IRF7314TRPBF
Dual MOSFET, P Channel, 20 V, 20 V, 5.3 A, 5.3 A, 0.049 ohm
- Manufacturer: INFINEON
- Product type: Dual MOSFETs
- Transistor Polarity:Dual P Channel; Continuous Drain Current Id:-5.3A; Drain Source Voltage Vds:-20V; On Resistance Rds(on):0.049ohm; Rds(on) Test Voltage Vgs:-4.5V; Threshold Volt
- MSL: MSL 1 - Unlimited
- SVHC: No SVHC (23-Jan-2024)
- No. of Pins: 8Pins
- Channel Type: P Channel
- Product Range: -
- Qualification: -
- Transistor Case Style: SOIC
- Operating Temperature Max: 150°C
- Power Dissipation N Channel: 2W
- Power Dissipation P Channel: 2W
- Drain Source Voltage Vds N Channel: 20V
- Drain Source Voltage Vds P Channel: 20V
- Continuous Drain Current Id N Channel: 5.3A
- Continuous Drain Current Id P Channel: 5.3A
- Drain Source On State Resistance N Channel: 0.049ohm
- Drain Source On State Resistance P Channel: 0.049ohm
| Delivery and price | |
|---|---|
| Units per pack | 5 |
| Price | 1.17 € |
| Current stock | 10+ |
| Lead time | 30 days |
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S1 1 8 D1<br>G1 2 7 D1 Voss = -20V<br>S2 3 6 D2<br>G2 4 5 D2 Rpgion) = 0.058 Ω<br>Top View<br>**----- End of picture text -----**<br>
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SO-8<br>**----- End of picture text -----**<br>
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Absolute Maximum Ratings ( T, = 25°C Unless Otherwise Noted)<br>Symbol_| Maximum<br>“20 | _Units_|<br>V<br>#12<br>Continuous Drain Current© Ta= 28°C ID po<br>Ta = 70°C -4.3 A<br>-21<br>25<br>. rer Ta = 25°C 2.0<br>PD<br>Se<br>**----- End of picture text -----**<br>
θ
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[Viemoss[| ——Sséarameter ————=(Min.|Typ.[Max.[Units|Conditions =<br>∆ ∆<br>F Viempss Ty_|Drain-to-Source[Breakdown VoltageBreakdownTemp. Coefficient_|-—|0.031]Votage _|-20|——| — — | VPCV || Vas=OV,lp=-250AReference to 25°C, Ip=-imA<br>Ω<br>Foxe [StieDniossuce Onfessines | [Togefooae| [Vega Ip=-tst<br>[Vast [= [o0082/0.098<br>Transconductance——~‘[-—|<br>feesfae [__[Dantosnvertetase] [Forward[Gate Threshold Vottagecare———*F0.70]Flas89|—|—| — || VWA§ |Vos=Ves.lo=-250H8|Vos=-10V,lp=-15Aapg ves =e SSE<br>‘losscss [ Gaieenunc Gat e Rewee to-Source Leste [faaSc nA Nia<br>[O55__|Gate-o-Source<br>fe —festeteemtmmeReverse Leakage ||teeter]—| -100 [eesey<br>[Oy Charge || 40 61 | nC | Vos = 16<br>_[Turn-OnDelayTime<br>Ror) |Gate-to-Drain (Miller) Charge [=| 7.7[ 12 |__| Vos=~45V, See Fig. 10 ©<br>fh, ['([RiseTime——SS~*~S~S] «|| | 18A || 226 Veolp = -2.98= -10V<br>Ω<br>SSC Ω<br>fe [Css iFalitime A Ro=3.4 ©<br>[ese [input[OutputCapC a pacitancecitance —=—=SCSC—~—~ = ~ d t=—=|| 8470 —| pF | V oe s = -15VOV<br>[= 1.0MHz, See Fig. §<br>Source-Drain Ratings and Characteristics<br>[Parameter<br>Is Continuous Source Current in. [Typ. [Max. [Units[ MOSFET ‘Conditions| symbol D<br>Io Pulsed Source Current A integral reverse G<br>[Veo [Diode Forward Voltage ——=S=S~=«| —— f.78]-1.0 | V | Ty=25°C, ls=-29A Ves= OVO S |<br>**----- End of picture text -----**<br>
ISD ≤ ≤ ≤
≤
≤ ≤
Rg=25 Ω , Ia~g=-2.9A.
