~~|Q1<br>~~Er~~|–––<br>~~Er~~|2.5<br>~~Er~~|–––<br>~~Er~~|||
|||Q2<br>~~Er~~|–––<br>~~Er~~|4.8<br>~~Er~~|–––<br>~~Er~~|||
|Qgodr|Gate Charge Overdrive<br>~~Er~~|Q1<br>~~Er~~|–––<br>~~Er~~|2.2<br>~~Er~~|–––<br>~~Er~~|||
|||Q2<br>~~Er~~|–––<br>~~Er~~|4.4<br>~~Er~~|–––<br>~~Er~~|||
|Qsw|Switch Charge (Qgs2+ Qgd)<br>~~I~~|Q1<br>~~I~~|–––<br>~~I~~|3.1<br>~~I~~|–––<br>~~I~~|||
|||Q2<br>~~I~~|–––<br>~~I~~|5.9<br>~~I~~|–––<br>~~I~~|||
|Qoss|Output Charge<br>~~I~~<br>~~TE~~|Q1<br>~~I~~<br>~~TE~~|–––<br>~~I~~<br>~~TE~~|4.5<br>~~I~~<br>~~TE~~|–––<br>~~I~~<br>~~TE~~|nC<br>~~TE~~|VDS= 16V, VGS= 0V<br>~~TE~~|
|||Q2<br>~~TE~~|–––<br>~~TE~~|9.1<br>~~TE~~|–––<br>~~TE~~|||
|RG|Gate Resistance<br>~~FSS~~|Q1<br>~~FSS~~|–––<br>~~FSS SS~~|3.2<br>~~SS~~|4.8<br>~~SS~~|Ω<br>~~SS~~|~~SS~~|
|||Q2<br>~~FSS~~|–––<br>~~FSS SS~~|2.9<br>~~SS~~|4.4<br>~~SS~~|||
|td(on)|Turn-On Delay Time<br>~~FSS~~<br>~~a~~|Q1<br>~~FSS~~<br>~~a~~|–––<br>~~FSS SS~~<br>~~a~~|6.9<br>~~SS~~<br>~~a~~|–––<br>~~SS~~<br>~~a~~|ns<br>~~SS~~|ID= 6.1A<br>ID= 8.8A<br>VDD= 15V, VGS= 4.5V<br>VDD= 15V, VGS= 4.5V<br>Clamped Inductive Load<br>Q1<br>Q2<br>~~SS~~|
|||Q2<br>~~a~~|–––<br>~~a~~|7.8<br>~~a~~|–––<br>~~a~~|||
|tr|Rise Time<br>~~Er~~|Q1<br>~~Er~~|–––<br>~~Er~~|7.3<br>~~Er~~|–––<br>~~Er~~|||
|||Q2<br>~~Er~~|–––<br>~~Er~~|10<br>~~Er~~|–––<br>~~Er~~|||
|td(off)|Turn-Off Delay Time<br>~~—————~~|Q1<br>~~—————~~|–––<br>~~—————~~|10<br>~~—————~~|–––<br>~~—————~~|||
|||Q2<br>~~—————~~|–––<br>~~—————~~|15<br>~~—————~~|–––<br>~~—————~~|||
|tf|Fall Time<br>~~TT~~|Q1<br>~~TT~~|–––<br>~~TT~~|3.2<br>~~TT~~|–––<br>~~TT~~|||
|||Q2<br>~~TT~~|–––<br>~~TT~~|4.6<br>~~TT~~|–––<br>~~TT~~|||
|Ciss|Input Capacitance<br>~~TT~~<br>~~Er~~|Q1<br>~~TT~~<br>~~Er~~|–––<br>~~TT~~<br>~~Er~~|910<br>~~TT~~<br>~~Er~~|–––<br>~~TT~~<br>~~Er~~|pF|VDS= 15V<br>VGS= 0V<br>ƒ = 1.0MHz|
|||Q2<br>~~Er~~|–––<br>~~Er~~|1780<br>~~Er~~|–––<br>~~Er~~|||
|Coss|Output Capacitance<br>~~OO~~|Q1<br>~~OO~~|–––<br>~~OO~~|190<br>~~OO~~|–––<br>~~OO~~|||
|||Q2<br>~~OO~~|–––<br>~~OO~~|390<br>~~OO~~|–––<br>~~OO~~|||
|Crss|Reverse Transfer Capacitance<br>~~pr~~|Q1<br>~~pr~~|–––<br>~~pr~~|94<br>~~pr~~|–––<br>~~pr~~|||
|||Q2<br>~~pr~~|–––<br>~~pr~~|180<br>~~pr~~|–––<br>~~pr~~|||
## **Typical Characteristics**
## **Q1 - Control FET**
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100<br>VGS<br>TOP 10V<br>| Am 8.0V5.0V<br>4.5V<br>| Lot 4.0V<br>10 3.5V<br>3.0V<br>BOTTOM 2.5V<br>ee ee eee el<br>PEATE<br>1<br>ea ee<br>PE EH HEE HE<br>PE 2.5V<br>STi ≤ 60µs PULSE WIDTH<br>Tj = 25°C<br>il i<br>0.1<br>eT<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 1. Typical Output Characteristics<br>100<br>|<br>VGS<br>PE EHH HEHE TOP 10V<br>ER)ee) eeeCAeen 8.0V5.0V<br>4.5V<br>4.0V<br>manny) 3.5V<br>3.0V<br>BOTTOM 2.5V<br>fry. elill<br>10<br>429TAWACF. 20tla ee eee l<br>A 2.5V<br>HHH<br>≤ 60µs PULSE WIDTH<br>Tj = 150°C<br>1 Tl<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 3. Typical Output Characteristics<br>100.0<br>ae, Ao<br>10.0<br>See TJ = 150°C Anne<br>re 2s<br>PP) ARR yy<br>TJ = 25°C<br>1.0 a po<br>Se eS<br>VDS = 15V<br>≤ 60µs PULSE WIDTH<br>0.1<br>1.0 2.0 3.0 4.0 5.0<br>VGS, Gate-to-Source Voltage (V)<br>)(Α<br>ID, Drain-to-Source Current<br>ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>
