IRF7313TRPBFXTMA1
Dual MOSFET, Dual N Channel, 30 V, 6.5 A, 0.029 ohm
- Manufacturer: INFINEON
- Product type: Dual MOSFETs
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 8Pins
- Channel Type: Dual N Channel
- Product Range: HEXFET Series
- Qualification: -
- Transistor Case Style: SO-8
- Operating Temperature Max: 150°C
- Power Dissipation N Channel: 2W
- Power Dissipation P Channel: -
- Drain Source Voltage Vds N Channel: 30V
- Drain Source Voltage Vds P Channel: -
- Continuous Drain Current Id N Channel: 6.5A
- Continuous Drain Current Id P Channel: -
- Drain Source On State Resistance N Channel: 0.029ohm
- Drain Source On State Resistance P Channel: -
| Delivery and price | |
|---|---|
| Units per pack | 5000 |
| Price | 0.221 € |
| Current stock | 1000+ |
| Lead time | 30 days |
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S1 1 8 D1<br>G1 2 7 D1 Voss = 30V<br>S2 3 6 D2<br>G2 4 5 D2 Rpgion) = 0.029 Ω<br>Top View<br>**----- End of picture text -----**<br>
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SO-8<br>**----- End of picture text -----**<br>
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Absolute Maximum Ratings ( T, = 25°C Unless Otherwise Noted)<br>Maximum<br>Symbol | __ 30 |<br>V<br>#20<br>Continuous Drain Current© Ta = 29°C ID po SH<br>Ta = 70°C 5.2<br>30<br>25<br>. rer Ta = 25°C 2.0<br>PD<br>Mesmum Foner Desenin ise] gs<br>**----- End of picture text -----**<br>
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θ<br>**----- End of picture text -----**<br>
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Parameter————=(Min.[Typ.[Max.<br>[Viempss[| [Units] Conditions ‘|<br>∆ ∆<br>F Vass Ty_|Drain-to-Source[Breakdown VoltageBreaklownTemp. CoefficientVottage || 30 |0.022|——| — — || Vi°CV || Vas=OV,lp=Reference to 25°C,250AIn=1mA<br>Ω<br>Feson [Site Oaninsoure Onsestany | |—Togsfaods| __Ves=aSV b= 478<br>[Vase [= [o.03200.046<br>Transconductance————=s[—-|<br>fasse [Forward[Gate [ewesnnatamecnes] Threshold Votage «(1.0|14|——|—-|[[—— | SV ||fsaeVos=15V,lp=58AVos=Ves lo=na 250Asorrcee—<br>‘lossGss [ Gaieenurce Gateto-Source Rows Leanne [fazeSr: | nA heecey<br>(|<br>Sgfa; |TetaiGate ChargR e verse Leakage || 22—|| -100 33 || t= BBA<br>[Oy ——fesetsnoe tore Sef Sa we [wets<br>Rion | Gate-to-Drain (Willer) Charge [| 64[96 |__| Vas= 10V, See Fig. 100<br>'(RiseTime——SSS~=~“—~‘“*~*~s*SCY CB lp = 1.08<br>ff _[Turn-On Delay Time «|| 81| 12 Voo = 18V<br>Ω<br>fon __|TummOff Delay Time ——=SSS*d | (28 | 88 R= 60<br>SSCs Ω<br>[Css fe siFaliTime | 28 Ro=15 @<br>[Coss [Input Capacitance ——~=S~«*d | 080] Vas = OV<br>[Crs [ ReverseOutput TransferCapacitanceCapacitance~~~||| 190,820 — | pF | Vos=25Vf= 1.0MHz, See Fig.8<br>Source-Drain Ratings and Characteristics<br>| Is | Continuous Parameter Source Current | Min. |Typ. [Max. [Units] [Conditions] MOSFET symbol D<br>G<br>Io Pulsed Source Current A integral reverse<br>[Veo__[Diode Forward Voltage === —— [078 [ 10 | V [T= 25°C, ls=17A Ves=OVO | S<br>**----- End of picture text -----**<br>
≤ ≤ ≤ ≤ 150°C
Rg=25_ Ω , lag= 4.0A.
