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ILCX18-FF5F10-25.000MHZ
Crystal, ILCX18 Series, 25 MHz, 30 ppm, 30 ppm, 10 pF
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: ILSI AMERICA
- Product type: Crystals
- SVHC: No SVHC (25-Jun-2025)
- Frequency Nom: 25MHz
- Product Range: ILCX18 Series
- Load Capacitance: 10pF
- Crystal Frequency: 25MHz
- Crystal Case / Package: SMD, 2.5mm x 2mm
- Frequency Stability + / -: 30ppm
- Frequency Tolerance + / -: 30ppm
- Operating Temperature Max: 85°C
- Operating Temperature Min: -40°C
| Delivery and price | |
|---|---|
| Units per pack | 500 |
| Price | 0.311 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**4 Pad Ceramic Crystal, 2.0 mm x 2.5 mm** **ILCX18 Series** |**Product Feature:**||**Applications:**|||||||||||| |---|---|---|---|---|---|---|---|---|---|---|---|---|---| |SMD Package||PCMCIA Cards|||||2.50±0.10||||||| |Small package Foot Print||Storage|||||||||||| |Supplied in Tape and Reel<br>Compatible with Leadfree Processing<br>Fundamental Mode up to 80.0 MHz||PC’s<br>GSM Cell Phone<br>Wireless Lan<br>USB<br>GSM Cell Phone|||||MARKING<br>(TOP VIEW)<br>~~J~~|||||2.00±0.10<br>~~!~~|| |**Frequency**<br>**ESR (Equivalent Series**<br>**Resistance)**|12.0 MHz to 80.0 MHz||||||.065 max<br>CASE LID<br>—~~<—|~~<br>ry||||||| |12 MHz – 19.9 MHz|100Max.||||||||||||| |20 MHz – 29.9 MHz|80Max.|||||0.90|||||||| |30 MHz – 39.9 MHz<br>40 MHz – 60.0 MHz<br>60 MHz – 80.0 MHz|60Max.<br>40Max.<br>40Max||||||2*<br>1<br>pc}<br>L~~y~~|||||~~oy~~|| |**Shunt Capacitance (C0)**|3.5 pF Max.|||4*<br>3<br>0.58<br>~~Y~~o ~~C~~J<br>Lt}<br>y;||||||||0.70<br>}|| |**Frequency Tolerance @ 25**C|30 ppm Standard (see Part Number Guide for more<br>options)||||||0.75||||||| |**Frequency Stability over**|50 ppm Standard (see Part Number Guide for more|||*PIN 2 AND 4 ARE INTERNALLY|||||||||| |**Temperature**|options)|||CONNECTED TO CASE LID AND SHOULD|||||||||| |||||BE CONNECTED TO GROUND.||||BE CONNECTED TO GROUND.|||||| |**Crystal Cut**|AT Cut||||||||||||| ||||||||1.70||||||| |**Load Capacitance**<br>**Drive Level**<br>**Aging**<br>**Temperature**|18pF Standard(see Part Number Guide for more options)<br>100 µW Max.<br>3 ppm Max. / Year Standard|||1.30<br>1.00<br>~~|~~<br>~~JL]:~~<br>——_—_~~__|~~<br>~~==~~<br>~~|~~<br>~~|~~L~~J~~<br>~~-~~o|||||||||| ||||||||1.20||||||| |**Operating**|0C to +70C Standard (see Part Number Guide for more<br>options)||||||RECOMMEND||||||| ||||||||LAND PATTERN||||||| |**Storage**|-40C to +85C Standard|||||DIMENSION IN mm|||||||| Notes: |**Package**|**Tolerance**<br>**(ppm) at Room**<br>**Temperature**|**Stability**<br>**(ppm) over Operating**<br>**Temperature**|**Operating**<br>**Temperature Range**|**Mode**<br>**(overtone)**|**Load**<br>**Capacitance**<br>**(pF)**|**Frequency**| |---|---|---|---|---|---|---| |ILCX18 -|B = ±50ppm|B = ±50ppm|0 = 0°C to +50°C|F = Fundamental|F = Fundamental<br>18 pF Standard<br>Or Specify|- 20.000 MHz| ||F = ±30ppm|F = ±30ppm|1 = 0°C to +70°C|||| ||G = ±25ppm|G = ±25ppm|2 = -10°C to +60°C|||| ||H = ±20ppm|H = ±20ppm|3 = -20°C to +70°C|||| ||I = ±15ppm|I = ±15ppm**|5 = -40°C to +85°C|||| ||J = ±10ppm*|J = ±10ppm**|9 = -10°C to +50°C|||| ||||D = -10°C to +105°C*|||| ||||E = -40°C to +105°C*|||| ** Not available for all temperature ranges. Rev: 05/06/16_G ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ● www.ilsiamerica.com ~~a~~ Specifications subject to change without notice Page 1 of 2 **4 Pad Ceramic Crystal, 2.0 mm x 2.5 mm** **ILCX18 Series** ## **Pb Free Solder Reflow Profile:** ## **Typical Application:** *Units are backward compatible with 240C reflow processes ## **Package Information:** MSL = 1 Termination = e4 (Au over Ni over W base metal). ## **Tape and Reel Information:** |**Quantity per**<br>**Reel**|**3000**| |---|---| |**Reel**<br>**A**<br>**B**|8.0 ±0.3<br>4.0 ±0.2| |**B**<br>**C**|4.0 ±0.2<br>3.5 ±0.2| |**D**|9.0±1.0 or 12.0 ±3.0| |**E**|60 / 80| |**F**|180| ## **Environmental Specifications:** |Thermal Shock|MIL-STD-883,Method 1011,Condition A| |---|---| |Moisture Resistance|MIL-STD-883,Method 1004| |Mechanical Shock|MIL-STD-883,Method 2002,Condition B| |Mechanical Vibration|MIL-STD-883,Method 2007,Condition A| |Resistance to SolderingHeat|J-STD-020C,Table 5-2 Pb-free devices(except 2 cycles max)| |Hazardous Substance|Pb-Free / RoHS / Green Compliant| |Solderability|JESD22-B102-D Method 2(PreconditioningE)| |Terminal Strength|MIL-STD-883,Method 2004,Test Condition D| |Gross Leak|MIL-STD-883,Method 1014,Condition C| |Fine Leak|MIL-STD-883,Method 1014,Condition A2,R1=2x10-8 atm cc/s| |Solvent Resistance|MIL-STD-202, Method 215| ## **Marking:** Line 1: I-Date Code (yww) Line 2: Frequency Rev: 05/06/16_G ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ● ~~a~~ www.ilsiamerica.com Specifications subject to change without notice Page 2 of 2
Updated at April 28, 2026
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