ILCX13-FF5F10-48.000MHZ

4 Pad Ceramic Crystal, 3.2mm x 2.5mm 

ILCX13 Series 

|**Frequency**|10 MHz to 150 MHz|
|---|---|
|**ESR (Equivalent Series Resistance)**<br>10.0 MHz – 11.9 MHz<br>12.0 MHz – 15.6 MHz<br>16.0 MHz – 19.9 MHz<br>20.0 MHz – 23.9 MHz<br>24.0 MHz – 60.0 MHz<br> 60.0MHz – 150.0MHz(3rd O/T)|250 Ohms Maximum<br>100 Ohms Maximum<br>80 Ohms Maximum<br>60 Ohms Maximum<br>40 Ohms Maximum<br>100 OhmsMaximum|
|**Shunt Capacitance (C0)**|3.5pF Maximum|
|**Frequency Tolerance @ 25**C|(See Part Number Guide)|
|**Frequency Stability over Temperature**|(See Part Number Guide)|
|**Crystal Cut**|AT Cut|
|**Load Capacitance**|8pF to 32pF or Specify|
|**Drive Level**|100µW Maximum|
|**Aging**|3ppm/Year Maximum|
|**Operating Temperature Range**|(See Part Number Guide)|
|**Storage Temperature Range**|-40C to +85C|



## **Part Number Guide** 

## **Sample Part Number: ILCX13 - FB1F18 - 20.000000 MHz** 

|**Package**|**Tolerance**<br>**(ppm) at Room**<br>**Temperature**|**Stability**<br>**(ppm) over Operating**<br>**Temperature**|**Operating**<br>**Temperature Range**|**Mode**<br>**(overtone)**<br>**Load Capacitance**<br>**(pF)**|**Load Capacitance**<br>**(pF)**<br>**Frequency**|
|---|---|---|---|---|---|
|ILCX13 -|B = ±50ppm|B = ±50ppm|0 = 0°C to +50°C|F = Fundamental<br>8pF to 32pF<br>Or Specify<br>3 = 3rdovertone|8pF to 32pF<br>Or Specify<br>- 20.000 MHz|
||F = ±30ppm|F = ±30ppm|1 = 0°C to +70°C|||
||G = ±25ppm|G = ±25ppm|2 = -10°C to +60°C|||
||H = ±20ppm|H = ±20ppm|3 = -20°C to +70°C|||
||I = ±15ppm|I = ±15ppm**|5 = -40°C to +85°C|||
||J = ±10ppm*|J = ±10ppm**|9 = -10°C to +50°C|||
||||D = -10°C to +105°C*|||
||||E = -40°C to +105°C*|||



*  Not available at all frequencies.   ** Not available for all temperature ranges. 

Rev:  03/20/18_K 

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ● www.ilsiamerica.com 

Specifications subject to change without notice 

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4 Pad Ceramic Crystal, 3.2mm x 2.5mm 

ILCX13 Series 

**Pb Free Solder Reflow Profile:** 

Units are backward compatible with 240C reflow processes 

|Ts max to TL(Ramp-up Rate)|3ºC / second max|
|---|---|
|Preheat<br>Temperature min (Ts min)<br>Temperature typ (Ts typ)<br>Temperature max (Ts max)<br>Time (Ts)|150ºC<br>175ºC<br>200ºC<br>60 to180 seconds|
|Ramp-up Tate (TLto Tp|3ºC / second max|
|Time Maintained Above<br>Temperature (TL)<br>Time (TL)|217ºC<br>60 to 150 seconds|
|L)<br>Peak Temperature (Tp)|260ºC max for 10<br>seconds|
|Time within 5ºC to Peak<br>Temperature (Tp)|20 to 40 seconds|
|Ramp-down Rate|6ºC / second max|
|Tune 25ºC to Peak<br>Temperature|8 minutes max|



## **Package Information:** 

MSL = 1 Termination = e4 (Au over Ni over W base metal). 

## **Tape and Reel Information:** 

|**Quantity per Reel**<br>**A**|**3000**|
|---|---|
|**A**<br>**B**|8.0 ±0.2<br>4.0 ±0.2|
|**C**<br>**D**|3.5 ±0.2<br>12.0 ±3.0|
|**E**|60 / 80|
|**F**|180|



## **Environmental Specifications:** 

|ThermalShock|MIL-STD-883,Method1011, Condition A|
|---|---|
|MoistureResistance|MIL-STD-883,Method1004|
|MechanicalShock|MIL-STD-883,Method2002, Condition B|
|Mechanical Vibration|MIL-STD-883,Method2007, Condition A|
|Resistance to SolderingHeat|J-STD-020C,Table 5-2 Pb-free devices (except2cyclesmax)|
|Hazardous Substance|Pb-Free /RoHS Compliant|
|Solderability|JESD22-B102-D Method2(PreconditioningE)|
|TerminalStrength|MIL-STD-883,Method2004,Test Condition D|
|GrossLeak|MIL-STD-883,Method1014, ConditionC|
|FineLeak|MIL-STD-883,Method1014, Condition A2|
|Solvent Resistance|MIL-STD-202, Method 215|



## **Marking:** 

Line 1:  I-Date Code (yww) Line 2:  Frequency 

Rev:  03/20/18_K 

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ● www.ilsiamerica.com ~~a~~ Specifications subject to change without notice 

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