ILCX07B-FB1F18-14.7456MHZ

## **ILCX07B Series** 

**Product Features:** Low Cost SMD Package Low ESR Compatible with Leadfree Processing 

## **Applications:** 

Fibre Channel Server & Storage Sonet / SDH 802.11 / WiFi T1/E1, T3/E3 

## **Electrical Specifications:** 

|**Electrical Specifications:**||
|---|---|
|**Frequency**|8MHz to 150MHz|
|**Equivalent Series Resistance**<br>8MHz – 9.999999MHz<br>10MHz – 11.999999MHz<br>12MHz – 15.999999MHz<br>16MHz – 19.999999MHz<br>20MHz – 23.999999MHz<br>24MHz – 50MHz<br>30MHz – 150MHz(Third Overtone)|100 Ohms Maximum<br>80 Ohms Maximum<br>60 Ohms Maximum<br>50 Ohms Maximum<br>40 Ohms Maximum<br>30 Ohms Maximum<br>80 OhmsMaximum|
|**Shunt Capacitance (C0)**|5pF Maximum|
|**Frequency Tolerance (at 25°C)**|±50ppm, ±30ppm, ±25ppm, ±20ppm, ±15ppm, or ±10ppm|
|**Frequency Stability (over Temperature)**|±50ppm, ±30ppm, ±25ppm, ±20ppm, ±15ppm, or ±10ppm|
|**Mode of Operation**<br>8MHz – 50MHz<br>30MHz – 150MHz|Fundamental<br>Third Overtone|
|**Crystal Cut**|AT Cut|
|**Load Capacitance**|8pF to 32pF or Specify|
|**Drive Level**|100µW Maximum|
|**Aging**|±5ppm/Year Maximum|
|**Operating Temperature Range**|See Part Number Guide|
|**Storage Temperature Range**|-40°C to +85°C|



## **Mechanical and Solder Pad Dimensions:** 

|**PinConnections**|**PinConnections**|
|---|---|
|Pin 1|Crystal|
|Pin 2|Cover/Ground|
|Pin 3|Crystal|
|Pin 4|Cover/Ground|



**Dimension Units: mm** 

Note: Chamfer not shown *Note 1: 2.6±0.1mm (<=10MHz) 2.4±0.1mm (>10MHz) 

|***Package**|**Frequency**<br>**Tolerance**|**Frequency**<br>**Stability**|**Operating Temperature**<br>**Range **|**Mode of**<br>**Operations**|**Load**<br>**Capacitance**|**Frequency**|
|---|---|---|---|---|---|---|
|ILCX07B-|B = ±50ppm|B = ±50ppm|0 = 0°C to +50°C|F = Fundamental|8pF to 32pF or<br>Specify|8pF to 32pF or<br>20.000 MHz|
||F = ±30ppm|F = ±30ppm|1 = 0°C to +70°C|3 = Third Overtone|||
||G = ±25ppm|G = ±25ppm|2 = -10°C to +60°C||||
||H = ±20ppm|H = ±20ppm|3 = -20°C to +70°C||||
||I = ±15ppm|I = ±15ppm*, **|5 = -40°C to +85°C||||
||J = ±10ppm*|J = ±10ppm*, **|9 = -10°C to +50°C||||
||||D = -10°C to +105°C*||||
||||E = -40°C to +105°C*||||



* Not available at all frequencies.   ** Not available for all temperature ranges. 

Revised A: 04/17/18 

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www.ilsiamerica.com 

## **ILCX07B Series** 

## **Pb Free Solder Reflow Profile:** 

|TsmaxtoTL(Ramp-upRate)|3ºC / secondmax|
|---|---|
|Preheat<br>Temperature min (Ts min)<br>Temperature typ (Ts typ)<br>Temperature max (Ts max)<br>Time (Ts)|150ºC<br>175ºC<br>200ºC<br>60 to180 seconds|
|Ramp-upRate (TL toTp)|3ºC / secondmax|
|Time Maintained Above<br>Temperature (TL)<br>Time(TL)|217ºC<br>60 to 150 seconds|
|Peak Temperature (Tp)|260ºC max for 10<br>seconds|
|Time within 5ºC to Peak<br>Temperature(Tp)|20 to 40 seconds|
|Ramp-down Rate|6ºC / second max|
|Tune 25ºC to Peak Temperature|8 minutes max|



*Units are backward compatible with +240°C reflow processes 

## **Package Information:** 

## FCC 

MSL = 1 (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metallization). 

## **Tape and Reel Information:** 

|PITCH<br>TAPE WIDTH<br>REEL DIA<br>QTY PER REEL|8.00<br>12.00<br>180<br>1,000|
|---|---|
|**Dimensions Units: mm**||



Revised A: 04/17/18 

Page 3 of 6 

www.ilsiamerica.com