≤ 300ys; duty cycle ≤ 2%. on FR-4 board, t ≤
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100 TOP 15V ves}<br> 10V<br> 7.0V 5.5V eeee<br> 4.5V<br> 4.0V ee eee<br> 3.5V<br> BOTTOM 3.0V<br>10<br>| V7 \ 3.0V<br>|‘ Gfff7 = SO<br>Uf) | ea<br>Y/ sa AG eee<br>Ly A eee<br>CAMS ell<br>1 Test T = 25°CJ<br>0.1 1 10<br>V , Drain-to-Source Voltage (V)DS<br>I , Drain-to-Source Current (A)D<br>**----- End of picture text -----**<br>
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100 vess—f<br> TOP 15V<br> 10V<br> 7.0V 5.5V eeee<br> 4.5V<br> 4.0V eee<br> 3.5V<br> BOTTOM 3.0V<br>10<br> 3.0V<br>| {yr 4 —-<br>— _—f fff a on<br>| fF 7A<br>|\#fffp$fy<br>Y ppm ee<br>V Js<br>7 |aa T = 150°CJ<br>1<br>0.1 1 10<br>V , Drain-to-Source Voltage (V)DS<br>D<br>I , Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>
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100 esa ee ee eee 100 eeeeeee<br>ee es ee pa<br>pt ee es P| | | [ | fT 7 [ | T 7 |<br>T = 25°CJ<br>T = 150°CJ<br>ee pf T = 150°CJ ff<br>10 ao 10 | b ger<br>T = 25°CJ<br>.—=—— | | | |llUhLet LU AA<br>es ee ne Ae A<br>ee ee es YT | | Y{f fT | [ | fT 7<br>ee ee ee ee | | [Tf [fi | tt<br>ee ee eee eee | fy ft ft<br> V = 10VDS<br>1 | | suseuse wor A 1 PA| A<br>3.0 3.5 4.0 4.5 5.0 0.4 0.6 0.8 1.0 1.2 1.4 1.6<br>V , Gate-to-Source Voltage (V)GS V , Source-to-Drain Voltage (V)SD<br>I , Reverse Drain Current (A)SD<br>D<br>I , Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>
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2.0 0.040<br>ID = 5.8A<br>C o] = F777<br>0.036<br>ELT} gL<br>1.5<br>Pree] & fe<br>0.032<br>1.0 CPP beer b e s) © ea<br>et e<br>TTT} 2 0.028 Ee<br>TULLE) BE<br>0.5<br>0.024<br>ETE) &— P toe<br>0.0 EC E VGS= 10V | e@ 0.020 « | ep[ [fy<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>T , Junction TemperatureJ ( C)° 0 10 20 30 40 [A]<br>I , Drain Current (A)D<br>Fig 5. Normalized On-Resistance Fig 6. Typical On-Resistance Vs. Drain<br>Vs. Temperature Current<br>0.12 200<br>> PC T LLILLLL_LL Gana TOP 1.8A<br> 3.2A<br>gs 0.10 ft fo fo 160 BOTTOM 4.0A<br>see 0.08 ffPOLtftoT eee ena<br>ee ee ee ee 120 AF<br>s 0.06 | ee fyee<br>s [WPL tT | GENES eee<br>80<br>ee 0.04 SL _ NEV<br>= ee A SNOW<br>— ~T)INT LS 40 P NNR<br>5 0.02 ~ |. oeee SALA<br>esee 0.00 eda an 0 PP PT tLASAKON SS A<br>0 3 6 9 12 15 [A] 25 50 75 100 125 150<br>V , Gate-to-Source Voltage (V)GS Starting T , Junction Temperature (°C)J<br>Ω<br>(Normalized)<br>DS(on)<br>R , Drain-to-Source On Resistance<br>Ω<br>AS<br>E , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>
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1200 20<br>V = 0V, f = 1MHzGS ID = 5.8A<br>C = C + C , C SHORTEDC = Ciss gs gd dsrss gd VDS = 15V<br>C = C + Coss ds gd 16<br>900 INEN ptee ee {|e|<br>s<br>CN S TOE<br>12<br>\OK ss<br>600<br>Pt PU PS| LUI TEaee<br>8<br>NN pit iyi tt<br>Poh FEE<br>300 ss<br>4<br>P S T) “EERE<br>0 a7Sel A 0 oeA |<br>1 10 100 0 10 20 30 40<br>V , Drain-to-Source Voltage (V)DS Q , Total Gate Charge (nC)G<br>Fig 9. Typical Capacitance Vs. Fig 10. Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 100<br>0.50<br>Seppeeestieee esata Setafl<br>a a a em<br>0.20<br> 10<br>0.10<br>0.05<br>See EET nee eee en<br>0.02 Se eles PDM<br> 1<br>e 0.01 reTIN | t1<br>t2<br>Sessa al Notes:<br>SINGLE PULSE<br>(THERMAL RESPONSE) 1. Duty factor D = t / t1 2<br>a ili et LUI00 PUTT| 2. Peak TJ = P DM x Z thJA + TA<br>0.1<br>0.00001 0.0001 0.001 0.01 0.1 1 10 100<br>t , Rectangular Pulse Duration (sec)1<br>C, Capacitance (pF)<br>GS<br>V , Gate-to-Source Voltage (V)<br>thJA<br>(Z )<br>Thermal Response<br>**----- End of picture text -----**<br>
## SO-8 Package Outline
Dimensions are shown in milimeters (inches)