≤
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100 VGS 100 VGS<br>TOP -7.50V TOP -7.50V<br>-4.50V -4.50V<br>-4.00V -4.00V<br>-3.50V LCOS ooh -3.50V ee<br>-3.00V -3.00V<br>-2.70V -2.70V<br>-2.00V 2 -2.00V “Ae<br>BOTTOM -1.50V BOTTOM -1.50V<br> 10 10<br>A | Lg"| | wT|<br>-1.50V<br> 1 -1.50V 1<br>f|<br>20µs PULSE WIDTHT = 25J °C 20µs PULSE WIDTHT = 150J °C<br>0.1 ti r 0.1 c on|<br>0.1 1 10 0.1 1 10<br>-V , Drain-to-Source Voltage (V)DS -V , Drain-to-Source Voltage (V)DS<br>Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics<br> 100 ee ee 100 SS SSS SSS SS LSS SS<br>aBESSEEERESERES] © eBSE SeSS<br>P OCAPP) T = 25 CJ | ° Lear p e 10 Eaten,AT T = 150 CJ ° RAS426888ee<br>°<br>Al T = 150 CJ {/—- | —}+ —_} — ff +f} + + —+ +<br> 10 A)SSS ASSES AESS AaS TA T = 25 CJ ° =<br>7,<br>| | Wi fy ft 7 tT tT fT ft<br> 1<br>Ay) 1 ff<br>a ee ee ee ee ee ee ee ee<br>| pba a pete<br>V = -10VDS<br>20µs PULSE WIDTH V = 0 V GS<br> 1 een 0.1 Ge ae s ee<br>1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>-V , Gate-to-Source Voltage (V)GS -V ,Source-to-Drain Voltage (V)SD<br>D D<br>-I , Drain-to-Source Current (A) -I , Drain-to-Source Current (A)<br>D SD<br>-I , Drain-to-Source Current (A) -I , Reverse Drain Current (A)<br>**----- End of picture text -----**<br>
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2.0 0.8<br>| =-2.9A<br>PPP [LLLP] RET ~= Ep Eb yt<br>1.5 PEEP EEL Ler eae 0.6 [ot Et Pye<br>1.0 0.4<br>tt er s {| | | | ft<br>peer ey 2[o} Et<br>0.5 LEP 0.2<br>ET TTP ETP e LE Pt<br>PEPPER? @ ELp ELLA |]<br>0.0 PU a) A 22 0.0 DEER ——_T_| “J<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 0 4 8 12 16 20 [A]<br>T , Junction Temperature (°C)J<br>-I , Drain Current (A)D<br>Fig 5. Normalized On-Resistance Fig 6. Typical On-Resistance Vs. Drain<br>Vs. Temperature Current<br>0.08 400<br>ID<br>TOP -1.3A<br>-2.3A<br>0.07 BOTTOM -2.9A<br>pe ee 300<br>0.06<br>«= {~_[\] of \<br>s fT 200<br>i) 0.05 eeVP NKRPN | |<br>— |) Jf Ke] ANON<br>100<br>0.04<br>es ee ee Ne TRAST<br>a ee ee oo SSK<br>ee 0.03 A 0 P| SSS<br>0.0 2.0 4.0 6.0 8.0 25 50 75 100 125 150<br>V , Gate-to-Source Voltage (V)GS Starting T , Junction TemperatureJ ( C)°<br>Ω<br>(Normalized)<br>DS(on)<br>R , Drain-to-Source On Resistance<br>Ω<br>AS<br>E , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>
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1400 10<br>V = 0V, f = 1MHzGS I = -2.9AD<br>C = C + C , C SHORTEDiss gs gd ds<br>1200 C = Crss gd<br>AN C = C + Coss ds gd 8 pf r ev<br>1000<br>s<br>PAS PTT TT ye Py]<br>NNNSE,eee See 6 PTT PP Py vA<br>800<br>ss<br>GE a Pot<br>600 NN TTA<br>4<br>NE Saeeeeeeanee<br>400<br>ss<br>enPSG ep Nl TT AVA 4<br>2 Pt LT AP<br>200 PT Pt<br>a SDT TT ryt TF To<br>0 es el A 0 Y(|| | tte<br>1 10 100 0 5 10 15 20 25 30<br>-V , Drain-to-Source Voltage (V)DS Q , Total Gate Charge (nC)G<br>Fig 9. Typical Capacitance Vs. Fig 10. Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 100<br>0 0.50 ==<br>0.20<br> 10<br>0.10<br>0.05<br>= S ST ee eh ToT<br>0.02 a eae ee PDM<br> 1 s 0.01 i caa t1<br>P T t2<br>Notes:<br>SINGLE PULSE<br>ati (THERMAL RESPONSE) EE 1. Duty factor D = t / t1 2<br>— E ENt 2. Peak TJ= P DM x Z thJA + TA<br>0.1<br>0.00001 0.0001 0.001 0.01 0.1 1 10 100<br>t , Rectangular Pulse Duration (sec)1<br>C, Capacitance (pF)<br>GS<br>-V , Gate-to-Source Voltage (V)<br>thJA<br>(Z )<br>Thermal Response<br>**----- End of picture text -----**<br>
## SO-8 Package Outline
Dimensions are shown in milimeters (inches)