**Fig 5.** Typical Transfer Characteristics
## **Q2 - Synchronous FET**
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100<br>| ger<br>ei|<br>VGS<br>10 TOP 10V<br>8.0V<br>5.0V<br>ee ee 4.5V4.0V i<br>3.5V<br>PIE Ea 3.0V<br>1 2.5V BOTTOM 2.5V<br>te, Col |<br>PE EH HEHE<br>SSE it<br>PE ≤ E 60µs PULSE WIDTH R<br>Tj = 25°C<br>Fee EEE<br>0.1<br>THIELLLL<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>
**Fig 2.** Typical Output Characteristics
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100 a<br>PEE HHH<br>beER’)eeee eee|<br>Y, VGS<br>eya aimmnaill TOP 10V<br>8.0V<br>10 5.0V<br>2.5V 4.5V<br>4.0V<br>e426 3.5V<br>ZABl eee 3.0V<br>BOTTOM 2.5V<br>EE<br>MBG<br>≤ 60µs PULSE WIDTH<br>Tj = 150°C<br>ET aL<br>1<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 4. Typical Output Characteristics<br>100.0<br>eey/o<br>10.0<br>pj TJ = 150°C | YA | |<br>Po A<br>| PE yy<br>1.0 ye T J = 25°C<br>SSS Se<br>VDS = 15V<br>≤ 60µs PULSE WIDTH<br>0.1<br>1.0 2.0 3.0 4.0 5.0<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>)(Α<br>ID, Drain-to-Source Current<br>**----- End of picture text -----**<br>
**Fig 6.** Typical Transfer Characteristics
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**Q1 - Control FET**
## **Typical Characteristics**
**Q2 - Synchronous FET**
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10000 10000<br>VGS = 0V, f = 1 MHZ VGS = 0V, f = 1 MHZ<br>Ciss = Cgs + Cgd, Cds SHORTED Ciss = Cgs + Cgd, Cds SHORTED<br>C = C C = C<br>rss gd rss gd<br>C = C + C C = C + C<br>| oss ds gd f k. oss ds gd ..<br>1000 Ciss Ciss<br>ages an t eal<br>1000<br>Ft Coss We] | ee<br>100 ee Crss PORTIA Coss<br>Crss<br>PE Fer E T H ll<br>10 100<br>1 10 100 1 10 100<br>C, Capacitance (pF) C, Capacitance (pF)<br>**----- End of picture text -----**<br>
VDS, Drain-to-Source Voltage (V)
VDS, Drain-to-Source Voltage (V)
**Fig 7.** Typical Capacitance vs. Drain-to-Source Voltage **Fig 8.** Typical Capacitance vs. Drain-to-Source Voltage
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12<br>ID= 6.1A V = 24V<br>DS<br>10 VDS= 15V<br>8 | Vian<br>6<br>| Yi<br>4<br>fe<br>2 ae<br>0 An<br>0 5 10 15 20<br> QG Total Gate Charge (nC)<br> Typical Gate Charge vs. Gate-to-Source Voltage<br>1000<br>OPERATION IN THIS AREA<br>LIMITED BY R DS(on)<br>100<br>1 mse c 100µsec<br>10<br>10msec<br>1<br>100msec<br>0.1 TA = 25°C<br>Tj = 150°C<br>Single Pulse<br>0.01 |<br>0.01 0.10 1.00 10.00 100.00<br>VDS , Drain-toSource Voltage (V)<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>
**Fig 9.** Typical Gate Charge vs. Gate-to-Source Voltage
**Fig 11.** Maximum Safe Operating Area
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12<br>ID= 8.8A V = 24V<br>DS<br>10 VDS= 15V<br>8 | Y_|<br>6<br>Jf<br>4<br>gf<br>2 p= 4a<br>0 Ji |i ti |<br>0 5 10 15 20 25 30 35<br> QG Total Gate Charge (nC)<br>VGS, Gate-to-Source Voltage (V)<br>**----- End of picture text -----**<br>
