IL3X2-HX5F9-32.768 KHZ

2 Pad Ceramic Package, 3.2mm x 1.5mm **IL3X2 Series** 

## **Product Features:** 

±10ppm Tolerance Available SMD Package Low Profile RoHS and REACH Compliant 

**Applications:** Real Time Clock Source Metering Industrial Control Time Reference 

## **Electrical Specifications** 

|**Frequency**|32.768kHz|
|---|---|
|**Equivalent Series Resistance**|70 kOhms Maximum|
|**Shunt Capacitance (C0)**|0.95pF Typical, 2.0pF Maximum|
|**Frequency Tolerance (at 25°C)**|±10ppm or ±20ppm|
|**Frequency Stability (over Temperature)**|-0.034ppm/(Change in °C)2Typical|
|**Turn over Temperature**|25°C ±5°C|
|**Mode of Operation**|Fundamental|
|**Crystal Cut**|X-Cut (Tuning Fork)|
|**Load Capacitance**|6pF, 7pF, 9pF, 12.5pF or Specify|
|**Drive Level**|1µWatt Maximum|
|**Aging**|3ppm/Year Maximum|
|**Operating Temperature Range**|-40°C to +85°C|
|**Storage Temperature Range**|-40°C to +85°C|



## **Mechanical and Solder Pad Dimensions** 

## **Part Number Guide** 

|**Sample Part Number: IL3X2 – HX5F12.5 – 32.768 kHz**|**Sample Part Number: IL3X2 – HX5F12.5 – 32.768 kHz**|**Sample Part Number: IL3X2 – HX5F12.5 – 32.768 kHz**|**Sample Part Number: IL3X2 – HX5F12.5 – 32.768 kHz**|**Sample Part Number: IL3X2 – HX5F12.5 – 32.768 kHz**|**Sample Part Number: IL3X2 – HX5F12.5 – 32.768 kHz**|**Sample Part Number: IL3X2 – HX5F12.5 – 32.768 kHz**|
|---|---|---|---|---|---|---|
|**Package**|**Frequency**<br>**Tolerance**|**Frequency**<br>**Stability**|**Operating**<br>**Temperature Range **|**Mode of**<br>**Operations**|**Load Capacitance**|**Frequency**|
|IL3X2-|J = ±10ppm<br>H = ±20ppm|X = X Cut|5 = -40°C to +85°C|F = Fundamental|6 = 6pF<br>7 = 7pF<br>9 = 9pF<br>12.5 = 12.5pF<br>(or Specify)|- 32.768 kHz|



Rev:  07/23/19_A 

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ● www.ilsiamerica.com ~~a~~ Specifications subject to change without notice 

Page 1 of 2 

## 2 Pad Ceramic Package, 3.2mm x 1.5mm **IL3X2 Series** 

## **Pb Free Solder Reflow Profile:** 

Units are backward compatible with +240°C reflow processes 

|TsmaxtoTL(Ramp-upRate)|3ºC / secondmax|
|---|---|
|Preheat<br>Temperature min (Ts min)<br>Temperature typ (Ts typ)<br>Temperature max (Ts max)<br>Time (Ts)|150ºC<br>175ºC<br>200ºC<br>60 to180 seconds|
|Ramp-upTate (TL toTp|3ºC / secondmax|
|Time Maintained Above<br>Temperature (TL)<br>Time (TL)|217ºC<br>60 to150 seconds|
|Peak Temperature (Tp)|260ºC max for 10<br>seconds|
|Time within 5ºC to Peak<br>Temperature (Tp)|20 to 40 seconds|
|Ramp-down Rate|6ºC / secondmax|
|Tune 25ºC to Peak Temperature|8 minutes max|



## **Package Information:** 

MSL = 1 (package does not contain plastic, storage life is unlimited under normal room conditions) Termination = e4 (Au over Ni over W base metallization) Cover: Metal Seam Seal 

## **Tape and Reel Information:** 

|PITCH|4.00|
|---|---|
|TAPE WIDTH|12.00|
|REEL DIA|180|
|QTY PER REEL|3,000|



**Environmental Specifications:** 

|ThermalShock|MIL-STD-883,Method1011, Condition A|
|---|---|
|MoistureResistance|MIL-STD-883,Method1004|
|MechanicalShock|MIL-STD-883,Method2002, Condition B|
|Mechanical Vibration|MIL-STD-883,Method2007, Condition A|
|Resistance to SolderingHeat|J-STD-020C,Table 5-2 Pb-free devices (except2cyclesmax)|
|Hazardous Substance|Pb-Free /RoHS / GreenCompliant|
|Solderability|JESD22-B102-D Method2(PreconditioningE)|
|GrossLeak|MIL-STD-883,Method1014, ConditionC|
|FineLeak|MIL-STD-883,Method1014, Condition A2,R1=2x10-8 atmcc/s|
|Solvent Resistance|MIL-STD-202,Method 215|



## **Marking:** 

Line 1:  Manufacturer Designator, Date Code 

Rev:  07/23/19_A 

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ● www.ilsiamerica.com Specifications subject to change without notice 

Page 2 of 2