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INCHES MILLIMETERS<br>DIM<br>D B MIN MAX MIN MAX<br>A 5 A .0532 .0688 1.35 1.75<br>A1 .0040 .0098 0.10 0.25<br>b .013 .020 0.33 0.51<br>8 7 6 5 c .0075 .0098 0.19 0.25<br>6 H D .189 .1968 4.80 5.00<br>ip E a 0.25 [.010] A = ERE E .1497 .1574 3.80 4.00<br>1 2 3 4<br>e .050 BASIC 1.27 BASIC<br>j os SEE<br>e1 .025 BASIC 0.635 BASIC<br>Te e ae H .2284 .2440 5.80 6.20<br>K .0099 .0196 0.25 0.50<br>6X e<br>cH SSE L .016 .050 0.40 1.27<br>y 0° 8° 0° 8°<br>e1 K x 45°<br>A<br>C<br>y<br>0.10 [.004]<br>8X b A1 8X L 8X c<br>0.25 [.010] C A B 0 7<br>FOOTPRINT<br>NOTES:<br>1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 8X 0.72 [.028]<br>2. CONTROLLING DIMENSION: MILLIMETER a<br>3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].<br>4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.<br>5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br> MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. yang<br>6.46 [.255]<br>6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>° MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. aan<br>7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO<br> A SUBSTRATE.<br>3X 1.27 [.050] te 8X 1.78 [.070]<br>**----- End of picture text -----**<br>
## SO-8 Part Marking Information (Lead-Free)
EXAMPLE: THIS IS AN IRF7101 (MOSFET)
DATE CODE (YWW)
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XXXX<br>INTERNATIONAL © F7101<br>RECTIFIER<br>LOGO<br>**----- End of picture text -----**<br>
P = DESIGNATES LEAD-FREE PRODUCT (OPTIONAL) Y = LAST DIGIT OF THE YEAR WW = WEEK A = ASSEMBLY SITE CODE LOT CODE
PART NUMBER
## SO-8 Tape and Reel
Dimensions are shown in milimeters (inches)
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TERMINAL NUMBER 1<br>oo © a)<br>12.3 ( .484 )<br>11.7 ( .461 )<br>a<br>8.1 ( .318 )<br>7.9 ( .312 ) FEED DIRECTION<br>**----- End of picture text -----**<br>
NOTES:
1. CONTROLLING DIMENSION : MILLIMETER.
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.
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330.00<br>(12.992)<br> MAX.<br>PY<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>
NOTES :
1. CONTROLLING DIMENSION : MILLIMETER.
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.
Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualifications Standards can be found on IR’s Web site.
**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 10/04
Updated at June 9, 2026
Infineon Technologies is a globally recognized leader in semiconductor solutions, renowned for driving innovation in power management, energy efficiency, and modern mobility. With a strong legacy of engineering excellence, the company provides highly reliable components designed to meet the rigorous demands of industrial, automotive, and advanced commercial applications. The core of our Infineon portfolio is centered on their industry-leading discrete semiconductors. We offer an extensive selection of single and dual MOSFETs, alongside a robust range of single IGBTs and advanced IGBT modules. These flagship power transistors are essential for high-efficiency power conversion and motor control, providing engineers with superior thermal performance and minimized switching losses. Beyond advanced field-effect transistors, the selection includes a comprehensive array of diodes and rectifiers, heavily featuring Schottky diodes, as well as fast-recovery and RF/PIN diodes. This power foundation is further supported by bipolar transistors, intelligent power modules, and thyristor SCR modules, delivering the critical building blocks required for complex power system designs. To support broader system integration, the portfolio also encompasses specialized solutions such as solid-state relays, AC/DC LED driver ICs, and Bluetooth communications modules. From high-power industrial rectifiers to wireless connectivity adapters, Infineon equips designers with the precision components needed to build efficient, scalable, and fully connected electronic systems.
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