**Fig 10.** Typical Gate Charge vs. Gate-to-Source Voltage
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1000<br>OPERATION IN THIS AREA<br>LIMITED BY R DS(on)<br>100<br>1 m sec<br>100µsec<br>10<br>10m se c<br>1<br>100 m sec<br>0.1 TA = 25°C<br>Tj = 150°C<br>Single Pulse<br>0.01 HH itt<br>0.01 0.10 1.00 10.00 100.00<br>VDS , Drain-toSource Voltage (V)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>
**Fig 12.** Maximum Safe Operating Area
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**Typical Characteristics**
**Q2 - Synchronous FET**
**Q1 - Control FET**
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**----- Start of picture text -----**<br>
1.5 1.5<br>ID = 7.6A ID = 11A<br>VGS = 10V VGS = 10V<br>TI Al = Vy<br>1.0 EECA = 1.0 TEETEDATE<br>eT) «= [DRT<br>0.5 REEL) 0.5 «TTF<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 -60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ , Junction Temperature (°C) TJ , Junction Temperature (°C)<br> Normalized On-Resistance vs. Temperature Fig 14. Normalized On-Resistance vs. Temperature<br>100.0 100.0<br>TJ = 150°C TJ = 150°C<br>10.0 10.0<br>1.0 ef 1.0 is TJ = 25°C e<br>TJ = 25°C<br>VGS = 0V VGS = 0V<br>0.1 PP pe 0.1 PP<br>0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2<br>VSD, Source-to-Drain Voltage (V) VSD, Source-to-Drain Voltage (V)<br> Typical Source-Drain Diode Forward Voltage Fig 16. Typical Source-Drain Diode Forward Voltage<br>40 25<br>ID = 7.6A ID = 11A<br>35<br>Ty TT]<br>20<br>30<br>25 15 T J = 125°C<br>TJ = 125°C<br>20<br>ASE AW<br>10<br>15 TJ = 25°C<br>TJ = 25°C<br>10 P SPfpo 5 Fe<br>2.0 4.0 6.0 8.0 10.0 2.0 4.0 6.0 8.0 10.0<br>VGS, Gate-to-Source Voltage (V) VGS, Gate-to-Source Voltage (V)<br>ISD, Reverse Drain Current (A) ISD, Reverse Drain Current (A)<br>RDS(on) , Drain-to-Source On Resistance (Normalized)<br>)Ω )Ω<br>RDS(on), Drain-to -Source On Resistance (m RDS(on), Drain-to -Source On Resistance (m<br>RDS(on) , Drain-to-Source On Resistance (Normalized)<br>**----- End of picture text -----**<br>
**Fig 14.** Normalized On-Resistance vs. Temperature
**Fig 13.** Normalized On-Resistance vs. Temperature
**Fig 15.** Typical Source-Drain Diode Forward Voltage
**Fig 16.** Typical Source-Drain Diode Forward Voltage
**Fig 17.** Typical On-Resistance vs.Gate Voltage
**Fig 18.** Typical On-Resistance vs.Gate Voltage
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**Typical Characteristics**
## **Q1 - Control FET**
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8<br>STILL<br>6 PANEL<br>CTC PSE<br>4<br>SECS<br>2 PEEING<br>iti per<br>0 PL Ett tL] ey<br>25 50 75 100 125 150<br>TJ , Ambient Temperature (°C)<br>Maximum Drain Current vs. Ambient Temp.<br>2.6<br>2.2 BiaseTNE<br>1.81.4 ALLLLLLLLLLBaN ID = 250µA<br>1.0<br>-75 -50 -25 0 25 50 75 100 125 150<br>TJ , Temperature ( °C )<br>ID , Drain Current (A)<br>VGS(th) Gate threshold Voltage (V)<br>**----- End of picture text -----**<br>