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INCHES MILLIMETERS<br>DIM<br>D B MIN MAX MIN MAX<br>A = 5 A .0532 .0688 1.35 1.75<br>A1 .0040 .0098 0.10 0.25<br>b .013 .020 0.33 0.51<br>8 7 6 5 c .0075 .0098 0.19 0.25<br>r E e) 6 ar e 0.25 [.010] H A Soe SE===== DE .189.1497 .1968.1574 4.803.80 5.004.00<br>1 2 3 4<br>e .050 BASIC 1.27 BASIC<br>e1 .025 BASIC 0.635 BASIC<br>H .2284 .2440 5.80 6.20<br>K .0099 .0196 0.25 0.50<br>6X q e d b SST L .016 .050 0.40 1.27<br>EF y 0° 8° 0° 8°<br>e1 K x 45°<br>A<br>C<br>y<br>0.10 [.004]<br>Toygi 8X b A1 o f — 8X L 4 8X c 4<br>0.25 [.010] C A B 7<br>FOOTPRINT<br>NOTES:<br>1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 8X 0.72 [.028]<br>2. CONTROLLING DIMENSION: MILLIMETER aie<br>3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].<br>4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.<br>5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>: | OOG0<br> MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].<br>6.46 [.255]<br>6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br> MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].<br>7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO<br> A SUBSTRATE.<br>3X 1.27 [.050] ne 8X 1.78 [.070]<br>**----- End of picture text -----**<br>
## SO-8 Part Marking Information (Lead-Free)
EXAMPLE: THIS IS AN IRF7101 (MOSFET)
XXXX INTERNATIONAL F7101 RECTIFIER LOGO ~~ee~~
DATE CODE (YWW) P = DESIGNATES LEAD-FREE PRODUCT (OPTIONAL) Y = LAST DIGIT OF THE YEAR WW = WEEK A = ASSEMBLY SITE CODE LOT CODE
PART NUMBER
## SO-8 Tape and Reel
Dimensions are shown in milimeters (inches)
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TERMINAL NUMBER 1<br>oO666) fF<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) ed FEED DIRECTION a<br>**----- End of picture text -----**<br>
NOTES:
1. CONTROLLING DIMENSION : MILLIMETER.
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.
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330.00<br>(12.992)<br> MAX.<br>SY<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>
NOTES :
1. CONTROLLING DIMENSION : MILLIMETER.
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.
Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualifications Standards can be found on IR’s Web site.
**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 10/04
## **IMPORTANT NOTICE**
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In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications.
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Updated at June 9, 2026
Infineon Technologies is a globally recognized leader in semiconductor solutions, renowned for driving innovation in power management, energy efficiency, and modern mobility. With a strong legacy of engineering excellence, the company provides highly reliable components designed to meet the rigorous demands of industrial, automotive, and advanced commercial applications. The core of our Infineon portfolio is centered on their industry-leading discrete semiconductors. We offer an extensive selection of single and dual MOSFETs, alongside a robust range of single IGBTs and advanced IGBT modules. These flagship power transistors are essential for high-efficiency power conversion and motor control, providing engineers with superior thermal performance and minimized switching losses. Beyond advanced field-effect transistors, the selection includes a comprehensive array of diodes and rectifiers, heavily featuring Schottky diodes, as well as fast-recovery and RF/PIN diodes. This power foundation is further supported by bipolar transistors, intelligent power modules, and thyristor SCR modules, delivering the critical building blocks required for complex power system designs. To support broader system integration, the portfolio also encompasses specialized solutions such as solid-state relays, AC/DC LED driver ICs, and Bluetooth communications modules. From high-power industrial rectifiers to wireless connectivity adapters, Infineon equips designers with the precision components needed to build efficient, scalable, and fully connected electronic systems.
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