**Fig 19.** Maximum Drain Current vs. Ambient Temp.
**Fig 21.** Threshold Voltage vs. Temperature
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600<br> I<br>D<br>500 TOP 0.34A<br> 0.48A<br>BOTTOM 6.1A<br>400 eo\ ||<br>300 VE |]<br>200<br>NN<br>100<br>Sa<br>0 | | P™<br>25 50 75 100 125 150<br>Starting TJ, Junction Temperature (°C)<br>EAS, Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>
**Fig 23.** Maximum Avalanche Energy vs. Drain Current
**Q2 - Synchronous FET**
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12 a<br>10<br>FPSECEE<br>8<br>PERN<br>6<br>SEES<br>4<br>FEES<br>2<br>FSET<br>0 FEE<br>25 50 75 100 125 150<br>TJ , Ambient Temperature (°C)<br>Fig 20. Maximum Drain Current vs. Ambient Temp.<br>2.2<br>1.8<br>ID = 250µA<br>1.4<br>1.0<br>-75 -50 -25 0 25 50 75 100 125 150<br>TJ , Temperature ( °C )<br>VGS(th) Gate threshold Voltage (V)<br>ID , Drain Current (A)<br>**----- End of picture text -----**<br>
**Fig 20.** Maximum Drain Current vs. Ambient Temp.
**Fig 22.** Threshold Voltage vs. Temperature
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1200<br> I<br>D<br>TOP 0.57A<br>1000<br> 0.77A<br>BOTTOM 8.8A<br>powi<br>800<br>600 Vit tf<br>400<br>KA |<br>200<br>aN<br>0 | |oSs™<br>25 50 75 100 125 150<br>Starting TJ, Junction Temperature (°C)<br>EAS, Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>
**Fig 24.** Maximum Avalanche Energy vs. Drain Current
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100<br>D = 0.50<br>j__|_| 0.20 be TF TATE OP EA<br>10 g 0.10 c<br>0.05<br>|__| | 0.02 eH<br>1 e 0.01 ee<br>R1 R1 R2 R2 R3R3 Ri (°C/W) τi (sec)<br>FETA HE τJ τ pq J τCτ 17.122 0.018925<br>0.1 SS oe τ 1τ1 τ2 τ2 pe τ3τ3 -— 53.325 0.74555<br>Ee ee ee eee Ci= Ciτi/Rii/Ri 19.551 39.2<br>0.01 Z| | |<br>Notes:<br>SINGLE PULSE 1. Duty Factor D = t1/t2<br>Yr LAT ( THERMAL RESPONSE ) a i 2. Peak Tj = P dm x Zthja + Tc HH<br>Paeiilll PE CP l<br>0.001<br>1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100<br>t1 , Rectangular Pulse Duration (sec)<br>Fig 25. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient (Q1)<br>100<br>D = 0.50<br>10 Se 0.20 Seeee eee ——— — antl|ee Atl<br>0.10<br>0.05<br>1 Aa 0.02 YEEeeSeri Ci CHL<br>0.01<br>R1 R1 R2 R2 R3R3 Ri (°C/W) τi (sec)<br>0.1 a| el τJ τ C J TT > τC τ | 10.908 0.02108 i<br>ee | τ1τ eee 1 τ2 τ2 τ3τ3 —_ 34.35 1.1482 |<br>a 0 | Ci= τi/Ri | 17.15 39.7 l<br>0.01 eat ee Ci i/Ri<br>Notes:<br>SINGLE PULSE 1. Duty Factor D = t1/t2<br>} ft Ar ( THERMAL RESPONSE ) aii 2. Peak Tj = P dm x Zthja + Tc HH<br>er aitlin POI ren il<br>0.001<br>1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100<br>Thermal Response ( Z thJA )<br>Thermal Response ( Z thJA )<br>**----- End of picture text -----**<br>
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t1 , Rectangular Pulse Duration (sec)<br>**----- End of picture text -----**<br>
**Fig 26.** Maximum Effective Transient Thermal Impedance, Junction-to-Ambient (Q2)
**Fig 27.** Layout Diagram
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Driver Gate Drive<br>P.W.<br>D.U.T + {+ P.W. Period ——— + D = —— Period<br>) [©)] • CircuitLow LayoutStray ConsiderationsInd | t V t GS=10V<br> •<br>- • Low Leakage Inductance @ D.U.T. ISD Waveform<br>+<br>Reverse<br>Recovery Body Diode Forward<br>oi - [1] Current Transformer - ® + Current r Current di/dt AN<br>® D.U.T. VDS Waveform Diode Recoverydv/dt ‘<br>00 > VDD<br>ma<br>• Re-Applied<br>• Driver same type as D.U.T. + Voltage Body Diode Forward Drop<br>Ro ( a8 • dv/dt controlled by Rg Vpp -<br>•<br>D.U.T. - Device Under Test ee ee<br>Ripple ≤ 5% ISD<br>Isp controlled by Duty Factor "D" @|\ t<br>* Veg = 5V for Logic Level Devices<br>Fig 28. Peak Diode Recovery dv/dt Test Circuit or N-Channel<br>HEXFET ® Power MOSFETs<br>V(BR)DSS(BR)DSS<br>15V << tp ><br>VDS L DRIVER<br>RG D.U.T +<br>- [V][DD]<br>IAS A<br>Ww dt /<br>20VVGS aie<br>tp 0.01Ω<br>**----- End of picture text -----**<br>
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V(BR)DSS(BR)DSS<br><< tp ><br>/<br>IAS<br>**----- End of picture text -----**<br>
**Fig 29b.** Unclamped Inductive Waveforms
**Fig 29a.** Unclamped Inductive Test Circuit
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LD<br>VDS<br>+<br>VDD -<br>D.U.T<br>VGS<br>Pulse Width < 1µs<br>Duty Factor < 0.1%<br> Switching Time Test Circuit<br>Current Regulator<br>Same Type as D.U.T.<br>50KΩ<br>12V .2µF<br>.3µF<br>D.U.T. +-VDS<br>VGS<br>-3mA<br>IG = ID<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>
## **Fig 30a.** Switching Time Test Circuit
**Fig 31a.** Gate Charge Test Circuit
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V<br>DS<br>90%<br>10%<br>XA<br>V<br>GS<br>td(on) tr td(off) tf<br>Fig 30b. Switching Time Waveforms<br>Id<br>Vds<br>Vgs<br>Vgs(th)<br>pengtg<br>Qgs1 Qgs2 Qgd Qgodr<br>**----- End of picture text -----**<br>
**Fig 31b.** Gate Charge Waveform
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## SO-8 Package Outline
Dimensions are shown in milimeters (inches)
## **SO-8 Part Marking**
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## **SO-8 Tape and Reel**
Dimensions are shown in millimeters (inches)
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TERMINAL NUMBER 1<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>rir 7.9 ( .312 ) | FEED DIRECTION |h<br>NOTES:<br>1. CONTROLLING DIMENSION : MILLIMETER.<br>2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).<br>3. OUTLINE CONFORMS TO EIA-481 & EIA-541.<br> 330.00<br>(12.992)<br> MAX.<br>| YO<br>14.40 ( .566 )<br>12.40 ( .488 )<br>NOTES :<br>1. CONTROLLING DIMENSION : MILLIMETER.<br>**----- End of picture text -----**<br>
NOTES:
1. CONTROLLING DIMENSION : MILLIMETER.
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.
Repetitive rating; pulse width limited by max. junction temperature. Starting TJ = 25°C, Q1: L = 7.7mH RG = 25Ω, IAS = 6.1A; Q2: L = 6.5mH RG = 25Ω, IAS = 8.8A. Pulse width ≤ 400µs; duty cycle ≤ 2%.
When mounted on 1 inch square copper board.
θ
Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualification Standards can be found on IR’s Web site.
**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 07/2006
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Updated at June 9, 2026
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